JP3377847B2 - Adhesive film sticking device to substrate - Google Patents

Adhesive film sticking device to substrate

Info

Publication number
JP3377847B2
JP3377847B2 JP35046993A JP35046993A JP3377847B2 JP 3377847 B2 JP3377847 B2 JP 3377847B2 JP 35046993 A JP35046993 A JP 35046993A JP 35046993 A JP35046993 A JP 35046993A JP 3377847 B2 JP3377847 B2 JP 3377847B2
Authority
JP
Japan
Prior art keywords
adhesive film
tape
substrate
film
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP35046993A
Other languages
Japanese (ja)
Other versions
JPH07195527A (en
Inventor
三郎 宮本
孝夫 松下
稔 雨谷
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to JP35046993A priority Critical patent/JP3377847B2/en
Publication of JPH07195527A publication Critical patent/JPH07195527A/en
Application granted granted Critical
Publication of JP3377847B2 publication Critical patent/JP3377847B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for surface treatment of various substrates such as a semiconductor substrate and a glass substrate for a liquid crystal display device. The present invention relates to an apparatus for attaching an adhesive film to a substrate surface. 2. Description of the Related Art As a means for sticking an adhesive film to the above-mentioned substrate, for example, a means disclosed in Japanese Patent Publication No. 64-4904 is known. This known means guides and transports a film supply tape, in which a fixed-shaped adhesive film is adhered to a continuous band-shaped base tape at predetermined intervals in a longitudinal direction thereof, along a fixed traveling path, and feeds the film in a tape supply path. The adhesive film is peeled and projected from the folded end of the base tape by guiding the tape back through the knife-edge-shaped guide member, and the film supply tape and the substrate are transferred in synchronization with each other, and the tape is continuously peeled from the folded end of the tape. The adhesive film is continuously attached to the surface of the substrate, and the tip of the peeled adhesive film and the tip of the substrate are mechanically positioned using a stopper. In the above conventional means, the film feeding is stopped by detecting the leading end or the trailing end of the adhesive film by a detecting mechanism, and the leading end of the adhesive film and the leading end of the substrate are separated. It is difficult to position a thin and flexible adhesive film with high accuracy because it is mechanically positioned using a stopper.Also, even if sufficient positioning accuracy can be secured, adhesion in the adhesive film transfer direction The positioning of the film and the substrate is only performed, and the positional accuracy in the direction orthogonal to the adhesive film transport direction is insufficient.Especially, when targeting a substrate with an orientation flat on the periphery, The angle accuracy of the substrate is also insufficient, and there is room for improvement here. [0004] The present invention has been made in view of such circumstances, and is directed to a substrate on which a pressure-sensitive adhesive film having a shape corresponding to the shape of the substrate can be stuck on the surface of the substrate with high positioning accuracy. An object of the present invention is to provide an adhesive film sticking device. [0005] In order to achieve the above object, the present invention has the following arrangement. That is, the present invention provides a tape transporting means for transporting a film supply tape in which an adhesive film of a fixed shape is adhered to a base tape at a predetermined interval in a longitudinal direction thereof, and the adhesive film is folded back by guiding the film supply tape. Means for peeling off from the base tape at the end, substrate transporting means for transporting the substrate to a predetermined sticking position, and an adhesive film that is continuously peeled off from the tape turning end by transporting the substrate and the film supply tape in synchronization. In an adhesive film sticking apparatus for a substrate having a means for continuously sticking to the substrate surface, an adhesive which stops the transfer of the film supply tape by detecting that the leading adhesive film has reached a certain position. A film detection mechanism, imaging means for photographing the stopped adhesive film, and image processing of the adhesive film by image processing. Displacement in the tape transport direction, displacement in the direction perpendicular to the tape transport direction, and displacement detection means for calculating and measuring the angle displacement of the adhesive film in the film plane, and the adhesive film based on the displacement detection result. Correction means for correcting a relative position and a relative angle with respect to the substrate to which this is attached. According to the above construction, the adhesive film advances while peeling off from the base tape by folding back the film supply tape with the knife edge of the guide member, and detects that the adhesive film has reached a predetermined position. When the tape running is stopped, the adhesive film is imaged here,
