TWI819815B - Processing device and manufacturing method of processed product - Google Patents

Processing device and manufacturing method of processed product Download PDF

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TWI819815B
TWI819815B TW111136393A TW111136393A TWI819815B TW I819815 B TWI819815 B TW I819815B TW 111136393 A TW111136393 A TW 111136393A TW 111136393 A TW111136393 A TW 111136393A TW I819815 B TWI819815 B TW I819815B
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holding
plate
holding plate
processing
processed
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TW202316505A (en
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深井元樹
今井一郎
大西将馬
山本裕子
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日商Ｔｏｗａ股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

The present invention provides a processing device that automatically replaces a holding plate for holding an object to be processed, holds a sealed substrate on a work table, and processes the sealed substrate using a processing mechanism while moving the work table. The processing device includes a plate accommodating part for accommodating a holding plate for holding a sealed substrate, a holding base part to which the holding plate is detachably attached and which holds the sealed substrate using the holding plate, and a plate transport mechanism for transporting the holding plate between the plate accommodating part and the holding base part. The plate transport mechanism transports the holding plate removed from the holding base part to the plate accommodating part, and transports the holding plate in the plate accommodating part to the holding base part.

Description

加工裝置以及加工品的製造方法Processing device and method of manufacturing processed product

本發明是有關於一種加工裝置以及加工品的製造方法。The present invention relates to a processing device and a method for manufacturing processed products.

先前，如專利文獻1所示，於將被切斷物切斷而製造經單片化的多個製品的切斷裝置中，想到以能夠對切斷用工作台裝卸吸附夾具的方式構成。 [現有技術文獻] [專利文獻] Previously, as shown in Patent Document 1, in a cutting device that cuts an object to be cut and manufactures a plurality of individual products, it has been considered to be configured so that an adsorption jig can be attached and detached to a cutting table. [Prior art documents] [Patent Document]

[專利文獻1]日本專利特開2016-040060號公報[Patent Document 1] Japanese Patent Application Publication No. 2016-040060

然而，所述切斷裝置中，僅對切斷用工作台將吸附夾具設為能夠裝卸，於實際更換吸附夾具時需要作業者進行作業。因此，有不僅耗費作業者的人力費，而且安裝狀態出現不均一的問題。另外，更換作業耗費時間，切斷裝置的生產性降低。However, in the cutting device described above, the suction jig is detachable only to the cutting table, and an operator is required to actually replace the suction jig. Therefore, there is a problem that not only the labor cost of the operator is consumed, but also the installation state becomes uneven. In addition, the replacement operation takes time, and the productivity of the cutting device decreases.

[發明所欲解決之課題][Problem to be solved by the invention]

因此，本發明是為了解決所述問題點而成，其主要課題在於，自動更換用以保持加工對象物的保持用板。 [解決課題之手段] Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to automatically replace the holding plate for holding the object to be processed. [Means to solve the problem]

即，本發明的加工裝置為將加工對象物保持於加工用工作台上並使該加工用工作台移動的同時，藉由加工機構對所述加工對象物進行加工的加工裝置，其特徵在於包括：板收容部，收容用以保持所述加工對象物的保持用板；保持基部，以能夠裝卸的方式安裝有所述保持用板，使用所述保持用板來保持所述加工對象物；以及板搬送機構，於所述板收容部與所述保持基部之間搬送所述保持用板，所述板搬送機構將自所述保持基部卸除的所述保持用板搬送至所述板收容部，並將位於所述板收容部的所述保持用板搬送至所述保持基部。 [發明的效果] That is, the processing device of the present invention is a processing device that processes the object to be processed by a processing mechanism while holding the object to be processed on a processing table and moving the table for processing, and is characterized by including: : a plate storage portion that accommodates a holding plate for holding the object to be processed; a holding base portion to which the holding plate is detachably mounted, and the holding plate is used to hold the object to be processed; and A plate conveying mechanism conveys the holding plate between the plate accommodating part and the holding base part, and the plate conveying mechanism conveys the holding plate removed from the holding base part to the plate accommodating part , and transport the holding plate located in the plate receiving part to the holding base. [Effects of the invention]

根據如此構成的本發明，可自動更換用以保持加工對象物的保持用板。According to the invention thus configured, the holding plate for holding the object to be processed can be automatically replaced.

繼而，對本發明舉例加以更詳細說明。然而，本發明不受以下說明的限定。Next, examples of the present invention will be described in more detail. However, the present invention is not limited by the following description.

如上文所述，本發明的加工裝置為將加工對象物保持於加工用工作台上並使該加工用工作台移動的同時藉由加工機構對所述加工對象物進行加工的加工裝置，其特徵在於包括：板收容部，收容用以保持所述加工對象物的保持用板；保持基部，以能夠裝卸的方式安裝有所述保持用板，使用所述保持用板來保持所述加工對象物；以及板搬送機構，於所述板收容部與所述保持基部之間搬送所述保持用板，所述板搬送機構將自所述保持基部卸除的所述保持用板搬送至所述板收容部，並將位於所述板收容部的所述保持用板搬送至所述保持基部。 若為所述加工裝置，則具有將自保持基部卸除的保持用板搬送至板收容部並將位於板收容部的保持用板搬送至保持基部的板搬送機構，故而可對保持基部自動更換保持用板。其結果為，可削減用以更換保持用板的人力費。另外，因自動更換保持用板，故而可減少保持用板對保持基部的安裝狀態的不均一。進而，因自動更換保持用板，故而可縮短保持用板的更換時間，可提高加工裝置的生產性。 As described above, the processing device of the present invention is a processing device that processes the object to be processed by a processing mechanism while holding the object to be processed on the processing table and moving the table for processing. It is characterized by The invention includes: a plate storage portion that accommodates a holding plate for holding the object to be processed; and a holding base portion to which the holding plate is detachably mounted, and the holding plate is used to hold the object to be processed. ; and a plate conveying mechanism that conveys the holding plate between the plate accommodating portion and the holding base, and the plate conveying mechanism conveys the holding plate removed from the holding base to the plate accommodating part, and transport the holding plate located in the plate accommodating part to the holding base part. If the processing device is the above-mentioned processing device, it has a plate conveying mechanism that conveys the holding plate removed from the holding base to the plate accommodating portion and conveys the holding plate located in the plate accommodating portion to the holding base. Therefore, the holding base can be automatically replaced. Keep using the board. As a result, the labor cost for replacing the holding plate can be reduced. In addition, since the holding plate is automatically replaced, unevenness in the attachment state of the holding plate to the holding base can be reduced. Furthermore, since the holding plate is automatically replaced, the replacement time of the holding plate can be shortened, and the productivity of the processing device can be improved.

所述板搬送機構理想為使所述保持用板上升並進行搬送。 若為所述結構，則於搬送保持用板時，可避免保持用板與其他構件的干擾，容易地搬送保持用板。 It is preferable that the said plate conveyance mechanism raises and conveys the said holding plate. According to the above structure, when the holding plate is transported, interference between the holding plate and other members can be avoided, and the holding plate can be easily transported.

所述板搬送機構理想為搬送下述保持用板中的至少一個：所述加工用工作台的保持用板；用以將所述加工後的所述加工對象物加以乾燥的、乾燥用工作台的保持用板、用以對所述加工後的所述加工對象物進行檢查的、檢查用工作台的保持用板；於收容前載置所述加工後的所述加工對象物的、移載工作台的保持用板；或為了搬送所述加工後的所述加工對象物而進行保持的、搬送用保持機構的保持用板。 若為所述結構，則可自動更換加工用工作台、檢查用工作台、移載工作台及搬送用保持機構各自的保持用板。 The plate transport mechanism preferably transports at least one of the following holding plates: a holding plate for the processing table; and a drying table for drying the processed object. a holding plate, a holding plate of an inspection workbench for inspecting the processed object; and a transfer plate for placing and transferring the processed object before storage A holding plate of a workbench; or a holding plate of a conveying holding mechanism for holding the processed object after the processing. According to the above-mentioned structure, the holding plates of each of the processing table, the inspection table, the transfer table, and the transport holding mechanism can be automatically replaced.

本發明的加工裝置更包括：加工對象物搬送機構，搬送所述加工對象物。 於所述結構中，為了可自動更換保持用板並且使裝置結構簡化且削減裝置成本，所述板搬送機構理想為使用所述加工對象物搬送機構而構成。即，板搬送機構成為具有下述功能的結構，即：搬送加工後的加工對象物。 The processing device of the present invention further includes a processing object transport mechanism for transporting the processing object. In the above-mentioned structure, in order to enable automatic replacement of the holding plate, simplify the device structure, and reduce device costs, the plate transport mechanism is preferably configured using the object transport mechanism. That is, the plate conveying mechanism is configured to have a function of conveying the processed object.

作為用以簡化裝置結構的具體實施方式，本發明的加工裝置理想的是更包括：第一保持機構，為了將所述加工對象物搬送至所述加工用工作台而對所述加工對象物進行保持；第二保持機構，為了自所述加工用工作台搬送所述加工後的所述加工對象物而對所述加工後的所述加工對象物進行保持；以及搬送用移動機構，使所述第一保持機構及所述第二保持機構移動。 於所述結構中，為了可自動更換保持用板並且使裝置結構簡化且削減裝置成本，所述板搬送機構理想為使用所述第二保持機構及所述搬送用移動機構而構成。 As a specific embodiment for simplifying the structure of the apparatus, the processing apparatus of the present invention preferably further includes a first holding mechanism that holds the object to be processed in order to transport the object to the processing table. Holding; a second holding mechanism that holds the processed object to be processed in order to transport the processed object from the processing table; and a transport moving mechanism that moves the The first holding mechanism and the second holding mechanism move. In the above structure, in order to automatically replace the holding plate and simplify the device structure and reduce the device cost, the plate transport mechanism is preferably configured using the second holding mechanism and the transport moving mechanism.

另外，可考慮本發明的加工裝置更包括：移載工作台，於收容前載置所述加工後的所述加工對象物；以及移載用移動機構，使所述移載工作台移動。 於所述結構中，為了可自動更換保持用板並且使裝置結構簡化且削減裝置成本，所述板搬送機構理想為使用所述移載工作台及所述移載用移動機構而構成。 In addition, it is conceivable that the processing device of the present invention further includes: a transfer table for placing the processed object before accommodation; and a transfer moving mechanism for moving the transfer table. In the above structure, in order to automatically replace the holding plate and simplify the device structure and reduce the device cost, the plate transfer mechanism is preferably configured using the transfer table and the transfer moving mechanism.

於使用移載工作台及移載用移動機構來構成板搬送機構的情況下，所述板搬送機構理想為更具有：於所述板收容部與所述移載工作台之間搬送所述保持用板的板取出/放入機構。When a plate transfer mechanism is configured using a transfer table and a transfer moving mechanism, the plate transfer mechanism preferably further includes: transferring the holding unit between the plate accommodating portion and the transfer table. Use a plate-for-plate takeout/put-in mechanism.

本發明的加工裝置可採用下述結構，即：可將加工後的所述加工對象物收容於托盤（亦稱為「托盤收容」）。所述加工裝置更包括：托盤搬送機構，搬送將經所述加工機構進行了單片化的所述加工對象物分類的托盤，且所述加工裝置將經所述單片化的所述加工對象物收容於所述托盤。 於本發明中，於如此進行托盤收容的加工裝置中，可自動更換用以保持加工對象物的保持用板。 The processing device of the present invention may have a structure in which the processed object can be stored in a pallet (also referred to as "tray storage"). The processing device further includes a pallet transport mechanism that transports a pallet for sorting the processing objects that have been singulated by the processing mechanism, and the processing device separates the processing objects that have been singulated into pieces. The items are stored in the tray. In the present invention, in the processing device that accommodates the pallets in this way, the holding plate for holding the object to be processed can be automatically replaced.

另外，本發明的加工裝置可採用下述結構，即：可將經單片化的加工對象物貼附於具有黏著面的貼附構件並進行收容（亦稱為「連環收容」）。所述加工裝置更包括：用以載置貼附構件的載置工作台，所述貼附構件具有用以貼附經所述加工機構進行了單片化的所述加工對象物的黏著面，且所述加工裝置將經所述單片化的所述加工對象物貼附於所述貼附構件並進行收容。 於本發明中，於如此進行連環收容的加工裝置中，可自動更換用以保持加工對象物的保持用板。 In addition, the processing apparatus of the present invention may adopt a structure in which individualized processing objects can be attached and stored on an attachment member having an adhesive surface (also called "serial storage"). The processing device further includes: a placement table for placing an attachment member having an adhesive surface for attaching the object to be processed that has been singulated by the processing mechanism, And the processing device attaches the individualized processing object to the attachment member and stores it therein. In the present invention, in the processing device that performs chain storage in this way, the holding plate for holding the object to be processed can be automatically replaced.

進而，本發明的加工裝置可採用下述結構，即：可將經單片化的加工對象物收容於筒狀容器（亦稱為「管收容」）。再者，筒狀容器有時被稱為管（tube）、盒棒（magazine stick）、棒盒（stick magazine）、棒（stick）等。所述加工裝置更包括：用以設置筒狀容器的容器設置部，所述筒狀容器自一端開口部收容經所述加工機構進行了單片化的所述加工對象物，且所述加工裝置將經所述單片化的所述加工對象物收容於所述筒狀容器。 於本發明中，於如此進行管收容的加工裝置中，可自動更換用以保持加工對象物的保持用板。 Furthermore, the processing apparatus of the present invention can adopt a structure that can store the individualized processing objects in a cylindrical container (also called "tube storage"). Furthermore, the cylindrical container is sometimes called a tube, a magazine stick, a stick magazine, a stick, etc. The processing device further includes: a container setting portion for setting a cylindrical container, the cylindrical container accommodates the processing object that has been singulated by the processing mechanism from an opening at one end, and the processing device The individualized object to be processed is stored in the cylindrical container. In the present invention, in the processing device that accommodates the tubes in this manner, the holding plate for holding the object to be processed can be automatically replaced.

此外，本發明的加工裝置可採用下述結構，即：可將經單片化的加工對象物以零散的狀態收容（亦稱為「塊收容」）。所述加工裝置更包括供經所述加工機構進行了單片化的所述加工對象物掉落而收容的收容箱，將經所述單片化的所述加工對象物收容於所述收容箱。 於如此進行塊收容的加工裝置中，可自動更換用以保持加工對象物的保持用板。 In addition, the processing apparatus of the present invention may adopt a structure that can store the individualized processing objects in a scattered state (also called "block storage"). The processing device further includes a storage box for dropping and storing the processing object that has been singulated by the processing mechanism, and the processing object that has been singulated into pieces is stored in the storage box. . In the processing device that accommodates the blocks in this way, the holding plate for holding the object to be processed can be automatically replaced.

為了自動檢查是否準確進行了保持用板的固定，本發明的加工裝置理想為更包括：檢查機構，檢查所述保持用板對所述保持基部的安裝狀態。In order to automatically check whether the holding plate is accurately fixed, the processing device of the present invention preferably further includes an inspection mechanism that checks the attachment state of the holding plate to the holding base.

作為檢查機構的具體實施方式，理想為所述檢查機構具有：檢查用流路，於搭載有所述保持用板的搭載面開口；以及探測感測器，設置於所述檢查用流路，探測流體自所述開口的洩漏。此處，探測感測器藉由測定流體的壓力或流量從而探測流體自所述開口的洩漏。As a specific embodiment of the inspection mechanism, it is desirable that the inspection mechanism has: an inspection flow path opening on a mounting surface on which the holding plate is mounted; and a detection sensor provided in the inspection flow path to detect Leakage of fluid from said opening. Here, the detection sensor detects fluid leakage from the opening by measuring the pressure or flow rate of the fluid.

