JP5113600B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet that does not have sufficient adhesive strength at room temperature, such as a heat-sensitive adhesive sheet, to an adherend.

  2. Description of the Related Art Conventionally, a semiconductor wafer (hereinafter simply referred to as “wafer”) is subjected to various treatments such as backside grinding by attaching a protective adhesive sheet to the circuit surface side. When affixing an adhesive sheet on a wafer, a method is known in which a belt-like adhesive sheet having a size that protrudes from the outer periphery of the wafer is fed out and affixed onto the wafer (see, for example, Patent Document 1). In this method, an adhesive sheet is attached to the wafer on the inner table, and an adhesive sheet protruding from the outer periphery of the wafer is attached to the outer table. Thereafter, the adhesive sheet is cut in accordance with the size of the wafer, and the unnecessary adhesive sheet that protrudes outside the wafer and is attached to the outer table is wound up and collected.

JP 2007-19241 A

  However, in Patent Document 1, if the adhesive sheet is a heat-sensitive adhesive type that does not have adhesive strength at room temperature, the adhesive sheet is not attached to the outer table, and therefore, when the adhesive sheet is cut, unnecessary adhesion is performed together with the operation of the cutter blade. There are inconveniences that the sheet is displaced and cannot be cut accurately, or that the unnecessary adhesive sheet is pulled when the unnecessary adhesive sheet is collected, and the adhesive sheet attached to the wafer is peeled off.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to accurately cut an adhesive sheet affixed to an adherend such as a wafer and to cover the adhesive sheet with the cut adhesive sheet. An object of the present invention is to provide a sheet sticking device and a sticking method capable of preventing an adhesive sheet on a body from being peeled off.

In order to achieve the above object, the present invention is a sheet sticking device for sticking an adhesive sheet that does not have sufficient adhesive strength at room temperature to an adherend,
A table on which the adherend is held, an attaching means for attaching an adhesive sheet having a size protruding from the outer periphery of the adherend surface, and a cutting means for cutting the adhesive sheet according to the size of the adherend surface And
The table includes an inner table for holding an adherend, and an outer table provided outside the inner table,
The outer table includes temporary attachment allowing means capable of closely holding the adhesive sheet on the mounting surface, and the close contact holding by the temporary attachment allowing means is performed against a force acting in a surface direction of the temporary attachment allowing means. Is configured to have a resistance that is the same as a state in which it is not held tightly with respect to a force acting in a direction other than the surface direction .

  In the present invention, the lift means is provided so as to be able to protrude from the placement surface of the inner table, and the lift means is provided so that the adherend can be moved away from and closer to the placement surface of the inner table. A configuration is also preferably employed.

  Further, the inner table may include a heating means capable of heating the adherend.

Furthermore, the sticking method of the present invention is a sheet sticking method for sticking an adhesive sheet that does not have sufficient adhesion at room temperature to an adherend,
Holding the adherend;
Applying an adhesive sheet of a size that protrudes from the outer periphery of the adherend surface of the adherend;
The temporary attachment allowing means has resistance against a force acting in the surface direction of the temporary attachment allowing means, and against the force acting in the direction other than the surface direction, the temporary attachment allowing means having resistance that is not different from the state of not being held tightly attached. a step of an adhesive sheet Ru is tightly held protruding from the adherend surface outer periphery of the adherend,
And a step of cutting the adhesive sheet in accordance with the size of the adherend surface.

