TWI830259B - Processing device and method of manufacturing processed product - Google Patents

Abstract

The present invention does not require a moving mechanism to move the processing table, and stores the individualized processing objects in a cylindrical container. The invention includes: a processing table to hold the processing objects; and a first holding mechanism to hold the processing objects. The object to be processed is transported to the processing table and held therein; a processing mechanism cuts the object to be processed held on the processing table into individual pieces; and the transfer table is moved individually by the processing mechanism. the pieced object to be processed; and a second holding mechanism that holds the pieced object in order to transport the object to be processed from the processing table to the transfer table. The object to be processed; a moving mechanism for transport, having a common transmission shaft extending along the arrangement direction of the processing table and the transfer table and for moving the first holding mechanism and the second holding mechanism. ; Processing moving mechanism to move the processing mechanism on the horizontal plane in the first direction along the transmission axis and in the second direction orthogonal to the first direction; the container setting part is used to set the automatic a cylindrical container with an opening at one end for accommodating the individualized processing objects; and a transport and storage mechanism for transporting the individualized processing objects from the transfer table to a location provided The cylindrical container is stored on the container setting part.

Description

Processing device and method of manufacturing processed product

The present invention relates to a processing device and a method for manufacturing processed products.

Previously, as shown in Patent Document 1, in a cutting system, a structure in which a strip picker moves in the X-axis direction and transfers a semiconductor strip from a loading device to a cutting device has been considered. The chuck table absorbs the semiconductor strip and moves it to the rear of the system in the Y-axis direction. After that, the semiconductor strip is cut into semiconductor packages by a mandrel. In addition, the chuck table is configured to move in the Y-axis direction using a ball screw (ball screw mechanism). Furthermore, as a member for accommodating the cut semiconductor package, as shown in Patent Document 2, a member accommodated in a rectangular tube-shaped transparent case called a stick can be considered.

However, in the cutting system, since the ball screw is used to move the chuck table for cutting, during actual cutting, as shown in Patent Document 3, for example, it is necessary to provide a protection device for the ball screw from processing. The bellows member affected by water or machining debris further requires a plurality of plate members to be provided on the bellows member in order to protect the bellows member. As a result, the device structure becomes complicated.

In addition, in the cutting system, the semiconductor strip is moved not only in the X-axis direction but also in the Y-axis direction to the rear of the system in order to cut the semiconductor strip, so the footprint of the device becomes larger. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2007-536727 [Patent Document 2] Japanese Patent Application Publication No. Sho 63-131902 [Patent Document 3] Japanese Patent Application Laid-Open No. 2004-186361

[Problem to be solved by the invention]

Therefore, the present invention is made to solve the above-mentioned problems, and its main object is to accommodate the individualized processing objects in a cylindrical container without requiring a moving mechanism for moving the processing table holding the processing object. [Means to solve the problem]

That is, the processing apparatus of the present invention is characterized by including: a processing table that holds an object to be processed; a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; and a processing mechanism that holds the object to be processed. The object to be processed held on the processing table is cut into pieces; the transfer table moves the object to be processed into pieces by the processing mechanism; and the second holding mechanism is to separate the object into pieces. The singulated object to be processed is transported from the processing table to the transfer table to hold the object to be processed into individual pieces; a transport moving mechanism has a moving mechanism along the processing table and A common transmission axis extends in the arrangement direction of the transfer table and is used to move the first holding mechanism and the second holding mechanism; a processing moving mechanism allows the processing mechanism to move along the horizontal plane The transmission shaft moves in a first direction and a second direction orthogonal to the first direction respectively; a container setting part is used to set a cylinder for receiving the singulated object to be processed from an opening at one end. a container; and a transport and storage mechanism that transports the individualized processing objects from the transfer table to and stores the cylindrical container provided on the container setting part. [Effects of the invention]

According to the invention configured in this way, it is possible to accommodate the individualized processing objects in the cylindrical container without the need for a moving mechanism for moving the processing table holding the processing object.

Next, the present invention will be described in more detail using examples. However, the present invention is not limited by the following description.

As described above, the processing apparatus of the present invention is characterized by including: a processing table that holds the object to be processed; and a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; a mechanism that cuts and separates the object to be processed held on the processing table; a transfer table that moves the object to be processed that is separated into individual pieces by the processing mechanism; and a second holding mechanism to transporting the singulated object to be processed from the processing table to the transfer table and retaining the singulated object to be processed; and a transport moving mechanism having a moving mechanism along the A common transmission shaft extends in the arrangement direction of the processing table and the transfer table and is used to move the first holding mechanism and the second holding mechanism; a processing moving mechanism to move the processing mechanism on a horizontal plane Move along the first direction of the transmission axis and the second direction orthogonal to the first direction respectively; a container setting part is used to set the single-piece processing object from the opening at one end. a cylindrical container of objects; and a transport and storage mechanism that transports the singulated object to be processed from the transfer table to the cylindrical container provided on the container setting part for storage.

In the above-mentioned processing device, a structure is adopted in which the first holding mechanism and the second holding mechanism are moved by a common transmission shaft extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism is used to perform processing. The mechanism moves respectively in the first direction along the transmission axis and the second direction orthogonal to the first direction on the horizontal plane, so the processing object can be processed without moving the processing table in the first direction and the second direction. Monolithization of things. Therefore, the processing table can be moved without using a ball screw mechanism or the like, and a bellows member for protecting the ball screw mechanism or the like and a cover member for protecting the bellows member are not required. As a result, the device structure of the processing device can be simplified. In addition, since the processing table is configured not to move in the first direction and the second direction on the horizontal plane, the movement space of the processing table and the useless space around it can be reduced, and the occupied area of the processing device can be reduced. Furthermore, the individualized processing objects can be transported from the transfer stage to the cylindrical container provided on the container setting part by the transportation and storage mechanism, and the individualized objects can be accommodated from the one end opening of the cylindrical container. Processing object.

As a specific arrangement aspect of the transmission shaft and the processing moving mechanism, it is desirable that the transmission shaft is arranged above the processing moving mechanism and crosses the processing moving mechanism. According to the above structure, the first holding mechanism that moves along the transmission axis can be moved above the processing moving mechanism, thereby preventing physical interference between the first holding mechanism and the processing moving mechanism. In addition, the second holding mechanism that moves along the transmission axis can be moved above the processing moving mechanism, thereby preventing physical interference between the second holding mechanism and the processing moving mechanism.

