JP2020072125A - Electronic component pick-up device and mounting device - Google Patents

Electronic component pick-up device and mounting device Download PDF

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JP2020072125A
JP2020072125A JP2018203187A JP2018203187A JP2020072125A JP 2020072125 A JP2020072125 A JP 2020072125A JP 2018203187 A JP2018203187 A JP 2018203187A JP 2018203187 A JP2018203187 A JP 2018203187A JP 2020072125 A JP2020072125 A JP 2020072125A
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pressing
adhesive sheet
electronic component
pressing body
common axis
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JP7154106B2 (en
JP2020072125A5 (en
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宣明 小西
Nobuaki Konishi
宣明 小西
康一 志賀
Koichi Shiga
康一 志賀
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2018203187A priority Critical patent/JP7154106B2/en
Priority to KR1020190134538A priority patent/KR102330577B1/en
Priority to CN201911028600.8A priority patent/CN111106037B/en
Priority to TW108138938A priority patent/TWI720667B/en
Publication of JP2020072125A publication Critical patent/JP2020072125A/en
Publication of JP2020072125A5 publication Critical patent/JP2020072125A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

To provide a pick-up device capable of suppressing the breakage of an electronic component.SOLUTION: A pick-up device 1 has: a pick-up portion 4 that picks up an electronic component 3 pasted to an adhesive sheet 2; and a back-up portion 200 provided oppositely to a surface on the opposite side to the electronic component 3 of the adhesive sheet 2. The back-up portion 200 has: an adsorption surface 220 that adsorbs and holds the adhesive sheet 2; a pressing portion 230 that is provided within the adsorption surface 220 so as to move along a common axis, and in which a plurality of pressing bodies 30 different in the size of the outer shape is arranged in a telescopic shape coaxial with the common axis; a drive mechanism 240 that moves the pressing portion 230 to perform a pressing action of pressing the adhesive sheet 2 with the whole pressing bodies 30 and a separating action successively moving the pressing bodies 30 in a separating direction; and a conversion mechanism 250 that is provided on the drive mechanism 240, and converts the action of a single driving member 241 moving along the common axis into the separating action of the plurality of pressing bodies 30.SELECTED DRAWING: Figure 1

Description

本発明は、電子部品のピックアップ装置及び実装装置に関する。   The present invention relates to an electronic component pickup device and a mounting device.

半導体チップをリードフレームや配線基板、インターポーザ基板等の基板上に実装するにあたって、半導体チップ毎に切断されて個片化された半導体ウエーハが粘着シートに貼着されたウエーハシートから、半導体チップを１つずつ取り出し、基板上に移送して実装することが行われている。   When mounting a semiconductor chip on a substrate such as a lead frame, a wiring board, or an interposer board, a semiconductor wafer cut into individual semiconductor chips and separated into individual pieces is attached to an adhesive sheet to form a semiconductor chip 1 It is carried out that they are taken out one by one and transferred onto a substrate for mounting.

このように、ウエーハシートなどの粘着シートに貼り付けられた半導体チップなどの電子部品を、粘着シートから剥離してピックアップするために、ピックアップ機構と突き上げ機構とを有するピックアップ装置が用いられている。ピックアップ機構は、電子部品を吸着する吸着ノズルを有する。突き上げ機構は、吸着ノズルに吸着された電子部品を下面側から突き上げピンで突き上げて、粘着シートからの電子部品の剥離及び取り出しを補助する。   As described above, a pickup device having a pickup mechanism and a push-up mechanism is used to peel off an electronic component such as a semiconductor chip attached to an adhesive sheet such as a wafer sheet from the adhesive sheet to pick up the electronic component. The pickup mechanism has a suction nozzle that sucks an electronic component. The push-up mechanism pushes up the electronic component sucked by the suction nozzle from the lower surface side with a push-up pin to assist in peeling and taking out the electronic component from the adhesive sheet.

ところで、最近の半導体チップは、その厚さが５０μｍ以下というように薄厚化が進められている。そのように薄い半導体チップを単に突き上げピンで粘着シートを引き伸ばしながら突き上げた場合には、半導体チップが損傷するおそれが大きくなる。そこで、特許文献１に示されるように、半導体チップの下面に貼着された粘着シートの剥離が半導体チップの周辺部から中心部に向かって徐々に進行するように、軸線を一致させて同心的に設けられた複数の押し上げ体を有するピックアップ装置が開発されている。このようなピックアップ装置において、複数の押し上げ体がなす上面形状は、通常、ピックアップされる半導体チップと同等の形状、例えば四角形に形成されている。   By the way, recent semiconductor chips are being thinned to a thickness of 50 μm or less. If such a thin semiconductor chip is simply pushed up while the adhesive sheet is being stretched by the push-up pin, the semiconductor chip is more likely to be damaged. Therefore, as shown in Patent Document 1, the axes are aligned so as to be concentric with each other so that the peeling of the adhesive sheet adhered to the lower surface of the semiconductor chip gradually progresses from the peripheral portion of the semiconductor chip toward the central portion. A pickup device having a plurality of push-up bodies provided in the vehicle has been developed. In such a pickup device, an upper surface shape formed by a plurality of push-up bodies is usually formed in a shape similar to that of a semiconductor chip to be picked up, for example, a quadrangle.

上記したピックアップ装置においては、まず複数の押し上げ体を同時に所定の高さまで上昇させて、ピックアップされる半導体チップの下面全体を押圧して押し上げる。そして、最も外側に位置する突き上げ体を残し、他の突き上げ体を所定の高さまでさらに上昇させる。次いで、２番目の突き上げ体を残して他の突き上げ体を上昇させる。半導体チップの下面の突き上げ体による支持は、周辺部から中心部に向かって順次開放されるため、半導体チップが粘着テープから剥離しやすくなる。さらに、半導体チップの下面からの粘着テープの剥離を促進するために、少なくとも最外周に位置する押し上げ体の粘着テープとの接触面（上面）に、粘着テープとの間に吸引力が作用する凹部を設けることが提案されている。押し上げ体の上面に設けられた凹部は、粘着シートが半導体チップから剥離し始める箇所となるため、剥離テープの半導体チップからの剥離を促進することができる。   In the pickup device described above, first, the plurality of push-up bodies are simultaneously raised to a predetermined height, and the entire lower surface of the semiconductor chip to be picked up is pushed and pushed up. Then, the push-up body located on the outermost side is left, and the other push-up bodies are further raised to a predetermined height. Next, the second thrust body is left and the other thrust bodies are raised. The support of the push-up body on the lower surface of the semiconductor chip is sequentially opened from the peripheral portion toward the central portion, so that the semiconductor chip is easily separated from the adhesive tape. Further, in order to promote the peeling of the adhesive tape from the lower surface of the semiconductor chip, at least the contact surface (upper surface) of the push-up body located at the outermost periphery with the adhesive tape (upper surface) is a recess where suction force acts between the concave portion and Is proposed. The concave portion provided on the upper surface of the push-up body serves as a place where the pressure-sensitive adhesive sheet starts to peel from the semiconductor chip, and therefore, peeling of the peeling tape from the semiconductor chip can be promoted.

特開２０１０−０５６４６６号公報JP, 2010-056466, A

しかしながら、上述したような複数の押し上げ体を有すると共に、少なくとも最外周に位置する押し上げ体の上面に凹部を設けたピックアップ装置を用いた場合においても、半導体チップに破損が生じる場合がある。半導体チップの破損の原因は明確ではないものの、厚さが例えば３０μｍ以下というように薄厚化された半導体チップを粘着シートから剥離してピックアップする際に、半導体チップの破損が生じやすい。また、半導体チップに形成される回路も半導体チップの高容量化や高機能化等を図るために高密度化しており、そのような回路形状も半導体チップの破損の一因と考えられる。   However, even in the case of using a pickup device having a plurality of push-up bodies as described above and having a recess on the upper surface of at least the outermost push-up body, the semiconductor chip may be damaged. Although the cause of the damage of the semiconductor chip is not clear, when the thin semiconductor chip having a thickness of, for example, 30 μm or less is peeled from the adhesive sheet and picked up, the semiconductor chip is likely to be damaged. Further, the circuits formed on the semiconductor chip are also highly densified in order to increase the capacity and the function of the semiconductor chip, and such a circuit shape is also considered to be a cause of damage to the semiconductor chip.

例えば、ＮＡＮＤ型フラッシュメモリ等のメモリチップにおいては、その厚さが年々薄厚化されており、上記したように３０μｍ以下、さらに２５μｍ以下、２０μｍ以下というような厚さを有する半導体チップの実用化が進められている。このため、そのような薄厚化された半導体チップをピックアップする場合においても、半導体チップに破損を生じさせることなく、より確実に半導体チップを粘着シートから剥離してピックアップすることが可能なピックアップ装置が求められている。   For example, in a memory chip such as a NAND flash memory, the thickness thereof has been reduced year by year, and as described above, a semiconductor chip having a thickness of 30 μm or less, 25 μm or less, 20 μm or less has been put to practical use. It is being advanced. Therefore, even when picking up such a thinned semiconductor chip, there is provided a pickup device capable of more reliably peeling the semiconductor chip from the adhesive sheet and picking it up without causing damage to the semiconductor chip. It has been demanded.

本発明の目的は、電子部品の破損を抑制できるピックアップ装置及び実装装置を提供することにある。   An object of the present invention is to provide a pickup device and a mounting device that can suppress damage to electronic components.

実施形態の電子部品のピックアップ装置は、粘着シートに貼着された電子部品をピックアップするピックアップ部と、前記粘着シートの前記電子部品とは反対側の面に対向して設けられたバックアップ部と、を有し、前記バックアップ部は、前記粘着シートのピックアップされる前記電子部品に対応する領域を吸着保持する吸着面と、前記吸着面内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体が前記共通の軸に同軸の入れ子状に配設された押圧部と、前記押圧部を移動させて、全ての押圧体により前記粘着シートを押圧する押圧動作と、いずれかの押圧体から隣接する押圧体を順次、前記電子部品を粘着シートから剥離させる離隔方向へ移動させる離隔動作とを行わせる駆動機構と、前記駆動機構に設けられ、前記共通の軸に沿って移動する単一の駆動部材の動作を、前記複数の押圧体の離隔動作に変換する変換機構と、を有する。   The electronic component pickup device of the embodiment, a pickup unit for picking up an electronic component attached to an adhesive sheet, and a backup unit provided opposite to the surface of the adhesive sheet opposite to the electronic component, The backup unit has a suction surface that suction-holds a region of the pressure-sensitive adhesive sheet corresponding to the electronic component to be picked up, and is provided movably along a common axis in the suction surface. A plurality of pressing bodies having different sizes, a pressing portion coaxially arranged on the common shaft in a nested form, and a pressing operation of moving the pressing portion and pressing the adhesive sheet by all the pressing bodies, A drive mechanism that is provided in the drive mechanism, and a drive mechanism that causes one of the press bodies to perform a separating operation that sequentially moves the adjacent press bodies in a separating direction that separates the electronic component from the adhesive sheet. The operation of the single drive member to move along the common axis, having a conversion mechanism for converting the separating operation of said plurality of pressing bodies.

前記変換機構は、各押圧体の相反する側面から外方に延出した少なくとも一対の延出部と、各押圧体の延出部を前記離隔方向に個別に付勢する付勢部材と、前記駆動部材により駆動され、各押圧体の前記離隔方向への移動を、いずれかの押圧体から隣接する押圧体へと順次許容する第１のカム機構と、を有していてもよい。   The conversion mechanism includes at least a pair of extending portions that extend outward from opposite side surfaces of each pressing body, and a biasing member that individually biases the extending portions of each pressing body in the separating direction, A first cam mechanism that is driven by a drive member and that sequentially allows the pressing bodies to move in the separating direction from any one of the pressing bodies to an adjacent pressing body may be included.

前記第１のカム機構は、各押圧体の前記粘着シートに押圧される押圧面とは反対側の面に設けられ、前記共通の軸に交差する方向に沿って、前記押圧体毎に形状が異なるカム面と、各押圧体のカム面に接して、各押圧体を前記付勢部材に抗する方向に付勢するとともに、前記離隔方向に交差する方向に移動するローラシャフトと、を有していてもよい。   The first cam mechanism is provided on a surface of each pressing body opposite to the pressing surface pressed by the adhesive sheet, and has a shape for each pressing body along a direction intersecting with the common axis. A different cam surface, and a roller shaft that is in contact with the cam surface of each pressing body, urges each pressing body in a direction against the urging member, and moves in a direction intersecting the separating direction. May be.

前記ローラシャフトの移動範囲は、前記吸着面の外縁の範囲内であってもよい。前記カム面の形状に応じて、前記一対の延出部の一方と他方に対する付勢部材の付勢力が相違していてもよい。最も外側の前記押圧体の一対の前記延出部が最も外側に設けられ、内側の前記押圧体になるに従って、前記延出部が順次内側に設けられていてもよい。   The moving range of the roller shaft may be within a range of an outer edge of the suction surface. The biasing force of the biasing member with respect to one and the other of the pair of extending portions may be different depending on the shape of the cam surface. The pair of extending portions of the outermost pressing body may be provided on the outermost side, and the extending portions may be sequentially provided on the inner side as the inner pressing body is formed.

前記変換機構は、前記駆動部材の前記共通の軸に沿う方向への移動を、前記ローラシャフトの前記離隔方向に交差する方向への移動へ変換する第２のカム機構を有していてもよい。   The conversion mechanism may include a second cam mechanism that converts the movement of the drive member in the direction along the common axis into the movement of the roller shaft in a direction intersecting the separation direction. ..

前記第２のカム機構は、ローラ及びこれに接する傾斜面を有し、前記ローラ及び前記傾斜面のいずれか一方を前記共通の軸に沿って移動させる主動カム、他方を前記共通の軸に交差する方向に移動させる従動カムとする直動カムであってもよい。   The second cam mechanism has a roller and an inclined surface that is in contact with the roller, a driving cam that moves one of the roller and the inclined surface along the common axis, and the other intersects with the common axis. It may be a linear cam that is a driven cam that is moved in the direction.

