JP2012119510A - Vacuum lamination device, and method of forming insulating layer using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To peel a support base film for stability in quality, related to a lamination device for laminating/transferring an insulating resin film in which an insulating resin layer is formed on the support base film, on a wiring circuit board.SOLUTION: An insulating resin film 110 cut to a predetermined size is temporarily fitted to a predetermined position of a wiring circuit board. An adhesive layer 113 is formed at a tip part that corresponds to a position of a temporary fitting part 112a of the support base film 111. In the step for vacuum lamination and flat plane pressing with the board being sandwiched between upper and lower transportation films 131, the support base film is bonded to the transportation film by way of the adhesive layer 113. Eventually, a transportation film taking-up guide roll 53 releases the transportation film 131, the adhesive layer 113, and the support base film 111 from the wiring circuit board, and then the board is discharged. Thus, the support base film 111 cut to the predetermined size is collected by taking it up together with the transportation film 131.

Description

  The present invention relates to a vacuum lamination apparatus for forming an insulating layer on a printed circuit board in a multilayer printed wiring board produced by alternately stacking wiring layers and insulating layers, and an insulating layer forming method using the same. Is.

  Conventionally, as a manufacturing method of a multilayer printed wiring board, a circuit board formed circuit board, a prepreg sheet impregnated with a glass cloth base material and impregnated with an epoxy resin as an insulating layer, and a copper foil are collectively laminated, There is known a method for establishing interlayer conduction through a through hole. However, in this method, since the resin of the prepreg is reflowed by heat and cured under a constant pressure, at least 1.0 to 1.5 hours are required for uniform curing and molding. In addition, in the laminating press, the number of substrates to be processed at one time is limited, and when the heating and cooling time is included, low productivity is a problem, such as requiring several hours for one processing. Furthermore, through-hole plating enters the outer layer, the conductor thickness increases, making it difficult to form a fine pattern. There is a problem that the thickness between the circuit layers is limited by the glass cloth and it is difficult to thin the entire multilayer printed wiring board.

  As a method for solving such a problem, a manufacturing technique of a build-up type multilayer printed wiring board in which organic insulating layers are alternately stacked on a conductor layer of a printed circuit board has been put into practical use. In Patent Document 1 and Patent Document 2, an insulating resin film is laminated on a printed circuit board on which a circuit is formed, and after heating and curing, a roughened surface is formed on the surface with a roughening agent, and a conductor layer is formed by plating. A method for manufacturing a multilayer printed wiring board is disclosed.

  In the multilayer printed wiring board manufacturing method by the build-up method, the insulating resin film 110 is usually laminated on the printed circuit board 120 with a vacuum pressure laminator to form the insulating layer 112b. Recently, a fine pattern is often formed on the insulating layer 112b, and it is necessary to flatten the surface of the insulating layer 112b. Therefore, a flat pressing process by the flat pressing unit 40 is performed as necessary. In such a laminating process, generally, a vacuum pressurizing laminator unit (1st unit) 30 and a flat press unit (2nd unit) 40 are integrated lines connected by a pair of upper and lower transport films 131 (FIG. 1). reference). The printed circuit board 120 is sandwiched between the upper and lower transport films 131 with the insulating resin film 110 temporarily attached at predetermined positions on the front and back sides, proceeds to vacuum pressing laminating processing and flat pressing processing, and after being cooled, from the device Discharged.

  Temporary attachment of the insulating resin film 110 is performed by a temporary attachment device called an auto cut laminator. This device temporarily sets the tip of an insulating resin film 110 or a photolithography dry film on the printed circuit board 120 sent from the previous process, laminates the dry film while feeding the printed circuit board 120, and is finally set. This is a device that cuts the film to a length and then sends the printed circuit board to the vacuum laminator. The temporary attachment position can be set in millimeters, and the protective sheet for the dry film is taken up in parallel with the lamination, so that quality improvement and labor saving can be achieved in the laminated finish. In the temporary attachment of the insulating resin film 110, since lamination is performed by a vacuum laminator, pressure is not applied by the laminating roll 16, but the insulating resin film 110 functions as a guide.

