JP4204658B2 - Sheet peeling apparatus and method - Google Patents

Sheet peeling apparatus and method Download PDF

Info

Publication number
JP4204658B2
JP4204658B2 JP34189597A JP34189597A JP4204658B2 JP 4204658 B2 JP4204658 B2 JP 4204658B2 JP 34189597 A JP34189597 A JP 34189597A JP 34189597 A JP34189597 A JP 34189597A JP 4204658 B2 JP4204658 B2 JP 4204658B2
Authority
JP
Japan
Prior art keywords
sheet
adhesive tape
wafer
peeling
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP34189597A
Other languages
Japanese (ja)
Other versions
JPH11163105A (en
Inventor
賢治 小林
光司 岡本
博 斉藤
剛 栗田
正樹 辻本
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP34189597A priority Critical patent/JP4204658B2/en
Priority claimed from US09/090,762 external-priority patent/US6149758A/en
Publication of JPH11163105A publication Critical patent/JPH11163105A/en
Application granted granted Critical
Publication of JP4204658B2 publication Critical patent/JP4204658B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a sheet peeling apparatus and method for peeling a sheet affixed to a plate-like member such as a semiconductor wafer.
[0002]
[Prior art]
In a semiconductor manufacturing process, there is a process of polishing and thinning the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer) in order to reduce the size and thickness of a semiconductor chip. In this process, the surface of the wafer (the surface on which a circuit is formed) ) Is protected by attaching a protective sheet made of an adhesive film or the like. After polishing, the protective sheet is peeled off from the wafer.
[0003]
As a method for peeling off the protective sheet, conventionally, an adhesive tape having a width of 25 mm to 50 mm is pasted on a protective sheet stuck on a wafer using a press roller, and the protective sheet is peeled off from the wafer by pulling the adhesive tape. It was.
[0004]
[Problems to be solved by the invention]
However, according to the above method, the pressure-sensitive adhesive tape is pressed with a press roller and stuck to the protective sheet, so that there is a possibility that wafer cracking due to this pressing may occur. In particular, as the wafer outer diameter becomes larger and the thickness becomes thinner in recent years, it is necessary to consider the problem of wafer cracking.
[0005]
Then, an object of this invention is to enable peeling | peeling sheets, such as a protection sheet, from a plate-shaped member, without damaging plate-shaped members, such as a wafer.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, in the present invention, in a sheet peeling apparatus and method for peeling a sheet affixed to a plate member using an adhesive tape, a reference portion (for example, a semiconductor wafer) formed on the plate member. The position of the formed orientation flat or V notch) was detected, the adhesive tape was adhered to the end of the sheet other than the reference portion, and the adhesive tape was pulled to peel off the sheet.
[0007]
In addition, with the recent increase in wafer outer diameter and wafer thinning, a UV (ultraviolet ray) curable protective sheet is used to irradiate UV at the time of peeling to weaken the adhesive force and peel off the sheet. In the case of such a system, the protective sheet was irradiated with UV before the sheet was peeled off using an adhesive tape.
[0008]
The present invention is particularly suitable for peeling off a protective sheet stuck on a wafer. However, the present invention is not limited to this, and sheet peeling for peeling a sheet stuck on a plate-like member using an adhesive tape. The apparatus and method can be generally applied.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described using a wafer protective sheet peeling apparatus as an example.
FIG. 1 is a plan view of a protective sheet peeling apparatus showing an embodiment of the present invention. The protective sheet peeling apparatus includes a wafer supply unit 600, a wafer transfer unit 700, an orientation flat alignment unit 800, and a UV irradiation unit 900. , And a sheet peeling portion 950. Hereinafter, each part will be described.
[0010]
FIG. 2 is a view of the wafer supply unit 600 viewed in the direction of arrow A in FIG. 1. In the wafer supply unit 600, two guide rails 603 are attached to the support column 601, and guides 605 are attached to the guide rails 603. A table 607 is attached so as to be movable up and down. A ball screw 609 is attached along the column 601, and a plate 611 that engages with the ball screw 609 is connected to the table 607. The ball screw 609 is rotated by a motor 615 via a belt 613, and the table 607 moves up and down by this rotation. A wafer carrier (wafer transfer container) 617 is placed on the table 607, and a plurality of wafers W each having a protective sheet attached are accommodated in a shelf in the wafer carrier 617.
