JP2010147123A - Apparatus for peeling sheet and method for peeling - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent an adherend such as a wafer from being damaged when a peeling tape is stuck to an adhesive sheet. <P>SOLUTION: An apparatus 10 for peeling a sheet includes: an adhesion means 16 for sticking a peeling tape PT to an adhesive sheet S; and a peeling means 15 for peeling the adhesive sheet S by relatively moving the peeling tape PT and a semiconductor wafer W. The adhesion means 16 includes a laser irradiation means 39. The laser irradiation means 39 is configured such that the peeling tape PT and the adhesive sheet S can be stuck by emitting a laser beam onto the peeling tape PT. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method. More specifically, the present invention relates to a sheet peeling method in which a peeling tape is bonded to an adhesive sheet affixed to an adherend, and the adhesive sheet can be peeled through the peeling tape. The present invention relates to an apparatus and a peeling method.

  In the process of processing a semiconductor wafer (hereinafter simply referred to as “wafer”), a protective adhesive sheet is attached to the circuit surface of the wafer, and various processes such as back-surface grinding are performed. After mounting, the adhesive sheet is peeled off before dicing. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In this document, first, the lead end of the peeling tape is pinched by a tape chuck and pulled out by a predetermined length. And it melt-bonds, pressing a part of peeling tape pulled out by the heater head against the outer edge part of an adhesive sheet.

JP 2007-36111 A

However, in Patent Document 1, there is a high possibility that stress is applied to the outer peripheral region of the wafer due to the impact of contacting the heater head with the adhesive sheet.
In particular, when a wafer ground to a thickness of several tens of microns in recent times is used, the influence of the stress becomes great, causing a disadvantage that the wafer is damaged when the peeling tape is adhered.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the object thereof is a sheet that can prevent the adherend from being damaged when the peeling tape is bonded to the adhesive sheet. It is providing the peeling apparatus and the peeling method.

In order to achieve the above object, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet affixed to an adherend from the adherend via a peeling tape.
A holding means for holding the adherend, an adhesive means for bonding the peeling tape to an adhesive sheet, and a peeling means for peeling the adhesive sheet by relatively moving the peeling tape and the adherend. ,
The adhering means includes a laser irradiating means, and the laser irradiating means is configured to be capable of adhering the adhesive sheet and the peeling tape by irradiating the peeling tape with a laser beam. Yes.

  In this invention, it is preferable to take the structure that the said peeling tape contains the position control means provided so that the state which contacted the adhesive sheet was maintainable.

  The position restricting means preferably includes a contact body that can be positioned so as to sandwich the adhesive sheet and the peeling tape, and the contact body is preferably provided so as to be able to transmit a laser beam.

  Further, the laser irradiation means and the holding means are provided so as to be relatively movable via a moving means, and this moving means can move the focal point of the laser beam emitted from the laser irradiation means along the outer edge shape of the adhesive sheet. It is good to provide.

Further, the present invention provides a sheet peeling method in which a peeling tape is bonded to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled from the adherend through the peeling tape.
Holding the adherend;
The step of bonding the adhesive sheet and the peeling tape by unwinding the peeling tape and irradiating the peeling tape affixed to the adherend with a laser beam;
A method is adopted in which the step of peeling the adhesive sheet from the adherend is performed by relatively moving the peeling tape and the adherend.

  According to the present invention, since the peeling tape and the adhesive sheet are bonded by irradiating the laser beam, the bonding can be performed without contacting the adhesive sheet as in the conventional heater head. As a result, it is possible to avoid applying stress to the adherend during bonding, and even if the adherend is an extremely thin wafer, it is possible to prevent the wafer from being damaged such as cracking. It becomes possible.

  In addition, when it is possible to maintain the state where the peeling tape is in contact with the adhesive sheet by the position regulating means, it is possible to prevent the peeling tape and the adhesive sheet from separating when irradiated with a laser beam, and the adhesive tape is peeled off. It becomes possible to adhere the adhesive tape stably.

  Furthermore, when the contact body can transmit the laser beam, the position of the peeling tape in the region irradiated with the laser beam can be regulated, and the peeling tape can be more stably and accurately adhered.

  Further, when the laser irradiation unit and the holding unit can be moved relative to each other via the moving unit, the focal position of the laser beam can be moved along various trajectories for irradiation. Thereby, for example, even an adhesive sheet having a complicated outer edge shape can be irradiated with a laser beam along the outer edge shape, and smooth peeling can be performed from the outer edge of the adhesive sheet.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the present specification and claims, “transmission” means that a laser beam is allowed to pass from one side of the contact body to the opposite side.