  In the general process of the printed wiring board, the substrate on which the insulating resin film 110 has been laminated is subjected to via processing using a laser drill in the next process, so the support base film 111 is peeled off and the surface of the insulating layer 112b Need to be exposed. However, in the general insulating resin film 110, the coated portion of the insulating resin layer 112 and the support base film 111 have the same dimensions, or along the coating (winding) direction of the insulating resin film 110. There are only a few millimeters of blank space where 112 is not applied. Therefore, the peeling of the support base film 111 is not automated and is generally performed manually by an operator one by one, and low productivity and quality variations have been problems.

  In addition, the supporting base film 111 of the insulating resin film (dry film) 110 has a high adhesive strength with the insulating resin layer 112, and is generally used in dry films for photolithography, such as an air blow method or an adhesive roll method. A peeling device (peeler) cannot be used. In addition, a peeling device specially designed for the insulating resin film 110 is expensive, and at present, a highly reliable device that can be employed as a manufacturing facility is not commercially available. Therefore, there has been a problem that a method for efficiently and stably peeling the support base film 111 from the laminated insulating resin film 110 at low cost has not been established.

  For such a problem, Patent Document 3 proposes a method in which the adhesive layer 113 is formed in advance on the support base film 111 of the insulating resin film 110. In this method, as shown in FIG. 10, the insulating resin layer 112 is formed on one surface of the support base film 111, and the adhesive layer 113 is formed on the remaining surface. The adhesive layer 113 is formed in a blank portion on the support base film 111 where the insulating resin layer 112 is not formed in order to avoid uneven thickness of the insulating resin layer 112. Further, since the adhesive layer 113 is formed simultaneously with the application of the insulating resin layer 112, it is formed in a strip shape or a line shape along the winding direction of the insulating resin film 110.

  As the type of adhesive, in order to avoid quality degradation of the insulating resin film 110, a solvent-free adhesive having no tack (adhesiveness) at room temperature, particularly a hot melt adhesive is preferred. Hot melt adhesives are not only solidified at the same time as cooling, but also exhibit adhesiveness, and those having various melting temperatures are commercially available, and have an advantage that the melting characteristics can be adjusted when the lamination temperature is changed.

  When the insulating resin film 110 on which the adhesive layer 113 is formed is temporarily attached to the printed circuit board 120, the adhesive is melted at the laminating temperature, and the support base film 111 and the transport film 131 are fused and adhered. In this state, the transport film 131 and the support base film 111 are completely bonded to each other when the substrate is finally cooled through the flat pressing process. When the substrate is finally discharged, the transport film 131 and the support base film 111 are peeled from the printed circuit board 120d by the transport film winding guide roll 53.

  On the other hand, Patent Document 4 proposes a method in which the adhesive layer 113 is formed by discharge using a nozzle applicator provided in a vacuum laminator charging machine (loader). In Patent Document 3, the adhesive layer 113 is formed when the insulating resin film 110 is manufactured. However, in the method of Patent Document 4, the adhesive layer 113 is formed immediately before the vacuum laminating process and can be applied to various insulating resin films 110. There are benefits.

Japanese Patent Laid-Open No. 09-296156 Japanese Patent No. 4117690 JP 2005-340594 A Japanese Patent No. 4525180

  However, the method for forming the insulating layer 112b according to Patent Document 3 has a problem that the manufacturing cost of the insulating resin film 110 is increased. The insulating resin film 110 is divided into several products by slitting the coating raw material, but the insulating resin film 110 used in Patent Document 3 is formed by forming an adhesive layer 113 on both ends of the insulating resin layer 112. The insulating resin layer 112 must be applied to the center of the slightly wider support base film 111, and the area efficiency cannot be increased. In addition, a new process is required to form the adhesive layer 113, and the manufacturing cost is further increased due to the addition of equipment cost and the decrease in yield.

  Further, in Patent Document 3 and Patent Document 4, since the adhesive layer 113 is formed on both ends of the insulating resin film 110 as shown in FIG. 10, the central portion of the support base film 111 is not bonded to the transport film 131. Accordingly, as shown in FIG. 11, when the printed circuit board 120d is discharged, the supporting base film is supported by the upper and lower guide rolls 53 from the insulating layer 112b formed by transferring and curing the insulating resin layer 112 to the printed circuit board 120d. In the process of peeling 111, there is a problem that wrinkles are generated at the center of the support base film 111, and peeling marks (unevenness) 141 are easily generated on the surface of the insulating layer 112b.

  Furthermore, in the methods of Patent Document 3 and Patent Document 4, since the adhesive layer 113 is formed in a strip shape (linear shape) along the winding direction at both ends of the insulating resin film 110, the amount of adhesive used is small. There were more problems than necessary.

