JP2014192358A - Chip exfoliation device and chip exfoliation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip exfoliation device which is capable of stably exfoliating a chip without damaging the chip, further, for which operation in exfoliation work is simplified and high-accuracy control is not required, either, and which can be provided at a low cost as a device, and a chip exfoliation method.SOLUTION: The chip exfoliation device comprises: a stage receiving a seat; a collet adsorbing the chip at a side opposite to the stage; adsorption means for adsorbing the seat being received by the stage closer to the stage; a vertical movement mechanism for the stage which vertically moves the stage; and a pin member receiving the chip to be exfoliated via the seat. The chip to be exfoliated is received by the pin member via the seat being adsorbed by the stage and in the state where the chip to be exfoliated is adsorbed by the collet, the vertical movement mechanism is controlled by control means and the stage is moved down. A vertical movement mechanism for a pin in a pin-driven existing chip exfoliation device is used as the vertical movement mechanism for the stage.

Description

  The present invention relates to a chip peeling apparatus and a chip peeling method.

  In the manufacture of semiconductor devices, a chip bonding technique in which a wafer on which a large number of elements are fabricated is diced and separated into individual semiconductor chips, which are bonded one by one to a predetermined position such as a lead frame. Is adopted.

  That is, chips individually separated from the wafer are held on an expanding tape (adhesive tape), and semiconductor chips are picked up one by one from the expanding tape and conveyed to a bonding position on the lead frame or the like.

  For this pickup, a pickup device provided with an adsorption collet as a holding body is used. In other words, the suction collet has suction holes on its lower surface, and the semiconductor chip is sucked through the suction holes. Then, a robot arm constituting a conveying means is attached to the suction collet, and the semiconductor chip adsorbed on the suction collet can be transported to the bonding position by swinging this arm.

  By the way, a pick-up device having a push-up needle (push-up bar) is usually used for picking up a chip at the pick-up position (Patent Document 1, Patent Document 2, etc.). That is, as shown in FIGS. 7A and 7B, the pickup apparatus includes a pickup stage 5 on which a sheet (adhesive sheet) 1 is placed, and a push-up needle 2 is disposed on the pickup stage 5. Yes.

  In this case, first, as shown in FIG. 7A, the collet 4 descends from above the chip 3 to be peeled, and the collet 4 adsorbs the chip 3. In this state, as shown in FIG. 7B, the push-up needle 2 is raised as shown by an arrow to break through the sheet 1 and raise the collet 4. Thereby, the chip 3 attached on the pressure-sensitive adhesive sheet 1 is peeled off. In this case, the peeled chip 3 is attracted by the collet 4 and transported to the bonding position.

  For this reason, in the pin drive type as shown in FIG. 7, if the needle 2 is raised while the collet 4 is stopped, the push-up of the push-up needle 2 may damage the chip 3 to be peeled off. was there.

  Therefore, it has been necessary to control the vertical movement of the needle 2 and the vertical movement of the collet 4 as shown in the graph of FIG. That is, in FIG. 8, the collet 4 is lowered to adsorb the chip 3 to be peeled, and at the same time, the needle 2 is raised to receive the sheet 1 with the needle 2. From this state, the push-up needle 2 and the collet 4 are raised and the push-up needle 2 breaks through the sheet 1. Thereafter, the collet 4 is raised and the push-up needle 2 is lowered to complete the chip 3 peeling step.

  For this reason, in such a pin drive type, it is necessary to synchronously control the vertical movement of the needle 2 and the collet 4, and the control configuration is complicated, resulting in high cost. In addition, when the synchronization control accuracy is poor or unstable, the chip may be damaged.

  Thus, various tip peeling devices that do not require synchronous control of the vertical movement of the needle 2 and the collet 4 have been proposed as a configuration in which the needle 2 is not moved up and down (Patent Document 1 and Patent Document 2).

  In Patent Document 1, as shown in FIG. 9, a vacuum hole 6 larger than the chip 3 to be picked up (separated) is provided on the upper surface 5a of the stage 5 on which the sheet 1 is placed. Next, a peeling method (pickup method) using this peeling apparatus will be described.