  FIG. 1 is a schematic front view of a sheet peeling apparatus according to the embodiment. In this figure, a sheet peeling apparatus 10 includes a holding means 11 for holding a wafer W as an adherend, a supporting means 12 for supporting a strip-like peeling tape PT, a feeding means 13 for feeding the peeling tape PT, A peeling means 15 for peeling the adhesive sheet S affixed to the circuit surface (upper surface in FIG. 1) of the wafer W via the peeling tape PT, and an adhesive means 16 for bonding the peeling tape PT to the outer edge side of the adhesive sheet S. And is configured. The peeling tape PT employs a heat-sensitive adhesive tape.

  The wafer W is held by the holding means 11 in a state of being integrated with the ring frame RF via the dicing sheet DS from the side opposite to the circuit surface (the lower surface in FIG. 1).

  The holding means 11 is composed of a table for adsorbing and holding the wafer W integrated with the ring frame RF on the upper surface from the dicing sheet DS side.

  The support means 12 includes a support shaft 18 that supports a peeling tape PT that is supported and wound by a frame (not shown), and a motor M1 that rotates the support shaft 18.

  The feeding means 13 includes a driving roller 20 that can be rotationally driven via a motor M2, a pinch roller 21 that sandwiches a peeling tape PT between the driving roller 20, and a plate-shaped guide that is oriented substantially in the horizontal direction. A member 23, a rotatable press roller 25 that presses the peeling tape PT on the guide member 23, and a lift cylinder 26 that lifts and lowers the press roller 25 are configured.

  The guide member 23 is provided so as to be movable in the left-right direction in FIG. Thus, as shown in FIG. 3, the guide member 23 supports the peeling tape PT pressed by the press roller 25 from below, and guides the lead end region to a position where it can be gripped by a chuck 37 described later. It becomes possible.

  The peeling means 15 includes a relative moving means 29 for relatively moving the peeling tape PT attached to the adhesive sheet S and the holding means 11, and a first means supported above the holding means 11 via a displacement means 30. A roller 31 and a second roller 32 provided on the left side of the first roller 31 in FIG. 1 and movable in the left-right direction in the drawing via a driving device (not shown) are provided. The displacing means 30 is composed of a linear motor, and is provided so as to be displaceable in a direction in which the first roller 31 is separated from and approached to the wafer W, that is, in the vertical direction in FIG.

  The relative movement means 29 is provided below the linear movement motor 34 and its slider 35 for moving the holding means 11 in the left-right direction in FIG. 1 and the bonding means 16, and a chuck 37 capable of gripping the peeling tape PT. And. The chuck 37 is configured to be movable in the left-right direction in FIG. 1 via a driving device (not shown).

  The bonding means 16 is provided with a linear motion motor 38, a laser irradiation means 39 provided so as to be able to advance and retreat in the vertical direction by the linear motion motor 38, and the linear motion motor 38 and the laser irradiation means 39 are movable. Moving means 40. The laser irradiation means 39 irradiates the peeling tape PT (exactly, the adhesive of the peeling tape PT) fed to the upper surface side of the adhesive sheet S with a laser beam, so that the adhesive sheet S and the peeling tape PT It is provided so that it can adhere. The laser emitted from the laser irradiating means 39 is set to conditions suitable for the heat-sensitive adhesion of the peeling tape PT. The moving means 40 includes an XY stage that can be moved in two orthogonal axes by a motor (not shown). Therefore, in this embodiment, since the adhesive sheet S has a circular planar shape, the moving means 40 moves the light emission source 39A of the laser irradiation means 39 along the arc-shaped movement locus as shown by the arrows in FIG. It can be done. Note that the linear motor 38 can be omitted by configuring the laser irradiation means 39 so that the focal length of the laser irradiation means 39 matches the peeling tape PT.

  A tape cutting means 42 is provided on the left side of the bonding means 16 in FIG. The tape cutting means 42 is provided on the lower side of the cutter blade 43, a tape receiving plate 44 having a concave portion on the upper surface, and a cutting cylinder for moving the cutter blade 43 in the direction perpendicular to the paper surface in FIG. 45 and an up / down cylinder 46 for moving the cutter blade 43 in the vertical direction in the figure.

