TWI720667B - Pick-up device and mounting device for electronic parts - Google Patents

Pick-up device and mounting device for electronic parts Download PDF

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TWI720667B
TWI720667B TW108138938A TW108138938A TWI720667B TW I720667 B TWI720667 B TW I720667B TW 108138938 A TW108138938 A TW 108138938A TW 108138938 A TW108138938 A TW 108138938A TW I720667 B TWI720667 B TW I720667B
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adhesive sheet
extruded
bodies
pressing
pick
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TW202017082A (en
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小西宜明
志賀康一
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日商芝浦機械電子裝置股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

本發明提供一種能夠抑制電子零件的破損的拾取裝置以及安裝裝置。實施方式的拾取裝置具有：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與粘著片的和電子零件為相反側的一面相向地設置，支承部具有：吸附面，吸附保持粘著片；擠壓部，與共同的軸呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在吸附面內沿著共同的軸而可移動，且外形的大小不同；驅動機構，進行擠壓動作及遠離動作，所述擠壓動作使擠壓部移動而利用所有擠壓體擠壓粘著片，所述遠離動作使擠壓體依次向遠離方向移動；以及轉換機構，設於驅動機構，將沿著共同的軸移動的單一的驅動構件的動作轉換為多個擠壓體的遠離動作。The present invention provides a pickup device and a mounting device capable of suppressing damage to electronic components. The pick-up device of the embodiment has: a pick-up part that picks up electronic parts attached to the adhesive sheet; and a support part provided opposite to the side of the adhesive sheet and the electronic part, and the support part has: a suction surface, suction Holding the adhesive sheet; the pressing part is provided with a plurality of extruded bodies in a nested shape coaxially with the common axis, and the plurality of extruded bodies are arranged to be movable along the common axis in the suction surface , And the size of the outer shape is different; the drive mechanism performs a squeezing action and a distance action, the squeezing action moves the squeezing part and uses all the squeezing bodies to squeeze the adhesive sheet, and the distance action causes the squeezing bodies to Move away from the direction; and a conversion mechanism, provided in the drive mechanism, converts the movement of a single drive member that moves along a common axis into the move away from a plurality of extruded bodies.

Description

電子零件的拾取裝置以及安裝裝置Pick-up device and mounting device for electronic parts

本發明涉及一種電子零件的拾取（pick up）裝置以及安裝裝置。The invention relates to a pick-up device and an installation device for electronic parts.

在將半導體晶片安裝於導線架（lead frame）或佈線基板、插入式基板（interposer substrate）等基板上時，進行下述操作，即：從晶圓薄片（wafer sheet）將半導體晶片逐一取出，移送至基板上並進行安裝，所述晶圓薄片是將以每個半導體晶片進行切斷而單片化的半導體晶圓貼附於粘著片而成。When mounting semiconductor wafers on a lead frame, wiring substrate, interposer substrate, or other substrates, perform the following operations, namely: take out the semiconductor wafers one by one from the wafer sheet and transfer them The wafer sheet is mounted on a substrate, and the wafer sheet is formed by attaching a semiconductor wafer cut and singulated for each semiconductor wafer to an adhesive sheet.

這樣，為了將貼附於晶圓薄片等粘著片的半導體晶片等電子零件從粘著片剝離並拾取，可使用具有拾取機構及上頂機構的拾取裝置。拾取機構具有吸附電子零件的吸附噴嘴。上頂機構利用上頂銷（pin）將吸附於吸附噴嘴的電子零件從下表面側上頂，輔助電子零件從粘著片的剝離及取出。In this way, in order to peel and pick up electronic components such as a semiconductor wafer attached to an adhesive sheet such as a wafer sheet from the adhesive sheet, a pick-up device having a pick-up mechanism and a top mechanism can be used. The pick-up mechanism has a suction nozzle that sucks electronic parts. The top mechanism uses top pins (pins) to lift up the electronic parts adsorbed on the suction nozzle from the lower surface side, assisting in peeling and taking out the electronic parts from the adhesive sheet.

此外，最近的半導體晶片正以其厚度為小於或等於50 μm的方式推進薄型化。在一邊拉伸粘著片一邊僅利用上頂銷將如此薄的半導體晶片上頂時，半導體晶片損傷的可能性變大。因此，如專利文獻1所示，開發出了下述拾取裝置，此拾取裝置具有使軸線一致而同心地設置的多個上推體，以使貼附於半導體晶片的下表面的粘著片的剝離從半導體晶片的周邊部向中心部緩緩地進行。此種拾取裝置中，多個上推體所形成的上表面形狀通常形成為與供拾取的半導體晶片同等的形狀、例如四方形。In addition, recent semiconductor wafers are being thinned so that their thickness is less than or equal to 50 μm. When such a thin semiconductor wafer is lifted up only by the top pin while the adhesive sheet is stretched, the semiconductor wafer is more likely to be damaged. Therefore, as shown in Patent Document 1, a pick-up device has been developed which has a plurality of push-up bodies arranged concentrically with the axis to be attached to the adhesive sheet on the lower surface of the semiconductor wafer. The peeling progresses gradually from the peripheral portion to the center portion of the semiconductor wafer. In such a pickup device, the shape of the upper surface formed by the plurality of push-up bodies is usually formed into a shape equivalent to the semiconductor wafer to be picked up, for example, a square shape.

所述拾取裝置中，首先使多個上推體同時上升至規定高度，將供拾取的半導體晶片的整個下表面擠壓上推。然後，留下位於最外側的上頂體而使其他上頂體進一步上升至規定高度為止。接著，留下第2個上頂體而使其他上頂體上升。半導體晶片的下表面的由上頂體進行的支撐從周邊部向中心部依次開放，因此半導體晶片容易從粘著帶剝離。進而提出：為了促進粘著帶從半導體晶片的下表面的剝離，至少在位於最外周的上推體的與粘著帶的接觸面（上表面）設置抽吸力在與粘著帶之間發揮作用的凹部。設於上推體的上表面的凹部成為粘著片開始從半導體晶片剝離的部位，因此能夠促進剝離帶從半導體晶片的剝離。In the pickup device, first, a plurality of push-up bodies are raised to a predetermined height at the same time, and the entire lower surface of the semiconductor wafer to be picked up is pressed and pushed up. Then, the upper acrobody located on the outermost side is left, and the other upper acrosomes are further raised to a predetermined height. Then, the second upper acrosome is left and the other upper acrosomes are raised. The support by the upper top body of the lower surface of the semiconductor wafer is sequentially opened from the peripheral portion to the center portion, so the semiconductor wafer is easily peeled from the adhesive tape. It is further proposed that in order to promote the peeling of the adhesive tape from the lower surface of the semiconductor wafer, at least the contact surface (upper surface) of the pusher located at the outermost periphery with the adhesive tape is provided with a suction force to exert a suction force between the adhesive tape and the adhesive tape. The concave part of the function. The concave portion provided on the upper surface of the push-up body serves as a location where the adhesive sheet starts to peel from the semiconductor wafer, and therefore it is possible to promote the peeling of the peeling tape from the semiconductor wafer.

[現有技術文獻] [專利文獻] [專利文獻1]日本專利特開2010-056466號公報[Prior Art Literature] [Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2010-056466

[發明所要解決的問題] 但是，即便在使用如上所述那樣的具有多個上推體並且至少在位於最外周的上推體的上表面設有凹部的拾取裝置時，有時半導體晶片也會產生破損。半導體晶片破損的原因雖不明確，但在將以厚度為例如小於或等於30 μm的方式經薄型化的半導體晶片從粘著片剝離並拾取時，容易產生半導體晶片的破損。另外，形成於半導體晶片的電路也為了實現半導體晶片的高容量化或高功能化等而高密度化，此種電路形狀也可認為是半導體晶片破損的一個原因。[The problem to be solved by the invention] However, even when a pickup device having a plurality of push-up bodies as described above is used and a recess is provided at least on the upper surface of the push-up body located at the outermost periphery, the semiconductor wafer may be damaged. Although the cause of the damage of the semiconductor wafer is not clear, when the semiconductor wafer thinned to a thickness of, for example, 30 μm or less is peeled from the adhesive sheet and picked up, the semiconductor wafer is likely to be damaged. In addition, circuits formed on semiconductor wafers have also been densified in order to achieve higher capacity or higher functionality of the semiconductor wafers. Such a circuit shape can also be considered as a cause of damage to the semiconductor wafer.

例如對於反及（NAND）型快閃記憶體（flash memory）等記憶體晶片而言，其厚度逐年薄型化，如上文所述那樣，正推進具有小於或等於30 μm、進而小於或等於25 μm、小於或等於20 μm那樣的厚度的半導體晶片的實用化。因此，尋求一種即使在拾取此種經薄型化的半導體晶片時，也可更可靠地將半導體晶片從粘著片剝離並拾取而不使半導體晶片產生破損的拾取裝置。For example, for memory chips such as NAND flash memory, the thickness is becoming thinner year by year. As mentioned above, it is advancing to have less than or equal to 30 μm, and then less than or equal to 25 μm. , Practical use of semiconductor wafers with a thickness less than or equal to 20 μm. Therefore, even when picking up such a thinned semiconductor wafer, the semiconductor wafer can be peeled from the adhesive sheet and picked up more reliably without causing damage to the semiconductor wafer.

本發明的目的在於提供一種能夠抑制電子零件的破損的拾取裝置以及安裝裝置。The object of the present invention is to provide a pickup device and a mounting device capable of suppressing breakage of electronic components.

[解決問題的技術手段] 實施方式的電子零件的拾取裝置包括：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與所述粘著片的和所述電子零件為相反側的一面相向地設置，所述支承部包括：吸附面，吸附保持所述粘著片的與供拾取的所述電子零件對應的區域；擠壓部，與共同的軸呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在所述吸附面內沿著所述共同的軸而可移動，且外形的大小不同；驅動機構，進行擠壓動作及遠離動作，所述擠壓動作使所述擠壓部移動而利用所有擠壓體擠壓所述粘著片，所述遠離動作從任一擠壓體起使鄰接的擠壓體依次向使所述電子零件從粘著片剝離的遠離方向移動；以及轉換機構，設於所述驅動機構，將沿著所述共同的軸移動的單一的驅動構件的動作轉換為所述多個擠壓體的遠離動作。[Technical means to solve the problem] The pick-up device of the electronic component of the embodiment includes: a pick-up part which picks up the electronic part attached to the adhesive sheet; and a support part which is provided facing the surface of the adhesive sheet on the opposite side to the electronic part, so The supporting portion includes: a suction surface that sucks and holds the area of the adhesive sheet corresponding to the electronic component for picking up; the pressing portion is provided with a plurality of pressings in a nested shape coaxial with a common axis The plurality of extruded bodies are arranged to be movable along the common axis in the suction surface, and have different shapes and sizes; the driving mechanism performs an extruding action and a moving away, the extruding action The pressing portion is moved to press the adhesive sheet with all the pressing bodies, and the moving away from any pressing body causes adjacent pressing bodies to peel off the electronic component from the adhesive sheet in sequence. And a conversion mechanism, provided in the drive mechanism, converts the movement of a single drive member that moves along the common axis into the movement of the plurality of extruded bodies.

所述轉換機構也可包括：至少一對伸出部，從各擠壓體的相反的側面向外伸出；施力構件，對各擠壓體的伸出部向所述遠離方向個別地施力；以及第1凸輪機構，由所述驅動構件所驅動，從任一擠壓體起向鄰接的擠壓體依次允許各擠壓體向所述遠離方向移動。The conversion mechanism may also include: at least a pair of protruding parts that protrude outward from opposite sides of each extruded body; and a urging member that individually applies the protruding parts of each extruded body in the away direction Force; and the first cam mechanism, driven by the drive member, from any extrusion body to the adjacent extrusion body sequentially allowing each extrusion body to move in the away direction.

所述第1凸輪機構也可包括：凸輪面，設於各擠壓體的和擠壓於所述粘著片的擠壓面為相反側的一面，沿著與所述共同的軸交叉的方向而在每個所述擠壓體中形狀不同；以及滾輪軸，與各擠壓體的凸輪面接觸，對各擠壓體向抵抗所述施力構件的方向施力，並且在與所述遠離方向交叉的方向移動。The first cam mechanism may include: a cam surface provided on a surface of each pressing body opposite to the pressing surface pressed against the adhesive sheet, along a direction intersecting the common axis In each of the extruded bodies, the shape is different; and the roller shaft is in contact with the cam surface of each extruded body, applies force to each extruded body in the direction resisting the force applying member, and moves away from the Move in the direction that crosses the direction.

所述滾輪軸的移動範圍也可為所述吸附面的外緣的範圍內。也可根據所述凸輪面的形狀，施力構件對所述一對伸出部中的一者與另一者的施加力不同。也可將最外側的所述擠壓體的一對所述伸出部設於最外側，隨著成為內側的所述擠壓體而依次在內側設有所述伸出部。The moving range of the roller shaft may also be within the range of the outer edge of the suction surface. Depending on the shape of the cam surface, the urging member may apply a different force to one of the pair of protrusions and the other. It is also possible to provide a pair of the protruding portions of the outermost extruded body on the outermost side, and sequentially provide the protruding portions on the inner side following the innermost extruded body.

所述轉換機構也可包括：第2凸輪機構，將所述驅動構件的沿著所述共同的軸的方向上的移動轉換為所述滾輪軸的與所述遠離方向交叉的方向上的移動。The conversion mechanism may include a second cam mechanism that converts the movement of the drive member in a direction along the common axis into a movement of the roller shaft in a direction crossing the distance direction.