As a specific embodiment of the transport and accommodating mechanism, it is desirable that the transport and accommodating mechanism includes: an intermediate table for temporarily placing the singulated object to be processed; and a first transport mechanism for transferring the single-piece processing object. The pieced processing object is transported from the transfer stage to the intermediate stage; and a second conveying mechanism transports the individualized processing object from the intermediate stage to the intermediate stage. The cylindrical container is stored on the container setting part.

In order to confirm or inspect the state of the individualized processing objects, it is desirable to further include an imaging unit that captures the individualized processing objects held by the first conveying mechanism. , or the singulated processing object placed on the transfer stage is photographed.

In order to automatically determine whether the individualized processing object is a good product or a defective product, it is desirable to further include a determination unit that performs the singulation process using the imaging data obtained by the imaging unit. The quality judgment of the processing object.

In order to automatically classify good products and defective products based on the judgment results of the judgment unit, it is desirable to further include a classification mechanism that classifies the processed individual pieces that are judged to be defective products by the judgment unit. Classify objects.

As a specific arrangement aspect of the sorting mechanism, it is desirable that the sorting mechanism is provided in the second transport mechanism.

As a specific embodiment of the sorting mechanism, it is desirable that the sorting mechanism guides the singulated processing object determined as a good product by the determination unit to a good product line of the cylindrical container, Switching is performed between a defective product route for discarding the processing object determined as a defective product by the determination unit to a waste container.

As a specific embodiment of the moving mechanism that moves the processing mechanism in at least the X direction as the first direction and the Y direction as the second direction, it is desirable that the processing moving mechanism includes an X-direction moving portion that moves The processing mechanism moves linearly in the X direction; and the Y direction moving part makes the processing mechanism linearly move in the Y direction. The X direction moving part has: a pair of and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving part. According to the above structure, since the pair of X-direction guide rails provided in the X-direction are provided across the processing table, the distance between the pair of X-direction guide rails can be increased. As a result, the influence on processing caused by the positional deviation of the X-direction guide rails in the Z-direction can be reduced. That is, the deviation of the orthogonality between the rotating tool (such as a blade) and the machining table can be reduced, and machining accuracy can be improved. In addition, for the X-direction guide rail, a guide rail with a lower specification than before can be used.

In addition, a method for manufacturing a processed product using the processing device is also an aspect of the present invention.

<One embodiment of the present invention> Hereinafter, one embodiment of the processing device of the present invention will be described with reference to the drawings. In addition, any of the figures shown below are omitted as appropriate or schematically drawn in an exaggerated manner for easy understanding. The same components are labeled with the same symbols, and descriptions are omitted where appropriate.

＜Overall structure of processing equipment＞ The processing device 100 of this embodiment is a cutting device that cuts the sealed substrate W as the processing object into individual pieces into a plurality of products P as the processed product.

Here, the sealed substrate W is a substrate to which electronic components such as semiconductor wafers, resistive elements, and capacitor elements are connected, and is formed by resin molding so as to resin seal at least the electronic components. As the substrate constituting the sealed substrate W, a lead frame or a printed wiring board can be used. In addition to these, a semiconductor substrate (including a semiconductor wafer such as a silicon wafer), a metal substrate, a ceramic substrate, a glass substrate can also be used. substrate, resin substrate, etc. In addition, wiring may or may not be implemented on the substrate constituting the sealed substrate W.

In addition, one of the surfaces of the sealed substrate W and product P of this embodiment becomes the mounting surface used for subsequent mounting. In the description of this embodiment, one of the surfaces used for mounting later will be described as the "mounting surface", and the surface on the opposite side will be described as the "opposite surface".

Specifically, as shown in FIG. 1 , the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W; and a first holding mechanism 3 that transports the sealed substrate W to The cutting tables 2A and 2B hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 cuts the sealed substrate W held on the cutting tables 2A and 2B; and moves The carrier 5 moves a plurality of products P; the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5; the transfer movement The mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 to hold the cutting mechanism 4 relative to the cutting mechanism. The sealed substrate W of the cutting table 2A and the cutting table 2B moves. Furthermore, the first holding mechanism 3 and the conveying moving mechanism 7 constitute a conveying mechanism (loader) for conveying the sealed substrate W, and the second holding mechanism 6 and the conveying moving mechanism 7 constitute a conveying mechanism for conveying the plurality of products P. (Unloader).

In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively referred to as the X direction as the first direction and the second direction. In the Y direction, let the vertical direction orthogonal to the X direction and the Y direction be the Z direction. Specifically, let the left-right direction in FIG. 1 be the X direction, and let the up-down direction be the Y direction. Although it will be described later, the X direction is the moving direction of the support body 812 and is a direction orthogonal to the longitudinal direction (the direction in which the beam portion extends) of the beam portion (cross beam portion) of the door-shaped support body 812 that spans a pair of legs. (Refer to Figure 2 and Figure 3).

<Cutting table 2A, cutting table 2B> The two cutting tables 2A and 2B are fixedly installed in the X direction, the Y direction, and the Z direction. Furthermore, the cutting table 2A can be rotated in the θ direction by the rotation mechanism 9A provided below the cutting table 2A. In addition, the cutting table 2B can be rotated in the θ direction by the rotation mechanism 9B provided below the cutting table 2B.

These two cutting tables 2A and 2B are installed along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged so that their upper surfaces are on the same horizontal plane (at the same height position in the Z direction) (see FIG. 4 ), and the center of the upper surfaces ( Specifically, they are arranged so that the rotation centers of the rotating mechanisms 9A and 9B are located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

In addition, the two cutting tables 2A and 2B suction and hold the sealed substrate W. As shown in FIG. 1 , two vacuum pumps 10A and 10B are arranged corresponding to the two cutting tables 2A and 2B for suction and holding. Each of the vacuum pumps 10A and 10B is, for example, a water-sealed vacuum pump.

Here, since the cutting table 2A and the cutting table 2B are fixed in the XYZ direction, the pipes (not shown) connected from the vacuum pump 10A and the vacuum pump 10B to the cutting table 2A and the cutting table 2B can be shortened. , which can reduce the pressure loss in the piping and prevent the reduction of adsorption force. As a result, even an extremely small package, for example, 1 mm square or less, can be reliably attracted to the cutting tables 2A and 2B. In addition, it is possible to prevent the reduction in adsorption force due to pressure loss in the piping, so that the capacity of the vacuum pump 10A and the vacuum pump 10B can be reduced, which contributes to downsizing and cost reduction.