  First, as shown in FIG. 9A, the tip of the needle 2 and the upper surface 5a of the stage 5 are arranged on substantially the same plane. In this state, the collet 4 positioned above the chip 3 to be peeled is lowered as indicated by an arrow, and the chip 3 is adsorbed by the collet 4.

  Thereafter, the inside of the stage 5 is set to a negative pressure state, and the sheet 1 is recessed in the vacuum hole 6 as shown in FIG. At this time, since the chip 3 is received by the needle 2, if the sheet 1 is recessed, the chip 3 is peeled from the sheet 1.

  Further, as described in Patent Document 2, as shown in FIG. 10, a recess 7 is provided on the upper surface 5a of the stage 5, and the sheet 1 is drawn into the recess.

  For this reason, in the thing of patent document 1 and patent document 2, when peeling the chip | tip 3, it is not necessary to raise the needle | hook 2, and the damage to the chip | tip 3 by a pin rise can be avoided. In addition, since it is not necessary to perform synchronous control of the needle 2 and the collet 4, the control configuration can be simplified.

JP-A-6-275663 JP-A-9-181150

  In the one described in Patent Document 1, since the sheet 1 is recessed in the vacuum hole 6, there is a case where the sheet 1 is excessively recessed, and if it is excessively recessed, the chip 3 adjacent to the chip 3 to be peeled is also removed. Drawn into. Due to this drawing, the chip 3 that is not the chip 3 to be peeled is damaged. For this reason, it is necessary to control the suction force with high accuracy, adjustment is difficult, and cost increases. Further, the vacuum hole 6 needs to be set larger than the outer shape of the chip 3, and it is necessary to form the vacuum hole 6 corresponding to the chip 3 to be peeled, resulting in high cost.

  In the thing of patent document 2, the sheet | seat 1 is attracted | sucked to a recessed part, and the sheet | seat 1 will not be dented too much. However, also in this case, it is necessary to make the concave portion larger than the outer shape of the chip 3 to be peeled off, and it is necessary to provide a concave portion corresponding to the chip 3 to be peeled, resulting in an increase in cost.

  Moreover, in the thing of patent document 2, simultaneously with attracting | sucking the sheet | seat 1 to the recessed part 7, the collet 4 is lowered | hung and the chip | tip 3 is adsorb | sucked to this collet 4. FIG. For this reason, when the sheet 12 is sucked into the concave portion 7, the chip 3 is also drawn into the concave portion and is supported only by the needle 2, and the chip 3 may be seriously damaged.

  Therefore, in view of such a situation, the present invention can stably peel the chip without damaging the chip, and also requires a simple operation with high precision and no need for high-precision control. An object of the present invention is to provide a chip peeling apparatus and a chip peeling method.

  The chip peeling apparatus of the present invention is a chip peeling apparatus for peeling a chip from a sheet on which a plurality of chips are attached, a stage that receives the sheet, a collet that sucks the chip on the opposite side of the stage, and a stage that receives the chip. A suction means for sucking the sheet that is being moved to the stage side, a vertical movement mechanism for the stage that moves the stage up and down, a pin member that receives the chip to be peeled through the sheet received by the stage, and a suction member And a control means for lowering the stage by controlling the vertical movement mechanism in a state where the chip to be peeled is received by the pin member via the sheet and the chip to be peeled is adsorbed by the collet. , The vertical movement mechanism for the pin in the existing chip peeling device of the pin drive type that moves the pin member up and down is the vertical movement mechanism for the stage One in which you used.

  According to the chip peeling apparatus of the present invention, the vertical movement mechanism can be set to the stage drive mode in which the vertical movement mechanism for the stage is used. With this stage drive mode, the pin member peels off the sheet adsorbed on the stage. The stage can be lowered while the chip to be peeled is received and the chip to be peeled is adsorbed by the collet. At the time of the lowering, the chip to be peeled is received by the pin member, so that the chip is peeled from the sheet by the lowering of the stage. For this reason, in this peeling operation, synchronous control of two members (for example, a collet and a pin member, a collet and a stage) is not required.