所述第2凸輪機構也可包括滾輪及與所述滾輪接觸的傾斜面，且所述第2凸輪機構為直動凸輪，所述直動凸輪將所述滾輪及所述傾斜面中的任一者設為沿著所述共同的軸移動的主動凸輪，將另一者設為在與所述共同的軸交叉的方向移動的從動凸輪。The second cam mechanism may also include a roller and an inclined surface in contact with the roller, and the second cam mechanism may be a linear cam that connects any of the roller and the inclined surface One is a driving cam that moves along the common axis, and the other is a driven cam that moves in a direction crossing the common axis.

所述擠壓部也可包括五個或五個以上的擠壓體，最外側的擠壓體形成為擠壓面的大小與供拾取的所述電子零件的貼附於所述粘著片的面的大小相同或略小，最內側的擠壓體形成為擠壓面的面積成為供拾取的所述電子零件的貼附於所述粘著片的面的面積的30%或30%以下的大小。The squeezing part may also include five or more squeezing bodies, and the outermost squeezing body is formed to have the size of the squeezing surface and the surface of the electronic component for picking up attached to the adhesive sheet. The size of the innermost extruded body is the same or slightly smaller, and the area of the extruded surface becomes 30% or less of the area of the surface attached to the adhesive sheet of the electronic component to be picked up.

本發明的電子零件的拾取裝置包括：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與所述粘著片的和所述電子零件為相反側的一面相向地設置，所述支承部包括：吸附面，吸附保持所述粘著片的與供拾取的所述電子零件對應的區域；擠壓部，與共同的軸呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在所述吸附面內沿著所述共同的軸而可移動，且外形的大小不同；驅動機構，進行擠壓動作及遠離動作，所述擠壓動作使所述擠壓部移動而利用所有擠壓體擠壓所述粘著片，所述遠離動作從任一擠壓體起使鄰接的擠壓體依次向使所述電子零件從粘著片剝離的遠離方向移動；以及轉換機構，設於所述驅動機構，將沿著所述共同的軸移動的單一的驅動構件的動作轉換為所述多個擠壓體的遠離動作，所述轉換機構包括：施力構件，對各擠壓體向所述遠離方向個別地施力；凸輪面，設於各擠壓體的和擠壓於所述粘著片的擠壓面為相反側的一面，沿著與所述共同的軸交叉的方向而在每個所述擠壓體中形狀不同；以及滾輪軸，與各擠壓體的凸輪面接觸，對各擠壓體向抵抗所述施力構件的方向施力，並且在與所述遠離方向交叉的方向移動。The pick-up device for electronic parts of the present invention includes: a pick-up part which picks up electronic parts attached to an adhesive sheet; and a support part which is provided facing the side of the adhesive sheet on the opposite side to the electronic part, so The supporting portion includes: a suction surface that sucks and holds the area of the adhesive sheet corresponding to the electronic component for picking up; the pressing portion is provided with a plurality of pressings in a nested shape coaxial with a common axis The plurality of extruded bodies are arranged to be movable along the common axis in the suction surface, and have different shapes and sizes; the driving mechanism performs an extruding action and a moving away, the extruding action The pressing portion is moved to press the adhesive sheet with all the pressing bodies, and the moving away from any pressing body causes adjacent pressing bodies to peel off the electronic component from the adhesive sheet in sequence. And a conversion mechanism, provided in the drive mechanism, converts the movement of a single drive member moving along the common axis into the movement of the plurality of extruded bodies, and the conversion mechanism includes : A urging member that individually energizes each extruded body in the away direction; a cam surface is provided on the opposite side of the extruded body and the extruded surface pressed against the adhesive sheet, along The shape of each of the extruded bodies is different in the direction intersecting the common axis; and the roller shaft is in contact with the cam surface of each extruded body, and opposes each extruded body against the urging member It applies force in the direction and moves in a direction that intersects the away direction.

本發明的電子零件的拾取裝置包括：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與所述粘著片的和所述電子零件為相反側的一面相向地設置，所述支承部包括：吸附面，吸附保持所述粘著片的與供拾取的所述電子零件對應的區域；擠壓部，呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在所述吸附面內沿著共同的軸而可移動，且外形的大小不同；以及驅動機構，使所述多個擠壓體沿著所述共同的軸而個別地動作，且包括沿著共同的軸移動的單一的驅動構件及將所述單一的驅動構件的動作轉換為所述多個擠壓體的個別的動作的轉換機構。The pick-up device for electronic parts of the present invention includes: a pick-up part which picks up electronic parts attached to an adhesive sheet; and a support part which is provided facing the side of the adhesive sheet on the opposite side to the electronic part, so The supporting portion includes: a suction surface that suctions and holds the area of the adhesive sheet corresponding to the electronic component for picking up; the pressing portion is provided with a plurality of extrusions in a coaxial nesting shape, the A plurality of extruded bodies are arranged to be movable along a common axis in the suction surface, and the sizes of the outer shapes are different; and a driving mechanism that causes the plurality of extruded bodies to be individually along the common axis The action includes a single drive member that moves along a common axis and a conversion mechanism that converts the action of the single drive member into individual actions of the plurality of extruded bodies.

本發明的安裝裝置包括：供給裝置，保持貼附保持有半導體晶片的粘著片；基板平台，載置基板；拾取裝置，從所述供給裝置所保持的所述粘著片拾取所述半導體晶片；以及安裝機構，將由所述拾取裝置所取出的所述半導體晶片安裝於所述基板，且所述拾取裝置為所述任一拾取裝置。The mounting device of the present invention includes: a supply device that holds and adheres an adhesive sheet holding a semiconductor wafer; a substrate platform that mounts a substrate; and a pickup device that picks up the semiconductor wafer from the adhesive sheet held by the supply device And a mounting mechanism for mounting the semiconductor wafer taken out by the pick-up device on the substrate, and the pick-up device is any one of the pick-up devices.

[發明的效果] 根據本發明，可提供一種能夠抑制電子零件的破損的拾取裝置以及安裝裝置。[Effects of the invention] According to the present invention, it is possible to provide a pickup device and a mounting device capable of suppressing breakage of electronic components.

以下，參照圖式對實施方式的拾取裝置進行說明。以下所示的圖式為示意性，各部的尺寸、形狀、各部的相互的尺寸比率等有時與現實情況不同。Hereinafter, the pickup device of the embodiment will be described with reference to the drawings. The drawings shown below are schematic, and the size, shape, and mutual size ratio of each portion may be different from the actual situation.

[第1實施方式] [構成] 圖1為表示第1實施方式的拾取裝置1的概略構成的透視正視圖，圖2為表示圖1所示的拾取裝置1的支承部200的吸附面220的平面圖，圖3為表示擠壓部230的平面圖，圖4（A）～圖4（H）為擠壓部230的分解圖。圖4（A）～圖4（H）的左側為正視圖，右側為側面圖。此外，以下的說明中，將與擠壓部230的軸平行的直線設為Z軸，將在與其正交的平面中彼此正交的二軸設為X軸及Y軸。當提及沿著軸的方向時，包含與軸平行的直線上的相反的兩個方向。其中，將擠壓部230移動而擠壓粘著片2的方向設為圖中的箭頭所示的Z方向，將與Z方向正交且滾輪軸82移動的方向設為圖中的箭頭所示的X方向。另外，本實施方式中，設X軸及Y軸為沿著水平的軸，Z軸為垂直的軸。進而，本實施方式中，將沿著重力的方向設為下方，抵抗重力的方向設為上方。此外，擠壓部230的軸為貫穿後述的與粘著片2接觸或遠離的擠壓面31的中心且與徑向的截面正交的直線。所謂擠壓部230的“徑向的截面”，是指正對擠壓面31而觀看擠壓部230時，沿著由擠壓面31的外形線所形成的平面圖形的方向的截面。此外，所謂“擠壓面的中心”，是指正對擠壓面31而觀看擠壓部230時，由擠壓面31的外形線所形成的平面圖形的中心或重心。[First Embodiment] [constitute] 1 is a perspective front view showing a schematic configuration of a pickup device 1 according to the first embodiment, FIG. 2 is a plan view showing a suction surface 220 of a support portion 200 of the pickup device 1 shown in FIG. 1, and FIG. 3 is a pressing portion The plan view of 230 is an exploded view of the pressing part 230 in FIGS. 4(A) to 4(H). The left side of Figure 4(A) to Figure 4(H) is a front view, and the right side is a side view. In addition, in the following description, the straight line parallel to the axis of the pressing portion 230 is referred to as the Z axis, and the two axes orthogonal to each other in the plane orthogonal to the axis are referred to as the X axis and the Y axis. When referring to a direction along an axis, it includes two opposite directions on a straight line parallel to the axis. Among them, the direction in which the pressing portion 230 moves to press the adhesive sheet 2 is set to the Z direction shown by the arrow in the figure, and the direction orthogonal to the Z direction and the direction in which the roller shaft 82 moves is set to the arrow in the figure. The X direction. In addition, in this embodiment, it is assumed that the X axis and the Y axis are horizontal axes, and the Z axis is a vertical axis. Furthermore, in this embodiment, the direction along the gravity is set as the downward direction, and the direction against the gravity is set as the upward direction. In addition, the axis of the pressing portion 230 is a straight line passing through the center of the pressing surface 31 that is in contact with or away from the pressure-sensitive adhesive sheet 2 described later and is orthogonal to the cross section in the radial direction. The “radial cross section” of the pressing portion 230 refers to a cross section along the direction of a plane figure formed by the outline line of the pressing surface 31 when the pressing portion 230 is viewed facing the pressing surface 31. In addition, the “center of the pressing surface” refers to the center or the center of gravity of a plane figure formed by the outline of the pressing surface 31 when the pressing portion 230 is viewed directly opposite the pressing surface 31.

（電子零件） 電子零件3例如可舉出半導體元件、及半導體元件以外的電阻或電容器等。半導體元件例如可舉出：電晶體（transistor）、二極體、發光二極體（Light Emitting Diode，LED）、電容器及閘流管（thyristor）等離散半導體（discrete semiconductor），積體電路（Integrated Circuit，IC）或大型積體電路（Large Scale Integration，LSI）等積體電路等。本實施方式如圖1所示，使用長方體形狀的半導體晶片作為電子零件3。各半導體晶片是通過將半導體晶圓切斷成小四方塊狀的切割（dicing）而單片化。(Electronic parts) Examples of the electronic component 3 include semiconductor elements, resistors other than semiconductor elements, capacitors, and the like. Examples of semiconductor elements include discrete semiconductors such as transistors, diodes, light-emitting diodes (Light Emitting Diodes, LEDs), capacitors and thyristors, and integrated circuits (Integrated Circuits). Circuit, IC) or Large Scale Integration (LSI) and other integrated circuits. As shown in FIG. 1, this embodiment uses a rectangular parallelepiped semiconductor wafer as the electronic component 3. Each semiconductor wafer is singulated by dicing that cuts the semiconductor wafer into small squares.

（粘著片） 電子零件3貼附於被稱為切割帶（dicing tape）的粘著片2。粘著片2保持於未圖示的晶圓環。通過將貼附於粘著片2的粘著面的半導體晶片切斷成小四方塊狀進行單片化，而成為在粘著片2貼附有多個電子零件3的狀態。(Adhesive sheet) The electronic component 3 is attached to an adhesive sheet 2 called a dicing tape. The adhesive sheet 2 is held by a wafer ring (not shown). The semiconductor wafer attached to the adhesive surface of the adhesive sheet 2 is cut into small four squares to separate into pieces, so that a plurality of electronic components 3 are attached to the adhesive sheet 2.

貼附有多個電子零件3的粘著片2設置成通過未圖示的驅動機構而可使晶圓環在沿著X軸、Y軸及Z軸的方向移動。由此，設置成相對於後述的支承部200而可將粘著片2在沿著X軸及Y軸的方向定位，並且設置成相對於支承部200的吸附面220而可接觸或遠離。此外，晶圓環與支承部200只要構成為相對地沿著X軸、Y軸及Z軸而受到驅動即可。也就是說，也可使支承部200在Z軸方向移動，相對於在Z軸方向固定的粘著片2而接觸或遠離。The adhesive sheet 2 to which the plurality of electronic components 3 are attached is provided so that the wafer ring can be moved in the directions along the X axis, the Y axis, and the Z axis by a driving mechanism not shown. Thereby, it is provided so that the adhesive sheet 2 can be positioned in the directions along the X-axis and the Y-axis with respect to the support part 200 mentioned later, and it is provided so that it can contact with or away from the suction surface 220 of the support part 200. In addition, the wafer ring and the support portion 200 may be configured to be driven along the X-axis, the Y-axis, and the Z-axis relative to each other. In other words, the support portion 200 may be moved in the Z-axis direction, so as to contact or move away from the adhesive sheet 2 fixed in the Z-axis direction.

（拾取裝置） 本實施方式的拾取裝置1為將貼附於粘著片2的多個電子零件3從粘著片2個別地剝離並取出的裝置。拾取裝置1具有拾取機構100、支承部200、控制裝置300。(Pickup device) The pick-up device 1 of this embodiment is a device which peels and takes out a some electronic component 3 attached to the adhesive sheet 2 from the adhesive sheet 2 individually. The pickup device 1 has a pickup mechanism 100, a support portion 200, and a control device 300.

拾取機構100拾取貼附於粘著片2的電子零件3。拾取機構100具有個別地吸附保持電子零件3的拾取部4。拾取部4具有主體部5、吸附噴嘴8。主體部5為圓柱形狀的構件，由未圖示的X驅動源、Y驅動源及Z驅動源在沿著X軸、Y軸及Z軸的方向進行驅動。在主體部5的一端面，設有向粘著片2突出的凸部6。在主體部5，在沿著Z軸的方向形成有使前端在凸部6的端面開口的抽吸孔7。所述抽吸孔7連接於包含未圖示的抽吸泵的空氣壓電路。The pickup mechanism 100 picks up the electronic component 3 attached to the adhesive sheet 2. The pick-up mechanism 100 has a pick-up part 4 which sucks and holds the electronic component 3 individually. The pickup unit 4 has a main body 5 and a suction nozzle 8. The main body 5 is a cylindrical member, and is driven by an X drive source, a Y drive source, and a Z drive source not shown in the directions along the X axis, the Y axis, and the Z axis. On one end surface of the main body portion 5, a convex portion 6 protruding toward the adhesive sheet 2 is provided. In the main body portion 5, a suction hole 7 is formed in the direction along the Z-axis, the tip of which is opened on the end surface of the convex portion 6. The suction hole 7 is connected to an air pressure circuit including a suction pump (not shown).