<First holding mechanism 3> As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting stages 2A and 2B. As shown in FIGS. 5 and 6 , the first holding mechanism 3 has: an adsorption head 31 provided with a plurality of adsorption portions 311 for adsorbing and holding the sealed substrate W; and a vacuum pump (not shown) connected to the adsorption unit. The suction part 311 of the head 31. Then, the suction head 31 is moved to a desired position by the conveyance moving mechanism 7 described below, etc., thereby conveying the sealed substrate W from the substrate supply mechanism 11 to the cutting stages 2A and 2B.

As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating part 111 for accommodating a plurality of sealed substrates W from the outside; and a substrate supply part 112 for moving the sealed substrates W accommodated in the substrate accommodating part 111 to a first position. A holding mechanism 3 adsorbs and holds the holding position RP. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. Furthermore, the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W adsorbed by the first holding mechanism 3 in order to make the sealed substrate W soft and easy to adsorb.

＜Cutting mechanism 4＞ As shown in FIGS. 1 , 2 , and 3 , the cutting mechanism 4 as a processing mechanism includes two rotating tools 40 including a blade 41A, a blade 41B, and two spindle portions 42A and 42B. The two spindle parts 42A and 42B are provided with their rotation axes along the Y direction, and the blades 41A and 41B attached to the spindle parts are arranged to face each other (see FIG. 3 ). The blade 41A of the spindle part 42A and the blade 41B of the spindle part 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in the plane including the X direction and the Z direction. Furthermore, as shown in FIG. 4 , the cutting device 100 of this embodiment is provided with a liquid supply mechanism 12 having a function of injecting cutting water in order to suppress the frictional heat generated by the blades 41A and 41B (processing). liquid) injection nozzle 121. The injection nozzle 121 is supported by, for example, a Z-direction moving portion 83 described below.

＜Transfer stage 5＞ As shown in FIG. 1 , the transfer stage 5 of this embodiment is a stage that moves a plurality of products P inspected by an inspection unit 13 to be described later. The transfer table 5 is called a so-called index table, and a plurality of products P are temporarily placed thereon. In addition, as shown in FIGS. 1 and 9 , the transfer stage 5 is provided movably in the Y direction, and is located at the transfer position X1 where a plurality of products P are placed by the second holding mechanism 6 and by the transport and storage mechanism 22 The plurality of products P are transported between the take-out positions X2. Furthermore, the transfer position X1 is set closer to the front side than the transfer shaft 71 and is arranged in line with the two cutting tables 2A and 2B on the horizontal plane in the X direction, and the take-out position X2 is set closer to the transfer shaft 71 . The shaft 71 is further inside.

＜Inspection Department 13＞ Here, as shown in FIG. 1 , the inspection unit 13 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection unit 13 of this embodiment includes a first inspection unit 131 that inspects the opposite surface of the product P, and a second inspection unit 132 that inspects the mounting surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the opposite surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. Furthermore, the first inspection part 131 and the second inspection part 132 may be shared.

In addition, in order to enable the inspection unit 13 to inspect both sides of the plurality of products P, an inversion mechanism 14 for inverting the plurality of products P is provided (see FIG. 1 ). The reversal mechanism 14 includes a holding base 141 that holds a plurality of products P, and a reversing portion 142 such as a motor that reverses the holding base 141 so that the front and back thereof are reversed.

When the second holding mechanism 6 holds a plurality of products P from the processing tables 2A and 2B, the opposite surface of the products P faces downward. In this state, while the plurality of products P are being transported from the processing tables 2A and 2B to the reversing mechanism 14 , the opposite surface of the products P is inspected by the first inspection unit 131 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 . During this movement, the mounting surface of the product P facing downward is inspected by the second inspection unit 132 . Thereafter, the product P is transferred to the transfer table 5 .

<Second holding mechanism 6> As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the holding table 141 or the transfer table 5 . As shown in FIG. 8 , the second holding mechanism 6 includes: an adsorption head 61 provided with a plurality of adsorption portions 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the adsorption head 61 . Adsorption part 611. Then, the adsorption head 61 is moved to a desired position by the conveyance moving mechanism 7 described below, etc., thereby conveying the plurality of products P from the cutting table 2A and the cutting table 2B to the holding table 141 or the transfer table. 5.

＜Transportation moving mechanism 7＞ As shown in FIG. 1 , the transport moving mechanism 7 moves the first holding mechanism 3 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B. The table 2A, the cutting table 2B and the holding table 141 move among each other.

Furthermore, as shown in FIG. 1 , the transport moving mechanism 7 has a common transmission shaft 71 along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5 . Extending in a straight line, it is used to move the first holding mechanism 3 and the second holding mechanism 6 .

The transmission shaft 71 is provided in a range in which the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer stage 5 (see Figure 1). In addition, with respect to the transmission shaft 71 , the first holding mechanism 3 , the second holding mechanism 6 , the cutting table 2A, the cutting table 2B, and the transfer table 5 are provided on the same side (the near side) in plan view. In addition, the inspection part 13 , the reversing mechanism 14 , the first cleaning mechanism 18 and the second cleaning mechanism 19 described below, and the container installation part 21 are also provided on the same side (the near side) with respect to the transmission shaft 71 .

Furthermore, as shown in FIGS. 5 , 6 and 8 , the transport moving mechanism 7 has: a main moving mechanism 72 for moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transmission shaft 71 ; and a lifting and lowering mechanism. The moving mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal movement mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move relative to the transmission shaft. 71 moves horizontally in the Y direction.

As shown in Figures 5 to 8, the main moving mechanism 72 has: a common guide rail 721, which is provided on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 are moved along the guide rail 721 .

The guide rail 721 extends in a straight line in the X direction along the transmission shaft 71 , and is provided in a range where the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 , and is similar to the transmission shaft 71 . The second holding mechanism 6 can move above the transfer platform 5 . A sliding member 723 is slidably provided on the guide rail 721 , and the sliding member 723 is provided with a first holding mechanism 3 and a second holding mechanism 6 via a lifting and lowering movement mechanism 73 and a horizontal movement mechanism 74 . Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6 , but the lifting and lowering movement mechanism 73 , the horizontal movement mechanism 74 and the sliding member 723 are specific to each of the first holding mechanism 3 and the second holding mechanism 6 . Set individually.

The rack and pinion mechanism 722 has: a cam rack 722a, which is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b, which is respectively provided in the first holding mechanism 3 and the second holding mechanism 6. Rotated by an actuator (not shown). The cam rack 722a is provided on the common transmission shaft 71 and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723 and is called a so-called roller pinion. As shown in FIG. 7, it has a pair of roller bodies 722b1 that rotate together with the rotation axis of the motor; A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are configured to be able to roll relative to the roller body 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion. Therefore, two or more roller pins 722b2 are in contact with the cam rack 722a, and no backlash is generated in the forward and reverse directions, which facilitates operation. When the first holding mechanism 3 and the second holding mechanism 6 move in the X direction, the positioning accuracy becomes better.