Image processing detects deviations of the adhesive film from the reference position in two orthogonal directions and angles. Thereafter, the relative position and the relative angle between the adhesive film and the substrate to which the adhesive film is adhered are corrected based on the deviation detection result, and the transfer of the film supply tape is resumed, and the peeling of the adhesive film is performed. The substrate is transferred in synchronization with the progress of the film, and the adhesive film is continuously adhered to the surface of the substrate. An embodiment in which the present invention is applied to an apparatus for attaching an adhesive film for protecting a surface to a semiconductor substrate will be described below with reference to the drawings. FIG. 1 is a front view of an adhesive film sticking apparatus according to the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a side view thereof. A cassette table 2 on which a cassette containing a plurality of semiconductor substrates (hereinafter abbreviated as "substrates") W is placed and loaded is placed on a processing table 1 of the adhesive film sticking apparatus. A cylinder 3, a handling robot 4 capable of reciprocating and turning the substrate W one by one for unloading substrates W from a cassette, and aligning the substrate W supplied by the handling robot 4 and the orientation of an orientation flat OF formed on the substrate W , A bonding table 6 for receiving and placing the substrate W whose alignment and orientation has been corrected by the aligner 5, a cassette table 7 for a cassette for collecting a poorly bonded substrate W found after the bonding process, and An air cylinder 8 for turning operation and the like are provided. On the front surface of a vertical frame 9 erected on the back of the processing table 1, a material roll 1 for supplying an adhesive film is provided.
0, a tape guide mechanism 1 for moving the film supply tape T fed out along a predetermined tape running path
1, an adhesive film sticking section 12, a winding roll 13 for collecting a film supply tape after the adhesive film is supplied, and the like. FIGS. 4 to 6 show the pasting table 6 and its driving structure. That is, on the processing table 1, the Y direction (the left-right direction in the figure) via the rail 20
Is provided with a first movable frame 21 which is horizontally movable, and a second movable frame 23 which is horizontally movable in an X direction (a direction orthogonal to the Y direction) via a guide shaft 22 is further provided thereon. The second movable frame 23 is equipped with a third movable frame 25 that can be moved up and down in parallel via a guide rail 24, and the attaching table 6 is horizontally fixed to the third movable frame 25 via support legs 26. Have been. The first movable frame 21 is moved forward and backward in the Y direction by a screw shaft 27 linked to the motor My by a belt, and the second movable frame 23 is moved by a screw shaft 28 driven by a motor Mx. The third movable frame 25 is moved up and down by an air cylinder 29. These motors My, M
By operating x and the air cylinder 29, the sticking table 6 can be translated in the Y direction, the X direction, and the vertical direction. In the center of the attaching table 6, a vacuum suction unit 30 for receiving the substrate W carried and adsorbed by the arm 4a of the handling robot 4 can protrude from the upper surface of the table by an air cylinder 31, and is driven by a motor Mz. It is provided so as to be rotatable around the vertical axis Z. As shown in FIG. 9, the film supply tape T is obtained by sticking an adhesive film Tf colored at a predetermined interval in a longitudinal direction to a base tape Tb made of a continuous strip-shaped transparent film. Adhesive film T
f is formed to have an outer dimension slightly smaller than the outer dimension of the substrate W, and is attached such that the flat portion of the substrate W corresponding to the orientation flat OF is directed forward in the tape transport direction. The film supply tape T is first guided by the brake roller 32 of the tape guide mechanism 11, and then guided by the adhesive film adhering portion 12, and is guided by the guide member 33 (FIG. 7).
At the leading end of the tape guide mechanism 11 again.
The tape traveling path is set so as to be wound around the nip roller 34 and reach the winding roll 13. As shown in FIGS. 7 and 8, the guide member 33 is formed of a plate material fixedly mounted between a pair of front and rear swing frames 35 which can vertically swing about a fulcrum P. The entire width of the leading end is formed in a knife-edge shape, and by folding back the film supply tape T at the leading end 33a of the guide member 33, the adhesive film Tf on the base tape Tb is peeled off and advanced forward from the knife edge leading end 33a. It has become. The swing frame 35 is configured to be vertically swingable by an air cylinder 36, and a sticking roller 37 that acts on the adhesive film Tf that has peeled and advanced is provided at the tip of the swing frame 35. ing. The swing frame 35 is provided with a pair of tape guides 38 for guiding the film supply tape T from both sides, and is provided with an adhesive film detecting mechanism 39 which is deviated laterally from the center of the tape running width. ing. The adhesive film detecting mechanism 39 includes a support frame 40 mounted on the swing frame 35, a support shaft 41 extending along the tape running direction, and a plurality of sensor holders 42 mounted on the support shaft 41 so as to be adjustable in position. Are provided with reflection-type optical sensors S 0 , S 1 , S 2 , S 3 , and S 4 at the leading end thereof, and the first optical sensor S 0 is set as an adhesive film presence / absence sensor. And the rear optical sensors S 1 , S 2 , S 3 , S 4 have various sizes (for example, 4,
