JP4892411B2 - Adhesive tape sticking device and sticking method - Google Patents

Description

  The present invention relates to a sticking apparatus and a sticking method for sticking an adhesive tape with a release paper to a side portion of a substrate such as a liquid crystal display panel.

  In the assembly process of the liquid crystal display device, an operation of mounting a TCP (Tape Carrier Package) on a liquid crystal display panel (hereinafter referred to as a substrate) or mounting this TCP on a circuit board is performed. When mounting the TCP on a substrate, first, an adhesive tape with release paper made of an anisotropic conductive member is attached to the side portion of the substrate. Next, the release paper is peeled from the pressure-sensitive adhesive tape, the TCP is temporarily pressure-bonded to the pressure-sensitive adhesive tape, and then the pressure-bonding is performed.

  When sticking adhesive tape with release paper on the side of the board, if the back side of the side of the board is supported by a backup tool and the adhesive tape with release paper is positioned on the top of the side The upper surface of the side portion of the substrate supported by the backup tool is pressed with a pressing tool to adhere the adhesive tape.

  By the way, recently, due to the increase in size of the substrate, the length of one side portion to which the adhesive tape is attached has also become longer. When the side part to which the adhesive tape is attached becomes longer, the width of the backup tool that supports the lower surface of the side part and the pressure tool that attaches the adhesive tape under pressure will also become longer. .

  However, when the backup tool or adhesive tape is lengthened, it may be difficult to set the upper end surface and the lower end surface parallel to each other with high accuracy, and the pressurizing tool increases in weight. It may be difficult to handle, or the drive mechanism for driving up and down may be enlarged.

  Then, when a board | substrate enlarges, the adhesive tape stuck on the upper surface of the one side part is divided | segmented into several, and is stuck. Accordingly, it is considered that the width dimension of the pressure tool is reduced according to the length dimension of the divided adhesive tape.

  Usually, when sticking the adhesive tape on the upper surface of one side of the substrate, the adhesive tape with release paper is pulled out from the supply reel by a predetermined length, and only the adhesive tape is cut by the cutting mechanism and supported by the backup tool Once positioned on the upper surface of one side, the cut portion of the adhesive tape is pressed with a pressing tool and attached to the upper surface of one side of the substrate. Next, the attaching operation is completed by peeling the release paper from the attached adhesive tape.

  When a plurality of adhesive tapes are attached to the upper surface of one side portion of the substrate, for example, when the adhesive tape is divided and adhered in two, the operation of attaching one adhesive tape to the upper surface of the one side portion of the substrate described above is performed. Repeatedly.

If the cut part of the adhesive tape is attached to the substrate, the release paper is peeled off from the part, and then the substrate is moved, and then the adhesive tape with the release paper is pulled out from the supply reel, and the above-described steps are performed. Repeatedly.

Patent Document 1 discloses a technique for attaching an adhesive tape to one side of a substrate. However, it is not shown that the adhesive tape attached to one side is divided into a plurality of parts.
JP 2003-51517 A

  By the way, when the adhesive tape is divided and adhered to the upper surface of one side portion of the substrate, the release paper is separated from the adhered adhesive tape portion every time the divided portions of the adhesive tape are adhered. And a work for pulling out the adhesive tape with release paper from the supply reel after peeling.

  In other words, when the adhesive tape is divided into a plurality of pieces and attached to the upper surface of one side of the substrate, the adhesive tape is not divided into one side of the substrate every time the divided adhesive tapes are attached. The work performed when sticking must be repeated several times.

  Therefore, when the adhesive tape is divided and adhered to the upper surface of one side of the substrate, the number of adhesive tapes that are divided and adhered as compared to the case where the adhesive tape is adhered without dividing. Therefore, productivity is greatly reduced.

  Therefore, when dividing and sticking adhesive tape on one side of the substrate, it is desired not only to repeat the same work multiple times but also to make the sticking work as efficient as possible. Yes.

  This invention, when attaching a plurality of adhesive tapes divided on one side of the substrate, rather than repeating the work performed when affixing the adhesive tape on one side of the substrate without dividing it multiple times. An object of the present invention is to provide a pressure-sensitive adhesive tape sticking device and a sticking method capable of improving work efficiency.

