TWI383718B - An anisotropic conductive film (ACF) sticking device, a flat panel display (FPD) manufacturing apparatus, and a flat panel display - Google Patents

Description

Anisotropic conductive film (ACF) adhesive device, flat panel display (FPD) manufacturing device, and flat panel display

According to the present invention, in order to mount a semiconductor circuit element such as a driver circuit on a substrate, an anisotropic conductive film (ACF) adhesive device for adhering an anisotropic conductive film (ACF) to the substrate includes the anisotropy. A flat panel display manufacturing apparatus of a conductive film (ACF) pasting device and a flat display manufactured by the manufacturing apparatus using the flat panel display.

One of the flat displays is a liquid crystal display. The liquid crystal display is configured by enclosing liquid crystal between liquid crystal panels formed by two transparent substrates. The liquid crystal panel is connected to the printed circuit board via a driver circuit, and the electrodes on the inner side of the driver circuit are connected to the liquid crystal panel, and the electrodes on the outer side are connected to the printed circuit board. The mounting method of the driver circuit is represented by a TAB (Tape Automated Bonding) method and a CoG (Chip On Glass) method, and both are suitable for forming at least two sides of the surface of the liquid crystal panel. There is a wiring pattern, and the electrodes in the wiring pattern are electrically connected to the electrodes of the driver circuit.

An anisotropic conductive film (ACF) is used for electrical connection between the driver circuit and the liquid crystal panel substrate, and between the driver circuit and the printed circuit board. An anisotropic conductive film (ACF) is obtained by uniformly adhering minute conductive particles to an adhesive resin having adhesiveness, and is electrically connected to the anisotropic conductive film (ACF) by electrodes. Sexual connection. Then, the adhesive resin is cured by heating to fix the driver circuit to the liquid crystal panel or the printed circuit board.

When the driver circuit is mounted on the liquid crystal panel by the TAB method, the anisotropic conductive film (ACF) is adhered to the portion of the substrate of the liquid crystal panel where the wiring pattern is provided, and the TCP (Tape Carrier Package) is used as the driver circuit. : Tape carrier package) TAB mounting on the substrate. The anisotropic conductive film (ACF) is an adhesive substance which is laminated on a backing paper web via a release layer, thereby forming an anisotropic conductive film (ACF) tape. Therefore, in a state where the anisotropic conductive film (ACF) tape is pressed against the substrate, the base paper tape is peeled off, and an anisotropic conductive film (ACF) is adhered to the substrate.

When an anisotropic conductive film (ACF) is adhered to a substrate, the anisotropic conductive film (ACF) is not always attached to an appropriate position. Usually, provisional pressure bonding is performed, and after mounting of the driver circuit, press bonding is performed in a heated state, and main pressure bonding is performed to thermally cure the adhesive resin. Therefore, it is preferable to check whether or not the anisotropic conductive film (ACF) is properly adhered in a state where the anisotropic conductive film (ACF) and the substrate are temporarily pressure-bonded.

Patent Document 1 discloses a technique for performing inspection of an adhesion state of an anisotropic conductive film (ACF). In Patent Document 1, the difference between the photographic pattern of the electrode portion to which the tape member is appropriately adhered and the photographic pattern of the electrode portion before the tape member is pasted is stored as a reference pattern, and the tape member is newly adhered. The difference between the photographic pattern of the electrode portion before the tape member is pasted with the image of the substrate is compared with the reference pattern, and the matching ratio by the pattern is calculated to determine the good and the defective product.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-142900

When the anisotropic conductive film (ACF) is adhered to the substrate, as disclosed in Patent Document 1, there is a bulk paste that covers the entire length of one side of the substrate and is continuously pasted; and each electrode group is provided Separate and individually adhere the split adhesive of the anisotropic conductive film (ACF). The electrodes formed at a small pitch of the substrate are formed into a group by a specific number of electrode groups for each driver circuit, and each electrode group is formed with a blank region between adjacent electrode groups. Since it is not necessary to adhere the anisotropic conductive film (ACF) to the blank area, the material is prevented from being wasted by using the split adhesion of the anisotropic conductive film (ACF) in an unnecessary blank area, and by forming an alien The adhesive resin and the conductive particles of the conductive film (ACF) are exposed in the blank region, and it is possible to avoid the occurrence of unsuitability for the processing or processing after the driver circuit is mounted.

Even after the entire batch of pasting and splitting, the inspection results of the adhesive state of the anisotropic conductive film (ACF) were performed, and the adhesion state of the anisotropic conductive film (ACF) was checked. In the case of the case, the anisotropic conductive film (ACF) must be peeled off and re-adhesive. However, in the case of the entire batch of adhesion, it is a one-length anisotropic conductive film (ACF) covering the entire length of the substrate, and even a very small portion of the anisotropic conductive film (ACF) is adhered. In the case of a bad situation, it is also necessary to peel off one piece of the long anisotropic conductive film (ACF). In this case, in order to peel off the full-length anisotropic conductive film (ACF) covering the substrate, a complicated mechanism is required, and a very small portion of the adhesive state is not adhered, and the full length of the substrate must be covered. The anisotropic conductive film (ACF) is peeled off as a whole, and the material of the anisotropic conductive film (ACF) is wasted. On the other hand, in the case of split adhesion, the overall length is very short compared to the entire batch of anisotropic conductive film (ACF), and the mechanism for peeling is not so complicated, and only the peeling difference is required. The square conductive film (ACF) is peeled off to suppress waste of the material of the anisotropic conductive film (ACF).

Then, when detecting an anisotropic conductive film (ACF) that requires re-adhesion, the liquid crystal panel is discharged from the production line, and the anisotropic conductive film (ACF) is re-bonded and returned to the production line. These operations are performed by the operator and require the intervention of the operator. Further, each work is performed by an operator, and there is a problem that the overall work efficiency is lowered.

