JP2012038747A - Acf sticking device for fpd module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ACF sticking device which applies uniform pressurizing force over the entire length of the ACF when sticking the ACF on a substrate.SOLUTION: The ACF sticking device for an FPD module includes a pressure-bonding blade 51 for pressure-bonding an ACF 8 to a substrate 2 having electrodes formed thereon, and a cap member 52. The cap member 52 is configured to cover a front end of the pressure-bonding blade 51 and to have elasticity.

Description

  The present invention relates to an ACF attaching device for an FPD module for attaching an ACF (Anisotropic Conductive Film) to a substrate made of a display panel or the like constituting an FPD (Flat Panel Display) device.

  For example, a liquid crystal display has a configuration in which a printed circuit board is connected via a semiconductor circuit device to a liquid crystal panel composed of two upper and lower transparent substrates forming a liquid crystal enclosure space. The semiconductor circuit device is a driver circuit including electrodes on the input side and the output side. The input side electrode is electrically connected to the substrate constituting the liquid crystal panel, and the output side electrode is electrically connected to the printed circuit board. Typical driver circuit mounting methods include the COG (Chip On Glass) method in which a chip-like IC package is directly connected to a liquid crystal panel and a printed circuit board, and TCP with a driver circuit mounted on a film-like substrate. There is a TAB (Tape Automated Bonding) method in which (Tape Carrier Package) is connected to a liquid crystal panel and a printed circuit board.

  A wiring pattern is formed on at least two sides on the surface of the substrate constituting the liquid crystal panel, and the electrodes in the wiring pattern and the input electrodes of the driver circuit are electrically connected. The liquid crystal panel is provided with a wiring pattern at a minute pitch interval, but a predetermined number of electrodes are also formed as a group in a semiconductor circuit device to be mounted. In the plurality of electrode groups, a space is formed between adjacent electrode groups. The driver circuit is also connected to the printed circuit board. For this purpose, a predetermined number of electrode groups are formed in plural on the printed circuit board side as well as on the liquid crystal panel side.

  In connecting the driver circuit and the liquid crystal panel or the like, it is necessary to securely connect a large number of electrodes arranged at minute intervals to fix the driver circuit. For this purpose, ACF is used. ACF is obtained by uniformly dispersing fine conductive particles in an adhesive binder resin. By thermocompression bonding of the ACF, the electrodes are electrically connected through the conductive particles, and the binder resin is cured by heating, so that the driver circuit is fixed to the liquid crystal panel or the printed circuit board.

  For example, after attaching ACF to a portion of a wiring pattern provided on a substrate of a liquid crystal panel, TCP as a driver circuit is mounted on TAB. ACF, which is an adhesive substance, is laminated on the backing tape via a release layer, thereby constituting an ACF tape. The ACF tape is wound around a supply reel, sent out from the supply reel, and pasted on the substrate surface by a pasting unit.

  When the ACF is attached to the substrate surface, a heated pressure bonding head is used. The pressure-bonding head includes a pressure-bonding blade having a flat surface at the tip, and the ACF is attached to the surface of the substrate by pressing the ACF tape against the substrate with the pressure-bonding blade to which a predetermined pressure is applied.

  However, when the ACF is pressed against the substrate, if the parallelism between the tip flat surface of the crimping blade and the ACF on the substrate is shifted (hereinafter referred to as the flatness of the crimping blade), the pressure applied to the ACF is the entire ACF. However, pressure unevenness occurs. For this reason, there was a problem that a part of the ACF that was not pressed at a predetermined pressure was peeled off from the substrate, resulting in poor ACF attachment.

  Here, as a means for adjusting the flatness of the crimping blade, for example, Patent Document 1 discloses a configuration in which a protective sheet is interposed between the crimping head and the ACF tape. According to this, since the protective sheet is in close contact with the tip of the crimping blade, when the crimping blade presses the ACF against the substrate, the thickness of the protective sheet is deformed by the pressing force of the crimping blade. Thereby, the shift | offset | difference of parallelism with the front end plane of a crimping blade and ACF on a board | substrate can be absorbed, and the flatness of a crimping blade can be adjusted.

JP 2008-251791 A

  However, in the adjusting means of Patent Document 1 described above, the range in which the flatness of the crimping blade can be adjusted is limited to the thickness range of the protective sheet, and the deviation of the flatness of the crimping blade is more than the thickness of the protective sheet. Is too large, the protective sheet cannot absorb the deviation, and there is a problem that an ACF sticking failure occurs.

