JP2012104608A - Mounting device and mounting method of flexible substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method of a flexible substrate capable of mounting a flexible substrate on a panel by bending without sucking the flexible substrate by suction means regardless of the length thereof.SOLUTION: The mounting device of a flexible substrate comprises a table 12 for holding a panel 1 having one surface on which one end of a flexible substrate 3 is mounted at a marginal part in the previous step, a freely bendable abutting member, i.e. a tape 19, arranged below the flexible substrate 3, bending means, i.e. a bracket 20, a Z table 22 and a Y table 23, for bending the flexible substrate 3 above the panel 1 by moving one end side of the tape 19 above the panel 1 from the side thereof, and a crimp tool 14 which crimps the other end of the flexible substrate 3 to the marginal part of the other surface of the panel 1 with the tape 19 interposed therebetween and mounts the flexible substrate 3.

Description

  The present invention relates to a flexible substrate mounting apparatus and mounting method for mounting a flexible substrate on an electrode portion at an edge of a panel.

  Liquid crystal panels are widely used as display screens for various electronic devices such as personal computers and mobile phones. In addition, touch panels are widely used as input means for these electronic devices.

  In manufacturing processes of various panels such as a liquid crystal panel and a touch panel, a flexible substrate (Flexible Print Circuit, hereinafter referred to as “FPC”) is mounted on electrode portions on both sides of the panel. As a method for mounting a flexible substrate on a panel, a technique for bending and mounting a flexible substrate has been proposed (Patent Document 1).

  In Patent Document 1, as shown in FIG. 2 in particular, one end portion of the FPC is mounted on a first electrode portion provided on an edge portion of one surface of the panel in the previous step. This panel is placed on a stage, where the FPC is bent, and the other end of the FPC is mounted on the second electrode portion provided on the edge of the other surface of the panel by using a crimping tool.

Japanese Patent No. 4468486

  The FPC of Patent Document 1 is substantially T-shaped as shown in the left end view of FIG. 2 and extends outward (Y direction) from the edge of the panel. It extends greatly to both sides (X direction), and the other end electrode portion is provided at both ends of the tip.

  As described above, the extension length of the FPC from the edge of the panel in the Y direction is long, and both end portions of the FPC extend greatly in both sides (X direction). The other end of the FPC or its vicinity is sucked and held by the suction port, the bending jig is turned 180 degrees to bend the FPC, and the other end electrode portion of the FPC is connected to the second surface (upper surface) of the other side of the panel. The electrode part is crimped by a crimping tool via an anisotropic conductive adhesive (hereinafter referred to as “ACF”).

  By the way, in recent years, a touch panel has been proposed in which an FPC having a narrow width (a length extending in the Y direction from the edge of the panel is short) is bonded to both surfaces of the panel. However, in the case of an FPC having a narrow width, since the extension length from the edge of the panel is short, the flexible substrate cannot be sucked and bent by the suction port of a suction means such as a folding jig as in Patent Document 1. Therefore, the technique described in Patent Document 1 cannot be applied to a technique for mounting a narrow FPC on a panel.

  Accordingly, an object of the present invention is to provide a flexible substrate mounting apparatus and mounting method that can be mounted on a panel by folding the FPC without adsorbing it by an adsorbing means regardless of the length of the FPC.

  The present invention is a flexible board mounting apparatus for bending a flexible board having one end mounted on an edge of one surface of a panel and mounting the other end of the flexible board on an edge of the other surface of the panel. A table portion that holds the other surface upward, a bendable contact member disposed below the flexible substrate, and one end of the contact member is moved from the side of the panel to the upper side of the panel. Thus, the bending means for bending the flexible board with the abutting member together with the abutting member and the other end of the flexible board are crimped to the edge of the other surface of the panel via the abutting member. And a crimping tool to be mounted.

  Further, the present invention is a flexible substrate mounting apparatus for bending a flexible substrate having one end mounted on the edge of one surface of the panel and mounting the other end of the flexible substrate on the edge of the other surface of the panel, A table portion that holds the other surface of the panel upward, a bendable abutting member, a banding means for banding the abutting member below the flexible substrate, and one end of the abutting member on the panel side The bending means for bending the flexible substrate together with the abutting member together with the abutting member by the abutting member and the other end of the flexible substrate via the abutting member. And a crimping tool for crimping and mounting to the edge of the other surface of the panel.

