JP2013110143A - Vacuum lamination device and method of forming insulation layer using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a running cost of a lamination device which laminates an insulation resin film in which an insulation resin layer is formed on a support base film on a wiring circuit board and removes the support base film to form an insulation layer on the wiring circuit board and enable the support base film to be removed with efficiency and stable quality.SOLUTION: A continuous line lamination device which is connected by a pair of upper and lower conveyance films 131 includes an ultrasonic welding mechanism in a conveyance film winding unit. A substrate is processed in the state that it is sandwiched between the upper and lower conveyance films 131 and insulation layers 112b are laminated on it. Support base films 111 and the conveyance films 131 remaining on a wiring circuit board 120c are bonded by ultrasonic welding and the conveyance films 131 and the support base films 111 are removed from the wiring circuit board 120c by conveyance film winding guide rollers 53 with ultrasonic welding parts 131a as the starting points.

Description

  The present invention relates to a vacuum lamination apparatus for forming an insulating layer on a printed circuit board in a multilayer printed wiring board produced by alternately stacking insulating layers and wiring layers, and a method for forming an insulating layer using the same. .

  Conventionally, as a general manufacturing method of a multilayer printed wiring board, a prepreg sheet as an insulating layer and a copper foil as a conductor layer are overlaid on an inner circuit board on which a circuit is formed, and after laminating by a laminating press, A method of connecting layers with holes has been put into practical use. This prepreg sheet is a resin sheet obtained by impregnating a glass cloth with an epoxy resin and semi-curing it. However, in this method, since the resin of the prepreg is reflowed by heat and cured under a certain pressure, at least 1.0 to 1.5 hours are required for uniform curing and molding. In addition, it is difficult to increase productivity because the number of substrates to be processed at one time is limited in the laminating press, and when heating and cooling time is included, it takes several hours for one processing. Furthermore, through-hole plating enters the outer layer, the conductor layer becomes thick, and it is difficult to form a fine pattern. In addition, the thickness of the insulating layer is limited by the glass cloth, and there is a problem that it is difficult to thin the entire multilayer printed wiring board.

  In response to such problems, the semiconductor package substrate is manufactured by a so-called build-up method in which insulating layers and conductor layers are alternately formed on the inner circuit board on which the circuit is formed, and the layers are connected by via holes formed by a laser drill. Technology has also been put into practical use. In the build-up method, the material used for forming the insulating layer is not a prepreg but an insulating resin film (dry film) obtained by applying an insulating resin to a support base film and semi-curing it. For example, Patent Document 1 and Patent Document 2 describe a multilayer printed wiring board in which an insulating resin film is laminated, heat-cured, a roughened surface is formed on the surface with a roughening agent, and a conductor layer is formed by plating. A manufacturing method is disclosed.

  In a method for producing a multilayer printed wiring board by a build-up method, an insulating layer is usually formed by laminating an insulating resin film on an inner circuit board with a pressure vacuum laminator. Recently, a fine pattern is often formed on an insulating layer, and it is necessary to flatten the surface of the insulating layer. Generally in such a lamination process, the vacuum laminator part (1st unit) and the plane press part (2nd unit) are the consistent lines connected with a pair of upper and lower conveyance films (refer to Drawing 1). The substrate is sandwiched between upper and lower transport films in a state where insulating resin films are temporarily pasted at predetermined positions on the front and back sides, proceed to vacuum laminating processing and flat pressing processing, and are cooled and discharged from the apparatus.

  Temporary sticking of the insulating resin film is performed by a temporary sticking device called an auto cut laminator. This device temporarily sticks the tip of an insulating resin film or photolithographic dry film to a predetermined position on the front and back of the substrate, laminates the dry film while feeding the substrate, and cuts the film to the last set length, It is an apparatus that sends a substrate to the next process. The temporary sticking position can be set in millimeters, and a dry film protective sheet is wound up in parallel with the lamination. Therefore, labor saving can be achieved by performing complicated operations fully automatically. In the temporary attachment of the insulating resin film, lamination is performed with a vacuum laminator, so the laminating roll does not pressurize and functions as a guide roller when feeding the film.