This invention is an adhesive tape sticking device that peels the release paper from the sticky adhesive tape while cutting and sticking a plurality of adhesive tapes with release paper on the side edges of the substrate,
A supply reel on which the adhesive tape with the release paper is wound, and a take-up reel for winding the release paper after the adhesive tape is attached to the substrate;
Withdrawing means for pulling out the adhesive tape with release paper from the supply reel at a length corresponding to the side of the substrate;
Cutting means for cutting only the adhesive tape into a plurality of portions of a predetermined length when the adhesive tape is pulled out from the supply reel by the drawing means;
A pressure unit having a width corresponding to the pressure-sensitive adhesive tape cut to a predetermined length, and pressure-bonding the cut pressure-sensitive adhesive tape to the substrate;
After the first cut portion of the adhesive tape is attached to the side portion of the substrate by the pressing means, the portion cut next to the adhesive tape is attached to the side portion of the substrate by the pressing means. When peeling off, the release paper is peeled off from the portion of the adhesive sheet that is first attached to the substrate, and then the release paper is peeled off from the portion of the substrate that is attached next to the adhesive tape. An adhesive tape sticking apparatus comprising: means.

  When the portion cut next to the adhesive tape is attached to the side portion of the substrate, it is preferable to move the pressurizing means and the substrate relative to the side portion of the substrate.

  A plurality of pressurizing means corresponding to the plurality of portions of the adhesive tape adhered to the side portions of the substrate; It is preferable to apply pressure to the part sequentially.

This invention is a method of attaching an adhesive tape that peels the release paper from the attached adhesive tape while cutting and adhering a plurality of adhesive tapes with release paper on the side edges of the substrate,
A step of pulling out the adhesive tape with the release paper with a length corresponding to the side portion of the substrate;
Cutting the adhesive tape alone into a plurality of portions of a predetermined length when pulling out the adhesive tape;
A step of sequentially sticking a plurality of parts of the adhesive tape cut to the side of the substrate;
After sticking the first cut part of the adhesive tape to the side part of the substrate, when sticking the next cut part to the side part of the substrate, it is first attached to the substrate. And a step of peeling the release paper from the attached portion, and then peeling the release paper from the next attached portion.

  It is preferable that the operation of attaching the adhesive tape to the substrate and the operation of peeling the release paper from the attached adhesive tape are performed a plurality of times with respect to the operation of pulling out the adhesive tape once.

  According to this invention, since the adhesive tape with release paper is first drawn out with a length corresponding to the side portion of the substrate, the above-mentioned adhesive tape can be pulled out only once, and the adhesive tape is cut first. After pasting the part, when pasting the next cut part, it is possible to perform the work of peeling the release paper from the first pasted part at the same time as the pasting work. As a result, the working time can be shortened.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing a sticking device for an adhesive tape 2 with a release paper 1, and this sticking device has a table 5 driven in the X, Y and Z directions by a first driving means 4. Have. As shown in FIG. 2, a substrate W made of a liquid crystal display panel is supplied and mounted on the upper surface of the table 5 with one side protruding outward from one end of the table 5.

  The substrate W supplied and placed on the upper surface of the table 5 is supported by the upper end surface of the backup tool 6 by driving the table 5 in the X, Y and Z directions. ing. The backup tool 6 has a width dimension that is approximately half of the length dimension of one side of the substrate W, and at least the upper end portion has a flat plate shape along the longitudinal direction of one side of the substrate W.

  Above the backup tool 6, a pressurizing tool 7 as a pressurizing unit is provided so as to be driven in the Z direction by the second driving unit 8. The pressure tool 7 is formed to have substantially the same width as the backup tool 6, and at least a lower end portion is a flat plate shape corresponding to the upper end portion of the backup tool 6.

  The adhesive tape 2 with the release paper 1 is wound around a supply reel 11. The adhesive tape 2 with the release paper 1 fed out from the supply reel 11 is attached to the upper surface of one side portion of the substrate W, the lower surface of which is supported by the backup tool 6, as will be described later by the pressure tool 7. Only the release paper 1 is wound on the take-up reel 12.

  The supply reel 11 is rotationally driven by the third drive means 9, and the take-up reel is rotationally driven by the fourth drive means 10.

  As shown in FIG. 3, in this embodiment, the adhesive tape 2 is divided into two parts and attached to the upper surface of one side of the substrate W. Let the parted adhesive tape 2 be the 1st part 2a and the 2nd part 2b.

  As a result, the width dimension of the backup tool 6 and the pressure tool 7 can be made substantially the same length dimension as the divided portions 2 a and 2 b of the adhesive tape 2. That is, even if the substrate W is enlarged, the width dimension of the backup tool 6 and the pressure tool 7 can be about half the width dimension of the substrate W.

  A peeling unit 16 constituting a peeling means is fixedly provided at one end in the width direction of the table 5. The peeling unit 16 includes a mounting plate 21, and a lower roller 22 and an upper roller 23 are rotatably provided at positions higher than the lower roller 22.

