CN109590705A - A kind of wafer automatic assembling apparatus and automatic assembly method - Google Patents
A kind of wafer automatic assembling apparatus and automatic assembly method Download PDFInfo
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- CN109590705A CN109590705A CN201811599686.5A CN201811599686A CN109590705A CN 109590705 A CN109590705 A CN 109590705A CN 201811599686 A CN201811599686 A CN 201811599686A CN 109590705 A CN109590705 A CN 109590705A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000010009 beating Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 255
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/001—Article feeders for assembling machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
- B23P19/06—Screw or nut setting or loosening machines
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of wafer automatic assembling apparatus and wafer automatic assembly methods.Wafer automatic assembling apparatus includes wafer disks transmission unit, turntable, wafer transfer unit and wafer assembly unit.The wafer disks transmission unit between wafer disks mounting table and the turntable for carrying the wafer disks；The wafer transfer unit is used to wafer being carried to wafer positioning mechanism from wafer feed mechanism；The wafer assembly unit includes: the rotating mechanism for rotating the turntable；For being opened and closed the cap-opening mechanism of wafer disks disk cover；And the wafer assembling mechanism for being packed into wafer in the wafer disks；And the automatic bolt screwing machine structure for the wafer disks for filling wafer to be beaten with screw automatically.The present invention can efficiently realize wafer Automated assembly.
Description
Technical field
The present invention relates to semiconductor crystal wafer manufacturing technology field, in particular to a kind of wafer automatic assembling apparatus and wafer are certainly
Dynamic assembly method.
Background technique
The PSS standard production process of wafer include gluing, exposure, development, ADI check, check, remove photoresist after etching, etching,
Cleaning, final inspection and packaging and other steps.Wherein, ADI inspection is needed for wafer to be put into be circulated again in aluminium dish to next process and be carried out
Etching is currently manually the wafer after inspection to be placed on inside aluminium dish, then manually carry out screw lock to aluminium dish and pay.Due to wafer
Placement location required precision is high and wafer cannot be allowed to be contaminated, and manually-operated qualification rate is lower, and wafer loss rate is also high,
Scrappage is about 5%.In addition, efficiency is very even if skilled person's work operates and can be only done within whole process one day 60 and face left the right side
It is low.The horizontal level of worker operation is uneven and mobility of people is big, also causes very big influence to production.
Accordingly, it is desirable to provide a kind of efficient, low pollution risk wafer automatic assembling apparatus and automatic assembly method.
Summary of the invention
It is a primary object of the present invention to overcome the deficiencies of existing technologies, provide it is a kind of efficiently, low pollution risk wafer from
Dynamic assembly device and automatic assembly method.
To reach above-mentioned purpose, the present invention provides a kind of wafer automatic assembling apparatus, comprising: wafer disks transmission unit turns
Disk, wafer transfer unit and wafer assembly unit.Wherein, the turntable has multiple supporting parts for accommodating wafer disks；The crystalline substance
Disk transmission unit between wafer disks mounting table and the turntable for carrying the wafer disks；The wafer transfer unit,
For wafer to be carried to wafer positioning mechanism from wafer feed mechanism；The wafer assembly unit includes: rotating mechanism, is used for
Rotating the turntable makes the wafer disks on the turntable turn to assembling station, beat screw station or discharge station；Cap-opening mechanism,
For being closed its disk cover after the assembling station opens the disk cover of the empty wafer disks and fills wafer in wafer disks；
Wafer assembling mechanism, for the wafer on the wafer positioning mechanism to be packed into the empty wafer disks in the assembling station
It is interior；Automatic bolt screwing machine structure, for beating screw station described and playing screw automatically to the wafer disks for filling wafer.
Preferably, the wafer disks transmission unit includes: wafer disks fetching device, for by the wafer disks from the crystalline substance
Disk mounting table is carried to wafer disk-positioning mechanism, and wafer disks are carried to the wafer from wafer disks blanking transfer mechanism
Disk mounting table；Wafer disks top rotary table mechanism, for the wafer disks to be carried to the turntable from the wafer disk-positioning mechanism；
Wafer disks cutting agency, for the wafer disks to be carried to the wafer disks blanking transfer machine from the discharge station of the turntable
Structure.
Preferably, the wafer transfer unit includes wafer material fetching mechanism, for by wafer from the wafer feed mechanism
It is carried to the wafer positioning mechanism.
