KR102182856B1 - Apparatus for mounting component - Google Patents

Abstract

The present invention relates to a component mounting apparatus and, more particularly, to an apparatus for sequentially mounting a plurality of components on a substrate. According to the present invention, the component mounting apparatus comprises: a component supply unit for supplying a first substrate having a plurality of components attached to one surface thereof; an index unit for applying a paste to the plurality of components attached to the first substrate supplied from the component supply unit; a substrate supply unit for supplying a second substrate in which an area in which the plurality of components are mounted is defined to a mounting position; and a gantry unit for receiving the first substrate from the index unit and sequentially mounting the plurality of components coated with the paste at the mounting position on the second substrate.

Description

Parts mounting device {APPARATUS FOR MOUNTING COMPONENT}

The present invention relates to a component mounting apparatus, and more specifically, to an apparatus for sequentially mounting a plurality of components on a substrate.

As the size of the parts mounted on the board is gradually miniaturized, the surface mounting technology (SMT), which is easy to mass-produce and high integration, is being used in the parts mounting process.

In such a surface mounting method, after applying solder paste and flux to the substrate, the components to be mounted are individually arranged, passed through a reflow equipment to dissolve the applied metal, and then The method of cooling and hardening it is mainly used.

For example, as the size of a component is in micrometers, such as μLED, and as the number of components mounted on one substrate increases and the spacing between components decreases, paste is used as a means to fix the components to the substrate and conduct electrical conduction. The difficulty of applying is increased, and it takes a lot of time to individually attach components to each of the pastes applied to the substrate, resulting in low mass production.

In addition, as a mounting device mainly used in the prior art, referring to Korean Patent Publication No. 10-1322531 (Patent Document 1), the conventional mounting device is accommodated in a tray by having a pickup unit for picking up one element. One of the plurality of devices is picked up (for example, suctioned by a vacuum method), transferred to a substrate at a mounting position, and mounted.

However, such a mounting method has a disadvantage in that the size of components is small and the spacing between components mounted on a substrate is narrowed.

Accordingly, there is a need to develop a component mounting apparatus capable of improving the problems of the conventional method described above.

Korean Registered Patent Publication No. 10-1322531

Under this technical background, the market demands a more highly efficient component mounting device, and for this, it is necessary to reduce the tack time of a series of assembly steps performed in the component mounting device.

For example, according to Korean Registered Patent Publication No. 10-1322531 (Patent Document 1), the mounting device must include a means (pickup unit) for picking up parts and transferring them to an assembly position, and using the pickup unit In order to pick up the parts mounted on the tray (vacuum adsorption), a space that can be supported when the pickup unit adsorbs the parts needs to be separately provided in the tray. This method has a disadvantage in that it is very sensitive to the size and spacing of the component to be mounted, and is particularly difficult to apply to the mounting of μLED as a target of the component mounting device according to the present invention.

Accordingly, the present invention provides an apparatus for sequentially mounting a plurality of parts on a substrate, but not receiving a plurality of parts in a tray, but providing a temporary attached state to a predetermined film, thereby providing a conventional pick and place. & place) method to provide a component mounting device capable of rapidly mounting a plurality of components on a substrate.

In addition, the present invention adds a process of applying the paste to the component attached to the film in the mounting device instead of applying the paste to the substrate on which the component is mounted, and increases the component mounting efficiency by directly mounting the paste-applied component on the substrate. An object of the present invention is to provide a component mounting device capable of improving and reducing the defect rate of a paste applied to a component.

In addition, it is an object of the present invention to provide a component mounting apparatus capable of reducing mounting defects when mounting a paste-coated component on a substrate.

The objects of the present invention are not limited to the above-mentioned object (for example, for an electric vehicle), and other objects and advantages of the present invention that are not mentioned can be understood by the following description and by the embodiments of the present invention. It will be understood more clearly. In addition, it will be easily understood that the objects and advantages of the present invention can be realized by means and combinations thereof indicated in the claims.

According to an aspect of the present invention, a component supply unit for supplying a first substrate having a plurality of components attached to one surface thereof, an index unit for applying a paste to the plurality of components attached to the first substrate supplied from the component supply unit, the A substrate supply unit for supplying a second substrate in which regions on which a plurality of parts are mounted is defined to a mounting position, and the plurality of parts coated with a paste at the mounting position by receiving the first substrate from the index unit and the second substrate There is provided a component mounting device including a gantry unit that is sequentially mounted on the device.

In an exemplary embodiment, the first substrate may include a sheet to which the plurality of components are attached, an inner ring supporting an edge of the sheet, and an outer ring supporting an edge of the inner ring.