  According to the present invention, since the temporary attachment allowing means can hold the adhesive sheet protruding from the outer periphery of the adherend surface, even if the adhesive sheet does not have an adhesive force when being applied to the adherend, Since the adhesive sheet that protrudes from the outer periphery is not stuck with air in between, it is possible to create a substantially bonded state, and when the adhesive sheet is cut or when the unnecessary adhesive sheet is collected, It can prevent the cutting accuracy from deteriorating due to misalignment, or the unnecessary adhesive sheet from being dragged, and the adhesive sheet affixed to the wafer from being peeled off from the adherend surface. Can be affixed. Note that, as described above, the close contact holding means holding in a close contact state without interposing air between the adhesive sheet and the mounting surface, and acts from the outside such as a sandwiching unit and an adsorbing unit. It does not maintain the holding power.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In FIG. 1, the schematic front view of the sheet sticking apparatus which concerns on embodiment is shown, and the one part top view is shown in FIG. In these drawings, a sheet sticking apparatus 10 is a sticking means for sticking a table 11 on which a wafer W as an adherend is placed and an adhesive sheet S having a size protruding from the outer periphery of the adherend surface W1 of the wafer W. The pressing roller 12, the cutting means 13 for cutting the adhesive sheet S in accordance with the size of the adherend surface W 1, and the feeding of the adhesive sheet S, and by cutting the cutting means 13 to the outside of the adherend surface W 1. And a collecting means 14 for collecting the generated unnecessary adhesive sheet S1. Here, the adhesive sheet S is formed in a belt shape and is made of a heat-sensitive adhesive sheet that does not have an adhesive force at room temperature, and is fed out on the table 11 as needed from the left side in FIG. Yes.

  The table 11 includes an outer table 16 and an inner table 17. The outer table 16 has a substantially square planar shape, and as shown in FIG. 3, a recess 20 is formed and a gap 18 is formed between the outer table 16 and the inner table 17. The inner table 17 is attached to the bottom of the recess 20 of the outer table 16 via the linear motor 24, and the outer table 16 is supported by the linear motor 19. Accordingly, the inner table 17 is adjusted according to the thickness of the wafer W, and the outer table 16 is adjusted according to the thickness of the adhesive sheet S, so that the relative distance between the inner table 17 and the press roller 12 is adjusted. Here, temporary attachment permission means 22 is provided on the upper surface of the outer table 16, and the temporary attachment permission means 22 supports the mounting surface 16A of the outer table 16 that supports the adhesive sheet S protruding from the outer periphery of the adherend surface W1. Is formed. In the present embodiment, the temporary attachment allowing means 22 is configured by a mirror-finished stainless steel plate, and thus, even if the adhesive sheet S does not have sufficient adhesive strength at room temperature, the air is sandwiched therebetween. Since it is not affixed, it is possible to form a state of being in close contact and temporarily attached.

  The inner table 17 has a heating means 25 built therein. The heating means 25 can heat the adhesive sheet S on the wafer W via the wafer W placed on the placement surface 17 </ b> A of the inner table 17. Further, as shown in FIG. 3, the inner table 17 is provided with lift means 27 that can project from the mounting surface 17A. The lift means 27 includes a plurality of shaft-like support bodies 28 oriented in a direction orthogonal to the mounting surface 17A, a suction pad 29 provided at the tip of the support body 28 and capable of sucking the wafer W, A driving means (not shown) for raising and lowering the support 28 is provided, and the wafer W sucked by the suction pad 29 is provided so as to be able to move away and approach from the placement surface 17A.

  The press roller 12 is provided so as to be movable in the vertical direction, and is provided so as to roll along the placement surfaces 16A and 17A of the outer table 16 and the inner table 17. Thereby, the adhesive sheet S can be pressed against the wafer W and the temporary attachment allowing means 22.

  The cutting means 13 includes a cutter blade 31, an arm 32 that holds the cutter blade 31, a rotary shaft 33 that rotates the arm 32 in a plane, and the cutter blade 31 via the rotary shaft 33 and the arm 32. And a motor (not shown) that rotates along the outer periphery of the wafer W. The cutting means 13 is provided at a position above the table 11 so as to be lifted and lowered via a lifting device not shown.

