JP4963692B2 - Semiconductor wafer processing apparatus and processing method - Google Patents

Description

  The present invention relates to a semiconductor wafer processing apparatus and a processing method. More specifically, the present invention is directed to a semiconductor wafer integrated with a ring frame via a mount sheet, and a protective adhesive sheet affixed to the surface of the semiconductor wafer. Wafer processing suitable for peeling the adhesive sheet while avoiding damage factors of the semiconductor wafer without causing the adhesive sheet to inadvertently adhere to the mount sheet when the peeling tape is applied. The present invention relates to an apparatus and a processing method.

An adhesive sheet for protecting the front surface (device forming surface) is attached to a semiconductor wafer (hereinafter simply referred to as “wafer”), and after performing back surface grinding, predetermined processing such as mounting on a ring frame is performed. After being broken, the adhesive sheet is peeled off from the wafer.
As a wafer processing apparatus for peeling off the adhesive sheet, for example, as described in Patent Document 1, a belt-like peeling tape is applied to the adhesive sheet, and the adhesive sheet is wound by winding the peeling tape. A structure that can be peeled is known.
JP 2007-43047 A

The wafer processing apparatus described in Patent Document 1 employs a configuration in which the detection means 100 detects the outer peripheral edge Se of the adhesive sheet S as schematically shown in FIG. However, even if the adhesive sheet S is accurately cut along the outer peripheral edge We of the wafer W, when the wafer W is chamfered at the outer peripheral edge, The outer peripheral edge Se of the adhesive sheet S is in a state of protruding from the outer peripheral edge We of the wafer W.
Therefore, as shown in FIG. 4B, the peeling tape PT is pressed by the pressing head 101 against the region including the outer peripheral edge Se of the adhesive sheet S detected by the detecting means 100 to the adhesive sheet S. When affixed, the protruding outer peripheral edge of the adhesive sheet S adheres to the mount sheet MS, and when the peeling is performed by the relative movement of the chuck member 102 that holds the front end side of the peeling tape PT and the table T, the mount The sheet MS is lifted, which causes inconvenience that the wafer W is damaged.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences. The purpose of the present invention is to adhere the outer peripheral edge of the adhesive sheet protruding from the outer peripheral edge of the wafer to the mount sheet when the adhesive sheet is peeled off. An object of the present invention is to provide a semiconductor wafer processing apparatus and a processing method capable of attaching a peeling tape to an adhesive sheet so that the adhesive sheet can be peeled while avoiding a wafer damage factor.

In order to achieve the above object, a semiconductor wafer processing apparatus according to the present invention is arranged inside a ring frame with a back surface side of a semiconductor wafer having a protective adhesive sheet affixed on the front surface facing upward, and the semiconductor wafer and the ring. Mount means for attaching and integrating a mount sheet on the upper surface side of the frame, detection means for detecting a distance from a predetermined position of the ring frame to a predetermined outer peripheral position of the semiconductor wafer, and a peeling tape on the adhesive sheet A peeling means for peeling off the adhesive sheet by sticking, and a control means for controlling the peeling means based on the distance detected by the detection means,
The said control means has taken the structure of specifying the sticking position of the said peeling tape based on the said distance, and controlling a peeling means to stick the peeling tape to the said position.

  In the present invention, the mounting means includes a mount sheet pasting unit, a mounting table including an outer table supporting the ring frame and an inner table supporting a semiconductor wafer, and a semiconductor wafer for supporting the inner table and the ring frame. It is possible to employ an arrangement that includes an alignment means for positioning.

  Further, it is preferable that the detection means is provided so as to also serve as the detection means of the alignment means.

  Further, the wafer processing method according to the present invention includes a step of disposing the semiconductor wafer having a protective adhesive sheet affixed on the front surface thereof with the back surface side facing upward, inside the ring frame, and the semiconductor wafer from a predetermined position of the ring frame. A step of detecting a distance to a predetermined outer peripheral position, a step of attaching and integrating a mounting sheet on the upper surface side of the semiconductor wafer and the ring frame, and a peeling tape for the adhesive sheet based on the distance Identifying a sticking position, and attaching a peeling tape to the position to peel the adhesive sheet.

