JP2020120127A - Mounting device for electronic component and manufacturing method of member for display - Google Patents

Abstract

To provide a mounting device for an electronic component, which allows for mounting of a flexible electronic component on a flexible panel for display, with a high degree of accuracy.SOLUTION: The mounting device for an electronic component comprises: a stage 42 on which a display panel P is mounted in such a manner that an edge part of display panel P protrudes in a range of 3 to 15 mm; a backup unit 43 that supports the edge part of the display panel P; a temporal crimping head 41 that holds an electronic component W; imaging apparatuses 43a and 43b that image an alignment mart provided in the edge part of the display panel P and an alignment mart provided in the electronic component W; a light irradiation section 44d that irradiates the display panel P with light from a side opposite to an imaging side; and a control device that positions the display panel P with the electronic component W on the basis of a positional relationship recognized by an imaging result to bond the electronic component W to the display panel P by thermo compression bonding. A flexural elastic modulus of the part protruded from the stage 41 is 2.6 GPa or more and 4.0 GPa or less.SELECTED DRAWING: Figure 4

Description

Embodiments of the present invention relate to an electronic component mounting apparatus that mounts a flexible electronic component on an edge portion of a flexible display panel, and a method for manufacturing a display member.

In the flat panel display market used as displays for mobile terminals such as televisions, personal computers, and smartphones, liquid crystal displays occupy an overwhelming prevalence rate. Under such circumstances, in recent years, an organic EL display, which has a feature that it can be thinned without requiring a backlight and can be bent by being formed on a flexible resin film, is particularly suitable for mobile terminals. Is attracting attention mainly in the small display market. Therefore, there is a demand for an electronic component mounting apparatus that can be bent, that is, can be suitably used for assembling a flexible organic EL display.

At present, as a general electronic component mounting device, an outer lead bonding device for a liquid crystal display (hereinafter referred to as an OLB device) is known (see Patent Document 1). However, an OLB device for an organic EL display is not known. For this reason, an OLB device for a liquid crystal display is used in place of the electronic component mounting process performed when manufacturing an organic EL display.

The OLB device for a liquid crystal display mounts an electronic component on a display panel formed of a glass substrate via an anisotropic conductive tape. In a mounting process using an OLB device for a liquid crystal display, first, an edge portion of a display panel on which electronic components are mounted is protruded from a stage and held, and the edge portion of the display panel is held by a pressure bonding head. Bring electronic components close together. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged by one camera from the lower side of the display panel, and the relative positions of the two are recognized. After that, the edge of the display panel is held from below by a backup tool, the electronic components are aligned with the display panel based on the recognized relative positions, and the display panel is pressed through the anisotropic conductive tape by the crimping head. The electronic components are mounted by heating and pressurizing them on the edges of the.

JP, 2006-135082, A

When the above-mentioned OLB device for a liquid crystal display is directly applied to the manufacturing process of an organic EL display, it is not possible to mount electronic parts with high precision. That is, the inventors of the present application use the above-mentioned OLB device for a liquid crystal display as it is, and an electronic component for a flexible display panel (hereinafter referred to as an organic EL panel) which is a component of the organic EL display. Was mounted and an attempt was made to manufacture a display member. Specifically, a COF (Chip on film) with a width of 38 mm is mounted as an electronic component on an organic EL panel having a size of 5.0 inches and a thickness of about 0.2 mm, which is widely used in smartphones. .. As a result, it has been found that it is not possible to mount electronic parts on an organic EL panel with high precision and high quality simply by directly applying the OLB device for a liquid crystal display. Specifically, the organic EL panel for a smartphone requires a mounting accuracy of about ±3 μm, but it has become clear that such a mounting accuracy and further the mounting quality cannot be satisfied.

The present invention has been made in order to address the problems of deterioration in mounting accuracy and mounting quality of electronic components that occur when the above-described conventional OLB device for a liquid crystal display is applied to a manufacturing process of an organic EL display. A mounting device for an electronic component, which enables the electronic component to be mounted on the display panel with high precision, even when the flexible electronic component is mounted on the flexible display panel by thermocompression bonding And a method for manufacturing a display member.

In the electronic component mounting apparatus of the embodiment, a plurality of electrodes arranged on an edge portion of a display panel having flexibility are arranged corresponding to the plurality of electrodes in the electronic component having flexibility. An electronic component mounting apparatus for mounting the electronic component on the display panel by connecting a plurality of terminals via a joining member, wherein the edge portion protrudes in a range of 3 mm or more and 15 mm or less, A horizontally movable stage on which the display panel is placed, a backup unit that supports the edge portion of the display panel placed on the stage from below, and the electronic component from above. A thermocompression bonding head that is movable in the horizontal and vertical directions and that thermocompresses the electronic component on the upper surface of the edge portion that is held and supported by the backup unit; and the edge of the display panel that protrudes from the stage. An image pickup device that takes an image of an alignment mark provided on a display unit and an alignment mark provided on the electronic component, and a light irradiation unit that emits light to the display panel from the side opposite to the image pickup device. A position recognizing device that recognizes a positional relationship between the display panel and the electronic component, and the position of the display panel and the electronic component are aligned based on the positional relationship recognized by the position recognizing device. A controller for adjusting the relative positions of the stage and the thermocompression bonding head, and controlling the stage and the thermocompression bonding head so that the electronic component is thermocompression bonded to the display panel by the thermocompression bonding head; The bending elastic modulus of the portion of the display panel protruding from the stage is 2.6 GPa or more and 4.0 GPa or less.

The method for manufacturing a display member according to the embodiment includes a mounting step of mounting a flexible display panel on a stage such that an amount of protrusion of an edge portion having a plurality of electrodes is 3 mm or more and 15 mm or less. A mounting step in which a bending elastic modulus of a portion of the display panel protruding from the stage is 2.6 GPa or more and 4.0 GPa or less, and a plurality of terminals provided corresponding to the plurality of electrodes A holding step of holding a flexible electronic component in a thermocompression bonding head, and an image capturing side of the alignment mark provided on the edge portion of the display panel placed on the stage. While imaging the alignment mark from the opposite side with light, the alignment mark provided on the electronic component held by the thermocompression bonding head is imaged, and based on the images of the two alignment marks taken, A position recognition step of recognizing a positional relationship between the display panel and the electronic component, and a relative position of the stage and the thermocompression bonding head is adjusted based on the positional relationship recognized in the position recognition step, and the thermocompression bonding is performed. A thermocompression bonding step of thermocompression-bonding the electronic component to the display panel with a head, wherein the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via a connecting member. Manufacture parts for use.

According to the mounting apparatus of the present invention, even when a flexible electronic component is mounted by thermocompression bonding on a flexible display panel such as an organic EL panel, the electronic component can be accurately and accurately mounted. It can be mounted while maintaining the mounting quality. Furthermore, according to the method for manufacturing a display member of the present invention, it is possible to provide a display member in which an electronic component is mounted on a display panel with high precision and while maintaining mounting quality.

It is a top view showing a mounting device of an electronic component in an embodiment. It is a side view of the mounting apparatus shown in FIG. It is sectional drawing of the organic EL panel applied to the mounting apparatus of embodiment. It is a perspective view which shows the temporary press bonding apparatus of the mounting apparatus shown in FIG. It is sectional drawing which expands and shows the stage of the temporary press bonding apparatus of the mounting apparatus shown in FIG. It is a top view which shows the organic EL panel and electronic component applied to the mounting apparatus of embodiment. It is a perspective view which shows the main press bonding apparatus of the mounting apparatus shown in FIG. It is a perspective view which shows an example of the holding body of the organic EL panel in the mounting apparatus shown in FIG. It is a perspective view which shows the other example of the holding body of the organic EL panel in the mounting apparatus shown in FIG. It is a top view which shows the mounting apparatus of the electronic component in other embodiment. 6 is a graph showing a variation in mounting accuracy according to the first embodiment. 9 is a graph showing a variation in mounting accuracy according to Comparative Example 1.

Hereinafter, an electronic component mounting apparatus and a display member manufacturing method according to an embodiment will be described with reference to the drawings. The drawings are schematic, and the relationship between the thickness and the plane size, the ratio of the thickness of each portion, and the like may be different from the actual one. In the description, the term indicating the vertical direction indicates a relative direction when the mounting surface of the electronic component of the display panel (organic EL panel) described later is the top, unless otherwise specified.

[Configuration of mounting device]
FIG. 1 is a plan view showing a configuration of an electronic component mounting apparatus of an embodiment, and FIG. 2 is a side view of the electronic component mounting apparatus of FIG. The electronic component mounting apparatus 1 shown in FIGS. 1 and 2 is used for manufacturing a constituent member (display member) of a display device such as an organic EL display. That is, in the mounting apparatus 1, the flexible electronic component W such as COF punched from the carrier tape T is attached to the organic EL panel P as a flexible display panel, and the anisotropy as a connecting member. It is an apparatus used for manufacturing a display member in which an electronic component W is mounted on an organic EL panel P, which is mounted via a conductive tape F.

Here, the organic EL panel P is mainly formed of a flexible member. As the flexible member, for example, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC) or the like is used. It is also possible to bond and use these members with an adhesive. The organic EL panel P has a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less. Hereinafter, this thickness and flexural modulus will be referred to as the physical characteristics of the organic EL panel P. The organic EL panel P in the present embodiment has a configuration in which a PI film having an organic EL element formed thereon is bonded to a PET film, which is a supporting material, with an adhesive. Since the thickness of the PET film (about 200 μm) is 10 times or more the thickness of the PI film (about 10 μm), the bending elastic modulus of the organic EL panel P is considered to be almost equal to the bending elastic modulus of the PET film.

Note that the above-mentioned physical characteristics do not have to be provided in the entire organic EL panel P, and at least a portion protruding from a mounting portion 42a (see FIG. 4) of the stage 42 described later may be provided. For example, if the edge portion of the organic EL panel P on which the electronic component W is mounted is projected by 15 mm from the mounting portion 42a of the stage 42, the range of 15 mm from this edge portion may have the above-mentioned physical characteristics. ..

More specifically, as shown in FIG. 3, the organic EL panel P on which the electronic component W is mounted has a display portion Pa and an edge portion Pb. The display portion Pa is a portion in which the organic EL element Pa1 as a display element is formed, and is a portion for displaying an image. The edge portion Pb is a portion located on the outer peripheral side of the display portion Pa, and is a portion formed with a connection portion Pb1 in which electrodes and the like connected to the electrodes of the electronic component W are formed. As described above, such an organic EL panel P is entirely composed of the PI film Ka as the base material including the display portion Pa and the edge portion Pb, and the organic EL element serving as the display portion Pa on the PI film Ka. Pa1 is formed. The PI film Ka is a very thin member having a thickness of less than 50 μm, specifically about 10 to 30 μm.

Therefore, in the present embodiment, the PET film Kb as a supporting material having the same size as the PI film Ka and a thickness of 200 μm is formed on the back surface of the PI film Ka (the surface opposite to the surface on which the organic EL element Pa1 is formed). ) Is pasted with an adhesive Kc. An optical film Kd such as a cover film (also referred to as a barrier film) for protecting the organic EL element Pa1 may be attached to the display portion Pa. The optical film Kd has substantially the same size as the display portion Pa. For example, as the cover film, a plastic film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and cycloolefin polymer (COP) coated with a gas barrier layer can be used. The cover film has a thickness of about several tens of μm to about 200 μm.

