JP2012004290A - Sheet peeling device and sheet peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent damage and the like to a semiconductor wafer while restricting the movement of the semiconductor wafer when an adhesive sheet is peeled from the semiconductor wafer.SOLUTION: A sheet peeling device 10 peels an adhesive sheet S attached on one face of a wafer W from the wafer W via a peeling tape PT. The sheet peeling device 10 comprises: supporting means 11 for supporting the semiconductor wafer W; tape attaching means 12 for attaching the peeling tape PT on the adhesive sheet S; and tension applying means 13 for applying tension to the peeling tape PT attached on the adhesive sheet S to peel the adhesive sheet S. The supporting means 11 includes: a contact face 20 which comes into contact with the other face of the semiconductor wafer W; and movement restricting means 17 and 18 which project from the contact face 20 and can restrict the movement of the semiconductor wafer W.

Description

  The present invention relates to a sheet peeling apparatus and a peeling method. More specifically, the present invention relates to a sheet peeling method in which a peeling tape is affixed to an adhesive sheet affixed to a semiconductor wafer, and the adhesive sheet can be peeled via the peeling tape. The present invention relates to an apparatus and a peeling method.

  A protective wafer is attached to the circuit surface of the semiconductor wafer, and the adhesive sheet is peeled off after various processes such as back grinding. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In this document, when the adhesive sheet is peeled from the semiconductor wafer, first, the semiconductor wafer to which the adhesive sheet is attached is sucked and supported on a table. Then, after sticking a peeling tape on the adhesive sheet, the tension is applied to the peeling tape.

  In addition, a semiconductor wafer having a form disclosed in Patent Document 2 is also used. In this document, the concave portion is formed by grinding so that the thickness of the outer edge side of the semiconductor wafer is relatively larger than the thickness of the other region, and the convex portion is formed along the outer edge of the semiconductor wafer. It serves as a reinforcing material and can prevent the semiconductor wafer from being damaged.

JP 2002-124494 A JP 2007-19461 A

  However, in the peeling apparatus of Patent Document 1, when the thickness of the semiconductor wafer is extremely reduced to 50 μm or less due to a recent request, the semiconductor wafer is sucked into a plurality of holes formed on the table for sucking air. There is an inconvenience that it is recessed. For this reason, the semiconductor wafer is deformed or damaged, resulting in a disadvantage that the product yield is lowered. Moreover, when holding the semiconductor wafer in which the recessed part was formed like patent document 2 with the table of patent document 1, the space between the said recessed part and a table will become a negative pressure, and the semiconductor wafer will be cracked. There is.

[Object of invention]
An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of preventing the semiconductor wafer from being damaged while regulating the movement of the semiconductor wafer when peeling the adhesive sheet from the semiconductor wafer. There is.

To achieve the above object, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet attached to one surface of a semiconductor wafer from the semiconductor wafer via a peeling tape.
A supporting means for supporting the semiconductor wafer by providing a contact surface that contacts the other surface of the semiconductor wafer; a tape attaching means for attaching a peeling tape to the adhesive sheet; and a peeling means attached to the adhesive sheet. Tension applying means for applying tension to the tape and peeling the adhesive sheet from the semiconductor wafer,
The support means includes a movement restricting means that protrudes from the contact surface and is capable of restricting the movement of the semiconductor wafer.

  In the present invention, it is preferable that the movement restricting means is provided so as to be able to protrude and retract from the contact surface.

  Further, it is preferable to adopt a configuration in which a recess is formed on the other surface of the semiconductor wafer, and the movement restricting means is provided in the recess so as to be disposed.

  Moreover, you may take the structure of providing the urging means which urges | biases at least one of the said adhesive sheet and peeling tape to the support means side during peeling of the said adhesive sheet.

  In addition, a configuration in which a pressing unit that biases the semiconductor wafer around the initial peeling site of the adhesive sheet toward the supporting unit is preferably employed.

Further, the peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet affixed to one surface of a semiconductor wafer from the semiconductor wafer via a peeling tape.
A step of bringing the contact surface of the support means into contact with the other surface of the semiconductor wafer and then projecting the movement restricting means from the contact surface to restrict the movement of the semiconductor wafer and supporting the semiconductor wafer;
A step of applying a peeling tape to the adhesive sheet of the supported semiconductor wafer;
A method is employed in which a tension is applied to the peeling tape attached to the adhesive sheet to perform a step of peeling the adhesive sheet from the semiconductor wafer.