In the present invention, the distance between the predetermined position of the ring frame and the predetermined outer peripheral edge position of the wafer is detected, and the application position of the peeling tape by the peeling means is specified based on the distance, so that the outer peripheral edge of the adhesive sheet is the wafer. Even in a state of protruding from the outer peripheral edge, it is possible to avoid the disadvantage of sticking the protruding adhesive sheet portion to the mount sheet, and it is possible to eliminate the conventional wafer damage factor caused by the sticking.
Further, since the inner table that supports the wafer is supported by the alignment means, the position of the wafer can be adjusted to be a predetermined position with respect to the ring frame. Therefore, as long as the position of the ring frame is maintained at a predetermined position, the position where the peeling tape is applied can be accurately captured.
Furthermore, since the detection means also serves as the detection means of the alignment means, it is possible to reduce the size of the apparatus and facilitate control.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view of a semiconductor wafer processing apparatus according to this embodiment. In this figure, a semiconductor wafer processing apparatus 10 has a mounting means 11 for integrating a wafer W and a ring frame RF, and a distance L (see FIG. 2) between a predetermined position of the ring frame RF and an outer peripheral edge position of the wafer W. Detecting means 12 for detecting, peeling means 13 for peeling the protective adhesive sheet S attached to the surface of the wafer W from the wafer W, transfer means 14 for transferring the mounted wafer W to the peeling means 13, And a control means 15 for controlling these means.

  As shown in FIG. 2, the mounting means 11 includes a mount sheet attaching unit 18, a mounting table 20 including an outer table 21 that supports the ring frame RF and an inner table 22 that supports the wafer W, and an inner table 22. Alignment means 23 for positioning the ring table RF with respect to the ring frame RF, position restriction means 24 provided on the outer table 21 for restricting the position of the ring frame RF, and movement means 25 for moving the outer table 21 in the X-axis direction. It is prepared for.

  The mount sheet affixing unit 18 is supported by the frame F1, a support roller 30 for supporting the original fabric R1 in which the mount sheet MS is temporarily attached to the strip-shaped release sheet RL, and the mount sheet MS from the release sheet RL. The peel plate 32 to be peeled, the press roller 33 for applying a pressing force to the mount sheet MS peeled from the release sheet RL and sticking it to the ring frame RF and the wafer W, and the original fabric R1 connected to the output shaft of the motor M1. A driving roller 34 for applying a repetitive output, a pinch roller 35 for sandwiching the release sheet RL between the drive roller 34, and a take-up roller 36 for winding the release sheet RL. Here, the mount sheet MS is configured by a substantially circular sheet that is larger than the inner diameter of the ring frame RF.

  As shown in FIG. 1, the outer table 21 has a substantially rectangular outer shape in plan view, includes a circular concave portion on the inner side, and an upper surface thereof is provided so that the ring frame RF can be sucked and held. The inner table 22 is provided in a circular shape with an outer shape that fits in the recess of the outer table 21, and the upper surface thereof is formed as a suction surface with suction holes (not shown). As shown in FIG. 2, the outer peripheral edge Se of the adhesive sheet S protrudes beyond the outer peripheral edge We of the wafer W by grinding the wafer W. Further, the outer periphery of the adhesive sheet S is formed obliquely in a side view by cutting obliquely along the chamfered portion of the wafer when it is attached to the wafer W before backside grinding.

  The alignment means 23 includes an X-axis linear motor 40 supported on the bottom of the outer table 21, a Y-axis linear motor 41 attached to a slider 40A of the X-axis linear motor 40, and the Y-axis linear motion. The θ motor 43 is attached to a slider 41A of the motor 41 and rotates the inner table 22 in a plane.

  As shown in FIG. 1, the position restricting means 24 includes an X-direction positioning plate 45 disposed on the upper right end of the outer table 21, and a Y-direction positioning plate 46 disposed on the upper upper end of the outer table 21. , X-direction moving pins 48 and Y-direction moving pins 49 located in the notches 21A formed on the upper part of the outer table 21 at positions facing the X- and Y-direction positioning plates 45, 46, respectively. 48 and 49 are constituted by cylinders 51 and 52 which are movably supported in the X direction and the Y direction, respectively.

  The moving means 25 includes a single-axis robot 56 that is fixed to the upper surface of the base 55 and extends in the X-axis direction, and a guide rail 57 that is arranged in parallel with the single-axis robot 56. 58 is fixed to the bottom surface of the outer table 21. In addition, a slider (not shown) provided on the lower surface of the outer table 21 is movably supported on the guide rail 57.

  The detection means 12 includes an area sensor, a line sensor, a CCD camera, and the like. This detection means 12 is used when the mounting table 20 moves from the position indicated by the solid line in FIG. 2 (position just before the start of mounting) to the position indicated by the two-dot chain line in FIG. A distance L between the outer peripheral edges is detected by setting the outer peripheral edge We and the outer peripheral edge on the rear end side in the moving direction of the ring frame RF as predetermined positions, and the distance data is output to the control means 15. .