In one embodiment, the index unit is a first substrate input unit that receives the first substrate from the component supply unit and inserts the first substrate into a stage, and is located downstream of the first substrate input unit, and is located on one side of the first substrate. It may include a dipping unit for applying a paste to a plurality of attached parts, and a squeezing unit for flattening the paste applied to the plurality of parts.

In one embodiment, the squeezing unit includes a dipping table in which a paste is accommodated, a squeezing head for flattening a paste accommodated in the dipping table, and a squeezing for measuring a flatness of the paste flattened by the squeezing head. It may include a sensor.

In the above embodiment, the dipping table containing the paste flattened by the squeezing unit is transferred to the lower portion of the dipping unit, and the first substrate is immersed in the paste accommodated in the dipping table while being adsorbed by the dipping unit. Thus, the paste can be simultaneously applied to a plurality of components attached to one surface of the first substrate.

In an embodiment, the index unit further includes a first alignment unit positioned downstream of the dipping unit, and the first alignment unit includes the first alignment unit in which a paste is applied to a plurality of parts by the dipping unit. The substrate may be aligned before being supplied to the gantry unit.

In one embodiment, the gantry unit picks up the first substrate coated with a paste on a plurality of components by the index unit and transfers the first substrate to the mounting position, and is transferred by the first substrate pickup unit. A second alignment unit for aligning the first substrate with respect to the second substrate and a plurality of components attached to the first substrate in a state in which the first substrate and the second substrate are aligned with the second substrate. It may include a mounting unit that is sequentially mounted on the substrate.

In the above embodiment, the mounting unit includes a center pin positioned at a center and an outer shaft surrounding the center pin, wherein the center pin and the outer shaft are lowered by the z-axis of the mounting unit to the first substrate At the same time, the component attached to one surface of the first substrate is brought into contact with one surface of the second substrate, and the component remains in contact with one surface of the second substrate by the center pin. As a result, only the outer shaft can be independently raised in the z-axis to mount the component on the second substrate.

As described above, according to the present invention, a plurality of parts are provided in a state temporarily attached to a predetermined film without being accommodated in a tray, so that a plurality of parts without adopting a conventional pick & place method There is an advantage that it is possible to quickly mount the device on a substrate.

In addition, according to the present invention, instead of applying the paste to the substrate on which the component is mounted, a process of applying the paste to the component attached to the film in the mounting device is added, and the component with the paste is directly mounted on the substrate to mount the component. While improving efficiency, it is possible to reduce the defect rate of paste applied to parts.

In addition, according to the present invention, it is possible to significantly reduce mounting defects by applying a paste to a component mounted on a substrate and mounting the paste-applied component on a substrate in one device.

1 is a top view schematically showing a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is (a) a top view and (b) a side view schematically showing a first substrate used in the component mounting apparatus shown in FIG. 1.
3 is a top view schematically showing an index unit included in the component mounting apparatus shown in FIG. 1.
4 is a side view of the index unit shown in FIG. 3.
5 is a side view schematically showing an operation sequence of a squeezing unit included in the index unit shown in FIG. 3.
6 is a side view schematically illustrating an operation sequence of the dipping unit included in the index unit shown in FIG. 3.
7 is a side view schematically illustrating an operation sequence in which a paste is applied to a plurality of components attached to a first substrate by the dipping unit shown in FIG. 6.
8 is a perspective view schematically illustrating an operation sequence of an alignment unit included in the index unit shown in FIG. 3.
9 is a top view schematically showing a gantry part included in the component mounting apparatus shown in FIG. 1.
10 is a perspective view schematically illustrating an operation sequence of a mounting head included in the gantry unit shown in FIG. 9.
11 is a side view schematically showing a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to an embodiment of the present invention.
Fig. 12 ?? 13 is a side view schematically showing a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to another embodiment of the present invention.
14 is a top view of (a) a laser-perforated first substrate and (b) a top view of a first substrate after all of the plurality of components attached to the first substrate are mounted in the order shown in FIGS. 12 and 13 to be.
15 is a side view schematically showing a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to another embodiment of the present invention.
16 is a top view of the first substrate after (a) a top view of the laser-perforated first substrate and (b) a top view of the first substrate after all of the plurality of components attached to the first substrate are mounted in the order shown in FIG. 15.
17 is a side view schematically illustrating a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to another embodiment of the present invention.
18 is a top view of a first substrate after all of the plurality of components attached to the first substrate are mounted in the order shown in FIG. 17.
19 is a top view schematically illustrating a substrate supply unit included in the component mounting apparatus shown in FIG. 1.

Certain terms are defined herein for convenience in order to make the invention easier to understand. Unless otherwise defined herein, scientific and technical terms used in the present invention will have the meanings commonly understood by those of ordinary skill in the art. In addition, unless otherwise specified in context, terms in the singular form are to include their plural forms, and the terms in the plural form are to be understood as including the singular form thereof.

