JP2022186182A - Manufacturing method for semiconductor chip and manufacturing apparatus for semiconductor chip - Google Patents

Abstract

To provide a manufacturing method for a semiconductor chip and a manufacturing apparatus for a semiconductor chip, in which an unnecessary piece is preferably not left on a second adhesive sheet.SOLUTION: A manufacturing apparatus EA for a semiconductor chip includes division schedule line forming means 10, first attaching means 20 that performs a step of attaching a first adhesive sheet AS1, dividing means 40 that forms a semiconductor chip CP sectioned along a division line SL and forms an unnecessary piece UF outside a chip collection region WF3, second attaching means 30 that attaches a second adhesive sheet AS2 on the other surface WF2 side of a semiconductor wafer WF, and first adhesive sheet separating means 90 that separates the first adhesive sheet AS1. In the second attaching step, the second adhesive sheet AS2 is attached to the other surface WF2 side of the semiconductor wafer WF so that the chip collection region WF3 is covered entirely and so as not to be in contact with an outer edge of the semiconductor wafer WF. In the first adhesive sheet separating step, the unnecessary piece UF is removed together with the first adhesive sheet AS1.SELECTED DRAWING: Figure 1

Description

The present invention relates to a semiconductor chip manufacturing method and a semiconductor chip manufacturing apparatus.

A semiconductor chip manufacturing method is known in which a second adhesive sheet is attached to a semiconductor chip attached to a first adhesive sheet, and the first adhesive sheet is peeled off (see, for example, Patent Document 1).

JP-A-2008-78430

However, in the electronic component manufacturing method (semiconductor chip manufacturing method) described in Patent Document 1, the wafer 1 (wafer) attached to the wafer fixing tape 5 (second adhesive sheet) to the film 3 (first adhesive Since the wafer portion (unnecessary piece) other than the electronic component 8 (semiconductor chip) remains on the second adhesive sheet after the sheet) is peeled off, the unnecessary piece is removed from the second adhesive sheet in the process of picking up the semiconductor chips in the die bonding process. 2. There is a possibility that the unwanted pieces may come off from the adhesive sheet and pile up on the semiconductor chip, or the presence of the unnecessary pieces may hinder the pick-up operation of the semiconductor chip.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor chip manufacturing method and a semiconductor chip manufacturing apparatus capable of minimizing unnecessary pieces from being left on the second adhesive sheet.

The present invention employs the configurations described in the claims.

According to the present invention, since the unnecessary pieces are removed together with the peeling of the first adhesive sheet, it is possible to avoid leaving unnecessary pieces on the second adhesive sheet as much as possible.

FIG. 2 is an explanatory diagram of a semiconductor chip manufacturing apparatus for carrying out the semiconductor chip manufacturing method of the present invention, and an explanatory diagram of the operation of the same apparatus;

An embodiment of the present invention will be described below with reference to the drawings.
Note that the X-axis, Y-axis, and Z-axis in this embodiment are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. do. Furthermore, in the present embodiment, when viewed from the front in FIG. 1 parallel to the Y-axis, when the direction is indicated without designating the drawing, "up" is the direction of the arrow of the Z-axis and "down". is the opposite direction, "left" is the arrow direction of the X axis, "right" is the opposite direction, "front" is the direction parallel to the Y axis in FIG. 1, and "rear" is the opposite direction.

The semiconductor chip manufacturing apparatus EA of the present invention performs a planned dividing line forming step of forming, within a semiconductor wafer (hereinafter also simply referred to as a "wafer") WF, a planned dividing line PL composed of mutually intersecting modified portions. A division line forming means 10 to be implemented, and a first sticking means 20 to carry out a first sticking step of sticking a first adhesive sheet AS1 to one surface WF1 of the wafer WF so as to cover the entire outer edge of the wafer WF. and a wafer reversing means 30 for performing a wafer reversing step of reversing the wafer WF and the like, and applying an external force to the wafer WF to form a dividing line SL using the planned dividing line PL as a starting point, thereby forming a predetermined chip on the wafer WF. Semiconductor chips (hereinafter also simply referred to as “chips”) CP separated by division lines SL are formed inside a sampling region WF3 (region surrounded by a thick solid line in FIG. 1B), and the chip sampling region WF3 is formed. a dividing means 40 for performing a dividing step of forming unnecessary pieces UF on the outside of the wafer WF; a second attaching means 50 for performing a second attaching step of attaching a second adhesive sheet AS2 to the other surface WF2 of the wafer WF; A frame arranging means 60 for carrying out a frame arranging step of arranging a ring frame RF as a frame member outside the wafer WF, and a frame larger than the outer edge shape of the wafer WF on the second adhesive sheet AS2 adhered to the wafer WF. A third sticking means 70 for performing a third sticking step of sticking a third adhesive sheet AS3 having an outer edge shape, an integrated product reversing means 80 for performing a combined product reversing step of vertically reversing the integrated product UP, and a wafer WF. and a first adhesive sheet peeling means 90 for performing a first adhesive sheet peeling process for removing unnecessary pieces UF together with the first adhesive sheet AS1 from the wafer transfer means TM for performing a wafer transfer process for transferring the wafer WF. are placed in

