JP2006210592A - Tape sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape sticking method by which wrong sticking of an ACF (Anisotropic Conductive Film) sticking sheet can be prevented. <P>SOLUTION: The ACF tape 2 is supplied to an ACF cutting section 13, and a half-cut cutting line 5 is formed in the ACF sheet 3. The ACF tape 2 is fed by a specified sticking length, and the half-cut cutting line 5 is formed therein to complete an ACF sticking sheet 8. A stage 12 is horizontally moved so as to allow a substrate 11 to locate under the ACF sticking sheet 8. A mount tape 4 is pressed down to the substrate 11 to float the mount tape 4 from the substrate 11 and apply a tension thereto. The ACF tape 2 is fed by a specified sticking length, and a half-cut cutting line 7 to complete an ACF sticking tape 9. The stage 12 is moved so as to allow a camera 1 to locate under the mount tape area between the half-cut cutting lines 5 and 6, the mount tape area is picked up by the camera 1, and then the picked-up picture is used to judge whether or not the ACF sticking sheet 8 remains. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a tape attaching method in which an ACF (Anisotropic Conductive Film) tape is half-cut and attached to a substrate in a liquid crystal panel or an FPC (Flexible Print Circuit) connected to the liquid crystal panel.

  2. Description of the Related Art Conventionally, a tape application method in which an ACF sheet attached to an ACF tape mount tape is half-cut with a predetermined application length and attached to a substrate is known (Patent Documents 1 and 2).

First, an ACF tape is supplied with an ACF sheet facing downward to an ACF cutting mechanism placed on the upper side of a stage on which a substrate can be moved. And the front end side of an ACF tape is clamped with a clamping member. Next, a first half cut is formed on the ACF sheet by an ACF cutting mechanism. Thereafter, the ACF tape sandwiched between the first and second half cuts is produced by feeding the ACF tape sandwiched between the sandwiching members by a predetermined pasting length and forming the second half cuts with the ACF cutting mechanism. Then, the ACF cutting mechanism is retracted in the horizontal direction intersecting the ACF tape feeding direction. Next, the stage on which the substrate is placed is moved horizontally so that the substrate is positioned below the ACF attached sheet. Then, in order to stick an ACF sticking sheet to a board | substrate, a mount tape is pressed toward a board | substrate. Then, the mount tape is lifted from the substrate and tension is applied. Next, the cutting mechanism is advanced to repeatedly produce an ACF-attached sheet and attach it to the substrate.
JP 2001-308149 A (FIGS. 7 and 8) JP 2000-340616 A

  However, in the conventional configuration, when the pressing force against the mount tape is not sufficient, the adhesive force is not sufficiently generated between the ACF adhesive sheet and the substrate, and the ACF adhesive sheet does not adhere to the substrate and remains on the mount tape. There is a problem that a pasting error occurs.

  Further, the clamping force is reduced due to wear of the clamping member that clamps the ACF tape, the tape feeding accuracy is deteriorated, and the dimensional accuracy of the application length of the ACF adhesive sheet is deteriorated. For this reason, there is a problem that an ACF sticking sheet having a bad sticking length dimension is stuck on the substrate, and an expensive IC or the like is mounted thereon, resulting in an increase in loss cost.

  Furthermore, with the recent miniaturization of digital network products, electronic components have become more densely mounted, and the pitch between the IC mounting position and other electronic component mounting positions has been spurred to narrow the pitch, thereby improving mounting accuracy. I have to go. In such a situation, there is a problem that it is necessary to further improve the accuracy of the attachment position of the ACF tape.

  The objective of this invention is providing the tape sticking method which can solve the problem of the said prior art example.

  A first tape application method according to the present invention is a tape application method in which an ACF sheet attached to a mount tape of an ACF tape is half-cut with a predetermined application length and attached to a substrate. The ACF tape is supplied with the ACF sheet facing downward to the cutting mechanism disposed on the upper side of the horizontally movable stage with the ACF facing upward, and the ACF sheet is formed with the first half-cut cut by the cutting mechanism. By feeding the tape and forming the second half-cut cut with the cutting mechanism, the first ACF adhesive sheet sandwiched between the first and second half-cut cuts is produced, and the cutting mechanism is retracted in the horizontal direction intersecting the ACF tape feed direction. The stage is horizontally moved so that the substrate is positioned below the first ACF adhesive sheet, and the first ACF adhesive sheet is attached to the substrate. The tape is pressed toward the substrate, the mount tape is lifted from the substrate, tension is applied, the cutting mechanism is advanced, the ACF tape is fed by a predetermined sticking length, and the third half-cut cut is formed by the cutting mechanism. The second ACF adhesive sheet sandwiched between the second and third half cut cuts is produced, the cutting mechanism is retracted in the horizontal direction, and the camera is positioned below the mount tape area sandwiched between the first and second half cut cuts. When the stage is moved horizontally, the mount tape area is imaged with a camera, the presence or absence of the first ACF adhesive sheet is determined based on the captured image, and when it is determined that the first ACF adhesive sheet does not remain, Mount tape for attaching the second ACF adhesive sheet to the substrate by horizontally moving the stage so that the substrate is positioned below the second ACF adhesive sheet Pressed toward the substrate, when it is determined that the first 1ACF sticking sheet remains is characterized in that an error stop sticking Keru step the first 2ACF sticking sheet to the substrate.

