JP5021394B2 - ACF pasting device and flat panel display manufacturing device - Google Patents

Description

  The present invention relates to an ACF adhering device for adhering an ACF (Anisotropic Conductive Film) to a substrate for mounting a semiconductor circuit element such as a driver circuit on the substrate, an apparatus for manufacturing a flat panel display including the ACF adhering device, and The present invention relates to a flat panel display manufactured using the flat panel display manufacturing apparatus.

  One flat panel display is a liquid crystal display. The liquid crystal display is configured by enclosing a liquid crystal between liquid crystal panels composed of two upper and lower transparent substrates. A printed circuit board is connected to the liquid crystal panel via a driver circuit. The inner electrode of the driver circuit is connected to the liquid crystal panel, and the outer electrode is connected to the printed circuit board. The driver circuit mounting method is typically a TAB (Tape Automated Bonding) method or a COG (Chip On Glass) method, but in any case, a wiring pattern is formed on at least two sides of the surface of the liquid crystal panel. The electrodes in this wiring pattern and the electrodes of the driver circuit are electrically connected.

  An ACF is used for electrical connection between the driver circuit and the liquid crystal panel substrate and between the driver circuit and the printed circuit board. The ACF is obtained by uniformly dispersing minute conductive particles in an adhesive binder resin, and the electrodes are electrically connected through the conductive particles by thermocompression bonding of the ACF. Then, the binder resin is cured by heating, and the driver circuit is fixed to the liquid crystal panel or the printed circuit board.

  When a driver circuit is mounted on a liquid crystal panel by the TAB method, an ACF is attached to a portion where a wiring pattern is provided on a substrate of the liquid crystal panel, and a TCP (Tape Carrier Package) as a driver circuit is mounted on the substrate. Since ACF is an adhesive substance, it is laminated on the backing tape via a release layer, thereby constituting an ACF tape. Therefore, with the ACF tape pressed against the substrate, only the mount tape is peeled off and the ACF is attached to the substrate.

  When the ACF is attached to the substrate, the ACF is not always attached at an appropriate position. Usually, temporary press-bonding is performed, and after the driver circuit is mounted, press-bonding is performed in a heated state and bonded to thermally cure the binder resin. Therefore, it is desirable to inspect whether the ACF is properly attached while the ACF and the substrate are temporarily bonded.

Patent Document 1 discloses a technique for inspecting the ACF attachment state. In Patent Document 1, the difference between the imaging pattern of the electrode part to which the tape member is properly attached and the imaging pattern of the electrode part before the tape member is attached is stored as a reference pattern, and the tape member is newly attached. The difference between the imaging pattern of the substrate and the imaging pattern of the electrode part before the tape member is affixed is obtained, the pattern of the difference is compared with the reference pattern, and the matching rate is calculated by pattern comparison to determine whether the product is good or not Discrimination from non-defective products is performed.
JP 2003-142900 A

  When the ACF is pasted on the substrate, as disclosed in Patent Document 1, batch pasting that is continuously pasted over the entire length of one side of the substrate and division in which the ACF is pasted separately for each electrode group There is paste. The minute pitch electrodes formed on the substrate form one group as a predetermined number of electrode groups for each driver circuit, and each electrode group has a blank region between adjacent electrode groups. . Since it is not necessary to paste the ACF in the blank area, it is possible to prevent the material from being wasted by adopting the division pasting in which the ACF is not stuck in the unnecessary blank area, and the ACF is added to the blank area. By exposing the adhesive resin and the conductive particles to be configured, it is possible to avoid inconvenience for processing and processing after the driver circuit is mounted.

  Whether it is batch pasting or split pasting, after performing the inspection of the ACF pasting state, if the pasting state is not good after the ACF pasting state inspection, the ACF is peeled off. , You have to re-paste. However, in the case of batch bonding, since it is one long ACF over the entire length of the substrate, even if the pasting state of only a part of this ACF is not good, the entire long ACF is removed. Must be peeled off. In this case, a complicated mechanism is required to peel off the ACF over the entire length of the substrate, and the entire ACF over the entire length of the substrate has to be peeled because of the poor pasting condition of a small part. , Waste of ACF material is caused. On the other hand, in the case of split pasting, the total length is very short compared to the batch pasting ACF, so the mechanism for peeling is not so complicated, and only the ACF that needs to be peeled is peeled off. It is possible to suppress the waste of the material.

  When an ACF that needs to be reattached is detected, the liquid crystal panel is once discharged from the line, the ACF reattachment operation is performed, and the ACF is returned to the line again. Since these operations are performed by an operator, intervention of the operator is required. And since each operation | work is performed by an operator, there exists a problem that the work efficiency as a whole falls.

  Therefore, an object of the present invention is to automatically perform an operation of performing ACF divisional pasting and reattaching only an ACF that needs to be pasted again.

