JP2004186387A - Device and method for sticking anisotropic conductive material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for sticking anisotropic conductive materials that enables simultaneous sticking to a plurality of sticking positions through an easy operation. <P>SOLUTION: The device and the method for sticking anisotropic conductive materials performs a grouping process of forming sticking position groups A1, A2, ..., by putting initial sticking positions a1, a2, ..., in two units, when an ACF (anisotropic conductive material) for electronic parts cut in a predetermined size is stuck to a plurality of sticking positions of the substrate 18, calculating sticking data (position coordinates of representative positions P1, P2, ..., and a tape length LA of a necessary fixed size ACF2A) needed to sticking operation for those sticking position groups; and positioning the substrate 18 and a press head and leading an ACF tape out in the sticking operation according to the calculated sticking data. Consequently, simultaneous sticking to the plurality of sticking positions is enabled through a simple operation. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an anisotropic conductive material sticking apparatus and method for pressing an anisotropic conductive material for bonding electronic components to a work and sticking the work.
[0002]
[Prior art]
As a method for mounting an electronic component on a work, there is known a method in which a tape-shaped anisotropic conductive material is attached to an electrode of the work, and a semiconductor chip is pressure-bonded thereon. Since an anisotropic conductive material (hereinafter, referred to as “ACF” in the present specification) has an adhesive property and is difficult to handle, it is attached to a base tape and is attached to an anisotropic conductive tape (hereinafter, referred to as an “ACF tape” in the present specification). ).
[0003]
The ACF tape is handled while being wound on a supply reel, and is supplied to an ACF attaching device. The ACF tape pulled out from the supply reel is guided to the lower surface of the pressing head after a half cut in which only the ACF is cut out at a predetermined pitch, and the ACF is attached to the work by lowering the pressing head in this state. (For example, see Patent Document 1).
[0004]
By the way, when a work such as a display panel is to be subjected to an ACF tape attaching operation, a large number of semiconductor chips are often mounted in series, and a large number of ACF tapes are attached to the work in a row. When applying the ACF tape, the pressing operation of pressing the half-cut ACF against the work by the pressing head as described above must be repeatedly performed for each semiconductor chip. In such a case, it is required to improve work efficiency.
[0005]
Here, since it is difficult to reduce the time required for one pressing operation, in order to improve the working efficiency of ACF bonding, a plurality of bonding positions can be obtained by one pressing operation of lowering the pressing head. It has been conventionally desired to target the target.
[0006]
[Patent Document 1]
JP-A-10-260422
[0007]
[Problems to be solved by the invention]
However, if it is intended to perform simultaneous pasting at a plurality of pasting positions using a conventional ACF pasting apparatus, the following problems must be solved. The attachment position of the ACF is obtained from the mounting data of each semiconductor chip. Generally, the mounting data only gives the attachment position of each ACF, and the attachment position data in the case of the plural simultaneous attachment as described above, that is, the pressing head. No data is required for simultaneous application, such as data for aligning the ACF with the work or the cut length of the ACF tape.
[0008]
Therefore, in order to perform a plurality of simultaneous crimping operations, it is necessary to separately perform an arithmetic process for converting the attachment position given by the mounting data into a new attachment position for the plurality of simultaneous crimping operations, and to newly input data. For this reason, there is a limit to the improvement of the work efficiency, and there has been a demand for an ACF attaching apparatus which enables simultaneous attaching to a plurality of attaching positions by a simple operation.
[0009]
Therefore, an object of the present invention is to provide a sticking device and a sticking method of an anisotropic conductive material which enable simultaneous sticking to a plurality of sticking positions by a simple operation.