Since the substrate on which the insulating resin film has been laminated is subjected to via processing using a laser drill in the next step, it is necessary to peel the support base film to expose the surface of the insulating resin.
However, in a general insulating resin film, the size of the support base film is the same as the coating portion of the insulating resin, or several millimeters wide where the insulating resin is not applied along the winding (coating) direction of the insulating resin film. There are only margins. Therefore, the peeling of the support base film cannot be automated, and is generally performed manually by the operator one by one, resulting in problems of low productivity and quality variations.

  Furthermore, if it supplements, the support base film after lamination | stacking has strong adhesive force with an insulating resin, and cannot use the air blow system or the peeling apparatus (peeler) of an adhesive roll system generally used with the dry film for photolithography. In addition, the peeling device designed exclusively for the insulating resin film is expensive, and at present, a highly reliable device that can be adopted as a manufacturing facility is not commercially available. Therefore, there has been a problem that a method for efficiently and stably peeling the support base film from the laminated insulating resin film at low cost has not been established.

  For such a problem, Patent Document 3 discloses that when an adhesive layer is formed in advance on a support base film of an insulating resin film and adhered to a transport film in the course of a vacuum laminating process, the transport film is wound up. A method for automatic peeling is described. In this method, an adhesive layer is formed on the surface of the support base film that contacts the transport film. In order to avoid uneven thickness of the insulating resin layer, the adhesive layer is formed in a blank portion of the support base film where the insulating resin layer is not formed. Further, since the adhesive layer is formed simultaneously with the application of the insulating resin, the adhesive layer is formed in a strip shape or a line shape along the winding direction of the insulating resin film as shown in FIG.

  In patent document 3, as a kind of adhesive, in order to avoid quality deterioration of the insulating resin film, a solvent-free adhesive having no tack (adhesiveness) at room temperature, particularly a hot melt adhesive is preferable. Hot melt adhesives are not only solidified at the same time as cooling, but also exhibit adhesiveness, and those having various melting temperatures are commercially available, and have an advantage that the melting characteristics can be adjusted when the lamination temperature is changed.

  When the insulating resin film on which the adhesive layer is formed is temporarily laminated on the printed circuit board, the adhesive is melted at the laminating temperature, and the support base film and the transport film are melted and adhered. In this state, through the flat pressing process, the transport film and the support base film are completely bonded to each other when the substrate is finally cooled. When the substrate is finally discharged, the support base film is automatically peeled in a form of being separated by the upper and lower guide rollers of the transport film.

  On the other hand, Patent Literature 4 describes a method of discharging and forming an adhesive layer with a heat gun installed in a vacuum laminator charging machine. In this method, when the substrate on which the insulating resin film is temporarily attached is put into a pressure vacuum laminator, adhesive layers are formed on both side ends of the insulating resin film 110 along the substrate transport direction as shown in FIG. To do. The adhesive layer is formed in a strip shape or a line shape outside the effective surface of the substrate.

  Further, Patent Document 4 proposes a method of attaching a heat gun to a temporary attachment position of an auto-cut laminator in order to improve the peelability of the support base film and increase the accuracy of the formation position of the adhesive layer. As shown in FIG. 13, this method has an advantage that the starting point when the support base film is peeled and the adhesive layer overlap with each other, so that peeling failure is hardly caused. In Patent Document 3, the adhesive layer is formed at the time of manufacturing the insulating resin film, but in the method of Patent Document 4, since the adhesive layer is formed on the apparatus side immediately before the vacuum laminating process, it can be applied to various insulating resin films. There are advantages.

