JP4311522B2 - Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method - Google Patents

Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method Download PDF

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Publication number
JP4311522B2
JP4311522B2 JP2002061900A JP2002061900A JP4311522B2 JP 4311522 B2 JP4311522 B2 JP 4311522B2 JP 2002061900 A JP2002061900 A JP 2002061900A JP 2002061900 A JP2002061900 A JP 2002061900A JP 4311522 B2 JP4311522 B2 JP 4311522B2
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Japan
Prior art keywords
sheet
substrate
adhesive sheet
wafer
original
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Expired - Fee Related
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JP2002061900A
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Japanese (ja)
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JP2003257898A (en
Inventor
雅之 山本
弘信 浮網
啓吾 船越
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日東電工株式会社
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Priority to JP2002061900A priority Critical patent/JP4311522B2/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/6839Separation by peeling using peeling wedge or knife or bar

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for attaching an adhesive sheet on a thin plate substrate such as a semiconductor wafer.
[0002]
[Prior art]
Conventionally, as this type of apparatus, there is one as shown in Japanese Patent Laid-Open No. 10-112494.
Specifically, an original sheet composed of an adhesive sheet and a release sheet (cover sheet) is supplied from the original fabric roll toward the substrate. In this supply process, the release sheet is peeled off from the adhesive sheet, and only the adhesive sheet is supplied to a semiconductor wafer (hereinafter simply referred to as “wafer”) as a substrate to be pasted, and is heated in advance by a heating means. The adhesive sheet is affixed to the substrate while being pressed by the affixing roller. The adhesive sheet adhered to the wafer is cut along the periphery of the wafer by a cutting means. The wafer with the adhesive sheet attached is placed in the center of the ring-shaped frame, a dicing tape is applied from the back side, the ring-shaped frame and the wafer are integrated, and the protective tape on the surface is peeled off. After that, it is cut into individual chips in a dicing process.
[0003]
Each cut chip is conveyed to the die bonding process, and is sucked and held from the surface, and is pressed against the mounting substrate with the lower surface of the chip, that is, the surface to which the adhesive sheet is bonded, facing the electrode portion on the mounting substrate. It is placed at a position of a predetermined electrode on the mounting substrate. Therefore, the chip is fixed to the mounting substrate by the adhesive sheet adhered to the back surface of the chip.
[0004]
[Problems to be solved by the invention]
However, the conventional example having such a configuration has the following problems.
The adhesive sheet itself is very thin, and the adhesive sheet stretches with a little pressing force and wrinkles are generated. That is, when only the adhesive sheet is attached to the back surface of the wafer, wrinkles are generated by the adhesive sheet being stretched by the application roller, and air bubbles are entrained between the wafer and the adhesive sheet.
[0005]
In such a state, when the wafer is integrated with the ring-shaped frame R via the dicing tape DT and cut into individual chips in the dicing process, as shown in FIG. The adhesive sheet T1 is not bonded to the chip 70. Therefore, when the chip 70 is picked up from, for example, the dicing tape DT and die-bonded to the lead frame, there is a problem that adhesion failure occurs.
[0006]
In addition, the thin adhesive sheet has low rigidity and is bent with a slight pressing force, so that it is difficult to cut, and there is a problem that it cannot be cut accurately along the periphery of the wafer.
[0007]
The present invention has been made in view of such circumstances, and has as its main object to provide an adhesive sheet attaching method and apparatus for attaching an adhesive sheet to a substrate with high accuracy, and a semiconductor wafer processing method.
[0008]
[Means for Solving the Problems]
  In order to achieve such an object, the present invention has the following configuration.
  That is, the invention according to claim 1 is an original sheet in a state where the adhesive sheet and the cover sheet are overlapped.Supplying onto the substrate placed and held on the holding means, while pressing and rolling the sticking roller on the original sheetPasting process to paste,
  Transported from the pasting processThe original sheetHold the non-stick surface of the attached substrate with the holding means, and sandwich the substrate between the heating plate and the holding table from above the cover sheetA heating and bonding process of heating and bonding the adhesive sheet to the substrate;
  It is characterized by comprising.
[0009]
(Operation / Effect) After the original sheet in a state where the adhesive sheet and the cover sheet are superposed is attached to the substrate, it is heated to adhere the adhesive sheet to the substrate. That is, since the original sheet in a state where the adhesive sheet and the cover sheet are superimposed is attached to the substrate, the cover sheet acts as a support material. Therefore, since the original sheet has rigidity, it is possible to avoid the occurrence of wrinkles due to the expansion of the adhesive sheet alone when the original sheet is stuck, and consequently the adhesion failure of the adhesive sheet due to the air entrained between the adhesive sheet and the substrate due to the generation of wrinkles Can be avoided.
[0010]
  In addition, since the original sheet having rigidity in a state where the adhesive sheet and the cover sheet are overlapped is handled, the adhesive sheet can be easily and accurately cut.
  Further, by heating from above the cover sheet and bonding the adhesive sheet to the substrate, the heat transfer efficiency to the adhesive sheet is good, and the adhesive sheet can be bonded to the substrate with higher accuracy. In addition, it is a case where an adhesive sheet is pasted on the back surface of a substrate (wafer) on which a protective tape is previously pasted as in the conventional method, and the adhesive sheet is heated while being heated by a heating means from the front side of the protective tape. When sticking to the back surface, it can be avoided that the adhesive of the protective tape melts and adheres to the heating means.
[0011]
The invention described in claim 2 is characterized in that, in the adhesive sheet sticking method according to claim 1, a peeling process for peeling the cover sheet from the adhesive sheet bonded to the substrate is provided.
[0012]
(Action / Effect)
After the adhesive sheet is heated and bonded to the substrate, the cover sheet is peeled from the adhesive sheet. Therefore, the board | substrate with which the adhesive sheet was adhere | attached accurately without involving air between a board | substrate and an adhesive sheet can be conveyed after the following process.
[0013]
The invention according to claim 3 is the adhesive sheet sticking method according to claim 1 or claim 2, wherein the original sheet is a belt-like sheet in which the adhesive sheet and the cover sheet are overlapped. And a cutting process of cutting the original sheet along the periphery of the substrate after the strip-shaped original sheet is attached to the substrate.
[0014]
According to a fourth aspect of the present invention, in the adhesive sheet attaching method according to the first or second aspect, the original sheet is preliminarily formed according to the shape of the substrate in a state where the adhesive sheet and the cover sheet are overlapped. The original sheet is affixed to a substrate.
[0015]
(Operation / Effect) A belt-shaped original sheet in which the adhesive sheet and the cover sheet are overlapped (Claim 3), or the substrate in advance in a state in which the adhesive sheet and the cover sheet provided on the base material are overlapped. The method of Claim 1 or Claim 2 can be suitably implemented by affixing the original sheet (Claim 4) cut | judged according to the shape to a board | substrate.
