JP7208747B2 - Sheet sticking device and sheet sticking method - Google Patents

Description

The present invention relates to a sheet sticking device and a sheet sticking method.

2. Description of the Related Art Conventionally, there has been known a sheet applying device that positions an adhesive sheet temporarily attached to one side of a belt-shaped release sheet so as to face an adherend and adheres the adhesive sheet to the adherend (for example, , see Patent Document 1).

JP 2009-26904 A

However, in the conventional sheet sticking apparatus 10 (sheet sticking apparatus) described in Patent Document 1, when the sticking sheet S1 (adhesive sheet) is arranged to face the wafer W (adherend), the position of the adhesive sheet is changed. When detected by the camera 27 (adhesive sheet detection means), since the second release sheet B (release sheet) supporting the adhesive sheet is suspended, the release sheet portion may be loosened or pulled. The adhesive sheet may not be able to detect the correct position of the adhesive sheet and may not be accurately attached to the adherend at a predetermined position.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sheet sticking apparatus and a sheet sticking method capable of detecting the correct position of an adhesive sheet and accurately sticking the adhesive sheet to a predetermined position on an adherend.

The present invention employs the configurations described in the claims.

According to the present invention, the position of the adhesive sheet on the original fabric held by the original fabric holding means is detected by the adhesive sheet detection device, and the adherend is arranged opposite to the position of the adhesive sheet detected by the adhesive sheet detection device. Since the adhesive sheet is pressed and attached to the adherend, the release sheet supporting the adhesive sheet is prevented from being loosened, pulled, or shaken, and the adhesive sheet is accurately positioned. can be detected to accurately attach the adhesive sheet to a predetermined position on the adherend.
Further, based on the position of the adherend detected by the adherend detection device, if the adherend is arranged to face the position of the adhesive sheet detected by the adhesive sheet detection device, the adhesive sheet can be adhered. It can be attached more precisely to a predetermined position on the body.

(A) to (F) are explanatory diagrams of the sheet sticking device according to the embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.
Note that the X-axis, Y-axis, and Z-axis in this embodiment are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. do. Furthermore, in the present embodiment, when viewed from the front in FIG. 1 parallel to the Y-axis, when the direction is indicated without designating the drawing, "up" is the direction of the arrow of the Z-axis and "down". is the opposite direction, "left" is the arrow direction of the X axis, "right" is the opposite direction, "front" is the direction parallel to the Y axis in FIG. 1, and "rear" is the opposite direction. Also, since FIGS. 1B to 1F are views viewed from the same direction as FIG. 1A, arrows indicating directions are omitted.

The sheet sticking apparatus EA of the present invention comprises a feeding means 10 for feeding an original fabric RS having an adhesive sheet AS temporarily adhered to one surface RL1 of a strip-shaped release sheet RL, and an adhesive sheet in the original fabric RS delivered by the feeding means 10. Adhesive sheet detection means 20 for detecting the position of the AS; adherend support means 30 for supporting a semiconductor wafer (hereinafter also simply referred to as "wafer") WF as an adherend to which the adhesive sheet AS is applied; A pressing means 40 for pressing and sticking the adhesive sheet AS to the wafer WF and a peeling means 50 for peeling the release sheet RL from the adhesive sheet AS stuck to the wafer WF are provided.