The planned dividing line forming means 10 is composed of a plurality of arms, and is a so-called driving device capable of displacing an object supported by the tip arm 11A, which is a working part, to any position and any angle within its working range. A multi-joint robot 11, a laser bracket 12 having a laser holding part 12A in which a tip arm 11A of the multi-joint robot 11 is fitted and held by the multi-joint robot 11, and a wafer WF supported by the laser bracket 12 and a laser irradiator 13 that irradiates a laser LS to form a division line PL.

The first sticking means 20 includes support rollers 21 for supporting the first raw fabric RS1, in which the band-shaped first adhesive sheet base BS1 is temporarily attached to the first release sheet RL1, and a closed-loop adhesive roller 21 that supports the first adhesive sheet base BS1. , a cutting means 22 for forming the first adhesive sheet AS1 and the first unnecessary sheet US1 inside and outside the first cut CU1, and guide rollers for guiding the first material RS1 23, a peeling plate 24 as peeling means for folding back the first peeling sheet RL1 at the peeling edge 24A and peeling the first adhesive sheet AS1 from the first peeling sheet RL1, and pressing the first adhesive sheet AS1 against the adhered object. and a driving roller 26 supported by an output shaft (not shown) of a rotating motor 26A as a driving device and sandwiching the first release sheet RL1 and the unnecessary sheet US1 with a pinch roller 26B. , is supported by the output shaft of a driving device (not shown), and the first release sheet RL1 and the unnecessary sheet US1 between the pinch roller 26B and the pinch roller 26B are always in a predetermined state during automatic operation of the semiconductor chip manufacturing apparatus EA. A recovery roller 27 is provided as recovery means for applying tension to recover the first release sheet RL1 and the unnecessary sheet US1.
The cutting means 22 includes a die-cut roller 22C supported by an output shaft 22B of a rotating motor 22A as a drive device, and a flat loop-shaped cutting blade 22D as a cutting member supported on the outer peripheral surface, and the die-cut roller 22C and the synchronous rotation. and an anvil roller 22E.

The wafer reversing means 30 includes a rotary motor 32 as a drive device supported by a slider 31A of a linear motor 31 as a drive device, and a pair of chuck arms 33A supported by an output shaft 32A of the rotary motor 32 and holding an object to be held. and a chuck motor 33 as a driving device (holding means).

The dividing means 40 includes an XY table 41 as a driving device, a linear motion motor 42 as a driving device supported by an output stand 41A of the XY table 41, and a driving device supported by an output shaft 42A of the linear motion motor 42. and a grinding member 44 such as a whetstone or an end mill supported by the output shaft 43A of the rotary motor 43 via a support plate 44A. By grinding the wafer WF from the side, the wafer WF is ground to a predetermined thickness, and the division lines SL are formed by using the division lines PL as an external force due to the vibration during the grinding of the wafer WF.

The second attaching means 50 is configured to attach the second adhesive sheet AS2 to the other surface WF2 of the wafer WF so as to cover the entire chip picking area WF3 and not contact the outer edge of the wafer WF. The second sticking means 50 has the same configuration as the first sticking means 20. In the description of the structure of the first sticking means 20, the tens place number 2 is changed to 5, and AS1, BS1, and CU1 are assigned. , RL1, RS1 and US1 are respectively changed to AS2, BS2, CU2, RL2, RS2 and US2, and the "first" in each configuration can be read as "second." A description of the configuration is omitted.

The frame arrangement means 60 is supported by a linear motor 62 as a driving device supported by a slider 61A of a linear motor 61 as a driving device and by an output shaft 62A of the linear motor 62 via a suction arm 63A. A suction pad 63 that can be held by suction means (holding means) such as a vacuum ejector (not shown) and a ring frame stocker 64 that stores the ring frame RF are provided.

The third sticking means 70 has the same configuration as the first sticking means 20, except that the tens place number 2 in the description of the structure of the first sticking means 20 is changed to 7, and AS1, BS1, CU1, and RL1 are used. , RS1 and US1 are changed to AS3, BS3, CU3, RL3, RS3 and US3, respectively, and "first" in each configuration can be read as "third." are omitted. At that time, the third sticking means 70 sticks the third adhesive sheet AS3 to the wafer WF and the ring frame RF to form the integral UP.

The one-piece reversing means 80 has the same structure as the wafer reversing means 30, and can be explained by changing the tens digit 3 to 8 in the explanation of the structure of the wafer reversing means 30. A detailed configuration description is omitted.

