JP2002344109A - Method of manufacturing printed wiring board, method of manufacturing prepreg, and method of manufacturing multilayered printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by which the cost of a printed wiring board can be reduced and the mass- productivity of the board can be improved. SOLUTION: This method of manufacturing a printed wiring board includes a step of supplying a base material from a base material roll 101, a step of respectively laminating two pieces of copper foil 107 and 112 upon both surfaces of the base material supplied from the roll 101, and a step of performing pattern formation on the base material upon which the foil 107 and 102 are laminated. This method also includes a step of cutting the pattern-formed base material into pieces of a prescribed size. In this method, the steps from the step of supplying the base material to the step of performing pattern formation are substantially performed on the base material roll 101.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, a method for manufacturing a prepreg, and a method for manufacturing a multilayer printed wiring board, in which electrical connection between layers is made by a conductor such as a conductive paste.

[0002]

2. Description of the Related Art ALIVH (Any Layer) is used as a multilayer wiring board for electrically connecting layers with a conductive paste.
An inner via hole (Inner Via Hole) substrate is known (Japanese Patent No. 26001128).

Here, a conventional method for manufacturing an ALIVH substrate will be described with reference to FIGS. 4 (a) to 4 (g). FIG. 4A is an explanatory view of a start step of a conventional ALIVH substrate manufacturing method, and FIG. 4B is a conventional ALIVH substrate manufacturing method.
FIG. 4C is an explanatory diagram of a laminating process of the method for manufacturing an IVH substrate, FIG. 4C is an explanatory diagram of a laser processing process of the conventional method for manufacturing an ALIVH substrate, and FIG.
It is explanatory drawing of the filling process of the manufacturing method of a LIVH board | substrate, FIG.4 (e) is explanatory drawing of the peeling process of the manufacturing method of the conventional ALIVH board, FIG.4 (f) is FIG. FIG. 4G is an explanatory view of a bonding step, and FIG. 4G is an explanatory view of an end step of a conventional ALIVH substrate manufacturing method.

First, an adhesive 402 is applied to one side of a release film 401 such as PET (see FIG. 4A).
Is impregnated with a thermosetting epoxy resin in an aromatic polyamide fiber and laminated on both sides of a porous substrate 403 cut into a sheet of a fixed size (see FIG. 4B).

Next, a through hole 404 is formed at a predetermined position of the porous substrate 403 by a laser processing method.
(C)).

Then, conductive paste 405 made of copper powder and epoxy resin is filled in through-hole 404 (FIG. 4).
(D)).

The porous substrate 4 having the through holes 404
03 is placed on a table of a screen printing machine, and such a filling is performed by directly printing the conductive pace 405 from above on the release film 401. And the role of preventing surface contamination of the porous substrate 403.

Next, the release film 401 is peeled from both sides of the porous substrate 403 (see FIG. 4E), and a metal foil 406 such as a copper foil is laminated on both sides of the porous substrate 403 and heated. By pressing, the porous substrate 403 and the metal foil 406
(See FIG. 4F).

The porous substrate 403 and the through hole 40
At this time, the conductive paste 405 in 4 is compressed, and the binder component in the conductive paste 405 is extruded into the porous base material, and the bond between the copper powder and between the copper powder and the metal foil 406 becomes strong. The density of the copper powder in the conductive paste 405 is densified, and electrical connection between layers is obtained. After that, the thermosetting resin as a component of the porous base material 403 and the resin component of the conductive paste 405 are cured.

Finally, the metal foil 406 is selectively etched into a predetermined pattern to complete a double-sided wiring board (FIG. 4).
(G)). That is, the prepreg and copper foil obtained on both sides of this double-sided printed wiring board are aligned, arranged (stacked), and heated and pressed again by a hot press machine to form a multilayered multilayer, and the outermost copper foil is formed. A four-layer substrate is obtained by etching and patterning. (If further multi-layering is required, the above-described steps are repeated using the four-layer substrate as a core (base) to obtain a six-layer or eight-layer substrate. To produce).

[0011]

However, the conventional manufacturing method as described above has problems such as an increase in cost and difficulty in improving mass productivity.

