WO2009113236A1 - Method and apparatus for cutting substrate - Google Patents

Abstract

Provided is an apparatus for cutting a substrate capable of improving the productivity of a product (a package (5)) formed by cutting a shaped substrate (1) along a cutting line (4). An apparatus for cutting a substrate (9) comprises two cutting tables (17 (17a and 17b)). At a substrate placing position (24), the shaped substrate (1) placed on one cutting table (17a) is aligned by an alignment mechanism (27) thereby setting the cutting line (4). (Substantially) simultaneously with this, moreover, the shaped substrate (1) placed on the other cutting table (17b) is cut along the cutting line (4) by a first cutting mechanism (28) (an integral cut inspecting means (62)) and a second cutting mechanism (29) thereby forming a cutting groove (kerf) (58). At the same time, the cutting groove (58) is inspected (kerf-checked) by a kerf check mechanism (59) (the integral cut inspecting means (62)).

Description

Substrate cutting method and apparatus

The present invention relates to a substrate cutting method for cutting a molded substrate in which a plurality of required electronic parts such as ICs are collectively sealed with a resin material into individual packages (pieces) and an improvement of the apparatus. It is.

Conventionally, by using a substrate cutting apparatus that employs a single table method, a required portion of a molded substrate is cut by a cutting mechanism (cutting mechanism) such as a blade (circular rotary cutting blade), so that each individual A package is formed, and this cutting is performed as follows.

That is, first, at the substrate mounting position of this apparatus, the molded substrate 1 is supplied and set on the mounting surface of a cutting table (mounting rotary table for cutting) with its ball surface 1a facing up and fixed by suction. At the same time, a cutting line is set on the ball surface (substrate surface) 1a of the molded substrate 1 (refer to FIG. 6A for the molded substrate 1 and FIG. 6B for the package 5).
At this time, the alignment mark (alignment mark) provided on the ball surface 1a of the molded substrate 1 is detected by the detection mechanism, and the required cutting line 4 is set. Hereinafter, this detection and setting is referred to as alignment setting.
Next, the cutting table on which the molded substrate 1 is placed is moved to the substrate cutting position, and at the substrate cutting position, the cutting line set on the molded substrate 1 by the cutting mechanism while injecting cooling water to the cutting location. Then, the molded substrate 1 can be cut along to form individual packages 5 (1c) to be cut substrates (package assemblies).
At this time, a cutting kerf having a required groove width (a cutting groove 58 having a required width) is formed at the position of the cutting line 4 on the substrate by the cutting mechanism.
Next, the cutting table on which the cut substrate 5 (1c) is placed is moved back to the substrate mounting position, and the groove width (cutting groove 58) of the cut kerf formed on the cut substrate 5 (1c) is returned. ) Is kerf-checked by the detection mechanism.
Conventionally, at the substrate mounting position in the substrate cutting apparatus, the alignment setting by the alignment mark and the kerf check of the width of the cutting groove 58 are performed by one detection mechanism.

JP 2003-166867 A

By the way, in recent years, in a substrate cutting apparatus, it has become a problem to improve the yield of products (packages) and to improve the number of products (packages) produced per hour, thereby efficiently cutting formed substrates. ing.
That is, it has been demanded to improve the productivity of products (packages) cut from molded substrates.
However, as described above, in the conventional cutting apparatus, the alignment setting and the kerf check are performed by using one detection mechanism at the substrate mounting position. There is an adverse effect that the package cannot be formed and the productivity of the product (package) cannot be improved.

Therefore, an object of the present invention is to provide a substrate cutting method and apparatus capable of improving product (package) productivity.

The substrate cutting method according to the present invention for solving the technical problem is as follows.
Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the above-described formed substrate is placed on the above-described cutting table,
First, at the substrate mounting position described above, by setting the alignment of the molded substrate described above with an alignment mechanism, a cutting line is set on the molded substrate described above,
Next, the cutting groove formed by cutting the molded substrate along the cutting line by the cutting mechanism at the substrate cutting position is inspected by a kerf check mechanism.

Further, a method for cutting a substrate according to the present invention for solving the above technical problem is as follows.
Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the molded substrate is placed on the cutting table described above,
In the above-described substrate placement position, by setting the alignment of the molded substrate described above with an alignment mechanism, a step of setting a cutting line on the molded substrate described above;
By cutting the molded substrate with the cutting mechanism described above along the cutting line of the molded substrate, the cutting groove corresponding to the cutting line described above is formed on the molded substrate. Forming, and
In the above-described substrate cutting position, performing a step of inspecting the cutting groove formed in the above-described molded substrate with a kerf check mechanism,
Cutting the molded substrate along the cutting line by moving the cutting mechanism relative to the cutting table in the cutting direction during the cutting process of the cutting line described above;
In the above-described cutting groove inspection step, the above-described cutting groove is inspected by the above-described kerf check mechanism by moving the above-described kerf check mechanism relative to the cutting table in a direction opposite to the cutting direction described above. It is characterized by doing.

Further, a method for cutting a substrate according to the present invention for solving the technical problem is as follows.
Using the substrate cutting apparatus provided with two cutting tables, the two cutting tables described above are moved from the substrate mounting position provided in the apparatus described above to the substrate cutting position, respectively, In each case, first, the molded substrate is placed on the cutting table at the substrate mounting position, and then the molded substrate is placed on the cutting table at the substrate cutting position. A method of cutting a substrate that forms a package by cutting with a cutting mechanism,
In each of the above-described cutting tables, first, in the above-described substrate mounting position, by setting the alignment of the molded substrate described above with an alignment mechanism, a cutting line is set on the molded substrate described above,
Next, in the above-described substrate cutting position, a step of inspecting a cutting groove formed by the above-described cutting mechanism with a kerf check mechanism is performed.

Further, a method for cutting a substrate according to the present invention for solving the above technical problem is as follows.
When the molded substrates placed on the two cutting tables are cut by the cutting mechanism, each of the cutting tables is set to the eccentric position of the cutting table as a center of rotation. It is characterized by being rotated separately at an angle.

Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is as follows.
A cutting mechanism for cutting a required portion of the molded substrate;
A cutting table for placing the molded substrate;
Reciprocating means for reciprocating the cutting table between the substrate mounting position and the substrate cutting position, and a substrate cutting apparatus comprising:
In the above-described substrate mounting position, while providing an alignment mechanism for setting the alignment of the molded substrate mounted on the cutting table described above,
In the above-described substrate cutting position, a kerf check mechanism for inspecting a cutting groove formed by cutting the above-described molded substrate with the above-described cutting mechanism is provided.

Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is as follows.
It is characterized by comprising an integrated cutting inspection means in which the cutting mechanism and the kerf check mechanism described above are integrated.

Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is as follows.
While providing an integrated cutting inspection means that integrates the cutting mechanism and the kerf check mechanism described above,
The cutting mechanism and the kerf check mechanism in the integrated cutting inspection means described above are arranged along the cutting line of the molded substrate cut by the cutting mechanism.

Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is as follows.
Two cutting tables described above are provided.

Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is as follows.
A rotation mechanism is provided for rotating the above-described cutting table at a required angle with the eccentric position as the center position of rotation.

Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is as follows.
A debris removal mechanism is provided for removing the debris adhering to the package surface by spraying a two-fluid mixture mixed with air and water onto the surface of the package formed by cutting with the aforementioned cutting mechanism. It is characterized by being configured.

The present invention adopts a twin table (two cutting tables) system in order to improve the productivity of a product (package).
Further, the present invention is a substrate cutting apparatus adopting a twin table system, in the substrate mounting position, set the alignment with the alignment mark of the molded substrate placed on one of the two cutting tables, And (almost) at the same time, the width of the cutting groove formed on the molded substrate placed on the other cutting table at the substrate cutting position is kerf-checked, so that alignment setting and kerf-check are performed (almost) simultaneously. The number of products (packages) produced per hour can be improved.
Furthermore, the present invention is configured such that a cut substrate (individual package) subjected to kerf check can be cleaned by a cleaning section provided between the substrate cutting position and the substrate mounting position.

