JP2013092569A - Fpd module assembly device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an FPD module assembly device that suppresses generation of bubbles when an ACF is attached onto a member to be mounted on a display panel substrate to improve adhesion property of the ACF.SOLUTION: An FPD module assembly device manufactures an FPD module by punching a member to be mounted, formed on a tape to mount it onto the peripheral part of a display panel substrate by an ACF. When the ACF is attached onto the member to be mounted by holding it with an upper blade and a lower blade and applying heat and pressure thereto in a temporary crimping process, a protective material composed of an elastic body such as silicon rubber is provided on the face of the upper blade that comes into contact with the member to be mounted and a buffer material also composed of silicon rubber is provided on the face of the lower blade that comes into contact with the lower face of the ACF. The protective material of the upper blade and buffer material of the lower blade are formed as, for example, a T-type pad that is inserted to each.

Description

  The present invention relates to an FPD module assembling apparatus, and an ACF (Anisotropic Conductive Film) is used to mount a COF or the like on the periphery of a display panel substrate of an FPD (Flat Panel Display) such as liquid crystal or plasma. The present invention relates to an FPD module assembling apparatus that improves adhesion characteristics when bonding.

An FPD module assembly apparatus is a display panel that sequentially performs a plurality of processing operations on an FPD display panel substrate (display cell substrate) such as liquid crystal display (LCD), organic EL (Electro-Luminescence), and plasma. Electronic components such as COF (Chip on film), FPC (Flexible Printed Circuit), and PCB (Printed Circuit Board) are connected to the peripheral edge of the substrate. For this mounting, a film-like anisotropic conductive member in which conductive particles are kneaded into an adhesive called ACF is used, and a display panel substrate and a mounting member such as COF via this ACF, or a COF or the like The electronic component that is called “mounting member” in the following description is called TCP (Tape Carrier Package) or TAB because of the difference in the detailed shape and thickness of the member. Or called COF. These TCP, TAB, and COF are constructed by mounting an IC chip on an FPC in which a long polyimide film having sprocket holes is wired and cutting out the FPC, and there is no difference in mounting. . Also, depending on the panel design, only an FPC without an IC chip may be mounted. There is no substantial difference between these parts in the FPD assembly process.

Hereinafter, the FPD module will be briefly described with reference to FIGS. 9 and 10.
FIG. 9 is a diagram illustrating a configuration of each part of the FPD module.
FIG. 10 is a diagram showing details of the mounting member.

  As shown in FIG. 9, the FPD module 9 connects a plurality of mounting members 2 and mounting members 3 to the peripheral portion of the display panel substrate 1 by an ACF layer 8a, and a PCB substrate 6 to some mounting members 2 Are connected by an ACF layer 8a. The mounting member 2 and the mounting member 3 are electronic components in which an IC chip 5 is mounted on an FPC 4 in which a printed circuit (not shown) made of copper foil is applied to a flat rectangular polyimide film (mounting member 2: FIG. 10 (a), (b), mounting member 3: FIG. 10 (c), (d)). The IC chip 5 is mounted almost at the center of the FPC 4. A printed circuit is provided on the lower surface of the FPC 4, and connection terminals 7 are provided on both sides (two long sides) in the longitudinal direction.

  For example, Patent Document 1 discloses an example in which an ACF (cut piece 27a of the adhesive tape 27) is attached to the mounting member (TAB2) side, and then the display panel and the mounting member are connected. According to this patent document 1, the cut piece 27a is affixed to the terminal of TAB2 by arrange | positioning the cut piece of TAB on the cut piece 27a of the adhesive tape 27, and heat-pressing. Thereafter, TAB2 placed on the cut piece 27a is conveyed onto the display panel, and is thermocompression bonded to fix the TAB2 on the display panel.

  Patent Document 2 discloses that when the mounting member (TAB2) and the ACF are fixed, the mounting member (TAB2) is sandwiched between the upper blade (crimp blade 671) and the lower blade (lower receiver 672), and heated and pressurized. (FIG. 7).

JP 2009-26830 A JP 2011-197461 A

  When the ACF is attached to the terminal of the mounting member as in Patent Document 2, the upper and lower blades are used for pressure bonding by means of applying pressure simultaneously with heating.

  However, there is a step between the terminal portion of the mounting member and the mounting member base material, and bubbles are generated between the ACF and the COF after pasting. Air bubbles led to turning when the ACF was applied, and there was a problem that the adhesive properties of the ACF were remarkably deteriorated.

