JP2009187037A - Acf sticking method and acf sticking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely peel a mount tape from an ACF after an ACF tape is half-cut and division-stuck, and to stick ACFs in order by sticking areas of a substrate. <P>SOLUTION: The ACF tape 13 from a supply reel 11 is half-cut halfway by a cutter unit 30, guided to a position between horizontal guide rollers 16 and 17, and crimped at the position to a position of a wiring group 5 constituting a crimp area of a lower substrate 2 of a liquid crystal cell 1 by a crimping head 37. After the crimping ends, the crimping head 37 is elevated to stick an ACF 9 on a sticking area of the lower substrate 2, and then a sticking machine including the crimping head 37 is pitch-send to a next sticking area to crimp an ACF 9 again, so that an ACF 9 is stuck on each sticking area of the lower substrate 2 each time the sticking machine is pitch-sent. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for attaching an ACF (Anisotropic Conductive Film) to a substrate for mounting a semiconductor circuit device including a driver circuit on a substrate constituting a liquid crystal panel or the like.

  For example, a liquid crystal panel in a liquid crystal display device has a configuration in which a printed circuit board is connected via a semiconductor device to a liquid crystal cell composed of two upper and lower transparent substrates in which a liquid crystal enclosure space is formed. Here, the semiconductor circuit device is a driver circuit for driving a liquid crystal panel, and the driver circuit includes inner and outer electrodes, and the inner electrode is disposed on one substrate constituting the liquid crystal cell. The outer electrode is electrically connected to the printed circuit board. As a typical driver circuit mounting method, a chip-like IC package is directly mounted on a liquid crystal cell substrate, and a printed circuit board is connected to the liquid crystal cell with a COG (Chip On Glass) method, There is a TAB (Tape Automated Bonding) system in which a TCP (Tape Carrier Package) having a driver circuit mounted on a substrate is connected to a liquid crystal cell and a printed circuit board.

  In any case, a wiring pattern is formed on at least two sides on the surface of one substrate constituting the liquid crystal cell, and this wiring pattern and the inner electrode of the driver circuit are electrically connected. A plurality of driver circuits are mounted on each side. Therefore, although wiring patterns are formed in the liquid crystal cell at a minute pitch interval, a predetermined number of wiring patterns are formed as a group for each semiconductor device mounted thereon, thereby constituting a plurality of wiring groups. Therefore, the liquid crystal cell has a plurality of wiring groups and a blank area between adjacent wiring groups. The driver circuit is also connected to the printed circuit board. Therefore, a plurality of wiring groups each including a predetermined number of wirings are formed on the printed circuit board side as well as the liquid crystal cell side. Note that the number of wires constituting the wiring group on the printed circuit board side is usually smaller than the number of wires in the wiring group on the liquid crystal cell side.

  When connecting a driver circuit as a semiconductor circuit device to a liquid crystal cell or a printed circuit board, the driver circuit is surely electrically connected between a large number of electrodes formed at minute intervals and wiring. Must be fixed. For this purpose, ACF is used. ACF is an adhesive binder resin in which fine conductive particles are uniformly dispersed. By thermocompression bonding of this ACF, the electrode and the wiring are electrically connected through the conductive particles, and heating is performed. As a result, the binder resin is cured to fix the driver circuit to the liquid crystal cell or the printed circuit board.

  Therefore, for example, an ACF is attached to a portion where a wiring pattern is provided on one substrate of a liquid crystal cell, and a TCP as a driver circuit is mounted on the TAB on this substrate. Since ACF is an adhesive substance, an ACF having a predetermined width is laminated on a mount tape via a release layer to constitute an ACF tape. The ACF tape is wound around a supply reel, sent out from the supply reel, and pasted on the substrate surface by a pasting machine. For this purpose, the ACF adhering machine is provided with a supply reel mounting section, and an ACF tape supplied from the supply reel is routed along a predetermined path from a guide roller or the like to an appropriate place. A guide member is arranged.