[0011]
A plate 619 is attached to the column 601, and plates 621 and 623 are connected to the plate 619 so as to sandwich the wafer carrier 617 (FIG. 1), and a wafer detection sensor (light transmission type or light reflection) is connected to the plates 621 and 623. 625, 627 is attached. While moving the wafer carrier 617 up and down, the sensor 625, 627 detects the step position, the number, etc. of the wafer W.
[0012]
The transfer unit 700 includes a multi-axis movable arm 701, and an adsorption member 703 is provided at the distal end of the movable arm. The wafer W is placed on the movable arm 701 and is adsorbed and fixed by the adsorption member 703. The movable arm 701 can carry the wafer W within a range indicated by a chain line 705.
[0013]
3 is a view of the orientation flat alignment unit 800 viewed in the direction of arrow B in FIG. 1, and FIG. 4 is a plan view thereof. The orientation flat alignment part 800 detects an orientation flat (orientation flat) part as a reference part formed on the wafer W, and rotates the wafer W so that the orientation flat part is not located at an adhesive part of an adhesive tape described later. Perform positioning.
[0014]
Wafer W is placed on turntable 801 by movable arm 701. The turntable 801 includes a suction port, and holds the wafer W by suction. The turntable 801 is rotated by a motor 803 and moved up and down by a cylinder 805. Centering plates 807 are attached to both sides of the turntable 801, and the centering plate 807 can be moved in the direction of the turntable 801 by a cylinder 809. On the centering plate 807, a stepped portion 807a is formed according to the diameter of the wafer W.
[0015]
The wafer W transferred by the movable arm 701 is placed on the turntable 801, and the centering plate 807 moves toward the turntable 801 to center the wafer W. Thereafter, the turntable 801 rotates while adsorbing the wafer W. A light transmission type or light reflection type sensor 811 is arranged across the wafer W. The sensor 811 detects the orientation flat part of the wafer W, and after the sensor 811 detects the orientation flat part, it rotates by a predetermined angle to turn the turntable 801. Stop it. Thereby, the wafer W is positioned so that the orientation flat part is not located at the adhesive part of the adhesive tape. That is, when the tape is bonded to the sheet by the heater cutter unit 500 (FIG. 13), which will be described later, the orientation flat portion is prevented from coming on the bonded portion so that the adhesive tape is securely bonded to the sheet.
[0016]
Above the turntable 801, a wafer holding arm 813 for adsorbing and holding the next wafer when positioning the wafer W is arranged. After the wafer holding arm 813 adsorbs and holds the wafer W, The apparatus waits at a position corresponding to the size of the wafer W (indicated by chain lines 813a and 813b in FIG. 4).
[0017]
FIG. 5 is a view of the UV irradiation unit 900 as viewed in the direction of arrow C in FIG. 1. An L-shaped opening 903 is formed at the corner 901, and the wafer W is moved from the opening 903 by the movable arm 701. Carry in along line 707 in FIG. The opening 903 is opened and closed by an L-shaped lid 905, and the lid 905 is driven by a cylinder 907. Wafer W is adsorbed on table 909. A UV lamp chamber 911 is installed in the center of the UV irradiation unit 900, and a UV lamp 913 is mounted therein. A shutter 917 that is opened and closed by a cylinder 915 is disposed below the UV lamp 913. Although not shown, the air in the UV lamp chamber 911 is forcibly exhausted through the duct 919 by exhaust power.
[0018]
When the wafer W is placed on the table 909 so that the UV light of the UV lamp 913 hits the adhesive surface of the protective sheet of the wafer W, the shutter 917 opens, and the table 909 sucks and holds the wafer W by the sucking means 909a. The left side of the wafer W is irradiated with ultraviolet rays on the adhesive surface of the protective sheet of the wafer W. After completion of irradiation, the table 909 returns to the corner 901 again, the suction unit 909a is released, and the wafer W is unloaded by the movable arm 701. The unloaded wafer W is transferred to the peeling unit 950 along the line 709 in FIG. Details of the peeling portion 950 will be described later.
[0019]
In addition, when using protective sheets other than a UV curable protective sheet, the UV irradiation part 900 does not need to be provided.
[0020]
Next, the overall operation flow of the protective sheet peeling apparatus will be described.
(1) A wafer carrier 617 is placed on the table 607 of the wafer supply unit 600 manually or by an automatic transfer machine.
