JPH08148451A - Semiconductor wafer automatic exfoliation device - Google Patents

Abstract

PURPOSE: To make it possible to automate the exfoliation operation in which the wafer, for which a polishing process is finished, is exfoliated from a wafer holder plate by a method wherein the wafer position on the wafer holder plate is detected, a vertically movable pawl is inserted into the gap between the wafer and the wafer holder plate, and a wafer exfoliation mechanism is moved forward and backward. CONSTITUTION: The pitch between wafer holder plates and the distance from the center point of the holder plate to the inside end and the outside end of a wafer 10 is measured by a centering laser displacement gauge 7 located above the positioning stage 3b of a plate transferring device 3, and the wafer 10 position on a holder plate 1 is detected. At this point, the affixing plate 1 is rotated, the wafer is positioned in such a manner that it is put in the wafer mating hole of the template 8 of a wafer exfoliation stage 3c. The wafer exfoliation robot 4 located in the vicinity of the wafer exfoliation stage 3c is provided with a thin pawl 4c, which can be inserted into the gap between the wafer 10 and the plate 1, at the tip of a band 4b, which can be moved vertically, on a substrate 4a which can be moved forward and backward.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for automatically performing a series of operations in a semiconductor wafer manufacturing process, from a wafer after polishing is peeled from a sticking plate to a cleaning carrier. .

[0002]

2. Description of the Related Art A semiconductor wafer is mirror-finished by polishing the surface of the semiconductor wafer in a state of being stuck to a sticking plate using an adhesive such as wax. Then, when the polishing is completed, it is peeled from the sticking plate and sent to the cleaning step. Conventionally, the work of peeling a wafer from this pasting plate is generally performed with a thin razor blade 13a as shown in FIG.
It was carried out manually by using a dedicated peeling jig 13 attached to the tip.

[0003]

However, this manual work requires very careful attention so as not to damage the wafer, and is extremely inferior in workability. Therefore, the applicant of the present invention automatically removes a wafer from a sticking plate on which a wafer after polishing is stuck and mounts the carrier in a carrier according to Japanese Patent Application No. 3-353865 (JP-A-5-162915). We applied for a wafer stripping device. This device moves a sticking plate to a wafer stripping mechanism, a sticking plate transport mechanism, a plate rotating table on which the sticking plate is placed and rotates, a sensor which detects a reference point provided on the sticking plate, and vertically moves and rotates. Wafer stripping mechanism provided with an openable / closable hand provided at the arm tip, a wafer loading mechanism having a wafer transport belt, and carrier lifting means, and control for the pasting plate transport mechanism, wafer stripping mechanism, and wafer loading mechanism And a device. Further, with such a configuration, the following operational effects are brought about. (A) Positioning with respect to the wafer stripping mechanism by rotating the attachment plate on which the wafer after polishing is attached on the plate rotating table and stopping the rotation of the plate rotation table when the sensor detects the reference point provided on the attachment plate. You can (B) The wafer peeled from the attaching plate by the wafer peeling mechanism is placed on the wafer transfer belt,
The wafer is sent into the carrier as it is, and a series of operations from the separation of the wafer to the loading of the carrier can be unmanned. In view of the above problems, it is an object of the present invention to provide a semiconductor wafer automatic peeling apparatus that automates the peeling work from the wafer sticking plate of the wafer that has undergone the polishing step and can save the labor of the work. .

[0004]

Therefore, according to the present invention, there is provided a semiconductor wafer automatic peeling device, basically a plate carrying-in mechanism for carrying a sticking plate having a semiconductor wafer stuck thereon to a plate transfer device, and a plate receiving stage. , A wafer positioning stage, a wafer peeling stage, and a plate discharging stage, and a plate transfer device for mounting and moving a sticking plate, and a sensor provided on the positioning stage for detecting a sticking position of a wafer on the sticking plate. And a wafer stripping mechanism provided with a vertically movable claw that can be inserted into the gap between the wafer and the pasting plate, and provided so as to be movable back and forth, and a wafer stripped from the pasting plate at the wafer stripping stage. A wafer transfer mechanism that transfers the wafer to the carrier loader for wafer storage, and A patch plate after Doha peeling was composed of a plate discharge mechanism for unloading from said plate discharge stage.

[0005]

According to the above structure, the wafer after polishing is
It is possible to unmanned a series of operations from peeling from the wafer sticking plate, loading into the wafer storage carrier, and carrying out the sticking plate after peeling the wafer.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an automatic semiconductor wafer peeling apparatus according to the present invention, FIG. 2 is a plan view of a main part of a wafer peeling robot, (B) is a side view of the main part, and FIG. 4A is a plan view, FIG. 4B is a partial sectional side view, and FIG. 5A is a peeling jig used in the prior art. A plan view and (B) are side views.