前記押圧部は、５個以上の押圧体を備え、最も外側の押圧体は、押圧面の大きさが、ピックアップされる前記電子部品の前記粘着シートに貼り付けられる面の大きさと同じ或いは若干小さくなるように形成され、最も内側の押圧体は、押圧面の面積が、ピックアップされる前記電子部品の前記粘着シートに貼り付けられる面の面積の３０％以下となる大きさに形成されて成っていてもよい。   The pressing portion includes five or more pressing bodies, and the outermost pressing body has a pressing surface size equal to or slightly smaller than the surface size of the electronic component to be picked up and attached to the adhesive sheet. The innermost pressing body is formed in such a size that the area of the pressing surface is 30% or less of the area of the surface of the electronic component to be picked up and attached to the adhesive sheet. May be.

本発明の電子部品のピックアップ装置は、粘着シートに貼着された電子部品をピックアップするピックアップ機構と、前記粘着シートの前記電子部品とは反対側の面に対向して設けられたバックアップ部と、を有し、前記バックアップ部は、前記粘着シートのピックアップされる前記電子部品に対応する領域を吸着保持する吸着面と、前記吸着面内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体が前記共通の軸に同軸の入れ子状に配設された押圧部と、前記押圧部を移動させて、全ての押圧体により前記粘着シートを押圧する押圧動作と、いずれかの押圧体から隣接する押圧体を順次、前記電子部品を粘着シートから剥離させる離隔方向へ移動させる離隔動作とを行う駆動機構と、前記駆動機構に設けられ、前記共通の軸に沿って移動する単一の駆動部材の動作を、前記複数の押圧体の離隔動作に変換する変換機構と、を有し、前記変換機構は、各押圧体を前記離隔方向に個別に付勢する付勢部材と、各押圧体の前記粘着シートに押圧される押圧面とは反対側の面に設けられ、前記共通の軸に交差する方向に沿って、前記押圧体毎に形状が異なるカム面と、各押圧体のカム面に接して、各押圧体を前記付勢部材に抗する方向に付勢するとともに、前記離隔方向に交差する方向に移動するローラシャフトと、を有する。   An electronic component pickup device of the present invention is a pickup mechanism for picking up an electronic component adhered to an adhesive sheet, and a backup unit provided to face the surface of the adhesive sheet opposite to the electronic component, The backup unit has a suction surface that suction-holds a region of the pressure-sensitive adhesive sheet corresponding to the electronic component to be picked up, and is provided movably along a common axis in the suction surface. A plurality of pressing bodies having different sizes, a pressing portion coaxially arranged on the common shaft in a nested form, and a pressing operation of moving the pressing portion and pressing the adhesive sheet by all the pressing bodies, A drive mechanism that performs a separating operation for moving the adjacent pressing body from any one of the pressing bodies sequentially in a separating direction for separating the electronic component from the adhesive sheet, and a driving mechanism provided in the driving mechanism, A conversion mechanism that converts the movement of a single drive member that moves along a common axis into the separating operation of the plurality of pressing bodies, wherein the converting mechanism separates each pressing body in the separating direction. A biasing member for biasing the pressing member and a surface of each pressing member opposite to the pressing surface pressed by the adhesive sheet, and each pressing member has a shape along a direction intersecting the common axis. A different cam surface, and a roller shaft that is in contact with the cam surface of each pressing body, urges each pressing body in a direction against the urging member, and moves in a direction intersecting the separating direction. ..

本発明の電子部品のピックアップ装置は、粘着シートに貼着された電子部品をピックアップするピックアップ部と、前記粘着シートの前記電子部品とは反対側の面に対向して設けられたバックアップ部と、を有し、前記バックアップ部は、前記粘着シートのピックアップされる前記電子部品に対応する領域を吸着保持する吸着面と、前記吸着面内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体が同軸の入れ子状に配設された押圧部と、前記複数の押圧体を前記共通の軸に沿って個別に動作させる駆動機構であって、共通の軸に沿って移動する単一の駆動部材と、この単一の駆動部材の動作を前記複数の押圧体の個別の動作に変換する変換機構と、を備える駆動機構と、を有する。   An electronic component pickup device of the present invention is a pickup unit for picking up an electronic component attached to an adhesive sheet, and a backup unit provided to face the surface of the adhesive sheet opposite to the electronic component, The backup unit has a suction surface that suction-holds a region of the pressure-sensitive adhesive sheet corresponding to the electronic component to be picked up, and is provided movably along a common axis in the suction surface. A pressing unit in which a plurality of pressing bodies of different sizes are coaxially arranged and a drive mechanism for individually operating the plurality of pressing bodies along the common axis, A drive mechanism that includes a single drive member that moves by moving the single drive member, and a conversion mechanism that converts the operation of the single drive member into the individual operations of the plurality of pressing bodies.

本発明の実装装置は、半導体チップを貼着保持した粘着シートを保持する供給装置と、基板を載置する基板ステージと、前記供給装置が保持した前記粘着シートから前記半導体チップをピックアップするピックアップ装置と、前記ピックアップ装置によって取り出された前記半導体チップを、前記基板に実装する実装機構と、を備えた実装装置であって、前記ピックアップ装置は、前記のいずれかのピックアップ装置である。   The mounting apparatus of the present invention includes a supply device that holds an adhesive sheet to which a semiconductor chip is attached and held, a substrate stage that mounts a substrate, and a pickup device that picks up the semiconductor chip from the adhesive sheet held by the supply device. And a mounting mechanism for mounting the semiconductor chip taken out by the pickup device on the substrate, wherein the pickup device is any one of the pickup devices described above.

本発明によれば、電子部品の破損を抑制できるピックアップ装置及び実装装置を提供することができる。   According to the present invention, it is possible to provide a pickup device and a mounting device that can suppress damage to electronic components.

第１の実施形態の電子部品のピックアップ装置の概略構成を示す透視正面図である。1 is a perspective front view showing a schematic configuration of a pickup device for an electronic component according to a first embodiment. 第１の実施形態の吸着面を示す平面図である。It is a top view which shows the adsorption | suction surface of 1st Embodiment. 第１の実施形態の押圧体を示す平面図である。It is a top view which shows the press body of 1st Embodiment. 第１の実施形態の押圧体を示す分解図であり、左側が正面図、右側が側面図である。It is an exploded view which shows the press body of 1st Embodiment, a left side is a front view and a right side is a side view. 押圧体の動作手順を示す説明図である。It is explanatory drawing which shows the operation procedure of a press body. 押圧体の動作手順を示す説明図である。It is explanatory drawing which shows the operation procedure of a press body. 第１の実施形態の第２のカム機構を示す動作説明図である。It is operation | movement explanatory drawing which shows the 2nd cam mechanism of 1st Embodiment. 第１の実施形態の第１のカム機構を示す動作説明図である。It is operation | movement explanatory drawing which shows the 1st cam mechanism of 1st Embodiment. 第２の実施形態の実装装置を示す構成図である。It is a block diagram which shows the mounting apparatus of 2nd Embodiment.

以下、実施形態のピックアップ装置について、図面を参照して説明する。以下に示す図面は模式的なものであり、各部のサイズ、形状、各部の相互のサイズの比率等は現実のものとは異なる場合がある。   Hereinafter, a pickup device according to an embodiment will be described with reference to the drawings. The drawings shown below are schematic, and the sizes and shapes of the respective parts, the ratios of the mutual sizes of the respective parts, and the like may differ from the actual ones.

［第１の実施形態］
［構成］
図１は、第１の実施形態のピックアップ装置１の概略構成を示す透視正面図、図２は図１に示すピックアップ装置１のバックアップ部２００の吸着面２２０を示す平面図、図３は押圧部２３０を示す平面図、図４は押圧部２３０の分解図である。図４（ａ）〜（ｈ）の左側が正面図、右側が側面図である。なお、以下の説明中において、押圧部２３０の軸に平行な直線をＺ軸、これに直交する平面において互いに直交する２軸をＸ軸及びＹ軸とする。軸に沿う方向といった場合、軸に平行な直線上の相反する２方向を含む。但し、押圧部２３０が移動して粘着シート２を押圧する方向を、図中の矢印で示すＺ方向、Ｚ方向に直交し、ローラシャフト８２が移動する方向を、図中の矢印で示すＸ方向とする。また、本実施形態では、Ｘ軸及びＹ軸は水平に沿う軸であり、Ｚ軸は垂直な軸であるものとする。さらに、本実施形態では、重力に従う方向を下方、重力に抗する方向を上方としている。なお、押圧部２３０の軸は、後述する粘着シート２に接離する押圧面３１の中心を貫いて、径方向の断面に直交する直線である。押圧部２３０の「径方向の断面」とは、押圧部２３０を押圧面３１に正対して見たときに、押圧面３１の外形線によって形成される平面図形に沿う方向の断面である。なお、「押圧面の中心」とは、押圧部２３０を押圧面３１に正対して見たときに、押圧面３１の外形線によって形成される平面図形の中心又は重心のことである。 [First Embodiment]
[Constitution]
FIG. 1 is a perspective front view showing a schematic configuration of the pickup device 1 of the first embodiment, FIG. 2 is a plan view showing a suction surface 220 of a backup part 200 of the pickup device 1 shown in FIG. 1, and FIG. 3 is a pressing part. FIG. 4 is a plan view showing 230, and FIG. 4 is an exploded view of the pressing portion 230. The left side of FIGS. 4A to 4H is a front view and the right side is a side view. In the following description, a straight line parallel to the axis of the pressing portion 230 will be referred to as the Z axis, and two axes that are orthogonal to each other in a plane orthogonal to this will be referred to as the X axis and the Y axis. The term "direction along the axis" includes two opposite directions on a straight line parallel to the axis. However, the direction in which the pressing portion 230 moves to press the adhesive sheet 2 is the Z direction indicated by the arrow in the drawing, is orthogonal to the Z direction, and the direction in which the roller shaft 82 moves is the X direction indicated by the arrow in the drawing. And Further, in the present embodiment, the X axis and the Y axis are horizontal axes, and the Z axis is a vertical axis. Further, in the present embodiment, the direction following gravity is downward and the direction against gravity is upward. The axis of the pressing portion 230 is a straight line that passes through the center of the pressing surface 31 that comes in contact with and separates from the pressure-sensitive adhesive sheet 2, which will be described later, and is orthogonal to the radial cross section. The “radial cross section” of the pressing portion 230 is a cross section in the direction along the plane figure formed by the outer shape line of the pressing surface 31 when the pressing portion 230 is directly faced to the pressing surface 31. The “center of the pressing surface” is the center or the center of gravity of the plane figure formed by the outline of the pressing surface 31 when the pressing portion 230 is directly faced to the pressing surface 31.

（電子部品）
電子部品３は、例えば、半導体素子、及び半導体素子以外の抵抗やコンデンサ等を挙げることができる。半導体素子としては、例えば、トランジスタ、ダイオード、ＬＥＤ、コンデンサ、及びサイリスタ等のディスクリート半導体、ＩＣやＬＳＩ等の集積回路等を挙げることができる。本実施形態は、図１に示すように、電子部品３として、直方体形状の半導体チップを用いる。各半導体チップは、半導体ウエーハをさいの目状に切断するダイシングにより個片化したものである。 (Electronic parts)
The electronic component 3 may be, for example, a semiconductor element, or a resistor or capacitor other than the semiconductor element. Examples of the semiconductor element include transistors, diodes, LEDs, capacitors, discrete semiconductors such as thyristors, and integrated circuits such as ICs and LSIs. In this embodiment, as shown in FIG. 1, a rectangular parallelepiped semiconductor chip is used as the electronic component 3. Each semiconductor chip is obtained by dicing a semiconductor wafer into diced pieces.

（粘着シート）
電子部品３は、ダイシングテープと呼ばれる粘着シート２に貼着されている。粘着シート２は、図示しないウエーハリングに保持されている。粘着シート２の粘着面に貼着された半導体ウエーハを、さいの目状に切断して個片化することにより、粘着シート２に複数の電子部品３が貼着された状態となっている。 (Adhesive sheet)
The electronic component 3 is attached to an adhesive sheet 2 called a dicing tape. The adhesive sheet 2 is held by a wafer ring (not shown). The semiconductor wafer attached to the adhesive surface of the adhesive sheet 2 is cut into diced pieces to be separated into individual pieces, so that a plurality of electronic components 3 are attached to the adhesive sheet 2.

複数の電子部品３が貼着された粘着シート２は、図示しない駆動機構によって、ウエーハリングをＸ軸、Ｙ軸及びＺ軸に沿う方向に移動可能に設けられている。これにより、後述するバックアップ部２００に対して、粘着シート２をＸ軸及びＹ軸に沿う方向に位置決め可能に設けられるとともに、バックアップ部２００の吸着面２２０に対して接離可能に設けられている。なお、ウエーハリングと、バックアップ部２００とは、相対的にＸ軸、Ｙ軸及びＺ軸に沿って駆動されるように構成されていればよい。即ち、バックアップ部２００がＺ軸方向に移動して、Ｚ軸方向に固定の粘着シート２に対して接離するようにしても良い。   The adhesive sheet 2 to which the plurality of electronic components 3 are adhered is provided so that a wafer ring can be moved in a direction along the X axis, the Y axis, and the Z axis by a driving mechanism (not shown). As a result, the adhesive sheet 2 is provided so that it can be positioned in the direction along the X-axis and the Y-axis with respect to the backup unit 200, which will be described later, and can be brought into contact with and separated from the suction surface 220 of the backup unit 200. .. It should be noted that the wafer ring and the backup unit 200 may be configured to be relatively driven along the X axis, the Y axis, and the Z axis. That is, the backup unit 200 may be moved in the Z-axis direction to come into contact with and separate from the adhesive sheet 2 that is fixed in the Z-axis direction.