[0018]
  The invention according to claim 5 is an adhesive sheet sticking device for sticking an adhesive sheet to a substrate,
  Holding means for placing and holding the substrate;
  An original sheet supply means for supplying a belt-shaped original sheet in which an adhesive sheet and a cover sheet are superposed toward the substrate held by the holding means;
  Affixing means for affixing to the substrate while pressing and rolling the affixing roller on the supplied strip-shaped original sheet,
  Cutting means for cutting the strip-shaped original sheet attached to the substrate along the periphery of the substrate;
  An unnecessary sheet collecting means for collecting an unnecessary original sheet after cutting;
  The original seaIs pastedHolding means for holding in contact with the non-sticking surface of the original sheet of the substrate that is attached and conveyed;
  A plate-shaped heat bonding means for sandwiching the substrate held by the holding means and heating the cover sheet to bond the adhesive sheet to the substrate;
  Peeling means for peeling the cover sheet from the adhesive sheet adhered to the substrate;
  Cover sheet collecting means for collecting the peeled cover sheet;
  It is characterized by comprising.
[0019]
(Operation / Effect) A band-shaped original sheet in a state where the adhesive sheet and the cover sheet are overlapped is supplied toward the substrate, and the original sheet is adhered to the substrate by the attaching means. This original sheet is cut along the periphery of the substrate by a cutting means. The cut original sheet is heated by the heating means, and the adhesive sheet adheres to the substrate. The cover sheet is peeled off from the adhesive sheet adhered to the substrate. Therefore, the method according to claim 3 can be suitably realized.
[0020]
  The invention according to claim 6 is an adhesive sheet attaching apparatus for attaching an adhesive sheet to a substrate,
  Holding means for placing and holding the substrate;
  An original sheet supply means for supplying an original sheet that has been cut in advance according to the shape of the substrate in a state where the adhesive sheet and the cover sheet are superposed on the substrate held by the holding means,
  Affixing means for affixing to the substrate while pressing and rolling the affixing roller on the supplied original sheet;
  The original seaIs pastedHolding means for holding in contact with the non-sticking surface of the original sheet of the substrate that is attached and conveyed;
  A plate-like heat bonding means for sandwiching the substrate held by the holding means and heating the cover sheet to bond the adhesive sheet to the substrate;
  Peeling means for peeling the cover sheet from the adhesive sheet adhered to the substrate;
  Cover sheet collecting means for collecting the peeled cover sheet;
  It is characterized by comprising.
[0021]
(Operation / Effect) An original sheet that has been preliminarily cut into the shape of the substrate in a state where the adhesive sheet and the cover sheet are overlapped is supplied toward the substrate. This original sheet is affixed to the substrate by an affixing means. The original sheet attached to the substrate is heated by the heating means, and the adhesive sheet adheres to the substrate. The cover sheet is peeled off from the adhesive sheet adhered to the substrate. Therefore, the method according to claim 4 can be suitably realized.
[0022]
  Claims7In the invention described in 1, the original sheet in a state where the adhesive sheet and the cover sheet are overlapped is used.Supplying onto the substrate placed and held on the holding means, while pressing and rolling the sticking roller on the original sheetA pasting process to be pasted on the back surface of the semiconductor wafer;
  Transported from the pasting processThe original sheetHold the original sheet non-sticking surface of the substrate with the holding means, and sandwich the semiconductor wafer between the heating plate and holding table from above the cover sheetA heating and bonding process of heating and bonding the adhesive sheet to the semiconductor wafer;
  Peeling process of peeling the cover sheet from the adhesive sheet bonded to the semiconductor wafer;
  Place the semiconductor wafer in the center of the ring-shaped frame with the back surface of the semiconductor wafer to which the adhesive sheet is bonded facing down, and attach the adhesive tape from the back surface of the ring-shaped frame to integrate the semiconductor wafer and the ring-shaped frame. Mounting process,
  A dicing process of cutting the semiconductor wafer integrated with the ring frame into individual chips;
  Bonding process for adhering and holding the cut chip, and bonding the chip to the mounting substrate with the back side to which the adhesive sheet is attached facing down;
  It is characterized by comprising.
[0023]
(Operation / Effect) After the original sheet in a state where the adhesive sheet and the cover sheet are superimposed on each other is attached to the back surface of the semiconductor wafer, it is heated to bond the adhesive sheet to the back surface of the semiconductor wafer. The cover sheet is peeled from the surface of the adhesive sheet bonded to the semiconductor wafer. The semiconductor wafer to which only the adhesive sheet is bonded is integrated with the ring frame in the mounting process. The semiconductor wafer integrated with the ring-shaped frame is cut into individual chips in the dicing process, and the chips are sucked and held and bonded to the mounting substrate.
[0024]
That is, since the original sheet in a state where the adhesive sheet and the cover sheet are superimposed is attached to the semiconductor wafer, the cover sheet acts as a support material. Therefore, since the original sheet has rigidity, it is possible to avoid the generation of wrinkles due to the expansion of the adhesive sheet alone when the original sheet is applied, and consequently the adhesion of the adhesive sheet by the air that is caught between the adhesive sheet and the semiconductor wafer due to the generation of wrinkles. Defects can be avoided. Therefore, since the adhesive sheet is securely bonded to each chip obtained by dicing the semiconductor wafer, bonding to the mounting substrate can be performed with high accuracy.
[0025]
  Claims8In the invention described in 1, the original sheet in a state where the adhesive sheet and the cover sheet are overlapped is used.Supplying onto the substrate placed and held on the holding means, while pressing and rolling the sticking roller from one end to the other end on the original sheetA pasting process to be pasted on the back surface of the semiconductor wafer;
  Transported from the pasting processThe original sheetHold the original sheet non-sticking surface of the substrate with the holding means, and sandwich the semiconductor wafer between the heating plate and holding table from above the cover sheetA heating and bonding process of heating and bonding the adhesive sheet to the semiconductor wafer;
  With the adhesive sheet and cover sheet overlapped, the semiconductor wafer is placed in the center of the ring frame with the back surface of the semiconductor wafer facing down, and an adhesive tape is attached from the back surface of the ring frame to the semiconductor wafer and the ring. Mounting process that integrates the frame,
  A dicing process of cutting the semiconductor wafer integrated with the ring frame into individual chips;
  Bonding process in which the cover sheet adsorbs and holds the cut chip while it is left on the adhesive sheet, and adheres the chip to the mounting substrate with the back surface to which the adhesive sheet is attached facing down
  It is characterized by comprising.
[0026]
(Operation / Effect) After the original sheet in a state where the adhesive sheet and the cover sheet are superimposed on each other is attached to the back surface of the semiconductor wafer, it is heated to bond the adhesive sheet to the back surface of the semiconductor wafer. The semiconductor wafer in a state where the cover sheet is adhered to the adhesive sheet is integrated with the ring-shaped frame by the adhesive tape with the cover sheet interposed in the mounting process. The semiconductor wafer integrated with the ring-shaped frame is cut into individual chips during the dicing process, and then the cover sheet is left on the adhesive tape, that is, the adhesive sheet only holds the chip adhered to the back surface. Bond to the mounting board.