The ACF adhering apparatus according to claim 1 of the present invention is for individually attaching ACF for each electrode group from an ACF tape in which ACF is attached to a mount tape to a substrate on which a plurality of electrodes are formed as a group. the ACF toward the tape on the substrate provided with a lifting drivable crimping head so as to press, the arrangement direction and parallel to movable ACF joining means of the electrode group of the substrate, affixed before Symbol substrate In order to peel the ACF from the substrate , a peeling member having a pressing member that can be driven up and down to press the peeling tape toward the substrate, and movable in parallel with the arrangement direction of the electrode group of the substrate ; of the ACF attached on the substrate, joining state is bad, consists of a inspection means you detect and reattachment requires ACF, determine that it is necessary to reattachment of ACF at the inspection means Is when was the characterized the peeling tape is peeled off by pressing the said ACF joining reattachment lines Ukoto again ACF by a means to a position of the exfoliated ACF of the release means on the reattachment requires ACF It is said.

  According to the ACF adhering device of claim 1, in the case of performing the division adhering in which the ACF is individually applied, the control device controls the ACF adhering unit, the inspection unit, and the peeling unit, so that reapplying is necessary. ACF can be automatically detected, and peeling and reattaching can be performed automatically. For this reason, work efficiency does not fall without an operator intervening. In addition, because it is divided and pasted, the mechanism is not complicated, and only the necessary ACF is re-applied, so that waste of material caused by peeling off the ACF that does not need to be re-applied is suppressed. can do.

  Here, with regard to the poor attachment of the ACF to the substrate, it is determined that the attachment is defective when the ACF is not attached to the substrate, when the ACF is turned over to the substrate, or when it is floating. be able to. Of these poor attachments, if the ACF is not attached to the substrate, it will of course require reattachment. In addition, when turning-up occurs, if the final pressure bonding is performed while turning up, the ACF attaching region becomes insufficient or the thickness of the ACF becomes non-uniform, so that the ACF needs to be attached again.

  An alignment mark for aligning the driver circuit is provided for each electrode group on the substrate constituting the liquid crystal panel, and the alignment mark is provided at a position close to the end of the ACF. Therefore, if the ACF at this portion is floating from the substrate, the alignment mark may be erroneously detected, resulting in a large shift in the relative positional relationship between the driver circuit and the liquid crystal panel. For this reason, when the float generated in the ACF is an end portion, particularly when the vicinity of the alignment mark is lifted, it is necessary to reattach the ACF. However, even if there is a float at a portion other than the end portion of the ACF, the ACF is temporarily bonded to the substrate and then finally pressed, so that the floating portion is generated at a portion other than the end portion of the ACF at the time of temporary press bonding. However, since it is finally pressure-bonded later, there is no need to re-paste.

  Therefore, even if the pasting state is not good, it is not necessary to re-paste everything, but the re-paste work is performed only when it is necessary to re-paste, thereby improving processing efficiency, waste of ACF, and complexity of the mechanism. Can be avoided.

The ACF adhering apparatus according to claim 2 of the present invention is the ACF adhering apparatus according to claim 1, wherein the ACF adhering means further includes an ACF tape supplying means for sending out the ACF tape, and the table sent out from the ACF tape supplying means. paper tape to have continuity, and half-cut means for cutting the ACF for each length fraction pasted to each of the electrode groups of the substrate, and having.

  By applying the ACF sticking apparatus as in claim 2, the ACF can be divided and stuck individually. In addition, after the ACF that needs to be reattached is peeled off, by applying this ACF attaching device, it becomes possible to attach the ACF to only the necessary portions individually.

  The ACF adhering apparatus according to claim 3 of the present invention is the ACF adhering apparatus according to claim 1, wherein the inspection means includes imaging means for photographing both end portions of the ACF attached to the substrate, and a reference ACF. And determining means for determining a pasting state by performing pattern matching between an image and an ACF image photographed by the photographing means.

  In order to inspect the attachment state of the ACF, an inspection means as in claim 3 can be applied. In this case, an ACF image in a good affixed state is acquired and stored as a reference image in advance, and pattern inspection is performed by pattern matching between the ACF image captured by the imaging unit and the reference ACF image. can do. When performing pattern matching, even if the two images do not completely match, it can be determined that re-pasting is not required if the difference between the two images is within an allowable range.

  Here, in each ACF, it is not necessary to acquire an image of the entire length of the ACF attachment region, and only the both end portions need be acquired. In other words, images need not be acquired for intermediate portions other than both end portions. As described above, it is determined that re-sticking is necessary because the end portion is lifted or turned up. Therefore, since the image area to be acquired need only be at both ends of the ACF, it is not necessary to make the photographing means wide. For this reason, since the acquired image data can be very small, the image processing when performing pattern matching can be performed at high speed, and the processing efficiency can be improved. Moreover, since the image data to be acquired is very small, it is possible to perform high-precision image processing.

The ACF sticking apparatus according to claim 4 of the present invention is the ACF sticking apparatus according to claim 1, wherein the peeling means has a peeling tape supply means for sending out a peeling tape having higher adhesiveness to the ACF than the substrate. is intended, the pressing member, the peeling tape fed from the peeling tape feeding means, is characterized in that for pressing the ACF affixed to the substrate.