（ピックアップ装置）
本実施形態のピックアップ装置１は、粘着シート２に貼着された複数の電子部品３を粘着シート２から個別に剥離して取り出す装置である。ピックアップ装置１は、ピックアップ機構１００、バックアップ部２００、制御装置３００を有する。 (Pickup device)
The pickup device 1 of the present embodiment is a device that individually removes a plurality of electronic components 3 attached to an adhesive sheet 2 from the adhesive sheet 2 and takes them out. The pickup device 1 includes a pickup mechanism 100, a backup unit 200, and a control device 300.

ピックアップ機構１００は、粘着シート２に貼着された電子部品３をピックアップする。ピックアップ機構１００は、電子部品３を個別に吸着保持するピックアップ部４を有する。ピックアップ部４は、主胴部５、吸着ノズル８を有する。主胴部５は、円柱形状の部材であり、図示しないＸ、Ｙ及びＺ駆動源によって、Ｘ軸、Ｙ軸及びＺ軸に沿う方向に駆動される。主胴部５の一端面には、粘着シート２に向かって突出した凸部６が設けられている。主胴部５には、先端を凸部６の端面に開口させた吸引孔７が、Ｚ軸に沿う方向に形成されている。この吸引孔７は、図示しない吸引ポンプを含む空気圧回路に接続されている。   The pickup mechanism 100 picks up the electronic component 3 attached to the adhesive sheet 2. The pick-up mechanism 100 has a pick-up unit 4 for individually sucking and holding the electronic components 3. The pickup section 4 has a main body section 5 and a suction nozzle 8. The main body portion 5 is a columnar member, and is driven in the direction along the X axis, the Y axis, and the Z axis by an X, Y, and Z driving source (not shown). A convex portion 6 protruding toward the adhesive sheet 2 is provided on one end surface of the main body portion 5. In the main body portion 5, a suction hole 7 having a tip open to the end surface of the convex portion 6 is formed in the direction along the Z axis. The suction hole 7 is connected to a pneumatic circuit including a suction pump (not shown).

吸着ノズル８は、凸部６に着脱可能に接続され、先端に向かって径が小さくなる円錐台形状の部材である。吸着ノズル８は、ゴムや軟質の合成樹脂などの弾性材料によって形成されている。吸着ノズル８には、一端が吸引孔７に連通し、他端が先端の平坦面８ａに開口したノズル孔９が形成されている。なお、主胴部５をＺ軸に沿う方向に駆動するＺ駆動源としてはボイスコイルモータなどを用い、ピックアップ部４による押圧荷重が一定となるよう制御することが好ましい。   The suction nozzle 8 is a member having a truncated cone shape that is detachably connected to the convex portion 6 and has a diameter that decreases toward the tip. The suction nozzle 8 is made of an elastic material such as rubber or soft synthetic resin. The suction nozzle 8 has a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opening to the flat surface 8a at the tip. A voice coil motor or the like is preferably used as a Z drive source that drives the main body portion 5 in the direction along the Z axis, and control is performed so that the pressing load by the pickup portion 4 becomes constant.

バックアップ部２００は、粘着シート２の粘着面と反対側の面に対向して設けられている。バックアップ部２００は、収容体２１０、吸着面２２０、押圧部２３０、駆動機構２４０、変換機構２５０を有する。   The backup unit 200 is provided so as to face the surface of the adhesive sheet 2 opposite to the adhesive surface. The backup unit 200 has a container 210, a suction surface 220, a pressing unit 230, a drive mechanism 240, and a conversion mechanism 250.

収容体２１０は、Ｚ軸に平行な直線を軸とする円筒形状の容器である。収容体２１０には、配管等を介して内部を吸引する吸引ポンプ２１１が接続されている。吸着面２２０は、粘着シート２のピックアップされる電子部品３に対応する領域を吸着保持する面である。電子部品３に対応する領域とは、粘着シート２におけるピックアップされる電子部品３が貼り付けられた領域を囲み、この領域よりも大きな領域である。   The container 210 is a cylindrical container whose axis is a straight line parallel to the Z axis. A suction pump 211 for sucking the inside is connected to the container 210 via a pipe or the like. The suction surface 220 is a surface for sucking and holding a region of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up. The region corresponding to the electronic component 3 is a region that surrounds the region of the adhesive sheet 2 to which the electronic component 3 to be picked up is attached, and is a region larger than this region.

吸着面２２０は、図２に示すように、収容体２１０の粘着シート２に対向する開口に取り付けられたキャップに形成されている。吸着面２２０には、複数の吸引孔２２１が設けられている。吸引孔２２１は、バックアップ部２００の内部や図示しない配管を介して吸引ポンプ２１１に接続されている。吸引ポンプ２１１を作動させることによって、吸着面２２０には、複数の吸引孔２２１を介して吸引力が発生する。従って、吸引ポンプ２１１を作動させて、吸着面２２０を粘着シート２の粘着面と反対側の面に接触させれば、粘着シート２が吸着保持される。つまり、本実施形態では、吸着面２２０において、吸引孔２２１が設けられている領域内の全体が、電子部品３に対応する領域となる。なお、吸引孔２２１は、吸着面２２０の略全域に設けるようにしているので、押圧部２３０上を含む吸着面２２０内の全域を、電子部品３に対応する領域としても良い。   As shown in FIG. 2, the suction surface 220 is formed on a cap attached to the opening of the container 210 facing the adhesive sheet 2. The suction surface 220 is provided with a plurality of suction holes 221. The suction hole 221 is connected to the suction pump 211 through the inside of the backup unit 200 and a pipe (not shown). By operating the suction pump 211, a suction force is generated on the suction surface 220 via the plurality of suction holes 221. Therefore, when the suction pump 211 is operated to bring the suction surface 220 into contact with the surface of the pressure-sensitive adhesive sheet 2 opposite to the pressure-sensitive adhesive surface, the pressure-sensitive adhesive sheet 2 is suction-held. That is, in the present embodiment, the entire area of the suction surface 220 where the suction holes 221 are provided corresponds to the electronic component 3. Since the suction holes 221 are provided almost in the entire area of the suction surface 220, the entire area of the suction surface 220 including the pressing portion 230 may be the area corresponding to the electronic component 3.

押圧部２３０は、吸着面２２０内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体３０が共通の軸に同軸の入れ子状に配設された部材である。ここで、共通の軸は、Ｚ軸に平行であり、上述した押圧部２３０の軸でもある。押圧部２３０は、吸着面２２０に設けられた矩形状の開口部２２２内に進退可能に設けられている。   The pressing portion 230 is a member that is movably provided along the common axis in the suction surface 220 and has a plurality of pressing bodies 30 having different outer sizes arranged coaxially with each other in a nested manner. .. Here, the common axis is parallel to the Z axis and is also the axis of the pressing portion 230 described above. The pressing portion 230 is provided so as to be able to move forward and backward within a rectangular opening 222 provided on the suction surface 220.

押圧体３０は、図２及び図３に示すように、共通の軸に直交する断面が、電子部品３と相似形状の矩形の筒状体又は柱状体である。最内周の押圧体３０Ａは、粘着シート２に対向する端面が、矩形の押圧面３１となった柱状体である。最内周よりも外周の押圧体３０Ｂ〜３０Ｈは、粘着シート２に対向する端面が、矩形の枠状の押圧面３２となった筒状体である。本実施形態では、押圧体３０内に、これよりも小さな外形の押圧体３０が順次挿入されることにより、８つの押圧体３０Ａ〜３０Ｈが同軸の入れ子状に且つ摺動可能に配設されている。最外周の押圧体３０Ｈの外形の大きさは、ピックアップの対象となる電子部品３の粘着シート２に貼り付けられる面の外形の大きさと同じ或いは若干小さい。若干小さいとは、例えば、電子部品３の粘着シート２に貼り付けられる面の外形よりも、押圧体３０Ｈの側壁の厚さによって決まる押圧面３２の幅程度まで小さくても許容される。これにより、電子部品３への負荷を抑えつつ、最外周から粘着シート２を剥離させることができる。以下の説明では、押圧体３０Ａ〜３０Ｈを区別しない場合には、押圧体３０とする場合がある。   As shown in FIGS. 2 and 3, the pressing body 30 is a rectangular tubular body or a columnar body whose cross section orthogonal to the common axis has a similar shape to the electronic component 3. The innermost peripheral pressing body 30A is a columnar body in which the end surface facing the adhesive sheet 2 is a rectangular pressing surface 31. The pressing bodies 30B to 30H on the outer periphery of the innermost periphery are tubular bodies in which the end surface facing the adhesive sheet 2 is a rectangular frame-shaped pressing surface 32. In the present embodiment, the pressing bodies 30 having an outer shape smaller than the pressing body 30 are sequentially inserted into the pressing body 30, so that the eight pressing bodies 30A to 30H are coaxially nested and slidably arranged. There is. The outer size of the outermost pressing body 30H is equal to or slightly smaller than the outer size of the surface of the electronic component 3 to be picked up that is attached to the adhesive sheet 2. To be slightly smaller is, for example, allowed to be smaller than the outer shape of the surface of the electronic component 3 attached to the adhesive sheet 2 to the width of the pressing surface 32 determined by the thickness of the side wall of the pressing body 30H. Thereby, the pressure-sensitive adhesive sheet 2 can be peeled from the outermost periphery while suppressing the load on the electronic component 3. In the following description, when the pressing bodies 30A to 30H are not distinguished, they may be referred to as the pressing body 30.

なお、電子部品３の破損を防止する観点からは、電子部品３の粘着シート２に貼り付けられる面の面積に対して、最内周の押圧体３０Ａの押圧面３１によって剥がされずに残る粘着シート２の面積が、３０％以下であることが好ましいが、本実施形態はこれに限定されない。また、各押圧体３０Ｂ〜３０Ｈの側壁の厚さによって決まる押圧面３２の幅は、０．６ｍｍ程度、或いはこれ以下とすることが好ましいが、本実施形態はこれには限定されない。また、本実施形態の電子部品３は正方形であるが、これには限定されず、長方形状であってもよい。電子部品３が長方形状の場合には、押圧面３１、３２は、電子部品３と相似の長方形とすれば良い。   From the viewpoint of preventing damage to the electronic component 3, the adhesive sheet that remains without being peeled off by the pressing surface 31 of the innermost pressing member 30A with respect to the area of the surface of the electronic component 3 that is attached to the adhesive sheet 2. The area of 2 is preferably 30% or less, but the present embodiment is not limited to this. Further, the width of the pressing surface 32 determined by the thickness of the side wall of each pressing body 30B to 30H is preferably about 0.6 mm or less, but the present embodiment is not limited to this. Further, although the electronic component 3 of the present embodiment has a square shape, it is not limited to this and may have a rectangular shape. When the electronic component 3 has a rectangular shape, the pressing surfaces 31 and 32 may have a rectangular shape similar to that of the electronic component 3.

押圧体３０Ｂ〜３０Ｈの押圧面３２には、図３及び図４に示すように、凹凸が形成されている。つまり、押圧面３２の矩形の４つの側辺部に沿って複数の第１の凸部３３が設けられ、矩形の４つの角部に第２の凸部３４が設けられている。第１の凸部３３と第２の凸部３４との間及び第１の凸部３３間には、凹部３５が設けられている。第１の凸部３３、第２の凸部３４の頭頂面は、粘着シート２を押圧する。このように粘着シート２を押し上げた時、第１の凸部３３は、電子部品３の４つの側辺部に平行な方向を部分的に支持し、第２の凸部３４は、電子部品３の中心から４つの角部に向かう方向を部分的に支持する。   As shown in FIGS. 3 and 4, the pressing surface 32 of each of the pressing bodies 30B to 30H has unevenness. That is, the plurality of first protrusions 33 are provided along the four sides of the rectangle of the pressing surface 32, and the second protrusions 34 are provided at the four corners of the rectangle. A recess 35 is provided between the first protrusion 33 and the second protrusion 34 and between the first protrusions 33. The top surfaces of the first protrusions 33 and the second protrusions 34 press the adhesive sheet 2. When the adhesive sheet 2 is pushed up in this way, the first convex portion 33 partially supports the direction parallel to the four side portions of the electronic component 3, and the second convex portion 34 forms the electronic component 3 Partially supports the direction from the center of the four corners.

凹部３５には、収容体２１０内に設けられた図示しない配管や押圧体３０Ａ〜３０Ｈ間の隙間及び切欠３６を通じて、吸引ポンプ２１１の吸引力が伝わる。切欠３６は、押圧体３０Ｂ〜３０Ｈの押圧面３２の一部に、部分円形状で切り欠くように形成された吸引経路である。また、隣接する押圧体３０においては、凹部３５は互い違いに設けられている。このような互い違いの構成により、外周及び角から中央に向かう吸引のラインが形成されるので、中央部分への吸引が最後まで確保され、粘着シート２の吸着性能が向上する。   The suction force of the suction pump 211 is transmitted to the concave portion 35 through a pipe (not shown) provided in the housing 210, a gap between the pressing bodies 30A to 30H, and the notch 36. The notch 36 is a suction path formed in a part of the pressing surface 32 of the pressing bodies 30B to 30H so as to have a partial circular shape. Further, in the pressing bodies 30 adjacent to each other, the concave portions 35 are provided alternately. With such a staggered structure, a suction line extending from the outer periphery and the corner toward the center is formed, so that suction to the central portion is ensured to the end, and the suction performance of the adhesive sheet 2 is improved.

駆動機構２４０は、押圧部２３０を移動させて、全ての押圧体３０により粘着シート２を押圧する押圧動作と、外側の押圧体３０から隣接する内側の押圧体３０を順次、電子部品を粘着シート２から剥離させる離隔方向へ移動させる離隔動作を行わせる機構である。ここで、本実施形態においては、離隔方向は、押圧の方向とは逆の方向である。変換機構２５０は、駆動機構２４０に設けられ、共通の軸に沿って移動する単一の第１の駆動部材２４１の動作を、複数の押圧体３０Ａ〜３０Ｈの離隔動作に変換する。   The drive mechanism 240 moves the pressing portion 230 and presses the pressure-sensitive adhesive sheet 2 by all the pressure members 30, and the pressure member 30 on the outer side to the pressure member 30 on the inner side in order, and the electronic components are pressed on the pressure sensitive adhesive sheet. It is a mechanism for performing a separating operation of moving in a separating direction of separating from 2. Here, in the present embodiment, the separating direction is the direction opposite to the pressing direction. The conversion mechanism 250 is provided in the drive mechanism 240, and converts the operation of the single first drive member 241 that moves along the common axis into the separating operation of the plurality of pressing bodies 30A to 30H.