[0027]
Therefore, the semiconductor wafer is in a state where the adhesive sheet and the cover sheet overlap each other, so that the cover sheet acts as a support material, the semiconductor wafer is bent during the transfer process, a transfer error due to the influence of the bend, and the semiconductor wafer itself. Defects can be avoided.
[0028]
In addition, since the semiconductor wafer is integrated with the ring-shaped frame via the adhesive sheet with the cover sheet remaining, it is possible to avoid adhesion of foreign matter to the surface of the adhesive sheet during the semiconductor wafer transfer process. Therefore, mounting (adhesion) defects on the mounting substrate during the bonding process can be avoided, and the chip can be bonded to the mounting substrate with higher accuracy.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
<First embodiment>
An adhesive sheet sticking apparatus of one embodiment used in the adhesive sheet sticking method of this embodiment will be described with reference to the drawings. In this embodiment, the original sheet in which the adhesive sheet and the cover sheet are overlapped is attached to the back surface of the semiconductor wafer (hereinafter simply referred to as “wafer”), and the adhesive sheet is adhered to the back surface of the wafer, A case where the sheet is peeled will be described as an example.
FIG. 1 is a plan view showing a schematic configuration of the adhesive sheet sticking apparatus, and FIG. 2 is a front view showing a schematic configuration of the adhesive sheet sticking apparatus.
[0030]
As shown in FIG. 1, the adhesive sheet sticking apparatus according to the embodiment includes a semiconductor wafer (hereinafter simply referred to as “wafer W”) in order from the base 1 and the left end on the front side (downward in FIG. 1) of the base 1. The first wafer supply unit 2 for loading the cassette C1 in which the wafer W is stored, the temporary stage 3 for temporarily placing the wafer W taken out from the cassette C1, and the case C2 in which the wafers W are stacked and loaded are loaded. A second wafer supply unit 5 and a wafer recovery unit 6 loaded with a case C3 for storing a processed wafer W bonded with an adhesive sheet. The temporary stage 3 and the second wafer supply unit 5 are provided. , And a first robot arm 7 that attracts and transports the wafer W in the alignment direction of the wafer recovery unit 6 is provided. A wafer transfer mechanism 9 having a second robot arm 10 is provided in the center of the base 1, an alignment stage 11 is provided on the right side thereof, and a heat bonding unit 24 is provided on the left side. Further, the original sheet pasting portion 12 is disposed on the right side of the base (upward in FIG. 1), and the cover sheet peeling portion 28 is disposed on the left side thereof.
[0031]
Hereinafter, the structure of each part is demonstrated concretely.
The first wafer supply unit 2 includes a cassette table that can be moved up and down, and cassettes C1 in which wafers W are stored in multiple stages at regular intervals are placed on the cassette table. At this time, the wafer W maintains a horizontal posture with the pattern surface facing upward.
[0032]
That is, the cassette C1 used in the present embodiment holds the back surface of the wafer W so that the wafer W thinly processed by the polishing process with the protective tape attached to the front surface is not bent by its own weight in the cassette C1. It is a shelf-type cassette provided with a holding member. The cassette C1 is not limited to this form, and may be any form that can maintain a horizontal posture in which the wafer W does not bend inside.
[0033]
The temporary stage 3 is provided with suction holes 4 (for example, four in FIG. 1) on the surface, and holds the wafer W by suction.
[0034]
The second wafer supply unit 5 includes a case base, and a case C2 in which wafers W to be processed are stacked and stored is placed on the case base.
[0035]
The wafer recovery unit 6 includes a case base, and a case C3 for storing the wafer W having an adhesive sheet bonded thereto is placed on the case base.
[0036]
The first robot arm 7 is configured to be movable while being held by a rail 8 provided in the alignment direction of the temporary placement stage 3, the second wafer supply unit 5, and the wafer collection unit 6, and can be moved up and down. Yes. In addition, a flat wafer holder is provided at the tip of the first robot arm 7. The wafer holder is provided with a suction hole (not shown), and the wafer W is vacuum-sucked from the surface.
[0037]
The shape of the wafer holding unit may be any shape that does not cause a suction failure when the wafer W is attracted and transported, for example, a horseshoe shape or substantially the same shape as the wafer W, Any shape that covers and covers the entire surface of the wafer W may be used.
[0038]
That is, the first robot arm 7 sucks and holds the wafer W placed on the temporary stage 3 and lifts it, takes out the wafer W to be processed from the case C2 of the second wafer supply unit 5, and holds and holds it. The wafer W is transferred to the wafer collecting unit 6.
[0039]
The wafer transfer mechanism 9 includes a second robot arm 10 and is configured to move up and down and turn by a drive mechanism (not shown).
[0040]
The second robot arm 10 is configured to be able to advance and retreat and reverse, and includes a flat-plate-shaped wafer holder at the tip. The wafer holding unit is provided with a suction hole (not shown), and vacuum sucks the wafer W. The shape of the wafer holding unit may be any shape that does not cause a suction failure when the wafer W is attracted and transported. For example, the shape of the wafer W is substantially the same as a horseshoe shape or the wafer W. Any shape that covers and covers the entire surface may be used.
[0041]
That is, the second robot arm 10 sucks and holds the surface of the wafer W (pattern surface with the protective tape attached) by moving the wafer holding unit forward and backward over the wafers W stored in multiple stages in the cassette C1. At the same time, the wafer W held by suction is conveyed in the order of the temporary placement stage 3, the alignment stage 11, the original sheet pasting part 12, the heat bonding part 24, and the cover sheet peeling part 28.
[0042]
The alignment stage 11 is configured to align the mounted wafer W. Specifically, centering of the wafer outer periphery is performed.
[0043]
As shown in FIG. 2, the original sheet pasting unit 12 includes an original sheet supply unit 13 that supplies the original sheet T in a state where the adhesive sheet T1 and the cover sheet T2 overlap each other, and an adsorption table 16 that adsorbs and places the wafer W thereon. An original sheet attaching mechanism 17 for attaching the original sheet T onto the wafer W, a cutter unit 19 for cutting the original sheet T attached to the wafer W along the periphery of the wafer W, and an unnecessary original sheet after cutting. An original sheet peeling mechanism 20 for peeling T and an original sheet collecting unit 22 for collecting the peeled unnecessary original sheet T are provided.
[0044]
The original sheet supply unit 13 guides the guide sheet 15 by winding the original sheet T in which the adhesive sheet T <b> 1 and the cover sheet T <b> 2 fed out from the bobbin 14 overlap each other. The bobbin 14 is pivotally supported by a vertical wall (not shown) and is restricted from rotating through a brake mechanism or the like. The original sheet supply unit 13 corresponds to the original sheet supply means of the present invention.