  In the method of Patent Document 3, when the temporary attachment position of the insulating resin film is shifted, and in the method of Patent Document 4, when the position of the printed circuit board is shifted during the conveyance process, the formation position of the adhesive layer is a predetermined position on the substrate. There was a problem that the position may be shifted with respect to the position.

  The present invention has been devised in view of the above problems. An insulating resin film in which an insulating resin layer is formed on a support base film is laminated on a printed circuit board, and the support base film is peeled off to insulate on the printed circuit board. In a laminating apparatus for forming a layer, a laminating apparatus capable of efficiently and quality-stable peeling of a supporting base film without introducing expensive equipment such as an auto peeler, and formation of an insulating layer using the laminating apparatus It aims to provide a method.

  In order to achieve the above object, the present invention comprises at least a tacking unit, a transport film unwinding unit, a vacuum pressure laminator unit, a flat press unit, and a transport film winding unit, and the tacking unit. However, the insulating resin layer-side surface of the insulating resin film having the insulating resin layer formed on the support base film is opposed to the both surfaces of the printed circuit board, and the tip of the insulating resin layer is placed on the wiring. A substrate temporarily attached to a predetermined area outside the effective area of the circuit board is formed, and an adhesive layer is formed on a front end portion of the support base film located in a relation between the front end and the back side of the insulating base layer, and the insulation The resin film is cut into a predetermined size, and the transport film unwinding unit superimposes the transport film on the substrate, and the vacuum pressure laminator unit The insulating resin layer of the insulating resin film is laminated on the substrate to form an insulating layer and the adhesive layer is adhered to the transport film, and the flat press unit smoothes the insulating layer of the substrate, and the transport The film winding unit peels off the transport film, the adhesive layer, and the support base film from the substrate while leaving the insulating layer on the surface of the substrate.

  In addition, the present invention is a method for forming an insulating layer, characterized in that an insulating layer is formed on a printed circuit board using the vacuum laminating apparatus described above.

  In the present invention, by forming the adhesive layer 113 with a temporary attachment device, there is an effect that the adhesive layer can be formed on the tip portion of the support base film 111 using a minimum amount of adhesive, and the positional accuracy of the adhesive layer is further improved. Can also be improved. In the present invention, the adhesive layer 113 is formed only at the tip of the support base film 111, which triggers the peeling of the support base film 111. Therefore, an adhesive for forming the adhesive layer 113 is used. There is an effect that the amount used can be reduced. Further, in the laminating apparatus of the present invention, since the adhesive layer 113 is formed in parallel with the temporary attachment of the insulating resin layer 112, the tip of the support base film 111 is accurately applied regardless of the positional deviation of the printed circuit board 120. There is an effect that the adhesive layer 113 can be formed. In addition, the positional relationship between the tacking portion 112a of the insulating resin layer 112 and the adhesive layer 113 can always be made constant by performing the processing in the same unit, and thus the peeling operation can be performed stably. effective.

  By using the vacuum laminating apparatus of the present invention, the support base film 111 is peeled off by an inexpensive method associated with a normal laminating operation without introducing expensive equipment such as an auto peeler, and the printed circuit board 120 is then peeled off. There is an effect that the insulating layer 112b can be formed efficiently. Further, since the peeled support base film 111 is wound and collected together with the transport film 131, the occupied space is small, and the burden of disposal work is reduced. That is, it is excellent in productivity and economy, and has an effect that the insulating layer can be stably formed with quality, yield and the like.