駆動機構２４０は、同軸の円筒形状の第１の駆動部材２４１、第２の駆動部材２４２を有する。第１の駆動部材２４１、第２の駆動部材２４２は、例えば、サーボモータにより駆動されるボールネジ機構やカムローラ機構等により、共通の軸に沿う方向に個別に駆動される。第１の駆動部材２４１は、後述する変換機構２５０を駆動する。第２の駆動部材２４２は、後述するフレーム５０を駆動する。   The drive mechanism 240 has a coaxial cylindrical first drive member 241 and a second drive member 242. The first drive member 241 and the second drive member 242 are individually driven in a direction along a common axis by, for example, a ball screw mechanism or a cam roller mechanism driven by a servo motor. The first drive member 241 drives the conversion mechanism 250 described later. The second drive member 242 drives the frame 50 described later.

変換機構２５０は、フレーム５０、延出部６０、付勢部材７０、第１のカム機構８０、第２のカム機構９０を有する。フレーム５０は、収容体２１０内に収容され、押圧部２３０、第１のカム機構８０、第２のカム機構９０を支持する部材である。   The conversion mechanism 250 includes a frame 50, an extension portion 60, a biasing member 70, a first cam mechanism 80, and a second cam mechanism 90. The frame 50 is a member that is housed in the housing 210 and supports the pressing portion 230, the first cam mechanism 80, and the second cam mechanism 90.

フレーム５０は、支持ブロック５１、第１の支持板５２、リニアガイド５３、第２の支持板５４を有する。支持ブロック５１は、収容体２１０内の粘着シート２側に設けられた直方体形状であり、その内部に押圧部２３０がＺ軸方向に沿って摺動可能に挿通された直方体形状のガイド孔５１ａが形成されている。さらに、支持ブロック５１の粘着シート２側には、相反する側面の外側に突出した突出部５１ｂが設けられている。ここで、相反する側面とは、共通の軸に関して対向する位置関係にあることである。例えば、本実施形態のように、支持ブロック５１が直方体形状である場合、４つある側面のうち共通の軸を挟んで位置する（対向する）２つの側面が、相反する側面である。   The frame 50 has a support block 51, a first support plate 52, a linear guide 53, and a second support plate 54. The support block 51 has a rectangular parallelepiped shape provided on the side of the adhesive sheet 2 in the container 210, and has a rectangular parallelepiped guide hole 51 a in which the pressing portion 230 is slidably inserted along the Z-axis direction. Has been formed. Further, on the pressure-sensitive adhesive sheet 2 side of the support block 51, a protruding portion 51b protruding outside the opposite side surfaces is provided. Here, the opposite side surfaces mean that the side surfaces are opposed to each other with respect to a common axis. For example, when the support block 51 has a rectangular parallelepiped shape as in the present embodiment, two side surfaces that are located (opposite each other) across a common axis among the four side surfaces are opposite side surfaces.

第１の支持板５２は、支持ブロック５１が取り付けられた円板状の部材である。リニアガイド５３は、ガイドレールにより、後述する移動体８３をＸ方向にスライド移動可能に支持する部材である。第２の支持板５４は、フレーム５０の駆動機構２４０側に設けられた円板状の部材である。第２の支持板５４には、第１の駆動部材２４１が挿通する孔が形成されている。また、第２の支持板５４には第２の駆動部材２４２の先端が固定されている。なお、第１の支持板５２、リニアガイド５３、第２の支持板５４は、図示しないＺ軸方向の支柱により互いに接続固定されている。   The first support plate 52 is a disc-shaped member to which the support block 51 is attached. The linear guide 53 is a member that supports a moving body 83 described later so as to be slidable in the X direction by a guide rail. The second support plate 54 is a disk-shaped member provided on the drive mechanism 240 side of the frame 50. The second support plate 54 has a hole through which the first drive member 241 is inserted. Further, the tip of the second drive member 242 is fixed to the second support plate 54. The first support plate 52, the linear guide 53, and the second support plate 54 are connected and fixed to each other by a column (not shown) in the Z-axis direction.

延出部６０は、図３及び図４に示すように、押圧体３０の相反する側面の外側に、それぞれ一対ずつ設けられている。ここで、押圧体３０の相反する側面とは、本実施形態のように押圧体３０が矩形の筒状である場合、共通の軸を挟んで位置する（対向する）２つの側面のことである。なお、相反する側面は、一つの押圧体３０に２組存在するが、本実施形態では、Ｘ軸方向で対向する組を相反する側面としている。また、側面の外側とは、側面を正面から見た場合に両端部となる部分である。つまり、各押圧体３０の相反する２側面から、合計４つの延出部６０が設けられている。なお、延出部６０は、側面の下端に設けられる。最も外側の押圧体３０Ｈの一対の延出部６０は、最も外側に設けられ、内側の押圧体３０Ｇ〜３０Ａになるに従って、延出部６０が順次内側に設けられている。なお、最内周の押圧体３０Ａの延出部６０は、相反する側面に一つずつ設けられている。つまり、全ての押圧体３０Ａ〜３０Ｈが、相反する側面に一対ずつ延出部６０が設けられていなくてはならないものではない。なお、延出部６０は、Ｙ軸方向で対向する２つの側壁の下端を、Ｘ軸方向で対向する２つの側壁の下端よりも下側に所定量延長させ、この延長部分の両端をＸ軸方向に延出させた部分と捉えることもできる。   As shown in FIGS. 3 and 4, the extending portions 60 are provided in pairs on the outer sides of the opposite side surfaces of the pressing body 30. Here, the opposite side surfaces of the pressing body 30 are two side surfaces located (opposing) with a common axis sandwiched therebetween when the pressing body 30 has a rectangular tubular shape as in the present embodiment. .. In addition, although two sets of opposite side surfaces are present in one pressing body 30, in the present embodiment, a pair of sets facing each other in the X-axis direction are set as opposite side surfaces. Further, the outside of the side surface is a portion that becomes both end portions when the side surface is viewed from the front. That is, a total of four extending portions 60 are provided from the two opposite side surfaces of each pressing body 30. The extension 60 is provided at the lower end of the side surface. The pair of extending portions 60 of the outermost pressing body 30H are provided on the outermost side, and the extending portions 60 are sequentially provided on the inner side in the order of the inner pressing bodies 30G to 30A. In addition, the extending portions 60 of the innermost pressing member 30A are provided one by one on opposite side surfaces. That is, all of the pressing bodies 30A to 30H do not have to be provided with the extending portions 60 one by one on opposite side surfaces. The extending portion 60 extends the lower ends of the two side walls facing each other in the Y-axis direction by a predetermined amount below the lower ends of the two side walls facing each other in the X-axis direction, and extends both ends of the extended portion along the X-axis. It can also be regarded as a part extended in the direction.

付勢部材７０は、図１及び図３に示すように、各押圧体３０の延出部６０を離隔方向に個別に付勢する部材である。付勢部材７０としては、板ばね、コイルスプリング等の弾性部材を用いて構成することができる。本実施形態では、付勢部材７０として、圧縮コイルばねを内蔵した筒の先端に、圧縮コイルばねの伸縮に応じて進退するピンが設けられた部材を用いる。付勢部材７０は、Ｚ軸に平行な方向に設けられ、一方の端部が支持ブロック５１に取り付けられ、他方の端部であるピンの先端が、延出部６０に接しているので、各押圧体３０を付勢している。   As shown in FIGS. 1 and 3, the biasing member 70 is a member that individually biases the extending portions 60 of the pressing bodies 30 in the separating direction. The biasing member 70 can be configured using an elastic member such as a leaf spring or a coil spring. In the present embodiment, as the biasing member 70, a member in which a pin that moves forward and backward according to the expansion and contraction of the compression coil spring is provided at the tip of a cylinder containing the compression coil spring is used. The biasing member 70 is provided in a direction parallel to the Z axis, one end of which is attached to the support block 51, and the tip of the pin, which is the other end, is in contact with the extending portion 60. The pressing body 30 is biased.

第１のカム機構８０は、第１の駆動部材２４１により駆動され、各押圧体３０の離隔方向への移動を、外側から内側に順次許容する機構である。第１のカム機構８０は、カム面８１、ローラシャフト８２、移動体８３を有する。   The first cam mechanism 80 is a mechanism that is driven by the first drive member 241 and sequentially allows the pressing bodies 30 to move in the separating direction from the outside to the inside. The first cam mechanism 80 has a cam surface 81, a roller shaft 82, and a moving body 83.

カム面８１は、各押圧体３０の粘着シート２とは反対側の面に設けられ、共通の軸に交差する方向、具体的には、Ｘ軸方向に沿って、各押圧体３０毎に形状が異なる面である。本実施形態では、カム面８１は、押圧面３１又は３２からの距離が押圧体３０毎に順次異なる部分を有する面である。カム面８１は、押圧体３０のＹ軸に沿う方向に対向する２つの側面の端面、具体的には、押圧面３１又は３２とは反対側である下端面に形成されている。カム面８１は、図４に示すように、第１の一致面８４と、傾斜面８５と、第２の一致面８６とを備える。第１の一致面８４は、押圧面３１又は３２からの距離がｄ１で一定の、他の押圧体３０との間で一致している面である。傾斜面８５は、第１の一致面８４に緩やかに連続して、押圧面３１又は３２からの距離がｄ２へと徐々に減少していく面である。第２の一致面８６は、押圧面３１又は３２からの距離がｄ２で一定の、他の押圧体３０との間で一致している面である。第１の一致面８４の長さｗは、内側の押圧体３０になるに従って長くなり、これに従って傾斜面８５の始端の位置ｐ及び第２の一致面８６の始端の位置ｑが、Ｘ軸に沿ってずれている。このことは、後述するローラシャフト８２が傾斜面８５に達するタイミングが、内側の押圧体３０になるほど遅くなることを意味する。   The cam surface 81 is provided on the surface of each pressing body 30 on the side opposite to the adhesive sheet 2, and has a shape for each pressing body 30 along a direction intersecting a common axis, specifically, the X-axis direction. Is a different aspect. In the present embodiment, the cam surface 81 is a surface having a portion in which the distance from the pressing surface 31 or 32 sequentially differs for each pressing body 30. The cam surface 81 is formed on the end surfaces of the two side surfaces facing each other in the direction along the Y axis of the pressing body 30, specifically, on the lower end surface opposite to the pressing surface 31 or 32. As shown in FIG. 4, the cam surface 81 includes a first matching surface 84, an inclined surface 85, and a second matching surface 86. The first matching surface 84 is a surface that matches the other pressing body 30 and has a constant distance d1 from the pressing surface 31 or 32. The inclined surface 85 is a surface that is gently continuous with the first matching surface 84 and that the distance from the pressing surface 31 or 32 gradually decreases to d2. The second matching surface 86 is a surface that matches the other pressing body 30 and has a constant distance d2 from the pressing surface 31 or 32. The length w of the first matching surface 84 becomes longer as the pressure member 30 on the inside is increased, and accordingly, the position p of the starting end of the inclined surface 85 and the position q of the starting end of the second matching surface 86 are aligned with the X axis. It is offset along. This means that the timing at which the roller shaft 82, which will be described later, reaches the inclined surface 85 is delayed toward the inner pressing body 30.

ローラシャフト８２は、各押圧体３０のカム面８１に接して、各押圧体３０を付勢部材７０に抗する方向に付勢するとともに、離隔方向に交差する方向、具体的には、Ｘ軸方向に移動する。ローラシャフト８２は、カム面８１が形成された２側面に亘る長さを有している。このローラシャフト８２が傾斜面８５に達していない場合、つまり第１の一致面８４に接している場合には、全ての押圧体３０を付勢部材７０に抗する方向に押し上げている。ローラシャフト８２が各押圧体３０の傾斜面８５に達すると、付勢部材７０の付勢力によって、各押圧体３０が順次、離隔方向に移動する。本実施形態では、内側の押圧体３０になるほどローラシャフト８２が傾斜面８５に達するタイミングが遅いので、外側の押圧体３０から順に離隔方向に移動することになる。   The roller shaft 82 contacts the cam surface 81 of each pressing body 30 to urge each pressing body 30 in a direction against the urging member 70, and at the same time, in a direction intersecting the separating direction, specifically, the X axis. Move in the direction. The roller shaft 82 has a length extending over two side surfaces on which the cam surface 81 is formed. When the roller shaft 82 does not reach the inclined surface 85, that is, when the roller shaft 82 is in contact with the first matching surface 84, all the pressing bodies 30 are pushed up in the direction against the biasing member 70. When the roller shaft 82 reaches the inclined surface 85 of each pressing body 30, each pressing body 30 is sequentially moved in the separating direction by the urging force of the urging member 70. In the present embodiment, the timing of the roller shaft 82 reaching the inclined surface 85 is delayed as the inner pressing body 30 is moved, so that the roller shaft 82 is sequentially moved in the separating direction from the outer pressing body 30.

