JP2012227194A - Fpd module assembly device and time recognition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure reliability on adhesive properties of an ACF stuck to a display substrate or a member to be mounted which is to be mounted on the display substrate.SOLUTION: An FPD module assembly device includes: an ACF sticking part 230 for sticking an ACF to a member to be mounted which is to be mounted on a display substrate; and a time recognition device 600 for recognizing the time elapsed from sticking of the ACF to the display substrate or the member to be mounted which is to be mounted on the display substrate. Then, when the elapsed time is recognized, for example, the timestamp, processing time of each device or the total sum of the processing time, and a processing status are used.

Description

  The present invention relates to an FPD module assembling apparatus and a time recognition method for mounting electronic components on a display panel of a flat panel display (FPD).

  Examples of the FPD include a liquid crystal display, an organic EL (Electro-Luminescence) display, and a plasma display. In the FPD, a driving IC is mounted on the periphery of the display substrate, and TAB (Tape Automated Bonding) connection such as COF (Chip on Film) or FPC (Flexible Printed Circuit) is performed. A peripheral substrate such as a PCB (Printed Circuit Board) is mounted around the display substrate. As a result, the FPD module is assembled.

  In the following description, an electronic component referred to as a “mounting member” is referred to as a TCP (Tape Carrier Package) or a COF due to a difference in the detailed shape or thickness of the member. These TCP and COF are configured by mounting an IC chip on an FPC obtained by wiring a long polyimide film having sprocket holes and cutting out the FPC, and there is no difference in mounting. Also, depending on the panel design, only an FPC without an IC chip may be mounted. There is no substantial difference between these parts in the FPD assembly process.

The FPD module assembly line is a device that mounts mounting members on the periphery and the periphery of the display substrate of the FPD by sequentially performing processes in which a plurality of processing operations are performed.
As an example of the processing steps in the FPD module assembly line, (1) a terminal cleaning step for cleaning the mounting member attachment portion at the substrate end, and (2) an anisotropic conductive film (ACF: There is an ACF process to paste Anisotropic Conductive Film. In addition, there are (3) a mounting process in which the mounting member is positioned and mounted at the position where the ACF is attached to the display substrate, and (4) a pressing process in which the mounted mounting member is heat-pressed and fixed by the ACF. Further, (5) there is a PCB process in which a PCB on which an ACF has been pasted is pasted and mounted on the side opposite to the display substrate side of the mounting member. The PCB process is composed of a plurality of processes.

  By passing through a series of processes by such a processing apparatus group, the electrodes on the display substrate and the electrodes provided on the mounting member are thermocompression bonded, and the electric electrodes of the two electrodes are electrically connected via the conductive particles inside the ACF. A connection is made. When the crimping process is completed, the ACF base resin is cured, so that the display substrate and the mounting member are mechanically connected simultaneously with the electrical connection of both electrodes.

  In addition, ACF should just be affixed previously to either one of the members to join. For example, in another example of the ACF process, the ACF is attached in advance to the mounting member side. Further, the display substrate module assembly line requires a processing device for rotating the display substrate according to the number of sides of the display substrate to be processed, the number of mounting members to be processed, the number of processing devices, and the like.

For example, Patent Documents 1 to 3 describe an FPD module assembling apparatus that attaches an ACF to a mounting member and then temporarily presses the mounting member to a display substrate.
Patent Document 1 discloses a technique in which an anisotropic conductive film whose surface is covered with release paper is attached to an outer lead of a carrier tape component.
Patent Document 2 discloses a technique in which an anisotropic conductive film is attached to a TCP immediately before the TCP is mounted and mounted on a liquid crystal display.
Patent Document 3 discloses a technique in which an ACF is simultaneously attached to two sides on the substrate side / panel side of an electronic component such as TCP or COF immediately before the temporary pressure bonding step.

JP-A-4-352442 JP-A-7-74208 JP 2008-16594 A

  As described in Patent Document 3, for example, when the ACF sticking device is configured to stick an ACF for connecting a PCB (substrate) to a mounting member, the device for sticking the ACF to the mounting member in the PCB connection unit Can be eliminated, and the configuration of the PCB connection unit can be simplified.

  However, if the PCB (substrate) connection ACF is pasted before mounting, until the PCB is pasted to the PCB connection ACF, the process of temporarily pressing the mounting member on the display substrate or the mounting substrate on the display substrate It goes through the process of pressure bonding. For this reason, the surface of the ACF for PCB connection previously attached to the mounting member is exposed to the air until the PCB is actually attached in the PCB connection unit. Then, during the process of the FPD module assembly line, when the time required to actually attach the PCB to the ACF for connecting the PCB attached to the mounting member mounted on the display substrate becomes longer, it was exposed to the air. Adhesiveness of ACF for PCB connection is lowered. As a result, there is a possibility that the PCB that is finally press-bonded to the mounting member by using the ACF for PCB connection may be easily peeled off. The same applies to the case where ACF is directly attached to the display substrate.

  The present invention has been made in view of such a situation, and an object of the present invention is an FPD that ensures the reliability with respect to the adhesiveness of an ACF attached to a display substrate or a mounting member mounted on the display substrate. A module assembly apparatus and a time recognition method are provided.

In the FPD module assembling apparatus of the present invention, the ACF is attached to the display substrate or the mounting member mounted on the display substrate, and the ACF is attached to the display substrate or the mounting member mounted on the display substrate. And a time recognizing device for recognizing the elapsed time since.
Further, the time recognition method of the present invention includes a step of attaching the ACF to the display substrate or a mounting member mounted on the display substrate, and an ACF attached to the display substrate or the mounting member mounted on the display substrate. Recognizing the elapsed time.
When recognizing the elapsed time, for example, a time stamp, a processing time of each device or a sum of processing times, and a processing status are used.

  According to the present invention, by recognizing the elapsed time after the ACF is attached to the display substrate or the mounting member mounted on the display substrate, the ACF that has been exposed to the air for a long time and has reduced adhesiveness can be obtained. It is possible to grasp that it exists in the FPD module assembly line and take appropriate measures. For this reason, even when the elapsed time is prolonged, the reliability of the ACF adhesion can be ensured, and the number of defective FPD modules produced can be reduced as much as possible.

It is a top view which shows schematic structure of the FPD module assembled by the FPD module assembly apparatus based on the 1st Embodiment of this invention. It is a floor layout figure of the FPD module assembly line which shows a 1st embodiment of the FPD module assembly device of the present invention. It is a block diagram of the FPD module assembly line which shows 1st Embodiment of the FPD module assembly apparatus of this invention. It is a top view which shows the temporary crimping | compression-bonding unit which concerns on 1st Embodiment of the FPD module assembly apparatus of this invention. It is the structure schematic of the ACF sticking part which concerns on 1st Embodiment of the FPD module assembly apparatus of this invention. It is a perspective view of the ACF sticking part which concerns on 1st Embodiment of the FPD module assembly apparatus of this invention. FIG. 7A is an explanatory view showing an imaging region in imaging of an electronic component performed by the ACF attaching unit according to the first embodiment of the FPD module assembling apparatus of the present invention, and FIG. 7B is a mounting member performed in the ACF attaching unit. It is explanatory drawing explaining the image measurement of. It is a block diagram which shows the time recognition apparatus which concerns on 1st Embodiment of the FPD module assembly apparatus of this invention. It is a time chart which shows the relationship between the processing time of each unit which concerns on 1st Embodiment of the FPD module assembly apparatus of this invention, and the elapsed time which a time recognition apparatus recognizes. It is a block diagram of the FPD module assembly line which shows 2nd Embodiment of the FPD module assembly apparatus of this invention. It is a block diagram which shows the time recognition apparatus which concerns on 2nd Embodiment of the FPD module assembly apparatus of this invention. It is a time chart which shows the relationship between the processing time of each unit which concerns on 2nd Embodiment of the FPD module assembly apparatus of this invention, and the elapsed time which a time recognition apparatus recognizes. It is a block diagram of the FPD module assembly line which shows 3rd Embodiment of the FPD module assembly apparatus of this invention. It is a block diagram which shows the time recognition apparatus which concerns on 3rd Embodiment of the FPD module assembly apparatus of this invention. It is a block diagram of the FPD module assembly line which shows 4th Embodiment of the FPD module assembly apparatus of this invention. It is a block diagram which shows the time recognition apparatus which concerns on 4th Embodiment of the FPD module assembly apparatus of this invention.