It is a schematic block diagram which shows one Embodiment of the vacuum lamination apparatus of this invention. (A) is a perspective view which shows an example of the unwinding roll 11 which wound up the insulating resin film of this invention. (B) is a schematic cross-sectional view of the insulating resin film 110 obtained by cutting the perspective view of (a) along the line A-A ′. (A) is a schematic plan view which shows an example of a printed circuit board. (B) is a schematic cross-sectional view of a printed circuit board obtained by cutting the schematic plan view of (a) along the line B-B ′. (A) is that the insulating resin film 110 is temporarily attached to both surfaces of the printed circuit board 120 of the present invention, and the adhesive layer 113 is formed at the tip of the support base film 111 adjacent to the temporary attaching portion of the insulating resin film. 2 is a schematic plan view of a printed circuit board 120a. (B) is a schematic cross-sectional view of a printed circuit board obtained by cutting the schematic plan view of (a) along the line C-C ′. (A), (b) is a schematic block diagram which shows an example of the attachment position of the nozzle applicator 13 in FIG. 1 of this invention. FIG. 3 is a schematic cross-sectional view showing a wired circuit board 120b in which a transport film 131 is sandwiched on both surfaces of the wired circuit board 120a of the present invention. FIG. 5 is a schematic cross-sectional view of a calibration showing a printed circuit board 120c obtained by laminating a printed circuit board 120b according to the present invention. It is explanatory drawing which shows the state which has peeled the conveyance film, the contact bonding layer, and the support base film from the printed circuit board 120c of this invention. It is a schematic structure sectional view showing wiring circuit board 120d in which insulating layer 112b was formed in both sides of wiring circuit board 120 of the present invention. It is a perspective view which shows an example of the unwinding roll 11 which wound up the insulating resin film which formed the adhesive layer 113 in the both ends of the support base film in patent document 3 and patent document 4. FIG. (B) is a schematic cross-sectional view of the insulating resin film 110 obtained by cutting the perspective view of (a) along the line D-D ′. It is a schematic diagram which shows the generation | occurrence | production condition of the peeling trace (nonuniformity) 141 in patent document 3 and patent document 4. FIG.

A schematic structural diagram showing an embodiment of the vacuum laminating apparatus of the present invention is shown in FIG.
The vacuum laminating apparatus of the present invention is characterized by including a tacking unit 10, a transport film unwinding unit 20, a vacuum pressure laminator unit 30, a flat press unit 40, and a transport film winding unit 50. . The tacking unit 10 is formed by stacking an insulating resin film 110 having an insulating resin layer 112 on a support base film 111, which will be described later, so that the surface on the insulating resin layer 112 side is opposed to the surface of the printed circuit board 120. A temporary attachment portion 112a is formed on the insulating resin layer 112 at the tip of the resin film 110, and a predetermined region outside the effective region 121 of the printed circuit board 120 and the insulating resin layer 112 are temporarily attached. An adhesive layer 113 is formed on the support base film 111 at the tip of the resin film 110. Then, the tacking unit 10 cuts the insulating resin film 110 into a predetermined size.

  The transport film unwinding unit 20 forms the printed circuit board 120b by superimposing the transport film 131 on the printed circuit board 120a in a state where the insulating resin film 110 is temporarily attached and the adhesive layer 113 is formed at the tip thereof. To do. The vacuum pressurization laminator unit 30 forms a printed circuit board 120c in which an insulating layer 112b is formed by laminating an insulating resin film 110 on the surface of the printed circuit board 120b under predetermined conditions. The flat press unit 40 smoothes the surface of the insulating layer 112b formed on the surface of the printed circuit board 120c. The transport film take-up unit 50 peels the transport film 131, the adhesive layer 113, and the support base film 111 from the printed circuit board 120c while leaving the insulating layer 112b on the surface of the printed circuit board 120c. Form.

  In the vacuum laminating apparatus of the present invention, the insulating resin layer 112 of the insulating resin film 110 in which the insulating resin layer 112 is formed on the support base film 111 is transferred onto the printed circuit board 120 on which the wiring layer and the like have been previously formed for insulation. It is a stacking apparatus for forming the layer 112b. Hereinafter, each unit constituting the vacuum laminating apparatus of the present invention will be described.

  The temporary attachment unit 10 is a device that cuts an insulating resin film 110 in which an insulating resin layer 112 is formed on a support base film 111 (described later) into a predetermined size and affixes it to a predetermined position on the printed circuit board 120. Representative models include Mach630 manufactured by Hakuto Co., Ltd., TLD-6500 manufactured by Hitachi Plant Technologies, Ltd., and MTA-602 model manufactured by MCK Corporation. The vacuum laminating apparatus of the present invention is characterized in that the temporary attachment unit 10 performs temporary attachment of the insulating resin film 110 and formation of the adhesive layer 113 in parallel.

