JP4602747B2 - Pasting device and pasting method - Google Patents

Description

  The present invention relates to a sticking device and a peeling method, and more particularly, a sticking device and a sticking method that can prevent generation of wrinkles and air bubbles when sticking an adhesive sheet to a plate-like member such as a semiconductor wafer. About.

  A semiconductor wafer (hereinafter simply referred to as “wafer”) on which a circuit surface is formed is divided into chips, and then each chip is picked up and bonded (die bonding) to a lead frame. This die bonding can be performed by previously sticking a heat-sensitive adhesive sheet for die bonding in the wafer processing step.

  For example, Patent Document 1 discloses an adhesive sheet sticking device. The sticking device disclosed in the document includes a table that sucks and supports the wafer with the back side of the wafer facing up, a sheet supply device that supplies an adhesive sheet for die bonding to the top side of the wafer, and a wafer. And a press roll for pressing the adhesive sheet supplied to the upper surface side and sticking the adhesive sheet on the wafer. Here, a cover sheet (release sheet) is temporarily attached to one surface of the adhesive sheet, and the release sheet is configured to be peeled after the adhesive sheet is attached to the wafer.

JP 2003-257898 A

  However, there is sometimes a problem in the original fabric in which the release sheet is temporarily attached to the adhesive sheet when the quality standard required for product accuracy is not cleared. Specifically, this is a case where the temporary attachment strength between the adhesive sheet and the release sheet is not uniform in the extending direction of the original fabric. In other words, with respect to a specific area along the extending direction, there are areas that are relatively temporarily attached relatively weakly compared to other areas, areas that are temporarily attached weakly, and variations in temporary attachment strength depending on the product lot. If there is, when the adhesive sheet is applied to the wafer and the release sheet is peeled off, the peel resistance becomes strong or weak. The heat-sensitive adhesive sheet for die bonding is that the adhesive sheet is not completely bonded to the wafer at the stage of peeling the release sheet, so that the adhesive sheet is also engulfed by peeling of the release sheet in a region where the temporary attachment strength is strong. Inconvenience.

In this case, by temporarily peeling the adhesive sheet and the release sheet before the adhesive sheet is attached to the wafer, the adhesive sheet is fed out while peeling the release sheet, and the adhesive sheet is attached with a predetermined tension. It is possible. However, in this case, since the release sheet is wound up by another roller before being attached to the wafer, the press roll directly presses the adhesive sheet, and the adhesive sheet is damaged. The adhesive of the adhesive sheet is likely to adhere to the press roll.
Therefore, as shown in FIG. 6, a preliminary peeling device 100 is provided in the middle of feeding the original fabric L on which the release sheet PS is temporarily attached to the adhesive sheet S, and the release sheet PS is preliminarily peeled from the adhesive sheet S to provide an adhesive sheet. A configuration in which S is attached to the wafer W was examined.
However, in such a configuration, since the adhesive sheet S is a heat-sensitive adhesive, the adhesive sheet S cannot be re-adhered by being once peeled off from the release sheet PS, and the adhesive sheet S becomes wrinkles or hangs down. When the adhesive sheet S is bonded to the wafer W, the bonding is performed in a state in which wrinkles and bubbles are mixed, resulting in inconvenience that frequent product defects occur.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to perform preliminary peeling even if there is a variation in the temporary attachment strength between the peeling sheet and the adhesive sheet in the original fabric state. By re-attaching, the peel strength between the release sheet and the adhesive sheet can be made uniform, and the adhesive sheet can be affixed to the plate-like member with a predetermined tension. It is another object of the present invention to provide a sticking device and a sticking method that can apply a pressing force by a press roll to an adhesive sheet via a release sheet and prevent adhesion of the adhesive to the press roll.

In order to achieve the above object, the present invention provides a pasting apparatus including a pasting table that supports a plate-shaped member, and a pasting unit that pastes an adhesive sheet to the plate-shaped member.
The sticking unit includes a pre-peeling device that peels the adhesive sheet from the release sheet in the course of feeding the raw material with the adhesive sheet temporarily attached to one surface of the belt-like release sheet, the pre-peeled adhesive sheet, and the peel A re-tacking device that re-temporarily attaches the sheet to the temporary position before pre-separation, and a press roll that presses the adhesive sheet against the plate-like member,
The adhesive sheet is stuck to the plate-like member by pressing the release sheet with a press roll in a state where the re-temporarily attached adhesive sheet is directed to the adherend surface of the plate-like member. ing.