A delivery means 10 supports an adhesive sheet laminate RS1 in which a band-shaped adhesive sheet base material AS1 is temporarily attached to one surface RL1 of a release sheet RL and a cover sheet CS is temporarily attached to the adhesive sheet base material AS1. A support roller 11, a guide roller 12 for guiding the adhesive sheet laminate RS1 and the like, and a cover sheet peeling roller 13A as a cover sheet peeling means always apply a predetermined tension to the cover sheet CS peeled from the adhesive sheet substrate AS1. A cover sheet recovery roller 13 as a recovery means for winding and recovering the cover sheet CS, and a closed loop cut CU is formed in the adhesive sheet base material AS1, and the area partitioned by the cut CU is adhered. The sheet AS is formed, and the unnecessary sheet US separated from the release sheet RL by the cutting means 14 and the unnecessary sheet stripping roller 15A as the unnecessary sheet stripping means is always given a predetermined amount. and an adjustment roller 16 rotatably supported by an output shaft 16B of a direct-acting motor 16A as a driving device. A predetermined tension is constantly applied to the release sheet RL present between the feeding force imparting means 17 for imparting a feeding force to the original fabric RS and the release sheet RL present between the feeding force imparting means 17, and the release sheet RL is wound and collected. a peeling sheet collecting roller 18 as a collecting means for collecting, an imaging means such as a camera or a projector for detecting the leading end of the adhesive sheet AS in the feeding direction of the original sheet RS fed out by the feeding means 10, an optical sensor or an ultrasonic sensor. and a sheet leading edge detection device 19 including various sensors such as the sensor.
The cutting means 14 is supported by an output shaft 14B of a rotary motor 14A as a drive device, and is synchronized with a die-cut roller 14D having a flat loop-shaped cutting blade 14C as a cutting member on the circumferential surface thereof and the die-cut roller 14D. and a rotating anvil roller 14E.
The feeding force imparting means 17 includes a linear motor 17A as a driving device, a linear motor 17C as a driving device supported by the first slider 17B, and a rotating motor 17E as a driving device supported by the slider 17D. , and a driving roller 17G which is supported by the output shaft (not shown) and sandwiches the peeling sheet RL with the pinch roller 17F.

The adhesive sheet detection means 20 includes an original fabric holding means 21 that holds the original fabric RS, and an imaging means such as a camera or a projector that detects the position of the adhesive sheet AS in the original fabric RS held by the original fabric RS. , and an adhesive sheet detection device 22 such as various sensors such as an optical sensor and an ultrasonic sensor.
The original fabric holding means 21 is supported by an output shaft 21B of a direct-acting motor 21A as a drive device, and has a positioning holding surface 21C that can be held by suction by a decompression means (holding means) (not shown) such as a decompression pump or a vacuum ejector. A raw fabric holding plate 21D is provided, and the raw fabric RS is held by the positioning and holding surface 21C.

The adherend support means 30 includes a linear motor 32 as a drive device supported by a slider 31A of a linear motor 31 as a drive device and a decompression means (not shown) such as a decompression pump and a vacuum ejector (not shown) supported by the slider 32A. an adherend support table 33 having an adherend support surface 33A capable of being sucked and held by an adherend support table 33; , an adherend detection device 34 such as various sensors such as an optical sensor and an ultrasonic sensor, and an adhesive sheet detected by the adhesive sheet detection device 22 based on the position of the wafer WF detected by the adherend detection device 34. The wafer WF is arranged to face the position of the AS.

The pressing means 40 has a part of components shared with the feeding means 10, and is rotatably connected to the linear motor 17A, the linear motor 41 as a driving device supported by the second slider 17H, and the slider 41A. and a supported pressure roller 42 .

The peeling means 50 is entirely shared with the delivery means 10, and includes a linear motor 17A, a first slider 17B, a linear motor 17C, a slider 17D, a rotary motor 17E, a pinch roller 17F, and a drive roller 17G. It consists of

The operation of the above sheet sticking apparatus EA will be described.
First, a user of the sheet sticking device EA (hereinafter simply referred to as the "user") moves the sheet sticking device EA in which the respective members are arranged at the initial positions indicated by the solid lines in FIG. After the raw fabric RS is set in the apparatus, a signal for starting the operation is inputted through an operation means (not shown) such as an operation panel or a personal computer. Then, the feeding means 10 drives the rotary motors 14A and 17E to feed the adhesive sheet laminate RS1 while rotating the die-cut roller 14D to form a closed loop cut CU in the adhesive sheet base material AS1 to form an adhesive sheet. An AS and an unnecessary sheet US are formed. Next, as shown in FIG. 1(A), when the sheet leading edge detection device 19 detects the leading edge of the leading adhesive sheet AS in the delivery direction, the delivery means 10 stops driving the rotary motors 14A and 17E.
When the original sheet RS is fed out, the cover sheet CS is peeled off from the adhesive sheet base material AS1 by the cover sheet peeling roller 13A, wound around the cover sheet collecting roller 13 and collected, and the unnecessary sheet US is The unnecessary sheet peeling roller 15A peels off the peeling sheet RL, and the unnecessary sheet collecting roller 15 winds and collects the unnecessary sheet.