Hereinafter, embodiments for implementing an FPD module assembling apparatus according to the present invention will be described in the following order with reference to the drawings. In addition, the same code | symbol is attached | subjected to the common member in each figure.
1. First Embodiment (Example of time recognition using time stamp)
2. Second Embodiment (Example of time recognition for accumulating processing time)
3. Third embodiment (example of time recognition using processing status)
4). Fourth embodiment (example of time recognition performed for each unit)

1. First Embodiment First, a first embodiment of an FPD module assembling apparatus according to the present invention will be described with reference to FIGS.

[FPD module]
First, the FPD module will be described with reference to FIG.
FIG. 1 is a plan view showing a schematic configuration of an FPD module assembled by the FPD module assembling apparatus according to the first embodiment of the present invention.

  The FPD module 7 is configured by connecting a plurality of mounting members 2 to the peripheral portion of the display substrate 1 by ACF bonding, and ACF connecting the PCB 6 to the mounting member 2 connected to one long side of the display substrate 1. . The mounting member 2 is an electronic component in which an IC chip 5 is mounted on an FPC (Flexible Printed Circuit) 4 in which a printed circuit (not shown) made of copper foil is applied to a flat rectangular polyimide film. The IC chip 5 is mounted substantially at the center of the FPC 4. A printed circuit is provided on the lower surface of the FPC 4, and outer lead terminals (not shown) are provided on both sides (two long sides) in the longitudinal direction.

  Depending on the type of the mounting member 2, there is a case where the IC chip 5 is on the lower surface side (COF type) and a case where there is no IC chip (FPC type). FIG. 1 shows a form in which an IC chip 5 is inserted into the hole of the FPC 4 as an example. Further, the mounting member 2 and the PCB 6 are different from each other in terms of circuit depending on the connection portion, but are not shown in the description of the mounting and mounting, and therefore are illustrated as being the same.

[FPD module assembly line]
Next, the FPD module assembly line which is the first embodiment of the FPD module assembly apparatus of the present invention will be described with reference to FIG. FIG. 2 is a floor layout diagram showing the entire FPD module assembly line.

  The FPD module assembly line 10 includes a receiving unit 100 as a receiving device that receives the display substrate 1, and an ACF attaching portion 230 as an ACF attaching device that attaches the ACF 3a (see FIG. 6) to the mounting member 2 mounted on the display substrate 1. In addition, a temporary pressure bonding unit 200 as a temporary pressure bonding device that temporarily pressure-bonds the mounting member 2 to the display substrate 1 via the ACF 3a, and a main pressure bonding unit as a main pressure bonding device that finally pressure bonds the temporarily pressed mounting member 2 to the display substrate 1. 300, a PCB connection unit 400 as a PCB connection device for connecting the PCB 6 to the ACF 3a for PCB connection affixed to the mounting member 2, and a carry-out unit 500 as a transfer device for transferring the display substrate 1. ing.

  The ACF attaching unit 230 attaches the ACF 3 a for PCB connection to the mounting member 2 before temporarily mounting the mounting member 2 to the display substrate 1. The PCB connection unit 400 connects the PCB 6 to the mounting member 2 after the mounting member 2 is finally press-bonded to the display substrate 1 via the ACF 3a for PCB connection. Based on the “processing information” received from each timer provided in each unit, the time recognizing device 600 calculates the elapsed time after the ACF 3a for PCB connection is attached to the mounting member 2 mounted on the display substrate 1. recognize. In this example, the time from when the ACF 3a is attached to the mounting member 2 mounted on the display substrate 1 to before the PCB connection unit 400 performs main pressure bonding of the PCB 6 to the mounting member 2 via the ACF 3a is expressed as “elapsed time. " The configuration of the time recognition device 600 will be described later with reference to FIG.

Each unit has frames 103, 203, 303, 403, and 503. Conveying rails 101, 201, 301, 401, and 501 are provided on the operation surface side of each frame, and adjacent conveying rails are connected.
The transport rails 101, 201, 301, and 401 support the transport stages 102, 202, 302, and 402 in a movable manner. These transfer stages 102, 202, 302 and 402 transfer the display substrate 1 to the work position of the next unit. Note that a device for receiving the display substrate 1 is separately provided in the last carry-out unit 500, but the carry-out from the carry-out unit 500 is generally omitted here because the specifications differ from factory to factory.

  Reference bars 204, 304, and 404 on which work sides of the display substrate 1 are placed are provided at work positions of the temporary pressure bonding unit 200, the main pressure bonding unit 300, and the PCB connection unit 400. These reference bars 204, 304, and 404 absorb the working side of the display substrate 1 and flatten the display substrate 1. These reference bars 204, 304 and 404 together with the rear end support (not shown) of each unit 200, 300 and 400 stably hold the display substrate 1 in operation.

  The temporary crimping unit 200 temporarily crimps the mounting member 2 (see FIG. 1) to the three sides of the long side and the short side of the display substrate 1 with the ACF 3a. The configuration for temporarily pressing the mounting member 2 will be described in detail later.

  The main crimping unit 300 has three main crimping portions 320A, 320B, and 320C, and simultaneously performs the crimping operation of the mounting member 2 mounted on the three sides of the display substrate 1. The three main crimping portions 320A, 320B, and 320C include a main crimping head having an upper blade and a lower blade. The upper blade and the lower blade are heated by a heater, and the mounting member 2 is heated and pressed to connect to the display substrate 1.

  In order to press-bond the mounting member 2 to the display substrate 1, the display substrate 1 to which the mounting member 2 has been temporarily bonded is pressed from the lower side with the lower blade while being pressed with the upper blade. The ACF 3a pressed by the upper blade is heated and cured at 190 ° C. for 5 seconds, for example.

  In the main crimping unit 300, there is a moving mechanism for moving the main crimping portions 320B and 320C for final crimping the gate-side mounting member 2 temporarily crimped to both short sides of the display substrate 1 in the left-right direction (unit alignment direction). I need it. However, in the main crimping operation with the longest tact time, the three main crimping operations can be performed simultaneously, so that the time (around time) required from the start to the end of the process can be shortened throughout the entire process. is there.

The PCB connection unit 400 connects the PCB 6 to the source-side mounting member 2 connected to the long side of the display substrate 1. The PCB connection unit 400 includes a PCB supply device 430, a transfer device 450, and a main pressure bonding part 460.
The transfer device 450 conveys the PCBs 6 supplied from the PCB supply device 430 one by one to the main crimping unit 460. Then, the main crimping section 460 pressurizes and heats the PCB 6 and connects it to the plurality of source-side mounting members 2.

[Time recognition device]
FIG. 3 is a block diagram showing the FPD module assembling apparatus according to the first embodiment of the present invention.
The FPD module assembly line 10 includes timers 200t, 230t for outputting “processing information” including processing time counted for each process to the provisional pressure bonding unit 200, the ACF attaching portion 230, the main pressure bonding unit 300, and the PCB connection unit 400. 300t and 400t are provided.

  Further, the FPD module assembly line 10 includes the time recognition device 600 and the warning unit 601 that recognize the elapsed time as described above. The warning unit 601 continues when the PCB 6 is not permanently bonded to the ACF 3a while the ACF 3a is stuck to the mounting member 2 mounted on the display substrate 1, and the elapsed time exceeds an allowable time described later. An alarm is notified to the operator.

  Each timer is always installed in the ACF attaching unit 230 and is installed in at least one of the temporary crimping unit 200, the main crimping unit 300, and the PCB connection unit 400. Among the processing to be performed, processing information including the time at which the processing included in the elapsed time is completed (however, the timing before the final press-bonding for the PCB connection unit 400) is sent to the time recognition device 600. Then, the time recognition device 600 recognizes the elapsed time based on the time stamp associated with the identification information (hereinafter referred to as “ID”) of the display substrate 1 from the processing information received from each timer. The display substrate 1 is identified for each sheet by the ID.

  The timer 200t is a time stamp that is attached at the end of the process in which the display substrate 1 to which the ACF 3a is attached by the ACF attaching unit 230 after the display substrate 1 is carried into the temporary crimping unit 200 is carried out to the main crimping unit 300. Is included in the processing information, and this processing information is sent to the time recognition device 600. In the following description, the processing information output by each timer includes an ID for each unit in addition to the ID of the display substrate 1.