Hereinafter, a component mounting apparatus according to some embodiments of the present invention will be described in more detail.

1 is a front view schematically showing a component mounting apparatus 1000 according to an embodiment of the present invention.

Referring to FIG. 1, a component mounting apparatus 1000 according to an embodiment of the present invention includes a component supply unit 100 for supplying a first substrate having a plurality of components attached to one surface thereof, and a component supply unit 100 supplied from the component supply unit 100. An index unit 200 for applying a paste to the plurality of parts attached to a first substrate, a substrate supply unit 400 for supplying a second substrate in which regions on which the plurality of parts are mounted are defined to a mounting position, and the index unit And a gantry unit 300 for receiving the first substrate from 200 and sequentially mounting the plurality of components coated with the paste at the mounting position on the second substrate.

In the component supply unit 100, the first substrate to which the components mounted on the second substrate are attached is accommodated in the first substrate magazine 110a, and the magazine pickup unit 110b includes the plurality of first substrates. The first substrate magazine 110a is picked up and transferred to a position where the first substrate is inserted into the index unit 200.

Here, one end of the magazine pickup unit 110b may be installed to be movable in the y-axis direction in the magazine transfer unit 120. Accordingly, the first substrate magazine 110a may be continuously supplied to the index unit 200 by a series of operations of the magazine pickup unit 110b and the magazine transfer unit 120.

In addition, although not shown separately, the first substrate from the first substrate magazine 110a transferred to the position where the first substrate is inserted into the index unit 200 is manually or by a separate unit to be described later. It can be supplied as 200.

FIG. 2 is (a) a top view and (b) a side view schematically showing a first substrate used in the component mounting apparatus shown in FIG. 1.

2A and 2B, the first substrate 130 includes a sheet 131 to which the plurality of components are attached, an inner ring 132 supporting an edge of the sheet 131, and the It includes an outer ring 133 supporting the rim of the inner ring 132.

The sheet 131 is a film made of a material having adhesiveness, and a plurality of components, for example, an electronic component such as a general light emitting device (LED) or a micro light emitting device (μLED), are provided on one side of the sheet 131 It may be temporarily attached. It is preferable that the sheet 131 is attached to the inner ring 132 in a completely unfolded state. The inner ring 132 may be selectively attached to the edge of the sheet 131 to prevent the sheet 131 from being wrinkled.

In addition, the rim of the inner ring 132 may be supported by the outer ring 133, and the outer ring 133 may be configured such that the first substrate 130 is picked up or gripped within the component mounting apparatus 1000. When it becomes, it can serve as a part that is gripped by various devices. The outer ring 133 is selectively picked up or gripped to prevent damage to the seat 131 or a component (LED) attached to the seat 131 in the process of picking up or gripping the first substrate 130 can do.

3 is a top view schematically showing an index unit included in the component mounting apparatus shown in FIG. 1.

Referring to FIG. 3, the index unit 200 includes a plurality of spaces into which the first substrate 130 is inserted, and from the stage 210 and the component supply unit 100 provided in a rotational manner, the first substrate ( 130) is sequentially supplied to the first substrate input unit 220, which is supplied to the stage 210, located downstream of the first substrate input unit 220, and is located on one surface of the first substrate 130 A dipping unit 230 for applying a paste to a plurality of attached components and a squeezing unit 240 for flattening the paste applied to the plurality of components are included.

As described above, when the stage 210 is provided in a rotational manner and the first substrate 130 is inserted by the first substrate input unit 220, the first substrate 130 is rotated by a predetermined angle. It may be placed in a process position by the dipping unit 230 located downstream of the first substrate input unit 220. In addition, when the application of the paste to the first substrate 130 by the dipping unit 230 is completed, the stage 210 is rotated again by a predetermined angle to align the first substrate 130 to be described later. It can be placed in the process position by the unit 250. Subsequently, the stage 210 may rotate again by a predetermined angle so that the first substrate 130R, which has been pre-mounted in the index unit 200, is placed in the discharge position.

3 shows that the rotation angle of the stage 210 for each process unit is 90 degrees, but is not necessarily limited thereto, and a process of processing the first substrate 130 in the index unit 200 The rotation angle may vary depending on the number of units and/or the position of a unit that performs a processing unit processed on the first substrate 130.

4 is a side view of the index unit shown in FIG. 3.

3 and 4, the squeezing unit 240 is placed at a position adjacent to the dipping unit 230, and the paste is attached to the first substrate 130 by the dipping unit 240. A process of flattening the paste is performed before applying to the plurality of parts.

To this end, after the paste accommodated in the dipping table 241 is flattened by the squeezing unit 240 (refer to Fig. 4A), the dipping table 241 is It is transferred to the lower part to prepare the paste application by the dipping unit 230 (see FIG. 4(b)).