As shown in FIG. 1, the semiconductor wafer automatic peeling apparatus in this embodiment is composed of a plurality of semiconductor wafers 1
A plate carry-in roller 2 that conveys the stuck plate 1 to which 0 is stuck to the plate transfer device 3, and a plate transfer device 3
, The wafer peeling robot 4, and the peeled wafer 1
The wafer transport mechanism 5 transports 0 to the wafer storage carrier loader 6, and the plate transport roller 11 transports the sticking plate 1 after peeling the wafer 10 out of the apparatus.

A reference point (not shown) is provided on the outer periphery of the sticking plate 1, and the wafer 10 to be stuck to this is shown.
Is on the diameter of the attachment plate 1 and 36 from the reference point.
The wafers 10 are arranged so that the centers of the respective wafers 10 are located at positions spaced by 0 ° / n (n is the number of wafers attached).

The plate transfer device 3 is formed in a substantially cross shape and is divided into four stages of a plate receiving stage 3a, a wafer positioning stage 3b, a wafer peeling stage 3c and a plate discharging stage 3d, and the plate carry-in roller 2 Sticking plate 1 sent from
It is configured such that the sticking plate 1 can be sequentially moved to the next stage by rotating the sticking plate 1 in a horizontal direction in a state of being mounted. Also,
Each of the plate receiving stage 3a, the wafer positioning stage 3b, the wafer peeling stage 3c, and the plate discharging stage 3d is provided so as to be movable up and down. In the operating state peculiar to each stage, the sticking plate 1 is raised to move to the next stage. It is designed to descend when moved to.

Positioning stage 3 of plate transfer device 3
A laser displacement sensor (sensor) 7 for centering is provided above b.
The laser displacement meter 7 is used to measure the pitch between the sticking plates that are sequentially carried in, the distance between the inner end and the outer end of the stuck wafer 10 from the center point of the sticking plates, and measure on the sticking plate 1. The attachment position of the wafer 10 is detected. Here, the sticking plate 1 is rotated, and the position is determined so that the sticking plate 1 can be housed in the wafer fitting hole 8a of the template 8 provided on the next wafer peeling stage 3c described later. At that time, if there is a deviation in the sticking position of the wafer 10, the deviation can be detected, the operation of the apparatus can be stopped, and a buzzer can notify the operator.

The wafer stripping robot 4 is provided in the vicinity of the wafer stripping stage 3c of the plate transfer device 3, and as shown in FIG. 2, it is vertically movable on a base 4a which can be moved back and forth. The thin hand 4b is provided with a thin claw 4c that can be inserted into the gap between the wafer 10 and the sticking plate 1, and the wafer 10 stuck while rotating the sticking plate 1 fixed on the wafer peeling stage 3c. Can be sequentially peeled off.

Further, a template 8 as shown in FIG. 3 is provided above the wafer peeling stage 3c, and the pasting plate 1 positioned by the positioning stage 3b immediately before is lifted and sucked by the template 8. ,
The attached wafer 10 can be housed in a wafer fitting hole 8a provided by cutting out from the peripheral edge of the template 8. As a result, the separated wafer 1
0 is locked at the inner peripheral edge of the wafer fitting hole 8a and can be retained at the bonding position even after peeling, so that the wafer 10 after peeling can be prevented from sliding on the bonding plate 1 and disturbing the position. Has been

The wafer 10 peeled from the attachment plate 1 at the wafer peeling stage 3c is transferred to the wafer transfer mechanism 5
Thus, the wafer is transferred to the wafer-loading carrier loader 6. The wafer transfer mechanism 5 is provided with a Bernoulli chuck 9 so that the peeled wafer 10 is sucked and transferred from above. The Bernoulli chuck 9 has a structure as shown in FIG.
By supplying air from a and jetting it out and exhausting it from the nozzles 9b and 9c, the wafer 10 is sucked and suspended without contact by the action related to the flange 9d and the internal vacuum chamber 9e,
The wafer 10 is designed to be held without being damaged or contaminated.

