CN110187528B - Bonding equipment and attaching device thereof - Google Patents
Bonding equipment and attaching device thereof Download PDFInfo
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- CN110187528B CN110187528B CN201910427410.7A CN201910427410A CN110187528B CN 110187528 B CN110187528 B CN 110187528B CN 201910427410 A CN201910427410 A CN 201910427410A CN 110187528 B CN110187528 B CN 110187528B
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- release substrate
- bonding
- cutting
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- 239000000463 material Substances 0.000 claims abstract description 136
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000005520 cutting process Methods 0.000 claims abstract description 41
- 238000005096 rolling process Methods 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 43
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 238000001514 detection method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- 238000011084 recovery Methods 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 11
- 230000033001 locomotion Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The invention relates to bonding equipment and a bonding device thereof, wherein the bonding device comprises a feeding mechanism, a cutting mechanism, a bonding mechanism and a traction mechanism, wherein the cutting mechanism is used for half-cutting a material belt, and the bonding mechanism is used for rolling and pressing the material belt and bonding a rubber material on a workpiece; the traction mechanism is used for drawing the release substrate; wherein, on the transmission path of the release substrate, the attaching mechanism is positioned between the cutting mechanism and the traction mechanism. According to the bonding equipment and the bonding device thereof, the material belt half-cut by the cutting mechanism can move to the bonding mechanism under the traction of the traction mechanism, so that the bonding mechanism can bond the rubber material to a workpiece, the rubber material is not required to be taken down from the release substrate in advance, the rubber material with the corresponding length can be cut out by half-cutting once, the bonding length can be flexibly adjusted by controlling the feeding speed of the rubber material, the rubber material is tightly bonded to the workpiece by rolling and pressing the material belt by the bonding mechanism, and the bonding at normal temperature is realized without heating.
Description
Technical Field
The invention belongs to the technical field of bonding, and particularly relates to bonding equipment and a bonding device thereof.
Background
With the development of electronic technology, electronic functional modules are usually packaged in a bonding manner, in some cases, a glue material (e.g., ACF) is needed in the bonding process, and in order to facilitate the realization of automation, some glue materials are usually formed into a material tape in an attached manner. For example, in the back-end process of liquid crystal panel manufacture, a COF (Chip On Film) is bonded to the liquid crystal panel, and then a PCB is bonded to the COF, and before the PCB is bonded to the COF, an ACF (Anisotropic Conductive Film) is attached to the PCB. ACF is usually in the form of a material tape roll as a material source. Before attaching, cutting is needed, and the ACF section at the cut part is attached on the PCB.
However, in the conventional attachment method, the ACF is hot-pressed on the PCB and attached to the PCB by using a blade heating method, and in this method, the attachment length is relatively fixed and is not easy to adjust, and heating is required, which wastes energy and easily damages the quality of the ACF.
Disclosure of Invention
Therefore, the pasting device and the binding equipment comprising the pasting device are needed to be provided, wherein the pasting device can realize pasting at normal temperature, the pasting length is flexible and adjustable, and one-half cutting is realized.
The application provides a device is paid to subsides includes:
the feeding mechanism is used for outputting a material belt, and the material belt comprises a release substrate and a rubber material attached to the release substrate;
the cutting mechanism is used for half-cutting the material belt so as to form a cut on the rubber material; the adhesive material can be peeled from the release substrate along the cut;
the sticking mechanism is used for rolling the material belt and sticking the rubber material to the workpiece;
the traction mechanism is used for drawing the release substrate;
the sticking mechanism is positioned between the cutting mechanism and the traction mechanism on the transmission path of the release substrate.
In one embodiment, the material feeding device comprises a rack, a mounting plate and a first driving mechanism, wherein the feeding mechanism, the cutting mechanism, the attaching mechanism and the traction mechanism are arranged on the mounting plate, the first driving mechanism is used for driving the mounting plate to move up and down along the vertical direction relative to the rack, and the attaching mechanism can be abutted against the material belt along the vertical direction.
In one embodiment, the mounting plate is slidably disposed on the frame, the first driving mechanism includes a screw rod, a movable seat and a servo motor, the screw rod is connected to the movable seat, the movable seat is fixed to the mounting plate, and the servo motor can drive the screw rod to rotate, so that the screw rod is screwed to transmit the movable seat to move up and down.