  The ACF is attached to the substrate by batch attachment that is continuously attached over the entire length of one side of the substrate and divided attachment that is divided for each wiring group and attached so that the ACF is not attached to the blank area. is there. In the case of batch pasting, the ACF is also pasted to unnecessary blank areas, so that the material is wasted, and the adhesive resin and the conductive particles constituting the ACF remain exposed in the blank areas. Therefore, inconvenience may occur for processing and processing after mounting the semiconductor device. Therefore, it is preferable to divide and paste.

  For example, Patent Document 1 discloses a method of dividing and pasting each ACF wiring group. In this Patent Document 1, the ACF tape with the mount tape being bonded is pasted and cut for each length, and the adhesive tape is placed on the mount tape by crimping it to the site where each wiring group of the liquid crystal cell is provided. By sticking and pulling up the adhesive tape, the mount tape is fixed to the adhesive tape side and peeled off from the ACF.

JP-A-9-83114

  In Patent Document 1 described above, an adhesive force is applied to the surface of the ACF tape opposite to the ACF attachment surface of the mount tape so that the mount tape is peeled off from the liquid crystal cell. Is provided with a release layer for facilitating peeling, so that the backing tape can be reliably peeled off from the ACF if the adhesive force of the adhesive tape for peeling the backing tape is sufficiently strong.

  Half-cut the ACF tape, cut only the ACF, hold the mount tape in a continuous state, press the ACF tape against the liquid crystal cell to attach the ACF, and lift the mount tape from the liquid crystal cell By adopting a method in which the backing tape is peeled from the ACF and recovered, it is not necessary to use the above-mentioned peeling adhesive tape, so that the number of steps can be reduced and the configuration can be simplified. By the way, in the case of the above-described batch bonding, since the ACF has a wide adhesive surface, it is advantageous in that the mount tape can be stably peeled off from the ACF. Here, the division bonding is to divide each of the plurality of electrodes into a group of electrodes to which one ACF is attached to a substrate on which a plurality of electrodes are formed, and set a plurality of attachment regions, An ACF is attached to each electrode group in each attachment region.

  The present invention has been made in view of the above points. The object of the present invention is to detach the backing tape from the ACF securely after the ACF tape is half-cut and divided and pasted. The purpose is to enable the ACF to be sequentially attached to each attachment region.

  In order to achieve the above-described object, in the present invention, a supply reel for feeding out an ACF tape in which an ACF is laminated on a release layer of a mount tape, and a hook provided in the vicinity of the ACF attachment start and end positions, respectively. The guide roller, the pressure-bonding head provided so as to be movable up and down between the two guide rollers, and the mount tape from which the ACF is peeled are collected, and the plurality of electrodes are applied to the substrate on which the plurality of electrodes are formed. Is divided into electrode groups to which one ACF is pasted, a plurality of pasting regions are set, and the ACF pasting method for pasting the ACF for each electrode group for each pasting region is as follows: A half-cut step of cutting the ACF for each length of the ACF tape attached to the one electrode group of the substrate; An ACF pressure-bonding step in which the ACF tape is pressure-bonded to the affixing region with a predetermined pressure by the pressure-bonding head, a mount peeling step in which the mount tape is peeled off from the ACF of the ACF tape pressure-bonded in the ACF pressure-bonding step, After the ACF is pasted to the pasting area, it comprises a pitch feeding step for pitch-feeding the crimping head to the next pasting area, and the ACF crimping step, the mount stripping step and the pitch feeding step are sequentially repeated. There is to make it work.

  Further, in the present invention, a plurality of electrodes are divided into electrode groups to which a single ACF is attached to a substrate on which a plurality of electrodes are formed, and a plurality of attachment regions are set. The structure of the ACF adhering apparatus that individually attaches the ACF for each adhering area includes a supply reel that sends out an ACF tape in which an ACF is laminated on a peeling layer of a mount tape, and the ACF tape that is sent out from the supply reel. The mounting tape has continuity, a half-cutting means for cutting the ACF for each length of the tape attached to one electrode group of the substrate, and the vicinity of the ACF application start position and end position, respectively. A guide roller with a hook disposed, and an ACF which is provided between the two guide rollers so as to be movable up and down and cut by the half-cutting means. A bonding mechanism comprising a bonding head which is crimped to the surface, is characterized in that the bonding mechanism was configured and a pitch feed means for feeding pitch per pasting region of the ACF of the substrate.

