JP5370280B2 - Tape sticking device and tape sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape applying device and method that can efficiently perform a tape releasing operation, and improve productivity while eliminating waste of a conducting tape. <P>SOLUTION: The tape applying method cuts a tape material 4 into individual pieces of conducting tapes 4b* and applies them to a plurality of application portions. The method selectively performs a precision-prioritized mode and a tact-prioritized mode. The precision-prioritized mode recurrently performs an operation for making a cut 4c on the tape material 4 by a cut part 7 and forming the individual pieces of the conducting tape 4b*, and an operation for applying the individual pieces of the conducting tape 4b*. The tact-prioritized mode continuously performs an operation for sequentially applying the individual pieces of the conducting tapes 4b* to each application portion of a substrate 20 while intermittently feeding the tape material 4 in a feed direction after the tape material 4 on which the number of necessary individual pieces of the conducting tapes 4b is preformed in sync with a substrate conveyance operation by which the substrate 20 is carried in or out. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a tape attaching device and a tape attaching method for attaching a tape for mounting a component on a substrate such as a display panel.

  In component mounting in which components such as IC, TCP (Tape Carrier Package), COF (Chip on Film), and FPC (Flexible Printed Circuit) are mounted on the side edge of a display panel (hereinafter referred to as a substrate) Prior to mounting operation, an anisotropic conductive tape (ACF) (hereinafter referred to as conductive tape) as an adhesive containing conductive particles is attached to an electrode portion provided on a side edge of a substrate. Pasting work is executed.

  This tape affixing operation is performed by pressing a tape member obtained by laminating a conductive tape on a protective tape called a separator against the side edge of the substrate by the pressure-bonding head of the affixing unit. It is pasted. And after affixing, the peeling process which peels a separator from a conductive tape is performed (for example, refer patent document 1). In the prior art shown in this patent document, only the separator is peeled by moving the peeling member interposed between the attached conductive tape and the separator in the horizontal direction.

JP 2001-294361 A

  In recent years, with the enlargement of television screens, the size of display panels used for this purpose tends to increase both vertically and horizontally. For this reason, the range to which the above-mentioned conductive tape is affixed in the assembly work of such a large display panel also increases. However, in the display panel, the electrode portion for connecting the components is not necessarily formed in the entire range of the side edge portion of the display panel, and the electrode portion having a predetermined length is often formed at intervals. When such a display panel is to be attached to the conductive tape, if a single piece of conductive tape is applied to the entire range of the side edges, the conductive tape will be applied to the originally unnecessary range. Cause waste.

  In order to eliminate such waste, only the component connection range in which the electrode portion is formed on the side edge portion of the display panel may be set as the object to be affixed with the conductive tape. However, when adopting such a tape application form, it is necessary to repeat the tape application operation and the tape peeling operation multiple times, so it is inevitable that the overall work tact time is delayed, and productivity There is a problem that decreases. For this reason, it has been desired to improve the working efficiency of the tape peeling operation while eliminating the waste of the conductive tape.

  Then, an object of this invention is to provide the tape sticking apparatus and tape sticking method which can perform tape peeling operation | movement efficiently, and can improve productivity, eliminating the waste of a conductive tape.

  The tape applicator of the present invention is a tape applicator that cuts an anisotropic conductive tape into individual conductive tapes of a predetermined application length and applies them to a plurality of application sites formed on the side edges of the substrate. The substrate holding table for holding the substrate and the tape member formed by laminating the anisotropic conductive tape on the separator are guided from the tape supply unit to the side portion of the substrate along the longitudinal direction thereof. In addition, a tape capable of performing a rewinding operation in which the anisotropic conductive tape is affixed to the affixing portion and the tape member which is a single unit of the separator is fed to the tape collecting unit side, and the tape member is returned to the side opposite to the feeding direction. The tape member is pressed by a pressure-bonding head to the guide member and the substrate held by the substrate holding table and the side edge portion of which is received by the receiving portion. A sticking means for sticking the tape to the sticking site, and the individual pieces that are arranged on the upstream side of the sticking means at intervals corresponding to the sticking length in the sticking site with respect to the anisotropic conductive tape In a state where the relative position of the cut part for forming the conductive tape, the peeling part for peeling the separator from the anisotropic conductive tape stuck by the sticking means, and the sticking means and the peeling part are maintained. Relative movement means for relatively moving in the horizontal direction with respect to the substrate holding table, and a control unit for controlling the relative movement means, tape guide means, cut part, sticking means and peeling part, the control part, Synchronizing with the relative movement by the relative movement means, the tape guide means performs the tape member feeding operation, and further the movement for forming the individual conductive tape And an accuracy priority mode in which the operation of pasting the individual conductive tape is repeated for each pasting part, and substrate transport for unloading the pasted substrate from the substrate holding table and bringing a new substrate into the substrate holding table. In synchronization with the operation, a necessary number of individual conductive tapes to be attached to the new substrate are formed by making a cut in the tape member, and the tape member after the cut is formed is rewound once. After that, while the tape member is intermittently fed in the feeding direction, the tact priority mode in which the operation of successively sticking the individual conductive tapes to the respective pasting portions of the substrate is performed selectively.