吸附噴嘴8為可裝卸地連接於凸部6且直徑向前端變小的圓錐台形狀的構件。吸附噴嘴8是由橡膠或軟質的合成樹脂等彈性材料所形成。在吸附噴嘴8，形成有一端與抽吸孔7連通且另一端在前端的平坦面8a開口的噴嘴孔9。此外，作為將主體部5在沿著Z軸的方向進行驅動的Z驅動源，優選使用音圈馬達（voice coil motor）等，並以拾取部4所給予的擠壓負荷成為一定的方式進行控制。The suction nozzle 8 is a member in the shape of a truncated cone that is detachably connected to the convex portion 6 and whose diameter becomes smaller toward the tip. The suction nozzle 8 is formed of an elastic material such as rubber or soft synthetic resin. The suction nozzle 8 is formed with a nozzle hole 9 whose one end is in communication with the suction hole 7 and the other end is opened on a flat surface 8a at the tip. In addition, as the Z drive source that drives the main body 5 in the direction along the Z axis, it is preferable to use a voice coil motor or the like, and to control such that the squeezing load given by the pickup 4 becomes constant. .

支承部200與粘著片2的和粘著面為相反側的一面相向地設置。支承部200具有收容體210、吸附面220、擠壓部230、驅動機構240、轉換機構250。The support part 200 is provided facing the surface of the adhesive sheet 2 on the opposite side to the adhesive surface. The support part 200 has a housing 210, a suction surface 220, a pressing part 230, a driving mechanism 240, and a conversion mechanism 250.

收容體210為以與Z軸平行的直線作為軸的圓筒形狀的容器。在收容體210，經由配管等而連接著對內部進行抽吸的抽吸泵211。吸附面220為吸附保持粘著片2的與供拾取的電子零件3對應的區域的面。所謂與電子零件3對應的區域，是指包圍粘著片2的貼附有供拾取的電子零件3的區域且比此區域更大的區域。The container 210 is a cylindrical container whose axis is a straight line parallel to the Z axis. The housing 210 is connected to a suction pump 211 that sucks the inside via a pipe or the like. The suction surface 220 is a surface that sucks and holds the area of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up. The area corresponding to the electronic component 3 refers to the area surrounding the adhesive sheet 2 where the electronic component 3 for pickup is attached and is larger than this area.

如圖2所示，吸附面220形成為安裝在收容體210的與粘著片2相向的開口的蓋（cap）。在吸附面220設有多個抽吸孔221。抽吸孔221經由支承部200的內部或未圖示的配管而連接於抽吸泵211。通過使抽吸泵211動作，而在吸附面220經由多個抽吸孔221產生抽吸力。因此，若使抽吸泵211動作而使吸附面220與粘著片2的和粘著面為相反側的一面接觸，則吸附保持粘著片2。也就是說，本實施方式中，在吸附面220中，設有抽吸孔221的區域內全體成為與電子零件3對應的區域。此外，抽吸孔221設於吸附面220的大致整個區域，因此也可將包含擠壓部230上的吸附面220內的整個區域設為與電子零件3對應的區域。As shown in FIG. 2, the suction surface 220 is formed as a cap attached to an opening of the housing body 210 facing the adhesive sheet 2. A plurality of suction holes 221 are provided on the suction surface 220. The suction hole 221 is connected to the suction pump 211 via the inside of the support part 200 or a pipe (not shown). By operating the suction pump 211, a suction force is generated on the suction surface 220 through the plurality of suction holes 221. Therefore, if the suction pump 211 is operated and the suction surface 220 is brought into contact with the surface of the pressure-sensitive adhesive sheet 2 on the opposite side to the pressure-sensitive adhesive surface, the pressure-sensitive adhesive sheet 2 is suction-held. That is, in the present embodiment, in the suction surface 220, the entire area in which the suction hole 221 is provided becomes an area corresponding to the electronic component 3. In addition, the suction hole 221 is provided in substantially the entire area of the suction surface 220, and therefore, the entire area including the suction surface 220 on the pressing portion 230 may be set as the area corresponding to the electronic component 3.

擠壓部230為與共同的軸呈同軸的嵌套狀地配設有多個擠壓體30的構件，所述多個擠壓體30設置成在吸附面220內沿著共同的軸而可移動，且外形的大小不同。此處，共同的軸與Z軸平行，也為上文所述的擠壓部230的軸。擠壓部230設置成在設於吸附面220的矩形狀的開口部222內可進退。The squeezing part 230 is a member in which a plurality of squeezing bodies 30 are arranged in a nested shape coaxially with a common axis, and the plurality of squeezing bodies 30 are arranged in the suction surface 220 along the common axis. Mobile, and the size of the shape is different. Here, the common axis is parallel to the Z axis, which is also the axis of the pressing portion 230 described above. The pressing part 230 is provided so as to be able to advance and retreat in the rectangular opening 222 provided on the suction surface 220.

如圖2及圖3所示，擠壓體30為矩形的筒狀體或柱狀體，其與共同的軸正交的截面和電子零件3形狀相似。最內周的擠壓體30A為與粘著片2相向的端面成為矩形的擠壓面31的柱狀體。比最內周更靠外周的擠壓體30B～擠壓體30H為與粘著片2相向的端面成為矩形框狀的擠壓面32的筒狀體。本實施方式中，通過在擠壓體30內依次插入外形比其更小的擠壓體30，而將8個擠壓體30A～30H配設成同軸的嵌套狀且可滑動。最外周的擠壓體30H的外形大小與成為拾取對象的電子零件3的貼附於粘著片2的面的外形的大小相同或略小。所謂略小，例如是指相較於電子零件3的貼附於粘著片2的面的外形，允許小到由擠壓體30H的側壁厚度所決定的擠壓面32的寬度程度為止。由此，能夠抑制對電子零件3的負載，並且從最外周剝離粘著片2。以下的說明中，在不區分擠壓體30A～擠壓體30H時，有時稱為擠壓體30。As shown in FIGS. 2 and 3, the extruded body 30 is a rectangular cylindrical body or a columnar body, and its cross-section orthogonal to the common axis is similar to the shape of the electronic component 3. The innermost extruded body 30A is a columnar body whose end surface facing the adhesive sheet 2 is a rectangular extruded surface 31. The extruded body 30B to the extruded body 30H that are closer to the outer periphery than the innermost periphery are cylindrical bodies in which the end surface facing the adhesive sheet 2 is a rectangular frame-shaped extruded surface 32. In the present embodiment, by sequentially inserting the extruding bodies 30 having a smaller outer shape into the extruding body 30, the eight extruding bodies 30A to 30H are arranged in a coaxially nested shape and slidable. The outer shape of the extruded body 30H on the outermost periphery is the same as or slightly smaller than the outer shape of the surface of the electronic component 3 to be picked up to be attached to the adhesive sheet 2. "Slightly smaller" means, for example, that it is allowed to be as small as the width of the pressing surface 32 determined by the thickness of the side wall of the pressing body 30H compared to the outer shape of the surface of the electronic component 3 attached to the adhesive sheet 2. Thereby, while suppressing the load on the electronic component 3, the adhesive sheet 2 can be peeled from the outermost periphery. In the following description, when the extruded body 30A to the extruded body 30H are not distinguished, they may be referred to as the extruded body 30.

此外，從防止電子零件3的破損的觀點來看，優選相對於電子零件3的貼附於粘著片2的面的面積，由最內周的擠壓體30A的擠壓面31殘留而未剝離的粘著片2的面積為30%或30%以下，但本實施方式不限定於此。另外，由各擠壓體30B～擠壓體30H的側壁厚度所決定的擠壓面32的寬度優選設為0.6 mm左右或更小，但本實施方式不限定於此。另外，本實施方式的電子零件3為正方形，但不限定於此，也可為長方形狀。當電子零件3為長方形狀時，擠壓面31、擠壓面32只要設為與電子零件3相似的長方形即可。In addition, from the viewpoint of preventing damage to the electronic component 3, it is preferable that the area of the surface of the electronic component 3 that is attached to the adhesive sheet 2 is left behind by the pressing surface 31 of the innermost extruded body 30A. The area of the peeled adhesive sheet 2 is 30% or less, but the present embodiment is not limited to this. In addition, the width of the pressing surface 32 determined by the side wall thickness of each of the pressing bodies 30B to 30H is preferably about 0.6 mm or less, but the present embodiment is not limited to this. In addition, the electronic component 3 of this embodiment has a square shape, but it is not limited to this, and may have a rectangular shape. When the electronic component 3 has a rectangular shape, the pressing surface 31 and the pressing surface 32 may be rectangular similar to the electronic component 3.

如圖3及圖4（A）～圖4（H）所示，在擠壓體30B～擠壓體30H的擠壓面32，形成有凹凸。也就是說，沿著擠壓面32的矩形的四個側邊部而設有多個第1凸部33，在矩形的四個角部設有第2凸部34。在第1凸部33與第2凸部34之間及第1凸部33間設有凹部35。第1凸部33、第2凸部34的頭頂面擠壓粘著片2。當如此將粘著片2上推時，第1凸部33局部地支撐與電子零件3的四個側邊部平行的方向，第2凸部34局部地支撐從電子零件3的中心朝向四個角部的方向。As shown in FIGS. 3 and 4 (A) to 4 (H), the pressing surface 32 of the extruded body 30B to the extruded body 30H is formed with unevenness. That is, a plurality of first convex portions 33 are provided along the four sides of the rectangle of the pressing surface 32, and the second convex portions 34 are provided at the four corners of the rectangle. Concave portions 35 are provided between the first convex portion 33 and the second convex portion 34 and between the first convex portion 33. The top surfaces of the first convex portion 33 and the second convex portion 34 press the adhesive sheet 2. When the adhesive sheet 2 is pushed up in this way, the first convex portion 33 partially supports the direction parallel to the four side portions of the electronic component 3, and the second convex portion 34 partially supports the four sides from the center of the electronic component 3 The direction of the corner.

經過設於收容體210內的未圖示的配管或擠壓體30A～擠壓體30H間的間隙及缺口36，抽吸泵211的抽吸力傳至凹部35。缺口36為以局部圓形狀地切缺的方式形成於擠壓體30B～擠壓體30H的擠壓面32的一部分的抽吸路徑。另外，在鄰接的擠壓體30中，凹部35設置成交錯。利用這種互不相同的構成，而形成從外周及角朝向中央的抽吸線，因此確保對中央部分的抽吸直至最後為止，粘著片2的吸附性能提高。The suction force of the suction pump 211 is transmitted to the recess 35 through the piping (not shown) provided in the housing 210 or the gap between the extruded body 30A to the extruded body 30H and the notch 36. The notch 36 is a suction path formed in a part of the pressing surface 32 of the extruded body 30B to the extruded body 30H so as to be cut in a partially circular shape. In addition, in the adjacent extruded bodies 30, the recesses 35 are arranged in a staggered manner. With this configuration that is different from each other, a suction line is formed from the outer periphery and the corner to the center. Therefore, the suction of the central part is ensured to the end, and the suction performance of the adhesive sheet 2 is improved.

驅動機構240為進行擠壓動作及遠離動作的機構，所述擠壓動作使擠壓部230移動而利用所有擠壓體30擠壓粘著片2，所述遠離動作從外側的擠壓體30起使鄰接的內側的擠壓體30依次向使電子零件3從粘著片2剝離的遠離方向移動。此處，本實施方式中，遠離方向為與擠壓的方向相反的方向。轉換機構250設於驅動機構240，將沿著共同的軸移動的單一的第1驅動構件241的動作轉換為多個擠壓體30A～30H的遠離動作。The driving mechanism 240 is a mechanism that performs a pressing action and a moving away. The pressing action moves the pressing part 230 to press the adhesive sheet 2 with all the pressing bodies 30. The moving away from the outside pressing body 30 As a result, the adjacent inner extruded body 30 is sequentially moved in the direction away from which the electronic component 3 is peeled from the adhesive sheet 2. Here, in this embodiment, the distance direction is the opposite direction to the direction of pressing. The conversion mechanism 250 is provided in the drive mechanism 240, and converts the movement of the single first drive member 241 that moves along the common axis into the movement of moving away from the plurality of extruded bodies 30A to 30H.

驅動機構240具有同軸的圓筒形狀的第1驅動構件241、第2驅動構件242。第1驅動構件241、第2驅動構件242例如是由伺服馬達（servo motor）所驅動的滾珠螺杆機構或凸輪滾輪機構等在沿著共同的軸的方向個別地驅動。第1驅動構件241驅動後述的轉換機構250。第2驅動構件242驅動後述的框架50。The driving mechanism 240 has a first driving member 241 and a second driving member 242 having a coaxial cylindrical shape. The first driving member 241 and the second driving member 242 are, for example, a ball screw mechanism or a cam roller mechanism driven by a servo motor, which are individually driven in a direction along a common axis. The first driving member 241 drives the conversion mechanism 250 described later. The second driving member 242 drives the frame 50 described later.