The timer 230t is installed in the ACF pasting unit 230, includes the time of the timing when the ACF 3a is pasted on the first mounting member 2 as a time stamp, and sends this processing information to the time recognition device 600.
The timer 300t has a time stamp attached at the end of the process of carrying out the display board 1 to the PCB connection unit 400 after the display board 1 is carried into the main crimping unit 300 and the ACF 3a attached to the display board 1 is finally crimped. The processing information is included in the processing information and sent to the time recognition device 600.
The timer 400t includes, in the processing information, a time stamp attached in consideration of an expected processing time from when the display substrate 1 is carried into the PCB connection unit 400 to before the final press-bonding. To device 600. As a result, an alarm is output to the operator before the PCB 6 is finally press-bonded to the ACF 3a having deteriorated adhesiveness, and the operator can check the ACF 3a. For this reason, generation | occurrence | production of the inferior goods containing PCB6 accidentally this press-bonded to ACF3a to which adhesiveness fell can be prevented.

  At the start of operation of each unit, the dates and times of the timers 200t, 230t, 300t, and 400t do not match. For this reason, the time recognition device 600 adjusts the current date and time according to the local standard time, and distributes the reference time including the date and time to the timers 200t, 230t, 300t, and 400t. Thus, the date and time of each timer are matched.

Here, the timers 200t, 230t, 300t, and 400t will be described.
The timers 200t, 230t, 300t, and 400t measure when the timing set for each process is completed according to the reference time, and when the display board 1 is processed for each process. There is.

  When measuring the timing at which the processing is completed in accordance with the reference time, for example, when looking at the provisional crimping unit 200, the timer 200t is finished processing as “March 1, 2011 10:10:15”. The obtained time is associated with the ID of the display substrate 1 as a time stamp. Then, the timer 200t notifies the time recognition device 600 of processing information including the ID of the display substrate 1 and a time stamp. Thereby, the time recognition device 600 recognizes what year, month, day, hour, minute, and second when the provisional pressure bonding unit 200 completes the processing for the display substrate 1.

  On the other hand, when measuring the processing time of the display substrate 1 for each unit, for example, the timer 200t starts counting from 0 seconds, counts up the elapsed time during processing, and then performs processing in the provisional pressure bonding unit 200. The time required up to the point of completion is associated with the ID of the display substrate 1 and notified to the time recognition device 600 as processing information. Thereby, the time recognition apparatus 600 recognizes the time required from the start to the end of the process performed by the temporary crimping unit 200 on the display substrate 1. A time recognition device that recognizes the elapsed time using such a timer will be described later as an FPD module assembly line 11 (see FIGS. 10 to 12) according to the second embodiment.

  Here, the FPD module assembly line 10 may be stopped for a long time due to consecutive holidays, unit failure, parts shortage, and the like. At this time, the ACF 3a used for the connection of the PCB 6 remains exposed to the air. As described above, when the ACF 3a is exposed to the air for a long time, the adhesiveness of the ACF 3a is lowered. Therefore, the ACF 3a having the lowered adhesiveness can be reliably detected on the display substrate 1 attached to the mounting member 2. Desired. Since the detected display substrate 1 is operated so as not to flow to the next process, for example, the display substrate 1 can be discarded, or the ACF 3a can be peeled off from the mounting member 2 and a new ACF 3a can be attached again. Become. In this example, the case where the elapsed time of the ACF 3a is recognized using the processing information in which the time stamp is associated with the ID of the display substrate 1 will be described later with reference to FIGS.

  When the ACF 3a is pasted on each of the plurality of mounting members 2 by the ACF pasting unit 230, and the plurality of mounting members 2 on which the ACF 3a is pasted are pasted on the display substrate 1, the time recognition device 600 uses the first mounting member 2 The time of the timing when the ACF 3a is pasted is set as the start of the processing time, and a time stamp is attached at the timing when all the ACFs 3a are pasted. At this time, the timer 230t associates the time stamp with the ID attached to the display substrate 1 and sends processing information including the ID and the time stamp to the time recognition device 600. Similarly, the timers 200t and 300t associate a time stamp attached at the timing when processing performed in each process is completed with respect to the display substrate 1 attached with the ID sent to the time recognition device 600 with the ID. Then, processing information including this ID and time stamp is sent to the time recognition device 600. However, in the PCB connection unit 400, the timer 400t includes the time stamp attached before the main press-bonding of the PCB 6 in the processing information and sends it to the time recognition device 600. The time recognition device 600 reads the ID and time stamp of the display substrate 1 from the processing information received from the timers 200t, 230t, 300t, and 400t, and is required before the PCB 6 is finally bonded to the ACF 3a attached to the display substrate 1. Recognize elapsed time.

  Then, when the ACF 3a is pasted on the mounting member 2 mounted on the display substrate 1 for a long time, an alarm from the warning unit 601 indicates that there is an ACF 3a that may have decreased adhesiveness on the line. To inform the operator. Since this alarm is recorded in a log that records the processing executed by the time recognition device 600 with time, the cause of the alarm is grasped by the log when the operator performs an action.

  In the following description, the time during which the adhesion of the ACF 3a exposed to air is maintained is referred to as “allowable time”. If the elapsed time exceeds the allowable time before the main crimping of the PCB 6 is performed, the warning unit 601 issues an alarm as an operator call. The operator call may be, for example, turning on an unillustrated indicator light, temporarily stopping the operation of each unit, sending an email indicating that an abnormality has occurred to the operator, or from an unillustrated speaker. A treatment that sounds a buzzer sound is assumed.

  The operator who receives the operator call takes measures immediately. For example, when the operator confirms the state of each unit and there is a concern about a decrease in the adhesiveness of the ACF 3a, the ACF 3a is mounted on the display substrate 1 staying in the process of the FPD module assembly line. By performing a process of turning the member 2 to a regeneration process, a measure for avoiding the occurrence of defective products is taken. As another example, the decrease in the adhesiveness of ACF3a may be considered to be caused by the decrease in the fluidity of the resin component due to exposure to air for a long time. For this reason, when an alarm is notified by the warning unit 601, the time recognition device 600 applies pressure to the PCB connection unit 400 more than the existing processing when the elapsed time does not exceed the predetermined time. The existing process can be changed to a process including at least one of the process of increasing, the process of increasing the pressurization time, or the process of increasing the pressure bonding temperature. Thereby, it is possible to maintain the quality of the FPD module by automatically correcting the processing included in the existing process without moving the display substrate 1 to another line.

[Temporary crimping unit]
FIG. 4 is a plan view showing the temporary crimping unit 200 according to the first embodiment of the FPD module assembling apparatus of the present invention. FIG. 5 is a schematic configuration diagram of the ACF sticking unit 230 according to the first embodiment.

  As shown in FIG. 4, the provisional pressure bonding unit 200 includes a mounting member supply unit 220, an ACF sticking unit 230, and a mounting unit 280. The mounting member supply unit 220 includes a reel 221, a reel feed mechanism 222 that rotates the reel 221, and a punching mechanism 223.

  A mounting member 2 mounted on the display substrate 1 is wound around a reel 221 as a long ribbon-like film. The reel 221 is rotated by a reel feeding mechanism 222 to feed a ribbon-like film at a specified pitch. The punching mechanism 223 punches out the ribbon-shaped film sent out by the reel 221 and cuts out the mounting member 2 individually. The cut-out mounting member 2 is taken out by the take-out mechanism 224 (see FIG. 5) and supplied to the ACF sticking unit 230.

  The ACF attaching section 230 attaches the ACF 3a of the ACF tape 3 to one side (one long side) in the longitudinal direction of the supplied mounting member 2 (see FIG. 6 described later). The mounting member 2 on which the ACF 3 a is pasted by the ACF pasting unit 230 is delivered to the delivery unit 275. The delivery unit 275 is supported by the X-axis guide 276 so as to be movable. The delivery unit 275 delivers the mounting member 2 to the mounting unit 280.

  The mounting unit 280 includes a long side mounting unit 280A for mounting the mounting member 2 on the long side of the display substrate 1 and short side mounting units 280B and 280C for mounting the mounting member 2 on the short side of the display substrate 1, respectively. Yes. The long side mounting portion 280A and the short side mounting portions 280B and 280C receive the mounting member 2 from the transfer portion 275.