Japanese Patent Laid-Open No. 11-087927 JP 2001-196743 A JP 2005-340594 A JP 2005-340595 A

  However, the method for forming an insulating layer according to Patent Document 3 has a problem that the manufacturing cost of the insulating resin film increases. The insulating resin film is divided into several products by slitting the coating raw material, but the insulating resin film used here must be coated with the insulating resin in a state of leaving blanks at both ends of the support base film. Therefore, a support base film having a narrower width than usual is used, and the area efficiency during coating is lowered. In addition, a new process is required to form the adhesive layer, and the manufacturing cost is further increased due to the addition of equipment cost and the reduction in yield.

  Moreover, in patent document 3 and 4, since the adhesive bond layer is formed in the both ends of an insulating resin film, the center part of a support base film is not adhere | attached with a conveyance film. Accordingly, when the substrate is discharged, as shown in FIG. 14, wrinkles are generated in the central portion of the support base film in the process of peeling the support base film from the insulating layer with the upper and lower guide rollers, and peeling marks ( Unevenness) 141 is likely to occur.

  Furthermore, in the conventional method, since the adhesive layer is formed in a strip shape (linear shape) along the winding direction at both ends of the insulating resin film, the amount of adhesive used in the above method is more than necessary. There's a problem. In the method of attaching the nozzle applicator to the temporary cut position of the auto-cut laminator, the use of the adhesive can be minimized, but the cost increase due to the use of the adhesive is inevitable.

  The present invention has been devised in view of the above problems. An insulating resin film in which an insulating resin layer is formed on a support base film is laminated on a printed circuit board, and the support base film is peeled off to insulate on the printed circuit board. An object of the present invention is to provide a laminating apparatus for forming a layer with a low running cost and capable of efficiently peeling a supporting base film, and a method for forming an insulating layer using the laminating apparatus.

  In order to achieve the above-mentioned object, the present invention at least overlaps an insulating resin film having an insulating resin layer formed on a support base film so that the surface of the insulating resin layer faces the surface of the printed circuit board, An auto-cut laminator unit 10 that temporarily sticks a predetermined area outside the effective area of the printed circuit board and an end of the insulating resin layer, and then cuts the insulating resin film into a predetermined size, and the insulating resin film temporarily A transport film feeding unit 20 for superimposing a transport film on the pasted wiring circuit board, and a vacuum pressure laminator unit 30 for laminating the insulating resin layer on a surface of the wiring circuit board under a predetermined condition to form an insulating layer; A flat press unit 40 for smoothing the insulating layer formed on the surface of the wired circuit board; and formed on the surface of the wired circuit board. The carrier film and the support base film in a state where the support base film remaining on the surface of the insulating layer and the carrier film are joined by ultrasonic welding and the insulating layer is left on the surface of the wiring circuit board. And a transport film take-up unit 50 that peels from the printed circuit board.

  According to another aspect of the present invention, there is provided an insulating layer forming method characterized in that an insulating layer is formed on a printed circuit board using the vacuum laminating apparatus.

  In this invention, a support base film and the conveyance film of a pressurization vacuum laminator are joined by ultrasonic welding. By using ultrasonic welding and not using an adhesive, running cost can be reduced, and there is an effect that quality and productivity can be improved by reliably joining in a short time. When using an adhesive as in the past, a heat gun that discharges the adhesive and a melter that discharges the melted adhesive with a pump is necessary, but since the melter always heats the adhesive, standby power may be large It is a problem. In addition, there is a concern about the problem of bad odor due to the melted adhesive at the manufacturing site. On the other hand, according to the present invention, the ultrasonic welding unit includes an ultrasonic oscillator, an ultrasonic horn, and a stay for stabilizing the pressurization, and both standby power and power consumption are low. According to this method of the present invention, the bonding time is only a few seconds and no consumables are used. Therefore, there is an effect that the running cost can be kept low without reducing the productivity.

  By using the vacuum laminating apparatus of the present invention, the supporting base film is peeled off by an inexpensive method associated with normal laminating operation without introducing expensive equipment such as an auto peeler, and an insulating resin is formed on the printed circuit board. There is an effect that the layer can be formed efficiently. Further, since the peeled support base film is wound and collected together with the transport film, the occupied space is small and the burden of disposal work is reduced. That is, it is excellent in productivity and economy, and has an effect that the insulating layer can be stably formed with quality, yield and the like.