In the organic EL panel P having such a configuration, when only the edge portion Pb protrudes from the mounting portion 42a of the stage 42, the edge portion Pb may have the above-mentioned physical characteristics. That is, the portion where the PI film Ka and the PET film Kb are bonded together may have the above-mentioned physical characteristics. Further, when a part of the edge portion Pb and the display portion Pa protrudes from the placement portion 42a, the edge portion Pb and the display portion Pa only have to have the above-mentioned physical characteristics. That is, when the display portion Pa does not have the cover film, the portion where the PI film Ka and the PET film Kb are bonded may have the above-mentioned physical characteristics. On the other hand, when the display portion Pa has the optical film Kd, the physical characteristics of the portion where the PI film Ka and the PET film Kb, which are the edge portions, are bonded together, the PI film Ka, the PET film Ks, and the optical portion which are the display portion Pa. It suffices if the physical properties of the portion where the film Kd is bonded are both the above-mentioned physical properties.

Here, the flexural modulus is a value measured according to the test method specified in JIS K7171: Method for determining plastic-bending characteristics (revised edition March 22, 2016). Specifically, in the flexural modulus test, a test piece having a length of 80±2 mm, a width of 10.0±0.2 mm and a thickness of 4.0±0.2 mm was adjusted to have a fulcrum distance of 64 mm. The test piece is supported on a support table of the flexure measuring device, and the indenter is lowered to the center between the fulcrums at a test speed of 2 mm/min to bend the center of the test piece. The test atmosphere is a standard atmosphere defined by JIS K7100 (temperature 23° C./humidity 50%).

As the electronic component W, a flexible electronic component such as COF is used. The COF is configured by mounting a semiconductor element on a flexible film-shaped circuit board made of PI (polyimide) or the like. As will be described later, the COF is formed by being cut into individual pieces by being punched out from a tape-shaped film member.
The display member is obtained by mounting an electronic component W such as COF on a display panel such as the organic EL panel P via a joining member such as the anisotropic conductive tape F. Is a member used as a component of a display device such as.

The mounting apparatus 1 according to the embodiment includes a punching device 10 (10A, 10B) for punching an electronic component W from a carrier tape T, an intermittent rotation transport device 20 for sucking and holding the punched electronic component W, and transporting the electronic component W while rotating intermittently. Anisotropic conductive tape sticking for sticking an anisotropic conductive tape F as a joining member to an electronic component W which is arranged at an intermittent stop position on the transport path of the rotary transport device 20 and is transported by the intermittent rotary transport device 20. Device (joining member pasting device) 30, temporary crimping device 40 for temporarily crimping the electronic component W to which the anisotropic conductive tape F is pasted to the organic EL panel P via the anisotropic conductive tape F, and temporary tacking device A main pressure bonding device 50 for main pressure bonding of the electronic component W temporarily pressure bonded to the organic EL panel P by 40, a first delivery device 60 for delivering the electronic component W between the punching device 10 and the intermittent rotation transfer device 20, A second delivery device 70 that delivers the electronic component W between the intermittent rotation transport device 20 and the temporary pressure bonding device 40, a first transport unit 80 that loads the organic EL panel P into the temporary pressure bonding device 40, A second transport unit 90 for transporting the organic EL panel P from the temporary pressure bonding device 40 to the main pressure bonding device 50, a third transport unit 100 for discharging the organic EL panel P from the main pressure bonding device 50, and a punching device 10, Intermittent rotation transport device 20, anisotropic conductive tape sticking device 30, temporary pressure bonding device 40, final pressure bonding device 50, first delivery device 60, second delivery device 70, first transport section 80, second It is configured to include a control device 110 that controls the operation of each unit such as the transport unit 90 and the third transport unit 100.

(Punching device 10)
The punching device 10 is for punching COF as the electronic component W from the carrier tape T, and includes a first punching device 10A and a second punching device 10B. The first punching device 10A and the second punching device 10B have the same configuration and are arranged in a state of being horizontally reversed when viewed from the front of the device. The first and second punching devices 10A, 10B are used one by one, and while one punching device 10A, 10B is punching, the carrier tape T of the other punching device 10A, 10B can be replaced. It has become.

The first and second punching devices 10</b>A and 10</b>B respectively include a supply reel 11 around which a carrier tape T before punching is wound and a die device 12 for punching out an electronic component W from the carrier tape T supplied from the supply reel 11. And a take-up reel 13 for winding the carrier tape T on which the electronic component W has been punched by the die unit 12. The carrier tape T fed from the supply reel 11 is changed in direction by the plurality of guide rollers 14 and the sprocket 15, and is sent to the take-up reel 13 via the mold device 12. The sprocket 15 is arranged in front of the mold device 12 in the carrier tape T conveying direction, and conveys the carrier tape T to the mold device 12 while conveying the carrier tape T by rotational driving by a drive motor (not shown). It is possible to position it.

The mold device 12 includes an upper mold 12a and a lower mold 12b arranged to face the upper mold 12a. The upper die 12a has a punch 12c on the lower surface thereof. On the other hand, the lower die 12b is formed with a die hole 12d which vertically penetrates into which the punch 12c is inserted. The electronic component W is punched out from the carrier tape T by moving the upper mold 12a in the vertical direction with the carrier tape T being supplied and positioned to the mold device 12. A suction hole (not shown) is provided on the front end surface of the punch 12c so that the punched electronic component W can be suction-held.

(Intermittent rotation transfer device 20)
In the intermittent rotation transfer device 20, four arm portions 21 having the same shape are arranged so as to be orthogonal to each other, and the index table 22 having a cross shape in a plan view and the index table 22 are intermittently rotated at 90° intervals. The rotation driving unit 23. A holding head 24 for sucking and holding the electronic component W is provided at the tip of each arm 21 of the index table 22. Positioning is performed with respect to four stop positions A to D of the index table 22 at intervals of 90° with respect to the receiving position A for receiving the electronic component W punched by the punching device 10 and the electronic component W held by the holding head 24. Gauging/cleaning position B for (gauging) and cleaning, sticking position C for sticking anisotropic conductive tape F to electronic component W held by holding head 24, anisotropic conductive tape A delivery position D for delivering the electronic component W to which F is attached to the temporary pressure bonding device 40 is set.

(Anisotropic conductive tape sticking device 30)
The anisotropic conductive tape sticking device 30 is provided corresponding to the sticking position C of the intermittent rotation transport device 20, and the tape-shaped member S in which the anisotropic conductive tape F is stuck and supported on the release tape R. The wound supply reel 31, the sticking head 32 arranged at a position facing the holding head 24 located at the sticking position C, and the release tape R after the anisotropic conductive tape F is peeled off The collecting section 33 to be housed, a plurality of guide sections 34 for guiding the tape-like member S supplied from the supply reel 31 to the collecting section 33 by following the transport path passing through the attachment position C, and a plurality of guide sections. The tape-shaped member S is intermittently conveyed by a predetermined length by being arranged downstream of the sticking position C on the conveyance path of the tape-shaped member S by 34 and reciprocating along the conveyance direction of the tape-shaped member S. The chuck feeding unit 35 and a cutting unit 36 arranged upstream of the attachment position C in the transport path of the tape-shaped member S and cutting only the anisotropic conductive tape F of the tape-shaped member S are provided. ..

The sticking head 32 is an anisotropic conductive member that is cut to a predetermined length at the terminal portion of the electronic component W held by the holding head 24 positioned at the sticking position C, and is conveyed and positioned at the sticking position C. The sticking tool 32a for pressing the tape F, the elevating and lowering drive unit 32b for moving the sticking tool 32a up and down, and the sticking tool 32a built in the sticking tool 32a are heated to heat the anisotropic conductive tape F. And a heater 32c that is attached to the terminal portion of the electronic component W.

(Temporary pressure bonding device 40)
As shown in FIG. 4, the temporary pressure bonding device 40 sucks and holds the electronic component W to which the anisotropic conductive tape F has been bonded by the anisotropic conductive tape bonding device 30 and temporarily bonds the organic component P to the organic EL panel P. A temporary pressure bonding head 41 as a thermocompression bonding head, a stage 42 for holding and positioning the organic EL panel P, and an edge portion on which the electronic component W of the organic EL panel P held by the stage 42 is mounted. , A position for recognizing the relative position between the backup unit 43 that supports the portion protruding from the stage from below, and the organic EL panel P held by the stage 42 and the electronic component W held by the temporary pressure bonding head 41. And a recognition device 44.

The temporary pressure bonding head 41 is built in the pressure tool 41a for sucking and holding the electronic component W from the upper surface side, the tool driving unit 41b for moving the pressure tool 41a in the Y, Z, and θ directions, and the pressure tool 41a. And a heater 41c for heating the pressure tool 41a. As shown in FIG. 4, the stage 42 has a mounting portion 42a on which the organic EL panel P is mounted, and a stage driving portion 42b that moves the mounting portion 42a in the X, Y, Z, and θ directions.

A plurality of suction holes 42d for sucking and holding the organic EL panel P are formed on the mounting surface 42c of the mounting portion 42a on which the organic EL panel P is mounted. The suction holes 42d are mainly arranged at positions facing the image display area on the organic EL panel P when the organic EL panel P is mounted on the mounting surface 42c. In this example, the adsorption holes 42d are arranged in a matrix at regular intervals in the area of the mounting surface 42c on which the organic EL panel P is mounted (the area surrounded by the two-dot chain line in FIG. 4). As will be described, the organic EL panel P mounted on the mounting surface 42c does not necessarily have to be suction-held over the entire area.

For example, in FIG. 4, a region of about half or one third of the length of the organic EL panel P may be suction-held from the side of the mounting surface 42c where the temporary pressure bonding head 41 is located. Since the suction holes 42d suck the display area of the organic EL panel P, it is preferable to set the hole diameter small so that suction marks do not remain in the display area due to the suction. The hole diameter can be obtained by experimenting the relationship between the suction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P due to this suction, and the size can be set so that no suction mark remains. good. The mounting surface 42c may be configured by a porous member, for example, a vacuum chuck using porous ceramics.

Further, with respect to the placing portion 42a, a suction groove extending from a suction hole for sucking the organic EL panel P to the vicinity of the side may be provided on the side portion on the side where the temporary pressure bonding head 41 is located. Specifically, as shown in FIG. 5, the side portion of the mounting portion 42a is configured by a suction block 42f which is a member different from the mounting portion 42a. The suction block 42f is a member elongated in the X direction, and is fixed to the mounting portion 42a such that the upper surface thereof is flush with the mounting surface 42c of the mounting portion 42a. On the upper surface of the adsorption block 42f, a plurality of suction holes 42g for adsorbing the organic EL panel P are arranged along the X direction. Further, on the upper surface of the suction block 42f, a suction groove 42h extending from each suction hole 42g toward the end of the suction block 42f (the end on the side where the temporary pressure bonding head 41 is located) is provided. The tip of the suction groove 42h extends to a position close to the end of the suction block 42f. The distance between the tip of the suction groove 42h and the end of the suction block 42f is preferably 1 to 3 mm. The lower side of the end of the suction block 42f is an inclined portion 42i that is inclined downward from the end side toward the mounting portion 42a side. By making the lower side of the end portion the inclined portion 42i, it is possible to prevent interference with the backup unit 43 from occurring easily.