More specifically, the base material is, for example, 3
Since each step is performed after the sheet is cut into a 40 mm × 510 mm size sheet, material loss and paste loss increase, the time required for reciprocal filling of the paste increases, and the time required for transport between the processes increases. Or the press time in the hot pressing process becomes longer (the batch furnace has to be charged every n times), or the amount of displacement of each layer becomes larger (a correction coefficient is required each time).

The present invention has been made in consideration of the above-described conventional problems and provides a method of manufacturing a printed wiring board, a method of manufacturing a prepreg, and a method capable of realizing cost reduction and improvement in mass productivity.
It is another object of the present invention to provide a method for manufacturing a multilayer printed wiring board.

[0014]

Means for Solving the Problems The first invention (claim 1)
Corresponds to the steps of: supplying a substrate from a roll substrate, laminating a metal foil on the substrate supplied from the roll substrate, and forming a pattern on the substrate on which the metal foil laminate has been performed. And a step of performing a predetermined cutting on the substrate on which the pattern has been formed, and from supplying the substrate from the roll substrate to (1) performing the metal foil lamination, or ( 2) A method of manufacturing a printed wiring board in which substantially all processes up to the pattern formation are performed on the roll base material.

According to a second aspect of the present invention (corresponding to claim 2), the metal foil laminate is a copper foil laminate, and the process from the supply of the substrate from the roll substrate to the copper foil lamination is performed. Is a first method for manufacturing a printed wiring board according to the present invention, in which film lamination, via formation, conductive paste filling, film peeling, and copper foil lamination are performed in this order.

According to a third aspect of the present invention (corresponding to claim 3), the metal foil laminate is a copper foil laminate, and in the process from the supply of the substrate from the roll substrate to the formation of the pattern. Are film lamination, via formation, conductive paste filling, film peeling, copper foil lamination, simple press, dry film resist (DF
R) A first method of manufacturing a printed wiring board according to the present invention, in which lamination, exposure, development, and etching are performed in this order.

According to a fourth aspect of the present invention (corresponding to claim 4), the conductive paste is filled by using a printing method using at least two or more squeegees. It is a manufacturing method of.

According to a fifth aspect of the present invention (corresponding to claim 5), a step of supplying a substrate from a roll substrate, a step of laminating a film on the substrate supplied from the roll substrate, A step of performing film peeling on the substrate on which the lamination has been performed, and a step of performing predetermined cutting on the substrate on which the film has been peeled off, from the supply of the substrate from the roll substrate to the film peeling Is a method for producing a prepreg in which substantially all of the processes are performed on the roll base material.

According to a sixth aspect of the present invention (corresponding to claim 6), in the process from the supply of the base material from the roll base material to the peeling of the film, film lamination, via formation, paste filling, film peeling Is a fifth method for producing a prepreg of the present invention performed in this order.

A seventh aspect of the present invention (corresponding to claim 7) is the method of manufacturing a prepreg according to the sixth aspect of the present invention, wherein the filling of the conductive paste is performed using a printing method using at least two or more squeegees. .

According to an eighth aspect of the present invention, there is provided a printed wiring board manufactured by the method for manufacturing a printed wiring board according to any one of the first to fourth aspects of the present invention. And a prepreg manufactured by the method of manufacturing a prepreg of the present invention, and alternately aligning and laminating the prepreg so that the prepreg is positioned on the outermost side, and the outermost one of the alternately aligned prepregs. A method for manufacturing a multilayer printed wiring board, comprising: laminating a metal foil on the surface of a prepreg, and performing hot pressing; and patterning the metal foil laminated on the surface of the outermost prepreg. It is.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) First, a method for manufacturing a printed wiring board according to the present embodiment will be described with reference to FIG. 1, which is an explanatory diagram of a method for manufacturing a printed wiring board according to the present embodiment.

First, the base material supplied from the roll base material 101 (porous base material in which an aromatic polyamide fiber is impregnated with a thermosetting epoxy resin) is transported, and placed on both sides of the base material. The PET films 102 and 110 supplied from the pet film supply roll are laminated while heating using a PET laminating machine (not shown).