  In the tape attaching method of the present invention, a substrate holding table for holding a substrate and a tape member in which an anisotropic conductive tape is laminated on a separator are provided from the tape supply portion to the side edge portion of the substrate along the longitudinal direction. The tape member that is guided to the affixed part and the anisotropic conductive tape is affixed to the affixed part and becomes a single unit of the separator is fed to the tape collecting part side, and the tape member is further returned to the side opposite to the feeding direction. A tape guide means capable of operation, and the tape member is pressed by a pressure-bonding head onto the substrate held by the substrate holding table and the side edge portion of which is received by a lower receiving portion, to thereby apply the anisotropic conductive tape to the substrate. Affixing means for affixing to the affixing part, and corresponding to the affixing length in the affixing part for the anisotropic conductive tape disposed upstream of the affixing means A cut part for forming the individual conductive tape by cutting at intervals, a peeling part for peeling the separator from the anisotropic conductive tape stuck by the sticking means, the sticking means and the peeling part, Relative movement means for moving the substrate relative to the substrate holding table in a horizontal direction while holding the relative positions of each other, and a control unit for controlling the relative movement means, tape guiding means, cutting part, attaching means, and peeling part The tape application method comprises cutting a anisotropic conductive tape into individual conductive tapes of a predetermined application length and attaching them to a plurality of application sites formed on the side edges of the substrate. And affixing the individual conductive tape to the affixing part, and raising the pressure-bonding head, and then driving the relative movement means to apply the affixing means. The tape guide means is driven and the tape member is fed while moving the peeling portion relative to the substrate holding table integrally, so that the pressure bonding head is aligned with the next application site. The tape guide in synchronism with the relative movement by the relative movement means, and a moving step of peeling the separator from the anisotropic conductive tape affixed to the one application site by the peeling part in the relative movement process. A tape member feeding operation by means, and further, an accuracy priority mode in which the operation for forming the individual conductive tape and the operation for pasting the individual conductive tape are repeated for each pasting part, and the pasting after the pasting The tape unit is synchronized with a substrate transfer operation for unloading a substrate from the substrate holding table and loading a new substrate into the substrate holding table. A necessary number of individual conductive tapes to be affixed to the new substrate are formed by making a cut in the material, and the tape member after the cut is formed is rewound and then the tape member is fed in the feed direction. While being intermittently fed, the tact priority mode in which the operation of successively sticking the individual conductive tapes to the respective pasting portions of the substrate is performed selectively.

According to the present invention, the accuracy priority mode in which the operation of forming the individual conductive tape and the operation of applying the individual conductive tape is repeated for each application site, and the substrate conveyance for carrying the substrate in and out of the substrate holding table. Synchronously with the operation, by forming a cut in the tape member, the necessary number of individual conductive tapes to be affixed to a new substrate is formed, and after the tape member after the cut is formed, the tape member is rewound once. Eliminate waste of conductive tape by selectively performing the tact priority mode in which the operation of successively applying individual conductive tape to each application part of the substrate is performed while intermittently feeding the tape member in the feed direction. performed efficiently tape peeling operation while, Ru can improve productivity.

The front view of the tape sticking apparatus of one embodiment of this invention The side view of the tape sticking apparatus of one embodiment of this invention Configuration and function explanatory diagram of the cut portion in the tape applicator of one embodiment of the present invention Explanatory drawing of the sticking length of the anisotropic conductive tape in the board | substrate used as the object of the tape sticking apparatus of one embodiment of this invention Process explanatory drawing of the tape sticking work operation by the precision priority mode in the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking work operation by the precision priority mode in the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking work operation by the tact priority mode in the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking work operation by the tact priority mode in the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking work operation by the tact priority mode in the tape sticking method of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the tape sticking apparatus 1 is demonstrated with reference to FIG. 1, FIG. The tape applicator 1 is an anisotropy for joining a component to a side edge and conducting the component to an electrode portion in a component mounting apparatus that mounts a component such as a driver on a side edge of a substrate such as a display panel. Conductive tape (hereinafter simply referred to as “conductive tape”) is cut into individual conductive tapes having a predetermined application length prior to component mounting operation, and a plurality of attachments formed on the side edges of the substrate. It has a function to be attached to a part.