That is, when a molded substrate is cut with one cutting table, the molded substrate is set to be aligned with another cutting table, or individual cut packages can be cleaned.
Further, when setting the alignment of the molded substrate on one cutting table, at the same time, the molded substrate can be cut on the other table, or individual cut packages can be cleaned.
For this reason, in the two cutting tables, it is comprised so that a molded board | substrate can be cut | disconnected efficiently each separately.
Therefore, the present invention can efficiently cut a molded substrate and improve the productivity of a product (package).

Moreover, this invention is a structure using the integrated cutting | disconnection test | inspection means formed by integrating the cutting | disconnection mechanism and the kerf check mechanism (calf inspection mechanism).
That is, in the present invention, at the substrate cutting position, first, the integrated cutting inspection means (cutting mechanism) is moved relatively in the cutting direction, and the formed substrate is moved along one cutting line in the formed substrate by the cutting mechanism. After forming a cutting groove corresponding to this cutting line, the integrated cutting inspection means (calf check mechanism) is immediately moved relatively in the direction opposite to the cutting direction (check direction). Thus, the width of the cutting groove can be kerf-checked (in the past, at the substrate cutting position, only one cutting groove corresponding to the cutting line was formed by the cutting mechanism). .
In addition, as described above, since the present invention is configured to kerf-check the width of this one cutting groove immediately after forming one cutting groove, the time for the relative movement of the cutting mechanism. The time for cutting the molded substrate can be shortened.
Therefore, as shown in the conventional example, the present invention shortens the time for cutting the formed substrate as described above, compared to the configuration in which all the cutting grooves are formed and then the widths of all the cutting grooves are inspected as shown in the conventional example. Therefore, the productivity of the product (package) is improved.

As described above, according to the present invention, it is possible to provide a substrate cutting method and apparatus capable of improving the productivity of a product (package).

FIG. 1 is a schematic plan view schematically showing a substrate cutting apparatus according to the present invention. FIG. 2 is an enlarged schematic plan view schematically showing an enlarged main part (package cutting unit) in the substrate cutting apparatus shown in FIG. FIG. 3 (1) is an enlarged schematic front view schematically showing an enlarged main part of the substrate cutting apparatus (package cutting unit) shown in FIG. 2, and FIG. 3 (2) is shown in FIG. 3 (1). It is an expansion schematic front view which expands and shows roughly the cutting mechanism (blade) and kerf check mechanism in the device principal part shown. FIG. 4 is an enlarged schematic longitudinal sectional view schematically showing an enlarged main part of the substrate cutting apparatus (package cutting unit) shown in FIG. 5 (1), FIG. 5 (2), and FIG. 5 (3) are enlarged schematic front views for explaining a method using the cutting mechanism (blade) and the kerf check mechanism shown in FIG. 3 (2). FIG. 5 (1) shows a state before the substrate is cut with the blade, FIG. 5 (2) shows a state when the substrate is cut with the blade, and FIG. 5 (3) shows a state when the kerf check mechanism is used. Yes. 6 (1) is a schematic perspective view schematically showing a molded substrate used in the present invention, and FIG. 6 (2) shows a package formed by cutting the molded substrate shown in FIG. 6 (1). It is a schematic perspective view.

Explanation of symbols

1 Molded substrate 1a Ball surface (substrate surface)
1b Mold surface (resin surface)
1c Cut substrate (package assembly)
2 Substrate 3 Resin molding 4 Cutting line 4a Longitudinal cutting line (cutting part in the first direction)
4b Transverse line (second direction cut)
5 Package 5a Ball surface 5b Mold surface 5 (1c) Package assembly (cut substrate)
DESCRIPTION OF SYMBOLS 6 Substrate part 7 Resin part 8 Ball electrode 9 Substrate cutting device 9a Device front surface 9b Device rear surface 10 Connector 11 Substrate alignment mechanism part 12 Substrate cutting mechanism part 13 Substrate supply stand 14 Substrate rotation alignment means 15 Substrate placement Means 15a First substrate placing means 15b Second substrate placing means 16 Reciprocating means 16a First reciprocating means 16b Second reciprocating means 17 Cutting table 17a First cutting table 17b Second Cutting table 20 Mounting surface (cutting table)
20a First placement surface (placement surface of the first cutting table)
20b 2nd mounting surface (mounting surface of 2nd cutting table)
21 Eccentric position (center position of rotation)
21a First eccentric position (the eccentric position of the first cutting table)
21b Second eccentric position (the eccentric position of the second cutting table)
24 Substrate placement position 25 Substrate cutting position 26 Moving area (single line)
26a First moving area (moving area of the first cutting table)
26b Second moving area (moving area of the second cutting table)
27 Alignment mechanism 28 First cutting mechanism 29 Second cutting mechanism 30 Cleaning unit 31 Bellows member 31a First bellows member 31b Second bellows member 33 Minimum interval 41 Substrate loading unit 42 Extrusion member 43 Package supply unit 44 Package Inspection unit 45 Inspection camera 46 Package selection means 47 Non-defective tray 48 Defective product tray 51 Suction hole 51a First suction hole 51b Second suction hole 52 Vacuum suction mechanism 52a First vacuum suction mechanism 52b Second vacuum suction mechanism 53 Table groove 53a First table groove 53b Second table groove 54 Alignment reciprocating mechanism 55 Reciprocating mechanism 57 of cutting mechanism Width (groove width of cutting groove)
58 Cutting groove (calf)
59 Calf check mechanism (calf inspection mechanism)
60 First sliding connecting member 61 Second sliding connecting member 62 Integrated cutting inspection means 63 First blade (rotary cutting blade)
64 Second blade (rotary cutting blade)
65 Cutting direction 66 Direction opposite to cutting direction (check direction)
67 Cooling water injection mechanism 68 Cooling pipe (injection hole)
69 Cutting water injection mechanism 70 Broken material removal mechanism (broken material blowing mechanism)
71 Air blow mechanism A Substrate loading unit B Substrate cutting unit C Package inspection unit D Package accommodation unit

The present invention will be described in detail with reference to the drawings.
1 and 2 show a substrate cutting apparatus according to the present invention.
3 (1) and 3 (2) show an integrated cutting inspection means integrated with the cutting mechanism and the kerf check mechanism (kerf inspection mechanism) according to the present invention.
FIG. 4 shows an integrated cutting inspection means (calf check mechanism) according to the present invention.
FIGS. 5 (1), 5 (2), and 5 (3) show a cutting state and a kerf check state performed by the integrated cutting inspection means according to the present invention.
FIG. 6 (1) is a molded substrate (cut substrate) used in the present invention, and FIG. 6 (2) is a package cut by the substrate cutting apparatus according to the present invention.

(About molded substrate and package used in the present invention)
Further, as shown in FIG. 6A, the molded substrate 1 is configured such that a ball surface (substrate surface) 1a and a mold surface 1b which is the opposite surface are provided as surfaces.
Further, the molded substrate 1 is configured by being provided with a substrate 2 and a resin molded body 3 provided on the mold surface (resin surface) 1a side of the molded substrate 1 (substrate 2). A cutting line 4 is set on the ball surface (substrate surface) 1a side of the substrate 1 (substrate 2).
Further, by cutting the molded substrate 1 along the cutting line 4, a cutting groove having a required width corresponding to the cutting line 4 (a cutting kerf having a required groove width) is formed on the ball surface 1 a of the molded substrate 1. ) Is formed.
Further, as shown in FIG. 6 (2), the package 5 formed by cutting the cutting line 4 of the molded substrate 1 is separated from the ball surface 5a and the surface opposite to the ball surface 5a. And a mold surface 5b.
Further, the package 5 includes a substrate portion 6 and a resin portion 7 provided on the mold surface 5b side of the package 5 (substrate portion 6).
In addition, a ball electrode 8 may be formed on the ball surface 5a (1a) side of the substrate portion 6 (substrate 2).
Also, in FIG. 6A, an assembly of individual packages 5 (appearance is the same size as the molded substrate 1), which becomes the cut substrate 1c cut and separated from the molded substrate 1, is denoted by reference numeral 5 ( 1c).
Therefore, as will be described later, individual packages 5 (1c) can be formed by cutting the molded substrate 1 using the substrate cutting device (9) according to the present invention.
In FIG. 6 (1), 4a is a long-side cutting line (cut in the first direction) corresponding to the long side of the rectangular shaped substrate 1 in a parallel state, and 4b is a short side. It is a cutting line in the short side direction corresponding to the parallel state (cutting part in the second direction).
In addition, if it mentions in relation to the direction of this cutting line (cutting part), the cutting line (4) which cut | disconnects the shaping | molding board | substrate 1 is set to arbitrary directions, for example, various directions (for example, 1st Or the second direction).