Preferably, wafer automatic assembling apparatus further includes screw conveying mechanism, for screw to be transmitted to loader automatically
Screw is simultaneously automatically loaded in the loader by position.
Preferably, the quantity of the automatic bolt screwing machine structure is 2, beats screw station to the turntable described in two respectively
Two wafer disks execute automatically beat screw operate.
Preferably, the quantity of the wafer feed mechanism is 2, and the quantity of the wafer positioning mechanism is 2, each crystalline substance
Justify positioning mechanism for identification and adjusts the position of the wafer and read the sequence number of the wafer.
Preferably, the wafer automatic assembling apparatus is divided into manual operation area and clean operating area, the wafer dress
Be located in the clean operating area with unit and with the manual operation separate from.
According to another aspect of the present invention, it is automatic to additionally provide a kind of wafer applied to above-mentioned wafer automatic assembling apparatus
Assembly method, comprising the following steps:
The wafer disks are carried to the turntable from the wafer disks mounting table；
The wafer is carried to the wafer positioning mechanism from the wafer feed mechanism；
Rotating the turntable makes the empty wafer disks turn to the assembling station, opens disk cover, the wafer is filled
The closure disk cover after in the full wafer disks；
It rotates the turntable and turns to the wafer disks for filling wafer and beat screw station automatically and execute automatic screw of beating
Operation；
The wafer disks are carried into back the wafer disks mounting table from the turntable.
Preferably, the step of wafer disks being carried to the turntable from the wafer disks mounting table includes: will be described
Wafer disks are carried to wafer disk-positioning mechanism from the wafer disks mounting table；And the wafer disks are positioned from the wafer disks
Mechanism is carried to the turntable.The step of wafer disks are carried into back the wafer disks mounting table from the turntable include: by
The wafer disks are carried to wafer disks blanking transfer mechanism from the discharge station of the turntable；And by the wafer disks from described
Wafer disks blanking transfer mechanism is carried to the wafer disks mounting table.
Preferably, the screw station of beating is 2, executes play screw operation automatically respectively.
Compared to the prior art, wafer automatic assembling apparatus of the invention makes wafer be placed into wafer disks and play screw
It is all full-automatic realization in whole process, meanwhile, wafer disks feeding, positioning, wafer are put into wafer in entire assemble flow
Disk plays screw, and wafer disks blanking is Parallel Implementation and guarantees to be overlapped in the time of each process, in this way, produce
Efficiency and qualification rate can bring huge economic benefit much higher than artificial production for factory.
Detailed description of the invention
Fig. 1 show the schematic diagram of wafer；
Fig. 2 show the schematic diagram of one embodiment of the invention wafer disks；
Fig. 3 show the schematic diagram of the disk cover of one embodiment of the invention wafer disks；
Fig. 4 show the schematic diagram of the disk body of one embodiment of the invention wafer disks；
Fig. 5 show the schematic diagram of the wafer automatic assembling apparatus of one embodiment of the invention；
Fig. 6 show the flow chart of the wafer automatic assembly method of one embodiment of the invention.
Specific embodiment
To keep the contents of the present invention more clear and easy to understand, below in conjunction with Figure of description, the contents of the present invention are made into one
Walk explanation.Certainly the invention is not limited to the specific embodiment, general replacement known to those skilled in the art
It is included within the scope of protection of the present invention.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
It is different from other way described herein using other and implements, therefore the present invention is by the limit of following public specific embodiment
System.
Wafer automatic assembling apparatus and wafer automatic assembly method of the invention are subject in detail below with reference to Fig. 1-Fig. 6
Explanation.Wafer automatic assembling apparatus includes wafer disks transmission unit, turntable 1, wafer transfer unit and wafer assembly unit.Entirely
The process of automatic assembling includes that wafer disks are carried to turntable, and wafer is packed into the wafer disks on turntable, executes and plays screw automatically
Operation and wafer disks blanking.Wafer disks transmission unit is for carrying wafer disks between wafer disks mounting table and turntable；Wafer
Transmission unit is used to wafer being carried to wafer positioning mechanism from wafer feed mechanism；Wafer assembles device for wafer is automatic
It is assembled in the wafer disks on turntable 1.