  The collection means 14 includes a single-axis robot 35 extending in the left-right direction in FIG. 1, a position fixed to a slider 36 of the single-axis robot 35, and a position indicated by a solid line and a position indicated by a two-dot chain line in FIG. A frame F movably provided between the pair of rollers, a pair of small-diameter rollers 37 supported by the frame F, a large-diameter roller 38 positioned therebetween, and unnecessary adhesion guided by the rollers 37 and 38. A winding roller 40 that winds up the sheet S1, and a driving roller 41 that is supported by the frame F and connected to the output shaft of the motor M, and winds the unnecessary adhesive sheet S1 between the winding roller 40 and the winding roller 40. It has. The take-up roller 40 is urged toward the drive roller 41 by a spring (not shown) so as to be able to cope with an increase in outer diameter accompanying take-up of the unnecessary adhesive sheet S1.

  Next, a method for sticking the adhesive sheet S using the sheet sticking apparatus 10 will be described.

  First, the collecting means 14 stops at a position indicated by a solid line in FIG. 1, the adhesive sheet S passes through the small diameter roller 37 and the large diameter roller 38, and the lead end is fixed to the winding roller 40. When the wafer W is placed on the inner table 17 by a transfer means (not shown), the inner table 17 is not shown so that the adherend surface W1 of the wafer W is at the same level as the placement surface 16A of the outer table 16. Positioning is performed by the sensor and the linear motion motor 24, and the wafer W is heated via the heating means 25. As shown in FIG. 1, the outer table 16 is raised to a position where the adhesive sheet S is sandwiched between the temporary attachment allowing means 22 and the press roller 12 by driving the linear motion motor 19.

  Then, the press roller 12 rolls and moves to a position indicated by a two-dot chain line in FIG. 1 while applying a pressing force to the adhesive sheet S, and presses the adhesive sheet S against the wafer W and the temporary attachment permission means 22. As a result of this operation, the adhesive sheet S does not have a sufficient adhesive force, so the air interposed between the adhesive sheet S, the wafer W and the temporary attachment allowing means 22 is driven out in the direction in which the press roller 12 rolls. Thus, the adhesive sheet S and the temporary attachment allowing means 22 are in close contact with each other. In this tightly held state, resistance is exerted against the force acting in the surface direction of the temporary attachment allowing means 22, but the force acting in other directions, for example, the force acting upward in FIG. In contrast, it is not much different from the state where it is not tightly held. Further, the adhesive sheet S and the wafer W are bonded with a sufficient adhesive force by heating by the heating means 25.

  In this state, after the cutter blade 31 is lowered to a position where the cutter blade 31 pierces the adhesive sheet S, the adhesive sheet S is cut along the shape of the wafer W by rotating along the outer periphery of the wafer W. During this cutting operation, the adhesive sheet S portion (unnecessary adhesive sheet S1) that protrudes from the wafer W is held in close contact by the temporary attachment allowing means 22, and therefore, the positional deviation occurs with the operation of the cutter blade 31. Therefore, accurate cleavage is not inhibited.

  After cutting of the adhesive sheet S, the cutting means 13 is retracted upward, the wafer W to which the adhesive sheet S is stuck is lifted by the support 28 of the lift means 27, and the wafer W is passed through a transfer arm (not shown). Is conveyed to a predetermined position.

Thereafter, the frame F moves to a position indicated by a two-dot chain line in FIG. 1, and the driving roller 41 and the winding roller 40 wind up the unnecessary adhesive sheet S1. At this time, since the unnecessary adhesive sheet S1 is peeled off with a force acting upward in FIG. 1, it can be easily peeled off from the temporary attachment allowing means 22 and adversely affects the winding operation and the surface of the temporary attachment allowing means 22. Never give. Then, the outer table 16 is lowered, the rotation of the driving roller 41 is locked, and the frame F is returned to the position indicated by the solid line in FIG. When the unnecessary adhesive sheet S1 is wound before removing the wafer W to which the adhesive sheet S is adhered, in the conventional structure, the unnecessary adhesive sheet S1 is pulled by the difference in speed between the rotation of the driving roller 41 and the frame F. In some embodiments, the adhesive sheet S on the wafer W may be peeled off. However, in the present embodiment, the unnecessary adhesive sheet S1 is held in close contact by the temporary attachment allowing means 22, and there is no such a possibility.
Thereafter, the adhesive sheet S can be pasted and cut by the same operation.