In one embodiment, the device comprises a material loading workbench, wherein the material loading workbench is used for loading the workpiece and driving the workpiece to horizontally move, and when the attachment mechanism pushes the material belt against the workpiece, the material loading workbench can drive the workpiece to horizontally move relative to the attachment mechanism.
In one of them embodiment, including second actuating mechanism, second actuating mechanism is used for the drive the mounting panel is relative frame horizontal motion, and when the mechanism will be pasted the material area to support to press in on the work piece, the mounting panel is in under the second actuating mechanism drives, can drive the mechanism is pasted relatively work piece horizontal migration.
In one embodiment, the attaching mechanism includes a roller, a wheel seat and a telescopic cylinder, the roller is rotatably disposed on the wheel seat, the wheel seat is connected with the telescopic cylinder, and the telescopic cylinder can drive the wheel seat to press down, so that the roller rolls and presses against the material belt.
In one embodiment, the recovery device comprises a recovery pipe, wherein the recovery pipe is positioned on one side of the traction mechanism and is used for recovering the release substrate after the rubber material is stripped.
In one embodiment, the device comprises an image detection assembly and a control module, wherein the image detection assembly is used for detecting the offset of a rubber material attached to the workpiece; the control module is used for regulating and controlling the traction speed or displacement of the traction mechanism to the release substrate according to the offset.
In one embodiment, the feeding device comprises a tension detection component, wherein the tension detection component is used for detecting tension information of the material belt, and the control module is further used for adjusting the feeding speed of the feeding mechanism according to the tension information.
In another aspect, the application provides a bonding apparatus, including the above attaching device.
The bonding equipment and the bonding device thereof comprise a feeding mechanism, a cutting mechanism, a bonding mechanism and a traction mechanism, wherein the bonding mechanism is positioned between the cutting mechanism and the traction mechanism on a transmission path of a release substrate, a half-cut material belt passing through the cutting mechanism can move to the bonding mechanism under the traction of the traction mechanism, so that the bonding mechanism can bond a rubber material to a workpiece, the rubber material is not required to be taken down from the release substrate in advance, the rubber material with corresponding length can be cut out by half-cutting once, and under the structural arrangement, the bonding length can be flexibly adjusted by controlling the feeding speed of the rubber material, the rubber material is tightly bonded to the workpiece by utilizing the rolling abutting pressure of the bonding mechanism on the material belt, so that the bonding at normal temperature is realized without heating.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings of the embodiments can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of an attaching device according to an embodiment;
FIG. 2 is an enlarged view of a portion of FIG. 1 taken at circle A;
FIG. 3 is an enlarged view of a portion of FIG. 1 taken at circle B;
FIG. 4 is a schematic side view of an embodiment of an attachment device;
FIG. 5 is an enlarged view of a portion of FIG. 4 taken about circle C;
FIG. 6 is a schematic structural view of an attachment device according to another embodiment;
FIG. 7 is a schematic side view of the attachment device shown in FIG. 6;
fig. 8 is a schematic perspective view of a loading table of the attaching device shown in fig. 6.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1, 4 and 5, an attaching device 100 according to an embodiment of the present invention may be used to attach a glue material 101b to a workpiece, where the glue material 101b may be an Anisotropic Conductive Film (ACF), the workpiece may be a Printed Circuit Board (PCB), and in other embodiments, the attaching device 100 may also be used to attach another Film-shaped glue material 101b, which is not limited herein.
Before the adhesive material 101b is attached, the incoming adhesive material 101b is generally supplied in a strip shape, and for example, in some embodiments, the adhesive material 101b is attached to the release substrate 101a to form the strip 101, so that the adhesive material 101b can be peeled off from the release substrate 101a when the adhesive material 101b needs to be attached to a workpiece.
The attaching device 100 will be further described below by taking the material source tape 101 as an example, which includes a release substrate 101a and an adhesive material 101b attached to the release substrate 101 a.
With continued reference to fig. 1, the attaching device 100 includes a feeding mechanism 10, a cutting mechanism 20, an attaching mechanism 30, and a drawing mechanism 40.