The first adhesive sheet peeling means 90 includes a support roller 91 that supports the strip-shaped peeling tape PT as a holding means, a guide roller 92 that guides the peeling tape PT, and an output shaft of a linear motion motor 93 as a driving device. A peeling roller 94 rotatably supported by 93A, a drive roller 95 supported by an output shaft (not shown) of a rotation motor 95A as a drive device, pinching the peeling tape PT between pinch rollers 95B, and a drive device (not shown). to constantly apply a predetermined tension to the peeling tape PT present between the pinch roller 95B and collect the peeling tape PT while the semiconductor chip manufacturing apparatus EA is automatically operated. A recovery roller 96 is provided as a recovery means, and constitutes unnecessary piece removing means for removing the unnecessary piece UF from the wafer WF together with the first adhesive sheet AS1.

The wafer transfer means TM is supported by a linear motor TM1 as a driving device having a slider TM1A that moves in the X-axis direction, and by the slider TM1A. and a support table TM2 with TM2A. A notch portion TM2B is formed in the support table TM2.

The operation of the above-described semiconductor chip manufacturing apparatus EA will be described.
First, the user of the semiconductor chip manufacturing apparatus EA (hereinafter simply referred to as the "user") is directed to the semiconductor chip manufacturing apparatus EA in which each member is arranged at the initial position indicated by the solid line in FIG. 1(A). After setting the first, second, and third raw sheets RS1, RS2, and RS3 as shown in the figure, a signal for starting automatic operation is input via an operation means (not shown) such as an operation panel or a personal computer. Then, the first, second and third pasting means 20, 50 and 70 drive the rotary motors 22A, 26A, 52A and 56A and 72A and 76A to rotate the die-cut rollers 22C, 52C and 72C to form the first and third sticking means 20, 50 and 70. While forming the first, second and third cuts CU1, CU2 and CU3 in the second and third sheet base materials BS1, BS2 and BS3, the first, second and third raw fabrics RS1, RS2 and RS3 are formed. feed out. The leading end portions of the first, second and third adhesive sheets AS1, AS2 and AS3 formed by the first, second and third cuts CU1, CU2 and CU3 are aligned with the release plates 24, 54 and 74. When a predetermined length is peeled at the peeling edges 24A, 54A, 74A, the first, second, and third pasting means 20, 50, 70 drive the rotary motors 22A, 26A, 52A, 56A and 72A, 76A. Stop. Next, when a user or a transfer means (not shown) such as an articulated robot or a belt conveyor places the wafer WF on the support table TM2 as shown in FIG. to start holding the wafer WF on the holding surface TM2A.

After that, the wafer transfer means TM drives the linear motor TM1 to move the support table TM2 leftward, and when the wafer WF reaches the working range of the division line forming means 10, the driving of the linear motor TM1 is stopped. After stopping, the planned division line forming means 10 drives the articulated robot 11 and the laser irradiator 13 to form the planned division line PL on the wafer WF as shown by the two-dot chain line in FIG. 1(A) and FIG. 1(B). to form Next, when the wafer transfer means TM drives the linear motor TM1 to move the support table TM2 leftward and the wafer WF reaches a predetermined position with respect to the first sticking means 20, the first sticking means 20 rotates. The motors 22A and 26A are driven to let out the first material RS1 in accordance with the moving speed of the support table TM2 to form a new first cut CU1 in the first sheet base material BS1. As indicated by a two-dot chain line, a first adhesive sheet AS1 is attached to one surface WF1 of the wafer WF so as to cover the entire outer edge of the wafer WF. Then, when the feeding direction leading end of the first adhesive sheet AS1 next to the leading first adhesive sheet AS1 is peeled off by the peeling edge 24A of the peeling plate 24 for a predetermined length, the first applying means 20 is rotated by the rotating motor. Stop driving 22A and 26A. After that, the support table TM2 continues to move to the left, and when the notch TM2B reaches the front of the chuck arm 33A, the wafer transfer means TM stops driving the linear motor TM1, and the wafer reversing means 30 starts the chuck motor. 33 is driven, and the wafer WF and the like are held by the chuck arm 33A as indicated by the chain double-dashed line in FIG. 1(C). Next, when the wafer transfer means TM stops driving the depressurizing means (not shown) and releases the suction holding of the wafer WF on the holding surface TM2A, the wafer reversing means 30 drives the linear motor 31 and the rotation motor 32, and (C) As indicated by the middle two-dot chain line, the wafer WF, etc. held by the chuck arm 33A is lifted to a predetermined height, and the wafer WF, etc. is turned upside down. After that, the wafer reversing means 30 drives the linear motor 31 to place the wafer WF and the like on the holding surface TM2A with the first adhesive sheet AS1 facing the holding surface TM2A. is driven to start sucking and holding the wafer WF or the like on the holding surface TM2A, the wafer reversing means 30 drives the chuck motor 33 to return the chuck arm 33A to the initial position.