It is a schematic block diagram which shows one Example of the vacuum lamination apparatus of this invention. (A) is a perspective view which shows an example of the winding film which winds up the insulating resin film 110 of this invention. (B) is a schematic cross-sectional view of the insulating resin film 110 obtained by cutting the perspective view of (a) along the line AA ′. (A) is a schematic plan view which shows an example of the wiring circuit board 120 of this invention. (B) is a schematic cross-sectional view of the printed circuit board 120 obtained by cutting the schematic plan view of (a) along the line BB ′. (A) is a schematic top view of the wiring circuit board 120a which temporarily bonded the insulating resin film 110 on both surfaces of the wiring circuit board 120 of this invention. Reference numeral 112a denotes a temporary pasting portion. (B) is a schematic cross-sectional view of a printed circuit board 120a obtained by cutting the schematic plan view of (a) along the line CC ′. FIG. 3 is a schematic cross-sectional view showing a wired circuit board 120b in which a transport film 131 is sandwiched on both surfaces of the wired circuit board 120a of the present invention. FIG. 5 is a schematic cross-sectional view showing a printed circuit board 120c obtained by subjecting the printed circuit board 120b to a vacuum laminating process and then a plane pressing process according to the present invention. It is explanatory drawing which shows the state which carried out ultrasonic welding of the support base film 111 on the insulating layer 112b of the layout circuit board 120c, and the conveyance film 131 of this invention. 131a is a joining portion by ultrasonic welding. It is a schematic block diagram which shows an example of the attachment position of the ultrasonic horn 55 of this invention. It is explanatory drawing which shows the state which has peeled the conveyance film 131 and the support base film 111 from the printed circuit board 120c of this invention. It is a schematic structure sectional view showing wiring circuit board 120d in which insulating layer 112b was formed in both sides of wiring circuit board 120 of the present invention. It is a perspective view which shows an example of the winding film which wound up the insulating resin film 110 which formed the adhesive layer 113 in the both ends of the support base film of a prior art. (B) is a schematic cross-sectional view of the insulating resin film 110 obtained by cutting the perspective view of (a) along the line DD ′. It is a perspective view which shows an example of the conventional wiring circuit board which formed the adhesive layer 113 in the both ends of the insulating resin film 110 along the conveyance direction of a board | substrate. (B) is a schematic cross-sectional view of a printed circuit board obtained by cutting the perspective view of (a) along the line EE ′. It is a perspective view which shows an example of the wiring circuit board which formed the contact bonding layer 113 near the temporary sticking position 112a of the insulating resin film 110 of a prior art. (B) is a schematic cross-sectional view of a printed circuit board obtained by cutting the perspective view of (a) along line FF ′. It is a schematic diagram which shows the generation | occurrence | production state of the peeling trace (nonuniformity) 141 of a prior art.

A schematic structural diagram showing an embodiment of the vacuum laminating apparatus of the present invention is shown in FIG.
Here, the area where the wiring layer of the printed circuit board 120 is formed is referred to as an effective area 121 of the printed circuit board. In the vacuum laminating apparatus of the present invention, after the insulating resin film 110 is temporarily attached to the printed circuit board 120, the auto-cut laminator unit 10 that cuts the insulating resin film 110 into a predetermined size and the insulating resin film 110 are temporarily attached. It is characterized by comprising a transport film delivery unit 20 for superimposing the transport film 131 on the printed circuit board 120, a vacuum pressure laminator unit 30, a flat press unit 40, and a transport film take-up unit 50.

  Here, the auto-cut laminator unit 10 is configured so that the surface of the insulating resin film 110 in which the insulating resin layer 112 is formed on the support base film 111 described later is opposed to the surface of the printed circuit board 120. The insulating resin film 110 is temporarily attached to the printed circuit board 120 by overlapping the end portion of the insulating resin layer 112 in a predetermined area outside the effective area 121 of the printed circuit board.

