FR2798513B1 - METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED - Google Patents

METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED

Info

Publication number
FR2798513B1
FR2798513B1 FR9911556A FR9911556A FR2798513B1 FR 2798513 B1 FR2798513 B1 FR 2798513B1 FR 9911556 A FR9911556 A FR 9911556A FR 9911556 A FR9911556 A FR 9911556A FR 2798513 B1 FR2798513 B1 FR 2798513B1
Authority
FR
France
Prior art keywords
microplates
transfer
integrated circuit
device used
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9911556A
Other languages
French (fr)
Other versions
FR2798513A1 (en
Inventor
Bernard Calvas
Olivier Brunet
Philippe Patrice
Didier Elbaz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9911556A priority Critical patent/FR2798513B1/en
Priority to PCT/FR2000/002379 priority patent/WO2001020659A1/en
Priority to AU70170/00A priority patent/AU7017000A/en
Publication of FR2798513A1 publication Critical patent/FR2798513A1/en
Application granted granted Critical
Publication of FR2798513B1 publication Critical patent/FR2798513B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR9911556A 1999-09-10 1999-09-10 METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED Expired - Fee Related FR2798513B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9911556A FR2798513B1 (en) 1999-09-10 1999-09-10 METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED
PCT/FR2000/002379 WO2001020659A1 (en) 1999-09-10 2000-08-25 Method for transferring integrated circuit microchips and implementing device
AU70170/00A AU7017000A (en) 1999-09-10 2000-08-25 Method for transferring integrated circuit microchips and implementing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9911556A FR2798513B1 (en) 1999-09-10 1999-09-10 METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED

Publications (2)

Publication Number Publication Date
FR2798513A1 FR2798513A1 (en) 2001-03-16
FR2798513B1 true FR2798513B1 (en) 2002-03-22

Family

ID=9549888

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9911556A Expired - Fee Related FR2798513B1 (en) 1999-09-10 1999-09-10 METHOD FOR THE TRANSFER OF MICROPLATES OF INTEGRATED CIRCUIT AND DEVICE USED

Country Status (3)

Country Link
AU (1) AU7017000A (en)
FR (1) FR2798513B1 (en)
WO (1) WO2001020659A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014956A (en) * 2002-06-11 2004-01-15 Shinko Electric Ind Co Ltd Work processing method of micro semiconductor device
SG147330A1 (en) 2007-04-19 2008-11-28 Micron Technology Inc Semiconductor workpiece carriers and methods for processing semiconductor workpieces

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851530A (en) * 1981-09-22 1983-03-26 Toshiba Corp Apparatus and method of arranging semiconductor pellet
US4627787A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Chip selection in automatic assembly of integrated circuit
CA2031776A1 (en) * 1989-12-08 1991-06-09 Masanori Nishiguchi Pickup method and the pickup apparatus for chip-type part
US5270260A (en) * 1990-08-23 1993-12-14 Siemens Aktiengesellschaft Method and apparatus for connecting a semiconductor chip to a carrier system
JP4204658B2 (en) * 1997-11-28 2009-01-07 リンテック株式会社 Sheet peeling apparatus and method

Also Published As

Publication number Publication date
FR2798513A1 (en) 2001-03-16
AU7017000A (en) 2001-04-17
WO2001020659A1 (en) 2001-03-22

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100531