Wherein, the feeding mechanism 10 is used for outputting the material belt 101. In the tape 101, the release substrate 101a is used as a carrier of the adhesive material 101b, and can drive the adhesive material 101b to move to a suitable position, so as to meet the subsequent operation requirements such as half-cut or adhesion. As shown in fig. 6, the feeding mechanism 10 may include a material tray 11 and a rotary driving member 12, where the material tray 11 can wind the material tape 101, and when the material tape 101 is output, the rotary driving member 12 drives the material tray 11 to rotate, so as to output the material tape 101. The rotary driving member 12 may be a rotary cylinder or a rotary motor, and is not limited herein.
The cutting mechanism 20 is used to half-cut the tape 101 to form a cut on the adhesive material 101 b. The half-cutting of the material tape 101 means: the tape 101 is not completely cut, but only a cut is formed on the adhesive material 101b, and the adhesive material 101b is segmented, that is, the adhesive material 101b is divided into segments by the cut. At this time, the adhesive 101b remains attached to the release substrate 101a and is transported together with the release substrate 101 a. The cut formed in the rubber material 101b can peel the half-cut rubber material 101b from the release substrate 101a along the cut, thereby meeting the requirement of attaching the rubber material 101b to the workpiece.
The attaching mechanism 30 is used for rolling the material tape 101 and attaching the adhesive material 101b to the workpiece.
The traction mechanism 40 is used for drawing the release substrate 101a, so that the release substrate 101a drives the adhesive material 101b to move.
In this embodiment, the attaching mechanism 30 is located between the cutting mechanism 20 and the drawing mechanism 40 on the transfer path of the release substrate 101 a. Therefore, the traction mechanism 40 can be used for drawing the material belt 101 half-cut by the cutting mechanism 20 to the attaching mechanism 30, specifically, along with the traction of the release substrate 101a by the traction mechanism 40, the release substrate 101a drives the rubber material 101b to move and enables the cut of the rubber material 101b to move to the attaching mechanism 30, so that the attaching mechanism 30 presses the material belt 101 to adhere the cut of the rubber material 101b to the workpiece, and along with the continuous traction of the release substrate 101a by the traction mechanism 40 and the relative movement of the workpiece and the attaching mechanism 30, the half-cut section of the rubber material 101b can be completely attached to the workpiece.
In addition, because the half-cut adhesive material 101b can pass through the attaching mechanism 30 along with the release substrate 101a, without removing the adhesive material 101b from the release substrate 101a in advance, the adhesive material 101b with a corresponding length can be cut out by half-cutting once, and under the structural arrangement, the attaching length can be flexibly adjusted by controlling the feeding speed of the adhesive material 101 b. The sticking process is effectively saved, and the sticking efficiency is improved. In this embodiment, the adhesive material 101b is tightly attached to the workpiece by rolling the tape by the attaching mechanism 30, so that the attaching at normal temperature is realized without heating.
In some production applications, because drive mechanism 40 can be through to the traction of leaving type substrate 101a, drive and glue material 101b and remove, thereby can half cut in gluing material 101 b's suitable position through cutting mechanism 20, thereby obtain the gluey material 101b of the required length of a plurality of sections, each section glues material 101b and is gluing material 101b between the incision that cuts twice around, thereby under this kind of mode, the phenomenon that has the waste material between the material 101b is glued to the multistage can not appear, and then effectively avoid gluing material 101b extravagant, manufacturing cost is reduced.
As shown in fig. 1 and 3, in some embodiments, the traction mechanism 40 includes a driving wheel 41 and a driven wheel 42, and the driving wheel 41 and the driven wheel 42 are in contact with each other on their wheel surfaces and clamp the release substrate 101a therebetween, so that when the driving wheel 41 rotates, the driving wheel 41 rotates together with the driven wheel 42 and draws the release substrate 101 a.
As shown in fig. 6, the driving wheel 41 may be connected to a driving motor 40a, so that the driving wheel 41 is rotated by the driving motor 40 a. In other embodiments, a rotary driving member such as a rotary cylinder may be used to drive the driving wheel 41 to rotate, and the present invention is not limited thereto.