[0010]
[Means for Solving the Problems]
2. The anisotropic conductive material bonding apparatus according to claim 1, wherein the anisotropic conductive material bonding apparatus is configured to bond an anisotropic conductive material for bonding electronic components to a plurality of bonding positions on a workpiece. Means for supplying an anisotropic conductive tape having an anisotropic conductive material adhered to a base tape, and a difference by forming notches at a constant pitch only in the anisotropic conductive material of the supplied anisotropic conductive tape. Notch forming means for preparing a fixed-size conductive material in which the anisotropic conductive material is cut to a fixed size, and pressing the anisotropic conductive tape after the notch formation against the work from the base tape side, A pressing head for attaching a fixed-size conductive material to a work; positioning means for relatively positioning the work with respect to the pressing head; position coordinates indicating the bonding position and data on dimensions of the fixed-size conductive material Provide the data Providing means and grouping the plurality of attaching positions according to a specified grouping pattern, and attaching data for simultaneously attaching a fixed-size conductive material to the plurality of grouped attaching positions by the pressing head. Grouping processing means for performing a process of creating based on data on position coordinates and dimensions of the sizing conductive material, and control means for controlling the positioning means based on the pasting data are provided.
[0011]
According to a second aspect of the present invention, there is provided a method for attaching an anisotropic conductive material to a work, wherein the anisotropic conductive material for bonding an electronic component is cut to a fixed size at a plurality of application positions of a workpiece by a pressing head. A method of attaching an isotropic conductive material, wherein the plurality of attachment positions are grouped according to a specified grouping pattern, and a fixed-size conductive material is simultaneously attached to the grouped plurality of attachment positions by the pressing head. A grouping processing step of performing a process of creating bonding data for the position coordinates and dimensions of the sizing conductive material based on the data, and an anisotropic conductive tape in which the anisotropic conductive material is bonded to a base tape A tape supplying step of supplying the anisotropic conductive tape, and forming a notch at a constant pitch only in the anisotropic conductive material of the supplied anisotropic conductive tape. Forming step, a positioning step of positioning the work relative to the pressing head for pressing the anisotropic conductive tape against the work from the base tape side, and a notch after the positioning. An attaching step of applying the fixed-size conductive material to the work by pressing the formed anisotropic conductive tape against the work by the press head, and in the positioning step, based on the application data, Control the positioning means.
[0012]
According to the present invention, there is provided a grouping processing means for performing data processing for simultaneously grouping a plurality of fixed-size conductive materials by a pressing head by grouping the bonding positions according to a specified grouping pattern, By aligning the workpiece with respect to the pressing head based on the above, simultaneous attachment to a plurality of attachment positions can be performed with a simple operation.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an anisotropic conductive material sticking apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of an anisotropic conductive material sticking apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing the configuration of a control system of the anisotropic conductive material sticking apparatus according to one embodiment of the present invention. FIG. 4 is an explanatory diagram of sticking data in the anisotropic conductive material sticking apparatus according to one embodiment of the present invention. FIG. 5 is a flowchart of an anisotropic conductive material sticking process according to one embodiment of the present invention, and FIG. 6 is a flowchart of a grouping process in the anisotropic conductive material sticking process according to one embodiment of the present invention. FIG. 7 is an explanatory view of a grouping process in the sticking process of the anisotropic conductive material according to one embodiment of the present invention. FIGS. 8 and 9 are sticking processes of the anisotropic conductive material according to one embodiment of the present invention. It is operation | movement explanatory drawing of FIG.
[0014]
First, an apparatus for attaching an anisotropic conductive material will be described with reference to FIG. This anisotropic conductive material sticking apparatus sticks anisotropic conductive materials for bonding electronic components to a plurality of sticking positions on a substrate as a work. In FIG. 1, the device for attaching an anisotropic conductive material has a structure in which components described below are arranged on an upright plate-shaped main body frame 1. A supply reel 3 is provided on the upper front surface of the main body frame 1. An ACF tape 2 having two layers, an ACF and a base tape 2b, is wound around the supply reel 3.
[0015]
A roller 4 for feeding the tape is provided on the side of the supply reel 3, and the roller 4 is driven via a belt 6 by a motor 5 for feeding the tape provided on the back surface of the main body frame 1. By driving the roller 4, the ACF tape 2 is fed out from the supply reel 3, and is guided to the guide roller 7 located on the left side of the roller 4 and the guide rollers 8 and 9 arranged below the main body frame 1. It is sent downstream. The supply reel 3, the rollers 4, and the motor 5 serve as a supply unit that supplies the ACF tape 2.