  In order to insert a protective sheet between the crimping blade and the ACF, a supply reel that supplies the protective sheet and a recovery reel that collects the protective sheet must be installed, and the reels must be replaced at a predetermined frequency. There is a problem of not becoming.

  On the other hand, it may be possible to increase the degree of freedom in adjusting the flatness of the crimping blade by increasing the thickness of the protective sheet. There is a problem that it becomes difficult.

  The present invention has been made in consideration of the above points. The object of the present invention is to easily adjust the flatness of the crimping blade and apply the ACF to the substrate over the entire length of the ACF. The purpose is to apply an even pressure.

  In order to achieve the above-described object, the ACF bonding apparatus for a PDF module according to the present invention covers a crimping blade for crimping ACF to a substrate on which an electrode is formed, covers the tip of the crimping blade, and has elasticity. And a cap member. Thereby, the flatness of the crimping blade can be adjusted by the elastic force of the cap member covering the tip of the crimping blade.

  It is desirable that the cap member be detachable from the crimping blade. Thereby, replacement | exchange of a cap member can be performed easily.

  It is desirable that the crimping blade is provided with an engaging portion for engaging with the cap member. Accordingly, the cap member can be attached to the crimping blade without using an adhesive.

  A flat part is formed at the tip of the cap member, and it is desirable to provide a notch at the end of the flat part. Thus, when the ACF is attached to the substrate, the cap member can be prevented from coming into contact with the adjacent ACF that has already been attached.

  It is desirable that the cap member is provided with a clamping portion for clamping the crimping blade. Thereby, a cap member can be reliably mounted | worn with respect to a crimping blade.

  According to the present invention, when the ACF is attached to the substrate, the pressure is adjusted and the flatness of the crimping blade is adjusted, so that a uniform pressing force can be applied to almost the entire surface of the ACF, and the ACF is not attached correctly. Occurrence can be prevented.

It is a principal part top view which shows the liquid crystal cell as a board | substrate with which ACF is affixed, and the driver circuit mounted in this board | substrate. It is a schematic block diagram of the ACF sticking apparatus of the FPD module which concerns on embodiment of this invention. FIG. 3 is a left side view of FIG. 2. It is composition explanatory drawing of the crimping head concerning an embodiment of the invention. It is sectional drawing which shows the structure of the front-end | tip part of the crimping | compression-bonding head at the time of cut | disconnecting by the AA line shown in FIG. It is a perspective view of a cap member concerning an embodiment of the invention. It is a principal part enlarged view of the ACF sticking apparatus which shows the crimping | compression-bonding state of an ACF tape. FIG. 8 is a left side view of FIG. 7. It is sectional drawing which shows the cap member which concerns on other embodiment of this invention. It is sectional drawing which shows the structure of the front-end | tip part of the crimping head which concerns on other embodiment of this invention. It is a general | schematic enlarged view of the ACF sticking apparatus at the time of using a short cap member. It is composition explanatory drawing of the crimping head which concerns on other embodiment of this invention. It is a top view of the liquid crystal cell in which ACF of different length was stuck. It is structure explanatory drawing of the crimping head at the time of using a fixing tool. It is a left view of FIG. It is a right view of FIG. It is composition explanatory drawing of the crimping head at the time of fixing a short cap member to a crimping blade using a fixing tool.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a main part plan view showing a liquid crystal panel as a substrate to which an ACF is attached and a driver circuit mounted on the substrate.
FIG. 1 shows a liquid crystal panel, which is an example of an FPD module, and a driver circuit made of TCP mounted on a substrate as a TAB as an example of a semiconductor circuit device mounted via an ACF. The substrate is not limited to a liquid crystal panel, but can be a substrate for other displays or other various printed circuit boards. The board is not limited to the driver circuit, and the ACF Various semiconductor circuit devices that are electrically connected to each other can be applied.

  In FIG. 1, a liquid crystal panel 1 is composed of a lower substrate 2 and an upper substrate 3 both made of a glass thin plate, and liquid crystal is sealed between the substrates 2 and 3. The lower substrate 2 protrudes from the upper substrate 3 by a predetermined width on at least two sides (may be one side or three sides or more), and is integrated on the film substrate 4a on the protruding portion 2a. A plurality of driver circuits 4 on which circuit elements 4b are mounted are mounted.

