CN109590705B - Automatic wafer assembling device and automatic assembling method - Google Patents
Automatic wafer assembling device and automatic assembling method Download PDFInfo
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- CN109590705B CN109590705B CN201811599686.5A CN201811599686A CN109590705B CN 109590705 B CN109590705 B CN 109590705B CN 201811599686 A CN201811599686 A CN 201811599686A CN 109590705 B CN109590705 B CN 109590705B
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims abstract description 365
- 230000007246 mechanism Effects 0.000 claims abstract description 115
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000012797 qualification Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/001—Article feeders for assembling machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
- B23P19/06—Screw or nut setting or loosening machines
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an automatic wafer assembling device and an automatic wafer assembling method. The automatic wafer assembling device comprises a wafer disc transmission unit, a rotary disc, a wafer transmission unit and a wafer assembling unit. The wafer disc transmission unit is used for conveying the wafer disc between the wafer disc loading platform and the turntable; the wafer transmission unit is used for conveying the wafer from the wafer feeding mechanism to the wafer positioning mechanism; the wafer assembling unit includes: a rotating mechanism for rotating the turntable; the cover opening mechanism is used for opening and closing the wafer disc cover; the wafer assembling mechanism is used for loading the wafer into the wafer disc; and the automatic screwing mechanism is used for automatically screwing the wafer disc filled with the wafers. The invention can efficiently realize the automatic assembly of the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer manufacturing, in particular to an automatic wafer assembling device and an automatic wafer assembling method.
Background
The PSS standard production process of the wafer comprises the steps of gluing, exposing, developing, ADI inspection, etching, post-etching inspection, glue removal, cleaning, final inspection, packaging and the like. The wafer is placed in the aluminum plate for ADI inspection and then transferred to the next procedure for etching, the wafer after inspection is manually placed in the aluminum plate at present, and then the aluminum plate is manually locked by screws. Because the precision requirement of the wafer placing position is high, the wafer cannot be polluted, the qualification rate of manual operation is low, the rejection rate of the wafer is high, and the rejection rate is about 5%. In addition, even if the whole process is finished by skilled manual operation for about 60 discs in one day, the efficiency is very low. The level of workers is uneven, the mobility of workers is high, and the production is greatly influenced.
Therefore, it is desirable to provide an efficient and low-contamination wafer automatic assembling apparatus and an automatic assembling method.
Disclosure of Invention
The invention mainly aims to overcome the defects of the prior art and provide an automatic wafer assembling device and an automatic wafer assembling method which are efficient and low in pollution risk.
To achieve the above object, the present invention provides an automatic wafer assembling apparatus, comprising: the device comprises a wafer disc transmission unit, a rotary disc, a wafer transmission unit and a wafer assembling unit. Wherein the turntable is provided with a plurality of bearing parts for accommodating the wafer disks; the wafer disc transmission unit is used for conveying the wafer disc between the wafer disc loading platform and the turntable; the wafer transmission unit is used for conveying the wafer from the wafer feeding mechanism to the wafer positioning mechanism; the wafer assembling unit includes: the rotating mechanism is used for rotating the turntable to enable the wafer disc on the turntable to rotate to an assembling station, a screwing station or a blanking station; the cover opening mechanism is used for opening the empty tray cover of the wafer tray at the assembling station and closing the tray cover of the wafer tray after the wafer tray is filled with wafers; the wafer assembling mechanism is used for loading the wafer on the wafer positioning mechanism into the empty wafer disc at the assembling station; and the automatic screwing mechanism is used for automatically screwing the wafer disc filled with the wafers at the screwing station.
Preferably, the wafer tray transfer unit includes: the wafer disc taking and placing mechanism is used for conveying the wafer disc from the wafer disc loading platform to the wafer disc positioning mechanism and conveying the wafer disc from the wafer disc blanking transfer mechanism to the wafer disc loading platform; a wafer disk upper turntable mechanism for transporting the wafer disk from the wafer disk positioning mechanism to the turntable; and the wafer disc blanking mechanism is used for conveying the wafer disc from the blanking station of the turntable to the wafer disc blanking transfer mechanism.