(Regarding the configuration of the substrate cutting apparatus according to the present invention)
That is, as shown in FIG. 1, a substrate cutting apparatus 9 according to the present invention includes a substrate loading unit A for loading a molded substrate 1 and a molded substrate 1 transferred from the substrate loading unit A. Inspection of package cutting unit B to be cut (separated) into package 5 (cut substrate 1c), and individual package 5 cut by substrate cutting unit B to be visually inspected and classified into good products and defective products The unit C and a package accommodation unit D for accommodating the packages inspected and sorted by the package inspection unit C into good and defective products in trays.

Therefore, the molded substrate 1 loaded in the substrate loading unit A is first transferred to the substrate cutting unit B and cut into individual packages 5, and then the cut individual packages 5 are converted into package inspection units. While being inspected and selected by C, the package 5 can be separately accommodated as a good product and a defective product by the package accommodation unit D.
Further, the substrate cutting apparatus 9 according to the present invention is configured such that the units A, B, C, and D described above can be detachably connected in series in this order and installed. ing.
Moreover, in the board | substrate cutting device 9 which concerns on this invention, it is comprised so that each unit A * B * C * D can be connected detachably with the connector 10, for example.
Further, in the substrate cutting device 9 shown in FIG. 1, 9a is a front surface of the device, and 9b is a rear surface of the device.

(About the configuration of the cutting unit of the package according to the present invention)
That is, as shown in FIG. 2, the substrate cutting unit B includes a substrate alignment mechanism 11 that aligns the molded substrate 1 in a required direction and a substrate cutting mechanism 12 that cuts the molded substrate 1. It is provided and configured.
Therefore, first, the molded substrate 1 supplied from the substrate loading unit A side is aligned in a required direction by the substrate alignment mechanism unit 11 and supplied to the substrate cutting mechanism unit 12, and then the substrate cutting mechanism. The molded substrate 1 can be cut by the portion 12.
The substrate cutting device 9 (substrate cutting unit B) according to the present invention employs a twin table (two cutting tables 17) system.

(Regarding the configuration of the substrate alignment mechanism)
That is, as shown in FIG. 2, the substrate alignment mechanism 11 includes a substrate supply table 13 to which the molded substrate 1 is supplied from the substrate loading unit A, and the molded substrate 1 supplied to the substrate supply table 13. And a substrate rotation aligning means 14 for supplying and setting the formed substrate 1 rotated and aligned at a required angle (for example, 90 degrees) and aligned in a required direction to the substrate cutting mechanism 12 side. Is configured.
Accordingly, the molded substrate 1 is first supplied and set from the substrate loading unit A to the substrate supply table 13, and then the molded substrate 1 is engaged from the substrate supply table 13 by the substrate rotation alignment means 14. The molded substrate 1 is arranged so as to be aligned in a required direction and supplied to the substrate cutting mechanism 12 side by being lifted up and rotated at a required angle.

(Regarding the configuration of the substrate cutting mechanism)
That is, as shown in FIG. 2, the substrate cutting mechanism unit 12 has an individualization line that is a production line in the cutting apparatus 9 (substrate cutting unit B) for substrate cutting (substrate individualization). Are arranged in two sets (two lines).
Further, these two sets of individualized lines are arranged in parallel with the Y direction, and the arrangement positions thereof substantially coincide with a moving area 26 of the cutting table 17 described later.
In the example shown in FIG. 2, with respect to two sets of individualized lines (movement area 26 of the cutting table 17), the first individualized line (movement of the first cutting table 17 a) is on the left side. A set of areas 26a) is arranged, and a set of second singulated lines (moving area 26b of the second cutting table 17b) is arranged on the right side.
Further, the substrate cutting mechanism 12 includes the substrate mounting means 15 and the substrate mounting means 15 in each of the first and second singulation lines (the moving area 26 of the cutting table 17). Reciprocating means 16 for reciprocating and guiding in the Y direction is provided.
Further, the substrate cutting mechanism 12 is provided with a substrate mounting position 24 and a substrate cutting position 25, and the reciprocating means 16 moves the substrate mounting means 15 (cutting table 17) to Y. It is configured to be able to reciprocate in the direction.
Accordingly, in the first singulation line 26a, the first substrate mounting means 15a (first cutting table 17a) is moved between the substrate mounting position 24 and the substrate cutting position 25 by the first reciprocating movement means 16a. It is comprised so that can be reciprocated.
Further, in the second singulation line 26b, the second substrate placing means 15b (second cutting table 17b) is moved between the substrate placing position 24 and the substrate cutting position 25 by the second reciprocating means 16b. It is comprised so that can be reciprocated.
Regarding the constituent members related to the singulation line (moving region 26) in the substrate cutting mechanism 12, the subscript “a” is attached to the first and the subscript “b” is attached to the second. Is.

(About cutting table)
That is, as shown in FIG. 2, the substrate placing means 15 (the first substrate placing means 15a and the second substrate placing means 15b) has the molded substrate 1 with the mold surface 1b on the lower surface. Alternatively, a cutting table (mounting rotary table for cutting) 17 (17a, 17b) to be placed is provided with the substrate surface 1a being the upper surface.
Further, as shown in FIG. 4, the molded substrate 1 placed on the cutting table 17 (17a, 17b) is sucked and fixed to the cutting table 17 (first cutting table 17a, second cutting table 17b). A suction hole 51 (first suction hole 51a, second suction hole 51b) and a vacuuming mechanism 52 (first vacuuming mechanism 52a, second vacuuming mechanism 52b) such as a vacuum pump are provided. It is configured.
Further, as shown in FIG. 4, the mounting surface 20 (first table mounting surface 20a, second table mounting surface 20b) of the cutting table 17 is cut with a blade (rotary cutting blade) described later. Table grooves 53 (first table grooves 53a and second table grooves 53b) corresponding to the mechanisms (first cutting mechanism 28 and second cutting mechanism 29) are provided.
Moreover, as shown in FIG. 4, the mounting surface of the cutting table is located at the position of the cutting line 4 (4a, 4b) set on the molded substrate 1 supplied and set to the table mounting surface 20 (20a, 20b). 20 (first table placement surface 20a, second table placement surface 20b) are configured so that the positions of the table grooves 53 (53a, 53b) coincide with each other.
Therefore, first, the molded substrate 1 aligned by the rotary alignment means 14 on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) is cut into the cutting line 4 (4a) of this molded substrate 1. 4b) is supplied and set in a state where it matches the position of the table groove 53 (53a, 53b), and then air is forced from the suction holes 51 (51a, 51b) by the vacuuming mechanism 52 (52a, 52b). Thus, the molded substrate 1 can be adsorbed and fixed on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) on the mold surface 1b side by vacuuming and vacuuming. It is configured.

(Eccentric rotation of cutting table)
Further, on the lower end side of the cutting table 17 (17a, 17b), the cutting table 17 (17a, 17b) is an eccentric position set on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b). Rotation mechanism that rotates (eccentric rotation) the cutting table 17 (17a, 17b) at a required angle (for example, at an angle of 90 degrees) with 21 (21a, 21b) as the center of rotation (Not shown) is provided.
Accordingly, with the cutting table 17 (17a, 17b) being attached to the table mounting surface 20 (20a, 20b) with the molded substrate 1 being sucked and fixed, the rotation position causes the eccentric position 21 (21a, 21b) to be the center of rotation. It is configured so that it can be rotated in a required direction (eccentric rotation) at a required angle (as an axial center position of the rotary shaft).