  Further, when the upper blade and the lower blade are pressure-bonded and pressurized, there is a problem in that the portion where the ACF adheres protrudes from the separator which is a tape-shaped ACF mount and adheres to the lower blade.

  The present invention has been made to solve the above problems, and its purpose is to prevent the ACF from adhering to the lower blade and suppress the generation of bubbles when the ACF is attached to the mounting member. An object of the present invention is to provide an FPD module assembling apparatus capable of improving the adhesive properties of ACF.

  An FPD module assembling apparatus that solves the problems of the present invention relates to a temporary pressure bonding unit, in which a mounting member formed on a tape is punched and mounted on a peripheral portion of a display panel substrate by ACF cut from the ACF tape. The FPD module assembling apparatus for manufacturing the FPD module is an apparatus premised on mounting the ACF on the punched mounting member in the temporary crimping process. In this FPD module assembling apparatus, when mounting the ACF layer on the punched mounting member, the punched mounting member is transported onto the corresponding ACF by the transport head, and the mounting member and the ACF layer are separated by the upper blade and the lower blade. Is sandwiched, heated and pressurized, and the mounting member is attached to the ACF and mounted, thereby performing temporary pressure bonding. For example, a protective material made of an elastic material such as silicon rubber is provided on the surface of the upper blade that contacts the mounting member, and a buffer material made of an elastic material such as silicon rubber is provided on the surface that contacts the lower surface of the ACF of the lower blade. It is a thing.

  The protective material for the upper blade or the cushioning material for the lower blade is formed, for example, as a T-type pad that is fitted in each.

  Further, the upper blade and the lower blade may be covered with the protective sheet, respectively, so that the role of the upper blade protective material and the lower blade cushioning material may be assumed.

  The thickness of the buffer material of the lower blade is equipped as a range of 500 μm to 1500 μm from the accuracy of the ACF attachment position and the state of bubbles.

  According to the present invention, when the ACF is attached to the mounting member, the ACF can prevent the ACF from adhering to the lower blade and suppress the generation of bubbles, thereby improving the adhesion characteristics of the ACF. An assembly apparatus can be provided.

It is a block diagram of the whole mounting assembly line of an FPD panel. It is the figure which showed in detail the structure of the part which supplies the mounting member of a temporary crimping | compression-bonding unit, and a part which affixes ACF to a mounting member, (a): Top view, (b): Side view. It is a side view of an ACF sticking part. It is the figure which expanded the principal part of the ACF sticking part ((a): Side view, (b): Sectional drawing which follows the AA line of (a)). The structure of the crimping head according to the prior art will be described. It is a figure explaining the state which affixed ACF on the mounting member 2 with the crimping head which concerns on a prior art. It is a figure explaining the structure of the crimping head concerning one embodiment of the present invention (T type pad). It is a figure explaining the structure of the crimping head concerning one embodiment of the present invention (C type pad). It is a figure explaining the structure of the crimping head concerning one embodiment of the present invention (protection sheet). It is a graph which shows the relationship between the thickness of the buffer material of a lower blade, the sticking precision of ACF, and the number of bubble generation. It is a figure which shows the structure of each part of an FPD module. It is a figure which shows the detail of a mounting member.

Hereinafter, an embodiment according to the present invention will be described with reference to FIGS.
First, the configuration of the entire FPD panel mounting assembly line including the FPD module assembling apparatus according to an embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a configuration diagram of an entire FPD panel mounting assembly line.
FIGS. 2A and 2B are diagrams showing in detail the configuration of the portion for supplying the mounting member of the temporary press-bonding unit and the portion for attaching the ACF to the mounting member and carrying it out ((a): plan view, (b): Side view).

  As shown in FIG. 1, the FPD panel mounting assembly line includes a receiving unit 100, a temporary crimping unit 200 that temporarily crimps the mounting member 2 from three directions, a main crimping unit 300 that performs final crimping from three directions, and a PCB connection. A unit 400 and a carry-out unit 500 are included.

  Each of the receiving unit 100, the provisional crimping unit 200, the main crimping unit 300, the PCB connection unit 400, and the carry-out unit 500 has frames 103, 203, 303, 403, and 503, respectively. Conveying rails 101, 201, 301, 401, and 501 are provided on the operation surface side, and are connected to each other. On each transfer rail, there are transfer stages 102, 202, 302, 402, and 502, respectively. The display panel substrate 1 is transferred from the working position of the unit to the working position of the next unit. The last carry-out unit 500 is provided with a device for receiving the display panel substrate 1 separately, but is omitted here.