  The release paper 1 after the adhesive tape 2 is adhered to the substrate W is sequentially engaged with the outer peripheral surfaces of the lower roller 22 and the upper roller 23. The release paper 1 led out from the upper roller 23 is taken up on the take-up reel 12 through one guide roller 13 located on one end side in the width direction of the table 5.

  A cutting mechanism 24 is provided near the other guide roller 13 at the other end in the width direction of the table 5. The cutting mechanism 24 has a holding member 25 arranged with its lower end surface being in contact with the release paper 1 and a cutter 26 provided facing the lower side of the holding member 25. The cutter 26 is formed by a cylinder (not shown). It is driven in the vertical direction.

  Between the holding member 25 and the cutter 26, the adhesive tape 2 with the release paper 1 fed from the supply reel 11 is passed with the adhesive tape 2 facing downward. When the cutter 26 of the cutting mechanism 24 is driven in the upward direction, only the adhesive tape 2 is cut.

  As shown in FIG. 4A, the cutting mechanism 24 forms cutting lines c at two places with a predetermined width as shown in FIG. 4A, and a portion r between the two cutting lines c is not shown. Removed by release tape. Thereby, the adhesive tape 2 is formed with a removed portion m that is divided into a predetermined length and removed by the release tape as shown in FIG.

  A feed chuck 27 is disposed between the peeling unit 16 and one guide roller 13. The feed chuck 27 is reciprocated in the horizontal direction indicated by the arrow X in FIG.

  If the feed chuck 27 is driven in the + X direction while holding the release paper 1 led out from the peeling unit 16, the adhesive tape 2 with the release paper 1 is fed out from the supply reel 11.

  When the feed chuck 27 is driven in the + X direction by the fifth drive means 28, the third drive means 9 that rotationally drives the supply reel 11 and the fourth drive means 10 that rotationally drives the take-up reel 12. Operate synchronously. As a result, when the adhesive tape 2 with the release paper 1 is unwound from the supply reel 11, the release paper 1 removed by sticking the adhesive tape 2 to the substrate W is taken up by the take-up reel 12.

  The feed chuck 27 is driven in the + X direction by a distance that draws the adhesive tape 2 with the release paper 1 from the supply reel 11 with a length corresponding to one side of the substrate W. The feed chuck 27 stops once when the adhesive tape 2 with the release paper 1 is pulled out at a predetermined length, for example, about half the length of one side of the substrate W.

  At that time, the cutter 26 of the cutting mechanism 24 is driven to form a first cutting line c on the adhesive tape 2 as shown in FIGS. The attached adhesive tape 2 is slightly fed to form the second cutting line c, the portion r between the pair of cutting lines c is removed, and the removal portion m is provided.

  After the removal portion m is formed, a length corresponding to about half of the length of one side portion of the substrate W is drawn again, and the removal portion m is provided again at that position. As a result, the adhesive tape 2 with the release paper 1 drawn out with a length corresponding to one side of the substrate W is divided by about half the length of one side of the substrate W as shown in FIG. Two divided portions 2a and 2b are provided.

  As described above, the take-up reel 12 winds the release paper 1 in synchronism with the feeding chuck 27 when the adhesive tape 2 with the release paper 1 is pulled out from the supply reel 11. That is, when the divided portions 2 a and 2 b of the adhesive tape 2 are attached to the substrate W as will be described later, only the remaining release paper 1 is taken up on the take-up reel 12.

  The first to fifth driving means 4, 8, 9, 10, 28 are controlled by a control device 31 shown in FIG.

  Next, an operation when the adhesive tape 2 is divided into two parts on the upper surface of one side portion of the substrate W and attached by the attaching apparatus having the above configuration will be described with reference to FIGS.

  First, the feed chuck 27 is driven by the fifth drive means 28, and the adhesive tape 2 with the release paper 1 is pulled out from the supply reel 11 by substantially the same length as one side of the substrate W. When pulling out the adhesive tape 2, when the length of about half of the length of the substrate W is pulled out, the cutter 26 is operated to put a pair of cutting lines c in the adhesive tape 2, and the portion r between them is removed. To provide a removal portion m.

  If the removal portion m is provided, the adhesive tape 2 with the release paper 1 is further drawn out by about half the length of the substrate W, and at that time, the removal portion m is formed on the adhesive tape 2 by the cutter 26 again.

  As a result, the adhesive tape 2 drawn out from the supply reel 11 with a length substantially equal to the length of one side of the substrate W is divided into approximately half the length of the one side as shown in FIG. Two divided portions 2a and 2b are formed. The two divided portions 2a and 2b are defined as a first divided portion 2a and a second divided portion 2b.