轉換機構250具有框架50、伸出部60、施力構件70、第1凸輪機構80、第2凸輪機構90。框架50為收容在收容體210內，支撐擠壓部230、第1凸輪機構80、第2凸輪機構90的構件。The conversion mechanism 250 has a frame 50, an extension 60, a biasing member 70, a first cam mechanism 80, and a second cam mechanism 90. The frame 50 is a member that is housed in the housing 210 and supports the pressing portion 230, the first cam mechanism 80, and the second cam mechanism 90.

框架50具有支撐塊51、第1支撐板52、線性導件53、第2支撐板54。支撐塊51為設於收容體210內的粘著片2側的長方體形狀，在其內部形成有使擠壓部230沿著Z軸方向可滑動地穿插的長方體形狀的導孔51a。進而，在支撐塊51的粘著片2側，設有向相反的側面的外側突出的突出部51b。此處，所謂相反的側面，是指關於共同的軸而處於相向的位置關係。例如，當如本實施方式那樣支撐塊51為長方體形狀時，四個側面中位於隔著共同的軸的位置（相向）的兩個側面為相反的側面。The frame 50 has a support block 51, a first support plate 52, a linear guide 53, and a second support plate 54. The support block 51 has a rectangular parallelepiped shape provided on the adhesive sheet 2 side in the housing body 210, and a rectangular parallelepiped guide hole 51a is formed in the interior to allow the pressing portion 230 to be slidably inserted in the Z-axis direction. Furthermore, on the adhesive sheet 2 side of the support block 51, a protrusion 51b protruding to the outside of the opposite side surface is provided. Here, the opposite sides refer to the positional relationship facing each other with respect to a common axis. For example, when the support block 51 has a rectangular parallelepiped shape as in the present embodiment, two of the four side surfaces located at positions (opposing to each other) across a common axis are opposite side surfaces.

第1支撐板52為安裝有支撐塊51的圓板狀的構件。線性導件53為通過導軌（guide rail）而在X方向可滑動移動地支撐後述的移動體83的構件。第2支撐板54為設於框架50的驅動機構240側的圓板狀的構件。在第2支撐板54，形成有供第1驅動構件241穿插的孔。另外，在第2支撐板54固定著第2驅動構件242的前端。此外，第1支撐板52、線性導件53、第2支撐板54通過未圖示的Z軸方向的支柱而彼此連接固定。The first support plate 52 is a disc-shaped member to which the support block 51 is attached. The linear guide 53 is a member that slidably supports a moving body 83 described later in the X direction by a guide rail. The second support plate 54 is a disc-shaped member provided on the drive mechanism 240 side of the frame 50. The second support plate 54 has a hole through which the first driving member 241 is inserted. In addition, the front end of the second driving member 242 is fixed to the second support plate 54. In addition, the first support plate 52, the linear guide 53, and the second support plate 54 are connected and fixed to each other by a pillar in the Z-axis direction (not shown).

如圖3及圖4（A）～圖4（H）所示，伸出部60在擠壓體30的相反的側面的外側分別設有各一對。此處，所謂擠壓體30的相反的側面，在如本實施方式那樣擠壓體30為矩形的筒狀時，是指位於隔著共同的軸的位置（相向）的兩個側面。此外，相反的側面在一個擠壓體30中存在兩組，但本實施方式中，將在X軸方向相向的組設為相反的側面。另外，所謂側面的外側，是指從正面觀看側面時成為兩端部的部分。也就是說，從各擠壓體30的相反的兩側面設有合計四個伸出部60。此外，伸出部60設於側面的下端。最外側的擠壓體30H的一對伸出部60設於最外側，隨著成為內側的擠壓體30G～擠壓體30A，而依次在內側設有伸出部60。此外，最內周的擠壓體30A的伸出部60是在相反的側面設有各一個。也就是說，並非所有的擠壓體30A～擠壓體30H必須在相反的側面設有各一對伸出部60。此外，伸出部60也能理解成下述部分，即：使在Y軸方向相向的兩個側壁的下端比在X軸方向相向的兩個側壁的下端更向下側延長規定量，並使此延長部分的兩端在X軸方向伸出的部分。As shown in FIGS. 3 and 4(A) to 4(H), the extension portion 60 is provided with a pair on the outer side of the opposite side surface of the extruded body 30, respectively. Here, the opposite side surfaces of the extruded body 30 refer to the two side surfaces that are located at (opposing) a common axis when the extruded body 30 has a rectangular cylindrical shape as in the present embodiment. In addition, there are two groups of opposite side surfaces in one extruded body 30, but in this embodiment, the groups facing in the X-axis direction are set as opposite side surfaces. In addition, the outside of the side surface refers to a portion that becomes both ends when the side surface is viewed from the front. In other words, a total of four extensions 60 are provided from opposite sides of each extruded body 30. In addition, the extension 60 is provided at the lower end of the side surface. The pair of protrusions 60 of the outermost extruded body 30H are provided on the outermost side, and the protrusions 60 are sequentially provided on the inner side following the inner extruded body 30G to the extruded body 30A. In addition, the protrusion 60 of the extruded body 30A at the innermost periphery is provided with one each on the opposite side surface. In other words, it is not necessary for all the extruded bodies 30A to 30H to be provided with a pair of protrusions 60 on opposite sides. In addition, the overhang 60 can also be understood as a portion in which the lower ends of the two side walls facing each other in the Y-axis direction are extended downward by a predetermined amount than the lower ends of the two side walls facing each other in the X-axis direction. The two ends of this extended part project in the X-axis direction.

如圖1及圖3所示，施力構件70為對各擠壓體30的伸出部60向遠離方向個別地施力的構件。施力構件70可使用板彈簧、線圈彈簧等彈性構件而構成。本實施方式中，使用在內置有壓縮線圈彈簧的筒的前端設有根據壓縮線圈彈簧的伸縮而進退的銷的構件來作為施力構件70。施力構件70設於與Z軸平行的方向，其中一個端部安裝於支撐塊51，作為另一端部的銷的前端與伸出部60接觸。通過此種構成，施力構件70對各擠壓體30進行施力。As shown in FIGS. 1 and 3, the urging member 70 is a member that individually urges the extension portion 60 of each extruded body 30 in the away direction. The urging member 70 can be configured using an elastic member such as a leaf spring and a coil spring. In this embodiment, as the urging member 70, a member in which a pin that advances and retreats in accordance with the expansion and contraction of the compression coil spring is provided at the tip of a cylinder in which the compression coil spring is incorporated is used. The urging member 70 is provided in a direction parallel to the Z axis, one end of which is mounted on the support block 51, and the tip of the pin as the other end is in contact with the extension 60. With this configuration, the urging member 70 urges each extruded body 30.

第1凸輪機構80為由第1驅動構件241所驅動，從外側向內側依次允許各擠壓體30向遠離方向移動的機構。第1凸輪機構80具有凸輪面81、滾輪軸82、移動體83。The first cam mechanism 80 is a mechanism that is driven by the first drive member 241 to sequentially allow the extrusion bodies 30 to move in the away direction from the outside to the inside. The first cam mechanism 80 has a cam surface 81, a roller shaft 82, and a moving body 83.

凸輪面81設於各擠壓體30的和粘著片2為相反側的一面，且為沿著與共同的軸交叉的方向，具體而言為沿著X軸方向，而在每個擠壓體30中形狀不同的面。本實施方式中，凸輪面81為具有距擠壓面31或擠壓面32的距離在每個擠壓體30中依次不同的部分的面。凸輪面81形成於擠壓體30的在沿著Y軸的方向相向的兩個側面的端面，具體而言為與擠壓面31或擠壓面32為相反側的下端面。如圖4（A）～圖4（H）所示，凸輪面81具備第1一致面84、傾斜面85及第2一致面86。第1一致面84為距擠壓面31或擠壓面32的距離固定為d1的在與其他擠壓體30之間一致的面。傾斜面85為與第1一致面84平緩地連續，距擠壓面31或擠壓面32的距離逐漸減少至d2的面。第2一致面86為距擠壓面31或擠壓面32的距離固定為d2的在與其他擠壓體30之間一致的面。第1一致面84的長度w隨著成為內側的擠壓體30而變長，伴隨於此，傾斜面85的開端的位置p及第2一致面86的開端的位置q沿著X軸偏移。這一情況意味著越成為內側的擠壓體30，後述的滾輪軸82到達傾斜面85的時機越遲。The cam surface 81 is provided on the side opposite to the adhesive sheet 2 of each extruded body 30, and is along a direction intersecting a common axis, specifically along the X-axis direction. Faces of different shapes in the body 30. In the present embodiment, the cam surface 81 is a surface having portions whose distances from the pressing surface 31 or the pressing surface 32 are sequentially different for each pressing body 30. The cam surface 81 is formed on the end surfaces of the two side surfaces facing each other in the direction along the Y axis of the extruded body 30, and specifically is a lower end surface on the opposite side to the pressing surface 31 or the pressing surface 32. As shown in FIGS. 4(A) to 4(H), the cam surface 81 includes a first coincidence surface 84, an inclined surface 85, and a second coincidence surface 86. The first coincidence surface 84 is a surface that coincides with the other extruded bodies 30 whose distance from the pressing surface 31 or the pressing surface 32 is fixed to d1. The inclined surface 85 is a surface that is smoothly continuous with the first coincidence surface 84, and the distance from the pressing surface 31 or the pressing surface 32 is gradually reduced to d2. The second coincidence surface 86 is a surface that coincides with the other extruded bodies 30 whose distance from the pressing surface 31 or the pressing surface 32 is fixed to d2. The length w of the first coincidence surface 84 becomes longer as the extruded body 30 becomes the inner side, and with this, the position p of the start of the inclined surface 85 and the position q of the start of the second coincidence surface 86 are shifted along the X axis . This situation means that the more it becomes the inner extruded body 30, the later the timing at which the roller shaft 82, which will be described later, reaches the inclined surface 85.

滾輪軸82與各擠壓體30的凸輪面81接觸，對各擠壓體30向抵抗施力構件70的方向施力，並且在與遠離方向交叉的方向，具體而言為在X軸方向移動。滾輪軸82具有橫跨形成有凸輪面81的兩側面的長度。當此滾輪軸82未到達傾斜面85時，也就是與第1一致面84接觸時，將所有擠壓體30向抵抗施力構件70的方向上推。若滾輪軸82到達各擠壓體30的傾斜面85，則由於施力構件70的施加力而各擠壓體30依次向遠離方向移動。本實施方式中，越成為內側的擠壓體30則滾輪軸82到達傾斜面85的時機越遲，因此從外側的擠壓體30起依次向遠離方向移動。The roller shaft 82 is in contact with the cam surface 81 of each extruded body 30, urges each extruded body 30 in a direction against the urging member 70, and moves in a direction intersecting the away direction, specifically in the X-axis direction . The roller shaft 82 has a length spanning both side surfaces on which the cam surface 81 is formed. When the roller shaft 82 does not reach the inclined surface 85, that is, when it is in contact with the first coincidence surface 84, all the extruded bodies 30 are pushed up in the direction against the urging member 70. When the roller shaft 82 reaches the inclined surface 85 of each extruded body 30, each extruded body 30 sequentially moves in the away direction due to the urging force of the urging member 70. In the present embodiment, the more the inner extruded body 30 is, the later the timing of the roller shaft 82 reaching the inclined surface 85 is, and therefore, the outer extruded body 30 sequentially moves in the away direction.

此外，滾輪軸82的移動範圍為吸附面220的外緣的範圍內。本實施方式中，滾輪軸82在收容體210的內徑的範圍內移動。因此，凸輪面81也形成在此範圍內。另外，施力構件70根據凸輪面81的形狀，對一對伸出部60中的一者與另一者的施加力不同。也就是說，理論上當傾斜面85的位置位於各擠壓體30的中央時，若使配置於隔著各擠壓體30的位置的一對施力構件70的施加力同等，則防止各擠壓體30的傾斜。但是，當凸輪面81的位置偏離中央時，必須根據其偏離量而改變施力構件70的施加力。In addition, the moving range of the roller shaft 82 is within the range of the outer edge of the suction surface 220. In this embodiment, the roller shaft 82 moves within the range of the inner diameter of the housing body 210. Therefore, the cam surface 81 is also formed in this range. In addition, depending on the shape of the cam surface 81, the urging member 70 has a different urging force to one of the pair of extension portions 60 and the other. That is, theoretically, when the position of the inclined surface 85 is located at the center of each extruded body 30, if the urging force of the pair of urging members 70 arranged at the position interposed between each extruded body 30 is made equal, each of the extruded bodies 30 will be prevented The inclination of the pressure body 30. However, when the position of the cam surface 81 deviates from the center, the urging force of the urging member 70 must be changed according to the amount of deviation.

例如，在其中一個伸出部60、滾輪軸82及另一個伸出部60之間，與力點、支點及作用點相同的關係成立。也就是說，當由一對施力構件70對兩側的伸出部60賦予同等的施加力，滾輪軸82位於中央時，施加力均等地作用於滾輪軸82的兩側，防止傾斜。相對於此，當滾輪軸82的位置偏向其中任一個伸出部60的位置時，相較於其中一個伸出部60而另一伸出部60距滾輪軸82的距離變遠。由於對兩個伸出部60賦予的施加力相同，因此距滾輪軸82的距離遠的另一伸出部60側的施加力強烈地發揮作用。因此，對於擠壓體30，產生傾斜的力發揮作用。此力的產生在擠壓體30為停止狀態時不成問題，但若在擠壓體30向遠離方向移動時產生，則成為妨礙順暢移動的原因而不佳。因此，使距傾斜面85遠的施力構件70的施加力比靠近傾斜面85的施力構件70的施加力更弱。也就是說，使用按壓力弱的壓縮線圈彈簧。For example, between one of the extension portions 60, the roller shaft 82, and the other extension portion 60, the same relationship as the point of force, the fulcrum, and the point of action is established. In other words, when the pair of urging members 70 gives the same urging force to the protruding portions 60 on both sides and the roller shaft 82 is located in the center, the urging force is equally applied to both sides of the roller shaft 82 to prevent tilting. In contrast, when the position of the roller shaft 82 deviates to the position of any one of the protrusions 60, the distance of the other protrusion 60 from the roller shaft 82 becomes farther than that of the one of the protrusions 60. Since the urging force applied to the two extension portions 60 is the same, the urging force on the side of the other extension portion 60 that is farther from the roller shaft 82 acts strongly. Therefore, the force that generates an inclination acts on the extruded body 30. The generation of this force is not a problem when the squeeze body 30 is in a stopped state, but if it is generated when the squeeze body 30 moves in the away direction, it becomes a cause of hindering smooth movement, which is undesirable. Therefore, the urging force of the urging member 70 far from the inclined surface 85 is made weaker than the urging force of the urging member 70 close to the inclined surface 85. In other words, use a compression coil spring with a weak pressing force.