  First, an insulating resin film 110 for use in the temporary attachment unit 10 is separately prepared. That is, the unwinding roll 11 of the insulating resin film 110 as shown in FIGS. This is because the insulating resin layer 112 is formed by a method such as applying a resin solution on one surface of the support base film 111 made of a PET film or the like by roll coating, or attaching and transferring a resin film. The surface of 112 is rolled up in a form covered with a protective film, and the unwinding roll 11 of the insulating resin film 110 is produced. Specifically, an insulating resin film 110 such as ABF-GX13 manufactured by Ajinomoto Fine Techno Co., Ltd. can be used.

  Next, as shown in FIGS. 3A and 3B, the printed circuit board 120 having the effective area 121 in which the wiring layer or the like is formed in advance is conveyed to the temporary attachment unit 10 by the roller conveyor 15. In the tacking unit 10, the unwinding roll 11 of the insulating resin film 110 in which the insulating resin layer 112 is formed on the support base film 111 is loaded. The insulating resin film 110 unwound from the unwinding roll 11 is wound off by the protective film winding roll 14 and peeled off, and the surface of the insulating resin layer 112 is exposed. Then, the surface of the insulating resin layer 112 opposite to the exposed surface is adsorbed by the air adsorption board 12. Further, the air adsorption plate 12 moves downward with the insulating resin layer 112 adsorbed, and the exposed surface of the insulating resin layer 112 is brought into contact with the printed circuit board 120. At that time, the temporary attachment portion 112a is formed by heating and pressure-bonding the tip portion of the insulating resin layer 112 to the tip portion outside the effective area 121 of the printed circuit board 120 to be temporarily attached.

  Further, in the tacking unit 10, as shown in FIGS. 4A and 4B, an adhesive layer 113 with a predetermined width is provided at the tip of the support base film 111 in the vicinity of the tacking portion 112 a of the insulating resin layer 112. Form. In particular, the adhesive layer 113 is formed up to the front end side of the support base film 111, and when the adhesive layer 113 is heated later, the adhesive layer 113 melts and crawls up to the side surface in front of the front end of the support base film 111. Next, the roller conveyor 15 and the laminating roll 16 work together to feed the printed circuit board 120 and cut the insulating resin film 110 at a predetermined position. In the tacking unit 10, a printed circuit board 120 a is manufactured in which an insulating resin film 110 that is cut to a predetermined size and has an adhesive layer 113 formed at the tip is temporarily attached to the tip.

  The adhesive layer 113 needs to be formed in the vicinity of the temporary attachment portion 112a of the insulating resin layer 112, but acts as a trigger when the support base film 111 is peeled off when the printed circuit board is discharged. In consideration, as shown in FIGS. 4A and 4B, it is preferable to form the front part of the temporary attachment part 112a with respect to the transport direction of the printed circuit board 120, preferably the tip part of the support base film 111. . In addition, the shape of the adhesive layer 113 is preferably formed linearly along the end portion of the support base film 111 where stress is concentrated during peeling. In particular, it is preferable to use a relatively simple adhesive discharge device called the nozzle applicator 13 because a high-viscosity adhesive with a small amount of seepage can be used in the laminating step.

  In addition, the nozzle applicator 13 is particularly preferable because the tip nozzle is small, so that the degree of freedom in design for changing the application position is high and the spread of the adhesive can be easily adjusted by adjusting the discharge amount of the adhesive. As the nozzle applicator 13 used in the present invention, Nordson Co., Ltd., Kaetsu Co., Ltd., ITW Dynatec Co., Ltd., etc. can be used. About the attachment position, as shown in FIG. 1, it fixes to the position close | similar to the temporary heater attached to the front-end | tip of the upper and lower air adsorption boards 12. As shown in FIG. As shown in FIG. 5A, the nozzle applicator 13 may be fixed by arranging a plurality of lateral arrangements of the printed circuit board 120, and forming the adhesive layer 113 in a strip shape by continuing small dot shapes. As shown in FIG. 5B, the linear adhesive layer 113 may be formed by sliding one nozzle in the lateral direction. This method is particularly preferable because the adhesive can be applied using the temporary (thermocompression) time of the insulating resin layer 112 and productivity is not lowered.

