JP4370341B2 - ACF pasting device - Google Patents

Description

  In order to mount a semiconductor circuit element such as a driver circuit on a substrate composed of a display panel constituting a flat display device such as a liquid crystal display or a plasma display, the present invention is for attaching an ACF (Anisotropic Conductive Film) to the substrate. The present invention relates to an ACF pasting apparatus and a flat display apparatus including an ACF pasted by the ACF pasting apparatus.

  For example, a liquid crystal display has a configuration in which a printed circuit board is connected via a semiconductor circuit element to a liquid crystal panel composed of two upper and lower transparent substrates in which a liquid crystal sealing space is formed. Here, the semiconductor circuit element is a driver circuit, and this driver circuit includes inner and outer electrodes. The inner electrode is on one substrate constituting the liquid crystal panel, and the outer electrode is Each is electrically connected to the printed circuit board. As a typical driver circuit mounting method, a chip-like IC package is directly mounted on a substrate constituting a liquid crystal panel, and a COG (Chip On Glass) method in which a printed circuit board is connected to the liquid crystal panel; There is a TAB (Tape Automated Bonding) system in which a TCP (Tape Carrier Package) in which a driver circuit is mounted on a film-like substrate is connected to a liquid crystal panel and a printed circuit board.

  In any case, a wiring pattern is formed on at least two sides on the surface of one substrate constituting the liquid crystal panel, and the electrode in the wiring pattern and the inner electrode of the driver circuit are electrically connected. Therefore, although the wiring pattern is formed on the liquid crystal panel at a minute pitch interval, a predetermined number of electrodes are formed as a group for each semiconductor circuit element mounted thereon. Therefore, the liquid crystal panel has a plurality of electrode groups and a blank area between adjacent electrode groups. The driver circuit is also connected to the printed circuit board. Therefore, a plurality of groups of a predetermined number of electrode groups are formed on the printed circuit board side as well as the liquid crystal panel side. Note that the number of wires constituting the electrode group on the printed circuit board side is usually smaller than the number of wires in the electrode group on the liquid crystal panel side.

  When connecting a driver circuit as a semiconductor circuit element to a liquid crystal panel or a printed circuit board, a large number of electrodes arranged at a minute interval are securely electrically connected and the driver circuit is fixed. Must. For this purpose, ACF is used. ACF is obtained by uniformly dispersing minute conductive particles in an adhesive binder resin. By thermocompression bonding the ACF, electrodes are electrically connected through the conductive particles, and the binder is heated by heating. The resin is cured and the driver circuit is fixed to the liquid crystal panel or the printed circuit board.

  Therefore, for example, an ACF is attached to a portion of the one substrate of the liquid crystal panel where the wiring pattern is provided, and a TCP as a driver circuit is mounted on the TAB on this substrate. Since ACF is an adhesive substance, it is laminated on the backing tape via a release layer, thereby constituting an ACF tape. The ACF tape is wound around a supply reel, sent out from the supply reel, and pasted onto the substrate surface using a pasting unit. For this purpose, the pasting unit is provided with a member for mounting the supply reel, and includes a guide roller or the like at an appropriate place for drawing the ACF tape supplied from the supply reel along a predetermined path. A guide member is disposed.

  The ACF is attached to the substrate by batch attachment that is continuously attached over the entire length of one side of the substrate, divided attachment for each electrode group, and attachment so that the ACF is not attached to the blank area. There is. In the case of batch pasting, the ACF is also pasted to unnecessary blank areas, so that the material is wasted. In the blank area, the adhesive resin and the conductive particles constituting the ACF are left exposed. Therefore, inconvenience may occur for processing and processing after mounting the semiconductor circuit element. Therefore, it is preferable to divide and paste.

  For example, Patent Document 1 discloses a method in which ACF is divided and pasted for each electrode group of a substrate. In this Patent Document 1, a plurality of holding parts holding ACF for one pasting length are arranged in the rotation direction of the rotating body, and the length of pasting the ACF tape with the mount tape being bonded is attached. It cut | disconnects for every and is comprised so that a mount tape may be adsorb | sucked to a holding | maintenance part. And this holding | maintenance part is made to contact / separate to a liquid crystal panel by making the shaft provided in the rotary body protrude and retract.

