JP6663939B2 - Electronic component mounting apparatus and display member manufacturing method - Google Patents

Description

  An embodiment of the present invention relates to an electronic component mounting apparatus for mounting a flexible electronic component on an edge of a flexible display panel, and a method for manufacturing a display member.

  In the flat panel display market used as a display of a portable terminal such as a television, a personal computer, and a smartphone, a liquid crystal display has an overwhelming prevalence. Under such circumstances, in recent years, an organic EL display having a feature that it can be thinned without a backlight and can be bent by being formed on a flexible resin film has been used especially for a portable terminal. Is attracting attention mainly in the small display market. For this reason, there is a demand for an electronic component mounting apparatus that can be bent, that is, can be suitably used for assembling a flexible organic EL display.

  At present, as a general electronic component mounting apparatus, an outer lead bonding apparatus (hereinafter, referred to as an OLB apparatus) for a liquid crystal display is known (see Patent Document 1). However, an OLB device for an organic EL display is not known. For this reason, an OLB device for a liquid crystal display is used instead of an electronic component mounting process performed when manufacturing an organic EL display.

  An OLB device for a liquid crystal display mounts electronic components on a display panel made of a glass substrate via an anisotropic conductive tape. In a mounting process using an OLB device for a liquid crystal display, first, an edge of a display panel on which electronic components are mounted is protruded from a stage and held, and the electronic component is brought close to the edge of the display panel. Hold. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged from below the display panel by one camera, and the relative positions of the two are recognized. Thereafter, the edge of the display panel is held by a backup tool from below, the electronic components are aligned with the display panel based on the recognized relative positions, and the edge of the liquid crystal panel is positioned via an anisotropic conductive tape. The electronic parts are mounted on the part by heating and pressing.

JP 2006-135082A

  When the above-described OLB device for a liquid crystal display is directly applied to a manufacturing process of an organic EL display, electronic components cannot be mounted with high accuracy. That is, the present inventors use the above-described OLB device for a liquid crystal display as it is, and as a component of an organic EL display, a flexible display panel (hereinafter, referred to as an organic EL panel) as an electronic component. And tried to manufacture a display member. Specifically, a 38 mm wide COF (Chip on film) was mounted as an electronic component on an organic EL panel having a size of about 5.0 mm and a thickness of about 0.2 mm, which is widely used in smartphones. . As a result, it was found that simply applying the OLB device for a liquid crystal display as it is cannot accurately mount electronic components on an organic EL panel. Specifically, an organic EL panel for a smartphone requires a mounting accuracy of about ± 3 μm, but it has been found that such an mounting accuracy cannot be satisfied.

The present inventors have determined that the following two factors affect accuracy.
(1. Occurrence of dripping at the edge of the organic EL panel)
A display panel used for manufacturing a liquid crystal display (hereinafter, referred to as a liquid crystal display panel) has a relatively high rigidity because glass substrates having a thickness of 0.5 to 0.7 mm are bonded to each other. Therefore, even if the edge of the liquid crystal display panel is held off by several tens of mm from the stage, the edge hardly hangs down by its own weight.

  On the other hand, in an organic EL panel, usually, a polyimide (PI) film having a thickness of about 0.01 to 0.03 mm (10 to 30 μm), which is a member on which an organic EL element is formed, is provided with a thickness as a support material. Has a very low rigidity because it uses a thin resin substrate formed by adhering to a polyethylene terephthalate (PET) film of about 0.1 to 0.2 mm. Moreover, due to the characteristics of the resin film, warping or swelling may occur due to elongation due to moisture absorption or the above-described stress during bonding. Therefore, in the organic EL panel, when the edge is protruded by several tens of mm from the stage and held, the protruded edge easily hangs down by its own weight. When the edge of the organic EL panel hangs down, the position of the alignment mark formed on the edge is shifted in the horizontal direction. Therefore, when the position of the alignment mark of the organic EL panel is recognized using a camera, the recognized position is shifted.

  The inventors of the present application have confirmed by experiments that, when the edge of the organic EL panel is held 20 mm protruding from the stage, as in the case of a liquid crystal display panel of the same size, the edge is sagged, It was confirmed that the sagging caused a displacement of about 4 μm in the horizontal direction (toward the stage side) at the position of the alignment arc. Moreover, when the edge of the organic EL panel hangs down, the alignment mark is inclined with respect to the horizontal state. When an image of the inclined alignment mark is taken from directly below, the length of the taken alignment mark in the tilt direction is shorter than that in the case where the image is taken in a horizontal state. That is, the shape of the alignment mark to be imaged is deformed by the amount of the inclination. As a result, a difference in shape from the reference mark stored in advance occurs, which also causes an error in the recognition position of the alignment mark.

  The inventors of the present application performed an experiment to compare the error of the recognition position between the alignment mark held horizontally and the alignment mark inclined at 5 ° with respect to the horizontal. As a result, the alignment mark inclined at 5 ° was on average. It was confirmed that the error was large about 1 μm. The reason why the experiment was performed with the alignment mark inclined at 5 ° was that when the sag generated when the edge protruded from the stage by 20 mm was measured for a plurality of organic EL panels, sagging of 5 ° or more was confirmed in each case. is there.

(2. Fluctuation of light reflection at the edge of the organic EL panel)
When imaging the alignment mark of the organic EL panel, illumination is applied from below the camera. The illumination conditions (irradiation amount, illumination angle, etc.) of this illumination are determined by using an organic EL panel as a reference (for example, an organic EL panel having a flat edge, hereinafter referred to as a “reference panel”). The conditions are set so that the alignment marks on the panel can be imaged well. For this reason, the edge of the organic EL panel actually picked up has drooping and warpage, and the state is different, such as inclining with respect to the edge of the reference panel. The degree of reflection is different from that of the reference panel. As a result, there is a problem that the alignment mark cannot be clearly imaged or cannot be imaged at all. As a result of experiments conducted by the inventors of the present application, it has been confirmed that, when the alignment mark cannot be clearly imaged, a maximum shift of about 1 μm occurs in the recognition position.

  Based on these findings, the inventors of the present application processed the portion (supporting surface) supporting the edge of the organic EL panel flat in order to suppress sagging and warpage of the edge of the organic EL panel, and corresponded to the alignment mark. A through-hole for imaging that penetrates up and down is formed in the portion to be formed, and a supporting member capable of holding the edge by suction is attached to the stage, and the edge of the organic EL panel is held so as not to hang or warp. Attempting to mount electronic components again in this state. However, even with the measures described above, the mounting accuracy of ± 3 μm could not be sufficiently satisfied. In response to the results, the inventors of the present application have conducted further intensive studies and found that the following three factors are involved.

(3. Surface accuracy problem of organic EL panel)
A resin film such as a PI film or a PET film constituting an organic EL panel is generally manufactured by thinly molding and solidifying a resin dissolved by heating or a solvent such as a solution casting method or a melt extrusion molding method. The resin film manufactured in this way is in a state of being stretched thinly, that is, in a so-called finished state (a state in which the resin film is kept in a molded state and is not polished to adjust the finish). For this reason, the surface has fine irregularities (undulations) as compared with a glass substrate on which chemical or physical polishing is performed after being formed. In addition, the state of the unevenness is different between one surface and the other surface of the resin film. Therefore, when an image of the alignment mark is captured by the camera, the traveling direction of the light reflected by the alignment mark varies depending on the location.

  For example, consider a case in which, in an organic EL panel, a swell having a concavely curved shape occurs on an upper surface portion where an alignment mark is formed. The lower surface of the organic EL panel is substantially horizontal. When light is irradiated onto the alignment mark of such an organic EL panel from below through the through hole of the support member, light irradiated toward one end (left end) of the alignment mark is first emitted to the lower surface of the organic EL panel. Through. At this time, since the lower surface of the organic EL panel is a horizontal surface, the incident light is hardly refracted. Light that travels in the organic EL panel and reaches a boundary between the upper surface of the organic EL panel and the alignment mark is reflected at the boundary. At this time, at the left end of the alignment mark, the surface of the organic EL panel is inclined downward (from left to right) toward the alignment mark. Reflects toward. Then, the reflected light is refracted because it enters the lower surface of the organic EL panel obliquely, and travels further outward (to the left).

  On the other hand, the light emitted toward the other end (right end) of the alignment mark is reflected at an interface between the upper surface of the organic EL panel and the alignment mark at a reflection angle corresponding to the inclination of the upper surface of the organic EL panel. The light is reflected (to the right) and refracted when passing through the lower surface of the organic EL panel, so that the light travels further outward (to the right). As described above, when fine irregularities (undulations) are generated on the surface of the resin film on which the alignment mark is formed, the reflected light of the light irradiated toward the alignment mark M is reflected on the light path at the time of incidence. The light enters the camera along different paths, and the path of the reflected light differs depending on the position of the alignment mark M. These factors cause an alignment mark recognition error, and the position recognition accuracy of the alignment mark decreases.

(4. Light transmittance of organic EL panel)
As described above, the organic EL panel is configured by bonding a PI film to a PET film with an adhesive. Therefore, when imaging the alignment mark formed on the upper surface side of the organic EL panel from the lower surface side of the organic EL panel, the light transmittance of the organic EL panel affects the recognition accuracy of the alignment mark. Specifically, no matter how the illumination is adjusted, it becomes difficult to clearly capture the edge of the alignment mark.

  When the present inventors measured the light transmittance between the glass plate of the liquid crystal display panel and the resin substrate of the organic EL panel in the portion where the alignment mark was formed, the organic EL panel was better than the liquid crystal display panel. Also had a low light transmittance of about 7.4%. Using the liquid crystal display panel and the organic EL panel, the present inventors repeat the alignment mark recognition 10 times for each of the same liquid crystal display panel and the same organic EL panel, and determine the alignment mark recognition position. Repeat accuracy was confirmed. As a result, the variation of the position recognition accuracy of the liquid crystal display panel was ± 0.3 μm, whereas the variation of the position recognition accuracy of the organic EL panel was ± 1.2 μm.

(5. Problems due to the structure of the organic EL panel)
The organic EL panel is formed by bonding a plurality of resin films having different characteristics with an adhesive or the like. Therefore, the light emitted toward the organic EL panel enters the camera after passing through the boundary surface between different members a plurality of times.

  Here, a configuration is considered in which a PI film having an organic EL element or an alignment mark formed on its surface is bonded to a PET film via an adhesive. When light is irradiated from the lower side toward the alignment mark of such an organic EL panel, the irradiated light is emitted at the interface between the air and the PET film, the interface between the PET film and the adhesive layer, and the adhesive layer. And the PI film. The light reflected on the interface between the PI film and the alignment mark passes through each of the above-described interfaces and enters the camera.

  As described above, when the interface between the air and the PET film is inclined due to the influence of the surface accuracy of the organic EL panel, light is incident obliquely to the lower surface of the PET film. The light is refracted at each of the above-described boundaries, and enters the camera along a path different from the path from which the light reflected by the alignment mark has entered. Therefore, the alignment mark recognition position is shifted by the amount of refracted light. This also lowers the accuracy of position recognition of the alignment mark. FIG. 11 is an image of circular alignment marks of the organic EL panel (FIG. 11A) and the liquid crystal display panel (FIG. 11B). It can be confirmed that the distortion of the peripheral portion of the alignment mark of the organic EL panel is large.

  In some cases, a thin film having a high reflectance is formed on the back side of the PI film by vapor deposition or the like. In such a case, most of the light incident on the organic EL panel is reflected by the thin film. In that case, it becomes impossible to clearly image the alignment mark, and the position recognition accuracy is significantly reduced. In some cases, a PI film serving as a base material contains carbon particles for the purpose of preventing electrification of an organic EL panel or the like. In such a case, the transmission of light is blocked by the carbon particles, so that it is difficult to image the alignment mark, and the recognition cannot be performed correctly.

  SUMMARY OF THE INVENTION The present invention has been made to address the problem of a reduction in mounting accuracy of electronic components that occurs when the above-described conventional OLB device for a liquid crystal display is applied to a manufacturing process of an organic EL display. Even when a flexible electronic component is mounted on a display panel by thermocompression bonding, an electronic component mounting apparatus and a display member that enable the electronic component to be mounted on the display panel with high accuracy. It is intended to provide a manufacturing method.