Therefore, the object of the present invention is to perform the split adhesion of the anisotropic conductive film (ACF) and automatically perform the re-sticking operation only for the anisotropic conductive film (ACF) which requires re-adhesion.

An anisotropic conductive film (ACF) pasting device according to the first aspect of the invention is characterized in that the substrate is formed into a plurality of groups by a plurality of electrodes, and each electrode group is individually adhered to each other. An anisotropic conductive film (ACF) adhesive means for a square conductive film (ACF); and an anisotropic conductive film (ACF) which is individually adhered to the substrate by the aforesaid anisotropic conductive film (ACF) bonding means And a means for inspecting the adhesive state; and a peeling means for peeling off the anisotropic conductive film (ACF) adhered to the substrate from the substrate; and an anisotropic conductive film (ACF) adhered to the substrate, The above-mentioned inspection means is controlled by detecting an anisotropic conductive film (ACF) which is in a bad adhesion state and requires a heavy adhesion, and the peeling means is controlled by peeling off the detected anisotropic conductive film (ACF) The method of controlling the adhesion of the anisotropic conductive film (ACF) by controlling the re-adhesion of the anisotropic conductive film (ACF) at the position of the exfoliated anisotropic conductive film (ACF).

For example, according to the anisotropic conductive film (ACF) bonding device according to the first application of the patent scope, when the individual bonding of the anisotropic conductive film (ACF) is performed, the anisotropic conductive film is controlled by the control device. (ACF) Adhesive means, inspection means and peeling means can automatically detect the anisotropic conductive film (ACF) which requires re-adhesion, and automatically peel and re-stick. Therefore, the operator is not required to intervene, and the work efficiency is not lowered. In addition, the separation and adhesion are carried out without incurring the complication of the mechanism, and the adhesion of only the necessary anisotropic conductive film (ACF) can be suppressed, and the anisotropic conductive film (ACF) which does not require heavy adhesion can be suppressed from being peeled off. The resulting waste of material.

Here, the adhesion of the anisotropic conductive film (ACF) of the substrate is caused by the fact that the anisotropic conductive film (ACF) is not adhered to the substrate, and the anisotropic conductive film (ACF) is rolled up for the substrate. The situation, the situation of floating, etc. can be judged as poor adhesion. In such a poor adhesion, in the case where the anisotropic conductive film (ACF) is not adhered to the substrate, it is of course necessary to re-stick. In addition, when the main crimping is performed in the rolled state in the case where the winding is caused, the adhesion area of the anisotropic conductive film (ACF) is insufficient, and the thickness of the anisotropic conductive film (ACF) becomes uneven. It becomes necessary to carry out the adhesion of the anisotropic conductive film (ACF).

A calibration mark for aligning the position of the driver circuit with each electrode group is provided on the substrate constituting the liquid crystal panel, and a calibration mark is provided at a position close to the end of the anisotropic conductive film (ACF). Therefore, when the anisotropic conductive film (ACF) at this portion floats from the substrate, the alignment mark is erroneously detected, and the relative positional relationship between the driver circuit and the liquid crystal panel greatly varies. Therefore, in the case where the floating of the anisotropic conductive film (ACF) is the end portion, particularly in the case where the vicinity of the alignment mark is floated, the adhesion of the anisotropic conductive film (ACF) is required. However, even if the portion other than the end portion of the anisotropic conductive film (ACF) floats, the anisotropic conductive film (ACF) is mainly pressed against the substrate after the temporary pressure bonding, even when it is tentatively crimped. The portion other than the end portion of the anisotropic conductive film (ACF) is floated, and then the main pressure is applied, so that it is not necessary to perform heavy adhesion.

Therefore, even in the case where the pasting state is bad, not all of them are re-adhesive, and the processing efficiency is improved by the work of re-sticking only in the case where re-adhesion is required, and the waste of the anisotropic conductive film (ACF) can be avoided. Or the complexity of the organization.

The anisotropic conductive film (ACF) adhesive device according to the second aspect of the invention is the anisotropic conductive film (ACF) adhesive device according to the first aspect of the invention, wherein the anisotropic conductive film (ACF) Adhesive means: an anisotropic conductive film (ACF) which is fed by an anisotropic conductive film (ACF) tape which is laminated on a release layer of an anisotropic conductive film (ACF). a tape feeding means; and the anisotropic conductive film (ACF) laminated on the backing paper tape fed from the anisotropic conductive film (ACF) tape feeding means is cut into each of the above a half-cutting means for length of each electrode group of the substrate; and a pressure-bonding means for pressing the anisotropic conductive film (ACF) cut by the half-cutting means to the surface of the substrate.

The adhesive anisotropic conductive film (ACF) can be individually divided by applying an anisotropic conductive film (ACF) adhesive device as in the second application of the patent application. In addition, after peeling off the anisotropic conductive film (ACF) which requires re-adhesion, by using the anisotropic conductive film (ACF) bonding device, the anisotropic conductive film (ACF) can be individually adhered only to the desired place. ).

The anisotropic conductive film (ACF) pasting device according to claim 3 of the invention is the anisotropic conductive film (ACF) adhesive device according to claim 1, wherein the anisotropic conductive Whether or not the film (ACF) needs to be re-adhered depends on whether or not the end portion of the aforementioned anisotropic conductive film (ACF) is separated by the aforementioned substrate, or whether the end portion of the aforementioned anisotropic conductive film (ACF) is reversed.

The anisotropic conductive film according to the anisotropic conductive film (ACF) bonding device according to the second application of the patent application, when the end of the anisotropic conductive film (ACF) is not separated from the substrate, or is not inverted. (ACF) is not detected and does not require re-adhesion of the anisotropic conductive film (ACF).