[0016]
Between the roller 4 and the guide roller 7, a tension generator 10 formed of a transparent bottomed cylindrical body is provided. The bottom of the tension generator 10 is connected to a suction device (not shown). By suctioning the inside of the tension generator 10, a predetermined tension is applied to the ACF tape 2 hanging inside the tension generator 10. A tape detection sensor 11 is provided above the tension generator 10. The tape detection sensor 11 optically detects the presence or absence of the ACF tape 2 inside the tension generator 10, and a tape feeding control unit 41 (FIG. 3). ).
[0017]
A cutter 12 is provided between the guide rollers 7 and 8. The cutter 12 is driven back and forth by a cylinder 13, and cuts 15 at predetermined intervals only in the ACF of the ACF tape 2 supported by the tape receiver 14. As a result, a fixed size ACF 2a obtained by cutting the ACF to a fixed size is prepared in the form of being stuck on the base tape 2b. Accordingly, the cutter 12 and the cylinder 13 form notch forming means for preparing a fixed size ACF 2a in which the ACF is cut to a fixed size by forming notches at a constant pitch only in the ACF portion of the supplied ACF tape 2. ing.
[0018]
A positioning table 16 is provided below the main body frame 1. A substrate holder 17 is placed on the positioning table 16, and the substrate holder 17 holds a substrate 18, which is a workpiece to which an ACF is to be attached. By driving the positioning table 16, the substrate 18 moves to an arbitrary position in the horizontal plane, whereby the substrate 18 is positioned with respect to the pressing head 20 described below. Therefore, the positioning table 16 serves as a positioning means for relatively positioning the substrate 18 with respect to the pressing head 20.
[0019]
A pressing head 20 is provided between the guide rollers 8 and 9. The pressing head 20 is connected to a rod 21 a of a cylinder 21. The pressing head 20 moves up and down as the rod 21a of the cylinder 21 for driving the pressing head is protruded and retracted. The pressing head 20 presses the ACF tape 2 after the notch is formed on the substrate 18 from the base tape 2b side, so that only the fixed size ACF 2a cut to a fixed size is adhered to the substrate 18.
[0020]
A feed amount detecting roller 22 and a receiving roller 23 are arranged above the guide roller 9 so as to sandwich the base tape 2b. As shown in FIG. 2, the feed amount detecting roller 22 is provided with a gear cut 25 on the outer surface, and the base tape 2 b contacts the teeth to travel, thereby rotating the feed amount detecting roller 22. This rotation is transmitted to the encoder 26, and the encoder 26 transmits a pulse corresponding to the feed amount of the base tape 2b to the tape feed control unit 42 (FIG. 3). The combination of the feed amount detecting roller 22 and the encoder 26 constitutes a feed amount detecting means for detecting the feed amount of the base tape 2b.
[0021]
A tape feed roller 27 is provided above the feed amount detection roller 22. The tape feed roller 27 is driven by a tape feed motor 28 provided on the back of the main body frame 1. The tape feed roller 27 and the tape feed motor 28 constitute tape feed means. A clamp roller 29 is provided alongside the tape feed roller 27. As shown in FIG. 1, the clamp roller 29 presses the base tape 2b against the tape feed roller 27 by a spring 30.
[0022]
A take-up reel 31 is provided beside the tape feed roller 27. A rotational tension is always applied to the tape take-up reel 31 in a direction in which the tape is taken up by a motor (not shown), and the base tape 2b sent by the tape feed roller 27 is taken up without any slack. It is wound up on a reel and collected.
[0023]
A base tape peeling mechanism having a base tape peeling pin 32 is provided at the lower right end of the main body frame 1. As shown in FIG. 2, the base tape peeling pin 32 is mounted on a belt 34 via a moving block 33, and the pulley 35 on which the belt 34 is tuned is driven to rotate by a base tape peeling motor 36. Therefore, the rotation of the base tape peeling motor 36 causes the base tape peeling pins 32 to move horizontally, and peels off only the base tape 2b from the ACF tape 2 pressed integrally by the pressing head 20 against the upper surface of the substrate 18.