The stage drive unit 42b is an X-axis direction drive unit that moves the mounting unit 42a in the X-axis direction, which is one direction in the horizontal direction, and a Y-axis direction drive that moves the mounting unit 42a in the Y-axis direction, which is the horizontal direction orthogonal to the X-axis direction. Section, a Z-axis direction drive section that moves in the Z-axis direction orthogonal to the horizontal direction, and a θ drive section that rotates and moves in the horizontal plane in this order from the lower side. The stage drive unit 42b is provided with a linear encoder attached to the X-axis direction drive unit and the Y-axis direction drive unit in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction.

The backup unit 43 is provided at a temporary pressure-bonding position for temporarily pressure-bonding the electronic component W to the organic EL panel P. Then, the backup unit 43 supports the edge portion of the organic EL panel P where the electrode array ER (FIG. 6) is formed from below and supports the backup tool 43a that is long in the X-axis direction. And a support base 43b formed in a substantially rectangular parallelepiped shape. The backup tool 43a is made of stainless steel, and the upper end surface (support surface) that supports the edge portion of the organic EL panel P is formed flat. In this embodiment, the backup unit 43 is fixedly arranged at the temporary pressure-bonding position, but it may be provided so as to be movable in the X-axis direction or in the X-axis direction and the Y-axis direction, if necessary. .. In this case, the support base 43b may be mounted on the X-axis moving device or the XY-axis moving device.

Next, the position recognition device 44 will be described with reference to FIGS. 4 and 6. FIG. 6 is a plan view showing a schematic configuration of the organic EL panel P and the electronic component W whose position is recognized by the position recognition device 44. In the drawing, the X-axis direction will be described as the left-right direction. The organic EL panel P has an electrode array ER formed on the edge thereof and a pair of alignment marks PM provided on both left and right sides of the electrode array ER. The electronic component W has a terminal row TR arranged so as to correspond to the electrode row ER, and a pair of alignment marks WM provided on both left and right sides of the terminal row TR. The position recognition device 44 recognizes the relative positional relationship between the pair of alignment marks PM of the organic EL panel P and the alignment mark WM of the electronic component W.

As shown in FIG. 4, such a position recognition device 44 processes an image captured by the first image capturing device 44a, the second image capturing device 44b, and the images captured by the first and second image capturing devices 44a and 44b. The processing unit 44c and the light irradiation unit 44d are provided. The first and second imaging devices 44a and 44b are individually mounted on the support base 43b of the backup unit 43 in the vicinity of the end of the backup tool 43a in an upward direction via the X-axis drive unit 44e. The first imaging device 44a includes a left alignment mark PM of the pair of alignment marks PM provided on the edge of the organic EL panel P and a left alignment mark PM of the pair of alignment marks WM provided on the electronic component W. The WM and the WM are simultaneously captured from the lower side into the image capturing area 44a1 (shown by the broken line in FIG. 6) and imaged. The second image pickup device 44b simultaneously puts the alignment mark PM on the right side of the organic EL panel P and the alignment mark WM on the right side of the electronic component W into the image pickup region 44b1 (shown by a broken line in FIG. 6) from below. Capture and image.

The first and second image pickup devices 43a and 43b are for picking up the alignment marks PM and WM as still images, respectively, and include a camera 44f such as a CCD (Charge Coupled Device) camera and an optical unit such as a telecentric lens. And a lens barrel portion 44g. The X-axis drive unit 44e is capable of synchronously moving the first and second imaging devices 44a and 44b so that the distance between them expands or contracts, and the distance between the left and right alignment marks PM and WM is increased. In addition, the arrangement interval of the first and second imaging devices 44a and 44b can be changed.

The image processing unit 44c receives the image pickup signal of the camera 44f, and extracts the images of the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W from the picked-up images obtained by being captured in the image pickup areas 44a1 and 44b1. It recognizes and detects data (hereinafter, referred to as “position data”) regarding the position of each alignment mark PM, WM. The image processing unit 44c uses the known pattern matching process to obtain an image in which the matching rate equal to or higher than the reference pattern of the alignment mark PM of the organic EL panel P set in advance in the captured image is obtained. Recognize as PM. Further, an image in which the matching rate of the reference pattern of the alignment mark WM of the electronic component W and the threshold value or more is obtained is recognized as the alignment mark WM of the electronic component W. Then, the position data of the recognized alignment marks PM and WM is obtained based on the camera coordinate system. As a result, the positional relationship between the organic EL panel P and the electronic component W can be recognized. The obtained position data is transmitted to the control device 110.

The light irradiation section 44d is arranged above the organic EL panel P mounted on the stage 42 so as to be able to irradiate light downward. In the present embodiment, the pair of light irradiation units 44d are provided at the same intervals as the arrangement intervals of the pair of alignment marks PM of the organic EL panel P. The light irradiation unit 44d is provided integrally with the temporary pressure bonding head 41 by using a support tool (not shown), but is not limited to this, and is supported by the frame or the gantry of the mounting apparatus 1 via the support tool. It may be done. In short, when the alignment mark PM of the organic EL panel P is imaged by the first and second image pickup devices 44a and 44b, the organic EL panel P from the side opposite to the first and second image pickup devices 44a and 44b. It suffices that it is provided so that the alignment mark PM can be irradiated with light. Further, as the light irradiation unit 44d, one long one may be arranged, and the number thereof is not limited.

(Main press bonding device 50)
As shown in FIG. 7, the main pressure bonding apparatus 50 includes a stage 51 for holding and positioning the organic EL panel P on which the electronic component W is temporarily pressure bonded via the anisotropic conductive tape F, and the organic EL panel P. On the other hand, a main pressure bonding head 52 for performing the main pressure bonding of the electronic component W, and an electronic component W in the organic EL panel P, which is disposed below the main pressure bonding head 52 so as to face the main pressure bonding head 52. A backup unit 53 that supports the temporarily press-bonded edge portion from below and a position recognition unit 54 for recognizing the position of the organic EL panel P are provided.

The stage 51 has a mounting section 51a on which the organic EL panel P is mounted, and a stage drive section 51b for moving the mounting section 51a in the X, Y, Z, and θ directions. The mounting portion 51a is a member having a rectangular shape in plan view, and the mounting surface (upper surface) 51c on which the organic EL panel P is mounted has a plurality of adsorption holes 51d for adsorbing and holding the organic EL panel P. Has been formed. Like the suction holes 42d of the stage 42 of the temporary pressure bonding device 40, the suction holes 51d are preferably set to have a small diameter so that no suction mark of the organic EL panel P remains. The stage drive unit 51b stacks an X-axis direction drive unit, a Y-axis direction drive unit, a Z-axis direction drive unit, and a θ drive unit in this order from the lower side, like the stage drive unit 42c of the temporary pressure bonding device 40. The drive unit is configured as described above.

The main pressure bonding head 52 includes a pressure tool 52a that presses the electronic component W that has been temporarily pressure bonded to the organic EL panel P from the upper surface side thereof, a tool drive unit 52b that moves the pressure tool 52a in the Z-axis direction, and pressure. It has a heater 52c which is built in the tool 52a and heats the pressure tool 52a. The backup unit 53 is provided directly below the pressure tool 52a of the main pressure bonding head 52 and has a length equal to that of the pressure tool 52a and a support member 53b for supporting the backup tool 53a. Have and. The upper surface of the backup tool 53a is formed as a flat surface that supports the lower surface of the edge portion where the electronic component W of the organic EL panel P mounted on the mounting portion 51a is temporarily pressure-bonded.

The position recognition unit 54 has a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are attached downward at a predetermined interval above the moving range of the organic EL panel P by the stage 51, and the electronic component W of the organic EL panel P is temporarily attached. An image of an alignment mark provided near both ends of the crimped edge is imaged. The interval (predetermined interval) between the first and second cameras 54a and 54b described above is the interval between the alignment marks. The alignment mark is an alignment mark different from the alignment mark PM used for the relative pressure data recognition in the temporary pressure bonding device 40. The image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the captured image of the alignment mark of the organic EL panel P captured by the first and second cameras 54a and 54b, and the alignment mark Detect the position of.

(First delivery device 60)
The first delivery device 60 receives the electronic component W punched from the carrier tape T by suction and holds the electronic component W from below, and receives the receiving part 61 at a position directly below the die device 12 of the punching devices 10A and 10B. It is provided with an X, Y, Z, and θ drive unit 62 for moving to a position directly below the holding head 24 of the intermittent rotation transfer device 20 positioned at the position A.

(Second delivery device 70)
The second delivery device 70 includes a receiving portion 71 that sucks and holds the electronic component W from the lower side, a position directly below the holding head 24 of the intermittent rotation transfer device 20 that is positioned at the delivery position D, and temporary pressure bonding. An X, Y, Z, θ drive unit 72 for moving the device 40 to a position directly below the temporary pressure bonding head 41 is provided.

(First transport unit 80)
The first transport unit 80 includes a holder 81 that holds the organic EL panel P supplied from a supply unit (not shown) from above and a supply position of the organic EL panel P by the supply unit (not shown). And an XZ drive unit 82 for moving the organic EL panel P to the stage 42 of the temporary pressure bonding device 40.

As shown in FIG. 8, the holding body 81 sucks and holds an edge portion of the organic EL panel P on which the electronic component W is mounted and on which the electrode row ER is formed, and the electrode surface suction block 81a. And a display area adsorbing portion 81b that adsorbs and holds a portion of the organic EL panel P other than the portion adsorbed by the electrode surface adsorbing block 81a. The electrode surface adsorption block 81a is a rectangular parallelepiped member that is long enough to adsorb and hold the entire edge portion of the organic EL panel P where the electrode array ER is formed, and is long in the direction along the edge portion. The suction surface 81c of the electrode surface suction block 81a is formed flat and has a plurality of suction holes 81d. Then, the suction hole 81d has a hole diameter set to a size such that the edge portion of the organic EL panel P is not deformed, like the mounting portion 42a of the temporary pressure bonding device 40. The edge portion on which the electrode array ER is formed can be flattened and held by suction. The display area suction portion 81b is formed of a porous body or sponge having a flat suction surface and has a large number of suction holes. The suction surfaces of the electrode surface suction block 81a and the display area suction portion 81b are adjusted to be located on the same plane.

The electrode surface suction block 81a does not suck and hold the entire electrode array ER, but actually excludes a portion of the electrode array ER where the terminal of the electronic component W is connected via the anisotropic conductive tape F. The part on the side of the display area is sucked and held. That is, as shown by the chain double-dashed line in FIG. 8, the portion of the electrode array ER of the organic EL panel P to which the terminal of the electronic component W is connected is held in a state of protruding from the holding body 81.

Although one display area suction portion 81b is shown in FIG. 8, a plurality of display area suction portions 81b may be arranged side by side. As shown in FIG. 9, the display area suction portion 81b is in a direction intersecting with the longitudinal direction of the electrode surface suction block 81a (the edge portion direction of the organic EL panel P held by the electrode surface suction block 81a) (this embodiment). Then, two of them are arranged side by side in the orthogonal direction). Each of the two display area suction portions 81b is supported by the main body portion 81e of the holder 81 so that the distance between the two display area suction portions 81b and the electrode surface suction block 81a can be adjusted. These display area suction portions 81b are flat porous sheets 81b2 that cover a base portion 81b1 made of a metal such as aluminum and a surface of the base portion 81b1 that holds the organic EL panel P (hereinafter, referred to as "lower surface"). With. The base portion 81b1 has a substantially lattice-like suction groove communicating with the vacuum suction holes on the lower surface thereof, and a vacuum suction force is applied to the entire area of the porous sheet 81b2 provided on the lower surface to form a porous sheet. The organic EL panel P can be held flat over the entire area 81b2 with a substantially uniform suction force. As the porous sheet 81b2, for example, a film obtained by processing a resin porous molded body into a film can be used. With such a configuration, the holding body 81 can be adsorbed and held even in the thin film-like organic EL panel P having flexibility evenly and without generating an adsorption mark.