  The projecting portion 2a of the lower substrate 2 is provided with a predetermined number of electrodes 5 connected to TFTs (Thin Film Transistors) formed on the portion where the substrates 2 and 3 are overlapped. A predetermined number of electrodes are formed as a group for each mounting portion of the driver circuit 4. Alignment marks 6a and 6a are formed on the left and right sides of each electrode group 5. Between the adjacent electrode groups 5 and 5, a blank region having a predetermined width, that is, a portion where no electrode is provided is formed. On the other hand, the driver circuit 4 is provided with a plurality of electrodes electrically connected to the respective electrodes constituting the electrode group 5, and the electrode group connected to the electrode group 5 is denoted by reference numeral 7. . The driver circuit 4 is also formed with alignment marks 6b and 6b on both the left and right sides of the electrode group 7. When the driver circuit 4 is mounted on the liquid crystal panel 1, the electrode group 7 is used with reference to these alignment marks. The position adjustment is performed so that each electrode constituting the electrode and each electrode constituting the electrode group 5 coincide with each other.

  The driver circuit 4 is mounted on the liquid crystal panel 1 via the ACF 8. As is well known, ACF 8 is obtained by dispersing a large number of fine conductive particles in a binder resin having an adhesive function. By heating and pressurizing the ACF 8 between the driver circuit 4 and the liquid crystal panel 1, each electrode constituting the electrode group 5 and each electrode constituting the electrode group 7 are electrically connected through the conductive particles. It becomes a state. At the same time, the binder resin is thermally cured to fix the driver circuit 4 to the liquid crystal panel 1. The ACF 8 is divided for each position of the electrode group 5 provided on the projecting portion 2a of the lower substrate 2, and is attached every length L. In this embodiment, the so-called divisional bonding method is used for attaching the ACF to the substrate. However, a batch bonding method in which the ACF is continuously attached over the entire length of one side of the substrate may be used.

FIG. 2 is a schematic configuration diagram of an ACF attaching apparatus for an FPD module according to an embodiment of the present invention, and FIG. 3 is a left side view thereof.
As shown in FIG. 2, the liquid crystal panel 1 is stably held on a support base 9 that holds the liquid crystal panel 1 in a horizontal state by, for example, a vacuum suction means. Here, the liquid crystal panel 1 is in contact with the support base 9 over a wide area, but the lower position of the protruding portion 2a of the lower substrate 2 to which the ACF 8 is attached is open. The support base 9 can be provided with position adjusting means in the X, Y, Z, and θ directions for alignment of the liquid crystal panel 1 and the driver circuit 4 and the like. Here, the X direction refers to a direction perpendicular to the alignment direction of the electrode groups 5 in the liquid crystal panel 1, the Y direction refers to a direction parallel to the alignment direction of the electrode groups 5 in the liquid crystal panel 1, and the Z direction refers to a liquid crystal. The direction perpendicular to the panel 1 is referred to, and the θ direction refers to the rotational direction of the liquid crystal panel 1 in the horizontal plane.

  The unit 10 for attaching the ACF 8 to the liquid crystal panel 1 has a mounting plate provided in the vertical direction, and a supply reel 11 is detachably attached thereto. The ACF 8 is composed of an ACF tape 13 laminated on the release layer of the mount tape 12, and the ACF tape 13 is wound around the supply reel 11. The ACF tape 13 is travel-guided along a travel path composed of rollers 14 to 17 attached to the attaching unit 10. Further, the drive roller 18 sandwiches the mount tape 12 after the ACF 8 is attached to the liquid crystal panel 1 and drives it so as to be fed into the discharge unit 19.

  The rollers 14 and 15 are guide rollers for a feeder of the ACF tape 13, and the guide roller 15 is attached to the swing arm 20. The swing arm 20 swings around the rotation shaft 21. Driving means (not shown) such as a motor is connected to the rotating shaft 21. When the swing arm 20 is swung in the direction of arrow F, at least one pasting from the supply reel 11, that is, FIG. The ACF tape 13 of the length L shown in FIG. 6 is sent out and stays between the rollers 14 and 15.

  The rollers 16 and 17 are horizontal guide rollers that guide the ACF tape 13 in the horizontal direction and regulate the length of one time that the ACF 8 is attached to the liquid crystal panel 1. The horizontal guide roller 17 defines the ACF 8 attachment start end position, and the horizontal guide roller 16 defines the ACF 8 attachment end position. By these, the ACF 8 attachment region is set.