為了使保持用板相對於保持基部的固定結構簡單，理想為所述保持基部具有：固定用圓筒部，插入至形成於所述保持用板的固定用插入孔，所述固定用圓筒部具有：圓筒本體，插入至所述固定用插入孔；可動件，以能夠移動至自所述圓筒本體的外側周面突出的位置及沒入的位置的方式設置；以及彈性體，以使所述可動件成為相對於所述圓筒本體突出的位置的方式賦予力，於所述固定用圓筒部插入至所述固定用插入孔的狀態下，所述可動件成為突出的位置，藉此對所述保持基部固定所述保持用板。In order to simplify the fixing structure of the holding plate to the holding base, it is desirable that the holding base has a fixing cylindrical portion inserted into a fixing insertion hole formed in the holding plate, and the fixing cylindrical portion is inserted into a fixing insertion hole formed in the holding plate. It has: a cylindrical body inserted into the fixing insertion hole; a movable member disposed so as to be movable to a position protruding from the outer peripheral surface of the cylindrical body and a position recessed; and an elastic body. The movable element is energized in such a manner that it assumes a protruding position relative to the cylindrical body. When the fixing cylindrical portion is inserted into the fixing insertion hole, the movable element assumes a protruding position. This pair of holding bases fixes the holding plate.

另外，為了使保持用板對板搬送機構的裝卸結構簡單，理想為所述板搬送機構具有：搬送用圓筒部，插入至形成於所述保持用板的搬送用保持孔，所述搬送用圓筒部具有：圓筒本體，插入至所述搬送用保持孔；可動件，以能夠移動至自所述圓筒本體的外側周面突出的位置及沒入的位置的方式設置；以及彈性體，以使所述可動件成為相對於所述圓筒本體突出的位置的方式賦予力，於所述搬送用圓筒部插入至搬送用插入孔的狀態下，所述可動件成為突出的位置，藉此將所述保持用板保持於所述板搬送機構。In addition, in order to simplify the attachment and detachment structure of the holding plate-to-plate conveying mechanism, it is desirable that the plate conveying mechanism has a conveying cylindrical portion inserted into a conveying holding hole formed in the holding plate. The cylindrical part has: a cylindrical body inserted into the holding hole for transportation; a movable member provided so as to be movable to a position protruding from the outer peripheral surface of the cylindrical body and a position recessed; and an elastic body. , the force is applied so that the movable element assumes a protruding position relative to the cylindrical body, and the movable element assumes a protruding position in a state where the conveyance cylindrical portion is inserted into the conveyance insertion hole, Thereby, the holding plate is held by the plate conveying mechanism.

另外，使用所述加工裝置來製造加工品的、加工品的製造方法亦為本發明的一形態。In addition, a method for manufacturing a processed product using the processing apparatus is also an aspect of the present invention.

＜本發明的各實施方式＞ 以下，參照圖式對本發明的加工裝置的各實施方式加以說明。再者，關於以下所示的任一圖，均為了容易理解而適當省略或誇張地示意性地描畫。對相同的構成構件標註相同符號，適當省略說明。 <Each embodiment of the present invention> Hereinafter, various embodiments of the processing device of the present invention will be described with reference to the drawings. In addition, any of the figures shown below are appropriately omitted or schematically drawn in an exaggerated manner for easy understanding. The same components are labeled with the same symbols and descriptions are omitted as appropriate.

＜加工裝置的總體結構＞ 本實施方式的加工裝置100為切斷裝置，藉由將作為加工對象物的密封完畢基板W切斷，從而單片化為多個作為加工品的製品P。 ＜Overall structure of processing equipment＞ The processing device 100 of this embodiment is a cutting device that cuts the sealed substrate W as the processing object into individual pieces into a plurality of products P as the processed product.

此處，所謂密封完畢基板W，是針對連接有半導體晶片、電阻元件、電容元件等電子元件的基板，以至少將電子元件加以樹脂密封的方式進行樹脂成形而成。作為構成密封完畢基板W的基板，可使用引線框架（lead frame）、印刷配線板，除了該些以外，亦可使用半導體製基板（包含矽晶圓等半導體晶圓）、金屬製基板、陶瓷製基板、玻璃製基板、樹脂製基板等。另外，對於構成密封完畢基板W的基板，可實施有配線亦可未實施配線。Here, the sealed substrate W is a substrate to which electronic components such as semiconductor wafers, resistive elements, and capacitive elements are connected, and is formed by resin molding to seal at least the electronic components with resin. As the substrate constituting the sealed substrate W, a lead frame and a printed wiring board can be used. In addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can also be used. Substrates, glass substrates, resin substrates, etc. In addition, the substrate constituting the sealed substrate W may or may not have wiring implemented.

另外，本實施方式的密封完畢基板W及製品P中，其中一個面成為後封裝的封裝面。本實施方式的說明中，將後封裝的其中一個面記載為「封裝面」，將其相反側的面記載為「標記面」。In addition, one of the surfaces of the sealed substrate W and the product P of this embodiment becomes the packaging surface of the post-packaging. In the description of this embodiment, one surface of the rear package is described as the "sealing surface" and the surface on the opposite side is described as the "marking surface".

具體而言，如圖1所示，切斷裝置100包括：兩個切斷用工作台（加工用工作台）2A、2B，保持密封完畢基板W；第一保持機構3，為了將密封完畢基板W搬送至切斷用工作台2A、切斷用工作台2B而保持密封完畢基板W；切斷機構（加工機構）4，將保持於切斷用工作台2A、切斷用工作台2B的密封完畢基板W切斷；移載工作台5，移動多個製品P；第二保持機構6，為了將多個製品P自切斷用工作台2A、切斷用工作台2B搬送至移載工作台5而保持多個製品P；以及搬送用移動機構7，使第一保持機構3及第二保持機構6移動。再者，由第一保持機構3及搬送用移動機構7構成搬送密封完畢基板W的搬送機構（裝載機），由第二保持機構6及搬送用移動機構7構成搬送多個製品P的搬送機構（卸載機）。Specifically, as shown in FIG. 1 , the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W; and a first holding mechanism 3 that holds the sealed substrate. W is transported to the cutting tables 2A and 2B to hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 seals the substrate W held on the cutting tables 2A and 2B. The cutting of the substrate W is completed; the transfer table 5 moves the plurality of products P; the second holding mechanism 6 transfers the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table. 5 to hold a plurality of products P; and a transport moving mechanism 7 to move the first holding mechanism 3 and the second holding mechanism 6 . Furthermore, the first holding mechanism 3 and the conveying moving mechanism 7 constitute a conveying mechanism (loader) for conveying the sealed substrate W, and the second holding mechanism 6 and the conveying moving mechanism 7 constitute a conveying mechanism for conveying the plurality of products P. (Unloader).

以下的說明中，將沿著切斷用工作台2A、切斷用工作台2B的上表面的平面（水平面）內相互正交的方向分別設為X方向及Y方向，將與X方向及Y方向正交的鉛垂方向設為Z方向。具體而言，將圖1的左右方向設為X方向，將上下方向設為Y方向。In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively referred to as the X direction and the Y direction. The vertical direction orthogonal to the direction is set as the Z direction. Specifically, let the left-right direction in FIG. 1 be the X direction, and let the up-down direction be the Y direction.

兩個切斷用工作台2A、2B吸附保持密封完畢基板W，並以至少能夠於Y方向上移動的方式設置。切斷用工作台2A藉由切斷用移動機構8A能夠於Y方向上移動，並且藉由旋轉機構9A能夠於θ方向上轉動。切斷用工作台2B藉由切斷用移動機構8B能夠於Y方向上移動，並且藉由旋轉機構9B能夠於θ方向上轉動。The two cutting tables 2A and 2B adsorb and hold the sealed substrate W, and are installed so as to be movable in at least the Y direction. The cutting table 2A is movable in the Y direction by the cutting moving mechanism 8A, and is rotatable in the θ direction by the rotating mechanism 9A. The cutting table 2B is movable in the Y direction by the cutting moving mechanism 8B, and is rotatable in the θ direction by the rotating mechanism 9B.

如圖1所示，第一保持機構3為了將密封完畢基板W自基板供給機構10搬送至切斷用工作台2A、切斷用工作台2B而保持密封完畢基板W。所述第一保持機構3具有用以吸附保持密封完畢基板W的多個吸附部（未圖示）。而且，第一保持機構3藉由後述的搬送用移動機構7等移動至所期望的位置，藉此將密封完畢基板W自基板供給機構10搬送至切斷用工作台2A、切斷用工作台2B。As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 10 to the cutting tables 2A and 2B. The first holding mechanism 3 has a plurality of adsorption portions (not shown) for adsorbing and holding the sealed substrate W. Then, the first holding mechanism 3 is moved to a desired position by the conveyance moving mechanism 7 described below, etc., thereby conveying the sealed substrate W from the substrate supply mechanism 10 to the cutting table 2A and the cutting table. 2B.

如圖1所示，基板供給機構10具有：基板收容部10a，自外部收容多個密封完畢基板W；以及基板供給部10b，使收容於該基板收容部10a中的密封完畢基板W移動至由第一保持機構3吸附保持的保持位置RP。As shown in FIG. 1 , the substrate supply mechanism 10 has a substrate storage portion 10 a that accommodates a plurality of sealed substrates W from the outside; and a substrate supply portion 10 b that moves the sealed substrates W accommodated in the substrate storage portion 10 a to a position from the outside. The first holding mechanism 3 absorbs and holds the holding position RP.

如圖1所示，切斷機構4具有包含刀片41A、刀片41B及兩個心軸部42A、42B的兩個旋轉工具40。兩個心軸部42A、42B以該些的旋轉軸沿著X方向的方式設置，安裝於該些心軸部的刀片41A、刀片41B以彼此相向的方式配置（參照圖1）。另外，兩個心軸部42A、42B構成為藉由心軸移動機構11能夠於X方向及Z方向上彼此獨立地移動。進而，於切斷機構4設置對位用的攝像相機12、攝像相機27，藉由該些攝像相機12、27進行切斷前的密封完畢基板W的對位、以及縱橫任一個方向被切斷後的密封完畢基板W藉由旋轉機構9B旋轉後的對位。As shown in FIG. 1 , the cutting mechanism 4 has two rotating tools 40 including a blade 41A, a blade 41B, and two spindle portions 42A and 42B. The two spindle parts 42A and 42B are provided with their rotation axes along the X direction, and the blades 41A and 41B attached to the spindle parts are arranged to face each other (see FIG. 1 ). In addition, the two spindle parts 42A and 42B are configured to be movable independently of each other in the X direction and the Z direction by the spindle moving mechanism 11 . Furthermore, the cutting mechanism 4 is provided with positioning cameras 12 and 27, and these cameras 12 and 27 perform positioning of the sealed substrate W before cutting and after cutting in either the vertical or horizontal direction. The sealed substrate W is positioned after being rotated by the rotating mechanism 9B.

而且，利用切斷用工作台2A進行的切斷是藉由使該切斷用工作台2A與兩個心軸部42A、42B相對地移動來切斷密封完畢基板W而進行單片化。另外，利用切斷用工作台2B進行的切斷是藉由使該切斷用工作台2B與兩個心軸部42A、42B相對地移動來切斷密封完畢基板W而進行單片化。心軸部42A的刀片41A及心軸部42B的刀片41B藉由在包含Y方向以及Z方向的面內旋轉來切斷保持於各工作台2A、2B上的密封完畢基板W。再者，利用切斷用工作台2A進行的切斷處理與利用切斷用工作台2B進行的切斷處理可交替地進行。Furthermore, the cutting performed by the cutting table 2A is performed by relatively moving the cutting table 2A and the two spindle portions 42A and 42B to cut the sealed substrate W into individual pieces. In addition, the cutting performed by the cutting table 2B is performed by relatively moving the cutting table 2B and the two spindle portions 42A and 42B to cut the sealed substrate W into individual pieces. The blade 41A of the spindle part 42A and the blade 41B of the spindle part 42B cut the sealed substrate W held on each of the tables 2A and 2B by rotating in the plane including the Y direction and the Z direction. Furthermore, the cutting process using the cutting table 2A and the cutting process using the cutting table 2B can be performed alternately.

另外，於心軸移動機構11設置有第一清潔機構13，所述第一清潔機構13對保持於切斷用工作台2A、切斷用工作台2B的多個製品P的上表面側（封裝面）進行清潔。所述第一清潔機構13設置於心軸移動機構11中對心軸部42A、心軸部42B進行支持的於X方向上延伸的支持體11a上。另外，第一清潔機構13對保持於切斷用工作台2A、切斷用工作台2B的多個製品P的上表面噴射洗淨液及/或壓縮空氣，來清潔製品P的上表面側（封裝面）。再者，第一清潔機構13亦可使用刷子。In addition, the spindle moving mechanism 11 is provided with a first cleaning mechanism 13 that cleans the upper surfaces (packagings) of the plurality of products P held on the cutting tables 2A and 2B. surface) for cleaning. The first cleaning mechanism 13 is provided on the support body 11 a extending in the X direction in the spindle moving mechanism 11 and supporting the spindle portions 42A and 42B. In addition, the first cleaning mechanism 13 injects cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B to clean the upper surfaces of the products P ( package surface). Furthermore, the first cleaning mechanism 13 may also use a brush.

如圖1所示，本實施方式的移載工作台5為移動經後述的檢查部14進行了檢查的多個製品P的工作台。所述移載工作台5被稱為所謂的分度工作台，於將多個製品P分類並收容至各種托盤21之前，暫時載置多個製品P。進而，移載工作台5以能夠沿著Y方向前後移動的方式設置。而且，移載工作台5藉由移載用移動機構15，於藉由第二保持機構6載置多個製品P的移載位置X1與藉由分類機構20搬送多個製品P的取出位置X2之間移動。再者，移載用移動機構15具有：導軌15a，沿Y方向對移載工作台進行導引；以及驅動部（未圖示），使移載工作台於該導軌15a上移動。As shown in FIG. 1 , the transfer table 5 of this embodiment is a table that moves a plurality of products P inspected by an inspection unit 14 to be described later. The transfer table 5 is called a so-called indexing table and temporarily places a plurality of products P before sorting and storing the products P on various pallets 21 . Furthermore, the transfer table 5 is provided so that it can move forward and backward along the Y direction. Furthermore, the transfer table 5 uses the transfer moving mechanism 15 to reach a transfer position X1 where a plurality of products P are placed by the second holding mechanism 6 and a take-out position X2 where a plurality of products P are transported by the sorting mechanism 20 move between. Furthermore, the transfer moving mechanism 15 has a guide rail 15a that guides the transfer table in the Y direction, and a drive part (not shown) that moves the transfer table on the guide rail 15a.

載置於移載工作台5的多個製品P根據由檢查部14所得的檢查結果（良品、不良品等）而由分類機構20分類至各種托盤21。各種托盤21由托盤移動機構22自托盤收容部23搬送至所期望的取出位置X2，載置由分類機構20所分類的製品P。經分類後，各種托盤21由托盤移動機構22收容於托盤收容部23。於本實施方式中，以於托盤收容部23收容例如收容製品P之前的托盤21、收容有良好製品P的托盤21、及收容有需要返工（rework）的不良製品P的托盤21等三種托盤的方式構成。再者，托盤移動機構22具有：載置托盤21的托盤載置部22a；導軌22b，沿著Y方向對該托盤載置部22a進行導引；移動機構（未圖示），使各種托盤21於X方向上移動；移動機構（未圖示），設置於各種托盤21的每一個上、且使各種托盤21於Z方向上移動；以及驅動部（未圖示），驅動該些構件而使托盤載置部22a移動。The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 14 . The various pallets 21 are conveyed from the pallet accommodating part 23 to the desired take-out position X2 by the pallet moving mechanism 22, and the products P classified by the sorting mechanism 20 are placed thereon. After being sorted, the various pallets 21 are accommodated in the pallet accommodating part 23 by the pallet moving mechanism 22 . In this embodiment, three types of pallets are accommodated in the pallet accommodating part 23, for example, the pallet 21 before accommodating the product P, the pallet 21 accommodating the good product P, and the pallet 21 accommodating the defective product P that needs to be reworked. way of composition. Furthermore, the pallet moving mechanism 22 has a pallet placing part 22a on which the pallet 21 is placed; a guide rail 22b that guides the pallet placing part 22a in the Y direction; and a moving mechanism (not shown) that moves various pallets 21 move in the The tray placing part 22a moves.