  Therefore, according to such an embodiment, since the adhesive sheet S is held in close contact with the mounting surface 16A of the outer table 16, the unnecessary adhesive sheet S1 when cutting by the cutting means 13 or when winding the unnecessary adhesive sheet S1. Can prevent misalignment. Thereby, the adhesive sheet S bonded to the wafer W can be accurately cut.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the temporary attachment permitting means 22 may be constituted by a steel plate other than stainless steel, and various modifications are possible as long as the adhesive sheet S can be held tightly, and may be constituted by a glass plate, a resin plate, or the like. Furthermore, the temporary attachment permission means 22 may be provided on the entire mounting surface 16A of the outer table 16, or may be provided partially.

  In addition, the adhesive sheet that does not have sufficient adhesive strength includes a low-adhesive adhesive sheet other than a heat-sensitive adhesive sheet that does not have adhesive strength at room temperature, and the adhesive sheet is cut as in the above embodiment. It is also possible to target an adhesive sheet that does not have an adhesive force that resists the external force when an external force is applied such as winding or winding.

  Furthermore, the adherend is not limited to the wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can be targeted. The semiconductor wafer is a silicon wafer or a compound wafer. There may be.

  Further, the sticking means and the cutting means may be composed of those other than those shown in the embodiment, and the sticking means is as long as the adhesive sheet can be attached to the adherend, and the cutting means is as long as the adhesive sheet can be cut. It is not limited at all.

The schematic front view of the sheet sticking apparatus which concerns on embodiment. Table top view The partial front view just before conveying the to-be-adhered body which stuck the adhesive sheet.

Explanation of symbols

10 Sheet sticking device 11 Table 12 Press roller (sticking means)
DESCRIPTION OF SYMBOLS 13 Cutting means 16 Outer table 16A Mounting surface 17 Inner table 22 Temporary attachment permission means 23 Detection means 25 Heating means 27 Lift means S Adhesive sheet W Semiconductor wafer (to-be-adhered body)
W1 surface

Claims (4)

In a sheet sticking device for sticking an adhesive sheet that does not have sufficient adhesive strength at room temperature to an adherend,
A table on which the adherend is held, an attaching means for attaching an adhesive sheet having a size protruding from the outer periphery of the adherend surface, and a cutting means for cutting the adhesive sheet according to the size of the adherend surface And
The table includes an inner table for holding an adherend, and an outer table provided outside the inner table,
The outer table includes temporary attachment allowing means capable of closely holding the adhesive sheet on the mounting surface, and the close contact holding by the temporary attachment allowing means is performed against a force acting in a surface direction of the temporary attachment allowing means. Has a resistance, and with respect to a force acting in a direction other than the surface direction , the sheet sticking device has a resistance that is the same as a state in which the force is not tightly held .   The lift means includes a lift means provided so as to be able to project from the placement surface of the inner table, and the lift means is provided so as to move the adherend away from and close to the placement surface of the inner table. The sheet sticking device according to claim 1.   3. The sheet sticking apparatus according to claim 1, wherein the inner table includes a heating unit capable of heating the adherend. In a sheet sticking method for sticking an adhesive sheet that does not have sufficient adhesive strength at room temperature to an adherend,
Holding the adherend;
Applying an adhesive sheet of a size that protrudes from the outer periphery of the adherend surface of the adherend;
The temporary attachment allowing means has resistance against a force acting in the surface direction of the temporary attachment allowing means, and against the force acting in the direction other than the surface direction, the temporary attachment allowing means having resistance that is not different from the state of not being held tightly attached. a step of an adhesive sheet Ru is tightly held protruding from the adherend surface outer periphery of the adherend,
And a step of cutting the adhesive sheet in accordance with the size of the adherend surface.

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