  The long side mounting portion 280A includes a shuttle chuck 281, a Y-axis guide 282, an X-axis guide 283, a mounting block 285, an X-axis guide 286, and a camera unit 287.

  The shuttle chuck 281 receives the mounting member 2 from the delivery unit 275. The shuttle chuck 281 is movably supported by the Y-axis guide 282. The Y-axis guide 282 is supported by the X-axis guide 283 so as to be movable. Thereby, the shuttle chuck 281 is movable in the horizontal direction. Two shuttle chucks 281 and two Y-axis guides 282 are provided. The two Y-axis guides 282 share the X-axis guide 283.

  The mounting block 285 includes a mounting base 291, a mounting member base 292, a mounting head 293, and a delivery head 294. The mounting base 291 is movably supported by the X-axis guide 286 and moves to a mounting position on the long side of the display substrate 1. The mounting member base 292, the mounting head 293, and the delivery head 294 are disposed on the mounting base 291.

  The shuttle chuck 281 approaches the mounting base 291 and passes the mounting member 2 to the mounting member base 292. The delivery head 294 delivers the mounting member 2 on the mounting member base 292 to the mounting head 293. The mounting head 293 temporarily presses (mounts) the mounting member 2 supplied from the delivery head 294 to the mounting position of the display substrate 1. At this time, prior to the movement of the mounting base 291, the pair of camera units 287 previously waiting below both ends of the mounting position each have a two-field lens, and the mounting marks on the display substrate 1 and the positioning marks on the mounting member 2 Take an image. The positioning error calculated by the image measurement is transmitted to the mounting head 293, and the mounting head 293 mounts the mounting member 2 on the display substrate 1 while adjusting (positioning) the mounting position by the received individual adjustment value. .

  Two sets of mounting blocks 285 and camera units 287 of the long side mounting unit 280A are provided corresponding to the shuttle chuck 281. The two mounting bases 291 share the X-axis guide 286.

  The short side mounting portions 280B and 280C have the same configuration as the long side mounting portion 280A. That is, the short side mounting portions 280B and 280C each include a shuttle chuck 281, an X axis guide 296, a Y axis guide 297, a mounting block 285, a Y axis guide 298, and a camera unit (not shown). .

  The shuttle chucks 281 of the short side mounting portions 280B and 280C are movably supported by the X axis guide 296, and the X axis guide 296 is movably supported by the Y axis guide 297. The mounting bases 291 of the short side mounting portions 280B and 280C are movably supported by the Y-axis guide 298 and move to the mounting position on the short side of the display substrate 1.

  When the display substrate 1 is placed on the reference bar 204, the reference marks at both ends are photographed in advance by the camera unit 287, and the display substrate 1 is delivered in a state where rough alignment adjustment is performed. However, in order to avoid the displacement of the mounting position due to the dimensional error of the display substrate 1, the alignment is performed individually even when mounting by the mounting head 293.

As shown in FIG. 5, the ACF sticking unit 230 includes a carry-in cross arm 260, an ACF sticking block 270, and a carry-out cross arm 262.
The carry-in cross arm 260 includes four arm pieces 260 a and supplies the mounting member 2 to the ACF attachment block 270. Each of the four arm pieces 260 a of the carry-in cross arm 260 has a mounting member chuck 261 that vacuum-sucks the mounting member 2. The carry-in cross arm 260 is rotated by about 90 degrees, and each arm piece 260a is arranged at the take-out position, the cleaning position, the imaging position, and the placement / crimping position.

  A punching mechanism 223 and a takeout mechanism 224 are disposed at the takeout position of the mounting member 2. At this take-out position, the upside down arm 224 a of the take-out mechanism 224 takes out the mounting member 2 from the punching mechanism 223 and passes it to the mounting member chuck 261. A brush 225 is disposed at the cleaning position. In this cleaning position, the brush 225 cleans the surface to which the ACF 3a (see FIG. 6) of the mounting member 2 adsorbed by the mounting member chuck 261 is attached.

  A first imaging camera 226 is disposed at the imaging position. At this imaging position, the first imaging camera 226 images the mounting member 2 attracted to the mounting member chuck 261 from below, and the length of the end portion (side to which the ACF 3a is attached) of the mounting member 2 and the alignment mark 256A. , 256B (see FIG. 6) is detected. An ACF sticking block 270 is disposed at the mounting / crimping position. At this placement / crimping position, the mounting member 2 attracted to the mounting member chuck 261 is transferred to the ACF attachment block 270. The ACF sticking block 270 will be described in detail later with reference to FIG.

  The carry-out cross arm 262 includes four arm pieces 262 a as well as the carry-in cross arm 260 and supplies the mounting member 2 to the mounting unit 280. Each of the four arm pieces 262 a of the carry-out cross arm 262 has a peeling chuck 284 that vacuum-sucks the mounting member 2. The carry-out cross arm 262 rotates by about 90 degrees, and each arm piece 262a is arranged at the peeling position, the imaging position, the carry-out position, and the standby position.

  An ACF attachment block 270 is disposed at the peeling position. At the peeling position, the mounting member 2 to which the ACF 3a (see FIG. 6) is attached is attracted to the peeling chuck 284. A second imaging camera 227 is disposed at the imaging position. At this imaging position, the second imaging camera 227 images the mounting member 2 adsorbed by the peeling chuck 284 from below. The image captured by the second imaging camera 227 is output to an image processing device (not shown), and the state of the ACF 3a attached to the mounting member 2 is inspected.

  A delivery unit 275 (see FIG. 4) is disposed at the carry-out position. At this unloading position, the mounting member 2 that has been determined to be acceptable by the inspection based on the image captured at the imaging position is delivered to the delivery unit 275. The delivery unit 275 delivers the supplied mounting member 2 to the mounting unit 280. At the standby position, the peeling chuck 284 that has not attracted the mounting member 2 is on standby. In addition, the mounting member 2 in which the inspection result at the imaging position is unacceptable is discarded at the standby position and collected by a collection unit (not shown).

[ACF pasting block]
Next, the ACF sticking block 270 will be described with reference to FIG. FIG. 6 is a perspective view of the ACF attachment unit 230 according to the first embodiment.

  The ACF attachment block 270 shown in FIG. 6 attaches the ACF 3 a of the ACF tape 3 to the two sides of the mounting member 2 supplied from the carry-in cross arm 260. The ACF attachment block 270 includes a supply reel (not shown), guide rollers 241A, 241B, and 241C, a base film collection unit 242, a first cutter blade 294A, and a second cutter blade 294B. Further, the ACF sticking block 270 includes an ACF guide 246, a crimping blade 247, a lower support 248, a suction receiver 249, a peeling roller 251, moving chucks 252A and 252B, and a fixed chuck 253.

  The first cutter blade 294A and the second cutter blade 294B are arranged at an appropriate interval in a direction parallel to the feed direction of the ACF tape 3 (longitudinal direction of the ACF tape). The first cutter blade 294A is moved in the vertical direction and the longitudinal direction of the ACF tape 3 by a first cutter blade driving mechanism (not shown). Further, the angle of the first cutter blade 294A is corrected with respect to the ACF tape 3 by the first cutter blade driving mechanism.

  Similar to the first cutter blade 294A, the second cutter blade 294B is moved in the vertical direction and the longitudinal direction of the ACF tape by a second cutter blade drive mechanism (not shown). Further, the angle of the second cutter blade 294B is corrected with respect to the ACF tape 3 by the second cutter blade driving mechanism. Thus, the first and second cutter blade drive mechanisms are used as a cutting unit that cuts the ACF at the cutting position determined by the arithmetic processing unit (not shown).

  The ACF tape 3 is half-cut by the first cutter blade 294A and the second cutter blade 294B. A hollow arm (not shown) is provided between the first cutter blade 294A and the second cutter blade 294B. This hollow arm attaches and removes excess ACF 3a between two half cuts formed by the first cutter blade 294A and the second cutter blade 294B to an adhesive tape. The half-cut here refers to a process of giving a cut to the ACF layer and cutting the base film layer so that the base film layer is not completely separated but maintains continuity.

  The ACF guide 246 is a stainless steel member having a smooth surface, and the surface facing the mounting member chuck 261 is subjected to fluororesin processing. As a result, the ACF 3 a protruding from the base film 3 b is not fixed to the ACF guide 246. The ACF guide 246 movably supports the ACF tape 3 and the mounting member 2 placed on the ACF 3 a of the ACF tape 3.