なお、ローラシャフト８２の移動範囲は、吸着面２２０の外縁の範囲内である。本実施形態では、ローラシャフト８２は、収容体２１０の内径の範囲内で移動する。よって、カム面８１もこの範囲内で形成されている。また、付勢部材７０は、カム面８１の形状に応じて、一対の延出部６０の一方と他方に対する付勢力が相違している。つまり、理論的には、傾斜面８５の位置が各押圧体３０の中央に位置している場合、各押圧体３０を挟む位置に配置された一対の付勢部材７０の付勢力を同等とすれば、各押圧体３０の傾きが防止される。しかし、カム面８１の位置が、中央からずれている場合には、そのずれ量に応じて、付勢部材７０の付勢力を変える必要がある。   The moving range of the roller shaft 82 is within the outer edge of the suction surface 220. In the present embodiment, the roller shaft 82 moves within the range of the inner diameter of the container 210. Therefore, the cam surface 81 is also formed within this range. Further, the biasing member 70 has different biasing forces for one and the other of the pair of extending portions 60 depending on the shape of the cam surface 81. That is, theoretically, when the position of the inclined surface 85 is located at the center of each pressing body 30, the urging forces of the pair of urging members 70 arranged at positions sandwiching each pressing body 30 should be equal. For example, the inclination of each pressing body 30 is prevented. However, when the position of the cam surface 81 deviates from the center, it is necessary to change the urging force of the urging member 70 according to the amount of deviation.

例えば、一方の延出部６０とローラシャフト８２と他方の延出部６０との間には、力点と支点と作用点と同様の関係が成り立つ。すなわち、両側の延出部６０に一対の付勢部材７０で同等の付勢力が付与されていて、ローラシャフト８２が中央に位置しているときは、ローラシャフト８２に両側に均等に付勢力が作用し、傾きは防止される。これに対して、ローラシャフト８２の位置がどちらか一方の延出部６０の位置に寄った場合、一方の延出部６０よりも他方の延出部６０の方がローラシャフト８２からの距離が遠くなる。両方の延出部６０に付与される付勢力は同じであるから、ローラシャフト８２からの距離が遠い方である他方の延出部６０側の付勢力が強く作用することになる。このため、押圧体３０には、傾きを生じさせる力が作用することになる。この力の発生は、押圧体３０が停止状態のときには問題ないが、押圧体３０が離隔方向に移動するときに生じていると、円滑な移動を妨げる原因となり好ましくない。そこで、傾斜面８５から遠い方の付勢部材７０の付勢力を、傾斜面８５に近い方の付勢部材７０の付勢力よりも弱くする。つまり、圧縮コイルばねの押付力が弱いものを使用する。   For example, the same relationship as the force point, the fulcrum, and the action point is established between the one extending portion 60, the roller shaft 82, and the other extending portion 60. That is, when the pair of biasing members 70 apply the same biasing force to the extending portions 60 on both sides and the roller shaft 82 is located at the center, the roller shaft 82 is uniformly biased to both sides. It works and tilt is prevented. On the other hand, when the position of the roller shaft 82 approaches the position of one of the extending portions 60, the distance between the extending portion 60 of the other extending portion 60 and the extending portion 60 is smaller than that of the extending portion 60. Get distant. Since the urging force applied to both of the extending portions 60 is the same, the urging force on the other extending portion 60 side, which is the side farther from the roller shaft 82, acts strongly. Therefore, a force that causes an inclination acts on the pressing body 30. This force is not a problem when the pressing body 30 is in a stopped state, but it is not preferable if it occurs when the pressing body 30 moves in the separating direction, because it causes smooth movement. Therefore, the biasing force of the biasing member 70 farther from the inclined surface 85 is made weaker than the biasing force of the biasing member 70 near the inclined surface 85. That is, a compression coil spring having a weak pressing force is used.

付勢力の強弱は、傾斜面８５からの距離に応じて決定すれば良い。例えば、一対の付勢部材７０同士の間の距離と傾斜面８５までの距離の比率で付勢力を決定することができる。即ち、一対の付勢部材７０同士の間の距離を１０とした場合、一方の付勢部材７０から傾斜面８５までの距離が４、他方の付勢部材７０から傾斜面８５までの距離が６であるならば、一方の付勢部材７０の付勢力に対して他方の付勢部材７０の付勢力が４／６倍の関係になるように設定すれば良い。   The strength of the biasing force may be determined according to the distance from the inclined surface 85. For example, the biasing force can be determined by the ratio of the distance between the pair of biasing members 70 and the distance to the inclined surface 85. That is, when the distance between the pair of biasing members 70 is 10, the distance from one biasing member 70 to the inclined surface 85 is 4, and the distance from the other biasing member 70 to the inclined surface 85 is 6. If so, the biasing force of the other biasing member 70 may be set to 4/6 times the biasing force of the other biasing member 70.

移動体８３は、移動ブロック８３ａ、軸受け８３ｂを有する。移動ブロック８３ａは、略直方体形状の部材であり、リニアガイド５３によってＸ方向にスライド移動可能に設けられている。軸受け８３ｂは、移動体８３の押圧体３０側に設けられ、ローラシャフト８２のＹ軸に沿う方向の軸を回動可能に支持する部材である。   The moving body 83 has a moving block 83a and a bearing 83b. The moving block 83a is a member having a substantially rectangular parallelepiped shape, and is provided so as to be slidable in the X direction by the linear guide 53. The bearing 83b is a member that is provided on the pressing body 30 side of the moving body 83 and rotatably supports the axis of the roller shaft 82 in the direction along the Y axis.

第２のカム機構９０は、第１の駆動部材２４１の離隔方向に沿う移動（Ｚ軸方向への移動）を、ローラシャフト８２の離隔方向に交差する方向（Ｘ軸方向）への移動に変換する機構である。第２のカム機構９０はローラ９２及びこれに接する傾斜面９１を有し、ローラ９２及び傾斜面９１のいずれか一方を、共通の軸、つまりＺ軸に沿って移動させる主動カム、他方をＺ軸に交差する方向（Ｘ軸方向）に移動させる従動カムとする直動カムである。   The second cam mechanism 90 converts movement of the first drive member 241 along the separating direction (movement in the Z-axis direction) into movement in a direction intersecting the separating direction of the roller shaft 82 (X-axis direction). It is a mechanism to do. The second cam mechanism 90 includes a roller 92 and an inclined surface 91 that is in contact with the roller 92. One of the roller 92 and the inclined surface 91 is a main cam that moves along a common axis, that is, the Z axis, and the other is Z. The linear cam is a driven cam that moves in a direction intersecting the axis (X-axis direction).

本実施形態の第２のカム機構９０は、傾斜面９１、ローラ９２、軸受け９３を有する。傾斜面９１は、移動ブロック８３ａの押圧体３０と反対側の面に設けられ、Ｚ方向に対して傾斜した面である。ローラ９２は、傾斜面９１に接して粘着シート２に近づく方向に移動することにより、移動ブロック８３ａをＸ方向に沿う図示左方向に移動させる（図１参照）。   The second cam mechanism 90 of this embodiment has an inclined surface 91, a roller 92, and a bearing 93. The inclined surface 91 is provided on the surface of the moving block 83a opposite to the pressing body 30 and is a surface inclined with respect to the Z direction. The roller 92 contacts the inclined surface 91 and moves in a direction approaching the adhesive sheet 2, thereby moving the moving block 83a to the left in the drawing along the X direction (see FIG. 1).

軸受け９３は、ローラ９２のＹ軸に沿う方向の軸を回動可能に支持する。軸受け９３は、第１の駆動部材２４１の端部に固定されている。このため、第１の駆動部材２４１の移動に従って、軸受け９３がローラ９２とともに、粘着シート２側に移動する。   The bearing 93 rotatably supports the shaft of the roller 92 along the Y-axis. The bearing 93 is fixed to the end of the first drive member 241. Therefore, according to the movement of the first drive member 241, the bearing 93 moves to the adhesive sheet 2 side together with the roller 92.

制御装置３００は、ピックアップ装置１の各部を制御する装置である。この制御装置３００は、例えば、プロセッサ、メモリ等を含む専用の電子回路若しくは所定のプログラムで動作するコンピュータ等によって構成できる。吸引ポンプ２１１による排気に関する制御、駆動機構２４０による駆動の制御、ピックアップ機構１００によるピックアップの制御などに関しては、その制御内容がプログラムされ、各種の設定がメモリ等の記憶部に記憶されている。制御装置３００は、ＰＬＣやＣＰＵなどの処理装置により、このような設定に従ってプログラムを実行する。   The control device 300 is a device that controls each unit of the pickup device 1. The control device 300 can be configured by, for example, a dedicated electronic circuit including a processor, a memory, or the like, or a computer that operates by a predetermined program. Regarding the control relating to the exhaust by the suction pump 211, the control of the drive by the drive mechanism 240, the control of the pickup by the pickup mechanism 100, the control contents are programmed, and various settings are stored in a storage unit such as a memory. The control device 300 executes the program according to such settings by a processing device such as a PLC or a CPU.

［動作］
以上のような本実施形態のピックアップ装置１の動作を、上記の図面に加えて、図５〜８を参照して説明する。まず、ウエーハリングを駆動する駆動機構によって、ピックアップされる電子部品３が、押圧部２３０の押圧面３２に合い、粘着シート２が吸着面２２０に接するように、粘着シート２を移動させる。この移動は、あらかじめ電子部品３の位置座標を含むマップ情報に基づいて行われる。 [motion]
The operation of the pickup device 1 of the present embodiment as described above will be described with reference to FIGS. 5 to 8 in addition to the above drawings. First, the drive mechanism that drives the wafer ring moves the adhesive sheet 2 so that the electronic component 3 to be picked up fits the pressing surface 32 of the pressing portion 230 and the adhesive sheet 2 contacts the suction surface 220. This movement is performed based on the map information including the position coordinates of the electronic component 3 in advance.

そして、図５（Ａ）に示すように、吸引ポンプ２１１によって、吸引孔２２１に吸引力を働かせることによって、粘着シート２を吸着面２２０に吸着させる。これにより、粘着シート２は、ピックアップされる電子部品３に対応する部分が吸着面２２０に吸着保持され、電子部品３の領域が、押圧体３０の押圧面３１、３２によっても吸着保持される。   Then, as shown in FIG. 5A, a suction force is applied to the suction holes 221 by the suction pump 211, so that the pressure-sensitive adhesive sheet 2 is sucked onto the suction surface 220. As a result, in the pressure-sensitive adhesive sheet 2, a portion corresponding to the electronic component 3 to be picked up is suction-held by the suction surface 220, and the region of the electronic component 3 is also suction-held by the pressing surfaces 31, 32 of the pressing body 30.

このように、粘着シート２を吸着面２２０により吸着保持したら、ピックアップ部４を電子部品３に向けて移動させて、吸着ノズル８により、ピックアップされる電子部品３の上面を吸着する。   In this way, after the adhesive sheet 2 is suction-held by the suction surface 220, the pickup unit 4 is moved toward the electronic component 3, and the suction nozzle 8 sucks the upper surface of the electronic component 3 to be picked up.

次に、駆動機構２４０により第２の駆動部材２４２を、粘着シート２側に予め設定した移動量だけ駆動することにより、図５（Ｂ）に示すように、フレーム５０に支持された押圧部２３０、つまり、押圧体３０Ａ〜３０Ｈを一括して粘着シート２側に押し上げる。すると、押圧体３０の押圧面３１、３２が、電子部品３の全体を均等に押圧するので、粘着シート２の電子部品３が貼着された部分が、吸着面２２０を超えて押し出される。   Next, by driving the second drive member 242 by the drive mechanism 240 to the side of the adhesive sheet 2 by a preset movement amount, as shown in FIG. 5B, the pressing portion 230 supported by the frame 50. That is, the pressing bodies 30A to 30H are collectively pushed up to the adhesive sheet 2 side. Then, the pressing surfaces 31 and 32 of the pressing body 30 uniformly press the entire electronic component 3, so that the portion of the adhesive sheet 2 to which the electronic component 3 is attached is pushed beyond the suction surface 220.

そして、駆動機構２４０により第１の駆動部材２４１を、粘着シート２側に駆動することにより、図７（Ａ）〜（Ｃ）に示すように、粘着シート２側にローラ９２を移動させる。つまり、ローラ９２をＺ軸方向に沿って上昇させる。この移動方向を、図中、白塗りの矢印で示す。すると、傾斜面９１をローラ９２が付勢するので、移動体８３の移動ブロック８３ａ及び軸受け８３ｂがＸ方向に移動する。この移動方向を、図中、黒塗りの矢印で示す。これにより、ローラシャフト８２がＸ方向に沿う図示左側へ移動する。   Then, by driving the first drive member 241 to the adhesive sheet 2 side by the drive mechanism 240, the roller 92 is moved to the adhesive sheet 2 side as shown in FIGS. That is, the roller 92 is raised along the Z-axis direction. This moving direction is indicated by a white arrow in the figure. Then, the roller 92 biases the inclined surface 91, so that the moving block 83a and the bearing 83b of the moving body 83 move in the X direction. This moving direction is indicated by a black arrow in the figure. As a result, the roller shaft 82 moves to the left side in the drawing along the X direction.

このように、ローラシャフト８２が移動すると、図８に示すように、ローラシャフト８２が、押圧体３０の一致面８４からカム面８１に沿って移動する。すると、図５（Ｃ）、（Ｄ）、（Ｅ）、図６（Ａ）、（Ｂ）、（Ｃ）、（Ｄ）に示すように、付勢部材７０の付勢力により、外側の押圧体３０Ｈから、押圧体３０Ｇ、３０Ｆ、３０Ｅ、３０Ｄ、３０Ｃ、３０Ｂが順次、離隔方向に移動、つまり、下降して行く。   In this way, when the roller shaft 82 moves, the roller shaft 82 moves from the matching surface 84 of the pressing body 30 along the cam surface 81, as shown in FIG. Then, as shown in FIGS. 5C, 5D, 5E, 6A, 6B, 6C, and 6D, the urging force of the urging member 70 pushes the outer side. From the body 30H, the pressing bodies 30G, 30F, 30E, 30D, 30C, 30B sequentially move in the separating direction, that is, descend.