  The temporary crimping unit 200 includes a source-side reference bar 204 and a gate-side reference bar 205 that perform flattening by placing and adsorbing the working side of the display panel substrate 1 during the temporary crimping operation. The display bars 1 and 205 and the rear end support (not shown) can stably hold the display panel substrate 1 without depending on the transfer stage 102 during the operation. In addition to the source-side mounting portion 280, the left and right gate-side mounting portions 290 are provided so that the mounting members 2 can be mounted simultaneously from three directions.

  In the provisional pressure bonding unit 200, as shown in FIG. 2B, for example, the mounting member 2 mounted on the source side is supplied as a long ribbon-shaped film TAB tape 232 wound around a reel 223, The reels are fed at a specified pitch by the reel feed mechanism 221 and are punched into the individual mounting members 2 by the punching mechanism 224. Thereafter, the mounting member 2 is reversed by the TAB reversing unit 225 and is held by the transport head 229 by the TAB transport unit 226. The mounting member 2 is held by the transport head 229, and after performing position correction based on the position data calculated in advance by the position detection camera 227, as shown in FIG. To the ACF pasting unit 230. In the ACF attaching part 230, the ACF layer 8 a from which the separator 8 b of the ACF tape 8 is peeled off is attached to both sides of the mounting member 2. The detailed structure of the ACF tape 8 and the attachment of the ACF attaching part 230 to the mounting member 2 will be described in detail later. The mounting member 2 to which the ACF layer 8 a is attached is delivered to the source-side mounting unit 280 and the gate-side mounting unit 290 by the TAB discharge unit 228. Then, the mounting member 2 to which the ACF layer 8a is attached is temporarily pressure-bonded to a predetermined position of the display panel substrate 1. Temporary pressure bonding is a process of mounting on the display panel substrate 1 by heating and pressing at a lower temperature and lower pressure than the main pressure bonding with a mounting head (not shown) before the main pressure bonding.

  The display panel substrate 1 for which the temporary pressure bonding has been completed is then sent to the main pressure bonding unit 300 shown in FIG. In addition to the source-side main press-bonding portion 320, the main-bonding unit 300 has gate-side main press-bonding portions 330 on the left and right sides, and each mounting member 2 can be finally press-bonded simultaneously from three directions. In the main pressure bonding, the display panel substrate 1 and the mounting member 2 are pressure-bonded by heating and pressurizing the mounting member 2 to which the ACF layer 8a mounted by the temporary pressure bonding is attached at a high temperature and high pressure by a mounting head (not shown). Thus, it is a process of completely ensuring their electrical conduction.

  Thereafter, the PCB substrate 6 is connected in the PCB connection unit 400. The PCB connection unit 400 has the same configuration as the main pressure bonding unit 300, and has a structure in which two sets of PCB supply parts 420 are provided on the back surface. The PCB substrate 6 taken out from the PCB tray 430 by the PCB transfer part 440 is the reference It is superimposed on the ACF layer 8a on the PCB side of the mounting member 2 of the display panel substrate 1 placed on the bar 404, and the main pressure bonding is performed. Naturally, since the ACF layer 8a on the PCB side is already pasted by the temporary pressure bonding unit 200, the PCB connecting unit 400 does not require a pasting mechanism for the ACF tape 8.

  The display panel substrate 1 that has been connected to the PCB substrate 6 is unloaded to the unloading unit 500 by the transfer stage 402.

Next, the details of the structure and operation of the ACF attachment unit 230 will be described with reference to FIGS. 3 and 4.
FIG. 3 is a side view of the ACF attachment part.
FIG. 4 is an enlarged view of the main part of the ACF attachment part ((a): side view, (b): cross-sectional view along line AA in (a)).

  The supply reel 233 feeds the ACF tape 8 while its feed length and speed are controlled by a feed motor (not shown).

  The direction of the ACF tape 8 is regulated by the guide roller 235 and sent to a fixed position on the ACF stage 250. The ACF stage 250 is a stainless steel member having a smooth surface. The ACF stage 250 has a built-in heater, but is used at a temperature of 40 ° C. to 60 ° C. at which ACF does not protrude.

  Here, as shown in the lower part of FIG. 4 (a), the ACF tape 8 is attached to the ACF layer 8a in which an adhesive layer containing conductive particles is formed and the ACF layer 8a adheres to each other when the tape is accommodated. It consists of a separator 8b for prevention.