  In addition, the vacuum pressurization laminator unit 30 heats and heats the printed circuit board 120 and the insulating resin film 110 in a state where the transport film 131 is superimposed on the printed circuit board 120 on which the insulating resin film 110 is temporarily attached, under predetermined conditions. The printed circuit board 120c on which the insulating layer 112b obtained by curing the insulating resin layer 112 by the pressing lamination process is laminated is manufactured.

  The flat press unit 40 smoothes the insulating layer 112b formed on the surface of the printed circuit board 120c.

  The transport film take-up unit 50 forms an ultrasonic weld 131a by ultrasonic welding of the support base film 111 and the transport film 131 remaining on the surface of the printed circuit board 120c with the insulating layer 112b on the surface. And join. Next, the transport film 131 and the support base film 111 which are welded by the ultrasonic welding portion 131a are peeled off from the printed circuit board 120c having the insulating layer 112b as a surface.

  In the vacuum laminating apparatus of the present invention, the insulating resin layer 112 of the insulating resin film 110 in which the insulating resin layer 112 is formed on the support base film 111 is transferred onto the printed circuit board 120 on which the wiring layer and the like have been previously formed for insulation It is a stacking apparatus for forming the layer 112b. Hereinafter, each unit constituting the vacuum laminating apparatus of the present invention will be described.

  The auto-cut laminator unit 10 is a device that cuts an insulating resin film 110 in which an insulating resin layer 112 is formed on a support base film 111, which will be described later, into a predetermined size and attaches it to a predetermined position on the printed circuit board 120. Typical models include Mach630 manufactured by Hakuto Co., Ltd., TLD-6500 manufactured by Hitachi Plant Technologies, Ltd., and MTA-602 manufactured by MCK Co., Ltd.

First, an insulating resin film 110 for use in the auto cut laminator unit 10 is separately prepared. The insulating resin layer 112 is formed by a method such as applying a resin solution on one surface of the support base film 111 made of a PET film or the like by roll coating or attaching and transferring the resin film. Then, as shown in FIGS. 2A and 2B, the insulating resin layer 1
The surface of 12 is covered with a protective film and wound into a roll shape, and a winding roll 11 of the insulating resin film 110 is produced. Specifically, a commercially available insulating resin film 110 (ABF-GX, manufactured by Ajinomoto Fine Techno Co., Ltd.) can be used.

  Next, the printed circuit board 120 is conveyed to the auto-cut laminator unit 10 by the roller conveyor 14. In the wired circuit board 120, as shown in FIGS. 3A and 3B, an area where a wiring layer or the like is formed is referred to as an effective area 121 of the wired circuit board.

  The auto-cut laminator unit 10 is loaded with the winding roll 11 of the insulating resin film 110 in which the insulating resin layer 112 is formed on the support base film 111 described above. Then, the auto-cut laminator unit 10 supplies the insulating resin film 110 from the take-up roll 11 and winds the protective film of the insulating resin film 110 with the protective film take-up roll 13 so that the surface of the insulating resin layer 112 is covered. After the exposure, the tip of the insulating resin film 110 is adsorbed to the temporary attachment plate 12.

  Next, the temporary attachment plate 12 moves downward to bring the insulating resin layer 112 of the insulating resin film 110 into contact with the printed circuit board 120. Next, as shown in FIGS. 4A and 4B, the tip of the insulating resin layer 112 covering a predetermined portion outside the effective area 121 of the printed circuit board is heated, and the portion is crimped to the printed circuit board 120. Thus, the temporary attachment portion 112a of the insulating resin layer is formed.

  Further, in the automatic cut laminator unit 10, the roller conveyor 14 and the laminating roll 15 work together to feed the printed circuit board 120 and cut the insulating resin film 110 at a predetermined position. In the auto-cut laminator unit 10, as shown in FIGS. 4A and 4B, the insulating resin film 110 cut to the size of the wiring circuit board 120 is wired at the temporary bonding portion 112 a of the insulating resin layer at the tip. A wired circuit board 120a temporarily attached to the circuit board 120 is obtained.