  The ACF 8 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16 and 17 and then separated from the mount tape 12. Then, the mount tape 12 from which the ACF 8 has been peeled is collected at a position downstream of the horizontal guide roller 17. The driving roller 18 is provided at a position downstream of the ACF 8 attachment region defined by the horizontal guide rollers 16 and 17. The driving roller 18 includes a driving roller 18a and a pinch roller 18b, and the mount tape 12 is sandwiched between the driving roller 18a and the pinch roller 18b. By rotating the drive roller 18a, the ACF tape 12 is pitch-fed every length L.

  As shown in FIG. 3, the affixing unit 10 is mounted on a lift drive unit 22 that moves in the Z direction, and this lift drive unit 22 is mounted on a longitudinal drive unit 23 that moves in the X direction. Further, the longitudinal drive unit 23 is mounted on a parallel drive unit 24 that moves in the Y direction, which constitutes the conveying means. With these mechanisms, the ACF 8 attachment region defined by the horizontal guide rollers 16-17 (see FIG. 2) is in the vertical direction, the X-axis direction in the horizontal plane (the direction orthogonal to the arrangement of the electrode group 5), It can be moved and adjusted in the Y-axis direction (the direction in which the electrode groups 5 are arranged). The liquid crystal panel 1 is held on the support base 9 by vacuum suction.

  Here, it is necessary to adjust the relative position of the ACF tape 13 between the horizontal guide rollers 16-17 and the electrode group 5 on the lower substrate 2. The back-and-forth movement drive unit 23 moves the pasting area in the direction of approaching / separating from the liquid crystal panel 1. Moreover, since the translation drive unit 24 moves the pasting region in a direction parallel to the arrangement direction of the electrode groups 5 in the liquid crystal panel 1, that is, the Y-axis direction, the position can be adjusted on the pasting unit 10 side. it can.

  The raising / lowering drive part 22 has the inclination block 30, and the cylinder 31 (or motor) in order to move this inclination block 30 to the front-back direction. Further, a slide member 32 that engages with the inclined surface of the inclined block 30 is connected to the pasting unit 10. The slide member 32 has an inclined surface that coincides with the inclined block 30, and has a configuration that cannot be displaced except in the vertical direction by the restriction rod 33. Thereby, when the cylinder 31 is driven, the affixing unit 10 is displaced in the vertical direction.

  Next, the back-and-forth movement drive unit 23 is for moving back and forth the pedestal 34 to which the inclined block 30 is mounted. The flat action drive unit 24 has a pedestal 34 and a transport table 36 on which the drive means 35 is mounted. The transport table 36 can move the affixing unit 10 in parallel with the arrangement direction of the electrode group 5 in the liquid crystal panel 1 by rotationally driving a ball screw 37 constituting a ball screw feeding means with a motor (not shown). .

  Further, as shown in FIG. 2, half cut means 40 is provided at a position slightly downstream from the position of the horizontal guide roller 16 in the travel path of the ACF tape 12, and only the ACF 8 is provided by this half cut means 40. Half cut. Further, in order to attach the ACF 8 to the protruding portion 2 a of the lower substrate 2, the ACF tape 13 is pressure-bonded to the surface of the lower substrate 2 with a predetermined pressure at a position between the horizontal guide rollers 16 and 17.

  As shown in FIGS. 2 and 3, the affixing unit 10 is provided with a crimping head 50. Here, the liquid crystal panel 1 is placed on the support base 9, but the protruding portion 2 a of the lower substrate 2 protrudes from the support base 9. The crimping head 50 is configured to pressurize the protruding portion from above and sandwich the ACF tape 13 together with the support base 56 disposed below the projecting portion 2a.

  The pasting unit 10 is provided with a supply reel 11, a travel path of the ACF tape 13 supplied from the supply reel 11, half-cut means 40, and a pressure bonding head 50. With this ACF attaching device, the ACF 8 necessary for mounting the driver circuit 4 on the TAB is attached to the electrode group 5 formed in a predetermined number on the projecting portion 2 a of the lower substrate 2 of the liquid crystal panel 1.

FIG. 4 is a configuration explanatory view of the crimping head 50 according to the embodiment of the present invention.
The crimping head 50 of this embodiment is of a so-called short type, and is used when a plurality of ACFs 8 are attached to the projecting portion 2a of the liquid crystal panel 1 at a predetermined interval as shown in FIG. .