[0024]
Next, the configuration of the control system will be described with reference to FIG. The tape feeding control unit 41 receives a signal from the tape detection sensor 11 and controls the tape feeding motor 5. That is, when the tape detection sensor 11 stops detecting the ACF tape 2 in the tension generator 10, the tape feeding motor 5 is driven for a predetermined time. The predetermined time refers to a time until a sufficient amount of the ACF tape 2 is supplied into the tension generator 10 during feeding.
[0025]
The tape feed control unit 42 controls the feed amount of the ACF tape 2 fed from the supply reel 3 and fed downstream by controlling the tape feed motor 28. That is, the rotation amount of the tape feed motor 28 is controlled based on the tape feed amount commanded from the main control unit 40. At this time, the tape feed controller 42 receives a pulse transmitted from the encoder 26 in proportion to the rotation of the tape feed amount detection roller 22 as a feedback signal, so that a tape feed operation matching the commanded tape feed amount is performed. Is
[0026]
The mechanism driving unit 43 drives the base tape peeling motor 36 and the positioning table 16 for moving the substrate 18 based on a control signal from the main control unit 40. The cylinder driving unit 44 similarly drives the cylinder 13 for driving the cutter and the cylinder 21 for driving the pressure bonding head based on a control signal from the main control unit 40.
[0027]
The storage unit 45 includes a data storage unit 46 and a program storage unit 47. The data storage unit 46 stores data of position coordinates (see coordinate data of a point pi shown in FIG. 4A) indicating a sticking position where the fixed size ACF cut to a predetermined length is stuck on the substrate 18. Data on the size of the ACF is stored (see the length La of the fixed size ACF 2a shown in FIG. 4C).
[0028]
As the data of the position coordinates indicating the sticking position, mounting data indicating the mounting position of an electronic component (semiconductor chip) mounted on the ACF stuck on the substrate 18 is used. The data storage unit 46 is a data providing unit that provides data on position coordinates indicating the attachment position and dimensions of the fixed-size conductive material. Instead of storing the data in the storage unit attached to the apparatus, the data providing means may be provided externally each time using a communication means or a data storage medium.
[0029]
The program storage unit 47 stores various processing programs such as an ACF attaching processing program and a grouping processing program executed as a subroutine in the ACF attaching processing. The ACF attaching processing program is an operation program for executing an ACF attaching operation of attaching the ACF tape 2 to the substrate 18 after the ACF tape 2 is pulled out to form a notch. The grouping processing program is a program for performing processing for grouping a plurality of sticking positions set on the substrate 18 according to a specified grouping pattern.
[0030]
This grouping process will be described with reference to FIG. FIG. 4A shows a position where the fixed-size ACF is attached at an edge 18a of the substrate 18 which is a display panel. Since a large number of semiconductor chips for a driver of a display panel are mounted in a row on the edge portion 18a, an ACF for bonding these semiconductor chips is attached prior to component mounting.
[0031]
In FIG. 4A, a range surrounded by a broken line frame is a fixed size ACF 2a (initial fixed size ACF... FIG. 4C) in which the tape length La is set according to the size of the semiconductor chip. The affixing positions a1, a2, a3,... Ai are shown, and points p1, p2, p3,. The coordinates (x1, y1) (x2, y1) (x3, y1) (xi, y1) of these center positions are given from the mounting data of the semiconductor chip as described above. Usually, the points p are often arranged at a constant pitch Δp. In this case, the x coordinate value of each point p is represented only by the initial coordinate value x1 and the pitch Δp.
[0032]
In the operation of attaching the fixed-size ACF to each of these attaching positions, the operation of pulling out the ACF tape after the notch is formed by a predetermined length and pressing the ACF tape against the substrate 18 by the pressing head 20 is repeated for each attaching position. Therefore, when a substrate having a large number of attachment positions is targeted, it takes a long time to complete the operation of attaching to one substrate, and the work efficiency is poor.
[0033]
For this reason, in the anisotropic conductive material sticking apparatus shown in the present embodiment, a single pressing operation of the pressing head 20 causes a fixed size to be set for a plurality of (two in the example shown here) bonding positions. ACF is attached at the same time. That is, as shown in FIG. 4 (b), the pasting position group is formed by combining two adjacent pasting positions into one.