Next, the wafer transfer means TM drives the linear motor TM1 to move the support table TM2 leftward, and when the wafer WF reaches the working range of the dividing means 40, the drive of the linear motor TM1 is stopped. , the dividing means 40 drives the XY table 41, the linear motion motor 42, and the rotary motor 43, and as shown by the two-dot chain line in FIG. The wafer WF is ground. Note that the vibration during the grinding acts as an external force, and the reformed portion collapses due to this external force, so that the line to be divided PL becomes the dividing line SL, and the wafer WF is formed as shown by the broken line in FIG. 1B. It is divided into chips CP and unnecessary pieces UF by dividing lines SL. When the wafer WF is ground to a predetermined thickness, the dividing means 40 stops driving the XY table 41, the linear motion motor 42, and the rotation motor 43, and then drives the XY table 41 and the linear motion motor 42 to perform grinding. The member 44 is returned to its initial position. Then, when the wafer transfer means TM drives the linear motor TM1 to move the support table TM2 leftward and the wafer WF reaches a predetermined position with respect to the second sticking means 50, the second sticking means 50 moves to the first sticking position. By performing the same operation as the means 20, as shown in FIG. 1A and FIG. A second adhesive sheet AS2 is attached to the other surface WF2 of the wafer WF.

After that, the support table TM2 continues to move leftward by driving the linear motor TM1 of the wafer transfer means TM, and when viewed from the front in the Y-axis direction, the center position of the wafer WF in the left-right direction is positioned on the right and left sides of the suction arm 63A. Upon reaching the central position in the direction, the wafer transfer means TM stops driving the linear motor TM1. Next, the frame placement means 60 drives the linear motor 61A, the direct-acting motor 62, and the decompression means (not shown) to attract and hold the ring frame RF in the ring frame stocker 64 as shown by the two-dot chain line in FIG. 1(D). After placing the ring frame RF on the holding surface TM2A, the wafer transfer means TM drives the depressurizing means (not shown) to start sucking and holding the ring frame RF on the holding surface TM2A. After that, the frame arranging means 60 stops driving the decompressing means (not shown), releases the suction holding of the ring frame RF by the suction pad 63, drives the linear motor 61A and the linear motor 62, and the suction pad 63 is initialized. When returned to the position, the wafer transfer means TM drives the linear motor TM1 to move the support table TM2 leftward. Next, when the support table TM2 reaches a predetermined position with respect to the third sticking means 70, the third sticking means 70 performs the same operation as the first sticking means 20, and the two-dot chain line in FIG. As shown, a third adhesive sheet AS3 is adhered onto the ring frame RF and the second adhesive sheet AS2 to form an integrated body UP.

After that, the support table TM2 continues to move to the left, and when the notch TM2B reaches the front of the chuck arm 83A, the wafer transfer means TM stops driving the linear motor TM1, and then the wafer reversing means 30 and the same movement as the wafer reversing means 30 continue. Perform an action to turn the integrated object UP upside down. Then, the wafer transfer means TM drives the linear motor TM1 to move the support table TM2 leftward, and when the left end portion of the first adhesive sheet AS1 in the integrated object UP reaches directly below the lowermost end portion of the peeling roller 94, the linear Stop driving the motor TM1. Next, when the first adhesive sheet peeling means 90 drives the direct-acting motor 93 to lower the peeling roller 94 and apply the peeling tape PT to the left end portion of the first adhesive sheet AS1, the wafer conveying means TM and the first adhesive The sheet peeling means 90 drives the linear motor TM1 and the rotating motor 95A to feed the peeling tape PT toward the recovery roller 96 in accordance with the moving speed of the support table TM2 to the left. As indicated by the dotted chain line, the first adhesive sheet AS1 is peeled off from the wafer WF. At this time, most of the unnecessary pieces UF located at the outer edge of the wafer WF (unnecessary pieces UF located outside the chip picking area WF3) are adhered to the first adhesive sheet AS1 without adhering to the second adhesive sheet AS2. Therefore, it is removed from the wafer WF together with the first adhesive sheet AS1. In the present embodiment, among the unnecessary pieces UF, the shaded unnecessary pieces UF in FIG. 1B could be removed from the wafer WF together with the first adhesive sheet AS1. After that, when the entire first adhesive sheet AS1 is peeled off from the wafer WF, the first adhesive sheet peeling means 90 drives the direct-acting motor 93 to return the peeling roller 94 to the initial position. Stop driving. Next, when the support table TM2 is pulled out from below the peeling roller 94, the wafer transfer means TM stops driving the linear motor TM1, and then stops driving the decompression means (not shown), thereby removing the integrated object UP on the holding surface TM2A. Release suction hold. Then, when the user or the transfer means (not shown) transfers the integrated object UP to the next process, the wafer transfer means TM drives the linear motor TM1 to return the support table TM2 to the initial position, and the same operation as described above is repeated thereafter. .