After that, a user or a wafer transfer means (not shown) such as an articulated robot or a belt conveyor places the wafer WF on the adherend support table 33 as shown in FIG. 1(A). Then, the adherend supporting means 30 drives the depressurizing means (not shown) and the adherend detecting device 34 to start sucking and holding the wafer WF on the adherend supporting surface 33A. to detect the position of the wafer WF placed on the . In addition, in conjunction with the start timing of suction and holding of the wafer WF on the adherend support surface 33A, the feeding means 10 drives the linear motor 17A in a state in which the drive of the rotation motor 17E is locked, and the pinch roller 17F and the drive roller are driven. 17G is moved to the left to let out the raw fabric RS. At this time as well, the delivery means 10 drives the rotating motor 14A, and the die-cut roller 14D forms a cut CU in the delivered adhesive sheet base material AS1 to form the adhesive sheet AS and the unnecessary sheet US, and the cover sheet. A collection roller 13 and an unnecessary sheet collection roller 15 collect the cover sheet CS and the unnecessary sheet US, respectively.

Next, when the sheet leading edge detector 19 detects the leading edge of the adhesive sheet AS next to the leading adhesive sheet AS in the delivery direction, the delivering means 10 stops driving the rotating motor 14A and the linear motor 17A. Then, the adhesive sheet detection means 20 drives the direct-acting motor 21A to lower the original sheet holding plate 21D, and as shown in FIG. ), the depressurizing means (not shown) is driven to start sucking and holding the original sheet RS on the positioning and holding surface 21C. Next, the adhesive sheet detection means 20 drives the adhesive sheet detection device 22 to detect the position of the adhesive sheet AS on the raw material RS sucked and held by the positioning holding surface 21C. After that, the adhesive sheet detecting means 20 stops driving the decompressing means (not shown), releases the suction holding of the original sheet RS on the positioning holding surface 21C, and then drives the linear motion motor 21A to initialize the original sheet holding plate 21D. return to position.

Next, the adherend supporting means 30 drives the linear motors 31 and 32 to move the sliders 31A and 32A in the left-right and front-rear directions, and as shown in FIG. Based on the position of the wafer WF detected, the wafer WF is placed directly under the adhesive sheet AS detected by the adhesive sheet detection device 22 . Then, the feeding means 10 and the pressing means 40 drive the direct-acting motor 16A and the linear motor 41 to lower the adjusting roller 16 and the pressing roller 42 as shown in FIG. 1(D). Next, the pressing means 40 drives the linear motor 17A to move the pressing roller 42 to the left and press the adhesive sheet AS against the upper surface of the wafer WF with a predetermined pressing force as shown in FIG. Paste.

After that, when the adhesive sheet AS is attached to the entire upper surface of the wafer WF, the pressing means 40 stops driving the linear motor 17A, and the peeling means 50 drives the linear motor 17C. After lowering the pinch roller 17F and the drive roller 17G, the pressing means 40 drives the linear motors 17A and 41 to return the pressing roller 42 to the initial position, as indicated by the dashed line. Next, the peeling means 50 drives the linear motor 17A and the rotating motor 17E, and as shown in FIG. The release sheet RL is separated from the adhesive sheet AS attached to the wafer WF by moving rightward. Then, when the entire release sheet RL is peeled off from the adhesive sheet AS attached to the wafer WF and the linear motor 17C returns to the initial position, the peeling means 50 stops driving the linear motor 17A and the rotation motor 17E, and then the sheet is delivered. Means 10 and peeling means 50 drive linear motor 16A and linear motor 17C to return adjusting roller 16, pinch roller 17F and drive roller 17G to their initial positions.

Next, after the adherend support means 30 drives the linear motors 31 and 32 to return the adherend support table 33 to the initial position, the drive of the decompression means (not shown) is stopped, and the pressure is applied to the adherend support surface 33A. , the suction holding of the wafer WF is released. After that, the user or wafer transfer means (not shown) transfers the wafer WF on the adherend supporting surface 33A to the next step, and the same operation as described above is repeated thereafter.

According to the embodiment as described above, the position of the adhesive sheet AS on the original fabric RS held by the original fabric holding means 21 is detected by the adhesive sheet detection device 22, and the position of the adhesive sheet AS detected by the adhesive sheet detection device 22 is detected. Since the wafer WF is arranged to face each other according to the position and the adhesive sheet AS is pressed and attached to the wafer WF, the release sheet RL supporting the adhesive sheet AS is not loosened, pulled, or shaken. can be prevented, the correct position of the adhesive sheet AS can be detected, and the adhesive sheet AS can be accurately adhered to the predetermined position of the wafer WF.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for those means and steps. The process is not limited at all. For example, as long as the pressing means can press and attach the adhesive sheet to the adherend, it is not limited at all as long as it is within the technical scope in light of the common general technical knowledge at the time of filing ( other means and steps are the same).