  According to the present invention, the movement of the semiconductor wafer can be restricted by the movement restricting means protruding from the contact surface of the support means, so that the position of the semiconductor wafer can be prevented from shifting when the adhesive sheet is peeled off. it can. As a result, it is possible to eliminate the need for the support means to suck and support the semiconductor wafer as in the prior art, and to prevent deformation and damage of the semiconductor wafer due to the suction.

  In addition, when the movement restricting means can be projected and retracted from the contact surface, the movement restricting means protrudes from the contact surface when the adhesive sheet is peeled to restrict the movement of the semiconductor wafer, while moving from the contact surface when the semiconductor wafer is transferred. The regulating means can be retracted to facilitate the conveyance.

  Furthermore, by making it possible to dispose the movement restricting means in the recess of the semiconductor wafer, it is possible to restrict the movement of the semiconductor wafer from the inside of the recess, and the support means can support the semiconductor wafer more stably. It becomes.

  Further, during the peeling of the adhesive sheet, the adhesive sheet is urged toward the support means by the urging means, so that it is possible to avoid the semiconductor wafer from being lifted from the contact surface by the external force of the tension applying means, and the adhesive sheet is poorly detached Can be prevented from occurring.

  Furthermore, since the semiconductor wafer around the initial peeling portion of the adhesive sheet is urged toward the support means by the pressing means, it is possible to better prevent the semiconductor wafer from lifting from the contact surface.

The schematic front view which carried out partial cross section view of the sheet peeling apparatus concerning each embodiment. (A)-(C) are peeling operation explanatory drawings of an adhesive sheet. The partial schematic plan view of the said sheet peeling apparatus. The partial schematic plan view of the sheet peeling apparatus which concerns on a modification. (A)-(C) are explanatory drawings of a biasing means. Explanatory drawing of a holding means.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “upper”, “lower”, “left”, and “right” are used with reference to FIG. 1 unless otherwise specified.

  1 to 3, the sheet peeling apparatus 10 includes a supporting unit 11 that holds a semiconductor wafer W (hereinafter, also referred to as “wafer W”), and one surface (upper surface) that serves as a circuit surface of the wafer W. The tape applying means 12 for applying the release tape PT to the adhesive sheet S attached to the adhesive, and the tension application for applying the tension to the release tape PT attached to the adhesive sheet S and releasing the adhesive sheet S from the wafer W And means 13. In this embodiment, the peeling tape PT is a heat-sensitive adhesive tape.

  The wafer W has a substantially circular shape in plan view, and has a concave portion W1 having a substantially circular shape in plan view formed by grinding the other surface (the lower surface in FIG. 1), and a convex portion W2 connected to the outer periphery of the concave portion W1. And. Therefore, the convex portion W2 is formed in a circle along the outer edge of the wafer W by making the thickness of the outer edge side of the wafer W larger than the thickness of the other region, that is, the concave portion W1 formation region.

  The support means 11 includes a hollow box-shaped table body 16, a first movement restricting means 17 provided in the right side area inside the table body 16, and a second movement restricting means 18 provided in the left side area. I have. The upper surface of the table body 16 is a contact surface 20, and the other surface of the wafer W, that is, the lower end surface of the convex portion W <b> 2 contacts the contact surface 20 so that the wafer W is placed thereon. ing. On the left and right sides of the contact surface 20 in the middle in the vertical direction in FIG. 3, holes 20 </ b> A that allow passage of a regulating member 22 described later are formed.

  The first and second movement restricting means 17 and 18 include a restricting member 22 that can come into contact with the wafer W, and a linear motion motor 23 that serves as a drive device that moves the restricting member 22 up and down from the contact surface 20 so as to protrude and retract. The linear motion motor 26 is provided as a drive device for moving the linear motion motor 23 in the left-right direction via the slider 25. The restricting member 22 of the first movement restricting means 17 protrudes upward from the right hole 20A so as to be disposed inside the recess W1 in the wafer W, and can contact the peripheral surface of the recess W1. Further, the restricting member 22 of the second movement restricting means 18 protrudes upward from the left hole 20 </ b> A and can contact the left end edge of the wafer W.