  According to this configuration, the presence or absence of the first ACF sticking sheet is determined based on the captured image of the mount tape area sandwiched between the first and second half cut cuts. For this reason, when it is determined that the first ACF sticking sheet remains, it is possible to prevent a sticking mistake by stopping the machine with an error that the first ACF sticking sheet is not normally stuck on the substrate.

  When it is determined that the first ACF-attached sheet does not remain, the second ACF-attached sheet is imaged with a camera, and it is determined whether or not the second ACF-attached sheet size is within a predetermined range based on the captured image, When it is determined that the sheet size is within a predetermined range, the stage is horizontally moved so that the substrate is positioned below the second ACF adhesive sheet, and the mount tape is directed toward the substrate in order to attach the second ACF adhesive sheet to the substrate. When the second ACF adhesive sheet size is determined to be out of the predetermined range, it is preferable that the process of attaching the second ACF adhesive sheet to the substrate is stopped by error. This is to prevent the defective ACF sticking sheet having a dimension outside the predetermined range from being stuck.

  When it is determined that the size of the second ACF adhesive sheet is within the predetermined range, the position and rotation angle of the second ACF adhesive sheet are calculated based on the captured image of the second ACF adhesive sheet, and the calculated position and rotation angle of the second ACF adhesive sheet are calculated. It is preferable to correct the sticking position of the second ACF sticking sheet on the substrate based on the above. This is to improve the pasting accuracy of the second ACF pasting sheet.

  A second tape application method according to the present invention is a tape application method in which an ACF sheet attached to an ACF tape mount tape is half-cut with a predetermined application length and attached to a substrate. Two half-cut cuts are formed, a first ACF sticking sheet is produced between them, the first ACF sticking sheet is stuck on the substrate, a third half-cut cut is formed on the ACF sheet, and a second ACF sticking sheet is produced. Check whether there is any remaining tape on the mount tape that held the 1ACF adhesive sheet. If there is residual tape, do not attach the second ACF adhesive sheet. If there is no residual tape, use the second ACF adhesive sheet as a substrate. It is characterized by sticking to.

  ADVANTAGE OF THE INVENTION According to this invention, the sticking mistake of an ACF sticking sheet can be prevented, and the tape sticking method which can prevent the sticking to the board | substrate of the ACF sticking sheet of a sticking length dimension defect can be provided.

  FIG. 1 is a perspective view of an ACF tape sticking apparatus 100 according to the present embodiment, and FIG. 2 is a perspective view for explaining an ACF sticking portion 15 and the like of the ACF tape sticking apparatus 100. The ACF tape attaching device 100 includes a substrate stage 12. The substrate stage 12 is provided so as to be movable in the XY direction (horizontal direction) by XY stage driving units 23 and 24. A substrate 11 is placed on the substrate stage 12. On the side of the substrate stage 12, the camera 1 is provided upward.

  The ACF tape applying apparatus 100 is provided with a tape feeding reel 17 around which the ACF tape 2 is wound. 3A is a cross-sectional view for explaining the ACF tape 2, and FIG. 3B is a bottom view thereof. The ACF tape 2 is formed with a base tape 4 having a thickness of about 80 μm, an ACF sheet 3 having a thickness of about 60 to 80 μm formed so as to cover the surface of the base tape 4, and a surface covering the ACF sheet 3 in order to protect it. A cover tape (not shown).

  The ACF tape 2 wound around the tape supply reel 17 is wound around the tension roller 18, and the cover tape (not shown) is peeled off by the cover tape suction device 20 to expose the ACF sheet 3. 34, the ACF cutting unit 13 (FIG. 1) disposed above the substrate stage 12 is guided.