  1 and 2, the tape applicator 1 has a configuration in which a substrate positioning unit 3 for positioning a substrate to be attached is disposed below an attaching mechanism 2 having a function of supplying and attaching a conductive tape. Yes. The affixing mechanism 2 is mainly composed of a vertical flat base plate 2a that is movable in the X direction by an affixing part moving mechanism 2b, and a tape supply reel 5 is disposed on the upper part of the base plate 2a. The tape supply reel 5 winds and stores a tape member 4 having a structure in which a conductive tape 4b is laminated on a separator 4a, and is driven to rotate by a reel drive mechanism 5a (see FIG. 2) disposed on the back surface of the base plate 2a. The

  By driving the reel drive mechanism 5a, the tape supply reel 5 rotates in the forward and reverse directions (arrow a), and the tape member 4 wound and unwound is fed and unwound. Around the tension roller 6a of the applying mechanism 6, it is guided downward (arrow b). The tension applying mechanism 6 has a function of applying a predetermined tension to the tape member 4 so that the fed tape member 4 does not sag. The tape supply reel 5 and the reel drive mechanism 5 a constitute a tape supply unit that supplies the tape member 4.

  A first guide roller 8 and a second guide roller 9 are disposed in a horizontal position on both sides of the lower end portion of the base plate 2a, and further above the second guide roller 9, a tape feeding mechanism 10 and a tape collecting portion 13 are disposed. Is arranged. The horizontal portion between the first guide roller 8 and the second guide roller 9 serves as an affixing work position for affixing the conductive tape 4b to the affixing portion 23 (see FIG. 4) of the substrate 20 by a later-described affixing means. The tape member 4 that has been fed out from the supply reel 5 and passed through the tension applying mechanism 6 is guided in a horizontal direction with the conductive tape 4b facing downward around the first guide roller 8, and the tape member 4 in the attaching work position. Of these, only the conductive tape 4 b on the lower surface side is attached to the attaching portion 23 of the substrate 20.

  Then, the tape member 4 in which the conductive tape 4b is pasted on the pasting portion 23 of the substrate 20 and becomes only the separator 4a is guided upward by the tape feeding mechanism 10 around the second guide roller 9 and by the tape collecting unit 13. Collected. The tape feeding mechanism 10 includes a driving roller 11 and an idle roller 12 that sandwich the separator 4a and feed in both forward and reverse directions (arrow c). The driving roller 11 is a roller driving mechanism 11a disposed on the back side of the base plate 2a. (See FIG. 2). That is, by switching the rotation direction of the tape supply reel 5 and the tape feed method of the tape feed mechanism 10, the tape feed 4 sends the tape member 4 from the tape supply reel 5 to the tape collection unit 13, and the tape supply reel from the tape collection unit 13 side. Rewinding operation for returning the tape member 4 to 5 is possible.

  The tape supply reel 5, the tape feeding mechanism 10, the first guide roller 8, and the second guide roller 9 are formed by connecting the tape member 4 formed by laminating the conductive tape 4b to the separator 4a from the tape supply portion to the side edge portion 20a of the substrate 20. To the affixing part 23 provided along the longitudinal direction thereof, and the tape member 4 in which the conductive tape 4b is affixed to the affixing part 23 of the substrate 20 and becomes a single unit of the separator 4a is sent to the tape recovery unit 13 side. Further, it is a tape guiding means capable of a rewinding operation for returning the tape member 4 to the side opposite to the feeding direction.

  A cut portion 7 is disposed on the downstream side of the first guide roller 8. The cutting part 7 has a function of cutting only the conductive tape 4b in the tape member 4 by sandwiching the tape member 4 between the receiving member 7c contacting the upper separator 4a and the cutter blade 7b attached to the blade holder 7a. Have. Thereby, the cut | interruption 4c which divides the range of the electrically conductive tape 4b stuck in one tape sticking operation | movement, ie, the sticking length, is formed. Here, with reference to FIG. 3, the structure and function of the cut part 7 are demonstrated.

  As shown in FIG. 3A, the cut portion 7 has a configuration in which a moving opening / closing blade mechanism 33 driven by an air cylinder 31 is disposed on the base portion 30. A coupling block 32 is coupled to the rod 31 a of the air cylinder 31, and a movable opening / closing blade mechanism 33 is coupled to the coupling block 32 via a bent link member 37. The movable opening / closing blade mechanism 33 is coupled with a receiving member 7c and a blade holder 7a on the upper and lower portions of a moving block 34, which is guided by a guide rail 35 disposed horizontally on the base portion 30 and reciprocates in the Y direction. It has become the composition.

  A central portion of the link member 37 is rotatably supported by the moving block 34 via a pin 37b, one end of the link member 37 is connected to the coupling block 32 via a pin 37a, and the other end is provided with a pin 37c. Via the receiving member 7c. Further, the link member 37 is urged clockwise by the tension spring 36. A stopper 38 is provided at the left end of the base portion 30 to restrict the advance position of the moving block 34 in the Y direction. In a state in which the cut portion 7 is disposed in the pasting mechanism 2, the tape member 4 to be cut is positioned outside the moving opening / closing blade mechanism 33 and is at an intermediate height between the receiving member 7c and the cutter blade 7b.