5 is a side view schematically showing an operation sequence of a squeezing unit included in the index unit shown in FIG. 3.

Referring to FIG. 5, the squeezing unit 240 includes a frame 242 and a squeezing base 243 installed on the frame 242 so as to be transportable in a transverse direction. A squeezing sensor 244, a front squeezing head 245, and a rear squeezing head 246 may be installed on the squeezing base 243.

5A and 5B, among the front squeezing head 245 and the rear squeezing head 246 installed on the squeezing base 243, the front squeezing head 245 is By selectively descending and moving forward while in contact with the paste P accommodated in the interior 241 of the dipping table, the paste P accommodated in the interior 241 of the dipping table may be primarily flattened. At this time, simultaneously with the movement of the front squeezing head 245, the squeezing sensor 244 may measure the flatness of the upper surface of the paste P. In addition, the squeezing sensor 244 is installed in front of the front squeezing head 245 and measures the flatness of the upper surface of the paste P by the front squeezing head 245. The degree to which the paste P is pressed can be adjusted.

Subsequently, referring to FIGS. 5C and 5D, the front squeezing head 245 installed on the squeezing base 243 rises, and the rear squeezing head 246 descends to the dipping The paste P flattened in one direction by the front squeezing head 245 is flattened again in the reverse direction by moving backward in contact with the paste P accommodated in the interior 241 of the table. Likewise, as the rear squeezing head 246 moves, the squeezing sensor 244 may measure the flatness of the upper surface of the paste P.

6 is a side view schematically showing the operation sequence of the dipping unit included in the index unit shown in FIG. 3, and FIG. 7 is a paste applied to a plurality of parts attached to the first substrate by the dipping unit shown in FIG. 6 It is a side view schematically showing the sequence of operations.

As described above, after the paste accommodated in the dipping table 241 by the squeezing unit 240 is flattened, the dipping table 241 is transferred to the lower portion of the dipping unit 240 and the dipping unit The paste application by 230 is prepared.

Referring to FIGS. 6A and 6B and 7A, the dipping unit 230 includes an adsorption head 231 and a z-axis transfer unit 232 in which the adsorption head 231 is installed below. ), and when the z-axis transfer unit 232 descends in the z-axis direction, the adsorption head 231 contacts the first substrate 130 and adsorbs the first substrate 130 (e.g. For example, vacuum adsorption). At this time, the adsorption head 231 adsorbs the rear surface of the sheet 131 to which the plurality of components (LEDs) are attached.

Subsequently, referring to FIGS. 6(c), 7(b) and (c), the first substrate 130 is adsorbed by the adsorption head 231 and the flattened paste is accommodated therein. The dipping table 241 and the dipping housing 247 are raised to perform a paste application process on a plurality of components attached to the first substrate 130.

As described above, when the dipping table 241 for accommodating the paste is raised while the adsorption head 231 adsorbs the first substrate 130 to perform the paste application process, the first substrate 130 Paste application can be performed more delicately for a plurality of parts attached to the device, and accordingly, the paste is applied to a part other than the surface on which the part is mounted on the second substrate, or the paste is immersed between the plurality of parts. As a result, it is possible to prevent a problem in which a short circuit or the like occurs in advance.

In addition, there is an advantage in that it is possible to improve the efficiency of the coating process since it is possible to simultaneously perform paste application on a plurality of components attached to one surface of the first substrate by the paste application method according to the present invention.

On the other hand, although not shown separately, according to another embodiment of the present invention, the dipping table 241 and the dipping housing 247 for accommodating a flattened paste therein rise, instead of adsorbing the first substrate 130. The adsorption head 231 may perform an additional lowering operation to apply a paste to a plurality of components attached to the first substrate 130.

8 is a perspective view schematically illustrating an operation sequence of an alignment unit included in the index unit shown in FIG. 3.

The index unit 200 further includes a first alignment unit 250 located downstream of the dipping unit 230, and the first alignment unit 250 is formed by a plurality of dipping units 230. The first substrate 130 on which the paste is applied may be aligned before being supplied to the gantry unit 300.

Referring to FIG. 8, the first alignment unit 250 may include an alignment base 251 and an alignment member 252 provided above the alignment base 251. The alignment member 252 serves to firstly hold the alignment of the first substrate 130 while fixing the first substrate 130. For this purpose, the upper portion of the alignment base 251 At least one can be provided. For example, the alignment member 252 may be provided in a shape such as a needle, and the alignment member 252 penetrates the sheet 131 of the first substrate 130 to pass through the first substrate ( 130 may be fixed by the alignment member 252.

The alignment base 251 on which the alignment member 252 is provided may be installed above the z-axis transfer unit 253, and may be disposed above the alignment base 251 by rotation of the stage 210. When the first substrate 130 on which the paste is applied to a plurality of components is located, the alignment base 251 is raised by the z-axis transfer unit 253 to align the first substrate 130. It can be made to perform a phosphorus process.