  The ACF tape 2 guided to the ACF cutting unit 13 reaches the tape supply unit 16 via the peeling roller unit 32. The tape supply unit 16 includes a fixed chuck 26 that sandwiches the ACF tape 2, a feed chuck 31 that feeds the ACF tape 2 by a predetermined ACF tape application length, and a tape traveling direction corresponding to a stroke corresponding to the ACF tape application length. A servo motor 27 for driving the feed chuck 31 so as to be reciprocally movable, and a mount tape suction device 19 for sucking the mount tape 4 of the ACF tape 2 are provided.

  The ACF cutting section 13 forms half cut cuts 5 and 6 having a width of about 40 μm by cutting the ACF sheet 3 attached to the mount tape 4 with a predetermined application length without cutting the mount tape 4 to form the ACF attached sheet 8. Is made. The ACF cutting section 13 is provided so as to be able to advance and retract in the horizontal direction perpendicular to the ACF tape feeding direction indicated by the arrow 25.

  The ACF tape attaching device 100 is provided with an ACF attaching portion 15 (FIG. 2). The ACF sticking unit 15 pressurizes the mount tape 4 toward the substrate 11 while heating the mount tape 4 in order to stick the ACF sticking sheet 8 to a predetermined mounting position of the substrate 11.

  The ACF attaching part 15 is provided so as to be movable up and down in the vertical direction indicated by an arrow 30. When the ACF sticking part 15 operates, the ACF cutting part 13 moves in the direction of the arrow 25 and is in the retracted state. On the other hand, when the ACF cutting part 13 operates, the ACF sticking part 15 moves upward and enters the retracted state. .

  The ACF tape affixing device 100 includes an illumination device 28 that illuminates the substrate 11 from above, an imaging device 29 for recognizing a substrate position correction mark (not shown) provided on the substrate 11, and an imaging device 29. Are provided with a controller 21 for calculating the substrate position correction amount based on the imaging information from the input and an input unit 22 for inputting external dimensions such as a sticking length of the ACF tape 2 and sticking conditions.

  The operation of the ACF tape attaching apparatus 100 configured as described above will be described. FIG. 5A to FIG. 5C and FIG. 6A to FIG. 6C are schematic views for explaining the operation of the ACF tape attaching apparatus 100. FIG.

  The ACF tape 2 fed out from the tape feeding reel 17 passes through the tension roller 18 and the guide rollers 33 and 34, passes through the operation places of the ACF cutting part 13 and the ACF attaching part 15, and passes through the peeling roller unit 32. It is clamped by the fixed chuck 26 through the open feed chuck 31.

  Next, the ACF cutting unit 13 forms the first half-cut cut 5 and the second half-cut cut 6 in order to cut the ACF sheet 3 to the predetermined pasting length. The distance between the first half-cut cut 5 and the second half-cut cut 6 corresponds to the predetermined sticking length and is controlled by the feed amount of the ACF tape 2 by the feed chuck 31. Therefore, the distance between the first half-cut cut 5 and the second half-cut cut 6 can be arbitrarily set by the control of the servo motor 27, and the ACF sheet 3 can be cut to a desired sticking length.

  Thereafter, the ACF cutting part 13 is retracted in the direction of the arrow 25. Then, the substrate stage 12 is moved so that the camera 1 is positioned below the ACF adhesive sheet 8 sandwiched between the half-cut cuts 5 and 6.

  Then, in order to confirm whether or not the half-cut is normally performed, the ACF-attached sheet 8 is imaged by the camera 1, and the coordinates of the four points P1, P2, P3, and P4 at the four corners are obtained by the controller 21 based on the imaging information. The midpoint P5 of the points P1 and P4 and the midpoint P6 of the points P2 and P3 are obtained, the length between the points P5 and P6 is obtained, and the external dimensions of the ACF attached sheet 8 are calculated. Then, the calculated outer dimension is compared with the outer dimension of the ACF sticking sheet 8 input at the input unit 22, and if the outer dimension calculation result is outside the allowable range set by the input unit 22, the machine is stopped with an error. .

  If the outer dimension calculation result is within the allowable range, the controller 21 based on the imaging information of the ACF sticker sheet 8 and the center point P7 and the rotation of the ACF sticker sheet 8 from the coordinates of the four points P1, P2, P3 and P4 at the four corners. The angle is obtained, the position correction amount of the substrate 11 is calculated based on the result, and the substrate stage 12 is driven by the XY stage driving units 23 and 24 to correct the position of the substrate 11. Then, as shown in FIGS. 5A and 5B, the ACF adhering portion 15 and the ACF tape 2 are lowered from the origin height (ORG) onto the substrate 11 and the mount tape 4 is applied with a predetermined pressing force. The adhesive surface of the ACF adhesive sheet 8 is attached to a predetermined position of the substrate 11 by pressing and heating at about 85 ° C.