  The electronic component mounting apparatus according to the embodiment has a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and a plurality of electronic components mounted on an edge of a flexible display panel. The electronic component is mounted on the display panel by connecting, via a joining member, a plurality of terminals of the flexible electronic component corresponding to the plurality of electrodes to the electrodes. An electronic component mounting apparatus, comprising: a stage on which the display panel is mounted; and a supporter for supporting, from below, the edge of the display panel on which the electronic component is mounted, A stage which can be moved in a horizontal direction together with a supporting portion; and a horizontally and vertically moving stage which holds the electronic component from above and thermocompresses the electronic component onto the upper surface of the edge portion supported by the supporting portion. A movable thermocompression head and an alignment mark provided on the edge of the display panel are imaged from above in a state where the edge of the display panel is supported by the support of the stage. A first imaging device, a second imaging device that images an alignment mark provided on the electronic component from below while the electronic component is held by the thermocompression bonding head, and a first imaging device. Based on the relative position information of the alignment mark of the display panel and the electronic component obtained from the image captured by the device and the second imaging device, to adjust the position of the display panel and the electronic component, The relative position between the stage and the thermocompression bonding head is adjusted, and the electronic component is thermocompression bonded to the display panel by the thermocompression bonding head in the adjusted positional relationship. Thus, a mounting operation control device that controls the stage and the thermocompression bonding head, a calibration member used for recognizing a relative positional relationship between the first imaging device and the second imaging device, The first imaging device, the second imaging device, and the calibration member are relatively moved in the horizontal direction so that a member is sequentially positioned at a position facing the first imaging device and the second imaging device. A horizontal movement device, a storage unit for storing a reference value of a relative positional relationship between the first imaging device and the second imaging device, and a storage unit for storing the first imaging device and the second imaging device. An image of the calibration member is captured, and a relative positional relationship between the first imaging device and the second imaging device is recognized based on the captured image. Memorized criteria , The relative positional relationship between the first imaging device and the second imaging device is determined, and the alignment position between the display panel and the electronic component is determined based on the determined deviation. And a calibration operation control device for correcting

  The method for manufacturing a display member according to the embodiment has a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and a flexible display panel held on a stage, A supporting step of supporting an edge portion of the display panel having a plurality of electrodes from below by a supporting portion provided on the stage, and a plurality of terminals provided corresponding to the plurality of electrodes; A holding step of holding a flexible electronic component on a thermocompression bonding head, and a first imaging device provided from above the display panel supported by the support section at the edge of the display panel. A first imaging step of imaging the aligned alignment mark, and an alignment device provided on the electronic component by a second imaging device from below the electronic component held by the thermocompression bonding head. A second image capturing step of capturing an image of the alignment mark, an image of the alignment mark of the display panel captured in the first image capturing step, and an image of the alignment mark of the electronic component captured in the second image capturing step A position recognizing step of recognizing a relative positional relationship between the display panel and the electronic component, and a relative position of the stage and the thermocompression bonding head based on the relative positional relationship recognized in the position recognizing step. A thermocompression bonding step of adjusting the position and thermocompression bonding the electronic component to the display panel by the thermocompression bonding head in the adjusted positional relationship, wherein the supporting step, the holding step, and the first imaging step are performed. Repeating the second imaging step, the position recognition step, and the thermocompression bonding step so that the plurality of electrodes of the display panel have the electronic components. A method of manufacturing a display member in which a plurality of terminals are continuously manufactured with a display member connected via a joining member, wherein a relative position between the first imaging device and the second imaging device is determined. An image of a calibration member used for recognition of a positional relationship is captured by the first imaging device and the second imaging device, and a relative positional relationship between the first imaging device and the second imaging device And the relative positional relationship between the first imaging device and the second imaging device is determined and determined by comparing the recognized result with a preset reference value. A correcting step of correcting an alignment position between the display panel and the electronic component based on the displacement.

  According to the mounting apparatus of the present invention, even when a flexible electronic component is mounted on a flexible display panel such as an organic EL panel by thermocompression bonding, the electronic component is accurately mounted. can do. Furthermore, according to the method for manufacturing a display member of the present invention, it is possible to provide a display member in which electronic components are mounted on a display panel with high accuracy.

FIG. 2 is a plan view illustrating the electronic component mounting apparatus according to the embodiment. FIG. 2 is a side view of the electronic component mounting apparatus shown in FIG. 1. FIG. 2 is a perspective view illustrating a temporary pressure bonding device of the electronic component mounting device illustrated in FIG. 1. FIG. 2 is a plan view showing an organic EL panel and electronic components applied to the mounting apparatus of the embodiment. FIG. 2 is a perspective view showing a final crimping device of the electronic component mounting device shown in FIG. 1. FIG. 2 is a perspective view showing an example of an organic EL panel holder in the electronic component mounting apparatus shown in FIG. 1. FIG. 2 is a perspective view showing another example of a holder for an organic EL panel in the electronic component mounting apparatus shown in FIG. 1. It is a top view which shows the mounting device of the electronic component in other embodiment. 5 is a graph illustrating a change in mounting accuracy according to the first embodiment. 9 is a graph showing a variation in mounting accuracy according to Comparative Example 1. FIG. 10 is a diagram illustrating an example of an image obtained by capturing a circular alignment mark of an organic EL panel and a liquid crystal display panel using a conventional OLB device.

  Hereinafter, an electronic component mounting apparatus and a method of manufacturing a display member according to an embodiment will be described with reference to the drawings. The drawings are schematic, and the relationship between the thickness and the plane dimension, the ratio of the thickness of each part, and the like may be different from the actual one. In the description, the terms indicating the up and down directions indicate the relative directions when the electronic component mounting surface of a display panel (organic EL panel) described later is faced up, unless otherwise specified.

[Configuration of mounting device]
FIG. 1 is a plan view showing the configuration of the electronic component mounting apparatus of the embodiment, and FIG. 2 is a side view of the electronic component mounting apparatus of FIG. The electronic component mounting apparatus 1 shown in FIGS. 1 and 2 is used for manufacturing a component (display member) of a display device such as an organic EL display. That is, the mounting apparatus 1 transfers the flexible electronic component W such as COF punched from the carrier tape T to the organic EL panel P as a flexible display panel and anisotropically as a joining member. This is a device that is mounted via a conductive tape F and used to manufacture a display member in which an electronic component W is mounted on an organic EL panel P.

  Here, the organic EL panel P is mainly formed of a flexible member. As the flexible member, for example, PI (polyimide), PET (polyethylene terephthalate), PC (polycarbonate), or the like is used. These members can also be used by bonding with an adhesive. The organic EL panel P is configured to have a thickness of 20 μm or more and 500 μm or less and a flexural modulus of 2.5 GPa or more and 4.0 GPa or less. The organic EL panel P according to the present embodiment has a configuration in which a PI film on which an organic EL element is formed is bonded to a PET film as a support via an adhesive. Since the thickness (about 200 μm) of the PET film is 10 times or more the thickness (about 10 μm) of the PI film, it is considered that the bending elastic modulus of the organic EL panel P is almost equal to the bending elastic modulus of the PET film.

  Here, the flexural modulus is a value measured according to a test method specified in JIS K7171: Plastics-Determination of flexural properties (revised on March 22, 2016). Specifically, in the flexural modulus test, a test piece having a length of 80 ± 2 mm, a width of 10.0 ± 0.2 mm, and a thickness of 4.0 ± 0.2 mm was adjusted to have a fulcrum distance of 64 mm. The center of the test piece is bent by lowering the indenter at a test speed of 2 mm / min to the center between the fulcrums. The test atmosphere is a standard atmosphere (temperature: 23 ° C./humidity: 50%) specified by JIS K7100.

As the electronic component W, a flexible electronic component such as COF is used. The COF is formed by mounting a semiconductor element on a flexible film-like circuit board formed of PI (polyimide) or the like. As will be described later, the COF is formed into individual pieces by punching from a tape-shaped film member.
The display member is obtained by mounting an electronic component W such as COF on a display panel such as an organic EL panel P via a bonding member such as an anisotropic conductive tape F. Etc. are members used as components of display devices.

  The mounting apparatus 1 according to the embodiment includes a punching device 10 (10A, 10B) for punching an electronic component W from a carrier tape T, an intermittent rotation transport device 20, which sucks and holds the punched electronic component W, and transports the electronic component W while rotating intermittently. Attach anisotropic conductive tape F as a joining member to electronic component W conveyed by intermittent rotary transfer device 20 at an intermittent stop position in the middle of the transfer path by rotary transfer device 20 Device (joining member adhering device) 30, temporary crimping device 40 for temporarily crimping electronic component W to which anisotropic conductive tape F is stuck to organic EL panel P via anisotropic conductive tape F, temporary crimping device 40, a first press-fitting device 50 for main-pressing the electronic component W temporarily press-bonded to the organic EL panel P, and a first transfer of the electronic component W between the punching device 10 and the intermittent rotary transfer device 20. The delivery device 60, the second delivery device 70 for delivering the electronic component W between the intermittent rotary transfer device 20 and the temporary crimping device 40, and the first delivery of the organic EL panel P to the temporary crimping device 40. A transport section 80, a second transport section 90 for transporting the organic EL panel P from the temporary pressure bonding apparatus 40 to the final pressure bonding apparatus 50, and a third transport section 100 for transporting the organic EL panel P from the final pressure bonding apparatus 50, are further provided. Punching device 10, intermittent rotary conveyance device 20, anisotropic conductive tape sticking device 30, temporary crimping device 40, final crimping device 50, first delivery device 60, second delivery device 70, first delivery unit 80 , A second transport unit 90, a third transport unit 100, and the like.

(Punching device 10)
The punching device 10 is for punching COF as the electronic component W from the carrier tape T, and includes a first punching device 10A and a second punching device 10B. The first punching device 10A and the second punching device 10B have the same configuration, and are arranged in a state where they are reversed left and right when viewed from the front of the device. The first and second punching devices 10A and 10B are used one by one, and the carrier tape T of the other punching devices 10A and 10B can be replaced while the punching is performed by one of the punching devices 10A and 10B. It has become.

  The first and second punching apparatuses 10A and 10B respectively include a supply reel 11 on which a carrier tape T before punching is wound, and a die apparatus 12 for punching an electronic component W from the carrier tape T supplied from the supply reel 11. And a take-up reel 13 for winding the carrier tape T from which the electronic component W has been punched out by the mold apparatus 12. The direction of the carrier tape T fed from the supply reel 11 is changed by a plurality of guide rollers 14 and sprockets 15, and is sent to the take-up reel 13 via the mold device 12. The sprocket 15 is disposed in front of the mold device 12 in the transport direction of the carrier tape T, and transports the carrier tape T to the mold device 12 while transporting the carrier tape T by rotational driving by a drive motor (not shown). Positioning is possible.

  The mold device 12 includes an upper mold 12a and a lower mold 12b disposed to face the upper mold 12a. The upper mold 12a has a punch 12c on its lower surface. On the other hand, the lower die 12b is formed with a vertically extending die hole 12d into which the punch 12c enters. The electronic component W is punched out of the carrier tape T by moving the upper mold 12a in the vertical direction in a state where the carrier tape T is supplied and positioned to such a mold apparatus 12. In addition, a suction hole (not shown) is provided on the tip end surface of the punch 12c, and is configured to be able to suck and hold the punched electronic component W.

(Intermittent rotation transfer device 20)
The intermittent rotary transfer device 20 includes four arm portions 21 having the same shape arranged in orthogonal relation to each other, and an index table 22 having a cross shape in a plan view, and intermittently driving the index table 22 at 90 ° intervals. A rotation drive unit 23. At the end of each arm 21 of the index table 22, a holding head 24 that sucks and holds the electronic component W is provided. The four stop positions A to D at every 90 ° of the index table 22 include a receiving position A for receiving the electronic component W punched by the punching device 10 and a positioning with respect to the electronic component W held by the holding head 24. (Gauging) and gauging / cleaning position B for cleaning, bonding position C for bonding anisotropic conductive tape F to electronic component W held by holding head 24, anisotropic conductive tape A transfer position D for transferring the electronic component W to which the F is attached to the temporary crimping device 40 is set.

(Anisotropic conductive tape sticking device 30)
The anisotropic conductive tape sticking device 30 is provided corresponding to the sticking position C of the intermittent rotary transfer device 20, and the tape-shaped member S that sticks and supports the anisotropic conductive tape F to the release tape R is provided. The supply reel 31 wound, the bonding head 32 disposed at a position facing the holding head 24 positioned at the bonding position C, and the release tape R after the anisotropic conductive tape F has been peeled off. A collecting unit 33 for accommodating, a plurality of guide units 34 for guiding the tape-shaped member S supplied from the supply reel 31 to the collecting unit 33 along a transport path passing through the attaching position C, and a plurality of guide units 34, the tape-like member S is disposed downstream of the sticking position C of the transport path of the tape-like member S, and reciprocates along the transport direction of the tape-like member S, thereby intermittently transporting the tape-like member S by a predetermined length. The chuck feeder 35 and the tape-shaped member S Than adhering position C of the transfer path is disposed upstream, and a cutting unit 36 which cuts only the anisotropic conductive tape F of tape-like member S.