  Further, an existing pin drive type device can be used as the device, and the cost can be reduced. In this case, the vertical movement mechanism is provided with a switching mechanism for switching between the pin and the stage, and the vertical movement mechanism is switched between the pin and the stage according to the type of chip to be peeled off. preferable. That is, it is preferable to enable switching between the stage driving mode and the pin driving mode in which the pin member is moved up and down, thereby enabling the peeling process in each mode.

  The control by the control means is preferably control in which the stage is divided into a plurality of stages and lowered stepwise to a predetermined position. In this way, when the stage is divided into a plurality of stages and lowered to a predetermined position stepwise, the peeling force can be applied gradually.

  It is preferable that the control means can be used in combination with a pin for a vertical movement mechanism and a stage. This eliminates the need to newly configure a control means for the vertical movement mechanism of the existing chip peeling apparatus.

  The chip peeling method of the present invention includes a stage for receiving a sheet, a collet for sucking a chip on the opposite side of the stage, a suction means for sucking the sheet received on the stage to the stage side, and a sheet received on the stage A chip for peeling a chip from a sheet on which a plurality of chips are attached using a chip peeling device including a pin member that receives a chip to be peeled via a pin and a vertical movement mechanism for a pin that moves the pin member up and down A peeling method, in which the vertical movement mechanism for the pin is changed to a vertical movement mechanism for the stage, and the sheet to be moved to the stage side with the chip to be peeled received by the pin member via the sheet A sheet adsorption process that adsorbs to the chip, a chip adsorption process that adsorbs the chip to be peeled with a collet, and a sheet adsorption process that adsorbs the sheet to the stage side, And a stage lowering step of lowering the stage with respect to the chip to be peeled using the vertical movement mechanism changed for the stage in a state where the chip to be peeled in the chip sucking step is sucked to the collet. It is provided.

  According to the chip peeling method of the present invention, the vertical movement mechanism for the pins of the existing peeling device can be changed to the vertical movement mechanism for the stage in the changing step. That is, it is possible to switch between a stage drive mode in which the stage is moved up and down and a pin drive mode in which the pin member is moved up and down. The sheet can be adsorbed to the stage side by the sheet adsorbing step. In the chip adsorption process, the chip can be adsorbed on the collet. For this reason, as the stage drive mode, in the state where the sheet is adsorbed to the stage side in the sheet adsorbing step and the chip to be separated is adsorbed to the collet in the chip adsorbing step, the vertical movement mechanism is used. The stage can be lowered with respect to the chip to be peeled. At the time of the lowering, the chip to be peeled is received by the pin member, so that the chip is peeled from the sheet by the lowering of the stage. For this reason, in this peeling operation, synchronous control of two members (for example, a collet and a pin member, a collet and a stage) is not required.

  In the chip peeling apparatus and the chip peeling method of the present invention, if the stage driving mode is set, it is not necessary to perform synchronous control of the rise of the pin member and the rise of the suction collet, so that the movement of the apparatus can be easily controlled. Low cost can be realized. In addition, a stable peeling operation can be performed without damaging the chip. In addition, as the chip peeling device, in the existing pin driving type peeling device, the vertical movement mechanism for the pin may be used as the vertical movement mechanism for the stage, so that the device formation can be easily achieved at low cost. it can.

  With a switching mechanism that switches the vertical movement mechanism between the pin and the stage, the vertical movement mechanism can be switched between the pin and the stage depending on the type of chip to be peeled. The peeling operation according to the chip to be performed can be performed, and the versatility is excellent.

  When the stage is divided into a plurality of stages and lowered stepwise to a predetermined position, the peeling force can be applied gradually, stable peeling work can be performed, and there is an advantage that the chip is hardly damaged. .

  If the control means can be used for both the pin of the vertical movement mechanism and the stage, it is not necessary to newly configure the control means for the vertical movement mechanism of the existing chip peeling apparatus. Cost reduction can be achieved.