According to the embodiment as described above, since the unnecessary pieces UF are removed together with the separation of the first adhesive sheet AS1, it is possible to avoid leaving unnecessary pieces UF on the second adhesive sheet AS2 as much as possible.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for those means and steps. The process is not limited at all. For example, the first attaching step may be any step of attaching the first adhesive sheet to one side of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer, in light of the common general knowledge at the time of filing. There is no limitation as long as it is within the technical scope (other means and steps are the same).

The planned division line forming means 10 may share the multi-joint robot 11 with the frame placement means 60, and the multi-joint robot 11 may hold the suction arm 63A to convey the ring frame RF. By applying vibration, heat, chemicals, chemical substances, etc., the wafer WF is weakened, pulverized, liquefied, or hollowed out by changing the properties, properties, properties, materials, composition, configuration, dimensions, etc. of the wafer WF. The line to be divided PL may be formed, and the line to be divided PL may be any line as long as it becomes the line to become the line SL by applying an external force.
The planned division line forming means 10 may form the planned division lines PL, which are made up of grooves crossing each other, on the one surface WF1 of the wafer WF. In this case, the planned dividing line forming means 10 applies laser light, electromagnetic waves, heat, chemicals, chemical substances, etc., or uses a cutting blade, taking into consideration the characteristics, characteristics, properties, material, composition, configuration, etc., of the wafer WF. , a groove forming means such as a cutting blade, etc., can be used to form the dividing lines PL formed of grooves on one surface WF1 of the wafer WF. Then, the dividing lines PL are exposed on the other surface WF2 side of the wafer WF to form the dividing lines SL, and the chips CP separated by the dividing lines SL are formed inside the predetermined chip picking area WK3 on the wafer WF. is formed, and the unnecessary piece UF is formed outside the chip picking area WK3. When thinning the wafer WF, any device such as a known grinding device, a known cutting device, or a known slicing device may be used.

The first, second and third pasting means 20, 50 and 70 temporarily adhere to the strip-shaped first, second and third release sheets RL1, RL2 and RL3 without employing the cutting means 22, 52 and 72. By forming closed-loop cuts in advance in the strip-shaped first, second, and third adhesive sheet base materials BS1, BS2, and BS3, predetermined regions partitioned by the cuts are divided into first and third adhesive sheet substrates BS1, BS2, and BS3. 2. The first, second, and third original sheets RS1, RS2, and RS3 as the third adhesive sheets AS1, AS2, and AS3 are delivered, and the first, second, and third adhesive sheets AS1, AS2, and AS3 are wafered. Alternatively, when the first, second, and third adhesive sheets AS1, AS2, and AS3 are adhered to the wafer WF, etc., the first, second, and third raw sheets RS1, RS2, and RS3 are fed out. The application tension is controlled by controlling the speed and tension of the first, second, and third adhesive sheets AS1, AS2, and AS3 so that a predetermined tension is applied or not applied. Alternatively, the first, second, and third adhesive sheets AS1, AS2, and AS3 may be separated from the first, second, and third original sheets RS1, RS2, and RS3, which are fanfold-folded without being wound, for example. may be separated and attached to the wafer WF or the like, or the first, second, and third separations may be performed by, for example, fan-folding, chopping with a shredder, or accumulating carelessly without winding. A collection means for collecting the sheets RL1, RL2, RL3, etc. may be employed, or the first, second, third unnecessary sheets US1, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US2, US1, US2, US2, US1, US2, US2, US2, US1, US2, US2, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US1, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US2, US1, US2, US1, US2, US1, US2, US1, US2, US2; An unnecessary sheet collecting means for peeling and collecting the US3 may be provided, or the collecting means may not be employed. The first, second, and third adhesive sheets AS1, AS2, and AS3 may be paid out and attached.
The cutting means 22, 52, 72 may employ, for example, a so-called flat blade as a cutting member that separates and approaches the first, second, and third sheet base materials BS1, BS2, and BS3. Cutting blades 22E, 52E, 72E that are detachable or non-detachable from 52C, 72C may be employed, and strip-like first, second, and third adhesive sheet substrates BS1, BS2, BS3 may have short widths. Incisions may be formed in all directions, and regions partitioned by the incisions may be used as the first, second, and third adhesive sheets AS1, AS2, and AS3. It doesn't have to be.
The first pasting step may be performed before the dividing line forming step.
The second sticking means 50 may use a second adhesive sheet AS2 laminated with a third adhesive sheet AS3 having an outer edge shape larger than the outer edge shape of the wafer WF.
The third attaching means 70 may or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention.