  The bonding head 32 is cut into a predetermined length at the terminal portion of the electronic component W held by the holding head 24 positioned at the bonding position C, and is transported and positioned at the bonding position C to the anisotropic conductive member. A sticking tool 32a for pressing the tape F, an elevating drive unit 32b that moves the sticking tool 32a up and down, and a built-in sticking tool 32a that heats the sticking tool 32a to heat the anisotropic conductive tape F And a heater 32c for adhering to the terminal part of the electronic component W.

(Temporary crimping device 40)
The temporary pressure bonding device 40 serves as a thermocompression head for temporarily holding the electronic component W to which the anisotropic conductive tape F is stuck by the anisotropic conductive tape sticking device 30 and temporarily pressing the electronic component W to the organic EL panel P. A temporary pressure bonding head 41, a stage 42 for holding and positioning the organic EL panel P, and a relative position between the organic EL panel P held by the stage 42 and the electronic component W held by the temporary pressure bonding head 41 are recognized. And a position recognition unit 43.

  The temporary pressure bonding head 41 is built in the pressure tool 41a that sucks and holds the electronic component W from the upper surface side, a tool driving unit 41b that moves the pressure tool 41a in the Y, Z, and θ directions, and is built in the pressure tool 41a. And a heater 41c for heating the pressing tool 41a. As shown in FIG. 3, the stage 42 is provided integrally with the mounting portion 42a on which the organic EL panel P is mounted and the mounting portion 42a, and the edge of the organic EL panel P on which the electronic component W is mounted. A supporting section 42b for supporting the section from below, and a stage driving section 42c for integrally moving the mounting section 42a and the supporting section 42b in the X, Y, Z, and θ directions.

  A plurality of suction holes 42e for sucking and holding the organic EL panel P are formed on a mounting surface 42d of the mounting portion 42a on which the organic EL panel P is mounted. When the organic EL panel P is mounted on the mounting surface 42d, the suction holes 42e are mainly arranged at positions facing the image display area of the organic EL panel P. In this example, a description will be given of an example in which the organic EL panels P on the mounting surface 42d are arranged in a matrix at equal intervals in an area (an area surrounded by a two-dot chain line in FIG. 3). Since it is sufficient that the organic EL panel P supported by the support portion 42b described later can be sucked and held so that at least the edge is flat, the organic EL panel P mounted on the mounting surface 42d is sucked and held over the entire area. It is not a must. For example, an area of about half or about ３ of the length of the organic EL panel P may be sucked and held from the support portion 42b side in a direction orthogonal to the edge. Since the suction hole 42e sucks the display area of the organic EL panel P, it is preferable to set the hole diameter small so that no suction mark remains in the display area due to the suction. The hole diameter is determined by determining the relationship between the suction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P due to the suction through experiments and the like, and setting the size so that no suction mark remains. good. The mounting surface 42d may be formed of a porous member, for example, a vacuum chuck using porous ceramics.

  As described above, the support portion 42b is a long member that is provided integrally with the placement portion 42a and supports the edge of the organic EL panel P, and has an upper surface formed as a flat support surface 42f. ing. The height position of the support surface 42f is set to the same height as the height of the mounting surface 42d of the mounting portion 42a. A plurality of suction holes 42g for suction-holding the edge of the organic EL panel P are arranged in a plurality of rows along the longitudinal direction of the support surface 42f. It is preferable that the suction hole 42g of the support portion 42b be smaller, like the suction hole 42e of the mounting portion 42a. However, the edge of the organic EL panel P supported by the support portion 42b is a portion where electrodes for connection to the electronic component W are arranged, and is not a display area. Therefore, it is not necessary to make the hole diameter as small as the suction hole 42e of the mounting portion 42a, but deformation due to suction occurs at the edge of the organic EL panel P where the alignment mark PM (see FIG. 4) is formed. Is not preferable because it causes a decrease in position recognition accuracy. The hole diameter and the suction force of the suction hole 42g are preferably set to such a size that the edge of the organic EL panel P is not deformed. Further, the arrangement interval of the suction holes 42g is shorter than the period of the unevenness due to warpage or undulation generated at the edge of the organic EL panel P so that the edge of the organic EL panel P is in close contact with the support surface 42f over the entire area. Preferably, it is an interval.

  Further, a calibration member 42j is provided on a side portion (the left side portion in the X-axis direction in FIG. 3) of the mounting portion 42a and the support portion 42b. The calibration member 42j includes a rectangular block-shaped base member 42j1 and a U-shaped concave portion provided in the base member 42j1 and vertically extending through an extension of the support portion 42b in the X-axis direction. 42j2, a square transparent plate 42j3 such as glass or resin fitted into the recess 42j2, and a target mark 42j4 provided at the center of the transparent plate 42j3. By imaging the target mark 42j4 with a first imaging unit 43a and a pair of imaging units 43e1 and 43e2, which will be described later, it is possible to obtain a correction value for a relative positional shift between the imaging units 43a, 43e1, and 43e2. Have been.

  The stage driving unit 42c moves the mounting unit 42a and the supporting unit 42b in the X-axis direction, which is one horizontal direction, and moves in the Y-axis direction, which is a horizontal direction orthogonal to the X-axis direction. A drive unit configured by stacking a Y-axis direction drive unit to be moved, a Z-axis direction drive unit to move in the Z-axis direction orthogonal to the horizontal direction, and a θ drive unit to rotate in a horizontal plane in this order from the bottom. is there. The stage drive section 42c is provided with a linear encoder in association with the X-axis direction drive section and the Y-axis direction drive section in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction.

  Next, the position recognition unit 43 will be described with reference to FIGS. FIG. 4 is a plan view illustrating a schematic configuration of the organic EL panel P and the electronic component W whose position is recognized by the position recognition unit 43. In the drawing, the X-axis direction is described as a left-right direction. The organic EL panel P has an electrode row ER formed on the edge thereof, and a pair of alignment marks PM provided on both left and right sides of the electrode row ER. The electronic component W has a terminal row TR arranged so as to correspond to the electrode row ER, and a pair of alignment marks WM provided on both right and left sides of the terminal row TR. The position recognition unit 43 recognizes a relative positional relationship between the pair of alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic component W.

  Such a position recognition unit 43 includes a first imaging device 43A and a second imaging device 43B. The first imaging device 43A captures the alignment mark PM provided on the edge of the organic EL panel P from above while the edge of the organic EL panel P is supported by the support portion 42b of the stage 42. belongs to. The second imaging device 43B is for imaging the alignment mark WM provided on the electronic component W from below while the electronic component W is held by the temporary pressure bonding head 41.

  The first imaging device 43A includes a first imaging unit 43a that captures the alignment mark PM of the organic EL panel P as a still image, and an image processing unit 43b that processes an image captured by the first imaging unit 43a. . The first imaging unit 43a includes a camera 43c such as a CCD (Charge Coupled Device) camera including an imaging element, and a lens barrel 43d including an optical unit such as a telecentric lens. The first imaging unit 43a is located above the stage 42 and in the vicinity of the pressure tool 41a positioned at a mark recognition position for recognizing the alignment marks WM and PM of the electronic component W and the organic EL panel P ( 3 (in the vicinity of the right side in FIG. 3). Note that the first imaging unit 43a may be fixed to a frame (not shown) that supports the pressing tool 41a so as to be movable in the Y, Z, and θ directions, or a support member that is directly fixed to a mount of the apparatus. You may make it fix to.

  The second imaging device 43B includes a second imaging unit 43e that captures the alignment mark WM of the electronic component W as a still image, and an image processing unit 43f that processes an image captured by the second imaging unit 43e. Have. The image processing unit 43f may be provided separately from the image processing unit 43b. However, one image processing unit may serve as both the image processing unit 43b and the image processing unit 43f. 110 may perform the functions of the two image processing units 43b and 43f.

  The second imaging unit 43e includes a pair of imaging units 43e1 and 43e2 arranged corresponding to the arrangement interval of the pair of alignment marks WM of the electronic component W. Each of the imaging units 43e1 and 43e2 has a camera 43g and a lens barrel 43h having an optical unit. Each of the imaging units 43e1 and 43e2 can be individually adjusted by the X-direction moving device 43i in accordance with the arrangement interval of the alignment mark WM of the electronic component W.

  The camera 43g is supported by the X-direction moving device 43i so that the optical axis is parallel to the horizontal X-axis direction. The lens barrel 43h connected to the camera 43g has a prism 43j as an optical axis conversion unit for converting the optical axis so that the optical axis is directed directly upward at the distal end side, and an image capturing port corresponding to the prism 43j. The opening 43h1 is provided. The X-direction moving device 43i synchronously moves the two imaging units 43e1 and 43e2 in opposite directions in the X-axis direction so that the arrangement interval of the openings 43h1 matches the arrangement interval of the alignment marks WM of the electronic component W. Although not shown, a coaxial illumination device is incorporated in the lens barrel 43h.

  The image processing unit 43b in the first imaging device 43A receives the imaging signal of the camera 43c, recognizes the alignment mark PM of the organic EL panel P obtained by being captured in the imaging area, and obtains data on the position of the alignment mark PM. (Hereinafter, referred to as “position data”). The image processing unit 43b performs an alignment mark of the organic EL panel P by using a known pattern matching process to obtain an image in which a matching rate equal to or more than a threshold value with a preset reference pattern of the alignment mark PM of the organic EL panel P in the captured image is obtained. Recognize as PM. Then, position data of the recognized alignment mark PM is obtained based on the camera coordinate system. The obtained position data is transmitted to the control device 110.

  The image processing unit 43f of the second imaging device 43B receives the imaging signal of the camera 43g, recognizes the alignment mark WM of the electronic component W obtained by being captured in the imaging area, and obtains data regarding the position of the alignment mark WM ( Hereinafter, "position data" is detected. The image processing unit 43f uses, as a alignment mark WM of the electronic component W, an image in which a predetermined reference pattern of the alignment mark WM of the electronic component W and a matching ratio equal to or higher than a threshold are obtained in the captured image by a known pattern matching process. recognize. Then, the position data of the recognized alignment mark WM is obtained based on the camera coordinate system. The obtained position data is transmitted to the control device 110.

(Firm bonding device 50)
As shown in FIG. 5, the pressing device 50 includes a stage 51 for holding and positioning the organic EL panel P to which the electronic component W has been temporarily pressed via the anisotropic conductive tape F, and the organic EL panel P A main press-bonding head 52 for main-pressing the electronic component W, and an electronic component W in the organic EL panel P disposed below the main press-bonding head 52 so as to face the main press-bonding head 52. And a position recognition unit 54 (54a, 54b) for recognizing the position of the organic EL panel P.

  The stage 51 has a placement section 51a on which the organic EL panel P is placed, and a stage drive section 51b for moving the placement section 51a in the X, Y, Z, and θ directions. The mounting portion 51a is a member having a rectangular shape in plan view, and a mounting surface (upper surface) 51c on which the organic EL panel P is mounted has a plurality of suction holes 51d for sucking and holding the organic EL panel P. Is formed. It is preferable that the diameter of the suction hole 51d is set small like the suction hole 42e of the stage 42 of the temporary pressure bonding apparatus 40 so that no suction mark of the organic EL panel P remains. The stage driving unit 51b, like the stage driving unit 42c of the temporary crimping device 40, stacks an X-axis driving unit, a Y-axis driving unit, a Z-axis driving unit, and a θ driving unit in this order from the bottom. The driving unit is configured as follows.

  The main pressing head 52 includes a pressing tool 52a for pressing the electronic component W temporarily pressed on the organic EL panel P from the upper surface side, a tool driving unit 52b for moving the pressing tool 52a in the Z-axis direction, A heater 52c that is built into the tool 52a and heats the pressing tool 52a. The backup unit 53 includes a backup tool 53a provided at a position directly below the pressure tool 52a of the main pressure bonding head 52 and having the same length as the pressure tool 52a, and a support member 53b for supporting the backup tool 53a. And The upper surface of the backup tool 53a is formed as a flat surface that supports the lower surface of the edge where the electronic component W of the organic EL panel P mounted on the mounting portion 51a is temporarily pressed.

  The position recognition unit 54 has a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are attached downward at a predetermined interval above the moving range of the organic EL panel P by the stage 51, and the electronic component W of the organic EL panel P is temporarily An image of an alignment mark provided near both ends of the crimped edge is taken. The interval (predetermined interval) between the first and second cameras 54a and 54b is the interval between the alignment marks. The alignment mark is an alignment mark different from the alignment mark PM used for recognizing the relative position data in the temporary crimping device 40. The image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the captured image of the alignment mark of the organic EL panel P captured by the first and second cameras 54a and 54b, and Detect the position of.