(About the eccentric position of the cutting table)
As described above, in the present invention, the eccentric position 21 (21a, 21b) on the mounting surface 20 (20a, 20b) of the cutting table 17 is set as the rotation center position.
The eccentric position 21 (21a, 21b) of the cutting table 17 (17a, 17b) is a position excluding the central position on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b).
In addition, for example, with respect to the eccentric position 21 (21a, 21b) of the rectangular cutting table 17 (17a, 17b), a rectangular mounting surface composed of long sides and short sides in the cutting table 17 (molded substrate 1). 20 (20a, 20b) can be set on a straight line formed by connecting the midpoints of the short sides and parallel to the long sides (except for the center position of the table mounting surface).

(Regarding the proximity state of the first and second cutting tables)
Further, for example, the first cutting table 17a and the second cutting table 17b are configured such that their long side directions are parallel to the Y direction.
Further, for example, the molded substrate 1 placed on the first cutting table 17a and the molded substrate 1 placed on the second cutting table 17b are in a state in which the long side direction is parallel to the Y direction. It is comprised so that it may become.
Accordingly, the first cutting table 17a and the second cutting table 17b are adjacent to each other, and are configured to have a minimum distance 33 between adjacent positions.
In this state, the first cutting table 17a and the second cutting table 17b can reciprocate between the substrate placement position 24 and the substrate cutting position 25 without colliding (interfering) with each other. It is configured as follows.
Therefore, the 1st cutting table 17a and the 2nd cutting table 17b are provided in the position which cannot be arrange | positioned in close proximity any more than this, and is comprised.
Note that the first cutting table 17a and the second cutting table 17b are configured to be adjacent to each other and at the same time so as not to rotate with the eccentric position as the rotation center position, and the cutting tables 17 (17a and 17b) Is configured to be able to rotate so as not to collide (interfere).
In addition, the first cutting table 17a (second cutting table 17b) is in a single state at the substrate cutting position 25, and further in a state where the second cutting table 17b is not adjacent (for example, the second cutting table 17b). In the presence of the substrate mounting position 24), the eccentric position 21a can be rotated at a required angle around the center of rotation.
Therefore, as described above, since the first cutting table 17a and the second cutting table 17b are arranged close to each other and at the minimum interval 33 of the proximity position, (for example, at the center position of the cutting table). Compared with a device having a center position of rotation, the overall size of the substrate cutting device can be reduced.

(About bellows member and cleaning part)
Further, on both sides of the substrate mounting means 15 (15a, 15b) in the reciprocating direction, the substrate is reciprocated from cutting waste generated when the molded substrate 1 placed on the cutting table 17 (17a, 17b) is cut. A vertical wall-shaped bellows member 31 (31a, 31b) that protects the means 16 (16a, 16b) is provided to be extendable and contractible.
In addition, between the substrate placement position 24 and the substrate cutting position 25 in the moving area 26 (26a, 26b) of the cutting table 17 (17a, 17b), each package 5 (1c) cut at the substrate cutting position 25 is provided. A cleaning unit 30 is provided for cleaning and drying.
That is, in the moving area 26 (26a, 26b) of the cutting table, the molded substrate 1 (or individual package 5) is placed in a state where the vertical wall-shaped bellows member 31 (31a, 31b) is expanded or contracted. The cut table 17 (17a, 17b) can be reciprocated, and the individual package 5 (1c) cut at the substrate cutting position 25 can be cleaned and dried in the cleaning unit 30.
Therefore, the reciprocating means 16 (16a, 16b) can be protected by the longitudinal wall-shaped bellows member 31 (31a, 31b) that expands or contracts.

(About alignment mechanism)
Further, an alignment mark (alignment mark) provided on the molded substrate 1 (ball surface 1a) placed on the cutting table 17 (17a, 17b) is detected at the substrate placement position 24 in the substrate cutting mechanism section 12. Thus, (one) alignment mechanism 27 for setting (imaginarily) the cutting line 4 (4a, 4b) is provided.
Further, the substrate cutting mechanism 12 is provided with an alignment reciprocating mechanism 54 that reciprocates the alignment mechanism 27 in the X direction, Y direction, and Z direction (vertical direction) in the apparatus 9 (substrate cutting unit B). It is configured.
That is, by moving the alignment mechanism 27 with the alignment reciprocating mechanism 54 and scanning, the molded substrates 1 placed on the two cutting tables 17 (17a, 17b) can be set for alignment. Therefore, the cutting line 4 (cutting part) can be set to the molded substrate 1 separately.
Accordingly, the molded substrate 1 placed on the first cutting table 17a and the molded substrate 1 placed on the second cutting table 17b are respectively set to be aligned and the cutting lines 4 (4a, 4b) are set. Can be set.

(About cutting mechanism)
As shown in FIGS. 2 and 3 (1), the molded substrate 1 placed on the cutting table 17 (17 a, 17 b) is placed on the cutting line 4 at the substrate cutting position 25 in the substrate cutting mechanism 12. Two cutting mechanisms (cutting mechanisms) having blades (circular rotary cutting blades) or the like that are cut along, that is, the first cutting mechanism 28 and the second cutting mechanism 29 are cutting means for the molded substrate 1. Is provided and configured.
That is, the first cutting mechanism 28 is configured with the first blade 63, and the second cutting mechanism 29 is configured with the second blade 64.
Further, the first cutting mechanism 28 and the second cutting mechanism 29 are provided with the first blade 63 and the second blade 64 facing each other at a predetermined interval (the blade surfaces are in parallel). Is configured.
Further, the axial direction of the spindle shaft that rotates these blades 63 and 64 separately is configured to be parallel to each other in the X direction.
Further, the first cutting mechanism 28 and the second cutting mechanism 29 are separated by reciprocating them both in the X direction, (relatively) in the Y direction, and in the Z direction (up and down direction). A mechanism reciprocating mechanism 55 is provided.
The first cutting mechanism 28 is configured with a first sliding connection member 60, and the second cutting mechanism 29 is configured with a second sliding connection member 61. Yes.
Therefore, the sliding connection member 60 attached to the first cutting mechanism 28 having the first blade 63 by the reciprocating mechanism 55 of the cutting mechanism, that is, the first cutting mechanism 28 in the X direction (relative It is configured so that it can be reciprocated in the Z direction (up and down direction) in the Y direction.
Further, the reciprocating mechanism 55 of the cutting mechanism moves the second sliding connecting member 61 attached to the second cutting mechanism 29 having the second blade 64, that is, the second cutting mechanism 29 in the X direction. , (Relatively) can be moved back and forth in the Z direction (up and down direction) in the Y direction.

Also, the first blade 63 and the second blade 64 are moved by moving the first cutting mechanism 28 and the second cutting mechanism 29 separately in the X direction by the reciprocating mechanism 55 of the cutting mechanism. It is comprised so that it can set suitably at a required space | interval.
Therefore, for example, when two parallel cutting lines 4 in the molded substrate 1 placed on the first cutting table 17a are cut by the first cutting mechanism 28 and the second cutting mechanism 29, The shaped substrate 1 can be cut along the Y direction with the cutting directions of the blades 63 and 64 in a parallel state.
Similarly, the molded substrate 1 placed on the second cutting table 17b can be cut along the Y direction with the cutting directions of the two blades 63 and 64 in parallel. It is configured to be able to.

The first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cooling water injection mechanism 67 that injects cooling water onto the blade 63 (64).
In the example shown in FIG. 3 (2), the cooling water injection mechanism 67 is configured by providing a circular cooling pipe 68 at a side position of the blade 63, and on the peripheral side surface of the circular cooling pipe 68. A required number of injection holes (not shown) are formed.
Therefore, when the molded substrate 1 is cut along the cutting line 4, the cooling water is injected from the injection holes of the cooling pipe 68 in the cooling water injection mechanism 67 onto the blade 63 (circular side surface thereof). It is comprised so that it can cool.