此處，如圖1所示，檢查部14設置於切斷用工作台2A、切斷用工作台2B與移載工作台5之間，檢查保持於第二保持機構6的多個製品P。本實施方式的檢查部14具有檢查製品P的標記面的第一檢查部141、及檢查製品P的封裝面的第二檢查部142。第一檢查部141為具有用以檢查標記面的光學系統的攝像相機，第二檢查部142為具有用以檢查封裝面的光學系統的攝像相機。再者，亦可使第一檢查部141與第二檢查部142共用。Here, as shown in FIG. 1 , the inspection unit 14 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection unit 14 of this embodiment includes a first inspection unit 141 that inspects the marking surface of the product P, and a second inspection unit 142 that inspects the packaging surface of the product P. The first inspection unit 141 is a camera having an optical system for inspecting the mark surface, and the second inspection unit 142 is a camera having an optical system for inspecting the package surface. Furthermore, the first inspection part 141 and the second inspection part 142 may be shared.

另外，為了藉由檢查部14能夠檢查多個製品P的兩面，設置有使多個製品P反轉的反轉機構16（參照圖1）。所述反轉機構16具有保持多個製品P的保持工作台161、以及使該保持工作台161以成為表背相反的方式反轉的馬達等反轉部162。進而，反轉機構16藉由使反轉機構16於X方向上移動的反轉用移動機構17能夠移動至移載工作台5。再者，反轉用移動機構17具有：導軌17a，沿著X方向對反轉機構16進行導引；以及驅動部（未圖示），使反轉機構16於該導軌17a上移動。In addition, in order to enable the inspection unit 14 to inspect both sides of the plurality of products P, an inversion mechanism 16 for inverting the plurality of products P is provided (see FIG. 1 ). The reversing mechanism 16 includes a holding table 161 that holds a plurality of products P, and a reversing portion 162 such as a motor that reverses the holding table 161 so that the front and back are reversed. Furthermore, the reversal mechanism 16 can be moved to the transfer table 5 by the reversal moving mechanism 17 that moves the reversal mechanism 16 in the X direction. Furthermore, the reversing moving mechanism 17 has a guide rail 17a that guides the reversing mechanism 16 in the X direction, and a driving part (not shown) that moves the reversing mechanism 16 on the guide rail 17a.

於第二保持機構6自切斷用工作台2A、切斷用工作台2B保持多個製品P時，製品P的標記面朝向下側。於所述狀態下，於自切斷用工作台2A、切斷用工作台2B向反轉機構16搬送多個製品P的中途，藉由第一檢查部141來檢查製品P的標記面。其後，保持於第二保持機構6的多個製品P由反轉機構16反轉，其後反轉機構16藉由反轉用移動機構17移動至移載工作台5的位置。於所述移動的期間中，藉由第二檢查部142來檢查朝向下側的製品P的封裝面。其後，將製品P移交至移載工作台5。When the second holding mechanism 6 holds a plurality of products P from the cutting tables 2A and 2B, the marked surfaces of the products P face downward. In this state, while the plurality of products P are being transported from the cutting tables 2A and 2B to the reversing mechanism 16 , the marked surfaces of the products P are inspected by the first inspection unit 141 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 16, and then the reversing mechanism 16 is moved to the position of the transfer table 5 by the reversing moving mechanism 17. During the movement, the sealing surface of the product P facing downward is inspected by the second inspection unit 142 . Thereafter, the product P is transferred to the transfer table 5 .

如圖1所示，第二保持機構6為了將多個製品P自切斷用工作台2A、切斷用工作台2B搬送至反轉機構16而保持多個製品P。所述第二保持機構6具有用以吸附保持多個製品P的多個吸附部（未圖示）。而且，藉由第二保持機構6由後述的搬送用移動機構7等移動至所期望的位置，從而將多個製品P自切斷用工作台2A、切斷用工作台2B搬送至保持工作台161。As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the reversing mechanism 16 . The second holding mechanism 6 has a plurality of adsorption portions (not shown) for adsorbing and holding a plurality of products P. Furthermore, the plurality of products P are transported from the cutting table 2A and the cutting table 2B to the holding table by moving the second holding mechanism 6 to a desired position by the conveying moving mechanism 7 described below. 161.

如圖1所示，搬送用移動機構7使第一保持機構3至少於基板供給機構10與切斷用工作台2A、切斷用工作台2B之間移動，並且使第二保持機構6至少於切斷用工作台2A、切斷用工作台2B與保持工作台161之間移動。As shown in FIG. 1 , the transport moving mechanism 7 moves the first holding mechanism 3 to a distance between the substrate supply mechanism 10 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 to a distance of The cutting table 2A, the cutting table 2B, and the holding table 161 move among each other.

而且，如圖1所示，搬送用移動機構7具有：共用的傳遞軸71，沿著兩個切斷用工作台2A、2B及移載工作台5的排列方向（X方向）一直線地延伸，用以使第一保持機構3及第二保持機構6移動。所述傳遞軸71設置於下述範圍，即：第一保持機構3可移動至基板供給機構10的基板供給部10b的上方，並且第二保持機構6可移動至保持工作台161的上方（參照圖1）。再者，傳遞軸71可針對第一保持機構3及第二保持機構6各自而分別設置。Furthermore, as shown in FIG. 1 , the transport moving mechanism 7 has a common transmission shaft 71 extending linearly along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5 . It is used to move the first holding mechanism 3 and the second holding mechanism 6 . The transmission shaft 71 is provided in a range in which the first holding mechanism 3 can move above the substrate supply part 10b of the substrate supply mechanism 10 and the second holding mechanism 6 can move above the holding table 161 (see Figure 1). Furthermore, the transmission shaft 71 may be provided separately for each of the first holding mechanism 3 and the second holding mechanism 6 .

進而，搬送用移動機構7構成為能夠使第一保持機構3及第二保持機構6相對於傳遞軸71分別於X方向及Z方向上移動。各方向上的移動機構例如可使用齒條與小齒輪機構，亦可使用滾珠螺桿機構，亦可使用氣缸，亦可使用直線馬達。Furthermore, the transport moving mechanism 7 is configured to move the first holding mechanism 3 and the second holding mechanism 6 in the X direction and the Z direction respectively with respect to the transmission shaft 71 . For example, the moving mechanism in each direction can use a rack and pinion mechanism, a ball screw mechanism, a cylinder, or a linear motor.

此外，如圖1所示，本發明的切斷裝置100更包括：第二清潔機構18，對保持於第二保持機構6的多個製品P的下表面側（標記面）進行清潔。所述第二清潔機構18設置於切斷用工作台2B與檢查部14之間，藉由向保持於第二保持機構6的多個製品P的下表面噴射洗淨液及/或壓縮空氣，從而清潔製品P的下表面側（標記面）。即，於第二保持機構6沿著傳遞軸71移動的中途，第二清潔機構18對製品P的下表面側（標記面）進行清潔。再者，第二清潔機構18亦可使用刷子。In addition, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 18 for cleaning the lower surface side (marking surface) of the plurality of products P held by the second holding mechanism 6 . The second cleaning mechanism 18 is provided between the cutting table 2B and the inspection part 14, and sprays cleaning liquid and/or compressed air to the lower surfaces of the plurality of products P held by the second holding mechanism 6, Thereby, the lower surface side (marking surface) of the product P is cleaned. That is, while the second holding mechanism 6 is moving along the transmission shaft 71 , the second cleaning mechanism 18 cleans the lower surface side (marking surface) of the product P. Furthermore, the second cleaning mechanism 18 may also use a brush.

＜切斷裝置100的動作的一例＞ 繼而，對切斷裝置100的動作的一例加以說明。圖2中，表示切斷裝置100的動作中的第一保持機構3的移動路徑、及第二保持機構6的移動路徑。再者，於本實施方式中，切斷裝置100的動作、例如密封完畢基板W的搬送、密封完畢基板W的切斷、製品P的檢查、後述的保持用板M1的更換等所有動作或控制是由控制部CTL（參照圖1）進行。 <Example of operation of cutting device 100> Next, an example of the operation of the cutting device 100 will be described. FIG. 2 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 during the operation of the cutting device 100. In addition, in this embodiment, all operations or controls of the cutting device 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, and replacement of the holding plate M1 described below, are included. This is performed by the control unit CTL (see Figure 1).

基板供給機構10的基板供給部10b使收容於基板收容部10a的密封完畢基板W向由第一保持機構3保持的保持位置RP移動。The substrate supply part 10 b of the substrate supply mechanism 10 moves the sealed substrate W accommodated in the substrate accommodating part 10 a to the holding position RP held by the first holding mechanism 3 .

繼而，搬送用移動機構7使第一保持機構3移動至保持位置RP，第一保持機構3吸附保持密封完畢基板W。其後，搬送用移動機構7使保持有密封完畢基板W的第一保持機構3移動至切斷用工作台2A、切斷用工作台2B，第一保持機構3解除吸附保持，將密封完畢基板W載置於切斷用工作台2A、切斷用工作台2B。而且，切斷用工作台2A、切斷用工作台2B吸附保持密封完畢基板W。Then, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transport moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and moves the sealed substrate W to the cutting table 2A and the cutting table 2B. W is placed on the cutting table 2A and the cutting table 2B. Furthermore, the cutting table 2A and the cutting table 2B adsorb and hold the sealed substrate W.

於所述狀態下，切斷用移動機構8A、切斷用移動機構8B使切斷用工作台2A、切斷用工作台2B移動至規定的切斷位置（傳遞軸71的內裏側）。於所述切斷位置，藉由切斷用移動機構8A、切斷用移動機構8B及心軸移動機構11使切斷用工作台2A、切斷用工作台2B及兩個心軸部42A、42B於X方向及Y方向上相對移動，並且藉由旋轉機構9A、旋轉機構9B使切斷用工作台2A、切斷用工作台2B旋轉，藉此將密封完畢基板W切斷成格子狀而單片化。In this state, the cutting moving mechanisms 8A and 8B move the cutting tables 2A and 2B to the predetermined cutting position (inner side of the transmission shaft 71 ). At the cutting position, the cutting table 2A, the cutting table 2B and the two spindle parts 42A, are moved by the cutting moving mechanism 8A, the cutting moving mechanism 8B and the mandrel moving mechanism 11. 42B moves relatively in the X direction and the Y direction, and rotates the cutting table 2A and the cutting table 2B by the rotating mechanism 9A and the rotating mechanism 9B, thereby cutting the sealed substrate W into a grid shape. Monolithic.

於切斷後藉由第一清潔機構13對保持於切斷用工作台2A、切斷用工作台2B的多個製品P的上表面側（封裝面）進行清潔。於所述清潔後，切斷用移動機構8A、切斷用移動機構8B使切斷用工作台2A、切斷用工作台2B移動至規定的搬送位置（傳遞軸71的近前側）。After cutting, the upper surface side (sealing surface) of the plurality of products P held on the cutting tables 2A and 2B is cleaned by the first cleaning mechanism 13 . After the above-mentioned cleaning, the cutting moving mechanisms 8A and 8B move the cutting tables 2A and 2B to the predetermined transport position (the front side of the transmission shaft 71 ).

繼而，搬送用移動機構7使第二保持機構6移動至切斷後的切斷用工作台2A、切斷用工作台2B，第二保持機構6吸附保持多個製品P。其後，搬送用移動機構7使保持有多個製品P的第二保持機構6移動至第二清潔機構18。藉此，第二清潔機構18對保持於第二保持機構6的多個製品P的下表面側（標記面）進行清潔。Then, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 adsorbs and holds the plurality of products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 18 . Thereby, the second cleaning mechanism 18 cleans the lower surface side (marking surface) of the plurality of products P held by the second holding mechanism 6 .

於清潔後，保持於第二保持機構6的多個製品P由檢查部141進行下表面側（標記面）的檢查，其後移交至反轉機構16，由反轉機構16吸附保持標記面後加以反轉。反轉後，反轉機構16藉由反轉用移動機構17移動，由檢查部142檢查製品P的封裝面。如此進行兩面檢查後，製品P自反轉機構16移交至移載工作台5。載置有製品P的移載工作台5藉由移載用移動機構15移動至取出位置。然後，載置於移載工作台5的多個製品P根據由檢查部14所得的檢查結果（良品、不良品等）而由分類機構20分類至各種托盤21。After cleaning, the plurality of products P held in the second holding mechanism 6 are inspected on the lower surface side (marked surface) by the inspection part 141, and then transferred to the reversing mechanism 16, and the reversing mechanism 16 adsorbs and holds the marked surface. be reversed. After the reversal, the reversal mechanism 16 is moved by the reversal moving mechanism 17, and the sealing surface of the product P is inspected by the inspection unit 142. After the double-sided inspection is performed in this way, the product P is transferred from the reversing mechanism 16 to the transfer table 5 . The transfer table 5 on which the product P is placed is moved to the take-out position by the transfer moving mechanism 15 . Then, the plurality of products P placed on the transfer table 5 are classified into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 14 .

＜保持用板M1的自動更換功能＞ 進而，本實施方式的切斷裝置100具有下述功能，即：自動更換用以保持密封完畢基板W或製品P的保持用板M1。 <Automatic replacement function of holding plate M1> Furthermore, the cutting device 100 of this embodiment has a function of automatically replacing the holding plate M1 for holding the sealed substrate W or the product P.

於本實施方式中，如圖3所示，用以切斷密封完畢基板W的切斷用工作台2A、切斷用工作台2B、用以檢查製品P的檢查用工作台（保持工作台161）、於分類前（收容前）載置製品P的移載工作台5、及為了搬送製品P而保持的搬送用保持機構（第二保持機構6）具有：能夠更換的保持用板M1；以及保持基部M2，以能夠裝卸的方式安裝有保持用板M1，使用保持用板M1來保持密封完畢基板W或製品P。再者，圖3中，代表性的表示切斷用工作台2A、切斷用工作台2B的保持用板M1及保持基部M2，但保持工作台161、移載工作台5及第二保持機構6亦同樣為具有保持用板M1及保持基部M2的結構。In this embodiment, as shown in FIG. 3 , there are a cutting table 2A and a cutting table 2B for cutting the sealed substrate W, and an inspection table (holding table 161 ) for inspecting the product P. ), the transfer table 5 on which the product P is placed before sorting (before storage), and the transport holding mechanism (second holding mechanism 6) that holds the product P for transporting the product P include: a replaceable holding plate M1; and The holding plate M1 is detachably attached to the holding base M2, and the sealed substrate W or the product P is held using the holding plate M1. In addition, in FIG. 3 , the holding plate M1 and the holding base M2 of the cutting table 2A and the cutting table 2B are representatively shown, but the holding table 161 , the transfer table 5 and the second holding mechanism 6 also has a structure having a holding plate M1 and a holding base M2.

具體而言，如圖1及圖4所示，切斷裝置100包括：板收容部24，收容保持用板M1；以及板搬送機構25，於板收容部24與保持基部M2之間搬送保持用板M1。Specifically, as shown in FIGS. 1 and 4 , the cutting device 100 includes a plate accommodating part 24 that accommodates the holding plate M1 , and a plate conveying mechanism 25 that conveys the holding plate M1 between the plate accommodating part 24 and the holding base M2 . Board M1.