It is a principal part simplification figure which shows the chip | tip peeling method using the chip | tip peeling apparatus which shows embodiment of this invention. It is a time chart figure of operation | movement with the collet and stage of the said chip | tip peeling apparatus. It is a work process figure of the chip | tip peeling method which shows embodiment of this invention. It is a simplified top view which shows the relationship between a chip | tip and the suction hole of a stage. It is an enlarged view which shows the positional relationship of a pin member and a chip | tip. It is a principal part simplification figure which shows the chip | tip peeling method at the time of setting to pin drive mode. It is explanatory drawing of the chip | tip peeling method using the conventional chip | tip peeling apparatus. It is a time chart figure of operation of the conventional pin drive type collet and push-up pin. It is explanatory drawing of the chip | tip peeling method using the other conventional chip | tip peeling apparatus. It is explanatory drawing of the chip | tip peeling method using another conventional chip | tip peeling apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 is a simplified view of a main part of a chip peeling apparatus according to the present invention. This chip peeling apparatus is for peeling the chip 11 from the sheet 12 on which a plurality of chips 11 (only one is drawn in the drawing) is attached, and the chip 11 is adsorbed on the opposite side of the sheet 12. Collet 13 to be performed, pin member 14 for receiving chip 11 adsorbed by collet 13 via sheet 12, stage 16 for receiving sheet 12, and suction means 15 for sucking sheet 12 to the side opposite to the chip (FIG. 4). Reference).

  That is, in a bonding apparatus for dicing a wafer on which a large number of elements are formed at once and separating it into individual semiconductor chips 11 and bonding them one by one to a predetermined position such as a lead frame, the chip peeling of the present invention. A device is used. In the bonding apparatus, the chips 11 individually separated from the wafer are held on a sheet (adhesive sheet) 12 and picked up one by one from the sheet 12 at a pickup position to a bonding position (bonding position) on the lead frame or the like. Be transported.

  The collet (adsorption collet) 13 is provided with an adsorption hole opened on its lower surface (adsorption surface). A vacuum generator (not shown) is connected to the adsorption hole, and the suction hole is driven by driving the vacuum generator. Air is sucked and the chip 11 is adsorbed.

  The stage 16 is arranged at the pickup position for picking up. The stage 16 is made of, for example, a short cylindrical body, and as shown in FIG. 4, a suction hole 20 constituting a part of the suction means 15 and a pin insertion hole 18 through which the pin member 14 is inserted are formed. ing. A vacuum generator (not shown) is connected to each suction port 20, and the sheet 12 placed on the upper surface 17 of the stage 16 is connected to the upper surface of the stage 16 through the suction port 20 by driving the vacuum generator. Adsorbed.

  The vacuum generator connected to the collet 13 and the stage 16 may be a pump that rotates with a motor, or an ejector type that includes a nozzle and a diffuser. In FIG. 4, the illustration of the sheet 12 is omitted.

  The stage 16 can be moved up and down via a vertical movement mechanism M. As the vertical movement mechanism M, various mechanisms such as a port nut mechanism having a screw shaft and a ball nut screwed to the screw shaft, a cylinder mechanism, and a linear motor mechanism can be used.

  The vertical movement mechanism M is connected to a drive source D such as a motor for driving the vertical movement mechanism M and a control means 21 for controlling the drive source D. The moving mechanism M is driven and controlled. The control means 21 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The ROM stores programs executed by the CPU and data.

  By the way, in this embodiment, it is possible to switch between a stage drive mode as shown in FIG. 1 and a pin drive mode as shown in FIG. Therefore, a switching mechanism 22 that switches the vertical movement mechanism M between a pin and a stage is provided.

  As the switching mechanism 22, for example, a base 23 on which the vertical movement mechanism M and the control means 21 are mounted, a reciprocating mechanism 24 for reciprocating the base 23 in the directions of arrows A1 and A2, and the like can be configured. As the reciprocating mechanism 24, various mechanisms such as a port / nut mechanism, a cylinder mechanism, and a linear motor mechanism can be used. In the example shown in the figure, a cylinder mechanism is used.

