JP2011082379A - Apparatus and method for full compression bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable FPD (flat panel display) full compression bonding apparatus, capable of absolutely thermocompression bonding when bonding to a substrate without a tilted compression bonding blade and the occurrence of scraping to an upper and a lower guide, even though the compression bonding blade is disposed asymmetric in biased arrangement. <P>SOLUTION: A full compression bonding apparatus 1 moves a plurality of compression bonding blades 21 having compression bonding blades 22 at their front edge along a compressing base 11 supporting the compression bonding blades 21 to determine the arrangement of the compression bonding blades 21; compresses an FPD substrate or a printed-circuit board by the compression bonding blade 22; and fixes mounting components on the FPD substrate or the printed-circuit board. A compensation force for compensating or reducing a reactive force given to the compression bonding blade 22 from the FPD substrate or the printed-circuit board and a rotational moment based on the bias arrangement of the plurality of compression bonding blades 21 when compression bonded are imparted to the compressing base 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  In the present invention, mounting parts such as TAB (Tape Automated Bonding) / COF (Chip on film) and COG (Chip on glass) are thermocompression bonded through ACF (Anisotropic Conductive Film), and FPD (Flat) display) The present invention relates to a main pressure bonding apparatus for fixing to a substrate or a printed circuit board, and more particularly to a main pressure bonding apparatus capable of reliably heat-bonding a mounted component.

  Conventionally, display substrates represented by liquid crystal substrates (hereinafter simply referred to as substrates) have been diversified. Along with this, the manufacturing equipment for the substrate is required to cope with diversification, and the same crimping apparatus constituting the manufacturing equipment has the same demand. Conventionally, there is a request to change the mounting pitch of the crimping apparatus at equal intervals, and the technique shown in Patent Document 1 includes pitch changing means for changing the positions of a plurality of crimping blades while maintaining the equal pitch. .

JP 2003-224165 A

  However, in recent years, demands for diversifying the substrate pitch have been added, and it is desired that the mounting pitch can be changed freely as well as simply changing the mounting pitch at regular intervals. As an example of changing to free, as shown to FIG. 8A, the crimping blade part 21 (crimping blade 22) may be arrange | positioned in the position where one side (left side in the figure) was offset. In this case, as shown in FIG. 8B, when the pressurization base 11 is lowered and the crimping blade 22 contacts and presses against the substrate 2 in order to thermocompress the ACF, the crimping blade 22 receives a reaction force from the substrate 2. A rotation moment as indicated by an arrow M is generated with the support portion a of the pressure base as the center of rotation, the crimping blade 22 is tilted, and the upper and lower guides 12 supporting the vertical movement are galling, which is ensured. It was found that thermocompression bonding is not possible. When the crimping blades 22 are evenly arranged on the left and right with the support portion a of the pressure base as the center, the respective crimping blades 22 act evenly on the substrate 2 and the reaction force to each crimping blade is generated from the support portion a. Since it is distributed equally to the left and right, the rotational moment as described above does not occur.

  The object of the present invention has been made in view of the above problems, and even when the crimping blades are not arranged evenly on the right and left sides, the crimping blades are tilted or vertically guided when crimping to the substrate. An object of the present invention is to provide a highly reliable main crimping apparatus or main crimping method for an FPD that can reliably perform thermocompression without causing galling.

  In order to achieve the above object, the present invention provides a plurality of crimping blade portions each having a crimping blade at a tip, a pressure base supporting the crimping blade portion, and the plurality of the pressure bonding along the pressure base. A crimping blade moving unit that moves the blade, presses the FPD substrate or the printed circuit board with the crimping blade, and fixes the mounted component to the FPD substrate or the printed circuit board. A biasing arrangement compensator that provides the pressure base with a compensation force that compensates or reduces a reaction force received by the crimping blade from the FPD board or the printed board and a rotational moment based on the offset arrangement of the plurality of crimping blades; One feature.

  In addition to the first feature, the second feature of the present invention is that, in addition to the first feature, the partial arrangement compensation unit is provided on at least one of both end sides of the pressure base. And

  Furthermore, in order to achieve the above object, the third feature of the present invention is that, in addition to the second feature, the partial arrangement compensation portion is provided on the lower side or the upper side of the pressure base. .