The substrate constituting the liquid crystal panel is moved so that each electrode group is positioned at a predetermined pitch interval so as to sequentially face the rotating body, and the shaft connected to the holding unit is extended to be attracted to the holding unit. A laminated tape of the ACF and the mount tape is pressed against the substrate. Then, the holding tape is held in an adsorbed state by the holding portion, and the shaft is pulled toward the rotating body, whereby the ACF is peeled off from the mounting tape and attached to the substrate.
JP-A-9-83114

  As described above, in Patent Document 1, the ACF attachment unit including the rotating body is fixedly held, and the ACF attachment operation is performed by moving the substrate of the liquid crystal panel in the horizontal direction. Yes. For this reason, the ACF attaching stage requires a space that is twice or more than the size of the electrode group in the arrangement direction. If the size of the substrate increases, a correspondingly large space is required, and there is a problem that the apparatus becomes extremely large.

  The present invention has been made in view of the above points, and an object of the present invention is to reduce the size and the size of the ACF attaching stage.

In order to achieve the above-described object, the present invention divides a plurality of electrodes into a group of electrodes to which a single ACF is attached, and attaches a plurality of electrodes to a substrate on which a plurality of electrodes are formed. An ACF adhering apparatus for setting an attaching area and individually attaching an ACF to each of the attaching areas , wherein the substrate is fixedly mounted on a table provided at a fixed position, and an electrode group of the substrate A support member that moves up and down by a predetermined stroke is attached to the transporting means that can move in the arrangement direction, and a supply reel that feeds an ACF tape in which an ACF is laminated on a release layer of a mount tape is set on the support member, The mounting tape of the ACF tape fed from the supply reel is made continuous, and a half-cut is cut for each length of the ACF attached to each electrode group of the substrate. Means and, this ACF cut by the half-cut unit provided pasting unit comprising a bonding head which is pressed against the surface of the substrate, said transport means, said attachment unit, the attachment region wherein the bonding head is Each position is pitch-fed so that it is positioned, and the crimping head is lowered each time it is positioned in each of the pasting areas, so that the ACF is not stuck to the board, and the head on the table is moved to the board. In order to detect whether or not an ACF is attached to each of the attachment areas, an ACF detection means independent of the transport means and the attachment unit is provided. is there.

Here, when the size of a board | substrate and the size of an ACF sticking mechanism are compared, it is applied when the sticking mechanism is smaller. The size of the pasting mechanism depends on the length of the pasting region composed of the electrode group to which the ACF is pasted, and cannot be smaller than that. Since ACF is affixed a plurality of locations with respect to the substrate, moving the bonding mechanism by the conveying means, by arranging the substrate in a fixed manner, with the configuration of performing paste ACF, than when moving the substrate Thus, the device configuration can be reduced in size and size. Basically, not the size of the substrate, dependent on the 1 unit of the ACF to be pasted thereto. Accordingly, the conveying means is conveyed by a feeding means that can be positioned with high accuracy using a ball screw or the like, and the crimping head is moved while being positioned at a position facing each of the pasting areas, and the ACF is pasted. It will be.

  The ACF tape is fed out from the supply reel, and the ACF is cut by the half-cut means. However, the mount tape is guided to the portion facing the pressure-bonding head while maintaining the continuity. And it is affixed by pressing an ACF tape against a board | substrate with a crimping head. Thereafter, in order to fix the ACF to the substrate and collect the mount tape, the mount tape is peeled from the ACF. In order to reliably peel off the mount tape, a guide roller with a hook for guiding the ACF tape to the ACF attachment start end position and the end position in the travel path of the ACF tape from the supply reel provided on the support member is provided. When it is arranged, the ACF is pasted, and the guide roller is pulled up, when it is controlled to move in the width direction of the ACF tape, the peelability between the ACF and the mount tape is improved.