Please refer to Fig. 1-Fig. 4 which shows the schematic diagram of wafer and wafer disks in the present invention.Wafer W has a pingbian, and
Usually it is carved with the sequence number of wafer in pingbian side.Wafer disks are the containers that can accommodate more wafers, can usually accommodate 5 or 7
Wafer.In the present embodiment, wafer automatic assembling apparatus is to be applied to ADI in PSS process to check flowing through to etching procedure
Journey, therefore wafer disks are aluminium dish.Wafer disks include disk cover and disk body part, have wafer receiving portion in disk body, since wafer is
With a pingbian, disk body receiving portion also phase Ying Youyi pingbian, to match with wafer shape.
Please continue to refer to Fig. 5, turntable 1 has multiple supporting parts for accommodating wafer disks, these supporting parts are around the center of circle of turntable 1
Annular distribution, the quantity of supporting part is 6 in the present embodiment, i.e., can at most place 6 wafer disks on turntable simultaneously.On turntable 1
Settable multiple stations, including feeding station, assembling station, beat screw station or discharge station.Feeding station mentioned here
It is the station that wafer disks are put into turntable, assembling station is the station for carrying out wafer assembling, and beating screw station is to carry out beating spiral shell automatically
The station of nail, discharge station are take wafer disks from turntable away stations.
Wafer disks transmission unit includes wafer disks fetching device 3, wafer disks top rotary table mechanism 5, wafer disks cutting agency 13.
Wherein, wafer disks fetching device 3 is mechanical arm or robot, wafer disks can will be carried to wafer disks from wafer disks mounting table 2
Positioning mechanism 4, and wafer disks are carried to wafer disks mounting table 2 from wafer disks blanking transfer mechanism 14.Here, wafer disks are fixed
Position mechanism 4 can recognize the position of wafer disks and be adjusted to designated position.Specifically, settable recess conduct in wafer disks
The origin of wafer disks, wafer disk-positioning mechanism 4 identified using visual sensor and PLC sensor the origin of wafer disks and by
The position of this adjustment wafer disks.It can ensure that wafer disks are put into the consistency in turntable by wafer disk-positioning mechanism 4.In wafer disks
Rotating disk mechanism 5 can be mechanical arm or robot, for wafer disks to be transported to the feeding of turntable 1 from wafer disk-positioning mechanism 4
Station.Wafer disks cutting agency 13 can be mechanical arm or robot, for being transported to wafer disks from the discharge station of turntable 1
Wafer disks blanking transfer mechanism 14.
Wafer transfer unit includes wafer material fetching mechanism 7, and wafer is carried to wafer localization machine from wafer feed mechanism
Structure.Since wafer feeding holding time is longer, in the present embodiment use two wafers feed mechanism 8-1 and 8-2, alternatingly feed,
To guarantee in non-stop-machine situation to wafer feeding.Wafer positioning mechanism 9-1 and 9-2 close to wafer feed mechanism side,
It, which can be played, seeks Bian Zuoyong, i.e. the platband position and being rotated of identification wafer is adjusted to designated position.Vision can be passed through by seeking side
Sensor combination PLC sensor is realized.It can ensure that wafer is put into the consistency in wafer disks by wafer positioning mechanism.Preferably
, wafer seeking border further includes a read module, can read the wafer sequence number of wafer pingbian side automatically.It can prevent as a result,
Because the character of sequence number and the too small wafer that can only inspect part by random samples of number read its sequence number and produced when only manually reading sequence number
Raw production risk.In the present embodiment, two wafers positioning mechanism 9-1 and 9-2 are set, forms binary channels and realizes two platelets of front and back
Round identification positioning.
Wafer assembly unit includes rotating mechanism (not shown), cap-opening mechanism 6, and wafer assembling mechanism 10 beats spiral shell automatically
Nailing machine structure 12-1 and 12-2.Rotating mechanism rotatable rotary table 1 makes the wafer disks on turntable accordingly turn to feeding station, assembling
Station beats screw station or discharge station.Assuming that No. 1 wafer disks are transported to the feeding station of turntable, rotating mechanism is by 1 turn of turntable
One angle, No. 1 wafer disks go to assembling station, and an empty supporting part can go to feeding station, continue in feeding station
Move in No. 2 wafer disks (No. 2 wafer disks are empty).Cap-opening mechanism 6 uncaps to No. 1 wafer disks at assembling station at the same time,
Wafer is successively placed by No. 1 wafer disks by wafer assembling mechanism 10 after the completion of uncapping, is opened after piling wafer in No. 1 wafer disks
Lid mechanism 6 again covers disk cover, and turntable 1 turns an angle again and extremely beats screw station.At this point, No. 1 wafer disks are beating screw station,
No. 2 wafer disks go to assembling station, another No. 3 empty wafer disks is in feeding station.When No. 1 wafer disks are to beat screw station complete
After playing screw automatically, rotating mechanism is rotated further by turntable 1 and No. 1 wafer disks is made to reach discharge station.Wherein cap-opening mechanism 6 can be with
It is a mechanical arm or robot, wafer assembling mechanism 10 is also possible to mechanical arm or robot.The present embodiment passes through in a work
Position progress wafer disks are uncapped and closing lid, can guarantee precision of the wafer in wafer disks.