As shown in fig. 2, 4 and 5, the cutting mechanism 20 includes a cutting blade 21 and a driving member (not shown) capable of driving the cutting blade 21 to move. The tape 101 passes through the cutting mechanism 20 while passing from the supply mechanism 10 to the attachment mechanism 30. Specifically, the tape 101 passes through the cutting range of the cutter 21, so that when the driving member drives the cutter 21 to move, the cutter 21 can half-cut the tape 101, that is, the adhesive material 101b of the tape 101 is cut into a notch without damaging the release substrate 101a, and then the adhesive material 101b moves to the position below the attaching mechanism 30 along with the release substrate 101 a. The sticking mechanism 30 sticks the adhesive material 101b to the workpiece by abutting the tape 101, and as the pulling mechanism 40 continues to pull the release base material 101a, the adhesive material 101b is peeled from the release base material 101a and finally completely stuck to the workpiece. The driving member may be a telescopic cylinder, and the telescopic cylinder is used to drive the cutter 21 to move telescopically relative to the material tape 101, so as to realize half-cutting.
With continued reference to fig. 2, 4 and 5, in some embodiments, the attaching mechanism 30 includes a roller 31, a roller seat 32 and a telescopic cylinder 33, the roller 31 is rotatably disposed on the roller seat 32, the roller seat 32 is connected to the telescopic cylinder 33, the telescopic cylinder 33 can drive the roller seat 32 to press down, so that the roller 31 rolls against the tape 101, and the roller 31 can press against the tape 101 with a suitable pressing force by adjusting the output pressure of the telescopic cylinder 33. In addition, the rolling and pressing manner adopted between the roller 31 and the tape 101 can reduce the friction force between the roller 31 and the tape 101, so that the release base material 101a can smoothly pass through the roller 31 under the traction of the traction mechanism 40, so that the rubber material 101b is continuously moved to the abutting position of the roller 31 and the workpiece, and finally the rubber material 101b is adhered to the workpiece.
As shown in fig. 1 and 4, the attaching device 100 includes a frame 100a, a mounting plate 100b, and a first driving mechanism 50. The feeding mechanism 10, the cutting mechanism 20, the attaching mechanism 30 and the traction mechanism 40 are all disposed on the mounting plate 100b, the first driving mechanism 50 is used for driving the mounting plate 100b to move up and down along the vertical direction relative to the rack 100a, and the attaching mechanism 30 can press the material belt 101 along the vertical direction.
The mounting plate 100b is slidably disposed on the frame 100 a. For example, the rack 100a is provided with a slide rail 100c, the mounting plate 100b is slidably connected to the slide rail 100c, the slide rail 100c extends in a vertical direction, and the mounting plate 100b can move up and down along the slide rail 100c relative to the rack 100a under the driving of the first driving mechanism 50.
Referring to fig. 6 and 7, the first driving mechanism 50 includes a screw 51, a movable base 52 and a servo motor 53, the screw 51 is connected to the movable base 52, the movable base 52 is fixed to the mounting plate 100b, and the servo motor 53 can drive the screw 51 to rotate, so that the screw 51 is screwed with the movable base 52 for moving up and down.
When the attachment mechanism 30 presses the tape 101 to attach the adhesive material 101b to the workpiece, the attachment mechanism 30 presses the tape 101 and the attachment mechanism 30 and the workpiece are relatively movable in the horizontal direction so as to attach the tape 101 to the workpiece via the half-cut adhesive material 101 b.
The relative movement of the attachment mechanism 30 and the workpiece in the horizontal direction can be realized by various structural forms. For example, in some embodiments, the workpiece is stationary and the application mechanism 30 is moved horizontally relative to the workpiece against the strip 101. In other embodiments, the attaching mechanism 30 can only move up and down along with the mounting plate 100b along the vertical direction relative to the workpiece to selectively press the adhesive material 101b against the workpiece, and the workpiece is moved horizontally relative to the attaching mechanism 30 by moving the workpiece, so that the adhesive material 101b can also be attached to the workpiece. In another embodiment, the work and the attaching mechanism 30 can independently move horizontally, and the work and the attaching mechanism can move relative to each other in the horizontal direction, so that the attaching requirement of the adhesive material 101b can be met.