It is detected that the ACF is pasted on the substrate, and when the ACF is missing or not pasted correctly, it can be repaired immediately. For this purpose, ACF detection means by image recognition or the like is provided to detect whether or not the ACF is attached to the substrate. The ACF detection means is provided independently of the transport means and the pasting unit. When the ACF detection means is driven, it can be moved in the direction in which the electrode groups of the substrates placed on the table are arranged by the drive means independent of the transport means. As a result, the ACF can be attached and inspected more efficiently.

As described above, the space saving of the ACF attaching stage is achieved, the configuration can be reduced in size and size , and whether the ACF is actually attached at a predetermined position on the ACF attaching stage. It can be detected quickly and reliably .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, FIG. 1 shows a liquid crystal panel as an example of a substrate to which the ACF is attached, and a driver circuit made of TCP mounted on the substrate as a TAB as an example of a semiconductor circuit element mounted via the ACF. The substrate may be a printed circuit board or the like as well as a liquid crystal panel, and is not limited to a driver circuit and is electrically connected via an ACF. If it is good.

  In FIG. 1, reference numeral 1 denotes a liquid crystal panel. The liquid crystal panel 1 is composed of a lower substrate 2 and an upper substrate 3 each made of a glass thin plate, and liquid crystal is sealed between the substrates 2 and 3. The lower substrate 2 protrudes from the upper substrate 3 by a predetermined width on at least two sides, and a plurality of driver circuits 4 in which the integrated circuit elements 4b are mounted on the film substrate 4a are mounted on the protruding portion 2a.

  The projecting portion 2a of the lower substrate 2 is provided with a predetermined number of electrodes connected to wirings respectively connected to TFTs (Thin Film Transistors) formed on the portion where the substrates 2 and 3 are overlapped. These electrodes have a predetermined number of electrodes formed as a group for each mounting portion of the driver circuit 4 as indicated by reference numeral 5 in the drawing. Alignment marks 6 are formed on the left and right sides of each electrode group 5. Therefore, a blank region having a predetermined width is formed between the adjacent electrode groups 5 and 5. On the other hand, the driver circuit 4 is provided with a plurality of electrodes electrically connected to the respective electrodes constituting the electrode group 5, and the electrode group connected to the electrode group 5 is denoted by reference numeral 7. . The driver circuit 4 also has alignment marks 8 formed on both the left and right sides of the electrode group 7. When the driver circuit 4 is mounted on the liquid crystal panel 1, the electrode group is based on the alignment marks 6 and 8. The position is adjusted so that the electrodes constituting the electrode 7 and the electrodes constituting the electrode group 5 coincide with each other.

  The driver circuit 4 is mounted on the liquid crystal panel 1 via the ACF 9. As is well known, the ACF 9 is obtained by dispersing a large number of fine conductive particles in a binder resin having an adhesive function. By heating and pressing the ACF 9 between the driver circuit 4 and the liquid crystal panel 1, the ACF 9 is electrically conductive particles. The driver circuit 4 is fixed to the liquid crystal panel 1 by electrically connecting the electrodes constituting the electrode group 5 and the electrodes constituting the electrode group 7 with the binder resin thermally cured. become. Here, the ACF 9 is divided for each position of the electrode group 5 provided on the projecting portion 2a of the lower substrate 2, and is attached every length L. As a result, the ACF 9 can be used without waste, and the attached ACF 9 is almost completely covered by the driver circuit 4.

  2 and 3 show a schematic configuration of an attaching mechanism for attaching the ACF 9 to the projecting portion 2a of the lower substrate 2. FIG. In the figure, reference numeral 10 denotes a support member on which a unit for attaching the ACF 9 to the liquid crystal panel 1 is mounted. A supply reel 11 is detachably mounted on the support member 10. As will be described later, the ACF 9 is laminated on the release layer of the mount tape 12 to form the ACF tape 13, and the ACF tape 13 is wound around the supply reel 11. The ACF tape 13 is travel-guided along a travel path composed of rollers 14 to 17 attached to the support member 10. Reference numeral 18 denotes a driving roller, which is driven so as to sandwich the mount tape 12 after the ACF 9 is attached to the liquid crystal panel 1 and send it to the discharge unit 19.