The wafer reversing means 30 may share the multi-joint robot 11 with the division line forming means 10, hold the chuck motor 33 by the multi-joint robot 11, and reverse the wafer WF and the like upside down. 80 may also be used. In these cases, the support table TM2 may be moved within the working range of the multi-joint robot 11 and the working range of the integrated object reversing means 80 after the first adhesive sheet AS1 is attached.
The wafer reversing means 30 may hold at least one of the first adhesive sheet AS1 and the wafer WF and turn the wafer WF upside down, or may move the support table TM2 without lifting the wafer WF. Alternatively, the wafer WF may be ground from below by the dividing means 40 or the second and third bonding means 50 and 70 may be grounded from below without turning the wafer WF upside down. can adhere the second and third adhesive sheets AS2 and AS3 to the wafer WF or the like, the semiconductor chip manufacturing apparatus EA of the present invention need not be equipped with the second and third adhesive sheets AS2 and AS3.

The dividing means 40 may use the force for polishing the wafer WF as an external force or the force for cutting the wafer WF as an external force to form the dividing lines SL using the planned dividing lines PL as a starting point, or grind the wafer WF. The dividing line SL may be formed by applying an external force by a vibrating device such as an ultrasonic vibration device or a vibrator without grinding, polishing, or cutting, with the planned dividing line PL as a starting point. All of the lines PL may be the division lines SL, or part of the lines to be divided PL may be the division lines SL.

The frame arranging means 60 may share the articulated robot 11 with the planned division line forming means 10, and the articulated robot 11 may hold the suction arm 63A to convey the ring frame RF, or may convey the ring frame RF in front of the support table TM2. The ring frame stocker 64 may be arranged at other locations, and may or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention.

The integrated object reversing means 80 may share the multi-joint robot 11 with the division line forming means 10, hold the chuck motor 83 by the multi-jointed robot 11, and vertically invert the integrated object UP, or the wafer reversing means. 30 may also be used. In these cases, after attaching the third adhesive sheet AS3, the support table TM2 may be moved within the work range of the articulated robot 11 and the work range of the wafer reversing means 30. FIG.
The integrated object reversing means 80 may hold at least one of the ring frame RF, the first adhesive sheet AS1, the second adhesive sheet AS2, the third adhesive sheet AS3, and the wafer WF, and turn the integrated object UP upside down. Alternatively, the support table TM2 may be moved without lifting the integrated object UP and the integrated object UP may be turned upside down, or the first adhesive sheet peeling means 90 may be removed without turning the integrated object UP upside down. can peel off the first adhesive sheet AS1 from the wafer WF, the semiconductor chip manufacturing apparatus EA of the present invention need not have it.

The first adhesive sheet peeling means 90 may apply the peeling tape PT to the first adhesive sheet AS1 without stopping the movement of the support table TM2, or may adhere the peeling tape PT to the first adhesive sheet AS1 without moving the peeling roller 94 up and down. The PT may be attached to the first adhesive sheet AS1, or the first adhesive sheet AS1 may be peeled off from the wafer WF by itself while or without moving the support table TM2, or may be held. As a means, a strip-shaped or sheet peeling sheet PT may be adopted, or a holding that is supported by the output shaft of a direct-acting motor as a driving device and can be adsorbed and held by a decompression means such as a decompression pump or a vacuum ejector. The first adhesive sheet AS1 may be peeled off from the wafer WF by holding the first adhesive sheet AS1 with a member or by holding the first adhesive sheet AS1 with a chuck motor or the like. A first adhesive sheet AS1 that may be supported and whose adhesive strength is reduced by energy rays such as ultraviolet rays, infrared rays, visible rays, X-rays, or gamma rays is adopted, and the first adhesive sheet AS1 is irradiated with energy rays. The first adhesive sheet AS1 may be peeled off from the wafer WF after the energy beam is irradiated by the energy beam irradiation means, or part of the unnecessary piece UF shaded in FIG. It may be removed from the wafer WF together with the first adhesive sheet AS1, the shaded unnecessary pieces UF and other unnecessary pieces UF may be removed from the wafer WF together with the first adhesive sheet AS1, or all unnecessary pieces UF may be removed. It may be removed from the wafer WF together with the first adhesive sheet AS1.

Wafer transfer means TM includes first sticking means 20, wafer reversing means 30, dividing means 40, second sticking means 50, frame arranging means 60, third sticking means 70, integral object reversing means 80, and first adhesive sheet peeling means. The wafers WF may be individually transported or relatively moved with respect to 90, or one of them may be shared.
The wafer transport means TM moves the first, second and third sticking means 20, 50 and 70 without or while moving the wafer WF to attach the first, second and third adhesive sheets to the wafer WF. AS1, AS2, and AS3 may be attached, or the first adhesive sheet peeling means 90 may be moved without or while moving the wafer WF to peel the first adhesive sheet AS1 from the wafer WF. However, it may or may not be provided in the semiconductor chip manufacturing apparatus EA of the present invention, and if not provided, the wafer WF may be transferred by another device.