(First delivery device 60)
The first transfer device 60 receives the electronic component W punched out of the carrier tape T by suction from below and holds the receiving portion 61 at a position directly below the die device 12 of the punching devices 10A and 10B. An X, Y, Z, θ drive unit 62 for moving the intermittent rotary transfer device 20 positioned at the position A to a position directly below the holding head 24 is provided.

(Second delivery device 70)
The second delivery device 70 is provided with a receiving portion 71 for sucking and holding the electronic component W from below, and a temporary press-fit between a position directly below the holding head 24 of the intermittent rotary transfer device 20 positioned at the delivery position D. An X, Y, Z, θ drive unit 72 for moving the device 40 to a position directly below the temporary pressure bonding head 41 is provided.

(First transport unit 80)
The first transport unit 80 includes a holding body 81 that sucks and holds the organic EL panel P supplied from a supply unit (not shown) from above, and a supply position of the organic EL panel P by the supply unit (not shown). And an XZ drive unit 82 for moving the organic EL panel P to a position at which the organic EL panel P is carried in with respect to the stage 42 of the temporary crimping device 40.

  As shown in FIG. 6, the holding body 81 sucks and holds the edge of the organic EL panel P where the electrode array ER on which the electronic component W is mounted is formed, and the electrode surface sucking block 81a. And a display area suction portion 81b that sucks and holds a portion of the organic EL panel P other than the portion sucked by the electrode surface suction block 81a. The electrode surface suction block 81a is a member having a rectangular parallelepiped shape formed to have a length capable of sucking and holding the entire edge of the organic EL panel P on which the electrode array ER is formed, and extending in a direction along the edge. The suction surface 81c of the electrode surface suction block 81a is formed flat and has a plurality of suction holes 81d. The diameter of the suction hole 81d is set to such a size that the edge of the organic EL panel P is not deformed similarly to the support portion 42b of the temporary pressure bonding apparatus 40. The edge on which the row ER is formed can be flattened and held by suction. The display area suction part 81b is formed of a porous body or sponge having a flat suction surface, and has many suction holes. The suction surfaces of the electrode surface suction block 81a and the display area suction portion 81b are adjusted so as to be located on the same plane.

  FIG. 6 shows one display area suction unit 81b, but a plurality of display area suction units 81b may be arranged side by side. As shown in FIG. 7, the display area suction portion 81b intersects with the longitudinal direction of the electrode surface suction block 81a (the edge direction of the organic EL panel P held by the electrode surface suction block 81a) (this embodiment). In this case, two are arranged side by side in a direction orthogonal to each other. The two display area suction portions 81b are supported by the main body portion 81e of the holder 81 such that the distance between the two display area suction portions 81b and the electrode surface suction block 81a can be adjusted. These display area adsorbing portions 81b are flat porous sheets 81b2 that cover a base portion 81b1 made of metal such as aluminum and a surface of the base portion 81b1 that holds the organic EL panel P (hereinafter, referred to as a “lower surface”). And A substantially lattice-shaped suction groove communicating with the vacuum suction hole is formed on the lower surface of the base portion 81b1, and a vacuum suction force is applied to the entire area of the porous sheet 81b2 provided on the lower surface to form a porous sheet. The organic EL panel P can be held flat with a substantially uniform suction force over the entire area 81b2. As the porous sheet 81b2, for example, a sheet obtained by processing a resin porous molded body into a film shape can be used. With this configuration, even if the holding body 81 is a thin film-shaped organic EL panel P having flexibility, the holding body 81 can be sucked and held flat without causing suction marks.

  When the organic EL panel P is placed on the stage 42 of the temporary crimping device 40, the upper surface (electrode surface) of the edge on which the electrodes of the organic EL panel P are formed is supported by the electrode surface suction block 81a. It will be pressed against the part 42b. Therefore, the electrode surface of the organic EL panel P is sandwiched between the flat suction surface 81c of the electrode surface suction block 81a and the flat support surface 42f of the support portion 42b, and the support portion 42b is flattened. Is held by suction. Further, the organic EL panel P is brought into contact with the mounting surface 42d of the mounting portion 42a in a state where the display area suction portion 81b sucks and holds the organic EL panel P flatly. It is sucked and held by the mounting portion 42a without wrinkles or the like.

(Second transport unit 90)
The second transport unit 90 includes a holding body 91 that adsorbs and holds the organic EL panel P to which the electronic component W has been temporarily pressed by the temporary bonding apparatus 40 from above, and the holding body 91 is organically moved from the stage 42 of the temporary bonding apparatus 40. An XZ drive unit 92 for moving the EL panel P to a carry-out position for carrying out the EL panel P and a carry-in position for the organic EL panel P with respect to the stage 51 of the main crimping device 50 is provided. The holding body 91 has a display area suction portion formed by a porous body or the like having a flat suction surface, which sucks and holds substantially the entire area of the upper surface of the organic EL panel P. This display area suction unit is configured similarly to the display area suction unit 81b of the holding body 81.

(Third transport unit 100)
The third transport unit 100 includes a holding member 101 that suction-holds the organic EL panel P to which the electronic component W has been completely pressed by the main pressing device 50, that is, a display member from above, and attaches the holding member 101 to the main pressing device. An XZ drive unit 102 is provided for moving the organic EL panel P from the stage 51 to an unloading position for unloading the organic EL panel P and a delivery position to a unloading device (not shown).

(Control device 110)
The control device 110 controls the mounting operation of the electronic component W on the organic EL panel P (mounting operation control device) and the relative positional relationship between a first imaging device 43A and a second imaging device 43B described later. It also serves as a control unit (calibration operation control device) for controlling the calibration operation to be corrected. The control device 110 includes a storage unit 111. The storage unit 111 stores various information for controlling each unit such as a load in the temporary crimping device 40, a heating temperature, reference position information of the alignment marks PM and WM, and the like. The storage unit 111 stores in advance the time interval as the timing at which the image of the target mark 42j4 as the calibration member is captured by the first imaging device 43A and the second imaging device 43B, or the number of mountings (the number of mountings) of the electronic component W. It is remembered. Here, as the time interval for capturing an image, an elapsed time since the mounting of the first electronic component W is set, for example, every 10 minutes or every 30 minutes. The number of mountings is set such that the number of mountings (or the number of mountings) after the first electronic component W is mounted is, for example, every 100 or 300 times.

  The image capture of the target mark 42j4 by the first and second imaging devices 43A and 43B may be repeatedly performed at the same time interval or the same number of times of mounting, or the interval or the number of times may be increased each time elapses. Alternatively, it may be made smaller. For example, when the relative positional relationship between the imaging units 43a, 43e1, and 43e2 changes due to the expansion of the heater 41c built in the pressurizing tool 41a due to heat, the temperature of the heater 41c is maintained at a constant temperature. Is considered to be saturated, the time interval or the number of mountings may be gradually increased in accordance with the degree of increase in the amount of thermal expansion. On the other hand, when the change in the relative positional relationship between the imaging units 43a, 43e1, and 43e2 does not saturate and continues to fluctuate slowly, the time interval or the number of mountings may be fixedly set to a predetermined value. .

  The control device 110 executes the capture of the image of the target mark 42j4 by the first and second imaging devices 43A and 43B based on the time interval or the number of mountings stored in the storage unit 111. For example, when a time interval of 30 minutes is set in the storage unit 111, measurement is started from the time when the first electronic component W is mounted, and every 30 minutes, the image of the target mark 42j4 is displayed. The capturing is executed to recognize the relative positional relationship between the three imaging units 43a, 43e1, 43e2 of the first and second imaging devices 43A, 43B.

[Operation of mounting device]
Next, the operation of the mounting apparatus 1 according to the embodiment will be described. First, the carrier tape T is supplied from the supply reel 11 of the first punching device 10A, and the electronic component W is punched from the carrier tape T by the mold device 12. The punched electronic component W is sucked and held by the punch 12c. The electronic component W held by the punch 12c is transferred to the receiving portion 61 of the first transfer device 60, and is transferred to the receiving position A of the intermittent rotary transfer device 20 by the first transfer device 60. The electronic component W transferred to the receiving position A is transferred to the holding head 24 of the intermittent rotary transfer device 20 positioned at the receiving position A. The first delivery device 60 rotates the direction of the electronic component W by 90 ° during the transfer of the electronic component W to the receiving position A, so that the edge on which the terminal row TR is formed is moved to the receiving position A. The position is adjusted in the direction (Y direction) along the outer side surface of the positioned holding head 24.

  The electronic component W held by the holding head 24 is sequentially transferred to a gauging / cleaning position B, a sticking position C, and a delivery position D by intermittent rotation of the index table 22. During this transfer, at the gauging / cleaning position B, the electronic component W is positioned with respect to the holding head 24 by abutment of a positioning mechanism (not shown), and adheres to the terminal portion by a cleaning mechanism such as a rotating brush (not shown). Cleaning of dust is performed. Further, at the sticking position C, the anisotropic conductive tape F is stuck to the terminal part of the electronic component W by the anisotropic conductive tape sticking device 30. When the positioning and cleaning are performed at the gauging / cleaning position B, and the electronic component W to which the anisotropic conductive tape F is attached is positioned at the application position C at the delivery position D, the electronic component W is transferred to the delivery position D. At the receiving portion 71 of the second delivery device 70. The electronic component W transferred to the receiving portion 71 is transferred to a position directly below the temporary pressure bonding head 41 of the temporary pressure bonding device 40 and transferred to the temporary pressure bonding head 41.

  On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out from the supply unit (not shown) by the holding body 81 of the first transport unit 80, and is supplied and placed on the stage 42 of the temporary pressure bonding apparatus 40. First, the holding body 81 of the first transport unit 80 moves to a supply unit (not shown), and the holding surface of the holding body 81, that is, the suction of the electrode surface suction block 81a, is placed on the upper surface of the organic EL panel P prepared in the supply unit. The surface 81c is brought into contact with the suction surface of the display area suction portion 81b. At this time, the suction force of the electrode surface suction block 81a and the display area suction portion 81b is applied while the organic EL panel P is lightly pressed by the holding body 81. By doing so, even when the organic EL panel P is warped or bent, the organic EL panel P can be held by the holder 81 in a flat state.

  The organic EL panel P held by the holder 81 is transferred onto the stage 42 of the temporary crimping device 40. At this time, the stage 42 of the temporary pressure bonding apparatus 40 is positioned at a supply position (a position indicated by a two-dot chain line in FIG. 1) where the organic EL panel P is supplied from the holder 81. The organic EL panel P conveyed on the stage 42 is mounted on the stage 42. At this time, the organic EL panel P is pressed onto the stage 42 and flattened by the lowering of the holder 81.

  More specifically, in the organic EL panel P, the electrode surface is suction-held on the suction surface 81c of the electrode surface suction block 81a of the holder 81, and the display area is suction-held by the display area suction portion 81b. By these, it is held in a flat state. In this state, since the organic EL panel P is pressed onto the stage 42, the organic EL panel P is supported by the suction surface 81c of the electrode surface suction block 81a of the holder 81 and the suction surface of the display area suction portion 81b, and by the support of the stage 42. It is sandwiched between the support surface 42f of the portion 42b and the mounting surface 42d of the mounting portion 42a. Therefore, the organic EL panel P is transferred onto the stage 42 while maintaining the flattened state, and is suction-held by the stage 42.

  At this time, in a state where the organic EL panel P is pressed on the stage 42, after applying a suction force to the suction hole 42 g of the support portion 42 b of the stage 42 and the suction hole 42 e of the mounting portion 42 a, the holding member 81 Although the suction force of the electrode surface suction block 81a and the display area suction portion 81b may be released, the suction force of the holder 81 may be released before the suction force is applied to the stage 42. By doing so, the restraint in the surface direction of the organic EL panel P sandwiched between the stage 42 and the holding member 81 is reduced, so that the holding member 81 may be temporarily warped or bent. It is expected that even if it is held, the warpage and bending will be corrected by pinching and flattened. For this reason, it is preferable that the force for pressing the holder 81 against the stage 42 be set to a magnitude that does not hinder the above-described correction.

  When the organic EL panel P is held on the stage 42, the holder 81 moves to a supply unit (not shown). The stage 42 moves to a temporary pressure bonding position by the temporary pressure bonding head 41. In the course of this movement, the left and right alignment marks PM of the organic EL panel P are moved so as to be positioned at a position (mark recognition position) immediately below the first imaging unit 43a. The first imaging unit 43a captures an image of the organic EL panel P including the alignment mark PM each time the alignment mark PM of the organic EL panel P is positioned immediately below. The captured image of the taken alignment mark PM is sent to the image processing unit 43b, and processed by the image processing unit 43b to obtain position data of each alignment mark PM. The obtained position data is sent to the control device 110. After the recognition of the position data of each alignment mark PM is completed, the organic EL panel P supported by the stage 42 is positioned at a temporary crimping position where the electronic component W is temporarily crimped.