  Before the ACF tape 8 is sent onto the ACF stage 250, the ACF layer 8a is cut to an appropriate length for being attached to the mounting member 2 by the cutter unit 269 on the cut stage 239, and the cutter unit 269 is cut into the ACF layer. By removing a part of 8a, a hollow portion 269b is formed as shown in FIG. 4 (b). This prevents the ACF layer 8a from adhering to each other when the ACF layer 8a is attached to the mounting member 2. Even when the ACF layer 8a is cut by the cutter unit 269, the separator 8b is not cut but is connected as a tape.

  Next, the mounting member 2 is transported by the transport head 229 and pressed onto the ACF tape 8 on the ACF tape 8 stretched with the ACF layer 8 a facing upward on the ACF stage 250. Here, the transport head 229 has a suction hole for holding the mounting member 2 in a vacuum. Thereafter, the transport head 229 opens the suction holes for holding the vacuum to the atmosphere, and the mounting member 2 is temporarily fixed on the ACF layer 8a with a slight adhesive force.

  The mounting member 2 released from the transport head 229 is fed by one pitch by the feed of the moving clamp 237 and the ACF tape 8 fed from the supply reel 233 in synchronization therewith, and is transported to the lower blade 251.

  The ACF tape 8 is moved to a predetermined position by alternately holding the separator 8b by the moving clamp 237 and the fixed clamp 236, and reciprocating the moving clamp 237. That is, when the tape is fed out, the fixed clamp is released, and the moving clamp 237 moves downward by grasping the separator 8b. Next, when the moving clamp 237 returns, the fixed clamp grips the separator 8b, and the moving clamp 237 opens the separator 8b, moves upward, and moves to just below the fixed clamp.

  At this time, the peeling pin 267 moves together with the guide pin 266 in the direction of the lower blade 251 to the next hollow portion 269b. Here, since the separator 8b is pushed down, the ACF layer 8a of the ACF tape 8 and the separator 8b act to peel each other.

  The upper blade 261 of the pressure-bonding head 260 is disposed on the lower blade 251. The ACF layer 8a is attached to the lower surface of the mounting member 2 by being sandwiched between the upper blade 261 and the lower blade 251 and heated and pressurized. . The details of the crimping head 260 and this process will be described later.

  The lower blade 251 has the same configuration as that of the ACF stage 250. However, since the upper blade 261 normally has a heater, it does not matter whether a heater is built in or not.

In this way, the ACF layer is formed on the left and right sides of the mounting member 2 (see FIGS. 4B and 10B, or one side when used on the gate side in FIG. 9 as in FIG. 10C). The mounting member 2 to which 8a is attached is transferred to the mounting portions 280 and 290 shown in FIG. 1 by the discharge head 268 of the TAB discharge portion 228. Thereafter, the separator 8b is wound around the recovery reel 238 by a winding (not shown). The take-up motor controls the take-up length and speed to take up and collect.

Next, the structure of the crimping head 260 and the process of attaching the ACF to the mounting member 2 will be described in detail with reference to FIGS.
FIG. 5 illustrates the structure of a conventional crimping head.
FIG. 6 is a diagram for explaining a state in which the ACF is attached to the mounting member 2 by the crimping head according to the related art.
7A to 7C are views for explaining the structure of the crimping head according to the embodiment of the present invention.
FIG. 8 is a graph showing the relationship between the thickness of the cushioning material of the lower blade, the ACF attachment accuracy, and the number of bubbles generated.

  First, the structure of the crimping head 260 according to the prior art and its problems will be described with reference to FIGS.

  As shown in FIG. 5, the pressure-bonding head 260 according to the prior art includes an upper blade 261, a heater block 262 containing a heater 263, a heat insulating material 264, and a holding block 265.

  The holding block 265 is connected to lifting means (not shown), and is a portion that supports the arm, the lower heater block 262, and the like from the heat insulating material 264. The heater block 262 incorporates a heater and heats the upper blade. The heat insulating material 264 is a member for preventing excessive heat from being transferred from the heater block 262 to the holding block 265 during heating. An upper blade 261 is attached to the heater block 262 above the lower blade 251 at the tip end at the right end of the drawing.