  Next, the printed circuit board 120 a is sent to the transport film sending unit 20 by the roller conveyor 14. In the transport film delivery unit 20, the transport film 131 is sent from the transport film delivery roll 21, and the transport film 131 is overlapped with the printed circuit board 120 a by the guide roller 22. Thereby, as shown in FIG. 5, the printed circuit board 120 b sandwiched on both sides by the transport film 131 is formed.

  The transport film 131 may be a PET film such as PTH-38 manufactured by Unitika Co., Ltd., 26X42 manufactured by Toray Industries, Inc., SP36 manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., or the like. It is particularly desirable to use a transport film 131 whose surface is roughened like these PET films. The reason is that the air between the wiring circuit board 120a and the transport film 131 is easily removed during vacuum lamination, so that the quality of the insulating layer 112b formed on both surfaces of the wiring circuit board 120c is stabilized when it is next laminated. This is because there is an effect.

  Next, the printed circuit board 120b sandwiched on both sides by the transport film 131 is moved by film transport, and the air between the printed circuit board 120a and the transport film 131 is removed by the pressurized vacuum laminator unit 30 to perform the lamination process. Then, it is fed into the flat press unit 40.

  In the pressurizing vacuum laminator unit 30, the insulating resin layer 112 on the support base film 111 is laminated and heated on both sides of the wiring circuit board 120. In the flat press unit 40, the insulating resin layer 112 is formed on both sides of the wiring circuit board 120 c. The smoothing process of the insulating layer 112b is performed, and the printed circuit board 120c on which the hardened insulating layer 112b is formed is manufactured as shown in FIG.

  For the pressurized vacuum laminator unit 40 and the flat press unit 50, commercially available pressure vacuum laminators such as CVP-300 of Nichigo Morton Co., Ltd. and MVLP-500 / 600IIB of Meiki Seisakusho Co., Ltd. are used. can do. These models are particularly preferable because they include a pressurized vacuum laminator unit 40 and a flat press unit 50, which are connected by a film transport system.

  Next, the printed circuit board 120 c is sent out from the flat press unit 40 and sent to the transport film winding unit 50. In the transport film take-up unit 50, the printed circuit board 120c is stopped for one cycle, and is cooled by the upper and lower cooling fans 54 during that time.

  In addition, the transport film winding unit 50 includes an ultrasonic horn 55. In the transport film winding unit 50, the ultrasonic horn 55 ultrasonically welds a predetermined position of the transport film 131 corresponding to the tip of the insulating resin film 110 to the support base film 111 as shown in FIG.

  In a normal laminating process, one cycle is about 1 minute, but in a conventional manufacturing method using a hot melt adhesive, when the time of one cycle is short, the cooling time of the hot melt adhesive by cooling the substrate is insufficient. Thus, there is a problem that sufficient adhesive strength between the transport film 131 and the support base film 111 cannot be obtained. Therefore, there is a problem that peeling of the support base film 111 from the printed circuit board 120c in the transport film winding unit 50 may not be stable.

  In contrast, in the present invention, since the time required for welding the support base film 111 to the transport film 131 by ultrasonic welding with the ultrasonic horn 55 is only a few seconds, sufficient adhesive strength between the transport film 131 and the support base film 111 is obtained. There is an effect to be obtained. In particular, if the transport film 131 and the support base film 111 are made of the same material, particularly good adhesive strength between the transport film 131 and the support base film 111 can be obtained.

  Since the ultrasonic welding part 131a acts as a trigger when the support base film 111 is peeled off, a straight line is formed along the straight line perpendicular to the substrate transport direction at the tip of the support base film 111 with respect to the substrate transport direction. It is preferable to form at a plurality of locations including the central portion and both end portions. Although the shape of the ultrasonic welding part 131a corresponds to the shape of the contact surface of the ultrasonic horn 55, a large number of thin stick-shaped ultrasonic horns 55 may be arranged linearly, Several sonic horns 55 may be arranged.