When the semiconductor chip manufacturing apparatus EA detaches the first adhesive sheet AS1 from the wafer WF on which the dividing line forming step, the first attaching step, and the dividing step have been performed, the second attaching means 50 and unnecessary piece removing means.

The first adhesive sheet AS1 may have the same outer edge shape as the outer edge shape of the wafer WF, or may have an outer edge shape larger than the outer edge shape of the wafer WF.
The second adhesive sheet AS2 may have the same outer edge shape as the chip picking area WF3, or may have an outer edge shape obtained by enlarging the chip picking area WF3.
The frame member may be annular, circular, elliptical, triangular, polygonal with more than quadrangle, non-annular (non-closed loop) frame member, or any other frame member.

The materials, types, shapes and the like of the first, second and third adhesive sheets AS1, AS2 and AS3, the peeling tape PT and the wafer WF in the present invention are not particularly limited. For example, the first, second, and third adhesive sheets AS1, AS2, and AS3, the peeling tape PT, and the wafer WF may be circular, elliptical, polygonal such as triangular or quadrangular, or other shapes. The first, second, and third adhesive sheets AS1, AS2, and AS3 and the peeling tape PT may be pressure-sensitive adhesive, heat-sensitive adhesive, or the like. 2. If a third adhesive sheet AS1, AS2, AS3 or a peeling tape PT is employed, a suitable coil for heating the first, second and third adhesive sheets AS1, AS2, AS3 or the peeling tape PT. The bonding may be performed by an appropriate method such as providing a heating means such as a heater or a heating side of a heat pipe. The first, second, and third adhesive sheets AS1, AS2, and AS3 and the peeling tape PT are, for example, single-layered adhesive layers or laminates of a substrate and an adhesive layer. 2 layers, 3 layers or more with one or more intermediate layers laminated between the base material and the adhesive layer, 3 layers with one or more cover layers laminated on the upper surface of the base material A layer or three or more layers, a base material, an intermediate layer, or a cover layer provided in a detachable manner, a single-layer double-sided adhesive sheet consisting only of an adhesive layer, and adhered to both outermost surfaces of one or more intermediate layers Any double-sided adhesive sheet laminated with an agent layer may be used. Further, the wafer WF may be, for example, a single object such as a silicon semiconductor wafer or a compound semiconductor wafer, or may be a composite formed by two or more of them. Note that the first, second, and third adhesive sheets AS1, AS2, and AS3 may be read as labels for information description, decorative labels, protective sheets, dicing tapes, die attach films, Any sheet such as a die bonding tape, a recording layer forming resin sheet, a film, a tape, or the like may be used.

The drive device in the above embodiment includes a rotating motor, a linear motor, a linear motor, a single-axis robot, an electric device such as a multi-joint robot having two or more joints, an air cylinder, a hydraulic cylinder, and a rodless robot. Actuators such as cylinders and rotary cylinders can be used, and combinations thereof directly or indirectly can also be used.
In the above embodiments, when a rotating member such as a roller is employed, a drive device for rotating the rotating member may be provided, or the surface of the rotating member or the rotating member itself may be made of deformable material such as rubber or resin. It may be composed of a member, the surface of the rotating member or the rotating member itself may be composed of a member that does not deform, or other members such as a shaft or a blade that rotates or does not rotate instead of the roller. Alternatively, if a pressing means such as a pressing roller or a pressing head or a pressing member that presses an object to be pressed is adopted, a roller, a round bar, a blade can be used instead of or in combination with the above examples In addition to the material and brush-like member, it may be possible to adopt the one by blowing gas such as air or gas. It may be composed of a member that does not deform such as , resin, etc., or if a peeling means such as a peeling plate or a peeling roller or a peeling member such as a peeling member is used, instead of the above examples Alternatively, a member such as a plate-shaped member, a round bar, or a roller may be adopted, and the peelable member may be made of a deformable member such as rubber or resin, or may be made of a non-deformable member. Alternatively, if a supporting (holding) means or a supporting (holding) member or the like that supports (holds) a member to be supported (member to be held) is employed, gripping means such as a mechanical chuck or a chuck cylinder may be used. , Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive equipment, etc. to support (hold) the supported member. Alternatively, if a cutting means or a cutting member that cuts the member to be cut or forms a cut or a cutting line in the member to be cut is adopted, it can be used in place of or in combination with the above examples. , Cutter blades, laser cutters, ion beams, thermal power, heat, water pressure, heating wires, spraying of gas or liquid, etc., or moving objects to be cut with a combination of appropriate driving equipment You may make it cut|disconnect by making it cut|disconnect.