5, 6, and 8 inches) are set as position sensors that detect the periphery of the substrate W. The mounting position of each sensor S 0 to S 4 were offset from the center of the conveying path, the substrate at both ends orientation flat OF is formed of the substrate W, joining the adhesive tape having a shape corresponding thereto If there is, avoiding the flat portions of the adhesive tape, by detecting the arcuate portion, it is because it is possible to position the adhesive tape having various shapes at a common optical sensor S 0 to S 4. As shown in FIG. 1, two CCD cameras 43 and 44 are provided on the front surface of the vertical frame 9 so as to face the adhesive film sticking portion 12 from above. As shown in FIG. 11, the CCD camera 43 monitors an area Va including the front side edge of the leading adhesive film Tf, and the CCD camera 44 monitors an area Vb including the flat part of the next adhesive film Tf. Are positioned so that The pressure-sensitive adhesive film sticking apparatus of this embodiment is constructed as described above. The film sticking operation will be described below with reference to the flowcharts of FIGS. 10 and 14. Here, a case in which a 5-inch substrate W is used as an example will be described. [Film supply operation] FIGS. 10 (a) and 10 (b)
As shown in (2), the film supply tape T is transported along a predetermined traveling path by the operation of the nip roller 34, and the leading adhesive film Tf is peeled off from the orientation flat OF portion thereof and protrudes from the tip knife edge portion of the guide member 33. (Step # 1). [0021] the top of the adhesive film Tf reaches the set position, the optical sensor S 0 detects the presence of the adhesive film Tf, the optical sensor S 2 corresponding to the 5-inch substrate is a rear edge of the adhesive film Tf detected Then (Step # 2)
), The nip roller 34 is stopped, and the transfer of the film supply tape T is stopped (step # 3). When the transfer of the film supply tape T is stopped, the position shift is detected by monitoring the side edge of the leading adhesive film Tf by the CCD camera 43, and the CCD camera 4
In step # 4, the angle deviation is detected by monitoring the flat portion of the subsequent adhesive film Tf. The detection of displacement of the leading adhesive film Tf in the X direction by the CCD camera 43 is performed as follows.
As shown in FIG. 11, a CCD camera 43 is provided on the tape guide surface of the guide member 33 for guiding the film supply tape T.
A reference line L along the tape running direction is formed in advance within the monitoring area Va. Although a plurality of types of reference lines L are formed at different positions according to the substrate size,
FIG. 11 shows only one reference line L. In the image of the monitoring area Va captured by the CCD camera 43, the scanning line Vs is moved in the X direction in FIG. 12A, and the distance Xa from the reference line L to the side edge of the adhesive film Tf is represented by a dot (pixel). ) Measure as a number. In this case, in FIG. 11, since the reference distance XL from the center O of the tape running path to the reference line L and the radius R of the adhesive film Tf are known, the shift amount ΔX of the adhesive film Tf in the X direction is: It is obtained by the following equation. ΔX = (XL−R) −Xa The displacement of the adhesive film Tf in the Y direction is detected as follows. That is, in FIG.
When there is no deviation in the direction, the distance in the X direction from the center C of the adhesive film to the optical sensor S2 is X 0 , and the distance in the Y direction is Y 0 , Y
Assuming that the amount of displacement in the direction is ΔY, the relationship of Y 0 + ΔY = {R 2 − (X 0 + ΔX) 2 } holds, and the amount of displacement ΔY in the Y direction can be obtained from the above equation. The detection of the angle deviation Δθ of the subsequent adhesive film Tf by the CCD camera 44 is performed as follows. That is, as shown in FIG. 12 (b), in captured image area Vb by the CCD camera 44, the Y direction distance Y 1 and Y 2 at a position spaced a predetermined distance X 12 as the number of pixels by image processing When measured, the following equation holds: tan Δθ = (Y 2 −Y 1) / X 12 Therefore, the angle deviation amount Δθ of the subsequent adhesive film Tf is calculated as Δθ = Arc tan {(Y 2 −Y 1) / X 12}. Can be. In this embodiment, as shown in FIG. 11, the detection of the angle deviation amount Δθ of the adhesive film Tf is performed by the next adhesive film Tf subsequent to the adhesive film Tf to be attached. It is intended for. The reason is as follows. The angle shift amount is obtained by detecting the inclination of the flat portion of the adhesive tape Tf. Since the roller 37 is located above the flat portion of the adhesive tape Tf to be subjected to the sticking process, the angle shift amount is flat. This is because it is difficult to photograph the part. Also, by measuring the angle shift amount of the subsequent adhesive film Tf in advance,