  The plate-like member in the sticking device may be a semiconductor wafer, and the adhesive sheet may be a die bonding sheet or a protective sheet for forming a protective film.

Further, the present invention is a method of paying out the original sheet in which the adhesive sheet is temporarily attached to one surface of the strip-shaped release sheet and sticking the adhesive sheet to the adherend surface of the plate-like member,
In the middle of unwinding the original fabric, pre-peel the adhesive sheet from the release sheet,
Re-temporarily attach to the temporary attachment position before the preliminary release of the pre- peeled adhesive sheet and the release sheet,
Next, a method is adopted in which the adhesive sheet is stuck to the plate member by pressing the release sheet in a state where the re-attached adhesive sheet faces the plate member.

  In the sticking method, the re-tempering can be performed by applying heat or static electricity.

According to the present invention, since the adhesive sheet and the release sheet are preliminarily peeled and temporarily reattached after the raw fabric is drawn out, as shown in FIG. 6, the adhesive sheet S becomes the release sheet PS. It is possible to effectively prevent the occurrence of wrinkles and sagging due to the fact that they cannot be re-attached to the wafer W, and when the adhesive sheet S is bonded to the wafer W, bonding is performed in a state in which wrinkles or bubbles are mixed. Can be resolved.
In addition, the adhesive sheet is attached by applying a pressing force through the release sheet, that is, the press roll is not in contact with the adhesive sheet. It is also possible to avoid adhesion of the adhesive to the surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sticking apparatus for sticking an adhesive sheet on the back side of a wafer. In this figure, a sticking apparatus 10 receives a wafer W as a plate-like member via a transfer means in a previous process and supports the wafer W, and the back surface of the wafer W adsorbed on the sticking table 11. A sticking unit 12 for sticking a heat-sensitive adhesive sheet S for die bonding on the side (upper surface side), and cutting the adhesive sheet S in the width direction for each wafer W on the side of the sticking unit 12 Means 13 are arranged. The wafer W has a protective tape PT attached in advance to the circuit surface side, and the wafer W is supported in a state where the surface on which the protective tape PT is applied is in contact with the upper surface of the application table 11.

  The sticking table 11 has an upper surface formed as a suction surface, and is maintained at a predetermined temperature at which the adhesive sheet S can be melted to a certain extent and bonded (temporarily attached) to the wafer W. Yes. 2 and 3, the sticking table 11 includes a base table 15, an inner table portion 16 provided on the upper surface side of the base table 15, and an outer table portion 17 surrounding the inner table portion 16. And is configured. The inner table portion 16 is provided in substantially the same plane shape as the wafer W so as to form a support surface of the wafer W, and a heater H is disposed therein to keep the wafer W at a predetermined temperature. Further, a heat transfer member 20 is disposed in the clearance C formed between the inner table portion 16 and the outer table portion 17, and the heat transfer member 20 causes the outer table portion 17 to have a temperature higher than that of the inner table portion 16. Is also provided to be kept at a low temperature. Therefore, the unnecessary adhesive sheet portion S1 that protrudes outside the wafer W is adhered to the outer table portion 17 with a weak adhesive force, and wrinkles or the like are generated on the wafer W when the adhesive sheet S is attached to the wafer W. Absent.

  Further, as shown in FIG. 1, the affixing table 11 is supported by a slider plate 22 that is movable on the guide rail 21. When a driving means (not shown) is driven, the wafer W in the previous step is supported. Is provided so as to be able to reciprocate between a position where it can be received and a position which has passed through the lower region of the sticking unit 12 to the right. In addition, the sticking table 11 is provided so as to be movable up and down via an elevating device 25. The elevating device 25 includes a guide block 27 fixed on the slide plate 22, a leg member 28 that is suspended from the lower surface side of the base table 15 and can be raised and lowered along the guide block 27, a cylinder (not shown), and the like. It is comprised with the raising / lowering force provision mechanism which consists of.