(2) The table 607 moves up and down by driving the motor 615, and the sensor 625 and 627 detect the step position, the number of sheets, and the like of the wafer W in the wafer carrier 617.
(3) The wafers W are taken out one by one from the uppermost stage of the wafer carrier 617 by the movable arm 701 and transferred to the orientation flat alignment unit 800. The table 607 is raised, the wafer carrier 617 is raised by one stage, and the movable arm 701 takes out the next wafer W.
(4) In the orientation flat alignment unit 800, the centering of the wafer W is performed by the centering plate 807, and the wafer W is sucked and rotated by the turntable 801. In the meantime, the movable arm 701 takes out the next wafer W from the wafer carrier 617, transfers it to the wafer holding arm 813, and keeps it waiting.
(5) The wafer W is rotated while being sucked and held by the turntable 801, and the orientation flat portion is detected by the sensor 811. After the detection, the wafer W is rotated by a predetermined angle and positioned while being sucked and held.
(6) After positioning the wafer W, the movable arm 701 moves the wafer W to the UV irradiation unit 900.
(7) After UV irradiation, the movable arm transports the wafer W to the sheet peeling unit 950, and the sheet peeling unit 950 peels the protective sheet.
(8) After peeling, the movable arm 701 carries the wafer W out of the sheet peeling unit 950 and stores it in a predetermined stage of the wafer carrier 617.
(9) The same processing is performed for the next wafer, and when all the wafers in the wafer carrier 617 have been peeled off, the wafer carrier is transported to the next process manually or by an automatic transporter. In the case where a protective sheet other than the UV curable protective sheet is used, movement to the UV irradiation unit 900, UV irradiation, and the like are unnecessary in the above description.
[0021]
In this way, the sheet such as the protective sheet can be peeled off from the plate-like member without damaging the plate-like member such as the wafer, and the adhesive tape adhesive portion on the reference portion (orientation flat, V-notch, etc.) of the wafer. Is not located, the adhesive tape can be securely bonded to the protective sheet, and the protective sheet can be peeled off.
[0022]
In the above example, the movable arm is used as the wafer transfer means, but other transfer means may be used. Further, the arrangement of each part is not limited to the above example. When using a UV curable protective sheet, if the wafer supply unit, orientation flat alignment unit, and UV irradiation unit are arranged in this order, it is efficient if the positioning of the wafer W is performed during the relatively long UV irradiation, The number of wafers processed can be increased.
[0023]
Next, the sheet peeling part 950 will be described in detail.
6 is a front view of the sheet peeling portion 950, FIG. 7 is a side view, and FIG. 8 is a plan view. The sheet peeling unit 950 includes a table 100, a table unit 200, a tape feeding unit 300, a peeling head unit 400, and a heater cutter unit 500.
[0024]
First, the outline of the sheet peeling unit 950 will be described. A wafer to which a protective sheet is attached is conveyed by the table unit 200. On the other hand, the adhesive tape T is fed out from the tape feeding unit 300 and pulled out by the peeling head unit 400. The adhesive tape T is thermocompression bonded to the end portion of the protective sheet by the heater cutter unit 500 and cut into a predetermined length. Next, the peeling head unit 400 holds and pulls the adhesive tape T to peel off the protective sheet from the wafer. Details of each part will be described below.
[0025]
The table unit 200 includes two guide rails 201 installed on the table 100 and a table 203 placed on the guide rail 201. The table 203 is movable on the guide rail 201 in the X-axis direction shown in the figure. On the base 100, a belt 209 is hung between pulleys 205 and 207, and the pulley 205 is rotated by a motor 211. The belt 209 is connected to the table 203 by a connector 213, and the table 203 moves on the guide rail 201 by the rotation of the motor 211.
[0026]
An elevating table 217 that is moved up and down by a cylinder 215 is disposed at the center of the table 203. The table 203 is formed with a plurality of annular suction grooves 219 concentrically with the lifting table 217 in accordance with the diameter of the wafer. Each suction groove 219 has a plurality of suction openings, and a negative pressure is applied to these suction openings. The wafer is sucked and held. When picking up the wafer from the table 203, after the suction is released, the cylinder 215 is driven to raise the elevating table 217.
