JP5113621B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, a sheet suitable for adhering a peeling tape to an adhesive sheet affixed to an adherend and peeling the adhesive sheet through the peeling tape. The present invention relates to a peeling apparatus and a peeling method.

  A semiconductor wafer (hereinafter simply referred to as a “wafer”) has a protective adhesive sheet attached to its circuit surface, and the adhesive sheet is peeled off after various processes such as back grinding. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In the same document, the step of peeling the adhesive sheet from the wafer is performed by attaching the peeling tape to the adhesive sheet via a peeling roller that wraps the peeling tape, and then rolling the peeling roller and the peeling tape and This is done by winding up the adhesive sheet.

JP 2005-175253 A

  However, in such a configuration, since it is inevitable to roll the peeling roller on the adhesive sheet, the adhesive sheet immediately after peeling is necessarily wound up along the peeling roller. Therefore, since the peeling angle between the adhesive sheet and the wafer is always constant, it is impossible to change the peeling angle according to conditions such as ultrathinning of the wafer and adhesiveness of the adhesive sheet. For this reason, the adhesive sheet is not peeled off from the wafer, but they are rolled up together, resulting in inconvenience that the wafer is damaged.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is that when the adhesive sheet is peeled off by winding the peeling tape, the adherend is rolled up together with the adhesive sheet. An object of the present invention is to provide a sheet peeling apparatus and a peeling method that can be prevented.

In order to achieve the above object, the present invention provides a holding means for holding an adherend to which an adhesive sheet is attached, an attaching means for attaching a peeling tape to the adhesive sheet, and the adhesion via the peeling tape. In a sheet peeling apparatus provided with a peeling means provided to be able to be folded at a folding position so as to make the sheet peel from the adherend and to face the peeled adhesive sheet and the unpeeled adhesive sheet ,
The stripping means Repetitive comprises a Demakito means, the feeding and winding means by displacing provided adjustably peel angle between the peeling tape and / or adhesive sheet and the adherend,
The feeding and winding means includes a driving roller that can be driven to rotate, and a peeling roller that is provided so that the peeling tape and / or the adhesive sheet can be sandwiched between the driving roller,
When the peeling roller is driven to rotate the driving roller and the peeling tape is fed and the adhesive sheet is peeled off, the peeling roller is peeled off with the closest part to the adherend adjacent to the folding position of the adhesive sheet. has been the adhesive sheet is pressed to the adherend side, and adopts a configuration in which Ru, provided to be able to send in the direction of removing the peeling tape and / or adhesive sheet by rotation of said drive roller .

Further, the peeling method of the present invention is a sheet peeling method in which a peeling tape is attached to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled from the adherend via the peeling tape.
The peeling roller provided so as to be able to press the peeled adhesive sheet to the adherend side, and provided so as to be rotationally driven, and provided so as to sandwich the peeling roller and the peeling tape and / or the adhesive sheet. Using a drive roller,
Holding the adherend with holding means;
A step to decremental the peeling tape by a peeling roller and the drive roller via a rotation of said drive roller,
A step of applying a peeling tape to the adhesive sheet attached to the adherend;
While adjusting the peeling angle between the adhesive sheet and the adherend, the adhesive sheet peeled by the peeling roller and the unpeeled adhesive sheet are folded at a folding position so as to face each other, and A step of making the closest part of the peeling roller adjacent to the bending position of the adhesive sheet;
Step wherein while the adhesive sheet is peeled off by the peeling roller presses the to the adherend side, peeling off the adhesive sheet I sent in the direction of removing the peeling tape and / or adhesive sheet by the rotation of the driving roller The method of preparing is taken.

  According to the present invention, the peeling angle can be easily adjusted according to various conditions by the angle adjusting means. Thereby, it can avoid that an adhesive sheet and a to-be-adhered body are wound together at the time of peeling, and it becomes possible to peel an adhesive sheet reliably and smoothly.

  Further, the peeled adhesive sheet and the unpeeled adhesive sheet are bent so as to face each other, and further, the peeled adhesive sheet is pressed to the adherend side with a peeling roller, so that the adherend is peeled off. It is possible to better prevent the hoisting.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic front view of a sheet peeling apparatus according to the embodiment. In this figure, a sheet peeling apparatus 10 includes a holding means 11 composed of a table for adsorbing and holding a wafer W as an adherend on the upper surface, a supporting means 12 for supporting a strip-like peeling tape PT, and a peeling tape. Peeling means 13 for peeling the adhesive sheet S affixed to the circuit surface (upper surface) of the wafer W via the PT, and a sticking means 14 for sticking the lead end side of the peeling tape PT to the outer edge side of the adhesive sheet S It is prepared for. The peeling tape PT employs a heat-sensitive adhesive tape.

  The wafer W is held by the holding means 11 in a state where it is arranged and integrated inside the opening of the ring frame RF via the mounting tape MT from the opposite surface (lower surface) side of the circuit surface.