  On the upper surface of the sticking table 11, cutter receiving grooves 11 </ b> A for cutting the strip-shaped raw fabric L fed from the sticking unit 12 in the width direction are formed, and on both sides along the moving direction of the sticking table 11. In the upper part, a rack 30 and a guide bar 31 attached to the outer side surface of the rack 30 are provided.

  The pasting unit 12 is provided in a region of a plate-like frame F arranged above the pasting table 11. The affixing unit 12 includes a support roll 32 that supports the original fabric L that is temporarily attached to the adhesive sheet S and wound in a roll shape so as to be fed, and a drive roll that applies a feeding force to the original fabric L. 33 and the pinch roll 34, two guide rolls 38, 38 arranged between the support roll 32 and the pinch roll 34, a dancer roll 39 provided between the guide rolls 38, 38, and the pinch roll 34 In addition, the preliminary peeling device 40 provided on the upstream side in the feeding direction of the original fabric L and the temporary provisioning device which is provided on the downstream side of the drive roll 33 and temporarily attaches the release sheet PS to the adhesive sheet S which has been preliminarily peeled off. The attachment device 41, the pressing member 43 that presses the lead end region of the original fabric L against the upper surface of the sticking table 11 and sandwiches the pressing member 43, and the adhesive sheet S on the back side of the wafer W Next, a heater built-in type press roll 45 that presses and adheres the adhesive sheet S to the wafer W, and a tension roll 46 and a guide roll 47 arranged immediately before the press roll 45 in the feed direction of the original fabric L are provided. Configured. Here, the re-tacking apparatus 41 is composed of a pair of heater-integrated rolls 41A and 41B arranged so as to sandwich the original fabric L. Further, the lower surface side of the pressing member 43 has an adsorbing portion, and adsorbs and holds the end portion of the original fabric L.

  As shown in FIG. 4, the sheet preliminary peeling device 40 includes a moving member 50 that can move along the feeding direction of the original fabric L, and a cylinder device 51 that moves the moving member 50. The moving member 50 is fixed to a support shaft 55 penetrating in the front-rear direction through a slit 54 provided in the plane of the frame F, and is fixed to the front end (front side end) of the support shaft 55 so as to face the front of the frame F. And a wing-like piece 56 having a length equal to or greater than the width of the original fabric L. This piece-like body 56 is disposed between the adhesive sheet S and the release sheet PS, and has a shape in which gentle arc surfaces in contact with these sheets S and PS are positioned on both the left and right sides, and the upper and lower ends thereof are very Provided in a pointed shape with a small curved surface, when the cylinder device 51 is driven to move up and down, the adhesive sheet S and the release sheet PS in a laminated state are forcibly and smoothly separated to perform preliminary peeling. It is supposed to be. The moving member 50 does not prevent the use of a roll-shaped member or the like instead of the piece-like body 56.

  The drive rolls 33 are each driven to rotate by a motor M (see FIG. 1) provided on the back side of the frame F. The pressing member 43, the press roll 45, and the tension roll 46 are provided so as to be movable up and down via cylinders 60, 61, and 62, respectively. As shown in FIG. 2, both ends of the press roll 45 are connected to the cylinder 61 via brackets 64. Pinions 67 and 67 and pinions 67 and 67 are provided at both ends of the rotation center shaft 66. Rollers 68, 68 are arranged at the respective outer positions. The pinions 67 and 67 are provided so as to be able to mesh with the racks 30 and 30, respectively, while the rollers 68 and 68 are configured to roll on the guide bars 31 and 31 regardless of the rotation of the press roll 45. ing.