  Although FIG. 6 shows that the mounting member chuck 261 is detached from the arm piece 260a of the carrying-in cross arm 260, the mounting member chuck 261 is connected to and integrated with the arm piece 260a. The mounting member chuck 261 is lowered together with the arm piece 260 a and presses the mounting member 2 against the ACF 3 a of the ACF tape 3 fed onto the ACF guide 246. Further, the mounting member chuck 261 and the ACF guide 246 have built-in heaters, and the mounting member 2 and the ACF tape 3 are heated at, for example, 70 to 90 ° C.

  The crimping blade 247 is lowered by an elevating mechanism (not shown), and the mounting member 2 and the ACF tape 3 are sandwiched between the pressure receiving blade 248 and pressurized at, for example, 2 MPa. Further, a heater is built in a portion of the crimping blade 247 and the lower support 248 facing the ACF tape 3, and the mounting member 2 and the ACF tape 3 are heated at, for example, 70 to 90 ° C. The heating temperature and pressure of the mounting member chuck 261, the ACF guide 246, the crimping blade 247, and the lower support 248 are appropriately set according to the adhesiveness of the ACF to be used.

  The moving chucks 252A and 252B sandwich the base film 3b between the two half cuts from which the excess ACF 3a has been removed, respectively. These movable chucks 252A and 252B are supported by chuck bases 255A and 255B, respectively. The chuck bases 255A and 255B move the moving chucks 252A and 252B by one pitch in the feeding direction of the ACF tape 3 or in the direction opposite to the feeding direction. The fixed chuck 253 is disposed between the guide roller 241C and the base film collection unit 242, and sandwiches the base film 3b peeled off from the ACF 3a.

Next, the operation of the ACF pasting block 270 will be described.
The direction of the ACF tape 3 is changed by the guide roller 241 </ b> A and is disposed at a fixed position on the ACF guide 246. The ACF tape 3 is half-cut by the first cutter blade 294A and the second cutter blade 294B before being placed on the ACF guide 246. At this time, the first cutter blade 294A and the second cutter blade 294B are the lengths of the end portions (sides to which the ACF 3a is attached) of the mounting member 2 detected from the image captured by the first imaging camera 226. The drive is controlled based on the inclination. The drive control of the first cutter blade 294A and the second cutter blade 294B will be described in detail later.

  The mounting member chuck 261 of the carry-in cross arm 260 conveys the mounting member 2 by vacuum suction and places it on the ACF 3 a of the ACF tape 3 stretched along the ACF guide 246 to pressurize it. At this time, the mounting member chuck 261 is driven based on the alignment marks 256A and 256B of the mounting member 2 imaged by the first imaging camera 226, and corrects the posture (X, Y, θ) of the mounting member 2 with respect to the ACF 3a. To do.

  As described above, the crimping blade 247 presses the mounting member 2 and the ACF tape 3 between the lower support 248 and the pressure. On the other hand, the peeling chuck 284 of the carry-out cross arm 262 sucks the mounting member 2 supported by the suction receiver 249. The moving chucks 252A and 252B sandwich the base film 3b, and the fixed chuck 253 opens the base film 3b.

  The mounting member chuck 261 that has been pressurized releases the vacuum suction to the atmosphere and moves away from the mounting member 2. In addition, the pressure-bonding blade 247 that has been pressurized is raised by the lifting mechanism. The chuck bases 255A and 255B move the moving chucks 252A and 252B sandwiching the base film 3b by one pitch in the feed direction. As a result, the mounting member 2 and the ACF tape 3 are fed by one pitch in the feeding direction.

  At this time, the peeling roller 251 is inserted between the ACF 3a attached to the mounting member 2 adsorbed by the peeling chuck 284 and the base film 3b, and the base film 3b is peeled from the ACF 3a.

  When the feeding of the mounting member 2 and the ACF tape 3 is completed, the fixed chuck 253 sandwiches the base film 3b from which the ACF 3a has been peeled off. Then, the moving chucks 252A and 252B open the base film 3b and move by one pitch in the direction opposite to the feeding direction by the chuck bases 255A and 255B.

  The carry-in cross arm 260 and the carry-out cross arm 262 rotate about 90 degrees. Thereby, the mounting member 2 adsorbed by the mounting member chuck 261 of the carry-in cross arm 260 is disposed above the ACF guide 246. Further, the mounting member 2 to which the ACF 3a adsorbed to the peeling chuck 284 of the carry-out cross arm 262 is attached is moved to the imaging position, and the peeling chuck 284 that does not suck the mounting member 2 is located above the suction receiver 249. Be placed. Thereby, the operation of the ACF sticking block 270 is completed, and the ACF tape 3 is half-cut by the first cutter blade 294A and the second cutter blade 294B.

[Cutter blade drive control]
Next, drive control of the first cutter blade 294A and the second cutter blade 294B in the ACF attaching part 230 will be described with reference to FIG. FIG. 7A is an explanatory diagram illustrating an imaging region in imaging of the mounting member 2 performed in the ACF attaching unit 230. FIG. 7B is an explanatory diagram for explaining image measurement of the mounting member 2 performed in the ACF attaching unit 230.

  The first cutter blade 294A and the second cutter blade 294B of the ACF attaching section 230 are driven and controlled by a control circuit (not shown). In the ACF pasting unit 230, the position of the terminal portion S is detected by an image processing device (not shown). Further, the length of the end portion (side to which the ACF 3a is attached) of the mounting member 2 and the inclination with respect to the terminal portion are detected.

  The first imaging camera 226 has a two-field lens and images imaging areas T1 and T2 including two corners of the mounting member 2 on which the two alignment marks 256A and 256B are provided. The image processing apparatus (not shown) detects the position of the terminal portion S by using the two alignment marks 256A and 256B. Further, the length M of the end portion (side to which the ACF 3a is attached) of the mounting member 2 is detected from the corner area M1 in the imaging area T1 and the corner area M2 in the imaging area T2. Furthermore, the inclination with respect to the terminal portion S of the front and rear sides of the mounting member 2 in the feeding direction (traveling direction) is detected.

  Note that the imaging unit according to the present embodiment is not limited to the first imaging camera 226 having a two-field lens, and may be configured by two imaging cameras and a prism, for example. In this case, one imaging camera images the imaging area T1 via the prism, and the other imaging camera images the imaging area T2 via the prism. When changing the positions of the imaging regions T1 and T2 according to the type of the mounting member, the two imaging cameras are fixed and the prism is moved, or the prisms are fixed and the two imaging cameras are moved. Yes.

  An arithmetic processing unit (not shown) determines a correction value for the posture (X, Y, θ) of the mounting member 2 with respect to the ACF 3 a based on the position of the terminal portion S. The first cutter blade 294A and the second cutter blade are based on the length M of the end portion of the mounting member 2 and the inclination of the front and rear sides of the mounting member 2 in the feeding direction (traveling direction) with respect to the terminal portion S. The cutting position by 294B is determined. And the cutting position by the 2nd cutter blade 294B is memorize | stored in a memory | storage part (not shown).

  The drive output unit (not shown) generates a drive signal based on the cutting position of the first cutter blade 294A determined based on the current image measurement, and outputs the drive signal to a first cutter blade drive mechanism (not shown). The first cutter blade drive mechanism rotates and horizontally moves the first cutter blade 294A based on the received drive signal when the corresponding mounting member 2 is at the imaging position.

  Thereby, the first cutter blade 294A is arranged at a position corresponding to the length M of the end portion of the mounting member 2 parallel to the front side of the corresponding mounting member 2 in the feeding direction. Then, the first cutter blade driving mechanism lowers the first cutter blade 294A and cuts the ACF 3a.

  Further, the drive output unit (not shown) extracts the cutting position by the second cutter blade 264B from the storage unit when the corresponding mounting member 2 is placed at the mounting / crimping position (above the ACF guide 246). To do. And a drive signal is produced | generated based on the extracted cutting position, and it outputs to the 2nd cutter blade drive mechanism not shown. The second cutter blade drive mechanism rotates and horizontally moves the second cutter blade 294B based on the received drive signal.

  Thus, the second cutter blade 294B is arranged at a position corresponding to the length M of the end portion of the mounting member 2 parallel to the rear side of the corresponding mounting member 2 in the feed direction. Then, the second cutter blade driving mechanism lowers the second cutter blade 294B and cuts the ACF 3a. As a result, the ACF 3a can be cut to a length corresponding to the corresponding mounting member 2, and the ACF 3a can be attached to the mounting member 2 with high accuracy.