  In order to peel off the ACF that needs to be reattached, a peeling means as in claim 4 can be applied. Since the ACF is attached to the substrate due to adhesiveness, the ACF can be peeled off by using a release tape having higher adhesiveness than the substrate. In order to peel off a plurality of ACFs, a peeling tape supply means is provided, and the peeling tape is continuously fed out to sequentially peel off the ACFs. At this time, the binder resin or the like slightly remains in the part of the ACF peeled off from the substrate. However, since the ACF is reattached to this part later, no particular problem is caused. Further, if the release tape of claim 4 is impregnated with a solvent such as IPA (isopropyl alcohol), the ACF can be more efficiently peeled off.

The ACF bonding apparatus according to claim 5 of the present invention is the ACF bonding apparatus according to claim 1, wherein the ACF bonding means and the peeling means are arranged on the electrode group of the substrate so as not to interfere with each other by the same driving means. The ACF adhering device according to claim 6 of the present invention is characterized in that the ACF adhering device according to claim 6 is a ball, wherein the ACF adhering means and the peeling means are balls. It is characterized in that each screw feed means is mounted via a clutch. Furthermore, the manufacturing apparatus of a flat display The display of Claim 7 of the present invention, that has an ACF application device according to any one of claims 1 to 6.

  The present invention can automatically detect an ACF that needs to be reattached and perform reattachment automatically when performing ACF divisional attachment. It is possible to improve the work efficiency by automatically performing the ACF reattaching operation without an operator, and to prevent the ACF material from being wasted by performing the division attaching. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a liquid crystal panel constituting a liquid crystal display as an example of a flat panel display, and a driver circuit made of TCP mounted on a substrate as a TAB as an example of a semiconductor circuit mounted via an ACF. The substrate may be a printed circuit board or the like as well as a liquid crystal panel, and the board mounted on the board is not limited to the driver circuit and is electrically connected via the ACF. I just need it.

  In FIG. 1, a liquid crystal panel 1 includes a lower substrate 2 and an upper substrate 3 such as a glass substrate. The lower substrate 2 has a protruding portion 2a that protrudes from the upper substrate 3 by a predetermined width on at least two sides, and a plurality of driver circuits 4 are mounted on the protruding portion 2a. The driver circuit 4 is configured by mounting an integrated circuit element 4b on a film substrate 4a.

  A predetermined number of electrodes connected to the TFT circuit form a group on the projecting portion 2 a of the lower substrate 2 to form an electrode group 5, and alignment marks 6 are formed on the left and right sides of the electrode group 5. A plurality of electrode groups 5 are formed on the projecting portion 2 a, and each electrode group 5 is formed with a blank area having a predetermined width between the adjacent electrode groups 5. In the driver circuit 4, an electrode group 7 composed of a plurality of electrodes electrically connected to the electrode group 5 on the substrate side is formed, and alignment marks 8 are formed on the left and right sides of the electrode group 7. Yes. Using the alignment mark 8 of the driver circuit 4 and the alignment mark 6 of the overhang portion 2a as a reference, alignment is performed so that the electrodes of the electrode group 5 and the electrode group 7 coincide with each other.

  The driver circuit 4 is mounted on the liquid crystal panel 1 via the ACF 9. As is well known, the ACF 9 is obtained by dispersing many conductive particles in a binder resin having an adhesive function, and heats and pressurizes the ACF 9 between the driver circuit 4 and the liquid crystal panel 1. As a result, the electrodes constituting the electrode group 5 and the electrodes constituting the electrode group 7 are electrically connected to each other through the conductive particles, and the binder resin is thermally cured, whereby the driver circuit 4 is changed to the liquid crystal panel. 1 is fixed. Here, the ACF 9 is divided for each position of the electrode group 5 provided on the projecting portion 2a of the lower substrate 2, and is attached every length L. As a result, the ACF 9 can be used without waste, and the attached ACF 9 is almost completely covered by the driver circuit 4.

  FIG. 2 shows a schematic configuration of the ACF sticking apparatus of the present invention. The ACF sticking device is mainly configured by mainly including a sticking device 10U as an ACF sticking means, an inspection device 60U as an inspection means, a peeling device 70U as a peeling means, and a control device 80U as a control means. The The control device 80U is shown in FIG.

  The pasting apparatus 10U will be described with reference to FIGS. 3 and 4. The affixing device 10U includes a support member 10, a supply reel 11, a mount tape 12, an ACF tape 13, rollers 14 to 17, a driving roller 18, a discharge unit 19, a swing arm 20, and a rotating shaft 21, and is schematically configured. Is done. The support member 10 is a support member on which a unit for attaching the ACF 9 to the liquid crystal panel 1 is mounted. A supply reel 11 is detachably mounted on the support member 10. The ACF 9 is laminated on the release layer of the mount tape 12 to form an ACF tape 13, and the ACF tape 13 is wound around the supply reel 11. The ACF tape 13 is travel-guided along a travel path composed of rollers 14 to 17 attached to the support member 10. The driving roller 18 sandwiches the mount tape 12 after the ACF 9 is attached to the liquid crystal panel 1 and drives it so as to be fed into the discharge unit 19.