このように、押圧体３０が順次移動すると、吸引ポンプ２１１の吸引力が作用しているため、電子部品３の外周側から内周側に向かって、粘着シート２の剥離が進行する。最終的には、図６（Ｅ）に示すように、最内周の押圧体３０Ａのみが、粘着シート２を押圧している状態となり、この押圧体３０Ａの押圧面３１の領域が、粘着シート２の電子部品３に貼着した部分となる。   In this way, when the pressing body 30 sequentially moves, the peeling of the adhesive sheet 2 progresses from the outer peripheral side of the electronic component 3 toward the inner peripheral side because the suction force of the suction pump 211 is acting. Finally, as shown in FIG. 6 (E), only the innermost pressing body 30A is in a state of pressing the adhesive sheet 2, and the area of the pressing surface 31 of this pressing body 30A is the adhesive sheet. It becomes a part attached to the electronic component 3 of 2.

最内周の押圧体３０Ａの押圧面３１は、その面積が非常に小さく設定されている。このため、電子部品３を吸着した吸着ノズル８を上昇させることによって、電子部品３は粘着シート２から容易に剥離される。つまり、押圧体３０Ａの押圧面３１が、電子部品３にかかるストレスを抑制して、剥離させることが可能な大きさに設定されている。この後、吸着ノズル８を上昇させることによって、電子部品３を粘着シート２からピックアップすることができる。   The pressing surface 31 of the innermost pressing member 30A has a very small area. Therefore, the electronic component 3 is easily peeled from the adhesive sheet 2 by raising the suction nozzle 8 that has suctioned the electronic component 3. That is, the pressing surface 31 of the pressing body 30A is set to a size that can suppress the stress applied to the electronic component 3 and can be peeled off. After that, the electronic component 3 can be picked up from the adhesive sheet 2 by raising the suction nozzle 8.

［作用効果］
（１）本実施形態のピックアップ装置１は、粘着シート２に貼着された電子部品３をピックアップするピックアップ部４と、粘着シート２の電子部品３とは反対側の面に対向して設けられたバックアップ部２００と、を有し、バックアップ部２００は、粘着シート２のピックアップされる電子部品３に対応する領域を吸着保持する吸着面２２０と、吸着面２２０内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体３０が共通の軸に同軸の入れ子状に配設された押圧部２３０と、押圧部２３０を移動させて、全ての押圧体３０により粘着シート２を押圧する押圧動作と、外側の押圧体３０から隣接する内側の押圧体３０を、電子部品３を粘着シート２から剥離させる離隔方向へ移動させる離隔動作とを行わせる駆動機構２４０と、駆動機構２４０に設けられ、共通の軸に沿って移動する単一の第１の駆動部材２４１の動作を、複数の押圧体３０の離脱動作に変換する変換機構２５０と、を有する。 [Effect]
(1) The pickup device 1 of the present embodiment is provided so as to face a pickup unit 4 for picking up the electronic component 3 attached to the adhesive sheet 2 and a surface of the adhesive sheet 2 opposite to the electronic component 3. The backup unit 200 has a suction unit 220 that sucks and holds a region of the adhesive sheet 2 corresponding to the electronic component 3 to be picked up, and the backup unit 200 moves along the common axis in the suction face 220. A plurality of pressing members 30 that can be provided and have different outer sizes are arranged coaxially on a common shaft in a nested manner, and the pressing unit 230 is moved to adhere to all pressing members 30. Driving for performing a pressing operation for pressing the sheet 2 and a separating operation for moving the inner pressing body 30 adjacent to the outer pressing body 30 in a separating direction for separating the electronic component 3 from the adhesive sheet 2. The structure 240, and the conversion mechanism 250 provided in the drive mechanism 240 and converting the operation of the single first drive member 241 that moves along the common axis into the disengagement operation of the plurality of pressing bodies 30. ..

このため、単一の第１の駆動部材２４１の動作によって、複数の押圧体３０を外側から順次離隔方向へ移動させて、粘着シート２から剥離させることができる。従って、装置の複雑化や大型化を防ぎつつ、ピックアップ時の電子部品３の破損を防止できる。   Therefore, by the operation of the single first driving member 241, the plurality of pressing bodies 30 can be sequentially moved from the outer side in the separating direction to be peeled from the adhesive sheet 2. Therefore, it is possible to prevent the electronic component 3 from being damaged at the time of pickup while preventing the device from becoming complicated and large-sized.

（２）変換機構２５０は、各押圧体３０の相反する側面から外方に延出した少なくとも一対の延出部６０と、各押圧体３０の延出部６０を離隔方向に個別に付勢する付勢部材７０と、第１の駆動部材２４１により駆動され、各押圧体３０の離隔方向への移動を、外側から内側に順次許容する第１のカム機構８０と、を有する。 (2) The conversion mechanism 250 individually biases at least a pair of extending portions 60 extending outward from the opposite side surfaces of each pressing body 30 and the extending portions 60 of each pressing body 30 in the separating direction. It has an urging member 70 and a first cam mechanism 80 that is driven by the first driving member 241 and sequentially allows the pressing bodies 30 to move in the separating direction from the outside to the inside.

このため、押圧体３０の側面から外方に延出した延出部６０を付勢部材７０で押さえることになるので、押圧体３０の内部で押さえる場合に比べて、押さえる位置の間隔が広くなり、押圧体３０のぐらつき等を防止して、移動の安定化を図ることができる。   For this reason, since the extending portion 60 extending outward from the side surface of the pressing body 30 is pressed by the biasing member 70, the distance between the pressing positions becomes wider than in the case of pressing inside the pressing body 30. It is possible to prevent the pressing body 30 from wobbling and stabilize the movement.

（３）第１のカム機構８０は、各押圧体３０の粘着シート２に押圧される押圧面３１、３２とは反対側の面に設けられ、共通の軸に交差する方向に沿って、押圧体３０毎に形状が異なるカム面８１と、各押圧体３０のカム面８１に接して、各押圧体３０を付勢部材７０に抗する方向に付勢するとともに、離隔方向に交差する方向に移動するローラシャフト８２と、を有する。 (3) The first cam mechanism 80 is provided on the surface of each pressing body 30 opposite to the pressing surfaces 31 and 32 pressed by the adhesive sheet 2, and presses along the direction intersecting the common axis. The cam surface 81 having a different shape for each body 30 is brought into contact with the cam surface 81 of each pressing body 30 to urge each pressing body 30 in the direction against the urging member 70, and in the direction intersecting the separating direction. And a roller shaft 82 that moves.

このため、ローラシャフト８２の移動に従って、複数の押圧体３０を順次離隔方向に移動させることができるので、個々の押圧体３０を独立に駆動する場合に比べて、簡単且つ小型の装置によって、押圧体３０の数を増やして多段にすることができる。従って、同一面積の電子部品３を粘着シート２から剥離する場合に、外側から剥離する際の一回毎の面積を小さくできるとともに、最後に残る中央の押圧面３１の面積を小さくすることができる。これにより、剥離の際に電子部品３に加わる負荷と剥離の速度のバランスを適切なものとして、電子部品３の破損を防止できる。例えば、押圧体３０を５つ以上としても、装置の複雑化や大型化を抑えつつ、電子部品３の破損を防ぐことができる。なお、平板の板状のブレードを押圧体として用いる場合と比べても、同様に、最後に残る中央の押圧面３１の面積を小さくすることができる。例えば、本実施形態では、電子部品３の粘着シート２に貼り付けられる面の面積に対して、最内周の押圧体３０Ａの押圧面３１によって剥がされずに残る粘着シート２の面積を、０．５％以下にすることができる。   Therefore, since the plurality of pressing bodies 30 can be sequentially moved in the separating direction in accordance with the movement of the roller shaft 82, the pressing can be performed by a simple and small device as compared with the case where the individual pressing bodies 30 are independently driven. The number of bodies 30 can be increased to provide multiple stages. Therefore, when the electronic components 3 having the same area are peeled from the adhesive sheet 2, the area for each peeling from the outside can be reduced, and the area of the central pressing surface 31 remaining at the end can be reduced. .. Accordingly, the load applied to the electronic component 3 at the time of peeling and the peeling speed are appropriately balanced, and the damage to the electronic component 3 can be prevented. For example, even if the number of pressing members 30 is five or more, it is possible to prevent the electronic component 3 from being damaged while suppressing the complexity and size of the device. Note that, similarly to the case where a flat plate-shaped blade is used as the pressing body, the area of the final pressing surface 31 in the center can be similarly reduced. For example, in the present embodiment, the area of the pressure-sensitive adhesive sheet 2 that is not peeled off by the pressing surface 31 of the innermost pressing member 30A is 0. It can be 5% or less.

（４）ローラシャフト８２の移動範囲は、吸着面２２０の外縁の範囲内である。このため、複数の押圧体３０が移動する共通の軸に直交する方向であるＸ軸方向に、ピックアップ装置１が大型化することを防止できる。 (4) The moving range of the roller shaft 82 is within the outer edge of the suction surface 220. Therefore, it is possible to prevent the pickup device 1 from increasing in size in the X-axis direction which is a direction orthogonal to the common axis along which the plurality of pressing bodies 30 move.

（５）カム面８１の形状に応じて、一対の延出部６０の一方と他方に対する付勢部材７０の付勢力が相違する。このため、付勢部材７０の付勢力を、各押圧体３０の傾きが生じないようにして、スムーズな動作を実現できる。 (5) The biasing force of the biasing member 70 with respect to one and the other of the pair of extending portions 60 differs depending on the shape of the cam surface 81. Therefore, the urging force of the urging member 70 can be prevented from inclining the pressing bodies 30, and a smooth operation can be realized.

（６）最も外側の押圧体３０の一対の延出部６０が最も外側に設けられ、内側の押圧体３０になるに従って、延出部６０が順次内側に設けられている。外側の押圧体３０であるほど平面視での大きさが大きくなるため、ぐらついた場合の押圧面３１の変位量も大きくなる。本実施形態では、外側の延出部６０ほど間隔が広くなるため、傾きを防止して押圧面３１を安定させることができる。 (6) The pair of extending portions 60 of the outermost pressing body 30 are provided on the outermost side, and the extending portions 60 are sequentially provided on the inner side as the inner pressing body 30 is formed. Since the outer pressing body 30 has a larger size in a plan view, the displacement amount of the pressing surface 31 in the case of wobbling also increases. In the present embodiment, the outer extending portion 60 has a wider interval, so that it is possible to prevent inclination and stabilize the pressing surface 31.

（７）変換機構２５０は、第１の駆動部材２４１の共通の軸に沿う方向への移動を、ローラシャフト８２の離隔方向に交差する方向への移動へ変換する第２のカム機構９０を有する。このため、駆動機構２４０の第１の駆動部材２４１の移動を共通の軸方向であるＺ軸方向として、これに直交する方向であるＸ軸方向のスペースの拡大を防止できる。 (7) The conversion mechanism 250 has the second cam mechanism 90 that converts the movement of the first drive member 241 in the direction along the common axis into the movement in the direction intersecting the separating direction of the roller shaft 82. .. Therefore, the movement of the first drive member 241 of the drive mechanism 240 is defined as the Z-axis direction, which is the common axial direction, and the expansion of the space in the X-axis direction, which is the direction orthogonal thereto, can be prevented.

（８）第２のカム機構９０は、ローラ９２及びこれに接する傾斜面９１を有し、ローラ９２及び傾斜面９１のいずれか一方を共通の軸に沿って移動させる主動カム、他方を前記共通の軸に交差する方向に移動させる従動カムとする直動カムである。このため、簡単な構成で、軸方向の動作をローラシャフト８２の動作に変換できる。なお、傾斜面９１を主動カム、ローラ９２を従動カムとしてもよい。 (8) The second cam mechanism 90 has a roller 92 and an inclined surface 91 that is in contact with the roller 92. The second cam mechanism 90 is a driving cam that moves one of the roller 92 and the inclined surface 91 along a common axis, and the other is the common cam. It is a direct acting cam that is a driven cam that moves in a direction intersecting the axis of. Therefore, the axial movement can be converted into the movement of the roller shaft 82 with a simple configuration. The inclined surface 91 may be the driving cam and the roller 92 may be the driven cam.

（９）押圧部２３０は、５個以上の押圧体３０Ａ〜３０Ｈを備え、最も外側の押圧体３０Ｈは、押圧面３２の大きさが、電子部品３の粘着シート２に貼り付けられる面の大きさ、つまり、電子部品３の外形よりも同じ或いは若干小さくなるように形成され、最も内側の押圧体３０Ａは、押圧面３１の面積が、電子部品３の粘着シート２に貼り付けられる面の面積の３０％以下となる大きさに形成されている。 (9) The pressing portion 230 includes five or more pressing bodies 30A to 30H, and the outermost pressing body 30H has a pressing surface 32 that is the size of the surface to be attached to the adhesive sheet 2 of the electronic component 3. That is, that is, the innermost pressing body 30A is formed to have the same size as or slightly smaller than the outer shape of the electronic component 3, and the area of the pressing surface 31 is the area of the surface to be attached to the adhesive sheet 2 of the electronic component 3. Is 30% or less.

このように構成されているため、電子部品３から粘着シート２を少しずつ引き剥がすことができるとともに、最終的に電子部品３から剥がされずに残る粘着シート２の面積を小さくすることができるので、厚みの薄い電子部品３であってもストレスを抑制して剥離させることが可能となる。このような構成は、一辺の長さを５ｍｍを超えるような比較的大きなサイズで、厚さが５０μｍ以下のような薄型の電子部品３のピックアップに特に有効である。なお、最も内側の押圧体３０Ａの押圧面３１の面積を電子部品３の面積の５％以下に設定し、筒状の押圧体３０の側壁の厚さを０．６ｍｍ以下となるように、その個数を設定すれば、より一層、ストレスに対する信頼性を向上させることができる。つまり、電子部品３の破損の抑制効果をより一層向上させることができる。   With this configuration, the adhesive sheet 2 can be peeled off from the electronic component 3 little by little, and the area of the adhesive sheet 2 that remains without being peeled off from the electronic component 3 can be reduced. Even the electronic component 3 having a small thickness can be suppressed and peeled off. Such a configuration is particularly effective for a pickup of a thin electronic component 3 having a relatively large size whose one side exceeds 5 mm and a thickness of 50 μm or less. The area of the pressing surface 31 of the innermost pressing body 30A is set to 5% or less of the area of the electronic component 3, and the thickness of the side wall of the cylindrical pressing body 30 is set to 0.6 mm or less. By setting the number, the reliability against stress can be further improved. That is, the effect of suppressing damage to the electronic component 3 can be further improved.