  In the present invention, the ultrasonic weld 131a formed at the tip of the support base film 111 is formed at a plurality of locations including a straight center and both ends along a straight line perpendicular to the substrate transport direction. The central portion of the front end portion of the support base film 111 is also bonded to the transport film 131 by the ultrasonic welding portion 131a. Therefore, as shown in FIG. 9, wrinkles are formed at the center of the support base film 111 in the process of peeling the support base film 111 from the insulating layer 112b of the printed circuit board 120c by winding with the upper and lower transport film winding guide rollers 53. There is an effect that does not occur. That is, the present invention has an effect that no peeling mark (unevenness) 141 occurs on the surface of the insulating layer 112b.

  As shown in FIG. 8, the ultrasonic horn 55 is installed on the outside of the transport film 131, at a position above and below the substrate, and after the printed circuit board 120c stops, it slides in the direction of the substrate and welds under predetermined conditions. Do. Further, in order to reliably perform ultrasonic welding, it is necessary to press the ultrasonic horn 55 against the adhesive with a constant pressure, so the ultrasonic horn 55 is attached to an air cylinder capable of controlling pressure.

  What is important in the ultrasonic welding conditions by the ultrasonic horn 55 is the pressure, the oscillation time, and the amplitude. These are optimized by the combination of the shape and material of the ultrasonic horn 55 and the base material to be welded. For example, when the thin stick-shaped ultrasonic horn 55 is used, if the pressure is increased, the pressure on the contact surface increases and a sufficient amplitude cannot be obtained. On the other hand, when the contact surface is formed in a line shape, it is necessary to increase the pressure and amplitude to apply an appropriate load to the contact surface. However, care should be taken, such as vibration being stopped if the load is applied too much, the ultrasonic horn 55 may be deformed, or the temperature of the welding interface will be too high, resulting in damage to the substrate. More specifically, a protrusion-like structure can be provided on the contact surface of the ultrasonic horn 55 to form a spot-shaped weld, but this is omitted here.

  The ultrasonic welding apparatus for driving the ultrasonic horn 55 of the transport film winding unit 50 uses a commercially available ultrasonic welding machine such as Branson (USA), Dukane (USA), Herman (Germany), or the like. be able to. Moreover, since the thickness of the printed circuit board 120 differs for each product, it is preferable to include an air cylinder that can automatically control the applied pressure and an oscillator that can automatically control the oscillation output. The ultrasonic horn 55 is attached to the transport film take-up unit 50 in a state where it is attached to the air cylinder, and the transmitter can be installed in a place where it can be easily operated outside the apparatus.

  When the printed circuit board 120c on which the insulating layer 112b is laminated is discharged from the carry film take-up unit 50, the carry film 131 and the support base film 111 are peeled off from the printed circuit board 120c as shown in FIG. As shown in FIG. 10, the printed circuit board 120 d in which the insulating layers 112 b are formed on both surfaces of the printed circuit board 120 can be obtained. In this process, the conveying film 131 and the support base film 111 are peeled off from the printed circuit board 120 by the conveying film take-up guide roller 53, starting from the ultrasonic welding part 131a.

  The support base film 111 and the printed circuit board 120 may be joined depending on the ultrasonic welding conditions of the transport film 131 and the support base film 111 and the shape of the substrate. However, the transport film 131 and the support base film 111 are the same. When formed of PET material, there is an effect that the transport film 131 and the support base film 111 can be peeled off from the printed circuit board 120c without problems as follows. That is, during this peeling process, the bonding strength between the PET material of the transport film 131 and the support base film 111 is the strongest, so that it is stable at the interface between the insulating layer 112b on the surface of the printed circuit board 120c and the support base film 111. And can be peeled off.

  The support base film 111 peeled off from the printed circuit board 120c is wound and collected together with the transport film 131 on the transport film take-up roll 51.

  In the present invention, the mounting position of the ultrasonic horn 55 is the substrate cooling unit of the transport film take-up unit 50. However, when a substrate cooling unit is added to the laminating process, it is easy to secure the installation space. It can also be attached to the unit.