(Second transport section 90)
The second transport unit 90 holds the organic EL panel P on which the electronic component W is temporarily pressure-bonded by the temporary pressure bonding apparatus 40 by suction from the upper side, and the holder 91 from the stage 42 of the temporary pressure bonding apparatus 40 to the organic state. The XZ drive unit 92 is provided for moving the EL panel P to the carry-out position and the organic EL panel P to the stage 51 of the main pressure bonding apparatus 50. The holding body 91 includes a display area adsorbing section that adsorbs and holds substantially the entire upper surface of the organic EL panel P and is formed of a porous body having a flat adsorbing surface. This display area suction portion 81b has the same structure as the display area suction portion 81b of the holder 81.

(Third transport section 100)
The third transport unit 100 includes a holding body 101 that adsorbs and holds the organic EL panel P, on which the electronic component W is main-bonded by the main-compression bonding apparatus 50, that is, a display member from above, and the main-bonding apparatus 101. The XZ drive unit 102 for moving the organic EL panel P from the stage 51 of 50 to a carry-out position for carrying out the organic EL panel P and a delivery position to a carry-out device (not shown).

(Control device 110)
The control device 110 includes a storage unit 111. In the storage unit 111, for example, the load in the temporary pressure bonding apparatus 40 and the final pressure bonding apparatus 50, the heating temperature, the pressing time, the reference pattern of the alignment marks PM and WM regarding the image processing unit 44c, and the position information of this reference pattern, Various information for controlling each unit is stored. In addition, the storage unit 111 stores a protrusion amount G for causing the edge portion of the organic EL panel P to protrude from the mounting portion 42a of the stage 42 by a predetermined amount. Specifically, the protrusion amount G is set in the range of 3 mm or more and 15 mm or less, and more preferably in the range of 3 mm or more and 8 mm or less. Here, it is assumed that the protrusion amount G=6 mm is set.

[Operation of mounting device]
Next, the operation of the mounting apparatus 1 of the embodiment will be described. First, the carrier tape T is supplied from the supply reel 11 of the first punching device 10A, and the electronic component W is punched from the carrier tape T by the mold device 12. The punched electronic component W is sucked and held by the punch 12c. The electronic component W held by the punch 12c is delivered to the receiving portion 61 of the first delivery device 60, and is transferred to the receiving position A of the intermittent rotation transfer device 20 by the first delivery device 60. The electronic component W transferred to the receiving position A is delivered to the holding head 24 of the intermittent rotation transfer device 20 positioned at the receiving position A. The first delivery device 60 rotates the direction of the electronic component W by 90° while transferring the electronic component W to the receiving position A, so that the edge portion where the terminal row TR is formed is moved to the receiving position A. The holding head 24 is aligned with the direction (Y direction) along the outer side surface of the positioned holding head 24.

The electronic component W held by the holding head 24 is sequentially transferred to the gauging/cleaning position B, the sticking position C, and the delivery position D by the intermittent rotation of the index table 22. During this transfer, at the gauging/cleaning position B, the electronic component W is positioned with respect to the holding head 24 by the contact of a positioning mechanism (not shown), and is attached to the terminal portion by a cleaning mechanism (not shown) such as a rotating brush. Dust is cleaned. Further, at the sticking position C, the anisotropic conductive tape sticking device 30 sticks the anisotropic conductive tape F to the terminal portion of the electronic component W. When positioning and cleaning are performed at the gauging/cleaning position B, and the electronic component W to which the anisotropic conductive tape F is attached at the attachment position C is positioned at the delivery position D, the electronic component W is delivered to the delivery position D. At the receiving portion 71 of the second delivery device 70, The electronic component W delivered to the receiving portion 71 is transported to a position directly below the temporary pressure bonding head 41 of the temporary pressure bonding device 40, and is transferred to the temporary pressure bonding head 41.

On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out from the supply unit (not shown) by the holder 81 of the first transport unit 80, and is supplied and placed on the stage 42 of the temporary pressure bonding device 40. First, the holder 81 of the first transport unit 80 moves to a supply unit (not shown), and the holding surface of the holder 81, that is, the electrode surface adsorption block 81a is adsorbed on the upper surface of the organic EL panel P prepared in the supply unit. The surface 81c and the suction surface of the display area suction portion 81b are brought into contact with each other. At this time, the suction force of the electrode surface suction block 81a and the display area suction portion 81b is applied while the organic EL panel P is lightly pressed by the holder 81. By doing so, even when the organic EL panel P is warped or bent, the organic EL panel P can be held by the holder 81 in a flat state.

Further, when the organic EL panel P of the supply unit is suction-held, the holding body 81 has an end portion on the side where the electrode array ER of the organic EL panel P is formed, and an outer end portion (display area) of the electrode surface suction block 81a. It is positioned so as to protrude by a preset length H from the edge portion on the side opposite to the suction portion 81b). For example, this length H is a length corresponding to the width over which the electronic component W is superposed on the organic EL panel P at the time of temporary pressure bonding.

That is, the storage unit 111 stores the length H. When the holding device 81 holds the organic EL panel P of the supply unit, the control device 110 refers to the length H stored in the storage unit 111 so that the end of the holding unit 81 on the electrode side of the organic EL panel P is located. The XZ drive unit 82 is controlled so that the length H is protruded and held. Specifically, since the organic EL panel P is prepared in the supply unit at a preset fixed position every time, the end of the organic EL panel P on the side where the electrode array ER is formed is set with reference to this fixed position. The holding body 81 is moved by controlling the XZ drive unit 82 so that the positional relationship of protruding by the length H is formed. It should be noted that a detector such as a photoelectric sensor for detecting the edge of the organic EL panel P is provided in the holder 81, and based on the position of the edge of the organic EL panel P detected using this detector. , The holding body 81 may be moved so that the protruding amount becomes the preset length H.

The organic EL panel P held by the holder 81 is transported onto the stage 42 of the temporary pressure bonding device 40. At this time, the stage 42 of the temporary pressure bonding device 40 is positioned at a supply position (a position indicated by a chain double-dashed line in FIG. 1) for receiving the supply of the organic EL panel P from the holder 81. The organic EL panel P transported onto the stage 42 is placed on the stage 42. The controller 110 mounts the holder 81 and the stage 42 so that the protrusion amount G of the edge portion of the organic EL panel P from the mounting portion 42a becomes the protrusion amount G=6 mm stored in the storage unit 111. The relative position of the section 42a, that is, the driving of the XZ drive section 82 and the stage drive section 42b is controlled.

As described above, the protrusion amount G is set in the range of 3 mm or more and 15 mm or less, and more preferably 3 mm or more and 8 mm or less. By setting the protrusion amount G in such a range, a flexible organic EL panel P having a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less with a thickness of 50 μm or more and 500 μm or less is provided. Also, it is possible to prevent sagging from occurring at the edge portion protruding from the mounting portion 42a. The relationship between the amount G of protrusion and the amount of sagging of the edge portion varies depending on the type of the organic EL panel P, but the organic EL has a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less. In the case of the panel P, as a result of experiments by the inventors, it has been found that if the protrusion amount G is set to 3 mm or more and 15 mm or less, the drooping of the edge can be suppressed within a range in which the recognition accuracy of the alignment mark PM can be maintained. ..

It should be noted that even in the range of the above-mentioned physical characteristics, it is better to set the protrusion amount G short in order to secure stable recognition accuracy without being influenced by the type, and it is set within the range of 3 mm or more and 8 mm or less. Is more preferable. Here, it is known that the shorter the protrusion amount G of the organic EL panel P is, the more reliable the recognition accuracy is secured. However, when the protrusion amount is shortened, the proximity distance between the mounting portion 42a and the backup tool 43a is shortened. The need arises. If the proximity distance between the mounting portion 42a and the backup tool 43a becomes shorter, there is a risk of interference, that is, collision, between them, so the lower limit value is set to 3 mm. The lower limit value (3 mm) of the protrusion amount G is a value set in consideration of the width dimension of the anisotropic conductive tape F used for connecting the organic EL panel P and the electronic component W.

The organic EL panel P is held by the holder 81 such that the end portion thereof protrudes by a length H. On the other hand, since the mounting portion 42a is positioned at the supply position and its position is known, the moving position of the holding body 81 at which the protrusion amount G is obtained can be easily calculated.

Further, when the organic EL panel P is mounted on the mounting portion 42a, the organic EL panel P is pressed against the mounting surface 42c and flattened by the lowering of the holding body 81. More specifically, the organic EL panel P is held in a flat state because the display area is sucked and held by the display area suction portion 81b of the holder 81. In this state, since the organic EL panel P is pressed against the mounting surface 42c of the stage 42, the organic EL panel P is positioned between the suction surface of the display area suction portion 81b of the holder 81 and the mounting surface 42c of the stage 42. Sandwiched between. Therefore, the organic EL panel P is transferred onto the stage 42 while being kept in a flattened state, and is adsorbed and held on the stage 42.

At this time, in a state where the organic EL panel P is pressed against the mounting surface 42c of the stage 42, a suction force is applied to the suction holes 42d of the mounting portion 42a of the stage 42, and then the electrode surface suction block of the holding body 81. The suction force of 81 a and the display area suction portion 81 b may be released, but the suction force of the holding body 81 may be released before the suction force is applied to the stage 42. By doing so, the restraint in the plane direction of the organic EL panel P sandwiched between the stage 42 and the holding body 81 is reduced, so that the holding body 81 is temporarily held in the state where the warp or the bending remains. Even when it is held at the position, it is expected that the warp and the bending are corrected by the sandwiching and flattened. Therefore, it is preferable that the force for pressing the holding body 81 against the stage 42 is set to a magnitude that does not hinder the above-described correction.

When the organic EL panel P is held on the stage 42, the holder 81 moves to a supply unit (not shown). On the other hand, the stage 42 moves to the mark recognition position prior to the temporary pressure bonding by the temporary pressure bonding head 41. The electronic component W held by the temporary pressure bonding head 41 is also positioned at the mark recognition position. In the state of being positioned at the mark recognition position, the organic EL panel P and the electronic component W have the edge portion where the electrode row ER of the organic EL panel P is formed and the terminal row of the electronic component W as shown in FIG. The edge portion on which the TR is formed opposes with a minute gap. Further, in this state, the light irradiation section 44d is located right above the alignment mark PM of the organic EL panel P. In such a state, light is emitted from the light emitting unit 44d, and an image including the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W is captured by the imaging devices 44a and 44b.

The captured image is sent to the image processing unit 44c, the position data of each alignment mark PM, WM is obtained, and the position of the organic EL panel P and the electronic component W is recognized. The obtained position data is sent to the control device 110. Since the alignment mark PM of the organic EL panel P captured in this way is captured as a silhouette image, even if the organic EL panel P is warped or undulated, the alignment mark PM provided on the upper surface of the organic EL panel P is not changed. Even when the image is taken through the resin substrate in which the PI film and the PET film of the EL panel P are bonded together, the alignment mark PM can be captured as a clear image.