  For this reason, in the stage driving mode shown in FIG. 1 (the mode in which the stage 16 moves up and down), the rod of the cylinder mechanism is retracted, and in the pin driving mode shown in FIG. 6 (the mode in which the pin 14 moves up and down). The rod of the cylinder mechanism is in an extended state. Further, the switching mechanism 22 requires a coupling mechanism for the stage 16 and the pin 14 and the vertical movement mechanism. As the connection mechanism, a publicly known mechanism such as a bolt / nut mechanism or a pin fastening mechanism can be used. In this case, it is preferable to be detachable.

  The stage 16 is accommodated in a cylindrical outer frame 25 in an inner fitting shape. The outer frame 25 is fixed and does not move up and down when the stage 16 and the pin 14 move up and down. Further, in the initial state shown in FIG. 1A, the upper surface 17 of the stage 16 and the upper surface 25a of the outer frame 25 are maintained at the same height.

  As shown in FIG. 5, the tip of the pin member 14 is a tapered tapered cone portion 14a. In the initial state shown in FIG. 1 (a), the sheet 12 is interposed between the pin member 14 and the chip 11. A clearance C corresponding to the thickness is provided. Note that the clearance C is not provided, and the cone portion 14 of the pin member 14 may be in contact with the chip to the extent that the chip 11 is not damaged.

  The collet 13 can move up and down on the pickup position, up and down on the bonding position, and reciprocating along the horizontal direction between the pickup position and the bonding position. As the moving mechanism, various mechanisms such as a port / nut mechanism, a cylinder mechanism, and a linear motor mechanism can be used. Furthermore, an XYZθ axis stage, a robot arm that can move in the XYZθ directions, and the like can be used. . The moving mechanism is controlled by the control means. As the control means, the control means 21 of the vertical movement mechanism M or other control means may be used. As other control means, the same microcomputer as the control means 21 can be used.

  Next, a chip peeling method for peeling a chip using the chip peeling apparatus configured as described above will be described with reference to FIG. This chip peeling method includes a stage drive mode as shown in FIG. 3A and a pin drive mode as shown in FIG.

  The stage drive mode includes a change step 30 for changing the pin vertical movement mechanism M to a stage vertical movement mechanism, a sheet suction step 31 for sucking the sheet 12 to the stage side, and the chip 11 to be peeled off to the collet 13. A chip suction process 32 for sucking and a stage lowering process 33 for lowering the stage 16 with respect to the chip 11 to be peeled. The pin driving mode includes a change process 40 for changing the vertical movement mechanism for the stage to a vertical movement mechanism for the pin, a sheet adsorption process 41 for adsorbing the sheet to the stage side, and the chip 11 to be peeled off on the collet 13. A chip adsorbing step 42 for adsorbing the pin member 14 and a pin member raising step 43 for raising the pin member 14 with respect to the chip 11 to be peeled.

  FIG. 1 shows a stage drive mode, in which the vertical movement mechanism M is switched to a state in which the stage 16 can move up and down (changing step 30). In this state, as shown in FIG. The upper surface 17 of the stage 16 and the upper surface 25a of the outer frame body 25 are arranged on the same plane. In this state, a stopper or the like for maintaining the position of the pin member 14 is necessary.

  In this state, the suction means 15 is driven to suck air from the suction holes 20 to bring the sheet 12 into close contact with the upper surface 17 of the stage 16 (sheet suction step 31). At this time, the sheet 12 side is moved by, for example, an XYZθ stage, and the chip 11 to be peeled is arranged at the pickup position.

  Thereafter, the collet 13 disposed on the pickup position is lowered, and the lower surface (adsorption surface) of the collet 13 is brought into contact with the chip 11 to be peeled, and the chip 11 is adsorbed to the collet 13 (chip adsorption process 32). . In this case, the pin member 14 is maintained in the state shown in FIG.

  Next, the stage 16 is lowered from the state shown in FIG. 1A as shown in FIG. That is, as shown in FIG. 2, the stage 16 is divided into a plurality of stages (in this case, two stages) and is lowered stepwise to a predetermined position (stage lowering step 33). At this time, the pin member 16 and the collet 13 maintain their positions without moving up and down. For this reason, the chip 11 is received by the pin member 16, and the sheet 12 is peeled from the chip 11.