As shown in FIGS. 5 and 8 , the lifting and lowering movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the lifting and lowering movement mechanism 73 of the first holding mechanism 3 is interposed between the transmission shaft 71 (specifically, the main movement mechanism 72 ) and the first holding mechanism 3 , and has: Z The direction guide rail 73a is provided along the Z direction; and the actuator portion 73b moves the first holding mechanism 3 along the Z direction guide rail 73a. Furthermore, the actuator part 73b may use a ball screw mechanism, a cylinder, or a linear motor, for example. Furthermore, as shown in FIG. 8 , the structure of the lifting and lowering movement mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and lowering movement mechanism 73 of the first holding mechanism 3 .

As shown in FIGS. 5 , 6 and 8 , the horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transmission shaft 71 (specifically, the lifting movement mechanism 73 ) and the first holding mechanism 3 and has: The Y-direction guide rail 74a is provided along the Y-direction; the elastic body 74b applies force to the first holding mechanism 3 to one side of the Y-direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move toward one side of the Y-direction guide rail 74a. Move on the other side. Here, an eccentric cam is used as the cam mechanism 74c. By rotating the eccentric cam using an actuator such as a motor, the movement amount of the first holding mechanism 3 in the Y direction can be adjusted.

Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3 . In addition, the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74 , and the first holding mechanism 3 and the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74 . Furthermore, like the up-and-down movement mechanism 73 , the horizontal movement mechanism 74 may not use the cam mechanism 74 c but may use, for example, a ball screw mechanism, a cylinder, or a linear motor.

<Moving mechanism for cutting 8 (moving mechanism for processing)> The cutting moving mechanism 8 linearly moves each of the two spindle portions 42A and 42B in each of the X direction, the Y direction, and the Z direction.

Specifically, as shown in FIGS. 2 , 3 and 4 , the moving mechanism 8 for cutting includes an X-direction moving part 81 that linearly moves the spindle parts 42A and 42B in the X direction; and moves in the Y direction. The part 82 linearly moves the spindle parts 42A and 42B in the Y direction; and the Z-direction moving part 83 linearly moves the spindle parts 42A and 42B in the Z direction.

The X-direction moving part 81 is shared by the two cutting tables 2A and 2B. As shown in FIGS. 2 and 3 , the X-direction moving part 81 has a pair of X-direction guide rails 811 across the two cutting tables 2A along the X direction. , 2B; and the support body 812 moves along the pair of X-direction guide rails 811 and supports the spindle parts 42A and 42B via the Y-direction moving part 82 and the Z-direction moving part 83. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. In addition, the support body 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of legs extending upward from a pair of X-direction guide rails 811 and a beam (crossbeam) extending along the Y-direction and extending across the pair of legs.

Furthermore, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a driving source (not shown) such as a servo motor. In addition, the support body 812 may also be configured to reciprocate by a linear motor or other linear motion mechanism.

Especially as shown in FIG. 3 , the Y-direction moving part 82 has a Y-direction guide rail 821 provided along the Y-direction in the support body 812 and a Y-direction slider 822 that moves along the Y-direction guide rail 821 . The Y-direction slider 822 is driven by a linear motor 823, for example, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 can also be configured to reciprocate by using other linear motion mechanisms such as ball screw mechanisms.

As shown in FIGS. 2 to 4 , the Z-direction moving part 83 has a Z-direction guide rail 831 provided in each Y-direction slider 822 along the Z-direction; and a Z-direction slider 832 along the Z-direction guide rail 831 The spindle parts 42A and 42B are moved and supported. That is, the Z-direction moving part 83 is provided corresponding to each of the spindle parts 42A and 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and moves linearly back and forth on the Z-direction guide rail 831 . In addition, the Z-direction slider 832 can also be configured to move back and forth by other linear motion mechanisms such as a ball screw mechanism.

Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71 , as shown in FIGS. 1 and 4 , the transmission shaft 71 is arranged above the cutting moving mechanism 8 and traverses the cutting moving mechanism 8 . . Specifically, the transmission shaft 71 is disposed above the support body 812 and crosses the support body 812 , and the transmission shaft 71 and the support body 812 have a mutually intersecting positional relationship.

＜Machining waste storage part 17＞ In addition, as shown in FIG. 1 , the cutting device 100 of this embodiment further includes a processing waste storage portion 17 that stores processing waste S such as end materials generated when the sealed substrate W is cut.

As shown in FIGS. 2 to 4 , the processing chip storage portion 17 is provided below the cutting tables 2A and 2B, and has a guide chute 171 surrounding the cutting table 2A in plan view. , the upper opening 171X of the cutting table 2B; and the recovery container 172 for recovering the processing chips S guided by the guide chute 171 . By arranging the processing waste storage portion 17 below the cutting tables 2A and 2B, the recovery rate of the processing waste S can be improved.

The guide chute 171 guides the processing chips S scattered or dropped from the cutting tables 2A and 2B to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A and 2B (see FIG. 3 ). Therefore, the processing chips S are less likely to be missed, and the processing chips S can be further increased. recovery rate. In addition, the guide chute 171 is provided to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4 ) to protect the rotating mechanisms 9A and 9B. It is constructed to protect it from the influence of machining chips S and cutting water.

In this embodiment, the processing chip receiving part 17 is shared by the two cutting tables 2A and 2B, but may be provided corresponding to the cutting table 2A and the cutting table 2B respectively.

The recovery container 172 collects the processing chips S that have passed through the guide chute 171 due to its own weight. In the present embodiment, as shown in FIG. 4 and others, the recovery container 172 is provided corresponding to the two cutting tables 2A and 2B. Furthermore, the two recovery containers 172 are arranged on the front side of the transmission shaft, and are configured to be independently detachable from the front side of the cutting device 100 . With this structure, maintenance such as disposal of machining chips S can be improved. Furthermore, the recovery container 172 may be provided as a whole under all the cutting tables, taking into account the size of the sealed substrate W, the size and amount of the processing chips S, workability, etc., or may be divided into three or more and provided.