[0027]
As the adhesive tape T, a heat-sensitive adhesive tape in which a heat-sensitive adhesive layer is provided on a heat-resistant film such as a polyethylene terephthalate film is used here, but a heat-sensitive adhesive tape having a heat-sensitive adhesive property on the substrate itself is used. May be. The adhesive tape T is set on the reel 301 and sent to the tape feeding unit 300. A spring 302 (FIG. 7) is attached to the rotation shaft of the reel 301, whereby a frictional force is applied to the rotation shaft of the reel 301 via a friction plate.
[0028]
As shown in FIG. 10, the tape feeding unit 300 includes a pinch roller 303 and a tension roller 305 that are in pressure contact with each other, and a guide roller 307 and a pinch roller 308. A tape receiving plate 309 is attached to the ball bush 311 by a shaft 310 at the lower end of the tape feeding unit 300. The tape receiving plate 309 is movable in the X-axis direction, and is always urged by the spring 313 in the protruding direction (left direction in FIG. 10).
[0029]
The adhesive tape T is unwound from the reel 301 and sandwiched between the pinch roller 308 and the guide roller 307, then changed in direction by the guide roller 307, and further sandwiched between the pinch roller 303 and the tension roller 305. It is sent to the receiving plate 309 and is pressed by the tape pressing plate 315 on the tape receiving plate 309. A cutter groove 309 a is formed at the front end of the tape pressing plate 315. The tape pressing plate 315 is driven by a cylinder 317. Further, a timing belt 321 is hung from the timing pulley 319 to the tension roller 305, and the timing pulley 319 is driven by a motor 323 (FIG. 8). The tension roller 305 is rotated in a direction opposite to the feeding direction of the adhesive tape T, and tension (back tension) in the direction opposite to the feeding direction is applied to the adhesive tape T.
[0030]
A tape pressing guide 306 is attached to the rear side of the tension roller 305 (the right side in FIG. 10) to prevent the adhesive tape T on the tape receiving plate 309 from moving backward.
[0031]
The tape supply unit 300 is movable in the vertical direction (Z-axis direction shown in the figure). That is, as shown in FIG. 7, the substrate 101 is installed on the base unit 100, and the tape feeding unit 300 moves in the Z-axis direction by the cylinder 325 fixed on the substrate 101.
[0032]
As shown in FIG. 7, the peeling head unit 400 includes a peeling head 401 and an arm 403 that supports the peeling head, and the arm 403 is attached to a guide 405 so as to be movable in the X-axis direction. The arm 403 is driven by a motor 407 installed at an end of the guide 405 via a power transmission mechanism (not shown). The guide 405 is attached on the base 100 by a support plate 409.
[0033]
The peeling head 401 includes a tape chuck 412 including an upper jaw 411 and a lower jaw 413, and the tape chuck 412 is opened and closed by moving the upper jaw 411 up and down with a cylinder 415. A tape detection sensor 417 (for example, a photoelectric sensor or the like, see FIG. 10) for detecting whether or not the adhesive tape T is present in the tape chuck 412 is attached to the peeling head 401.
[0034]
Next, the heater cutter unit 500 will be described. FIG. 9A is an enlarged plan view of the heater cutter portion, and FIG. 9B is a side view. FIG. 13 is a front view of the heater cutter unit 500. A rod-shaped heater 503 is embedded in the heater block 501, and a heater tool 505 is fixed to the lower end of the heater block 501 with a screw 507. Concave portions as shown in FIG. 9B are formed at the lower end of the heater tool 505 so as to locally apply heat. Further, the heater tool 505 can be replaced, and a tool having a different shape can be used according to the size of the wafer and the curvature of the wafer outer periphery. The heater block 501 is attached to the frame 508 so as to freely move up and down (in the Z-axis direction in the figure) by two guide rods 506 and is moved up and down by a heater upper and lower cylinder 509 fixed to the frame 508.
[0035]
Two plate-like tape pressing guides 511 are attached to the frame 508 so as to sandwich the heater block 501 from the front and rear (X-axis direction). The tape pressing guide 511 is made of a heat insulating member such as a polyimide resin or a polyether ether ketone resin. The upper end of the tape pressing guide 511 is fixed to the frame 508, the lower end is formed round, and is free to press the adhesive tape T. A cutter moving cylinder 513 is attached to the side surface of one tape press guide 511 (FIG. 9A), and a cutter blade 515 is attached to the piston tip of the cylinder 513. The cutter blade 515 is driven by the cylinder 513. Reciprocates in the Y-axis direction. A plate-like tape presser 517 is disposed below the cylinder 513, and a slit 517 a through which the cutter blade 515 passes is formed in the tape presser 517.