  FIG. 8 is a block diagram showing a time recognition device 600 according to the first embodiment of the FPD module assembly device of the present invention.

  The time recognizing device 600 includes a time stamp attached at a timing when processing is completed in each step from the timers 200t, 230t, 300t, and 400t (however, the PCB connection unit 400 is a timing before the main press-bonding of the PCB 6) and this time. An information collecting unit 602 that collects processing information including the ID and the like of the display substrate 1 associated with the stamp is provided. Further, an allowable time database 603 for storing the allowable time for each type of the display substrate 1 is provided. Moreover, the determination part 604 which determines whether the time when ACF3a is exposed to the air exceeded permissible time was provided. When the determination unit 604 determines the time during which the ACF 3 a is exposed to the air, the elapsed time obtained from the allowable time read from the allowable time database 603 and the time stamp of the display substrate 1 collected by the information collection unit 602. Compare

  The time recognizing device 600 includes a year, month, day, hour, and hour in accordance with a standard time (in this example, a local standard time) received from an external network (not shown), and is a reference time used as a reference time in the FPD module assembly line 10. A reference time holding unit 605 that corrects the information and holds the reference time and distributes the reference time to the determination unit 604 and each timer is provided. The reference time held by each timer is set to the reference time received from the reference time holding unit 605.

  Note that the warning unit 601, the information collection unit 602, the determination unit 604, and the reference time storage unit 605 may be configured as a program executed by an arithmetic processing device such as a computer, or correspond to each functional block. A processing mechanism may be provided. The allowable time database 603 may be stored in a memory, an HDD, or the like, or an allowable time table may be written in the program of the determination unit 604.

  FIG. 9 is a time chart showing the relationship between the processing time of each unit and the elapsed time recognized by the time recognition device 600. FIG. 9A shows a normal operation state of the FPD module assembling apparatus. FIG. 9B shows a state in which the process of the next process is stopped after the process by the provisional pressure bonding unit 200 is performed.

  As shown in FIG. 9A, in a normal operation, the temporary crimping unit 200, the ACF attaching unit 230, the main crimping unit 300, and the PCB connection unit 400 perform processing on the display substrate 1 in a predetermined processing time, respectively. The display substrate 1 is transferred to the next process. In FIG. 9, the inverted triangle attached to the upper right of the rectangular frame indicating the processing time of each unit represents a time stamp indicating the end time of processing performed for each process. However, this inverted triangle represents the processing time in which the ACF 3a is pasted on the mounting member 2 that is first pasted on the display substrate 1 in the ACF pasting portion 230, and in the PCB connection unit 400, before the PCB 6 is finally press-bonded. Expressed as a time stamp indicating the processing time. In this example, after the ACF 3a is pasted on the mounting member 2 that is first pasted on the display substrate 1 by the ACF pasting unit 230, the allowable time during which the adhesiveness of the ACF 3a does not decrease is set to about several hours. The processing time required from the ACF pasting section 230 to the final bonding of the PCB 6 by the PCB connection unit 400 is expressed as an elapsed time recognized by the time recognition device 600. Since this elapsed time is within the allowable time, It can be seen that no elapsed time has been generated so that the adhesiveness of the ACF 3a exposed to is lowered.

  As shown in FIG. 9B, in this example, the ACF 3 a is attached to the display substrate 1 by the ACF attaching unit 230, and after the temporary pressure bonding unit 200 is temporarily pressure bonded, the main pressure bonding unit 300 which is the next process is performed. Processing has stopped. Here, although the time at which the process is completed for each process is added to the process information as a time stamp by the timers 200t and 230t, the display board 1 is not subjected to the process by the main pressure bonding unit 300. Processing by the unit 400 is not performed. As described above, the time recognition device 600 includes the processing information including the time stamp attached at the timing when the ACF 3 a is attached to the first mounting member 2 mounted on the display substrate 1 by the ACF attaching unit 230, The elapsed time is recognized based on the processing information including the time stamp attached at the timing when the process of carrying the display substrate 1 to the main crimping unit 300 is completed by the timer 200t of the crimping unit 200. Then, as shown in FIG. 9B, when the elapsed time recognized by the time recognition device 600 exceeds the allowable time, the time recognition device 600 considers that the adhesiveness of the ACF 3a is lowered, and the PCB 6 is finally press-bonded. The warning unit 601 issues a warning to the operator before.

  In addition, when the elapsed time exceeds the allowable time, the time recognition device 600 includes an instruction to exclude the display substrate 1 to which the ACF 3a is attached in an alarm. As a result, the operator can take measures such as removing the display substrate 1 stuck with the ACF 3a from the line that has remained in the FPD module assembly line 10 beyond the allowable time. In addition, while notifying an alarm, the display substrate 1 may be automatically removed by a transfer device (not shown).

  According to the FPD module assembling apparatus according to the first embodiment described above, the time recognition apparatus 600 until the ACF 3a is pasted on the PCB side of the mounting member 2 and before the PCB 6 is finally press-bonded to the ACF 3a. By recognizing the elapsed time and comparing the elapsed time with the allowable time, it is possible to identify the ACF 3a having reduced adhesiveness. At this time, since the time recognition device 600 uses the time stamp and the ID of the display substrate 1 that are given for each process when recognizing the elapsed time, the display substrate 1 that needs to be handled can be reliably identified.

  For this reason, the time recognition apparatus 600 can grasp that the display substrate 1 to which the ACF 3a that has been exposed to the air for a long time and the adhesiveness is reduced is present in the FPD module assembly line. Appropriate measures such as eliminating the display substrate 1 or correcting an existing process can be taken before the main body is pressure-bonded. For example, when the warning unit 601 notifies an alarm, an operator call (indicator lamp, device pause, mail transmission, buzzer sound, etc.) can be performed to prompt the operator to take measures. As a result of the operator's confirmation, if there is a concern that the adhesiveness of the ACF 3a may be reduced, for example, the regeneration of peeling the mounting member 2 (for example, COF) to which the ACF 3a is attached from the display substrate 1 that has stayed in the middle of the process. By performing the process of transferring the display substrate 1 to the process, the display substrate 1 to which the ACF 3 a having reduced adhesion is attached is removed from the FPD module assembly line 10. As a result, it is possible to prevent the PCB 6 from being connected to the ACF 3a for PCB connection whose adhesiveness has deteriorated, and to ensure the reliability of the ACF for adhesiveness even when the elapsed time is prolonged. Can do. In addition, by recognizing the elapsed time during processing of the ACF 3a for PCB connection by the time recognition device 600 and taking appropriate measures, it is possible to prevent the elapsed time from being prolonged and to reduce the production of defective products as much as possible.

2. Second Embodiment Next, a second embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIGS. FIG. 10 is a block diagram of an FPD module assembly line 11 showing a second embodiment of the FPD module assembly apparatus of the present invention.

  The main configuration of the FPD module assembly line 11 is the same as that of the FPD module assembly line 10 according to the first embodiment described above. However, the FPD module assembly line 11 includes timers 210t, 231t for measuring the processing time required for processing the temporary bonding unit 200, the ACF attaching unit 230, the main pressing unit 300, and the PCB connection unit 400 for the display substrate 1, respectively. 310t, 410t, and a time recognizing device 610 that recognizes the sum of these processing times as an elapsed time. That is, each of the timers 200t, 230t, 300t, and 400t according to the first embodiment has a reference time, and the display board uses as a time stamp what time and how many seconds the processing obtained from the reference time is completed. In this example, the timers 210t, 231t, 310t, and 410t measure how many seconds it took to process the display substrate 1, and the time recognition device 610 calculates these processing times. It differs from the first embodiment in that the accumulated total processing time is recognized as the elapsed time.

  FIG. 11 is a block diagram showing a time recognition device 610 according to the second embodiment of the FPD module assembly device of the present invention.

  The time recognizing device 610 works from the start of processing performed by each unit on the display substrate 1, which is timed by timers installed in the ACF pasting unit 230, the temporary crimping unit 200, the main crimping unit 300 and the PCB connection unit 400. Receives processing time required for discharge. Then, the time recognition device 610 recognizes the total processing time received from each timer as the elapsed time.