The control device 110, based on the position data of the left and right alignment marks PM of the organic EL panel P and the position data of the left and right alignment marks WM of the electronic component W sent from the image processing unit 44c, controls the organic EL panel P and the electronic device. A relative positional deviation with the part W in the X, Y, and θ directions is obtained. Then, the control device 110 moves the organic EL panel P and the electronic component W to the temporary pressure bonding position. At this time, the organic EL panel P and the electronic component W are aligned with each other by controlling the tool drive unit 41b and the stage drive unit 42c based on the obtained relative positional displacement so as to eliminate the positional displacement. ..

Specifically, the control device 110, based on the position data of the left and right alignment marks PM of the organic EL panel P, the inclination θP of a line segment connecting these two points and the coordinates (XP, YP) of the midpoint of this line segment. Ask for. Further, the control device 110 obtains the inclination θW of the line segment connecting these two points and the coordinates (XW, YW) of the midpoint of this line segment from the position data of the left and right alignment marks WM of the electronic component W. The difference between the inclination obtained here and the coordinates of the middle point is obtained as a relative positional deviation between the two. The positional deviation is corrected from the obtained relative positional deviation as follows.

First, the difference between the inclination θP of the line segment connecting the alignment marks PM of the organic EL panel P and the inclination θW of the line segment connecting the alignment marks WM of the electronic component W is eliminated, that is, θP−θW=0. Thus, the pressure tool 41a is rotated in the θ direction. Next, the stage 42 (stage driving unit 42b) is moved so that the midpoint of the line segment connecting the alignment marks PM of the organic EL panel P coincides with the midpoint of the line segment connecting the alignment marks WM of the electronic component W. Drive it. At this time, when the rotation center of the pressure tool 41a in the θ direction is located deviated from the position of the midpoint of the line segment connecting the alignment marks WM of the electronic component W, the rotation of the pressure tool 41a causes Since the position of the midpoint of the line segment is displaced in the horizontal direction by the amount of rotation of the pressure tool 41a, the movement position of the organic EL panel P is executed in consideration of this displacement.

The organic EL panel P positioned at the temporary pressure bonding position has its edge supported on the upper surface of the backup tool 43a. Further, the electronic component W is positioned directly above the electrode row ER of the organic EL panel P such that the terminal row TR faces each other with a slight gap. In this state, the pressing tool 41a is lowered by driving the tool driving unit 41b. As a result, the terminal portion of the electronic component W is heated and pressed on the electrode surface of the organic EL panel P via the anisotropic conductive tape F at the preset heating temperature, pressure, and pressurization time, and the organic EL panel The electronic component W is temporarily pressure-bonded to P.

When a preset pressurizing time elapses, the suction of the electronic component W by the pressurizing tool 41a is released, and the pressurizing tool 41a rises. The pressure tool 41a is moved to the delivery position where the electronic component W is delivered from the second delivery device 70. Further, the stage 42 on which the organic EL panel P to which the electronic component W has been temporarily pressure-bonded is placed is moved to a carry-out position where the organic EL panel P is transferred to the second transport section 90. At this carry-out position, the organic EL panel P is sucked and held by the holding body 91 of the second carrying section 90 in the same manner as the holding by the holding body 81 of the first carrying section 80. It is transported to the stage 51.

The organic EL panel P supplied to the final pressure bonding apparatus 50 by the second transport unit 90 is transferred onto the stage 51 positioned at the carry-in position, and is adsorbed and held on the stage 51. The operation at the time of delivery is performed in the same manner as the delivery of the organic EL panel P from the first transport unit 80 to the stage 42. At this time, the edge of the organic EL panel P to which the electronic component W is temporarily pressure-bonded is held in a state of protruding from the stage 51.

When the organic EL panel P is held on the stage 51, the stage 51 is moved to support the edge portion of the organic EL panel P on the upper surface of the backup tool 53a. In the middle of this movement, the position recognition unit 54 recognizes the position of the alignment mark of the organic EL panel P (a mark different from the alignment mark PM). Based on the result of this position recognition, the stage 51 is moved so that the electrode surface of the organic EL panel P is positioned on the upper surface of the backup tool 53a in a correct positional relationship. When the edge portion of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressing tool 52a is lowered by the driving of the tool driving unit 52b, and the organic material is heated at a preset heating temperature, pressing force, and pressing time. The electronic component W temporarily press-bonded to the EL panel P is finally pressure-bonded.

When the preset pressurizing time has elapsed, the pressurizing tool 52a is raised. Further, the organic EL panel P to which the electronic component W is permanently pressure-bonded, that is, the stage 51 on which the display member is mounted is moved to the carry-out position where the organic EL panel P is transferred to the third transport unit 100. At this carry-out position, the organic EL panel P is sucked and held by the holding body 101 of the third carrying unit 100 and carried to a carry-out device (not shown).

The above-described mounting operation including the temporary pressure bonding step and the final pressure bonding step of the electronic component W to the organic EL panel P is repeatedly performed until the organic EL panel P on which the electronic component W is to be mounted is exhausted. In the mounting apparatus 1 of the embodiment, it is important to improve the positional accuracy in the temporary crimping step, whereas in the main crimping step, it is important to improve the crimping strength and reliability with the anisotropic conductive tape F. The process time is also different. Therefore, the mounting efficiency of the electronic component W can be improved by applying the temporary pressure bonding device 40 and the final pressure bonding device 50 and performing the temporary pressure bonding process and the final pressure bonding process. However, the mounting apparatus 1 of the embodiment is not limited to such a configuration. The main pressure bonding apparatus 50 may perform the positioning process to the main pressure bonding process.

[Operation and effect of mounting device]
In the mounting apparatus 1 of the above-described embodiment, the electronic component W is a flexible organic EL panel P having a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less. The edge portion to be mounted is mounted on the stage 42 (mounting portion 42a) so that the protruding amount from the stage 42 is 3 mm or more and 15 mm or less, and the alignment mark PM is provided on the edge portion of the organic EL panel P. The light irradiation unit 44d emits light from above, which is the opposite side of the imaging devices 44a and 44b. Then, in this state, the alignment mark PM provided on the edge of the organic EL panel P and the alignment mark WM of the electronic component W held by the temporary pressure bonding head 41 are imaged by the imaging devices 44a and 44b. Further, the captured image is image-processed by the image processing unit 44c, the positional relationship between the organic EL panel P and the electronic component W is recognized, and based on the position recognition result, the control device 110 causes the organic EL panel P and the electronic component W to be detected. The electronic component W is temporarily pressure-bonded to the organic EL panel P via the anisotropic conductive tape F, and then the main-pressure bonding is performed.

By doing so, when the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are detected, the edge of the organic EL panel P on which the electrodes are formed protrudes from the stage 42. It is possible to prevent sagging at the edge. In addition, even if the organic EL panel P is made of a resin such as PI or PET and may have a warp or undulation at its edge, or is made of a resin substrate having a lower transmittance than glass, it may be affected by transmitted light. By capturing the alignment mark PM as a silhouette image, the difference in brightness between the alignment mark PM and the background can be improved, and thus the alignment mark PM can be captured clearly. Therefore, it is possible to reduce the recognition error of the alignment mark PM caused by the sagging of the edge of the organic EL panel P and the recognition error of the alignment mark PM caused by the lack of sharpness of the captured image. As a result, the mounting accuracy of the electronic component W on the organic EL panel P can be improved. Therefore, even when the flexible electronic component W is mounted on the flexible organic EL panel P, the mounting precision and the mounting quality can be improved.

That is, since a display panel (hereinafter, referred to as a liquid crystal display panel) used for manufacturing a conventional liquid crystal display is formed by bonding glass substrates having a thickness of 0.5 to 0.7 mm to each other, High rigidity. Therefore, even if the edge of the liquid crystal display panel is projected and held by several tens of millimeters from the stage, the edge hardly hangs down by its own weight.

On the other hand, in the organic EL panel P, the PI film Ka having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), which is a member on which the organic EL element is formed as described above, is the supporting material. Since a thin resin substrate formed by adhering to a PET film Kb having a thickness of about 0.1 to 0.2 mm is used, the rigidity is extremely low. Therefore, in the organic EL panel P, when the edge of the organic EL panel P is protruded from the stage by several tens of millimeters and held, the protruding edge easily hangs down by its own weight. When the edge portion of the organic EL panel P hangs down, the position of the alignment mark PM formed on the edge portion shifts in the horizontal direction. Therefore, in recognizing the position of the alignment mark PM of the organic EL panel P using the camera, the recognition position is displaced.

It was confirmed by experiments by the inventors of the present application that when the edge portion of the organic EL panel P is held 20 mm beyond the stage as in the case of a liquid crystal display panel of the same size, the edge portion sags. It was confirmed that the sag caused a positional deviation of about 4 μm in the horizontal direction (toward the stage side) at the position of the alignment mark PM. Moreover, when the edge of the organic EL panel P hangs down, the alignment mark is inclined with respect to the horizontal state. When the tilted alignment mark PM is imaged from directly below, the length of the imaged alignment mark in the tilting direction is shorter than that when imaged in the horizontal state. That is, the shape of the imaged alignment mark PM is deformed by the amount of inclination. As a result, there is a difference in shape from the reference mark stored in advance, which also causes an error in the recognition position of the alignment mark PM.

The inventors of the present application conducted an experiment to compare the recognition position error between the alignment mark PM held horizontally and the alignment mark PM tilted 5° with respect to the horizontal. It was confirmed that the error was large by about 1 μm. The experiment was performed with the alignment mark tilted by 5°, because the sag that occurred when the edge portion was projected 20 mm from the stage was measured for a plurality of organic EL panels P, and a sag of 5° or more was confirmed in each case. Is.

On the other hand, in the mounting apparatus 1 according to the embodiment, as described above, the organic EL panel P having a thickness of 50 μm or more and 500 μm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less is used. The edge protruding from the stage 42 of the organic EL panel P is set by mounting the component W on the stage 42 (mounting portion 42a) so that the protruding amount of the edge portion from the stage 42 is 3 mm or more and 15 mm or less. It is possible to prevent the parts from sagging. As a result, it is possible to suppress the occurrence of a recognition error of the alignment mark PM due to the hanging portion of the organic EL panel P protruding from the stage 42. That is, when the bending elastic modulus of the protruding portion of the organic EL panel P is 2.6 GPa or more and the thickness is 50 μm or more and the protruding amount is 15 mm or less, it is possible to prevent the protruding portion from sagging. If the bending elastic modulus of the protruding portion exceeds 4.0 GPa or the thickness exceeds 500 μm, the characteristics such as flexibility of the organic EL panel P and the basic characteristics as a thin display panel may deteriorate.

Further, when the alignment mark PM of the organic EL panel P is imaged, if the illumination is applied from the lower side where the camera is located, the alignment mark PM cannot be clearly imaged or cannot be imaged at all. The problem occurs. For the irradiation conditions (irradiation light amount, irradiation angle, etc.) when illuminating from below, a reference organic EL panel (for example, an organic EL panel having a flat edge, which will be referred to as a “reference panel” hereinafter) is used. , Set the conditions so that the alignment mark on the reference panel can be imaged well. Even when such an irradiation condition is applied, the edge of the organic EL panel P that is actually imaged has a sag or a warp and is tilted with respect to the edge of the reference panel. The reflection degree of the illumination at the edge of the EL panel P becomes different from that of the reference panel. As a result, there arises a problem that the alignment mark PM cannot be clearly imaged or cannot be imaged at all. As a result of experiments by the inventors of the present application, it was confirmed that when the alignment mark PM could not be clearly imaged, the recognition position was displaced by a maximum of about 1 μm.