  The crimping head 50 has a crimping blade 51, and this crimping blade 51 is attached to the lifting block 53. The lifting block 53 to which the crimping blade 51 is attached is moved up and down by a cylinder 57 with a predetermined stroke. That is, when the cylinder 57 is in the extended state, the crimping blade 51 descends and comes into contact with the protruding portion 2 a of the liquid crystal panel 1 placed on the support base 56. When the cylinder 57 is in the contracted state, the crimping blade 51 rises and is disposed at an upper position separated from the liquid crystal panel 1.

  The crimping blade 51 incorporates a heater (not shown), so that the crimping head 50 thermally bonds the ACF tape 13 to the liquid crystal panel 1. The degree of heating is relatively low so that the binder resin of ACF8 is somewhat softened so that the adhesive strength is not lost. The crimping blade 51 constituting the crimping head 50 has a width dimension that can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has at least an attachment length L of ACF8.

  A cap member 52 is attached to the crimping blade 51 so as to cover the tip of the crimping blade 51. Therefore, when the cylinder 57 is in the extended state, the cap member 52 attached to the crimping blade 51 substantially contacts the protruding portion 2 a of the liquid crystal panel 1.

FIG. 5 is a cross-sectional view showing the configuration of the tip portion of the crimping head when cut along the line AA shown in FIG.
As shown in FIG. 5, a pair of engagement recesses 51 e for engaging with the cap member 52 are provided on the side surface of the distal end portion of the crimping blade 51. A distal end flat surface 51 b for pressing the ACF 8 is formed at the distal end of the crimping blade 51.

The cap member 52 includes a bottom portion 52a and a side wall portion 52d that is a sandwiching portion for sandwiching the crimping blade 51.
A tip flat surface 52b is formed below the bottom 52a of the cap member 52, and stepped portions 52c formed so as to cut out the end portions are provided at both ends of the flat surface 52b.

  The side wall part 52d is formed to extend in a direction perpendicular to the flat surface 52b along both ends of the bottom part 52a. An engaging convex portion 52e for engaging with the engaging concave portion 51e of the crimping blade 51 is provided at the upper end portion of the side wall portion 52d. The engaging convex portions 52e are formed so as to face each other.

  The cap member 52 is made of an elastic member, for example, fluorine rubber. In an initial state before being attached to the crimping blade 51, the side wall 52d is formed so as to be inclined inward. Therefore, when the cap member 52 is attached to the crimping blade 51, the cap member 52 can be reliably attached by being sandwiched by the restoring force of the side wall portion 52d. In addition, the material of the cap member 52 should just have elasticity, for example, you may use the silicon rubber etc. which have high heat conductivity. The cap member 52 is manufactured by, for example, an extrusion molding method, and the length is adjusted in accordance with the length L of the ACF attached to the liquid crystal panel.

  As shown in FIG. 5, in the present embodiment, the width T of the tip flat surface 51 b of the crimping blade 51 is formed to be larger than the width P of the tip flat surface 52 b of the cap member 52. ing. That is, the area of the tip flat surface 51 b of the crimping blade 51 is configured to be larger than the area of the tip flat surface 52 b of the cap member 52. Thereby, the applied pressure applied to the front end flat surface 51 b of the crimping blade 51 can be uniformly transmitted to the entire front end flat surface 52 b of the cap member 52. In this way, by applying a uniform pressing force over the entire length of the ACF 8, the ACF 8 can be reliably attached to a liquid crystal panel or the like.

FIG. 6 is a perspective view of the cap member 52 according to the embodiment of the present invention.
The bottom 52a of the cap member 52 is formed in a flat plate shape. At both end portions on the upper surface side of the bottom portion 52a, plate-like side wall portions 52d extending in the direction perpendicular to the bottom portion 52a are provided along the longitudinal direction. In addition, step portions 52c are formed along the longitudinal direction at both end portions on the lower surface side of the bottom portion 52a. As described above, the side wall 52d is formed so as to be inclined inward.

  The engaging convex part 52e is formed by protruding the upper end part of the side wall part 52d inward. The engaging projections 52e are arranged at a predetermined distance, and an opening 54 is formed in the upper part of the cap member 52. The cap member 52 is attached to the crimping blade 51 through the opening 54.

FIG. 7 is an enlarged view of a main part of the ACF adhering apparatus showing the pressure-bonded state of the ACF tape, and FIG. 8 is a left side view thereof.
As shown in FIG. 7 and FIG. 8, by operating the cylinder 57, the crimping blade 51 is lowered and the mount tape 12 of the ACF tape 13 is pushed to crimp the ACF 8 to the lower substrate 2. Next, when the ACF 8 is pressure bonded to the lower substrate 2, the pressure applied to the ACF tape 13 by the pressure bonding head 50 is released.