  As described above, the ACF can be sequentially attached to each attachment region of the substrate by repeating the operations of the pressure bonding of the ACF tape to the substrate and the separation of the mounting tape after the pressure bonding without dividing the mounting tape.

It is a principal part external view which shows the liquid crystal cell as a board | substrate with which ACF is affixed, and the driver circuit mounted in this board | substrate. It is a front view which shows schematic structure of an ACF sticking machine. FIG. 3 is a right side view of FIG. 2. It is a structure explanatory drawing of a horizontal feed roller. It is XX sectional drawing of FIG. It is a structure explanatory view of a cutter unit. It is explanatory drawing which shows a half cut process. It is explanatory drawing which shows an ACF tape descending state. It is explanatory drawing which shows a crimping | compression-bonding process. It is explanatory drawing which shows the raising state of a crimping | compression-bonding block. It is explanatory drawing of the operation | movement which peels from the ACF of a mount tape. It is YY sectional drawing of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, FIG. 1 shows a liquid crystal cell as an example of a substrate to which an ACF is attached, and a driver circuit made of TCP mounted on a substrate as a TAB as an example of a semiconductor device mounted via the ACF. Note that the substrate may be not only a liquid crystal cell but also a printed circuit board or the like, and it is not limited to a driver circuit to be mounted on this board as long as it is electrically connected via an ACF. .

  In FIG. 1, reference numeral 1 denotes a liquid crystal cell. The liquid crystal cell 1 is composed of a lower substrate 2 and an upper substrate 3 each made of a glass thin plate, and liquid crystal is sealed between the substrates 2 and 3. The lower substrate 2 protrudes from the upper substrate 3 by a predetermined width on at least two sides, and a plurality of driver circuits 4 in which the integrated circuit elements 4b are mounted on the film substrate 4a are mounted on the protruding portion 2a.

  The projecting portion 2a of the lower substrate 2 is provided with a predetermined number of wirings drawn from TFTs (Thin Film Transistors) formed in the portion where the substrates 2 and 3 are overlapped. As indicated by reference numeral 5 in the figure, a predetermined number of wirings are formed as a group for each mounting portion of the driver circuit 4, and this wiring group is set as a pasting region in the present embodiment. Alignment marks 6 are formed on the left and right sides of each wiring group 5. Therefore, a blank area having a predetermined width is formed between adjacent wiring groups 5 and 5. On the other hand, the driver circuit 4 is provided with a plurality of electrodes that are electrically connected to the wirings constituting the wiring group 5, and the electrode group connected to the wiring group 5 is denoted by reference numeral 7. . The driver circuit 4 also has alignment marks 8 formed on the left and right sides of the electrode group 7. When the driver circuit 4 is mounted on the liquid crystal cell 1, the electrode group is based on the alignment marks 6 and 8. Position adjustment is performed so that each electrode constituting 7 and each wire constituting the wiring group 5 coincide.

  The driver circuit 4 is mounted on the liquid crystal cell 1 via the ACF 9. As is well known, the ACF 9 is obtained by dispersing a large number of fine conductive particles in a binder resin having an adhesive function. By heating and pressing the ACF 9 between the driver circuit 4 and the liquid crystal cell 1, the ACF 9 is electrically conductive particles. Each of the wirings constituting the wiring group 5 and the respective electrodes constituting the electrode group 7 are electrically connected to each other via the wiring, and the binder resin is thermally cured to fix the driver circuit 4 to the liquid crystal cell 1. become. Here, the ACF 9 is divided for each position of the wiring group 5 provided on the projecting portion 2a of the lower substrate 2 and is attached every length L. As a result, the ACF 9 can be used without waste, and the attached ACF 9 is almost completely covered by the driver circuit 4.

