JP5572045B2 - Sheet sticking device and sticking method - Google Patents

Sheet sticking device and sticking method Download PDF

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Publication number
JP5572045B2
JP5572045B2 JP2010201863A JP2010201863A JP5572045B2 JP 5572045 B2 JP5572045 B2 JP 5572045B2 JP 2010201863 A JP2010201863 A JP 2010201863A JP 2010201863 A JP2010201863 A JP 2010201863A JP 5572045 B2 JP5572045 B2 JP 5572045B2
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adherend
adhesive sheet
sheet
means
support surface
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JP2012059928A (en
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弘一 山口
陽太 青木
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リンテック株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly to a sheet sticking apparatus and a sticking method capable of sticking an adhesive sheet having a recess formed in an adhesive layer to an adherend.

  As a semiconductor wafer (hereinafter sometimes referred to as “wafer”), there is a type in which solder bumps (hereinafter referred to as “bumps”) for ensuring electrical conduction are formed on the circuit surface side. . In addition, the wafer is subjected to a process such as back grinding by attaching a protective adhesive sheet to the circuit surface side. As such an adhesive sheet, for example, disclosed in Patent Document 1, an opening (concave portion) having a diameter smaller than the outer shape of the wafer and having no adhesive layer formed is provided on one surface side of the base sheet. There is something. Such an adhesive sheet is affixed to the circuit surface side of the wafer and then cut along the outer edge of the wafer, sealing only the outer edge of the wafer to prevent intrusion of cleaning water during backside grinding.

  Further, for example, Patent Document 2 discloses an application device that attaches an adhesive sheet to a wafer and cuts the adhesive sheet along the outer edge of the wafer.

JP 2005-123382 A JP 2007-62004 A JP 2006-352054 A

However, in the sheet sticking device of Patent Document 2, when the adhesive sheet of Patent Document 1 is adopted, there is an inconvenience that the concave portion and the wafer cannot be aligned and cannot be handled.
Here, in Patent Document 3, the adhesive sheet is pre-cut into the outer shape of the wafer, and during the feeding of the adhesive sheet, the detection means detects the positional deviation of the adhesive sheet, corrects the deviation amount, and corrects the difference between the wafer and the adhesive sheet. The outer shape is affixed so that it is approximately the same. However, in Patent Document 3, since the table for supporting the wafer is moved to correct the shift amount, there is a disadvantage that the configuration of the moving mechanism around the table becomes complicated.

[Object of invention]
An object of the present invention is to provide a sheet on which a concave portion of an adhesive sheet having a concave portion can be accurately arranged at a predetermined position of the adherend and the adhesive sheet can be attached to the adherend while simplifying the structure. It is providing the sticking apparatus and the sticking method.

In order to achieve the above object, the present invention provides an adhesive sheet in which an adhesive layer is provided on one surface of a base sheet, and concave portions are formed in the adhesive layer at predetermined intervals. In the sheet sticking device for sticking to
A support means having a support surface capable of supporting the adherend from the other surface side of the adherend, a feed means for feeding the adhesive sheet so as to face the support surface, and a support means for feeding the adhesive sheet so as to face the support surface. A recessed portion detecting means for detecting the position of the recessed portion in the adhered adhesive sheet, a conveying means capable of placing the adherend on the support surface, and pressing the adhesive sheet from the base sheet side to the adherend. A pressing means for attaching,
The conveying means places the adherend on the support surface such that the concave portion is arranged at a predetermined position of the adherend and the adhesive sheet is stuck on the basis of the detection result of the recess detecting means. It is configured to be placed.

  In this invention, you may take the structure of having a cutting means which can cut | disconnect the adhesive sheet affixed on the said to-be-adhered body.

In addition, including an adherend detection means for detecting the position of the adherend,
Based on the detection result of the adherend detection means, the transport means places the adherend on the support surface so that the concave portion is attached to a predetermined position of the adherend. A configuration is also preferably employed.

  Furthermore, the said cutting | disconnection means can take the structure that the said adhesive sheet can be cut | disconnected in the shape based on the detection result of the said recessed part detection means or the said adherend detection means.

Further, the sticking method of the present invention is a method in which an adhesive layer is provided on one surface of a base sheet, and an adhesive sheet having recesses formed at predetermined intervals on the adhesive layer is attached to one surface of an adherend. In the sheet sticking method to
Extending the adhesive sheet to face the support surface;
Detecting the position of the recess in the adhesive sheet that has been drawn out so as to face the support surface;
A step of placing the adherend on the support surface such that the concave portion is disposed at a predetermined position of the adherend and the adhesive sheet is affixed based on the detection result of the recess;
And a step of pressing the adhesive sheet from the base sheet side and sticking it to the adherend.