  Further, a position regulating means 49 is provided on the right side of the bonding means 16 in FIG. The position regulating means 49 includes a contact body 50 that can be positioned so as to sandwich the adhesive sheet S and the peeling tape PT, and a linear motion motor 51 that displaces the contact body 50 in the vertical direction in FIG. By lowering the contact body 50 via the linear motion motor 51, the peeling tape PT is provided so as to be kept in contact with the adhesive sheet S. The contact body 50 is formed of a plate body that can transmit the laser beam irradiated from the laser irradiation means 39.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  First, after the peeling tape PT is pulled out from the support shaft 18 and passed between the drive roller 20 and the pinch roller 21, the lead end side of the peeling tape PT protrudes from the tip of the guide member 23, and the press The peeling tape PT is pressed onto the guide member 23 by the roller 25.

  Then, the wafer W integrated with the ring frame RF is held on the upper surface of the holding unit 11 through a transfer unit (not shown). Next, while the holding means 11 is moved by the linear motion motor 34, the right outer edge in FIG. 1 of the adhesive sheet S is detected by a sensor (not shown), and the linear motion motor so that the outer edge position stops immediately below the laser irradiation means 39. 34 is controlled.

  Next, as shown in FIG. 3, the guide member 23 is advanced in the right direction in the figure via the cylinder 27, and at the same time, the motor M2 is operated to rotate the drive roller 20 to release a predetermined length of the peeling tape. Extend PT. Accordingly, the guide member 23 and the lead end side of the peeling tape PT are positioned between the chucks 37. When the press roller 25 is retracted upward and the guide member 23 is retracted, the peeling tape PT is left between the chucks 37 and is gripped by the chucks 37 (see FIG. 4). Thereafter, the chuck 37 is moved to the position indicated by the two-dot chain line in FIG. 4 and the peeling tape PT is pulled out.

  Next, the linear motion motor 51 of the position restricting means 49 is actuated to lower the contact body 50, and the position of the peeling tape PT is restricted while being in contact with the adhesive sheet S so as not to cause stress on the wafer W. In this state, as shown in FIG. 5, after the laser irradiation means 39 is moved downward by the linear motion motor 38, the laser irradiation means 39 emits a laser beam. At this time, the laser beam passes through the contact body 50, the adhesive of the peeling tape PT is heated by the laser beam, and the peeling tape PT and the adhesive sheet S are bonded. Further, as shown in FIG. 2, the laser irradiation means 39 moves in an arc shape along the outer edge shape of the adhesive sheet S via the moving means 40, and adhesion is performed in the region indicated by the oblique lines in FIG. Thereafter, the peeling tape PT is pressed onto the guide member 23 by the press roller 25 and the cylinders 45 and 46 are operated, whereby the peeling tape PT is cut by the cutter blade 43 on the tape receiving plate 44. When the adhesion area is enlarged, the laser irradiation means 39 can be scanned over a wide range by the moving means 40.

  Thereafter, as shown in FIG. 6, the second roller 32 is moved to the right side in the drawing, and the peeling tape PT is sandwiched between the first roller 31 and the second roller 32. Next, the first roller 31 is displaced in the vertical direction via the displacing means 30, and the distance between the first roller 31 and the wafer W is adjusted. Next, the chuck 37 and the holding unit 11 are moved via the relative moving unit 29 so that the peeling tape PT attached to the adhesive sheet S and the holding unit 11 are relatively moved in the opposite directions. As a result, the peeling tape PT is bent so as to face the adhesive sheet S on the wafer W, and is further moved relative to the peeled adhesive as shown in FIGS. 7A and 7B. The sheet S and the unpeeled adhesive sheet S are bent and peeled at a peeling angle α so as to face each other.

  Here, when the first roller 31 is displaced by the displacing means 30, the peeling angle α increases as the first roller 31 approaches the adhesive sheet S attached to the wafer W. In FIG. 7A, the displacement amount of the first roller 31 is such that the closest approach portion (lower part in the drawing) of the first roller 31 to the wafer W is adjacent to the bending position, and the peeled adhesive sheet S is The first roller 31 is set so as to be pressed toward the wafer W side. As a result, the unpeeled adhesive sheet S immediately before peeling and the adhesive sheet S immediately after peeling are opposed to each other with a small interval, and the adhesive sheet S is folded so that the peeling angle α is about 180 °. Is peeled off. Further, as shown in FIG. 7B, when the distance from the wafer W to the first roller 31 is increased as compared with FIG. 7A, the peeling angle α can be set small.

  When the peeling of the adhesive sheet S is completed, the wafer W is transported to the next process by a transporting unit (not shown), and the adhesive sheet S and the peeling tape PT attached thereto are collected by a collecting unit (not shown), and then the holding unit 11, After the first and second rollers 31 and 32 and the chuck 37 are returned to the initial positions, the same operation as described above is repeated.