施加力的強弱只要根據距傾斜面85的距離而決定即可。例如，可由一對施力構件70彼此之間的距離與距傾斜面85的距離的比率來決定施加力。也就是說，將一對施力構件70彼此之間的距離設為10時，若從其中一個施力構件70至傾斜面85的距離為4，從另一施力構件70至傾斜面85的距離為6，則只要以相對於其中一個施力構件70的施加力而另一施力構件70的施加力成為4/6倍的關係的方式設定即可。The strength of the applied force may be determined according to the distance from the inclined surface 85. For example, the urging force may be determined by the ratio of the distance between the pair of urging members 70 and the distance from the inclined surface 85. That is, when the distance between a pair of urging members 70 is 10, if the distance from one urging member 70 to the inclined surface 85 is 4, the distance from the other urging member 70 to the inclined surface 85 is 4 If the distance is 6, it may be set so that the force applied by one force applying member 70 and the force applied by the other force applying member 70 become 4/6 times the relationship.

移動體83具有移動塊83a、軸承83b。移動塊83a為大致長方體形狀的構件，設置成通過線性導件53而在X方向可滑動移動。軸承83b設於移動體83的擠壓體30側，為可轉動地支撐滾輪軸82的沿著Y軸的方向的軸的構件。The moving body 83 has a moving block 83a and a bearing 83b. The moving block 83a is a substantially rectangular parallelepiped-shaped member, and is provided to be slidably movable in the X direction by the linear guide 53. The bearing 83b is provided on the side of the extruded body 30 of the movable body 83, and is a member that rotatably supports the axis of the roller shaft 82 in the direction of the Y axis.

第2凸輪機構90為將第1驅動構件241的沿著遠離方向的移動（Z軸方向上的移動）轉換為滾輪軸82的與遠離方向交叉的方向（X軸方向）上的移動的機構。第2凸輪機構90具有滾輪92及與所述滾輪92接觸的傾斜面91，且為直動凸輪，所述直動凸輪將滾輪92及傾斜面91中的一者設為沿著共同的軸，也就是Z軸，移動的主動凸輪，將另一者設為在與Z軸交叉的方向（X軸方向）移動的從動凸輪。The second cam mechanism 90 is a mechanism that converts the movement of the first drive member 241 in the distance direction (movement in the Z axis direction) into the movement of the roller shaft 82 in the direction (X axis direction) intersecting the distance direction. The second cam mechanism 90 has a roller 92 and an inclined surface 91 in contact with the roller 92, and is a linear cam that sets one of the roller 92 and the inclined surface 91 along a common axis, That is, the Z-axis, the active cam that moves, sets the other as a driven cam that moves in the direction intersecting the Z-axis (X-axis direction).

本實施方式的第2凸輪機構90具有傾斜面91、滾輪92、軸承93。傾斜面91設於移動塊83a的和擠壓體30為相反側的一面，且為相對於Z方向而傾斜的面。滾輪92通過與傾斜面91接觸並向靠近粘著片2的方向移動，而使移動塊83a向沿著X方向的圖示左方向移動（參照圖1）。The second cam mechanism 90 of this embodiment has an inclined surface 91, a roller 92, and a bearing 93. The inclined surface 91 is provided on the surface of the moving block 83a on the opposite side to the extruded body 30, and is a surface inclined with respect to the Z direction. The roller 92 is in contact with the inclined surface 91 and moves in a direction approaching the adhesive sheet 2 to move the moving block 83 a in the left direction of the figure along the X direction (refer to FIG. 1 ).

軸承93可轉動地支撐滾輪92的沿著Y軸的方向的軸。軸承93固定於第1驅動構件241的端部。因此，隨著第1驅動構件241的移動，軸承93與滾輪92一併向粘著片2側移動。The bearing 93 rotatably supports the shaft of the roller 92 in the direction of the Y-axis. The bearing 93 is fixed to the end of the first drive member 241. Therefore, as the first drive member 241 moves, the bearing 93 and the roller 92 move to the adhesive sheet 2 side together.

控制裝置300為控制拾取裝置1的各部的裝置。此控制裝置300例如可包含含有處理器（processor）、記憶體等的專用的電子電路或以規定的程式進行動作的電腦（computer）等。關於與由抽吸泵211進行的排氣有關的控制、由驅動機構240進行的驅動的控制、及由拾取機構100進行的拾取的控制等，將其控制內容程式設計，並將各種設定儲存在記憶體等儲存部。控制裝置300通過可程式設計邏輯控制器（Programmable Logic Controller，PLC）或中央處理器（Central Processing Unit，CPU）等處理裝置按照此種設定執行程式。The control device 300 is a device that controls each part of the pickup device 1. The control device 300 may include, for example, a dedicated electronic circuit including a processor, a memory, etc., or a computer that operates in a predetermined program. Regarding the control related to the exhaust by the suction pump 211, the drive control by the drive mechanism 240, and the pick-up control by the pickup mechanism 100, the control content is programmed, and various settings are stored in Storage parts such as memory. The control device 300 executes programs in accordance with such settings through processing devices such as a programmable logic controller (PLC) or a central processing unit (CPU).

[動作] 除了所述圖式以外，參照圖5（A）～圖8對以上那樣的本實施方式的拾取裝置1的動作進行說明。首先，通過驅動晶圓環的驅動機構，供拾取的電子零件3對準擠壓部230的擠壓面32，以粘著片2與吸附面220接觸的方式使粘著片2移動。所述移動是基於預先包含電子零件3的位置座標的地圖資訊而進行。[action] In addition to the drawings, the operation of the pickup device 1 of the present embodiment as described above will be described with reference to FIGS. 5(A) to 8. First, by driving the driving mechanism of the wafer ring, the electronic component 3 to be picked up is aligned with the pressing surface 32 of the pressing portion 230, and the adhesive sheet 2 is moved so that the adhesive sheet 2 is in contact with the suction surface 220. The movement is performed based on map information including the position coordinates of the electronic component 3 in advance.

接著，如圖5（A）所示，通過利用抽吸泵211使抽吸力作用於抽吸孔221，而使粘著片2吸附於吸附面220。由此，粘著片2的與供拾取的電子零件3對應的部分吸附保持於吸附面220，電子零件3的區域也由擠壓體30的擠壓面31、擠壓面32吸附保持。Next, as shown in FIG. 5(A), by applying a suction force to the suction hole 221 by the suction pump 211, the adhesive sheet 2 is adsorbed to the suction surface 220. As a result, the portion of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up is sucked and held on the suction surface 220, and the area of the electronic component 3 is also sucked and held by the pressing surface 31 and the pressing surface 32 of the extruded body 30.

這樣，利用吸附面220吸附保持粘著片2後，使拾取部4向電子零件3移動，利用吸附噴嘴8吸附供拾取的電子零件3的上表面。In this way, after the adhesive sheet 2 is sucked and held by the sucking surface 220, the pickup 4 is moved to the electronic component 3, and the upper surface of the electronic component 3 to be picked up is sucked by the sucking nozzle 8.

接著，利用驅動機構240將第2驅動構件242向粘著片2側以預先設定的移動量驅動，由此如圖5（B）所示，將經框架50支撐的擠壓部230，也就是擠壓體30A～擠壓體30H，一起向粘著片2側上推。於是，擠壓體30的擠壓面31、擠壓面32均等地擠壓整個電子零件3，因此粘著片2的貼附有電子零件3的部分被擠出而超過吸附面220。Next, the second driving member 242 is driven to the adhesive sheet 2 side by a predetermined amount of movement by the driving mechanism 240, thereby as shown in FIG. 5(B), the pressing part 230 supported by the frame 50, that is, The extruded body 30A to the extruded body 30H are pushed up to the adhesive sheet 2 side together. Then, the pressing surface 31 and the pressing surface 32 of the extruded body 30 evenly press the entire electronic component 3, and therefore the part of the adhesive sheet 2 where the electronic component 3 is attached is squeezed out to exceed the suction surface 220.

然後，利用驅動機構240將第1驅動構件241向粘著片2側驅動，由此如圖7（A）～圖7（C）所示，使滾輪92向粘著片2側移動。也就是說，使滾輪92沿著Z軸方向上升。圖中，以塗白箭頭表示其移動方向。於是，滾輪92對傾斜面91施力，因此移動體83的移動塊83a及軸承83b在X方向移動。圖中，以塗黑箭頭表示其移動方向。由此，滾輪軸82向沿著X方向的圖示左側移動。Then, by driving the first driving member 241 to the adhesive sheet 2 side by the driving mechanism 240, as shown in FIGS. 7(A) to 7(C), the roller 92 is moved to the adhesive sheet 2 side. That is, the roller 92 is raised in the Z-axis direction. In the figure, the direction of movement is indicated by a painted white arrow. Then, the roller 92 urges the inclined surface 91, and therefore the moving block 83a and the bearing 83b of the moving body 83 move in the X direction. In the figure, the direction of movement is indicated by a black arrow. As a result, the roller shaft 82 moves to the left side of the figure along the X direction.

這樣，若滾輪軸82移動，則如圖8所示，滾輪軸82從擠壓體30的第1一致面84沿著凸輪面81移動。於是，如圖5（C）、圖5（D）、圖5（E）、圖6（A）、圖6（B）、圖6（C）、圖6（D）所示，由於施力構件70的施加力，從外側的擠壓體30H起，擠壓體30G、擠壓體30F、擠壓體30E、擠壓體30D、擠壓體30C、擠壓體30B依次向遠離方向移動，也就是逐漸下降。In this way, when the roller shaft 82 moves, as shown in FIG. 8, the roller shaft 82 moves from the first matching surface 84 of the extruded body 30 along the cam surface 81. Therefore, as shown in Figure 5 (C), Figure 5 (D), Figure 5 (E), Figure 6 (A), Figure 6 (B), Figure 6 (C), Figure 6 (D), due to the force The applied force of the member 70 starts from the outer extruded body 30H, the extruded body 30G, the extruded body 30F, the extruded body 30E, the extruded body 30D, the extruded body 30C, and the extruded body 30B move away from each other in order, That is, it gradually decreases.

這樣，若擠壓體30依次移動，則由於抽吸泵211的抽吸力發揮作用，因此粘著片2的剝離從電子零件3的外周側向內周側進行。最終，如圖6（E）所示，僅最內周的擠壓體30A成為擠壓粘著片2的狀態，此擠壓體30A的擠壓面31的區域成為粘著片2的貼附於電子零件3的部分。In this way, when the squeezing body 30 moves sequentially, the suction force of the suction pump 211 acts, so that the peeling of the adhesive sheet 2 proceeds from the outer peripheral side to the inner peripheral side of the electronic component 3. Finally, as shown in FIG. 6(E), only the innermost extruded body 30A is in a state of pressing the adhesive sheet 2, and the area of the pressing surface 31 of this extruded body 30A becomes the sticking of the adhesive sheet 2 In the part of electronic parts 3.

對於最內周的擠壓體30A的擠壓面31而言，其面積設定得非常小。因此，通過使吸附有電子零件3的吸附噴嘴8上升，而電子零件3從粘著片2容易地剝離。也就是說，擠壓體30A的擠壓面31設定為可抑制電子零件3所受的應力並使其剝離的大小。然後，通過使吸附噴嘴8上升，而能夠將電子零件3從粘著片2拾取。The area of the pressing surface 31 of the innermost pressing body 30A is set to be very small. Therefore, by raising the suction nozzle 8 holding the electronic component 3, the electronic component 3 is easily peeled off from the adhesive sheet 2. That is, the pressing surface 31 of the pressing body 30A is set to a size that can suppress the stress on the electronic component 3 and cause it to peel off. Then, by raising the suction nozzle 8, the electronic component 3 can be picked up from the adhesive sheet 2.

[作用效果] （1）本實施方式的拾取裝置1具有：拾取部4，拾取貼附於粘著片2的電子零件3；以及支承部200，與粘著片2的和電子零件3為相反側的一面相向地設置，支承部200具有：吸附面220，吸附保持粘著片2的與供拾取的電子零件3對應的區域；擠壓部230，與共同的軸呈同軸的嵌套狀地配設有多個擠壓體30，所述多個擠壓體30設置成在吸附面220內沿著共同的軸而可移動，且外形的大小不同；驅動機構240，進行擠壓動作及遠離動作，所述擠壓動作使擠壓部230移動而利用所有擠壓體30擠壓粘著片2，所述遠離動作從外側的擠壓體30起使鄰接的內側的擠壓體30向使電子零件3從粘著片2剝離的遠離方向移動；以及轉換機構250，設於驅動機構240，將沿著共同的軸移動的單一的第1驅動構件241的動作轉換為多個擠壓體30的遠離動作。[Effect] (1) The pickup device 1 of this embodiment has: a pickup part 4 that picks up the electronic component 3 attached to the adhesive sheet 2; and a support part 200 that faces the side of the adhesive sheet 2 on the opposite side to the electronic component 3 The support portion 200 has: a suction surface 220 that sucks and holds the area of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up; the squeeze portion 230 is arranged in a nested shape coaxially with the common axis. The plurality of extruded bodies 30 are arranged to be movable along a common axis within the suction surface 220 and have different shapes and sizes; the driving mechanism 240 performs the extruding action and the moving away The squeezing action moves the squeezing part 230 to squeeze the adhesive sheet 2 with all the squeezing bodies 30, and the separating action moves the adjacent inner squeezing body 30 from the outer squeezing body 30 to the electronic component 3 from The moving away from the peeling direction of the adhesive sheet 2; and the conversion mechanism 250, which is provided in the drive mechanism 240, converts the movement of the single first driving member 241 moving along the common axis into the moving away of the plurality of squeezing bodies 30.