As shown in FIG. 3, the peeling means 13 includes a peeling table 60 that supports the mounted wafer W, and a peeling tape attaching unit 59 located above the peeling table 60. The peeling tape sticking unit 59 has a feeding portion 61 that feeds the heat-sensitive adhesive peeling tape PT at a position facing the adhesive sheet S, and a holding chuck that holds the lead end of the peeling tape PT fed from the feeding portion 61. 62, pressing means 64 for pressing and peeling the peeling tape PT against the adhesive sheet S, cutting means 65 for cutting the peeling tape PT, and moving means 63 for moving the peeling table 60 in the X-axis direction It is configured with.
The feeding portion 61 is provided between the driving roller 67 and a support roller 66 provided on the frame F2 for supporting the peeling tape PT, a driving roller 67 rotatably connected to the output shaft of the motor M2, and the driving roller 67. And a pinch roller 68 that sandwiches the tape PT.

  The holding chuck 62 includes a pair of upper and lower chuck claws 62A and 62B that can be spaced apart from each other, and is provided so as to be movable in the X-axis direction via a single-axis robot (not shown) extending in the X-axis direction.

  The pressing means 64 includes a cylinder 70 and a pressing head 72 having a heater 71 provided by the cylinder 70 so as to advance and retract in the Z-axis direction.

  The cutting means 65 includes a cutter blade 73, a cutting cylinder 74 that moves the cutter blade 73 in the Y-axis direction, and a vertical cylinder that is supported by the cutting cylinder 74 and moves the cutter blade 73 in the Z-axis direction. 75. A tape guide plate 76 having a recess is provided below the cutter blade 73. The tape guide plate 76 is always urged to the left in FIG. 3 via a bush 78, a shaft 80, and a coil spring 81. It is provided so as to be movable in the X-axis direction.

  The peeling table 60 is provided in a substantially square shape in plan view, and the upper surface side is formed as an adsorption surface. The peeling table 60 is provided with a position restricting means 82, which is provided so as to be movable in the X-axis direction via a moving means 63. The position restricting means 82 and the moving means 63 are given the same reference numerals because the position restricting means 24 and the moving means 25 of the mount means 11 are configured so as to be symmetrical with respect to the X1 axis parallel to the X axis. The description is omitted.

The transfer means 14 includes a reversing device 90 disposed above the initial position of the mounting table 20, and a transfer device 91 that can be positioned above the reversing device 90. The reversing device 90 includes a substantially H-shaped arm 93 having a suction pad 92 that sucks four regions of the ring frame RF, and a motor M3 that supports the arm 93 and reverses the direction of the suction pad 92 up and down. And a support arm 94 that supports the motor M3, and a Z-axis robot 95 that supports the support arm 94 so as to be movable in the Z-axis direction.
Similarly to the reversing device 90, the transfer device 91 includes a substantially H-shaped arm 97 provided with a suction pad 96, a cylinder 98 that supports the arm 97 so as to be movable up and down, and the cylinder 98 as a Y-axis. And a Y-axis robot 99 that is movably supported along the direction.

  Next, the overall operation of the wafer processing apparatus in this embodiment will be described.

(Wafer mounting process)
When the ring frame RF is placed on the outer table 21 of the mounting table 20 at the initial position by a transfer robot (not shown), the X and Y direction moving pins 48 and 49 are connected via the cylinders 51 and 52 to the ring frame RF. The outer peripheral edge (orientation flat portion in this embodiment) is abutted against the X and Y direction positioning plates 45 and 46. As a result, the ring frame RF is set and held at a predetermined position. Thereafter, the wafer W is placed on the inner table 22 by a transfer robot (not shown).

  Next, as shown in FIG. 2, the mounting table 20 is moved to a position immediately before the start of mounting via the moving unit 25, and the driving of the alignment unit 23, the outer peripheral edge of the wafer W by the detecting unit 12, and the V notch Alignment is performed by detection. As a result, the center position of the wafer W coincides with the center position of the ring frame RF with the V notch of the wafer W oriented in a predetermined direction.

  Thereafter, when the mounting table 20 moves toward the initial position, the mounting sheet pasting unit 18 operates, and the mounting sheet MS peels off the mounting sheet MS from the peeling sheet RL, and the mounting sheet MS receives a pressing force by the press roller 33. In response, the ring frame RF and the back surface of the wafer W are affixed. When the mounting table 20 moves toward the initial position and before the wafer W is covered with the mount sheet MS, the detection means 12 moves the outer peripheral edge We of the wafer W and the ring frame RF. A distance L from the outer peripheral edge portion on the rear end side in the direction is detected, and the detected data is output to the control means 15.

  The mounted wafer W is sucked and held by the reversing device 90, and as shown by the two-dot chain line in FIG. The In this state, the mounted wafer W is transferred to the arm 97 and moved to the peeling unit 12 side, and the Y-axis robot 99 is lowered via a moving mechanism (not shown), so that the mounted wafer W is peeled off. Is placed on the work table 60.