  The support means 12 includes a support shaft 16 supported by the frame F1, and a motor M1 that rotates the support shaft 16. The peeling tape PT fed out from the support shaft 16 is guided to the peeling means 13 by a plurality of guide rollers 18.

  The peeling means 13 includes a moving means 20 including a linear motion motor 20A for moving the holding means 11 in the horizontal direction in FIG. 1 and a slider 20B thereof, and a take-up winding means capable of feeding and winding the peeling tape PT. 21 and an angle adjusting means 23 composed of a linear motion motor that supports and displaces the feeding and winding means 21 in the vertical direction, and is provided on the left side of the feeding and winding means 21 and moves in the vertical direction to be separated from each other. The upper chuck 24A and the lower chuck 24B are accessible. The chuck 24 is configured to be movable in the left-right direction in FIG. 1 via a driving device (not shown).

  The feeding and winding means 21 includes a driving roller 26 supported rotatably on a frame F2 connected to the angle adjusting means 23 via a motor M2, and a peeling tape PT between the driving roller 26 and the driving roller 26. And a peeling roller 27 to be sandwiched. As shown in FIG. 2, the peeling roller 27 is divided into three parts, and is attached to the rotary shaft 27B to form a clearance 27A. Each clearance 27A is a shaft-shaped guide member 30 oriented in a substantially horizontal direction. Is provided so that it can be inserted. Each guide member 30 is provided so as to be able to advance and retreat via a cylinder 31 and protrudes and retracts on the left side of the drive roller 26 and the peeling roller 27 in FIG. As a result, the guide member 30 supports the peeling tape PT fed from the lower side of the drive roller 26 and the peeling roller 27 from below as indicated by a two-dot chain line in FIG. It is possible to guide to a position where it can be gripped.

  The sticking means 14 includes a direct acting motor 33 and a pressing head 34 having a heater 34A as a heating means provided so as to be able to advance and retreat in the vertical direction by the direct acting motor 33. The sticking means 14 is configured to weld the peeling tape PT to the adhesive sheet S by pressing the peeling tape PT fed to the upper surface side of the adhesive sheet S by the chuck 24 with the pressing head 34 and heating. It is configured.

  Tape cutting means 36 is provided on the right side of the sticking means 14. The tape cutting means 36 includes a cutter blade 37, a cutting cylinder 39 that moves the cutter blade 37 in a direction orthogonal to the paper surface in FIG. 1, and a vertical cylinder 38 that moves the cutter blade 37 in the vertical direction in FIG. It is comprised by.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  First, after the peeling tape PT is pulled out from the support shaft 16 and wound around each guide roller 18, the lead end side of the peeling tape PT is passed between the driving roller 26 and the peeling roller 27. .

  Then, the wafer W integrated with the ring frame RF is held on the upper surface of the holding unit 11 through a transfer unit (not shown). Next, while moving the holding means 11 via the moving means 20, the right outer edge of the adhesive sheet S is detected via a sensor (not shown), and the moving means 20 so that the outer edge position stops just below the pressing head 34. To control.

  Next, the motor M2 is operated to rotate the driving roller 26, and the peeling tape PT having a predetermined length is fed out to the left side of the driving roller 26 and the peeling roller 27. Thereafter, the cylinder 31 is actuated to advance the guide member 30 to the position indicated by the two-dot chain line in FIG. 1, the driving means (not shown) is actuated, and the guide member 30 and the peeling tape are interposed between the lower chucks 24A and 24B. Position PT. Then, the guide member 30 moves backward, and the upper and lower chucks 24A and 24B approach each other, thereby gripping the peeling tape PT. Thereafter, the chuck 24 is moved leftward to pull out the peeling tape PT, and the peeling tape PT is positioned below the pressing head 34.

  Next, as shown in FIG. 3, the pressing head 34 heated by the heater 34 </ b> A is moved downward by the linear motor 33, and the peeling tape PT is heated and welded to the adhesive sheet S. Next, the gripping of the peeling tape PT by the chuck 24 is released. Thereafter, while moving the support means 11 to the right via the moving means 20, the motor M2 is operated so that the adhesive sheet S between the peeling roller 27 and the wafer W is not loosened, and the drive roller 26 is moved. Rotate in the opposite direction. As a result, as shown in FIG. 4A, the peeling tape PT is bent at a peeling angle α so as to face the adhesive sheet S on the wafer W.

  After moving so that the right outer edge of the wafer W is positioned below the peeling roller 27, the angle adjusting means 23 is operated to lower the take-up winding means 21. The peeling angle α increases as the descending amount increases. When the peeling angle α is determined in this way, as shown in FIGS. 4B and 4C, the support means 11 is moved to the right via the movement means 20 to support the motors M1 and M2. By rotating in synchronization with the movement of the means 11, the peeling tape PT and the adhesive sheet S are wound up, and the adhesive sheet S is peeled off from the right outer edge of the wafer W.