In some embodiments, as shown in fig. 6 and 7, the applying device 100 includes a loading table 60, the loading table 60 is used for loading the workpiece and driving the workpiece to move horizontally, and when the applying mechanism 30 presses the tape 101 against the workpiece, the loading table 60 can drive the workpiece to move horizontally relative to the applying mechanism 30.
Referring to fig. 8, the loading table 60 includes a mounting seat 61, a supporting plate 62 and a servo motor 63, and the supporting plate 62 is slidably connected to the mounting seat 61 and is used for placing a workpiece such as a PCB. The servo motor 63 is mounted on the mounting seat 61 and can drive the supporting plate 62 to move horizontally, so that the workpiece such as a PCB on the supporting plate 62 moves horizontally to meet the requirement of the attaching mechanism 30 for attaching the adhesive material 101b to the workpiece.
In some embodiments, the mounting seat 61 includes a side plate 61a and two connecting plates 61b, and the side plate 61a and the connecting plates 61b may be integrally formed, which is not limited herein. The two connecting plates 61b are vertically connected to opposite sides of the side plate 61a, respectively, and the servo motor 63 is disposed between the two connecting plates 61 b. The supporting plate 62 is slidably connected to the two side plates 61a by a connecting member such as a slide rail 60a, and the servo motor 63 is connected to the supporting plate 62 by a transmission structure such as a driving screw to drive the supporting plate 62 to move horizontally.
In other embodiments, the attaching device 100 includes a second driving mechanism (not shown in the figures), the second driving mechanism is used for driving the mounting plate 100b to move horizontally relative to the rack 100a, and when the attaching mechanism 30 presses the tape 101 against the workpiece, the mounting plate 100b is driven by the second driving mechanism to drive the attaching mechanism 30 to move horizontally relative to the workpiece. This arrangement also satisfies the relative movement between the work and the attaching mechanism 30 in the horizontal direction, and the attachment of the adhesive material 101b at different positions of the work can be performed in accordance with the attachment requirement.
It should be noted that the second driving mechanism may have the same structure as the first driving mechanism 50, except that the second driving mechanism performs a movement in a different direction to the mounting plate 100b by the first driving mechanism 50.
As shown in fig. 1 and 3, in some embodiments, the attaching device 100 includes a recovery pipe 100d, and the recovery pipe 100d is located at one side of the traction mechanism 40 and is used for recovering the release substrate 101a after the adhesive material 101b is peeled.
In some embodiments, the attaching device 100 includes an image detection component (not shown) and a control module (not shown), wherein the image detection component is used for detecting the offset of the adhesive material 101b attached to the workpiece; the control module is used for regulating and controlling the traction speed or displacement of the traction mechanism 40 to the release substrate 101a according to the offset. By means of the structure, the pasting effect of the glue material 101b can be checked, and meanwhile when the pasting of the glue material 101b deviates, the working state of the traction mechanism 40 can be timely adjusted to correct the pasting deviation of the glue material 101b, so that the glue material 101b can be more accurately pasted at the position of the workpiece to be pasted.
As further shown in fig. 1, the application device 100 includes a tension detection component 70, and the tension detection component 70 is used for detecting the tension information of the tape 101. The control module is further configured to adjust the feeding speed of the feeding mechanism 10 according to the tension information, so as to avoid that the feeding speed of the feeding mechanism 10 is too fast, which results in that the material tape 101 is too loose, and affects the precision of the half-cutting of the material tape 101 by the cutting mechanism, specifically, because the material tape 101 is in a fluffy state, when the cutting mechanism performs the half-cutting of the material tape 101, the position of the cut formed on the adhesive material 101b is inconsistent with the actual desired position. Accordingly, under such control and adjustment, too low feeding speed of the feeding mechanism 10 can be avoided, which causes the tape 101 to be too tight and easily deformed or broken.