  The tape sticking means 12 includes a feeding means 28 for feeding the strip-shaped peeling tape PT, and a sticking means 29 provided along with the feeding means 28.

  The feeding means 28 supports a peeling tape PT that is supported and wound by a frame (not shown), and includes a support shaft 31 that can be rotated via a motor M1 as a driving device, and a motor M2 as a driving device. A drive roller 32 that can be rotated via the pinch roller 33 that sandwiches the peeling tape PT between the drive roller 32, a plate-shaped guide member 35 that supports the peeling tape PT from below in FIG. A rotatable press roller 37 sandwiching the peeling tape PT with the guide member 35 and a cylinder 38 as a drive device for raising and lowering the press roller 37 are configured. The guide member 35 is provided so as to be movable in the left-right direction in FIG. 1 via a cylinder 39 as a driving device, and as shown in FIG. 2A, the lead end of the peeling tape PT sandwiched between press rollers 37. The region can be guided to a position where it can be gripped by a chuck 52 described later.

  The affixing means 29 includes a linear motion motor 41 as a drive device, and a pressing head 42 having a heater 42 </ b> A provided by the linear motion motor 41 so as to advance and retract in the vertical direction. The affixing means 29 adheres the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with a pressing head 42 by a chuck 52 described later. It has become. Note that a tape cutting means 44 is provided on the left side of the sticking means 29. The tape cutting means 44 includes a cutter blade 45, a tape receiving plate 46 provided on the lower side of the cutter blade 45 and having a recess on the upper surface, and a cylinder 47 as a drive device for moving the cutter blade 45 in the vertical direction. The cutter blade 45 is composed of a cylinder 48 as a driving device for moving the cutter blade 45 in the direction orthogonal to the paper surface in FIG.

  The tension applying means 13 is provided below the sticking means 29 and a linear motion motor 51 as a driving device provided so as to be movable in the left-right direction through the support means 11 via the slider 50, and holds the peeling tape PT. And a chuck 52 as a driving device that can be gripped by the member 52A. The chuck 52 is provided so as to be movable in the left-right direction via a driving device (not shown).

  Next, the peeling method of the adhesive sheet S in the sheet peeling apparatus 10 will be described with reference to FIGS.

  First, the peeling tape PT is pulled out from the support shaft 31, passed between the drive roller 32 and the pinch roller 33, sandwiched between the press roller 37 and the guide member 35, and the lead end side protrudes from the tip of the guide member 35. Is done. Further, the restricting members 22 of the first and second movement restricting means 17 and 18 are made to stand by at a position where they do not protrude from the contact surface 20 as indicated by a two-dot chain line in FIG. Then, the wafer W to which the adhesive sheet S is attached is placed on the placement surface 20 of the support means 11 via a conveyance means (not shown).

  Next, the linear motion motors 23 of the movement restricting means 17 and 18 are actuated to raise the restricting member 22 and project it from the contact surface 20. Thereafter, the direct acting motors 26 of the movement restricting means 17 and 18 are respectively operated to move the restricting member 22 in the right direction. When the regulating member 22 of the first movement regulating means 17 contacts the peripheral surface of the recess W1 of the wafer W and the regulating member 22 of the second movement regulating means 18 contacts the left edge of the wafer W, each linear motion The operation of the motor 26 is stopped. Thereby, the movement of the wafer W in the left direction is restricted by the respective restriction members 22 on the contact surface 20. As shown in FIG. 3, even if the diameter of the wafer W is changed, the movement stroke of the linear motion motor 26 in the second movement restricting means 18 has a margin and can be dealt with.

  Thereafter, the linear motor 51 moves the support means 11 so that the right outer edge position of the adhesive sheet S stops just below the pressing head 42. Next, as shown in FIG. 2A, the guide member 35 is advanced to the right via the cylinder 39, and at the same time, the motor M2 is operated to rotate the driving roller 32 to feed out the peeling tape PT. Accordingly, the guide member 35 and the lead end side of the peeling tape PT are positioned between the gripping members 52A of the chuck 52. When the press roller 37 is retracted upward and the guide member 35 is retracted, the peeling tape PT is left between the gripping members 52A and is gripped by the operation of the chuck 52. Thereafter, the chuck 52 is moved to a position indicated by a two-dot chain line in FIG. 2A by a driving device (not shown), the peeling tape PT is pulled out, and the peeling tape PT is peeled so as to face the adhesive sheet S below the pressing head 42. The tape PT is positioned.

