JP4801016B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method, and more particularly to a sheet sticking apparatus and a sticking method suitable for sticking a sticking sheet to an adherend such as a semiconductor wafer.

  Conventionally, on a semiconductor wafer (hereinafter simply referred to as “wafer”), a surface protective adhesive sheet, a die bonding adhesive sheet for die bonding a chip to a substrate, and a surface protective film are formed on the wafer. It is practiced to attach an adhesive sheet for this purpose (hereinafter, these adhesive sheets are collectively referred to as “adhesive sheet”). When affixing such an adhesive sheet to a wafer, the belt-like adhesive sheet is affixed to the wafer using a press roller, and then the adhesive sheet is cut to fit the size of the wafer. A configuration is adopted in which the adhesive sheet portion on the outer peripheral side of the wafer is collected as an unnecessary sheet (see, for example, Patent Document 1).

JP 2003-115469 A

In the sheet sticking apparatus described in Patent Document 1, since the adhesive sheet is cut according to the size of the wafer after sticking the adhesive sheet on the wafer, the adhesive sheet is cut inside the wafer. It is something that cannot be done. In particular, when a thermosetting or heat-sensitive adhesive sheet is affixed to a wafer, the adhesive sheet melted by heating flows down from the outer periphery of the wafer and adheres to the table that supports the wafer, and the wafer can be removed from the table. In addition to being unable to do so, there is a disadvantage that the wafer will be damaged if it is forcibly removed.
Such inconvenience can be solved by cutting the adhesive sheet inside the outer periphery of the wafer in anticipation of the flow-down due to melting of the adhesive, but in this case, the wafer or the cutter blade for cutting the sheet is damaged. It causes the inconvenience of letting you.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the object of the present invention is to fit within the adherend surface of the adherend without damaging the adherend such as a wafer. An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of forming and sticking a sticking sheet.

In order to achieve the above object, the present invention provides a strip-shaped original fabric in which a first release sheet is temporarily attached to one surface of an adhesive sheet and a second release sheet is temporarily attached to the other surface. A supporting means for supporting, a table for supporting the adherend, a feeding means for feeding out the original fabric, and a notch reaching from the first release sheet side to the second release sheet in the middle of feeding the original fabric. In this case, there is no need for an incision means for forming an adhesive sheet portion surrounded by the incision as an adhesive sheet, an outer adhesive sheet portion located outside the adhesive sheet, and a first release sheet portion overlapping therewith. while the sheet, and the recovery means for recovering the first release sheet portion overlapping the sticking sheet as an inner unnecessary sheet, continuous linked via a connecting tape and said outer unnecessary sheet and the inner unnecessary sheet A sheet sticking device comprising means and, and a sticking means for the by applying a pressing force from the second release sheet side sticking the sticking sheet to the adherend,
The cutting means adopts a configuration in which a sticking sheet having a size that fits within the adherend surface of the adherend is formed.

  The present invention further includes a cutting means for cutting the second release sheet along the outer periphery of the adherend, and the cutting means has a size that protrudes from the adherend surface of the adherend. It is comprised so that the peeling sheet of 2 may be cut | disconnected.

  Moreover, in this invention, the said sticking sheet is a heat-sensitive-adhesive adhesive sheet, and the structure that the said table is provided with a heating means is employable.

  Furthermore, it is configured to further include an alignment unit that detects the position of the adherend and the position of the sticking sheet and performs alignment so that the sticking sheet is stuck to a predetermined position of the adherend. Good.

In addition, the present invention includes a step of feeding a belt-shaped raw material in which the first release sheet is temporarily attached to one surface of the adhesive sheet and the second release sheet is temporarily attached to the other surface; A step of forming an incision reaching the second release sheet from the first release sheet side in the course of unwinding the original fabric, and forming an adhesive sheet portion surrounded by the cut as an adhesive sheet; and The outer adhesive sheet portion positioned on the outer side and the first release sheet portion that overlaps the outer adhesive sheet portion are used as outer unnecessary sheets, while the first release sheet portion that overlaps the sticking sheet is used as an inner unnecessary sheet, and the connecting tape including a higher Engineering recovering connects the outer unnecessary sheet and the inner unnecessary sheet, and a step of sticking the sticking sheet by applying a pressing force from the second release sheet side to a predetermined adherend Shi A door sticking method,
When the sticking sheet is formed, a method is adopted in which a cut is formed in the adhesive sheet so as to have a size that fits within the adherend surface of the adherend.