  The rollers 14 and 15 are guide rollers for the feeder of the ACF tape 13, and the guide roller 15 is attached to the swing arm 20. Further, the swing arm 20 swings about the rotation shaft 21. A driving means (not shown) composed of a motor or the like is connected to the rotating shaft 21, and the swing arm 20 is swung in the direction of arrow F, so that at least one pasting (length L) from the supply reel 11 is performed. The ACF tape 13 is fed out and supplied between the rollers 14 and 15. As a result, the reaction force acting when the ACF tape 13 is fed is always constant, and the resistance to the feeding force does not fluctuate due to the difference in the amount of winding of the supply reel 11.

  As shown in FIGS. 5 and 6, the rollers 16 and 17 guide the ACF tape 13 in the horizontal direction in the travel route, and define the length of the ACF 9 attached to the liquid crystal panel 1 for one time. It is a horizontal guide roller. The horizontal guide roller 17 defines the ACF 9 pasting start position, and the horizontal guide roller 16 defines the ACF 9 pasting end position. By these, the ACF 9 pasting area is set. The horizontal guide rollers 16 and 17 are formed by forming flanges 16b and 17b on both sides of the cylindrical parts 16a and 17a. The heights of the portions protruding from the cylindrical parts 16a and 17a of the flanges 16b and 17b are the same as those of the ACF tape 13. The dimensions are almost the same as or slightly larger than the thickness of the mount tape 12.

  Accordingly, the ACF 9 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16 and 17, separated from the mount tape 12, and the mount tape 12 after the ACF 9 is peeled off at a position downstream of the horizontal guide roller 17. Collected. A driving roller 18 is provided at a position downstream of the ACF 9 application region defined by the horizontal guide rollers 16 and 17. The driving roller 18 includes a driving roller 18a and a pinch roller 18b, and the mount tape 12 is sandwiched between the driving roller 18a and the pinch roller 18b. Then, the ACF tape 13 is pitch-fed every length L by rotationally driving the drive roller 18a.

  As shown in FIG. 4, the support member 10 is attached to the elevating drive unit 22. The elevating drive unit 22 is attached to the front / rear drive unit 23, and the front / rear drive unit 23 is attached to the parallel drive unit 24. By these mechanisms, the ACF 9 application area defined by the horizontal guide rollers 16 and 17 in the routing path of the ACF tape 13 is set in the horizontal direction in the X-axis direction (the direction orthogonal to the arrangement of the electrode groups 5 to which the ACF 9 is applied). ) And the Y-axis direction (alignment direction of the electrode group 5). The liquid crystal panel 1 is placed on a fixed table 25 and fixedly held by means such as vacuum suction. Here, the front / rear drive unit 23 moves the pasting area in the direction of approaching / separating from the liquid crystal panel 1, and the parallel drive unit 24 of the electrode group 5 to which the ACF 9 is pasted in the liquid crystal panel 1. The pasting area is moved in a direction parallel to the arrangement direction, that is, in the X-axis direction.

  The raising / lowering drive part 22 has the inclination block 30 and the cylinder 31 in order to move this inclination block 30 to the front-back direction. The support member 10 is connected to a slide member 32 that engages with the inclined surface of the inclined block 30. The slide member 32 has an inclined surface that coincides with the inclined block 30, and is configured such that it cannot be displaced except by the restricting member 33 in the vertical direction. Accordingly, by driving the cylinder 31, the support member 10 is displaced in the vertical direction. Here, a motor may be used in place of the cylinder 31.

  The front / rear drive unit 23 is for moving the pedestal 34 on which the inclined block 30 is mounted back and forth. The pedestal 34 and its driving means 35 are attached to the conveying means 36. The conveying means 36 can move the entire attaching device 10U in parallel with the arrangement direction of the electrode group 5 in the liquid crystal panel 1 by rotating the ball screw 37 constituting the ball screw feeding means by driving a motor (not shown). ing. The fixed table 25 is provided with an XY direction moving mechanism for transferring the liquid crystal panel 1 between the pre-process and the post-process, a position adjustment unit in the horizontal rotation direction, an adjustment unit in the tilt direction, and the like. You can also.

  In the travel path of the ACF tape 13 attached to the support member 10, as shown in FIGS. 7 and 8, a cutter unit 40 as a half-cut means is provided at a position slightly downstream from the position of the horizontal guide roller 16. The cutter unit 40 is attached to the surface of the support member 10 so as to be movable in the front-rear direction. The cutter unit 40 has a cutter 41 and a cutter receiver 42, and the cutter 41 is rotatable about a shaft 43 in a direction approaching / separating from the cutter receiver 42 as indicated by an arrow in the figure. . Then, the spring 41 is normally held away from the cutter receiver 42 by the urging force of the spring 44 acting on the cutter 41, and the cutter 41 is held in a direction against the spring 44 by the pushing roller 46 provided in the cylinder 45. It is pushed and displaced in a direction close to the cutter receiver 42. Then, at the position where the cutter 41 is closest to the cutter receiver 42, an interval that is the same as or slightly shorter than the thickness of the mount tape 12 of the ACF tape 13 is formed therebetween. Thereby, only ACF9 can be half-cut.