保持用板M1形成有用以吸附密封完畢基板W或製品P的、未圖示的吸附部（吸附孔），藉由安裝於保持基部M2，從而經由設置於該保持基部M2的吸附流路M21來吸附密封完畢基板W或製品P（參照圖3）。另外，關於保持用板M1，切斷用工作台2A及切斷用工作台2B所用的保持用板M1、保持工作台161所用的保持用板M1、移載工作台5所用的保持用板M1、及第二保持機構6所用的保持用板M1的形狀或吸附部的結構等不同。再者，關於保持用板M1，亦可使切斷用工作台2A及切斷用工作台2B所用的保持用板M1、保持工作台161所用的保持用板M1、移載工作台5所用的保持用板M1、及第二保持機構6所用的保持用板M1的形狀或吸附部的結構等共通而相同。進而，各種保持用板M1視密封完畢基板W或製品P而形狀或吸附部的結構等各不相同，是對照密封完畢基板W或製品P而選擇。The holding plate M1 is formed with an adsorption portion (adsorption hole) not shown in the figure for adsorbing the sealed substrate W or the product P. By being attached to the holding base M2, the holding plate M1 passes through the adsorption flow path M21 provided in the holding base M2. The substrate W or product P is adsorbed and sealed (see Figure 3). In addition, regarding the holding plate M1, the holding plate M1 is used for the cutting table 2A and the cutting table 2B, the holding plate M1 is used for the holding table 161, and the holding plate M1 is used for the transfer table 5. , and the shape of the holding plate M1 used in the second holding mechanism 6 or the structure of the adsorption portion are different. Furthermore, as for the holding plate M1, the holding plate M1 used for the cutting table 2A and the cutting table 2B, the holding plate M1 used for the holding table 161, and the holding plate M1 used for the transfer table 5 may also be used. The holding plate M1 and the holding plate M1 used in the second holding mechanism 6 have the same shape, the structure of the adsorption portion, and the like. Furthermore, the various holding plates M1 differ in shape or structure of the adsorption portion depending on the sealed substrate W or the product P, and are selected based on the sealed substrate W or the product P.

另外，如圖3所示，切斷裝置100設置有固定機構26，所述固定機構26用於以能夠對保持基部M2裝卸保持用板M1的方式構成。具體而言，固定機構26具有：固定用插入孔261，形成於保持用板M1；以及固定用圓筒部262，設置於保持基部M2，插入至形成於保持用板M1的固定用插入孔261。In addition, as shown in FIG. 3 , the cutting device 100 is provided with a fixing mechanism 26 configured to allow attachment and detachment of the holding plate M1 to the holding base M2. Specifically, the fixing mechanism 26 has: a fixing insertion hole 261 formed in the holding plate M1; and a fixing cylindrical portion 262 provided in the holding base M2 and inserted into the fixing insertion hole 261 formed in the holding plate M1. .

固定用圓筒部262被稱為所謂夾筒（chuck cylinder），如圖5所示，具有：圓筒本體262a，插入至固定用插入孔261；球狀的可動件262b，以能夠移動至自圓筒本體262a的外側周面突出的位置及沒入的位置的方式設置；以及彈性體262c，以使該可動件262b成為相對於圓筒本體262a突出的位置的方式賦予力，所述固定用圓筒部262以藉由供給壓縮空氣從而可動件262b於突出位置（圖5的（a））與沒入位置（圖5的（b））之間切換的方式構成。The fixing cylindrical part 262 is called a so-called chuck cylinder. As shown in FIG. 5 , it has a cylindrical body 262 a inserted into the fixing insertion hole 261 and a spherical movable member 262 b capable of moving to its own position. The outer peripheral surface of the cylindrical body 262a is provided in a protruding position and a recessed position; and an elastic body 262c is provided to impart force to the movable member 262b in a protruding position relative to the cylindrical body 262a. The cylindrical portion 262 is configured such that the movable element 262b is switched between a protruding position (Fig. 5(a)) and a recessed position (Fig. 5(b)) by supplying compressed air.

進而，固定用圓筒部262具有活塞部262d。所述活塞部262d於圓筒本體262a的內部，介於可動件262b與彈性體262c之間，藉由壓縮空氣而於圓筒本體262a的內部移動，藉此將可動件262b於突出位置與沒入位置之間切換。若開始供給壓縮空氣，則所述活塞部262d抵抗自彈性體262c承受的力而於圓筒本體262a的內部移動，使可動件262b移動至沒入位置（圖5的（b）），若供給壓縮空氣，則藉由自彈性體262c承受的力而於圓筒本體262a的內部移動，使可動件262b移動至突出位置（圖5的（a））。Furthermore, the fixing cylindrical part 262 has a piston part 262d. The piston part 262d is located inside the cylindrical body 262a, between the movable member 262b and the elastic body 262c, and moves inside the cylindrical body 262a by compressed air, thereby moving the movable member 262b between the protruding position and the recessed position. switch between positions. When the supply of compressed air starts, the piston portion 262d moves inside the cylindrical body 262a against the force received from the elastic body 262c, causing the movable element 262b to move to the submerged position ((b) in Fig. 5). The compressed air moves inside the cylindrical body 262a due to the force received from the elastic body 262c, causing the movable member 262b to move to the protruding position ((a) in FIG. 5).

另外，如圖5所示，形成於保持用板M1的固定用插入孔261具有：凸部261a，於插入有固定用圓筒部262的狀態下，可動件262b成為突出位置時，將該可動件262b卡住，使固定用圓筒部262不脫落。所述凸部261a將位於突出位置的可動件262b卡住，且不將位於沒入位置的可動件262b卡住。因此，藉由在固定用圓筒部262插入至固定用插入孔261的狀態下，將可動件262b設為突出位置，從而對保持基部M2固定保持用板M1（參照圖5的（a））。另一方面，藉由在固定用圓筒部262插入至固定用插入孔261的狀態下，將可動件262b設為沒入位置，從而解除保持用板M1對保持基部M2的固定（參照圖5的（b））。In addition, as shown in FIG. 5 , the fixing insertion hole 261 formed in the holding plate M1 has a convex portion 261 a. When the fixing cylindrical portion 262 is inserted and the movable member 262 b reaches the protruding position, the movable member 262 b is moved to the protruding position. The piece 262b is stuck so that the fixing cylindrical part 262 does not fall off. The convex portion 261a blocks the movable member 262b located in the protruding position, but does not block the movable member 262b located in the recessed position. Therefore, by setting the movable element 262 b to the protruding position with the fixing cylindrical portion 262 inserted into the fixing insertion hole 261 , the holding plate M1 is fixed to the holding base M2 (see (a) of FIG. 5 ). . On the other hand, by setting the movable member 262b to the recessed position with the fixing cylindrical portion 262 inserted into the fixing insertion hole 261, the fixing of the holding base M2 by the holding plate M1 is released (see FIG. 5 (b)).

板收容部24收容更換前後（使用前後）的保持用板M1，於本實施方式中，設置於傳遞軸71的內裏側、且較位於取出位置X2的移載工作台5更靠內裏側。另外，為了使利用後述的板取出/放入機構25d的保持用板M1的取出/放入變得容易，板收容部24設置成藉由升降移動機構240能夠升降移動（參照圖1）。如圖4所示，所述板收容部24具有載置各保持用板M1的滑動架部241。於本實施方式中，將上側多段的滑動架部241設為收容更換前的新的保持用板M1，將下側多段的滑動架部241設為收容更換後的舊的保持用板M1。所述板收容部24例如藉由利用板搬送機構25使成為對象的滑動架部241向前方滑動，從而於該滑動架部241載置使用後的舊的保持用板M1，或取出使用前的新的保持用板M1。再者，於滑動架部241的前邊部設置有突出部241a，使用該突出部241a進行抽出。The plate storage portion 24 stores the holding plate M1 before and after replacement (before and after use). In the present embodiment, it is provided on the inner side of the transmission shaft 71 and on the inner side of the transfer table 5 located at the take-out position X2. In addition, in order to facilitate the removal/insertion of the holding plate M1 by the plate removal/insertion mechanism 25d described later, the plate storage portion 24 is provided so as to be able to move up and down by the up-and-down movement mechanism 240 (see FIG. 1 ). As shown in FIG. 4 , the plate accommodating part 24 has a slide frame part 241 on which each holding plate M1 is placed. In this embodiment, the upper multi-stage slide rack portion 241 is configured to accommodate the new holding plate M1 before replacement, and the lower multi-stage sliding rack portion 241 is configured to accommodate the old holding plate M1 after replacement. The plate storage part 24 slides the target slide rack part 241 forward, for example, by using the plate transport mechanism 25, thereby placing the used holding plate M1 on the slide rack part 241, or taking out the used holding plate M1. New holding plate M1. Furthermore, a protruding portion 241a is provided at the front edge of the slide frame portion 241, and the protruding portion 241a is used for extraction.

＜板搬送機構25＞ 板搬送機構25將自保持基部M2卸除的保持用板M1搬送至板收容部24，並將位於板收容部24的保持用板M1搬送至保持基部M2。 <Plate transfer mechanism 25> The plate conveyance mechanism 25 conveys the holding plate M1 removed from the holding base M2 to the plate accommodating part 24, and conveys the holding plate M1 located in the plate accommodating part 24 to the holding base M2.

具體而言，如圖1及圖4所示，板搬送機構25具有：第一搬送機構25a，使用第二保持機構6及搬送用移動機構7而構成；第二搬送機構25b，使用反轉機構16及反轉用移動機構17而構成；第三搬送機構25c，使用移載工作台5及移載用移動機構15而構成；以及板取出/放入機構25d，於板收容部24與移載工作台5之間搬送保持用板M1。Specifically, as shown in FIGS. 1 and 4 , the plate conveying mechanism 25 includes a first conveying mechanism 25 a that uses a second holding mechanism 6 and a conveying moving mechanism 7 , and a second conveying mechanism 25 b that uses a reversing mechanism. 16 and the reversing moving mechanism 17; the third conveying mechanism 25c is formed using the transfer table 5 and the transferring moving mechanism 15; The holding plate M1 is transported between the worktables 5 .

第一搬送機構25a使用第二保持機構6及搬送用移動機構7而構成，於切斷用工作台2A、切斷用工作台2B或保持工作台161的保持基部M2與反轉機構16的保持工作台161之間搬送保持用板M1。The first conveying mechanism 25 a is configured using the second holding mechanism 6 and the conveying moving mechanism 7 , and is held by the holding base M2 of the cutting table 2A, the cutting table 2B or the holding table 161 and the reversing mechanism 16 The holding plate M1 is transported between the worktables 161 .

如圖6所示，成為第一搬送機構25a的第二保持機構6具有：搬送用圓筒部282，插入至形成於保持用板M1的搬送用保持孔281（參照圖3）。本實施方式中，使用第二保持機構6的保持基部M2的固定用圓筒部262來構成搬送用圓筒部282。搬送用保持孔281為與上文所述的固定機構26的固定用插入孔261同樣的結構。再者，搬送用保持孔281與固定用插入孔261為上下相反的結構。再者，第二保持機構6亦可代替搬送用圓筒部282而使用卡在保持用板M1的緣部進行保持的保持爪。第二保持機構6以使進行保持用板M1的保持的部分能夠升降的方式構成，可於使保持有保持用板M1的部分上升而設為上升位置的狀態下，搬送保持用板M1。此處，所謂「上升位置」，意指相較於安裝於更換對象的保持基部M2的保持用板M1的位置、或搬送中可取的最低的保持用板M1的位置，使保持用板M1上升的高度的位置。As shown in FIG. 6 , the second holding mechanism 6 serving as the first conveying mechanism 25 a has a conveying cylindrical portion 282 inserted into the conveying holding hole 281 formed in the holding plate M1 (see FIG. 3 ). In this embodiment, the conveying cylindrical part 282 is configured using the fixing cylindrical part 262 of the holding base M2 of the second holding mechanism 6 . The transport holding hole 281 has the same structure as the fixing insertion hole 261 of the fixing mechanism 26 described above. In addition, the holding hole 281 for transportation and the insertion hole 261 for fixation have a vertically opposite structure. Furthermore, the second holding mechanism 6 may use a holding claw that engages and holds the edge portion of the holding plate M1 instead of the conveyance cylindrical portion 282 . The second holding mechanism 6 is configured so that the portion holding the holding plate M1 can be raised and lowered, and can transport the holding plate M1 with the portion holding the holding plate M1 raised to the raised position. Here, the "raised position" means that the holding plate M1 is raised relative to the position of the holding plate M1 attached to the holding base M2 of the replacement object or the position of the lowest holding plate M1 that can be taken during transportation. height position.

第二搬送機構25b使用反轉機構16及反轉用移動機構17而構成，於第二保持機構6與移載工作台5之間搬送保持用板M1。再者，於藉由第二搬送機構25b搬送保持用板M1時，移載工作台5位於移交製品P的移載位置X1。The second transport mechanism 25 b is configured using the reversal mechanism 16 and the reversal moving mechanism 17 , and transports the holding plate M1 between the second holding mechanism 6 and the transfer table 5 . Furthermore, when the holding plate M1 is transported by the second transport mechanism 25b, the transfer table 5 is located at the transfer position X1 where the product P is transferred.

第三搬送機構25c使用移載工作台5及移載用移動機構15而構成，使保持用板M1移動至藉由後述的板取出/放入機構25d而取出/放入的位置。具體而言，構成第三搬送機構25c的移載用移動機構15使移載工作台5的保持基部M2於移載位置X1與取出/放入位置X3之間移動。再者，取出/放入位置X3可為與上文所述的取出位置X2相同的位置，亦可為不同的位置。The third transport mechanism 25c is configured using the transfer table 5 and the transfer moving mechanism 15, and moves the holding plate M1 to a position where it is taken out/in by a plate taking out/inputting mechanism 25d described later. Specifically, the transfer moving mechanism 15 constituting the third transport mechanism 25c moves the holding base M2 of the transfer table 5 between the transfer position X1 and the take-out/insertion position X3. Furthermore, the take-out/put-in position X3 may be the same position as the take-out position X2 mentioned above, or may be a different position.

板取出/放入機構25d於位於取出/放入位置X3的移載工作台5的保持基部M2與板收容部24之間搬送保持用板M1。板取出/放入機構25d具有：板保持機構251，對保持用板M1進行保持；以及取出/放入用移動機構252，使該板保持機構251移動。板保持機構251可採用具有插入至保持用板M1上所形成的搬送用保持孔281（參照圖3）中的搬送用圓筒部的結構，亦可採用具有卡在保持用板M1的緣部進行保持的保持爪的結構，亦可採用具有對保持用板M1進行吸附保持的吸附部的結構。The plate take-out/put-in mechanism 25d transports the holding plate M1 between the holding base M2 of the transfer table 5 located at the take-out/placement position X3 and the plate accommodating part 24. The plate take-out/insertion mechanism 25d has a plate holding mechanism 251 that holds the holding plate M1, and a take-out/placement moving mechanism 252 that moves the plate holding mechanism 251. The plate holding mechanism 251 may be configured to have a conveying cylindrical portion inserted into the conveying holding hole 281 (see FIG. 3 ) formed in the holding plate M1 , or may have an edge portion that is caught on the holding plate M1 The structure of the holding claws for holding may be a structure having an adsorption part for adsorbing and holding the holding plate M1.

另外，如圖4所示，取出/放入用移動機構252包括：Y方向移動部252a，使板保持機構251於Y方向上移動；以及Z方向移動部252b，使板保持機構251於Z方向上移動。再者，取出/放入用移動機構252亦可具有使板保持機構251於X方向上移動的X方向移動部。各移動部252a、252b例如可使用齒條與小齒輪機構，亦可使用滾珠螺桿機構，亦可使用氣缸，亦可使用直線馬達。In addition, as shown in FIG. 4 , the take-out/insertion moving mechanism 252 includes a Y-direction moving part 252 a that moves the plate holding mechanism 251 in the Y direction, and a Z-direction moving part 252 b that moves the plate holding mechanism 251 in the Z direction. Move up. Furthermore, the take-out/insertion moving mechanism 252 may have an X-direction moving part that moves the plate holding mechanism 251 in the X-direction. Each moving part 252a, 252b may use a rack and pinion mechanism, a ball screw mechanism, a cylinder, or a linear motor, for example.

＜保持用板M1的檢查機構29＞ 如圖3及圖6所示，本實施方式的切斷裝置100更包括：檢查機構29，檢查保持用板M1對保持基部M2的安裝狀態。 <Inspection mechanism 29 of holding plate M1> As shown in FIGS. 3 and 6 , the cutting device 100 of this embodiment further includes an inspection mechanism 29 for inspecting the attachment state of the holding plate M1 to the holding base M2.