[0045]
Examples of the adhesive sheet T1 include a die bond film. Also. The adhesive applied or impregnated on the adhesive sheet T1 is preferably a thermoplastic resin having heat resistance. For example, polyimide adhesive, polyamide adhesive, fluorine adhesive, polyester adhesive, polyolefin adhesive, polyethylene adhesive, polyvinyl alcohol adhesive, polyvinyl butyral adhesive, vinyl acetate adhesive, Examples thereof include a vinyl chloride adhesive, a methacrylic adhesive, an acrylic adhesive, a styrene adhesive, a cellulose adhesive, and a vinyl ether adhesive.
[0046]
The suction table 16 sucks and holds the surface of the wafer W to which the protective tape is attached. Further, the suction table 16 includes a heater inside, and preheats the placed wafer W to facilitate the attachment of the original sheet T. The preheating temperature is, for example, 110 ° C., and is set to a temperature at which the adhesive material of the protective tape attached to the surface of the wafer W cannot be unwound. The suction table 16 corresponds to the holding means of the present invention.
[0047]
The original sheet sticking mechanism 17 is gripped by a rail of the apparatus main body so that the frame can slide in the traveling direction of the original sheet T, and is interlocked and connected via a drive unit such as a motor (not shown). An affixing roller 18 is rotatably supported on the frame, and the affixing roller 18 is driven to swing up and down by a cylinder (not shown). That is, the application roller 18 presses the surface of the original sheet T and rolls the original sheet T on the back surface of the wafer W while rolling. The original sheet sticking mechanism 17 corresponds to the sticking means of the present invention.
[0048]
The cutter unit 19 moves up and down over a standby position and a cutting action position that cuts the original sheet T by a lifting mechanism (not shown), and cuts the adhesive sheet T1 and the cover sheet T2 along the periphery of the wafer W. The cutter unit 19 corresponds to the cutting means of the present invention.
[0049]
The original sheet peeling mechanism 20 is gripped by a rail of the apparatus main body so that the frame can slide in the traveling direction of the original sheet T, and is interlocked and connected via a drive unit such as a motor (not shown). A peeling roller 21 is rotatably supported on the frame, and the peeling roller 21 is driven to swing up and down by a cylinder (not shown). The peeling roller 21 peels an unnecessary original sheet T after being cut along the peripheral edge of the wafer W from the wafer W.
[0050]
In the original sheet collection unit 22, a collection bobbin 23 is pivotally supported on a vertical wall (not shown), and is linked to a driving mechanism such as a motor. That is, a predetermined amount of the original sheet T is fed out from the original sheet supply unit 13 and supplied onto the wafer W, and the drive unit operates to wind up the unnecessary original sheet T after cutting around the recovery bobbin 23. It has become.
[0051]
As shown in FIG. 3, the heat bonding unit 24 heats (for example, 180 ° C.) the suction sheet 25 on which the wafer W is placed and sucked and held, and the original sheet T attached to the back surface of the wafer W. A heating plate 26 for bonding the adhesive sheet T1 to the wafer W is provided.
[0052]
The suction table 25 performs centering of the outer periphery of the wafer and holds the surface by suction.
[0053]
The heating plate 26 is provided with a heater therein and is interlocked with the cylinder 27, and the original sheet T attached to the standby position above the wafer W and the back surface of the wafer W by driving the cylinder 27. It moves up and down over a heat treatment position where it is pressed and heated. The heating plate 26 corresponds to the heating means of the present invention.
[0054]
Note that a heating roller or an oven using radiant heat may be used as the heating means.
[0055]
As shown in FIG. 2, the cover sheet peeling unit 28 includes a tape supply unit 29 that supplies the peeling tape Ts, a suction table 33 that holds and holds the wafer, and an original attached to the back surface of the wafer W. A cover sheet peeling mechanism 32 that peels the peeling tape Ts together with the cover sheet T2 while affixing the peeling tape Ts while pressing the cover sheet T2 on the surface side of the sheet T, and a cover sheet that collects the peeled cover sheet A recovery unit 35 is provided.
[0056]
The tape supply unit 29 winds and guides the peeling tape Ts fed from the bobbin 30 around the guide roller 31 and feeds it to the cover sheet peeling mechanism 32. The bobbin 30 is pivotally supported on a vertical wall (not shown).
[0057]
The suction table 33 performs centering of the outer periphery of the wafer and holds the surface by suction. Further, the suction table 33 is gripped by a rail of the apparatus main body so that the frame can slide in the traveling direction of the peeling tape Ts, and is interlocked and connected to a drive unit (not shown). In the present embodiment, the adhesive of the adhesive sheet T1 heated by the heat bonding part 24 is cooled at room temperature by the suction table 33, and the adhesive is cured. In addition, about cooling, you may make it cool the adhesive sheet T1 actively using a fan etc., for example.
[0058]
In the cover sheet peeling mechanism 32, a peeling roller 34 is rotatably supported on the frame, and the peeling roller 34 is driven to swing up and down by a cylinder (not shown). That is, the release tape Ts is applied to the surface of the cover sheet T2 while being pressed. The cover sheet peeling mechanism 32 corresponds to the peeling means of the present invention.
[0059]
In the tape recovery unit 35, a recovery bobbin 36 is pivotally supported on a vertical wall (not shown), and the recovery bobbin 36 is linked to a driving unit such as a motor. In other words, a predetermined amount of the release tape Ts is fed out from the tape supply unit 29 and supplied onto the wafer W, and the release tape Ts integrated with the cover sheet Ts is activated in the recovery bobbin 36 by operating the drive unit. It is designed to be wound up.
[0060]
Next, the operation of the adhesive sheet affixing device of the present embodiment having the above-described configuration will be described with reference to the drawings.
[0061]
When the shelf-type cassettes C1 that store the wafers W in multiple stages at regular intervals are placed on the wafer supply unit 2, the cassette base moves up and down and stops at a position where the second robot arm 10 can take out the wafers W to be taken out.
[0062]
The wafer transfer mechanism 9 rotates and the wafer holding part of the second robot arm 10 is inserted into the cassette C1. The second robot arm 10 sucks and holds the surface of the wafer W from above the wafer W by the wafer holding unit, and transfers the wafer W to the temporary stage 3.
[0063]
The wafer W placed on the temporary stage 3 is attracted and held by the first robot arm 7 and lifted. At this time, the tip of the second robot arm 10 is inserted below the wafer W, and the wafer W is sucked and held from the back surface by the wafer holder.
[0064]
When the wafer W is sucked and held by the second robot arm 10, the suction of the first robot arm 7 is released. The second robot arm 10 reverses in the process of transporting the attracted wafer W to the alignment stage 11 and transfers the wafer W to the alignment stage 11 with the back surface of the wafer W facing up.