  In order to attach the ACF 9 to the overhanging portion 2 a of the lower substrate 2, the ACF tape 13 is pressed from above with a predetermined pressure by the pressure-bonding head 47 at a position between the horizontal guide rollers 16 and 17. Yes. The pressure-bonding head 47 is mounted on the support member 10 so as to be moved up and down by a vertical driving means 48, and a predetermined pressure is applied to the ACF tape 13 against the liquid crystal panel 1 by the vertical driving means 48. Further, the pressure-bonding head 47 is provided with heating means such as a heater (not shown), and the pressure-bonding head 47 heat-bonds the ACF tape 13 to the liquid crystal panel 1. However, the degree of heating is relatively low enough to soften the binder resin of ACF9. The crimping head 47 has a width dimension that can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has a length for attaching the ACF 9. When the ACF tape 13 is crimped to the liquid crystal panel 1 by the crimping head 47, a pedestal 49 is provided to support the crimping region of the liquid crystal panel 1 from below.

  As described above, the affixing unit constituting the ACF affixing device on the support member 10, that is, the supply reel 11, the travel path of the ACF tape 13 supplied from the supply reel 11, the cutter unit 40 constituting the half-cut means, and the crimping head. 47 is attached.

  Next, the inspection device 60U will be described. Returning to FIG. 2, the inspection device 60 </ b> U mainly includes an illumination light source 61, a television camera 62, and a determination device 63. The illumination light source 61 is a light source for supplying illumination light to the ACF 9, and the television camera 62 is an image capturing unit for capturing an attached state of the ACF 9. However, although the television camera 62 may acquire the entire image of the ACF 9, it acquires images only at both ends of the ACF 9 in order to improve processing efficiency and perform high-precision image processing. The determination device 63 stores in advance images (reference images) of both end portions of the ACF 9 that are well pasted, and performs a comparison determination between the captured image of the ACF 9 and the reference image. In addition, a guide member 64 and a ball screw feeding means 65 are provided to enable the inspection device 60U to move in parallel with the traveling direction of the parallel drive unit 24. The reference image preferably includes not only both end portions of the ACF 9 but also an image of the alignment mark 6 provided in the vicinity thereof.

  Pattern matching can be applied as an example of a method for comparing images. By comparing the two images by pattern matching, if the predetermined error amount is not exceeded, it can be determined that the ACF attachment state is good, and if it exceeds, it can be determined that reattachment is required. it can. As shown in FIG. 2, the inspection device 60U may operate separately and independently with respect to the pasting device 10U, or may operate integrally.

  The peeling device 70U will be described with reference to FIGS. The peeling device 70U includes a peeling tape 71, an air cylinder 72, a pressing member 73, a tape supply reel 74, a tape collection reel 75, and a drive unit 76, and is roughly configured. The peeling tape 71 is a cloth tape suitable for wiping off the adhesive, and the wiping surface is pressed against the ACF 9 to perform peeling by the action of the adhesive force of the ACF 9. For this reason, it is assumed that the release tape 71 has higher affinity for the adhesive force of the ACF 9 than the lower substrate 2. The air cylinder 72 is a cylinder for applying a pressing force for pressing the pressing member 73 against the ACF 9. The pressing member 73 is a member for pressing the peeling tape 71. The tape supply reel 74 is a supply reel for supplying the peeling tape 71, and the tape collection reel 75 is a collection reel for collecting the peeling tape 71. The drive unit 76 is a drive unit for supplying power for rotating the tape collection reel 75.

  From the tape supply reel 74, the peeling tape 71 can be sent out by one pitch (substantially corresponding to the length L in FIG. 1). The peeling tape 71 peels off one ACF 9, and the next ACF 9 Is peeled off from the tape supply reel 74 by one pitch of the peeling tape 71. For this reason, the tape collection reel 75 is controlled so that the driving unit 76 winds up the peeling tape 71 for one pitch, and the peeling tape 71 for one pitch is sent out.

  As described above, the affixing device 10 </ b> U is movable in parallel with the arrangement direction of the electrode group 5 by rotating the ball screw 37 and moving the conveying means 36. Similarly, in order to adopt a configuration in which the peeling device 70U is movable in the same direction as the pasting device 10U, a configuration in which the entire peeling device 70U is movable along the ball screw 37 is adopted. At this time, the peeling device 70U and the pasting device 10U can be moved by separate ball screws, but in order to avoid complication of the device and mechanism, as shown in FIG. 10, the peeling device 70U and the pasting device 10U. The ball screw 37 is preferably shared.

  Since the peeling device 70U and the pasting device 10U share the ball screw 37, it is necessary to prevent the operations from interfering with each other. For this reason, for example, the clutch mechanisms 10C and 70C are provided in the peeling device 70U and the pasting device 10U. When the affixing device 10U operates to apply the ACF 9, the clutch mechanism 10C of the affixing device 10U is in an activated state, and the clutch mechanism 70C of the peeling device 70U is in a released state. Thereby, only the sticking apparatus 10U moves and the peeling apparatus 70U does not move. On the other hand, when the peeling device 70U operates to peel the ACF 9, the clutch mechanism 70C of the peeling device 70U is activated and the clutch mechanism 10C of the pasting device 10U is released. Thereby, only the peeling apparatus 70U moves and the sticking apparatus 10U does not move. By adopting such a mechanism, interference between the pasting device 10U and the peeling device 70U can be avoided.