  According to the present invention, the position of the concave portion is detected by the concave portion detecting means, and the adherend is placed on the support surface by the conveying means based on the detection result. Therefore, the alignment is performed without moving the supporting means. Since this can be done, the support means and the surrounding structure can be simplified and made compact.

  In addition, since the cutting means cuts the adhesive sheet into a shape based on the detection result of the concave portion detection means or the adherend detection means, the adhesive sheet is attached corresponding to the adhesive sheet having various shapes or the adherend. can do.

The schematic front view of the sheet sticking apparatus which concerns on embodiment. (A) is the front view which looked at the principal part of FIG. 1 in part end view, (B) is the schematic perspective view which looked at the adhesive sheet from the lower side.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “upper” and “lower” are used with reference to FIG. 1 unless otherwise specified.

  1 and 2, the sheet sticking apparatus 10 includes a support means 11 provided to support a wafer W as an adherend, and a belt-like adhesive sheet S temporarily attached to one surface of the belt-like release sheet RL. The feeding means 12 for feeding out the original fabric R, the recessed portion detecting means 13 for detecting the position of the recessed portion C formed in the adhesive sheet S, and the articulated robot 15 as a driving device constituting a conveying means and a cutting means described later. A pressing unit 18 that presses and adheres the adhesive sheet S to the wafer W supported by the support unit 11, an alignment device 19 that positions the wafer W before being supported by the support unit 11, and the sheet pasting device. 10 and a control means 20 for controlling the overall operation.

  A plurality of bumps B are formed on one surface (upper surface) of the wafer W, and these bumps B are electrodes of a semiconductor chip and have a predetermined height.

  The adhesive sheet S includes a base sheet BS and an adhesive layer AD laminated on one surface (the upper surface in FIG. 2B) of the base sheet BS. In the adhesive layer AD, concave portions C are formed at predetermined intervals in the extending direction of the adhesive sheet S (there is no adhesive on the bottom surface of the concave portion, but there may be present). Each recess C is formed in a shape and size that can be accommodated in the plane of the wafer W and that can receive all the bumps B on the wafer W. Between adjacent recesses C, a reference mark BM is provided. The positions of the reference marks BM and the center positions DC of the recesses in the end dimension width direction (Y-axis direction) of the adhesive sheet S are the same without being shifted in the Y-axis direction. The distances D in the X-axis direction between the respective reference marks BM and the recess center position DC that is closest to the feeding direction (X-axis direction) of the adhesive sheet S are all set to be the same. That is, the relative positional relationship between each recess center position DC and the corresponding reference mark BM is always constant, and the recess center position DC can be determined from the position of the reference mark BM.

  The support means 11 has an outer peripheral edge substantially the same shape as the outer peripheral edge shape of the wafer W, and an inner table 22 having a support surface 21 capable of adsorbing and supporting the wafer W from the other surface (lower surface in FIG. 1). And an outer table 25 provided in a concave shape in cross-section so as to form a gap between the inner table 22 and a linear motion motor 27 as a driving device for raising and lowering the inner table 22, Depending on the thickness of the adhesive sheet S and the thickness of the wafer W, it can be moved up and down.

  The feeding means 12 includes a support roller 33 that is provided on the frame F and supports the original roll R wound in a roll shape, a collection roller 34 that collects the release sheet RL, and a support roller 33 and a collection roller 34. A plurality of guide rollers 36 to 39 disposed therebetween, a driving roller 41 that can be rotated via a motor M1 as a driving device, a pinch roller 42 that sandwiches the release sheet RL between the driving roller 41, and an original The release sheet RL is folded back while the anti-R is being fed, and the release plate 43 that peels the adhesive sheet S from the release sheet RL, and the pressing sheet 18 is applied to the adhesive sheet S when the adhesive sheet S is attached to the wafer W. A load cell 44 for detecting tension, a tension measuring roller 46 to which the load cell 44 is connected, and a peeling plate so that a detection value of the load cell 44 becomes a predetermined value. 3, driving means 47 for moving 3, cylinders 53 and 54 as drive devices that sandwich the adhesive sheet S via the brake shoes 50 and 51 and suppress the feeding of the adhesive sheet S, a peeling plate 43, and guide rollers 37 to 39. A frame F1 that supports the load cell 44, the tension measuring roller 46, and the cylinders 53 and 54, and a winding unit 56 that winds up the unnecessary adhesive sheet S1 outside the wafer W are configured. The feeding means 12 can feed the adhesive sheet S peeled from the peeling sheet RL by the peeling plate 43 so as to face the support surface 21.