Automatic bolt screwing machine structure 12-1 or 12-2 plays screw to the wafer disks for filling wafer beating screw station automatically.Automatically
Existing full-automatic screw machine, full-automatic screw fixing machine etc. can be used in screw driving mechanism, herein with no restrictions.It should be noted that
It is to beat screw holding time longest in entire assemble flow, therefore use two sets of automatic bolt screwing machine structures can in the present embodiment
It carries out playing screw operation simultaneously.Preferably, wafer automatic assembling apparatus further includes screw conveying mechanism 11, can be automatically by screw
It is transmitted to loader position and screw is automatically loaded in loader, screw absorption is transported to wafer disks by automatic bolt screwing machine structure
Screw is played above.Later, rotating mechanism rotation turntable 1 makes the wafer disks for accomplishing fluently screw turn to discharge station, under wafer disks
Wafer disks are carried to wafer disks blanking transfer mechanism 14, wafer disks fetching device 3 by material mechanism 13 from the discharge station of turntable
Wafer disks are carried to wafer disks mounting table 2 from wafer disks blanking transfer mechanism 14, this completes wafers in a wafer disks
Assembly.
As shown in figure 5, manual operation area A and clean operating area B can be divided into inside whole wafer automatic assembling apparatus,
Manual operation area A and clean operating area B are just separated.Region C where wafer assembly unit is to be located at clean operating area B
Interior and manual operation area A is much isolated, and thus feeding and wafer assembling will not cause to influence each other.
Fig. 6 show the wafer automatic assembly method of one embodiment of the invention comprising following steps:
Firstly, wafer disks are carried to turntable from wafer disks mounting table and wafer is carried to crystalline substance from wafer feed mechanism
Circle positioning mechanism.Wherein, wafer disks are first carried to wafer disk-positioning mechanism from wafer disks mounting table, by wafer disk-positioning mechanism
The position of wafer disks is identified and adjusted, wafer disks are carried to the feeding station of turntable from wafer disk-positioning mechanism later, thus
Complete the carrying of wafer disks.
Then, rotation turntable makes empty wafer disks turn to assembling station, disk cover is opened, after wafer is filled in wafer disks
It is closed disk cover；
Then, rotation turntable make the wafer disks for filling wafer turn to automatically beat screw station execute automatically beat screw grasp
Make；Preferably, beating screw station has 2 automatically；Wafer disks are turned into discharge station after playing screw；
Finally, wafer disks are carried back wafer disks mounting table from turntable comprising by wafer disks from the discharge station of turntable
It is carried to wafer disks blanking transfer mechanism；And wafer disks are carried to wafer disks mounting table from wafer disks blanking transfer mechanism.
In conclusion wafer automatic assembling apparatus of the invention makes wafer be placed into wafer disks and beat the entire mistake of screw
It is all full-automatic realization in journey, meanwhile, wafer disks feeding, positioning, wafer are put into wafer disks, beat spiral shell in entire assemble flow
Nail, wafer disks blanking are Parallel Implementation and guarantee to be overlapped in the time of each process, and whole process passes through automation stream
Pipeline mode realizes that one day yield can achieve 900 disks.For whole scrappage within 0.5%, production efficiency and qualification rate can
It is enough to be produced much higher than artificial, huge economic benefit can be brought for factory.
Although the present invention is disclosed as above with preferred embodiment, right many embodiments are illustrated only for the purposes of explanation
, it is not intended to limit the invention, those skilled in the art can make without departing from the spirit and scope of the present invention
Several changes and retouches, and the protection scope that the present invention is advocated should be subject to described in claims.