The anisotropic conductive film (ACF) adhesive device according to the fourth aspect of the invention is the anisotropic conductive film (ACF) adhesive device according to claim 1, wherein the inspection means has : a photographing means for photographing the both end portions of the anisotropic conductive film (ACF) of the substrate; and an image of the anisotropic conductive film (ACF) serving as a reference and a photograph taken by the photographing means The pattern matching of the portrait of the square conductive film (ACF) is used to determine the means of determining the adhesion state.

In order to check the adhesion state of the anisotropic conductive film (ACF), the inspection means as in the fourth aspect of the patent application can be applied. In this case, the image of the anisotropic conductive film (ACF) in a good adhesion state is taken as a reference image and memorized, and the image of the anisotropic conductive film (ACF) photographed by the photographing means is obtained. The pattern of the reference anisotropic conductive film (ACF) is pattern-matched and can be inspected. When the pattern matching is performed, and the two images are not completely matched, it is possible to determine that the re-sticking is not required as long as the difference between the two images is within the allowable range.

Here, in each of the anisotropic conductive films (ACF), it is not necessary to obtain an image of the entire length of the adhesive region of the anisotropic conductive film (ACF), and it is only necessary to obtain both end portions. That is, it is not necessary to obtain an image for the intermediate portion other than the both end portions. As described above, it is determined that it is necessary to be re-adhered, but the end is floated or rolled up. Therefore, the obtained image area is only the both ends of the ACF, and the photographing means need not be set to a wide range. Therefore, the image data obtained can be made extremely small, and the image processing at the time of pattern matching can be made high speed, and the processing efficiency can be improved. In addition, the image data obtained is very small, and high-resolution image processing can also be applied.

The anisotropic conductive film (ACF) pasting device according to the fifth aspect of the invention is the anisotropic conductive film (ACF) adhesive device according to claim 1, wherein the peeling means has a peeling tape supply means for feeding a peeling tape having a higher adhesion to an anisotropic conductive film (ACF) than the substrate; and pressing the peeling tape fed from the peeling tape supply means A pressurizing means for an anisotropic conductive film (ACF) adhered to the substrate.

In order to peel off the anisotropic conductive film (ACF) which requires re-adhesion, a peeling means as in the fifth item of the patent application can be used. The anisotropic conductive film (ACF) is adhered to the substrate by adhesion, and the anisotropic conductive film (ACF) can be peeled off by using a peeling tape having a higher adhesiveness than the substrate. In order to peel off a plurality of anisotropic conductive films (ACF), a peeling tape supply means is provided, and the peeling tape is continuously fed, and the anisotropic conductive film (ACF) is sequentially peeled off. At this time, although a certain amount of adhesive resin or the like remains on the portion of the exfoliated anisotropic conductive film (ACF) on the substrate, the anisotropic conductive film (ACF) is not adhered to the portion thereafter, and Lead to special problems. Further, if the release tape of the fifth application of the patent application is impregnated with a solvent such as IPA (isopropyl alcohol), the anisotropic conductive film (ACF) can be peeled off more efficiently.

The apparatus for manufacturing a flat panel display according to claim 6 of the present invention has the anisotropic conductive film (ACF) pasting device described in claim 1, 2, 3, 4 or 5. In addition, the flat panel display of the seventh aspect of the present invention is manufactured by the apparatus for manufacturing a flat panel display according to claim 6 of the patent application. As an example of a device to which the above-described anisotropic conductive film (ACF) bonding device can be applied, there is a device for manufacturing a flat display.

In the invention, when the separation and adhesion of the anisotropic conductive film (ACF) is performed, the anisotropic conductive film (ACF) which needs to be re-adhesive can be automatically detected, and the adhesion is automatically performed. By performing the re-sticking operation of the anisotropic conductive film (ACF) automatically without the intervention of the operator, the work efficiency can be improved, and the anisotropic conductive film (ACF) material can be prevented by performing the split adhesion. Waste is produced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a liquid crystal panel constituting a liquid crystal display as an example of a flat panel display, and is an example of a semiconductor circuit mounted via an anisotropic conductive film (ACF), and is represented by a TAB (tape automatic bonding). A driver circuit formed by a TCP (tape carrier package) mounted on a substrate. In addition, the substrate is not limited to a liquid crystal panel, and may be a printed circuit board or the like. Further, the substrate is not limited to the driver circuit, and is electrically connected via an anisotropic conductive film (ACF). Yes.

In the first embodiment, the liquid crystal panel 1 has a structure in which the substrate 2 and the upper substrate 3 are lower than a glass substrate. The lower substrate 2 has a protruding portion 2a that protrudes from the upper substrate 3 by a specific width at least on two sides, and the plurality of driver circuits 4 are mounted on the protruding portion 2a. The driver circuit 4 is constructed by arranging the integrated circuit element 4b on the film substrate 4a.

The electrode group 5 is formed on the protruding portion 2a of the lower substrate 2, and a specific number of electrodes connected to the TFT circuit are formed, and calibration marks 6 are formed on the left and right sides of the electrode group 5. The electrode group 5 is formed in plural in the protruding portion 2a, and each electrode group 5 is formed with a blank region having a specific width between the adjacent electrode groups 5. An electrode group 7 composed of a plurality of electrodes electrically connected to the electrode group 5 on the substrate side is formed in the driver circuit 4, and calibration marks 8 are formed on the left and right sides of the electrode group 7. The alignment of the electrode group 5 and the electrode group 7 is performed so that the electrodes of the electrode group 5 and the electrode group 7 are aligned with each other based on the calibration mark 8 of the driver circuit 4 and the alignment mark 6 of the protruding portion 2a.