  Then, as shown in FIG. 5C, the ACF attaching portion 15 is raised from the substrate 11 by a predetermined peeling height H1. Next, the ACF tape 2 on the side of the peeling roller unit 32 is bent by a tape deflection generating portion (not shown), and as shown in FIG. 6A, the peeling roller unit 32 is passed over the ACF adhering sheet 8 to guide rollers. The backing tape 4 is lifted from the ACF sticking sheet 8 and peeled off. Thereafter, as shown in FIG. 6B, the peeling unit 32 returns to the original position over the ACF sticking sheet 8 in the reverse direction. And as shown in FIG.6 (c), the ACF sticking part 15 and the ACF tape 2 are raised to origin height (ORG). Next, the feed chuck 31 is closed, the fixed chuck 26 is opened, and the ACF tape 2 is fed by the predetermined sticking length. The mount tape 4 is collected by the mount tape suction device 19.

  Next, the ACF cutting part 13 is advanced, and as shown in FIGS. 4A and 4B, the third half-cut line 7 is formed by the ACF cutting part 13 to thereby form the second half-cut line 6 and the third half-cut line. An ACF attached sheet 9 sandwiched between half-cut cuts 7 is produced. Thereafter, the ACF cutting part 13 is retracted in the direction of the arrow 25. Next, the substrate stage 12 is horizontally moved so that the camera 1 is positioned below the mount tape area sandwiched between the first and second half-cut cuts 5 and 6.

  Then, the pasting position of the ACF pasting sheet 8 one time before the position of the ACF pasting sheet 9 to be pasted this time (region of the mount tape 4 sandwiched between the first half-cut cut 5 and the second half-cut cut 6) Is captured by the camera 1. Then, based on the imaging information, the controller 21 determines whether or not there is a pasting mistake sheet (ACF pasting sheet 8). When it is determined that the ACF adhesive sheet 8 is present at that position, it is determined that the ACF adhesive sheet 8 is not normally adhered to the substrate 11 and the machine is stopped by error. The mount tape 4 is recognized as gray in an area where there is no pasting mistake sheet (ACF pasting sheet 8). A region with a pasting mistake sheet is recognized as white. Therefore, it is possible to determine the presence or absence of a pasting mistake sheet by a known image processing technique.

  When it is determined that there is no ACF sticking sheet 8, the ACF sticking sheet 9 is imaged by the camera 1 to determine whether or not the sticking length dimension is within an allowable range. If it is determined that it is within the allowable range, the ACF application sheet 9 is applied to the substrate by the ACF application unit 15, and if it is determined that it is not within the allowable range, the machine is stopped with an error.

  FIG. 7A is a cross-sectional view for explaining an ACF tape that has been melted by thermocompression bonding, and FIG. 7B is a bottom view thereof. FIG. 8A is a cross-sectional view for explaining the inspection of whether or not the ACF tape is dissolved by thermocompression bonding, and FIG. 8B is a bottom view thereof.

  When the ACF adhering portion 15 is exchanged or the like and its mounting position is shifted in the direction of arrow A7 in FIG. 7A, the end face of the ACF adhering portion 15 is pressed when the ACF adhering sheet 8 is pressed and attached to the substrate 11. 15A exceeds the half-cut cut 6 and is thermocompression bonded onto the end 3B of the ACF sheet 3. For this reason, there exists a possibility that the edge part 3B will melt | dissolve and it may become a jagged shape and the sticking length of the following ACF sticking sheet 9 may become short. Therefore, in the present embodiment, before the ACF adhesive sheet 9 is attached to the substrate 11, the roughness D1 of the end 3B is detected by the camera 1, and if the predetermined value, for example, 75 μm or more, the machine is error-stopped.

  When the roughness D1 is equal to or larger than a predetermined value, the camera 1 recognizes and determines whether or not the position of the end surface 15A of the ACF pasting portion 15 is beyond the half cut notch 7 and on the ACF sheet 3 side. Good.

  4 (a) and 4 (b) show an example in which the past position of the ACF sticking sheet 8 and the ACF sticking sheet 9 are separately picked up by the camera 1 in FIGS. 4 (a) and 4 (b). May be.

  The present invention can be applied to a tape attaching method in which an ACF tape is half cut and attached to a substrate in a liquid crystal panel or an FPC connected to the liquid crystal panel.