In addition, as shown in FIG. 4 and others, the machining chip storage portion 17 has a separation portion 173 that separates cutting water and machining chips S. As a structure of the separation unit 173 , for example, a filter such as a porous plate that allows cutting water to pass is provided on the bottom surface of the recovery container 172 . The separation part 173 makes it possible to collect the machining chips S without accumulating cutting water in the recovery container 172 .

＜First Cleaning Mechanism 18＞ In addition, as shown in FIGS. 1 and 5 , the cutting device 100 of the present invention further includes a first cleaning mechanism 18 . The first cleaning mechanism 18 cleans a plurality of cutting tables held on the cutting tables 2A and 2B. Clean the upper surface side (mounting surface) of product P. The first cleaning mechanism 18 uses a spray nozzle 18 a (see FIG. 5 ) that sprays cleaning fluid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. to clean the upper surface side of product P.

As shown in FIG. 5 , the first cleaning mechanism 18 is configured to move along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on the sliding member 723 which slides on the guide rail 721 provided on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the sliding member 723, an up-and-down movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided. As the lifting and lowering movement mechanism 181 , for example, it may be considered to use a rack and pinion mechanism, a ball screw mechanism, or a cylinder.

＜Second cleaning mechanism＞ Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (opposite surface) of the plurality of products P held by the second holding mechanism 6 . ) for cleaning. The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection part 13, and injects cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. The lower surface side of product P is cleaned. That is, while the second holding mechanism 6 is moving along the transmission shaft 71 , the second cleaning mechanism 19 cleans the lower surface side of the product P.

＜Containment structure＞ Furthermore, the cutting device 100 of this embodiment is configured to accommodate a plurality of products P in the cylindrical container 20 (also referred to as “tube accommodation”). Furthermore, the cylindrical container 20 may be called a tube, a magazine stick, a stick magazine, a stick, or the like.

Specifically, as shown in FIGS. 1 , 9 , 10(a) and 10(b) , the cutting device 100 includes a container setting part 21 for setting a plurality of products from the one end opening 20x. The cylindrical container 20 of P; and the transport and storage mechanism 22 transport and store a plurality of products P from the transfer table 5 to the cylindrical container 20 provided on the container installation part 21.

The container installation part 21 is provided with an empty cylindrical container 20 that does not contain the product P, and the product P is inserted from the one end opening 20x of the cylindrical container 20 by the transport and storage mechanism 22 .

As shown in FIGS. 1 and 9 , the container setting part 21 of this embodiment includes an empty container receiving part 211 for accommodating an empty cylindrical container 20 , and an insertion position setting part 212 for feeding the empty cylinder from the empty container receiving part 211 . and the empty cylindrical container 20 is placed at an insertion position where the product P is inserted from the one end opening 20x; and the stored container storage portion 213 is used to store the fully loaded product P or a desired number of stored products. Cylindrical container 20.

Here, as shown in FIG. 10 , the cylindrical container 20 accommodates a plurality of products P arranged in a row. Specifically, the cylindrical container 20 has a linearly extending shape and has a space for accommodating the product P inside. In addition, the cross-sectional shape orthogonal to the longitudinal direction of the cylindrical container corresponds to the cross-sectional shape of the product P. Furthermore, the cylindrical container 20 shown in FIG. 10 has a structure in which a part of the side peripheral wall extending in the longitudinal direction is left open, but it may also have a structure in which the side peripheral wall is closed. In addition, the cylindrical container 20 may have a structure in which a plurality of products P are stored in a state arranged in a plurality of rows, in addition to a structure in which a plurality of products P are arranged in a row. Furthermore, the cylindrical container 20 may be made of resin or metal. In addition, FIG. 10 shows a form with leads as the product P, but it may also be a leadless type such as Quad Flat No-Lead (QFN).

As shown in FIGS. 1 and 9 , the transport and storage mechanism 22 includes an intermediate table 23 for temporarily placing a plurality of products P; and a first transport mechanism 24 for transporting a plurality of products P from the transfer table 5 in the take-out position to the middle. The stage 23; and the second conveying mechanism 25 transport a plurality of products P from the intermediate stage 23 to the cylindrical container 20 provided in the insertion position setting part 212 of the container setting part 21 for storage.

The intermediate table 23 transports the product P from the transfer table 5 at the take-out position X2 via the first transport mechanism 24 and temporarily places it thereon. In addition, the product P temporarily placed on the intermediate table 23 is conveyed to the cylindrical container 20 provided on the container installation part 21 by the second conveyance mechanism 25 . The intermediate table 23 in this embodiment is fixed in the X direction and the Y direction, but may be configured to be movable.

The first conveyance mechanism 24 conveys a predetermined number (for example, one) of a plurality of products P from the transfer stage 5 moved to the take-out position X2 to the intermediate stage 23 .

Specifically, as shown in FIGS. 9 and 11 , the first conveyance mechanism 24 includes: a product adsorption mechanism 241 that adsorbs a predetermined number (for example, one) of a plurality of products P held on the transfer table 5 ; and an adsorption movement. Mechanism 242 moves the product adsorption mechanism 241 along the X direction.

As shown in FIG. 11 , the product adsorption mechanism 241 includes: an adsorption head 241A provided with an adsorption portion 241 a for adsorbing and holding a plurality of products P; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption head 241A. Section 241a. This product adsorption mechanism 241 is configured such that each adsorption portion 241a adsorbs one product P. In addition, the plurality of adsorption portions 241a are configured to move up and down independently of each other, and each adsorption portion 241a is lowered to adsorb the product P individually.

As shown in FIG. 11 , the suction moving mechanism 242 includes an X-direction moving part 242a that moves the product suction mechanism 241 in the X direction, and a Z-direction moving part 242b that moves the product suction mechanism 241 in the Z direction. Furthermore, the suction moving mechanism 242 may have a Y-direction moving part that moves the product suction mechanism 241 in the Y direction.

The X-direction moving part 242a has an X-direction guide rail 242a1 provided along the X direction on the inner side of the transmission shaft 71, and a support body 242a2 that moves along the X-direction guide rail 242a1 and supports the product suction mechanism 241 via the Z-direction moving part 242b. Furthermore, the support body 242a2 linearly reciprocates along the X direction on the X direction guide rail 242a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servo motor. In addition, the support body 242a2 may also be configured to reciprocate by a linear motor or other linear motion mechanism.

As shown in FIG. 11 , the Z-direction moving part 242b has: a Z-direction guide rail 242b1, which is provided along the Z-direction on the support body 242a2; and a Z-direction slider 242b2, which moves along the Z-direction guide rail 242b1 and supports the product adsorption mechanism 241 . Furthermore, the Z-direction slider 242b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 242b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction. In addition, the Z-direction slider 242b2 may also be configured to reciprocate by a linear motor or other linear motion mechanism.