Next, the base material after the adhesion of the pet films 102 and 110 is transported, and a YAG laser, a CO2 laser,
Using a drill or the like, a through-hole 104 for interlayer connection is formed at a predetermined location by a through-hole processing machine 103 optimal for the material of the base material.

Next, the base material is conveyed onto a table of a printing machine, and a conductive paste (C
u or a Cu-Ag alloy powder and an epoxy resin are kneaded and filled with a metal paste 106.

The filling is performed by printing the conductive paste 106 directly on the pet film 102 using two or more squeegees 105. Such a construction method using two or more squeegees 105 eliminates the need for reciprocating filling and shortens the tact time.

Next, the base material filled with the conductive paste 106 is conveyed to take-up rolls (PET peeling machine) 111 arranged vertically and the PET films 102, 110
Is peeled off.

The base material is a copper foil (metal foil) supply roll 1
07, and the supplied copper foils 107 and 112 are temporarily bonded by a copper foil laminating machine (not shown).

Further, the substrate is transported, and a photolithographic method (D
DFR lamination 108 by FR laminating machine 113
UV curing, DFR development, etching, DF
The copper foil is patterned by a patterning method including a process such as R peeling, and after the photolithography process is completed, the base material is cut using shearing or the like to complete the printed wiring board 109.

In this way, by performing a series of processes on the same roll substrate, each process can be operated continuously, and the lead time is greatly reduced. Further, reduction in material loss, reduction in transport time between processes, reduction in cost, and the like are realized, so that mass productivity can be improved.

As described above, although the effect of performing a series of processes on the same roll base material is great, continuous operation may be difficult because the required time of each process is different. . To solve this,
For example, the transfer speed of the substrate may be adjusted to the process requiring the longest time.

However, in order to further reduce the overall required time required for the entire process, it is of course desirable to increase the transport speed of the substrate.

Therefore, for example, in the step of filling the conductive paste 106, which is a process requiring a relatively long time, not only printing is performed using two or more squeegees 105 as described above, but also the squeegee 105 is transported. Printing may be performed while moving in the transport direction at a speed close to the speed. By doing so, the conductive paste 10
6 can be surely filled, and there is no need to greatly reduce the transport speed of the base material.
Peeling can be accurately performed without any delay due to a reduction in the transport speed.

(Embodiment 2) Next, a method for manufacturing a prepreg according to the present embodiment will be described with reference to FIG. 2, which is an explanatory view of a method for manufacturing a prepreg according to the present embodiment.

The method for manufacturing a prepreg of the present embodiment is as follows.
Similar to the above-described method of manufacturing a printed wiring board according to the first embodiment, except that the base material filled with the conductive paste 106 is transported to winding rolls 111 arranged above and below, and the pet films 102 and 110 are peeled off. After that, the base material is cut using shearing or the like, and the prepreg 201 is manufactured.

(Embodiment 3) Next, FIG. 3A which is an explanatory view of an alignment laminating step of a method for manufacturing a multilayer printed wiring board according to the present embodiment, and FIG. A method for manufacturing a multilayer printed wiring board according to the present embodiment will be described with reference to FIG.

In the present embodiment, the printed wiring board 109 obtained in the first embodiment described above and the prepreg 201 obtained in the second embodiment described above are used.
Are alternately laminated (see FIG. 3A), and after the copper foil is laminated on the outermost surface of the prepreg 201, hot pressing is performed collectively (see FIG. 3B).

Thereafter, the copper foil on the outermost surface of the obtained base material is subjected to pattern processing by a photolithography method, and a multilayer printed wiring board 301 is obtained.

As described above, by performing the collective pressing, the tact time can be significantly reduced and the displacement of each layer can be reduced significantly as compared with the case of sequentially laminating, so that the cost can be reduced and the mass productivity can be improved.

As described above, the present invention provides, for example, a method for manufacturing a double-sided board required for manufacturing a printed wiring board.
This is a method for manufacturing a printed wiring board in which all processes from substrate supply to copper foil lamination or pattern formation are performed on the same roll substrate, and cut after pattern formation.

Also, the present invention provides, for example, film lamination, via formation, conductive paste filling, film peeling,
This is a method for manufacturing the above-described printed wiring board, in which a series of copper foil lamination processes is performed on the same roll base material.