The first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cutting water injection mechanism 69 that injects cutting water onto the blade 63 (64).
In the example shown in FIG. 3B, a cutting water injection mechanism 69 is provided on the device front surface 9a side of the blade 63 (along the cutting direction of the blade 63).
Therefore, when the molded substrate 1 is cut along the cutting line 4, the cutting water spray mechanism 69 can spray the cutting water onto the blade 63 (the cutting edge).

Further, when the molded substrate 1 is cut by the cutting mechanism 28 and the cutting mechanism 29 (blades 63 and 64), foreign matters such as broken materials (cutting chips) are generated on the molded substrate 1 (package 5).
This broken material (foreign matter) tends to adhere and remain on the surface of the package 5 (for example, the ball surface 5a), and the broken material may remain attached to the surface of the package 5 even after washing with cleaning water.
Therefore, it is required to efficiently remove the broken material from the surface (5a) of the package 5 after cleaning the package 5.
That is, the first cutting mechanism 28 (or the second cutting mechanism 29) is generated when the molded substrate 1 is cut by the blade 63 (64) along the cutting line 4, and is generated on the surface (5a) of the package 5. A debris removal mechanism (broken material blow-off mechanism) 70 removes the debris remaining on the gas) by blowing it off with a gas-liquid two-fluid mixture (water containing a large number of air bubbles) that is a mixture of air and water. It is provided and configured.
In the example shown in FIG. 3 (2), the broken material removal mechanism 70 is provided on the apparatus front surface 9 a side of the blade 63, and the broken material removal mechanism 70 is disposed between the blade 63 and the cutting water injection mechanism 69. It is provided and sandwiched between the two.
That is, the cutting water injection mechanism 69 and the broken material removal mechanism 70 are provided in this order from the blade 63 side along the cutting direction of the blade 63 (in the Y direction).
Therefore, the broken material (foreign matter) generated when the molded substrate 1 is cut by the blade 63 along the cutting line 4 can be removed by being blown off by the broken material removing mechanism 70.

(About cutting grooves)
That is, as shown in FIG. 4, the molded substrate 1 is moved along the cutting line 4 set on the molded substrate 1 placed on the cutting table 17 (17a, 17b) by the first cutting mechanism 28 (first , Or the second cutting mechanism 29 (second blade), the required width 57 of the molded substrate 1 is such that the longitudinal direction of the groove corresponds to the Y direction corresponding to the cutting line 4. A cutting groove (kerf) 58 having the following can be formed.
In this case, since the cutting line 4 is cut in full cut, the blades 63 and 64 are placed in the table grooves 53 (53a and 53b) of the cutting table 17 (17a and 17b) corresponding to the position of the cutting line 4. The cutting edge can be entered.
Accordingly, by cutting the molded substrate 1 along the cutting line 4 using the first cutting mechanism 28 and the second cutting mechanism 29, a cutting groove 58 having a required width 57 corresponding to the cutting line 4. (Cutting groove) can be formed.
In addition, when the cutting groove 58 having a required width 57 formed on the ball surface 1a in the molded substrate 1 (cut substrate 1c) is viewed in a plane, it is a single line in the Y direction.

(Calf check mechanism)
Further, as shown in FIGS. 3A and 3B, the substrate cutting mechanism 12 has a groove width of a cutting groove 58 formed by cutting the molded substrate 1 along the cutting line 4. A kerf check mechanism (calf inspection mechanism) 59 for inspecting 57 is provided.
That is, by using the kerf check mechanism 59, the groove width 57 of the cutting groove 58 that forms one groove line in the Y direction formed on the ball surface 1a of the molded substrate 1 can be scanned and inspected. It is configured.
Therefore, the size of each package 5 (length and width) formed by cutting the molded substrate 1 can be accurately set to a required length, and each package can be formed.
The kerf check mechanism 59 can inspect the groove width 57 of the cutting groove 58 and can inspect the shape of the cutting groove (kerf) 58, for example, the chipping state of the cutting groove 58. is there.
Therefore, the kerf check mechanism 59 can check a package in which chipping or the like is generated in the shape of the cutting groove 58 (that is, in the shape of the package 5), and can efficiently remove the package, so that a high-quality and highly reliable product ( Individual packages).

Further, the kerf check mechanism 59 has a foreign substance such as dust attached to the surface of each package 5 by pumping compressed air to the surface of the cut substrate 1C (individual package 5) to be inspected by the kerf check mechanism 59. An air blow mechanism 71 that blows off the air is provided.
That is, in the example shown in FIG. 3B, the air blow mechanism 71 is provided on the apparatus front surface 9a side of the kerf check mechanism 59.
Accordingly, the compressed air is pumped to the surface of the cut substrate 1c (5) by the air blow mechanism 71, so that foreign matters such as dust adhering to the surface of the package 5 (for example, the ball surface 5a) are ejected and removed. Can do.

(About integrated cutting inspection means)
As shown in FIGS. 3A and 3B, in the first cutting mechanism 28, the cleaning unit 30 side of the first blade 63 (the reciprocating mechanism 55 side of the cutting mechanism or the device) A kerf check mechanism 59 is provided via a sliding connecting member 60 at a position on the front surface 9a side.
Further, as the installation position of the kerf check mechanism 59, along the cutting groove 58 (cutting line 4) formed by cutting the molded substrate 1 along the cutting line 4 with the first blade 63 (Y direction). (Along a straight line extending in the direction).
Therefore, the first cutting mechanism 28 and the kerf check mechanism 59 are integrated by the sliding connection member 60 in a state where the first cutting mechanism 28 and the kerf check mechanism 59 are arranged along the cutting line 4 (cutting groove 58) of the molded substrate 1. The cutting inspection means 62 is formed.
As shown in FIG. 3B, the rotation direction of the first blade 63 of the first cutting mechanism 28 is clockwise in the figure.

Similarly to the first cutting mechanism 28, the integrated cutting inspection means 62 is operated by the reciprocating mechanism 55 of the cutting mechanism in the X direction, the Y direction (the cutting table 17 side reciprocates), and the Z direction (vertical direction). ) Can be reciprocated.
Therefore, the first cutting mechanism 28 in the integrated cutting inspection means 62 cuts the cutting line 4 formed on the molded substrate 1 to form a cutting groove 58 having a required width 57 corresponding to the cutting line 4. It is comprised so that it can form.

(About the arrangement of the cutting mechanism and kerf check mechanism in the integrated cutting inspection means)
Further, as described above, the positions of the first cutting mechanism 28 and the kerf check mechanism 59 in the integrated cutting inspection means 62 are, for example, as shown in FIG. It can be arranged on the cutting line 4 (cutting groove 58) of the molded substrate 1 cut by 28 (blade 63) (on the Y direction).
Therefore, when the cutting table 17 on which the molded substrate 1 is placed is reciprocated in the Y direction (in the direction in which the cutting line 4 extends), the first cutting mechanism 28 and the kerf check mechanism 59 are the same. It will reciprocate relative to the cutting table 17 along a straight line (the cutting line 4 or the cutting groove 58).
The relative movement of the molded substrate 1 (cutting table 17) and the cutting mechanisms 28 and 29 (calf check mechanism 59) will be described in detail later.
That is, first, the integrated cutting inspection means 62 is moved relative to the cutting table 17 from the apparatus back surface 9b side to the apparatus front surface 9a side (by moving relatively in the forward direction), so that the integrated cutting is performed. The cutting line 4 can be cut in the Y direction, which is the cutting direction 65, by the first cutting mechanism 28 (blade 63) in the inspection means 62.
Next, the integrated cutting inspection means 62 is moved relative to the cutting table 17 from the apparatus front surface 9a side to the apparatus back surface 9b side (relative to the return direction, which is opposite to the forward direction). By being moved, the cutting groove 58 corresponding to the cutting line 4 can be inspected by the kerf check mechanism 59 in the integrated cutting inspection means 62.
Therefore, the kerf check mechanism 59 in the integrated cutting inspection means 62 can inspect (kerf check) the width 57 of the cutting groove 58 formed corresponding to the cutting line 4.
Further, as described above, since the present invention can efficiently perform the cutting of the single cutting line 4 and the kerf check, the integrated cutting inspection means 62 (the first cutting mechanism 28 and the kerf check). The time for the mechanism 59) to move relative to the cutting table 17 can be reduced, and the time for cutting the molded substrate 1 can be shortened.
For this reason, since the molded substrate 1 can be efficiently cut into the individual packages 5, the number of products produced per hour can be improved.