  Further, in order to achieve the above object, the present invention moves the plurality of crimping blade portions each having a crimping blade at the tip along a pressure base that supports the crimping blade portion, thereby arranging the crimping blade portions. In the final press-bonding method of determining and pressurizing the FPD board or the printed board with the press-fit blade and fixing the mounted component to the FPD board or the print board, the reaction force that the press-fit blade receives from the FPD board or the print board during the pressurization A fourth feature is that a compensation force for compensating or reducing a rotational moment based on the uneven arrangement of the plurality of crimping blade portions is applied to the pressure base.

  Furthermore, in order to achieve the above object, the present invention has a fifth feature that, in addition to the second or fourth feature, the compensation force is generated by an air cylinder.

  According to the present invention, even when the crimping blades are in an uneven arrangement, the crimping blades can be reliably thermocompression bonded without causing the crimping blades to be tilted or the upper and lower guides to be galvanized. The present crimping apparatus and the present crimping method can be provided.

In the figure showing the basic concept of the present invention, when pressurizing a substrate with a crimping blade, pressurizing on the unevenly arranged side so that the crimping blade portion does not tilt due to the reaction force from the substrate and the unevenly arranged crimping blade portion It is the figure which provided the compensation power to the edge part vicinity of a base. FIG. 1B is a diagram in which a compensation force is applied to the vicinity of the end portion of the pressure base on the side opposite to the uneven arrangement side, unlike FIG. 1A. It is the figure which showed this crimping | compression-bonding apparatus which is the 1st Embodiment of this invention. It is the figure used for description of TAB loading processing work. It is the figure which showed compensating compensation by giving the compensation force which pulls down the left side of a pressurization base by the left side deviation arrangement compensation part. It is the figure which showed compensating the left side deviation arrangement | positioning by giving the compensation force which raises the right side of a pressurization base by the right side deviation arrangement | positioning compensation part. It is the figure which showed the TAB mounting process flow of this crimping | bonding apparatus in 1st Embodiment. It is the figure which showed the side view when the crimping blade part shown in FIG. It is the figure which showed this crimping | compression-bonding apparatus which is the 2nd Embodiment of this invention. It is the figure which showed the case where the crimping | compression-bonding blade part in the past was unevenly arranged in the position which shifted to the one side. It is a figure which shows the state which the crimping blade part inclined by the reaction force and deviation arrangement | positioning from a board | substrate when pressurizing a board | substrate with a crimping blade in the state of FIG. 8A.

  FIG. 1 is a diagram showing a basic concept of the present invention, and is a diagram showing an example in which a crimping blade portion 21 having a crimping blade 22 is arranged on the left side. In this case, as described with reference to FIG. 8B, when the crimping blade 22 is pressed against the substrate 2 in order to thermocompress the ACF, the crimping blade 22 receives the reaction force R from the substrate 2 during the pressing, and rotates. Moment M = R × KM is generated. Therefore, in the present invention, as shown in FIG. 1A, a compensation force H that generates a rotational moment MH (for example, H × KH) that compensates or reduces so as to cancel the rotational moment is given to the action point b of the pressurizing base 11. . As a result, at the time of thermocompression bonding to the substrate 2, the pressure base 11 can be kept horizontal, and the thermocompression bonding can be surely performed without tilting the crimping blade or causing galling in the upper and lower guides.

  How to arrange the crimping blade portion 21 is determined in advance corresponding to the substrate to be processed, and the rotational moment based on the uneven arrangement generated at that time can be known in advance. Therefore, the compensation power can be known in advance. The timing for applying the compensation force may basically be given because it does not affect the raising and lowering of the pressurizing base, or may be given before the crimping and released after the crimping is completed. Although it is desirable to completely cancel the rotational moment due to the reaction force, the compensation force may be such that the inclination of the crimping blade is within an allowable range and no galling occurs in the upper and lower guides.

FIG. 1A is a diagram showing an example in which the compensation force H is applied downward to the vicinity of the end portion of the pressure base on the unevenly arranged side of the crimping blade portion 21. FIG. 1B is a diagram showing an example in which the compensation force H is applied upward in the vicinity of the pressure base end portion on the side opposite to the unevenly arranged side of the crimping blade portion 21.
FIG. 2 shows the main crimping apparatus 1 showing the first embodiment of the present invention. The present crimping apparatus 1 shown in FIG. 2 shows an example in which five crimping blade portions 21 are offset on the left side. The basic idea of the first embodiment shown in FIG. 2 is that a compensation force H that compensates or reduces so as to cancel the rotational moment due to the reaction force R generated based on this uneven arrangement is applied to the left and right ends of the pressure base 11. The supporting air cylinder 41 is provided to the pressure base 11.