  2 and 3 show a schematic configuration of a pasting machine for pasting the ACF 9 on the projecting portion 2a of the lower substrate 2. FIG. In the figure, reference numeral 10 denotes a mounting plate on which a mechanism for attaching the ACF 9 to the liquid crystal cell 1 is mounted. A supply reel 11 is detachably mounted on the mounting plate 10. As will be described later, the ACF 9 is laminated on the release layer of the mount tape 12 to form the ACF tape 13, and the ACF tape 13 is wound around the supply reel 11. The ACF tape 13 is travel-guided along a travel path composed of rollers 14 to 17 attached to the mounting plate 10. Further, reference numeral 18 denotes a driving roller which is driven so as to sandwich the mount tape 12 after the ACF 9 is attached to the liquid crystal cell 1 and send it to the discharge unit 19.

  The rollers 14 and 15 are guide rollers for the feeder of the ACF tape 13, and the guide roller 15 is attached to the swing arm 20, and the swing arm 20 swings around the rotation shaft 21. Yes. A driving means (not shown) made of a motor or the like is connected to the rotating shaft 21, and the swing arm 20 is swung in the direction of the arrow F, so that at least one pasting from the supply reel 11, that is, FIG. The ACF tape 13 having the length L shown in FIG. 1 is fed out and supplied between the rollers 14 and 15. As a result, the reaction force acting when the ACF tape 13 is fed is always constant, and the resistance to the feeding force does not fluctuate due to the difference in the amount of winding of the supply reel 11.

  As shown in FIGS. 4 and 5, the rollers 16 and 17 guide the ACF tape 13 in the horizontal direction in the travel route, and define the length of the ACF 9 attached to the liquid crystal cell 1 for one time. The horizontal guide roller 17 defines the ACF 9 pasting start position, and the horizontal guide roller 16 defines the ACF 9 pasting end position, which sets the ACF 9 pasting area. Is done. These horizontal guide rollers 16 and 17 are formed with flange portions 16b and 17b on both sides of the cylindrical portions 16a and 17a, and the height of the portions protruding from the cylindrical portions 16a and 17a of the flange portions 16b and 17b is as follows. The dimensions of the ACF tape 13 are almost the same as or slightly larger than the thickness of the mount tape 12.

  Accordingly, the ACF 9 is attached to the liquid crystal cell 1 between the horizontal guide rollers 16 and 17 and separated from the mount tape 12. Further, the mount tape 12 after the ACF 9 is peeled off is collected at a position downstream of the horizontal guide roller 17. A driving roller 18 is provided at a position downstream of the ACF 9 attachment region defined by the horizontal guide rollers 16 and 17, and the driving roller 18 includes a driving roller 18a and a pinch roller 18b. The mount tape 12 is sandwiched between the drive roller 18a and the pinch roller 18b. Then, the ACF tape 12 is pitch-fed every length L by rotationally driving the drive roller 18a.

  As apparent from FIG. 3, the mounting plate 10 is mounted on the Z-axis stage 22, the Z-axis stage 22 is mounted on the Y-axis stage 23, and the Y-axis stage 23 is mounted on the X-axis stage 24. Yes. Therefore, the Y-axis stage 23 and the X-axis stage 24 adjust the X, Y direction, that is, the position in the horizontal plane, of the ACF 9 attachment portion defined by the space between the horizontal guide rollers 16-17 in the routing path of the ACF tape 13. In addition, by operating the Z-axis stage 22, the entire mounting plate 10 to which the attaching mechanism is mounted can be driven up and down. Since the Z-axis, Y-axis, and X-axis stages 22 to 24 can be configured in the conventional manner, detailed description thereof will be omitted.

  The liquid crystal cell 1 is placed on the table 25 and fixedly held by vacuum suction. The table 25 is provided with a Z-axis stage 26, a Y-axis stage 27, and an X-axis stage 28, similarly to the ACF 9 sticker side. Here, the X-axis stage 24 on the sticking machine side constitutes a pitch feed means for pitch-feeding each ACF 9 sticking region of the liquid crystal cell 1.