  The flexible substrate mounting method of the present invention includes a step of holding a panel having one end of the flexible substrate mounted on an edge of one surface on the table portion with the other surface facing upward, and a lower portion of the flexible substrate. A bending step of bending the flexible substrate together with the abutting member by the abutting member by moving the one end side of the abuttable bending member from the side of the panel to the upper side of the panel by the moving means; And mounting the other end portion of the flexible substrate by crimping the other end portion of the flexible substrate to the edge portion of the other surface of the panel with a crimping tool.

  In the present invention, the FPC is bent together with the contact member by the contact member disposed below the FPC, and the other end is crimped to the edge of the other surface of the panel for mounting. Therefore, the suction means for folding the FPC can be eliminated, and the FPC can be folded and mounted on the panel regardless of the length of the FPC. When the FPC is long, it can be correctly bent at a predetermined position by the bending position defining member.

  Further, since the crimping tool is mounted by crimping the other end to the edge of the other surface of the panel with the contact member in between, it is possible to prevent an adhesive such as ACF from adhering to the crimping tool.

The side view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention The perspective view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention (A) The perspective view of the panel before mounting the other end part of the ground part of the flexible substrate in Embodiment 1 of this invention in the 2nd electrode part of the other surface of a panel (b) Embodiment 1 of this invention The perspective view of the panel after mounting the other end part of the ground part of the flexible substrate in the 2nd electrode part of the other surface of the panel The top view of the flexible substrate in Embodiment 1 of this invention The front view of the bracket in Embodiment 1 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 1 of this invention The perspective view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The fragmentary perspective view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The fragmentary top view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention The partial side view of the mounting apparatus of the flexible substrate in Embodiment 2 of this invention

(Embodiment 1)
1 and 2, a table portion 12 is provided on a base 11 of a flexible substrate mounting apparatus 10. On the table part 12, the panel 1 in which the electrode part of the one end part of the flexible substrate (FPC) 3 was mounted in the previous process is carried. FIG. 3A shows the panel 1. The panel 1 of the first embodiment is a touch panel and is formed by joining two glass plates 1a and 1b. The edge of one surface of the lower first glass plate 1a (the left end of the lower surface in FIG. 3A) is the first electrode portion a, and the FPC3 is formed in the first step on the first electrode portion a. One end of the is mounted.

  FIG. 4 is a plan view of the FPC 3. The planar shape of the FPC 3 is substantially T-shaped, and includes a horizontally long base portion 3a, a land portion 3b on one side of the base portion 3a, a ground portion 3c as an electrode portion on the other side, and a connector portion 3d extending long from the center. It is made up. The tip electrode portion 3d 'of the connector portion 3d is connected to a printed board (not shown). As described above, in the previous step, one end portion (hatched) of the base portion 3a is transparent to the first electrode portion a provided on one edge of the first glass plate 1a. (See FIG. 6). Chips 4, 5, and 6 are mounted on the land portion 3b.

  In the mounting apparatus 10, the ground portion 3c shown in FIG. 3A is bent along the edge of the panel 1 as shown in FIG. 3B, and the other end of the ground portion 3c is second glass. The second electrode portion b at the edge of the other surface of the plate 1b (the upper surface in FIG. 3A) is bonded and mounted via the ACF 9 (see FIG. 6). Since the ground portion 3c does not require high mounting position accuracy, position recognition by a recognition means such as a camera may not be performed.

  In FIG. 2, the mounting apparatus 10 performs a mounting operation on the two left and right panels 1 simultaneously in parallel. Therefore, two left and right table portions 12 on which the panel 1 is placed are provided. An ACF 9 is attached in advance on the second electrode portion b provided on the side of the edge of the other surface of the panel 1. 2 and 3, the description of ACF 9 is omitted.

  The table unit 12 is a movable table, and moves the panel 1 held on the other side upward in the X direction, the Y direction, the Z direction, and the θ direction. In the present invention, the X direction is the direction in which the panel 1 is transported on the production line (in FIG. 2, the arrangement direction of the two table portions 12), and the Y direction is a direction orthogonal to the X direction in the horizontal plane. The Z direction is the vertical direction, and the θ direction is the horizontal rotation direction.