因此，能夠利用單一的第1驅動構件241的動作，使多個擠壓體30從外側起依次向遠離方向移動，從粘著片2剝離。因此，能夠防止裝置的複雜化或大型化，並且防止拾取時的電子零件3的破損。Therefore, by the operation of the single first driving member 241, the plurality of extruded bodies 30 can be sequentially moved in the away direction from the outside, and peeled from the adhesive sheet 2. Therefore, it is possible to prevent the complication or enlargement of the device, and to prevent the electronic component 3 from being damaged during pickup.

（2）轉換機構250具有：至少一對伸出部60，從各擠壓體30的相反的側面向外伸出；施力構件70，對各擠壓體30的伸出部60向遠離方向個別地施力；以及第1凸輪機構80，由第1驅動構件241所驅動，從外側向內側依次允許各擠壓體30向遠離方向移動。(2) The conversion mechanism 250 has: at least a pair of extensions 60 that extend outward from opposite sides of each extruded body 30; an urging member 70 that faces away from the extension 60 of each extruded body 30 Individually energize; and the first cam mechanism 80, driven by the first drive member 241, sequentially allows each extrusion body 30 to move away from the outside to the inside.

因此，利用施力構件70來按壓從擠壓體30的側面向外伸出的伸出部60，故，與以擠壓體30的內部進行按壓的情況相比，按壓位置的間隔變寬，能夠防止擠壓體30的搖晃等，實現移動的穩定化。Therefore, the urging member 70 is used to press the protruding portion 60 that protrudes outward from the side surface of the extruded body 30. Therefore, the interval between the pressing positions becomes wider compared with the case where the inside of the extruded body 30 is pressed. The shaking of the extruded body 30 can be prevented, and the movement can be stabilized.

（3）第1凸輪機構80具有：凸輪面81，設於各擠壓體30的和擠壓於粘著片2的擠壓面31、擠壓面32為相反側的一面，沿著與共同的軸交叉的方向而在每個擠壓體30中形狀不同；以及滾輪軸82，與各擠壓體30的凸輪面81接觸，對各擠壓體30向抵抗施力構件70的方向施力，並且在與遠離方向交叉的方向移動。(3) The first cam mechanism 80 has a cam surface 81 which is provided on the opposite side of the pressing surface 31 and the pressing surface 32 of each pressing body 30 which are pressed against the adhesive sheet 2 along the same side as the pressing surface 32. The shape of each extrusion body 30 is different in the direction in which the shafts intersect; and the roller shaft 82 is in contact with the cam surface 81 of each extrusion body 30 and urges each extrusion body 30 in a direction resisting the urging member 70 , And move in a direction that intersects the away direction.

因此，能夠隨著滾輪軸82的移動而使多個擠壓體30依次向遠離方向移動，故，與獨立地驅動各個擠壓體30的情況相比，能夠利用簡單且小型的裝置增加擠壓體30的個數而設為多階段。因此，在從粘著片2剝離相同面積的電子零件3時，能夠減小從外側剝離時的每一次的面積，並且能夠減小最後殘留的中央的擠壓面31的面積。由此，使剝離時對電子零件3施加的負載與剝離的速度的平衡適當，能夠防止電子零件3的破損。例如，即便將擠壓體30設為五個或五個以上，也能夠抑制裝置的複雜化或大型化，並且防止電子零件3的破損。此外，與將平板的板狀的刀片（blade）用作擠壓體的情況相比，同樣地能夠減小最後殘留的中央的擠壓面31的面積。例如，本實施方式中，能夠相對於電子零件3的貼附於粘著片2的面的面積，將由最內周的擠壓體30A的擠壓面31殘留而未剝離的粘著片2的面積設為小於或等於0.5%。Therefore, the plurality of extrusion bodies 30 can be sequentially moved away from each other in accordance with the movement of the roller shaft 82. Therefore, compared with the case where each extrusion body 30 is driven independently, the extrusion can be increased by a simple and compact device. The number of bodies 30 is multi-stage. Therefore, when the electronic component 3 of the same area is peeled from the pressure-sensitive adhesive sheet 2, the area per time when peeling from the outside can be reduced, and the area of the central pressing surface 31 that remains last can be reduced. As a result, the load applied to the electronic component 3 during peeling and the speed of peeling are appropriately balanced, and damage to the electronic component 3 can be prevented. For example, even if the number of extruded bodies 30 is five or more, it is possible to suppress the complication or enlargement of the device, and to prevent the damage of the electronic component 3. In addition, as compared with the case where a flat plate-shaped blade is used as an extruded body, the area of the extruded surface 31 in the center that remains last can be reduced in the same manner. For example, in this embodiment, relative to the area of the surface of the electronic component 3 that is attached to the adhesive sheet 2, the pressure surface 31 of the innermost extruded body 30A can be left unpeeled from the pressure-sensitive adhesive sheet 2 The area is set to be less than or equal to 0.5%.

（4）滾輪軸82的移動範圍為吸附面220的外緣的範圍內。因此，能夠防止拾取裝置1在與多個擠壓體30移動的共同的軸正交的方向即X軸方向大型化。(4) The moving range of the roller shaft 82 is within the range of the outer edge of the suction surface 220. Therefore, it is possible to prevent the pickup device 1 from being enlarged in the X-axis direction, which is a direction orthogonal to the common axis on which the plurality of extrusion bodies 30 move.

（5）根據凸輪面81的形狀，施力構件70對一對伸出部60中的一者與另一者的施加力不同。因此，能夠以不產生各擠壓體30的傾斜的方式設定施力構件70的施加力，實現順利的動作。(5) Depending on the shape of the cam surface 81, the urging member 70 exerts a different urging force on one of the pair of extension portions 60 and the other. Therefore, the urging force of the urging member 70 can be set so that the inclination of each extrusion body 30 is not generated, and a smooth operation can be achieved.

（6）最外側的擠壓體30的一對伸出部60設於最外側，隨著成為內側的擠壓體30，而依次在內側設有伸出部60。越是外側的擠壓體30則俯視時的大小越變大，因此搖晃時的擠壓面31的位移量也變大。本實施方式中，越是外側的伸出部60則間隔越變寬，因此能夠防止傾斜而使擠壓面31穩定。(6) The pair of protrusions 60 of the outermost extruded body 30 are provided on the outermost side, and become the inner extruded body 30, and the protrusions 60 are sequentially provided on the inner side. The outer side of the extruded body 30 has a larger size in plan view, and therefore the displacement amount of the extruded surface 31 during shaking also increases. In the present embodiment, the more the outer extension 60 is, the wider the interval is. Therefore, it is possible to prevent inclination and stabilize the pressing surface 31.

（7）轉換機構250具有：第2凸輪機構90，將第1驅動構件241的沿著共同的軸的方向上的移動轉換為滾輪軸82的與遠離方向交叉的方向上的移動。因此，能夠將驅動機構240的第1驅動構件241的移動設為共同的軸方向即Z軸方向，防止與其正交的方向即X軸方向的空間的擴大。(7) The conversion mechanism 250 includes the second cam mechanism 90 that converts the movement of the first drive member 241 in the direction along the common axis into the movement of the roller shaft 82 in the direction intersecting the distance direction. Therefore, the movement of the first drive member 241 of the drive mechanism 240 can be set in the Z-axis direction which is the common axis direction, and it is possible to prevent the expansion of the space in the X-axis direction which is the direction orthogonal to the Z-axis direction.

（8）第2凸輪機構90具有滾輪92及與所述滾輪92接觸的傾斜面91，且為直動凸輪，所述直動凸輪將滾輪92及傾斜面91中的任一者設為沿著共同的軸移動的主動凸輪，將另一者設為在與所述共同的軸交叉的方向移動的從動凸輪。因此，能夠利用簡單的構成將軸方向的動作轉換為滾輪軸82的動作。此外，也可將傾斜面91設為主動凸輪，將滾輪92設為從動凸輪。(8) The second cam mechanism 90 has a roller 92 and an inclined surface 91 in contact with the roller 92, and is a linear cam. The linear cam sets any one of the roller 92 and the inclined surface 91 along The driving cam that moves on the common axis is set as a driven cam that moves in a direction intersecting the common axis. Therefore, the movement in the axial direction can be converted into the movement of the roller shaft 82 with a simple configuration. In addition, the inclined surface 91 may be used as a driving cam, and the roller 92 may be used as a driven cam.

（9）擠壓部230具備五個或五個以上的擠壓體30A～30H，最外側的擠壓體30H形成為擠壓面32的大小與電子零件3的貼附於粘著片2的面的大小，也就是電子零件3的外形，相同或略小，最內側的擠壓體30A形成為擠壓面31的面積成為電子零件3的貼附於粘著片2的面的面積的30%或30%以下的大小。(9) The pressing part 230 is provided with five or more pressing bodies 30A to 30H, and the outermost pressing body 30H is formed to the size of the pressing surface 32 and the size of the electronic component 3 attached to the adhesive sheet 2 The size of the surface, that is, the outer shape of the electronic component 3, is the same or slightly smaller. The innermost extruded body 30A is formed so that the area of the extruded surface 31 becomes 30 of the area of the surface of the electronic component 3 attached to the adhesive sheet 2. % Or less than 30% of the size.

由於如此構成，因而能夠將粘著片2從電子零件3逐次少量地剝離，並且能夠減小最終未從電子零件3剝落而殘留的粘著片2的面積，因此即便是厚度薄的電子零件3也可抑制應力並使其剝離。這種構成對於使一邊的長度超過5 mm那樣的相對較大尺寸且厚度為小於或等於50 μm那樣的薄型的電子零件3的拾取特別有效。此外，若將最內側的擠壓體30A的擠壓面31的面積設定為電子零件3的面積的5%或5%以下，並以使筒狀的擠壓體30的側壁的厚度成為小於或等於0.6 mm的方式設定其個數，則能夠更進一步提高對應力的可靠性。也就是說，能夠更進一步提高電子零件3的破損的抑制效果。Due to this structure, the adhesive sheet 2 can be peeled off the electronic component 3 in small amounts one by one, and the area of the adhesive sheet 2 remaining without peeling from the electronic component 3 can be reduced. Therefore, even the electronic component 3 with a thin thickness can be reduced. It can also suppress stress and make it peel off. This configuration is particularly effective for picking up thin electronic components 3 having a relatively large size such that the length of one side exceeds 5 mm and a thickness of 50 μm or less. In addition, if the area of the pressing surface 31 of the innermost extruded body 30A is set to 5% or less of the area of the electronic component 3, and the thickness of the side wall of the cylindrical extruded body 30 is less than or Setting the number equal to 0.6 mm can further improve the reliability of stress. That is, the effect of suppressing the damage of the electronic component 3 can be further improved.

[第2實施方式] 參照圖9，作為第2實施方式，對具備第1實施方式的拾取裝置1的安裝裝置400進行說明。以下的說明中，將沿著垂直方向的直線的方向設為Z軸方向，將與Z軸方向正交的水平方向的平面中沿著彼此正交的兩直線的方向設為X軸方向、Y軸方向。[Second Embodiment] 9, as a second embodiment, a mounting device 400 including the pickup device 1 of the first embodiment will be described. In the following description, the direction of the straight line along the vertical direction is referred to as the Z-axis direction, and the direction along the two straight lines orthogonal to each other in the horizontal plane orthogonal to the Z-axis direction is referred to as the X-axis direction and Y-axis direction. Axis direction.

安裝裝置400除了拾取裝置1及控制裝置300以外，具有供給裝置500、中間平台600、基板平台700及安裝機構800。供給裝置500為保持貼附保持有半導體晶片等電子零件3的粘著片2的裝置。供給裝置500具有晶圓環510、晶圓台520及未圖示的驅動機構。晶圓環510為保持貼附有經單片化的電子零件3的粘著片2的構件。晶圓台520為可移動地支撐晶圓環510的裝置。驅動機構在X軸、Y軸及Z軸方向可移動地支撐晶圓台520，使晶圓環510沿著X軸、Y軸及Z軸移動。In addition to the pickup device 1 and the control device 300, the mounting device 400 has a supply device 500, an intermediate stage 600, a substrate stage 700, and a mounting mechanism 800. The supply device 500 is a device that holds the adhesive sheet 2 on which the electronic components 3 such as semiconductor wafers are attached and held. The supply device 500 has a wafer ring 510, a wafer table 520, and a driving mechanism not shown. The wafer ring 510 is a member that holds the adhesive sheet 2 to which the singulated electronic component 3 is attached. The wafer stage 520 is a device that movably supports the wafer ring 510. The driving mechanism movably supports the wafer stage 520 in the X-axis, Y-axis, and Z-axis directions, and moves the wafer ring 510 along the X-axis, Y-axis, and Z-axis.