  Next, as shown in FIG. 2 (B), when the pressing head 42 is moved downward by the linear motion motor 41, the peeling tape PT is pressed down, and the peeling tape PT is heated by the heater 42A to be an adhesive sheet. Adhere to S. Thereafter, the peeling tape PT is sandwiched between the press roller 37 and the guide member 35, and the cylinders 47 and 48 are operated to cut the peeling tape PT with the cutter blade 45 on the tape receiving plate 46.

  Thereafter, as shown in FIG. 2C, the chuck 52 and the support are provided via the linear motor 50 or the like so that the peeling tape PT attached to the adhesive sheet S and the wafer W relatively move in the opposite direction. The means 11 is moved. Thereby, tension is applied to the peeling tape PT attached to the adhesive sheet S, and the adhesive sheet S is peeled off from the wafer W while being folded back. By applying this tension, a force for moving the wafer W in the left direction on the contact surface 20 is generated, but the wafer W comes into contact with the restriction member 22 of the first and second movement restriction means 17, 18. The movement of the wafer W in the left direction is restricted. In the peeling operation of the adhesive sheet S, it is preferable to set the peeling angle θ as close to 180 degrees as possible so that the wafer W does not float from the contact surface 20. Further, in order to prevent the wafer W from being lifted, for example, a material having a large friction coefficient with the wafer W, such as rubber or resin, is used for the restricting member 22 or a process for roughening the surface of the restricting member 22 is performed. It is preferable to apply. Further, the convex portion W2 on the right end side of the wafer W may be configured to be sucked in a spot manner.

  When the peeling of the adhesive sheet S is completed, the peeled adhesive sheet S and the peeling tape PT attached thereto are collected by a collecting means (not shown), and the wafer W is transferred to the next process by a conveying means (not shown). And after the support means 11, the chuck | zipper 52, and each control member 22 return to an initial position, the same operation | movement as the above will be repeated.

  Therefore, according to such an embodiment, it is possible to prevent the adhesive W from being peeled from the wafer W while preventing the wafer W from being deformed or damaged due to negative pressure in the recess W1 due to suction. . Further, since the regulating member 22 of the first movement regulating means 17 is brought into contact with the peripheral surface of the recess W1, the movement of the wafer W in the left direction can be regulated even in the right region of the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  The installation positions and the number of installations of the movement restricting means 17 and 18 can be variously changed as long as the movement of the wafer W can be restricted in the same manner as described above. For example, as shown in FIG. 4, two second movement restricting means 18 that can move the restricting member 22 in the radial direction of the wafer W in a plan view are provided, and three moves together with the first movement restricting means 17. The regulating means may be positioned at intervals of 120 ° in the circumferential direction of the wafer W. Further, the movement of the wafer W may be regulated by being sandwiched between the circumferential surface side of the recess W1 and the outer edge side of the wafer W by the regulating member 22, or a plurality of regulating members 22 are arranged on the circumferential surface side of the recess W1. The movement of the wafer W may be restricted.

  Further, as shown in FIGS. 5A to 5C, during peeling of the adhesive sheet S, at least one of the adhesive sheet S and the peeling tape PT is biased toward the support means 11 side (downward). A biasing means 60 may be provided. Thereby, it is possible to prevent the wafer W from being lifted from the contact surface 20 in the peeling operation of the adhesive sheet S. The urging means 60 in FIG. 5A is composed of a plate positioned between the peeled adhesive sheets S, and the urging means 60 in FIG. 5B is located between the peeled adhesive sheets S. Consists of rollers. The urging means 60 in FIG. 3C is a roller located on the adhesive surface side of the peeled adhesive sheet S. Each urging means 60 is provided so as to be movable up and down and to the left and right via a linear motor as a driving device (not shown), to adjust the distance between the urging means 60 and the upper surface of the wafer W, and to motivate the tension applying means 13. Operation is possible. Thereby, the wafer W is urged downward, and it is possible to better avoid the wafer W from being lifted by applying tension to the peeling tape PT.