As shown in FIGS. 9 and 12 , the second transport mechanism 25 transports the product P placed on the intermediate table 23 to the cylindrical container 20 provided in the insertion position setting part 212 of the container setting part 21 , and removes the product from the cylindrical container 20 . The product P is inserted into the one end opening 20x of the container 20 and accommodated therein.

Specifically, the second conveyance mechanism 25 has a product guide part 251 that guides the product P to the one end opening 20x of the cylindrical container 20, and a product moving part 252 that moves the product P toward the cylindrical shape. The one end opening 20x of the container 20 moves.

The product guide 251 arranges and guides the products P to the cylindrical container 20 . Since the cylindrical container 20 of this embodiment is provided along the Y direction, the product guide 251 is also provided along the Y direction. In this embodiment, the container setting part 21 is provided on the front side of the transmission shaft 71 and the intermediate table 23 is provided on the back side of the transmission shaft 71 . Therefore, the product guide part 251 is perpendicular to the transmission shaft 71 below the transmission shaft 71 .

The product moving part 252 has a pressing member 252a that presses the product P, and a driving part 252b that moves the pressing member 252a in the Y direction. Furthermore, as the driving part 252b, for example, a ball screw mechanism, a cylinder, or a linear motor may be used.

＜Defective product classification function＞ The cutting device 100 of this embodiment has the function of inspecting the quality of a plurality of products P and classifying defective products.

Specifically, as shown in FIGS. 1 , 9 and 12 , the cutting device 100 further includes: an imaging unit 26 that photographs a plurality of products P; and a determination unit 27 that uses the imaging data obtained by the imaging unit 26 to perform The quality determination of a plurality of products P; and the classification mechanism 28 classifies the products P determined as defective products by the determination unit 27 .

The imaging unit 26 is an imaging camera that photographs the product P held by the product adsorption mechanism 241 of the first conveyance mechanism 24 from below, and photographs the lower surface (opposite surface) of the product P. In addition, another imaging unit may be used to photograph, for example, the upper surface (mounting surface) of the product P placed on the transfer table 5 .

The determination unit 27 uses the imaging data obtained by the imaging unit 26 to detect defects in the product P (for example, lead bends, lack of resin filling, air bubbles, etc.), and determines the quality of the product P. This determination unit 27 includes a control unit CTL.

The sorting mechanism 28 is provided in the second conveying mechanism 25 and, as shown in FIG. 12 , guides the product P determined to be a defective product by the determination part 27 to a good product route R1 of the cylindrical container 20 and is used to guide the product P determined to be a defective product by the determination part 27 Switching is performed between the discarded product P and the defective product route R2 of the discard container 29 .

Specifically, the sorting mechanism 28 is provided in a part of the product guide part 251 and switches between the good product route R1 and the defective product route R2. The sorting mechanism 28 of this embodiment has a rotary table 281 for placing the product P, and a moving mechanism 282 for moving the product P from the rotary table 281 to each of the routes R1 and R2. The rotation of the rotary table 281 switches the good products. Route R1 and defective product route R2. Here, the good product route R1 is along the Y direction, and the defective product route R2 is along the X direction. Furthermore, the moving mechanism 282 may have the same structure as the product moving part 252 of the second conveying mechanism 25 .

＜Example of operation of cutting device＞ Next, an example of the operation of the cutting device 100 will be described with reference to FIGS. 9 , 11 , 12 and 13 . In addition, FIG. 13 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting device 100. In this embodiment, all operations or controls of the cutting device 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, and tube storage of the product P, are controlled by the control unit CTL (see Figure 1).

The substrate supply part 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating part 111 toward the holding position RP held by the first holding mechanism 3 (see FIG. 1 ).

Next, as shown in FIG. 13 , the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 absorbs and holds the sealed substrate W. Thereafter, the transport moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and holds the sealed substrate W. Place them on the cutting table 2A and the cutting table 2B. At this time, the X-direction position of the sealed substrate W is adjusted by the main moving mechanism 72 , and the Y-direction position of the sealed substrate W is adjusted by the horizontal moving mechanism 74 . Furthermore, the cutting table 2A and the cutting table 2B adsorb and hold the sealed substrate W.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and lowering movement mechanism 73 raises the first holding mechanism 3 to a position where it is not in contact with the cutting movement mechanism 8 (supporting mechanism). Body 812) to the location where physical interference occurs. Furthermore, when moving the first holding mechanism 3 holding the sealed substrate W to the cutting stage 2B, there is no need to retract the support body 812 from the cutting stage 2B to the transfer stage 5 side. As described above, the first holding mechanism 3 is raised and lowered.

In this state, the cutting moving mechanism 8 sequentially moves the two spindle portions 42A and 42B in the X direction and the Y direction, and rotates the cutting tables 2A and 2B to cut the sealed substrate W into Grid-like and monolithic.

After cutting, the conveyance moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (mounting surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the above cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

Next, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 absorbs and holds the plurality of products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (opposite surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, the plurality of products P held in the second holding mechanism 6 are inspected on the lower surface side (opposite surface) by the inspection part 131 , and then handed over to the reversing mechanism 14 , where they are passed through the reversing mechanism 14 The adsorption holds the opposite side and then reverses. After the reversal, the reversal mechanism 14 moves, and the mounting surface of the product P is inspected by the inspection unit 132 . After the double-sided inspection is performed in this way, the product P is transferred from the reversing mechanism 14 to the transfer table 5 .

The transfer table 5 on which the plurality of products P is mounted moves to the take-out position X2 (see FIGS. 1 , 9 and 11 ). On the other hand, the empty cylindrical container 20 is installed in the insertion position setting part 212 of the container setting part 21 (see FIGS. 9 and 12 ).

In this state, as shown in FIG. 11 , the first conveyance mechanism 24 adsorbs and holds the product P from the transfer table 5 in the take-out position X2. Then, it moves upward of the imaging unit 26 . Thereby, the product P adsorbed and held by the first conveyance mechanism 24 is photographed by the imaging unit 26 . In addition, the determination unit 27 uses the imaging data obtained by the imaging unit 26 to determine the quality of the product P. Thereafter, the first conveyance mechanism 24 moves the product P to the intermediate table 23 , releases the adsorption and holding of the product P, and places the product P on the intermediate table 23 . The product P placed on the intermediate table 23 is conveyed to the turntable 281 by, for example, the moving mechanism 282 of the sorting mechanism 28 .