  In this state, the air cylinder 31 is driven to project the rod 31a (arrow f), so that the movable opening / closing blade mechanism 33 is first moved through the coupling block 32 and the link member 37 as shown in FIG. Advance in the direction (arrow g). When the rod 31a protrudes by a predetermined length, the distal end portion of the moving block 34 comes into contact with the stopper 38, whereby the advancement of the moving opening / closing blade mechanism 33 in the Y direction is stopped. In this state, the tape member 4 to be cut is positioned between the cutter blade 7b mounted on the blade holder 7a and the receiving member 7c.

  Thereafter, as shown in FIG. 3C, the rod 31a further protrudes (arrow h), whereby the link member 37 coupled to the coupling block 32 resists the urging force of the tension spring 36. And the receiving member 7c is pushed downward via the pin 37c (arrow i). Thereby, the tape member 4 is pushed down from above by the receiving member 7c, and is sandwiched between the cutter blade 7b, and only the conductive tape 4b is cut by the cutter blade 7b, thereby forming a cut 4c.

  That is, the cut part 7 cuts the cuts 4c at intervals corresponding to the sticking length L (see FIG. 4B) at the sticking part 23 of the substrate 20 to the conductive tape 4b. 6). The cut 4c corresponds to the sticking start position S of the individual conductive tape 4b * that is stuck individually. In the tape sticking operation, the sticking start position S is aligned with the sticking start end 23a of the sticking part 23. (See FIG. 5).

  A pressure-bonding head 15 that is moved up and down by a lifting mechanism 14 is disposed above the feeding path in the horizontal direction (X direction) of the tape member 4 between the first guide roller 8 and the second guide roller 9. The above-described cut portion 7 is arranged so that the cut 4c is formed at the upstream side end portion 15a of the crimping head 15. A lower receiving portion 22 is disposed below the pressure bonding head 15 so as to face the pressure bonding head 15, and the substrate holding table 19 is moved by the substrate moving mechanism 18 to the back side in the Y direction of the lower receiving portion 22. A substrate positioning unit 3 having a configuration to be configured is disposed. The substrate holding table 19 holds the substrate 20 to be attached. As shown in FIG. 2, the substrate 20 has a structure in which two glass substrates are bonded to each other, and a side edge portion 20 a where the lower glass substrate is partially exposed is shown by arrows AA. As described above, a plurality (three in the present embodiment) of electrode portions 21 each including a plurality of terminals 21a for component connection are formed at predetermined intervals along the longitudinal direction of the side edge portion 20a.

  The substrate moving mechanism 18 is configured by stacking an X-axis table 18X, a Y-axis table 18Y, and a Zθ-axis table 18Zθ from below, and a substrate holding table 19 is coupled to the upper surface of the Zθ-axis table 18Zθ. By driving the substrate moving mechanism 18, the substrate holding table 19 holding the substrate 20 moves in the X direction, the Y direction, the Z direction, and the θ direction. Thereby, the sticking site | part 23 of the side edge part 20a of the board | substrate 20 can be positioned in the sticking operation position by the crimping | compression-bonding head 15. FIG.

  That is, the side edge 20a of the substrate 20 is moved in the Y direction by the Y-axis table 18Y (arrow d) and is positioned below the crimping head 15, and the side edge 20a is lowered by the Zθ-axis table 18Zθ (arrow e). Thus, the back surface of the side edge portion 20 a is received by the lower receiving surface of the upper end surface of the lower receiving portion 22. Then, by driving the X-axis table 18X in a state where the back surface of the side edge portion 20a is separated from the bottom surface of the upper end surface of the bottom portion 22, the side edge portion 20a of the substrate 20 moves in the X direction. The affixing site 23 set along the side edge 20a can be opposed to the crimping head 15. That is, the substrate moving mechanism 18 moves the substrate holding table 19 in the X direction along at least the side edge portion 20a of the substrate 20. In addition, the receiving operation by the contact between the back surface of the side edge portion 20a of the substrate 20 and the receiving surface of the upper end surface of the receiving portion 22, the back surface of the side edge portion 20a and the receiving surface of the upper end surface of the receiving portion 22 The separation operation may be performed by moving the support part 22 in the vertical direction by making the support part 22 movable in the vertical direction.

  In the tape affixing operation by the pressure-bonding head 15, the pressure-sensitive head 15 is lowered by the elevating mechanism 14 with the tape member 4 having the conductive tape 4b to be affixed on the lower surface side positioned above the side edge 20a. While pressing the member 4 to the application part of the side edge part 20a with a predetermined load, the tape member 4 is heated by the heater 16 provided in the crimping | compression-bonding head 15. FIG. Accordingly, the individual conductive tape 4b * is attached so as to cover the electrode portion 21. A camera 25 is mounted on the side edge of the base plate 2a with the imaging direction facing downward. The camera 25 images the individual conductive tape 4b * after being attached to the electrode unit 21 from above. By recognizing this imaging result, the quality of the pasting result of the individual conductive tape 4b * is checked.