[0034]
For example, the pasting positions a1 and a2 are combined into one to form a pasting position group A1. The coordinates (X1, Y1) and (X2, Y1) of the points P1, P2,... Indicating the representative positions of the newly formed pasting position groups are changed to the points p1, p2, p3,. It is calculated from the coordinate value of pi. Here, the representative positions P1, P2,... Are obtained by calculating the midpoint between two adjacent points p1. If there is no adjacent point, the pasting position becomes the representative position as it is.
[0035]
Along with the calculation of the representative position, the length of the fixed size ACF to be attached to each attachment position group is calculated. That is, as shown in FIG. 4 (c), the length of the tape for covering all of the portions corresponding to the sticking positions in each sticking position group with the ACF is determined by the pitch Δp of the sticking position ai known in advance and the initial value. Is calculated based on the tape length La of the fixed size ACF 2a. Therefore, when there are two sticking positions, the tape length is (2 × LA), and when there is one sticking position (when there are no adjacent points), the tape length is (LA). In the formation of the notch, a fixed size ACF2A which is notched at every pitch LA and cut to a fixed size of the length LA is continuously prepared. The position coordinates of the representative position of each pasting position group and the necessary tape length calculated here are stored in the data storage unit 46.
[0036]
In the actual ACF attaching operation, the fixed size ACF2A cut to the fixed length of the tape length LA is attached to the representative positions P1, P2,... Shown in FIG. Thereby, the original attaching positions a1, a2,... Are completely covered by the ACF. Here, the tape length of the fixed size ACF to be stuck to the sticking position group is set to 2 × LA because the fixed pitch at the time of forming the notch is set in the minimum unit that can correspond to one initial sticking position. By doing so, as will be described later (see FIG. 7B), the necessary range can be covered by pasting the required number of fixed-size ACFs in series even for the pasting position group constituted by the odd pasting positions. In order to
[0037]
That is, in the above-described grouping process, the data (representative position and tape) necessary for simultaneously attaching the fixed size ACF2A to the plurality of grouped attaching positions (the attaching position groups A1, A2,. A process is performed for creating the pasting data including the length) based on the previously stored position coordinates of the pasting positions a1, a2,... And the data La of the initial fixed size ACF 2a.
[0038]
The main control unit 40 is an arithmetic processing unit. The main control unit 40 executes a program stored in a program storage unit 47 based on various data stored in a data storage unit 46 of a storage unit 45, so that a tape feeding control unit 41, The tape feed control unit 42, the mechanism drive unit 43, and the cylinder drive unit 44 are totally controlled. The operation input unit 48 is an input device such as a keyboard and a mouse, and inputs various command commands and data. The notifying unit 49 is a display device, a signal light, or the like, and notifies an abnormal operation during the operation of the attaching device.
[0039]
In the above configuration, the processing function realized by the main control unit 40 executing the grouping processing program groups a plurality of pasting positions according to the specified grouping pattern, and sets the grouping paste positions to the grouped pasting positions. This is a grouping processing unit that performs a process of creating sticking data for simultaneously sticking the size ACF by the pressing head 20 based on the data on the position coordinates and the size of the fixed size ACF. Further, the main control unit 40 is a control unit that controls the operation of the positioning table 16 based on the created attachment data.
[0040]
This anisotropic conductive material sticking apparatus is configured as described above. Hereinafter, a method of attaching the anisotropic conductive material using the present apparatus will be described with reference to the flow of the ACF attaching process in FIG. . First, a grouping process is performed on a plurality of bonding positions initially set on the work target substrate 18, that is, on bonding positions set for each semiconductor chip mounted on the substrate 18 (ST1) (grouping processing step). . Details of this grouping process will be described later.
[0041]
By the grouping process, data processing for grouping the pasting position of the substrate 18 for each group is completed, and when pasting data is created, a pasting operation of pasting the fixed size ACF to a plurality of pasting positions at the same time is executed. In this attaching operation, first, the ACF tape 2 is pulled out from the supply reel 3 and supplied to the downstream side (tape supply step). Next, notches are formed at a constant pitch (tape length LA) only in the ACF of the supplied ACF tape 2 (notch forming step). Thus, a plurality of fixed-size ACFs 2A having a tape length LA are prepared on the upstream side of the pressing head 20.