  The press-bonding device 1 shown in FIG. 2 moves down the press-bonding blade portion 21 constituting the press-bonding head 20 together with the pressurizing base 11 by the pressurizing cylinder 51 of the pressurizing base driving unit 50 provided on the upper portion of the pressurizing base 11. After that, the pressing blade 22 is pressed against the lower blade 32 of the lower blade portion 31 provided in the lower portion corresponding to the pressing blade portion 21, and TAB5 (shown upside down in FIG. 3) is printed on the substrate as shown in FIG. Crimp to 2 and fix. The pressure base 11 is horizontally lowered by the upper and lower guides 12 provided on the upper left and right ends of the pressure base 11. The upper and lower guides 12 have a structure in which a guide shaft 12b having one end fixed to the pressure base 11 is slid in an elongated cylindrical guide 12a.

  However, in FIG. 2, the five crimping blade portions 21 are unevenly arranged on the left side, and as described above, the reaction force that the crimping blades 22 are inclined due to the uneven arrangement during crimping or the upper and lower guides are galling. R is emitted. In view of this, the offset arrangement compensating portions 40 (40L, 40R) for compensating for the rotational moment due to the reaction force are provided on the lower left and right ends of the pressurizing base 11. The uneven arrangement compensation unit 40 is provided on a pedestal 43 on which a support air cylinder 41 is fixed to the apparatus main body, and is connected to the pressure base 11 via a relay shaft 11 a fixed to the pressure base 11 by the cylinder rod 42. A compensation force H shown in FIG. 1A is applied to compensate or reduce the rotational moment due to the uneven arrangement, and the crimping blade 22 is kept horizontal.

In this embodiment, there are two ways of compensation shown in FIG. First, as shown in FIG. 4A, the left reaction force R is compensated by applying a compensation force HL for lowering the left side of the pressure base 11 by the left side offset arrangement compensation unit 40L. At this time, the right side offset compensator 40R in FIG. 4A maintains a neutral state in which no force is generated.
Secondly, as shown in FIG. 4B, the left reaction force R is compensated by applying a compensation force HR that raises the left side of the pressure base by the right side displacement compensator 40R. At this time, similarly to the first case, the left side offset compensating unit 40L maintains a neutral state in which no force is generated.

  Further, unlike FIG. 2, when there is an uneven arrangement on the right side, the first and second compensation methods are reversed on the left and right.

  Further, the support air cylinder 41 shown in FIG. 2 is a double-acting cylinder in which the rod operates in both directions, and either one of the above-described two modes can be selected depending on which pressure is applied. Therefore, in the present embodiment, the offset arrangement compensation units 40L and 40R are provided on the left and right, but it is not always necessary to provide them on the left and right, and may be provided only on one side. When the supporting air cylinder 41 is a single-acting cylinder that operates only in one direction and is, for example, an extrusion type, the eccentricity compensator 40 is provided on the left and right sides and compensated by the second method shown in FIG. 4B.

  According to the above embodiment, even if the crimping blade portions are arranged in an uneven arrangement, the pressure base 11 can be maintained horizontally by compensating or reducing so as to cancel the rotational moment based on the uneven arrangement that occurs during the crimping. It is possible to reliably perform thermocompression bonding without tilting the crimping blade or causing galling in the upper and lower guides.

FIG. 5 is a diagram showing a TAB mounting process flow of the main crimping apparatus 1 shown in FIG. Hereinafter, the processing flow will be described.
First, as shown in FIG. 2, the pressure-bonding head 20 (pressure-bonding blade portion 21 and lower blade portion 31) is arranged corresponding to the processing substrate (Step 1). In FIG. 2, the five crimping blade portions 21 are arranged on the left side, and the eccentric arrangement is generated on the left side from the center of the pressure base 11. How to arrange the crimping blade portion 21 is determined in advance corresponding to the substrate to be processed, and the rotational moment and the compensation force H based on the uneven arrangement generated at that time can be known in advance. Therefore, thereafter, based on the pre-set offset arrangement, a compensation force H is applied to the pressure base 11 as shown in FIG. 4A (Step 2). After applying the compensation force, the crimping blade 22 is lowered to the front of the lower blade 32 of the lower blade portion 31 in the applied state (Step 3). While the pressure base is kept horizontal with the compensation force H, the TAB mounting portion 2a (see FIG. 3) of the substrate transported to the lower blade 32 is heat-bonded by the pressure blade 22 (Step 4). After the thermocompression bonding, the pressure base 11 is raised (Step 5). Thereafter, the processing from Step 3 to Step 5 is repeated until the processing operation is completed for all the substrates.