  If the adhesive layer 113 is tacky after being formed, it is not preferable because the adhesive adheres to the roller conveyor 15 and contaminates the printed circuit board 120, thereby reducing workability and quality. Therefore, the adhesive used in the present invention is preferably a hot-melt adhesive that solidifies immediately after forming the adhesive layer 113 and does not leave a tack on the surface. Among them, those having a high melt viscosity are particularly preferable because they are excellent in adhesiveness and mechanical properties and have a small amount of seepage during the lamination process. If the softening point of the hot melt adhesive is too low, when pressure is applied during the lamination process in the vacuum pressurization laminator unit 30, the adhesive spreads too much and oozes out of the printed circuit board 120b, and the upper and lower transport films 131 It is not preferable because the adhesive adheres and interferes with the conveyance process. On the other hand, if the softening point is too high, the adhesive is not sufficiently melted, which is not preferable because sufficient adhesiveness cannot be obtained when the support base film 111 is peeled off.

  The softening point of the hot melt adhesive is preferably in the range of minus 30 ° C. or more and less than plus 30 ° C. than the lamination temperature (press temperature) when the insulating resin film 110 is laminated on the printed circuit board 120b. Specific examples of commercially available products include H-629A (softening point 120 ° C.) manufactured by Toyo Petrolite Co., Ltd., Nanostack A (softening point 111 ° C.) manufactured by Sanyo Chemical Industries, Ltd., Jet Melt manufactured by Sumitomo 3M Co., Ltd. EC3760 (softening point 81 ° C.), Asahi Chemical Synthesis Co., Ltd. Asahimelt RK960 (softening point 98 ° C.), Daicel Chemical Industries, Ltd. Liquimelt 1354 (softening point 100 ° C.), Hitachi Chemical Polymer Co., Ltd. Hibon 9881H Examples thereof include hot-melt adhesives for soft packaging materials such as (softening point 85 ° C.).

  The method for forming the adhesive layer 113 is not particularly limited, such as a method of sticking a double-sided adhesive tape to the tip of the support base film 111, in addition to the method of partially applying and forming the adhesive as described above. . However, the method of applying double-sided tape complicates the mechanism of the device, such as peeling of the separator film, and the double-sided tape that is thin enough not to affect the laminated finish and excellent in heat resistance and adhesive strength is limited to expensive ones. Therefore, it is not preferable.

  The printed circuit board 120 a on which the adhesive layer 113 is formed is fed into the transport film unwinding unit 20 by the roller conveyor 15. In the transport film unwinding unit 20, the transport film 131 sent out from the transport film unwinding roll 21 is superposed on the adhesive layer 113 on the support base film 111 of the printed circuit board 120a by the guide roll 22 as shown in FIG. Then, the printed circuit board 120b having both sides sandwiched by the transport film 131 is produced. The transport film 131 may be a PET film such as PTH-38 manufactured by Unitika Co., Ltd., 26X42 manufactured by Toray Industries, Inc., SP36 manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., or the like. The surface of these PET films is roughened, and air between the printed circuit board 120b and the transport film 131 is easily removed during the lamination process in the vacuum pressure laminator unit 30, and the PET film is bonded to the transport film 131. This is particularly preferable because the bonding with the layer 113 is stable.

  The printed circuit board 120b sandwiched on both sides by the transport film 131 moves to the film transport system interlocked with the roller conveyor 15, and is sent to the vacuum pressure laminator unit 30 and then to the flat press unit 40. As shown in FIG. 7, in the vacuum pressure laminator unit 30, the insulating resin layer 112 on the support base film 111 is sandwiched between the press upper plate 31 and the press lower plate 32 and heated and pressed at a predetermined temperature. As a result, a printed circuit board 120c is obtained which is laminated on the printed circuit board 120b and the insulating resin layer 112 is cured to form the insulating layer 112b on both sides.

  Next, the flat press unit 40 heats and presses the printed circuit board 120c between the press upper plate 41 and the press lower plate 42, thereby planarizing the insulating layers 112b on both sides of the printed circuit board 120c. Processing is performed. In these processes, the adhesive layer 113 is heated and melted, crawls up to the front side of the front end of the support base film 111, and adheres to the transport film 131 in a state of closing the front of the support base film 111. In this manner, the front end portion of the support base film 111 is bonded to the transport film 131 so as to be closed by the molten adhesive layer 113. As the vacuum pressurizing laminator, commercially available products such as CVP-300 of Nichigo Morton Co., Ltd. and MVLP-500 / 600IIB of Meiki Seisakusho Co., Ltd. can be used. These models are provided with a vacuum laminator unit 30 and a flat press unit 40, which are preferably connected by a film transport system.