[0042]
Then, in this state, the positioning table 16 is driven to relatively move the substrate 18 with respect to the pressing head 20 to perform positioning (ST2) (positioning step). In other words, the pressing head 20 is relatively positioned to the representative position of the sticking position group to be stuck. Here, as shown in FIG. 8A, in a state where the ACF tape 2 is pulled out with respect to the pressing head 20, just below the center point of the fixed size ACF 2A (corresponding to the position of the notch 15 here). The positioning table 16 is moved so that the representative position P of the substrate 18 is located. In the positioning process, the main controller 40 controls the operation of the positioning table 16 via the mechanism driving unit 43 based on the pasting data created by the grouping process, thereby performing the positioning.
[0043]
Next, the ACF tape 2 having a length necessary for sticking to the sticking position group is pulled out (ST3). At this time, as shown in FIG. 8A, the notch 15 is aligned with the edge 20a of the pressing head 20. As a result, the fixed size ACF 2A having a length (2 × LA) required for the bonding position group (A1 in the example shown in FIG. 8) is located immediately above the correct bonding position of the substrate 18.
[0044]
Thereafter, as shown in FIG. 8B, the pressing head 20 is lowered, and the ACF tape 2 is pressed against the substrate 18 from the base tape 2b side. Thereby, fixed size ACF2A is pasted to each pasting position in the pasting position group (ST4) (pasting step). Next, it is determined whether or not the pasting position group corresponds to the last group. If not, the process returns to (ST2) and the same processing is executed for the next group. Then, in (ST5), it is confirmed that it is the last group, and the ACF attaching process ends.
[0045]
Next, details of the grouping process performed in (ST1) of the above flow will be described with reference to FIGS. In FIG. 6, first, data of position coordinates of each pasting position is read from the data storage unit 46 (ST11). That is, the data of the position coordinates of the plurality of pasting positions a1, a2,... Shown in FIG. At this time, the tape length La (see FIG. 4C) of the original fixed size ACF 2a is also read at the same time.
[0046]
Next, a grouping pattern is input as an instruction (ST12). Here, the grouping pattern specifies how a plurality of given paste positions are grouped together. For example, in the example shown in FIG. 7A, an example is shown in which a plurality of (six) initial pasting positions a1 to a6 are grouped in units of two to form three pasting position groups A1, A2, and A3. I have. In this case, two continuous fixed-size ACFs 2A are simultaneously attached to the respective attachment position groups A1, A2, and A3.
[0047]
Further, the example shown in FIG. 7B shows an example in which odd (five) initial pasting positions a1 to a5 are knitted into three pasting position groups A1, A2, and A3. In this case, an example is shown in which the initial pasting positions a1 to a4 are knitted into two pasting position groups A1 and A2 and a pasting position group A3 including only the pasting position a5. In this case, two continuous size ACFs 2A are simultaneously attached to the attachment position groups A1 and A2, respectively, and only one fixed size ACF 2A is attached to the attachment position group A3.
[0048]
In this way, by setting the tape length of the fixed size ACF2A, that is, the fixed size pitch at the time of forming the notch in the minimum unit that can correspond to one initial bonding position, the number of the initial bonding positions is odd. However, grouping is possible. Note that, in the above example, the pasting positions are grouped in units of two, but of course, it is also possible to group pasting positions in units of three or more.
[0049]
FIG. 9 shows a pasting operation when only one such fixed-size ACF 2A is pasted. That is, as shown in FIG. 9A, when the ACF tape 2 is pulled out from the pressing head 20, the positioning table is positioned so that the representative position P3 of the substrate 18 is located immediately below the center point of the fixed size ACF 2A. 16 is moved. Next, the ACF tape 2 is pulled out by a length (LA) necessary for sticking to the sticking position group A3, and the notch 15 is aligned with the edge 20a of the pressing head 20. Thereafter, as shown in FIG. 9B, the pressing head 20 is lowered to press the ACF tape 2 against the substrate 18. Thereby, the fixed size ACF2A is attached to the attaching position.