  The driving means 47 includes a single-axis robot 58 as a driving device, and a slider (not shown) of the single-axis robot 58 is attached to the frame F1, and the tension of the adhesive sheet S detected by the load cell 44 via the control means 20 is detected. Thus, the frame F1 is supported so as to be movable up and down.

  The winding unit 56 sandwiches an unnecessary sheet S1 between the roller 60 supported by the frame F2, the driving roller 61 driven by the motor M2 as a driving device, and the driving roller 61, and rotates following the driving roller 61. A take-up roller 63. The frame F2 is supported on a slider 65A of a linear motor 65 as a driving device and is provided so as to be movable in the X-axis direction.

  The concave portion detection means 13 is made up of imaging means such as a camera provided above the peeling plate 43 shown in FIG. 1, and images the reference mark BM on the adhesive sheet S that is fed out, and the X-axis and the reference mark BM. The position in the Y-axis direction is detected, and the data can be output to the control means 20.

  The articulated robot 15 includes a base portion 70, first to sixth arms 76 disposed on the upper surface side of the base portion 70, and a holding chuck 77 attached to the free end side of the sixth arm 76. The holding chuck 77 can be moved in any position and in any direction within the work area. The holding chuck 77 is detachably connected to a cutter blade holder 79 that supports the cutter blade 78, and can be replaced with a transport arm holder 81 shown in a plan view in a circle surrounded by a two-dot chain line in FIG. Yes. The transfer arm holder 81 supports the transfer arm 82. The transfer arm 82 is provided with a plurality of suction ports (not shown), and is connected to a decompression means (not shown) by connection with the holding chuck 77 to attract the wafer W. It can be held. Here, the cutter blade 78, the cutter blade holder 79, and the articulated robot 15 constitute cutting means, and the transport arm holder 81, the transport arm 82, and the articulated robot 15 constitute transport means.

  The pressing means 18 includes a frame 84 that can move in the X-axis direction via a slider (not shown) of the linear motor 65, a cylinder 85 as a drive device provided on the upper surface side of the frame 84, and an output of the cylinder 85. A pressing roller 86 is rotatably supported on the shaft and is provided so as to move up and down by the operation of the cylinder 85.

  The alignment device 19 is composed of a turntable 89 projecting from the upper surface of the base 88 and a sensor for detecting an outer peripheral edge of the wafer W and an orientation mark such as a V notch and an orientation flat formed on the outer peripheral edge. Body detection means 90. The turntable 89 is provided such that the wafer W can be rotated in the circumferential direction while supporting the wafer W on the upper surface thereof. The adherend detection unit 90 can detect the position of the outer periphery of the wafer W, the orientation mark, and the like by imaging the outer periphery of the wafer W, and can output the detection result to the control unit 20.

  The control means 20 can be composed of a sequencer, a personal computer or the like. The control means 20 is connected to an input means (not shown) composed of an operation panel or the like, and the operating conditions and data of each means can be input by this input means. Further, the control unit 20 inputs the detection results of the recess detection unit 13, the load cell 44, and the adherend detection unit 90, and the operation direction and the operation amount of each driving device from the detection result and the input from the input unit. It has a function of determining conditions such as operation speed and controlling them. Also, a function of determining the recess center position DC from the data input from the recess detection means 13 and a function of determining the post-attachment center position H where the recess center position DC is located when the adhesive sheet S is attached to the wafer W. And the function of determining the wafer center position WC and the position of the orientation mark from the data input from the adherend detection means 90. The control means 20 is connected to each device to be controlled by a cable (not shown), a wireless structure, or the like.

  Next, a method for applying the adhesive sheet S in the present embodiment will be described.

  In the initial setting, the original fabric R is pulled out from the support roller 33 by a predetermined length, and as shown in FIG. 1, the release sheet RL is peeled off by the release plate 43 at the raised position, and the adhesive sheet is fixed to the take-up roller 63. On the other hand, the release sheet RL is fixed to the collection roller 34.

  When the power is turned on, the motors M1 and M2 operate to wind up the adhesive sheet S over a predetermined length, and to wind up the release sheet RL with the recovery roller 34, so that the release plate 43 removes the release sheet RL from the release sheet RL. The peeled adhesive sheet S is fed out so as to face above the support surface 21. Next, the operations of the motors M1 and M2 are stopped, and the brake shoes 50 and 51 are brought into contact with the guide rollers 37 and 39, respectively, and the feeding of the adhesive sheet S is suppressed. After suppressing the feeding of the adhesive sheet S, the reference mark BM of the adhesive sheet S located on the peeling plate 43 is detected by the recess detecting unit 13, and detection data is output to the control unit 20. The control means 20 determines the position of the recess center position DC and the post-paste center position H based on the input data from the recess detection means 13.