所述檢查機構29具有：檢查用流路29a，於搭載有保持用板M1的搭載面M22開口；以及探測感測器（未圖示），設置於檢查用流路29a，探測流體自開口的洩漏。檢查用流路29a具有形成於保持基部M2的搭載面M22的開口，供給有壓縮空氣。另外，探測感測器藉由檢測於檢查用流路29a中流動的壓縮空氣的壓力或流量，從而探測壓縮空氣自開口的洩漏。藉由所述檢查機構29，可得知保持用板M1是否密接地固定於保持基部M2的搭載面M22。於根據檢查機構29而保持用板M1不密接於保持基部M2的搭載面M22的情況下，可藉由固定機構26解除固定，再次重新安裝保持用板M1。The inspection mechanism 29 has an inspection flow path 29a that opens on the mounting surface M22 on which the holding plate M1 is mounted, and a detection sensor (not shown) that is provided in the inspection flow path 29a and detects the flow of fluid from the opening. leak. The inspection flow path 29a has an opening formed in the mounting surface M22 of the holding base M2, and compressed air is supplied. In addition, the detection sensor detects the leakage of the compressed air from the opening by detecting the pressure or flow rate of the compressed air flowing in the inspection flow path 29a. The inspection mechanism 29 can determine whether the holding plate M1 is closely fixed to the mounting surface M22 of the holding base M2. When the holding plate M1 is not in close contact with the mounting surface M22 of the holding base M2 according to the inspection mechanism 29, the fixing can be released by the fixing mechanism 26 and the holding plate M1 can be reinstalled.

＜保持用板M1的更換動作＞ 繼而，參照圖7及圖8，對本實施方式的板搬送機構25進行的保持用板M1的更換動作加以說明。 <Replacement operation of holding plate M1> Next, the replacement operation of the holding plate M1 by the plate transport mechanism 25 of this embodiment will be described with reference to FIGS. 7 and 8 .

再者，以下的更換動作中，自板收容部24取出保持用板M1時的保持用板M1的判別是藉由下述方式進行，即：藉由設置於板搬送機構25（板取出/放入機構25d）的標識符讀取器（未圖示）來讀取設置於保持用板M1的射頻識別（Radio Frequency Identification，RFID）等的標識符。In addition, in the following replacement operation, when the holding plate M1 is taken out from the plate accommodating part 24, the holding plate M1 is determined by the following method: The identifier reader (not shown) in the mechanism 25d) reads an identifier such as a radio frequency identification (Radio Frequency Identification, RFID) provided on the holding plate M1.

（1）移載工作台5的保持用板M1的更換動作（參照圖7的（a））(1) Replacement operation of the holding plate M1 of the transfer table 5 (see (a) of Fig. 7 )

位於移載位置X1的移載工作台5藉由移載用移動機構15移動至取出/放入位置X3。然後，卸除移載工作台5的保持用板M1。再者，於卸除移載工作台5的保持用板M1時，向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，解除固定機構26的固定。The transfer table 5 located at the transfer position X1 is moved to the take-out/put-in position X3 by the transfer moving mechanism 15 . Then, the holding plate M1 of the transfer table 5 is removed. Furthermore, when the holding plate M1 of the transfer table 5 is removed, compressed air is supplied to the fixing cylindrical part 262 to set the movable element 262b to the recessed position, and the fixing of the fixing mechanism 26 is released.

板取出/放入機構25d自位於取出/放入位置X3的移載工作台5接收移載工作台5的保持用板M1，將保持用板M1載置並收容於板收容部24的滑動架部241。The plate take-out/put-in mechanism 25d receives the holding plate M1 of the transfer table 5 from the transfer table 5 located at the take-out/placement position Department 241.

繼而，板取出/放入機構25d自板收容部24取出新的保持用板M1並搬送至移載工作台5的保持基部M2，使保持用板M1下降並載置。於所述狀態下，若向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，則保持用板M1下降，固定用圓筒部262進入保持用板M1的固定用插入孔261，其後若停止供給壓縮空氣，則可動件262b成為突出位置，對移載工作台5的保持基部M2固定保持用板M1。Next, the plate taking-out/inserting mechanism 25d takes out the new holding plate M1 from the plate accommodating part 24, transports it to the holding base M2 of the transfer table 5, and lowers and places the holding plate M1. In this state, if compressed air is supplied to the fixing cylindrical part 262 and the movable element 262b is set to the recessed position, the holding plate M1 descends and the fixing cylindrical part 262 enters the fixing insertion of the holding plate M1 hole 261, and then when the supply of compressed air is stopped, the movable member 262b becomes a protruding position, and the holding plate M1 is fixed to the holding base M2 of the transfer table 5.

（2）保持工作台161的保持用板M1的更換動作（參照圖7的（b）） 於對保持工作台161的保持用板M1進行更換的情況下，將移載工作台5的保持用板M1預先卸除。 (2) Replacement operation of the holding plate M1 of the holding table 161 (see (b) of FIG. 7 ) When replacing the holding plate M1 of the holding table 161, the holding plate M1 of the transfer table 5 is removed in advance.

保持工作台161藉由反轉用移動機構17移動至位於移載位置X1的移載工作台5。然後，卸除保持工作台161的保持用板M1，將保持用板M1移交至移載工作台5。再者，於卸除保持工作台161的保持用板M1時，向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，解除固定機構26的固定。The holding table 161 is moved to the transfer table 5 located at the transfer position X1 by the reversing moving mechanism 17 . Then, the holding plate M1 of the holding table 161 is removed, and the holding plate M1 is transferred to the transfer table 5 . Furthermore, when the holding plate M1 of the holding table 161 is removed, compressed air is supplied to the fixing cylindrical part 262 to set the movable element 262b to the recessed position, and the fixing of the fixing mechanism 26 is released.

繼而，已接收有保持工作台161的保持用板M1的移載工作台5藉由移載用移動機構15自移載位置X1移動至取出/放入位置X3。然後，板取出/放入機構25d自位於取出/放入位置X3的移載工作台5接收保持工作台161的保持用板M1，將保持用板M1載置並收容於板收容部24的滑動架部241。Then, the transfer table 5 that has received the holding plate M1 of the holding table 161 moves from the transfer position X1 to the take-out/insertion position X3 by the transfer moving mechanism 15 . Then, the plate take-out/put-in mechanism 25d receives the holding plate M1 of the holding table 161 from the transfer table 5 located at the take-out/placement position X3, and places and accommodates the holding plate M1 in the sliding plate accommodating part 24. Frame part 241.

繼而，板取出/放入機構25d自板收容部24取出新的保持用板M1並搬送至移載工作台5，使保持用板M1下降並載置。載置有保持用板M1的移載工作台5藉由移載用移動機構15自取出/放入位置X3移動至移載位置X1。Next, the plate taking-out/inserting mechanism 25d takes out the new holding plate M1 from the plate accommodating part 24, transports it to the transfer table 5, and lowers and places the holding plate M1. The transfer table 5 on which the holding plate M1 is mounted moves from the take-out/insertion position X3 to the transfer position X1 by the transfer moving mechanism 15 .

然後，保持工作台161的保持基部M2藉由反轉用移動機構17移動至位於移載位置X1的移載工作台5。然後，保持工作台161的保持基部M2自移載工作台5接收保持用板M1。此處，若向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，則固定用圓筒部262進入保持用板M1的固定用插入孔261，其後若停止供給壓縮空氣，則可動件262b成為突出位置，對保持工作台161的保持基部M2固定保持用板M1。Then, the holding base M2 of the holding table 161 is moved to the transfer table 5 located at the transfer position X1 by the reversing moving mechanism 17 . Then, the holding base M2 of the holding table 161 receives the holding plate M1 from the transfer table 5 . Here, when the compressed air is supplied to the fixing cylindrical part 262 and the movable element 262b is set to the recessed position, the fixing cylindrical part 262 enters the fixing insertion hole 261 of the holding plate M1. After that, the supply of compressed air is stopped. When the air is released, the movable element 262b reaches the protruding position, and the holding plate M1 is fixed to the holding base M2 of the holding table 161.

（3）第二保持機構6的保持用板M1的更換動作（參照圖8的（a）） 於更換第二保持機構6的保持用板M1的情況下，將移載工作台5的保持用板M1及保持工作台161的保持用板M1預先卸除。 (3) Replacement operation of the holding plate M1 of the second holding mechanism 6 (see (a) of Fig. 8 ) When replacing the holding plate M1 of the second holding mechanism 6 , the holding plate M1 of the transfer table 5 and the holding plate M1 of the holding table 161 are removed in advance.

藉由搬送用移動機構7使第二保持機構6移動至保持工作台161，並且使保持用板M1下降並卸除，將保持用板M1載置於保持工作台161。再者，於卸除第二保持機構6的保持用板M1時，向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，解除固定機構26的固定。The second holding mechanism 6 is moved to the holding table 161 by the transport moving mechanism 7 , and the holding plate M1 is lowered and removed, and the holding plate M1 is placed on the holding table 161 . Furthermore, when the holding plate M1 of the second holding mechanism 6 is removed, compressed air is supplied to the fixing cylindrical part 262 to set the movable element 262b to the recessed position, and the fixing of the fixing mechanism 26 is released.

載置有第二保持機構6的保持用板M1的保持工作台161藉由反轉用移動機構17移動至位於移載位置X1的移載工作台5，將保持用板移交至移載工作台5。The holding table 161 on which the holding plate M1 of the second holding mechanism 6 is mounted is moved to the transfer table 5 located at the transfer position X1 by the reversing moving mechanism 17, and the holding plate is transferred to the transfer table. 5.

繼而，已接收有第二保持機構6的保持用板M1的移載工作台5藉由移載用移動機構15自移載位置X1移動至取出/放入位置X3。然後，板取出/放入機構25d自位於取出/放入位置X3的移載工作台5接收第二保持機構6的保持用板M1，將保持用板M1載置並收容於板收容部24的滑動架部241。Then, the transfer table 5 that has received the holding plate M1 of the second holding mechanism 6 moves from the transfer position X1 to the take-out/insertion position X3 by the transfer moving mechanism 15 . Then, the plate take-out/put-in mechanism 25d receives the holding plate M1 of the second holding mechanism 6 from the transfer table 5 located at the take-out/placement position X3, and places and stores the holding plate M1 in the plate accommodating part 24. Slide frame part 241.

繼而，板取出/放入機構25d自板收容部24取出新的保持用板M1並搬送至移載工作台5，使保持用板M1下降並載置。載置有保持用板M1的移載工作台5藉由移載用移動機構15自取出/放入位置X3移動至移載位置X1。Next, the plate taking-out/inserting mechanism 25d takes out the new holding plate M1 from the plate accommodating part 24, transports it to the transfer table 5, and lowers and places the holding plate M1. The transfer table 5 on which the holding plate M1 is mounted moves from the take-out/insertion position X3 to the transfer position X1 by the transfer moving mechanism 15 .

然後，保持工作台161的保持基部M2藉由反轉用移動機構17移動至位於移載位置X1的移載工作台5。然後，保持工作台161自移載工作台5接收新的保持用板M1，並移動至向第二保持機構6移交的位置。Then, the holding base M2 of the holding table 161 is moved to the transfer table 5 located at the transfer position X1 by the reversing moving mechanism 17 . Then, the holding table 161 receives the new holding plate M1 from the transfer table 5 and moves to a position where it is transferred to the second holding mechanism 6 .

其後，藉由搬送用移動機構7使第二保持機構6移動至保持工作台161，使保持基部M2下降，安裝載置於保持工作台161的新的保持用板M1。此處，藉由搬送用移動機構7將設置於第二保持機構6的保持基部M2的固定用圓筒部262插入至形成於保持用板M1的固定用插入孔261。於所述狀態下，若向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，則固定用圓筒部262進入保持用板M1的固定用插入孔261，其後若停止供給壓縮空氣，則可動件262b成為突出位置，對第二保持機構6的保持基部M2固定保持用板M1。Thereafter, the second holding mechanism 6 is moved to the holding table 161 by the transport moving mechanism 7, the holding base M2 is lowered, and the new holding plate M1 placed on the holding table 161 is installed. Here, the fixing cylindrical portion 262 provided in the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transport moving mechanism 7 . In this state, if compressed air is supplied to the fixing cylindrical part 262 and the movable element 262b is set to the recessed position, the fixing cylindrical part 262 enters the fixing insertion hole 261 of the holding plate M1, and then if When the supply of compressed air is stopped, the movable element 262b reaches the protruding position, and the holding plate M1 is fixed to the holding base M2 of the second holding mechanism 6 .

再者，第二保持機構6的保持用板M1的更換動作亦可藉由如下方式來進行，即於不使用保持工作台161的情況下利用搬送用移動機構7使第二保持機構6直接移動至移載工作台5。Furthermore, the replacement operation of the holding plate M1 of the second holding mechanism 6 can also be performed by using the transportation moving mechanism 7 to directly move the second holding mechanism 6 without using the holding table 161. to transfer workbench 5.

（4）切斷用工作台2A、切斷用工作台2B的保持用板M1的更換動作（參照圖8的（b）） 於對切斷用工作台2A、切斷用工作台2B的保持用板M1進行更換的情況下，將移載工作台5的保持用板M1、保持工作台161的保持用板M1及第二保持機構6的保持用板M1預先卸除。 (4) Replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B (see (b) of Fig. 8 ) When replacing the holding plate M1 of the cutting table 2A and the cutting table 2B, the holding plate M1 of the transfer table 5, the holding plate M1 of the holding table 161 and the second The holding plate M1 of the holding mechanism 6 is removed in advance.

於卸除切斷用工作台2A、切斷用工作台2B的保持用板M1並藉由第一搬送機構25a（搬送用移動機構7及第二保持機構6）使保持用板M1上升而處於上升位置的狀態下將其搬送至保持工作台161，使保持用板M1下降並載置。再者，於卸除切斷用工作台2A、切斷用工作台2B的保持用板M1時，向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，解除固定機構26的固定。After removing the holding plate M1 of the cutting tables 2A and 2B, the holding plate M1 is raised by the first conveying mechanism 25a (the conveying moving mechanism 7 and the second holding mechanism 6). It is transported to the holding table 161 in the raised position, and the holding plate M1 is lowered and placed. Furthermore, when removing the holding plate M1 of the cutting tables 2A and 2B, compressed air is supplied to the fixing cylindrical part 262 to set the movable element 262b to the recessed position, and the fixing mechanism is released. 26 fixed.

載置有切斷用工作台2A、切斷用工作台2B的保持用板M1的保持工作台161藉由反轉用移動機構17移動至位於移載位置X1的移載工作台5，將保持用板M1移交至移載工作台5。The holding table 161 on which the holding plate M1 of the cutting table 2A and the cutting table 2B is moved is moved to the transfer table 5 located at the transfer position X1 by the reversing moving mechanism 17, and the holding plate M1 is held. Transfer the plate M1 to the transfer workbench 5.

繼而，已接收有切斷用工作台2A、切斷用工作台2B的保持用板M1的移載工作台5藉由移載用移動機構15自移載位置X1移動至取出/放入位置X3。然後，板取出/放入機構25d自位於取出/放入位置X3的移載工作台5接收切斷用工作台2A、切斷用工作台2B的保持用板M1，將保持用板M1載置並收容於板收容部24的滑動架部241。Then, the transfer table 5 that has received the holding plate M1 of the cutting tables 2A and 2B moves from the transfer position X1 to the take-out/insertion position X3 by the transfer moving mechanism 15 . Then, the plate take-out/put-in mechanism 25d receives the holding plate M1 of the cutting table 2A and the cutting table 2B from the transfer table 5 located at the take-out/placement position X3, and places the holding plate M1 And it is accommodated in the sliding frame part 241 of the board receiving part 24.