(Adhesive sheet peeling process)
When the mounted wafer W is placed on the peeling table 60, the ring frame RF is subjected to position restriction similar to the position restriction performed on the mounting table 20. Then, as shown in FIG. 3, the peeling table 60 moves below the peeling tape attaching unit 59. At this time, based on the distance L detected by the detection means 12, the control means 15 specifies the position where the peeling table 60 is stopped. That is, the peeling table 60 is stopped at a position where the left end position of the pressing head 72 in FIG. 3 is a distance L away from the left end position of the ring frame RF. At this time, in consideration of the chamfered portion formed on the outer peripheral edge We of the wafer W, it is preferable to perform control so that the left end of the pressing head 72 is located at a position slightly away from the distance L. In this state, after the lead end of the peeling tape PT is held by the holding chuck 62 and pulled out by a predetermined length, the pressing means 64 is lowered to melt and bond the peeling tape PT to the adhesive sheet S. At this time, the position where the lower end of the pressing head 72 contacts is reliably maintained within the outer peripheral edge of the wafer W without pressing the portion of the adhesive sheet S protruding from the outer peripheral edge We of the wafer W. Therefore, there is no inconvenience that the adhesive sheet S and the mount sheet S are bonded.

  In the state where the adhesion of the peeling tape PT is completed in this way, the peeling tape is cut by the cutting means 65, and the holding chuck 62 and the peeling table 60 are relatively moved along the X-axis direction, thereby the adhesive sheet. S can be peeled from the wafer W. The operation of the holding chuck 62 pulling out the peeling tape PT is substantially the same as Japanese Patent Application No. 2008-167940 by the present applicant.

  Therefore, according to such an embodiment, even when the outer peripheral side of the adhesive sheet S protrudes outside the outer peripheral edge We of the wafer W, the peeling tape PT is specified by specifying the outer peripheral edge position of the wafer W. Since the adhesive sheet S is inadvertently adhered to the mount sheet MS, it is possible to prevent the wafer from being cracked.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, when the mounting table 20 is positioned below the mount sheet pasting unit 18, the detection means 12 detects the distance L between the outer peripheral edge of the ring frame RF and the outer peripheral edge We of the wafer W. However, the distance L may be detected when the mounting table 20 is at the workpiece receiving position. The distance L may be a distance between the inner periphery of the ring frame RF and the outer periphery of the wafer W.

  Further, the transfer device 91 may be performed by an articulated robot capable of attracting and holding the ring frame RF on which the wafer W is mounted.

1 is a schematic plan view showing an overall configuration of a semiconductor wafer processing apparatus according to an embodiment. The schematic front view of the mounting means in the said semiconductor wafer processing apparatus. The schematic front view of the peeling means in the said semiconductor wafer processing apparatus. (A), (B) is a principal part front view for demonstrating the conventional inconvenience.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor wafer processing apparatus 11 Mounting means 12 Detection means 13 Peeling means 15 Control means 18 Mount sheet sticking unit 20 Mounting table 21 Outer table 22 Inner table 23 Alignment means S Adhesive sheet PT Peeling tape W Semiconductor wafer We Outer periphery RF ring Frame MS mount sheet

Claims (4)

Mounting means for disposing a semiconductor wafer having a protective adhesive sheet attached to the front side thereof on the inner side of the ring frame with the back side facing upward, and attaching and mounting a mounting sheet on the upper surface side of the semiconductor wafer and the ring frame Detecting means for detecting a distance from a predetermined position of the ring frame to a predetermined outer peripheral edge position of the semiconductor wafer; peeling means for attaching a peeling tape to the adhesive sheet to peel the adhesive sheet; and the detecting means Control means for controlling the peeling means based on the detected distance,
The semiconductor wafer processing apparatus according to claim 1, wherein the control means controls the peeling means so as to specify a position where the peeling tape is applied based on the distance and to apply the peeling tape to the position.   The mounting means supports the inner table and positions the semiconductor wafer with respect to the ring frame, and includes a mounting sheet pasting unit, a mounting table including an outer table supporting the ring frame and an inner table supporting the semiconductor wafer. 2. The semiconductor wafer processing apparatus according to claim 1, further comprising an alignment unit.   The semiconductor wafer processing apparatus according to claim 1, wherein the detection unit also serves as a detection unit of the alignment unit. A step of placing the back side of the semiconductor wafer with the protective adhesive sheet attached to the front side facing up and inside the ring frame;
Detecting a distance from a predetermined position of the ring frame to a predetermined outer peripheral position of the semiconductor wafer;
A step of attaching and integrating a mounting sheet on the upper surface side of the semiconductor wafer and the ring frame;
And a step of identifying a position where the peeling tape is attached to the adhesive sheet based on the distance, and affixing the peeling tape to the position and peeling the adhesive sheet.

Images