  As shown in FIG. 1, the cutting means 13 can be advanced and retracted via an arm portion 70 extending along the moving direction of the sticking table 11 and a uniaxial robot 71 provided on the lower surface on the distal end side of the arm portion 70. And a cutter unit 72 provided. The cutter unit 72 includes a cutter up / down cylinder 75 supported by a bracket 74 that moves along the uniaxial robot 71, and a cutter 77 attached to the tip of the cutter up / down cylinder 75. Here, the cutter up / down cylinder 75 is attached to the bracket 74 in a state in which the cutter up / down cylinder 75 is rotatable in a substantially vertical plane. The angle can be adjusted. The single-axis robot 71 can advance and retract along the extending direction of the arm unit 70. The cutting means 13 is supported so as to be movable along a guide 79 directed in a direction orthogonal to the moving direction of the sticking table 11. Therefore, when the leading end of the cutter 77 is in a posture to enter the cutter receiving groove 11A of the sticking table 11 and the entire cutting means 13 moves along the guide 79, the original fabric L can be cut in the width direction.

  Next, a method for applying the adhesive sheet S in the present embodiment will be described.

  The wafer W is transferred onto the affixing table 11 with the surface to which the protective tape PT is affixed positioned on the lower surface side, and is sucked and supported by the affixing table 11 with the back surface of the wafer W as the upper surface side.

  As shown in FIG. 1, when the affixing table 11 is located immediately below the affixing unit 12, the lead end region of the original fabric L that is sucked and held on the lower surface side of the pressing member 43 is moved downward by the pressing member 43. 11 is brought into contact with the upper surface of 11. Before the lead end of the original fabric L is pressed against the outer table portion 17 by the pressing member 43, the piece 56 is reciprocated upward from the position shown in FIG. To do. Further, when the adhesive sheet S and the release sheet PS that have been preliminarily peeled pass through the rolls 41A and 41B constituting the re-temporary bonding apparatus 41, the temporary bonding strength is increased in the extending direction by the heat of the rolls 41A and 41B. It is temporarily re-attached so that it may become constant along. The temporary attachment strength can be variably set according to the material and thickness of the adhesive sheet S and the release sheet PS, the mechanical characteristics of the sticking device 10, and the like. Thereafter, when the piece 56 is stopped, the press roll 45 is lowered to sandwich the original fabric L between the upper surface of the wafer W and the unnecessary adhesive sheet portion S1 other than the wafer W region (see FIG. 3). Will come into contact with the outer table portion 17. Next, the pressing member 43 is lifted by releasing the suction. At this time, the rollers 68 provided on both ends of the press roll 45 come into contact with the upper surface of the guide bar 31 and at the same time, the pinion 67 engages with the rack 30 so that the pinion 67 can rotate and move along the rack 30. . In this state, the sticking table 11 moves to the right side in FIG. 1, and the press roll 45 rotates due to the engagement between the rack 30 and the pinion 67, and the roller 68 rolls on the guide bar 31 as a guide surface. The adhesive sheet S of the raw fabric L that is fed out is pasted on the upper surface of the wafer W. At the time of sticking, the unnecessary adhesive sheet portion S1 that protrudes from the outer periphery of the wafer W is adhered to the outer table portion 17 with a weak adhesive force, so that when the press roll 45 is rotated on the wafer W, There is no inconvenience of generating wrinkles by being pulled by the anti-L tension and the pressing force of the press roll 45. The press roll 45 is controlled so as to maintain a temperature at which the adhesive sheet S can be temporarily attached to the wafer W by a heater which is a built-in heating means.

  Thus, when the adhesive sheet S of the raw fabric L is stuck to the wafer W and the pressing member 43 reaches the upper position immediately after passing through the cutter receiving groove 11A, as shown in FIG. Descends to bring the fabric L into contact with the affixing table 11. Thereafter, the cutter 77 of the cutting means 13 enters the cutter receiving groove 11A, and the arm portion 70 supporting the cutter unit 72 moves in the direction perpendicular to the paper surface in FIG. 5 to cut the adhesive sheet S in the width direction. . When the cutting in the width direction is completed, the pressing member 43 sucks the original fabric L located on the lower surface side of the pressing member 43 and returns to the raised position to prepare for the next bonding to the wafer W. Further, the cutting means 13 is displaced to a position where the cutting edge position of the cutter 77 is raised by the raising of the cutter up / down cylinder 75, and retracts in a direction away from the upper surface position of the sticking table 11.