  1 and 2, a lower receiving portion 13 is provided on the side of the table portion 12. A crimping tool 14 is provided above the table portion 12. The crimping tool 14 is horizontally long in the X direction, and pressing portions 14a extend downward from both ends thereof. The pressing part 14 a is heated by a heater 15 built in the crimping tool 14.

  The back surface of the crimping tool 14 is coupled to the Z table 16. As the Z table 16 is driven, the crimping tool 14 moves up and down. That is, the Z table 16 serves as a vertical movement means for the crimping tool 14. The lower receiving part 13 supports the edge part of the panel 1 pressed by the pressing part 14a of the crimping tool 14 from below. The mounting apparatus 10 simultaneously performs mounting work on the two panels 1 on the two left and right table portions 12 by the two left and right pressing portions 14a.

  Next, means for bending the ground portion 3c of the FPC 3 will be described. In FIG. 2, an opening 13 a is formed in the upper part of one side portion of the lower receiving portion 13. A tape 19 as a contact member is passed through the opening 13a. The tape 19 is bendable, preferably has some elasticity, and is made of a heat-resistant tape-like or sheet-like material so that it can withstand the heating by the crimping tool 14. Both are collectively referred to as “sheet shape”.

  As shown in FIG. 2, a bracket 20 as a moving body is provided on the side of the table portion 12. As shown in FIG. 5, the bracket 20 has leg portions 20a on both sides, and a horizontal pin 21 projects from the inner surface of the lower end portion of the leg portion 20a. As shown in the partially enlarged view K and FIG. 3 of FIG. 2, the tape 19 circulates around the upper end portion 13 b of the lower receiving portion 13, and one end portion side thereof is held by the pin 21 of the bracket 20. Therefore, the pin 21 is a holding portion that holds one end of the tape 19. The upper end portion 13b is a lower receiving portion of the edge portion of the panel 1, and also serves as a band adjusting portion of the tape 19 for positioning the tape 19 below the ground portion 3c that is a portion to be bent of the FPC 3. .

  In FIG. 1, the bracket 20 is held by a Z table 22 and a Y table 23. Therefore, the bracket 20 can move in the vertical (Z) direction and the horizontal (Y) direction. In FIG. 2, the Z table 22 and the Y table 23 are omitted.

  2 and 6, the other end portion side of the tape 19 is connected to a string-like body 31. The string-like body 31 is tuned to a pulley 32 provided on the side of the table portion 12, and a weight 33 is attached to the lower end portion of the string-like body 31 as a tension applying means for applying tension to the tape 19. ing. As tension applying means provided on the other end side of the tape 19, a spring or the like can be applied.

  In FIG. 6, the tape 19 is arranged below the FPC 3 and is tuned around the upper end portion 13 b of the lower receiving portion 13 so as to face the lower surface of the FPC 3. Therefore, the upper end portion (adjustment portion) 13 b and the weight 33 serve as an adjustment means for adjusting the tape 19 below the FPC 3.

  The flexible substrate mounting apparatus has the above-described configuration, and the operation will be described next. 6 to 10 show the mounting operations in order. The panel 1 on which the FPC 3 is mounted in the previous process is carried onto the table unit 12 as shown in FIGS. FIG. 6 shows the state at this time. One end of the ground portion 3c of the FPC 3 is mounted on the first electrode portion a on one surface of the panel 1 (the lower surface in FIG. 6) through an ACF 8 as an adhesive in the previous step. An ACF 9 is affixed in advance on the second electrode portion b on the other surface (the upper surface in FIG. 6). ACFs 8 and 9 are transparent bodies. One end of the tape 19 is attached to the pin 21 of the leg 20a of the bracket 20, and a weight 33 is connected to the other end. The tape 19 circulates around the upper end portion 13 a of the lower receiving portion 13, and the tape 19 on the upper end portion 13 a is positioned below the ground portion 3 c that is a bending target portion of the FPC 3.