  On the other hand, the temporary pressure bonding head 41 holding the electronic component W moves from the delivery position where the electronic component W is received from the second delivery device 70 to the temporary pressure bonding position. In the course of this movement, the electronic component W is moved to the mark recognition position. The alignment mark PM of the organic EL panel P is imaged by the upper first imaging device 43A, and the alignment mark WM of the electronic component W is imaged by the lower second imaging device 43B. The obtained organic EL panel P and electronic component W are slightly separated in the horizontal direction as shown in FIG. That is, as shown in FIG. 4, the electronic component W at the mark recognition position is located at the edge of the terminal row TR formed in the horizontal direction with respect to the electrode surface of the organic EL panel P positioned at the mark recognition position. Are positioned so as to be opposed to the edge where the electrode row ER is formed, and the lower surface of the electronic component W is positioned slightly higher than the electrode surface of the organic EL panel P in the vertical (vertical) direction. It is positioned in.

  When the electronic component W is positioned at the mark recognition position, the camera 43g of the second imaging device 43B captures an image of the alignment mark WM of the electronic component W. That is, the arrangement interval of the openings 43h1 in the pair of imaging units 43e1 and 43e2 of the second imaging device 43B is adjusted to match the arrangement interval of the alignment marks WM of the electronic component W. Therefore, each alignment mark WM of the electronic component W positioned at the mark recognition position is located above the corresponding opening 43h1. In this state, the pair of imaging units 43e1 and 43e2 simultaneously capture images of the alignment mark WM of the electronic component W. The captured images of the alignment marks WM are sent to the image processing unit 43f, and the image processing unit 43f obtains position data of the alignment marks WM. The obtained position data is sent to the control device 110.

  The control device 110 converts the position data of the left and right alignment marks PM of the organic EL panel P sent from the image processing unit 43b and the position data of the left and right alignment marks WM of the electronic component W sent from the image processing unit 43f. Based on this, the relative displacement between the organic EL panel P and the electronic component W in the X, Y, and θ directions is obtained. Based on the obtained relative positional deviation, the tool driving unit 41b and the stage driving unit 42c are controlled so as to eliminate the positional deviation, and the organic EL panel P and the electronic components are moved while moving the organic EL panel P to the temporary pressure bonding position. Align with W.

  Specifically, the control device 110 determines the inclination θP of the line connecting these two points and the coordinates (XP, YP) of the middle of the line from the position data of the left and right alignment marks PM of the organic EL panel P. Ask for. Further, the control device 110 obtains, from the position data of the left and right alignment marks WM of the electronic component W, an inclination θW of a line connecting these two points and coordinates (XW, YW) of a middle point of the line. The difference between the inclination obtained here and the coordinates of the midpoint is obtained as a relative displacement between the two. The positional deviation is corrected from the obtained relative positional deviation as follows.

  First, the difference between the inclination θP of the line connecting the alignment marks PM of the organic EL panel P and the inclination θW of the line connecting the alignment marks WM of the electronic component W is eliminated, that is, θP−θW = 0. Thus, the pressing tool 41a is rotated in the θ direction. Next, the stage 42 (stage driving section 42c) is moved so that the midpoint of the line connecting the alignment marks PM of the organic EL panel P coincides with the midpoint of the line connecting the alignment marks WM of the electronic component W. Drive. At this time, when the rotation center of the pressing tool 41a in the θ direction is shifted from the position of the midpoint of the line connecting the alignment marks WM of the electronic component W, the rotation of the pressing tool 41a causes Since the position of the midpoint of the line segment is displaced in the horizontal direction by the rotation of the pressing tool 41a, the moving position of the organic EL panel P is executed in consideration of this displacement.

  After correcting the displacement between the organic EL panel P and the electronic component W, the pressing tool 41a is lowered by driving the tool driving unit 41b. As a result, the terminal portion of the electronic component W is heated and pressurized on the electrode surface of the organic EL panel P via the anisotropic conductive tape F at a preset heating temperature, pressurizing force, and pressurizing time. The electronic component W is temporarily pressure-bonded to the organic EL panel P whose edge having is supported from below by the support portion 42b. At this time, a backup member that supports the support portion 42b of the stage 42 from below may be provided, and the support portion 42b may be supported from below when the temporary compression bonding is performed by the backup member. By doing so, it is possible to prevent the stage 42 from bending due to pressurization, so that it is possible to reduce the rigidity of the stage 42 and reduce the weight. The load at the time of moving the stage 42 is reduced, the vibration at the time of movement can be reduced, and stable and quick movement and positioning can be performed.

  After a predetermined pressurizing time has elapsed, the suction of the electronic component W by the pressurizing tool 41a is released and the pressurizing tool 41a rises. The pressing tool 41a is moved to a delivery position where the electronic component W is delivered from the second delivery device 70. The stage 42 on which the organic EL panel P to which the electronic component W has been temporarily pressed is placed is moved to a carry-out position where the organic EL panel P is delivered to the second transport unit 90. At this unloading position, the upper surface of the organic EL panel P is suction-held by the holder 91 of the second transport unit 90 in the same manner as the hold by the holder 81 of the first transport unit 80. To the stage 51.

  The organic EL panel P supplied to the final pressure bonding apparatus 50 by the second transport unit 90 is delivered to the stage 51 positioned at the carry-in position, and is suction-held on the stage 51. The operation at the time of the delivery is performed in the same manner as the delivery of the organic EL panel P from the first transport unit 80 to the stage 42. However, the difference is that the edge of the organic EL panel P to which the electronic component W has been temporarily pressed is held in a state of protruding from the stage 51.

  When the organic EL panel P is held on the stage 51, the stage 51 is moved to support the edge of the organic EL panel P on the upper surface of the backup tool 53a. During this movement, the position of the alignment mark (a mark different from the alignment mark PM) of the organic EL panel P is recognized by the position recognition unit 54. Based on this position recognition result, the stage 51 is moved so that the electrode surface of the organic EL panel P is positioned on the upper surface of the backup tool 53a in a correct positional relationship. When the edge of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressing tool 52a is lowered by driving the tool driving unit 52b, and the organic EL panel P is driven at a preset heating temperature, pressure, and pressing time. The electronic component W temporarily crimped to the EL panel P is completely crimped.

  After a predetermined pressurizing time has elapsed, the pressurizing tool 52a is raised. The stage 51 on which the organic EL panel P on which the electronic component W has been permanently pressed, that is, the stage on which the display member is placed, is moved to a carry-out position where the organic EL panel P is transferred to the third transport unit 100. At this unloading position, the upper surface of the organic EL panel P is adsorbed and held by the holder 101 of the third transfer unit 100, and the organic EL panel P is transferred to a not-shown unloading device.

  The above-described mounting operation including the step of temporarily pressing the electronic component W onto the organic EL panel P and the step of final pressing is repeatedly performed until there is no more organic EL panel P on which the electronic component W is to be mounted. In the mounting device 1 of the embodiment, it is important to improve the positional accuracy in the provisional pressure bonding process, while it is important to improve the bonding strength and reliability of the anisotropic conductive tape F in the final pressure bonding process. The process time is also different. Therefore, the mounting efficiency of the electronic component W can be improved by applying the temporary crimping device 40 and the final crimping device 50 and performing the temporary crimping process and the final crimping process. However, the mounting device 1 of the embodiment is not limited to such a configuration. You may make it perform the process from a positioning process to a main press bonding process with the main press bonding apparatus 50. In this case, the supporting portion 42b and the backup portion 53 are provided on the stage 51 of the final crimping device 50.

  In the course of the operation of mounting the electronic component W described above, every time the time interval or the number of mountings stored in the storage unit 111 elapses, the control device 110 causes the imaging units 43a, 43e1, and 43e2 to change the image of the target mark 42j4. Perform capture. Based on the image data of the target mark 42j4 captured by the imaging units 43a, 43e1, and 43e2, a calibration operation for correcting the displacement of the imaging units 43a, 43e1, and 43e2 is performed. That is, when aligning the organic EL panel P with the electronic component W, the edge of the organic EL panel P is supported from below by the support portion 42b, and the alignment mark PM of the organic EL panel P is aligned with the upper first mark. Of the organic EL panel by the conventional OLB device, as will be described in detail later, by imaging the alignment mark WM of the electronic component W with the lower second imaging device 43B while taking an image with the imaging device 43A. And the alignment mark on the upper surface of the organic EL panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged by one camera on the lower side, and the position is lowered. It is possible to suppress a reduction in the mounting accuracy based on the recognition of the surface accuracy and light transmittance of the organic EL panel, the structure of the organic EL panel, and the like due to the recognition.

  As described above, the alignment mark PM of the organic EL panel P is imaged by the upper first imaging device 43A, and the alignment mark WM of the electronic component W is imaged by the lower second imaging device 43B. By recognizing the relative position between the organic EL panel P and the electronic component W based on the image information of the mark and performing alignment, a mounting accuracy within ± 3 μm could be obtained. However, if such a mounting process is performed continuously, the mounting accuracy may decrease over time. After performing the mounting operation repeatedly for about 5 hours continuously without performing the calibration operation of the imaging unit by the present inventors, the mounting accuracy of the electronic component W was measured. Was done.

  Specifically, the time required for mounting one electronic component W (tact time) was set to 10 seconds, and the mounting accuracy was measured immediately after the start of mounting, at the lapse of 3 hours, and at the time of 5 hours. As a result, the mounting position shift immediately after the start of mounting, that is, the relative position shift (X, Y, θ) between the organic EL panel P and the electronic component W becomes (−0.4 μm, 1.3 μm, −0.0059 °). The mounting accuracy was within ± 3 μm. After 3 hours, the mounting displacement was (1.4 μm, −3.5 μm, −0.0063 °), and the mounting accuracy exceeded ± 3 μm. Further, after 5 hours, the mounting accuracy was (2.6 μm, −4.1 μm, −0.0067 °), and the mounting accuracy further exceeded ± 3 μm. Such a phenomenon that the mounting accuracy decreases over time or the mounting accuracy decreases suddenly is that the alignment marks PM and WM of the organic EL panel P and the electronic component W are simultaneously imaged by one camera. Sometimes it did not happen. For this reason, it is considered that by using the two upper and lower imaging devices 43A and 43B, the relative positions of the imaging devices 43A and 43B are shifted, and the mounting accuracy is reduced with time. For this reason, in the mounting apparatus 1 of the embodiment, the calibration operation for correcting the positional deviation of the imaging units 43a, 43e1, 43e2 is performed based on the image data of the target mark 42j4 captured by the imaging units 43a, 43e1, 43e2. .

  At the time of capturing the above-described image, first, the stage is driven so that the target mark 42j4 moves to a preset position (XY coordinate) immediately below the lens barrel 43d of the first imaging unit 43a in FIG. The section 42c is controlled. Then, when the target mark 42j4 is positioned immediately below the lens barrel 43d, the target mark 42j4 is imaged by the first imaging unit 43a. The image processing unit 43b detects data relating to the position of the target mark 42j4 (hereinafter, referred to as “position data”) based on the captured image of the first imaging unit 43a. Here, the position data is XY coordinates. If there is no shift in the position of the first imaging unit 43a, this position data matches the coordinates of the movement position of the target mark 42j4. The image processing unit 43b detects the position data of the alignment mark PM, but also has a function of detecting the position data of the target mark 42j4. The position data of the target mark 42j4 thus detected is transmitted to the control device 110.

  When imaging of the target mark 42j4 by the first imaging unit 43a is completed, the stage is moved so that the target mark 42j4 moves to a preset position immediately above the opening 43h1 of the imaging unit 43e1 located on the right side in FIG. It controls the driving section 42c. Then, when the target mark 42j4 is positioned immediately above the opening 43h1, the image of the target mark 42j4 is captured by the imaging unit 43e1. The image processing unit 43f detects the position data of the target mark 42j4 based on the captured image of the imaging unit 43e1, and transmits the data to the control device 110, similarly to the image processing unit 43b. Here, the image processing unit 43f also has a function of detecting the position data of the target mark 42j4.

  Also, when the imaging of the target mark 42j4 by the imaging unit 43e1 is completed, the stage drive is performed so that the target mark 42j4 moves to a preset position immediately above the opening 43h1 of the imaging unit 43e2 located on the left side in FIG. The section 42c is controlled. Then, when the target mark 42j4 is positioned immediately above the opening 43h1, the image of the target mark 42j4 is captured by the imaging unit 43e2. The image processing unit 43f detects the position data of the target mark 42j4 based on the captured image of the imaging unit 43e2 and transmits the same to the control device 110, as described above. The stage driving unit 42c is a driving device of the stage 42 of the organic EL panel P during the mounting operation, and a moving device (horizontal moving device) of the first and second imaging devices 43A and 43B and the target mark 42j4 during the calibration operation. Also serves as.