[0065]
The wafer W placed on the alignment stage 11 is centered on the outer periphery of the wafer. If necessary, the wafer W can be aligned based on the orientation and the notch. After alignment, the back surface of the wafer W is sucked and held by the second robot arm 10 and transferred to the original sheet pasting unit 12.
[0066]
The wafer W transferred to the original sheet pasting unit 12 is sucked and placed on the suction table 16. At this time, as shown in FIG. 4, each of the original sheet sticking mechanism 17, the original sheet peeling mechanism 20, and the cutter unit 19 is in the standby position.
[0067]
When the positioning on the suction table 16 is completed, the application roller 18 of the original sheet application mechanism 17 swings down as shown in FIG. 5, and the application roller 18 overlaps the adhesive sheet T1 and the cover sheet T2. While pressing the surface of the sheet T, the sheet rolls in the direction opposite to the original sheet supply direction (from right to left in FIG. 5), and the original sheet T is attached to the back surface of the wafer W. When the original sheet sticking mechanism 17 reaches the sticking end position of the original sheet, the sticking roller 18 rises.
[0068]
Next, as shown in FIG. 6, the cutter unit 19 descends to the cutting action position, and the cutting edge pierces and penetrates the original sheet T. The cutting edge moves along a groove of a suction table 16 formed in a substantially wafer shape (not shown). That is, the original sheet T is cut along the periphery of the wafer W. At this time, the original sheet T is tensioned by the original sheet sticking mechanism 17 and the original sheet peeling mechanism 20.
[0069]
After cutting the original sheet T, the cutter unit 19 rises and returns to the standby position.
[0070]
Next, as shown in FIG. 7, the original sheet peeling mechanism 20 rolls up and separates the unnecessary original sheet T cut on the wafer W while moving on the wafer W in the direction opposite to the original sheet running direction. .
[0071]
When the original sheet peeling mechanism 20 reaches the end position of the peeling operation, the original sheet sticking mechanism 17 and the original sheet peeling mechanism 20 move in the original sheet running direction and return to the initial position shown in FIG. At this time, unnecessary original sheet T is wound around the collection bobbin 23 and a certain amount of original sheet T is fed out from the original sheet supply unit 13.
[0072]
The wafer W to which the original sheet T is attached is attracted and held on the back surface by the second robot arm 10 and transferred to the heat bonding unit 24.
[0073]
The wafer W transferred to the heat bonding unit 24 is placed on the suction table 25, and the wafer outer periphery is centered. After the alignment, the heating plate 26 at the standby position above the wafer W is lowered as shown in FIG. 8 and pressed from the surface of the original sheet T affixed to the surface of the wafer W, that is, from the cover sheet T2. Then, the adhesive sheet T1 is heat bonded to the wafer W. The wafer W having the adhesive sheet T1 bonded to the back surface is sucked and held by the second robot arm 10 and transferred to the cover sheet peeling unit 28.
[0074]
As shown in FIG. 9, the surface of the wafer W transferred to the cover sheet peeling unit 28 is sucked and held by the suction table 33, and the wafer outer periphery is centered. At this time, the adhesive sheet T1 heated by the heat bonding part 24 is once cooled at room temperature to cure the adhesive. After the alignment, the suction table 25 moves to a position where the peeling roller 34 contacts the peripheral edge of the original sheet T as shown in FIG. 10 (from right to left in FIG. 10).
[0075]
When the suction table 33 reaches the cover sheet peeling position, the peeling roller 32 descends and presses the peeling tape Ts to be attached to the periphery of the original sheet T. In this state, the suction table 33 moves in the peeling tape running direction (from right to left in FIG. 10). As the suction table 33 moves, the peeling roller 34 rolls on the wafer W while pressing the peeling tape Ts. That is, the release tape Ts is attached to the original sheet T, and only the cover sheet T2 on the surface of the original sheet T attached with the release tape Ts is released together with the release tape Ts.
[0076]
When the suction table 25 reaches the peeling end position, as shown in FIG. 11, the peeling roller 32 rises, the cover sheet T2 integrated with the peeling tape Ts is wound around the recovery bobbin 36, and a certain amount of peeling is performed. The tape Ts is fed out from the tape supply unit 29.
[0077]
The wafer W having only the adhesive sheet T1 bonded to the back surface is transferred to the temporary stage 3 with the second robot arm 10 sucking and holding the back surface.
[0078]
The wafer W placed on the temporary placement stage 3 is lifted with the first robot arm 7 sucking and holding the back surface. At this time, the tip of the second robot arm 10 is inserted below the wafer W, and the wafer W is sucked and held from the surface by the wafer holding unit.
[0079]
When the second robot arm 10 sucks and holds the surface of the wafer W, the suction of the first robot arm 7 is released. The second robot arm 10 reverses in the process of transporting the attracted wafer W to the cassette C1, and stores the wafer W in the cassette C1 with the surface of the wafer W facing up. This completes the one-round operation of attaching the adhesive sheet T1 to the back surface of the wafer W.
[0080]
As described above, by sticking the original sheet T in which the adhesive sheet T1 and the cover sheet T2 overlap each other to the back surface of the wafer W, the sticking roller 18 of the original sheet sticking mechanism 17 rolls while pressing the original sheet T. However, since the original sheet T itself has rigidity, it is not stretched. That is, the adhesive sheet T1 is difficult to stretch. Therefore, generation | occurrence | production of the wrinkle at the time of sticking an original sheet can be avoided, and by extension, the adhesion defect of the adhesive sheet T1 by the air wound between the adhesive sheet T1 and the back surface of the wafer W by generation | occurrence | production of a wrinkle can be avoided.
[0081]
Also, the cover sheet T2 and the adhesive sheet T1 in a two-layered state have rigidity, the bending due to the pressing force applied to the adhesive sheet T1 at the time of cutting can be suppressed, and the adhesive sheet T1 including the cover sheet T2 can be accurately cut.
[0082]
Further, since the adhesive sheet T1 is heat bonded to the wafer while pressing the heating plate 26 from the upper surface of the original sheet T, that is, the cover sheet T2, the heat transfer efficiency to the adhesive sheet T1 is good and the adhesive sheet T1 is accurately attached. While being able to adhere to the wafer W and the temperature is not directly transmitted to the wafer W itself, thermal stress on the wafer W can be avoided.
[0083]
<Second embodiment>
In this example, after the adhesive sheet and the cover sheet are attached to the back surface of the wafer, the adhesive sheet is adhered to the back surface of the wafer, and the adhesive tape is applied to the ring frame and the back surface of the wafer without peeling the cover sheet. A semiconductor wafer processing method in the case of attaching, integrating, dicing and bonding will be described as an example.