  The rollers 14 and 15 are guide rollers for the feeder of the ACF tape 13, and the guide roller 15 is attached to the swing arm 20, and the swing arm 20 swings around the rotation shaft 21. Yes. A driving means (not shown) made of a motor or the like is connected to the rotating shaft 21, and the swing arm 20 is swung in the direction of the arrow F, so that at least one pasting from the supply reel 11, that is, FIG. The ACF tape 13 having the length L shown in FIG. 1 is fed out and supplied between the rollers 14 and 15. As a result, the reaction force acting when the ACF tape 13 is fed is always constant, and the resistance to the feeding force does not fluctuate due to the difference in the amount of winding of the supply reel 11.

  As shown in FIGS. 4 and 5, the rollers 16 and 17 guide the ACF tape 13 in the horizontal direction in the travel route, and define the length of the ACF 9 to be attached to the liquid crystal panel 1 once. The horizontal guide roller 17 defines the ACF 9 attachment start end position, and the horizontal guide roller 16 defines the ACF 9 attachment end position. Is set. These horizontal guide rollers 16 and 17 are formed with flange portions 16b and 17b on both sides of the cylindrical portions 16a and 17a, and the height of the portions protruding from the cylindrical portions 16a and 17a of the flange portions 16b and 17b is as follows. The dimensions of the ACF tape 13 are almost the same as or slightly larger than the thickness of the mount tape 12.

  Accordingly, the ACF 9 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16 and 17 and separated from the mount tape 12. Further, the mount tape 12 after the ACF 9 is peeled off is collected at a position downstream of the horizontal guide roller 17. A driving roller 18 is provided at a position downstream of the ACF 9 attachment region defined by the horizontal guide rollers 16 and 17, and the driving roller 18 includes a driving roller 18a and a pinch roller 18b. The mount tape 12 is sandwiched between the drive roller 18a and the pinch roller 18b. Then, the ACF tape 12 is pitch-fed every length L by rotationally driving the drive roller 18a.

  As is clear from FIG. 3, the support member 10 is mounted on the lift drive unit 22, which is mounted on the longitudinal drive unit 23, and further the forward drive unit 23 is connected to the parallel drive unit 24. It is installed. With these mechanisms, the ACF 9 attachment region defined by the space between the horizontal guide rollers 16-17 (see FIG. 2) in the routing path of the ACF tape 13 is arranged in a horizontal plane in the X-axis direction (the electrode group 5 to which the ACF 9 is attached). In the direction perpendicular to the Y axis) and the Y axis direction (the direction in which the electrode groups 5 are arranged). On the other hand, the liquid crystal panel 1 is placed on the table 25 and is fixedly held by means such as vacuum suction. Here, the forward / backward drive unit 23 moves the pasting area in a direction approaching / separating from the liquid crystal panel 1, and the parallel motion drive unit 24 is an electrode to which the ACF 9 is pasted in the liquid crystal panel 1. The pasting area is moved in a direction parallel to the arrangement direction of the group 5, that is, in the X-axis direction.

  The raising / lowering drive part 22 has the inclination block 30, and the cylinder 31 in order to move this inclination block 30 to the front-back direction. The support member 10 is connected to a slide member 32 that engages with the inclined surface of the inclined block 30. The slide member 32 has an inclined surface that matches the inclined block 30, and is The structure is such that it cannot be displaced except in the direction. Accordingly, by driving the cylinder 31, the support member 10 is displaced in the vertical direction. Here, a motor may be used in place of the cylinder 31.

  Next, the longitudinal movement drive unit 23 is for moving the pedestal 34 on which the inclined block 30 is mounted back and forth, and the reciprocation of the pedestal 34 is performed by a driving means 35 including a cylinder, a motor, and the like. Become. The pedestal 34 and its driving means 35 are mounted on the conveying means 36. The conveying means 36 can move the entire attaching mechanism in parallel with the arrangement direction of the electrode group 5 in the liquid crystal panel 1 by rotationally driving the ball screw 37 constituting the ball screw feeding means with a motor 38 (see FIG. 13). It has become. The table 25 is provided with an XY direction moving mechanism for transferring the liquid crystal panel 1 between the pre-process and the post-process, a position adjustment unit in the horizontal rotation direction, an adjustment unit in the tilt direction, and the like. You can also.