  The control device 80U will be described. Since control device 80U shown in Drawing 4 controls sticking device 10U, inspection device 60U, and peeling device 70U, control device 80U is connected to sticking device 10U, inspection device 60U, and peeling device 70U. In order for the control device 80U to control each device, a configuration in which bidirectional (or unidirectional) signal input / output is possible between the control device 80U and each device is adopted.

  Hereinafter, the operations of attaching, inspecting, peeling, and reattaching the ACF 9 will be described. First, the ACF 9 attaching operation will be described. As shown in FIG. 8, the ACF tape 13 is half-cut. At this time, the elevating drive unit 22 holds the support member 10 in the raised position, and the half-cut ACF 9 is disposed on the electrode group 5 in the liquid crystal panel 1 installed on the fixed table 25. To do. Thus, when the ACF tape 13 is half-cut, the half-cut position is the pasting end position, and the end where the previous ACF 9 is pasted is the pasting start end position. The horizontal guide roller 17 is disposed at the pasting start position, and the horizontal guide roller 16 is disposed at the pasting end position. From this state, the elevating drive unit 22 is operated to lower the support member 10 as shown in FIG. The lowermost position of the support member 10 is such that the surface of the ACF 9 of the ACF tape 13 positioned between the horizontal guide rollers 16 and 17 faces the protruding portion 2a of the lower substrate 2 of the liquid crystal panel 1 in a non-contact state with a slight gap. .

  Therefore, as shown in FIG. 12, the pressure-bonding head 47 is lowered and the ACF tape 13 is pressure-bonded to the lower substrate. At the time of crimping, a predetermined load set by the vertical driving means 48 is applied to the ACF tape 13, and an equal pressing force is applied between the start position of the ACF tape 13 and the end position, and half cut is performed. The pressure applied by the pressure-bonding head 47 is prevented from acting on the base end side from the pasting end position. At this time, at least the lower surface of the projecting portion 2 a on the lower substrate 2 of the liquid crystal panel 1 is in contact with the pedestal 49 at a position where the ACF 9 is attached.

  When the ACF 9 is pressure-bonded to the lower substrate 2, the pressure-bonding head 47 is raised as shown in FIG. 13 to release the pressure applied to the ACF tape 13. The ACF 9 is affixed to the lower substrate 2, and the mount tape 12 is still laminated on the ACF 9. Accordingly, in order to prevent the ACF 9 from lifting when the mount tape 12 is peeled off, after the crimping is finished and the crimping head 47 is separated from the ACF tape 13, as shown in FIGS. The drive part 22 is operated and the support member 10 is raised. At this time, if the front / rear drive unit 23 is also driven together with the lifting / lowering drive unit 22 and is operated to be lifted obliquely upward in the width direction of the ACF tape 13, the mount tape 12 is peeled off from the ACF 9. The At this time, the mount tape 12 was in close contact with and integrated with the ACF 9, and thus, when peeling, a part of the ACF 9 may be lifted or turned up.

  As described above, the attachment of the ACF 9 to one electrode group 5 in the projecting portion 2a of the lower substrate 2 is completed. The supporting member 10 is held at the raised position, the driving roller 18 is operated, and the ACF tape 13 is pulled out from the supply reel 11 and fed by one pitch. And the parallel drive part 24 is operated and the sticking apparatus 10U whole is moved 1 pitch. As shown in FIG. 1, this one pitch is a distance P between the front and rear attachment positions of the ACF 9. Accordingly, the operation of attaching the ACF 9 to the next electrode group 5 is performed by the operation of the parallel drive unit 24. On the other hand, the fixed table 25 that holds the liquid crystal panel 1 does not move. Then, the ACF 9 is sequentially attached to the electrode group 5 by repeating the same operation as described above.

  When the pasting device 10U completes the pasting operation of all the ACFs 9, the pasting device 10U is moved to the end position of the ball screw 37, the clutch mechanism 10C is released, and the operation of the pasting device 10U is stopped.

  Every time when the attachment of one ACF 9 is completed, or after the division and attachment of the ACF 9 to several electrode groups 5 is completed, an inspection of the attachment state of the ACF 9 is performed. Therefore, when the pasting operation of the ACF 9 is finished, the pasting device 10U outputs a signal to that effect to the control device 80U, and the control device 80U sends the signal of the ACF 9 to the inspection device 60U when this signal is input. Outputs a command to check the pasting status. It should be noted that, instead of performing an inspection of the pasting state after the pasting operation of the ACF 9, it is possible to inspect the pasting state by overlapping the pasting operation. When the inspection device 60U as described above operates integrally with the pasting device 10U, since the inspection is performed immediately after the pasting operation is completed, it is easy to overlap the two operations.