This is because the angle shift amount of the next substrate W to be bonded to the adhesive film Tf can be corrected in advance by the aligner 5, so that the time required for the bonding process can be shortened accordingly. [Substrate Supply Operation] The substrate W of the cassette loaded in the cassette table 2 is taken out by the handling arm 4 a of the handling robot 4 and is aligned with the aligner 5.
(Steps # 11 and # 12). In the aligner 5, the loaded substrate W
Alignment and orientation correction are performed (step #
13). In this case, the direction correction is performed based on the previously detected angle shift amount Δθ. The substrate W whose alignment has been completed is transferred onto the bonding table 6 again via the handling robot 4 (step # 14). Based on the data of the X direction shift amount ΔX and the Y direction shift amount ΔY of the leading adhesive film Tf to be attached to the substrate W transferred on the table 6, the table 6
The position is corrected in the direction and the Y direction (Step # 15), and the position is raised to a position immediately below the adhesive film sticking section 12 (Step # 16). After the above processing is completed, the swing frame 35 of the adhesive film sticking section 12 is moved down, and as shown in FIG.
The tip end of the adhesive film Tf protruding from a is pressed and adhered to the surface of the substrate W via the attaching roller 37 (step # 17). Then, the transfer of the film supply tape T is resumed by the operation of the nip roller 34 and the adhesive is applied. The peeling advance of the film Tf is continuously performed, and the table 6 is moved in the Y direction in synchronization with the tape transfer speed, and as shown in FIG.
Are continuously pressed and adhered to the surface of the substrate W (step # 18). When the adhesion of the adhesive film Tf is completed, as shown in FIG. 13, four places Vc to Vf on the periphery of the substrate W are monitored by a CCD camera (not shown), and the outer peripheral edge of the substrate W and the adhesive film Tf are monitored. By detecting the distance d with respect to the outer peripheral edge, it is determined whether or not the adhesive film Tf is adhered within an allowable error. In this case, the monitoring position of the CCD camera is one, and the substrate W is rotated by rotating the vacuum suction unit 30 of the attaching table 6 at a pitch of 90 °. The non-defective product is returned to the original cassette of the supply cassette table 2 via the handling robot 4, and the defective product is stored in the cassette of the collection cassette table 7. In this embodiment, the amount of the angle shift of the adhesive tape Tf is determined by the adhesive tape Tf to be subjected to the sticking process.
Although the following succeeding adhesive tape Tf has been detected as a target, the adhering roller 37 is configured to be retractable, and so on.
The angle shift amount of the adhesive tape Tf to be attached may be detected. Further, the angle deviation of the substrate W may be corrected by raising and rotating and displacing the vacuum suction part 30 of the bonding table 6. The correction can also be made by rotating and displacing the suction table 6. As is apparent from the above description, according to the present invention, an image of an adhesive film which has been transported to a predetermined position and stopped is taken, and the image is analyzed to determine the positions in two orthogonal directions. Since the shift and the direction shift are calculated and detected, the position shift and the direction shift can be accurately detected in a non-contact state where no mechanical force acts on the adhesive film, and the correction for each element is accurately performed, and the Adhesive film can be attached to a substrate under alignment.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall front view of an adhesive film sticking apparatus according to the present invention. FIG. 2 is a plan view of a main part of the pressure-sensitive adhesive film sticking apparatus. FIG. 3 is an overall side view of the adhesive film sticking apparatus. FIG. 4 is a plan view of the attaching table. FIG. 5 is a partially cutaway front view showing the attaching table driving structure. FIG. 6 is a side view showing a pasting table driving structure. FIG. 7 is a longitudinal sectional front view of an adhesive film sticking portion. FIG. 8 is a plan view of an adhesive film sticking portion. FIG. 9 is a perspective view of an adhesive film sticking section. FIG. 10 is an explanatory diagram showing an adhesive film sticking operation. FIG. 11 is a plan view of the adhesive film sticking portion in a tape transfer stopped state. FIG. 12 is an explanatory diagram showing a camera monitoring area. FIG. 13 is an explanatory diagram showing an inspection operation. FIG. 14 is a flowchart showing an operation. [Description of Signs] 33 Guide member 39 Adhesive film detection mechanism T Film supply tape Tb Base tape Tf Adhesive film