  Next, the articulated robot 15 is operated to hold the transfer arm holder 81 on the holding chuck 77, and then the wafer W is sucked and held by the transfer arm 82. Then, by placing the wafer W on the turntable 89 of the alignment device 19 and rotating the wafer W, the adherend detection unit 90 detects the position of the wafer center position WC and the orientation mark, and the position data is obtained. Output to the control means 20. The control unit 20 determines the wafer center position WC and the position of the orientation mark based on the input data from the adherend detection unit 90.

  Next, the articulated robot 15 is operated, the wafer W on the turntable 89 is sucked and held by the transfer arm 82 and transferred to the inner table 22, and the wafer W is placed on the support surface 21. In this transfer, the control means 20 controls the operation of the articulated robot 15 so that the wafer center position WC coincides with the post-sticking center position H obtained previously. In other words, the transport unit places the wafer W on the support surface 21 so that the concave portion C is arranged at a predetermined position of the wafer W and the adhesive sheet S is attached based on the detection result of the concave portion detection unit 13. .

  After placing the wafer W on the support surface 21, the cylinder 85 of the pressing means 18 is operated, and the adhesive sheet S is pressed from the base sheet BS side by the pressing roller 86 as shown by a two-dot chain line in FIG. However, the pressing means 18 is moved to the left in FIG. As the pressing roller 86 moves, tension is applied to the adhesive sheet S, and a tensile force is applied to the tension measuring roller 46. Accordingly, the load cell 44 detects the change in tension, and the control means 20 lowers the frame F1 by the single-axis robot 58 so as to maintain the predetermined tension, so that the solid line in FIG. The adhesive sheet S is attached to the upper surface of the outer table 25 and the upper surface of the wafer W. As a result, the adhesive sheet S is pressed by the pressing roller 86 and attached to the wafer W in a state where a predetermined tension is applied. In this pasting, since the wafer center position WC is placed so as to coincide with the center position H after pasting as described above, the wafer center position WC on the support surface 21 and the recess center position DC are determined. They coincide in the X-axis and Y-axis directions.

  When the application of the adhesive sheet S is completed, the holding chuck 77 is transferred from the transfer arm holder 81 to the cutter blade holder 79 in the articulated robot 15. Then, the articulated robot 15 is operated to cut the adhesive sheet S along the outer peripheral edge of the wafer W via the cutter blade 78. In this cutting, the articulated robot 15 uses the post-paste center position H, the recess center position DC, or the wafer center position WC as the rotation center, and the cutter blade 78 moves to a circular locus corresponding to the diameter of the wafer W and cuts. Control is performed by the control means 20.

  After the cutting of the adhesive sheet S, the holding chuck 77 is transferred again to the transfer arm holder 81 in the articulated robot 15. Then, by the operation of the articulated robot 15, the wafer W to which the adhesive sheet S is stuck is sucked and held by the transfer arm 82, removed from the inner table 22, and transferred to a subsequent process or the like. Thereafter, the frame F2 moves to the left in the drawing, so that the unnecessary adhesive sheet S1 is peeled off from the upper surface of the outer table 25 and taken up by the take-up roller 63. Next, the brake shoes 50 and 51 are separated from the guide rollers 37 and 39, and the frame F1 is raised. At the same time, the pressing roller 86 is raised by the operation of the cylinder 85 and returned to the position shown in FIG. 1 together with the frame F2, and a new adhesive sheet S is fed out. Thereafter, the same operation as described above is performed. .

  Therefore, according to such an embodiment, since the concave portion center position DC is detected by the concave portion detecting means 13 and the operation of the articulated robot 15 is controlled based on the positional information, the wafer W is transferred. The adhesive sheet S can be pasted with the recess C aligned. In addition, the wafer W and the recess C can be aligned without moving the inner table 22, and the configuration of the support means 11 can be simplified.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the cutting means and the conveying means can be variously modified as long as the same function as that of the above embodiment can be exhibited.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

  Furthermore, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a semiconductor wafer or a compound semiconductor wafer.

  Further, the reference mark BM may be provided on any of the adhesive layer AD and the base sheet BS as long as it can be detected by the recess detection unit 13, and the shape and position thereof are not limited to the illustrated configuration example. .