Therefore, according to such an embodiment, since the peeling tape PT and the adhesive sheet S are bonded to each other by the irradiation of the laser beam, stress is generated such that the wafer W is pressed to perform the bonding. Can be prevented.
As a result, even if the thickness of the wafer W is as thin as several tens of microns, it is possible to peel the adhesive sheet S while avoiding damage to the wafer W due to adhesion of the peeling tape PT.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the displacement means 30 and the linear motion motors 34, 37, 51 may be replaced with driving means such as an air cylinder or a hydraulic cylinder.

Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.
Furthermore, the peeling tape PT may employ a pressure-sensitive adhesive tape other than the heat-sensitive adhesive tape, and may be an adhesive tape that generates an adhesive force in response to a laser beam.
Further, the peeling angle α is not limited to 180 ° and can be changed as appropriate.

  Further, in the peeling operation of the adhesive sheet S, the operation of the chuck 37 may be stopped and only the holding unit 11 may be moved. Conversely, the operation of the holding unit 11 by the linear motor 34 is stopped and only the chuck 37 is moved. It may be moved.

  Further, the contact body 51 is formed of a material that cannot transmit a laser beam, and a through hole is provided in the surface, and the laser irradiation means 39 irradiates the laser beam in the planar shape of the through hole. Also good. However, if it is set as the structure of the said embodiment, it is advantageous at the point which can provide the versatility which can respond to the adhesive sheet S of various shapes.

  Further, the moving unit 40 may be attached to the holding unit 11 side to move the holding unit 11, or both the bonding unit 16 and the holding unit 11 may be moved.

  Further, the position regulating means 49 may be configured to maintain the state where the peeling tape PT is in contact with the adhesive sheet S by blowing gas or using static electricity.

  Further, the peeling tape PT may be composed of a simple thermoplastic film in addition to the adhesive tape.

  In the above embodiment, the temperature of the peeling tape PT is raised by the laser irradiation means 39. However, the temperature of the adhesive sheet S or the contact body 50 is raised by the laser to bond the peeling tape PT to the adhesive sheet S. You may comprise.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. The partial top view for demonstrating the irradiation area | region of a laser beam. The front view for description of the state which extended | stretched the peeling tape from FIG. FIG. 4 is an explanatory front view of a preparation state in which the peeling tape is further drawn out from FIG. 3. The front view for description of the state which affixed the peeling tape on the adhesive sheet. The front view for description of the state which sandwiched the peeling tape with the 1st and 2nd roller. (A) And (B) is a partial front view for explanation during peeling of an adhesive sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 15 Peeling means 16 Bonding means 39 Laser irradiation means 40 Moving means 49 Position control means 50 Contact body PT Stripping tape S Adhesive sheet W Semiconductor wafer (adhered body)

Claims (5)

In the sheet peeling apparatus for peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
A holding means for holding the adherend, an adhesive means for bonding the peeling tape to an adhesive sheet, and a peeling means for peeling the adhesive sheet by relatively moving the peeling tape and the adherend. ,
The bonding means includes laser irradiation means, and the laser irradiation means is provided so that the adhesive sheet and the peeling tape can be bonded by irradiating the peeling tape with a laser beam. Sheet peeling device.   2. The sheet peeling apparatus according to claim 1, further comprising a position regulating means provided so as to be able to maintain a state where the peeling tape is in contact with the adhesive sheet.   3. The sheet peeling device according to claim 2, wherein the position regulating means includes a contact body that can be positioned so as to sandwich the adhesive sheet and the peeling tape, and the contact body is provided so as to be able to transmit a laser beam. apparatus.   The laser irradiation means and the holding means are provided so as to be relatively movable via a moving means, and this moving means is provided so that the focal point of the laser beam emitted from the laser irradiation means can be moved along the outer edge shape of the adhesive sheet. The sheet peeling apparatus according to claim 1, wherein the sheet peeling apparatus is provided. In the sheet peeling method of adhering a peeling tape to the adhesive sheet affixed to the adherend, and peeling the adhesive sheet from the adherend through the peeling tape,
Holding the adherend;
The step of bonding the adhesive sheet and the peeling tape by unwinding the peeling tape and irradiating the peeling tape affixed to the adherend with a laser beam;
The sheet peeling method characterized by performing the process of peeling an adhesive sheet from an adherend by moving the said peeling tape and an adherend relatively.

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