Preferably, the wafer transmission unit comprises a wafer taking mechanism for conveying the wafer from the wafer loading mechanism to the wafer positioning mechanism.
Preferably, the automatic wafer assembling device further comprises a screw conveying mechanism for automatically conveying screws to the feeder position and automatically loading the screws into the feeder.
Preferably, the number of the automatic screwing mechanisms is 2, and automatic screwing operations are respectively executed on the two wafer disks of the turntable at the two screwing stations.
Preferably, the number of the wafer loading mechanisms is 2, the number of the wafer positioning mechanisms is 2, and each wafer positioning mechanism is used for identifying and adjusting the position of the wafer and reading the serial number of the wafer.
Preferably, the automatic wafer assembling device is divided into a manual operation area and a clean operation area, and the wafer assembling unit is located in the clean operation area and isolated from the manual operation area.
According to another aspect of the present invention, there is also provided an automatic wafer assembling method applied to the automatic wafer assembling apparatus, including the steps of:
carrying the wafer plate from the wafer plate loading table to the turntable;
conveying the wafer from the wafer loading mechanism to the wafer positioning mechanism;
rotating the turntable to enable the empty wafer disc to rotate to the assembling station, opening a disc cover, filling the wafer into the wafer disc, and then closing the disc cover;
rotating the turntable to enable the wafer disc filled with the wafers to rotate to an automatic screwing station to execute automatic screwing operation;
and conveying the wafer disc from the turntable back to the wafer disc loading platform.
Preferably, the step of transferring the wafer plate from the wafer plate stage to the turntable includes: conveying the wafer disc from the wafer disc loading table to a wafer disc positioning mechanism; and carrying the wafer disk from the wafer disk positioning mechanism to the turntable. The step of transporting the wafer plate from the turntable back to the wafer plate stage comprises: carrying the wafer disc from the blanking station of the turntable to a wafer disc blanking transfer mechanism; and conveying the wafer disc from the wafer disc blanking transfer mechanism to the wafer disc loading platform.
Preferably, the number of the screwing stations is 2, and automatic screwing operation is respectively executed.
Compared with the prior art, the automatic wafer assembling device disclosed by the invention has the advantages that the whole processes of placing the wafer into the wafer disc and screwing are realized in a full automation manner, meanwhile, in the whole assembling process, the wafer disc is fed and positioned, the wafer is placed into the wafer disc and the screwing is carried out, the wafer disc is fed and the blanking is realized in parallel, and the time of each process is ensured not to be overlapped, so that the production efficiency and the qualification rate are far higher than those of manual production, and great economic benefits can be brought to factories.
Drawings
FIG. 1 is a schematic view of a wafer;
FIG. 2 is a schematic view of a wafer tray according to an embodiment of the invention;
FIG. 3 is a schematic view of a cover of a wafer tray according to an embodiment of the invention;
FIG. 4 is a schematic view of a body of a wafer platter according to an embodiment of the present invention;
FIG. 5 is a schematic view of an automatic wafer assembling apparatus according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating an automatic wafer assembling method according to an embodiment of the invention.
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited to the specific embodiments disclosed below.
The automatic wafer assembling apparatus and the automatic wafer assembling method according to the present invention will be described in detail with reference to fig. 1 to 6. The automatic wafer assembling device comprises a wafer disc transmission unit, a turntable 1, a wafer transmission unit and a wafer assembling unit. The whole automatic assembly process comprises the steps of conveying a wafer disc to the turntable, loading the wafer into the wafer disc on the turntable, executing automatic screwing operation and blanking the wafer disc. The wafer disc transmission unit is used for conveying the wafer disc between the wafer disc loading platform and the turntable; the wafer transmission unit is used for conveying the wafer from the wafer loading mechanism to the wafer positioning mechanism; the wafer assembling device is used for automatically assembling wafers into wafer disks on the turntable 1.