  As already shown in FIGS. 3 and 4, the mounting member 2 on which the ACF layer 8 a conveyed onto the lower blade 251 is attached is heated on the surface to, for example, 70 ° C. to 90 ° C. The upper blade 261 of the pressure-bonding head 260 is pushed downward so that the surface pressure applied to the ACF layer 8a is 2 MPa. At this time, the surface temperature and the applied pressure of the ACF layer 8a and the mounting member 2 are appropriately set according to the characteristics of the ACF to be used. In this way, the ACF layer 8a is attached to the mounting member 2 pressurized under heating.

  However, as shown in FIG. 6, there is a problem that bubbles 10 are generated when the ACF layer 8a and the mounting member 2 are attached. Due to the bubbles 10, the ACF layer 8 a and the mounting member 2 are easily peeled off, which in turn causes a connection failure.

  Therefore, in the present embodiment, as will be described below, the upper blade 261 is provided with a protective material, and the lower blade 251 is provided with a buffer material. The protective material for the upper blade 261 and the cushioning material for the lower blade 251 are made of an elastic silicon rubber-based member that is easy to transfer heat. Since the protective material and the cushioning material serve as a cushion at the time of pressurization, the generation of bubbles can be suppressed, and the adhesion characteristics of the ACF layer 8a to the mounting member 2 can be improved. In addition, when the conventional mounting member 2 and the ACF layer 8a are pressurized with heating, the adhesive of the portion of the ACF layer 8a protruding from the mounting member 2 may adhere to the upper blade 261. However, the protective material by the silicon rubber-based member of the upper blade 261 has an effect of preventing the adhesive material from adhering to the protective material.

In addition to attaching a protective material to the upper blade 261, a buffer material is attached to the lower blade 251. Therefore, when the upper blade 261 and the lower blade 251 are pressure-bonded, For example, as shown in FIG. 7A, a groove is formed at the tip of the upper blade 261 so as to be fitted into the upper blade 261 as shown in FIG. 7A. In addition, a T-shaped pad 241a is provided, and as a cushioning material for the lower blade 251, a groove is formed at the tip of the lower blade 251, and a T-shaped pad 241b is provided so as to fit into the groove. In this case, since both the upper blade and the lower blade have a buffering action, the effect of suppressing the generation of bubbles is great.

  Further, for example, as shown in FIG. 7B, a C-shaped pad 240 a is provided as a protective material for the upper blade 261 so as to cover the tip of the upper blade 261, and the lower blade 251 is used as a cushioning material for the lower blade 251. A C-type pad 240b is provided so as to cover the tip of the pad.

  Further, as shown in FIG. 7C, the tip of the upper blade 261 is covered with a protective sheet 242a as a protective material for the upper blade 261, and the tip of the lower blade 251 is covered with a protective sheet 242b as a cushioning material for the lower blade 251. Cover. In this case, the protective sheet 242a and the protective sheet 242b may be sent periodically by a reel mechanism or the like, or may be semi-fixed and manually removed after a certain period of time. .

  The protective material for the upper blade 261 and the cushioning material for the lower blade 251 may be applied in various combinations.

  Here, the optimum design of the protective material for the upper blade 261 and the buffer material for the lower blade 251 will be described.

  FIG. 8 shows the relationship between the thickness of the buffer material of the lower blade, the ACF application accuracy, and the number of bubbles generated. The horizontal axis 601 represents the buffer material thickness, and the vertical axis 602 represents the ACF application accuracy. The vertical axis 603 represents the number of bubbles generated, the curve 604 represents the relationship between the thickness of the buffer material and the ACF attachment accuracy, and the curve 605 represents the relationship between the thickness of the buffer material and the number of bubbles generated.

  As can be seen from the curve 604, as the thickness of the cushioning material increases, the positional accuracy of the ACF attachment deteriorates. At this time, the allowable range of the ACF attachment accuracy is a range indicated by an arrow 606. On the other hand, as can be seen from the curve 605, the number of bubbles generated decreases as the thickness of the buffer increases, and the number of bubbles increases as the thickness decreases. At this time, the allowable range of the number of generated bubbles is a range indicated by an arrow 607.

  Therefore, an appropriate range for maintaining the positional accuracy of the ACF attachment and generating bubbles with the thickness of the buffer material is a portion represented by an arrow 608 that is an intersection of the arrow 606 and the arrow 607. According to the inventors' measurements, this was between 500 μm and 1500 μm.