In the present embodiment, the process from taking out the wafer W from the cassette C1 of the wafer supply unit 2 and bonding the adhesive sheet T1 to the back surface of the wafer W by the subsequent heat bonding unit 24 in the first embodiment apparatus described above. Since these are the same, description thereof will be omitted, and description will be made after the adhesive sheet T1 is bonded to the back surface of the wafer W. The same components as those in the first embodiment are denoted by the same reference numerals.
[0084]
The wafer W, to which the adhesive sheet T1 is bonded to the back surface in the heating bonding section 24 shown in FIG. 1, is cooled to room temperature, and then attached to the back surface of the wafer W with the adhesive sheet T1 and the cover sheet T2 being overlapped. The second robot arm 9 is transported to the temporary placement stage 3 as it is.
[0085]
The wafer W placed on the temporary placement stage 3 is lifted with the first robot arm 7 sucking and holding the back surface. At this time, the tip of the second robot arm 10 is inserted below the wafer W, and the wafer W is sucked and held from the surface by the wafer holding unit.
[0086]
When the second robot arm 10 sucks and holds the surface of the wafer W, the suction of the first robot arm 7 is released. The second robot arm 10 reverses in the process of transporting the attracted wafer W to the cassette C1, and stores the wafer W in the cassette C1 with the surface of the wafer W facing up. The cassette C1 in which the wafers W are stored is transported to the next mount frame creation process.
[0087]
The cassette C1 transported to the mount frame creation unit is placed on a wafer supply unit (not shown). When the cassette C1 is placed, the robot arm is activated, the wafer holder at the tip of the robot arm is inserted into the cassette C1, the surface of the wafer W is sucked and held, and is transferred to an alignment stage (not shown).
[0088]
The wafer W placed on the alignment stage with its back side down is aligned. When the alignment is completed, the surface of the wafer W is attracted and held by the robot arm and transferred to the mount table. In the process of being transferred to the mount table, the wafer W is inverted and placed on the mount table with the surface facing down.
[0089]
On the mount table 40 shown in FIG. 13, a ring-shaped frame f supplied from a frame supply unit (not shown) and subjected to alignment processing is placed in advance. At the center of the ring-shaped frame f placed on the mount table 40, the wafer W transferred from the alignment stage by the robot arm is placed.
[0090]
The wafer W placed on the mount table 40 with its surface facing down is sucked and held and aligned. When the alignment is completed, the pasting mechanism 42 applies the dicing tape DT to the upper side of the wafer W after the separator S is peeled off in the process of being fed from the original roll 41, and the ring mechanism f and the cover are attached to the back surface of the wafer W. The dicing tape DT is pasted over the sheet T2.
[0091]
Specifically, as shown in FIG. 12, the sticking roller 43 of the sticking mechanism 42 in the standby position is lowered to press the dicing tape DT against the ring-shaped frame f, and as shown in FIG. 43 presses the dicing tape DT and rolls in the direction opposite to the tape supply direction (from left to right in FIG. 13) to attach the dicing tape DT to the ring frame f and the wafer W. When the sticking mechanism 42 reaches the tape sticking end position, the sticking roller 43 rises.
[0092]
When the dicing tape DT pasting is completed, as shown in FIG. 14, the cutter unit 44 at the standby position above the wafer W is lowered and pivots along the shape of the substantially ring-shaped frame f to cut the dicing tape DT. When the cutting of the dicing tape DT is completed, the cutter unit 44 moves up and returns to the standby position.
[0093]
Next, as shown in FIG. 15, the peeling mechanism 45 moves on the wafer W in the direction opposite to the tape supply direction (from left to right in FIG. 15), so that the unnecessary dicing tape DT1 after cutting is peeled off. . The peeled unnecessary tape DT1 is collected by the collecting unit 46 and a new dicing tape DT is fed out from the original fabric roll 41.
[0094]
The mount frame on which the dicing tape DT is attached and the ring frame f and the wafer W are integrated is housed in a cassette and conveyed to the next dicing process.
[0095]
As shown in FIG. 16, the wafer W is sucked and held on the holding table 50 so that the surface of the wafer W faces up, and the ring-shaped frame f is held by the holding member 51 from above and below. Is done. In this state, the wafer W is cut into individual chips W1 as shown in FIG. At this time, in order to facilitate the removal of the chip W1, the cover sheet T2 is cut.
[0096]
When the cutting of the wafer W is completed, as shown in FIG. 18, the holding table 50 is raised and the dicing tape DT is stretched to make it easy to remove the chip W1 from the dicing tape DT. In this state, the collet 52 at the upper standby position descends, holds the chip W1 by suction and transports it to a mounting board (not shown). At this time, as shown in FIG. 18, among the original sheets T attached to the back surface of the chip, the cover sheet T2 is left adhered to the dicing tape DT, and only the adhesive sheet T1 is bonded to the back surface of the chip W1. In this state, it is transferred to the mounting board.
[0097]
The chip W1 sucked and held by the collet 52 is mounted at a predetermined position on the mounting board with the back surface thereof facing down. That is, the chip W1 is bonded to the mounting substrate by the adhesive sheet T1.
[0098]
As described above, after the adhesive sheet T1 is heat bonded to the back surface of the wafer W, the wafer W attached in a state where the adhesive sheet T1 and the cover sheet T2 are overlapped without peeling off the cover sheet T2 is ring-shaped. By integrating with the shaped frame f, the original sheet T acts as a support, and the wafer W processed thinly by back grinding can be given rigidity. Therefore, since the bending of the wafer W during the transfer process can be eliminated, it is possible to avoid a suction failure when the wafer W is sucked and held by a robot arm or the like. In addition, the loss of the wafer W itself due to the influence of the deflection of the wafer W can be avoided.
[0099]
Further, since the dicing tape DT is attached to the wafer W via the cover sheet T2 in a state where the cover sheet T2 is attached, it is possible to avoid adhesion of foreign matters to the adhesive sheet T1 during the transfer process of the wafer W. it can. Therefore, the bonding of the chip W1 to the mounting substrate can be performed with higher accuracy.
[0100]
The present invention is not limited to the above-described embodiment, and can be modified as follows.
(1) In the above embodiment, the belt-shaped original sheet T is supplied and attached to the wafer W, and the adhesive sheet T1 and the cover sheet T2 are cut along the periphery of the wafer W by the cutter unit 19. An original sheet T in which an adhesive sheet T1 having a shape of a substrate such as a wafer W provided on a material and a cover sheet T2 overlap each other may be attached to the wafer W or the like.
[0101]
Specifically, as shown in FIG. 19, while supplying the original sheet T in the shape of the wafer W continuously provided on the belt-like base material 60 as shown in FIG. Further, the original sheet T is peeled off from the base material 60 by the edge member 61. At this time, the suction table 62 that sucks and holds the wafer W is moved in the original sheet traveling direction, and the sticking roller 63 above the wafer W is rolled while being pressed on the original sheet T to be peeled. Affix to wafer W.