Furthermore, the recess detection means 13 may detect the formation edge of the recess C, and detect the recess center position DC by the intersection of the perpendicular bisectors of two different strings at the formation edge. According to this, the reference mark BM of the adhesive sheet S can be omitted.
Further, when the adhesive sheet S is a raw fabric temporarily attached to one surface of the release sheet RL at a predetermined interval, and the concave portion C is formed in the adhesive sheet S, the concave portion detecting means is used instead. A convex part detecting means capable of detecting the convex part formed on the outer periphery of the concave part C can also be adopted.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Support means 12 Feeding means 13 Concave detection means 15 Articulated robot 18 Press means 78 Cutter blade 82 Transfer arm 90 Adhering body detection means AD Adhesive layer BS Base material sheet C Concavity S Adhesive sheet W Semiconductor wafer ( Adherend)

Claims (5)

  1. In the sheet sticking apparatus for sticking the adhesive sheet, which is provided with an adhesive layer on one surface of the base material sheet, and in which concave portions are formed at predetermined intervals on the adhesive layer, on one surface of the adherend,
    A support means having a support surface capable of supporting the adherend from the other surface side of the adherend, a feed means for feeding the adhesive sheet so as to face the support surface, and a support means for feeding the adhesive sheet so as to face the support surface. A recessed portion detecting means for detecting the position of the recessed portion in the adhered adhesive sheet, a conveying means capable of placing the adherend on the support surface, and pressing the adhesive sheet from the base sheet side to the adherend. A pressing means for attaching,
    The conveying means places the adherend on the support surface such that the concave portion is arranged at a predetermined position of the adherend and the adhesive sheet is stuck on the basis of the detection result of the recess detecting means. A sheet sticking device characterized by being placed.
  2.   The sheet sticking apparatus according to claim 1, further comprising a cutting unit capable of cutting the adhesive sheet attached to the adherend.
  3. An adherend detection means for detecting the position of the adherend;
    The transport means places the adherend on the support surface so that the concave portion is attached to a predetermined position of the adherend based on the detection result of the adherend detection means. The sheet sticking device according to claim 1 or 2, characterized in that
  4.   4. The sheet sticking apparatus according to claim 2, wherein the cutting means is provided so as to be capable of cutting the adhesive sheet into a shape based on a detection result of the recess detection means or the adherend detection means. .
  5. In a sheet sticking method in which an adhesive layer is provided on one surface of a base sheet, and an adhesive sheet in which concave portions are formed at predetermined intervals in the adhesive layer is attached to one surface of an adherend.
    Extending the adhesive sheet to face the support surface;
    Detecting the position of the recess in the adhesive sheet that has been drawn out so as to face the support surface;
    A step of placing the adherend on the support surface such that the concave portion is disposed at a predetermined position of the adherend and the adhesive sheet is affixed based on the detection result of the recess;
    And a step of affixing the adhesive sheet to the adherend by pressing the adhesive sheet from the substrate sheet side.
JP2010201863A 2010-09-09 2010-09-09 Sheet sticking device and sticking method Active JP5572045B2 (en)

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JP2010201863A JP5572045B2 (en) 2010-09-09 2010-09-09 Sheet sticking device and sticking method

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JP2010201863A JP5572045B2 (en) 2010-09-09 2010-09-09 Sheet sticking device and sticking method
TW100130499A TWI517291B (en) 2010-09-09 2011-08-25 Sheet attachment and attachment method
KR1020110088771A KR101854655B1 (en) 2010-09-09 2011-09-02 Apparatus and method for attaching sheet
CN201110279056.1A CN102403196B (en) 2010-09-09 2011-09-06 Sheet adhering apparatus and method of attaching

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JP2012059928A JP2012059928A (en) 2012-03-22
JP5572045B2 true JP5572045B2 (en) 2014-08-13

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CN1324658C (en) * 2003-07-16 2007-07-04 三洋电机株式会社 Cutting method, cutting device and method of manufacturing semiconductor device

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JP5918025B2 (en) * 2012-05-22 2016-05-18 株式会社ディスコ Protective member and protective tape attaching method
JP6045817B2 (en) * 2012-05-28 2016-12-14 株式会社ディスコ Sticking method
JP6145331B2 (en) * 2013-06-19 2017-06-07 リンテック株式会社 Sheet sticking device and sticking method
JP6219197B2 (en) * 2014-02-26 2017-10-25 リンテック株式会社 Sheet sticking device and sticking method

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JP4795743B2 (en) * 2005-05-19 2011-10-19 リンテック株式会社 Pasting device
JP4452691B2 (en) * 2005-08-04 2010-04-21 リンテック株式会社 Sheet cutting device and cutting method
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TWI517291B (en) 2016-01-11
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