Next, the operation of this apparatus will be described. (S1). The sticking plate 1 is carried into the plate receiving stage 3 a by the plate carrying-in roller 2. After the loading is completed, the transport roller 2 moves down. If the other stations are operating normally, the plate transfer device 3 rotates,
Shift to the wafer positioning stage 3b. (S2). When the sticking plate 1 shifts to the wafer positioning stage 3b and the plate transfer device 3 stops, the wafer positioning stage 3b rises and the sticking plate 1
While horizontally rotating, the laser displacement meter 7 detects the bonding position of the wafer 10, and also determines the position so that the wafer 10 can be accommodated in the wafer fitting hole 8a of the template 8 provided on the next wafer peeling stage 3c and then stops. To do. At that time, if there is an abnormality such as a deviation in the sticking position of the wafer 10 stuck on the sticking plate 1, this is detected, the operation of the apparatus is stopped, and a buzzer alarms. If the attachment position is normal, the wafer positioning stage 3b moves down. If the other stations are operating normally, the plate transfer device 3 rotates and shifts to the wafer peeling stage 3c. (S3). The sticking plate 1 is the wafer peeling stage 3c
When the plate transfer device 3 stops after shifting to, the wafer peeling stage 3c rises and the sticking plate 1 is sucked onto the template 8. Then, the wafer peeling robot 4 moves forward, and the claw 4c at the tip of the hand 4b moves to the wafer 10
Then, the wafer 10 is peeled off by being inserted into the gap between the sticking plate 1 and driving the hand 4b up and down. The peeled wafer 10 is moved to the recovery position of the wafer 10 by the rotation of the wafer peeling stage 3c, is adsorbed by the Bernoulli chuck 9, and is conveyed to the wafer storage carrier loader 6 by the wafer conveyance mechanism 5. At the same time, the wafer peeling mechanism 4 peels the next wafer 10 that has come to the peeling position as described above, and repeats until there is no wafer 10 stuck to the sticking plate 1. Sticking plate 1
When the peeling of all the wafers 10 attached to
The wafer peeling stage 3c moves down. If the other stations are operating normally, the plate transfer device 3 rotates and shifts to the wafer unloading stage 3d. (S4). The sticking plate 1 is the wafer unloading stage 3d
When the plate transfer device 3 is stopped by shifting to, the plate unloading roller 11 rises and the sticking plate 1 is unloaded. (S5). The above (S1) to (S4) are repeated until all the lots of sticking plate 1 are processed. FIG.
The middle 12 is a control device, which automatically controls the series of operations in the present device.

[0015]

The present invention having the above-mentioned constitution can obtain the following excellent effects. (1). It is possible to unmanned a series of operations from peeling the wafer after polishing is completed from the wafer sticking plate and loading it into the wafer storage carrier. (2). Since the plate transfer device is formed in a substantially cross shape and divided into four parts, a plate receiving stage, a wafer positioning stage, a wafer peeling stage and a plate discharging stage, the functions of each stage can be independently and simultaneously advanced. Therefore, a series of operations can be performed continuously and quickly. (3). Provide a template on the wafer peeling stage,
Since the stuck wafer is stored in the wafer fitting hole provided by cutting out from the peripheral edge of the template, the movement of the wafer after peeling is regulated, so that the peeled wafer is placed on the sticking plate. It can prevent slipping and disturbing the position. (4). Since the wafer transfer mechanism is equipped with the Bernoulli chuck, the wafer can be transferred without being damaged or contaminated.

[Brief description of drawings]

FIG. 1 is a plan view of a semiconductor wafer automatic peeling apparatus according to the present invention.

FIG. 2A is a plan view of a main part of the wafer peeling robot,
(B) is a side view of a main part.

FIG. 3 is a perspective view showing a state where a sticking plate is sucked onto a template.

FIG. 4A is a plan view and FIG. 4B is a partial cross-sectional side view of a Bernoulli chuck.

FIG. 5 shows a peeling jig used in the prior art (A).
Is a plan view and (B) is a side view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesion plate 2 Plate loading roller 3 Plate transfer device 3a Plate receiving stage 3b Wafer positioning stage 3c Wafer stripping stage 3d Plate unloading stage 4 Wafer stripping robot 5 Wafer transfer mechanism 6 Wafer storage carrier loader 7 Laser displacement meter (sensor) 8 Template 9 Bernoulli chuck 10 Wafer 11 Plate transport roller 12 Controller

Claims (5)

[Claims] 1. A plate loading mechanism for loading a bonding plate on which a semiconductor wafer is bonded to a plate transfer device, and a plate receiving stage, a wafer positioning stage, a wafer peeling stage, and a plate discharging stage for mounting the bonding plate. A plate transfer device that moves by moving the sensor, a sensor that is provided on the wafer positioning stage to detect the bonding position of the wafer on the bonding plate, and a vertically movable claw that can be inserted into the gap between the wafer and the bonding plate. Provided, and a wafer peeling mechanism provided to be movable back and forth, a wafer transfer mechanism for transferring the wafer peeled from the sticking plate at the wafer peeling stage to a wafer storage carrier loader, and the sticking plate after wafer peeling Play carried out from the plate carry-out stage Semiconductor wafer automatic peeling apparatus characterized by comprising a discharge mechanism. 2. A semiconductor wafer automatic stripping apparatus according to claim 1, wherein each of a plate receiving stage, a wafer positioning stage, a wafer stripping stage and a plate discharging stage is provided so as to be vertically movable. 3. The automatic semiconductor wafer peeling apparatus according to claim 1, wherein the sensor provided on the positioning stage is a laser displacement meter. 4. The automatic semiconductor wafer peeling apparatus according to claim 1, wherein the wafer peeling stage is provided with a template. 5. The wafer transfer mechanism comprises a Bernoulli chuck for sucking a wafer.
The semiconductor wafer automatic peeling device described.