9 is a top view schematically showing a gantry part included in the component mounting apparatus shown in FIG. 1.

Referring to FIG. 9, the gantry unit 300 includes a y-axis frame 310 extending in a y-axis direction and a y-axis transfer unit 320 installed to be movable along the y-axis frame 310. In addition, an x-axis frame 330 extending in the x-axis direction is installed on one side of the y-axis transfer unit 320, and one side of the x-axis frame 330 (here, the x-axis frame 330) The first substrate 130R to which the paste is applied by the index unit 200 is picked up and transferred to the mounting stage 350 on one side of the index unit 200). The substrate pickup unit 340 may be installed.

The x-axis frame in which the first substrate pickup unit 340 is installed after picking up the first substrate 130R on which the paste application process has been completed from the index unit 200 by the first substrate pickup unit 340 As 330 moves in the y-axis direction by the y-axis transfer unit 320, the first substrate pickup unit 340 is positioned above the mounting stage 350, and the picked up first substrate ( 130R) is discharged to the mounting position of the mounting stage 350.

When the first substrate 130R on which the paste coating process has been completed is picked up from the index unit 200 by the first substrate pickup unit 340, the stage 210 of the index unit 200 is at a predetermined angle. By rotating by the amount, the first substrate 130R, which has been subsequently subjected to the paste application process, may be placed in a pickup position by the first substrate pickup unit 340 again.

In addition, after discharging the first substrate 130R to the mounting position of the mounting stage 350, the y-axis transfer unit 320 moves in the reverse direction along the y-axis again to move the first substrate pickup unit 340 ) Can be performed.

At this time, the other side of the x-axis frame 330 (here, the other side of the x-axis frame 330 is a position opposite to the one side of the first substrate pickup unit 340 is installed, that is, the mounting stage 350) (Meaning an area adjacent to ), a mounting head 360 for mounting a plurality of components attached to the first substrate 130R with respect to the second substrate transferred to the mounting stage 350 may be installed.

10 is a perspective view schematically illustrating an operation sequence of a mounting head included in the gantry unit shown in FIG. 9.

Referring to FIG. 10, a second substrate 410 supplied by a substrate supply unit to be described later is positioned at a mounting position of the mounting stage 350, and the first substrate pickup unit is positioned above the second substrate 410. The first substrate 130 transferred by 340 is positioned.

The mounting head 360 includes a second alignment unit 361 for aligning the first substrate 130 transferred by the first substrate pickup unit 340 with the second substrate 410 and the A mounting unit 362 that sequentially mounts a plurality of components attached to the first substrate 130 on the second substrate 410 while the first substrate 130 and the second substrate 410 are aligned ) Can be included.

In this case, referring to FIGS. 10A and 10B, after aligning the first substrate 130 with the second substrate 410 by the second alignment unit 361, the A mounting process may be performed by the mounting unit 362. If it is determined that the first substrate 130 is not aligned with the second substrate 410 by the second alignment unit 361, the first substrate 130 is ) And/or the position and/or angle of the second substrate 410 may be adjusted.

11 is a side view schematically showing a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to an embodiment of the present invention.

Referring to FIG. 11, the mounting unit 362 may include a center pin 362b positioned at a center and an outer shaft 362a surrounding the center pin 362b.

First, referring to Figures 11 (a) and (b), the center pin 362b and the outer shaft 362a is the seat 131, more accurately by the z-axis lowering of the mounting unit 362 Is the component (LED) attached to one surface of the sheet 131 by contacting the other surface of the sheet 131 on which the component (LED) is attached to the other surface and pressing the sheet 131 downward. ) Is brought into contact with one surface of the second substrate 410.

Subsequently, referring to (c) of FIG. 11, only the outer shaft 362a is maintained while the component (LED) is in contact with one surface of the second substrate 410 by the center pin 362b. By independently increasing the z-axis, the contact area of the mounting unit 362 with respect to the other surface of the sheet 131 is reduced. In this case, the center pin 362b penetrates the sheet 131 and remains in contact with the component LED, thereby separating the component LED from one surface of the sheet 131. At this time, the external force applied to the component (LED) by the center pin (362b) is greater than the adhesive force of the component (LED) to one surface of the sheet 131, the sheet 131 in the step The component (LED) can be selectively separated from.

Subsequently, as the mounting head 360 rises in the z-axis direction, the center pin 362b is separated from the component (LED) mounted on the substrate 410, and the x-axis and y-axis of the mounting unit 360 And a mounting process for a plurality of parts attached to the sheet 131 by repetitive operation along the z-axis (see FIGS. 11(d) and (e)).