Further, the present invention provides, for example, film lamination, via formation, conductive paste filling, film peeling,
This is a method for manufacturing the above printed wiring board, in which a series of processes of copper foil lamination, simple pressing, dry film resist (DFR) lamination, exposure, development, and etching are performed on the same roll base material.

In the present invention, for example, as a method for producing a prepreg required for producing a printed wiring board, all processes from substrate supply to pet removal are performed on the same roll substrate and then cut. This is a method for manufacturing the above printed wiring board.

Further, the present invention is the above-mentioned method for manufacturing a printed wiring board, wherein a series of processes of film lamination, via formation, paste filling, and film peeling are performed on the same roll base material.

Further, the present invention is the above-mentioned method for manufacturing a printed wiring board, wherein at least two or more squeegees are used as a paste filling means by a printing method.

Further, according to the present invention, for example, the printed wiring board obtained by the above-described method of manufacturing a printed wiring board and the prepreg obtained by the above-described method of manufacturing a printed wiring board are alternately aligned and laminated. After laminating the copper foil on the outermost surface of, hot pressing,
Patterning the uppermost surface copper foil.

That is, in the method for manufacturing a double-sided board required for manufacturing a printed wiring board according to the present invention, all processes from substrate supply to copper foil lamination or pattern formation are performed on the same roll substrate. It is characterized by cutting after pattern formation. According to the manufacturing method of the present invention, material and paste loss can be reduced, transport time between processes and press time can be reduced, and cost reduction and mass productivity can be realized.

In the above method, a film laminate,
Via formation, conductive paste filling, film peeling, copper foil lamination, simple pressing, dry film resist (DF
R) It is desirable to perform a series of processes of lamination, exposure, development, and etching on the same roll substrate. By performing a series of processes from pet film lamination to etching on the same roll substrate, the line speed of the production line can be increased, and a printed wiring board can be efficiently produced.

Further, the method for producing a prepreg required for producing a printed wiring board according to the present invention is characterized in that all processes from substrate supply to pet peeling are performed on the same roll substrate and then cut. And

In the above method, it is desirable that a series of processes of film lamination, via formation, conductive paste filling, and film peeling be performed on the same roll substrate. By performing a series of processes from film lamination to film peeling on the same roll substrate, material and paste losses can be reduced.

In the above method, it is preferable that at least two or more squeegees are used as the paste filling means by a printing method. By using at least two or more squeegees, the necessity of reciprocating filling is eliminated, so that the tact time can be significantly reduced and paste loss can be reduced.

In the method of manufacturing a printed wiring board according to the present invention, the double-sided board obtained by the above-described manufacturing method and the prepreg obtained by the above-described manufacturing method are alternately aligned and laminated, and a copper foil is formed on the outermost surface of the prepreg. After the lamination, the method includes a step of performing hot pressing and a step of patterning the uppermost copper foil.

In the above-mentioned method, it is preferable that the double-sided board and the prepreg are laminated at once, instead of being laminated sequentially in each layer. By stacking them all at once, it is only necessary to put them into the batch furnace n times, and it is possible to alleviate the case where a correction coefficient is required each time and the amount of displacement in each layer is large.

As described above, according to the present invention, the same roll is used from the introduction of the base material to the etching, so that the material and paste loss can be reduced, the transport time between each process can be reduced, and pressing is performed after collective lamination. As a result, it is possible to shorten the pressing time, and realize the cost reduction and the improvement of the mass productivity.

[0056]

As is apparent from the above description,
The present invention has an advantage that the cost of the printed wiring board can be reduced and the mass productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a prepreg manufacturing method according to a second embodiment of the present invention.