  By driving any or all of the above-described stages, the position is adjusted between the ACF 9 applicator and the liquid crystal cell 1, and then the ACF tape 12 is pressed onto a predetermined position of the liquid crystal cell 1. Then, the ACF 9 is attached to the position of the wiring group 5 provided on the projecting portion 2a of the lower substrate 2, and the mount tape 11 is collected. For this purpose, in the ACF tape 13, the mount tape 11 is made to maintain continuity, and so-called half cut is performed in which the ACF 9 is cut for each attachment length L. For this purpose, a cutter unit 30 serving as a half-cut means is provided at a position slightly downstream of the position of the horizontal guide roller 16 in the travel path of the ACF tape 12, and this cutter unit 30 is placed horizontally on the mounting plate 10. It is mounted to move in the direction. As shown in FIG. 6, the cutter unit 30 includes a cutter 31 and a cutter receiver 32. The cutter receiver 32 is fixedly held by a slider 33. The cutter 31 is indicated by an arrow in FIG. As described above, the shaft 34 is rotatable in the direction of approaching and separating from the cutter receiver 32. The cutter 35 is normally held away from the cutter receiver 32 by the urging force of the spring 35 acting on the cutter 31, and the cutter 31 pushes the cutter 31 in a direction against the spring 35 by the pushing roller 36. It is configured to swing and displace in a direction close to the receiver 32. At a position where the cutter 31 is closest to the cutter receiver 32, an interval that is the same as or slightly shorter than the thickness of the mount tape 12 of the ACF tape 13 is formed therebetween. As a result, only the ACF 9 can be half-cut.

  Further, in order to attach the ACF 9 to the overhanging portion 2 a of the lower substrate 2, the ACF tape 13 is pressed from above with a predetermined pressure by the pressure-bonding head 37 at a position between the horizontal guide rollers 16 and 17. ing. The pressure-bonding head 37 is mounted on the mounting plate 10 so as to be movable up and down by a lift drive means 38, and the ACF tape 13 is applied to the liquid crystal cell 1 with a predetermined pressure by the lift drive means 38. The crimping head 37 includes a heater (not shown). Therefore, the crimping head 37 causes the ACF tape 13 to be thermocompression bonded to the liquid crystal cell 1. However, the degree of heating is relatively low enough to soften the binder resin of ACF9. The crimping head 37 has a width dimension that can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has an attachment length L of the ACF 9. The crimping head 37 does not directly contact the ACF tape 13, but a protective sheet (not shown) is interposed therebetween. Further, when the ACF tape 13 is bonded to the liquid crystal cell 1 by the pressure bonding head 37, a support base 39 is provided to support the pressure bonding region in the liquid crystal cell 1 from below.

  The present embodiment is configured as described above. Next, the procedure of the ACF 9 attaching operation will be described with reference to FIGS. Thus, the procedure of the ACF 9 attaching operation is controlled by the control device 40 shown in FIG.

  First, FIG. 7 shows a half-cut process of the ACF tape 13. The mounting plate 10 is held in the raised position, and is disposed at a position where the ACF 9 is to be attached to the wiring group 5 in the liquid crystal cell 1 installed on the table 25. At this time, it is assumed that the ACF 9 has already been attached to the preceding wiring group 5. Accordingly, the ACF 9 is already pasted between the driving roller 18a and the pinch roller 18b constituting the driving roller 18, and the mount tape 12 from which the ACF 9 has been peeled is sandwiched, and the ACF 9 is laminated. The end portion of the ACF tape 13 corresponds to the attachment start end position of the wiring group 5. When the ACF 9 is first attached from the supply reel 11, a leader tape is connected to the tip of the ACF tape 13, so that the boundary between the leader tape and the ACF tape 13 faces the attachment start end position. Will do. Therefore, in this case, the leader tape is sandwiched between the drive roller 18a and the pinch roller 18b constituting the drive roller 18, and the ACF 9 is not sandwiched.