[0036]
The heater cutter unit 500 is movable in the vertical direction (Z-axis direction). That is, the heater cutter unit 500 is moved in the Z-axis direction by the cylinder 519 (FIG. 8) attached to the substrate 101.
[0037]
Next, the operation of the sheet peeling unit 950 will be described in steps 1 to 8 separately.
[0038]
(Step 1: Wafer set)
The wafer W is set on the table 203 by the movable arm 701. The wafer W is placed in accordance with a suction groove 219 of a corresponding size on the table 203, and then a vacuum device (not shown) is operated to suck the wafer W. The table 203 is directly under the tape feeding unit 300. Move (FIG. 10).
[0039]
In the tape feeding unit 300, the adhesive tape T is placed in advance on the guide roller 307, the pinch roller 303, and the tension roller 305 in advance, and the vicinity of the tip of the adhesive tape T is held by the tape presser 315 and the tape receiving plate 309. . The tension roller 305 is driven, and an appropriate back tension is applied to the adhesive tape T.
[0040]
At this time, the tape chuck 412 of the peeling head unit 400 is open. Then, the peeling head unit 400 moves toward the tape feeding unit 300 in the X-axis direction. The movement of the peeling head unit 400 may be performed simultaneously with the movement of the table 203.
[0041]
(Step 2: Grip the tip of the adhesive tape)
As shown in FIG. 11, the peeling head unit 400 pushes the tape receiving plate 309, whereby the tape receiving plate 309 is retracted, and the tip of the adhesive tape T is inserted into the opening of the tape chuck 412. At this time, since the adhesive tape T is sandwiched between the tension roller 305 and the pinch roller 303 and is further pressed backward by the tape pressing guide 306, only the tape receiving plate 309 is retracted and attached to the tape receiving plate 309. The tip of the adhesive tape T is securely inserted into the opening of the tape chuck 412. When the tip of the adhesive tape T is detected by the sensor 417, the tape chuck 412 is closed and the tip of the adhesive tape T is gripped. Next, the back tension by the tension roller 305 is released, and the tape presser 315 is lifted away from the adhesive tape T.
[0042]
(Step 3: Pull out adhesive tape)
As shown in FIG. 12, the peeling head unit 400 is moved away from the tape feeding unit 300 along the X-axis direction, and the adhesive tape T is pulled out. At this time, the tension roller 305 is activated to apply back tension.
[0043]
(Step 4: Tape thermocompression bonding and cutting)
As shown in FIG. 13, the heater cutter unit 500 is lowered, and the tape pressing guide 511 pushes down the adhesive tape T to the vicinity of the wafer W. The adhesive tape T is pressed by the tape pressers 517 and 315 on the tape receiving plate 309. Thereafter, the heater upper / lower cylinder 509 is driven, and the heater tool 505 presses the adhesive tape T against the protective sheet F at the tip of the wafer W for several seconds, and the adhesive tape T is thermocompression bonded to the protective sheet. At this time, the position of the table 203 is adjusted according to the size of the wafer W. The table 203 only needs to be moved to just below the heater cutter unit 500 before the thermocompression bonding of the adhesive tape T. Subsequently, the cutter blade 515 moves in the Y-axis direction, and the adhesive tape T is cut to a predetermined length.
[0044]
(Step 5: Tape feed and heater cutter rise)
As shown in FIG. 14, the tape feeding unit 300 and the heater cutter unit 500 are raised. As shown in the figure, the adhesion point P between the adhesive tape T and the protective sheet F is in the vicinity of the edge of the wafer W. For example, the distance d from the edge of the wafer W is within 3 mm.
[0045]
(Step 6: Protective sheet peeling)
As shown in FIG. 15, the peeling head 400 is moved to the right in the figure by the motor 407, and the table 203 is moved to the left in the figure by the motor 211, and the protective sheet F is held and pulled by the peeling head 400. . At this time, it is desirable that the holding position by the peeling head 400 is as close as possible to the protective sheet F and the pulling direction is horizontal. As a result, the stress applied to the wafer W can be minimized, and the adsorption between the wafer W and the table 203 is difficult to come off. Since the table 203 also moves in the opposite direction simultaneously with the movement of the peeling head 400, the peeling operation is completed in a short time.