The driver circuit 4 is mounted on the liquid crystal panel 1 via the ACF 9 . As is well known, ACF9 heats and pressurizes ACF 9 between driver circuit 4 and liquid crystal panel 1 in order to disperse minute conductive particles in a binder resin having adhesive properties. As a result, the electrodes constituting the electrode group 5 and the electrodes constituting the electrode group 7 are electrically connected to each other via the conductive particles, and the driver circuit 4 is fixed to the liquid crystal panel 1 by thermal curing of the binder resin. Here, the ACF 9 is divided into positions of the electrode group 5 provided in each of the protruding portions 2a of the lower substrate 2, and is adhered to each length L in an amount. Thereby, the ACF 9 can be used without waste, and the attached ACF 9 is almost completely covered by the driver circuit 4.

Fig. 2 is a view showing the schematic configuration of an ACF pasting device of the present invention. The ACF adhesive device mainly includes an adhesive device 10U as an ACF adhesive means, an inspection device 60U as an inspection means, a peeling device 70U as a peeling means, and a control device 80U as a control means. In addition, Fig. 4 shows a control device 80U.

The pasting device 10U will be described using the third and fourth figures. The sticking device 10U mainly has a support member 10, a supply reel 11, a bottom paper web 12, an ACF reel 13, and rollers 14 to 17, a driving roller 18, a discharge portion 19, and a swing arm 20. And rotating the shaft 21. The support member 10 is provided with a support member of the ACF 9 for the pasting unit of the liquid crystal panel 1, and the support member 10 is provided with a supply reel 11 for loading and unloading. The ACF 9 is laminated on the peeling layer of the base paper web 12 to constitute an ACF tape 13 which is wound around the supply reel 11. The ACF reel 13 is guided along the traveling path formed by the rollers 14 to 17 of the support member 10. The driving roller 18 is driven to sandwich the bottom paper web 12 after the ACF 9 is adhered to the liquid crystal panel 1, and is fed to the discharge portion 19.

The rollers 14, 15 are guide rollers for the feeder of the ACF reel 13, and the guide rollers 15 are attached to the swing arm 20. Further, the swing arm 20 is pivoted about the rotation shaft 21. A driving means (not shown) formed by a motor or the like is connected to the rotating shaft 21, and the swing arm 20 is swung in the direction of the arrow F, and at least one ACF is attached from the supply reel 11 (amount of length L). The tape 13 is fed between the rollers 14, 15. As a result, the reaction force acting when the ACF tape 13 is fed out is always constant, and the resistance to the delivery force does not change based on the difference in the winding amount of the supply reel 11.

The rollers 16 and 17 are guided in the horizontal direction by the ACF tape 13 in the traveling path as shown in the fifth and sixth figures, and define the horizontal guide of the adhesion length of the ACF 9 to the liquid crystal panel 1 once. Roller. The horizontal guide roller 17 defines the position of the beginning of the attachment of the ACF 9, and the horizontal guide roller 16 defines the position of the attachment end of the ACF 9, by which the adhesion area of the ACF 9 is set. The horizontal guide rollers 16 and 17 are formed at the both end portions of the cylindrical portions 16a and 17a to form the crotch portions 16b and 17b, and the height of the portion protruding from the cylindrical portions 16a and 17a of the crotch portions 16b and 17b is associated with the ACF roll. The thickness of the bottom paper web 12 in the belt 13 is almost the same, or only slightly larger than it.

Therefore, between the horizontal guide rollers 16, 17, the ACF 9 is adhered to the liquid crystal panel 1, and is separated from the bottom paper web 12 at a position on the downstream side of the horizontal guide roller 17, and the bottom paper roll after the ACF 9 is peeled off. The belt 12 is recycled. Then, the drive roller 18 is provided at a position further downstream than the adhesion region of the ACF 9 divided by the horizontal guide rollers 16, 17. The drive roller 18 has a drive roller 18a and a clamp roller 18b, and the bottom paper roll 12 is sandwiched between the drive roller 18a and the clamp roller 18b. Then, by driving the drive roller 18a to rotate, the ACF tapes 13 are fed at equal intervals according to the length L.

As shown in FIG. 4, the support member 10 is attached to the elevation drive unit 22. The elevation drive unit 22 is mounted on the front and rear drive unit 23, and the front and rear drive unit 23 is mounted on the parallel drive unit 24. With such a mechanism, the adhesion region of the ACF 9 defined by the horizontal guide rollers 16 and 17 in the bypass path of the ACF tape 13 can be arranged in the X-axis direction in the horizontal plane (with the electrode group 5 adhered to the ACF 9). The orthogonal direction) and the Y-axis direction (the direction in which the electrode groups 5 are arranged) move. Further, the liquid crystal panel 1 is placed on the fixed table 25 and fixedly held by vacuum suction or the like. Here, the front and rear driving portions 23 move the adhesive region in the direction in which the liquid crystal panel 1 approaches and separates, and the parallel driving portion 24 is attached to the liquid crystal panel 1 so that the adhesive region is aligned with the electrode group 5 to which the ACF 9 is adhered. Parallel direction, that is, the movement in the X-axis direction.

The elevation drive unit 22 has an inclined block 30 and a cylinder 31 that moves the inclined block 30 in the front-rear direction. Further, a sliding member 32 that is engaged with the inclined surface of the inclined block 30 is coupled to the support member 10. The sliding member 32 has an inclined surface that coincides with the inclined block 30, and is not displaceable in the vertical direction by the regulating member 33. Therefore, by driving the air cylinder 31, the support member 10 can be displaced in the up and down direction. Here, an electric motor may be used instead of the cylinder 31.