(Relative movement of cutting mechanism, etc.)
Here, in relation to the cutting of the cutting line 4 and the inspection of the width 57 of the cutting groove 58, the cutting table 17 (17a, 17a) for the integrated cutting inspection means 62, the cutting mechanisms 28, 29, and the kerf check mechanism 59 is described. (Refer to FIG. 5 (1), FIG. 5 (2), and FIG. 5 (3)).
That is, as described above, the cutting table 17 (17a, 17a) is configured to reciprocate in the Y direction by the reciprocating means 16 (16a, 16b).
For example, the front of the apparatus in which the first cutting mechanism 28 (including the kerf check mechanism 59) and the second cutting mechanism 29 are not moved in the Y direction, and the cutting table 17 (17a, 17b) is in the Y direction. The first cutting mechanism 28 and the second cutting mechanism 29 are moved separately from each other in the cutting direction 65, that is, in the direction from the apparatus back surface 9b side to the apparatus front surface 9a side. It can be set to the state moved automatically.
Further, for example, the first cutting mechanism 28 (including the kerf check mechanism 59) and the second cutting mechanism 29 are not moved in the Y direction, and the cutting table 17 (17a, 17b) is moved in the Y direction. The first cutting mechanism 28 (calf check mechanism 59) and the second cutting mechanism 29 are moved in a direction 66 opposite to the cutting direction 65, respectively, by moving from the apparatus rear surface 9b side to the apparatus front surface 9a side. That is, it can be set to a state in which it is relatively moved in the direction from the device front surface 9a side to the device back surface 9b side.
The cutting table 17 (17a, 17b) substantially reciprocates in the Y direction so that the integrated cutting inspection means 62 performs cutting and inspection.

(About cutting and inspection by integrated cutting inspection means)
That is, the integrated cutting inspection means 62 is moved relative to the cutting table 17 in the cutting direction 65 along the Y direction, so that the molded substrate 1 is formed by the first cutting mechanism 28 (first blade 63). Can be cut along the cutting line 4.
Further, the integrated cutting inspection means 62 is moved relative to the cutting table 17 in a direction 66 (check direction) opposite to the cutting direction along the Y direction, thereby cutting by the kerf check mechanism 59. The width 57 of the cutting groove 58 formed corresponding to the line 4 can be inspected.
Therefore, first, the integrated cutting inspection means 62 is moved in the cutting direction 65 relative to the cutting table 17 as the forward path (advanced state) of the integrated cutting inspection means 62, so that the integrated cutting inspection means 62 The molded substrate 1 is cut along one cutting line 4, and then the integrated cutting inspection means 62 is cut relative to the cutting table 17 as the return path (reverse state) of the integrated cutting inspection means 62. By moving in a direction 66 opposite to the direction, the integrated cutting inspection means 62 can inspect the width 57 of one cutting groove 58.

Next, cutting and inspection by the integrated cutting inspection means 62 according to the present invention will be described in detail with reference to FIGS. 5 (1), 5 (2), and 5 (3).
FIG. 5A shows a state before the substrate is cut by the integrated cutting inspection unit 62, and FIG. 5B shows a state when the substrate is cut by the integrated cutting inspection unit 62 (first cutting mechanism 28). FIG. 5 (3) shows a state when the substrate is inspected by the integrated cutting inspection means 62.
In this case, the cutting table 17 (17a, 17b) reciprocates in the Y direction, but the integrated cutting inspection means 62 does not move in the Y direction.

That is, first, as shown in FIG. 5 (1), before the substrate is cut, the molded substrate 1 placed on the cutting table 17 (17a, 17b) is moved from the apparatus front surface 9a side (cleaning unit 30 side) to the apparatus. It is moved along the Y direction toward the back surface 9b.
Next, as shown in FIG. 5B, when the substrate is cut, first, the integrated cutting inspection means 62 is moved downward, and the integrated cutting inspection means 62 is moved in the X direction. Thus, the cutting direction 65 that is the Y direction of the first blade 63 is matched with the (single) cutting line 4 in the Y direction set on the ball surface 1a of the molded substrate 1, The molded substrate 1 (cutting table 17) is moved from the apparatus front surface 9a side to the apparatus rear surface 9b side along the Y direction (in an immovable state in the Y direction). Accordingly, the molded substrate 1 is cut in the cutting direction 65 by the first blade 63 (first cutting mechanism 28) along the cutting line 4 by moving the cutting substrate 65 in the cutting direction 65. A cutting groove 58 having the required width 57 (one) It can be formed.
In this case, the integrated cutting inspection means 62 is moved up after the cutting line 4 is cut by the first blade 63.
Next, as shown in FIG. 5 (3), when the substrate is inspected, the molded substrate 1 (cutting table 17) is moved from the apparatus back surface 9b side to the apparatus front surface 9a side along the Y direction ( By moving the integrated cutting inspection means 62 (moving in the Y direction) relative to the cutting table 17 in a direction 66 (check direction) opposite to the cutting direction, the integrated cutting inspection means 62 (kerf check mechanism) 59), the width 57 of the (one) cutting groove 58 corresponding to the cutting line 4 can be inspected.

Further, regarding the inspection of the width 57 of the cutting groove 58 formed by cutting the molded substrate 1 along the cutting line 4 with the second cutting mechanism 29 (second blade 64), the second cutting mechanism 29 (first The width of the cutting groove 58 by the second blade 64) can be inspected by scanning in the Y direction with the integrated cutting inspection means 62 (kerf check mechanism 59).

(About substrate cutting method)
First, the molded substrate 1 is supplied and set from the substrate loading unit A to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B, and the molded substrate 1 is set by the rotary alignment means 14 as required. Aligned in the direction and supplied to the mounting surface 20a (20b) of the first cutting table 17a (or the second cutting table 17b) present at the substrate mounting position 24.
At this time, the molded substrate 1 can be mounted on the table mounting surface 20a (20b) by suction and fixation.
Next, the first cutting table 17 a is moved to the substrate cutting position 25 with the molded substrate 1 placed thereon.
At this time, the vertical wall-shaped bellows members 31a separately provided on both sides in the moving direction of the first cutting table 17a extend one side with the movement of the first cutting table 17a, and the other side It will be reduced.
Next, the first cutting table 17a is rotated at a required angle (for example, an angle of 90 degrees) with the eccentric position 21a on the mounting surface 20a of the first cutting table 17a as the rotation center position.
At this time, the molded substrate 1 is cut by using the first cutting mechanism 28 (integrated cutting inspection means 62) and the second cutting mechanism 29 along the cutting line 4 (4b) in the short side direction. Can do.
At this time, the width 57 of the cutting groove 58 corresponding to the cutting line 4 (4b) can be inspected by the kerf check mechanism 59 of the integrated cutting inspection means 62.
Next, the first cutting table 17a on which the molded substrate 1 cut along all of the cutting lines 4b in the short side direction is placed at a required angle in the opposite direction with the eccentric position 21a as the rotation center position. Rotate to return to the original position.
At this time, the molded substrate 1 is cut using the first cutting mechanism 28 (integrated cutting inspection means 62) and the second cutting mechanism 29 along the cutting line 4 (4a) in the long side direction. Can do.
At this time, the width 57 of the cutting groove 58 corresponding to the cutting line 4 (4a) can be inspected by the kerf check mechanism 59 of the integrated cutting inspection means 62.
Accordingly, individual packages 5 (cut substrates 1c) can be formed on the mounting surface 20a of the first cutting table 17a.
The molded substrate 1 placed on the placement surface 20b of the second cutting table 17b is the same as the case of the first cutting table 17a.