  Thereafter, the collet 13 rises and transports the sucked chip to the bonding position. This chip 11 is bonded at this bonding position. Then, the stage 16 is raised to return to the initial state shown in FIG. 1A, the suction of the stage 16 is released, and then the chip 11 to be peeled next is positioned on the pickup stage. Thereafter, all the chips 11 of this single sheet 12 can be peeled off by sequentially performing the above steps.

  Next, a chip peeling method in the pin driving mode will be described. In this case, the process is performed as shown in FIG. In the pin driving mode, first, the vertical movement mechanism M is switched to a state in which the pin member 14 can move up and down (changing step 41), and in this state, the pin member 14 is raised to the state shown in FIG. Further, the stage 16 maintains its upper surface 17 in a state where it is disposed on the same plane as the upper surface 25 a of the outer frame body 25. For this reason, a stopper or the like for maintaining the position of the stage 16 is necessary.

  Then, the suction means 15 is driven to suck air from the suction holes 20 to bring the sheet 12 into close contact with the upper surface 17 of the stage 16 (sheet suction step 41). Thereafter, the collet 13 disposed on the pickup position is lowered, and the lower surface (adsorption surface) of the collet 13 is brought into contact with the chip 11 to be peeled, and the chip 11 is adsorbed to the collet 13 (chip adsorption process 42). .

  In this state, the pin member 14 is raised as shown in FIG. 6 (b) while maintaining the stage 16 in that position. At this time, the pin member 14 is divided into a plurality of steps (in this case, two steps) and is raised stepwise to a predetermined position (pin member raising step 43). That is, the stepwise rise of the pin member 14 can be controlled by the control means 21. Further, the collet 13 is raised in synchronization with the rise of the pin member 16. For this reason, since the sheet 12 is adsorbed to the upper surface 17 of the stage 16, the sheet 12 is peeled from the chip 11 as the pin member 14 is raised. In addition, the control means of the collet 13 can be used as the control means for synchronizing the pin member 16 and the collet 13.

  Thereafter, the collet 13 rises and transports the adsorbed chip 11 to the bonding position. This chip 11 is bonded at this bonding position. Then, the pin member 14 is lowered to return to the initial state shown in FIG. 6A, the suction of the stage 16 is released, and then the chip 11 to be peeled next is positioned on the pickup stage. Thereafter, all the chips 11 of this single sheet 12 can be peeled off by sequentially performing the above steps.

  According to the chip peeling apparatus, in the stage drive mode, the chip 11 to be peeled is received by the pin member 14 via the sheet 12 adsorbed to the stage 16 and the chip 11 to be peeled is collet 13. Only the stage 16 can be lowered while being adsorbed at. Since the chip 11 to be peeled is received by the pin member 14 at the time of the lowering, the chip 11 is peeled from the sheet 12 by the lowering of the stage 16. For this reason, synchronous control of two members (for example, the collet 13 and the pin member 14, the collet 13 and the stage 16) is not required in this peeling operation.

  That is, since the synchronous control of the raising of the pin member 14 and the raising of the collet 13 is not required, it is possible to easily control the movement of the apparatus and to realize a low cost. In addition, a stable peeling operation can be performed without damaging the chip 11.

  The stage 16 can be divided into a plurality of stages and lowered stepwise to a predetermined position, the peeling force can be gradually applied, stable peeling work can be performed, and the chip 11 is hardly damaged. There are advantages.

  In addition, the above-mentioned device can be an existing pin drive type, and it is only necessary to use a pin vertical movement mechanism for the stage vertical movement mechanism M, so that the device can be formed at low cost and easily. Can be achieved. In this case, a switching mechanism 22 for switching the vertical movement mechanism M between the pin and the stage is provided, and the vertical movement mechanism M is switched between the pin and the stage according to the type of the chip 11 to be peeled off. It can be configured as above, and is excellent in versatility.