  In this state, the cutter unit 30 is operated in order to make a half cut at the pasting end position in the wiring group 5. The cutter unit 30 is disposed at a position retracted rearward from the surface of the mounting plate 10 (the surface on which the supply reel 11 and the like are mounted), and advances from this position. At this time, the cutter 31 is held at a position separated from the cutter receiver 32. As the slider 33 of the cutter unit 30 moves forward, the cutter receiver 32 comes into contact with the upper surface of the mount tape 12 of the ACF tape 13. Then, after the slider 33 is moved forward most, the push roller 36 moves forward, and the cutter 31 rotates around the axis of the shaft 34 against the spring 35, so that it contacts the surface of the ACF 9 in the ACF tape 13. The ACF 9 is cut in contact. At this time, the mount tape 12 is not cut and maintains continuity. When the ACF tape 13 is half-cut in this way, the cutter unit 30 is retracted to the mounting plate 10 side.

  When the ACF tape 13 is half-cut as described above, the half-cut position is the pasting end position, the end where the previous ACF 9 was pasted becomes the pasting start end position, and the horizontal guide roller 17 is The horizontal guide roller 16 is disposed at the pasting end position, and the horizontal guide roller 16 is disposed at the pasting end position. In this state, as shown in FIG. 8, the Z-axis stage 22 is operated to lower the mounting plate 10. The lowermost position of the mounting plate 10 is that the surface of the ACF 9 of the ACF tape 13 positioned between the horizontal guide rollers 16 and 17 is slightly spaced from the protruding portion 2a of the lower substrate 2 of the liquid crystal cell 1, for example, about 1 to several mm. Set so as to be spaced apart.

  Next, as shown in FIG. 9, the pressure-bonding head 37 is lowered and the ACF tape 13 is pressure-bonded to the lower substrate 2. This is the crimping process. At this time, it is desirable that the pressure bonding head 37 is heated to a predetermined temperature. The predetermined load set by the elevating drive means 38 acts on the ACF tape 13. Here, a uniform pressing force acts between the starting end position of the ACF tape 13 and the end position, and the pressing force by the pressure-bonding head 37 acts on the base end side of the half-cut attaching end position. do not do. At this time, at least the lower surface of the protruding portion 2a of the lower substrate 2 of the liquid crystal cell 1 at the position where the ACF 9 is attached is in contact with the support base 39, thereby effectively receiving the applied pressure. Become.

  Here, since the crimping head 37 is operated after the mounting plate 10 is lowered to a position where the ACF tape 13 is very close to the lower substrate 2, the ACF tape 13 between the horizontal guide rollers 16 and 17 moves almost during this time. The pressure-bonding head 37 is surely and uniformly applied with pressure to the ACF tape 13 over the entire length of the area where the ACF 9 is attached, and the pressure is applied to other portions. There is nothing. Further, the tension of the ACF tape 13 is not changed by the operation of the pressure bonding head 37.

  When the ACF 9 is pressure-bonded to the lower substrate 2 in this way, as shown in FIG. 10, the pressure-bonding head 37 is raised to release the pressure applied to the ACF tape 13. The ACF 9 is affixed to the lower substrate 2, but the mount tape 12 is still laminated on the ACF 9. Therefore, as shown in FIG. 11, the mounting plate 10 is raised to peel the mount tape 12 from the ACF 9. At this time, if the mount tape 12 is lifted straight up, a force in a direction to lift the ACF 9 from the lower substrate 2, that is, a direction to peel it off from the lower substrate 2 acts, so that the pressure-bonded ACF 9 is rolled from the lower substrate 2. Or partially lifted.