Of the above steps, the configuration that already realizes Step 2 (deviation arrangement compensation unit 40) has already been described. Therefore, the configuration for realizing Steps 1, 3, 4, and 5 will be described below with reference to FIG.
6 is a side view of the crimping blade portion 21 shown in FIG. 2 as viewed from the arrow B. In addition to the crimping blade portion 21, a crimping blade portion moving portion 60 that moves the crimping blade portion 21 to the left and right is shown. Show.

  The crimping blade part moving unit 60 includes crimping blade part moving units 61U and 61D provided at two upper and lower positions between the rear frame part 18 and the crimping blade part 21 on the right side in FIG. The pressure blade portion 21 is provided between the pressure blade portion 21 and the pressure base 11. In each crimping blade moving unit 60, the sliders 63U, 63D, and 63J slide on the rails 62U, 62D, and 62J fixed to the rear frame 18 or the pressure base 11, and the crimping blade 21 is moved in the direction perpendicular to the paper surface. Can be moved to. The crimping blade moving unit 60 may be driven by a motor or the like, or may be moved manually. A similar mechanism is provided in the lower blade portion 31. Thereby, the desired arrangement of the crimping head 20, that is, Step 1, can be realized.

  On the other hand, the crimping blade portion 21 descends the crimping blade 22 by the cylinder 23, and the crimping portion 21A for crimping the TAB mounting portion 2a shown in FIG. There is a crimping part guide 21B for guiding the raising and lowering of the crimping part 21 by. The crimping portion 21 </ b> A presses the crimping blade 22 against the TAB mounting portion mounted on the lower blade 32 by the cylinder rod 24 that moves up and down by the cylinder 23. At this time, each crimping blade 22 receives an individual reaction force from the substrate and receives a reaction force R as a whole. Between the cylinder rod 24 and the crimping blade 22, there is a spring 29 that softens the impact of the crimping blade on the substrate during crimping. Incidentally, 35 is a wiring to a heater (not shown) provided in the crimping blade 22, and 36 is a lead wire to a thermocouple for measuring the temperature of the crimping blade 22.

  The crimping section guide 21B includes crimping section sliders 26, 27U, and 27D that move the guide rail 25 fixed to the crimping section fixing frame 28 that fixes the slides 63U and 63D. When the crimping part 21A is raised and lowered by the pressure base 11, all the crimping part sliders 26, 27U and 27D are raised and lowered, and when the crimping blade 22 is raised and lowered by the cylinder 23, only the crimping part sliders 27U and 27D are raised and lowered. Step 3 and Step 5 can be realized by raising and lowering the former, and Step 4 can be realized by raising and lowering the latter.

  As described above, according to the present embodiment, the pressure base 11 can be kept horizontal by thermocompression bonding in a state where the uneven arrangement is compensated, and the crimping blade is not inclined and the upper and lower guides are not galling. It is possible to provide a highly reliable FPD main crimping apparatus that can reliably perform thermocompression bonding.

  Next, a main crimping apparatus 1 according to a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the uneven arrangement compensation unit 70 is provided on the upper left side of the pressure base 11 and a spring (tensile or compression spring) 71 is used as a means for applying a compensation force. Of course, an air cylinder may be used. The configuration other than the partial arrangement compensation unit 70 is the same as that of the first embodiment.

The eccentric arrangement compensator 70 has a cylindrical tube 72 in which a spring 71 can be housed, a connecting rod 73 in which one end is fixedly connected to the pressure base 11 and the other end is in contact with the tension spring 71 in the tube 72. It consists of.
As already described, the arrangement of the pressure bonding head 20 is determined in advance with respect to the substrate to be processed, and the reaction force R and the compensation force H based on the uneven arrangement can be known in advance. In FIG. 7, since the crimping head 20 is arranged on the right side, a deviation arrangement occurs on the right side. In order to compensate for this, a tension spring 71 is set in the cylinder 72 of the unevenly arranged compensator 70, and a compensation force H is applied upward in the drawing. Unlike FIG. 7, when there is an uneven arrangement on the left side, a compression spring is used as a spring. When a spring is used, the compensation force changes depending on the moving distance of the pressure base 11. Accordingly, the one having a spring constant that can obtain an appropriate compensation force H when the pressure base 11 is in the thermocompression bonding state is selected.