繼而，板取出/放入機構25d自板收容部24取出新的保持用板M1並搬送至移載工作台5，使保持用板M1下降並載置。載置有保持用板M1的移載工作台5藉由移載用移動機構15自取出/放入位置X3移動至移載位置X1。Next, the plate taking-out/inserting mechanism 25d takes out the new holding plate M1 from the plate accommodating part 24, transports it to the transfer table 5, and lowers and places the holding plate M1. The transfer table 5 on which the holding plate M1 is mounted moves from the take-out/insertion position X3 to the transfer position X1 by the transfer moving mechanism 15 .

然後，保持工作台161的保持基部M2藉由反轉用移動機構17移動至位於移載位置X1的移載工作台5。然後，保持工作台161自移載工作台5接收新的保持用板M1，並移動至向第二保持機構6移交的位置。Then, the holding base M2 of the holding table 161 is moved to the transfer table 5 located at the transfer position X1 by the reversing moving mechanism 17 . Then, the holding table 161 receives the new holding plate M1 from the transfer table 5 and moves to a position where it is transferred to the second holding mechanism 6 .

其後，第二搬送機構25b（搬送用移動機構7及第二保持機構6）將保持用板M1於設為上升位置的狀態下搬送至切斷用工作台2A、切斷用工作台2B的保持基部M2，使保持用板M1下降並載置。於所述狀態下，若向固定用圓筒部262供給壓縮空氣而將可動件262b設為沒入位置，則固定用圓筒部262進入保持用板M1的固定用插入孔261，其後若停止供給壓縮空氣，則可動件262b成為突出位置，對切斷用工作台2A、切斷用工作台2B的保持基部M2固定保持用板M1。Thereafter, the second conveyance mechanism 25b (the conveyance moving mechanism 7 and the second holding mechanism 6) conveys the holding plate M1 to the cutting tables 2A and 2B in a state of being in the raised position. The base M2 is held, and the holding plate M1 is lowered and placed. In this state, if compressed air is supplied to the fixing cylindrical part 262 and the movable element 262b is set to the recessed position, the fixing cylindrical part 262 enters the fixing insertion hole 261 of the holding plate M1, and then if When the supply of compressed air is stopped, the movable element 262b reaches the protruding position, and the holding plate M1 is fixed to the holding base M2 of the cutting table 2A and the cutting table 2B.

再者，切斷用工作台2A、切斷用工作台2B的保持用板M1的更換動作亦可藉由如下方式來進行，即於不使用保持工作台161的情況下利用搬送用移動機構7使第二保持機構6直接移動至移載工作台5。Furthermore, the replacement operation of the holding plate M1 of the cutting tables 2A and 2B can also be performed by using the transport moving mechanism 7 without using the holding table 161 The second holding mechanism 6 is moved directly to the transfer workbench 5 .

進而，亦可將移載工作台5、保持工作台161、切斷用工作台2A、切斷用工作台2B及第二保持機構6的保持用板M1的更換設為一系列動作來進行。例如可想到，將移載工作台5、保持工作台161、第二保持機構6及切斷用工作台2A、切斷用工作台2B的保持用板M1依序卸除，其後依序安裝切斷用工作台2A、切斷用工作台2B、第二保持機構6、保持工作台161及移載工作台5的保持用板M1。Furthermore, the transfer table 5 , the holding table 161 , the cutting table 2A, the cutting table 2B, and the holding plate M1 of the second holding mechanism 6 may be replaced as a series of operations. For example, it is conceivable that the transfer table 5 , the holding table 161 , the second holding mechanism 6 and the holding plates M1 of the cutting tables 2A and 2B are sequentially removed and then installed in sequence. The cutting table 2A, the cutting table 2B, the second holding mechanism 6 , the holding table 161 and the holding plate M1 of the transfer table 5 .

＜本實施方式的效果＞ 根據本實施方式的切斷裝置100，具有將自保持基部M2卸除的保持用板M1搬送至板收容部24並將位於板收容部24的保持用板M1搬送至保持基部M2的板搬送機構25，故而可對保持基部M2自動更換保持用板M1。其結果為，可削減用以更換保持用板M1的人力費。另外，因自動更換保持用板M1，故而可縮短保持用板M1的更換時間，可提高切斷裝置100的生產性。進而，可減少保持用板M1對保持基部M2的安裝狀態的不均一。 <Effects of this embodiment> According to the cutting device 100 of this embodiment, it has a plate conveying mechanism that conveys the holding plate M1 removed from the holding base M2 to the plate accommodating part 24 and conveys the holding plate M1 located in the plate accommodating part 24 to the holding base M2 25, the holding plate M1 can be automatically replaced with the holding base M2. As a result, the labor cost for replacing the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting device 100 can be improved. Furthermore, unevenness in the attachment state of the holding plate M1 to the holding base M2 can be reduced.

＜本發明的變形實施方式＞ 例如，於所述第一實施方式中，為自動更換切斷用工作台2A、切斷用工作台2B、檢查用工作台（保持工作台161）、移載工作台5及搬送用保持機構（第二保持機構6）各自的保持用板M1的結構，但亦可採用自動更換切斷用工作台2A、切斷用工作台2B、檢查用工作台（保持工作台161）、移載工作台5及搬送用保持機構（第二保持機構6）中的至少一個的結構。 <Modified embodiment of the present invention> For example, in the first embodiment, the cutting table 2A, the cutting table 2B, the inspection table (holding table 161), the transfer table 5, and the transport holding mechanism ( The second holding mechanism 6) has a structure of each holding plate M1, but the cutting table 2A, the cutting table 2B, the inspection table (holding table 161), and the transfer table can also be automatically replaced. 5 and the structure of at least one of the holding mechanism for transportation (the second holding mechanism 6).

所述實施方式的板搬送機構25可採用不使用第二保持機構6及搬送用移動機構7的結構，亦可採用不使用移載工作台5及移載用移動機構15的結構，亦可採用不使用反轉機構16及反轉用移動機構17的結構。The plate transport mechanism 25 of the above embodiment may be configured without using the second holding mechanism 6 and the transport moving mechanism 7, or may be configured without using the transfer table 5 and the transfer moving mechanism 15, or may be A structure that does not use the reversing mechanism 16 and the reversing moving mechanism 17 .

例如，於採用不使用移載工作台5及移載用移動機構15的結構、或者不使用反轉機構16及反轉用移動機構17的結構的情況下，藉由將板收容部24配置於第二保持機構6能夠接入的位置（例如，反轉機構16與移載工作台5之間），從而可於不使用移載工作台5及移載用移動機構15、或者反轉機構16及反轉用移動機構17的情況下藉由第二保持機構6及搬送用移動機構7來構成板搬送機構25。For example, in the case of adopting a structure that does not use the transfer table 5 and the transfer moving mechanism 15, or a structure that does not use the reversing mechanism 16 and the reversing moving mechanism 17, by arranging the plate receiving portion 24 in A position where the second holding mechanism 6 can be accessed (for example, between the reversing mechanism 16 and the transfer table 5 ), so that the transfer table 5 and the transfer moving mechanism 15 or the reversing mechanism 16 can be In the case of the reversing moving mechanism 17 , the plate conveying mechanism 25 is composed of the second holding mechanism 6 and the conveying moving mechanism 7 .

另外，如圖9所示，亦可採用如下結構：將托盤收容部23配置於傳遞軸71的近前側，並且將傳遞軸71延伸至第二保持機構6可移動至托盤收容部23的位置。若為所述結構，則可使用第二保持機構6及搬送用移動機構7來構成板搬送機構25。於所述結構的情況下，藉由於板收容部24的下方設置托盤移動機構22的導軌22b，成為板收容部24與托盤移動機構22不發生干擾的結構。In addition, as shown in FIG. 9 , a structure may be adopted in which the tray accommodating part 23 is arranged on the front side of the transmission shaft 71 and the transmission shaft 71 is extended to a position where the second holding mechanism 6 can move to the tray accommodating part 23 . With the above structure, the plate conveying mechanism 25 can be configured using the second holding mechanism 6 and the conveying moving mechanism 7 . In the case of the above-mentioned structure, by providing the guide rail 22b of the pallet moving mechanism 22 below the plate accommodating part 24, it becomes a structure in which the plate accommodating part 24 and the pallet moving mechanism 22 do not interfere.

另外，所述第一實施方式的板收容部24收容切斷用工作台2A、切斷用工作台2B、檢查用工作台（保持工作台161）、移載工作台5及搬送用保持機構（第二保持機構6）各自的保持用板M1，但亦可採用根據保持用板M1的種類而設置多個專用的板收容部24的結構。In addition, the plate storage part 24 of the first embodiment stores the cutting table 2A, the cutting table 2B, the inspection table (holding table 161), the transfer table 5, and the transport holding mechanism ( The second holding mechanism 6) each has a holding plate M1, but a structure in which a plurality of dedicated plate receiving portions 24 are provided according to the type of the holding plate M1 may be adopted.

亦可將所述實施方式的板收容部24及板取出/放入機構25d單元化。藉由如此將板收容部24及板取出/放入機構25d單元化，可外置於已有的切斷裝置上。The plate storage part 24 and the plate removal/insertion mechanism 25d of the said embodiment may be unitized. By unitizing the plate storage part 24 and the plate removal/insertion mechanism 25d in this way, it can be externally installed on an existing cutting device.

所述實施方式是進行托盤收容的切斷裝置，但並不限於托盤收容，亦可進行以下的收容。The above-described embodiment is a cutting device that accommodates pallets. However, the cutting device is not limited to pallet accommodation, and the following accommodations are also possible.

例如，如圖10所示，切斷裝置100亦可將多個製品P貼附於具有黏著面101x的貼附構件101並進行收容（亦稱為「連環收容」）。所述進行連環收容的切斷裝置100中的保持用板M1的自動更換功能與所述實施方式相同。For example, as shown in FIG. 10 , the cutting device 100 can attach and store a plurality of products P to the attachment member 101 having the adhesive surface 101x (also called "serial storage"). The automatic replacement function of the holding plate M1 in the cutting device 100 for storing the chain is the same as that of the above-described embodiment.

具體而言，如圖11所示，貼附構件包括：框狀構件101a，呈例如圓環狀或矩形形狀；以及樹脂片101b，具有配置於所述框狀構件101a的內側的黏著面101x。框狀構件101a例如為不鏽鋼等的金屬製。另外，樹脂片101b例如包括樹脂製的片狀基材101b1、及包含塗佈於該片狀基材101b1的上表面的接著劑的接著層（黏著層）101b2。再者，接著層（黏著層）101b2的上表面成為黏著面101x。Specifically, as shown in FIG. 11 , the attachment member includes a frame-shaped member 101 a , for example, in an annular or rectangular shape, and a resin sheet 101 b having an adhesive surface 101 x arranged inside the frame-shaped member 101 a. The frame member 101a is made of metal such as stainless steel, for example. In addition, the resin sheet 101b includes, for example, a resin sheet-like base material 101b1 and an adhesive layer (adhesive layer) 101b2 including an adhesive applied to the upper surface of the sheet-like base material 101b1. Furthermore, the upper surface of the adhesive layer (adhesive layer) 101b2 becomes the adhesive surface 101x.

於此情況下，移載工作台5於將多個製品P貼附於貼附構件101上之前暫時載置多個製品P。而且，移載工作台5藉由移載用移動機構15而於藉由第二保持機構6載置多個製品P的移載位置X1與藉由貼附用搬送機構102搬送多個製品P的取出位置X2之間移動。In this case, the transfer table 5 temporarily places the plurality of products P before attaching the plurality of products P to the attachment member 101 . Furthermore, the transfer table 5 is moved between the transfer position X1 where the plurality of products P are placed by the second holding mechanism 6 by the transfer moving mechanism 15 and the position where the plurality of products P are transported by the attachment transfer mechanism 102 . Take out and move between positions X2.

載置於移載工作台5的多個製品P根據由檢查部14所得的檢查結果（良品、不良品等）而由貼附用搬送機構102貼附於貼附構件101。貼附構件101載置於載置工作台103。如圖10所示，載置工作台103設置成能夠沿著Y方向移動。然後，載置工作台103藉由載置用移動機構104於由貼附構件搬送機構105搬送貼附構件101的貼附構件搬送位置X4與由貼附用搬送機構102搬送多個製品P的貼附位置X5之間移動。再者，載置用移動機構104具有：導軌104a，沿著Y方向對載置工作台103進行導引；以及驅動部（未圖示），使載置工作台103於該導軌104a上移動。另外，貼附構件搬送機構105於位於貼附構件搬送位置X4的載置工作台103與收容貼附構件101的貼附構件收容部106之間搬送貼附構件101。所述貼附構件搬送機構105吸附並保持貼附構件101的框狀構件101a。The plurality of products P placed on the transfer table 5 are attached to the attachment member 101 by the attachment transfer mechanism 102 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 14 . The attachment member 101 is placed on the placement table 103 . As shown in FIG. 10 , the mounting table 103 is provided movably in the Y direction. Then, the placement table 103 moves the placement movement mechanism 104 between the attachment member transport position X4 where the attachment member 101 is transported by the attachment member transport mechanism 105 and the attachment member transport position X4 where the plurality of products P are transported by the attachment transport mechanism 102 . Move between attached positions X5. Furthermore, the placement moving mechanism 104 has a guide rail 104a that guides the placement table 103 in the Y direction, and a drive unit (not shown) that moves the placement table 103 on the guide rail 104a. In addition, the sticking member transport mechanism 105 transports the sticking member 101 between the placement table 103 located at the sticking member transport position X4 and the sticking member accommodating portion 106 that accommodates the sticking member 101. The attachment member conveying mechanism 105 adsorbs and holds the frame-shaped member 101a of the attachment member 101.

另外，如圖12所示，切斷裝置100構成為可將多個製品P收容於筒狀容器107（亦稱為「管收容」）。再者，筒狀容器107有時被稱為管（tube）、盒棒（magazine stick）、棒盒（stick magazine）、棒（stick）等。所述進行管收容的切斷裝置100中的保持用板M1的自動更換功能與所述實施方式相同。In addition, as shown in FIG. 12 , the cutting device 100 is configured to accommodate a plurality of products P in a cylindrical container 107 (also referred to as “tube accommodation”). In addition, the cylindrical container 107 may be called a tube, a magazine stick, a stick magazine, a stick, or the like. The automatic replacement function of the holding plate M1 in the tube-accommodating cutting device 100 is the same as that in the above-described embodiment.

具體而言，如圖13所示，筒狀容器107將多個製品P以排列成行狀的狀態進行收容。具體而言，筒狀容器107具有直線狀地延伸的形狀，於內部具有收容製品P的空間。另外，筒狀容器107的與長度方向正交的剖面形狀為與製品P的剖面形狀對應的形狀。藉由搬送收容機構108自筒狀容器107的一端開口部107x插入製品P。再者，圖13所示的筒狀容器107為沿著長度方向延伸的側周壁的一部分打開的結構，但亦可為所述側周壁閉合的結構。另外，筒狀容器107除了將多個製品P以排列成一行的狀態進行收容的結構以外，亦可為將多個製品P以排列成多行的狀態進行收容的結構。進而，筒狀容器107可為樹脂製，亦可為金屬製。另外，圖13中，作為製品P而表示具有引線的形態，但亦可為方形扁平無引線（Quad Flat No-lead，QFN）等無引線型。Specifically, as shown in FIG. 13 , the cylindrical container 107 contains a plurality of products P arranged in a row. Specifically, the cylindrical container 107 has a linearly extending shape and has a space for accommodating the product P inside. In addition, the cross-sectional shape perpendicular to the longitudinal direction of the cylindrical container 107 corresponds to the cross-sectional shape of the product P. The product P is inserted from the one end opening 107x of the cylindrical container 107 by the transportation and storage mechanism 108. Furthermore, the cylindrical container 107 shown in FIG. 13 has a structure in which a part of the side peripheral wall extending in the longitudinal direction is opened, but it may also have a structure in which the side peripheral wall is closed. In addition, the cylindrical container 107 may have a structure in which a plurality of products P are stored in a state arranged in a plurality of rows, in addition to a structure in which a plurality of products P are arranged in a row. Furthermore, the cylindrical container 107 may be made of resin or metal. In addition, in FIG. 13 , the product P is shown to have a lead, but it may also be a leadless type such as a Quad Flat No-lead (QFN).