Correspondingly, the application provides a bonding device comprising the above attaching device 100, so that after the adhesive material 101b is attached to a workpiece by using the attaching device 100, bonding operation can be performed on the workpiece, and stable connection between different workpieces is realized. Since the attaching device 100 has high attaching efficiency and does not generate waste of the adhesive material 101b, the bonding equipment comprising the attaching device 100 can also greatly save production cost.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An attachment device, comprising:
the feeding mechanism is used for outputting a material belt, and the material belt comprises a release substrate and a rubber material attached to the release substrate;
the cutting mechanism is used for half-cutting the material belt so as to form a cut on the rubber material; the adhesive material can be peeled from the release substrate along the cut;
the sticking mechanism is used for rolling the material belt and sticking the rubber material to the workpiece;
the traction mechanism is used for drawing the release substrate to enable the release substrate to drive the rubber material to move;
the adhesive tape cutting device comprises a cutting mechanism, a traction mechanism, an adhesive material sticking mechanism and a sticking mechanism, wherein the sticking mechanism is positioned between the cutting mechanism and the traction mechanism on a transmission path of a release substrate, and the traction mechanism can continuously pull and move a half-cut material tape passing through the cutting mechanism so as to enable a cut of the adhesive material to move to the sticking mechanism and stick the adhesive material to a workpiece in the moving process of the sticking mechanism relative to the workpiece.
2. The attaching device of claim 1, comprising a frame, a mounting plate, and a first driving mechanism, wherein the feeding mechanism, the cutting mechanism, the attaching mechanism, and the drawing mechanism are disposed on the mounting plate, the first driving mechanism is configured to drive the mounting plate to move vertically relative to the frame, and the attaching mechanism is capable of pressing the strip vertically.
3. The attaching device of claim 2, wherein the mounting plate is slidably disposed on the frame, the first driving mechanism includes a screw rod, a moving seat and a servo motor, the screw rod is connected to the moving seat, the moving seat is fixed to the mounting plate, and the servo motor can drive the screw rod to rotate, so that the screw rod is screwed to drive the moving seat to move up and down.
4. A placement device according to claim 2, comprising a loading table for loading said workpiece and driving said workpiece to move horizontally, and said loading table is capable of driving said workpiece to move horizontally relative to said placement mechanism when said placement mechanism presses said strip against said workpiece.
5. The attaching device of claim 2, comprising a second driving mechanism, wherein the second driving mechanism is configured to drive the mounting plate to move horizontally relative to the frame, and when the attaching mechanism presses the strip against the workpiece, the mounting plate is driven by the second driving mechanism to drive the attaching mechanism to move horizontally relative to the workpiece.
6. A sticking device according to any one of claims 1-5, wherein the sticking mechanism comprises a roller, a roller seat and a telescopic cylinder, the roller is rotatably arranged on the roller seat, the roller seat is connected with the telescopic cylinder, and the telescopic cylinder can drive the roller seat to be pressed downwards so that the roller rolls to press against the material belt.
7. The attachment device according to claim 1, comprising a recovery tube located on one side of the pulling mechanism and configured to recover the release substrate after the adhesive is peeled.
8. The attaching device of claim 1, comprising an image detection assembly and a control module, wherein the image detection assembly is used for detecting the offset of the adhesive material attached to the workpiece; the control module is used for regulating and controlling the traction speed or displacement of the traction mechanism to the release substrate according to the offset.
9. The application device of claim 8, comprising a tension detection assembly, wherein the tension detection assembly is configured to detect tension information of the material tape, and the control module is further configured to adjust a feeding speed of the feeding mechanism according to the tension information.
10. Bonding apparatus comprising a bonding device according to any of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910427410.7A CN110187528B (en) | 2019-05-22 | 2019-05-22 | Bonding equipment and attaching device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910427410.7A CN110187528B (en) | 2019-05-22 | 2019-05-22 | Bonding equipment and attaching device thereof |
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| CN110187528A CN110187528A (en) | 2019-08-30 |
| CN110187528B true CN110187528B (en) | 2022-02-01 |
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| CN110745618B (en) * | 2019-10-15 | 2020-11-20 | 华中科技大学 | Full-automatic thin section collecting system |
| CN110672607B (en) * | 2019-10-15 | 2021-01-08 | 华中科技大学 | Ex-situ microscopic imaging system in section collection process |
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| CN110187528A (en) | 2019-08-30 |
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