  Specifically, the time recognizing device 610 includes an information collecting unit 602 that collects processing information including the processing time processed in each process and the ID of the display substrate 1 from the timers 210t, 231t, 310t, and 410t, and the ACF 3a. An allowable time database 603 for storing the allowable time is provided. Note that the timer 410t installed in the PCB connection unit 400 outputs the time from when the PCB 6 is loaded into the PCB connection unit 400 to when the PCB 6 is finally press-bonded to the time recognition device 610 as a processing time.

  The time recognition device 610 includes a time accumulation unit 606 that accumulates the processing time collected by the information collection unit 602 for each ID of the display substrate 1 as an elapsed time, and the elapsed time exceeds the allowable time read from the allowable time database 603. A determination unit 607 for determining whether or not When determining that the elapsed time exceeds the allowable time, the determination unit 607 instructs the warning unit 601 to notify the operator of an alarm.

  The time recognition device 610 does not require the reference time holding unit 605 according to the first embodiment described above. This is because the timers 210t, 231t, 310t, and 410t measure the processing time required for each process regardless of the reference time, and the reference time holding unit 605 is a reference for the timers 210t, 231t, 310t, and 410t. This is because there is no need to distribute time. The determination unit 607 also does not need the reference time holding unit 605 because the reference time is not used when comparing the elapsed time and the allowable time.

  FIG. 12 is a time chart showing the relationship between the processing time of each unit and the elapsed time recognized by the time recognition device 610. FIG. 12A shows a normal operation state of the FPD module assembling apparatus. FIG. 12B shows a state where the process of the next process is stopped after the process by the provisional pressure bonding unit 200 is performed.

  In the normal operation state shown in FIG. 12A, the time recognition device 610 performs the process until the PCB connection unit 400 performs the main pressure bonding of the PCB 6 within an allowable time after the ACF 3a is attached to the mounting member 2 mounted on the display substrate 1. Recognize the elapsed time. Here, unlike FIG. 9A described above, in FIG. 12A, a time stamp is not attached even if the processing of each step is completed. That is, the processing time of each process is only sent to the time recognition device 610 as processing information.

  As shown in FIG. 12B, in this example, the display substrate 1 is transported to the main pressure bonding unit 300 after the processing in the temporary pressure bonding unit 200 is completed. However, if the operation of the main pressure bonding unit 300 is stopped, no processing is performed on the conveyed display substrate 1. At this time, the timer 310t starts measuring the processing time at the timing when the display substrate 1 is received, and continues counting until the main press bonding process is performed. The processing information including the measured processing time is sent to the time recognition device 610 in real time in each of the ACF pasting unit 230, the provisional crimping unit 200, and the main crimping unit 300. Normally, each timer can measure time independently even when the power of the unit is turned off. For this reason, even if the processing of the entire FPD module assembly line 11 is stopped, the processing information is sent from the timer to the time recognition device 610 when the processing is resumed, so that the time recognition device 610 recognizes the elapsed time. be able to.

  The time accumulating unit 606 provided in the time recognizing device 610 accumulates the processing time of each process for the display substrate 1 specified by the ID from the processing information collected from each unit by the information collecting unit 602, and the accumulated processing time is obtained. Elapsed time. Then, the determination unit 607 compares the allowable time read from the allowable time database 603 with the elapsed time, and issues an alarm notification instruction to the warning unit 601 when the elapsed time exceeds the allowable time.

  According to the time recognition device 610 according to the second embodiment described above, an alarm is notified when the elapsed time obtained by accumulating the processing time counted by each unit exceeds the allowable time. For this reason, the operator can know that the adhesiveness of the ACF 3a attached to the display substrate 1 has decreased when the elapsed time exceeds the allowable time, and the display substrate 1 before the PCB 6 is finally crimped. Can be quickly taken out of the FPD module assembly line 11.

3. Third Embodiment Next, a third embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIG. 13 and FIG. FIG. 13 is a block diagram of an FPD module assembly line 12 showing a third embodiment of the FPD module assembly apparatus of the present invention.

  The main configuration of the FPD module assembly line 12 is the same as that of the FPD module assembly line 10 according to the first embodiment described above. However, in this example, the ACF sticking portion 230, the provisional pressure bonding unit 200, the main pressure bonding unit 300, and the PCB connection unit 400 do not include a timer. For this reason, each of the ACF pasting unit 230, the provisional pressure bonding unit 200, the main pressure bonding unit 300, and the PCB connection unit 400 processes a processing status indicating that predetermined processing for the display substrate 1 is started or ended together with the ID of the display substrate 1. The information is sent to the time recognition device 611 as information. However, when the ACF 3 a is attached to the mounting member 2 that is first attached to the display substrate 1, the ACF attaching unit 230 sends a processing status indicating that the ACF 3 a is attached to the time recognition device 611. In the PCB connection unit 400, before the final press-bonding of the PCB 6, a processing status indicating that the PCB 6 has not been subjected to the final press-bonding is sent to the time recognition device 611 as processing information together with the ID of the display substrate 1. Then, the time recognition device 611 can recognize the processing time of the display substrate 1 for each process based on the processing status sent from each unit, and can recognize the elapsed time of the display substrate 1.

FIG. 14 is a block diagram illustrating an internal configuration example of the time recognition device 611.
The time recognition device 611 determines the processing time for the display substrate 1 specified by the ID based on the processing status for each process received from each unit, in addition to the warning unit 601, the allowable time database 603, and the reference time holding unit 605. A determination unit 608 is provided. In this example, since the elapsed time for the ACF 3a attached to the mounting member 2 is recognized only by the time recognition device 611 based on the processing status, it is not necessary to provide a timer for each unit. For this reason, the reference time holding unit 605 sends the reference time adjusted to the standard time to the determination unit 608. Then, the determination unit 608 recognizes the elapsed time of the display substrate 1 by grasping the reception timing of the processing status received from each unit from the reference time. By adopting a configuration in which each unit does not include a timer in this way, the configuration of the FPD module assembly line 12 can be simplified.

  According to the FPD module assembling apparatus according to the third embodiment described above, the time recognizing device 611 is based on the processing status received from each unit, and the ACF 3a attached to the mounting member 2 mounted on the display substrate 1. Recognize the processing time. The elapsed time until the ACF 3a is pasted on the mounting member 2 mounted on the display substrate 1 and the PCB 6 is finally bonded to the ACF 3a is recognized by the processing status received by the time recognition device 611. For this reason, the time recognition device 611 can determine that the elapsed time has exceeded the allowable time. Then, by giving an alarm notification to the operator by the warning unit 601, the operator can quickly take measures such as removing the display substrate 1 from the FPD module assembly line 12 before the PCB 6 is finally bonded.

4). Fourth Embodiment Next, a fourth embodiment of the FPD module assembling apparatus of the present invention will be described with reference to FIG. 15 and FIG. FIG. 15 is a block diagram of an FPD module assembly line showing a fourth embodiment of the FPD module assembly apparatus of the present invention.

  The main configuration of the FPD module assembly line 13 is the same as that of the FPD module assembly line 10 according to the first embodiment described above. However, this example is characterized in that a timer, a time recognizing device, and a warning unit are provided for each of the ACF adhering unit 230, the provisional crimping unit 200, the main crimping unit 300, and the PCB connection unit 400. That is, the FPD module assembly line 13 is installed in the ACF attaching unit 230 and installed in at least one of the temporary crimping unit 200, the main crimping unit 300, and the PCB connection unit 400. Timers 231t, 210t, 310t, and 410t for measuring the processing time for each unit to perform processing, and time recognition devices 612a to 612d. The time recognition devices 612a to 612d provided in each unit recognize the elapsed time for each unit in which a timer is installed.

  Here, the ACF pasting unit 230 includes a timer 231t that counts the elapsed time, and a time recognition device 612a that notifies the alarm from the warning unit 601a when the elapsed time counted by the timer 231t exceeds the allowable time. In addition, although ACF 3a is affixed to the mounting member 2 mounted on the display substrate 1 by the ACF affixing unit 230, the ACF 3a is exposed to the air when transportation is stopped during the transportation of the display substrate 1 to the next process. Become. For this reason, the elapsed time until the display substrate 1 is transported to the next process is recognized by the time recognition device 612a.

