CN109590705A - A kind of wafer automatic assembling apparatus and automatic assembly method - Google Patents
A kind of wafer automatic assembling apparatus and automatic assembly method Download PDFInfo
- Publication number
- CN109590705A CN109590705A CN201811599686.5A CN201811599686A CN109590705A CN 109590705 A CN109590705 A CN 109590705A CN 201811599686 A CN201811599686 A CN 201811599686A CN 109590705 A CN109590705 A CN 109590705A
- Authority
- CN
- China
- Prior art keywords
- wafer
- disks
- turntable
- carried
- wafer disks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000010009 beating Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 255
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/001—Article feeders for assembling machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
- B23P19/06—Screw or nut setting or loosening machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811599686.5A CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811599686.5A CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109590705A true CN109590705A (en) | 2019-04-09 |
CN109590705B CN109590705B (en) | 2020-09-04 |
Family
ID=65962828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811599686.5A Active CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109590705B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111618885A (en) * | 2020-07-29 | 2020-09-04 | 山东元旭光电股份有限公司 | Automatic wafer feeding device |
CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148451A (en) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | Semiconductor wafer automatic exfoliation device |
JP2000061831A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Wafer supplying mechanism for polishing device |
CN101866869A (en) * | 2010-05-25 | 2010-10-20 | 中国电子科技集团公司第四十五研究所 | Wafer transmission set for special equipment of semiconductor |
CN106328556A (en) * | 2016-10-25 | 2017-01-11 | 深圳市昱燊科技有限公司 | Automatic tester for wafer |
CN106898573A (en) * | 2015-12-18 | 2017-06-27 | 有研半导体材料有限公司 | A kind of rotating disc type wafer auto plate separation loading machine |
CN108025875A (en) * | 2015-12-11 | 2018-05-11 | 上野精机株式会社 | Shifting apparatus |
CN108878126A (en) * | 2018-06-27 | 2018-11-23 | 东莞市冠美自动化科技有限公司 | A kind of chip inductor kludge |
-
2018
- 2018-12-26 CN CN201811599686.5A patent/CN109590705B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148451A (en) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | Semiconductor wafer automatic exfoliation device |
JP2000061831A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Wafer supplying mechanism for polishing device |
CN101866869A (en) * | 2010-05-25 | 2010-10-20 | 中国电子科技集团公司第四十五研究所 | Wafer transmission set for special equipment of semiconductor |
CN108025875A (en) * | 2015-12-11 | 2018-05-11 | 上野精机株式会社 | Shifting apparatus |
CN106898573A (en) * | 2015-12-18 | 2017-06-27 | 有研半导体材料有限公司 | A kind of rotating disc type wafer auto plate separation loading machine |
CN106328556A (en) * | 2016-10-25 | 2017-01-11 | 深圳市昱燊科技有限公司 | Automatic tester for wafer |
CN108878126A (en) * | 2018-06-27 | 2018-11-23 | 东莞市冠美自动化科技有限公司 | A kind of chip inductor kludge |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111618885A (en) * | 2020-07-29 | 2020-09-04 | 山东元旭光电股份有限公司 | Automatic wafer feeding device |
CN111618885B (en) * | 2020-07-29 | 2020-10-16 | 山东元旭光电股份有限公司 | Automatic wafer feeding device |
CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
Also Published As
Publication number | Publication date |
---|---|
CN109590705B (en) | 2020-09-04 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 200233 room 1101, building 2, No. 188, Yizhou Road, Xuhui District, Shanghai Applicant after: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. Address before: Room 305-308, Kaike International Building, Area A, 1801 Hongmei Road, Xuhui District, Shanghai, 2003 Applicant before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
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CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Forsyte Robot Co.,Ltd. Address before: Room 1101, building 2, 188 Yizhou Road, Xuhui District, Shanghai Patentee before: SHANGHAI FORESIGHT ROBOTICS Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 201712 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee after: Shanghai Fosaite Technology Co.,Ltd. Country or region after: China Address before: 201702 Building 2, No. 338, Jiuye Road, Qingpu District, Shanghai Patentee before: Shanghai Forsyte Robot Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address |