  Here, with reference to FIG. 4, the relationship between the pressing length of the crimping head 15 and the pasting length of the pasting part of the board | substrate 20 is demonstrated. As shown in FIG. 4A, a pressing head 15 having a pressing length B for pressing the tape member 4 is attached to the lifting mechanism 14 shown in the present embodiment. And as shown in FIG.4 (b), the arrangement | sequence length of the electrode part 21 in the side edge part 20a of the board | substrate 20 used as a sticking object, ie, the sticking length L of the sticking site | part 23 of the electrically conductive tape 4b in the board | substrate 20, is crimping | bonding. It is somewhat shorter than the pressing length B of the head 15, and the entire range of one piece conductive tape 4b * can be covered by a single pressing operation by the crimping head 15.

  And in this Embodiment, by pressing the crimping | compression-bonding head 15 with respect to the 1st press position P1, the 2nd press position P2, and the 3rd press position P3 corresponding to each of the three electrode parts 21. Then, the individual conductive tapes 4b * are sequentially pasted to the respective pasting portions 23. The elevating mechanism 14 and the pressure bonding head 15 are provided with the tape member 4 in which the conductive tape 4b is laminated on the separator 4a with respect to the substrate 20 held by the substrate holding table 19 and the side edge portion 20a is received by the lower receiving portion 22. An affixing means for affixing the individual conductive tape 4b * to the affixing portion 23 of the substrate 20 by being pressed by the crimping head 15 is configured.

  In FIG. 1, the peeling part 17 is arrange | positioned by the side of the center side of the 2nd guide roller 9 in the fixing position of the sticking mechanism 2, and the relative position of the peeling part 17 and the above-mentioned sticking means is always. Kept the same. The peeling portion 17 includes two peeling rollers, a first peeling roller 17a located on the lower surface side of the separator 4a fed in the horizontal direction, and a second peeling roller 17b located on the upper surface side of the separator 4a. The separator 4a is peeled off from the individual conductive tape 4b * attached by the means.

  That is, as shown in FIG. 6, in the state where the first peeling roller 17a is positioned between the individual conductive tape 4b * attached to the side edge 20a of the substrate 20 and the separator 4a, the attaching part moving mechanism 2b is moved. The first peeling roller 17a enters the interface between the conductive tape 4b and the separator 4a of the tape member 4 by driving and horizontally moving the peeling portion 17 together with the base plate 2a in the X direction relative to the substrate 20. The separator 4a is peeled off from the individual conductive tape 4b * attached to the side edge 20a of the substrate 20. The second peeling roller 17b can freely move up and down at the peeling portion 17, and the tape member 4 on which the conductive tape 4b pressed against the side edge portion 20a of the substrate 20 is laminated at the time of the tape affixing operation by the pressure-bonding head 15. The second peeling roller 17b can be moved up and down together with the pressure bonding head 15.

  In this peeling operation, by feeding the tape member 4 in synchronization with the horizontal movement of the peeling portion 17 by the tape feeding mechanism 10, the separated separator 4a can be recovered without causing slack in the peeled separator 4a. it can. Therefore, the affixing part moving mechanism 2b is a relative moving means for relatively moving the affixing means and the peeling part 17 in the horizontal direction with respect to the substrate holding table 19 while maintaining the relative positions thereof.

  In the attaching mechanism 2, instead of horizontally moving the base plate 2a by the attaching portion moving mechanism 2b, the substrate holding table 19 is horizontally moved in the X direction by the substrate moving mechanism 18, whereby the attaching means and the peeling portion 17 described above are used. May be moved relative to the substrate holding table 19 in the horizontal direction while maintaining their relative positions. In this case, the substrate moving mechanism 18 constitutes the aforementioned relative moving means.

  Operations of the affixing part moving mechanism 2b, the cutting part 7, the tape feeding mechanism 10, the elevating mechanism 14, the crimping head 15, the peeling part 17, and the substrate moving mechanism 18 are controlled by the control part 24. At this time, the control unit 24 performs the tape member feeding operation by the tape feeding mechanism 10 in synchronization with the relative movement between the substrate holding table 19 and the peeling unit 17 by the pasting unit moving mechanism 2b, whereby the tape peeling described above is performed. As a result, the tape attaching operation described below is executed. Hereinafter, a tape application method in which the conductive tape 4b is cut into individual conductive tapes 4b * having a predetermined application length by the tape application device 1 and applied to a plurality of application sites 23 formed on the side edge 20a of the substrate 20. This will be described with reference to FIGS.