[0102]
(2) In the above-described embodiment, the non-conductive adhesive is taken as an example for the adhesive sheet T1, but an adhesive sheet in which a conductive resin is applied to the base material may be used. A bonding material that has three functions at the same time, and is a polymer film with electrical anisotropy that is electrically conductive in the thickness direction and insulative in the surface direction by thermocompression bonding. An anisotropic conductive film (ACF) in which conductive particles are mixed may be used.
[0103]
When an anisotropic conductive film is used, it is suitable for underfill by face-down bonding. That is, by anisotropically bonding an anisotropic conductive film to the electrode part on the surface of the semiconductor chip, the semiconductor chip is placed on the electrode part of the substrate with the surface of the semiconductor chip facing down. Bonding can be performed while conducting conduction between each other.
[0104]
(3) In the above embodiment, the processed wafer W obtained by bonding the adhesive sheet T1 to the wafer W is stored in the cassette C1 of the wafer supply unit 2, but may be stored in the case C3 of the wafer recovery unit 5. Then, the wafer W after the wafer W to be processed is taken out from the case C2 of the second wafer supply unit 5 and the adhesive sheet T1 is bonded may be stored in the cassette C1 or the case C3 of the wafer collection unit 6.
[0105]
(4) In the above embodiment, the wafer W is transferred to each component by the second robot arm 10, but a plurality of robot arms are provided so that the wafer W can be processed in parallel at the same time. You may make it convey.
[0106]
(5) In the above embodiment, after the adhesive sheet T1 is bonded to the back surface of the wafer W, the second robot arm 10 sucks the back surface of the wafer W and conveys it to the cover sheet peeling unit 28. After heat bonding, the wafer W is slid on the mounting table or the like provided from the heat bonding part 24 and the adhesive of the adhesive sheet T1 is positively cured, and then the cover sheet is peeled off by the second robot arm 10. You may convey to the part 28. FIG.
[0107]
(6) In the second embodiment, the wafer W having the original sheet T in a state where the adhesive sheet T1 and the cover sheet T2 overlap each other is attached to the back surface in a ring shape on the back surface of the wafer W via the dicing tape DT. Although integrated with the frame f, as in the first embodiment, the wafer W in which only the adhesive sheet T1 is bonded to the back surface of the wafer W may be integrated with the ring-shaped frame via the dicing tape DT. .
[0108]
【The invention's effect】
As is clear from the above description, according to the present invention, a thin adhesive sheet alone is attached to a substrate by sticking a rigid original sheet to the substrate and heating and adhering the adhesive sheet and the cover sheet in an overlapping state. It is possible to avoid wrinkles that occur when pasting. Therefore, it is possible to avoid the adhesion failure of the adhesive sheet, which is caused by air entrained between the substrate and the adhesive sheet when wrinkles are generated, and the adhesive sheet can be adhered to the substrate with high accuracy.
[0109]
In addition, since the original sheet in which the adhesive sheet and the cover sheet overlap has rigidity, the adhesive sheet is difficult to bend by the pressing force applied at the time of cutting. As a result, the adhesive sheet can be cut with high accuracy.
[Brief description of the drawings]
FIG. 1 is a plan view showing a schematic configuration of an adhesive sheet attaching apparatus according to an embodiment.
FIG. 2 is a front view showing a schematic configuration of an adhesive sheet sticking apparatus according to the present embodiment.
FIG. 3 is a front view showing a schematic configuration of a heat bonding portion.
FIG. 4 is a schematic front view for explaining an original sheet sticking step.
FIG. 5 is a schematic front view for explaining an original sheet attaching step.
FIG. 6 is a schematic front view for explaining an original sheet attaching step.
FIG. 7 is a schematic front view for explaining an original sheet attaching step.
FIG. 8 is a schematic front view illustrating a heat bonding step.
FIG. 9 is a schematic front view illustrating a cover sheet peeling process.
FIG. 10 is a schematic front view illustrating a cover sheet peeling process.
FIG. 11 is a schematic front view illustrating a cover sheet peeling process.
FIG. 12 is a front view showing a schematic device configuration of a mount frame creation unit;
FIG. 13 is a schematic front view illustrating a mounting process.
FIG. 14 is a schematic front view illustrating a mounting process.
FIG. 15 is a schematic front view illustrating a mounting process.
FIG. 16 is a front view showing a state in which the mount frame is held on the mount table.
FIG. 17 is a front view showing a state where a wafer is diced.
FIG. 18 is a diagram illustrating an operation of sucking a chip from a mount frame.
FIG. 19 is a perspective view showing a wafer-shaped original sheet attaching step.
FIG. 20 is a schematic front view illustrating a process of attaching a wafer-shaped original sheet.
FIG. 21 is a cross-sectional view showing a state where an adhesive sheet is attached to a wafer by a conventional method.
[Explanation of symbols]
W… Wafer
W1 ... Chip
T1 ... Adhesive sheet
T2 ... Cover sheet
T ... Original sheet
f ... Ring frame
DT ... Dicing tape
2 ... 1st wafer supply part
3… Temporary placement stage
7 ... 1st robot arm
9 ... Wafer transfer mechanism
12 ... Original sheet pasting part
24 ... Heat bonded part
26… Heating plate
28… Cover sheet peeling part

Claims (8)

  1. Supplying the original sheet in a state where the adhesive sheet and the cover sheet are superposed on the substrate placed and held on the holding means, and applying the application sheet while pressing and rolling the application roller on the original sheet,
    The non-sticking surface of the substrate to which the original sheet is transported from the sticking process is held by a holding means, and the substrate is sandwiched between a heating plate and a holding table and heated from above the cover sheet, and the adhesive sheet is attached to the substrate. Heat bonding process to bond,
    A method for attaching an adhesive sheet, comprising:
  2. In the adhesive sheet sticking method according to claim 1,
    A method for attaching an adhesive sheet, comprising: a peeling process for peeling the cover sheet from the adhesive sheet adhered to the substrate.
  3. In the adhesive sheet sticking method according to claim 1 or 2,
    The original sheet is a belt-like sheet in a state where the adhesive sheet and the cover sheet are overlapped, and after the belt-like raw sheet is attached to the substrate, the cutting process of cutting the raw sheet along the peripheral edge of the substrate An adhesive sheet affixing method characterized by comprising:
  4. In the adhesive sheet sticking method according to claim 1 or 2,
    The said original sheet is cut | disconnected according to the shape of the board | substrate previously in the state which accumulated the adhesive sheet and the cover sheet, This adhesive sheet sticking method characterized by sticking to a board | substrate.