  When the detection of the position data of the target mark 42j4 in each of the imaging units 43a, 43e1, and 43e2 is completed, the control device 110 obtains a shift in the relative position of each of the imaging units 43a, 43e1, and 43e2. That is, the reference position of the target mark 42j4 is stored in advance in the storage unit 111 for each of the imaging units 43a, 43e1, and 43e2. The reference position is the XY coordinate in the present embodiment, and the XY coordinate is, for example, before the mounting of the electronic component W is started, using the respective imaging units 43a, 43e1, and 43e2 in the same manner as described above. Can be obtained by recognizing the position of.

  The control device 110 compares the actually detected position data of the target mark 42j4 for each of the imaging units 43a, 43e1, and 43e2 with the corresponding reference position, and detects the relative positional deviation of each of the imaging units 43a, 43e1, and 43e2 with respect to the reference position. Ask for. Then, the relative position shift determined for each of the imaging units 43a, 43e1, and 43e2 is stored in the storage unit 111 as a correction value for each of the imaging units 43a, 43e1, and 43e2. The correction value stored in the storage unit 111 is used when calculating a relative positional shift between the organic EL panel P and the electronic component W in the X, Y, and θ directions.

  That is, the position data of the alignment mark PM of the organic EL panel P and the position data of the alignment mark WM of the electronic component W are obtained by the first imaging device 43A and the second imaging device 43B. Sent to 110. The controller 110 determines the relative positional deviation between the organic EL panel P and the electronic component W in the X, Y, and θ directions. At this time, if the correction value is stored in the storage unit 111, the control device 110 stores the position data of each alignment mark PM and WM sent from each of the imaging devices 43A and 43B with the correction value stored in the storage unit 111. to correct.

  More specifically, the position data of the left and right alignment marks PM of the organic EL panel P recognized by the first imaging device 43A are values corrected using the correction values stored as the correction values of the imaging unit 43a. Is position data (correction position data). Among the alignment marks WM of the electronic component W recognized by the second imaging device 43B, the position data of the right alignment mark WM recognized using the imaging unit 43e1 is stored as a correction value of the imaging unit 43e1. The value corrected using the correction value is defined as position data (corrected position data). Further, regarding the position data of the left alignment mark WM recognized using the imaging unit 43e2, a value corrected using the correction value stored as the correction value of the imaging unit 43e2 is set as position data (correction position data). .

  Based on the correction position data of the alignment marks PM and WM obtained in this way, the relative position shift in the X, Y, and θ directions between the organic EL panel P and the electronic component W is obtained. The position data detected using the above-described imaging units 43a, 43e1, 43e2 is stored in the storage unit 111 as a new reference position, thereby updating the stored reference position. That is, the reference position is updated each time the image of the target mark 42j4 is captured by each of the imaging units 43a, 43e1, and 43e2.

[Function and effect of mounting device]
According to the mounting device 1 of the above-described embodiment, the flexible organic EL panel P is supported by the stage 42 having the supporting portion 42b that supports the edge on which the electronic component W is mounted from below, and The alignment mark PM of the organic EL panel P supported by the stage 42 is imaged from above by the first imaging unit 43a of the first imaging device 43A, and the electronic component W held by the temporary pressure bonding head 41 is captured. The alignment mark WM is imaged from below by the pair of imaging units 43e1 and 43e2 of the second imaging device 43B. Then, based on these captured images, the relative positional relationship between the organic EL panel P and the electronic component W is recognized, and based on the recognized relative positional relationship, the organic EL panel P and the electronic component W are aligned, and the organic EL panel P and the electronic component W are aligned. The electronic component W is temporarily press-bonded to the EL panel P via the anisotropic conductive tape F, and is then completely press-bonded.

  In addition, the target mark provided on the stage 42 by the pair of imaging units 43e1 and 43e2 of the first imaging unit 43A and the second imaging unit 43B at the timing stored in the storage unit 111. 42j4, and recognizes a relative positional relationship between the pair of imaging units 43e1 and 43e2 of the first imaging unit 43a and the second imaging unit 43B of the first imaging device 43A, and based on the recognition result. Thus, the alignment position between the organic EL panel P and the electronic component W is corrected.

  With this configuration, when detecting the relative position data between the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, the edge of the organic EL panel P where the electrodes are formed is moved to the stage 42. Is supported by the supporting portion 42b. Accordingly, the edge of the organic EL panel P is prevented from sagging, and the position recognition accuracy of the alignment mark PM provided on the edge can be improved. Further, the alignment mark PM of the organic EL panel P is imaged from above, and the alignment mark WM of the electronic component W is imaged from below. Therefore, the alignment mark PM formed on the upper surface of the organic EL panel P can be imaged without passing through a resin such as PI or PET constituting the organic EL panel P, so that the alignment mark PM can be stably sharpened. It becomes possible to take an image.

  Further, at the timing (time interval or the number of mounting times) stored in the storage unit 111, the first imaging unit 43a of the first imaging device 43A and the pair of imaging units 43e1 and 43e2 of the second imaging device 43B respectively. Are recognized, and the alignment position between the organic EL panel P and the electronic component W is corrected based on the recognition result. For this reason, even when the first imaging unit 43a and the pair of imaging units 43e1 and 43e2 are arranged independently of each other, it is possible to recognize the deviation of the relative positional relationship over time. Thus, even if the relative positional relationship between the first imaging unit 43a and the pair of imaging units 43e1 and 43e2 is deviated, it is possible to correct the deviation. For example, in the case where long-time continuous mounting such as 24-hour operation is repeated, the imaging units 43a, 43e1, and 43e2 are caused by thermal expansion caused by a change in the temperature inside the apparatus due to the frictional heat of the movable unit and the influence of a heat source such as a heater. Even if a so-called temperature drift occurs in which the relative position between them shifts, a high mounting accuracy can be maintained by correcting the drift.

  Thus, it is possible to improve the recognition accuracy of the relative position data between the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W. The alignment accuracy between the organic EL panel P and the electronic component W, which is performed using such relative position data, is improved, and as a result, the flexible electronic component W is mounted on the flexible organic EL panel P. Even in the case of mounting, the mounting accuracy can be improved.

  In addition, a plurality of suction holes 42g are formed in the supporting surface 42f of the supporting portion 42b that supports the edge of the organic EL panel P on which the electronic component W is mounted from below, due to warpage or undulation generated at the edge of the organic EL panel P. The organic EL panel P is provided at intervals shorter than the period of the irregularities, and is suction-held while the edge of the organic EL panel P is supported by the support surface 42f. Thereby, the edge of the organic EL panel P can be supported in a flatter state, so that the alignment mark PM of the organic EL panel P and its surrounding portion can be stably held in a horizontal and flat state, and alignment can be performed. The position recognition accuracy of the mark PM can be further improved.

  Further, the edge of the organic EL panel P on which the electronic component W is mounted is sucked from below by a plurality of suction holes 42g provided in the support surface 42f of the support portion 42b. Therefore, even when the resin constituting the organic EL panel P warps or swells at the edge of the organic EL panel P due to moisture absorption or the like, the edge of the organic EL panel P is connected to the support portion 42b. It becomes possible to make it adhere on the support surface 42f. Thereby, the alignment mark PM of the organic EL panel P and its surrounding portion can be stably held in a flat state, and the position recognition accuracy of the alignment mark PM can be improved.

  The holding body 81 of the first transport unit 80 that supplies and mounts the organic EL panel P on the stage 42 is separated by the flat suction surface 81c of the electrode surface suction block 81a and the flat suction surface of the display area suction unit 81b. The surface holding the EL panel P is formed to be flat. Thus, even if the organic EL panel P has flexibility and is likely to be warped or bent, the organic EL panel P can be held in a flat state by the holding body 81 by being sucked and held on the flat holding surface. Become. Therefore, the organic EL panel P can be placed and held on the stage 42 in a flat state, thereby stabilizing the effect of improving the position recognition accuracy of the alignment mark PM performed in the state held on the stage 42. Can be obtained.

  Further, when the organic EL panel P is placed on the stage 42 by the holder 81, the organic EL panel P is moved by the holding surface of the holder 81 onto the support surface 42 f of the support part 42 b of the stage 42 and the mounting part 42 a. It is configured to be sandwiched between the placing surface 42d. Thus, the organic EL panel P can be delivered to the stage 42 while maintaining a flat state. Thus, the organic EL panel P can be held on the stage 42 in a flat state, and the effect of improving the position recognition accuracy of the alignment mark PM performed in the state held on the stage 42 can be more stably obtained. It becomes possible.

  In addition, while imaging of the pair of alignment marks WM of the electronic component W is performed using the pair of imaging units 43e1 and 43e2, imaging of the pair of alignment marks PM of the organic EL panel P is performed using the single imaging unit 43a. To do it. That is, the imaging of a total of four alignment marks WM and PM is performed by the three imaging units 43a, 43e1, and 43e2. In addition, the imaging of the pair of alignment marks PM of the organic EL panel P by the single imaging section 43a is performed by moving the organic EL panel P.

  Position recognition of the alignment marks WM, PM using two cameras, two cameras for imaging a pair of alignment marks WM of the electronic component W and two cameras for imaging a pair of alignment marks PM of the organic EL panel P. In comparison with the case where the correction is performed, it is possible to reduce an error generated at the time of so-called calibration when correcting an error caused by a temperature drift or the like using the target mark 42j4. That is, when the position of the target mark 42j4 is recognized by each of the imaging units 43a, 43e1, and 43e2, a position recognition error of the target mark 42j4 and a positioning error of the target mark 42j4 occur for each of the imaging units 43a, 43e1, and 43e2. Therefore, as the number of cameras (imaging units) increases, the influence of this error increases. By suppressing the number of the imaging units 43a, 43e1, and 43e2 to three, the above-described error can be reduced as much as possible.

  The distance between the alignment marks WM can be recognized by imaging the pair of alignment marks WM of the electronic component W with the two imaging units 43e1 and 43e2. Thus, it is possible to recognize a difference from a reference interval between the alignment marks WM of the electronic component W, for example, a distance between the designed alignment marks WM. From this, it is possible to recognize the elongation amount of the electronic component W. Therefore, the mounting accuracy of the electronic component W can be improved by reflecting the amount of elongation of the electronic component W recognized here in the positioning position during the temporary compression bonding, the thermocompression bonding condition during the final compression bonding, and the like.

  For example, regarding the positioning position of the temporary crimping, in the terminal row TR of the electronic component W and the electrode row ER of the organic EL panel P, the terminals and electrodes are inclined outward from the center toward the outside, and further, There are C-shaped terminal rows and electrode rows that are arranged so that the inclination angles of the terminals and electrodes are large. When the electronic component W having the terminal row TR and the electrode row ER is mounted on the organic EL panel P, the positioning position in the Y direction is corrected based on the above-described expansion amount, thereby improving the mounting accuracy. be able to.

  As for the thermocompression bonding conditions at the time of the main bonding, the thermocompression bonding is performed under the thermocompression bonding conditions in which the larger the elongation amount of the electronic component W is, the stronger the suppression of the elongation of the electronic component W that occurs at the main bonding is. As a result of experiments conducted by the present inventors, it has been found that the steeper the rise of the initial pressing force (the time until the predetermined pressing force is reached), the more the effect of suppressing the elongation of the electronic component W is improved. Based on this finding, it is conceivable to control the rise of the pressing force more steeply as the amount of elongation of the electronic component W increases. In this case, thermal expansion may be caused by heating the organic EL panel P. Therefore, with respect to the growth of the organic EL panel P due to heating at the time of the final press bonding, the tendency of the expansion is grasped in advance by an experiment or the like. You may make it consider in a crimping | compression-bonding condition.

  Note that the present invention is not limited to the above embodiment. For example, an organic EL panel has been described as an example of the display panel, but the display panel is not limited to this. For example, it is also possible to use a component of flexible electronic paper as a display panel.

  Further, the anisotropic conductive tape F is used for connecting the organic EL panel P and the electronic component W, but the present invention is not limited to this. Other joining members such as an adhesive containing conductive particles may be used. When an adhesive is used, a thermosetting or photocurable adhesive can be used.

  The configurations of the first to third transport units 80, 90, 100 are not limited to those described above, and may be other configurations. For example, instead of using a porous sheet, a soft rubber or resin material such as foamed urethane rubber or silicon rubber provided with a plurality of suction openings may be used.

  Although it has been described that the organic EL panel P is transported from the stage 42 of the temporary pressure bonding apparatus 40 to the stage 51 of the final pressure bonding apparatus 50 using the second transport unit 90, the present invention is not limited to this. For example, the stage 51 of the final crimping device 50 is configured to be movable to a position close to the stage 42 of the temporary crimping device 40, and the stage 51 of the final crimping device 50 moved to the position close to the stage 42 of the temporary crimping device 40 On the other hand, the organic EL panel P may be transported using the first transport unit 80. That is, the first transport unit 80 may also serve as the second transport unit 90.