Claims (10)
1. a kind of wafer automatic assembling apparatus, which is characterized in that including wafer disks transmission unit, turntable, wafer transfer unit and
Wafer assembly unit, wherein
The turntable, with multiple supporting parts for accommodating wafer disks；
The wafer disks transmission unit, for carrying the wafer disks between wafer disks mounting table and the turntable；
The wafer transfer unit, for wafer to be carried to wafer positioning mechanism from wafer feed mechanism；
The wafer assembly unit, comprising:
Rotating mechanism makes the wafer disks on the turntable turn to feeding station, assembling station, beats spiral shell for rotating the turntable
Follow closely station or discharge station；
Cap-opening mechanism, for opening the disk cover of the empty wafer disks in the assembling station and filling wafer in wafer disks
After be closed its disk cover；
Wafer assembling mechanism, for the wafer on the wafer positioning mechanism to be packed into the empty wafer in the assembling station
In disk；
Automatic bolt screwing machine structure, for beating screw station described and playing screw automatically to the wafer disks for filling wafer.
2. according to right want 1 described in wafer automatic assembling apparatus, which is characterized in that the wafer disks transmission unit includes:
Wafer disks fetching device, for the wafer disks to be carried to wafer disk-positioning mechanism from the wafer disks mounting table, with
And wafer disks are carried to the wafer disks mounting table from wafer disks blanking transfer mechanism；
Wafer disks top rotary table mechanism, for the wafer disks to be carried to the feeding of the turntable from the wafer disk-positioning mechanism
Station；
Wafer disks cutting agency, for being carried to the wafer disks in the wafer disks blanking from the discharge station of the turntable
Rotation mechanism.
3. wafer automatic assembling apparatus according to claim 1, which is characterized in that the wafer transfer unit includes:
Wafer material fetching mechanism, for wafer to be carried to the wafer positioning mechanism from the wafer feed mechanism.
4. wafer automatic assembling apparatus according to claim 1, which is characterized in that further include screw conveying mechanism, be used for
Automatically screw is transmitted to loader position and screw is automatically loaded in the loader.
5. wafer automatic assembling apparatus according to claim 4, which is characterized in that the quantity of the automatic bolt screwing machine structure
It is 2, beats screw station described in two respectively two wafer disks of the turntable are executed and play screw automatically and operate.
6. wafer automatic assembling apparatus according to claim 1, which is characterized in that the quantity of the wafer feed mechanism is
2, the quantity of the wafer positioning mechanism is 2, and each wafer positioning mechanism for identification and adjusts the position of the wafer
And read the sequence number of the wafer.
7. wafer automatic assembling apparatus according to claim 5, which is characterized in that the wafer automatic assembling apparatus divides
For artificial operating space and clean operating area, the wafer assembly unit be located in the clean operating area and with it is described artificial
Operating space isolation.
8. a kind of wafer automatic assembly method using wafer automatic assembling apparatus as described in claim 1, which is characterized in that
Include:
The wafer disks are carried to the turntable and by the wafer from the wafer feeding from the wafer disks mounting table
Mechanism is carried to the wafer positioning mechanism；
Rotating the turntable makes the empty wafer disks turn to the assembling station, opens disk cover, the wafer is filled institute
The closure disk cover after stating in wafer disks；
Rotate the turntable make the wafer disks for filling wafer turn to automatically beat screw station execute automatically beat screw operate；
The wafer disks are carried into back the wafer disks mounting table from the turntable.
9. automatic assembly method according to claim 8, which is characterized in that
The step of wafer disks are carried to the turntable from the wafer disks mounting table include:
The wafer disks are carried to wafer disk-positioning mechanism from the wafer disks mounting table；And
The wafer disks are carried to the turntable from the wafer disk-positioning mechanism；
The step of wafer disks are carried back the wafer disks mounting table from the turntable include:
The wafer disks are carried to wafer disks blanking transfer mechanism from the discharge station of the turntable；And
The wafer disks are carried to the wafer disks mounting table from the wafer disks blanking transfer mechanism.
10. wafer automatic assembly method according to claim 8, which is characterized in that the screw station of beating is 2, point
Screw operation Zhi Hang not be played automatically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811599686.5A CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811599686.5A CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109590705A true CN109590705A (en) | 2019-04-09 |
| CN109590705B CN109590705B (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811599686.5A Active CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
Country Status (1)
| Country | Link |
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| CN (1) | CN109590705B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111618885A (en) * | 2020-07-29 | 2020-09-04 | 山东元旭光电股份有限公司 | Automatic wafer feeding device |
| CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
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| CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109590705B (en) | 2020-09-04 |
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