  Next, the table portion 12 is driven to lower the panel 1 (see the arrow N1 in FIG. 6), and the ground portion 3c is positioned on the tape 19 on the upper end portion 13b as shown in FIG. Next, the Z table 22 (FIG. 1) is driven so that the pin 21 of the bracket 20 is positioned above the panel 1 to slightly raise the bracket 20 (arrow N2), and the Y table 23 (FIG. 1) is driven. Then, the bracket 20 is moved upward from the side of the panel 1 (arrow N3). By this operation, the tape 19 is also moved from the solid line position in FIG. 7 to the chain line position. Accordingly, the ground portion 3c on the tape 19 is bent along the front edge of the panel 1 by this movement of the tape 19 and is bent together with the tape 19 above the other surface (upper surface) of the panel 1 by the tape 19 (the chain line in FIG. 7). (Refer to the earth part 3c shown by). Therefore, the bracket 20 as the moving body and the Z table 22 and the Y table 23 as the moving means are the bending means of the FPC 3. If the initial position of the pin 21 is set higher than the upper surface of the panel 1, the Z table 22 can be dispensed with.

  Next, as shown in FIG. 8, the crimping tool 14 is lowered (arrow N4), and the other end portion of the ground portion 3c is pressed through the tape 19 by the pressing portion 14a. The pressing portion 14 a is heated by the heater 15, and therefore, the other end portion of the ground portion 3 c is mounted by being crimped to the second electrode portion b via the ACF 9. In this case, since the pressing portion 14a presses the ground portion 3c with the tape 19 in between, the ACF 9 can be prevented from adhering to the lower surface of the pressing portion 14a. Note that this pressure bonding may be either temporary pressure bonding or main pressure bonding.

  If the ground part 3c is crimped and mounted on the second electrode part b as described above, the crimping tool 14 moves up (arrow N5) as shown in FIG. Next, the bracket 20, the table portion 12 and the like operate in the opposite direction to the previous one and return to the initial position (position shown in FIG. 6) as shown in FIG. Therefore, the panel 1 is unloaded from the table unit 12 to the next process by unillustrated unloading means, the next panel 1 is loaded onto the table unit 12, and the above operation is repeated. The mounting operation described above is performed in parallel on the two panels 1 on the two left and right table portions 12. FIG. 3B shows the panel 1 in which the ground portion 3c is bent and mounted as described above.

  When the above-described mounting operation is repeated, the tape 19 becomes increasingly dirty due to the ACF 9 adhering thereto. In that case, if the moving stroke length of the bracket 20 in the direction of arrow N3 (FIG. 7) is changed, a new part of the tape 19 is fed out to the part of the ground portion 3c. Alternatively, if the pin 21 of the bracket 20 is used as the winding shaft of the tape 19 and the ACF 9 adheres to the tape 19 and becomes dirty, the winding shaft is rotated manually or by the power of a motor or the like to wind the tape 19. A new part of the tape 19 may be fed out to the part of the ground part 3c. In order to feed out a new part of the tape in this way, the tape 19 is preferably longer.

(Embodiment 2)
11 is a perspective view of a flexible substrate mounting apparatus according to Embodiment 2 of the present invention, FIG. 12 is a partial perspective view thereof, FIG. 13 is a partial plan view thereof, and FIGS. 14 to 18 are partial side views sequentially illustrating the same operation. It is. The same elements as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  11 to 13, the edge portion of the panel 60 is supported by the lower receiving portion 40. The panel 60 is a liquid crystal panel and is formed by joining two glass plates 60a and 60b. The lower receiving portion 40 is a rod-shaped body having a rectangular cross section, and is made of a transparent material such as transparent glass. A camera 41 as a recognition unit is provided below the lower receiving part 40. Further, a banding portion 42 of the tape 19 is provided on the side of the lower receiving portion 40. The tape 19 having one end held by the pin 21 of the bracket 20 circulates around the banding portion 42 and is connected to the weight 33 on the other end side as in the first embodiment. Therefore, the tape 19 is tuned below the FPC 43 as in the first embodiment.

  One end of the FPC 43 is mounted on the first electrode portion a (FIG. 14) on the lower surface of the panel 60 in the previous step. In FIG. 13, the length L2 in the Y direction in which the FPC 43 extends from the panel 60 is longer than the same length L1 of the ground portion 3c of the first embodiment (see FIG. 3A). Position reference marks M <b> 1 and M <b> 2 are formed at appropriate positions such as the upper surface corner of the panel 60 and the upper surface corner of the FPC 43.

  12 and 13, a cylinder 51 as an actuator is provided on the side of the FPC 43 mounted on the panel 1. The rod 51 a of the cylinder 51 protrudes and sinks on the upper surface of the FPC 43. The rod 51a is a bending position defining member of the FPC 43. The cylinder 51 is provided on a movable table 52 as movable means, and moves in the Y direction (the direction in which the FPC 43 protrudes from the panel 60) by driving the movable table 52, and moves up and down in the Z direction. Thus, the position of the rod 51a in the same direction is changed by changing the position of the cylinder 51 in the Y direction. The cylinder 51 and the movable table 52 serve as FPC bending position defining means 50.