──────────────────────────────────────────────────続 き Continuation of front page (51) Int.Cl. 7 Identification symbol FI // B29L 31:34 H01L 21/78 M (56) References JP-A-2-69924 (JP, A) JP-A-2- 138670 (JP, A) JP-A-4-368743 (JP, A) JP-B 64-4904 (JP, B2) (58) Fields investigated (Int. Cl. 7 , DB name) B29C 63/00-65 / 82 B65C 1/00-11/06 H05K 3/02-3/08

Claims (1)

  1. (57) [Claims] (1) Tape transport means for transporting a film supply tape in which an adhesive film having a predetermined shape is adhered to a base tape at predetermined intervals in a longitudinal direction thereof, and a film supply tape is folded back and guided. Means for peeling off the adhesive film from the base tape at the tape folding end, substrate transport means for transporting the substrate to a predetermined attaching position, and continuous transport from the tape folding end by transporting the substrate and the film supply tape in synchronization. A device for continuously adhering the adhesive film to be peeled off to the substrate surface, which detects that the leading adhesive film has reached a certain position. An adhesive film detection mechanism for stopping the transfer of the supply tape, an imaging unit for photographing the stopped adhesive film, and image processing. A shift in the tape transfer direction of the adhesive film, a shift in a direction perpendicular to the tape transfer direction, and a shift detecting means for calculating and measuring an angle shift of the adhesive film in the film plane, and an adhesive based on the shift detection result. A device for adhering an adhesive film to a substrate, comprising: a correcting means for correcting a relative position and a relative angle between the film and the substrate to which the film is adhered.
JP35046993A 1993-12-29 1993-12-29 Adhesive film sticking device to substrate Expired - Lifetime JP3377847B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35046993A JP3377847B2 (en) 1993-12-29 1993-12-29 Adhesive film sticking device to substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35046993A JP3377847B2 (en) 1993-12-29 1993-12-29 Adhesive film sticking device to substrate

Publications (2)

Publication Number Publication Date
JPH07195527A JPH07195527A (en) 1995-08-01
JP3377847B2 true JP3377847B2 (en) 2003-02-17

Family

ID=18410707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35046993A Expired - Lifetime JP3377847B2 (en) 1993-12-29 1993-12-29 Adhesive film sticking device to substrate

Country Status (1)

Country Link
JP (1) JP3377847B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191048A (en) * 2011-03-11 2012-10-04 Nitto Denko Corp Dicing film with protection film
EP2891592A4 (en) * 2012-08-29 2016-01-20 Nitto Denko Corp Protective adhesive sheet sticking device
KR101827492B1 (en) * 2014-09-29 2018-02-08 주식회사 엘지화학 Apparatus for drying optical film