  In addition, it has been described that the image of the target mark 42j4 to be captured at each preset timing is performed once for each of the imaging units 43a, 43e1, and 43e2, but the invention is not limited to this. For example, it is also possible to take in a plurality of times for each of the imaging units 43a, 43e1, and 43e2, and recognize the average value of the positions of the target marks 42j4 recognized a plurality of times as the positions of the target marks 42j4.

  A plurality of the final press bonding apparatuses 50 may be installed in the mounting apparatus 1 in consideration of a difference in process time between the temporary press bonding step and the final compression bonding step. In addition, instead of providing a plurality of main bonding apparatuses 50, a stage 51 capable of mounting a plurality of organic EL panels P in parallel is provided in one main bonding apparatus 50, and a plurality of organic EL panels mounted in parallel. It is also possible to provide a final pressure bonding head 52 that can perform final pressure bonding of the electronic components W on the panel P collectively or individually. Here, in the case where the final compression bonding is performed at once, the final compression head 52 is provided with a pressing tool 52a having a length that can cover the entire area of the plurality of organic EL panels P placed in parallel. In addition, in the case where the main bonding is performed individually, a pressing tool 52a having a length that can cover the electronic component W mounted on one organic EL panel P is provided in the main bonding head 52 according to the mounting interval of the organic EL panel P. I do. It is preferable that each pressing tool 52a is configured so that the pressing force can be set individually.

  The edge of the organic EL panel P on which the electrode array ER is formed is suction-held by the holder 81 of the first transport unit 80, but is not limited thereto. For example, when the anisotropic conductive tape F is adhered to the electrode row ER of the organic EL panel P, other members cannot or do not want to contact the electrode row ER of the organic EL panel P. In some circumstances, the edge of the organic EL panel P where the electrode row ER is formed may not be held by suction, but may be held in a state where the edge protrudes from the holding body 81. As described above, even when the edge portion of the organic EL panel P on which the electrode array ER is formed is protruded and held by suction, a flexible film having a thickness of 20 μm or more and 500 μm or less and a flexural modulus of 2.5 GPa or more and 4.0 GPa or less is provided. In the case of an organic EL panel (display-like panel), the vicinity of the electrode array ER is sucked and held by the flat suction surface 81c of the holding body 81, so that warpage and undulation temporarily reaching the edge portion where the electrode array ER is formed are provided. Even if this occurs, the flat supporting surface 42f of the supporting portion 42b of the stage 42 can be sucked and held by the edges of the plurality of suction holes 42g by the suction force of the suction holes 42g.

  The correction of the position recognition error of each alignment mark PM, WM due to the relative position shift of the imaging units 43a, 43e1, 43e2 using the target mark 42j4, that is, the so-called temperature drift correction has been described. It is not limited, but may be another method.

  For example, as the reference position of the target mark 42j4, the position of the target mark 42j4 recognized by using each of the imaging units 43a, 43e1, and 43e2 before starting the mounting of the electronic component W is used. The positions of the imaging units 43a, 43e1, 43e2, more specifically, the design center positions of the cameras 43c, 43g may be used as reference positions. In other words, an absolute reference position may be set.

  The reference position of the target mark 42j4 is updated every time the image of the target mark 42j4 is captured by the imaging units 43a, 43e1, and 43e2. The position may not be updated. Even in this case, the same effect can be obtained.

  Further, a single target mark 42j4 is fixedly arranged on the mounting portion 42a of the stage 42, and the stage 42 is moved to position the target mark 42j4 at the position of each of the imaging units 43a, 43e1, 43e2. It may be configured as follows.

  For example, a calibration glass substrate having three target marks is prepared on one glass substrate in accordance with the arrangement positions of the imaging units 43a, 43e1, and 43e2, and the calibration glass substrate is placed on the mounting unit 42a. It is placed in a predetermined positional relationship using a jig. At this time, the two target marks imaged by the imaging units 43e1 and 43e2 for the electronic component W are set so as to protrude from the support portion 42b of the stage 42 by a predetermined amount toward the side where the temporary pressure bonding head 41 is located. Thus, the target mark can be imaged from below by the imaging units 43e1 and 43e2. Then, the stage 42 on which the calibration glass substrate is mounted is moved so that the three target marks are located at the reference positions of the imaging units 43a, 43e1, and 43e2. In this state, the corresponding target mark is recognized using each of the imaging units 43a, 43e1, and 43e2, and the relative positional shift of each of the imaging units 43a, 43e1, and 43e2 with respect to the reference position is recognized.

  Furthermore, a dedicated target mark may be arranged for each of the imaging units 43a, 43e1, 43e2. Specifically, a target mark is provided at a position directly above or immediately below each of the imaging units 43a, 43e1, and 43e2 so that the target mark can be positioned and retracted. By positioning this target mark at a position immediately above or immediately below each of the imaging units 43a, 43e1, and 43e2 from the retracted position at each preset timing, and by using the imaging units 43a, 43e1, and 43e2 to recognize the target mark, You may make it recognize the relative positional shift of each imaging part 43a, 43e1, 43e2 with respect to a reference position. In this case, it is preferable that each target mark is directly supported by the frame of the mounting device 1 in order to minimize the occurrence of relative displacement between the target marks.

  Furthermore, a lighting device may be built in the support surface 42f of the support portion 42b of the stage 42. Specifically, a lighting device is built in a portion of the support surface 42f facing the alignment mark PM of the organic EL panel P, and when the alignment mark PM is imaged by the first imaging unit 43a, the alignment mark PM Irradiate light from below. By doing so, it is possible to obtain a large difference in brightness between the image of the alignment mark PM and the background image, as compared with the case where the alignment mark PM is imaged by reflected light, and to make the image of the alignment mark PM clearer. And the recognition accuracy can be improved. Also, instead of incorporating the lighting device in the support portion 42b, a light-transmitting window is provided, or the support portion 42b is formed of a light-transmitting member, for example, a transparent glass material, and light is irradiated through these. You may do it.

  In the embodiment described above, the configuration in which the anisotropic conductive tape F is attached to the electronic component W has been described, but the present invention is not limited to this. The anisotropic conductive tape F may be attached to the organic EL panel P, that is, the display panel. In this case, instead of providing the anisotropic conductive tape sticking device 30 at the sticking position C of the intermittent rotary transfer device 20, the anisotropic conductive tape is attached to the organic EL panel P upstream of the supply section of the organic EL panel P. It is preferable to provide an anisotropic conductive tape sticking device for sticking F. For example, a mounting device 201 as shown in FIG. 8 may be applied. FIG. 8 shows a configuration of a mounting apparatus 201 according to another embodiment.

[Mounting Device According to Another Embodiment]
The mounting device 201 shown in FIG. 8 includes an anisotropic conductive tape sticking device 230, a temporary pressure bonding device 240, and a full pressure bonding device 250 arranged side by side in the X direction, and a punching device 210 disposed behind the temporary pressure bonding device 240 in the Y direction. Further, a transport device 260 for transporting the electronic component W is disposed between the temporary pressure bonding device 240 and the punching device 210. First to fourth transport units 271, 272, 273, and 274 of the organic EL panel P are disposed between the processing devices 230, 240, and 250. The mounting device 201 supplies the organic EL panels P four by four and performs processing in the processing devices 230, 240, and 250. The punching device 210 punches out the electronic component W from the carrier tape T, and has the same configuration as the punching device 10 described in the above embodiment.

  In the anisotropic conductive tape sticking device 230, the anisotropic conductive tape F is stuck to the organic EL panel P. In the anisotropic conductive tape adhering device 230, two mounting portions 231 and 232 for holding two organic EL panels P side by side in the X direction are arranged side by side in the X direction. These mounting portions 231 and 232 are provided so as to be movable in the XYZθ directions. Adhering units 233 and 234 for anisotropic conductive tape F are arranged corresponding to the two mounting portions 231 and 232. The mounting portions 231 and 232 sequentially position the organic EL panels P on the mounting portions 231 and 232 at the bonding positions by the corresponding bonding units 233 and 234, respectively. Each of the sticking units 233 and 234 sticks the anisotropic conductive tape F to the organic EL panel P positioned at the sticking position.

  The temporary crimping device 240 temporarily crimps the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is stuck. The temporary crimping device 240 includes a mounting portion 241 that holds the four organic EL panels P arranged in the X direction, a temporary bonding head 242 that temporarily compresses the electronic component W to the organic EL panel P held by the mounting portion 241, When the electronic component W is temporarily bonded to the organic EL panel P by the temporary bonding head 242, a backup tool (not shown) that supports the organic EL panel P from below is provided. The mounting portion 241 is provided so as to be movable in the XYZθ directions, and sequentially positions the four organic EL panels P on the mounting portion 241 at the temporary pressure bonding position by the temporary pressure bonding head 242. The temporary pressure bonding head 242 sequentially temporarily compresses the electronic component W to the organic EL panel P positioned at the temporary pressure bonding position. It goes without saying that the temporary crimping device 240 includes the same position recognition device as the temporary crimping device 40 described in the above embodiment.

  Here, the electronic components W punched by the punching device 210 are sequentially supplied to the temporary pressure bonding head 242 by the transport device 260. That is, the transport device 260 is movable in the XYZθ direction by the XYZθ driving unit 261, includes the receiving unit 262 that sucks and holds the electronic component W from below, receives the electronic component W from the punching unit 210, and Hand over to

  The final pressure bonding apparatus 250 performs final pressure bonding of the electronic component W temporarily pressed to the organic EL panel P. In the final pressure bonding apparatus 250, four mounting portions 251, 252, 253, 254 for individually holding the organic EL panels P are arranged side by side in the X direction. Also, four permanent pressure bonding heads 255, 256, 257, 258 are provided corresponding to the four mounting portions 251, 252, 253, 254. The press bonding heads 255, 256, 257, 258 are provided so that the pressing force can be individually adjusted, and are provided so as to be able to move up and down collectively. Each of the mounting portions 251, 252, 253, 254 is movable in the XYZθ direction, and the organic EL panel P can be positioned with respect to the corresponding main pressure bonding heads 255, 256, 257, 258. The four final pressure bonding heads 255, 256, 257, 258 collectively perform final pressure bonding on the four organic EL panels P positioned by the four mounting portions 251, 252, 253, 254.

  The first to fourth transport units 271, 272, 273, and 274 transfer four organic EL panels P to and from each of the processing devices 230, 240, and 250 at the same time. That is, each of the first to fourth transport units 271, 272, 273, and 274 includes four holding units that adsorb and hold the organic EL panel P from the upper side in the X direction. Then, the first transport unit 271 transfers four organic EL panels P from the supply unit (not shown) to the anisotropic conductive tape sticking device 230 at the same time. The second transport unit 272 transfers four organic EL panels P from the anisotropic conductive tape sticking device 230 to the temporary crimping device 240 at the same time. The third transport unit 273 transfers four organic EL panels P from the temporary pressure bonding device 240 to the final pressure bonding device 250 at the same time. The fourth transport section 274 simultaneously transports four organic EL panels P from the final pressure bonding apparatus 250 to a transport section (not shown). The present invention is applicable to the mounting apparatus 201 having such a configuration.

  Next, examples of the present invention and evaluation results thereof will be described.

(Example 1)
Using the mounting apparatus 1 of the above-described embodiment, an experiment was performed to confirm mounting accuracy by a TEG (Test Element Group) under the following conditions. Here, the TEG is an evaluation member manufactured for a test. Here, an evaluation member of the organic EL panel P was manufactured. Specifically, a TEG of an organic EL panel having a size of 5 inches (120 mm × 65 mm) was produced using a glass plate having a thickness of 0.5 mm. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was used. The reason why the TEG of the organic EL panel P is made of a glass plate is to minimize the effects of warpage, bending, and transmittance for the purpose of checking positioning accuracy described later. Hereinafter, the TEG of the organic EL panel P is simply referred to as the organic EL panel P. The target accuracy was ± 3 μm, which is a general accuracy required for an organic EL panel used for a display panel for a smartphone.

<Experiment conditions>
Temporary pressure head heater: OFF
Tact time: 10 seconds (however, the moving speed of the temporary crimping tool 41a and the mounting portion 42a is the same as the case of mounting in 5 seconds of tact).
Repetition time (number of times): 4.8 hours Temperature drift correction: Once every 360 times

  At the time of the experiment, the organic EL panel P is first mounted on the mounting portion 42a in a state where each is at the standby position, and the electronic component W is held by the pressing tool 41a. The standby position is a supply position for receiving the organic EL panel P from the first transport unit 80 for the placement unit 42a, and a position for receiving the electronic component W from the second delivery device 70 for the pressing tool 41a. From this state, the organic EL panel P and the electronic component W are positioned at the mark recognition position prior to the temporary pressure bonding. At this time, the pressure head 41a is positioned while being rotated in the horizontal direction at θ = + 5 °. This is to confirm the correction accuracy of the rotational deviation.