於此情況下，移載工作台5於將多個製品P收容於筒狀容器107之前暫時載置多個製品P。而且，移載工作台5藉由移載用移動機構15而於藉由第二保持機構6載置多個製品P的移載位置X1與藉由搬送收容機構108搬送多個製品P的取出位置X2之間移動。In this case, the transfer table 5 temporarily places the plurality of products P before accommodating the plurality of products P in the cylindrical container 107 . Furthermore, the transfer table 5 is moved to a transfer position X1 where a plurality of products P are placed by the second holding mechanism 6 by the transfer moving mechanism 15 and a take-out position where the plurality of products P are transferred by the transfer and storage mechanism 108 Move between X2.

載置於移載工作台5的多個製品P根據由檢查部14所得的檢查結果（良品、不良品等）而由搬送收容機構108收容於筒狀容器107。筒狀容器107載置於容器設置部109。再者，圖12的容器設置部109包括：收容空的筒狀容器107的部分；配置自一端開口部107x插入製品P的空的筒狀容器107的部分；以及收容製品P滿載或收容了所期望個數的收容完畢的筒狀容器107的部分。另外，搬送收容機構108將多個製品P自位於取出位置X2的移載工作台5搬送至中間工作台108a，將製品P自該中間工作台108a搬送至筒狀容器107進行收容。The plurality of products P placed on the transfer table 5 are stored in the cylindrical container 107 by the transport and storage mechanism 108 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 14 . The cylindrical container 107 is placed on the container installation part 109 . In addition, the container installation part 109 of FIG. 12 includes: a part for accommodating the empty cylindrical container 107; a part for arranging the empty cylindrical container 107 inserted into the product P from the one end opening 107x; A desired number of stored cylindrical containers 107. In addition, the transport and storage mechanism 108 transports a plurality of products P from the transfer table 5 located at the take-out position X2 to the intermediate table 108a, and transports the products P from the intermediate table 108a to the cylindrical container 107 for storage.

另外，如圖14所示，切斷裝置100亦可將多個製品P以零散的狀態收容於收容箱（亦稱為「塊收容」）。In addition, as shown in FIG. 14 , the cutting device 100 can also store a plurality of products P in a scattered state in a storage box (also called "block storage").

所述切斷裝置100與所述實施方式不同，代替移載工作台5、分類機構20及檢查部14等而包括乾燥用工作台110及收容箱111，傳遞軸71設置於第二保持機構6可移動至收容箱111的上方的範圍。而且，第二保持機構6藉由搬送用移動機構7將多個製品P自切斷用工作台2A、切斷用工作台2B搬送至乾燥用工作台110，並自乾燥用工作台110搬送至收容箱111。乾燥用工作台110用於將經第二清潔機構18清潔的多個製品P進一步乾燥。乾燥用工作台110藉由第二保持機構6及搬送用移動機構7來搬送多個製品P並載置。所述乾燥用工作台110吸附並保持多個製品P。於所述乾燥用工作台110包括對載置於乾燥用工作台110的多個製品P進行乾燥的乾燥機構（未圖示）。再者，乾燥機構自乾燥用工作台110的上方噴射作為氣體的壓縮空氣，將吸附保持於乾燥用工作台110的多個製品P乾燥。The cutting device 100 is different from the above embodiment in that it includes a drying table 110 and a storage box 111 instead of the transfer table 5, the classification mechanism 20, the inspection part 14, etc., and the transmission shaft 71 is provided in the second holding mechanism 6 It can move to the upper range of the storage box 111. Furthermore, the second holding mechanism 6 transports the plurality of products P from the cutting workbench 2A and the cutting workbench 2B to the drying workbench 110 by the transport moving mechanism 7, and transports the products P from the drying workbench 110 to the drying workbench 110. Containment Box 111. The drying table 110 is used to further dry the plurality of products P cleaned by the second cleaning mechanism 18 . The drying table 110 transports and places a plurality of products P by the second holding mechanism 6 and the transport moving mechanism 7 . The drying table 110 adsorbs and holds a plurality of products P. The drying table 110 includes a drying mechanism (not shown) for drying a plurality of products P placed on the drying table 110 . Furthermore, the drying mechanism injects compressed air as a gas from above the drying table 110 to dry the plurality of products P adsorbed and held on the drying table 110 .

收容箱111將多個製品P以零散的狀態進行收容，且包括自第二保持機構6撣落多個製品P的例如樹脂製的撣落構件112。而且，藉由使第二保持機構6相對於撣落構件112於X方向移動，從而製品P被撣落而掉落，收容於收容箱111。再者，亦可採用下述結構，即：不設置撣落構件112，而藉由第二保持機構6解除吸附保持後自第二保持機構6噴射氣體，藉此使多個製品P掉落。另外，除了將撣落構件112固定於收容箱111的結構以外，亦可固定於其他構件，或者亦可採用下述結構，即：以能夠移動的方式構成撣落構件112，使撣落構件112相對於第二保持機構6移動，藉此撣落多個製品P。The storage box 111 stores a plurality of products P in a scattered state, and includes a dusting member 112 made of, for example, resin for dusting off the plurality of products P from the second holding mechanism 6 . Furthermore, by moving the second holding mechanism 6 in the X direction relative to the dusting member 112 , the product P is dusted and dropped, and is stored in the storage box 111 . Furthermore, a structure may be adopted in which the dusting member 112 is not provided, but the second holding mechanism 6 releases the adsorption and holding and then injects gas from the second holding mechanism 6 to drop the plurality of products P. In addition, in addition to the structure in which the dusting member 112 is fixed to the storage box 111, it may also be fixed to other members, or the following structure may be adopted, that is, the dusting member 112 may be configured in a movable manner, so that the dusting member 112 Move relative to the second holding mechanism 6, thereby brushing off a plurality of products P.

而且，進行塊收容的切斷裝置100中的板搬送機構25與所述各實施方式不同，使用第二保持機構6及搬送用移動機構7來構成。此處，構成板搬送機構25的第二保持機構6與第一實施方式同樣地，具有搬送用圓筒部282（參照圖6），所述搬送用圓筒部282插入至形成於保持用板M1的搬送用保持孔281（參照圖3）。Furthermore, the plate conveying mechanism 25 in the cutting device 100 for accommodating the blocks is configured using the second holding mechanism 6 and the conveying moving mechanism 7, unlike the above-described embodiments. Here, the second holding mechanism 6 constituting the plate conveying mechanism 25 has a conveying cylindrical portion 282 (see FIG. 6 ) that is inserted into a portion formed on the holding plate, similarly to the first embodiment. The holding hole 281 for transportation of M1 (refer to Fig. 3).

藉由所述板搬送機構25（第二保持機構6及搬送用移動機構7），如圖15所示，進行第二保持機構6的保持用板M1、乾燥用工作台110的保持用板M1及切斷用工作台2A、切斷用工作台2B的保持用板M1的更換動作。As shown in FIG. 15 , the plate transport mechanism 25 (the second holding mechanism 6 and the transport moving mechanism 7 ) holds the plate M1 held by the second holding mechanism 6 and the plate M1 held by the drying table 110 . and the replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B.

此處，於進行切斷用工作台2A、切斷用工作台2B的保持用板M1的更換動作及乾燥用工作台110的保持用板M1的更換動作的情況下，將構成板搬送機構25的第二保持機構6的保持用板M1預先卸除。另外，切斷用工作台2A、切斷用工作台2B的保持用板M1的更換動作與乾燥用工作台110的保持用板M1的更換動作的哪一個先進行均可。另外，亦可自切斷用工作台2A、切斷用工作台2B及乾燥用工作台110的保持基部M2卸除保持用板M1，其後於切斷用工作台2A、切斷用工作台2B及乾燥用工作台110的保持基部M2安裝新的保持用板M1。Here, when performing the replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B and the replacement operation of the holding plate M1 of the drying table 110, the plate transport mechanism 25 is configured The holding plate M1 of the second holding mechanism 6 is removed in advance. In addition, whichever of the replacement operation of the holding plate M1 of the cutting tables 2A and 2B or the replacement operation of the holding plate M1 of the drying table 110 is performed first may be performed. In addition, the holding plate M1 may be removed from the holding base M2 of the cutting table 2A, the cutting table 2B, and the drying table 110, and then the holding plate M1 may be removed from the cutting table 2A, the cutting table 2B, and the drying table 110. 2B and the holding base M2 of the drying table 110 are equipped with a new holding plate M1.

進而，亦可將第二保持機構6、切斷用工作台2A、切斷用工作台2B及乾燥用工作台110的保持用板M1的更換設為一系列動作，但亦可分別進行第二保持機構6、切斷用工作台2A、切斷用工作台2B或乾燥用工作台110中至少一個的保持用板M1的更換。此時，於更換切斷用工作台2A、切斷用工作台2B或乾燥用工作台110的保持用板M1時，將構成板搬送機構25的第二保持機構6的保持用板M1預先卸除。Furthermore, the replacement of the second holding mechanism 6 , the cutting table 2A, the cutting table 2B, and the holding plate M1 of the drying table 110 may be performed as a series of operations, but the second operation may be performed separately. Replacement of the holding plate M1 of at least one of the holding mechanism 6, the cutting table 2A, the cutting table 2B, or the drying table 110. At this time, when replacing the holding plate M1 of the cutting table 2A, the cutting table 2B or the drying table 110, the holding plate M1 constituting the second holding mechanism 6 of the plate transport mechanism 25 is removed in advance. remove.

於所述各實施方式中，對雙切割工作台方式且雙心軸結構的切斷裝置進行了說明，但並不限於此，亦可為單切割工作台方式且單心軸結構的切斷裝置、或單切割工作台方式且雙心軸結構的切斷裝置等。In each of the above embodiments, a cutting device of a double cutting table type and a double mandrel structure has been described, but the invention is not limited thereto. A cutting device of a single cutting table type and a single mandrel structure may also be used. , or a cutting device with a single cutting table and a double mandrel structure, etc.

另外，可將切斷裝置（加工裝置）100設為於第二清潔機構18與檢查部14或乾燥用工作台110之間能夠分離及連結（能夠裝卸）的模組結構。於此情況下，例如可於第二清潔機構18側的模組、與檢查部14側的模組或乾燥用工作台110側的模組之間，追加進行與檢查部14中的檢查為不同種類的檢查的模組。再者，除了此處例示的結構以外，亦可將切斷裝置（加工裝置）100設為能夠於某處分離及連結（能夠裝卸）的模組結構，亦可將追加的模組設為檢查以外的各種功能的模組。In addition, the cutting device (processing device) 100 may be configured as a module structure that is detachable and connectable (detachable) between the second cleaning mechanism 18 and the inspection unit 14 or the drying table 110 . In this case, for example, between the module on the second cleaning mechanism 18 side and the module on the inspection unit 14 side or the module on the drying table 110 side, an inspection different from the inspection in the inspection unit 14 may be additionally performed. Type of inspection module. Furthermore, in addition to the structure illustrated here, the cutting device (processing device) 100 may be configured as a module structure that can be separated and connected (removable) somewhere, or an additional module may be configured as an inspection unit. Modules with various functions other than.

另外，本發明的加工裝置亦可進行切斷以外的加工，例如亦可進行切削或磨削等其他機械加工。In addition, the processing device of the present invention can also perform processing other than cutting, for example, it can also perform other mechanical processing such as cutting or grinding.

除此以外，本發明並不限於所述實施方式，當然能夠於不偏離其主旨的範圍進行各種變形。 [產業上的可利用性] In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. [Industrial availability]

根據本發明，可自動更換用以保持加工對象物的保持用板。According to the present invention, the holding plate for holding the object to be processed can be automatically replaced.

2A、2B:切斷用工作台（加工用工作台、工作台） 3:第一保持機構 4:切斷機構（加工機構） 5:移載工作台（板搬送機構） 6:第二保持機構（搬送用保持機構、板搬送機構） 7:搬送用移動機構（板搬送機構） 8A、8B:切斷用移動機構 9A、9B:旋轉機構 10:基板供給機構 10a:基板收容部 10b:基板供給部 11:心軸移動機構 11a:支持體 12:攝像相機 13:第一清潔機構 14:檢查部 15:移載用移動機構（板搬送機構） 15a:導軌 16:反轉機構 17:反轉用移動機構 17a:導軌 18:第二清潔機構 20:分類機構 21:托盤 22:托盤移動機構 22a:托盤載置部 22b:導軌 23:托盤收容部 24:板收容部 25:板搬送機構 25a:第一搬送機構 25b:第二搬送機構 25c:第三搬送機構 25d:板取出/放入機構 26:固定機構 27:攝像相機 29:檢查機構 29a:檢查用流路 40:旋轉工具 41A、41B:刀片 42A、42B:心軸部 71:傳遞軸 100:切斷裝置（加工裝置） 101:貼附構件 101a:框狀構件 101b:樹脂片 101b1:片狀基材 101b2:接著層（黏著層） 101x:黏著面 102:貼附用搬送機構 103:載置工作台 104:載置用移動機構 104a:導軌 105:貼附構件搬送機構 106:貼附構件收容部 107:筒狀容器 107x:一端開口部 108:搬送收容機構 108a:中間工作台 109:容器設置部 110:乾燥用工作台 111:收容箱 112:撣落構件 141:第一檢查部（檢查部） 142:第二檢查部（檢查部） 161:保持工作台（檢查用工作台） 162:反轉部 240:升降移動機構 241:滑動架部 241a:突出部 251:板保持機構 252:取出/放入用移動機構 252a、252b:移動部 261:固定用插入孔 261a:凸部 262:固定用圓筒部 262a:圓筒本體 262b:可動件 262c:彈性體 262d:活塞部 281:搬送用保持孔 282:搬送用圓筒部 CTL:控制部 M1:保持用板 M2:保持基部 M21:吸附流路 M22:搭載面 P:製品（加工品） X1:移載位置 X2:取出位置 X3:取出/放入位置 X4:貼附構件搬送位置 X5:貼附位置 W:密封完畢基板（加工對象物） RP:保持位置 X、Y、Z、θ:方向 2A, 2B: Cutting table (processing table, work table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5: Transfer workbench (plate transfer mechanism) 6: Second holding mechanism (holding mechanism for transportation, plate transportation mechanism) 7: Moving mechanism for transportation (plate transportation mechanism) 8A, 8B: Moving mechanism for cutting 9A, 9B: Rotating mechanism 10:Substrate supply mechanism 10a:Substrate receiving part 10b:Substrate supply department 11: Spindle moving mechanism 11a:Support 12:Video camera 13:The first cleaning agency 14:Inspection Department 15: Moving mechanism for transfer (plate transfer mechanism) 15a: Guide rail 16:Reversal mechanism 17:Moving mechanism for reversal 17a: Guide rail 18:Second cleaning mechanism 20:Classification agency 21:Pallet 22:Pallet moving mechanism 22a:Pallet placement part 22b: Guide rail 23:Pallet storage department 24: Board Containment Department 25: Board transport mechanism 25a: First transport mechanism 25b: Second transport mechanism 25c: Third transport mechanism 25d: Plate take-out/put-in mechanism 26: Fixed mechanism 27:Video camera 29: Inspection agency 29a: Inspection flow path 40: Rotary tool 41A, 41B: Blade 42A, 42B: Spindle part 71:Transmission shaft 100: Cutting device (processing device) 101: Attached components 101a: Frame-like member 101b:Resin sheet 101b1: Sheet substrate 101b2: Adhesion layer (adhesive layer) 101x: Adhesive surface 102: Transfer mechanism for attachment 103:Loading workbench 104:Moving mechanism for placement 104a: Guide rail 105: Attached component transport mechanism 106: Attached component storage part 107:Tubular container 107x: Open at one end 108:Transfer to shelter 108a: Middle workbench 109: Container setting department 110: Drying workbench 111: Containment box 112: Dust off components 141:First Inspection Department (Inspection Department) 142:Second Inspection Department (Inspection Department) 161: Maintain workbench (workbench for inspection) 162:Reversal Department 240: Lifting and moving mechanism 241:Sliding frame part 241a:Protuberance 251: Plate holding mechanism 252: Moving mechanism for taking out/inserting 252a, 252b: Mobile Department 261: Insertion hole for fixation 261a:convex part 262: Fixed cylindrical part 262a:Cylinder body 262b: Movable parts 262c: Elastomer 262d:Piston part 281: Holding hole for transportation 282: Cylinder part for transportation CTL:Control Department M1: Holding plate M2: Keep the base M21: Adsorption flow path M22: Mounting surface P: products (processed products) X1: transfer position X2: take out position X3: take out/put in position X4: Transfer position of attached components X5: attachment position W: Sealed substrate (object to be processed) RP: maintain position X, Y, Z, θ: direction