  As described above, the attachment of the ACF 8 to the one electrode group 5 in the projecting portion 2a of the lower substrate 2 is completed. The affixing unit 10 is held in the raised position, the driving roller 18 is operated, and the ACF tape 13 is pulled out from the supply reel 11 and fed by one pitch. Then, the translation drive unit 24 is operated to move the pasting unit 10 by one pitch, that is, by the amount indicated by the interval P in FIG. The substrate support 9 that holds the liquid crystal panel 1 does not move. In this state, the ACF 8 is sequentially attached to the electrode group 5 by repeating the same operation as described above. That is, for each arrangement of the electrode groups 5 in the liquid crystal panel 1, the ACF 8 is pressure-bonded almost limited to the length L, and this is sequentially repeated. When the batch pasting method is adopted, the operation is completed once.

  In the present embodiment, since the cap member 52 having elasticity is attached to the distal end portion of the crimping blade 51, when the ACF 8 is crimped, the cap member 52 is deformed, so that The flatness of the crimping blade 51 can be accurately obtained by absorbing the deviation from the ACF on the substrate. As a result, the pressure-bonding blade 51 can pressurize the entire ACF with a uniform force, so that the pressure unevenness can be reduced and the ACF sticking failure can be prevented.

  Further, in the present embodiment, the cap member 52 can be easily detached from the crimping blade 51 by releasing the engagement with the crimping blade 51, so that the cap member 52 can be easily replaced. .

FIG. 9 is a cross-sectional view of a cap member 82 according to another embodiment of the present invention.
The cap member 82 of the present embodiment is configured so that the vicinity of the center portion of the side wall portion 82d is curved outward. Thus, by curving the side wall portion 82d outward, a gap can be formed between the crimping blade 51 and the side wall portion 82d in a state where the cap member 82 is attached to the crimping blade 51. Therefore, the operator can easily remove the cap member 82 by inserting a finger into the gap.

FIGS. 10A to 10D are cross-sectional views showing the configuration of the tip portion of the crimping head according to another embodiment of the present invention.
As shown in FIG. 10A, an engagement recess 91 e for engaging with the cap member 92 is formed at the center of the tip flat surface 91 b of the crimping blade 91. The engaging recess 91e is formed so that the cross-sectional shape is T-shaped.

  The cap member 92 includes a flat contact portion 92a that covers the tip flat surface 91b of the crimping blade 91, and a T-shaped engagement convex portion 92b that is provided continuously along the center of the contact portion 92a.

  The cap member 92 is attached to the crimping blade 91 by fitting the engagement convex portion 92 b of the cap member 92 into the engagement concave portion 91 e of the crimping blade 91. When pressing against the liquid crystal panel, the entire lower surface of the contact portion 92a of the cap member 92 contacts the liquid crystal panel.

  In the embodiment shown in FIG. 10B, the cross-sectional shape of the engaging recess 101e of the crimping blade 101 is an inverted trapezoid, and the cross-sectional shape of the engaging convex portion 102b of the cap member 102 is an inverted trapezoid. Is formed. The cap member 102 is attached to the crimping blade 101 by fitting the engagement convex portion 102 b of the cap member 102 into the engagement concave portion 101 e of the crimping blade 101.

  In the embodiment shown in FIG. 10C, the engagement recess 111e of the crimping blade 111 is formed in a T shape, and the cap member 112 is formed so that the cross-sectional shape is a T shape. The tip of the cap member 112 is configured to protrude from the center of the tip flat surface 111b of the crimping blade 111, and the protruding tip 112a contacts the liquid crystal panel.

  In the embodiment shown in FIG. 10D, the cross-sectional shape of the engagement recess 121e of the crimping blade 121 is formed in an inverted trapezoidal shape, and the cross-sectional shape of the cap member 122 is an inverted trapezoidal shape. The tip of the cap member 122 is configured to protrude from the center of the tip flat surface 121b of the crimping blade 121, and the protruding tip 122a contacts the liquid crystal panel.

FIG. 11 is a schematic enlarged view of the ACF sticking apparatus when a short cap member is used.
As shown in FIG. 11, when the attachment dimension L of the ACF 8 to be attached is shortened by changing the size of the liquid crystal panel or the like, the cap whose length in the longitudinal direction is adjusted to be short by cutting the crimping blade 51 The member 52 may be attached.