  In the present embodiment, two tape sticking operation modes of accuracy priority mode and tact priority mode can be selected and executed in accordance with the sticking position accuracy of the conductive tape 4b required for the target substrate 20. It has become. That is, when targeting a substrate 20 that requires a high tape pasting position accuracy due to a requirement for mounting accuracy, an accuracy priority mode is selected that emphasizes the pasting position accuracy, and when other substrates 20 are targeted, production is performed. Select the tact priority mode that emphasizes the performance.

  First, an execution example of the accuracy priority mode will be described. As shown in FIG. 5A, in the state where the side edge portion 20a of the substrate 20 held by the substrate holding table 19 (FIG. 1) is received by the lower receiving portion 22, the attaching mechanism 2 is moved to move the pressure bonding head. 15 is aligned with the first pressing position P1, and the bonding start position S of the conductive tape 4b is aligned with the bonding start end 23a corresponding to the first pressing position P1 (arrow j). Next, as shown in FIG. 5B, the cut portion 7 located at the side end portion 15a of the crimping head 15 is operated to cut the conductive tape 4b, and as shown in FIG. Insert. Thereby, the piece conductive tape 4b * aligned with the crimping head 15 is formed immediately above the first pressing position P1.

  Next, as shown in FIG. 6 (a), by lowering the crimping head 15 (arrow k), the individual conductive tape 4b * is pressed against the first pressing position P1, and the corresponding application site 23 ( (Affixing process). At this time, the second peeling roller 17 b of the peeling portion 17 is lowered together with the pressure bonding head 15. However, the lowering operation of the second peeling roller 17b is not an essential requirement and can be omitted.

  Thereafter, when the pressing for the first pressing position P1 is completed, the pressure-bonding head 15 is raised (arrow l) as shown in FIG. 6B. Next, alignment for the second pressing position P2 is performed. That is, by driving the attaching part moving mechanism 2b, as shown in FIG. 6C, the attaching means including the crimping head 15 and the peeling part 17 are integrated with the substrate 20 held on the substrate holding table 19. Then, while relatively moving in the horizontal direction (arrow m), the tape guide means is driven to feed the tape member 4 (arrow n).

  Then, in the relative movement of the substrate holding table 19 and the peeling portion 17 in the X direction, the first peeling roller 17a of the peeling portion 17 and the substrate 20 move relative to each other, whereby the pasting portion 23 of the side edge portion 20a of the substrate 20 is obtained. Separation of the separator 4a from the individual conductive tape 4b * affixed to is performed. Then, by positioning the side end portion 15a of the crimping head 15 directly above the end portion on the upstream side of the second pressing position P2, the alignment for the second pressing position P2 is completed. Thereafter, the respective work operations similar to those in FIG. 5 (b) and thereafter are similarly executed, and the piece conductive tape 4b * is attached to the attaching portion 23 corresponding to the second pressing position P2. Thereafter, a similar work operation is executed for the third pressing position P3, and the tape attaching work for the substrate 20 is completed.

  That is, in the above-described accuracy priority mode, the operation of cutting the conductive tape 4b by the cut portion 7 to form the individual conductive tape 4b * and the operation of applying the individual conductive tape 4b * are performed for each application part 23. It is a form that is repeatedly performed. In this operation mode, since the individual conductive tape 4b * is individually formed at a position immediately above each pasting portion 23, a tape feeding operation after cutting is unnecessary and a feeding position error does not occur. There is little position shift with respect to the sticking site | part 23 of the piece electrically conductive tape 4b *. Therefore, the piece conductive tape 4b * can be attached to the attaching portion 23 with high positional accuracy.

  Next, an execution example of the tact priority mode will be described. Here, the required number of individual conductive tapes 4b * are formed in advance on the substrate 20 before the individual conductive tapes 4b * are attached to the side edges 20a. That is, by operating the cut portion 7 while intermittently feeding the tape member 4 to the tape, the number of the piece conductive tapes 4b * having a size corresponding to the sticking length L of the sticking part 23 (here) 3) in advance. This individual piece forming operation is a substrate carrying operation in which a substrate 20 after pasting is carried out from the substrate holding table 19 and a new substrate 20 is carried into the substrate holding table 19 in the process of continuously working a plurality of substrates 20. Done in sync with

  In the state where the individual piece forming operation is completed, as shown in FIG. 7A, the substrate 20 receives the side edge portion 20 a by the lower receiving portion 22. And the crimping | compression-bonding head 15 is aligned with respect to the 1st press position P1 by moving the sticking mechanism 2. FIG. Thereafter, as shown in FIG. 7B, the tape member 4 is rewound by the tape guiding means (arrow o), and among the plurality of previously formed individual conductive tapes 4b *, the most downstream individual conductive tape. 4b * is aligned with the first pressing position P1. As a result, the individual conductive tape 4b * aligned with the crimping head 15 is positioned immediately above the first pressing position P1. Next, as shown in FIG. 7C, by lowering the crimping head 15 (arrow p), the individual conductive tape 4b * is pressed against the first pressing position P1, and the corresponding application site 23 ( (Affixing process). At this time, the second peeling roller 17 b of the peeling portion 17 is lowered together with the pressure bonding head 15. However, the lowering operation of the second peeling roller 17b is not an essential requirement and can be omitted.