  In this state, the position of the alignment mark between the organic EL panel P and the electronic component W is recognized using the first and second imaging devices 43A and 43B. Perform positioning. In this alignment, the edge of the electronic component W is not overlapped with the edge of the organic EL panel P, but a small distance is set between the edge of the organic EL panel P and the edge of the electronic component W. It is carried out in a state where they face each other at a distance. Specifically, the alignment is performed such that the alignment marks PM and WM are spaced from each other by 3.3 mm. Since the distance from the alignment marks PM and WM to the edge is approximately 0.6 to 1.2 mm, respectively, the edges are arranged at an interval of 0.9 to 2.1 mm.

  When the alignment is completed, the alignment mark of the organic EL panel P and the alignment mark of the electronic component W are placed in the same field of view from the lower side and imaged simultaneously using the second imaging device 43B, and the organic EL panel P and the The relative positional deviation between the electronic component W and the electronic component W is recognized. That is, the right alignment marks of the organic EL panel P and the electronic component W are placed in the same field of view of the imaging unit 43e1 of the second imaging device 43B, and images are taken simultaneously, and the left alignment marks are taken of the second imaging device 43B. And within the same field of view of the imaging unit 43e2. Then, the relative position deviation obtained from the recognition result is recorded as mounting accuracy.

  The supporting portion 42b supporting the edge of the organic EL panel P was provided for an experiment in which a notch portion penetrating vertically was provided at a position corresponding to the alignment mark so that the alignment mark could be viewed from below. One used. The reason why the organic EL panel P is made of a glass plate is to minimize the influence of the TEG warpage, undulation, transmittance, or the like on the recognition accuracy even when the alignment mark is recognized through the TEG. is there.

(Comparative Example 1)
Comparative Example 1 was the same as Example 1 except that "temperature drift correction" was not performed.

  In Example 1 and Comparative Example 1 described above, the movement of the organic EL panel P and the electronic component W, the recognition of each alignment mark, and the recording of the relative displacement were performed during the above-described repetition time (4.8 hours). It was performed continuously. The measurement results of Example 1 are shown in Table 1 and FIG. The measurement results of Comparative Example 1 are shown in Table 2 and FIG. With respect to the results shown in these tables and figures, in the data (about 1800 times) acquired during the repetition time, the average value (1) of the first to tenth data and the average of the data of ten times every 100 times The values ((2) to (18)) are shown in Tables 1 and 2 as “relative positional deviation recognition results”. The “difference from the measurement result of (1)” in Tables 1 and 2 is a value obtained by subtracting the first data (1) from the average value ((2) to (18)) of the data every 100 times. 9 and 10 show the fluctuation of the “difference from the measurement result of (1).” As is clear from the comparison between Tables 1 and 9 and Tables 2 and 10, “temperature drift correction” was performed. By doing so, it is possible to greatly suppress the fluctuation of the mounting accuracy, and thus it is possible to maintain the mounting accuracy of the flexible electronic component on the flexible display panel for a long period of time. I understand.

  Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in other various forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and their equivalents.

  DESCRIPTION OF SYMBOLS 1 ... Mounting apparatus, 10 (10A, 10B) ... Punching apparatus, 12 ... Die apparatus, 20 ... Intermittent rotation conveyance apparatus, 21 ... Arm part, 24 ... Holding head, 30 ... Anisotropic conductive tape sticking apparatus (joining) Member bonding device), 32 bonding head, 40 temporary bonding device 40, 41 temporary bonding head, 42 stage, 42a mounting portion, 42b supporting portion, 42c stage driving portion, 42j calibration 42j3: transparent plate material, 42j4: target mark, 43: position recognition unit, 43A: first imaging device, 43B: second imaging device, 43a: first imaging unit, 43e (43e1, 43e2): first 2 imaging unit, 43b, 43f image processing unit, 50 final bonding device, 51 stage, 52 final bonding head, 53 backup unit, 60 first delivery device, 61 receiving unit, 70th , A receiving unit, 80, a first transport unit, 81, a holder, 81a, an electrode surface suction block, 81b, a display area suction unit, 90, a second transport unit, 91, a holder, 100 ... Third transporting unit, 101 holding body, 110 control unit, 111 storage unit, F anisotropic conductive tape, P organic EL panel, W electronic component.

Claims (12)

Flexible electrodes having a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and arranged on the edges of a flexible display panel, A component mounting device for mounting the electronic component on the display panel by connecting a plurality of terminals arranged in correspondence with the plurality of electrodes through a joining member in the component,
A stage on which the display panel is mounted, comprising: a supporter for supporting the edge of the display panel on which the electronic component is mounted, from below, and is movable in a horizontal direction together with the supporter. The stage,
Holding the electronic component from above, thermocompression bonding of the electronic component to the upper surface of the edge supported by the support portion, a thermocompression head movable horizontally and vertically,
A first imaging device that images an alignment mark provided on the edge of the display panel from above while the edge of the display panel is supported by the support of the stage;
A second imaging device that images the alignment mark provided on the electronic component from below, in a state where the electronic component is held by the thermocompression bonding head;
Positions of the display panel and the electronic component based on relative position information of the alignment mark of the display panel and the electronic component obtained from images captured by the first imaging device and the second imaging device. In order to adjust the relative position between the stage and the thermocompression bonding head, so that the electronic component is thermocompression bonded to the display panel by the thermocompression bonding head in the adjusted positional relationship, the stage and the A mounting operation control device for controlling the thermocompression bonding head;
A calibration member used for recognizing a relative positional relationship between the first imaging device and the second imaging device;
The first imaging device, the second imaging device, and the calibration member are horizontally moved so that the calibration member is sequentially positioned at a position facing the first imaging device and the second imaging device. A horizontal moving device for relatively moving at
A storage unit that stores a reference value of a relative positional relationship between the first imaging device and the second imaging device;
An image of the calibration member is captured by the first imaging device and the second imaging device, and a relative position between the first imaging device and the second imaging device based on the captured image. By recognizing the relationship and comparing the recognized result with a reference value stored in the storage unit, a deviation of a relative positional relationship between the first imaging device and the second imaging device is determined and calculated. An electronic component mounting apparatus, comprising: a calibration operation control device that corrects an alignment position between the display panel and the electronic component based on the displacement. The alignment marks of the display panel are a pair of alignment marks provided on both sides of the plurality of electrodes of the display panel,
The alignment mark of the electronic component is a pair of alignment marks provided on both sides of the plurality of terminals of the electronic component,
The first imaging device is located at a position above the stage, near the thermocompression bonding position where the thermocompression bonding head thermocompression-bonds the electronic component to the edge of the display panel,
The second imaging device includes a pair of imaging devices, and the pair of imaging devices is disposed below a surface of the stage on which the display panel is mounted, and is disposed between a pair of alignment marks of the electronic component. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is arranged to correspond to (1). The storage unit further stores a time interval as the timing of capturing the image of the calibration member or the number of times the electronic component is mounted by the thermocompression bonding head,
The calibration operation control device executes the capture of the image of the calibration member by the first imaging device and the second imaging device based on the time interval or the number of mountings stored in the storage unit. An electronic component mounting apparatus according to claim 1.   The calibration operation control device recognizes the image of the calibration member with the first imaging device and the second imaging device, and recognizes the relative positional relationship as a new reference value in the storage unit. The electronic component mounting apparatus according to claim 1, wherein the mounting is performed.   The electronic component mounting apparatus according to claim 1, wherein the calibration member includes a target mark that can be imaged in both directions, and is fixed to the stage.   The electronic component mounting apparatus according to any one of claims 1 to 5, wherein the support section has a plurality of suction holes for suction holding an edge of the display panel. Further, a transport unit that supplies the display panel to the stage,
The transport unit includes an electrode surface suction block that sucks and holds the edge portion of the display panel flat, and a display area suction block that sucks and holds a portion of the display panel other than a portion that is sucked by the electrode surface suction block. The mounting device for an electronic component according to claim 1, further comprising a holder having a portion.   The electronic component mounting apparatus according to claim 7, wherein the display area suction unit includes a flat suction surface and a porous sheet provided on the suction surface.   A plurality of the display area suction units are arranged side by side in a direction intersecting with the edge of the display panel sucked and held by the electrode surface suction block, and each of them has an interval between the electrode surface suction blocks. 9. The electronic component mounting apparatus according to claim 7, wherein the electronic component mounting apparatus is provided so as to be adjustable. A punching device for punching the electronic component from a carrier tape,
An intermittent rotation transfer device that includes a plurality of holding heads that hold the electronic component punched by the punching device, and that moves the holding head intermittently.
A joining member sticking device that is arranged on the transport path of the electronic component by the intermittent rotation transport device and sticks the joining member to the electronic component,
The electronic component having the stage, the thermocompression bonding head, the first imaging device, and the second imaging device, the electronic component having the joining member attached by the joining member attaching device is temporarily attached to the display panel. A temporary crimping device for crimping,
A final press bonding device for final press bonding of the electronic component temporarily pressed to the display panel by the temporary press bonding device;
A first delivery device that delivers the electronic component between the punching device and the intermittent rotation transport device;
A second delivery device for delivering the electronic component between the intermittent rotary transfer device and the temporary crimping device,
A transport unit that transports the display panel from the temporary compression bonding apparatus to the final compression bonding apparatus,
The temporary crimping device and the main crimping device are arranged adjacent to each other,
The said intermittent rotation conveyance device and the said punching device are arrange | positioned in order of the said intermittent rotation conveyance device and the said punching device in the direction orthogonal to the said adjacent direction with respect to the said temporary crimping | compression-bonding apparatus, Claim 1 thru | or Claim. Item 10. The electronic component mounting apparatus according to any one of items 9. A punching device for punching the electronic component from a carrier tape,
In the display panel, a joining member attaching device that attaches the joining member to the edge on which the electronic component punched by the punching device is mounted,
A temporary crimping device that includes the stage, the thermocompression bonding head, the first imaging device, and the second imaging device, and temporarily crimps the electronic component to the display panel via the bonding member;
A final press bonding device for final press bonding of the electronic component temporarily pressed to the display panel by the temporary press bonding device;
A delivery device for delivering the electronic component between the punching device and the temporary crimping device,
A transport unit that transports the display panel from the bonding member attaching device to the temporary pressure bonding device,
With another transport unit that transports the display panel from the temporary pressure bonding device to the final pressure bonding device,
The joining member attaching device, the temporary crimping device, and the final crimping device are arranged in this order,
The electronic component mounting device according to claim 1, wherein the punching device is arranged in a direction perpendicular to the arrangement direction with respect to the temporary crimping device. A flexible display panel having a thickness of 20 μm or more and 500 μm or less, a bending elastic modulus of 2.5 GPa or more and 4.0 GPa or less, and holding a flexible display panel on a stage, and an edge of the display panel having a plurality of electrodes. Supporting the portion from below by a supporting portion provided on the stage,
A holding step of holding a plurality of terminals provided corresponding to the plurality of electrodes, and holding a flexible electronic component on a thermocompression bonding head,
A first imaging step of imaging an alignment mark provided on the edge of the display panel by a first imaging device from above the display panel supported by the support;
A second imaging step of imaging an alignment mark provided on the electronic component by a second imaging device from below the electronic component held by the thermocompression bonding head;
The display panel and the electronic device are formed based on an image of the alignment mark of the display panel captured in the first imaging step and an image of the alignment mark of the electronic component captured in the second imaging step. A position recognition process for recognizing a relative positional relationship with the component;
The relative position between the stage and the thermocompression head is adjusted based on the relative positional relationship recognized in the position recognition step, and the thermocompression head applies the electronic component to the display panel with the adjusted positional relationship. And a thermocompression bonding step for performing crimping,
By repeatedly performing the supporting step, the holding step, the first imaging step, the second imaging step, the position recognition step, and the thermocompression bonding step, the plurality of electrodes of the display panel are A method of manufacturing a display member for continuously manufacturing a display member in which the plurality of terminals of the electronic component are connected via a joining member,
An image of the calibration member used for recognizing a relative positional relationship between the first imaging device and the second imaging device is captured by the first imaging device and the second imaging device, and A recognition step of recognizing a relative positional relationship between the first imaging device and the second imaging device;
By comparing the recognized result with a preset reference value, a deviation of a relative positional relationship between the first imaging device and the second imaging device is determined, and the display is performed based on the determined deviation. A method for manufacturing a display member, comprising: a correction step of correcting a position at which a display panel and an electronic component are aligned.

Images