  In order to prevent the ACF 9 from floating when the mount tape 12 is peeled off, after the pressure bonding is completed and the pressure bonding head 37 is separated from the ACF tape 12, the Z-axis stage 22 is operated to raise the mounting plate 10. In the mount peeling process for peeling the mount tape 12, the Y axis stage 23 is driven together with the Z axis stage 22, and as shown by an arrow in FIG. Operate to pull up. As a result, the mount tape 12 is peeled off from the ACF 9. At this time, the mount tape 12 is subjected to a force to shift laterally with respect to the winding portion around the horizontal guide rollers 16 and 17, but the horizontal guide rollers 16 and 17 have a flange 16b. , 17b, the mount tape 12 does not fall off from the horizontal guide rollers 16 and 17 due to lateral displacement at the winding portions around the cylindrical portions 16a and 17a. Along with the movement, the mount tape 12 moves obliquely upward. As a result, the force in the direction of lifting the ACF 9 from the lower substrate 2 when the mount tape 12 is peeled is suppressed, and the ACF 9 is held in close contact with the lower substrate 2 by the pressure applied by the pressure bonding head 37.

  Thus, the ACF 9 is attached to one wiring group 5. Therefore, the driving roller 18 is actuated to feed the ACF tape 13 by one pitch, and then the pasting machine side applies the ACF to the liquid crystal cell 1 by the pitch feeding means by the X-axis stage 24 on the pasting machine side. Move one pitch of the attachment area. From this state, half-cutting of the ACF 9, crimping by the crimping head 37, and peeling of the mount tape 12 by lifting the mounting plate 10 obliquely upward are repeated. As a result, the ACF 9 can be applied sequentially and smoothly, limited to the positions of the plurality of wiring groups 5 provided on the projecting portion 2 a of the lower substrate 2.

DESCRIPTION OF SYMBOLS 1 Liquid crystal cell 2 Lower board | substrate 2a Overhang | projection part 3 Upper board | substrate 4 Driver circuit 5 Wiring group 9 ACF 10 Mounting plate 11 Supply reel 12 Mount tape 13 ACF tape 16, 17 Horizontal guide roller 16a, 17a Cylindrical part 16b, 17b Gutter part 22 Z Axis stage 23 Y-axis stage 24 X-axis stage 30 Cutter unit 31 Cutter 32 Cutter receiver 37 Crimp head 38 Lifting drive means 40 Controller

Claims (2)

A supply reel that feeds ACF tape with ACF laminated on the release layer of the mount tape, guide rollers with hooks arranged in the vicinity of the ACF application start position and end position, and can be moved up and down between both guide rollers The crimping head provided on the substrate and the backing tape from which the ACF has been peeled are collected, and the plurality of electrodes are respectively attached to an electrode group to which one ACF is attached to the substrate on which the plurality of electrodes are formed. A method of attaching an ACF by dividing and setting a plurality of attachment regions and attaching an ACF to each electrode group for each attachment region,
A half-cutting step for cutting the ACF every length of the ACF tape attached to the one electrode group of the substrate;
An ACF pressure bonding step in which the ACF tape is pressure-bonded to the attachment region with a predetermined pressure by the pressure-bonding head;
A backing stripping step for stripping the backing tape from the ACF of the ACF tape crimped in the ACF crimping step;
It consists of a pitch feeding step of pitch feeding the crimping head to the next pasting area,
The ACF adhering method, wherein the ACF pressure bonding step, the backing sheet peeling step and the pitch feeding step are sequentially repeated. For a substrate on which a plurality of electrodes are formed, each of the plurality of electrodes is divided into an electrode group to which one ACF is pasted, and a plurality of pasting areas are set, and each pasting area is individually set. An ACF pasting apparatus for pasting ACF,
A supply reel that feeds out an ACF tape in which an ACF is laminated on a release layer of the mount tape, and the mount tape of the ACF tape that is sent out from the supply reel has continuity and is attached to one electrode group of the substrate Half-cutting means for cutting the ACF for every length to be formed, guide rollers with hooks arranged in the vicinity of the ACF attachment start end position and end position, respectively, and provided so as to be movable up and down between both guide rollers. An affixing mechanism comprising a pressure-bonding head for pressure-bonding the ACF cut by the half-cut means to the surface of the substrate;
An ACF adhering apparatus characterized in that the adhering mechanism includes pitch feed means for pitch-feeding each ACF adhering area of the substrate.

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