Referring to fig. 1-4, a wafer and a wafer disk according to the present invention are shown. The wafer W has a flat side, and the flat side is usually engraved with serial numbers of the wafer. A wafer plate is a container that holds a plurality of wafers, typically 5 or 7 wafers. In this embodiment, the automatic wafer assembling apparatus is applied to the flow process from the ADI inspection to the etching process in the PSS process, and thus the wafer disc is an aluminum disc. The wafer tray comprises a tray cover and a tray body part, wherein a wafer accommodating part is arranged in the tray body, and the wafer is provided with a flat edge, and the tray body accommodating part is correspondingly provided with a flat edge so as to be matched with the shape of the wafer.
Referring to fig. 5, the turntable 1 has a plurality of carrying portions for holding the wafer disks, the carrying portions are annularly distributed around the center of the turntable 1, the number of the carrying portions in this embodiment is 6, that is, 6 wafer disks can be placed on the turntable at most. The turntable 1 can be provided with a plurality of stations, including a feeding station, an assembling station, a screwing station or a blanking station. The loading station is a station for placing a wafer disc into the turntable, the assembling station is a station for assembling the wafer, the screwing station is a station for automatically screwing screws, and the unloading station is a station for taking the wafer disc away from the turntable.
The wafer disc transmission unit comprises a wafer disc picking and placing mechanism 3, a wafer disc upper rotating disc mechanism 5 and a wafer disc blanking mechanism 13. The disk pick-and-place mechanism 3 is a robot arm or a robot, and is capable of transferring a disk from the disk mounting table 2 to the disk positioning mechanism 4 and transferring a disk from the disk unloading relay mechanism 14 to the disk mounting table 2. Here, the wafer table positioning mechanism 4 can recognize the position of the wafer table and adjust it to a specified position. Specifically, a notch may be formed on the wafer plate to serve as an origin of the wafer plate, and the wafer plate positioning mechanism 4 uses the vision sensor and the PLC sensor to identify the origin of the wafer plate and adjust the position of the wafer plate accordingly. The consistency of putting the wafer disks into the turntable can be ensured by the wafer disk positioning mechanism 4. The wafer disc on-turntable mechanism 5 may be a robot arm or a robot for transporting the wafer disc from the wafer disc positioning mechanism 4 to the loading station of the turntable 1. The wafer disk unloading mechanism 13 may be a robot arm or a robot for transferring the wafer disk from the unloading station of the turntable 1 to the wafer disk unloading relay mechanism 14.
The wafer transfer unit includes a wafer picking mechanism 7 which carries the wafer from the wafer loading mechanism to the wafer positioning mechanism. Because the wafer is loaded for a long time, the two wafer loading mechanisms 8-1 and 8-2 are adopted in the embodiment to alternately supply materials, so that the wafer is loaded without stopping the machine. The wafer positioning mechanisms 9-1 and 9-2 are close to one side of the wafer feeding mechanism and can play a role in edge searching, namely identifying the flat edge position of the wafer and adjusting the flat edge position to a specified position in a rotating mode. Edge finding can be realized by combining a vision sensor with a PLC sensor. The wafer positioning mechanism can ensure the consistency of the wafer placed in the wafer disc. Preferably, the wafer edge finder further comprises a reading module for automatically reading the serial number of the wafer at the flat side of the wafer. Therefore, the production risk caused by that only partial wafers can be sampled and inspected to read the serial numbers because the characters and the numbers of the serial numbers are too small when the serial numbers are read manually can be prevented. In the embodiment, two wafer positioning mechanisms 9-1 and 9-2 are arranged to form a double channel to realize the identification and positioning of the front wafer and the rear wafer.