  The printed circuit board 120 c sent out from the flat press unit 40 is sent to the transport film winding unit 50. Here, the printed circuit board 120c is cooled by the cooling fan 54 for several tens of seconds, and the adhesive layer 113 is solidified. In the transport film winding unit 50, the transport film winding guide roll 53 peels the transport film 131, the adhesive layer 113, and the support base film 111 from the printed circuit board 120c, as shown in FIG. As a result, a printed circuit board 120d in which insulating layers 112b are formed on both sides of the printed circuit board 120 as shown in FIG. 9 can be obtained.

In the above embodiment, the tip portion outside the effective area 121 of the printed circuit board 120 is
Although the tip of the insulating resin layer 112 is temporarily attached by heating and pressure bonding, and the adhesive layer 113 is formed on the upper surface of the insulating resin layer 112, the present invention is not limited thereto. That is, tip portions of a plurality of insulating resin layers 112 corresponding to the number of predetermined regions are temporarily attached to a plurality of predetermined regions outside the effective region 121 of the printed circuit board 120, The adhesive layer 113 may be formed on the top surface of the tip.

  Further, according to the present invention, a multilayer wiring circuit board, a semiconductor package board, and the like can be manufactured by repeating circuit formation, via formation, and formation of the insulating layer on the insulating layer 112b of the printed circuit board 120d a predetermined number of times.

  According to the method for forming the insulating layer 112b using the vacuum laminating apparatus of the present invention, the support base film 111 can be peeled by an inexpensive method associated with a normal laminating operation without introducing expensive equipment such as an auto peeler. As a result, the insulating layer 112b can be efficiently formed on the printed circuit board 120. Further, since the peeled support base film 111 is wound and collected together with the transport film 131, the occupied space is small and the burden of disposal work is reduced. In other words, the insulating layer 112b can be formed with excellent productivity and economy, and with stability in quality, yield, and the like. Thereby, a multilayer wiring circuit board, a semiconductor package board, etc. can be manufactured easily.

DESCRIPTION OF SYMBOLS 10 ... Temporary attachment unit 11 ... Insulating resin film unwinding roll 12 ... Air adsorption board 13 ... Nozzle applicator 14 ... Protection film winding roll 15 ... Roller conveyor 16 ... Lamination Roll 20 ... Conveying film unwinding unit 21 ... Conveying film unwinding roll 22 ... Guide roll 30 ... Vacuum pressure laminator units 31, 41 ... Press upper plates 32, 42 ... Press Lower plate 40 ... flat press unit 50 ... transport film winding unit 51 ... transport film winding roll 52 ... nip roll 53 ... transport film winding guide roll 54 ... cooling fan 110 ..Insulating resin film 111 ... support base film 112 ... insulating resin layer 112a ··· Insulating resin layer temporary attachment portion 112b ··· Insulating layer 113 ··· Adhesive layer 120 ··· Wiring circuit substrate 120a · · · Insulating resin film temporary attachment and wiring layer circuit board 120b after formation of adhesive layer -Wiring circuit board 120c sandwiched between upper and lower transfer films ... Wiring circuit board 120d after lamination processing and before peeling of support base film ... Wiring circuit board 121 after formation of insulating layer ... Effective area 131 ... -Conveying film 141 ... peeling mark (unevenness)

Claims (2)

  At least a temporary attachment unit, a conveyance film unwinding unit, a vacuum pressure laminator unit, a flat press unit, and a conveyance film winding unit are provided, and the temporary attachment unit supports both sides of the printed circuit board. An insulating resin film having an insulating resin layer formed on a base film is overlapped with the insulating resin layer side facing each other, and the tip of the insulating resin layer is temporarily attached to a predetermined area outside the effective area of the printed circuit board. And forming an adhesive layer on a front end portion of the support base film positioned in a relation between the front end and the back side of the insulating resin layer, cutting the insulating resin film into a predetermined size, and transporting the film. An unwinding unit overlays the transport film on the substrate, and the vacuum pressure laminator unit is placed on the substrate in front of the insulating resin film. An insulating resin layer is laminated to form an insulating layer and the adhesive layer is adhered to the transport film, the flat press unit smoothes the insulating layer of the substrate, and the transport film take-up unit A vacuum laminating apparatus, wherein the transport film, the adhesive layer, and the support base film are peeled from the substrate with the insulating layer left on the surface.   A method for forming an insulating layer, comprising: forming an insulating layer on a printed circuit board using the vacuum lamination apparatus according to claim 1.

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