  The sheet sticking method further includes a step of cutting the second release sheet along the outer periphery of the adherend, and the second release sheet has a size that protrudes from the adherend surface of the adherend. It is configured to be cut like this.

According to the present invention, the adhesive sheet is cut in the course of feeding the original fabric to form a sticking sheet having a size that fits within the adherend surface of the adherend. In the case of the thermosetting type, it is possible to surely eliminate the inconvenience that the adhesive flows down from the outer periphery of the adherend onto the table, and when the adherend is subsequently taken out, the adherend It is also possible to avoid inconveniences such as damage.
Moreover, since it was set as the structure which cut | disconnects a 2nd peeling sheet in the state which becomes the magnitude | size which protrudes from the to-be-adhered surface of an adherend, since an adhesive sheet is protected by the 2nd release sheet, it adheres to an adherend It can be stored for a while with the adhesive sheet attached. Also, when peeling off the second release sheet remaining on the sticking sheet, it is possible to perform the work easily by gripping the protruding portion, and when attaching and peeling the adhesive tape In this case, the adhesive tape for peeling can be pressed or welded only to the protruding portion, so that the adherend is not damaged by the pressing means or the welding means.
Furthermore, since the adherend and the sticking sheet can be positioned by the alignment means, the sticking sheet is not shifted and sticks out of the adherend, and the sticking sheet adheres to the table. It can be surely prevented.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment, and FIG. 2 shows an enlarged perspective view of a main part showing a process for manufacturing a sticking sheet to be attached to an adherend. Yes. In these drawings, the sheet sticking apparatus 10 is a belt-like shape in which the first release sheet A is temporarily attached to one surface of the adhesive sheet S and the second release sheet B is temporarily attached to the other surface. A support means 11 for supporting the original fabric R, a table 12 for supporting a wafer W as an adherend, a delivery means 13 for delivering the original fabric R, and the first release sheet A in the course of delivering the original fabric R A notch means 15 for forming an incision C reaching the second release sheet B from the side and forming an adhesive sheet portion surrounded by the incision C as an adhesive sheet S1, and located outside the adhesive sheet S1 The outer adhesive sheet portion S2 and the outer release sheet portion A1 that overlaps the outer adhesive sheet portion S2 serve as the outer unnecessary sheet D, while the inner release sheet portion A2 that overlaps the sticking sheet S1 is collected as the inner unnecessary sheet E. Collecting means 16, connecting means 17 for connecting the outer unnecessary sheet D and the inner unnecessary sheet E via a connecting adhesive tape T, and applying the pressing force from the second release sheet B side for the application. An attaching means 18 for attaching the sheet S1 to the wafer W, a cutting means 19 for cutting the second release sheet B along the outer periphery of the wafer W, and a winding means 20 for winding the second release sheet B including.
The adhesive sheet S in this embodiment is composed of a heat-sensitive adhesive sheet that is bonded to the back surface of the wafer and used when bonding the diced chip to the lead frame.

  The support means 11 is composed of a roller 22 that supports a belt-shaped raw fabric R wound in a roll shape, and the raw fabric R fed out from the roller 22 is cut through a guide roller 23 located in the lower part of FIG. It is guided in a substantially horizontal direction toward the insertion means 15.

The table 12 is provided with a suction hole (not shown) on the upper surface side as a suction surface of the wafer W, and a coil heater 24 as a heating unit is built in the table 12, and the wafer W is placed outside the suction surface of the wafer W. A circular groove 12A having a diameter larger than W is provided. In the present embodiment, a protective sheet (not shown) is attached to the circuit surface of the wafer W, and is sucked and supported by the table 12 via the protective sheet, and is supported in a state where the back surface is exposed to the upper surface side. .
The table 12 is supported by a motor M, a first linear motor M1, and a second linear motor M2. The motor M allows the wafer W to rotate in the plane thereof, and the first linear motor M1. 1 allows the second linear motion motor M2 and the table 12 to move in the left-right direction in FIG. 1, while the second linear motion motor M2 enables the table 12 to move in the direction perpendicular to the paper surface in FIG.
Further, a camera 27 that interacts with the motor M and the first and second linear motion motors M1 and M2 is disposed above the table 12, and these motor M and the first and second linear motors are arranged. The moving means M1 and M2 and the camera 27 constitute an alignment means 25. The camera 27 is movable between a detection position for detecting the positions of the wafer W and the sticking sheet S1 above the table 12 and a retreat position outside the table 12 with respect to the detection position. It is supported.