With respect to such a point, in the mounting apparatus 1 of the embodiment, in addition to preventing the edge portion of the organic EL panel P protruding from the stage 42 from sagging, the alignment mark PM is imaged by the imaging device. Light is irradiated by the light irradiation unit 44d from above, which is the opposite side to 44a and 44b, and the alignment mark PM is captured as a silhouette image by the transmitted light. As a result, even if the organic EL panel P is made of a resin such as PI or PET and may have a warp or undulation at its edge, or is made of a resin substrate having a lower transmittance than glass, the alignment mark Since the difference in brightness between the PM and the background can be improved, the alignment mark PM can be clearly imaged. By these, the recognition error of the alignment mark PM can be reduced, so that the mounting accuracy of the electronic component W on the organic EL panel P can be improved.

In order to suppress the sagging and warping of the edge portion of the organic EL panel P, the inventors of the present invention support a portion (support surface) that supports the edge portion of the organic EL panel P to be flat and have suction holes. The tool was attached to the stage, held so that the edge of the organic EL panel did not sag, and an attempt was made to mount electronic components in this state. The support was made of stainless steel used in a backup tool of a general OLB device. Further, an observation hole for image pickup having a diameter of 3 mm and penetrating up and down was provided in a portion of the support corresponding to the position of the alignment mark.

However, even with such a support, some types of organic EL panels could not sufficiently satisfy the mounting accuracy of ±3 μm. That is, when an experiment was conducted to confirm the mounting accuracy using a plurality of types of organic EL panels, it was found that there are some types that achieve a mounting precision within ±3 μm and some types that the mounting precision exceeds ±3 μm. did.

That is, since the organic EL panel P is composed of a thin and flexible resin substrate, if it is adsorbed with a large adsorption force, an adsorption mark is generated. Although not used for displaying an image, fine edges (also referred to as “leads”) connected to the terminals of the electronic component W are formed at the edge of the organic EL panel P. Therefore, when an adsorption mark is generated on the electrode portion, the electrode is deformed such as bent. Since the stress remains inside the deformed electrode, it becomes a factor that reduces the durability of the electrode, which is not preferable. Therefore, it is necessary to set the size of the suction holes and the negative pressure acting on the suction holes within a range that does not cause suction marks on the organic EL panel. In the above-mentioned experiment, adsorption holes having a diameter of 0.5 mm were formed in a row at intervals of 2 mm in the support, and a negative pressure of -40 kPa was applied to the adsorption holes. However, it has been found that when the suction force is set in consideration of the suction mark in this way, the edge portion cannot be made to follow the support surface of the support depending on the type of the organic EL panel.

That is, depending on the type of the organic EL panel, there may be warping or undulation at the edge, and even in the organic EL panel having such warping or undulation, the warping or undulation is corrected by adsorption. There are those that imitate the support surface of the support tool and those that do not correct the warp and swell. In such an organic EL panel in which warpage and undulation are not corrected, it has been confirmed that the mounting accuracy exceeds ±3 μm. Then, in such an organic EL panel in which the warp and the undulation are not corrected, the reflection degree of the illumination emitted from the same side as the camera is different from that of the reference panel, and as a result, the alignment mark cannot be clearly imaged. It was found that the recognition accuracy of the alignment mark was reduced.

Furthermore, it has been found that a new problem arises by providing a support tool and providing the support tool with an observation hole for imaging. That is, by providing the observation hole, when the pressure bonding head is brought into contact with the organic EL panel via the electronic component during the temporary pressure bonding, the impact due to the contact causes an impression of the observation hole in the organic EL panel. Was confirmed. Such an indentation also deforms the electrodes of the organic EL panel as in the case of the above-described suction indentation, and therefore deteriorates the mounting quality and must be avoided. It should be noted that no indentation was observed in the suction holes of the support because the diameter was as small as 0.5 mm.

Therefore, we tried to recognize the alignment mark through the support without forming an observation hole by forming the support with glass. As a result, the occurrence of indentation could be eliminated, but it was found that there was a problem in durability. Specifically, when a repeated mounting test was carried out, occurrence of chipping in the support tool was recognized after the number of times of mounting exceeded 10,000 times. Therefore, when using such a glass-made support tool, it is necessary to replace the support tool after about 10,000 times of mounting. In such mounting, the time (tact time) required for mounting one electronic component is usually 3 seconds to 5 seconds, and therefore, when continuously operated, it is 10000 in 8.3 hours to 13.9 hours. It is a calculation to reach times. Therefore, it is necessary to replace the support tool every 8.3 to 13.9 hours, that is, the frequency of 2-3 times a day.

Since it is necessary to uniformly press the electrode portion of the electronic component against the electrode portion of the organic EL panel between the support and the pressure bonding head, precise parallelism is required. Although individual supports are processed into the same shape, they have individual differences. Therefore, it is necessary to adjust the parallelism with the crimping tool every time the support tool is replaced. Therefore, the production of the OLB device cannot be performed because the operation of the OLB device must be stopped during the adjustment. Occurrence of such an outage several times a day leads to a significant decrease in productivity and is not realistic. It is also conceivable that a glass lid is fitted over the observation hole of the support made of stainless steel to make the support surface of the support apparently flat. However, as long as the lid is made of glass, it has a problem of durability, and if a step is formed between the upper surface of the lid and the support surface, it may cause an indentation, which is not realistic.

The mounting apparatus 1 of the embodiment has a problem in the case where the alignment mark is recognized while preventing the edge portion of the organic EL panel P from being drooped by using the above-described support tool, that is, the impression by the observation hole of the support tool, This makes it possible to suppress a decrease in alignment mark recognition accuracy due to warping or undulation that is not corrected on the support surface of the support, and a decrease in mounting efficiency due to the durability of the glass support. That is, in addition to protruding the edge portion from the stage 42 of the organic EL panel P and preventing sagging of the protruding edge portion, the alignment mark PM is captured as a silhouette image by the transmitted light. It is possible to improve the mounting accuracy and the mounting quality of the electronic component W on the organic EL panel P while avoiding the problems caused by the support as described above.

Further, in the mounting apparatus 1 of the embodiment, the backup tool 43a used at the time of temporary pressure bonding is formed of, for example, stainless steel, and the supporting surface that supports the edge portion of the organic EL panel P is formed flat. Therefore, it is possible to prevent an indentation from being generated on the edge portion of the organic EL panel P during the temporary pressure bonding. Moreover, since it is made of stainless steel, damage is less likely to occur even when pressed by the temporary pressure bonding head 41, excellent long-term durability is achieved, and good productivity can be maintained.

Further, based on the amount G of protrusion of the edge of the organic EL panel P from the mounting portion 42a of the stage 42 stored in the storage unit 111, the control device 110 drives the stage driving unit 42b and the XZ driving unit 82. By controlling, the organic EL panel P is mounted on the mounting part 42a of the stage 42 from the holder 81 of the first transport part 80 with the protrusion amount G set in the range of 3 mm or more and 15 mm or less. There is. As a result, the organic EL panel P can be surely placed on the placing portion 42a with the protrusion amount G set, and the edge of the organic EL panel P is reliably prevented from sagging and stable. It is possible to further improve the recognition accuracy of the alignment mark PM. As a result, the mounting accuracy of the electronic component W on the organic EL panel P can be stably obtained, and the mounting quality of the electronic component W can be improved.

The present invention is not limited to the above embodiment. For example, the organic EL panel has been described as an example of the display panel, but the display panel is not limited to this. For example, a flexible electronic paper constituent member can be used as a display panel. In short, any display panel having a thickness of 50 μm or more and 500 μm or less and a flexural modulus of 2.6 GPa or more and 4.0 GPa or less and having flexibility can be applied.

Further, the organic EL panel P is mounted on the mounting part 42a by controlling the stage drive part 42b and the XZ drive part 82 based on the set protrusion amount G, but it is not limited to this. Instead, the amount of protrusion of the organic EL panel P may be detected, and the stage drive unit 42b and the XZ drive unit 82 of the first transport unit 80 may be controlled so that the set protrusion amount G is achieved. In this case, for example, at the stage 42 or at the delivery position of the organic EL panel P with respect to the stage 42, a photoelectric sensor for detecting the end portion (side where the electrode array ER is formed) of the organic EL panel P held by the holder 81, It is preferable to provide a detector such as a laser sensor and control the protrusion amount of the edge portion from the mounting portion 42a to be the set protrusion amount G based on the detection result of the detector.

Instead of storing the protrusion amount G in the storage unit 111, information about the type of display panel (type information) may be stored. In this case, a conversion table representing the relationship between the product type information of the display panel P and the protrusion amount G corresponding to the product type information is acquired and created in advance by an experiment or the like, and this conversion table is stored in the storage unit 111. I will let you. Then, based on the product type information input by the input means (not shown), the protrusion amount G corresponding to the product type information may be read.

Further, as the image pickup device of the position recognition device 44, first and second image pickup devices 44a and 44b for picking up the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W at the same time in the same visual field are taken. Although the case of use is described, the image pickup device of the position recognition device 44 is not limited to this. For example, the first and second imaging devices 44a and 44b may separately image the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, respectively.

Furthermore, two image pickup devices are provided, the alignment mark WM of the electronic component W is imaged by the first and second image pickup devices 44a and 44b, and the alignment mark PM of the organic EL panel P is imaged by the other two image pickup devices. It may be done. At this time, the other two image pickup devices may be attached so that the alignment mark PM of the organic EL panel P is not picked up from the lower side but is picked up from the upper side. In this case, it is advisable to dispose the light irradiation part 44d at a position lower than the mounting part 42a of the stage 42 and irradiate the alignment mark PM of the organic EL panel P with light from the lower side. In this way, when the alignment mark PM of the organic EL panel P is imaged from the upper side by transmitted illumination, the alignment mark P provided on the upper surface side of the organic EL panel P is directly imaged. Therefore, it is possible to obtain a larger difference between bright and dark than when the image is taken from the lower side through the resin base material of the organic EL panel P by the transillumination, and the recognition accuracy can be further improved.

Although the alignment mark PM of the organic EL panel P is picked up by transmissive illumination, the alignment mark WM of the electronic component W may also be picked up by transmissive illumination. In this case, the pressure tool 41a of the temporary pressure bonding head 41 is provided with a light guide section in accordance with the position of the alignment mark WM of the electronic component W, and the light emitted from the light irradiation section 44d is aligned through the light guide section. It is also possible to lead to the WM. Of course, a light irradiation unit may be provided individually, or the light irradiation unit may be embedded in the pressure tool 41a.

Although the anisotropic conductive tape F is used for connecting the organic EL panel P and the electronic component W, the invention is not limited to this. Other connecting members such as an adhesive containing conductive particles may be used. When using an adhesive, it is possible to use a thermosetting or photocurable adhesive.

The configurations of the first to third transport units 80, 90, and 100 are not limited to those described above, and may have other configurations. For example, instead of using a porous sheet, a flexible rubber or resin material such as foamed urethane rubber or silicon rubber provided with a plurality of suction openings may be used.

Although it has been described that the organic EL panel P is transported from the stage 42 of the temporary pressure bonding apparatus 40 to the stage 51 of the main pressure bonding apparatus 50 by using the second transportation unit 90, the present invention is not limited to this. For example, the stage 51 of the main pressure bonding apparatus 50 is configured to be movable to a position close to the stage 42 of the temporary pressure bonding apparatus 40, and the stage 51 of the main pressure bonding apparatus 50 moved to the position close to the stage 42 of the temporary pressure bonding apparatus 40. On the other hand, the first transport unit 80 may be used to transport the organic EL panel P. That is, the first transport unit 80 may also serve as the second transport unit 90.