  5. An adhesive sheet sticking device for sticking an adhesive sheet to a substrate,
    Holding means for placing and holding the substrate;
    An original sheet supply means for supplying a belt-shaped original sheet in which an adhesive sheet and a cover sheet are superposed toward the substrate held by the holding means;
    Affixing means for affixing to the substrate while pressing and rolling the affixing roller on the supplied strip-shaped original sheet,
    Cutting means for cutting the strip-shaped original sheet attached to the substrate along the periphery of the substrate;
    An unnecessary sheet collecting means for collecting an unnecessary original sheet after cutting;
    Holding means for holding said original sea Togaha Ri attached are those with the original sheet non sticking surface of the substrate which is conveyed in contact with,
    A plate-shaped heat bonding means for sandwiching the substrate held by the holding means and heating the cover sheet to bond the adhesive sheet to the substrate;
    Peeling means for peeling the cover sheet from the adhesive sheet adhered to the substrate;
    An adhesive sheet affixing device comprising: a cover sheet recovery means for recovering the peeled cover sheet.
  6. An adhesive sheet sticking device for sticking an adhesive sheet to a substrate,
    Holding means for placing and holding the substrate;
    An original sheet supply means for supplying an original sheet that has been cut in advance according to the shape of the substrate in a state where the adhesive sheet and the cover sheet are superposed on the substrate held by the holding means,
    Affixing means for affixing to the substrate while pressing and rolling the affixing roller on the supplied original sheet;
    Holding means for holding said original sea Togaha Ri attached are those with the original sheet non sticking surface of the substrate which is conveyed in contact with,
    A plate-like heat bonding means for sandwiching the substrate held by the holding means and heating the cover sheet to bond the adhesive sheet to the substrate;
    Peeling means for peeling the cover sheet from the adhesive sheet adhered to the substrate;
    An adhesive sheet affixing device comprising: a cover sheet recovery means for recovering the peeled cover sheet.
  7. The original sheet in which the adhesive sheet and the cover sheet are superposed is supplied onto the substrate placed and held on the holding means, and is applied to the back surface of the semiconductor wafer while pressing and rolling the application roller on the original sheet. Affixing process, and
    A substrate non-sticking surface of the substrate to which the original sheet is transferred transported from the sticking process is held by a holding means, and a semiconductor wafer is sandwiched between a heating plate and a holding table and heated from above the cover sheet. A heat bonding process for bonding the adhesive sheet to the wafer;
    Peeling process of peeling the cover sheet from the adhesive sheet bonded to the semiconductor wafer;
    Place the semiconductor wafer in the center of the ring-shaped frame with the back surface of the semiconductor wafer to which the adhesive sheet is bonded facing down, and attach the adhesive tape from the back surface of the ring-shaped frame to integrate the semiconductor wafer and the ring-shaped frame. Mounting process,
    A dicing process of cutting the semiconductor wafer integrated with the ring frame into individual chips;
    A semiconductor wafer processing method comprising: a bonding step of adhering and holding the cut chips, conveying the chips, and bonding the chips to a mounting substrate with the back surface to which the adhesive sheet is attached facing down.
  8. The original sheet in a state where the adhesive sheet and the cover sheet are superimposed is supplied onto the substrate placed and held on the holding means, and the semiconductor is pressed while rolling by pressing the application roller from one end to the other end on the original sheet. A pasting process to be pasted on the back side of the wafer;
    A substrate non-sticking surface of the substrate to which the original sheet is transferred transported from the sticking process is held by a holding means, and a semiconductor wafer is sandwiched between a heating plate and a holding table and heated from above the cover sheet. A heat bonding process for bonding the adhesive sheet to the wafer;
    With the adhesive sheet and cover sheet overlapped, the semiconductor wafer is placed in the center of the ring frame with the back surface of the semiconductor wafer facing down, and an adhesive tape is attached from the back surface of the ring frame to the semiconductor wafer and the ring. Mounting process that integrates the frame,
    A dicing process of cutting the semiconductor wafer integrated with the ring frame into individual chips;
    The cover sheet is provided with a bonding process of adhering and holding the cut chip while being left on the adhesive sheet, and bonding the chip to the mounting substrate with the back surface to which the adhesive sheet is bonded facing down. Semiconductor wafer processing method.
JP2002061900A 2002-03-07 2002-03-07 Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method Expired - Fee Related JP4311522B2 (en)

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JP4886971B2 (en) * 2004-05-26 2012-02-29 リンテック株式会社 Pasting device
JP2006140251A (en) * 2004-11-11 2006-06-01 Lintec Corp Sheet cutting method and mounting method
JP4602747B2 (en) * 2004-12-08 2010-12-22 リンテック株式会社 Pasting device and pasting method
JP4739853B2 (en) * 2005-08-08 2011-08-03 リンテック株式会社 Sheet cutting device and cutting method
KR101282699B1 (en) * 2005-08-11 2013-07-05 린텍 가부시키가이샤 Sheet application device and application method
JP4468884B2 (en) 2005-12-09 2010-05-26 リンテック株式会社 Tape sticking device, mounting device, and mounting method
JP4890868B2 (en) 2006-01-18 2012-03-07 リンテック株式会社 Sheet cutting device and cutting method
JP4890873B2 (en) * 2006-02-06 2012-03-07 リンテック株式会社 Sheet pasting device
JP4589246B2 (en) * 2006-02-13 2010-12-01 リンテック株式会社 Sheet sticking device and sticking method
JP4841262B2 (en) * 2006-02-13 2011-12-21 株式会社東京精密 Wafer processing equipment
JP4637057B2 (en) * 2006-05-25 2011-02-23 リンテック株式会社 Sheet sticking device and sticking method
JP2008085148A (en) * 2006-09-28 2008-04-10 Tokyo Seimitsu Co Ltd Adhesion expression method and adhesion expression equipment of adhesive film
JP2008159829A (en) * 2006-12-25 2008-07-10 Lintec Corp Sheet attacher and attachment method
JP5113599B2 (en) * 2008-04-08 2013-01-09 リンテック株式会社 Sheet sticking device and sticking method
JP5216472B2 (en) * 2008-08-12 2013-06-19 日東電工株式会社 Method and apparatus for attaching protective tape to semiconductor wafer
JP4918539B2 (en) * 2008-12-26 2012-04-18 日東精機株式会社 Protective tape peeling device
JP5097152B2 (en) * 2009-03-02 2012-12-12 和夫 田▲邉▼ Wafer peeling method
JP5572045B2 (en) * 2010-09-09 2014-08-13 リンテック株式会社 Sheet sticking device and sticking method
JP6078233B2 (en) 2012-01-31 2017-02-08 リンテック株式会社 Sheet pasting device
JP6085422B2 (en) * 2012-05-09 2017-02-22 リンテック株式会社 Pasting device
JP6034682B2 (en) * 2012-12-07 2016-11-30 リンテック株式会社 Sheet sticking device and sheet sticking method
JP2013232685A (en) * 2013-07-25 2013-11-14 Tokyo Electron Ltd Bonding apparatus
JP2014030066A (en) * 2013-11-14 2014-02-13 Lintec Corp Sheet sticking device and sheet sticking method
JP2020068328A (en) * 2018-10-25 2020-04-30 リンテック株式会社 Sheet attachment method

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