FIG. 3A is an explanatory view of an alignment laminating step in a method for manufacturing a multilayer printed wiring board according to Embodiment 3 of the present invention; FIG. 3B is a diagram illustrating a multilayer printed wiring board according to Embodiment 3 of the present invention; Diagram of the hot pressing process of the manufacturing method

FIG. 4A is an explanatory view of a start step of a conventional ALIVH substrate manufacturing method. FIG. 4B is an explanatory view of a conventional ALIVH substrate manufacturing method laminating step. FIG. 4 (d); explanation of a filling step in a conventional ALIVH substrate manufacturing method FIG. 4 (e); explanation of a peeling step in a conventional ALIVH substrate manufacturing method FIG. 4 (f): Explanatory drawing of the bonding step of the conventional ALIVH substrate manufacturing method FIG. 4 (g): Explanatory drawing of the conventional ALIVH substrate manufacturing method

[Explanation of symbols]

 Reference Signs List 101 Base roll 102, 110 PET film 103 Through hole processing machine 104 Through hole 105 Squeegee 106 Conductive paste 107, 112 Copper foil 108 DFR lamination 109 Printed wiring board 111 Winding roll (PET peeling machine) 113 DFR laminating machine 201 Prepreg

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H05K 3/46 H05K 3/46 G Y (72) Inventor Susumu Matsuoka 1006 Kazuma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Yasuhiro Nakatani 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.F-term (reference) EJ82 GB43 JL02 5E317 AA24 BB02 BB12 CC25 CD27 CD36 GG16 GG17 5E339 AB02 AC01 AC06 AD03 AD05 AE02 BC02 BD02 BD06 BD07 BE11 CF16 CF17 EE01 EE04 5E346 AA06 AA12 AA15 AA22 AA32 AA41 EE32 DD02 CC02 DD02 CC02 EE18 FF01 FF18 GG14 GG15 GG19 GG22 GG26 GG28 HH31

Claims (8)

[Claims] A step of supplying a substrate from a roll substrate; a step of laminating a metal foil on the substrate supplied from the roll substrate; and forming a pattern on the substrate on which the metal foil laminate has been performed. And a step of performing a predetermined cutting on the substrate on which the pattern is formed, from supplying the substrate from the roll substrate to (1) performing the metal foil lamination, or ( 2) A method for manufacturing a printed wiring board, wherein substantially all processes up to the pattern formation are performed on the roll base material. 2. The metal foil laminate is a copper foil laminate, and in a process from supply of a substrate from the roll substrate to performing the copper foil lamination, film lamination, via formation, conductive paste filling. 2. The method for manufacturing a printed wiring board according to claim 1, wherein the film peeling and the copper foil lamination are performed in this order. 3. The metal foil laminate is a copper foil laminate, and in a process from supply of a base material from the roll base material to formation of the pattern, film lamination, via formation, conductive paste filling, 2. The method for manufacturing a printed wiring board according to claim 1, wherein film peeling, said copper foil lamination, simple pressing, dry film resist (DFR) lamination, exposure, development, and etching are performed in this order. 4. The method according to claim 1, wherein the filling of the conductive paste is at least two.
4. The method for manufacturing a printed wiring board according to claim 2, wherein the method is performed using a printing method using at least one squeegee. 5. A step of supplying a substrate from a roll substrate, a step of performing film lamination on the substrate supplied from the roll substrate, and performing a film peeling on the substrate on which the film lamination has been performed. And a step of performing a predetermined cutting on the substrate on which the film has been peeled, substantially all processes from the supply of the substrate from the roll substrate to the film peeling on the roll substrate Prepreg manufacturing method to be performed. 6. The prepreg according to claim 5, wherein in the process from supply of the substrate from the roll substrate to peeling of the film, film lamination, via formation, paste filling, and film peeling are performed in this order. Manufacturing method. 7. The method according to claim 7, wherein the conductive paste is filled with at least 2
7. The method for producing a prepreg according to claim 6, wherein the method is performed using a printing method using at least one squeegee. 8. A printed wiring board manufactured by the method for manufacturing a printed wiring board according to any one of claims 1 to 4, and a prepreg manufactured by a method for manufacturing a prepreg according to any one of claims 5 to 7. A step of alternately aligning and laminating the outermost prepreg so that the prepreg is located, Of the alternately aligned and laminated prepregs, laminating a metal foil on a surface of the outermost prepreg,
A method for manufacturing a multilayer printed wiring board, comprising: performing a hot press; and patterning a metal foil laminated on a surface of the outermost prepreg.