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4795743B2 (en) * 2005-05-19 2011-10-19 リンテック株式会社 Pasting device
CN100547752C (en) * 2005-05-19 2009-10-07 琳得科株式会社 Adhering apparatus
JP2006339608A (en) * 2005-06-06 2006-12-14 Lintec Corp Sticking controller
JP4468884B2 (en) * 2005-12-09 2010-05-26 リンテック株式会社 Tape sticking device, mounting device, and mounting method
JP5113273B2 (en) * 2006-03-03 2013-01-09 株式会社 ベアック Reinforcing plate pasting device, reinforcing plate die cutting die, reinforcing plate generating cutting device, flexible substrate, and electronic device
JP4719790B2 (en) * 2006-03-03 2011-07-06 株式会社 ベアック Reinforcing plate pasting device
WO2007099645A1 (en) * 2006-03-03 2007-09-07 Beac Co., Ltd. Device for sticking reinforcement board, die for punching reinforcement board and flexible board
JP4637057B2 (en) * 2006-05-25 2011-02-23 リンテック株式会社 Sheet sticking device and sticking method
JP4988453B2 (en) * 2007-06-28 2012-08-01 リンテック株式会社 Sheet sticking device and sticking method
JP4801016B2 (en) * 2007-07-19 2011-10-26 リンテック株式会社 Sheet sticking device and sticking method
JP5112268B2 (en) * 2007-12-06 2013-01-09 日東電工株式会社 Manufacturing method of image display device
WO2009072470A1 (en) * 2007-12-06 2009-06-11 Nitto Denko Corporation Method for manufacturing image display device
JP5015824B2 (en) * 2008-02-29 2012-08-29 日東精機株式会社 Adhesive film position detector and adhesive film sticking device
JP2012049388A (en) * 2010-08-27 2012-03-08 Shin Etsu Chem Co Ltd Sheet for forming semiconductor wafer protective film
JP2012084688A (en) 2010-10-12 2012-04-26 Nitto Denko Corp Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape
JP5702983B2 (en) * 2010-10-12 2015-04-15 日東電工株式会社 Double-sided adhesive tape application method and double-sided adhesive tape application device
JP5368608B2 (en) * 2012-07-03 2013-12-18 日東電工株式会社 Dicing film with protective film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012191048A (en) * 2011-03-11 2012-10-04 Nitto Denko Corp Dicing film with protection film
EP2891592A4 (en) * 2012-08-29 2016-01-20 Nitto Denko Corp Protective adhesive sheet sticking device
KR101827492B1 (en) * 2014-09-29 2018-02-08 주식회사 엘지화학 Apparatus for drying optical film

Also Published As

Publication number Publication date
JPH07195527A (en) 1995-08-01

Similar Documents

Publication Publication Date Title
US5894657A (en) Mounting apparatus for electronic component
US7789988B2 (en) Method for separating protective tape, and apparatus using the same
KR100822328B1 (en) Apparatus for conveying a board and method thereof
US7849900B2 (en) Apparatus for joining a separating adhesive tape
US6770899B2 (en) Work piece feeding machine
JP4885483B2 (en) Transfer device and method, peeling device and method, sticking device and method
JP4780559B2 (en) Film sticking method and apparatus
US7849899B2 (en) Adhesive film position detector and adhesive film joining apparatus
TWI363429B (en) Device and method for joining substrates
JP4503691B1 (en) Method and apparatus for continuous production of liquid layer display element
JP4342829B2 (en) Optical film sticking device, method and substrate
JP2004361741A (en) Optical film pasting device and method
KR20060050253A (en) Label sticking device and label sticking method
US8132608B2 (en) Die bonding apparatus
TWI609767B (en) Manufacturing system of optical display device, and manufacturing method of optical display device
KR20030086619A (en) Device and method for feeding taped electrical components
JPWO2011155036A1 (en) Method for aligning film sheet and rectangular panel in display panel manufacturing apparatus
JP3705202B2 (en) Printing method and printing apparatus for continuous sheet
JP4503692B1 (en) Information storage / read operation system and method for manufacturing information storage / read operation system used in apparatus for continuously manufacturing liquid crystal display elements
JP5434884B2 (en) Electronic component mounting apparatus and electronic component mounting method
US20050199337A1 (en) Single sheet joining method and apparatus using the same
EP1293836B1 (en) Device for exposure of a strip-shaped workpiece with a meander correction device
JP4530891B2 (en) Method for positioning semiconductor wafer with support plate, method for manufacturing semiconductor wafer using the same, and positioning device for semiconductor wafer with support plate
US7519448B2 (en) Method for determining position of semiconductor wafer, and apparatus using the same
TWI375843B (en)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081206

Year of fee payment: 6

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111206

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141206

Year of fee payment: 12

EXPY Cancellation because of completion of term