12 and 13 are side views schematically showing a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to another embodiment of the present invention.

Referring to FIGS. 12A and 12B, the mounting head 360 may additionally include a laser irradiation unit 363. The laser irradiation unit 363 may be fixedly installed on one side of the second alignment unit 361 or the mounting unit 362 or may be installed spaced apart from each other. However, since at least the laser irradiation unit 363 is located upstream of the mounting unit 362 in the operation of the mounting head 360, the mounting unit after irradiation of the laser light by the laser irradiation unit 363 It is preferable to allow the mounting process of the component (LED) by 362 to be performed.

The laser irradiation unit 363 may output laser light having a predetermined intensity to perforate the sheet 131. In this case, it is preferable that the laser irradiation unit 363 perforates only a part of the area 134 to which the component (LED) is attached, as shown in FIG. 14A.

When the output area of the laser light by the laser irradiation unit 363 is widened and the entire area 134 to which the component (LED) is attached is perforated, the sheet 131 only by laser irradiation by the laser irradiation unit 363 The component (LED) can be separated from, but the intensity of the laser light irradiated by the laser irradiation unit 363 is excessively strong, causing damage to the component (LED) or separation from the sheet 131 There may be a problem that the component (LED) falls freely and is attached to an unintended position.

Accordingly, the perforation of the sheet 131 by the laser irradiation unit 363 is part of the area 134 to which the component (LED) is attached, preferably the area 134 to which the component (LED) is attached. It is preferable to perform only in the center of the.

The perforation operation of the sheet 131 by the laser irradiation unit 363 and the mounting operation of the component (LED) by the mounting unit 362 may be performed simultaneously or sequentially.

For example, after the perforation operation on the sheet 131 is completed by the laser irradiation unit 363, the mounting unit 362 is mounted on the component (LED) attached to the sheet 131 Alternatively, the mounting operation by the mounting unit 362 may be performed immediately after the perforation operation for one component (LED) is completed by the laser irradiation unit 363. In addition, in other cases, the mounting operation by the mounting unit 362 is performed after the perforation operation is completed for the component (LED) attached to a partial area of the sheet 131 by the laser irradiation unit 363. can do.

In addition, referring to FIGS. 13C to 13E, since the perforation operation on the sheet 131 was performed by the laser irradiation unit 363, the center pin 362b provided in the mounting unit 362 ), the component (LED) having a lower adhesion to the sheet 131 can be easily separated and mounted by the downward motion in the z-axis direction. At this time, preferably, the center pin 362b passes through the opening h formed by the perforation by the laser irradiation unit 363 to directly contact the component (LED), and the center pin 362b The component (LED) can be easily separated from the sheet 131 by the external force applied by the. Subsequently, a mounting process for a plurality of components attached to the sheet 131 may be performed by repeated operations along the x-axis, y-axis, and z-axis of the mounting unit 362.

14B is a top view of the first substrate after all of the plurality of components attached to the first substrate are mounted, and the plurality of components attached to the first sheet 131 are all the second substrate 410 When mounted on the first sheet 131, only the opening h perforated by the laser irradiation unit 363 exists in the first sheet 131. At this time, a part of the first sheet 131 perforated by the laser irradiation unit 363 does not remain on the component (LED), but by the energy of the laser light irradiated by the laser irradiation unit 363 When incinerated, the possibility that a part of the first sheet 131 exists as a foreign material in the component (LED) mounted on the second substrate 410 may be extremely low.

15 is a side view schematically showing a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to another embodiment of the present invention.

In FIG. 15, in the same manner as shown in FIG. 12, laser drilling may be performed on a part of the area to which the component (LED) is attached by the laser irradiation unit 363 provided on the mounting head 360. .

The laser irradiation unit 363 may output laser light having a predetermined intensity to perforate the sheet 131. In this case, it is preferable that the laser irradiation unit 363 punch only a part of the area 134 to which the component (LED) is attached, as shown in FIG. 16A.

In particular, only a part of the region 134 to which the component is attached to form an opening h, but one side of the opening h is longer than one side of the region 134 to which the component is attached to the substrate. I can. In this case, the mounting guide 362c, which will be described later, may pass through the opening h.

Similarly, the perforation operation of the sheet 131 by the laser irradiation unit 363 and the mounting operation of the component (LED) by the mounting unit 362 may be performed simultaneously or sequentially.

Subsequently, referring to FIGS. 15C and 15D, the center pin 362b provided in the mounting unit 362 because the perforation operation on the sheet 131 was performed by the laser irradiation unit 363. ), the component (LED) having a lower adhesion to the sheet 131 can be easily separated and mounted by the downward motion in the z-axis direction.

At this time, preferably, the center pin 362b passes through the opening h formed by the perforation by the laser irradiation unit 363 to directly contact the component (LED), and the center pin 362b The component (LED) can be easily separated from the sheet 131 by the external force applied by the.