  In addition, ultrasonic welding of the transport film 131 and the support base film 111 may be performed at any stage of the lamination process, but in a state where the insulating resin film 110 is temporarily attached, for example, like the wiring circuit board 120a, It is preferable to carry out after the insulating layer 112b has been laminated, because the temporary sticking portion may be peeled off by ultrasonic welding and the insulating resin film 110 may be wrinkled when the ultrasonic horn 55 is pressed.

According to the method for forming the insulating layer 112b using the vacuum laminating apparatus of the present invention, the support base film 111 can be peeled by an inexpensive method associated with a normal laminating operation without introducing expensive equipment such as an auto peeler. As a result, the insulating layer 112b can be efficiently formed on the printed circuit board 120. Further, since the peeled support base film 111 is wound and collected together with the transport film 131 on the transport film take-up roll 51, the occupied space is small and the burden of disposal work is reduced. In other words, the insulating layer 112b can be formed stably in terms of quality, yield, etc. with excellent productivity and economy.

  Furthermore, by repeating circuit formation, via formation, and formation of the insulating layer 112b a predetermined number of times on the insulating layer 112b of the wired circuit board 120d obtained by the above manufacturing method, a multilayer wiring circuit board, a semiconductor package board, etc. Can be easily manufactured.

10 .... Automatic cut laminator unit 11 .... Insulating resin film unwinding roll 12 .... Air adsorption board 13 ... Protective film winding roll 14 ...... Roller conveyor 15 ... Laminating roll 20 ... Transport film unwinding unit 21 ... Transport film unwinding roll 22 ... Guide roll 30 ... Vacuum pressure laminator unit 31a ... Heating plate on vacuum laminator 31b ··· Vacuum laminator lower heating plate 40 ··· Flat pressing unit 41a · · · Flat pressing upper heating plate 41b · · · Flat pressing lower heating plate 50 · ··· Conveying film winding unit 51 ··· ..Conveying film take-up roll 52... Nip roll 53... Conveying film take-up guide roller 54. · Cooling fan 55 ··· Ultrasonic horn 110 ··· Insulating resin film 111 ··· Support base film 112 ··· Insulating resin layer 112a · · · Temporary bonding portion 112b of insulating resin layer ··· .... Insulating layer 113 ... Adhesive layer 120 ... Wiring circuit board 120a ... Wiring circuit board 120b on which an insulating resin film is temporarily attached ... Wiring circuit sandwiched between upper and lower transfer films Substrate 120c ... Wiring circuit board 120d after lamination processing ... Wiring circuit board 121 after supporting base film peeling ... Effective area 131 of wiring circuit board ... Transport film 131a ... Ultrasonic welding part 141... Peeling mark (unevenness)

Claims (2)

  At least an insulating resin film having an insulating resin layer formed on a support base film is overlaid so that the surface of the insulating resin layer faces the surface of the printed circuit board, and a predetermined area outside the effective area of the printed circuit board An auto-cut laminator unit (10) that cuts the insulating resin film into a predetermined size after temporarily attaching an end portion of the insulating resin layer, and a transport film on the wiring circuit board on which the insulating resin film is temporarily attached. A transfer film feeding unit (20) for superimposing, a vacuum pressure laminator unit (30) for laminating the insulating resin layer on the surface of the wiring circuit board under a predetermined condition to form an insulating layer, and a wiring circuit board A flat press unit (40) for smoothing the insulating layer formed on the surface, and a surface of the insulating layer formed on the surface of the wired circuit board The remaining support base film and the transport film are joined by ultrasonic welding, and the transport film and the support base film are removed from the wiring circuit board in a state where the insulating layer is left on the surface of the wiring circuit board. A vacuum laminating apparatus comprising: a transport film take-up unit (50) for peeling.   A method for forming an insulating layer, comprising: forming an insulating layer on a printed circuit board using the vacuum lamination apparatus according to claim 1.