The feeding means 10 may support the raw fabric RS to which the adhesive sheet AS is preliminarily preliminarily attached to one side RL1 of the strip-shaped release sheet RL, and feed the raw fabric RS. The delivery means 10 may or may not have the cutting means 14 .
The feeding means 10 may be provided without the unnecessary sheet peeling roller 15A and the unnecessary sheet collecting roller 15, and the support roller 11, the guide roller 12, and the support roller 11, the guide roller 12, and the pinch roller 17F and the drive roller 17G may be moved without or while being moved. The raw material RS may be fed out by moving the adjusting roller 16 or the like, or may be fed out while being held by a holding means such as a chuck cylinder or a suction pad. Instead of each roller, a plate-shaped member, a shaft member, or the like may be used to support or guide the adhesive sheet laminate RS1, the original fabric RS, or the release sheet RL. For example, the cover sheet CS, unnecessary sheet US or peeling may be supported by fan-fold folding without winding, or by shredding with a shredder or the like, for example, by fan-fold folding without winding. A configuration for collecting the sheet RL may be adopted, or a configuration may be adopted for collecting the cover sheet CS, the unnecessary sheet US, or the release sheet RL simply by stacking without winding or fan-folding. , the adjusting roller 16 may not be moved up and down, and the direct-acting motor 16A and the adjusting roller 16 may not be provided.
The cutting means 14 forms cuts CU in the entire short width direction in the band-shaped adhesive sheet base material AS1 temporarily attached to the release sheet RL, and the regions partitioned by the cuts CU are used as the adhesive sheet AS. , other regions may be used as the unnecessary sheet US, or the cutting member may be moved without or while moving the original sheet RS to form the cut CU in the adhesive sheet base material AS1 to form the adhesive sheet AS and the unnecessary sheet. Alternatively, as a cutting member, for example, a so-called flat blade that forms a cut CU having a predetermined shape in the adhesive sheet base material AS1 by moving away from and approaching the adhesive sheet base material AS1 is adopted. Alternatively, the cutting blade 14C may be detachable from the die-cut roller 14D, or may not be detachable.

The adhesive sheet detection means 20 may employ an adhesive sheet detection device 22 that partially detects the adhesive sheet AS and an adhesive sheet detection device 22 that detects the position of the adhesive sheet AS. may be employed to detect the position of the adhesive sheet AS, or the adhesive sheet detection device 22 may be employed to partially detect the adhesive sheet AS and the adhesive sheet The position of the adhesive sheet AS may be detected by moving at least one of the detection device 22 and the raw sheet RS to detect the adhesive sheet AS as a whole.
The original fabric holding means 21 may be configured so as not to separate and approach the original fabric RS. and the other surface RL2 of the release sheet RL. A surface other than a flat surface, such as a concave-convex curved surface or a convex-concave mold surface, may be used.
The adhesive sheet detection device 22 may detect the position of the adhesive sheet AS from one surface RL1 side of the release sheet RL as in the above embodiment. In the case of adopting the original sheet holding plate 21D, or in the case of adopting the adhesive sheet detection device 22 capable of detecting the adhesive sheet AS through the non-transparent release sheet RL, etc., the adhesive is adhered from the other surface RL2 side of the release sheet RL. The position of the seat AS may be detected.

The adherend supporting means 30 may not be provided with the adherend detecting device 34 and may be configured to arrange the wafer WF so as to face the position of the adhesive sheet AS detected by the adhesive sheet detecting device 22 . In this case, for example, the wafer transfer means (not shown) places the wafer WF on the adherend support surface 33A so that the wafer WF placed on the adherend support table 33 is always at a predetermined position. Alternatively, the adherend support means 30 may include positioning means such as a driving device and a positioning frame, and the wafer WF placed on the adherend support surface 33A may be arranged at a predetermined position. The wafer WF can be positioned by the positioning means.
The adherend supporting means 30 may have a configuration in which the adherend supporting table 33 is immovable in the front-rear direction, the adherend supporting table 33 may not have a holding means, or may be positioned outside or outside the wafer WF. A frame member such as a ring frame or a frame may be supported so as to surround the wafer WF, and the wafer WF and the frame member may be used as the adherend. Based on the detection result, the wafer WF and the frame member are arranged to face each other in accordance with the position of the adhesive sheet AS detected by the adhesive sheet detecting means 20, and the pressing means 40 presses the adhesive sheet AS against the wafer WF and the frame member. Can be pasted.