The classification mechanism 28 switches the good product route R1 and the defective product route R2 for each product P based on the result of the quality determination by the determination unit 27 . If it is a good product, the product P is switched to the good product route R1 (see (a) of FIG. 12 ), and the product P is transported to the product guide 251 by the moving mechanism 282 . The product P conveyed to the product guide part 251 is inserted into the inside of the cylindrical container 20 by the product moving part 252 of the second conveyance mechanism 25, and is accommodated. On the other hand, if the product is a defective product, the product P is switched to the defective product route R2 (see (b) of FIG. 12 ), and the product P is transported to the waste container 29 by the moving mechanism 282 and discarded.

When the cylindrical container 20 becomes full, or when a desired number of products P are accommodated in the cylindrical container 20 , the accommodated cylindrical container 20 in the insertion position setting part 212 is moved to the accommodated container. accommodating part 213, and the empty cylindrical container 20 is sent out from the empty container accommodating part 211 and set in the insertion position setting part 212.

<Effects of this embodiment> According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the first holding mechanism 3 are moved by the common transmission shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5 . The second holding mechanism 6 has a structure in which the cutting moving mechanism 8 moves the cutting mechanism 4 on the horizontal plane in the X direction along the transmission shaft 71 and in the Y direction orthogonal to the X direction, so there is no need to use The sealed substrate W can be separated into individual pieces by moving the cutting table 2A and the cutting table 2B in the X direction and the Y direction. Therefore, the cutting table 2A and the cutting table 2B can be moved without using the ball screw mechanism or the like, and a bellows member for protecting the ball screw mechanism or the like and a cover member for protecting the bellows member are not required. As a result, the device structure of the cutting device 100 can be simplified.

In addition, since the cutting table 2A and the cutting table 2B are configured not to move in the X direction and the Y direction on the horizontal plane, the movement space of the cutting table 2A and the cutting table 2B and their surroundings can be reduced. The useless space can reduce the occupied area of the cutting device 100.

Furthermore, the plurality of products P can be conveyed from the transfer stage 5 to the cylindrical container 20 provided on the container installation part 21 by the conveyance and storage mechanism 22, and the plurality of products P can be accommodated from the one end opening 20x of the cylindrical container 20. P.

＜Other variations＞ In addition, the present invention is not limited to the above-described embodiment.

For example, in the above-mentioned embodiment, the container installation part 21 is provided on the front side of the transmission shaft 71 , but it may be provided on the back side of the transmission shaft 71 .

In addition, the cylindrical container 20 provided in the container installation part 21 may be provided along the X direction in addition to the structure provided along the Y direction, or may be provided along other directions.

Furthermore, the classification mechanism 28 may be configured to be capable of classifying products P judged as defective products and products P judged to be defective products, and may be configured to remove defective products from the route of defective products. For example, as shown in FIG. 14( a ), the sorting mechanism 28 may have a structure in which an opening and closing mechanism 283 is provided on the bottom surface of the product guide 251 on which the product P slides, and the opening and closing mechanism 283 is opened to drop and remove defective products. In addition, as shown in (b) of FIG. 14 , the sorting mechanism 28 may be provided with a removal mechanism 284 that presses the product P judged to be a defective product laterally while moving in the product guide 251 . By this removal mechanism 284 is a structure that presses and removes defective products.

The imaging unit 26 of the above embodiment takes an image of the product P held on the first conveyance mechanism 24 , but may also take an image of the product P placed on the transfer table 5 . In addition, the imaging unit 26 may be installed on the product adsorption mechanism 241 of the first conveyance mechanism 24 to photograph the product P placed on the transfer table 5 or the intermediate table 23 . In addition, in addition to the imaging unit of the above-mentioned embodiment, the imaging unit 26 may also use an imaging unit installed in the product suction mechanism 241 of the first conveyance mechanism 24 .

In the embodiment, a cutting device with a double cutting table type and a double mandrel structure has been described, but the invention is not limited thereto. A cutting device with a single cutting table type and a single mandrel structure may also be used, or a single cutting device may be used. Cutting table type and double mandrel structure cutting device, etc.

In addition, the cam rack element constituting the transmission shaft 71 can be configured by connecting a plurality of cam rack elements. Therefore, for example, the cutting device (processing device) 100 can be configured to be separable and connectable between the second cleaning mechanism 19 and the inspection unit 13 ( Modular structure that can be loaded and unloaded). In this case, for example, a module that performs a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Furthermore, in addition to the structure illustrated here, the cutting device (processing device) 100 may be configured as a module structure that can be separated and connected (removable) somewhere, or an additional module may be used as an inspection unit. Modules with various functions other than.

In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. [Industrial availability]

According to the present invention, a moving mechanism for moving the processing table is unnecessary, and the individualized processing objects can be accommodated in the cylindrical container.

2A, 2B: Cutting table (processing table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5:Transfer platform 6: Second holding mechanism 7:Moving mechanism for transportation 8: Moving mechanism for processing (moving mechanism for cutting) 9A, 9B: Rotating mechanism 10A, 10B: Vacuum pump 11:Substrate supply mechanism 12:Liquid supply mechanism 13:Inspection Department 14:Reversal mechanism 17: Processing waste collection department 18:The first cleaning agency 18a, 121: Injection nozzle 19:Second cleaning mechanism 20:Tubular container 20x: Open at one end 21: Container setting department 22:Transfer to a shelter 23: Center stage 24:First transport mechanism 25: Second transport mechanism 26:Camera Department 27: Judgment Department 28:Classification agency 29:Abandoned containers 31, 61, 241A: adsorption head 40: Rotary tool 41A, 41B: Blade 42A, 42B: Spindle part 71:Transmission shaft 72: Main moving mechanism 73, 181: Lifting and moving mechanism 73a, 242b1, 831: Z-direction guide rail 73b: Actuator part 74: Horizontal moving mechanism 74a, 821: Y direction guide rail 74b: Elastomer 74c: Cam mechanism 81, 242a: X direction moving part 82:Y direction moving part 83. 242b: Z-direction moving part 100: Cutting device (processing device) 111:Substrate receiving section 112:Substrate supply department 113:Heating part 131:First Inspection Department (Inspection Department) 132:Second Inspection Department (Inspection Department) 141:Keeping platform 142:Reversal Department 171:Guide chute 171X: Upper opening 172:Recycling container 173:Separation Department 211: Empty Container Collection Department 212: Insertion position setting part 213: Containment Completed Container Containment Department 241: Product adsorption mechanism 241a, 311, 611: adsorption part 242:Moving mechanism for adsorption 242a1:X direction guide rail 242a2, 812: Support body 242b2, 832: Z direction slider 251: Product Guidance Department 252: Product Moving Department 252a: Pressing member 252b:Drive Department 281: Rotary table 282:Mobile mechanism 283:Opening and closing mechanism 284:Remove mechanism 721: Guide rail 722:Pinion mechanism 722a: Cam rack 722b: pinion 722b1:Roller body 722b2:Roller pin 723:Sliding member 811: A pair of X-direction guide rails 813: Ball screw mechanism 822:Y direction slider 823: Linear motor CTL:Control Department P: products (processed products) R1: Good product route (route) R2: Defective product route (route) RP: maintain position S: Processing chips W: Sealed substrate (object to be processed) X, Y, Z, θ: direction X1: transfer position X2: take out position