  In the case where the stage 16 is divided into a plurality of stages and lowered stepwise to a predetermined position, the peeling force can be applied gradually, a stable peeling operation can be performed, and the chip 11 is hardly damaged. There is. As the control means 21, it is possible to use both the pin for the vertical movement mechanism M and the stage, and there is no need to newly configure the control means 21 for the vertical movement mechanism of the existing chip peeling apparatus.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above embodiment, and various modifications are possible. For example, when the stage 16 is lowered, the embodiment has two stages. However, even if there are three or more steps, it may be a continuous descent without performing such a stepwise descent. Further, when descending stepwise, the amount of descent at each step can be set arbitrarily, and the amount of descent at each step can be the same or different. As the entire descending amount of the stage 16, it is possible to select an amount that does not damage the chip 11 adjacent to the chip 11 to be peeled by being drawn into the recess to be formed.

  The number of suction ports 20 opening on the upper surface 17 of the stage 16 can be increased or decreased. However, when the chip 11 is rectangular or rectangular as shown in the figure, the chip can be separated evenly as shown in the figure. It is preferable to correspond to the corners of the four corners. Moreover, in the said embodiment, although the stage 16 was comprised from the short cylinder body, the thing of other shapes, such as a prismatic body, may be sufficient.

  The pin member 14 shown in FIG. 1 is not limited to one for the stage 16, and may be a plurality of two or more. Further, the outer diameter of the pin member 14, the taper angle of the tapered portion 14a, the sharpness of the tip, and the like may be any as long as they can break through the sheet 12.

  3A and 3B, the sheet adsorption process 31 (41) is performed before the chip adsorption process 32 (42). Conversely, the chip adsorption process 32 (42) is performed more than the sheet adsorption process 31 (41). ) May be performed first. Moreover, you may perform the chip | tip adsorption | suction process 32 (42) and the sheet | seat adsorption | suction process 31 (41) simultaneously.

11 Chip 12 Sheet 13 Collet 14 Pin member 15 Adsorption means 16 Stage 21 Control means 22 Switching mechanism M Vertical movement mechanism

Claims (5)

A chip peeling apparatus for peeling a chip from a sheet on which a plurality of chips are attached,
A stage for receiving the sheet, a collet for sucking the chip on the opposite side of the stage, a suction means for sucking the sheet received on the stage to the stage side, a vertical movement mechanism for the stage for moving the stage up and down, and a stage A pin member that receives a chip to be peeled off via a sheet that is being received, and a chip that is to be peeled off by a pin member via a sheet that is adsorbed on a stage, and the chip to be peeled off is adsorbed by a collet And a control means for lowering the stage by controlling the vertical movement mechanism, and the pin vertical movement mechanism for the pin drive type existing chip peeling apparatus for moving the pin member up and down is used as the stage vertical movement mechanism. A chip peeling apparatus characterized by being used as:   A switching mechanism for switching a vertical movement mechanism between a pin and a stage is provided, and the vertical movement mechanism is switched between a pin and a stage according to the type of chip to be peeled. The chip peeling apparatus as described.   3. The chip peeling apparatus according to claim 1, wherein the control means controls the stage to be divided into a plurality of stages and descends to a predetermined position stepwise.   4. The chip peeling apparatus according to claim 2, wherein the control means can be used in combination with a pin for a vertical movement mechanism and a stage. A stage for receiving the sheet, a collet for sucking the chip on the opposite side of the stage, a suction means for sucking the sheet received on the stage to the stage side, and a chip to be peeled off via the sheet received on the stage A chip peeling method using a chip peeling device provided with a pin member to be received and a pin vertical movement mechanism for moving the pin member up and down, and peeling the chip from a sheet on which a plurality of chips are attached,
A changing step of changing the vertical movement mechanism for the pin to a vertical movement mechanism for the stage;
In a state where the chip to be peeled is received by the pin member via the sheet, a sheet adsorption process for adsorbing the sheet to the stage side,
A chip adsorption process for adsorbing the chip to be peeled off with a collet;
The stage is peeled off using the vertical movement mechanism that has been changed for the stage while the sheet is sucked to the stage in the sheet suction process and the chip to be peeled in the chip suction process is sucked to the collet. And a stage lowering step for lowering the chip to be chipped.

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