  Next, the table 5 is driven in the X and Y directions (horizontal direction) by the first driving means 4, and the length of one side portion of the substrate W held on the upper surface of the table 5 is projected from the upper surface of the table 5. One end of the direction is positioned above the backup tool 6. Next, the table 5 is lowered, and the lower surface on one end portion side of the substrate W is supported by the upper end surface of the backup tool 6 as shown in FIG.

  Thereby, as shown in FIG. 5, of the two divided portions 2 a and 2 b divided from the adhesive tape 2, the first divided portion 2 a located downstream in the feeding direction of the adhesive tape 2 is the backup tool 6 for the substrate W. It positions so that it may oppose the upper surface of the longitudinal direction one end supported by.

  When the substrate W is positioned with respect to the adhesive tape 2, the pressing tool 7 is driven in the downward direction by the second driving means 8 as shown by a chain line in FIG. Accordingly, the first divided portion 2a of the adhesive tape 2 is pressed and attached to one end portion of the upper surface of one side portion of the substrate W.

  If the 1st part 2a of the adhesive tape 2 was stuck to the board | substrate W with the pressurization tool 7, the table 5 in which the board | substrate W was mounted by the 1st drive means 4 will be the direction shown by + X in FIG. To drive. In synchronism with the driving of the table 5, the feed chuck 27 is driven in the + X direction by the fifth driving means 28, and the take-up reel 12 is driven to rotate by the fourth driving means 10, so that the first separation of the release paper 1 is performed. The part which has been already peeled off from the adhesive tape 2 and is located downstream of the part 2a is wound up.

  As a result, the release paper 1 is peeled from the first divided portion 2a of the adhesive tape 2 attached to the substrate W by the peeling unit 16 as shown in FIG. The end portion and the second divided portion 2b of the adhesive tape 2 that has been cut can be positioned opposite to each other below the pressing tool 7.

  In this way, when the substrate W and the second divided portion 2b of the adhesive tape 2 are positioned at a position facing the pressurizing tool 7, the second driving means 8 is actuated to make the pressurizing tool 7 in FIG. The second part 2b of the adhesive tape 2 is pressed and adhered to the other end of the upper surface of one side of the substrate W.

  If the second portion 2b of the adhesive tape 2 is attached to the other longitudinal end of the upper surface of one side of the substrate W, the pressing tool 7 is raised by the second driving means 8 as shown in FIG. After that, the table 5 is driven in the + X direction. As a result, the release paper 1 is peeled from the second portion 2b of the adhesive tape 2 adhered to the substrate W.

  If the release paper 1 is peeled from the second portion 2b of the adhesive tape 2, the substrate with the adhesive tape 2 attached is transferred from the table 5 to the next process, and then the table 5 is driven in the -X direction to start Returning to the position, the above-described steps are repeated.

  Thus, if the 1st part 2a and the 2nd part 2b of the adhesive tape 2 are stuck to one side part of the board | substrate W, the operation | work which peels the release paper 1 from the 1st part 2a, The operation of crimping the second divided portion 2b to the substrate W can be performed simultaneously.

  In addition, since the adhesive tape 2 is initially drawn out with substantially the same length as one side of the substrate W, the two times of attaching the first divided portion 2a and the second divided portion 2b to the substrate W are performed twice. In contrast to the work, the work of pulling out the adhesive tape 2 is only required to be pulled out with a length substantially the same as the length of one side of the substrate W.

  Therefore, by these things, the operation | work which sticks the 1st part 2a and the 2nd part 2b to the one side part of the board | substrate W is efficient compared with the case where the pasting operation is repeated twice. Since it can be performed well, the tact time can be shortened.

  Furthermore, if the adhesive tape 2 is divided into the first divided portion 2a and the second divided portion 2b and attached to the upper surface of one side portion of the substrate W, the width dimension of the backup tool 6 and the pressure tool 7 will be described. Can be about half the length of one side of the substrate W.

  For this reason, even if the substrate W is enlarged, the width dimension of the backup tool 6 and the pressure tool 7 can be made sufficiently smaller than the length dimension of the substrate W. In addition to being able to easily set the degree, it is not necessary to increase the size of the second driving means 8 for driving the pressurizing tool 7 up and down.

In the above-described embodiment, after the first divided portion of the adhesive tape is attached to the substrate, when the next second divided portion is attached to the substrate, the adhesive tape is driven by driving the table while feeding the adhesive tape. The second portion of the substrate and the portion facing the second portion of the substrate are positioned with respect to the backup tool and the pressure tool, but the substrate and the adhesive tape are not moved, and the backup tool and the pressure tool are moved to the substrate. It is good also as a structure which can be driven along the longitudinal direction.
And after sticking a 1st division part to a board | substrate, you may make it position so that these backup tools and pressurization tools may be driven and it may oppose the 2nd division part 2b.