Instead of the linear motor 17A, the pressing means 40 may employ a driving device or the like that is not shared with the feeding means 10 and the peeling means 50 to move the pressing roller 42. Alternatively, the pressing roller 42 may not be moved. Alternatively, the wafer WF may be moved while being moved, and the adhesive sheet AS may be pressed and attached to the wafer WF, or the pressure roller 42 may not be moved up and down.

The peeling means 50 may move the adherend support table 33 and the release sheet RL to separate the release sheet RL from the adhesive sheet AS without or while moving the pinch roller 17F and the driving roller 17G. , the pinch roller 17F and the drive roller 17G may be configured so as not to move up and down, or a part or all of the linear motor 17A, the first slider 17B, the linear motor 17C, the slider 17D, the rotating motor 17E, the pinch roller 17F and the drive roller 17G. Alternatively, a member that is not shared by the feeding means 10 and the pressing means 40 may be employed to separate the release sheet RL from the adhesive sheet AS attached to the wafer WF. The release sheet RL may be held by holding means such as a suction pad or the like, and the chuck cylinder may be moved to separate the release sheet RL from the adhesive sheet AS. The release sheet RL may be held by a holding member that is supported and can be held by suction by a decompression means such as a decompression pump or a vacuum ejector, and the release sheet RL held by the holding member may be separated from the adhesive sheet AS and peeled. good.

After the adhesive sheet detection device 22 detects the position of the adhesive sheet AS on the original fabric RS sucked and held by the original fabric holding plate 21D, the sheet sticking device EA separates the original fabric holding plate 21D from the original fabric RS. Alternatively, the adhesive sheet detector 22 detects the position of the adhesive sheet AS on the original sheet RS sucked and held by the original sheet holding plate 21D. After that, the adhesive sheet AS sucked and held by the original fabric holding plate 21D is gradually separated from the original fabric holding plate 21D without separating the original fabric holding plate 21D from the original fabric RS. The adhesive sheet AS may be attached by being pressed against the upper surface of the wafer WF with a predetermined pressing force.
In the raw fabric RS, the cover sheet CS may not be temporarily attached to the adhesive sheet base material AS1, or a sheet or layer other than the cover sheet CS may be temporarily attached to the adhesive sheet base material AS1. Alternatively, another sheet or layer may be temporarily attached to the cover sheet CS, and if the cover sheet CS or another sheet or the like is not temporarily attached to the adhesive sheet base material AS1, the delivery means 10 The cover sheet peeling roller 13A and the cover sheet collecting roller 13 may or may not be provided.
A predetermined circuit may be formed on at least one of one surface and the other surface of the wafer WF, or no circuit may be formed on both of them.

The material, type, shape, etc. of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, or other shapes, and may have adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When a heat-sensitive adhesive sheet AS is used, it may be adhered by an appropriate method such as providing a heating means such as an appropriate coil heater for heating the adhesive sheet AS or the heating side of a heat pipe. Further, such an adhesive sheet AS includes, for example, a single layer consisting of only an adhesive layer, one composed of a base material and an adhesive layer, and one having an intermediate layer between the base material and the adhesive layer. , three or more layers, such as having a cover layer on the upper surface of the substrate, or a so-called double-sided adhesive sheet that allows the substrate to be separated from the adhesive layer. It may have a single or multiple intermediate layer, or may have a single or multiple layer without an intermediate layer. Examples of adherends include food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, information recording substrates such as circuit boards and optical discs, glass plates, steel plates, pottery, wooden boards, and resins. It may be an object, or a composite formed by two or more of them, and any form of member or article may also be targeted. In addition, the adhesive sheet AS can be arbitrarily used, for example, a label for information recording, a label for decoration, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a resin sheet for forming a recording layer, etc. sheet, film, tape, or the like.