  Generally, when the ACF attachment length is changed, it is necessary to change the length of the crimping blade, so the crimping blade itself is replaced. However, according to this embodiment, it can respond only by changing the dimension of the cap member 52, and since it is not necessary to replace the crimping blade 51 itself, the cost of the apparatus can be kept low. Furthermore, it is possible to prevent the cap member 52 from coming into contact with the adjacent ACF 8 that has already been attached.

FIG. 12 is a diagram illustrating the configuration of a crimping head 80 according to another embodiment of the present invention.
The pressure-bonding head 80 of this embodiment is of a so-called long type, as shown in FIG. 13B, when a single and long ACF 8 'is attached to the projecting portion 2a of the liquid crystal panel 1. Used.

  The crimping head 80 has a crimping blade 51 ′, and this crimping blade 51 ′ is attached to the lifting block 53 ′. The raising / lowering block 53 'to which the crimping blade 51' is attached is moved up and down with a predetermined stroke by the cylinder 57 '. That is, when the cylinder 57 ′ is in the extended state, the crimping blade 51 ′ is lowered and comes into contact with the protruding portion 2 a of the liquid crystal panel 1 placed on the support base 56. When the cylinder 57 ′ is contracted, the crimping blade 51 ′ rises and is disposed at an upper position away from the liquid crystal panel 1.

  A heater (not shown) is built in the crimping blade 51 ′, so that the crimping head 80 causes the ACF tape 13 to be thermally bonded to the liquid crystal panel 1. The degree of heating is relatively low so that the binder resin of ACF 8 'is somewhat softened so that the adhesive strength is not lost. The crimping blade 51 ′ constituting the crimping head 80 has a width dimension that can sufficiently cover the width of the ACF tape 13, and the dimension in the length direction has at least an attachment length L of ACF8 ′. .

  A cap member 52 ″ is attached to the crimping blade 51 ′ so as to cover the tip of the crimping blade 51 ′. Therefore, when the cylinder 57 ′ is in the extended state, the crimping blade 51 ′ is attached to the crimping blade 51 ′. The attached cap member 52 ″ substantially contacts the protruding portion 2a of the liquid crystal panel 1.

  As described above, the crimping blade 51 ′ of the present embodiment is configured to be long in the Y direction because it is necessary to crimp one long ACF 8 ′. Conventionally, when using a crimping blade configured to be long in the Y direction as described above, a plurality of pull-out bolts and push bolts are provided in the lifting block, and the inclination of the crimping blade is changed by moving the position of the bolt, The flatness of the crimping blade was adjusted. However, the operator has to adjust the flatness of the crimping blade by moving the position of each bolt, and there is a problem that the work load increases.

  However, according to this embodiment, the flatness of the crimping blade 51 'can be accurately obtained only by attaching the cap member 52 "having elasticity to the tip of the crimping blade 51'. The work burden when adjusting the flatness of the sheet can be reduced.

FIG. 14 is a configuration explanatory view of a pressure-bonding head when a cap member is fixed to a pressure-bonding blade using a fixing tool, FIG. 15 is a left side view thereof, and FIG. 16 is a right side view thereof.
Here, the fixture for fixing the cap member 52 to the crimping blade 51 is composed of a first fixture 61 and a second fixture 62.

As shown in FIG. 14, the first fixing bracket 61 is attached to the front surface of the crimping blade 51, and the second fixing bracket 62 is attached to the side surface of the crimping blade 51.
The first fixing bracket 61 includes a fixing screw 71 and a rectangular fixing portion 61a. An engaging portion 61b is formed at one end of the fixed portion 61a. The engaging portion 61b extends downward and is bent at the tip.

  As shown in FIG. 15, the tip of the engaging portion 61 b of the first fixing fitting 61 is bent in an L shape, and this tip is in close contact with the tip flat surface 51 b of the crimping blade 51.

  The longitudinal direction of the fixing portion 61 a coincides with the direction along the tip of the crimping blade 51. A through hole 61c for inserting the fixing screw 71 is formed at the center of the fixing portion 61a. The through hole 61c is formed along the longitudinal direction. The fixing portion 61 a is fixed to the front surface of the crimping blade 51 by a fixing screw 71.

  As shown in FIG. 16, the second fixing fitting 62 is composed of a fixing screw 72 and a flat fixing portion 62a. A through hole (not shown) for inserting the fixing screw 72 is formed in the fixing portion 62a. The fixing portion 62 a is fixed to the side surface of the crimping blade 51 by a fixing screw 72.