The front and rear drive unit 23 moves the base 34 of the tilting block 30 to the front and rear of the apparatus, and the rear movement of the base 34 is performed by a driving means 35 formed by a cylinder or a motor. Then, the base 34 and its driving means 35 are mounted on the transport means 36. The transporting means 36 rotationally drives the roller lead screw 37 constituting the ball screw feeding means by driving a motor or the like (not shown) so that the entire sticking means 10U can be arranged in the electrode group 5 with the liquid crystal panel 1. The directions move in parallel. In addition, the fixed table 25 may be provided with an XY direction moving mechanism for transferring the liquid crystal panel 1 between the front work and the rear work, or a position adjustment unit in the horizontal rotation direction or an adjustment unit in the oblique direction.

In the traveling path of the ACF tape 13 that is mounted on the support member 10, as shown in FIGS. 7 and 8, a cutter as a half-cutting means is provided at a position slightly downstream of the position of the horizontal guide roller 16. The unit 40, the cutter unit 40 is configured to be movable in the front-rear direction with respect to the surface of the support member 10. The cutter unit 40 has a cutter 41 and a cutter drill 42, which is rotatable in the direction of approaching and leaving the cutter drill 42 centering on the shaft 43 as indicated by the direction of the arrow. Then, the spring force acting on the spring 44 of the cutter 41 is always held in a state of being separated from the cutter drill 42, and is pressed against the spring 44 by the crimp roller 46 provided in the cylinder 45. The knife 41 is oscillated and displaced toward the direction of the cutter drill 42. Then, the cutter 41 is at the position closest to the cutter drill 42 with the same thickness as the bottom paper web 12 of the ACF tape 13 formed therebetween, and is only slightly spaced apart. Thereby, only the ACF 9 can be half cut.

In order to adhere the ACF 9 to the protruding portion 2a of the lower substrate 2, the ACF tape 13 is attached to the position between the horizontal guide rollers 16, 17, and is pressed by a specific pressing force from the upper portion by the press fitting 47. The pressure joint 47 is attached to the support member 10 by the vertical drive means 48, and the ACF tape 13 is biased to the liquid crystal panel 1 by the upper and lower drive means 48. Further, the pressure joint 47 is provided with a heating means such as a heater (not shown), and the pressure joint 47 is thermocompression bonded to the liquid crystal panel 1 by the ACF tape 13. However, the degree of heating is set to be lower than the degree of softening of the binder resin of ACF9. Then, the press fitting 47 has a width dimension which can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has the adhesive length of the ACF9. Further, a receiving table 49 for supporting the crimping region in the liquid crystal panel 1 from below when the ACF tape 13 of the press fitting 47 is pressed against the liquid crystal panel 1 is provided.

As described above, the support member 10 is provided with an adhesive unit constituting the ACF pasting device, that is, the supply reel 11, the traveling path of the ACF reel 13 supplied from the supply reel 11, and the cutter unit 40 constituting the half cutting means. And the pressure joint 47.

Next, the inspection device 60U will be described. Returning to Fig. 2, the inspection device 60U is mainly configured to include an illumination source 61, a television camera 62, and a determination device 63. The illumination source 61 is a light source that supplies illumination light to the ACF 9, and the television camera 62 is a photographing means for attaching the photographing ACF9. However, the television camera 62 can obtain an image of the entire ACF 9, and it is possible to obtain only the images of both ends of the ACF 9 in order to improve the efficiency and the image processing with high precision. The determination device 63 stores an image (reference image) of both ends of the ACF 9 having a good adhesion state in advance, and compares the image of the captured ACF 9 with the reference image. Further, in order to allow the inspection device 60U to move in parallel with the traveling direction of the elevation drive unit 22, the guide member 64 and the ball screw feed means 65 are provided. Further, the reference image is not limited to the both end portions of the ACF 9, and it is preferable to include the image of the calibration mark 6 provided in the vicinity thereof.

Pattern matching can be applied to an example of a technique for comparing portraits. By comparing the two images by pattern matching, it is possible to determine that the adhesion state of the ACF is good when the amount of error is not exceeded, and in the case of exceeding, it can be determined that re-sticking is required. As shown in FIG. 2, the inspection device 60U may be operated independently of the attachment device 10U or may be integrally operated.

The peeling device 70U will be described using Figs. 2 and 9. The peeling device 70U mainly includes a peeling tape 71, a cylinder 72, a pressing member 73, a tape supply spool 74, a take-up reel 75, and a driving unit 76. The peeling tape 71 is suitable for wiping off the tape of the adhesive, and pressing the wiper surface against the ACF 9 is peeled off by the adhesive force of the ACF 9 . Therefore, the affinity of the peeling tape 71 for the adhesive force of the ACF 9 is made such that the peeling tape 71 is higher than the lower substrate 2. The cylinder 72 is a cylinder that acts to press the pressing member 73 against the pressing force for the ACF 9. The pressing member 73 is a member for pressing the peeling tape 71. The take-up reel 74 is a supply reel for the peeling reel 71, and the take-up reel 75 is a take-up reel for recovering the peeling reel 71. The drive unit 76 is a drive unit that supplies power for rotationally driving the take-up reel 75.

The tape take-up reel 74 can feed the peeling tape 71 at a pitch of 1 (approximately the length L of the first drawing), and the peeling tape 71 peels off one ACF 9 and peels off the next ACF 9 from the tape. The supply reel 74 feeds the peeling tape 71 of one pitch. Therefore, the drive unit drive unit 76 controls the take-up reel 75 so that the peeling reel 71 of one pitch is fed out so as to take up the peeling tape 71 of one pitch.

As described above, the sticking device 10U is driven by the conveyance means 36 by the rotation of the roller lead screw 37, and moves as a whole in parallel with the arrangement direction of the electrode group 5. The peeling device 70U is also the same, and is configured to be movable in the same direction as the pasting device 10U, and the peeling device 70U can be moved along the roller lead screw 37. At this time, the peeling device 70U and the pasting device 10U can be moved by the individual independent ball lead screws. However, in order to avoid complication of the device or mechanism, the peeling device 70U and the pasting device 10U are shared as in Fig. 10. The roller lead screw 37 is preferred.