［第２の実施形態］
図９を参照して、第２の実施の形態として、第１の実施形態のピックアップ装置１を備えた実装装置４００について説明する。以下の説明では、垂直方向の直線に沿う方向をＺ軸方向、Ｚ軸方向に直交する水平方向の平面において、互いに直交する２直線に沿う方向をＸ軸方向、Ｙ軸方向とする。 [Second Embodiment]
As a second embodiment, a mounting apparatus 400 including the pickup device 1 of the first embodiment will be described with reference to FIG. In the following description, a direction along a vertical straight line is defined as a Z-axis direction, and a direction along two straight lines orthogonal to each other on a horizontal plane orthogonal to the Z-axis direction is defined as an X-axis direction and a Y-axis direction.

実装装置４００は、ピックアップ装置１及び制御装置３００の他、供給装置５００と、中間ステージ６００と、基板ステージ７００と、実装機構８００と、を有する。供給装置５００は、半導体チップなどの電子部品３を貼着保持した粘着シート２を保持する装置である。供給装置５００は、ウエーハリング５１０、ウエーハテーブル５２０及び図示しない駆動機構を有する。ウエーハリング５１０は、個片化された電子部品３が貼着された粘着シート２を保持する部材である。ウエーハテーブル５２０は、ウエーハリング５１０を移動可能に支持する装置である。駆動機構は、ウエーハテーブル５２０をＸ軸、Ｙ軸及びＺ軸方向に移動可能に支持し、ウエーハリング５１０をＸ軸、Ｙ軸及びＺ軸に沿って移動させる。   The mounting apparatus 400 includes the pickup apparatus 1 and the control apparatus 300, a supply apparatus 500, an intermediate stage 600, a substrate stage 700, and a mounting mechanism 800. The supply device 500 is a device that holds the adhesive sheet 2 to which the electronic component 3 such as a semiconductor chip is attached and held. The supply device 500 has a wafer ring 510, a wafer table 520, and a drive mechanism (not shown). The wafer ring 510 is a member that holds the adhesive sheet 2 to which the individualized electronic components 3 are attached. The wafer table 520 is a device that movably supports the wafer ring 510. The drive mechanism movably supports the wafer table 520 in the X-axis, Y-axis, and Z-axis directions, and moves the wafer ring 510 along the X-axis, Y-axis, and Z-axis.

中間ステージ６００は、ピックアップ装置１の吸着ノズル８によって吸着保持された電子部品３を実装機構８００に受け渡す際に、電子部品３を一時的に載置するステージである。基板ステージ７００は、基板７１０を載置する部材である。つまり、電子部品３が実装される基板７１０を支持する部材である。基板ステージ７００は、図示しないＸＹθ方向移動機構に支持され、Ｘ軸方向、Ｙ軸方向、θ（水平回転）方向に移動可能に設けられている。   The intermediate stage 600 is a stage on which the electronic component 3 is temporarily placed when the electronic component 3 sucked and held by the suction nozzle 8 of the pickup device 1 is transferred to the mounting mechanism 800. The substrate stage 700 is a member on which the substrate 710 is placed. That is, it is a member that supports the substrate 710 on which the electronic component 3 is mounted. The substrate stage 700 is supported by an XYθ-direction moving mechanism (not shown), and is provided so as to be movable in the X-axis direction, the Y-axis direction, and the θ (horizontal rotation) direction.

実装機構８００は、ピックアップ装置１によって取り出された電子部品３を、基板７１０に実装する機構である。実装機構８００は、中間ステージ６００上から電子部品３を吸着保持し、吸着保持した電子部品３を基板ステージ７００に支持された基板７１０上の所定の位置に実装する。実装機構８００は、実装ツール８１０及び図示しないＸＹＺ駆動機構を有する。実装ツール８１０は電子部品３を吸着保持する吸着ノズルである。ＸＹＺ駆動機構は、実装ツール８１０を、Ｘ、Ｙ、Ｚ軸方向に移動させる機構である。   The mounting mechanism 800 is a mechanism for mounting the electronic component 3 taken out by the pickup device 1 on the substrate 710. The mounting mechanism 800 sucks and holds the electronic component 3 from the intermediate stage 600, and mounts the sucked and held electronic component 3 at a predetermined position on the substrate 710 supported by the substrate stage 700. The mounting mechanism 800 has a mounting tool 810 and an XYZ drive mechanism (not shown). The mounting tool 810 is a suction nozzle that holds the electronic component 3 by suction. The XYZ drive mechanism is a mechanism that moves the mounting tool 810 in the X, Y, and Z axis directions.

ピックアップ装置１は、上述の第１の実施形態と同様の構成である。また、制御装置３００は、第１の実施形態の制御装置３００に、供給装置５００、基板ステージ７００、実装機構８００を制御する機能が付加されたものである。   The pickup device 1 has the same configuration as that of the above-described first embodiment. Further, the control device 300 is obtained by adding the function of controlling the supply device 500, the substrate stage 700, and the mounting mechanism 800 to the control device 300 of the first embodiment.

このような実装装置４００においては、供給装置５００のウエーハテーブル５２０に支持されたウエーハリング５１０上から、ピックアップ装置１が、上述のように電子部品３をピックアップする。ピックアップ装置１は、ピックアップした電子部品３を、中間ステージ６００を介して、実装機構８００の実装ツール８１０に受渡す。実装ツール８１０は、基板ステージ７００上の基板７１０に実装される。実装装置４００は、このような電子部品３のピックアップ、受渡し、基板７１０への実装の動作を、順次繰り返し実行する。   In such a mounting device 400, the pickup device 1 picks up the electronic component 3 from the wafer ring 510 supported by the wafer table 520 of the supply device 500 as described above. The pickup device 1 delivers the picked-up electronic component 3 to the mounting tool 810 of the mounting mechanism 800 via the intermediate stage 600. The mounting tool 810 is mounted on the substrate 710 on the substrate stage 700. The mounting apparatus 400 sequentially and repeatedly performs such operations of picking up and delivering the electronic component 3 and mounting it on the substrate 710.

このような実装装置４００では、上述の第１の実施形態と同様の作用効果を奏することができる。さらに、この作用効果によって、実装装置４００による電子部品３の実装品質の向上と実装の信頼性の向上を図ることができ、ひいては、電子部品３が基板７１０に実装されて製造される半導体パッケージなどの電子部品製品の品質の向上を図ることができる。   In such a mounting apparatus 400, it is possible to achieve the same effects as those of the above-described first embodiment. Further, due to this function and effect, the mounting quality of the electronic component 3 by the mounting apparatus 400 can be improved and the reliability of the mounting can be improved, and by extension, a semiconductor package manufactured by mounting the electronic component 3 on the substrate 710 and the like. It is possible to improve the quality of electronic component products.

［変形例］
本実施形態は、以下のような変形例も適用可能である。例えば、粘着シート２の支持方向、ピックアップ機構１００のピックアップ方向、バックアップ部２００の第１の駆動部材２４１、第２の駆動部材２４２の駆動方向、押圧体３０の移動方向は、垂直方向であっても、水平方向であっても、これらに対して傾斜した方向であってもよい。 [Modification]
The following modifications can be applied to the present embodiment. For example, the supporting direction of the adhesive sheet 2, the pickup direction of the pickup mechanism 100, the driving directions of the first driving member 241, the second driving member 242 of the backup unit 200, and the moving direction of the pressing body 30 are vertical directions. Also, it may be horizontal or inclined with respect to these.

また、上記の態様において、第１の駆動部材２４１及び変換機構２５０によって、押圧体３０を外側の押圧体３０Ｈから隣接する内側の押圧体３０Ｇ、３０Ｆ…、に向けて順に離隔方向に移動、つまり、下降させるようにしたが、これに限られるものではない。例えば、内側に位置する押圧体３０Ａから隣接する外側の押圧体３０Ｂ、３０Ｃ…、の順に下降させるようにしても良いし、中間の押圧体３０から隣接する外側の押圧体３０と内側の押圧体３０に順に下降させるようにしてもよい。また、各押圧体３０を下降させるタイミングについても、均等の時間間隔で下降させるものに限られるものではなく、押圧体３０毎に下降させる時間間隔を違えるようにしてよい。例えば、電子部品３が粘着シート２に接している面積が小さくなるほど、押圧体３０を下降させる時間間隔を短くしてもよい。より具体的には、外側から内側に近づくほど、押圧体３０を下降させる時間間隔を短くしてもよい。   Further, in the above-described aspect, the first driving member 241 and the conversion mechanism 250 sequentially move the pressing body 30 from the outer pressing body 30H toward the inner pressing bodies 30G, 30F, ... , But it is not limited to this. For example, the pressing body 30A located on the inner side may be lowered in the order of the outer pressing bodies 30B, 30C, ..., Which are adjacent to each other, or the outer pressing body 30 and the inner pressing body 30 which are adjacent to the intermediate pressing body 30. You may make it descend | fall in order to 30. Further, the timing of lowering each pressing body 30 is not limited to the one at a uniform time interval, and the time interval for lowering each pressing body 30 may be different. For example, the smaller the area in which the electronic component 3 is in contact with the adhesive sheet 2, the shorter the time interval for lowering the pressing body 30 may be. More specifically, the time interval for lowering the pressing body 30 may be shortened as it approaches the inside from the outside.

さらに、押圧体３０が移動する離隔方向は、電子部品３を粘着シート２から剥離させる方向であればよく、押圧の方向とは逆の方向には限定されない。例えば、押圧体３０を押圧方向に移動、つまり、上昇させるようにしても良い。すなわち、外側の押圧体３０Ｈに対してより内側の押圧体３０ほど高くなるように順次に上昇させるようにしてもよい。また、押圧体３０に上昇と下降を行わせるようにしてもよい。例えば、上記の態様において、カム面８１に、各押圧体３０を同じタイミングで所定量、上昇させる傾斜面を形成し、各押圧体３０を一括して所定量上昇させた後、外側の押圧体３０Ｈから順に下降させるように動作させてもよい。このように構成すれば、第２の駆動部材２４２を省くことが可能となる。   Furthermore, the separating direction in which the pressing body 30 moves may be any direction as long as it separates the electronic component 3 from the adhesive sheet 2, and is not limited to the direction opposite to the pressing direction. For example, the pressing body 30 may be moved in the pressing direction, that is, raised. That is, the inner pressing body 30 may be sequentially raised with respect to the outer pressing body 30H. Further, the pressing body 30 may be made to move up and down. For example, in the above-described aspect, the cam surface 81 is formed with an inclined surface that raises each pressing body 30 by a predetermined amount at the same timing, and the pressing bodies 30 are collectively raised by a predetermined amount, and then the outer pressing body is pressed. You may operate so that it may descend from 30H in order. With this structure, the second drive member 242 can be omitted.

このような押圧体３０の動作のさせ方の変更は、カム面８１の形状、所謂、カム曲線を押圧体３０毎に適宜変更すればよい。例えば、上記の態様において、各押圧体３０を下降させる時間間隔を短くしたいのならば、各押圧体３０間のカム面８１における傾斜面８５の相対間隔を短くすればよい。また、押圧体３０の下降量を大きくしたいのならば、第１の一致面８４に対する第２の一致面８６の高低差を大きくすればよい。このように、カム面８１により制御する構成を採用すると、各押圧体３０のカム面８１のカム曲線の変更によって、各押圧体３０の押し上げ量や離隔量、押し上げ或いは離隔のタイミングを自由に設定することができる。   The operation of the pressing body 30 can be changed by appropriately changing the shape of the cam surface 81, that is, a so-called cam curve, for each pressing body 30. For example, in the above aspect, if it is desired to shorten the time interval for lowering the pressing bodies 30, the relative interval between the inclined surfaces 85 on the cam surface 81 between the pressing bodies 30 may be shortened. Further, if it is desired to increase the descending amount of the pressing body 30, the height difference of the second matching surface 86 with respect to the first matching surface 84 may be increased. In this way, if the configuration in which the cam surface 81 is used for control is adopted, the amount of push-up, the amount of separation, the timing of push-up or separation of each pressing body 30 can be freely set by changing the cam curve of the cam surface 81 of each pressing body 30. can do.

また、上記の態様において、押圧体３０を矩形の筒状、或いは、矩形の柱状に形成したものとしたが、これに限られるものではなく、円筒状や円柱状、或いは、矩形以外の各筒状や角柱状に形成してもよい。例えば、押圧体３０を円筒状及び円柱状とした場合、各押圧体３０の相反する側面とは、各押圧体３０の共通の軸を含む平面に対して垂直に交わる直線上に位置する２つの側面となる。したがって、円筒状の押圧体３０において、上記実施形態のように押圧体３０の側面の外側に延出部６０設けた場合には、延出部６０は円筒の側面に接するように設けられることになる。   Further, in the above aspect, the pressing body 30 is formed in the shape of a rectangular tube or a rectangular column, but the present invention is not limited to this, and the cylindrical shape, the cylindrical shape, or each tube other than the rectangular shape. It may be formed into a rectangular shape or a prismatic shape. For example, when the pressing body 30 has a cylindrical shape and a columnar shape, the opposite side surfaces of each pressing body 30 are located on two straight lines that intersect perpendicularly to the plane including the common axis of each pressing body 30. It becomes the side. Therefore, in the cylindrical pressing body 30, when the extending portion 60 is provided outside the side surface of the pressing body 30 as in the above embodiment, the extending portion 60 is provided so as to contact the side surface of the cylinder. Become.

なお、本発明のいくつかの実施形態を説明したが、これらの実施形態は例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施し得るものであり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれると共に、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the scope equivalent thereto.