  The wafer W to which the adhesive sheet S of the original fabric L is thus attached is transferred to an outer peripheral cutting table (not shown), and the unnecessary adhesive sheet portion S1 is cut by the cutting means 13, and the unnecessary adhesive sheet portion. S1 and the release sheet PS positioned on the wafer W are removed by a removal device (not shown), and the wafer W is sequentially transferred to the ring frame mounting step and the protective tape PT peeling step after the step. The Rukoto.

  As described above, according to the sticking device 10 according to the present embodiment, since the adhesive sheet S and the release sheet PS that constitute the original fabric L are preliminarily peeled off, the temporary attachment is performed again. As shown in FIG. 6, the adhesive sheet S cannot be re-attached to the release sheet PS, so that the appropriate tension of the adhesive sheet is lost, so that the adhesive sheet is wrinkled or drooped. Therefore, the adhesive sheet S can be bonded to the wafer W in a state in which the entry of wrinkles and bubbles is avoided. Moreover, since the press roll 45 is configured to apply a pressing force to the adhesive sheet S via the release sheet PS, there is no inconvenience that the adhesive adheres to the press roll 45.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the embodiment, the case where the pair of rolls 41A and 41B with a built-in heater is employed as the re-temporary attachment device 41 is illustrated and described, but the present invention is not limited to this. That is, it may be a case where the heater is not built-in type. In this case, a chamber maintained at a constant heating temperature may be provided and a roll may be disposed in the chamber. Alternatively, the adhesive sheet S and the release sheet PS can be electrostatically charged and temporarily bonded to each other. In short, the re-temporary attachment in the present invention is sufficient if the temporary attachment strength can be readjusted uniformly along the extending direction of the original fabric L.

  In addition, although illustrated and described as an apparatus for attaching the adhesive sheet S for die bonding to the wafer W, other sheets may be used as long as they have heat-sensitive adhesive properties, such as a dry resist film or a protective film. The present invention can also be applied when a forming sheet or the like is attached to the wafer W.

  Furthermore, this invention includes the case where a sheet | seat is affixed on plate-shaped members other than a wafer.

The schematic front view of a sticking apparatus. The schematic perspective view of a sticking table. Sectional drawing of a sticking table. The schematic perspective view which shows a preliminary | backup peeling apparatus. The schematic front view which shows the state which the sticking table moved to the original fabric sticking end position. The schematic front view for demonstrating the inconvenience at the time of performing preliminary peeling and sticking an adhesive sheet on a wafer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Pasting apparatus 11 Pasting table 12 Pasting unit 40 Preliminary peeling apparatus 41 Re-tacking apparatus 45 Press roll L Original fabric W Semiconductor wafer (plate-shaped member)
PS release sheet S adhesive sheet (heat-sensitive adhesive sheet)

Claims (4)

In a sticking apparatus comprising a sticking table that supports a plate-like member, and a sticking unit that sticks an adhesive sheet to the plate-like member,
The sticking unit includes a pre-peeling device that peels the adhesive sheet from the release sheet in the course of feeding the raw material with the adhesive sheet temporarily attached to one surface of the belt-like release sheet, the pre-peeled adhesive sheet, and the peel A re-tacking device that re-temporarily attaches the sheet to the temporary position before pre-separation, and a press roll that presses the adhesive sheet against the plate-like member,
The adhesive sheet is affixed to the plate-like member by pressing the release sheet with a press roll in a state where the re-temporarily attached adhesive sheet faces the adherend surface of the plate-like member. Pasting device.   2. The sticking apparatus according to claim 1, wherein the plate member is a semiconductor wafer, and the adhesive sheet is a die bonding sheet or a protective sheet for forming a protective film. In the method of sticking the adhesive sheet to the adherend surface of the plate-like member by feeding out the original fabric in which the adhesive sheet is temporarily attached to one surface of the strip-shaped release sheet,
In the middle of unwinding the original fabric, pre-peel the adhesive sheet from the release sheet,
Re-temporarily attach to the temporary attachment position before the preliminary release of the pre- peeled adhesive sheet and the release sheet,
Next, the adhesive sheet is attached to the plate-like member by pressing the release sheet in a state where the re-attached adhesive sheet faces the plate-like member.   The sticking method according to claim 3, wherein the re-attachment is performed by applying heat or static electricity.

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