It is a perspective view of the ACF tape sticking device concerning this embodiment. It is a perspective view for demonstrating the ACF sticking part etc. of the ACF tape sticking apparatus which concerns on this Embodiment. (A) is sectional drawing for demonstrating the ACF tape which concerns on this Embodiment, (b) is the bottom view. (A) is sectional drawing for demonstrating the ACF tape at the time of the sticking mistake generation which concerns on this Embodiment, (b) is the bottom view. (A)-(c) is sectional drawing for demonstrating operation | movement of the ACF tape sticking apparatus which concerns on this Embodiment. (A)-(c) is sectional drawing for demonstrating operation | movement of the ACF tape sticking apparatus which concerns on this Embodiment. (A) is sectional drawing for demonstrating the ACF tape in which the melt | dissolution by thermocompression bonding produced, (b) is the bottom view. (A) is sectional drawing for demonstrating the test | inspection of the presence or absence of melt | dissolution of the ACF tape by thermocompression bonding, (b) is the bottom view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Camera 2 ACF tape 3 ACF sheet 4 Mount tape 5, 6, 7 Half cut cut 8, 9 ACF sticking sheet 10 Mount tape area | region 11 Board | substrate 12 Substrate stage 13 ACF cutting part 100 ACF tape sticking apparatus

Claims (4)

A tape application method for attaching an ACF sheet attached to an ACF tape mount tape to a substrate by half-cutting it with a predetermined application length, and placing the substrate on top of a horizontally movable stage with the camera facing upward ACF tape is supplied to the cutting mechanism placed on the ACF sheet with the ACF sheet facing downward, the first half-cut cut is formed on the ACF sheet by the cutting mechanism, and the ACF tape is fed by a predetermined pasting length to cut the second half-cut cut. To form a first ACF adhesive sheet sandwiched between the first and second half-cut cuts, retract the cutting mechanism in a horizontal direction intersecting the ACF tape feeding direction, and a substrate is placed below the first ACF adhesive sheet. The stage is moved horizontally so that it is positioned, and in order to attach the first ACF attachment sheet to the substrate, the mount tape is pressed toward the substrate, and the mount tape is The tape is lifted from the substrate, tension is applied, the cutting mechanism is advanced, the ACF tape is fed by a predetermined sticking length, and the third half cut cut is formed by the cutting mechanism, so that it is sandwiched between the second and third half cut cuts. A second ACF sticking sheet is prepared, the cutting mechanism is retracted in the horizontal direction, and the stage is moved horizontally so that the camera is positioned below the mount tape area sandwiched between the first and second half cut cuts. The mount tape area is imaged with a camera, and the presence or absence of the first ACF sticking sheet is determined based on the captured image,
When it is determined that the first ACF adhesive sheet does not remain, the stage is horizontally moved so that the substrate is positioned below the second ACF adhesive sheet, and the mount tape is attached to the substrate to adhere the second ACF adhesive sheet to the substrate. Press towards
When it is determined that the first ACF sticking sheet remains, the step of sticking the second ACF sticking sheet to the substrate is stopped by error. When it is determined that the first ACF adhesive sheet does not remain, the second ACF adhesive sheet is imaged with a camera, and it is determined whether or not the second ACF adhesive sheet dimension is within a predetermined range based on the captured image.
When it is determined that the size of the second ACF adhesive sheet is within a predetermined range, the stage is horizontally moved so that the substrate is positioned below the second ACF adhesive sheet, and a mount tape is attached to attach the second ACF adhesive sheet to the substrate. Press towards the board,
The tape sticking method according to claim 1, wherein when the second ACF sticking sheet dimension is determined to be outside the predetermined range, the step of sticking the second ACF sticking sheet to the substrate is stopped by error. When it is determined that the size of the second ACF adhesive sheet is within the predetermined range, the position and rotation angle of the second ACF adhesive sheet are calculated based on the captured image of the second ACF adhesive sheet, and the calculated position and rotation angle of the second ACF adhesive sheet are calculated. The tape sticking method according to claim 2, wherein the sticking position of the second ACF sticking sheet on the substrate is corrected based on. A tape application method in which an ACF sheet attached to a mount tape of an ACF tape is half-cut with a predetermined application length and attached to a substrate, wherein first and second half-cut cuts are formed in the ACF sheet, A 1ACF adhesive sheet is prepared, this first ACF adhesive sheet is attached to a substrate, a third half-cut cut is formed on the ACF sheet to produce a second ACF adhesive sheet, and the first ACF adhesive sheet is held on the backing tape holding A tape affixing method characterized by checking whether there is a residual tape, affixing the second ACF affixing sheet when there is a residual tape, and affixing the second ACF affixation sheet to the substrate when there is no residual tape.

Images