  In the present embodiment, the descending amount of the take-up winding means 21 is such that the closest part (lower part in the figure) of the peeling roller 27 with respect to the wafer W is adjacent to the bending position, and the peeled adhesive sheet S is removed from the peeling roller. 27 is set to press the wafer W side. As a result, the unpeeled adhesive sheet S immediately before peeling and the adhesive sheet S immediately after peeling are opposed to each other with a small interval, and the adhesive sheet S is folded so that the peeling angle α is about 180 °. Is peeled off.

  When the peeling of the adhesive sheet S is completed, the adhesive sheet S affixed to the peeling tape PT is wound around the guide rollers 18. Thereafter, the motors M1 and M2 are operated so that the adhesive sheet S and the peeling tape PT attached thereto are suspended from the drive roller 26 and the peeling roller 27 on the left side. In this state, the peeling tape PT is cut on the guide member 30 by advancing the guide member 30 and operating the cylinders 38 and 39. Then, the holding means 11 returns to the left position, the wafer W is transferred to the predetermined position together with the ring frame RF by the transfer means (not shown), and a new wafer W with the ring frame RF is placed on the holding means 11 and thereafter. The same operation as described above is performed.

  Therefore, according to such an embodiment, the peeling angle α is set to about 180 °, and the folding edge of the adhesive sheet S can be peeled off while pressing the wafer W downward by the peeling roller 27. It is possible to avoid winding up to the peeling roller 27 side without being peeled off from S. Thereby, it is possible to effectively prevent the wafer W from being damaged when the adhesive sheet S is peeled off. Moreover, since the said peeling angle (alpha) can be adjusted according to the descending amount of the delivery winding means 21 by the angle adjustment means 23, it becomes possible to adjust the magnitude | size of the peeling angle (alpha) according to various conditions.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the linear motion motor constituting the angle adjusting means 23 may be replaced with a displacement means such as an air cylinder or a hydraulic cylinder.

Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.
Furthermore, the peeling tape PT may employ a pressure-sensitive adhesive tape in addition to the heat-sensitive adhesive tape.
Further, the peeling angle α is not limited to 180 ° and can be changed as appropriate.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. Explanatory drawing of a pinch roller. Explanatory drawing of the state which the sticking means stuck the tape for peeling. (A)-(C) are explanatory drawings of the state which has peeled the adhesive sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Holding means 13 Peeling means 14 Sticking means 15 Moving means 21 Feeding winding means 23 Angle adjusting means 26 Driving roller 27 Peeling roller PT Peeling tape S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (2)

A holding means for holding the adherend to which the adhesive sheet is affixed, a sticking means for sticking a peeling tape to the adhesive sheet, and the adhesive sheet is peeled from the adherend through the peeling tape and peeled off. In a sheet peeling apparatus provided with a peeling means provided so as to be able to be folded at a folding position so as to oppose the adhesive sheet thus formed and the unpeeled adhesive sheet ,
The stripping means Repetitive comprises a Demakito means, the feeding and winding means by displacing provided adjustably peel angle between the peeling tape and / or adhesive sheet and the adherend,
The feeding and winding means includes a driving roller that can be driven to rotate, and a peeling roller that is provided so that the peeling tape and / or the adhesive sheet can be sandwiched between the driving roller,
When the peeling roller is driven to rotate the driving roller and the peeling tape is fed and the adhesive sheet is peeled off, the peeling roller is peeled off with the closest part to the adherend adjacent to the folding position of the adhesive sheet. The sheet is provided so as to press the adhered adhesive sheet toward the adherend side and to send the peeling tape and / or the adhesive sheet in the direction of peeling by the rotational driving of the driving roller. Peeling device. In the sheet peeling method of sticking a peeling tape to the adhesive sheet stuck to the adherend, and peeling the adhesive sheet from the adherend through the peeling tape,
The peeling roller provided so as to be able to press the peeled adhesive sheet to the adherend side, and provided so as to be rotationally driven, and provided so as to sandwich the peeling roller and the peeling tape and / or the adhesive sheet. Using a drive roller,
Holding the adherend with holding means;
A step to decremental the peeling tape by a peeling roller and the drive roller via a rotation of said drive roller,
A step of applying a peeling tape to the adhesive sheet attached to the adherend;
While adjusting the peeling angle between the adhesive sheet and the adherend, the adhesive sheet peeled by the peeling roller and the unpeeled adhesive sheet are folded at a folding position so as to face each other, and A step of making the closest part of the peeling roller adjacent to the bending position of the adhesive sheet;
Step wherein while the adhesive sheet is peeled off by the peeling roller presses the to the adherend side, peeling off the adhesive sheet I sent in the direction of removing the peeling tape and / or adhesive sheet by the rotation of the driving roller And a sheet peeling method.

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