  The feeding means 13 includes a driving roller 30 supported by the frame F, a motor M3 that rotates the driving roller 30, and a pinch roller 31 that sandwiches the second release sheet B between the driving roller 30. ing. The frame F is movable in the left-right direction in FIG. 1 via a slider M4A of a linear motor M4 located on the side of the table 12.

  The cutting means 15 includes a die cut roller 35 disposed on the first release sheet A side, an anvil roller 36 disposed on the second release sheet B side, and rotated in synchronization with the die cut roller 35 by a mechanism (not shown), The motor M5 that rotates the die cut roller 35 is included. The die cut roller 35 includes a roller body 35A and a cutting blade 35B provided on the outer peripheral surface of the roller body 35A. The cutting blade 35B is formed so as to have a substantially circular shape having a diameter smaller than the diameter of the adherend surface of the wafer W when deployed on a flat surface. Therefore, the original fabric R after passing through the cutting means 15 is formed. A substantially circular cut C (see FIG. 2) is formed. As shown in FIG. 1, the roller main body 35 </ b> A is formed with a cutting blade absence region 35 </ b> C so that the raw fabric R can be passed through. When positioned on the side, the forming interval of the sticking sheet S1 can be arbitrarily set by changing the feeding speed of the original fabric R. Moreover, the cutting blade 35B can also be made into the shape corresponding to V notch and orientation flat formed in the wafer.

  The collection means 16 includes the separation block 37, the collection drive roller 38 that is rotated by a motor M6 disposed below the separation block 37, and the collection drive roller 38. And the inner unnecessary sheet E, a pinch roller 39, a collecting roller 40 for winding and collecting the outer unnecessary sheet D and the inner unnecessary sheet E, and a motor M7 for rotating the collecting roller 40. The peeling block 37 is for peeling the outer unnecessary sheet D and the inner unnecessary sheet E from the second peeling sheet B and the sticking sheet S1. In this embodiment, the peeling block 37 is peeled downward in the substantially horizontal direction. Although it is configured with a guide surface that can be formed, it is not particularly limited and may be configured with a roller or a plate-like blade material.

  The connecting means 17 includes a pressing means 41 that receives a single-wafer type connecting tape T from a tape supply device (not shown) and affixes the connecting tape T so as to cross the notch C portion. The pressing means 41 includes a suction grid 43 in which suction holes (not shown) are formed on the upper surface side, and the suction grid 43 is provided so as to be able to advance and retract in the vertical direction via a cylinder 44. Although not shown here, a cradle serving as a receiving surface for the pressing force by the suction grid 43 is provided on the upper surface side of the second release sheet B in FIG.

  The sticking means 18 is constituted by a press roller 48 supported by a frame F1, and the frame F1 is movable in the left-right direction in FIG. 1 via a slider M4B of the linear motor M4. The press roller 48 is supported by the frame F1 so as to be movable in the vertical direction by a driving means (not shown), thereby applying an optimal pressing force according to the thickness of the wafer W or the sticking sheet S1. It has become.

  The cutting means 19 includes a rotary arm 50 provided above the table 12 and rotated by a motor M8, and a cutter blade 51 attached to the tip of the rotary arm 50. The cutting means 19 uses the position shown in FIG. 1 as the retracted position, while the cutting edge of the cutter blade 51 enters the groove 12A of the table 12 when the cutter blade 51 cuts the second release sheet B. It is provided so that it can be lowered. Instead of the cutting means 19, an articulated robot described in Japanese Patent Application Laid-Open No. 2004-62004 by the present applicant may be used.

  The winding means 20 includes an arm 52 having one end rotatably supported by the frame F, a winding roller 53 rotatably supported by the other end of the arm 52, and driving the winding roller 53. And a spring (not shown) that urges the roller 30 so as to be in contact with the outer peripheral surface of the roller 30, the winding roller 53 rotates following the driving roller 30, and the second release sheet B is wound up.

  Next, the sheet sticking method in this embodiment is demonstrated, also referring FIG. 3 thru | or FIG.

  First, as shown in FIG. 1, a roll-shaped raw fabric R is pulled out by a predetermined length and passed between a die-cut roller 35 and an anvil roller 36. After the first release sheet A and the adhesive sheet S are peeled from the second release sheet B at the corner position of the release block 37 and passed between the recovery drive roller 38 and the pinch roller 39, The lead end is fixed to the collection roller 40. On the other hand, the second release sheet B passes between the drive roller 30 and the pinch roller 31 and fixes its lead end to the take-up roller 53, thereby completing the initial setting. In this initial setting stage, the anvil roller 36 and the pinch rollers 39 and 31 are retracted in a direction away from the die cut roller 35 and the drive rollers 38 and 30 by a driving means (not shown) to ensure a predetermined clearance. It is like that.