圖1為示意性地表示本發明的一實施方式的切斷裝置（托盤收容）的結構的圖。 圖2為表示所述實施方式的切斷裝置的動作的示意圖。 圖3為表示所述實施方式的保持用板及保持基部的結構的示意圖。 圖4為表示所述實施方式的板搬送機構（板取出/放入機構）及板收容部的立體圖。 圖5為示意性地表示所述實施方式的固定機構的結構的剖面圖。 圖6為表示所述實施方式的第二保持機構的保持基部的立體圖。 圖7為表示所述實施方式的保持用板的更換動作的圖。 圖8為表示所述實施方式的保持用板的更換動作的圖。 圖9為示意性地表示變形實施方式的切斷裝置的結構的圖。 圖10為示意性地表示變形實施方式的切斷裝置（連環收容）的結構的圖。 圖11為示意性地表示貼附構件的結構的（a）平面圖、（b）剖面圖、及（c）局部放大剖面圖。 圖12為示意地表示變形實施方式的切斷裝置（管收容）的結構的圖。 圖13為示意性地表示筒狀容器的結構的（a）立體圖、及（b）剖面圖。 圖14為示意性地表示變形實施方式的切斷裝置（塊收容）的結構的圖。 圖15為表示所述實施方式的保持用板的更換動作的圖。 FIG. 1 is a diagram schematically showing the structure of a cutting device (tray storage) according to one embodiment of the present invention. FIG. 2 is a schematic diagram showing the operation of the cutting device according to the embodiment. FIG. 3 is a schematic diagram showing the structure of the holding plate and the holding base of the embodiment. FIG. 4 is a perspective view showing the plate conveying mechanism (plate taking-out/inserting mechanism) and the plate accommodating part of the embodiment. FIG. 5 is a cross-sectional view schematically showing the structure of the fixing mechanism of the embodiment. FIG. 6 is a perspective view showing the holding base of the second holding mechanism of the embodiment. FIG. 7 is a diagram showing the replacement operation of the holding plate according to the embodiment. FIG. 8 is a diagram showing the replacement operation of the holding plate according to the embodiment. FIG. 9 is a diagram schematically showing the structure of a cutting device according to a modified embodiment. FIG. 10 is a diagram schematically showing the structure of a cutting device (chain storage) according to a modified embodiment. 11 is (a) a plan view, (b) a cross-sectional view, and (c) a partially enlarged cross-sectional view schematically showing the structure of the attachment member. FIG. 12 is a diagram schematically showing the structure of a cutting device (tube storage) according to a modified embodiment. 13 is (a) a perspective view and (b) a cross-sectional view schematically showing the structure of a cylindrical container. FIG. 14 is a diagram schematically showing the structure of a cutting device (block storage) according to a modified embodiment. FIG. 15 is a diagram showing the replacement operation of the holding plate according to the embodiment.

2A、2B:切斷用工作台(加工用工作台、工作台) 2A, 2B: Cutting table (processing table, work table)

3:第一保持機構 3: The first holding mechanism

4:切斷機構(加工機構) 4: Cutting mechanism (processing mechanism)

5:移載工作台(板搬送機構) 5: Transfer workbench (plate transfer mechanism)

6:第二保持機構(搬送用保持機構、板搬送機構) 6: Second holding mechanism (holding mechanism for transportation, plate transportation mechanism)

7:搬送用移動機構(板搬送機構) 7: Moving mechanism for transportation (plate transportation mechanism)

8A、8B:切斷用移動機構 8A, 8B: Moving mechanism for cutting

9A、9B:旋轉機構 9A, 9B: Rotating mechanism

10:基板供給機構 10:Substrate supply mechanism

10a:基板收容部 10a:Substrate receiving part

10b:基板供給部 10b:Substrate supply department

11:心軸移動機構 11: Spindle moving mechanism

11a:支持體 11a:Support

12:攝像相機 12:Video camera

13:第一清潔機構 13:The first cleaning agency

14:檢查部 14:Inspection Department

15:移載用移動機構(板搬送機構) 15: Moving mechanism for transfer (plate transport mechanism)

15a:導軌 15a: Guide rail

16:反轉機構 16:Reversal mechanism

17:反轉用移動機構 17:Moving mechanism for reversal

17a:導軌 17a: Guide rail

18:第二清潔機構 18:Second cleaning mechanism

20:分類機構 20:Classification agency

21:托盤 21:Pallet

22:托盤移動機構 22:Pallet moving mechanism

22a:托盤載置部 22a:Pallet placement part

22b:導軌 22b: Guide rail

23:托盤收容部 23:Pallet storage department

24:板收容部 24: Board Containment Department

25:板搬送機構 25: Board transport mechanism

25a:第一搬送機構 25a: First transport mechanism

25b:第二搬送機構 25b: Second transport mechanism

25c:第三搬送機構 25c: Third transport mechanism

25d:板取出/放入機構 25d: Plate take-out/put-in mechanism

27:攝像相機 27:Video camera

40:旋轉工具 40: Rotary tool

41A、41B:刀片 41A, 41B: Blade

42A、42B:心軸部 42A, 42B: Spindle part

71:傳遞軸 71:Transmission shaft

100:切斷裝置(加工裝置) 100: Cutting device (processing device)

141:第一檢查部(檢查部) 141:First Inspection Department (Inspection Department)

142:第二檢查部(檢查部) 142:Second Inspection Department (Inspection Department)

161:保持工作台(檢查用工作台) 161: Maintain workbench (inspection workbench)

162:反轉部 162:Reversal Department

240:升降移動機構 240: Lifting and moving mechanism

251:板保持機構 251: Plate holding mechanism

252:取出/放入用移動機構 252: Moving mechanism for taking out/inserting

CTL:控制部 CTL:Control Department

M1:保持用板 M1: Holding plate

X1:移載位置 X1: transfer position

X2:取出位置 X2: take out position

X3:取出/放入位置 X3: take out/put in position

W:密封完畢基板(加工對象物) W: Sealed substrate (object to be processed)

RP:保持位置 RP: maintain position

X、Y、Z、θ:方向 X, Y, Z, θ: direction

Claims (15)

一種加工裝置，將加工對象物保持於加工用工作台上，使所述加工用工作台移動的同時，藉由加工機構對所述加工對象物進行加工，所述加工裝置包括：板收容部，收容用以保持所述加工對象物的保持用板；保持基部，以能夠裝卸的方式安裝有所述保持用板，使用所述保持用板來保持所述加工對象物；以及板搬送機構，於所述板收容部與所述保持基部之間搬送所述保持用板，所述板搬送機構將自所述保持基部卸除的所述保持用板搬送至所述板收容部，並將位於所述板收容部的所述保持用板搬送至所述保持基部，其中，所述板搬送機構搬送下述保持用板中的至少一個：所述加工用工作台的保持用板；用以將所述加工後的所述加工對象物加以乾燥的、乾燥用工作台的保持用板；用以對所述加工後的所述加工對象物進行檢查的、檢查用工作台的保持用板；於收容前載置所述加工後的所述加工對象物的、移載工作台的保持用板；或為了搬送所述加工後的所述加工對象物而進行保持的、搬送用保持機構的保持用板。 A processing device that holds an object to be processed on a processing workbench and processes the object to be processed by a processing mechanism while moving the workbench for processing, the processing device including: a plate receiving portion, A holding plate for holding the object to be processed is accommodated; a holding base portion to which the holding plate is detachably mounted is used to hold the object to be processed; and a plate transport mechanism is provided The holding plate is conveyed between the plate accommodating part and the holding base part, and the plate conveying mechanism conveys the holding plate removed from the holding base part to the plate accommodating part and places it there. The holding plate in the plate accommodating part is conveyed to the holding base, wherein the plate conveying mechanism conveys at least one of the following holding plates: a holding plate of the processing table; a holding plate for a drying workbench for drying the processed object; a holding plate for an inspection workbench for inspecting the processed object; and in storage a holding plate of a transfer table on which the processed object is placed; or a holding plate of a conveying holding mechanism that holds the processed object in order to convey it . 如請求項1所述的加工裝置，其中所述板搬送機構使所述保持用板上升並搬送。 The processing apparatus according to claim 1, wherein the plate transport mechanism lifts and transports the holding plate. 如請求項1或2所述的加工裝置，其中所述板搬送機構可搬送所述加工後的所述加工對象物。 The processing apparatus according to claim 1 or 2, wherein the plate transport mechanism can transport the processed object. 如請求項1或2所述的加工裝置，更包括：第一保持機構，為了將所述加工對象物搬送至所述加工用工作台而對所述加工對象物進行保持；第二保持機構，為了自所述加工用工作台搬送所述加工後的所述加工對象物而對所述加工後的所述加工對象物進行保持；以及搬送用移動機構，使所述第一保持機構及所述第二保持機構移動，所述板搬送機構是使用所述第二保持機構及所述搬送用移動機構而構成。 The processing device according to claim 1 or 2, further comprising: a first holding mechanism for holding the processing object in order to transport the processing object to the processing table; and a second holding mechanism, and holding the processed object to transport the processed object from the processing table; and a transport moving mechanism that causes the first holding mechanism and the The second holding mechanism moves, and the plate conveying mechanism is configured using the second holding mechanism and the conveying moving mechanism. 如請求項1或2所述的加工裝置，更包括：移載工作台，於收容前載置所述加工後的所述加工對象物；以及移載用移動機構，使所述移載工作台移動，所述板搬送機構是使用所述移載工作台及所述移載用移動機構而構成。 The processing device according to claim 1 or 2, further comprising: a transfer workbench to place the processed object before storage; and a transfer moving mechanism to move the transfer workbench To move, the plate transport mechanism is configured using the transfer table and the transfer moving mechanism. 如請求項5所述的加工裝置，其中所述板搬送機構更具有：板取出/放入機構，於所述板收容部與所述移載工作台之間搬送所述保持用板。 The processing device according to claim 5, wherein the plate transport mechanism further includes a plate take-out/insertion mechanism for transporting the holding plate between the plate accommodating part and the transfer table. 如請求項1或2所述的加工裝置，更包括：托盤搬送機構，搬送將經所述加工機構進行了單片化的所述加工對象物分類的托盤，將經所述單片化的所述加工對象物收容於所述托盤。 The processing device according to claim 1 or 2, further comprising: a pallet transport mechanism that transports pallets for sorting the processing objects that have been singulated by the processing mechanism, and separates all of the singulated objects. The object to be processed is stored in the tray. 如請求項1或2所述的加工裝置，更包括用以載置貼附構件的載置工作台，所述貼附構件具有用以貼附經所述加工機構進行了單片化的所述加工對象物的黏著面，將經所述單片化的所述加工對象物貼附於所述貼附構件並進行收容。 The processing device according to claim 1 or 2, further comprising a placement workbench for placing an attachment member, the attachment member having a position for attaching the said processing mechanism to single-piece The adhesive surface of the object to be processed attaches the individualized object to be processed to the attachment member and stores the object. 如請求項1或2所述的加工裝置，更包括用以設置筒狀容器的容器設置部，所述筒狀容器自一端開口部收容經所述加工機構進行了單片化的所述加工對象物，將經所述單片化的所述加工對象物收容於所述筒狀容器。 The processing device according to claim 1 or 2, further comprising a container setting portion for setting a cylindrical container, the cylindrical container receiving the processing object singulated by the processing mechanism from an opening at one end. The object to be processed is stored in the cylindrical container. 如請求項1或2所述的加工裝置，更包括：收容箱，供經所述加工機構進行了單片化的所述加工對象物掉落而收容，將經所述單片化的所述加工對象物收容於所述收容箱。 The processing device according to claim 1 or 2, further comprising: a storage box for dropping and storing the processing object that has been singulated by the processing mechanism, and storing the singulated object. The object to be processed is stored in the storage box. 如請求項1或2所述的加工裝置，更包括：檢查機構，檢查所述保持用板對所述保持基部的安裝狀態。 The processing device according to claim 1 or 2, further comprising: an inspection mechanism for inspecting the installation state of the holding plate to the holding base. 如請求項11所述的加工裝置，其中所述檢查機構具有：檢查用流路，於搭載有所述保持用板的搭載面開口；以及 探測感測器，設置於所述檢查用流路，探測流體自所述開口的洩漏。 The processing device according to claim 11, wherein the inspection mechanism has an inspection flow path opening on a mounting surface on which the holding plate is mounted; and A detection sensor is provided in the inspection flow path and detects fluid leakage from the opening. 如請求項1或2所述的加工裝置，其中所述保持基部具有：固定用圓筒部，插入至形成於所述保持用板的固定用插入孔，所述固定用圓筒部具有：圓筒本體，插入至所述固定用插入孔；可動件，以能夠移動至自所述圓筒本體的外側周面突出的位置及沒入的位置的方式設置；以及彈性體，以使所述可動件成為相對於所述圓筒本體突出的位置的方式賦予力，於所述固定用圓筒部插入至所述固定用插入孔的狀態下，所述可動件成為突出的狀態，藉此對所述保持基部固定所述保持用板。 The processing device according to claim 1 or 2, wherein the holding base has a fixing cylindrical part inserted into a fixing insertion hole formed in the holding plate, and the fixing cylindrical part has a round a cylindrical body inserted into the fixing insertion hole; a movable member movable to a position protruding from the outer peripheral surface of the cylindrical body and a position recessed; and an elastic body movable. The force is applied in such a manner that the movable member becomes a protruding position relative to the cylindrical body. When the fixing cylindrical part is inserted into the fixing insertion hole, the movable member becomes in a protruding state, thereby causing the movable member to protrude. The holding base fixes the holding plate. 如請求項1或2所述的加工裝置，其中所述板搬送機構具有：搬送用圓筒部，插入至形成於所述保持用板的搬送用保持孔，所述搬送用圓筒部具有：圓筒本體，插入至所述搬送用保持孔；可動件，以能夠移動至自所述圓筒本體的外側周面突出的位置及沒入的位置的方式設置；以及彈性體，以使所述可動件成為相對於所述圓筒本體突出的位置的方式賦予力，於所述搬送用圓筒部插入至搬送用插入孔的狀態下，所述可動件成為突出的狀態，藉此將所述保持用板保持於所述板搬送機構。 The processing device according to claim 1 or 2, wherein the plate conveyance mechanism has a conveyance cylindrical portion inserted into a conveyance holding hole formed in the holding plate, and the conveyance cylindrical portion has: a cylindrical body inserted into the holding hole for transportation; a movable member disposed so as to be movable to a position protruding from the outer peripheral surface of the cylindrical body and a position recessed; and an elastic body so that the The movable element is energized in such a manner that it protrudes relative to the cylindrical body. When the conveyance cylindrical portion is inserted into the conveyance insertion hole, the movable element protrudes, whereby the movable element protrudes. The holding plate is held by the plate transport mechanism. 一種加工品的製造方法，使用如請求項1至請求項14中任一項所述的加工裝置來製造加工品。 A method of manufacturing a processed product using the processing device according to any one of claims 1 to 14.
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