The wafer assembling unit includes a rotating mechanism (not shown), a cover opening mechanism 6, a wafer assembling mechanism 10, and automatic screw opening mechanisms 12-1 and 12-2. The rotating mechanism can rotate the turntable 1, so that the wafer disc on the turntable correspondingly rotates to a feeding station, an assembling station, a screwing station or a discharging station. Assuming that the No. 1 wafer disk is conveyed to the loading station of the turntable, the rotating mechanism rotates the turntable 1 by an angle, the No. 1 wafer disk is conveyed to the assembly station, and an empty bearing part is conveyed to the loading station, and the No. 2 wafer disk is continuously conveyed into the loading station (the No. 2 wafer disk is empty). Meanwhile, the cover opening mechanism 6 opens the cover of the No. 1 wafer disc at the assembling station, the wafer disc is sequentially placed on the No. 1 wafer disc by the wafer assembling mechanism 10 after the cover opening is finished, the cover opening mechanism 6 covers the disc cover after the No. 1 wafer disc is filled with wafers, and the rotary disc 1 rotates by an angle to the screw opening station. At the moment, the No. 1 wafer disc is in a screw beating station, the No. 2 wafer disc is transferred to an assembling station, and the other empty No. 3 wafer disc is in a feeding station. After the No. 1 wafer disc completes automatic screw driving at the screw driving station, the rotating mechanism rotates the turntable 1 again to enable the No. 1 wafer disc to reach the blanking station. The uncapping mechanism 6 may be a robot arm or a robot, and the wafer assembling mechanism 10 may also be a robot arm or a robot. According to the embodiment, the wafer disc is opened and closed at one station, so that the precision of the wafer in the wafer disc can be guaranteed.
The automatic screwing mechanism 12-1 or 12-2 automatically screws the wafer disc filled with the wafers at the screwing station. The automatic screwing mechanism can adopt the existing full-automatic screw machine, the full-automatic screw machine and the like, and is not limited herein. It should be noted that the screwing takes the longest time in the whole assembly process, so that the screwing operation can be performed simultaneously by using two sets of automatic screwing mechanisms in the embodiment. Preferably, the automatic wafer assembling device further comprises a screw conveying mechanism 11, which can automatically convey the screws to the feeder position and automatically load the screws into the feeder, and the automatic screwing mechanism sucks and conveys the screws to the upper surface of the wafer disc for screwing. Then, the rotating mechanism rotates the turntable 1 to enable the wafer disc with the screws to rotate to a blanking station, the wafer disc blanking mechanism 13 conveys the wafer disc from the blanking station of the turntable to the wafer disc blanking transfer mechanism 14, and the wafer disc picking and placing mechanism 3 conveys the wafer disc from the wafer disc blanking transfer mechanism 14 to the wafer disc loading platform 2, so that the assembly of the wafers in one wafer disc is completed.
As shown in fig. 5, the inside of the entire automatic wafer assembling apparatus may be divided into a manual operation area a and a clean operation area B, which are just separated. The area C where the wafer assembling unit is located in the clean operation area B and is far away from the manual operation area A, and therefore feeding and wafer assembling cannot be influenced mutually.
Fig. 6 shows an automatic wafer assembling method according to an embodiment of the present invention, which includes the following steps:
first, the wafer disk is transferred from the wafer disk mounting table to the turntable, and the wafer is transferred from the wafer loading mechanism to the wafer positioning mechanism. The wafer disc is conveyed from the wafer disc loading table to the wafer disc positioning mechanism, the wafer disc positioning mechanism identifies and adjusts the position of the wafer disc, and then the wafer disc is conveyed from the wafer disc positioning mechanism to the feeding station of the turntable, so that the wafer disc is conveyed.