  Further, in addition to the configuration of the above embodiment, the holding means 62 shown in FIG. The pressing means 62 includes an L-shaped pressing body 64 having a wedge-shaped tip, a linear motion motor 65 as a drive device that moves the pressing body 64 up and down from the contact surface 20, and the linear motion motor. A linear motion motor 67 is provided as a driving device for moving 65 in the left-right direction via a slider 66. By moving the tip of the pressing body 64 between the upper surface of the right end of the wafer W and the adhesive sheet S before the adhesive sheet S is peeled off, the initial peeling of the adhesive sheet S can be performed more smoothly. Moreover, by stopping the pressing body 64 in the inserted state and peeling the adhesive sheet S, the lifting of the wafer W can be more effectively regulated by the pressing body 64.

  Furthermore, the semiconductor wafer in the present invention may be a silicon semiconductor wafer or a compound semiconductor wafer.

Further, the peeling operation of the adhesive sheet S may stop the operation of the chuck 52 and move the support means 11 as long as it can be peeled off as described above, or conversely stop the operation of the support means 11, The chuck 52 may be moved.
Further, a pressure-sensitive adhesive tape may be adopted as the peeling tape PT.
Further, the tape cutting means 44 for cutting the peeling tape PT is not an essential requirement.
Furthermore, the drive device in the above embodiment employs an electric device such as a rotation motor, a linear motion motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, a combination of them directly or indirectly can be adopted (some of them overlap with those exemplified in the embodiment).
In the above embodiment, the wafer W including the recess W1 and the protrusion W2 connected to the outer periphery of the recess W1 has been illustrated and described. However, the wafer W in which the recess W1 and the protrusion W2 are not formed is targeted. You can also In this case, the movement of the wafer W can be restricted only by the second movement restriction means 18 without using the first movement restriction means 17. In such a configuration, it is important to adjust the urging means 60 and the holding means 62 so that the wafer W does not float up.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Support means 12 Tape sticking means 13 Tension applying means 17 1st movement control means (movement control means)
18 Second movement restriction means (movement restriction means)
20 Contact surface 60 Biasing means 62 Holding means PT Stripping tape S Adhesive sheet W Semiconductor wafer W1 Recess

Claims (6)

In a sheet peeling apparatus for peeling an adhesive sheet attached to one surface of a semiconductor wafer from the semiconductor wafer via a peeling tape,
A support means for supporting the semiconductor wafer by providing a contact surface that contacts the other surface of the semiconductor wafer; a tape attaching means for attaching a release tape to the adhesive sheet; and a release means attached to the adhesive sheet. Tension applying means for applying tension to the tape and peeling the adhesive sheet from the semiconductor wafer,
The sheet peeling apparatus according to claim 1, wherein the support means includes movement restriction means that protrudes from the contact surface and is capable of restricting movement of the semiconductor wafer.   The sheet peeling apparatus according to claim 1, wherein the movement restricting unit is provided so as to be able to appear and retract from the contact surface.   3. A sheet peeling apparatus according to claim 1, wherein a concave portion is formed on the other surface of the semiconductor wafer, and the movement restricting means is provided inside the concave portion so as to be disposed.   4. The sheet peeling apparatus according to claim 1, further comprising biasing means for biasing at least one of the adhesive sheet and the peeling tape toward the support means during peeling of the adhesive sheet.   The sheet peeling apparatus according to any one of claims 1 to 4, further comprising a pressing unit that biases the semiconductor wafer around the initial peeling site of the adhesive sheet toward the support unit. In the sheet peeling method of peeling the adhesive sheet affixed to one surface of the semiconductor wafer from the semiconductor wafer via the peeling tape,
A step of bringing the contact surface of the support means into contact with the other surface of the semiconductor wafer and then projecting the movement restricting means from the contact surface to restrict the movement of the semiconductor wafer and supporting the semiconductor wafer;
A step of applying a peeling tape to the adhesive sheet of the supported semiconductor wafer;
Applying a tension to the peeling tape affixed to the adhesive sheet and peeling the adhesive sheet from the semiconductor wafer.

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