[0046]
(Step 7: Protective sheet disposal)
As shown in FIG. 16, when the peeling head 400 moves to a predetermined position, the tape chuck 412 is opened, and the adhesive tape T and the protective sheet F are dropped onto the disposal box 103 accommodated in the table 100. At this time, high-pressure air may be blown from above.
[0047]
(Step 8: Wafer removal)
When the table 203 returns to the initial position, the lift table 217 is raised, and then the wafer W is taken out. This extraction is performed by the movable arm 701.
[0048]
As described above, since the adhesive tape T is bonded to the end portion of the protective sheet F, the wafer can be prevented from cracking without pressing the wafer with a press roller as in the prior art, and the wafer has a large outer diameter. It is possible to cope with the reduction in thickness and the thickness of the wafer. As described above, the adhesive tape is not particularly limited as long as it can adhere to the protective sheet at the edge of the wafer, and a heat-sensitive adhesive tape is preferably used. Adhesive tape can also be used.
[0049]
If a heat-sensitive adhesive tape is used as the adhesive tape T, only a part of the protective sheet F is thermocompression bonded, so that it is possible to prevent wafer cracking without pressing the wafer with a press roller as in the prior art. it can. In addition, when using adhesive tape, if abrasive scraps, cutting scraps or water adheres to the surface of the protective sheet, the adhesiveness with the adhesive tape will deteriorate, so the protective tape may not be removed with a single pull. Or the surface of the protective tape had to be cleaned. However, if a heat-sensitive adhesive tape is used, adhesion is possible even if dust or water adheres to the surface. Moreover, since the heat-sensitive adhesive tape is not sticky at room temperature, it is easy to handle such that surface processing of the transport roller is unnecessary and a release sheet is unnecessary. In addition, an inexpensive material such as a heat seal material can be used as the material, and since the adhesive force is strong, the amount of use can be reduced, saving resources and cost.
[0050]
Furthermore, if the edge of the protective sheet is bonded and a heat-sensitive adhesive tape is used as in the above device, the wafer edge is generally not formed with an electronic circuit. There is an advantage that the heat-sensitive adhesive tape can be easily used.
[0051]
In the above apparatus, the cutter blade is provided as a cutting means for cutting the adhesive tape into a predetermined length, but various cutting means can be used without being limited thereto. Further, this cutting means need not be provided in the above apparatus. For example, if an adhesive tape having an appropriate length is used from the beginning, the protective sheet can be peeled off without being cut by bonding the adhesive tape to the end of the protective sheet F and pulling it as it is.
[0052]
【The invention's effect】
As described above, according to the present invention, a sheet can be peeled without damaging a plate-like member such as a wafer.
[Brief description of the drawings]
FIG. 1 is a plan view of a protective sheet peeling apparatus showing an example of the present invention.
FIG. 2 is a view of a wafer supply unit as seen in the direction of arrow A in FIG.
FIG. 3 is a view of the orientation flat alignment unit as seen in the direction of arrow B in FIG.
FIG. 4 is a plan view of an orientation flat alignment unit.
FIG. 5 is a view of a UV irradiation unit viewed in the direction of arrow C in FIG.
FIG. 6 is a front view of a sheet peeling portion.
FIG. 7 is a side view of a sheet peeling portion.
FIG. 8 is a plan view of a sheet peeling portion.
FIG. 9 is a plan view and a side view of a heater cutter unit.
FIG. 10 is a diagram illustrating the operation of a sheet peeling unit.
FIG. 11 is a diagram illustrating the operation of a sheet peeling unit.
FIG. 12 is a diagram illustrating the operation of a sheet peeling unit.
FIG. 13 is a diagram illustrating the operation of a sheet peeling unit.
FIG. 14 is a diagram illustrating the operation of a sheet peeling unit.
FIG. 15 is a diagram illustrating the operation of the sheet peeling unit.
FIG. 16 is a diagram illustrating the operation of a sheet peeling unit.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 100 Stand part 200 Table part 300 Tape feeding part 400 Stripping head part 500 Heater cutter part 505 Heater tool 515 Cutter blade 600 Wafer supply part 700 Wafer conveyance part 800 Orientation flat alignment part 900 UV irradiation part 950 Sheet peeling part W Semiconductor wafer F Protective sheet T Adhesive tape