  The inspection device 60U starts inspection of the ACF 9 attachment state based on a command from the control device 80U. The television camera 62 is moved one pitch at a time along the guide member 64 by the ball feed screw means 65 to acquire images of both end portions of the ACF 9 in each electrode group 5. The acquired image is output to the determination device 63, and the determination device 63 determines whether the pasted state is good or not by comparing with a reference image stored in advance. As shown in FIG. 16, the acquired image is limited to both end portions of the ACF 9 (limited to the broken line portion in the figure), so the amount of image data is small, and image processing by pattern matching is performed at high speed. This can be done and the processing efficiency is improved. In addition, since the amount of data is small, it is possible to perform image processing with high accuracy. At this time, even if the images do not completely match, it may be determined that the images are good and the ACF 9 does not need to be reattached if the difference between the images is within a certain range. On the other hand, if the difference between the two images exceeds a certain range, it is determined that the ACF 9 has caused a sticking failure.

  Here, although the ACF 9 may float at portions other than both ends, as described above, the lift generated at this portion does not need to be reattached even if it is determined that the attachment is poor. Here, since the TV camera 62 has photographed both end portions of the ACF 9 and has detected whether or not floating or turning has occurred in these portions, even if the other portions have floating, It is not determined that ACF 9 needs to be reattached. Here, when the ACF 9 is partially separated from the lower substrate 2, it can be determined as “floating”, and when a part of the ACF 9 is inverted, it can be determined as “turned up”.

  As the television camera 62 is moved, the ACF 9 is inspected for all the electrode groups 5. By this inspection, it is possible to acquire information as to whether or not reattachment is required for each ACF 9, and this information is output from the determination device 63 of the inspection device 60U to the control device 80U. At this time, not only information on whether or not re-sticking is required, but also information on the position of the ACF 9 that needs to be re-attached is output to the control device 80U. Note that the determination device 63 may be provided in the control device 80U. In this case, whether the captured images of the ACF 9 are sequentially output to the control device 80U, and re-sticking is required in the determination device in the control device 80U. It is determined whether or not.

  Next, in order to perform the re-sticking operation of the ACF 9, the ACF 9 that requires re-sticking is peeled off. For this reason, the control device 80U controls the peeling device 70U so as to peel off the ACF 9 that is not in a good adhesion state. At this time, the control device 80U outputs information about the ACF 9 that needs to be reattached and its location to the peeling device 70U. The peeling device 70U moves to the location of the ACF 9 to be peeled when the ball screw 37 is rotationally driven.

  Here, in order for the peeling device 70U to move, the clutch mechanism 70C of the peeling device 70U is put into an operating state. At this time, since the clutch mechanism 10C is released at the terminal position, the pasting device 10U does not operate and the pasting device 10U and the peeling device 70U do not interfere with each other. In this state, the peeling device 70U is moved to lower the pressing member 73 attached to the tip of the air cylinder 72 as shown in FIG. When the pressing member 73 is lowered, the peeling tape 71 is also lowered. Then, as shown in FIG. 18, the pressing member 73 is pressed against the lower substrate 2 so as to be pressed, whereby the peeling tape 71 is completely adhered to the ACF 9 to be peeled.

  In this state, as shown in FIG. 19, the pressing member 73 is raised by the operation of the air cylinder 72 to release the applied pressure. As the pressing member 73 rises, the peeling tape 71 also rises, so that the ACF 9 that is in close contact with the peeling tape 71 is peeled from the lower substrate 2. Thereby, ACF9 used as the object of peeling can be peeled.

  When another ACF 9 is peeled off, the peeling device 70U moves to the position of the ACF 9 to be reattached, and similarly, the peeling tape 71 is pressed against the ACF 9 to peel off the ACF 9. At this time, in order to peel off another ACF 9, the tape is fed by the tape supply reel 74 and the tape collection reel 75, and another ACF 9 is peeled off at a new portion of the peeling tape 71.

  When the peeling of all ACFs 9 to be peeled is completed, the peeling device 70U is moved to the terminal position opposite to the terminal position where the pasting device 10U is waiting, and the clutch mechanism 70C is released at that position. , Put it in a standby state. Thereby, even if the sticking apparatus 10U moves next, it does not interfere with the peeling apparatus 70U.

  Here, a slight amount of adhesive or the like remains on the portion of the lower substrate 2 where the ACF 9 has been peeled off by the peeling device 70U. For this reason, the residue must be removed neatly. However, since the ACF 9 is re-applied to this portion, even if some sticky matter remains, there is no particular problem. Further, when the peeling device 70U peels off the ACF 9, since the ACF 9 is in a temporarily press-bonded state, the ACF 9 can be easily peeled off.

  Next, a new ACF 9 is attached to the part of the ACF 9 that has been peeled off. This pasting operation is performed by the pasting apparatus 10U. For this reason, a signal indicating that all the ACFs 9 to be peeled are peeled off is output from the peeling device 70U to the control device 80U, and the control device 80U that has input this signal becomes a target to be pasted on the pasting device 10U. Control to re-attach the ACF 9 is performed. At this time, the affixing device 10U makes the clutch mechanism 10C active again to make it movable. The pasting device 10U moves to the pasting position of the ACF 9 in accordance with a signal from the control device 80U. In the above-described pasting operation, the pasting apparatus 10U is moved by one pitch in order to divide and paste all the ACFs 9, but in the pasting operation, the pasting operation of the ACF 9 is performed only at the peeled site. Therefore, the pasting device 10U is directly fed by the parallel drive unit 24 until the target site is reached.