中間平台600為在將由拾取裝置1的吸附噴嘴8吸附保持的電子零件3交付至安裝機構800時，暫時載置電子零件3的平台。基板平台700為載置基板710的構件。也就是說，為支撐供安裝電子零件3的基板710的構件。基板平台700支撐於未圖示的XYθ方向移動機構，設置成在X軸方向、Y軸方向、θ（水平旋轉）方向可移動。The intermediate platform 600 is a platform on which the electronic component 3 is temporarily placed when the electronic component 3 sucked and held by the suction nozzle 8 of the pickup device 1 is delivered to the mounting mechanism 800. The substrate platform 700 is a member on which the substrate 710 is placed. That is, it is a member that supports the substrate 710 on which the electronic component 3 is mounted. The substrate stage 700 is supported by an XYθ-direction movement mechanism not shown, and is provided to be movable in the X-axis direction, the Y-axis direction, and the θ (horizontal rotation) direction.

安裝機構800為將由拾取裝置1所取出的電子零件3安裝於基板710的機構。安裝機構800從中間平台600上吸附保持電子零件3，並將吸附保持的電子零件3安裝於經基板平台700所支撐的基板710上的規定位置。安裝機構800具有安裝工具810及未圖示的XYZ驅動機構。安裝工具810為吸附保持電子零件3的吸附噴嘴。XYZ驅動機構為使安裝工具810在X軸方向、Y軸方向、Z軸方向移動的機構。The mounting mechanism 800 is a mechanism for mounting the electronic component 3 taken out by the pickup device 1 on the substrate 710. The mounting mechanism 800 sucks and holds the electronic component 3 from the intermediate platform 600, and mounts the sucked and held electronic component 3 at a predetermined position on the substrate 710 supported by the substrate platform 700. The mounting mechanism 800 has a mounting tool 810 and an XYZ drive mechanism (not shown). The mounting tool 810 is a suction nozzle that sucks and holds the electronic component 3. The XYZ drive mechanism is a mechanism that moves the mounting tool 810 in the X-axis direction, the Y-axis direction, and the Z-axis direction.

拾取裝置1為與所述第1實施方式相同的構成。另外，控制裝置300是對第1實施方式的控制裝置300附加了控制供給裝置500、基板平台700、安裝機構800的功能。The pickup device 1 has the same configuration as the first embodiment described above. In addition, the control device 300 adds the functions of controlling the supply device 500, the substrate platform 700, and the mounting mechanism 800 to the control device 300 of the first embodiment.

此種安裝裝置400中，拾取裝置1如上文所述那樣，從經供給裝置500的晶圓台520所支撐的晶圓環510上拾取電子零件3。拾取裝置1將所拾取的電子零件3經由中間平台600而交付至安裝機構800的安裝工具810。安裝工具810安裝於基板平台700上的基板710。安裝裝置400依次反復執行此種電子零件3的拾取、交付、向基板710的安裝的動作。In this mounting device 400, the pickup device 1 picks up the electronic component 3 from the wafer ring 510 supported by the wafer table 520 of the supply device 500 as described above. The pickup device 1 delivers the picked-up electronic component 3 to the mounting tool 810 of the mounting mechanism 800 via the intermediate platform 600. The installation tool 810 is installed on the substrate 710 on the substrate platform 700. The mounting device 400 sequentially repeats the operations of picking up, delivering, and mounting the electronic component 3 to the substrate 710.

此種安裝裝置400中，能夠發揮與所述第1實施方式相同的作用效果。進而，由於所述作用效果，而能夠實現安裝裝置400對電子零件3的安裝品質的提高及安裝可靠性的提高，甚至能夠實現將電子零件3安裝於基板710所製造的半導體封裝等電子零件製品的品質的提高。In this type of mounting device 400, the same effects as those of the first embodiment described above can be exerted. Furthermore, due to the aforementioned effects, it is possible to improve the mounting quality and mounting reliability of the electronic component 3 by the mounting device 400, and even realize the electronic component products such as a semiconductor package manufactured by mounting the electronic component 3 on the substrate 710. The improvement of the quality.

[變形例] 本實施方式也可適用於以下那樣的變形例。例如，粘著片2的支撐方向、拾取機構100的拾取方向、支承部200的第1驅動構件241、第2驅動構件242的驅動方向、擠壓體30的移動方向可為垂直方向，也可為水平方向，也可為相對於這些方向而傾斜的方向。[Modifications] This embodiment can also be applied to the following modification examples. For example, the support direction of the adhesive sheet 2, the pickup direction of the pickup mechanism 100, the drive direction of the first drive member 241 and the second drive member 242 of the support portion 200, and the movement direction of the extrusion body 30 may be vertical or may be It is a horizontal direction, and it may be a direction inclined with respect to these directions.

另外，所述形態中，利用第1驅動構件241及轉換機構250使擠壓體30從外側的擠壓體30H起向鄰接的內側的擠壓體30G、擠壓體30F……、依次向遠離方向移動，也就是下降，但不限於此。例如，也可從位於內側的擠壓體30A起使鄰接的外側的擠壓體30B、擠壓體30C……、依次下降，也可從中間的擠壓體30起使鄰接的外側的擠壓體30和內側的擠壓體30依次下降。另外，關於使各擠壓體30下降的時機，不限於以均等的時間間隔下降，也可使每個擠壓體30下降的時間間隔不同。例如，也可電子零件3與粘著片2接觸的面積越小，則越縮短使擠壓體30下降的時間間隔。更具體而言，也可越從外側靠近內側，則越縮短使擠壓體30下降的時間間隔。In addition, in the above-mentioned form, the first drive member 241 and the conversion mechanism 250 are used to move the extruded body 30 from the outer extruded body 30H to the adjacent inner extruded body 30G, the extruded body 30F..., and then move away from each other in this order. Directional movement, that is, descending, but not limited to this. For example, the adjacent outer extruded body 30B, the extruded body 30C,..., from the inner extruded body 30A may be sequentially lowered, or the adjacent outer extruded body 30 may be pressed from the middle extruded body 30. The body 30 and the inner extruded body 30 descend sequentially. In addition, regarding the timing of lowering each extruded body 30, it is not limited to the lowering at an equal time interval, and the time interval for lowering each extruded body 30 may be different. For example, the smaller the contact area between the electronic component 3 and the adhesive sheet 2 is, the shorter the time interval for lowering the extruded body 30 is. More specifically, the closer to the inside from the outside, the shorter the time interval for lowering the extruded body 30.

進而，擠壓體30移動的遠離方向只要為使電子零件3從粘著片2剝離的方向即可，不限定於與擠壓的方向相反的方向。例如，也可使擠壓體30向擠壓方向移動，也就是上升。也就是說，也可設為相對於外側的擠壓體30H而越靠內側的擠壓體30，則依次上升得越高。另外，也可使擠壓體30進行上升與下降。例如，所述形態中，也可在凸輪面81形成使各擠壓體30以相同時機上升規定量的傾斜面，以使各擠壓體30一起上升規定量後，從外側的擠壓體30H起依次下降的方式動作。若這樣構成，則能夠省略第2驅動構件242。Furthermore, the direction in which the extruded body 30 moves away should just be a direction in which the electronic component 3 is peeled from the pressure-sensitive adhesive sheet 2, and is not limited to the direction opposite to the direction of extrusion. For example, the extrusion body 30 can also be moved in the extrusion direction, that is, ascended. In other words, it may be set that the inner extruded body 30 with respect to the outer extruded body 30H sequentially rises higher. In addition, the extruded body 30 can also be raised and lowered. For example, in the above-mentioned form, it is also possible to form an inclined surface on the cam surface 81 to raise each extruded body 30 by a predetermined amount at the same timing, so that each extruded body 30 is raised together by a predetermined amount, and then the outer extruded body 30H Starting and descending sequentially. With this structure, the second drive member 242 can be omitted.

此種擠壓體30的動作方式的變更只要對每個擠壓體30適當變更凸輪面81的形狀，所謂凸輪曲線即可。例如，所述形態中，若欲縮短使各擠壓體30下降的時間間隔，則只要縮短各擠壓體30間的凸輪面81的傾斜面85的相對間隔即可。另外，若欲增大擠壓體30的下降量，則只要增大第2一致面86相對於第1一致面84的高低差即可。這樣，若採用利用凸輪面81來進行控制的構成，則能夠通過各擠壓體30的凸輪面81的凸輪曲線的變更來自由地設定各擠壓體30的上推量或遠離量、上推或遠離的時機。To change the operation mode of the extrusion body 30 as described above, it is only necessary to appropriately change the shape of the cam surface 81 for each extrusion body 30, a so-called cam curve. For example, in the above-mentioned form, if it is desired to shorten the time interval for lowering each extruded body 30, it is only necessary to shorten the relative interval of the inclined surface 85 of the cam surface 81 between the extruded bodies 30. In addition, if it is desired to increase the amount of descent of the extruded body 30, it is only necessary to increase the height difference of the second coincidence surface 86 with respect to the first coincidence surface 84. In this way, if the configuration using the cam surface 81 for control is adopted, it is possible to freely set the pushing-up amount or the separating amount, the pushing-up or the pushing-up amount of each extrusion body 30 by changing the cam curve of the cam surface 81 of each extrusion body 30 Time to stay away.

另外，所述形態中，將擠壓體30形成為矩形的筒狀、或矩形的柱狀，但不限於此，也可形成為圓筒狀或圓柱狀、或者矩形以外的方筒狀或角柱狀。例如，當將擠壓體30設為圓筒狀及圓柱狀時，所謂各擠壓體30的相反的側面，成為位於相對於各擠壓體30的包含共同的軸的平面而垂直相交的直線上的兩個側面。因此，在圓筒狀的擠壓體30中如所述實施方式那樣在擠壓體30的側面的外側設有伸出部60時，伸出部60成為設置成與圓筒的側面接觸。In addition, in the above-mentioned form, the extruded body 30 is formed into a rectangular tube shape or a rectangular column shape, but it is not limited to this, and it may be formed into a cylindrical shape or a column shape, or a square tube shape or a square column shape other than a rectangular shape. shape. For example, when the extruded body 30 is cylindrical or cylindrical, the so-called opposite side surfaces of each extruded body 30 are straight lines that are located perpendicular to the plane containing the common axis of each extruded body 30. On the two sides. Therefore, in the cylindrical extruded body 30, when the protruding part 60 is provided outside the side surface of the extruded body 30 as in the above-mentioned embodiment, the protruding part 60 is provided so as to be in contact with the side surface of the cylinder.

此外，對本發明的若干實施方式進行了說明，但這些實施方式是作為示例而提示，並非意在限定發明的範圍。這些新穎的實施方式也能以其他各種形態實施，可在不偏離發明主旨的範圍內進行各種省略、替換、變更。這些實施方式或其變形包含在發明的範圍或主旨內，並且也包含在申請專利範圍所記載的發明及其均等範圍內。In addition, although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can also be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments or their modifications are included in the scope or gist of the invention, and are also included in the invention described in the scope of patent applications and their equivalent scope.

1:拾取裝置2:粘著片 3:電子零件4:拾取部 5:主體部6:凸部 7、221:抽吸孔8:吸附噴嘴 8a:平坦面9:噴嘴孔 30、30A～30H:擠壓體31、32:擠壓面 33:第1凸部34:第2凸部 35:凹部36:缺口 50:框架51:支撐塊 51a:導孔51b:突出部 52:第1支撐板53:線性導件 54:第2支撐板60:伸出部 70:施力構件80:第1凸輪機構 81:凸輪面82:滾輪軸 83:移動體83a:移動塊 83b、93:軸承84:第1一致面 85、91:傾斜面86:第2一致面 90:第2凸輪機構92:滾輪 100:拾取機構200:支承部 210:收容體211:抽吸泵 220:吸附面222:開口部 230:擠壓部240:驅動機構 241:第1驅動構件242:第2驅動構件 250:轉換機構300:控制裝置 400:安裝裝置500:供給裝置 510:晶圓環520:晶圓台 600:中間平台700:基板平台 710:基板800:安裝機構 810:安裝工具d1、d2:距離 p、q:位置w:長度1: Pickup device 2: Adhesive sheet 3: Electronic parts 4: Pickup part 5: Main body part 6: Convex part 7, 221: Suction hole 8: Adsorption nozzle 8a: flat surface 9: nozzle hole 30, 30A～30H: Extrusion body 31, 32: Extrusion surface 33: The first convex part 34: The second convex part 35: recess 36: notch 50: frame 51: support block 51a: guide hole 51b: protrusion 52: The first support plate 53: Linear guide 54: second support plate 60: extension 70: Force applying member 80: No. 1 cam mechanism 81: Cam surface 82: Roller shaft 83: moving body 83a: moving block 83b, 93: bearing 84: first consistent surface 85, 91: Inclined surface 86: Second consistent surface 90: 2nd cam mechanism 92: Roller 100: Pickup mechanism 200: Support part 210: containment body 211: suction pump 220: suction surface 222: opening 230: Squeeze part 240: Drive mechanism 241: The first drive member 242: The second drive member 250: Conversion mechanism 300: Control device 400: Installation device 500: Supply device 510: Wafer ring 520: Wafer table 600: Intermediate platform 700: Substrate platform 710: base plate 800: mounting mechanism 810: installation tools d1, d2: distance p, q: position w: length

圖1為表示第1實施方式的電子零件的拾取裝置的概略構成的透視正視圖。 圖2為表示第1實施方式的吸附面的平面圖。 圖3為表示第1實施方式的擠壓體的平面圖。 圖4（A）～圖4（H）為表示第1實施方式的擠壓體的分解圖，左側為正視圖，右側為側面圖。 圖5（A）～圖5（E）為表示擠壓體的動作順序的說明圖。 圖6（A）～圖6（E）為表示擠壓體的動作順序的說明圖。 圖7（A）～圖7（C）為表示第1實施方式的第2凸輪機構的動作說明圖。 圖8為表示第1實施方式的第1凸輪機構的動作說明圖。 圖9為表示第2實施方式的安裝裝置的構成圖。FIG. 1 is a perspective front view showing a schematic configuration of a pickup device for electronic components according to the first embodiment. Fig. 2 is a plan view showing the suction surface of the first embodiment. Fig. 3 is a plan view showing the extruded body of the first embodiment. 4(A) to 4(H) are exploded views showing the extruded body of the first embodiment, the left side is a front view, and the right side is a side view. 5(A) to 5(E) are explanatory diagrams showing the operation sequence of the extruded body. 6(A) to 6(E) are explanatory diagrams showing the operation sequence of the extruded body. 7(A) to 7(C) are operation explanatory diagrams showing the second cam mechanism of the first embodiment. Fig. 8 is an explanatory diagram showing the operation of the first cam mechanism of the first embodiment. Fig. 9 is a configuration diagram showing a mounting device according to a second embodiment.