Claims (4)

  1. Detection means for detecting a position of a reference portion for positioning in the rotation direction of the plate-like member formed on the plate-like member, and positioning the plate-like member so that the reference portion is not located at the adhesive portion of the adhesive tape. Positioning means, adhesive means for bonding the adhesive tape by heating with a heater at the end of the sheet affixed to the plate-like member, and peeling means for peeling the sheet by pulling the adhesive tape The sheet peeling apparatus characterized in that the heater adheres the adhesive tape to the sheet substantially only by the contact / separation operation with respect to the adhesive tape .
  2.  The sheet peeling apparatus according to claim 1, wherein the adhesive tape is a heat-sensitive adhesive tape.
  3. In the sheet peeling method for peeling a sheet affixed to a plate-shaped member using an adhesive tape, the position of a reference portion formed on the plate-shaped member for positioning in the rotation direction of the plate-shaped member is detected, and the bonding A sheet peeling method in which a tape is bonded to an end portion of the sheet other than the reference portion by heating with a heater and the sheet is peeled by pulling the adhesive tape , wherein the heater is substantially the adhesive tape. The sheet peeling method characterized by adhering the adhesive tape to the sheet only by the contact / separation operation with respect to the sheet.
  4.   The sheet peeling method according to claim 3, wherein an ultraviolet curable sheet is used as the sheet, and the sheet is irradiated with ultraviolet rays before peeling the sheet.
JP34189597A 1997-11-28 1997-11-28 Sheet peeling apparatus and method Expired - Lifetime JP4204658B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34189597A JP4204658B2 (en) 1997-11-28 1997-11-28 Sheet peeling apparatus and method