Then, rotating the turntable to enable the empty wafer disc to rotate to an assembly station, opening the disc cover, filling the wafer into the wafer disc, and then closing the disc cover;
then, rotating the turntable to enable the wafer tray filled with the wafers to rotate to an automatic screwing station to execute automatic screwing operation; preferably, the number of the automatic screwing stations is 2; rotating the wafer disc to a blanking station after screwing;
finally, the wafer disc is conveyed from the turntable back to the wafer disc loading table, and the wafer disc loading table comprises a wafer disc conveying mechanism which conveys the wafer disc from a blanking station of the turntable to a wafer disc blanking transfer mechanism; and transferring the wafer disk from the wafer disk blanking transfer mechanism to the wafer disk loading table.
In conclusion, the automatic wafer assembling device provided by the invention enables the whole processes of placing the wafer into the wafer disc and screwing to be realized in a full-automatic mode, meanwhile, in the whole assembling process, the wafer disc is fed, positioned, placed into the wafer disc and screwed, the wafer disc is fed in parallel, the time of each process is not overlapped, and the whole process realizes that the yield per day can reach 900 discs in an automatic assembly line mode. The whole rejection rate is within 0.5%, the production efficiency and the qualification rate can be far higher than those of manual production, and huge economic benefits can be brought to factories.
Although the present invention has been described with reference to preferred embodiments, it is to be understood that the foregoing is illustrative and not restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An automatic wafer assembling device is characterized by comprising a wafer disc transmission unit, a turntable, a wafer transmission unit and a wafer assembling unit, wherein,
the turntable is provided with a plurality of bearing parts for containing the wafer disks;
the wafer disc transmission unit is used for conveying the wafer disc between the wafer disc loading platform and the turntable;
the wafer transmission unit is used for conveying the wafer from the wafer feeding mechanism to the wafer positioning mechanism;
the wafer assembling unit includes:
the rotating mechanism is used for rotating the turntable to enable the wafer disc on the turntable to rotate to a feeding station, an assembling station, a screwing station or a blanking station;
the cover opening mechanism is used for opening the empty tray cover of the wafer tray at the assembling station and closing the tray cover of the wafer tray after the wafer tray is filled with wafers;
the wafer assembling mechanism is used for loading the wafer on the wafer positioning mechanism into the empty wafer disc at the assembling station;
and the automatic screwing mechanism is used for automatically screwing the wafer disc filled with the wafers at the screwing station.
2. The wafer automatic assembly apparatus of claim 1, wherein the wafer disk transfer unit comprises:
the wafer disc taking and placing mechanism is used for conveying the wafer disc from the wafer disc loading platform to the wafer disc positioning mechanism and conveying the wafer disc from the wafer disc blanking transfer mechanism to the wafer disc loading platform;
the wafer disc upper rotating disc mechanism is used for conveying the wafer disc from the wafer disc positioning mechanism to a feeding station of the rotating disc;
and the wafer disc blanking mechanism is used for conveying the wafer disc from the blanking station of the turntable to the wafer disc blanking transfer mechanism.
3. The wafer automatic assembly apparatus of claim 1, wherein the wafer transfer unit comprises:
and the wafer taking mechanism is used for conveying the wafer from the wafer feeding mechanism to the wafer positioning mechanism.
4. The automated wafer assembly apparatus of claim 1, further comprising a screw feed mechanism for automatically delivering screws to a feeder location and automatically loading screws into the feeder.
5. The automatic wafer assembling device according to claim 4, wherein the number of the automatic screwing mechanisms is 2, and automatic screwing operations are simultaneously performed on two wafer disks of the turntable at two screwing stations respectively.
6. The automatic wafer assembling device of claim 1, wherein the number of the wafer loading mechanisms is 2, the number of the wafer positioning mechanisms is 2, and each wafer positioning mechanism is used for identifying and adjusting the position of the wafer and reading the serial number of the wafer.
7. The automatic wafer assembling device according to claim 5, wherein the automatic wafer assembling device is divided into a manual operation area and a clean operation area, and the wafer assembling unit is located in the clean operation area and isolated from the manual operation area.