The peeling device 70U and the bonding device 10U share the relationship of the roller lead screw 37, and it is necessary to prevent the interference from interfering with each other. Therefore, the clutch mechanisms 10C and 70C are provided, for example, in the peeling device 70U and the pasting device 10U. When the pasting device 10U operates to adhere the ACF 9, the clutch mechanism 10C of the pasting device 10U is brought into an operating state, and the clutch mechanism 70C of the peeling device 70U is released. Thereby, only the pasting device 10U moves, and the peeling device 70U does not move. On the other hand, when the peeling device 70U operates to peel off the ACF 9, the clutch mechanism 70C of the peeling device 70U is brought into an operating state, and the clutch mechanism 10C of the pasting device 10U is released. Thereby, only the peeling device 70U moves, and the pasting device 10U does not move. By employing such a mechanism, interference between the pasting device 10U and the peeling device 70U can be avoided.

The control device 80U will be described. In the control device 80U shown in Fig. 4, in order to control the bonding device 10U and the inspection device 60U and the peeling device 70U, the control device 80U is connected to the bonding device 10U and the inspection device 60U and the peeling device 70U. In order to control the respective devices, the control device 80U employs a configuration in which input and output of signals in both directions (or one direction) can be performed between the control device 80U and each device.

Hereinafter, each operation of adhesion, inspection, peeling, and re-adhesion of ACF9 will be described. First, the adhesion of ACF9 will be explained. As shown in Fig. 8, the ACF tape 13 is half-cut. At this time, the support member 10 is held at the raised position by the elevation drive unit 22, and the half-cut ACF 9 is placed at the position to be adhered to the electrode group 5 of the liquid crystal panel 1 provided on the fixed table 25. Thus, when the half cut of the ACF tape 13 is performed, the half cut position is the pasting end position, and the end portion of the previous adhesive ACF 9 becomes the pasting start end position. Then, the horizontal guide roller 17 is disposed at the adhesive start end position, and the horizontal guide roller 16 is disposed at the pasting end position. In this state, the elevation drive unit 22 is operated, and as shown in Fig. 11, the support member 10 is lowered. The lowermost position of the support member 10 is such that the surface of the ACF 9 of the ACF tape 13 between the horizontal guide rollers 16 and 17 has a slight gap in a non-contact state and faces the protruding portion 2a in the lower substrate 2 of the liquid crystal panel 1.

Therefore, as shown in Fig. 12, the press fitting 47 is lowered, and the ACF tape 13 is pressure-bonded to the lower substrate. When crimping, the specific load set by the up-and-down driving means 48 acts on the ACF tape 13, and the equal pressing force acts on the bonding start end position in the ACF tape 13 to the end position, and The pressing force of the press fitting 47 does not act on the base end side more than the position of the pasted end of the cut. At this time, in the protruding portion 2a of the lower substrate 2 of the liquid crystal panel 1, at least the lower surface where the position of the ACF 9 is adhered is the abutting receiving portion 49.

When the ACF 9 is pressed against the lower substrate 2, as shown in Fig. 13, the pressure joint 47 is raised to release the pressing force to the ACF tape 13. Although the ACF 9 is adhered to the lower substrate 2, the ACF 9 is laminated with the bottom paper web 12 again. Therefore, when the base paper web 12 is peeled off, in order to prevent the ACF 9 from floating, after the crimping is completed, the crimping joint 47 is separated from the ACF coil 13, and as shown in Figs. 14 and 15, the lifting drive is driven. The portion 22 operates to raise the support member 10. At this time, the front and rear drive units 23 are also driven together with the elevation drive unit 22, and the bottom paper web 12 is pulled away from the ACF 9 when the operation is performed by pulling up obliquely upward in the width direction of the ACF tape 13. The ground was stripped. At this time, the bottom paper web 12 is integrally joined to the ACF 9 and, when peeled off, a part of the ACF 9 may be floated or rolled up.

By the above, the adhesion of the ACF 9 to one of the electrode groups 5 in the protruding portion 2a of the lower substrate 2 is completed. The support member 10 is held at the raised position, the drive roller 18 is operated, and the ACF tape 13 is pulled out from the supply reel 11 to supply one pitch portion at a time. Then, the parallel drive unit 24 is operated to move the entire attachment device 10U by one pitch. This 1 pitch is the interval P between the pasting position of the front and rear ACF 9 as shown in Fig. 1. Therefore, the adhesion operation to the ACF 9 of the next electrode group 5 is performed by the operation of the parallel driving unit 24. In this regard, the fixed table 25 that holds the liquid crystal panel 1 does not operate. Then, the adhesion to the ACF 9 for the electrode group 5 is performed in accordance with the same operation as described above.

Then, when the pasting operation of the ACF 9 is completed by the pasting device 10U, the bonding device 10U is moved to the end position of the roller lead screw 37, the clutch mechanism 10C is released, and the operation of the bonding device 10U is stopped.

When the pasting of one ACF 9 is completed, or when the division and pasting of the ACF 9 of the plurality of electrodes and all of the electrode groups 5 is completed, the adhesion state of the ACF 9 is checked. Therefore, at the end of the pasting operation of the ACF 9, the pasting device 10U outputs the signal to the control device 80U, and when the control device 80U has input the signal, the control device 80U outputs a command for checking the pasting state of the ACF 9 to the inspection device 60U. In addition, after the ACF9 adhesive bonding operation is completed, the adhesion state inspection is not performed, and the pasting operations are overlapped, and the adhesion state inspection can be performed. When the inspection apparatus 60U and the attachment apparatus 10U are integrally operated as described above, the inspection is performed immediately after the end of the pasting operation, and it is easy to overlap the two operations.