１ ピックアップ装置
２ 粘着シート
３ 電子部品
４ ピックアップ部
５ 主胴部
６ 凸部
７ 吸引孔
８ 吸着ノズル
８ａ 平坦面
９ ノズル孔
３０、３０Ａ〜３０Ｈ 押圧体
３１、３２ 押圧面
３３ 第１の凸部
３４ 第２の凸部
３５ 凹部
３６ 切欠
５０ フレーム
５１ 支持ブロック
５１ａ ガイド孔
５１ｂ 突出部
５２ 第１の支持板
５３ リニアガイド
５４ 第２の支持板
６０ 延出部
７０ 付勢部材
８０ 第１のカム機構
８１ カム面
８２ ローラシャフト
８３ 移動体
８３ａ 移動ブロック
８３ｂ 軸受け
８４ 第１の一致面
８５ 傾斜面
８６ 第２の一致面
９０ 第２のカム機構
９１ 傾斜面
９２ ローラ
９３ 軸受け
１００ ピックアップ機構
２００ バックアップ部
２１０ 収容体
２１１ 吸引ポンプ
２２０ 吸着面
２２１ 吸引孔
２２２ 開口部
２３０ 押圧部
２４０ 駆動機構
２４１ 第１の駆動部材
２４２ 第２の駆動部材
２５０ 変換機構
３００ 制御装置
４００ 実装装置
５００ 供給装置
５１０ ウエーハリング
５２０ ウエーハテーブル
６００ 中間ステージ
７００ 基板ステージ
７１０ 基板
８００ 実装機構
８１０ 実装ツール DESCRIPTION OF SYMBOLS 1 Pickup device 2 Adhesive sheet 3 Electronic component 4 Pickup part 5 Main body part 6 Convex part 7 Suction hole 8 Adsorption nozzle 8a Flat surface 9 Nozzle hole 30, 30A to 30H Pressing body 31, 32 Pressing surface 33 First convex part 34 2nd convex part 35 concave part 36 notch 50 frame 51 support block 51a guide hole 51b projecting part 52 first support plate 53 linear guide 54 second support plate 60 extension part 70 biasing member 80 first cam mechanism 81 Cam surface 82 Roller shaft 83 Moving body 83a Moving block 83b Bearing 84 First matching surface 85 Sloping surface 86 Second matching surface 90 Second cam mechanism 91 Sloping surface 92 Roller 93 Bearing 100 Pickup mechanism 200 Backup unit 210 Housing 211 suction pump 220 suction surface 221 suction hole 222 opening 230 pressing portion 240 drive mechanism 241 1 of the drive member 242 the second drive member 250 converting mechanism 300 the controller 400 mounting device 500 feeder 510 wafer ring 520 wafer table 600 intermediate stage 700 substrate stage 710 the substrate 800 mounted mechanism 810 mounted tools

Claims (12)

粘着シートに貼着された電子部品をピックアップするピックアップ部と、
前記粘着シートの前記電子部品とは反対側の面に対向して設けられたバックアップ部と、
を有し、
前記バックアップ部は、
前記粘着シートのピックアップされる前記電子部品に対応する領域を吸着保持する吸着面と、
前記吸着面内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体が前記共通の軸に同軸の入れ子状に配設された押圧部と、
前記押圧部を移動させて、全ての押圧体により前記粘着シートを押圧する押圧動作と、いずれかの押圧体から隣接する押圧体を順次、前記電子部品を粘着シートから剥離させる離隔方向へ移動させる離隔動作とを行わせる駆動機構と、
前記駆動機構に設けられ、前記共通の軸に沿って移動する単一の駆動部材の動作を、前記複数の押圧体の離隔動作に変換する変換機構と、
を有することを特徴とする電子部品のピックアップ装置。 A pickup unit for picking up the electronic component attached to the adhesive sheet,
A backup unit provided opposite to the surface of the adhesive sheet opposite to the electronic component,
Have
The backup unit is
A suction surface for suction-holding a region of the adhesive sheet corresponding to the electronic component to be picked up,
A pressing unit provided movably along a common axis in the suction surface, and a plurality of pressing bodies having different outer sizes arranged coaxially with the common axis in a nested manner.
The pressing unit is moved to press the adhesive sheet by all the pressing bodies, and the pressing body adjacent to any one of the pressing bodies is sequentially moved in a separating direction to separate the electronic component from the adhesive sheet. A drive mechanism for performing a separation operation,
A conversion mechanism that is provided in the drive mechanism and that converts the operation of a single drive member that moves along the common axis into the separating operation of the plurality of pressing bodies;
An electronic component pickup device comprising: 前記変換機構は、
各押圧体の相反する側面から外方に延出した少なくとも一対の延出部と、
各押圧体の延出部を前記離隔方向に個別に付勢する付勢部材と、
前記駆動部材により駆動され、各押圧体の前記離隔方向への移動を、いずれかの押圧体から隣接する押圧体へと順次許容する第１のカム機構と、
を有することを特徴とする請求項１記載の電子部品のピックアップ装置。 The conversion mechanism is
At least a pair of extending portions extending outward from the opposite side surfaces of each pressing body,
A biasing member that individually biases the extending portion of each pressing body in the separating direction,
A first cam mechanism that is driven by the drive member and sequentially allows movement of each pressing body in the separating direction from any pressing body to an adjacent pressing body;
The electronic device pickup device according to claim 1, further comprising: 前記第１のカム機構は、
各押圧体の前記粘着シートに押圧される押圧面とは反対側の面に設けられ、前記共通の軸に交差する方向に沿って、前記押圧体毎に形状が異なるカム面と、
各押圧体のカム面に接して、各押圧体を前記付勢部材に抗する方向に付勢するとともに、前記離隔方向に交差する方向に移動するローラシャフトと、
を有することを特徴とする請求項２記載の電子部品のピックアップ装置。 The first cam mechanism is
A pressing surface of each pressing body that is opposite to the pressing surface that is pressed by the pressure-sensitive adhesive sheet, and a cam surface having a different shape for each pressing body along a direction intersecting the common axis,
A roller shaft that is in contact with the cam surface of each pressing body, urges each pressing body in a direction against the urging member, and moves in a direction intersecting the separating direction,
The electronic device pickup device according to claim 2, further comprising: 前記ローラシャフトの移動範囲は、前記吸着面の外縁の範囲内であることを特徴とする請求項３記載の電子部品のピックアップ装置。   The electronic device pickup device according to claim 3, wherein a moving range of the roller shaft is within a range of an outer edge of the suction surface. 前記カム面の形状に応じて、前記一対の延出部の一方と他方に対する付勢部材の付勢力が相違することを特徴とする請求項３又は請求項４記載の電子部品のピックアップ装置。   The pick-up device for an electronic component according to claim 3 or 4, wherein the biasing force of the biasing member with respect to one and the other of the pair of extending portions is different depending on the shape of the cam surface. 最も外側の前記押圧体の一対の前記延出部が最も外側に設けられ、内側の前記押圧体になるに従って、前記延出部が順次内側に設けられていることを特徴とする請求項２乃至５のいずれかに記載の電子部品のピックアップ装置。   The pair of extending portions of the outermost pressing body are provided on the outermost side, and the extending portions are sequentially provided on the inner side as the inner pressing body is formed. 5. The electronic component pickup device according to any one of 5 above. 前記変換機構は、
前記駆動部材の前記共通の軸に沿う方向への移動を、前記ローラシャフトの前記離隔方向に交差する方向への移動へ変換する第２のカム機構を有することを特徴とする請求項２乃至６のいずれかに記載の電子部品のピックアップ装置。 The conversion mechanism is
7. A second cam mechanism for converting movement of the drive member in a direction along the common axis into movement in a direction intersecting the separation direction of the roller shaft. An electronic component pickup device as set forth in any one of 1. 前記第２のカム機構は、
ローラ及びこれに接する傾斜面を有し、
前記ローラ及び前記傾斜面のいずれか一方を前記共通の軸に沿って移動させる主動カム、他方を前記共通の軸に交差する方向に移動させる従動カムとする直動カムであることを特徴とする請求項７記載の電子部品のピックアップ装置。 The second cam mechanism is
A roller and an inclined surface in contact with the roller,
One of the roller and the inclined surface is a driving cam that moves along the common axis, and the other is a linear cam that is a driven cam that moves in a direction intersecting the common axis. An electronic component pickup device according to claim 7. 前記押圧部は、５個以上の押圧体を備え、
最も外側の押圧体は、押圧面の大きさが、ピックアップされる前記電子部品の前記粘着シートに貼り付けられる面の大きさと同じ或いは若干小さくなるように形成され、
最も内側の押圧体は、押圧面の面積が、ピックアップされる前記電子部品の前記粘着シートに貼り付けられる面の面積の３０％以下となる大きさに形成されて成ることを特徴とする請求項１乃至８のいずれかに記載の電子部品のピックアップ装置。 The pressing portion includes five or more pressing bodies,
The outermost pressing body is formed such that the size of the pressing surface is the same as or slightly smaller than the size of the surface of the electronic component to be picked up and attached to the adhesive sheet,
The innermost pressing body is formed in such a size that an area of a pressing surface is 30% or less of an area of a surface of the electronic component to be picked up and attached to the adhesive sheet. 9. The electronic device pickup device according to any one of 1 to 8. 粘着シートに貼着された電子部品をピックアップするピックアップ機構と、
前記粘着シートの前記電子部品とは反対側の面に対向して設けられたバックアップ部と、
を有し、
前記バックアップ部は、
前記粘着シートのピックアップされる前記電子部品に対応する領域を吸着保持する吸着面と、
前記吸着面内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体が前記共通の軸に同軸の入れ子状に配設された押圧部と、
前記押圧部を移動させて、全ての押圧体により前記粘着シートを押圧する押圧動作と、いずれかの押圧体から隣接する押圧体を順次、前記電子部品を粘着シートから剥離させる離隔方向へ移動させる離隔動作とを行う駆動機構と、
前記駆動機構に設けられ、前記共通の軸に沿って移動する単一の駆動部材の動作を、前記複数の押圧体の離隔動作に変換する変換機構と、
を有し、
前記変換機構は、
各押圧体を前記離隔方向に個別に付勢する付勢部材と、
各押圧体の前記粘着シートに押圧される押圧面とは反対側の面に設けられ、前記共通の軸に交差する方向に沿って、前記押圧体毎に形状が異なるカム面と、
各押圧体のカム面に接して、各押圧体を前記付勢部材に抗する方向に付勢するとともに、前記離隔方向に交差する方向に移動するローラシャフトと、
を有することを特徴とする電子部品のピックアップ装置。 A pickup mechanism for picking up the electronic components attached to the adhesive sheet,
A backup unit provided opposite to the surface of the adhesive sheet opposite to the electronic component,
Have
The backup unit is
A suction surface for suction-holding a region of the adhesive sheet corresponding to the electronic component to be picked up,
A pressing portion provided movably along a common axis in the suction surface, and a plurality of pressing bodies having different outer sizes arranged coaxially with the common shaft in a nested manner,
The pressing unit is moved to press the pressure-sensitive adhesive sheet by all the pressure members, and an adjacent pressure member is sequentially moved from one of the pressure members in a separating direction in which the electronic component is separated from the pressure-sensitive adhesive sheet. A drive mechanism that performs a separating operation,
A conversion mechanism that is provided in the drive mechanism and that converts the operation of a single drive member that moves along the common axis into the separating operation of the plurality of pressing bodies;
Have
The conversion mechanism is
A biasing member that individually biases each pressing body in the separating direction,
A pressing surface provided on the opposite side of the pressing surface pressed by the pressure-sensitive adhesive sheet of each pressing body, along a direction intersecting the common axis, a cam surface having a different shape for each pressing body,
A roller shaft that is in contact with the cam surface of each pressing body, urges each pressing body in a direction against the urging member, and moves in a direction intersecting the separating direction,
An electronic component pickup device comprising: 粘着シートに貼着された電子部品をピックアップするピックアップ部と、
前記粘着シートの前記電子部品とは反対側の面に対向して設けられたバックアップ部と、
を有し、
前記バックアップ部は、
前記粘着シートのピックアップされる前記電子部品に対応する領域を吸着保持する吸着面と、
前記吸着面内に共通の軸に沿って移動可能に設けられ、外形の大きさが異なる複数の押圧体が同軸の入れ子状に配設された押圧部と、
前記複数の押圧体を前記共通の軸に沿って個別に動作させる駆動機構であって、共通の軸に沿って移動する単一の駆動部材と、この単一の駆動部材の動作を前記複数の押圧体の個別の動作に変換する変換機構と、を備える駆動機構と、
を有することを特徴とする電子部品のピックアップ装置。 A pickup unit for picking up the electronic component attached to the adhesive sheet,
A backup unit provided opposite to the surface of the adhesive sheet opposite to the electronic component,
Have
The backup unit is
A suction surface for suction-holding a region of the adhesive sheet corresponding to the electronic component to be picked up,
A pressing portion that is provided movably along a common axis within the suction surface, and has a plurality of pressing bodies having different outer sizes arranged coaxially in a nested manner.
A drive mechanism for individually operating the plurality of pressing bodies along the common axis, wherein a single drive member that moves along the common axis and the operation of the single drive member A drive mechanism that includes a conversion mechanism that converts individual operations of the pressing body,
An electronic component pickup device comprising: 半導体チップを貼着保持した粘着シートを保持する供給装置と、
基板を載置する基板ステージと、
前記供給装置が保持した前記粘着シートから前記半導体チップをピックアップするピックアップ装置と、
前記ピックアップ装置によって取り出された前記半導体チップを、前記基板に実装する実装機構と、を備えた実装装置であって、
前記ピックアップ装置は、請求項１乃至１１のいずれかに記載のピックアップ装置であることを特徴とする実装装置。
A supply device for holding an adhesive sheet to which a semiconductor chip is attached and held,
A substrate stage on which a substrate is placed,
A pickup device for picking up the semiconductor chip from the adhesive sheet held by the supply device;
A mounting device comprising a mounting mechanism for mounting the semiconductor chip taken out by the pickup device on the substrate,
The mounting device according to claim 1, wherein the pickup device is the pickup device according to any one of claims 1 to 11.
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