(About inspection of groove width of cutting groove in substrate cutting method)
That is, at the substrate cutting position 25, as shown in FIG. 5 (1), the molded substrate 1 placed on the cutting table 17 (17a, 17b) is moved forward from the apparatus front surface 9a side to the apparatus rear surface 9b side. ) To move the integrated cutting inspection means 62 (or the second cutting mechanism 29) provided with the first cutting mechanism 28 in the cutting direction 65 relative to the cutting table 17.
Next, as shown in FIG. 5 (2), the integrated cutting inspection means 62 (or the second cutting mechanism 29) provided with the first cutting mechanism 28 is moved down, and the first cutting mechanism 28 is moved downward. By moving the integrated cutting inspection means 62 (or the second cutting mechanism 29) provided with the cutting mechanism 28 in the cutting direction 65 relative to the cutting table 17, the first blade 63 (or the first cutting mechanism 28) is moved. The shaped substrate 1 is cut along the cutting line 4 (4a, 4b) with the blade 64 of 2 to form a cutting groove 58 having a required width 57 corresponding to the cutting line 4 (4a, 4b). it can.
Therefore, next, as shown in FIG. 5 (3), there is a cutting groove 58 that is placed on the cutting table 17 (17a, 17b) and cut along the cutting line 4 (4a, 4b). By moving the molded substrate 1 from the apparatus back surface 9b side to the apparatus front surface 9a side (reversely), the integrated cutting inspection means 62 provided with the kerf check mechanism 59 is cut in the cutting direction relative to the cutting table 17. Is moved in the opposite direction 66 (check direction).
At this time, the width 57 of the cutting groove 58 can be inspected (kerf check) by the kerf check mechanism 59 provided in the integrated cutting inspection means 62.

In the embodiment described above, the integrated cutting inspection means 62 is provided with a cutting groove 58 formed by cutting the cutting line 4 (4a, 4b) provided on the molded substrate 1 by the second cutting mechanism 29. The kerf check mechanism 59 can inspect.
Further, in the above-described embodiment, at the substrate mounting position 24, the molded substrate 1 placed on the first cutting table 17a is aligned by the alignment mechanism 27 and the cutting lines 4 (4a, 4b) are set. And (substantially) simultaneously, at the substrate cutting position 25, the molded substrate 1 placed on the second cutting table 17b is moved along the cutting line 4 (4a, 4b) with the first cutting mechanism 28 (integrated cutting inspection means). 62) and the second cutting mechanism 29 are cut to form the cutting groove 58, and the width 57 of the cutting groove 58 formed on the molded substrate 1 is inspected by the kerf check mechanism 59 (integrated cutting inspection means 62). can do.
For this reason, the alignment setting using the twin table method of the present invention and the kerf check after cutting are compared with the configuration in which the alignment setting by the single table method of the conventional example and the kerf check after cutting are performed by one detection mechanism. The number of products (packages) produced per hour can be improved by the configuration in which the processes are performed individually.

(About the effect)
In other words, the present invention is a substrate cutting device 9 adopting a twin table system (two cutting tables 17), and aligns the molded substrate 1 on the first cutting table 17a at the substrate mounting position 24. Setting and (substantially) simultaneously cutting the molded substrate 1 on the second cutting table 17b along the cutting line 4 (4a, 4b) at the substrate cutting position 25 to form the cutting groove 58. The width 57 of the cutting groove 58 formed in the molded substrate 1 can be inspected.
Accordingly, by adopting the twin table method (two cutting tables 17), the substrate mounting position 24 is aligned with the molded substrate 1 on one of the two cutting tables 17 at the substrate mounting position 24. The cutting line 4 is set and the cutting line 4 is set, and at the same time, the molded substrate 1 on the other cutting table 17 can be cut and inspected at the substrate cutting position 25.
That is, by adopting the configuration of the twin table system (two cutting tables 17) and the configuration in which "alignment setting" and "inspection including cutting" are performed at the same time, the single table system shown in the conventional example is used. However, compared with the configuration in which “alignment setting” and “inspection” are combined with one detection mechanism, “alignment setting” and “inspection” are separately performed in the present invention. The number of (package) production can be improved and the molded substrate 1 can be efficiently cut.
Therefore, the productivity of the product (package) can be improved.

In addition, as described above, the present invention is a substrate cutting device 9 adopting a twin table system (two cutting tables 17), and is formed on the first cutting table 17a at the substrate mounting position 24. The alignment is performed on the finished substrate 1 and (substantially) at the same time, at the substrate cutting position 25, the shaped substrate 1 on the second cutting table 17b is cut along the cutting line 4 (4a, 4b) to obtain a cutting groove. 58 and the width 57 of the cutting groove 58 formed in the molded substrate 1 can be inspected.
For example, when the molded substrate 1 placed on one of the cutting tables 17a is cut (including the kerf check) at the substrate cutting position 25, the molded substrate 1 is supplied to the other cutting table 17b by the rotational alignment means 14. It can be set and placed and set for alignment.
For example, when the molded substrate 1 placed on one of the cutting tables 17a is cut (including the kerf check) at the substrate cutting position 25, first, the cut substrate 1c placed on the other cutting table 17b ( The package 5) is cleaned by the cleaning unit 30, and then the individual packages placed on the cutting table 17b can be transferred to the inspection unit C side at the substrate placement position 24.
Further, for example, when setting the alignment of the molded substrate 1 placed on one of the cutting tables 17a at the substrate placement position 24, the cleaned substrate 1c (package 5) placed on the other cutting table 17b is cleaned. 30 can be washed.
For this reason, in the present invention, the number of products (packages) produced per hour by the substrate cutting device 9 provided with the two cutting tables 17 (17a and 17b), the alignment mechanism 27, and the kerf check mechanism 59. Since the molded substrate 1 can be cut efficiently, the productivity of the product (package) can be improved.

In the present invention, the integrated cutting inspection means 62 can be formed by integrating the first cutting mechanism 28 and the kerf check mechanism 59.
Further, at the substrate cutting position 25, the integrated cutting inspection means 62 (first cutting mechanism 28) is cut in the cutting direction 65 by moving the cutting table 17 forward from the apparatus front surface 9a side to the apparatus rear surface 9b side. After moving relative to the table 17 and cutting the molded substrate 1 along the cutting line 4 by the first cutting mechanism 28 to form the cutting groove 58, the cutting table 17 is immediately moved to the apparatus rear surface 9b side. Is moved backward from the apparatus front surface 9a side to move the integrated cutting inspection means 62 (calf check mechanism 59) relative to the cutting table 17 in a direction 66 opposite to the cutting direction. The width 57 of the cutting groove 58 can be inspected.
That is, as shown in the conventional example, in the present invention, the substrate cutting position is compared with the configuration in which the alignment setting and the width of the cutting groove are inspected after cutting all the cutting lines at the substrate mounting position. 25, since the width 57 of the cutting groove 58 corresponding to this single cutting line 4 can be inspected immediately after cutting along the single cutting line 4, time for cutting the molded substrate 1 And the productivity of the product (package) can be improved.

In the above-described embodiment, the rotation center position of the cutting table 17 on which the molded substrate 1 is placed is set to the eccentric position 21 on the placement surface 20 of the cutting table 17, and two pieces are cut. Since the table 17 (17a, 17b) is provided at the close position (interval 33) so as to be able to run in parallel in a parallel state, the overall size of the substrate cutting apparatus can be reduced. .

The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as necessary without departing from the spirit of the present invention.

(About the second integrated cutting inspection means)
In the above-described embodiment, the kerf check mechanism 59 is attached to the first cutting mechanism 28 and the (first) integrated cutting inspection means 62 is formed and used. However, the second cutting mechanism A configuration may be adopted in which a kerf check mechanism 59 is attached to 29 to form a second integrated cutting inspection means.
In this case, two integrated cutting inspection means (62) are used to perform cutting along the cutting line of the substrate and inspection of the width of the cutting groove.
Therefore, in the present invention, a configuration using a plurality of required integral cutting inspection means (62) can be adopted.