The inspection device 60U starts the inspection of the adhesion state of the ACF 9 in accordance with a command from the control device 80U. The television camera 62 moves the guide member 64 at a pitch of one pitch by the ball screw feeding means 65, and gradually obtains an image of both end portions of the ACF 9 in each electrode group 5. The acquired image is output to the determination device 63, and the determination device 63 compares the reference image stored in advance to determine whether the pasting state is good or not. The image obtained is limited to the both ends of the ACF 9 (limited to the dotted line in the figure) as shown in Fig. 16. The amount of image data is small, and the image processing by pattern matching can be performed at high speed. Efficiency is improved. In addition, the image processing can be performed with high precision even in the case of a small amount of data. At this time, the basis of the good or bad may be that the two images are not completely identical, and as long as the difference between the two images is within a certain range, it can be judged to be good, and the heavy viscosity of the ACF 9 is not required. On the other hand, when the difference between the two images exceeds a certain range, it is determined that the generated ACF 9 is poorly attached.

Here, although the ACF 9 has a phenomenon in which a portion other than the both ends is floated, the floating of the portion is not required to be sticky even if it is judged to be defective in adhesion. Here, the television camera 62 photographs both end portions of the ACF 9 to detect whether or not the portion is floated or rolled up, and even if other portions are floated or rolled up, it is not determined that the ACF 9 needs to be re-adhesive. Here, when the ACF 9 is partially separated from the lower substrate 2, it can be determined as "floating", and when one of the ACFs 9 is reversed, it can be determined as "rolling up".

Together with the movement of the television camera 62, the adhesion state of the ACF 9 is checked for all the electrode groups 5. By this inspection, it is possible to obtain information on whether or not each ACF 9 needs to be re-adhesive, and this information is output from the determination device 63 of the inspection device 60U to the control device 80U. At this time, not only information on whether or not to re-stick, but also information on the position of the ACF 9 that needs to be re-adhered in each ACF 9 is also output to the control device 80U. Further, the determination device 63 may be provided by the control device 80U. In this case, the image of the photographed ACF 9 is sequentially output to the control device 80U, and the determination device in the control device 80U determines whether or not re-adhesion is required. .

Next, in order to carry out the re-adhesive work of ACF9, peeling of ACF9 which requires re-adhesion is performed. For this reason, the control device 80U controls the peeling device 70U to peel off the ACF 9 which is in a bad adhesion state. At this time, the control device 80U outputs the information of the ACF 9 and its place that need to be re-adhered to the peeling device 70U. The peeling device 70U is driven by the rotation of the roller lead screw 37 to move to the place where the ACF 9 to be peeled off is moved.

Here, the relationship of the peeling device 70U moves causes the clutch mechanism 70C of the peeling device 70U to be in an operating state. At this time, since the clutch mechanism 10C is released at the end position, the sticking device 10U does not operate, and the sticking device 10U does not interfere with the peeling device 70U. In this state, the moving peeling device 70U lowers the pressing member 73 attached to the front end of the cylinder 72 as shown in Fig. 17 . When the pressing member 73 is lowered, the peeling tape 71 is also lowered. Then, as shown in Fig. 18, the lower substrate 2 is completely pressed by the pressure contact pressing member 73, and the peeling tape 71 is completely in close contact with the ACF 9 to be peeled off.

In this state, as shown in Fig. 19, the pressing member 73 is raised by the operation of the air cylinder 72, and the pressing force is released. At the same time as the rising of the pressing member 73, the peeling tape 71 also rises, so that the ACF 9 that is in close contact with the peeling tape 71 is peeled off from the lower substrate 2. Thereby, the ACF 9 to be peeled off can be peeled off.

Then, when the other ACF 9 is peeled off, the peeling device 70U is moved to the position of the ACF 9 to be the heavy target, and similarly, the peeling tape 71 is pressed against the ACF 9 to peel off the ACF 9 . At this time, in order to peel off the other ACF 9, the tape supply reel 74 and the take-up reel 75 are supplied with a tape, and in the new portion of the peeling tape 71, the other ACF 9 is peeled off.

After the peeling of the ACF 9 which is the object to be peeled off is completed, the peeling device 70U is moved to the end position on the side opposite to the end position on which the pasting device 10U stands by, and the clutch mechanism 70C is released to be in the standby state. Thereby, the adhesive device 10U does not interfere with the peeling device 70U even if it moves.

Here, a small amount of adhesive or the like remains in the portion of the lower substrate 2 from which the ACF 9 is peeled off by the peeling device 70U. Therefore, the residue originally needs to be beautifully removed, but this portion is re-adhered to ACF9 again, and there is no problem even if a little adhesive remains. Further, when the peeling device 70U peels off the ACF 9, the ACF 9 is in a state of being temporarily crimped, and the ACF 9 can be easily peeled off.

Next, the ACF 9 was reattached to the portion of the ACF 9 which was peeled off. This pasting operation is performed by the pasting device 10U. Therefore, the control device 80U outputs a signal to the control device 80U that the ACF 9 to be peeled off is completely peeled off from the peeling device 70U, and the control device 80U that inputs the signal controls the sticking device 10U to re-adhere the ACF 9 to be the object of heavy adhesion. At this time, the sticking device 10U again causes the clutch mechanism 10C to be in an operating state, so that it can be moved. The pasting device 10U follows the signal from the control device 80U and moves to the re-stick position of the ACF9. In the above-mentioned heavy-adhesive operation, in order to divide and stick all the ACFs 9, the sticking device 10U is moved by one pitch, but in the case of heavy-adhesion work, the ACF9 is adhered only in the peeled portion. The parallel driving unit 24 and the bonding apparatus 10U are directly sent to the target portion.