EA Semiconductor chip manufacturing apparatus 10 Division line forming means 20 First sticking means 40 Dividing means 50 Second sticking means 70 Third sticking means 90 First adhesive sheet peeling means (unnecessary piece removing means)
AS1... First adhesive sheet AS2... Second adhesive sheet AS3... Third adhesive sheet CP... Semiconductor chip PL... Dividing line SL... Dividing line UF... Unwanted piece WF... Semiconductor wafer WF1... One side WF2... The other side WF3 …chip collection area

Claims (6)

a planned dividing line forming step of forming, within the semiconductor wafer, planned dividing lines made up of mutually intersecting modified portions;
a first attaching step of attaching a first adhesive sheet to one surface side of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer;
Applying an external force to the semiconductor wafer, forming a dividing line using the dividing line as a starting point, forming semiconductor chips separated by the dividing line inside a predetermined chip picking region of the semiconductor wafer, and forming the chip a dividing step of forming unnecessary pieces outside the collection area;
a second attaching step of attaching a second adhesive sheet to the other surface of the semiconductor wafer;
a first adhesive sheet peeling step of peeling the first adhesive sheet from the semiconductor wafer;
In the second attaching step, attaching a second adhesive sheet to the other surface side of the semiconductor wafer so as to cover the entire chip extraction area and not contact the outer edge of the semiconductor wafer;
In the first adhesive sheet peeling step, the unnecessary pieces are removed together with the first adhesive sheet. a planned division line forming step of forming, on one surface of a semiconductor wafer, a planned division line composed of grooves crossing each other;
a first attaching step of attaching a first adhesive sheet to one surface side of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer;
The semiconductor wafer is thinned, the line to be divided is exposed on the other surface side of the semiconductor wafer to form a dividing line, and a predetermined chip picking area of the semiconductor wafer is divided by the dividing line inside. a division step of forming a semiconductor chip and forming an unnecessary piece outside the chip picking area;
a second attaching step of attaching a second adhesive sheet to the other surface of the semiconductor wafer;
a first adhesive sheet peeling step of peeling the first adhesive sheet from the semiconductor wafer;
In the second attaching step, attaching a second adhesive sheet to the other surface side of the semiconductor wafer so as to cover the entire chip extraction area and not contact the outer edge of the semiconductor wafer;
In the first adhesive sheet peeling step, the unnecessary pieces are removed together with the first adhesive sheet. 3. A third attaching step of attaching a third adhesive sheet having an outer edge shape larger than an outer edge shape of the semiconductor wafer on the second adhesive sheet attached to the semiconductor wafer. 3. The method of manufacturing a semiconductor chip according to claim 1 or 2. 3. The second adhesive sheet according to claim 1, wherein the second bonding step uses the second adhesive sheet laminated with a third adhesive sheet having an outer edge shape larger than the outer edge shape of the semiconductor wafer. of semiconductor chips. a planned dividing line forming step of forming, within the semiconductor wafer, planned dividing lines made up of mutually intersecting modified portions;
a first attaching step of attaching a first adhesive sheet to one surface side of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer;
Applying an external force to the semiconductor wafer, forming a dividing line using the dividing line as a starting point, forming semiconductor chips separated by the dividing line inside a predetermined chip picking region of the semiconductor wafer, and forming the chip In a semiconductor chip manufacturing apparatus for peeling the first adhesive sheet from the semiconductor wafer on which the dividing step of forming unnecessary pieces outside the sampling area has been performed,
Second attaching means for attaching a second adhesive sheet to the other surface of the semiconductor wafer so as to cover the entire chip picking area for picking the semiconductor chips from the semiconductor wafer and not contact the outer edge of the semiconductor wafer. When,
An apparatus for manufacturing a semiconductor chip, further comprising unnecessary piece removing means for removing the unnecessary piece from the semiconductor wafer together with the first adhesive sheet. a planned division line forming step of forming, on one surface of a semiconductor wafer, a planned division line composed of grooves crossing each other;
a first attaching step of attaching a first adhesive sheet to one surface side of the semiconductor wafer so as to cover the entire outer edge of the semiconductor wafer;
The semiconductor wafer is thinned, the line to be divided is exposed on the other surface side of the semiconductor wafer to form a dividing line, and a predetermined chip picking area of the semiconductor wafer is divided by the dividing line inside. A semiconductor chip manufacturing apparatus for peeling the first adhesive sheet from a semiconductor wafer on which semiconductor chips are formed and a division step of forming unnecessary pieces outside the chip extraction area is performed,
Second attaching means for attaching a second adhesive sheet to the other surface of the semiconductor wafer so as to cover the entire chip picking area for picking the semiconductor chips from the semiconductor wafer and not contact the outer edge of the semiconductor wafer. When,
An apparatus for manufacturing a semiconductor chip, further comprising unnecessary piece removing means for removing the unnecessary piece from the semiconductor wafer together with the first adhesive sheet.

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