  Next, when the automatic sticking mode is selected by an operation panel (not shown), the motors M3, MM5, M6, and M7 rotate synchronously to form a cut C in the original fabric R, and as shown in FIG. An initial feeding operation for forming one sheet S1 is performed, stops at a predetermined position, and enters a standby state.

  The adhesive sheet S is divided into an adhesive sheet S1 and an outer adhesive sheet portion S2 by the cut C, and the first release sheet A includes an inner release sheet portion A2 and an outer release sheet portion A1. (See FIGS. 6A and 6B). After the original fabric R passes through the notch means 15, the connecting adhesive tape T is supplied to the suction grid 43 one by one from a supply means (not shown), and is pasted so as to cross the notch C at the leading end in the original feed direction. (See FIG. 2). The application of the connecting adhesive tape T is adjusted in timing when a sensor (not shown) detects that the cut C has reached a predetermined position. In the raw fabric R that has passed through the connecting means 17, the outer unnecessary sheet D and the inner unnecessary sheet E are peeled off by the peeling block 37, and a circular sticking sheet S1 is formed on the second peeling sheet B (on the lower surface side). Only remains (see FIG. 6C).

  When the wafer W is placed on the table 12 via a transfer means (not shown), alignment is performed by the alignment means 25 so that the wafer W is oriented to a predetermined position. When this alignment operation is completed, the frame F supporting the feeding means 13 moves to the right side with respect to the initial position shown in FIG. 1 via the linear motor M4 with the motor M3 locked (see FIG. 3). ). In synchronism with the movement of the feeding means 13, the motors M5, M6 and M7 are also driven to form the next sticking sheet S1. When the camera 27 detects that the sticking sheet S1 is located at a predetermined position on the wafer W, the sticking means 18 moves to the right side from the initial position shown in FIG. 1 via the linear motor M4 (FIG. 4). (Refer to FIG. 6) The application sheet S1 is attached to the upper surface (attachment surface) of the wafer W by the heat of the coil heater 24 (see FIG. 6D). At this time, since the sticking sheet S1 is sized to fit within the adherend surface of the wafer W, the sticking sheet S1 does not stick out of the wafer W.

  When the sticking of the sticking sheet S1 is completed in this way, the cutting means 19 has a groove in the table 12 as the tip (lower end) of the cutter blade 51 penetrates the second release sheet B as shown in FIG. Lower to a position received within 12A. Then, the arm 50 rotates in a plane via the motor M8, and the second release sheet B is cut along the outer periphery of the wafer W. At this time, the second release sheet B is cut so as to have a size that protrudes from the adherend surface of the wafer W (see FIG. 6E).

  Next, while the feeding means 13 and the sticking means 18 return to the initial positions shown in FIG. 1, the winding roller 53 rotates following the rotation of the driving roller 30, and the second release sheet B is wound up. Become.

  Thereafter, the same operation excluding the initial feeding operation is repeated, so that the sticking sheets S1 can be sequentially attached to each wafer W.

Therefore, according to such an embodiment, since the sticking sheet S1 having a size that fits within the adherend surface of the wafer W is formed and stuck so as to fit within the adherend surface of the wafer W, for example, When the sticking sheet is a heat-sensitive adhesive sheet, there is no inconvenience that the adhesive flows out to the outer periphery of the wafer and adheres to the upper surface of the table 12.
In addition, since the second release sheet B is cut so as to have a size that protrudes from the adherend surface of the wafer W, it is possible to easily perform the release operation using the protruding portion.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the case where a heat-sensitive adhesive sheet is used as the adhesive sheet S has been described. However, the present invention is not limited to this, and a pressure-sensitive adhesive sheet or an ultraviolet curable adhesive sheet is used. Etc. can also be used.

  Further, the planar shape of the sticking sheet S1 is not limited to a circular shape, and various shapes can be adopted according to the planar shape of the adherend, and if the die cut roller 35 forms a closed loop according to this, the die cutting roller 35 can be used. Good. Furthermore, it may replace with the die-cut roller 35 of the cutting means 15, and may use the press type | mold with which the cutting blade was formed in the plane.

  Furthermore, the adherend in the present invention is not limited to the semiconductor wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can be used. The semiconductor wafer is a silicon wafer. Or a compound wafer.

  In the above embodiment, the cutting of the first release sheet A by the cutting means 19 is illustrated and described so as to cut the circumference in accordance with the planar shape of the circular wafer W. You may make it cut | disconnect so that it may become a magnitude | size which protrudes from the adherend surface of a to-be-adhered body using a robot irrespective of a to-be-adhered body shape.