  In the travel path of the ACF tape 12 mounted on the support member 10, as shown in FIGS. 6 and 7, a cutter unit 40 as a half-cut means is provided at a position slightly downstream from the position of the horizontal guide roller 16. The cutter unit 40 is mounted on the support member 10 so as to be movable in the horizontal direction. The cutter unit 40 includes a cutter 41 and a cutter receiver 42, and the cutter 41 is rotatable about a shaft 43 in a direction approaching and separating from the cutter receiver 42 as indicated by an arrow in FIG. Yes. In addition, the blade 44 is normally held away from the cutter receiver 42 by the urging force of the spring 44 acting on the cutter 41, and the cutter 41 is pushed in a direction against the spring 44 by the pushing roller 46 provided in the cylinder 45. It is configured to move and oscillate in a direction close to the cutter receiver 42. Then, at the position where the cutter 41 is closest to the cutter receiver 42, an interval that is the same as or slightly shorter than the thickness of the mount tape 12 of the ACF tape 13 is formed therebetween. As a result, only the ACF 9 can be half-cut.

  Further, in order to attach the ACF 9 to the overhanging portion 2 a of the lower substrate 2, the ACF tape 13 is pressed from the upper part with a predetermined pressure by the pressure-bonding head 47 at a position between the horizontal guide rollers 16 and 17. ing. The pressure bonding head 47 is mounted on the support member 10 so as to be movable up and down by a vertical movement driving means 48 (FIG. 3). The vertical movement driving means 48 applies a predetermined pressure to the liquid crystal panel 1 on the ACF tape 13. Will come to let you. The crimping head 47 includes a heater (not shown). Accordingly, the crimping head 47 causes the ACF tape 13 to be thermocompression bonded to the liquid crystal panel 1. However, the degree of heating is relatively low enough to soften the binder resin of ACF9. The pressure-bonding head 47 has a width dimension that can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has the attachment length L of the ACF 9. When the ACF tape 13 is crimped to the liquid crystal panel 1 by the crimping head 47, a pedestal 49 is provided to support the crimping region of the liquid crystal panel 1 from below.

  As described above, the affixing unit constituting the ACF affixing device on the support member 10, that is, the supply reel 11, the travel path of the ACF tape 13 supplied from the supply reel 11, and the cutter unit 40 constituting the half-cut means. A crimping head 47 is attached. A method of attaching ACF 9 necessary for mounting the driver circuit 4 to the TAB on the electrode group 5 formed in a predetermined number on the projecting portion 2a of the lower substrate 2 of the liquid crystal panel 1 by this ACF attaching device will be described with reference to FIGS. This will be described with reference to FIG. The procedure of the ACF 9 attaching operation is controlled by the control device 50 shown in FIG.

  First, as shown in FIG. 7, the ACF tape 13 is half-cut. At this time, the elevating drive means 22 holds the support member 10 in the raised position, and the half-cut ACF 9 is disposed on the electrode group 5 in the liquid crystal panel 1 installed on the fixed table 25. To do. Thus, when the ACF tape 13 is half-cut, the half-cut position is the pasting end position, and the end where the previous ACF 9 was pasted is the pasting start end position. The horizontal guide roller 17 is disposed at the pasting start position, and the horizontal guide roller 16 is disposed at the pasting end position. From this state, the elevating drive unit 22 is operated to lower the support member 10 as shown in FIG. The lowermost position of the support member 10 is such that the surface of the ACF 9 of the ACF tape 13 located between the horizontal guide rollers 16 and 17 faces the protruding portion 2a of the lower substrate 2 of the liquid crystal panel 1 in a non-contact state with a slight gap. Let

  Therefore, as shown in FIG. 9, the pressure bonding head 47 is lowered and the ACF tape 13 is pressure bonded to the lower substrate 2. At this time, it is desirable that the crimping head 47 is heated to a predetermined temperature. At the time of this crimping, a predetermined load set by the vertical movement driving means 48 is applied to the ACF tape 13, and a uniform pressure is applied between the starting position of the ACF tape 13 and the end position. The pressure applied by the pressure-bonding head 47 is prevented from acting on the base end side of the half-cut pasting end position. At this time, at least the lower surface of the projecting portion 2 a on the lower substrate 2 of the liquid crystal panel 1 is in contact with the pedestal 49 at a position where the ACF 9 is attached.