1:拾取裝置 1: Pickup device

2:粘著片 2: Adhesive sheet

3:電子零件 3: electronic parts

4:拾取部 4: Pickup part

5:主體部 5: Main body

6:凸部 6: Convex

7:抽吸孔 7: Suction hole

8:吸附噴嘴 8: Adsorption nozzle

8a:平坦面 8a: flat surface

9:噴嘴孔 9: Nozzle hole

50:框架 50: Frame

51:支撐塊 51: Support block

51a:導孔 51a: pilot hole

51b:突出部 51b: protrusion

52:第1支撐板 52: The first support plate

53:線性導件 53: Linear guide

54:第2支撐板 54: The second support plate

60:伸出部 60: Overhang

70:施力構件 70: force component

80:第1凸輪機構 80: 1st cam mechanism

81:凸輪面 81: cam surface

82:滾輪軸 82: roller shaft

83:移動體 83: moving body

83a:移動塊 83a: Move block

83b、93:軸承 83b, 93: Bearing

84:第1一致面 84: First Consistent Side

85、91:傾斜面 85, 91: Inclined surface

86:第2一致面 86: Second Consistency

90:第2凸輪機構 90: 2nd cam mechanism

92:滾輪 92: scroll wheel

100:拾取機構 100: Pickup mechanism

200:支承部 200: Support

210:收容體 210: Containment

211:抽吸泵 211: Suction Pump

220:吸附面 220: Adsorption surface

230:擠壓部 230: Squeeze part

240:驅動機構 240: drive mechanism

241:第1驅動構件 241: The first drive member

242:第2驅動構件 242: The second drive member

250:轉換機構 250: conversion mechanism

300:控制裝置 300: control device

Claims (12)

一種電子零件的拾取裝置，其特徵在於包括：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與所述粘著片的和所述電子零件為相反側的一面相向地設置，所述支承部包括：吸附面，吸附保持所述粘著片的與供拾取的所述電子零件對應的區域；擠壓部，與共同的軸呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在所述吸附面內沿著所述共同的軸而能夠移動，且外形的大小不同；驅動機構，進行擠壓動作及遠離動作，所述擠壓動作使所述擠壓部移動而利用所有擠壓體擠壓所述粘著片，所述遠離動作從任一擠壓體起使鄰接的擠壓體依次向使所述電子零件從所述粘著片剝離的遠離方向移動；以及轉換機構，設於所述驅動機構，將沿著所述共同的軸移動的單一的驅動構件的動作轉換為所述多個擠壓體的遠離動作。 A pick-up device for electronic parts, characterized by comprising: a pick-up part for picking up electronic parts attached to an adhesive sheet; and a support part provided opposite to the side of the adhesive sheet that is opposite to the electronic part , The support portion includes: a suction surface that sucks and holds the area of the adhesive sheet corresponding to the electronic component for picking; the squeezing portion is arranged in a nested shape coaxially with a common axis The extruded body, the plurality of extruded bodies are arranged to be movable along the common axis in the suction surface, and have different sizes of outer shapes; the driving mechanism performs the extruding action and the moving away, the extruding The pressing action moves the pressing portion to press the adhesive sheet with all the pressing bodies, and the distance action moves the adjacent pressing bodies from any one of the pressing bodies to move the electronic component from the The adhesive sheet is moved away from the peeling direction; and a conversion mechanism is provided in the drive mechanism, and converts the movement of a single drive member that moves along the common axis into the moving away of the plurality of extruded bodies. 如申請專利範圍第1項所述的電子零件的拾取裝置，其中所述轉換機構包括：至少一對伸出部，從各擠壓體的相反的側面向外伸出；施力構件，對各擠壓體的伸出部向所述遠離方向個別地施力；以及 第1凸輪機構，由所述驅動構件所驅動，從任一擠壓體起向鄰接的擠壓體依次允許各擠壓體向所述遠離方向移動。 According to the first item of the scope of patent application, the pick-up device for electronic parts, wherein the conversion mechanism includes: at least a pair of protruding parts protruding from opposite sides of each extruded body; The protruding parts of the extruded body individually apply force to the away direction; and The first cam mechanism is driven by the drive member, and sequentially allows each extrusion body to move in the away direction from any extrusion body to the adjacent extrusion body. 如申請專利範圍第2項所述的電子零件的拾取裝置，其中所述第1凸輪機構包括：凸輪面，設於各擠壓體的和擠壓於所述粘著片的擠壓面為相反側的一面，沿著與所述共同的軸交叉的方向而在每個所述擠壓體中形狀不同；以及滾輪軸，與各擠壓體的凸輪面接觸，對各擠壓體向抵抗所述施力構件的方向施力，並且在與所述遠離方向交叉的方向移動。 The pick-up device for electronic parts according to the second item of the scope of patent application, wherein the first cam mechanism includes a cam surface, and the pressing surface provided on each pressing body and pressing on the adhesive sheet are opposite to each other The side surface is different in shape in each of the extruded bodies along the direction intersecting the common axis; and the roller shaft is in contact with the cam surface of each extruded body and resists each extruded body. The force applying member applies force in the direction of the force application member and moves in a direction crossing the distance direction. 如申請專利範圍第3項所述的電子零件的拾取裝置，其中所述滾輪軸的移動範圍為所述吸附面的外緣的範圍內。 In the electronic component pick-up device described in claim 3, the moving range of the roller shaft is within the range of the outer edge of the suction surface. 如申請專利範圍第3項或第4項所述的電子零件的拾取裝置，其中根據所述凸輪面的形狀，施力構件對所述一對伸出部中的一者與另一者的施加力不同。 The pick-up device for electronic parts as described in item 3 or item 4 of the scope of patent application, wherein according to the shape of the cam surface, the urging member applies to one and the other of the pair of protrusions The force is different. 如申請專利範圍第2項所述的電子零件的拾取裝置，其中將最外側的所述擠壓體的一對所述伸出部設於最外側，隨著成為內側的所述擠壓體而依次在內側設有所述伸出部。 The pick-up device for electronic parts described in claim 2, wherein a pair of the extension portions of the outermost extruded body are provided on the outermost side and become the inner extruded body. The protrusions are arranged on the inner side in turn. 如申請專利範圍第3項所述的電子零件的拾取裝置，其中所述轉換機構包括：第2凸輪機構，將所述驅動構件的沿著所述共同的軸的方向上的移動轉換為所述滾輪軸的與所述遠離方向交叉的方向上的移動。 The pick-up device for electronic parts according to claim 3, wherein the conversion mechanism includes: a second cam mechanism that converts the movement of the driving member in the direction along the common axis into the The movement of the roller shaft in a direction intersecting the distance direction. 如申請專利範圍第7項所述的電子零件的拾取裝置，其中所述第2凸輪機構包括：滾輪及與所述滾輪接觸的傾斜面，且所述第2凸輪機構為直動凸輪，將所述滾輪及所述傾斜面中的任一者設為沿著所述共同的軸移動的主動凸輪，將另一者設為在與所述共同的軸交叉的方向移動的從動凸輪。 In the electronic component pick-up device described in claim 7, wherein the second cam mechanism includes a roller and an inclined surface in contact with the roller, and the second cam mechanism is a linear cam, Either one of the roller and the inclined surface is a driving cam that moves along the common axis, and the other is a driven cam that moves in a direction intersecting the common axis. 如申請專利範圍第1項所述的電子零件的拾取裝置，其中所述擠壓部包括五個或五個以上的擠壓體，最外側的擠壓體形成為擠壓面的大小與供拾取的所述電子零件的貼附於所述粘著片的面的大小相同或略小，最內側的擠壓體形成為擠壓面的面積成為供拾取的所述電子零件的貼附於所述粘著片的面的面積的30%或30%以下的大小。 As claimed in the first item of the scope of patent application, the picking device for electronic parts, wherein the pressing portion includes five or more pressing bodies, and the outermost pressing body is formed to have the size of the pressing surface and the size of the pressing surface for picking up. The size of the surface of the electronic component attached to the adhesive sheet is the same or slightly smaller, and the innermost extruded body is formed so that the area of the extruded surface becomes the area for the pick-up of the electronic component to be attached to the adhesive The size of the surface area of the sheet is 30% or less. 一種電子零件的拾取裝置，其特徵在於包括：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與所述粘著片的和所述電子零件為相反側的一面相向地設置，所述支承部包括：吸附面，吸附保持所述粘著片的與供拾取的所述電子零件對應的區域；擠壓部，與共同的軸呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在所述吸附面內沿著所述共同的軸而能夠移動，且外形的大小不同； 驅動機構，進行擠壓動作及遠離動作，所述擠壓動作使所述擠壓部移動而利用所有的所述擠壓體擠壓所述粘著片，所述遠離動作從任一擠壓體起使鄰接的擠壓體依次向使所述電子零件從所述粘著片剝離的遠離方向移動；以及轉換機構，設於所述驅動機構，將沿著所述共同的軸移動的單一的驅動構件的動作轉換為所述多個擠壓體的遠離動作，所述轉換機構包括：施力構件，對各擠壓體向所述遠離方向個別地施力；凸輪面，設於各擠壓體的和擠壓於所述粘著片的擠壓面為相反側的一面，沿著與所述共同的軸交叉的方向而在每個所述擠壓體中形狀不同；以及滾輪軸，與各擠壓體的凸輪面接觸，對各擠壓體向抵抗所述施力構件的方向施力，並且在與所述遠離方向交叉的方向移動。 A pick-up device for electronic parts, characterized by comprising: a pick-up part for picking up electronic parts attached to an adhesive sheet; and a support part provided opposite to the side of the adhesive sheet that is opposite to the electronic part , The support portion includes: a suction surface that sucks and holds the area of the adhesive sheet corresponding to the electronic component for picking; the squeezing portion is arranged in a nested shape coaxially with a common axis An extruded body, the plurality of extruded bodies are arranged to be movable along the common axis in the adsorption surface, and the shapes of the plurality of extruded bodies are different in size; The drive mechanism performs a squeezing action and a distance movement. The squeezing action moves the squeezing part to squeeze the adhesive sheet with all the squeezing bodies. The adjacent extruded bodies are sequentially moved in the direction away from the peeling of the electronic components from the adhesive sheet; and the conversion mechanism is provided in the drive mechanism and is a single drive that moves along the common axis The action of the member is converted into the moving away of the plurality of extruded bodies, and the conversion mechanism includes: an urging member that individually applies force to each extruded body in the away direction; and a cam surface is provided on each extruded body And the pressing surface pressed to the adhesive sheet is the opposite side, and the shape is different in each of the pressing bodies along the direction intersecting the common axis; and the roller shaft is different from each other. The cam surfaces of the extruded bodies are in contact with each other, and each extruded body is urged in a direction resisting the urging member, and moves in a direction crossing the distance direction. 一種電子零件的拾取裝置，其特徵在於包括：拾取部，拾取貼附於粘著片的電子零件；以及支承部，與所述粘著片的和所述電子零件為相反側的一面相向地設置，所述支承部包括：吸附面，吸附保持所述粘著片的與供拾取的所述電子零件對應的區域；擠壓部，呈同軸的嵌套狀地配設有多個擠壓體，所述多個擠壓體設置成在所述吸附面內沿著共同的軸而能夠移動，且外形的 大小不同；以及驅動機構，使所述多個擠壓體沿著所述共同的軸而個別地動作，且包括沿著所述共同的軸移動的單一的驅動構件、及將所述單一的驅動構件的動作轉換為所述多個擠壓體的個別的動作的轉換機構。 A pick-up device for electronic parts, characterized by comprising: a pick-up part for picking up electronic parts attached to an adhesive sheet; and a support part provided opposite to the side of the adhesive sheet that is opposite to the electronic part , The support portion includes: a suction surface that sucks and holds the area of the adhesive sheet corresponding to the electronic component for picking up; the compression portion is provided with a plurality of extrusion bodies in a coaxial nesting shape, The plurality of extruded bodies are arranged to be movable along a common axis in the suction surface, and have a shape of Different sizes; and a drive mechanism that makes the plurality of extruded bodies move individually along the common axis, and includes a single drive member that moves along the common axis, and the single drive A conversion mechanism for converting the movement of the member into the individual movement of the plurality of extruded bodies. 一種安裝裝置，包括：供給裝置，保持貼附保持有半導體晶片的粘著片；基板平台，載置基板；拾取裝置，從所述供給裝置所保持的所述粘著片拾取所述半導體晶片；以及安裝機構，將由所述拾取裝置所取出的所述半導體晶片安裝於所述基板，且所述安裝裝置的特徵在於，所述拾取裝置為根據申請專利範圍第1項至第11項中任一項所述的拾取裝置。 A mounting device includes: a supply device for holding and attaching an adhesive sheet holding a semiconductor wafer; a substrate platform for placing a substrate; a pickup device for picking up the semiconductor wafer from the adhesive sheet held by the supply device; And a mounting mechanism for mounting the semiconductor wafer taken out by the pick-up device on the substrate, and the mounting device is characterized in that the pick-up device is according to any one of items 1 to 11 of the scope of patent application The pickup device described in the item.
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