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP34189597A JP4204658B2 (en) 1997-11-28 1997-11-28 Sheet peeling apparatus and method
US09/090,762 US6149758A (en) 1997-06-20 1998-06-04 Sheet removing apparatus and method
PT98110700T PT886299E (en) 1997-06-20 1998-06-10 Device and process for replacing sheets
EP19980110700 EP0886299B1 (en) 1997-06-20 1998-06-10 Sheet removing apparatus and method
DE1998633237 DE69833237T2 (en) 1997-06-20 1998-06-10 Cover film receiving device and method
SG1998001412A SG75851A1 (en) 1997-06-20 1998-06-13 Sheet removing apparatus and method
TW87109740A TW396366B (en) 1997-06-20 1998-06-18 Sheet removing apparatus and method
KR10-1998-0023135A KR100507259B1 (en) 1997-06-20 1998-06-19 Sheet removing apparatus and method
CN98114924A CN1089946C (en) 1997-06-20 1998-06-19 Sheet removing apparatus and method

Publications (2)

Publication Number Publication Date
JPH11163105A JPH11163105A (en) 1999-06-18
JP4204658B2 true JP4204658B2 (en) 2009-01-07

Family

ID=18349580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34189597A Expired - Lifetime JP4204658B2 (en) 1997-11-28 1997-11-28 Sheet peeling apparatus and method

Country Status (1)

Country Link
JP (1) JP4204658B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3560823B2 (en) * 1998-08-18 2004-09-02 リンテック株式会社 Wafer transfer device
FR2798513B1 (en) * 1999-09-10 2002-03-22 Gemplus Card Int Method for the transfer of microplates of integrated circuit and device used
JP4166920B2 (en) 2000-02-24 2008-10-15 リンテック株式会社 Sheet peeling apparatus and method
JP2006316078A (en) * 2003-10-17 2006-11-24 Lintec Corp Method and apparatus for peeling adhesive tape
JP4795743B2 (en) * 2005-05-19 2011-10-19 リンテック株式会社 Pasting device
JP5113621B2 (en) * 2008-05-14 2013-01-09 リンテック株式会社 Sheet peeling apparatus and peeling method
JP5317280B2 (en) * 2009-07-16 2013-10-16 株式会社タカトリ Protective tape peeling device

Also Published As

Publication number Publication date
JPH11163105A (en) 1999-06-18

Similar Documents

Publication Publication Date Title
US7078262B2 (en) Semiconductor wafer transport method and semiconductor wafer transport apparatus using the same
US7455095B2 (en) Protective tape separation method, and apparatus using the same
TWI291723B (en) Protective tape applying and separating method
US7849900B2 (en) Apparatus for joining a separating adhesive tape
JP3447518B2 (en) Adhesive sheet sticking apparatus and method
KR101049024B1 (en) Protective Tape Bonding Method and Bonding Device to Semiconductor Wafer
KR100868142B1 (en) Protective tape applying method and apparatus, and protective tape separating method
EP0318806B1 (en) Process for peeling protective film off a wafer
TW559880B (en) Method and apparatus for peeling protective sheet
CN1089946C (en) Sheet removing apparatus and method
JP3504543B2 (en) Semiconductor device separation method and device, and semiconductor device mounting method
KR101278465B1 (en) Adhering apparatus
US4775438A (en) Process for peeling protective film off a thin article
JP4509666B2 (en) Sheet peeling apparatus and peeling method
KR100901934B1 (en) Method of cutting a protective tape and protective tape applying apparatus using the same method
KR101212365B1 (en) Support board separating apparatus, and support board separating method using the same
JP4187065B2 (en) Adhesive tape application method and apparatus
TWI305663B (en) Protective tape applying and separating method
US6689245B2 (en) Die bonding sheet sticking apparatus and method of sticking die bonding sheet
US7896047B2 (en) Semiconductor wafer mount apparatus
KR100639587B1 (en) Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same
JP2005150177A (en) Method and device for sticking adhesive tape on rear of semiconductor wafer
JP4417028B2 (en) Device for attaching dicing tape to dicing frame
JP3737118B2 (en) Method and apparatus for peeling protective adhesive tape of semiconductor wafer
JP5547954B2 (en) Adhesive tape peeling method and apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040826

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071009

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071204

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080806

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080916

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20081014

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20081015

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111024

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111024

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121024

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121024

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131024

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term