  When the ACF 9 is pressure-bonded to the lower substrate 2, the pressure-bonding head 47 is raised as shown in FIG. 10 to release the pressure applied to the ACF tape 13. The ACF 9 is affixed to the lower substrate 2, and the mount tape 12 is still laminated on the ACF 9. Accordingly, in order to prevent the ACF 9 from lifting when the mount tape 12 is peeled off, after the crimping is finished and the crimping head 47 is separated from the ACF tape 12, as shown in FIG. 11 and FIG. The drive unit 22 is actuated to raise the support member 10. At this time, the longitudinal drive unit 23 is also driven together with the elevation drive unit 22, and is operated so as to be lifted obliquely upward in the width direction of the ACF tape 12. The mount tape 12 is peeled off from the ACF 9.

  As described above, the attachment of the ACF 9 to the one electrode group 5 in the projecting portion 2a of the lower substrate 2 is completed. The supporting member 10 is held at the raised position, the driving roller 18 is operated, and the ACF tape 13 is pulled out from the supply reel 11 and fed by one pitch. And the parallel drive part 24 is operated and the whole sticking mechanism is moved 1 pitch. As shown in FIG. 1, this one pitch is a distance between the front and rear attachment positions of the front and rear ACFs 9. Therefore, the operation of the parallel drive unit 24 performs the work of attaching the ACF 9 to the next electrode group 5. On the other hand, the fixed table 25 that holds the liquid crystal panel 1 does not move. Then, the ACF 9 is sequentially attached to the electrode group 5 by repeating the same operation as described above.

  Incidentally, in FIG. 13, when the liquid crystal panel 1 is moved in the arrangement direction of the electrode groups 5 (X-axis direction) as indicated by an arrow S in FIG. In order to attach the ACF 9, a space corresponding to twice the approximate size in the width direction of the liquid crystal panel 1 is required. In particular, in recent years, the size of the liquid crystal panel 1 has become extremely large due to a demand for an increase in the screen size of the flat display. Therefore, the space more than twice the Y-axis direction becomes a huge space.

  The attachment mechanism of the ACF 9 is slightly smaller than the total length of the liquid crystal panel 1 although the size is somewhat different depending on the total length of the electrode group 5. Therefore, in the present invention, the support member 10 to which each member constituting the pasting unit is mounted is provided on the conveying means 36 in the parallel drive unit 24, and the ball screw 37 is rotated by driving the motor 38. As shown by the arrow P in FIG. 13, the transport member 36 is transported in the direction in which the electrode groups 5 of the liquid crystal panel 1 are arranged, that is, in the X-axis direction. In addition, the ACF 9 is attached by positioning every one pitch of the attaching portion of the ACF 9. Therefore, the ACF adhering stage only needs to secure a space that is substantially necessary to accommodate the liquid crystal panel 1, and thus the ACF adhering stage is reduced in size as compared with the case where the liquid crystal panel 1 is moved. It can be made compact and no useless space is created.

  As described above, the ACF 9 is sequentially attached to the lower substrate 2. However, when the ACF is attached by operating the pressure-bonding head 47, the ACF 9 does not completely adhere to the substrate 2 and adheres to the mount tape 12. It may be pulled up as it is and not attached to the lower substrate 2 side. Moreover, although it is affixed on the lower board | substrate 2, it cannot be said that the affixing position may not have shifted | deviated. Therefore, after the ACF 9 is pasted on the liquid crystal panel 1 by the pasting mechanism, an image of the pasting stage of the ACF 9 is detected using the TV camera 60 in order to detect whether the ACF 9 is pasted at a proper position. Acquired and the presence / absence of the ACF 9 and the pasting position are detected based on this image.