DESCRIPTION OF SYMBOLS 1 ... Display panel board | substrate, 2 ... Mounting member (source side), 3 ... Mounting member (gate side), 4 ... FPC, 5 ... IC chip, 6 ... PCB substrate, 7 ... Connection terminal, 8 ... ACF tape, 8a ... ACF layer, 8b ... separator, 9 ... FPD module, 10 ... air bubbles,
DESCRIPTION OF SYMBOLS 100 ... Accepting unit, 101 ... Transfer rail, 102 ... Transfer stage, 103 ... Frame,
DESCRIPTION OF SYMBOLS 200 ... Temporary press bonding unit, 201 ... Conveying rail, 202 ... Conveying stage, 203 ... Frame, 204 ... Source side reference bar, 205 ... Gate side reference bar, 220 ... TAB supply part, 230 ... ACF sticking part, 232 ... TAB tape 280 ... source side mounting portion, 290 ... gate side mounting portion,
DESCRIPTION OF SYMBOLS 300 ... Main crimping unit, 301 ... Conveying rail, 302 ... Conveying stage, 303 ... Frame, 304 ... Source side reference bar, 305 ... Gate side reference bar, 320 ... Source side main crimping part, 330 ... Gate side main crimping part,
400 ... PCB connection unit, 401 ... conveying rail, 402 ... conveying stage, 403 ... frame, 404 ... reference bar, 420 ... PCB supply unit, 430 ... PCB tray, 440 ... PCB transfer unit, 450 ... PCB crimping unit,
500: Discharge unit, 501 ... Conveying rail, 502 ... Conveying stage, 503 ... Frame,
221: Reel feed mechanism, 223 ... Reel, 224 ... Punching mechanism, 225 ... TAB reversing unit, 226 ... TAB transport unit, 227 ... Position detection camera, 228 ... TAB discharge unit, 229 ... Transport head,
233 ... supply reel, 235 ... guide roller, 236 ... fixed clamp, 237 ... moving clamp, 238 ... collection reel, 239 ... cut stage, 250 ... ACF stage, 251 ... lower blade, 260 ... crimping head, 261 ... upper blade, 262 ... Heater block, 263 ... Heater, 264 ... Heat insulating material, 265 ... Holding block, 266 ... Guide pin, 267 ... Peeling pin, 268 ... TAB discharge head, 269 ... Cutter unit, 269b ... Cavity part,
240a, 240b ... C type pad, 241a, 241b ... T type pad, 242a, 2432b ... protective sheet,
601 ... Protective material, thickness of buffer material, 602 ... ACF sticking accuracy, 603 ... Number of bubbles generated, 604 ... Curve (relationship between protective material, buffer material thickness and ACF sticking accuracy), 605 ... Curve (protective material) ,... (Relationship between the thickness of the buffer material and the number of bubbles generated), 606... Arrow (allowable range of ACF attachment accuracy), 607... Arrow (allowable range of bubble generation number), 608.

Claims (4)

An FPD module assembling apparatus for manufacturing an FPD (Flat Panel Display) module mounted on a peripheral portion of a display panel substrate by ACF (Anisotropic Conductive Film),
Supply means for supplying an ACF tape on which ACF is laminated from a supply reel;
Cutting means for cutting the ACF laminated on the ACF tape in correspondence with a region where the ACF is pasted on the mounting member;
A transport head;
A crimping portion having an upper blade;
A lower blade,
The mounting head transports the mounting member onto the ACF laminated on the ACF tape cut by the cutting means,
The mounting blade and the ACF are sandwiched between the upper blade and the lower blade, and when the upper blade and the lower blade are sandwiched between the upper blade and the lower blade, the upper blade and the lower blade are pressed against each other and heated. In the FPD module assembling apparatus that pressurizes and mounts the mounting member on the ACF, and temporarily press-bonds the mounting member on which the ACF is bonded to the display panel substrate.
A protective material made of an elastic body is provided on the surface of the upper blade that contacts the mounting member,
An FPD module assembling apparatus, wherein a cushioning material made of an elastic body is provided on a surface of the lower blade that contacts the lower surface of the ACF.   2. The FPD module assembling apparatus according to claim 1, wherein at least one of the protective material and the cushioning material is a T-type pad that is fitted to surfaces of the upper blade or the lower blade that are in contact with each other.   2. The FPD module assembling apparatus according to claim 1, wherein at least one of the protective material or the cushioning material is a C-type pad formed so as to surround surfaces of the upper blade or the lower blade that are in contact with each other. .   2. The FPD module assembling apparatus according to claim 1, wherein at least one of the protective material or the cushioning material is a protective sheet formed so as to cover the upper blade or the lower blade. 3.

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