The provisional pressure bonding unit 200 includes a timer 210t that counts the elapsed time, and a time recognition device 612b that notifies an alarm from the warning unit 601b when the elapsed time counted by the timer 210t exceeds the allowable time.
The crimping unit 300 includes a timer 310t that counts the elapsed time, and a time recognition device 612c that notifies an alarm from the warning unit 601c when the elapsed time counted by the timer 310t exceeds the allowable time.
The PCB connection unit 400 includes a timer 410t that counts the elapsed time, and a time recognition device 612d that notifies an alarm from the warning unit 601d when the elapsed time counted by the timer 410t exceeds the allowable time. The time recognizing device 612d recognizes the processing time until the display substrate 1 with the ACF 3a attached to the mounting member 2 is carried into the PCB connection unit 400 and the PCB 6 is finally press-bonded as the elapsed time.

  Each of the time recognition devices 612a, 612b, 612c, and 612d includes an allowable time database 603 that stores the allowable time. In the permissible time database 603, permissible time for each process for the display substrate 1 of the ACF pasting unit 230, the provisional pressure bonding unit 200, the main pressure bonding unit 300, and the PCB connection unit 400 is stored.

  And each time recognition apparatus 612a, 612b, 612c, 612d recognizes processing time independently by the timer with which each unit is provided. Therefore, the operator who has been notified of the alarm can quickly determine which unit has the display substrate 1 that needs to be handled.

  FIG. 16 is a block diagram illustrating an internal configuration example of the time recognition device 612a. Here, the time recognition device 612a will be described, but the other time recognition devices 612b, 612c, and 612d are configured in the same manner as the time recognition device 612a, and thus detailed description of these time recognition devices is omitted.

  In addition to the warning unit 601a, the information collecting unit 602, and the allowable time database 603, the time recognizing device 612a exceeds the allowable processing time for the display substrate 1 specified by the ID based on the processing information collected from the timer 231t. A determination unit 608 for determining whether or not there is. In this example, since the processing time is measured for each unit, if the processing time from the start to the end of the process required in the process exceeds the allowable time, an alarm is notified to the operator for each unit. In particular, the time recognition device 612d connected to the PCB connection unit 400 allows the elapsed time until the display substrate 1 with the ACF 3a attached to the mounting member 2 is carried into the PCB connection unit 400 and the PCB 6 is finally bonded. Determine if the time is exceeded. When the allowable time is exceeded, the warning unit 601d notifies the operator of an alarm before the PCB 6 is finally bonded.

  According to the FPD module assembling apparatus according to the fourth embodiment described above, the time recognition apparatuses 612a to 612d are provided for each unit. Then, the processing time is recognized for each unit, and an alarm is notified to the operator when the processing time exceeds the allowable time in each process. For this reason, the time recognizing devices 612a to 612d can determine for each unit that the elapsed time exceeds the allowable time. Since the alarms are given to the operator by the warning units 601a to 601d, the operator can promptly take measures such as removing the display board 1 from the FPD module assembly line 13 before the PCB 6 is finally crimped. It becomes.

  The first to fourth embodiments of the FPD module assembling apparatus of the present invention have been described above including the effects. However, the FPD module assembling apparatus of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention described in the claims.

  For example, in the above-described embodiment, when the entire FPD module assembly line is stopped, it is difficult to notify an alarm when the elapsed time reaches an allowable time. For this reason, by using a power source different from the FPD module assembly line for the time recognition device, it is possible to promptly notify an alarm when the elapsed time exceeds the allowable time, and the operator can quickly take action. It becomes. Also, the change of the existing processing process performed when the elapsed time exceeds the allowable time can be applied to the second to fourth embodiments, similarly to the change in the first embodiment described above. Good. Further, according to the first to fourth embodiments described above, the time recognition device recognizes the time during which the PCB connection ACF 3a is exposed to the air, but the ACF is directly attached to the display substrate 1. The elapsed time may be recognized as the time when the ACF is exposed to the air or the time when the ACF directly attached to the PCB 6 is exposed to the air.

  DESCRIPTION OF SYMBOLS 1 ... Display board | substrate 10, 11, 12, 13 ... FPD module assembly line, 100 ... Receiving unit, 200 ... Temporary crimping unit, 200t, 230t, 300t, 400t ... Timer, 300 ... Final crimping unit, 400 ... PCB connection unit , 500 ... Unloading unit, 600 ... Time recognition device, 601 ... Warning section, 602 ... Information collection section, 603 ... Permissible time database, 604 ... Judgment section, 605 ... Reference time holding section, 610, 611, 612a to 612d ... Time Recognition device

Claims (10)

An ACF attaching device for attaching ACF to a display substrate or a mounting member mounted on the display substrate;
An FPD module assembling apparatus comprising: a time recognizing device for recognizing an elapsed time after the ACF is attached to the display substrate or the mounting member mounted on the display substrate. Furthermore, a temporary pressure bonding apparatus for temporarily pressure bonding the mounting member to the display substrate via the ACF;
A main crimping apparatus for final crimping the temporarily mounted mounting member to the display substrate;
A PCB connection device for connecting a PCB via an ACF for PCB connection affixed to the mounting member,
The ACF attaching device attaches an ACF for PCB connection to the mounting member before temporarily pressing the mounting member to the display substrate,
The PCB connection device connects the PCB to the mounting member after the mounting member is finally press-bonded to the display substrate,
The time recognizing device is a time from when the ACF is attached to the display substrate or the mounting member mounted on the display substrate to before the PCB connection device fully press-bonds the PCB to the mounting member. The FPD module assembly apparatus according to claim 1, wherein the elapsed time is recognized as the elapsed time. Furthermore, the time when the ACF is attached to the display substrate or the mounting member mounted on the display substrate, which is installed in the ACF attaching device, is a time stamp, and the temporary crimping device, the main crimping device, Among the PCB connection devices, processing information that is installed in at least one of the devices and includes processing time including a time at which the processing included in the elapsed time is completed among processing performed by each device on the display substrate. A timer for sending to the time recognition device;
3. The FPD module assembling apparatus according to claim 2, wherein the time recognizing device recognizes the elapsed time based on the time stamp read from the processing information received from the timer. Further, the processing time required from the start to the end of the processing performed by each device on the mounting member or the display substrate is set in the ACF sticking device, the temporary pressure bonding device, the main pressure bonding device, and the PCB connection device. A timer for timing and sending the processing time to the time recognition device;
3. The FPD module assembling apparatus according to claim 2, wherein the time recognizing device recognizes the sum of the processing times received from the timer as the elapsed time. The ACF sticking device, the provisional pressure bonding device, the main pressure bonding device, and the PCB connection device each send a processing status indicating that predetermined processing on the display substrate has started or ended to the time recognition device,
3. The FPD module assembling apparatus according to claim 2, wherein the time recognizing device recognizes the total processing time obtained from the processing status received from each device as the elapsed time. Furthermore, it is installed in the ACF sticking device, and is installed in at least one of the temporary crimping device, the main crimping device, and the PCB connection device, and each device processes the display substrate. A timer for measuring the processing time and sending the processing time to the time recognition device;
3. The time recognition device is installed in each device in which the timer is installed, and recognizes the processing time received from the timer as the elapsed time for each device in which the timer is installed. The FPD module assembling apparatus described.   Furthermore, the said elapsed time is equipped with the warning part which alert | reports an alarm when the adhesiveness of the said ACF exposed to the air | atmosphere has been exceeded, The alarm part which alert | reports an alarm is provided. The FPD module assembling apparatus according to any one of claims.   When the elapsed time exceeds the allowable time during which the adhesion of the ACF exposed to the air is maintained, the elapsed time for the PCB connection device is the allowable time. The existing process is changed to a process including at least one of a process for increasing the pressing force, a process for increasing the pressurizing time, and a process for increasing the pressure-bonding temperature, compared to the existing process in the case where the pressure is not exceeded. The FPD module assembling apparatus according to claim 2, wherein the FPD module assembling apparatus according to claim 2.   The time recognizing device instructs to exclude the display substrate to which the ACF is attached when the elapsed time exceeds the allowable time during which the adhesion of the ACF exposed to air is maintained. The FPD module assembling apparatus according to claim 1, wherein the FPD module assembling apparatus according to claim 1 is performed. Attaching the ACF to the display substrate or a mounting member mounted on the display substrate;
Recognizing an elapsed time since the ACF was attached to the display substrate or the mounting member mounted on the display substrate.

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