A plurality of main pressure bonding devices 50 may be installed in the mounting device 1 in consideration of the difference in process time between the temporary pressure bonding process and the main pressure bonding process. Further, instead of providing a plurality of main pressure-bonding devices 50, a stage 51 capable of mounting a plurality of organic EL panels P in parallel is provided in one main pressure-bonding device 50, and a plurality of organic ELs mounted in parallel are also provided. It is also possible to provide a main pressure bonding head 52 that can perform the main pressure bonding of the electronic components W on the panel P collectively or individually. Here, in the case of performing the main pressure bonding collectively, the main pressure bonding head 52 is equipped with a pressure tool 52a having a length capable of covering the entire area of the plurality of organic EL panels P placed in parallel. In the case of individual main pressure bonding, the main pressure bonding head 52 is equipped with a pressure tool 52a having a length capable of covering the electronic component W mounted on one organic EL panel P in accordance with the mounting interval of the organic EL panel P. To do. It is preferable that each pressurizing tool 52a is configured so that the pressing force can be set individually.

In the above-described embodiment, the configuration in which the anisotropic conductive tape F is attached to the electronic component W has been described, but the configuration is not limited to this. The anisotropic conductive tape F may be attached to the organic EL panel P, that is, the display panel. In this case, instead of providing the anisotropic conductive tape sticking device 30 at the sticking position C of the intermittent rotation transfer device 20, the anisotropic conductive tape is provided on the organic EL panel P on the upstream side of the supply section of the organic EL panel P. An anisotropic conductive tape sticking device for sticking F may be provided. For example, a mounting apparatus 201 as shown in FIG. 10 may be applied. FIG. 10 shows the configuration of a mounting apparatus 201 according to another embodiment.

[Mounting Device According to Another Embodiment]
In the mounting device 201 shown in FIG. 10, an anisotropic conductive tape attaching device 230, a temporary pressure bonding device 240, and a main pressure bonding device 250 are arranged side by side in the X direction, and a punching device 210 is arranged behind the temporary pressure bonding device 240 in the Y direction. In addition, a transport device 260 for transporting the electronic component W is arranged between the temporary pressure bonding device 240 and the punching device 210. Transport units 271, 272, 273, 274 of the organic EL panel P are arranged between the processing devices 230, 240, 250. The mounting apparatus 201 supplies four organic EL panels P each and performs processing in each processing apparatus. The punching device 210 punches the electronic component W from the carrier tape T, and has the same configuration as the punching device 10 described in the above embodiment.

The anisotropic conductive tape sticking device 230 sticks the anisotropic conductive tape F to the organic EL panel P. In the anisotropic conductive tape sticking device 230, two mounting portions 231, 232 for holding two organic EL panels P side by side in the X direction are arranged side by side in the X direction. These mounting portions 231 and 232 are provided so as to be movable in the XYZθ directions, respectively. Further, the sticking units 233 and 234 of the anisotropic conductive tape F are arranged corresponding to the two mounting portions 231 and 232. The respective mounting parts 231, 232 sequentially position the organic EL panels P on the mounting parts 231, 232 at the bonding positions by the corresponding bonding units 233, 234, respectively. Each sticking unit 233, 234 sticks the anisotropic conductive tape F on the organic EL panel P positioned at the sticking position.

The temporary pressure bonding device 240 temporarily pressure-bonds the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is attached. The temporary pressure bonding device 240 includes a mounting portion 241 that holds four organic EL panels P side by side in the X direction, a temporary pressure bonding head 242 that temporarily pressure-bonds the electronic component W to the organic EL panels P held by the mounting portion 241. A backup tool (not shown) is provided to support the organic EL panel P from below when the electronic component W is temporarily pressure bonded to the organic EL panel P by the temporary pressure bonding head 242. The mounting portion 241 is provided so as to be movable in the XYZθ directions, and sequentially positions the four organic EL panels P on the mounting portion 241 at the temporary pressure bonding positions by the temporary pressure bonding head 242. The temporary pressure bonding head 242 sequentially temporarily pressure-bonds the electronic component W to the organic EL panel P positioned at the temporary pressure bonding position. Needless to say, the temporary pressure bonding device 240 includes the same position recognition device as the temporary pressure bonding device 40 described in the above embodiment.

Here, the provisional pressure bonding head 242 is sequentially supplied with the electronic components W punched by the punching device 210 by the transport device 260. That is, the transport device 260 is movable in the XYZθ directions by the XYZθ drive unit 261, and is provided with a receiving unit 262 that sucks and holds the electronic component W from below, receives the electronic component W from the punching unit 210, and temporarily presses the head 242. Hand over to.

The main pressure bonding device 250 performs the main pressure bonding of the electronic component W temporarily bonded to the organic EL panel P. In the main pressure bonding apparatus 250, four mounting portions 251, 252, 253, 254 which individually hold the organic EL panels P one by one are arranged side by side in the X direction. Further, four main pressure bonding heads 255, 256, 257, 258 are provided corresponding to the four mounting portions 251, 252, 253, 254. The main pressure bonding heads 255, 256, 257, and 258 are provided so that the pressing force can be individually adjusted and can be collectively moved up and down. The respective mounting portions 251, 252, 253, 254 are movable in the XYZθ directions, and the organic EL panel P can be positioned with respect to the corresponding main pressure bonding heads 255, 256, 257, 258. The four main pressure bonding heads 255, 256, 257, 258 collectively perform the main pressure bonding for the four organic EL panels P positioned by the four mounting portions 251, 252, 253, 254.

The transport units 271, 272, 273, and 274 simultaneously transfer four organic EL panels P to and from the processing devices 230, 240, and 250. That is, the transport units 271, 272, 273, and 274 are formed by arranging four holding units that adsorb and hold the organic EL panel P in parallel in the X direction. Then, the transport unit 271 simultaneously transfers four organic EL panels P from the supply unit (not shown) to the anisotropic conductive tape sticking device 230. The transport unit 272 simultaneously transfers four organic EL panels P from the anisotropic conductive tape sticking device 230 to the temporary pressure bonding device 240. The transport unit 273 simultaneously transfers four organic EL panels P from the temporary pressure bonding device 240 to the final pressure bonding device 250. The transport unit 274 simultaneously transports four organic EL panels P from the main pressure bonding apparatus 250 to a transport unit (not shown). The present invention is also applicable to the mounting apparatus 201 having such a configuration.

Next, examples of the present invention and evaluation results thereof will be described.

(Example 1)
Using the mounting apparatus 1 of the above-described embodiment, an experiment for confirming mounting accuracy by TEG (Test Element Group) was performed under the following conditions. Here, TEG is an evaluation member manufactured for testing, and here, an evaluation member of the organic EL panel P was manufactured. Specifically, a PI film having a size of 5 inches (120 mm×65 mm) and a thickness of 0.03 mm (30 μm) and a PET film having a size of 5 inches and a thickness of 0.20 mm (200 μm) are also used. A TEG of an organic EL panel was produced by bonding with an ultraviolet curable resin for optics. The flexural modulus of PET is 3.07 GPa and the flexural modulus of PI is 3.5 GPa. The bending elastic modulus of the organic EL panel P was estimated to be about 3.1 GPa from the ratio of the thicknesses of both. As the electronic component W, COF having a width of 36 mm and a length of 25 mm was used. Hereinafter, the TEG of the organic EL panel P will be simply referred to as the organic EL panel P. The target accuracy is ±3 μm, which is a general accuracy required for an organic EL panel used for a smartphone display panel.

<Experimental conditions>
Heater for temporary pressure bonding head: OFF
Tact time: 10 seconds (however, the moving speeds of the temporary pressure bonding tool 41a and the mounting portion 42a are the same as those when mounting is performed with a tact of 5 seconds).
Repeat time (number of times): 2.8 hours (1000 times)

In the experiment, first, the organic EL panel P is mounted on the mounting portion 42a in a state where each is in the standby position, and the electronic component W is held by the pressing tool 41a. The standby position is a supply position where the placing section 42a receives the organic EL panel P from the first transport section 80, and a pressing tool 41a is a position where the electronic component W is received from the second delivery device 70. From this state, the organic EL panel P and the electronic component W are positioned at the mark recognition position prior to the temporary pressure bonding. At this time, the pressure head 41a is positioned while being rotated in the horizontal direction of θ=+5°. This is to confirm the correction accuracy of the rotation deviation. The protruding amount G at the edge of the organic EL panel P was set to 4 mm.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are recognized using the first and second imaging devices 44a and 43b, and the organic EL panel P and the electronic component W are recognized based on the recognition result. Align. In this alignment, the edge of the electronic component W is not overlapped with the edge of the organic EL panel P, but the edge of the organic EL panel P and the edge of the electronic component W are slightly separated. It is performed in a state of facing each other. Specifically, the alignment marks PM and WM are aligned with each other with a distance of 3 mm. Since the distances from the alignment marks PM and WM to the edges are about 0.6 to 1.2 mm, the edges are arranged at intervals of 0.6 to 1.8 mm.

When the alignment is completed, the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are placed in the same visual field from the lower side by using the first and second imaging devices 44a and 44b, and the images are taken simultaneously. Then, the relative positional deviation between the organic EL panel P and the electronic component W is recognized. Then, the relative positional deviation obtained from this recognition result was recorded as the mounting accuracy. Since the alignment marks PM and WM are spaced from each other by 3 mm, the alignment marks PM and WM are displaced by 3 mm in the Y-axis direction in an ideal positioning state. ..

As a result, the maximum value of the positional deviation in the X-axis direction was 0.7 μm, and the minimum value was −0.4 μm. Moreover, the maximum value of the positional deviation in the Y-axis direction was 0.5 μm, and the minimum value was −0.9 μm. In all cases, the target precision was within ±3 μm.

(Example 2)
In Example 2, the experiment was performed under the same conditions as in Example 1 except that the protrusion amount G was set to 15 mm. As a result, the maximum value of displacement in the X-axis direction was 1.6 μm, and the minimum value was −1.1 μm. Moreover, the maximum value of the positional deviation in the Y-axis direction was 0.9 μm, and the minimum value was −2.3 μm. In all cases, the target precision was within ±3 μm.

(Comparative Example 1)
In Comparative Example 1, the experiment was performed under the same conditions as in Example 1 except that the protrusion amount G was set to 20 mm. As a result, the maximum value of positional deviation in the X-axis direction (maximum position of positional deviation in the plus direction) was 2.7 μm, and the minimum value (maximum position of positional deviation in the negative direction) was −2.0 μm. Moreover, the maximum value of the positional deviation in the Y-axis direction was 1.5 μm, and the minimum value was −5.8 μm. The positional deviation in the X-axis direction was within ±3 μm, which is the target accuracy, but the positional deviation in the Y-axis direction was significantly outside the range of ±3 μm, which is the target accuracy.