  Next, the operation will be described. 14 to 18 show the order of operation. In FIG. 14, the electrode part of the one end part of FPC43 is mounted in the 1st electrode part a of the edge part of the 1st surface of the 1st glass plate 60a in the front process. In FIG. 14, the position of the position reference mark M <b> 1 on the panel 60 is recognized by the camera 41 through the transparent lower receiving part 40. Next, the table portion 12 is driven to lower the panel 60 (arrow N11), and the panel 60 is landed on the lower receiving portion 40 (see the panel 1 indicated by a chain line in FIG. 14).

  Next, as shown in FIG. 15, the rod 51 a of the cylinder 51 is protruded from the side of the FPC 43 onto the upper surface thereof. Next, the movable table 52 is driven to lower the rod 51a of the cylinder 51 (arrow N12), and the FPC 43 is sandwiched from above and below by the tape 19 and the rod 51a (see the rod 51a indicated by the chain line in FIG. 15). Next, as shown in FIG. 16, the bracket 20 is slightly raised (arrow N13), and then moved upward from the side of the panel 60 (arrow N14). By this operation, the FPC 43 is bent together with the tape 19 by the tape 19, and the bending position at this time is defined by the rod 51a.

  In the state indicated by the chain line in FIG. 16, the camera 41 recognizes the position reference mark M <b> 2 of the FPC 43. Then, the amount of positional deviation of the position reference mark M2 is calculated by a control unit (not shown). If this amount of positional deviation is greater than or equal to the allowable value, the table unit 12 is driven to move the panel 1 horizontally to correct the positional deviation. Note that the amount of positional deviation is generally very small (for example, about 10 μm), and can be corrected by slightly moving the table portion 12 horizontally. Of course, if the amount of positional deviation is less than the allowable value, there is no need to perform position correction.

  Next, as shown in FIG. 17, the crimping tool 14 is lowered (arrow N15), and the FPC 43 is mounted on the second electrode portion on the other surface of the panel 60 by the pressing portion 14a with the tape 19 interposed therebetween. . Next, as shown in FIG. 18, the rod 51a is retracted to the side of the FPC 43, and the crimping tool 14 is raised (arrow N16). Next, the bracket 20, the table portion 12, etc. operate in the opposite direction to the previous one and return to the initial position (position shown in FIG. 16).

  As described above, in the second embodiment, the extension length L2 of the FPC 43 from the panel 60 is long, and the bending position is defined by the rod 51a. Therefore, if the folding position defining means 50 is provided, it can be bent at a predetermined position and mounted on the electrode portion of the panel regardless of the length of the FPC. According to the second embodiment, the mounting according to the first embodiment can be implemented, but in that case, the bending position defining means 50 and the camera 41 do not need to be used.

  Note that there are various dimensions, planar shapes, etc. of the FPC that is the mounting target, and therefore, a means suitable for the FPC or the like is applied to the position recognition or misalignment correction performed by the recognition means performed before the crimping by the crimping tool. Is done.

  In the present invention, the FPC is bent together with the contact member by the contact member disposed below the FPC, and the other end is crimped to the edge of the other surface of the panel for mounting. Therefore, the suction means for folding the FPC is not required, and the FPC can be folded and mounted on the panel regardless of the length of the FPC. Further, since the crimping tool is mounted by crimping the other end to the edge of the other surface of the panel with the contact member in between, it is possible to prevent an adhesive such as ACF from adhering to the crimping tool. Therefore, the present invention is particularly useful for assembling liquid crystal panels and touch panels.