Therefore, the control device 80U outputs the information for the ACF 9 that is the target of the heavy adhesion (that is, the information of the peeled ACF 9) to the parallel driving portion 24 of the pasting device 10U, and the parallel driving portion 24 moves the pasting device 10U based on this information. Then, as described above, the ACF tape 13 is supplied, half of the ACF 9 is cut, and the cut ACF 9 is pressed against the liquid crystal panel 1. Thereby, the adhesion of ACF9 can be performed.

After the re-adhesion of all the ACFs 9 is completed, the pasting device 10U moves to the end position again, and at this position, the clutch mechanism 10C is released and the standby state is reached. By the above, the re-sticking operation is performed, and the operations of one liquid crystal panel 1 are all completed. Then, when the processing of the next liquid crystal panel 1 is performed, the clutch mechanism 10C is again brought into an operating state, and the ACF 9 is gradually divided and pasted at one place.

All of the above operations are performed by the control device 80U, whereby the ACF 9 that needs to be re-adhesive can be automatically defined to perform re-adhesion without the intervention of the operator.

1. . . LCD panel

2. . . Lower substrate

3. . . Upper substrate

4. . . Driver circuit

5. . . Electrode group

6. . . Calibration mark

7. . . Electrode group

8. . . Calibration mark

9. . . Anisotropic conductive film

10. . . Support member

10U. . . Adhesive device

11. . . Supply reel

12. . . Bottom paper tape

13. . . Anisotropic conductive film tape

14~17. . . Wheel

18. . . Drive roller

19. . . Discharge department

twenty two. . . Lifting drive

twenty three. . . Front and rear drive

twenty four. . . Parallel drive

40. . . Cutter unit

47. . . Pressure connector

60U. . . Inspection device

70U. . . Stripping device

71. . . Stripping tape

80U. . . Control device

Fig. 1 is a schematic view showing an essential part of a liquid crystal cell as a substrate to which an ACF is pasted and a driver circuit mounted on the substrate.

Fig. 2 is a schematic configuration diagram of an ACF pasting device.

Fig. 3 is a front elevational view showing the appearance of the pasting device.

Figure 4 is a left side view of Figure 3.

Fig. 5 is an explanatory view of the configuration of the horizontal feed roller.

Figure 6 is a cross-sectional view taken along line A-A of Figure 5.

Fig. 7 is a block diagram showing the configuration of the cutter unit.

Fig. 8 is an explanatory view showing a half cut process.

Figure 9 is a left side view of the stripping device.

Fig. 10 is a plan view showing the action of the pasting device and the peeling device.

Fig. 11 is an explanatory view showing a state in which the ACF tape is lowered.

Fig. 12 is an explanatory view showing a lowered state of the press fitting.

Fig. 13 is an explanatory view showing the pull-up state of the crimp block.

Fig. 14 is an explanatory view showing a peeling operation of the ACF from the bottom paper web.

Figure 15 is a cross-sectional view taken along line B-B of Figure 14.

Figure 16 is a diagram showing the inspection of both ends of the ACF.

Fig. 17 is an explanatory view showing a state in which the tape is peeled off by pressing.

Fig. 18 is an explanatory view showing a lowered state of the pressing member.

Fig. 19 is an explanatory view showing a state in which the pressing member and the peeling tape are pulled up.

10U. . . Adhesive device

37. . . Roller lead screw

60U. . . Inspection device

61. . . Illumination source

62. . . Television camera

63. . . Decision device

64. . . Guide member

65. . . Ball lead screw feeding means

70U. . . Stripping device

71. . . Stripping tape

72. . . cylinder

73. . . Pressing member

74. . . Tape and reel supply reel

75. . . Tape reel

Claims (6)

An ACF (isotropic conductive film) pasting device, characterized in that: an ACF adhesive means comprising: in order to adhere an ACF tape to an ACF by a roll of a backing paper, attaching the ACF to a plurality of electrodes And each of the electrode groups on the plurality of substrates is formed, and the ACF tape is pressed against the substrate to be lifted and driven; the inspection means is for inspecting the adhesion of the ACF adhered to the substrate, and ACF which must be re-applied; the ACF peeling means is to peel the peeling tape from the ACF at the same time as the ACF is pressed against the ACF, and the peeling tape is peeled off from the substrate together with the ACF. And a moving means for moving the ACF bonding means and the ACF peeling means in a direction parallel to an arrangement direction of the electrode groups of the substrate; and the control means is driven as follows, that is, by the inspection means When the ACF reattachment is required, the ACF that needs to be reattached is removed from the substrate by the ACF peeling means, and the ACF pasting means is reattached at the ACF. ACF to be re-posted. The ACF pasting device according to claim 1, wherein the ACF attaching means further comprises: an ACF tape feeding means for feeding the ACF tape; and the tape is supplied from the ACF. The ACF of the ACF tape fed to the means is cut into a half-cutting means for each length of each electrode group adhered to the substrate: the ACF tape is crimped by the pressure joint of the ACF bonding means The above substrate. The ACF pasting device of claim 1, wherein the ACF is required to be re-adhered according to whether the end of the ACF is separated by the substrate or whether the end of the ACF is reversed. . The ACF pasting device according to claim 1, wherein the inspection means includes: a photographing means for photographing the both ends of the ACF attached to the substrate; and an image of the ACF serving as a reference and The pattern matching of the image of the ACF photographed by the photographing means determines the means for determining the sticking state. The ACF pasting device according to claim 1, wherein the moving means is constituted by a ball screw feeding means, and the ACF attaching means and the ACF peeling means are respectively attached to the ball lead screw through a clutch mechanism. Composed of means. A manufacturing apparatus for a flat panel display, comprising: the ACF pasting device described in claim 1, 2, 3, 4 or 5.