  For this reason, the control device 80U outputs information for specifying the ACF 9 to be reapplied (that is, information on the peeled ACF 9) to the parallel drive unit 24 of the application device 10U, and the parallel drive unit 24 outputs this information. Based on the above, the pasting apparatus 10U is moved. Then, as described above, the ACF tape 13 is supplied, the ACF 9 is half-cut, and the cut ACF 9 is pressure-bonded to the liquid crystal panel 1. Thereby, the ACF 9 can be reattached.

  When the reattachment of all the ACFs 9 is completed, the attaching device 10U moves again to the end position, releases the clutch mechanism 10C at that position, and puts it in a standby state. The resticking operation is performed as described above, and all operations for one liquid crystal panel 1 are completed. Then, when the next processing of the liquid crystal panel 1 is performed, the clutch mechanism 10C is again activated and the ACFs 9 are divided and pasted one by one.

  All of the above operations are performed by the control device 80U, so that the ACF 9 that needs to be automatically reattached can be identified and reattached without requiring operator intervention.

It is a principal part schematic diagram which shows the liquid crystal cell as a board | substrate with which ACF is affixed, and the driver circuit mounted in this board | substrate. It is a schematic block diagram of an ACF sticking apparatus. It is a front view which shows the external appearance structure of a sticking apparatus. FIG. 4 is a left side view of FIG. 3. It is a structure explanatory drawing of a horizontal feed roller. It is AA sectional drawing of FIG. It is a structure explanatory view of a cutter unit. It is explanatory drawing which shows a half cut process. It is a left view of a peeling apparatus. It is a top view for demonstrating operation | movement with a sticking apparatus and a peeling apparatus. It is explanatory drawing which shows an ACF tape descending state. It is explanatory drawing which shows the downward state of a crimping | compression-bonding head. It is explanatory drawing which shows the raising state of a crimping | compression-bonding block. It is explanatory drawing of the operation | movement which peels from the ACF of a mount tape. It is BB sectional drawing of FIG. It is explanatory drawing which shows the test | inspection of the both ends of ACF. It is explanatory drawing which shows the state which pushes down a peeling tape. It is explanatory drawing which shows the descent | fall state of a press member. It is explanatory drawing which shows the raising state of a pressing member and a peeling tape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 5 Electrode group 10U Pasting apparatus 62 Television camera 60U Inspection apparatus 63 Judgment apparatus 70U Peeling apparatus 80U Control apparatus

Claims (7)

In order to individually attach the ACF for each electrode group from the ACF tape on which the ACF is attached to the mount tape to a substrate on which a plurality of electrodes are formed as a group ,
An ACF adhering means comprising a crimping head that can be driven up and down to press the ACF tape toward the substrate, and movable in parallel with the arrangement direction of the electrode group of the substrate ;
To peel the pasted ACF before Symbol substrate from the substrate, the release tape has a lift drivable pressing member so as to press toward the substrate, parallel to the arrangement direction of the electrode group of the substrate and peeling means capable of moving in,
Of the ACF attached on the substrate, a paste state is bad, consists of a inspection means that detect the required ACF and reattached,
When it is determined by the inspection means that the ACF needs to be re-attached, the peeling tape of the peeling means is pressed onto the ACF that needs to be re-attached and peeled off, and the ACF is placed at the position of the peeled ACF. ACF application device according to claim <br/> that intends rows reattachment of ACF again joining means. The ACF adhering means further includes a length for adhering the ACF to each electrode group of the substrate by providing the ACF tape supplying means for sending out the ACF tape and the mount tape delivered from the ACF tape supplying means with continuity. The ACF adhering device according to claim 1 , further comprising half-cutting means for cutting every minute.   The inspection means performs pattern matching between an imaging means for imaging both end portions of the ACF attached to the substrate, a reference ACF image and an ACF image taken by the imaging means, and the pasting state is determined. The ACF pasting apparatus according to claim 1, further comprising a judging unit that judges. The peeling means has a peeling tape supply means for sending out a peeling tape having higher adhesiveness to the ACF than the substrate , and the pressing member is provided with the peeling tape sent from the peeling tape supply means, 2. The ACF sticking apparatus according to claim 1, wherein the ACF sticking apparatus is pressed against the ACF attached to the substrate. 2. The ACF according to claim 1, wherein the ACF adhering means and the peeling means can be moved in parallel with the arrangement direction of the electrode groups of the substrate so as not to interfere with each other by the same driving means. Pasting device. 6. The ACF sticking apparatus according to claim 5, wherein the ACF sticking means and the peeling means are each mounted on a ball screw feeding means via a clutch. The flat panel display manufacturing apparatus which has an ACF sticking apparatus of any one of Claims 1 thru | or 6 .

Images