  Thereafter, when the pressing for the first pressing position P1 is completed, the pressure-bonding head 15 is raised (arrow q) as shown in FIG. Next, alignment for the second pressing position P2 is performed. That is, by driving the attaching part moving mechanism 2b, as shown in FIG. 8B, the attaching means including the crimping head 15 and the peeling part 17 are integrated with the substrate 20 held on the substrate holding table 19. Then, while relatively moving in the horizontal direction (arrow r), the tape guide means is driven to feed the tape member 4 (arrow s).

  Then, in the relative movement of the substrate holding table 19 and the peeling portion 17 in the X direction, the first peeling roller 17a of the peeling portion 17 and the substrate 20 move relative to each other, whereby the pasting portion 23 of the side edge portion 20a of the substrate 20 is obtained. Separation of the separator 4a from the individual conductive tape 4b * affixed to is performed. Then, by positioning the side end portion 15a of the crimping head 15 directly above the end portion on the upstream side of the second pressing position P2, the alignment for the second pressing position P2 is completed. Thereafter, as shown in FIG. 9, by lowering the crimping head 15 (arrow t), the individual conductive tape 4 b * is pressed against the second pressing position P <b> 2 and is attached to the corresponding application site 23. . Thereafter, each operation operation similar to that in FIG. 8 and thereafter is executed for the third pressing position P3, and the tape attaching operation for the substrate 20 is completed.

  That is, in the above-described tact priority mode, the necessary number of pieces to be attached to the new substrate 20 by making a cut in the tape member 4 in synchronization with the substrate transfer operation for replacing the substrate 20 after the attachment and the new substrate 20. After the piece conductive tape 4b * is formed and the tape member 4 after the cut 4c is formed is temporarily rewound, the piece conductive tape 4b * is intermittently fed in the feeding direction. Are successively applied to each application part 23 of the substrate 20.

  In this tact priority mode, the individual conductive tape 4b * is formed in synchronism with the substrate transfer operation, so that the individual conductive tape formation is performed in comparison with the accuracy priority mode in which the individual conductive tape 4b * is individually formed. Work time can be reduced. Furthermore, in this case, since it is not necessary to advance the cut portion 7 in the attaching operation for attaching the individual conductive tape 4b * to the side edge portion 20a, the lifting / lowering stroke Hs of the crimping head 15 in the attaching operation (FIG. 8 ( b) can be set small, thereby shortening the time required for the pasting operation. Therefore, compared to the above-described accuracy priority mode, it is possible to shorten the production tact time per substrate and ensure high productivity.

  That is, in the above-described tape pasting method, the pasting step of pasting the individual conductive tape 4b * to one pasting site 23, and the pressurizing head 15 is lifted, and then the pasting part moving mechanism 2b which is a relative moving means is driven. The tape guide unit 15 is driven to feed the tape member 4 while the adhesive unit and the peeling unit 17 are integrally moved relative to the substrate holding table 19. In this relative movement process, the moving step of peeling the separator 4a from the individual conductive tape 4b * stuck to the one pasting portion 23 by the peeling portion 17 in this relative movement process is repeatedly executed. .

  In this movement step, the separator 4a is peeled off and crimped to the next pasting part 23 by causing the tape feeding mechanism 10 to feed the tape member 4 in synchronism with the relative movement by the pasting part moving mechanism 2b. The alignment of the head 15 can be performed simultaneously. Therefore, it is possible to shorten the time required for the peeling operation in the tape application work. Further, in the present embodiment, the above-described accuracy priority mode and tact priority mode are selected and executed in consideration of the characteristics of the work target substrate 20 and the desired productivity. Thereby, tape peeling operation | movement can be performed efficiently, eliminating the waste of a conductive tape, and ensuring of the required sticking position accuracy and improvement of productivity can be made compatible.

  The tape sticking device and the tape sticking method of the present invention efficiently perform the tape peeling operation while eliminating the waste of the conductive tape, and ensure both the required sticking position accuracy and the productivity improvement. It can be used for affixing a tape for mounting components on a substrate such as a display panel.