  If the backup tool is approximately the same length as one side of the substrate, only the pressing tool is driven and positioned with respect to the substrate. In other words, any configuration may be used as long as the substrate and the backup tool can be relatively moved to position them.

  When pasting the first part and then pasting the second part, without driving the table, when driving the pressure tool to oppose the second part, the peeling unit is It is provided so that it can be driven along the X direction. And when driving a pressurizing tool and making it oppose a 2nd parting part, a peeling unit should just be driven to -X direction and it should just peel a release paper from a 1st parting part.

  Moreover, although the case where the two parts which the adhesive tape was divided | segmented on the upper surface of the one side part of a board | substrate was demonstrated was demonstrated, the adhesive tape was divided | segmented into three or more on the upper surface of the one side part of a board | substrate, and it affixed. The present invention can be applied even when wearing.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the peeling apparatus which shows one embodiment of this invention. The side view which shows the state which the part which protruded from the table of the one side part of a board | substrate was instruct | indicated by the backup tool. The top view of the board | substrate which shows the state by which the adhesive tape was divided | segmented into two and adhered on the upper surface of one side part. (A), (b) is explanatory drawing which removes a part of this adhesive tape and forms a removal part part in the adhesive tape with a release paper with a cutting mechanism. Explanatory drawing when the 1st part by which the adhesive tape was divided | segmented was opposedly positioned below the pressurization tool. Explanatory drawing when peeling a release paper from the 1st part by which the adhesive tape was parted. Explanatory drawing when releasing a release paper from the 2nd part by which the adhesive tape was parted.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Release paper, 2 ... Adhesive tape, 5 ... Table, 6 ... Backup tool, 7 ... Pressure tool (pressurizing means), 11 ... Supply reel, 12 ... Take-up reel, 16 ... Peeling unit (peeling means).

Claims (5)

Attaching the adhesive tape with release paper on the side of the substrate in a plurality of cuts and sticking, and peeling the release paper from the attached adhesive tape,
A supply reel on which the adhesive tape with the release paper is wound, and a take-up reel for winding the release paper after the adhesive tape is attached to the substrate;
Withdrawing means for pulling out the adhesive tape with release paper from the supply reel at a length corresponding to the side of the substrate;
Cutting means for cutting only the adhesive tape into a plurality of portions of a predetermined length when the adhesive tape is pulled out from the supply reel by the drawing means;
A pressure unit having a width corresponding to the pressure-sensitive adhesive tape cut to a predetermined length, and pressure-bonding the cut pressure-sensitive adhesive tape to the substrate;
After the first cut portion of the adhesive tape is attached to the side portion of the substrate by the pressing means, the portion cut next to the adhesive tape is attached to the side portion of the substrate by the pressing means. When peeling off, the release paper is peeled off from the portion of the adhesive sheet that is first attached to the substrate, and then the release paper is peeled off from the portion of the substrate that is attached next to the adhesive tape. A pressure-sensitive adhesive tape sticking device comprising: means.   When the portion cut next to the adhesive tape is attached to the side portion of the substrate, the pressurizing means and the substrate are moved relative to the side portion of the substrate. The adhesive tape sticking device according to claim 1.   A plurality of pressurizing means corresponding to the plurality of portions of the adhesive tape adhered to the side portions of the substrate; The pressure-sensitive adhesive tape sticking apparatus according to claim 1, wherein the pressure-sensitive sticking is sequentially applied to the part. Attaching the adhesive tape with release paper on the side of the substrate in a plurality of cuts and sticking, and peeling the release paper from the attached adhesive tape,
A step of pulling out the adhesive tape with the release paper with a length corresponding to the side portion of the substrate;
Cutting the adhesive tape alone into a plurality of portions of a predetermined length when pulling out the adhesive tape;
A step of sequentially sticking a plurality of parts of the adhesive tape cut to the side of the substrate;
After sticking the first cut part of the adhesive tape to the side part of the substrate, when sticking the next cut part to the side part of the substrate, it is first attached to the substrate. And a step of peeling the release paper from the part that has been attached, and then peeling the release paper from the part that has been subsequently attached.   5. The sticking operation of the adhesive tape to the substrate and the releasing operation of the release paper from the stuck adhesive tape are performed a plurality of times with respect to one pulling-out operation of the adhesive tape. A method of attaching the adhesive tape as described.

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