The television camera 60 is configured to be moved independently of the sticking Ri attached mechanism. For this purpose, driving means for the TV camera 60 including the guide member 61 and the ball screw feeding means 62 is provided in parallel with the traveling direction of the parallel movement driving unit 24, and along the guide member 61 independently of the attaching mechanism. The position of the electrode group 5 that has been pasted by the pasting mechanism is photographed by the TV camera 60, the video is transmitted to the control device 50, and image analysis is performed. A determination is made as to whether or not it is pasted at the correct position. As a result of the determination, if the ACF 9 is not pasted, the ACF 9 is pasted again and the subsequent steps are continued. If the ACF 9 attachment position is not appropriate, the liquid crystal panel 1 is taken out of the system, the inappropriate ACF 9 is peeled off, the ACF 9 is attached at the correct position, and the subsequent steps are continued.

It is a principal part external view which shows the liquid crystal cell as a board | substrate with which ACF is affixed, and the driver circuit mounted in this board | substrate. It is a front view which shows schematic structure of an ACF sticking machine. FIG. 3 is a left side view of FIG. 2. It is a structure explanatory drawing of a horizontal feed roller. It is AA sectional drawing of FIG. It is a structure explanatory view of a cutter unit. It is explanatory drawing which shows a half cut process. It is explanatory drawing which shows an ACF tape descending state. It is explanatory drawing which shows a crimping | compression-bonding process. It is explanatory drawing which shows the raising state of a crimping | compression-bonding block. It is explanatory drawing of the operation | movement which peels from the ACF of a mount tape. It is BB sectional drawing of FIG. It is operation | movement explanatory drawing explaining the action | operation of the conveyance means of a sticking unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 Lower board | substrate 2a Overhang | projection part 3 Upper board | substrate 4 Driver circuit 5 Electrode group 9 ACF 10 Support member 11 Supply reel 12 Mount tape 13 ACF tape 16, 17 Horizontal guide roller 16a, 17a Cylindrical part 16b, 17b Elevation part 22 Driving unit 23 Longitudinal driving unit 24 Flat behavior driving unit 25 Fixed table 35 Driving unit 36 Conveying unit 37 Ball screw 38 Motor 40 Cutter unit 41 Cutter 42 Cutter receiver 47 Crimp head 48 Vertical movement driving unit 60 TV camera 61 Guide member 62 Ball Screw feeding means

Claims (3)

For a substrate on which a plurality of electrodes are formed, each of the plurality of electrodes is divided into an electrode group to which one ACF is pasted, and a plurality of pasting areas are set, and each pasting area is individually set. An ACF pasting apparatus for pasting ACF,
The substrate is fixedly attached to a table provided at a fixed position,
A support member that moves up and down by a predetermined stroke is attached to the transport means that can move in the direction in which the electrodes of the substrate are arranged ,
The support member is provided with a supply reel for sending out an ACF tape in which an ACF is laminated on a release layer of the mount tape, and the mount tape of the ACF tape sent from the supply reel is provided with continuity, A half-cut unit that cuts for each length to be pasted to each electrode group of the substrate, and a bonding unit that includes a pressure-bonding head that crimps the ACF cut by the half-cut unit to the surface of the substrate,
The conveying means pitch-feeds the affixing unit so that the pressure-bonding head is positioned for each of the affixing regions, and the pressure-bonding head is lowered every time it is positioned in each of the affixing regions. ACF is attached to the substrate,
In order to detect whether or not an ACF is attached to each of the attachment regions on the substrate on the table, ACF detection means independent of the transfer means and the attachment unit is provided. An ACF adhering apparatus characterized by having a configuration. The support member is further provided with a guide roller with a hook for guiding the ACF tape at the start and end positions of the ACF attachment, and after the ACF is attached to the substrate by the pressure-bonding head, The ACF adhering apparatus according to claim 1, wherein the guide roller is configured to operate so as to move in the width direction of the ACF tape while being raised. The ACF adhering apparatus according to claim 1 , wherein the ACF detecting unit is configured to be movable in a direction in which the electrode groups of the substrate are arranged by a driving unit independent of the driving of the conveying unit. .

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