  In the above embodiment, the partial arrangement compensation unit 70 is provided on one side. However, the partial arrangement compensation unit 70 may be provided on both sides, and compensation may be performed using either one of a compression spring and a tension spring.

  Further, by providing a spring in the upper and lower guides 12, the upper and lower guides may have the function of the partial arrangement compensation unit 70 and may be used in combination.

  Furthermore, in the above embodiment, a spring is used as a source for generating the compensation force. However, for example, even when a magnet such as an electromagnet is used for the upper end of the cylinder 72 and the upper portion of the connecting rod 73, the same effect as the spring can be obtained. . In particular, in the case of an electromagnet, the compensation force can be kept constant by adjusting the current in accordance with the moving distance of the pressure base 11.

  Furthermore, the partial arrangement compensation unit may be constituted by a weight that compensates or reduces the partial arrangement. For example, a weight capable of compensating or reducing the uneven arrangement with respect to the arrangement pattern is prepared, and means capable of hanging the weight from the pressure base or placing it on the pressure base is provided on both ends of the pressure base.

  As described above, also in the second embodiment, the pressure base 11 can be kept horizontal by thermocompression bonding in a state where the uneven arrangement is compensated, and the crimping blade is not tilted and the upper and lower guides are not galling. It is possible to provide a highly reliable FPD main crimping apparatus that can reliably perform thermocompression bonding.

  The present invention is applicable to an FPD manufacturing apparatus that requires a relatively long and highly accurate ACF bonding such as a liquid crystal, a PDP, an FPD, and an organic EL and that requires cost reduction by high-speed bonding.

1: Main crimping device 2: Substrate 6: ACF
11: Pressurizing base 12: Vertical guide 20: Crimping head 21: Crimping blade part 22: Crimping blade 31: Lower blade part 32: Lower blade 40, 70: Unbalanced compensation part 41: Supporting air cylinder 50: Pressure base Drive unit 60: Crimp blade moving unit 71: Spring (compression or tension spring) H: Compensation force R: Reaction force

Claims (9)

One or more crimping blade portions each having a crimping blade at a tip, a pressure base that supports the crimping blade portion, and a crimping blade portion moving unit that moves the one or more crimping blade portions along the pressure base. In the main pressure bonding apparatus for pressurizing the FPD board or the printed circuit board with the pressure bonding blade and fixing the mounted component to the FPD board or the printed circuit board,
A compensation mechanism for applying to the pressure base a compensation force that compensates or reduces a reaction force that the pressure blade receives from the FPD board or the printed board during the pressurization and a rotational moment based on the uneven arrangement of the plurality of pressure blade parts; This crimping device is characterized in that.   The main pressure bonding apparatus according to claim 1, wherein the compensation mechanism is provided on at least one of both end sides of the pressure base.   The main pressure bonding apparatus according to claim 2, wherein the compensation mechanism is provided on a lower side of the pressure base.   The main pressure bonding device according to claim 2, wherein the compensation mechanism is provided on an upper side of the pressure base.   The main pressure bonding device according to claim 2, wherein the compensation force is generated by an air cylinder.   The main pressure bonding apparatus according to claim 2, wherein the compensation force is generated by a spring or a magnet.   The main pressure bonding device according to claim 2, wherein the compensation force is generated by a weight. One or more crimping blade parts having a crimping blade at the tip are moved along a pressure base supporting the crimping blade part to determine the arrangement of the crimping blade part, and the FPD board or the printed circuit board is placed with the crimping blade. In the main pressure bonding method of pressurizing and fixing the mounted component to the FPD board or printed board,
Providing the pressure base with a compensation force that compensates or reduces a reaction force that the pressure blade receives from the FPD substrate or the printed circuit board during the pressurization and a rotational moment based on the uneven arrangement of the one or more pressure blade portions. A feature of this crimping method.   9. The main pressure bonding method according to claim 8, wherein the compensation force is generated by an air cylinder.

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