In addition, the mounting unit 362 may include the center pin 362b positioned at the center and a mounting guide 362c surrounding the center pin 362b. The mounting guide 362c is the center pin 362b to support at least a portion of the edge of the component (LED) in a state in which the center pin (362b) is in contact with the component (LED) attached to the sheet 131. It is preferable to protrude to the lower portion of (362b). For example, the mounting guide 362c may be formed to protrude from the lower portion of the center pin 362b so as to support the upper and lower or left and right of the edge of the component (LED).

When the center pin 362b provided on the mounting unit 362 descends in the z-axis direction, the mounting guide 362c having a shape corresponding to at least a portion of the edge of the component (LED) is the center pin 362b By guiding the descending path of the component (LED) that is separated from and dropped from the sheet 131, it can be mounted on the correct mounting position of the second substrate 410.

Due to the mounting guide 362c, the component (LED), which is separated from the sheet 131 and falls, is not accurately mounted at the mounting position, thereby preventing a defect from occurring.

Subsequently, a mounting process for a plurality of components attached to the sheet 131 may be performed by repeated operations along the x-axis, y-axis, and z-axis of the mounting unit 362.

FIG. 16B is a top view of the first substrate after all the plurality of components attached to the first substrate are mounted, and the plurality of components attached to the first sheet 131 are all the second substrate 410 When mounted on the first sheet 131, only the opening h'perforated by the laser irradiation unit 363 is present in the first sheet 131. At this time, a part of the first sheet 131 perforated by the laser irradiation unit 363 does not remain on the component (LED), but by the energy of the laser light irradiated by the laser irradiation unit 363 When incinerated, the possibility that a part of the first sheet 131 exists as a foreign material in the component (LED) mounted on the second substrate 410 may be extremely low.

17 is a side view schematically illustrating a sequence in which a plurality of components attached to a first substrate by a mounting unit are mounted on a second substrate according to another embodiment of the present invention.

Referring to FIG. 17, the mounting head 360 may include UV irradiation units 365 and 367. Here, the UV irradiation units 365 and 367 may be installed in separate z-axis transfer units 364 and 366. The UV irradiation units 365 and 367 may be provided in two forms, as shown in (a) of FIG. 15.

First, the large-area type UV irradiation unit 365 cures the adhesive component of the sheet 131 at a time through the entire UV irradiation on the sheet 131, whereas the spot type UV irradiation unit 367 is one component. Through partial UV irradiation on the area to which the (LED) is attached or a partial area of the sheet 131, it is limited to the UV-irradiated area and cured. These two types of UV irradiation units 365 and 367 may be selected by comprehensively considering the area of the sheet 131 and the number of parts attached to the sheet 131.

As described above, the UV irradiation units 365 and 367 induce curing of the sheet 131, and the sheet 131 is cured by UV irradiation, so that the adhesion of the component (LED) to the sheet 131 In order to reduce this, it is preferable that the sheet 131 is a UV-curable film or contains at least a part of a UV-curable component.

In addition, it is preferable that the UV irradiation by the UV irradiation units 365 and 367 is performed at a level in which the adhesion of the component (LED) to the sheet 131 is not completely removed. If the sheet 131 is completely cured by the UV irradiation units 365 and 367 and the adhesive force of the component (LED) to the sheet 131 is completely removed, the component from the sheet 131 As the (LED) is unintentionally separated, there is a high possibility of mounting defects.

Therefore, the UV irradiation units 365 and 367 irradiate UV at a level in which the adhesion of the component (LED) to the sheet 131 is not completely removed, but the component (LED) from the sheet 131 Separation and mounting is preferably performed by a separate mounting unit 362, as shown in (b) and (c) of FIG. 17.

Referring to (b) and (c) of Figure 17, the implementation shown in Figure 11 because the adhesion of the component (LED) attached to the sheet 131 by the UV irradiation unit (365, 367) was reduced. Unlike an example, a separate outer shaft may not be required for the mounting unit 362. In this case, a component (LED) having a lower adhesion to the sheet 131 can be easily separated and mounted by the lowering motion of the center pin 362b provided on the mounting unit 362 in the z-axis direction. .

18 is a top view of the first substrate after all of the plurality of components attached to the first substrate are mounted, and the mounting unit 362 removes the sheet 131 when the components attached to the first substrate are mounted. Since it does not penetrate, there is no trace of perforation from the first sheet 131 mounted on the second substrate 410 of the plurality of components attached to the first sheet 131. Accordingly, the possibility that a part of the first sheet 131 exists as a foreign material in the component (LED) mounted on the second substrate 410 may be extremely reduced.

19 is a top view schematically illustrating a substrate supply unit included in the component mounting apparatus shown in FIG. 1.