The measurement results of Example 1 described above are shown in Table 1 and FIG. The measurement results of Comparative Example 1 are shown in Table 2 and FIG. Tables 1 and 2 show the average value (1) of the 1st to 10th data and the average value (2) of the 101st to 110th data in the 1000 times of data acquired during the repetition time. Similarly, the average value ((3) to (10)) of the data for 10 times for every 100 times is shown as "relative positional deviation recognition result". The “difference from the measurement result of (1)” in Table 1 is a value obtained by subtracting the average value (1) from the average values ((2) to (10)) of data every 100 times. FIG. 11 and FIG. 12 show variations in “difference from measurement result of (1)”. As is clear from the comparison between Table 1 and FIG. 11 and Table 2 and FIG. 12, it can be seen that the variation of the mounting accuracy in Example 1 is significantly suppressed as compared with Comparative Example 1. Therefore, it can be seen that the mounting accuracy of the flexible electronic component on the flexible display panel can be maintained for a long period of time.

(Examples 3 and 4)
As Examples 3 and 4, another TEG was manufactured by using the mounting apparatus 1 of the above-described embodiment, and an experiment for confirming the mounting accuracy was conducted. Assuming that the organic EL panel P has an optical film attached to the display portion, a TEG having a PEN film attached to a portion corresponding to the display portion was produced. More specifically, a PEN film having a size of 114 mm×65 mm and a thickness of 0.15 mm (125 μm) is attached to the TEG used in Examples 1 and 2 by using an ultraviolet curable resin for optics, and a new piece is prepared. TEG was prepared. This PEN film has an end portion on the opposite side to the edge portion on which the electronic component W is mounted to the TEG used in Examples 1 and 2, and an end portion on the edge portion side on which the electronic component W is mounted is matched. And the end of the PEN film were bonded so that a gap of 6 mm was formed. The bending elastic modulus of PEN is 2.2 GPa, the bending elastic modulus of PI is 3.5 GPa, and the bending elastic modulus of PET is 3.07 GPa. The bending elastic modulus of the organic EL panel P was estimated to be about 2.8 GPa from the ratio of the three thicknesses. As the electronic component W, as in Examples 1 and 2, COF having a width of 36 mm and a length of 25 mm was used.

In Example 3, the experiment was conducted under the same conditions as in Example 1. As a result, the maximum value of the positional deviation in the X-axis direction was 0.9 μm and the minimum value was −0.3 μm. Moreover, the maximum value of the positional deviation in the Y-axis direction was 1.0 μm, and the minimum value was −0.7 μm. Although inferior to Example 1, all were within the target accuracy of ±3 μm. In Example 3, since the protrusion amount G was 4 mm, the portion protruding from the stage 21 in the organic EL panel P was only the edge portion where the PEN film did not exist, and therefore the result was substantially the same as in Example 1. I guess.

In Example 4, the experiment was performed under the same conditions as in Example 1 except that the protrusion amount G was set to 12 mm. By setting the protrusion amount G to 12 mm, the portion of the organic EL panel P to which the PEN film is attached protrudes by 6 mm. As a result, the maximum value of displacement in the X-axis direction was 1.9 μm, and the minimum value was −1.5 μm. Moreover, the maximum value of the positional deviation in the Y direction was 2.6 μm, and the minimum value was −1.6 μm. In all cases, the target precision was within ±3 μm.

(Comparative example 2)
In Comparative Example 2, the experiment was performed under the same conditions as in Example 1 except that the protrusion amount G was set to 20 mm. As a result, the maximum value of displacement in the X-axis direction was 2.8 μm and the minimum value was −2.3 μm. Moreover, the maximum value of the positional deviation in the Y direction was 8.2 μm, and the minimum value was −0.6 μm. Although the positional deviation target accuracy in the X-axis direction was within ±3 μm, the positional deviation in the Y-axis direction was significantly out of the range of the target accuracy ±3 μm.

From these results, it is understood that the mounting accuracy can be improved as the protruding amount G of the edge portion of the organic EL panel P from the mounting portion 42a of the stage 42 is shorter. It was confirmed that the mounting accuracy can be set within ±3 μm by setting the protrusion amount to 15 mm or less.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are also included in the invention described in the claims and an equivalent range thereof.

DESCRIPTION OF SYMBOLS 1... Mounting device, 10 (10A, 10B)... Punching device, 12... Mold device, 20... Intermittent rotation conveyance device, 21... Arm part, 24... Holding head, 30... Anisotropic conductive tape sticking device (joining) Member pasting device), 32... Pasting head, 40... Temporary crimping device, 41... Temporary crimping head, 42... Stage, 42a... Placing section, 42b... Stage drive section, 43... Backup unit, 43a... Backup tool, 44... Position recognition device, 44a... 1st imaging device, 44b... 2nd imaging device, 44c... Image processing device, 44d... Light irradiation part, 50... Main pressure bonding device, 51... Stage, 52... Main pressure bonding head, 53... Backup unit, 60... First delivery device, 61... Receiving unit, 70... Second delivery device, 71... Receiving unit, 80... First transporting unit, 81... Holding body, 81a... Electrode surface adsorption block , 81b... Display area suction section, 90... Second transport section, 91... Holder, 100... Third transport section, 101... Holder, 110... Control device, 111... Storage section, F... Anisotropic conductivity Tape, P... Organic EL panel, W... Electronic component.

In the electronic component mounting apparatus of the embodiment, a plurality of electrodes arranged on an edge portion of a display panel having flexibility are arranged corresponding to the plurality of electrodes in the electronic component having flexibility. A mounting device for an electronic component that mounts the electronic component on the display panel by connecting a plurality of terminals via a joining member,
A stage movable in the horizontal direction on which the display panel is mounted so that the edge portion protrudes in a range of 3 mm or more and 15 mm or less;
A backup unit that supports the edge portion of the display panel placed on the stage from below,
A thermocompression bonding head that holds the electronic component from above and thermocompresses the electronic component on the upper surface of the edge portion supported by the backup unit, the thermocompression bonding head being movable in horizontal and vertical directions,
Imaging for imaging the alignment mark provided on the edge and the alignment mark provided on the electronic component in a state before the edge of the display panel protruding from the stage is supported by the backup unit. A device and a position recognition device that includes a light irradiation unit that irradiates the display panel with light from a side opposite to the imaging device, and recognizes a positional relationship between the display panel and the electronic component.
Based on the positional relationship recognized by the position recognition device, the relative positions of the stage and the thermocompression bonding head are adjusted so that the display panel and the electronic component are aligned with each other, and the thermocompression bonding head is also disposed. According to, so as to thermocompression-bond the electronic component to the display panel, comprising a control device for controlling the stage and the thermocompression-bonding head,
The bending elastic modulus of the portion of the display panel protruding from the stage is 2.6 GPa or more and 4.0 GPa or less.

The method for manufacturing a display member according to the embodiment includes a mounting step of mounting a flexible display panel on a stage such that an amount of protrusion of an edge portion having a plurality of electrodes is 3 mm or more and 15 mm or less. And a placing step in which a bending elastic modulus of a portion of the display panel protruding from the stage is 2.6 GPa or more and 4.0 GPa or less,
A holding step of holding a plurality of terminals provided corresponding to the plurality of electrodes, the electronic component having flexibility in a thermocompression bonding head;
The alignment mark provided on the edge portion of the display panel placed on the stage is imaged in a state where the alignment mark is irradiated with light from the side opposite to the imaging side, and the thermocompression head is attached to the image. A position recognition step of capturing an image of the alignment mark provided on the held electronic component, and recognizing the positional relationship between the display panel and the electronic component based on the captured images of both alignment marks,
The relative position between the stage and the thermocompression bonding head is adjusted based on the positional relationship recognized in the position recognition step, the edge portion of the display panel is supported by a backup unit, and the thermocompression bonding head is used to perform the electronic operation. A thermocompression bonding step of thermocompression bonding the component to the edge portion of the display panel supported by the backup unit ,
A display member is manufactured in which the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via a connecting member.

Claims (8)

To a plurality of electrodes arranged at the edge of the flexible display panel, a plurality of terminals arranged corresponding to the plurality of electrodes in a flexible electronic component are connected via a joining member. A mounting device of an electronic component for mounting the electronic component on the display panel by connecting,
A stage movable in the horizontal direction on which the display panel is mounted so that the edge portion protrudes in a range of 3 mm or more and 15 mm or less;
A backup unit that supports the edge portion of the display panel placed on the stage from below,
A thermocompression bonding head that holds the electronic component from above and thermocompresses the electronic component on the upper surface of the edge portion supported by the backup unit, the thermocompression bonding head being movable in horizontal and vertical directions,
An image pickup device for picking up an image of an alignment mark provided on the edge of the display panel and an alignment mark provided on the electronic component, the image pickup device being opposite to the display panel. A position recognizing device that includes a light irradiation unit that irradiates light from the side, and that recognizes the positional relationship between the display panel and the electronic component;
Based on the positional relationship recognized by the position recognition device, the relative positions of the stage and the thermocompression bonding head are adjusted so that the display panel and the electronic component are aligned with each other, and the thermocompression bonding head is also disposed. According to, so as to thermocompression-bond the electronic component to the display panel, comprising a control device for controlling the stage and the thermocompression-bonding head,
A mounting device for an electronic component, wherein a bending elastic modulus of a portion of the display panel protruding from the stage is 2.6 GPa or more and 4.0 GPa or less. Furthermore, the stage is provided with a transport unit that supplies the display panel,
The electronic device according to claim 1, wherein the control device controls the movement of the stage and the transport unit based on a protrusion amount of the edge portion of the display panel that is preset within a range of 3 mm or more and 15 mm or less. Component mounting equipment. The imaging device of the position recognition device simultaneously captures an image of the alignment mark of the display panel mounted on the stage and an image of the alignment mark of the electronic component in the same field of view to capture an image. The electronic component mounting apparatus according to claim 1 or 2. The imaging device of the position recognition device includes a first imaging device that images the alignment mark of the display panel placed on the stage from above, and the electronic component held by the thermocompression head. A second imaging device for imaging the alignment mark from below,
The light irradiation unit of the position recognition device irradiates the alignment mark of the display panel mounted on the stage with light from a side opposite to the first imaging device. 2. The electronic component mounting apparatus according to 2. The electronic component mounting apparatus according to claim 1, wherein a thickness of a portion of the display panel protruding from the stage is 50 μm or more and 500 μm or less. A mounting step of mounting a flexible display panel on a stage such that an amount of protrusion of an edge portion having a plurality of electrodes is within a range of 3 mm or more and 15 mm or less, the stage of the display panel. A placing step in which the flexural modulus of the protruding portion is 2.6 GPa or more and 4.0 GPa or less;
A holding step of holding a plurality of terminals provided corresponding to the plurality of electrodes, the electronic component having flexibility in a thermocompression bonding head;
The alignment mark provided on the edge portion of the display panel placed on the stage is imaged in a state where the alignment mark is irradiated with light from the side opposite to the imaging side, and the thermocompression head is attached to the image. A position recognition step of capturing an image of the alignment mark provided on the held electronic component, and recognizing the positional relationship between the display panel and the electronic component based on the captured images of both alignment marks,
A thermocompression bonding step of adjusting the relative position of the stage and the thermocompression bonding head based on the positional relationship recognized in the position recognition step, and thermocompression bonding the electronic component to the display panel by the thermocompression bonding head. Be equipped with
A method of manufacturing a display member, comprising manufacturing a display member in which the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via a connecting member. The method for manufacturing a display member according to claim 6, wherein a thickness of a portion of the display panel protruding from the stage is 50 μm or more and 500 μm or less. The display member according to claim 6 or 7, wherein the display member is continuously manufactured by repeatedly performing the placing step, the holding step, the position recognition step, and the thermocompression bonding step. Manufacturing method.

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