JP2003008176A - Manufacturing method of multi-layer board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of multi-layer board with an improved yield at molding. SOLUTION: A board 2 is cut into a size according to the molding machine, and the boards are jointed by using a jointing material, in which the edges of adjoining boards 2 are bonded with a tape material 3 as an example, to fabricate a sheet-shaped connected board 1. In a process for the connected board 1, a plurality of circuit pattern 5, each as an inner layer circuit board 8, are formed in one board 2. Then, the connected board is cut at a connected part 3a jointed with the jointing material to form an inner layer material 4 with a size according to the molding machine. An outer material is stack on the inner layer material 4 through a prepreg 9 and molded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a multi-layer laminate using an elongated sheet-like connecting substrate, which is produced by adhering an end portion with a tape material, as an inner layer material.

[0002]

2. Description of the Related Art Multi-layer printed wiring boards are used as electronic devices and electric parts. This multilayer printed wiring board is produced using a multilayer laminate obtained by laminating an outer layer material such as a metal foil on a circuit board for an inner layer on which a circuit pattern for the inner layer is formed via a prepreg, and molding this laminate. . The circuit board for the inner layer is manufactured, for example, by forming a circuit on the surface of a substrate such as a double-sided metal foil-clad laminate. In the production of the circuit board for the inner layer, for example, a dry film made of a photosensitive resin is provided on the substrate, a resist layer is formed on the substrate through exposure processing and development processing, and a resist layer on the substrate is subjected through etching processing. Is to be removed.

When manufacturing a circuit board for an inner layer through a plurality of steps as described above, when a short-sized board is used, conventionally, various kinds of processing are performed on each board. The processing efficiency was poor.

[0004]

On the other hand, the multilayer laminate is
It has been widely used to mold with a molding size of 500 mm x 500 mm or less. However, for efficiency, the multilayer laminate has a larger size, for example, 1000 mm x 500 mm.
It has been proposed to mold it in a size of the order of magnitude. In order to form a multi-layer laminated board with such a large size, a plurality of short inner layer circuit boards are arranged according to the size of the molding machine to prevent misalignment of these inner layer circuit boards during molding. The inner-layer circuit board adjacent to is attached by tape or molded. For this reason, in the molding of a multilayer laminated plate, it takes a lot of work time to combine the constituent materials. Therefore, a method for manufacturing a multilayer laminated plate with improved productivity is desired.

Further, in forming a circuit, a continuous method is adopted in which a long substrate is conveyed in the longitudinal direction and a processing for continuously forming a circuit pattern on the substrate is performed. Is starting to appear. However, such a continuous process cannot be performed on a substrate already formed in a short length. Therefore, the present applicant has proposed to carry out such a continuous method even on a substrate formed in a short length (Japanese Patent Application No. 2000-360).
235). In this continuous substrate processing method, end portions of a plurality of substrates are joined by adhering a tape material to each other to produce a continuous sheet-shaped connecting substrate, and the continuous processing is performed.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a multilayer laminated board which can realize improvement in productivity during molding.

[0007]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found that, for example, when a multi-layer laminate is molded by a molding machine having a molding size of 1000 mm × 500 mm. Then, a double-sided metal foil-clad laminate is cut into 1000 mm x 500 mm as a substrate, and the end portions of this substrate are processed into a long sheet-shaped connecting substrate to which a tape material is attached, and a circuit is formed on one substrate. When a plurality of patterns are formed and an inner layer material with a size of 1000 mm × 500 mm is manufactured, the inner layer material is suitable for the size of the molding machine, and therefore, a process such as attaching with tape to prevent misalignment. Therefore, the present invention has been completed and found that the working time can be shortened and the productivity can be improved.

A method of manufacturing a multilayer laminate according to claim 1,
After cutting the substrate into a size corresponding to the size of the molding machine to be molded, after joining the substrates by joining the ends of a plurality of adjacent substrates with a bonding material, to produce a long sheet-like connected substrate, This connecting board is processed to form a plurality of circuit patterns that will become the inner layer circuit board on a single board, and then separated at the connecting part that is joined with the joining material to a size corresponding to the size of the molding machine. Of the inner layer material, and then the outer layer material is laminated on the obtained inner layer material via a prepreg, and molded. As described above, since the inner layer material corresponding to the size of the molding machine having a larger size is adopted, the working time can be shortened and the productivity can be improved.