DESCRIPTION OF SYMBOLS 1 Tape sticking apparatus 2 Sticking mechanism 2b Sticking part moving mechanism 3 Substrate positioning part 4 Tape member 4a Separator 4b Conductive tape 4b * Single piece conductive tape 5 Tape supply reel 7 Cut part 8 First guide roller 9 Second guide roller 10 Tape feed Mechanism 13 Tape recovery part 14 Lifting mechanism 15 Crimping head 17 Peeling part 18 Substrate moving mechanism 19 Substrate holding table 20 Substrate 20a Side edge part 21 Electrode part 22 Bottom receiving part 23 Pasting part 23a Pasting start end part B Pressing length P1 First Pressing position P2 second pressing position P3 third pressing position S sticking start position L sticking length

Claims (2)

A tape applicator that cuts anisotropic conductive tape into individual conductive tapes of a predetermined application length and applies them to a plurality of application sites formed on the side edges of the substrate,
A substrate holding table for holding the substrate and a tape member formed by laminating an anisotropic conductive tape on a separator are guided from a tape supply unit to a bonding portion provided along a longitudinal direction of the side edge of the substrate. A tape guide capable of rewinding the tape member, which is made of a separator alone with the anisotropic conductive tape being applied to the application site, and returning the tape member to the side opposite to the feeding direction. Means,
Affixing means for pressing the tape member with a pressure-bonding head and affixing the anisotropic conductive tape to the affixing part to the substrate held by the substrate holding table and receiving the side edge by a receiving part,
A cut portion that is disposed upstream of the affixing means and cuts at an interval corresponding to the affixing length at the affixing site to the anisotropic conductive tape to form the individual conductive tape, and the affixing means A peeling portion for peeling the separator from the anisotropic conductive tape attached by
A relative movement means for relatively moving the sticking means and the peeling portion in a horizontal direction with respect to the substrate holding table in a state of holding a relative position of each other;
A controller for controlling the relative movement means, the tape guide means, the cut portion, the pasting means and the peeling portion;
The control unit causes the tape guide means to feed the tape member in synchronization with the relative movement by the relative movement means;
Furthermore, an accuracy priority mode in which the operation of forming the individual conductive tape and the operation of applying the individual conductive tape is repeated for each application site, and the substrate after application is unloaded from the substrate holding table and newly added. A necessary number of pieces of conductive tape to be attached to the new substrate is formed by making a cut in the tape member in synchronization with the substrate carrying operation for carrying a new substrate into the substrate holding table. After rewinding the tape member after it has been formed, the tact priority is given to successively affixing the individual conductive tape to each affixing portion of the substrate while intermittently feeding the tape member in the feeding direction. A tape applicator characterized by selectively performing a mode. While guiding a substrate holding table for holding a substrate and a tape member formed by laminating anisotropic conductive tape on a separator from a tape supply unit to a side edge of the substrate along a longitudinal direction thereof, A tape guiding means capable of performing a rewinding operation of feeding the tape member, which is a single unit of the separator by sticking the anisotropic conductive tape to the pasting portion, to the tape collecting unit side and further returning the tape member to the side opposite to the feeding direction; ,
Affixing means for pressing the tape member with a pressure-bonding head and affixing the anisotropic conductive tape to the affixing part to the substrate held by the substrate holding table and receiving the side edge by a receiving part, A cut portion that is disposed upstream of the affixing means and cuts at an interval corresponding to the affixing length at the affixing site to the anisotropic conductive tape to form the individual conductive tape, and the affixing means The peeling part for peeling the separator from the anisotropic conductive tape stuck by the step, and the relative movement in the horizontal direction with respect to the substrate holding table with the sticking means and the peeling part held in a relative position A tape pasting apparatus comprising: a relative moving means for controlling the tape; and a control section for controlling the relative moving means, the tape guiding means, the cut portion, the pasting means, and the peeling portion. I, the anisotropic conductive tape a predetermined sticking length of pieces conductive by cutting the tape Keru affixed to a plurality of joining portions formed in the side edge of the substrate tape adhering method,
A step of attaching the individual conductive tape to one of the attachment portions, and after raising the pressure-bonding head, the relative movement means is driven to integrally attach the attachment means and the peeling portion to the substrate holding table. The tape guide means is driven while moving relative to the tape member to feed the tape member, thereby aligning the pressure-bonding head with the next application site, and in the relative movement process, the peeling portion is Including a moving step of peeling the separator from the anisotropic conductive tape attached to the application site,
Performing the tape member feeding operation by the tape guiding means in synchronization with the relative movement by the relative moving means;
Furthermore, an accuracy priority mode in which the operation of forming the individual conductive tape and the operation of applying the individual conductive tape is repeated for each application site,
In synchronization with the substrate transport operation for carrying out the substrate after pasting from the substrate holding table and carrying the new substrate into the substrate holding table, the necessary number of pieces to be pasted on the new substrate by making a cut in the tape member After the piece conductive tape is formed and the tape member after the cut is formed is rewound, the piece conductive tape is attached to the substrate while the tape member is intermittently fed in the feeding direction. A tape affixing method characterized by selectively performing a tact priority mode in which operations for affixing sequentially to a part are continuously performed.

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