  As a method for attaching the fixing portion to the crimping blade 51, the first fixing fitting 61 is attached to the front surface of the crimping blade 51 in a state where the cap member 52 is attached to the crimping blade 51. At this time, in a state where the longitudinal direction of the fixing portion 61a of the first fixing fitting 61 is along the tip of the crimping blade 51 and the engaging portion 61b is in contact with the end portion of the cap member 52, the fixing portion 61a. Is fixed with a fixing screw 71. At this time, the mounting position of the fixing screw 71 is the end of the through hole 61c. Next, the second fixing bracket 62 is attached to the side surface of the crimping blade 51. At this time, the fixing portion 62 a is fixed by the fixing screw 72 in a state where the fixing portion 62 a is in contact with the end portion of the cap member 52.

  According to the present embodiment, the cap member 52 is fixed with the two types of fixing fittings 61 and 62 in between, so that the cap member can be reliably fixed to the crimping blade.

  FIG. 17 is a configuration explanatory view of a crimping head when a short cap member is fixed to a crimping blade using a fixture. That is, this is a case where the length of the cap member 52 ′ attached to the crimping blade 51 is shorter than the length of the cap member 52 shown in FIG. 14. Note that, in FIG. 17, portions corresponding to those in FIG. 14 are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 17, the cap member 52 ′ is fixed by the first fixing fitting 61 on the front surface of the crimping blade 51. The position for fixing the first fixing fitting 61 is adjusted according to the length of the cap member 52 ′, and then the fixing portion 61 a is fixed with the fixing screw 71. At this time, the position of the fixing screw 71 is adjusted along the through hole 61c so that the position of the fixing screw 71 is near the center of the crimping blade 51. Thereafter, the second fixing fitting 62 is attached and fixed to the side surface of the crimping blade 51.

  According to the present embodiment, even when the length of the cap member 52 is changed by changing the size of the liquid crystal panel or the like, the cap member 52 ′ is securely fixed to the crimping blade 51 by the fixing brackets 61 and 62. can do.

  The ACF attaching device for the FPD module of the present invention is not limited to the above-described embodiments, and the shape of the crimping blade, the shape of the cap portion, other materials, the configuration and the like do not depart from the configuration of the present invention. It goes without saying that various modifications and changes can be made. For example, the cap member only needs to be detachable from the crimping blade, and the crimping blade may be provided with a convex portion and the cap member may be provided with a concave portion, and the crimping blade and the cap member may be engaged. In addition, the cap member may be attached to the crimping blade by simply using an adhesive without providing the engaging portion.

1 .. LCD panel 2 .. Lower substrate, 2a .. Overhang
3. Upper substrate 4 Driver circuit 5 Electrode group 8 ACF
9. Support base 11, Supply reel 12, Mount tape 13, ACF tape 16, 17, Horizontal guide roller 22, Elevating drive 23, Longitudinal drive 24, Flat action drive
36 ・ ・ Transport stand 40 ・ ・ Half-cut means 50 ・ ・ Crimp head (short type)
51, 51 ', 91, 101, 111, 121 ... Crimp blades 51b, 91b, 111b, 121b ... Tip planes 51e, 91e, 101e, 111e, 121e ... Engaging recesses 52, 52', 52 ", 102 ···, 112,122 ·· Cap member 52a · · Bottom portion 52b · · · Flat end surface 52c · · Stepped portion 52d · · Side wall portion (clamping portion) · 52e · · Envelope convex portions 53 and 53 '· · Elevating block 54 · · · Opening 56 · · Supports 57 and 57 '· · Cylinder 61 · · First fixing bracket 61a · · Fixing portion 61b · · Engagement portion 61c · · Through hole 62 · · Second fixing bracket 62a · · ·Fixed part,
71, 72 ... Fixing screw 80 ... Crimp head (long type)

Claims (5)

A crimping blade for crimping the ACF to the substrate on which the electrode is formed;
A cap member that covers the tip of the crimping blade and has elasticity;
A device for attaching an ACF to an FPD module.   The ACF attachment device for an FPD module according to claim 1, wherein the cap member is detachable from the crimping blade.   The ACF attaching device for an FPD module according to claim 2, wherein the crimping blade is provided with an engaging portion for engaging with the cap member.   2. The ACF bonding apparatus for an FPD module according to claim 1, wherein a flat portion is formed at a tip of the cap member, and a notch is provided at an end of the flat portion.   The ACF attaching apparatus for an FPD module according to claim 1, wherein the cap member is provided with a holding portion for holding the crimping blade.

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