A method for manufacturing a multilayer laminate according to claim 2 is
In the method for producing a multilayer laminate according to claim 1, the size of the inner layer material in the longitudinal direction is 1000 mm or more, and the size in the width direction is 500 mm or more.

A method for manufacturing a multilayer laminate according to claim 3 is
The method for manufacturing a multilayer laminate according to claim 1 or 2, wherein after the connecting substrate is processed, there is a step of winding in a roll shape, and a cushioning material is inserted at the time of winding. It is characterized in that the cushion material is wound while being applied to the surface of the substrate. Due to the above, when the connection board is rolled into a roll after being processed, there is a risk that buckling may occur at the connection part to which the tape material is attached and an indentation may occur on the circuit surface overlapping with this, but the cushioning material It is possible to maintain a good circuit surface by using the.

A method for manufacturing a multilayer laminate according to claim 4 is
The method for manufacturing a multilayer laminated board according to any one of claims 1 to 3, wherein the joining material is joined by attaching a tape material to an end portion of the substrate.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described with reference to the drawings.
FIG. 1A is a perspective view showing an example of a connection board on which a circuit to which the present invention is applied is formed, FIG. 1B is a perspective view showing an example of an inner layer material, and FIGS. 2A and 2B are shown. It is sectional drawing of the principal part which showed the step of sticking a tape material on a board | substrate.

The connecting board 1 used in the present invention is subjected to a processing treatment so that the inner layer material 4 can be formed when a multilayer laminated board is formed.
It can be used as. This connection board 1
Is a long sheet shape in which the ends of a plurality of adjacent substrates 2 and 2 are connected by a connecting portion 3a. The connection of the ends of the substrates 2 and 2 can be formed by joining with a joining material such as affixing the tape material 3. In the production of this connection board 1, first, the board 2 is cut into a size corresponding to the size of a molding machine for molding a multilayer laminated plate. The size corresponding to the size of the molding machine refers to the maximum size that can be effectively molded by the molding machine, and the minimum size is at least ½ or more of the maximum size in the longitudinal direction and the width direction.

As shown in FIG. 2, the connection board 1 can be manufactured by attaching the tape material 3 to the ends of the boards 2 and 2. The substrate 2 may be a laminated plate in which the insulating layer 7 and the conductor layer 6 are laminated and integrated. Specifically, the laminated plate is formed by impregnating a base material such as a glass woven cloth or a glass non-woven cloth with a resin such as an epoxy resin to form a prepreg which is semi-cured by heating and drying, and laminating a required number of the prepreg. An example is a double-sided metal foil-clad laminate, which is integrated by heating and pressing a laminate in which metal foils such as copper foils are laminated on both sides. In this case, the insulating layer 7 is formed of the cured product of the prepreg and the conductor layer 6 is formed of the metal foil.

The tape material 3 includes a base material layer 11 and
It is possible to use a material including an adhesive layer 12 arranged on one surface side of the base material layer 11. The base material layer 11 can be formed of a polyethylene terephthalate film or a polyimide film. The adhesive layer 12 may be formed of an appropriate adhesive, but may be formed of a thermoplastic resin such as a polyester resin or a thermosetting resin such as an epoxy resin.

In the joining of the substrates 2 with the tape material 3, the substrates 2 and 2 to be joined are arranged with their end faces facing each other. At this time, the end surface of the substrate 2 facing each other has a slight gap 20.
It is preferable to separate them with a gap. In this state, the tape material 3 is arranged along the seam (gap) between the substrates 2 on each of the one surface side and the other surface side of the substrate 2, and the end surface of one substrate 2 to the end of the other substrate 2 is arranged. The adhesive layer 12 is arranged over the surface of the part, and the base material layer 11 is arranged on the outer surface of the adhesive layer 12.