Referring to FIG. 19, the substrate supply unit 400 includes an x-axis frame 430 extending in the x-axis direction and an x-axis transfer unit 420 installed to be movable along the x-axis frame 430. The second substrate 410 may be accommodated on the x-axis transfer unit 420. In addition, the x-axis frame 430 may be installed to be movable along the y-axis frame 440 on the y-axis frame 440 extending in the y-axis direction.

Accordingly, after the second substrate 410 is manually or automatically supplied to the top of the x-axis transfer unit 420 at the supply position of the second substrate 410, the x-axis transfer unit 420 The second substrate 410 may be discharged to the mounting stage 350 by moving in the y-axis direction along the y-axis frame 440.

The embodiments of the present invention have been described above, but those of ordinary skill in the relevant technical field can add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. Accordingly, the present invention can be variously modified and changed, and it will be said that this is also included within the scope of the present invention.

1000 parts mounting device 100 parts supply
110a first substrate magazine 110b magazine pickup unit
120 Magazine Transfer Unit 130 First Substrate
131 seat 132 inner ring
133 outer ring 200 index part
210 stage 220 first substrate input unit
230 Dipping unit 231 Suction head
232 z-axis feed unit 240 squeezing unit
241 Dipping Table 242 Frames
243 squeezing base 244 squeezing sensor
245 Front squeezing head 246 Rear squeezing head
250 first alignment unit 251 alignment base
252 Alignment member 253 Z-axis transfer unit
300 gantry section 310 y-axis frame
320 y-axis transfer unit 330 x-axis frame
340 first substrate pickup unit 350 mounting stage
360 mounting head 361 2nd alignment unit
362 mounting unit 400 board supply
410 second substrate 420 x-axis transfer unit
430 x-axis frame 440 y-axis frame

Claims (8)

A component supply unit for supplying a first substrate having a plurality of components attached to one surface thereof;
An index part for applying a paste to the plurality of parts attached to the first substrate supplied from the part supply part;
A substrate supply unit supplying a second substrate in which an area in which the plurality of components are mounted is defined to a mounting position; And
A gantry unit receiving the first substrate from the index unit and sequentially mounting the plurality of components coated with the paste on the second substrate at the mounting position;
Including,
The index unit,
A stage located downstream of the component supply unit and transferring the inputted first substrate;
A first substrate input unit positioned above the stage and receiving the first substrate from the component supply unit and inserting the first substrate into the stage;
A dipping unit located downstream of the first substrate input unit and applying a paste to a plurality of components attached to one surface of the first substrate transferred by the stage; And
A squeezing unit for flattening the paste applied to the plurality of parts;
Including,
The stage includes a plurality of spaces into which the first substrate is inserted,
The first substrate injected into the stage is transferred by rotation of the stage,
Parts mounting device.
The method of claim 1,
The first substrate,
A sheet to which the plurality of parts are attached;
An inner ring supporting the edge of the sheet; And
An outer ring supporting an edge of the inner ring;
Containing,
Parts mounting device.
delete The method of claim 1,
The squeezing unit,
A dipping table in which the paste is accommodated;
A squeezing head for flattening the paste accommodated in the dipping table; And
A squeezing sensor that measures a degree of flatness of the paste flattened by the squeezing head;
Containing,
Parts mounting device.
The method of claim 4,
The dipping table in which the paste flattened by the squeezing unit is accommodated is transferred to the lower portion of the dipping unit,
The first substrate is immersed in a paste accommodated in the dipping table while being adsorbed by the dipping unit, so that the paste is simultaneously applied to a plurality of components attached to one surface of the first substrate,
Parts mounting device.
The method of claim 1,
The index unit further includes a first alignment unit located downstream of the dipping unit,
The first alignment unit aligns the first substrate coated with a paste on a plurality of components by the dipping unit before being supplied to the gantry unit,
Parts mounting device.
The method of claim 1,
The gantry unit,
A first substrate pickup unit configured to pick up the first substrate on which the paste is applied to a plurality of components by the index unit and transfer the first substrate to the mounting position;
A second alignment unit for aligning the first substrate transferred by the first substrate pickup unit with the second substrate; And
A mounting unit for sequentially mounting a plurality of components attached to the first substrate on the second substrate while the first substrate and the second substrate are aligned;
Containing,
Parts mounting device.
The method of claim 7,
The mounting unit includes a center pin located in the center and an outer shaft surrounding the center pin,
The center pin and the outer shaft contact the first substrate by the z-axis lowering of the mounting unit, and at the same time contact the component attached to the first substrate to one surface of the second substrate,
While the component is maintained in contact with one surface of the second substrate by the center pin, only the outer shaft is independently raised in the z-axis to perform mounting of the component on the second substrate,
Parts mounting device.

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