FIG. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing the cutting table of the embodiment and its surrounding structure. FIG. 3 is a diagram (plan view) schematically showing the structure of the cutting table and its surrounding structures according to the embodiment, viewed from the Z direction. 4 is a diagram (front view) viewed from the Y direction schematically showing the structure of the cutting table and its surrounding structures according to the embodiment. 5 is a diagram (front view) viewed from the Y direction schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment. 6 is a diagram (side view) viewed from the X direction, schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment. 7 is a cross-sectional view schematically showing the structure of a rack and pinion mechanism according to the embodiment. 8 is a diagram (front view) viewed from the Y direction schematically showing the structure of the second holding mechanism and the transport moving mechanism of the embodiment. 9 is a diagram (plan view) viewed from the Z direction, schematically showing the structure of the transfer table, the container installation part, and the transport and storage mechanism of the embodiment. 10 is (a) a perspective view and (b) a cross-sectional view schematically showing the structure of the cylindrical container according to the embodiment. FIG. 11 is a diagram (front view) viewed from the Y direction, schematically showing the structure of the first conveyance mechanism of the embodiment. FIG. 12 is a schematic diagram showing (a) a route for good products and (b) a route for defective products in the classification mechanism according to the embodiment. FIG. 13 is a diagram schematically showing the movement paths of the first holding mechanism and the second holding mechanism of the embodiment. FIG. 14 is a schematic diagram showing a classification mechanism according to a modified embodiment.

2A, 2B: Cutting table (processing table)

3: The first holding mechanism

4: Cutting mechanism (processing mechanism)

5:Transfer platform

6: Second holding mechanism

7:Moving mechanism for transportation

8: Moving mechanism for processing (moving mechanism for cutting)

9A, 9B: Rotating mechanism

10A, 10B: Vacuum pump

11:Substrate supply mechanism

13:Inspection Department

14:Reversal mechanism

17: Processing waste collection department

18:The first cleaning agency

19:Second cleaning mechanism

21: Container setting department

22:Transfer to a shelter

23: Center stage

24:First transport mechanism

25: Second transport mechanism

26:Camera Department

27: Judgment Department

28:Classification agency

29:Abandoned containers

40: Rotary tool

41A, 41B: Blade

42A, 42B: Spindle part

71:Transmission shaft

100: Cutting device (processing device)

111:Substrate receiving section

112:Substrate supply department

113:Heating part

131:First Inspection Department (Inspection Department)

132:Second Inspection Department (Inspection Department)

141:Keeping platform

142:Reversal Department

172:Recycling container

211: Empty Container Collection Department

212: Insertion position setting part

213: Containment Completed Container Containment Department

241: Product adsorption mechanism

242:Moving mechanism for adsorption

251: Product Guidance Department

252: Product Moving Department

812:Support

CTL:Control Department

P: products (processed products)

RP: maintain position

W: Sealed substrate (object to be processed)

X, Y, Z, θ: direction

X1: transfer position

X2: take out position

Claims (9)

A processing device includes: a processing table that holds an object to be processed; a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; and a processing mechanism that holds the object to the processing table. The object to be processed is cut into individual pieces; the transfer table moves the object to be processed into individual pieces by the processing mechanism; and the second holding mechanism is to move the object to be processed into individual pieces. The object to be processed is transported from the processing table to the transfer table and the singulated object to be processed is held; and a moving mechanism for transportation has a movement mechanism along the processing table and the transfer table. A common transmission shaft extending in the arrangement direction and used to move the first holding mechanism and the second holding mechanism; a processing moving mechanism to move the processing mechanism on a horizontal plane along the first transmission shaft along the transmission shaft direction and a second direction orthogonal to the first direction; a container setting portion for setting a cylindrical container for receiving the singulated object to be processed from an opening at one end; and transportation and storage A mechanism for transporting the singulated object to be processed from the transfer table to and storing the cylindrical container provided on the container installation part, wherein the moving mechanism for processing includes: The X-direction moving part makes the processing mechanism linearly moving in the X direction as the first direction; and a Y-direction moving part to make the processing mechanism linearly move in the Y-direction as the second direction, the X-direction moving part having: a pair of A direction guide rail is provided along the X direction across the processing table; and a support body moves along the pair of X direction guide rails and supports the processing mechanism via the Y direction moving part. The processing device according to claim 1, wherein the transmission shaft is disposed above the processing moving mechanism and crossing the processing moving mechanism. The processing device according to claim 1 or claim 2, wherein the transport and storage mechanism includes: an intermediate table for temporarily placing the singulated object to be processed; and a first transport mechanism for transferring the processing object into pieces. The individualized processing object is transported from the transfer stage to the intermediate stage; and a second conveying mechanism transports the individualized processing object from the intermediate stage to the setting It is stored in the cylindrical container on the container setting part. The processing device according to claim 3, further comprising an imaging unit configured to capture the individualized processing objects held by the first conveying mechanism or placed on the transfer The single-piece processing object is photographed on the stage. The processing apparatus according to claim 4, further comprising a determination unit configured to determine the quality of the singulated object to be processed using the imaging data obtained by the imaging unit. The processing apparatus according to Claim 5, further comprising a classification mechanism that classifies the individualized processing objects determined as defective products by the determination unit. The processing device according to claim 6, wherein the sorting mechanism is provided in the second conveying mechanism. The processing apparatus according to claim 6, wherein the sorting mechanism is configured on a good product line that guides the singulated processing object determined as a good product by the determination unit to the cylindrical container, and It is used to switch between the defective product routes from which the processing object determined to be a defective product by the determination unit is discarded to a waste container. A method of manufacturing a processed product using the processing device according to any one of claims 1 to 8.