1, 60 Panel 1a, 1b, 60a, 60b Glass plate 3, 43 FPC (flexible substrate)
8, 9 Anisotropic conductive agent (ACF adhesive)
DESCRIPTION OF SYMBOLS 10 Mounting device of flexible substrate 12 Table part 13, 40 Bottom receiving part 13b, 42 Adjusting part (guide part)
14 Crimping tool 14a Pressing part 19 Tape (contact member)
20 Bracket (moving body, bending means)
21 pin (holding part)
22 Z table (moving means, bending means)
23 Y table (moving means, bending means)
33 weight (tensioning means)
50 Bending position defining means 51 Cylinder (actuator)
51a Rod (Bending position regulating member)
52 Movable table (movable means)

Claims (17)

A flexible board mounting apparatus that bends a flexible board having one end mounted on one edge of the panel and mounts the other end of the flexible board on the other edge of the panel,
A table portion that holds the other surface of the panel facing upward, a bendable abutting member disposed below the flexible substrate, and one end of the abutting member moved from the side of the panel to the upper side of the panel By bending the flexible substrate with the contact member together with the contact member, and bending the other end of the flexible substrate to the edge of the other surface of the panel with the contact member interposed therebetween. A mounting apparatus for a flexible board, comprising: a crimping tool for mounting in a flexible manner.   The said bending means comprises a moving body having a holding portion for holding one end of the abutting member, and a moving means for moving the moving body upward from the side of the panel. The mounting apparatus of the flexible substrate as described.   The apparatus for mounting a flexible substrate according to claim 1, wherein tension applying means for applying tension to the contact member is provided on the other end side of the contact member.   The apparatus for mounting a flexible substrate according to claim 1, further comprising a bending position defining member that is positioned on an upper surface of the flexible substrate and defines a bending position of the flexible substrate.   5. The apparatus for mounting a flexible substrate according to claim 4, wherein the bending position defining member is a rod of an actuator projecting and sinking on an upper surface of the flexible substrate.   5. The flexible board mounting according to claim 4, further comprising movable means for moving the bending position defining member in a protruding direction of the flexible board from the panel, wherein the position of the bending position defining member can be changed. apparatus. A flexible board mounting apparatus that bends a flexible board having one end mounted on one edge of the panel and mounts the other end of the flexible board on the other edge of the panel,
A table portion that holds the other surface of the panel upward, a bendable abutting member, a banding means for banding the abutting member below the flexible substrate, and one end of the abutting member on the panel side The bending means for bending the flexible substrate together with the abutting member together with the abutting member by the abutting member and the other end of the flexible substrate via the abutting member. A flexible board mounting apparatus comprising: a crimping tool for crimping and mounting to an edge of the other surface of the panel.   The said bending means comprises a moving body having a holding portion for holding one end of the abutting member, and a moving means for moving the moving body upward from the side of the panel. The mounting apparatus of the flexible substrate as described.   The banding means is provided between a tension applying means for applying tension to the other end side of the contact member, and between the holding section and the tension applying means, and the contact member is positioned below the flexible substrate. The apparatus for mounting a flexible substrate according to claim 7, further comprising: a band adjusting unit that adjusts the contact member.   The flexible substrate mounting apparatus according to claim 7, further comprising a bending position defining member that is positioned on an upper surface of the flexible substrate and defines a bending position of the flexible substrate.   The apparatus for mounting a flexible substrate according to claim 10, wherein the bending position defining member is a rod of an actuator projecting and sinking on an upper surface of the flexible substrate.   The flexible board mounting according to claim 10, further comprising movable means for moving the bending position defining member in a protruding direction of the flexible board from the panel, wherein the position of the bending position defining member can be changed. apparatus.   A process in which a panel having one end of a flexible board mounted on the edge of one surface is held on the table with the other side facing upward, and one end of the bendable contact member disposed below the flexible board A bending process of bending the flexible substrate together with the contact member together with the contact member by moving the panel upward from the side of the panel by the moving means, and the contact member at the other end of the flexible substrate. A method of mounting a flexible substrate, comprising: a step of crimping and mounting on an edge of the other surface of the panel with a crimping tool.   The flexible substrate mounting method according to claim 13, wherein a tension is applied to the other end portion side of the contact member by a tension applying unit, and the movement is performed on the one end portion side of the contact member.   The method for mounting a flexible substrate according to claim 13 or 14, wherein, in the bending step, a bending position of the flexible substrate is defined by a bending position defining member provided on a side of the table portion.   The method for mounting a flexible substrate according to claim 15, wherein the bending position defining member is a rod of an actuator that projects and sinks on an upper surface of the flexible substrate.   16. The mounting of a flexible substrate according to claim 15, further comprising movable means for moving the bending position defining member in a protruding direction of the flexible substrate from the panel so that the position of the bending position defining member can be changed. Method.

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