Next, by heating the tape material 3, the adhesive layer 12 is melted. When the gap 20 is provided between the end faces of the substrates 2, part of the adhesive layer 12 flows into the gap between the substrates 2 due to the flow of the adhesive layer 12. At this time, when the tape materials 3 are arranged on both sides of the seam of the substrate 2, the adhesive layers 12 of the tape materials 3 are integrated in the gap between the end faces of the substrate 2. In this state, the adhesive layer 12
If a material made of a thermosetting resin is used, heating is further performed, and if a material made of a thermoplastic resin is used, the adhesive layer 12 is hardened by cooling. By doing so, as shown in FIG. 2B, the end surface of one substrate 2 and the end surface of the other substrate 2 are adhered to the base material layer 11 via the adhesive layer 12, and are also adhered. By filling the space between the end faces of the substrate 2 with the layer 12, the ends of the substrate 2 are also bonded to each other via the adhesive layer 12. As a result, the ends of the substrate 2 are joined together.

Examples of the processing applied to the connecting substrate 1 include polishing, dry film laminating, exposure, development, etching, peeling, drying, surface treatment and the like. The connection substrate 1 is subjected to the above-mentioned processing, so that the circuit pattern 5 to be an inner layer circuit is formed. In the present invention, one substrate 2 of the connection substrate 1 is used.
On the other hand, a plurality of circuit patterns 5 which are to be the inner layer circuit board 8 alone are formed. Then, the connection substrate 1 is a tape material 3
The inner layer material 4 is obtained by separating at the connecting portion 3 to which is adhered. FIG. 1 shows the connection board 1 in which three circuit patterns 5 are formed on an inner layer material 4 produced from one board 2. The inner layer material 4 has three circuit patterns 5a, 5b, and 5c arranged in parallel on the surface at predetermined intervals. When the inner layer material 4 is cut between the adjacent circuit patterns 5a, 5b, 5c (dotted line portions in FIG. 1B), when the printed wiring board is manufactured, the inner layer circuit boards 8a, 8b, 8c
It can be used as.

Further, the connection board 1 is not always subjected to continuous cutting and separating work after being subjected to processing. Practically, the connection substrate 1 may be processed into a roll, wound into a roll, and conveyed to the next step. Therefore, it is desirable that the connection board 1 be wound while the cushion material 21 is inserted at the time of winding and the cushion material 21 is applied to the surface of the board. An example of the cushion material 21 is a polyethylene terephthalate (PET) film having a thickness of about 150 to 300 μm. If the connecting board 1 is wound without inserting the cushion material 21, the connecting board 3 may be buckled at the connecting portion 3a to which the tape material 3 is adhered, and an indentation may be formed on the circuit surface overlapping with this. The connection board 1 can hold a good circuit surface by inserting the cushion material 21.

In addition, it is preferable that the connection board 1 is a thin material having a thickness of the base material 2 of about 0.04 to 0.2 mm for winding. In particular, the thickness of the base material 2 is 0.04
An ultra-thin material having a thickness of about 0.06 mm may be chipped or torn during transportation when a conventional single plate is used for processing. It is preferable because it can prevent various troubles.

Next, the molding of a multilayer laminate using the obtained inner layer material 4 will be described. FIG. 3 is a schematic cross-sectional view schematically showing the combination of the multilayer laminated plate before molding, and FIG.
[Fig. 4] is a schematic cross-sectional view showing a state after molding of the multilayer laminated board, and Fig. 4 (b) is a schematic cross-sectional view of the obtained printed wiring board. The multilayer laminate of the present invention may use one inner layer material 4 or a plurality of inner layer materials 4. The figure shows the inner layer material 4
Shows a multilayer laminated board using one sheet and a multilayer printed wiring board having four layers of circuits.

As shown in FIG. 3, the method for manufacturing the above-mentioned multi-layer laminated board is such that prepregs 9 are laminated on both outer sides of the inner layer material 4,
Further, the outer layer material of the metal foil 10 is laminated on the outer side thereof to form a laminated body, and the laminated body is sandwiched between molding plates 13 made of stainless steel or the like for molding. The prepreg 9 may be the same as that used to form the insulating layer 7 of the inner layer material 4 described above. Examples of the metal foil 10 include copper foil. In the molding of the above-mentioned multilayer laminate, a plurality of the laminates and the molding plate 13 are alternately stacked, placed in a molding machine, and heated and pressed. By the manufacturing method described above, the resin of the prepreg 9 is cured to form the insulating layer 9a.
A multilayer laminated board as shown in is obtained.