8. An automatic wafer assembling method using the automatic wafer assembling apparatus according to claim 1, comprising:
conveying the wafer disc from the wafer disc loading table to the turntable and conveying the wafer from the wafer loading mechanism to the wafer positioning mechanism;
rotating the turntable to enable the empty wafer disc to rotate to the assembling station, opening a disc cover, filling the wafer into the wafer disc, and then closing the disc cover;
rotating the turntable to enable the wafer disc filled with the wafers to rotate to an automatic screwing station to execute automatic screwing operation;
and conveying the wafer disc from the turntable back to the wafer disc loading platform.
9. The automated assembly method of claim 8,
the step of transferring the wafer plate from the wafer plate stage to the turntable includes:
conveying the wafer disc from the wafer disc loading table to a wafer disc positioning mechanism; and
transporting the wafer disk from the wafer disk positioning mechanism to the turntable;
the step of transporting the wafer plate from the turntable back to the wafer plate stage comprises:
carrying the wafer disc from the blanking station of the turntable to a wafer disc blanking transfer mechanism; and
and conveying the wafer disc to the wafer disc loading platform from the wafer disc blanking transfer mechanism.
10. The automatic wafer assembling method of claim 8, wherein the number of the screw-driving stations is 2, and automatic screw-driving operation is performed simultaneously.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811599686.5A CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811599686.5A CN109590705B (en) | 2018-12-26 | 2018-12-26 | Automatic wafer assembling device and automatic assembling method |
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| CN109590705A CN109590705A (en) | 2019-04-09 |
| CN109590705B true CN109590705B (en) | 2020-09-04 |
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| CN111618885B (en) * | 2020-07-29 | 2020-10-16 | 山东元旭光电股份有限公司 | Automatic wafer feeding device |
| CN112008595A (en) * | 2020-09-02 | 2020-12-01 | 珠海市中芯集成电路有限公司 | Wafer grinding device and grinding method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148451A (en) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | Semiconductor wafer automatic exfoliation device |
| JP2000061831A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Wafer supplying mechanism for polishing device |
| CN101866869A (en) * | 2010-05-25 | 2010-10-20 | 中国电子科技集团公司第四十五研究所 | Wafer transmission set for special equipment of semiconductor |
| CN106328556A (en) * | 2016-10-25 | 2017-01-11 | 深圳市昱燊科技有限公司 | Automatic tester for wafer |
| CN106898573A (en) * | 2015-12-18 | 2017-06-27 | 有研半导体材料有限公司 | A kind of rotating disc type wafer auto plate separation loading machine |
| CN108025875A (en) * | 2015-12-11 | 2018-05-11 | 上野精机株式会社 | Shifting apparatus |
| CN108878126A (en) * | 2018-06-27 | 2018-11-23 | 东莞市冠美自动化科技有限公司 | A kind of chip inductor kludge |
-
2018
- 2018-12-26 CN CN201811599686.5A patent/CN109590705B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148451A (en) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | Semiconductor wafer automatic exfoliation device |
| JP2000061831A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Wafer supplying mechanism for polishing device |
| CN101866869A (en) * | 2010-05-25 | 2010-10-20 | 中国电子科技集团公司第四十五研究所 | Wafer transmission set for special equipment of semiconductor |
| CN108025875A (en) * | 2015-12-11 | 2018-05-11 | 上野精机株式会社 | Shifting apparatus |
| CN106898573A (en) * | 2015-12-18 | 2017-06-27 | 有研半导体材料有限公司 | A kind of rotating disc type wafer auto plate separation loading machine |
| CN106328556A (en) * | 2016-10-25 | 2017-01-11 | 深圳市昱燊科技有限公司 | Automatic tester for wafer |
| CN108878126A (en) * | 2018-06-27 | 2018-11-23 | 东莞市冠美自动化科技有限公司 | A kind of chip inductor kludge |
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