  Furthermore, as an adhesive sheet, an original fabric having an adhesive layer on both surfaces of a substrate can be used.

  Alternatively, the second release sheet B may be wound around the winding roller 53 without performing the cutting process of the second release sheet B. In this case, the wafer W to which the sticking sheet S1 is stuck is not stored and is transferred to the next process immediately after sticking.

The schematic front view of the sheet sticking apparatus which concerns on this embodiment. The principal part expansion perspective view which shows the process of manufacturing the sheet | seat for sticking stuck to a to-be-adhered body. The schematic front view of the sheet sticking apparatus which shows the state which extended the sheet | seat for sticking on the wafer. The schematic front view of the sheet sticking apparatus which shows the state which stuck the sheet | seat for sticking on the wafer. The schematic front view which shows the state which cut | disconnects a 2nd peeling sheet along a wafer outer periphery. (A)-(E) is explanatory drawing which represented the process until it forms the sheet | seat for sticking from a raw fabric, and affixes it on a wafer in steps.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Support means 12 Table 13 Feeding means 15 Cutting means 16 Collecting means 18 Sticking means 19 Cutting means 24 Coil heater (heating means)
27 Camera (alignment means)
25 Alignment Means A First Release Sheet A1 Outer Release Sheet Part A2 Inner Release Sheet Part B Second Release Sheet C Notch D Outer Unnecessary Sheet E Inner Unnecessary Sheet R Original Fabric S Adhesive Sheet S1 Adhesive Sheet S2 Outer Adhesiveness Sheet part W Wafer (Substrate)

Claims (6)

The first release sheet is temporarily attached to one surface of the adhesive sheet, and the support means for supporting the belt-like original fabric in which the second release sheet is temporarily attached to the other surface, and the adherend are supported. And an adhesive sheet portion surrounded by the cut and forming a notch reaching the second release sheet from the first release sheet side in the course of feeding the original fabric. An incision means formed as an adhesive sheet, an outer adhesive sheet portion located outside the adhesive sheet, and a first release sheet portion overlapping therewith are used as outer unnecessary sheets, while overlapping the adhesive sheet. and recovery means for recovering the first release sheet portion as an inner unnecessary sheet, and connecting means for connecting through a connecting tape and said outer unnecessary sheet and the inner unnecessary sheet, or the second release sheet side Wherein the sticking sheet pressing force by applying a sheet sticking apparatus and a sticking means for sticking to the adherend,
The sheet cutting apparatus according to claim 1, wherein the cutting means forms a sticking sheet having a size that fits within the adherend surface of the adherend.   The apparatus further includes cutting means for cutting the second release sheet along the outer periphery of the adherend, and the cutting means has a size that protrudes from the adherend surface of the adherend. The sheet sticking device according to claim 1, wherein the sheet sticking device is cut.   3. The sheet sticking apparatus according to claim 1, wherein the sticking sheet is a heat-sensitive adhesive sheet, and the table includes a heating unit.   The apparatus further comprises an alignment unit that detects a position of the adherend and a position of the sticking sheet and aligns the sticking sheet so that the sticking sheet is stuck to a predetermined position of the adherend. Item 4. The sheet sticking device according to 1, 2 or 3. While the first release sheet is temporarily attached to one surface of the adhesive sheet and the belt-like original fabric in which the second release sheet is temporarily attached to the other surface, and in the course of delivering the original fabric Forming an incision reaching the second release sheet from the first release sheet side and forming an adhesive sheet portion surrounded by the cut as an adhesive sheet; and an outer adhesive located outside the adhesive sheet The first release sheet portion that overlaps the adhesive sheet and the first release sheet portion that overlaps the adhesive sheet portion as the outer unnecessary sheet, and the first unnecessary release sheet portion that overlaps the adhesive sheet as the inner unnecessary sheet, and the outer unnecessary sheet and the inner side by the connecting tape sheet sticking method der containing a more Engineering recovering connects the unnecessary sheet, and a step of sticking the sticking sheet by applying a pressing force from the second release sheet side to a predetermined adherend Te,
A method for sticking a sheet, wherein when the sheet for sticking is formed, a cut is formed in the adhesive sheet so as to have a size that fits within an adherend surface of the adherend.   The method further includes a step of cutting the second release sheet along the outer periphery of the adherend, and the second release sheet is cut to a size that protrudes from the adherend surface of the adherend. The sheet sticking method according to claim 5.

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