The drive device in the above embodiment includes a rotating motor, a linear motor, a linear motor, a single-axis robot, an electric device such as a multi-joint robot having two or more joints, an air cylinder, a hydraulic cylinder, and a rodless robot. Actuators such as cylinders and rotary cylinders can be used, and a direct or indirect combination thereof can also be used.
In the above embodiments, when a rotating member such as a roller is employed, a drive device for rotating the rotating member may be provided, or the surface of the rotating member or the rotating member itself may be made of deformable material such as rubber or resin. It may be composed of a member, the surface of the rotating member or the rotating member itself may be composed of a member that does not deform, or other members such as a shaft or a blade that rotates or does not rotate instead of the roller. Alternatively, if a pressing means such as a pressing roller or a pressing head or a pressing member that presses an object to be pressed is adopted, a roller, a round bar, a blade can be used instead of or in combination with the above examples A member such as material, rubber, resin, sponge, etc. may be adopted, or a configuration in which pressure is applied by blowing gas such as air or gas may be adopted. It may be configured with a member that does not deform. A member such as a plate-shaped member, a round bar, or a roller may be adopted instead of or in combination with the object, and the object to be peeled may be configured with a deformable member such as rubber or resin, or may be deformed. It may be composed of a member that does not support, or if a member that supports (holds) a supported member (held member) such as a supporting (holding) means or a supporting (holding) member is adopted, a mechanical chuck or a chuck cylinder A structure that supports (holds) the supported member by gripping means such as, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, driving equipment, etc. may be adopted, or if a cutting means or cutting member that cuts the member to be cut or forms a cut or a cutting line in the member to be cut is adopted, instead of the above examples Alternatively, a cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc. is used for cutting, or cutting is performed by combining appropriate driving equipment. It is also possible to cut by moving the object to be cut.

EA... Sheet sticking device 10... Delivery means 20... Adhesive sheet detection means 21... Original fabric holding means 22... Adhesive sheet detection device 30... Adherend supporting means 33... Adherend support table 34... Adherend detection device 40... Pressing means 50 Peeling means AS Adhesive sheet RL Peeling sheet RL1 One side RS Raw fabric WF Semiconductor wafer (adherend)

Claims (3)

a feeding means for feeding the original sheet with the adhesive sheet temporarily attached to one surface of the strip-shaped release sheet;
Adhesive sheet detection means for detecting the position of the adhesive sheet on the raw fabric fed out by the feeding means;
an adherend supporting means for supporting an adherend to which the adhesive sheet is attached;
a pressing means for pressing and attaching the adhesive sheet to the adherend;
a peeling means for peeling the release sheet from the adhesive sheet by moving along the other surface of the release sheet temporarily attached to the adhesive sheet attached to the adherend;
The adhesive sheet detecting means detects the position of the adhesive sheet on the original fabric held by attracting and holding the original fabric to the holding surface of the original fabric holding means and the holding surface of the original fabric holding means. Equipped with an adhesive sheet detection device that detects
The sheet sticking apparatus, wherein the adherend support means arranges the adherend opposite to the position of the adhesive sheet detected by the adhesive sheet detector. The adherend support means includes an adherend support table for supporting the adherend, and an adherend detection device for detecting the position of the adherend supported by the adherend support table. 1. The adherend is arranged to face the position of the adhesive sheet detected by the adhesive sheet detector based on the position of the adherend detected by the adherend detector. The sheet sticking device according to 1. A feed-out step of feeding out the original sheet with the adhesive sheet temporarily attached to one surface of the strip-shaped release sheet;
an adhesive sheet detection step of detecting the position of the adhesive sheet on the raw fabric fed out in the feeding step;
an adherend supporting step of supporting an adherend to which the adhesive sheet is attached;
a pressing step of pressing and attaching the adhesive sheet to the adherend;
a peeling step of peeling the release sheet from the adhesive sheet using a peeling means that moves along the other surface of the release sheet temporarily attached to the adhesive sheet attached to the adherend;
In the adhesive sheet detection step, an original fabric holding step of attracting and holding the original fabric to a holding surface of the original fabric holding means, and in the original fabric holding step, attracting and holding the original fabric to the holding surface of the original fabric holding means . performing position detection for detecting the position of the adhesive sheet on the original fabric with an adhesive sheet detection device;
In the adherend support step, the adherend is arranged to face the adherend according to the position of the adhesive sheet detected by the adhesive sheet detector.

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