[0050]
【The invention's effect】
According to the present invention, there is provided a grouping processing means for performing data processing for simultaneously grouping a plurality of fixed-size conductive materials by a pressing head by grouping the bonding positions according to a specified grouping pattern, By aligning the work with the pressing head based on the above, simultaneous sticking to multiple sticking positions is possible with simple operation, and efficient sticking work can be performed for a work with many sticking positions. Can be.
[Brief description of the drawings]
FIG. 1 is a front view of an apparatus for attaching an anisotropic conductive material according to an embodiment of the present invention.
FIG. 2 is a perspective view of an apparatus for attaching an anisotropic conductive material according to an embodiment of the present invention.
FIG. 3 is a block diagram showing a configuration of a control system of the anisotropic conductive material sticking apparatus according to one embodiment of the present invention;
FIG. 4 is an explanatory view of pasting data in the anisotropic conductive material pasting apparatus according to one embodiment of the present invention;
FIG. 5 is a flowchart of a process of attaching an anisotropic conductive material according to an embodiment of the present invention.
FIG. 6 is a flowchart of a grouping process in the attaching process of the anisotropic conductive material according to the embodiment of the present invention;
FIG. 7 is an explanatory diagram of a grouping process in the attaching process of the anisotropic conductive material according to the embodiment of the present invention;
FIG. 8 is an explanatory diagram of an operation of a process of attaching an anisotropic conductive material according to an embodiment of the present invention.
FIG. 9 is an explanatory diagram illustrating an operation of a process of attaching an anisotropic conductive material according to an embodiment of the present invention.
[Explanation of symbols]
2 ACF tape
2a, 2A Fixed size ACF
3 Supply reel
12 cutters
13 cylinder
15 Notch
16 Positioning table
18 Substrate
20 Press head
40 Main control unit
46 Data storage unit
47 Program storage unit
a1, a2, a3 ··· Pasting position
A1, A2 ... Pasting position group

Claims (2)

An anisotropic conductive material bonding apparatus for bonding an anisotropic conductive material for bonding electronic components to a plurality of bonding positions of a work, wherein the anisotropic conductive material is bonded to a base tape. Supply means for supplying the tape, and a fixed-size conductive material in which the anisotropic conductive material is cut to a fixed size by forming cutouts at a constant pitch only in the anisotropic conductive material of the supplied anisotropic conductive tape A notch forming means for preparing, a pressing head for applying the fixed-size conductive material to the work by pressing the anisotropic conductive tape after the notch formation from the base tape side to the work, Positioning means for relatively positioning the work with respect to the head, data providing means for providing data on the position coordinates indicating the bonding position and dimensions of the fixed-size conductive material, and a specified grouping pattern. The plurality of attaching positions are grouped together, and the pasting data for simultaneously attaching the sized conductive material to the grouped plurality of attaching positions by the pressing head are represented by the position coordinates and the dimensions of the sized conductive material. And a control means for controlling the positioning means based on the pasting data. An apparatus for pasting an anisotropic conductive material, comprising: A method of attaching an anisotropic conductive material, which is obtained by cutting a fixed-size conductive material for bonding an electronic component to a plurality of application positions of a workpiece by a pressing head, the method comprising: The plurality of attaching positions are grouped according to the patterning pattern, and the position coordinates and the dimensions of the sizing conductive material are simultaneously attached to the plurality of grouped attaching positions by the pressing head. A grouping processing step of performing a processing to create based on the data about, a tape supply step of supplying an anisotropic conductive tape in which the anisotropic conductive material is adhered to a base tape, and a supplied anisotropic conductive Forming a notch at a constant pitch only in the anisotropic conductive material of the tape to prepare the conductive material having a fixed size; A positioning step of relatively positioning the work by a positioning means with respect to the pressing head for pressing the conductive tape against the work, and the anisotropic conductive tape after the notch is formed by the pressing head after the positioning. An attaching step of applying the fixed-size conductive material to the work by pressing against the work, and controlling the alignment means based on the attachment data in the alignment step. Method of attaching conductive material.

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