(Independent cutting mechanism and independent kerf check mechanism)
Further, in the above-described embodiment, the configuration using the integrated cutting inspection means 62 in which the cutting mechanism (28, 29) and the kerf check mechanism (59) are integrated is exemplified. However, the required number of cutting mechanisms (28, 29) are exemplified. ) And the required number of kerf check mechanisms (59) can be provided independently of each other.
For example, it is possible to employ a configuration in which two cutting mechanisms and two kerf check mechanisms are provided independently of each other.
In this case, one cutting mechanism and one kerf check mechanism are independently provided exclusively for the cutting table 17a (molded substrate 1), and the cutting table 17b (molded substrate 1). One cutting mechanism and one kerf check mechanism can be provided independently and exclusively.

(About multiple alignment mechanisms)
In the above-described embodiment, the configuration using the single alignment mechanism 27 is illustrated, but a configuration using a plurality of required alignment mechanisms can be adopted.
In this case, for example, two alignment mechanisms can be employed, and the two cutting tables 17 (17a and 17b) can be provided separately and exclusively.

(About half-cut)
In the above-described embodiment, the configuration in which the cutting groove 58 is formed by full-cutting the cutting line 4 of the molded substrate 1 is illustrated. However, the groove depth (distance) of the cutting groove 58 is set to a required groove depth. Can be set.
For example, the cutting line 4 of the molded substrate 1 can be half cut to form a cutting groove having a required groove depth (for example, a half groove depth at the time of full cutting).

(About placement of molded substrates)
In the above-described embodiment, the configuration is shown in which the molded substrate 1 is supplied and set on the cutting table 17 with the ball surface 1a as the upper surface, but the molded substrate 1 is disposed on the cutting table 17 and the resin surface 1b is the upper surface. It is possible to adopt a configuration in which the cutting line is set by supplying and setting the alignment by the resin surface 1b.

(About the configuration of other units)
That is, the substrate loading unit A includes a substrate loading unit 41 that loads the molded substrate 1 and an extrusion member 42 that pushes the molded substrate 1 from the substrate loading unit 41.
Therefore, the molded substrate 1 can be supplied to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B by extruding the molded substrate 1 from the substrate loading unit 41 by the pushing member 42. It is configured as follows.
The package inspection unit C includes a package supply unit 43 that supplies each package 5 (cut substrate 1c) cut by the substrate cutting unit B to the package inspection unit 44, and an individual unit from the package supply unit 43. A package inspection unit 44 for inspecting the package 5 (1c), an inspection camera 45 for inspecting the individual packages 5 by the package inspection unit 44, and the package 5 inspected by the package inspection units 44 and 45 as good and defective And a package sorting means 46 for sorting and transferring the package to the package accommodation unit D.
Accordingly, in the package inspection unit C, each package 5 (1c) supplied from the substrate cutting unit B to the package supply unit 43 is inspected by the camera 45 by the package inspection unit 44, whereby the package selection unit 46 is inspected. Thus, it can be sorted into non-defective products and defective products and transferred to the package accommodation unit D.
The package housing unit D includes a non-defective product tray 47 that stores non-defective products and a defective product tray 48 that stores defective products.
Therefore, in the package housing unit D, the package 5 inspected as a non-defective product by the package inspection unit C is stored in the non-defective product tray 47 by the package sorting means 46, and the package 5 inspected as a defective product is stored in the package sorting means 46. Can be accommodated in the defective product tray 48.

As described above, the package inspection unit C is a unit that inspects the package 5 cut from the molded substrate 1 with an inspection camera (inspection mechanism).
That is, in the inspection unit C, the ball surface 5a (including the package size) of the package 5 can be inspected first, and then the resin surface 5b of the package 5 can be inspected.
Furthermore, in the inspection unit C, the ball surface 5a of each package 5 (1c) is placed on the first plate with the ball surface 5a as the upper surface, and is reversed in this state, and is individually viewed by the inspection camera from the lower position. The ball surface 5a of the package 5 (1c) is inspected, and then the package 5 (1c) is placed on the second plate with the resin surface 5b of the package 5 (1c) as the upper surface, and this package 5 ( The resin surface 5b of 1c) can be inspected with an inspection camera.

Claims (10)

1. Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the above-described formed substrate is placed on the above-described cutting table,
   First, at the substrate mounting position described above, by setting the alignment of the molded substrate described above with an alignment mechanism, a cutting line is set on the molded substrate described above,
   Next, the cutting groove formed by cutting the molded substrate along the cutting line with the cutting mechanism at the substrate cutting position is inspected with a kerf check mechanism. Cutting method.
2. Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the molded substrate is placed on the cutting table described above,
   In the above-described substrate placement position, by setting the alignment of the molded substrate described above with an alignment mechanism, a step of setting a cutting line on the molded substrate described above;
   By cutting the molded substrate with the cutting mechanism described above along the cutting line of the molded substrate, the cutting groove corresponding to the cutting line described above is formed on the molded substrate. Forming, and
   In the above-described substrate cutting position, performing a step of inspecting the cutting groove formed in the above-described molded substrate with a kerf check mechanism,
   Cutting the molded substrate along the cutting line by moving the cutting mechanism relative to the cutting table in the cutting direction during the cutting process of the cutting line described above;
   In the above-described cutting groove inspection step, the above-described cutting groove is inspected by the above-described kerf check mechanism by moving the above-described kerf check mechanism relative to the cutting table in a direction opposite to the cutting direction described above. A method for cutting a substrate, comprising:
3. Using the substrate cutting apparatus provided with two cutting tables, the two cutting tables described above are moved from the substrate mounting position provided in the apparatus described above to the substrate cutting position, respectively, In each case, first, the molded substrate is placed on the cutting table at the substrate mounting position, and then the molded substrate is placed on the cutting table at the substrate cutting position. A method of cutting a substrate that forms a package by cutting with a cutting mechanism,
   In each of the above-described cutting tables, first, in the above-described substrate mounting position, by setting the alignment of the molded substrate described above with an alignment mechanism, a cutting line is set on the molded substrate described above,
   Next, a method for cutting a substrate, comprising performing a step of inspecting a cutting groove formed by the above-described cutting mechanism with a kerf check mechanism at the above-described substrate cutting position.
4. When the formed substrates placed on the two cutting tables are cut separately by the cutting mechanism, each of the cutting tables described above has a predetermined angle with the eccentric position of the cutting table as the center position of rotation. The substrate cutting method according to claim 3, wherein the substrate is rotated separately.
5. A cutting mechanism for cutting a required portion of the molded substrate;
   A cutting table for placing the molded substrate;
   Reciprocating means for reciprocating the cutting table between the substrate mounting position and the substrate cutting position, and a substrate cutting apparatus comprising:
   In the above-described substrate mounting position, while providing an alignment mechanism for setting the alignment of the molded substrate mounted on the cutting table described above,
   A substrate cutting apparatus comprising a kerf check mechanism for inspecting a cutting groove formed by cutting the molded substrate with the above-described cutting mechanism at the substrate cutting position.
6. 6. The substrate cutting apparatus according to claim 5, further comprising an integrated cutting inspection means in which the cutting mechanism and the kerf check mechanism are integrated.
7. While providing an integrated cutting inspection means that integrates the cutting mechanism and the kerf check mechanism,
   The said cutting mechanism and said kerf check mechanism in said integrated cutting inspection means were comprised so that it might arrange | position along the cutting line of the molded board | substrate which said cutting mechanism cut | disconnects. Board cutting equipment.
8. 6. The substrate cutting apparatus according to claim 5, wherein two of the cutting tables are provided.
9. 6. The substrate cutting apparatus according to claim 5, wherein a rotation mechanism is provided for rotating the cutting table at a required angle with an eccentric position of the cutting table as a rotation center position.
10. A debris removal mechanism is provided for removing the debris adhering to the package surface by spraying a two-fluid mixed liquid in which air and water are mixed on the surface of the package formed by the cutting mechanism. The substrate cutting device according to claim 5, wherein the substrate cutting device is configured.

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