Since the above-mentioned manufacturing method corresponds to the size of the molding machine for molding the inner layer material 4, there is a conventional step of sticking the inner layer circuit board with tape so as not to cause a positional deviation. do not need. Therefore, the manufacturing method,
Working time can be shortened and productivity can be improved. In the above manufacturing method, the inner layer material 4 has a longitudinal size of 1
The effect can be remarkably exhibited when a sheet having a width of 000 mm or more and a size in the width direction of 500 mm or more is adopted. The manufacturing method is, for example, 1300 to 1000 × 600 to 500.
It is suitable when molding a large size of about mm. Further, the above-mentioned multi-layer laminate is more suitable for molding a laminate having a total thickness of 0.3 mm or less.

The multilayer laminated board thus obtained is cut and the outer layer circuit 15 is formed on the outer metal foil 10 to obtain a multilayer printed wiring board as shown in FIG. 4 (b). You can

Although the metal foil 10 is used as the outer layer material in the above embodiment, an outer layer circuit board having a circuit formed thereon may be used instead of the metal foil 10.

[0026]

Since the method for producing a multilayer laminated board of the present invention corresponds to the size of the molding machine for molding the inner layer material, the inner layer circuit board is taped so as not to cause a positional shift as in the conventional case. It does not require a process such as sticking. as a result,
The manufacturing method of the above-mentioned multilayer laminated board can shorten the working time,
Productivity is improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of an embodiment of the present invention, and FIG. 1 (a) is a perspective view showing an example of a connecting substrate on which a circuit is formed.
(B) is a perspective view showing an example of an inner layer material.

2 (a) and 2 (b) are cross-sectional views of a main part showing a step of attaching a tape material to a substrate.

FIG. 3 is a schematic cross-sectional view showing an example of an embodiment of the present invention and schematically showing a combination of a multilayer laminated plate before molding.

FIG. 4A is a schematic cross-sectional view showing a state after molding of a multilayer laminated board, and FIG. 4B is a schematic cross-sectional view of the obtained printed wiring board.

[Explanation of symbols]

1 connection board 2 substrates 3 tape materials 3a connection part 4 Inner layer material 5, 5a, 5b, 5c Circuit pattern 8 Inner layer circuit board 21 Cushion material

Continued front page    (72) Inventor Yoshiaki Ezaki             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company F-term (reference) 5E346 AA05 AA06 AA12 AA15 BB01                       CC02 CC08 CC32 DD02 DD12                       EE02 EE06 EE09 EE13 GG01                       GG26 GG28 HH33

Claims (4)

[Claims] 1. A continuous sheet-shaped connecting substrate in which the substrates are cut by cutting the substrates into a size corresponding to the size of a molding machine to be molded, and joining the ends of a plurality of adjacent substrates with a bonding material. After manufacturing, the connecting substrate is processed to form a plurality of circuit patterns to be the inner layer circuit board by itself on one substrate, and then separated at the connecting portion joined by the joining material to form a molding machine. A method for producing a multi-layer laminate, which comprises forming an inner layer material having a size corresponding to a size, and then laminating an outer layer material on the obtained inner layer material via a prepreg and molding the inner layer material. 2. The size of the inner layer material in the longitudinal direction is 10
The method for producing a multilayer laminate according to claim 1, wherein the size in the width direction is 00 mm or more and the size in the width direction is 500 mm or more. 3. After processing the connection substrate,
The multi-layer lamination according to claim 1 or 2, wherein there is a step of winding in a roll shape, and a cushion material is inserted at the time of winding, and the cushion material is wound while being applied to the surface of the substrate. Method of manufacturing a plate. 4. The method for manufacturing a multilayer laminate according to claim 1, wherein the joining material is joined by attaching a tape material to the end portion of the substrate.