JP2012004225A - Fixture for substrate to be cut and manufacturing method for product substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixture for a substrate to be cut and a manufacturing method for a product substrate capable of reducing manufacturing time of the product substrate.SOLUTION: A fixture 40 for a semiconductor substrate A comprises: a mounting section 41 where the semiconductor substrate A is to be mounted; a blade groove 45 in which blade 32a and 32b to cut the semiconductor substrate A are to be inserted; and a water supply hole 46 having an opening 46a on the blade groove 45 to supply water to the blade groove 45.

Description

  The present invention relates to a jig for a substrate to be cut and a method for manufacturing a product substrate.

  Conventionally, a semiconductor package in which a plurality of ICs are encapsulated with a resin material is cut to manufacture a semiconductor package (for example, Patent Document 1). The semiconductor package manufacturing apparatus disclosed in Patent Document 1 includes a jig for fixing a semiconductor substrate and a cutting mechanism for cutting the semiconductor substrate.

  In this manufacturing apparatus, the jig includes a mounting portion on which the semiconductor substrate is mounted, and a blade groove that is formed corresponding to the cut portion of the semiconductor substrate and partitions the mounting portion. In addition, the cutting mechanism includes a blade rotatably supported by the spindle, an injection mechanism that injects cooling water onto the side and tip of the blade, and debris removal that injects a gas-liquid two-fluid mixture onto the surface of the package when cutting And a mechanism capable of reciprocating vertically and horizontally and vertically.

  In this manufacturing apparatus, the semiconductor substrate is placed on the jig such that the cut portion coincides with the blade groove of the jig. In this state, the cutting mechanism moves along the cutting line of the semiconductor substrate and cuts the semiconductor substrate by rotating the blade and inserting the blade groove of the jig. The spray mechanism sprays cooling water onto the blade when cutting with the blade, and suppresses the blade and the semiconductor substrate from becoming high temperature. In addition, the broken material removal mechanism jets the gas-liquid two-fluid mixture and blows away the broken material such as cutting chips adhering to the upper surface of the package (surface opposite to the jig) by cutting. Yes.

JP 2009-218397 A

  In the above manufacturing method, the broken material generated by cutting the semiconductor substrate falls into the blade groove, or the broken material is mixed into the cooling water or the gas-liquid two-fluid sprayed around the cutting portion. Or the like, the broken material may adhere to the surface of the semiconductor substrate on the jig side. For this reason, after cutting the semiconductor substrate, it is necessary to move the cut semiconductor package to a cleaning unit to remove the broken material adhering to the semiconductor package, which increases the manufacturing time.

  Note that such problems may occur when cutting a substrate made up of a plurality of ICs and dividing them into one IC chip, or when cutting other resin substrates before encapsulating or stacking ICs. It may also occur when manufacturing a product substrate by cutting.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a jig for a substrate to be cut and a method for manufacturing a product substrate, which can shorten the manufacturing time of the product substrate.

  According to an aspect of the present invention, a jig for a substrate to be cut includes a placement portion on which the substrate to be cut is placed, a blade groove into which a blade for cutting the substrate to be cut is inserted, and a blade groove Removing means for removing the broken material.

  Further, according to one aspect of the present invention, the substrate to be cut is placed on a jig, and the substrate to be cut is cut along a blade groove formed in the jig by a blade to be divided into product substrates. Then, the product substrate is manufactured by removing the broken material in the blade groove by the removing means provided corresponding to the blade groove.

  According to these configurations, it is not necessary to move the cut product substrate to the cleaning unit when removing broken material from the product substrate, and the substrate to be cut is placed on the cutting jig while being cut. The broken material adhering to the surface of the substrate on the jig side can be removed. Therefore, it is possible to shorten the time required for removing the broken material from the product substrate and shorten the production time of the product substrate.

  According to one aspect of the present invention, it is possible to reduce the time required to remove the broken material from the product substrate and to shorten the manufacturing time of the product substrate.

The schematic diagram which shows the manufacturing apparatus of the semiconductor package which concerns on embodiment. The top view which shows a jig | tool. The schematic diagram which shows collectively the cross-section in the III-III line | wire of FIG. 2, and its periphery mechanism. The top view which shows the jig | tool and cutting mechanism at the time of the cutting | disconnection of the board | substrate for semiconductors. The schematic diagram which shows collectively the cross-section in the VV line | wire of FIG. 4, and its periphery mechanism.

Hereinafter, an embodiment will be described with reference to FIGS.
FIG. 1 shows a semiconductor package manufacturing apparatus 10 according to this embodiment. The manufacturing apparatus 10 includes a transport unit 20 for placing a semiconductor substrate (substrate to be cut) A before cutting, a cutting unit 30 for cutting the semiconductor substrate A, and a semiconductor substrate A after cutting, that is, a semiconductor package ( A storage unit 50 for storing the product substrate (B), and a control device 60 for controlling the operations of the units 20, 30 and 50. In FIG. 1, a plurality of semiconductor substrates A are placed on the transfer unit 20, the semiconductor substrates A are not placed on the cutting unit 30, and the semiconductor package B is placed in the storage unit 50. The state where it is stored is shown.

  The semiconductor substrate A has a substantially rectangular shape in plan view, and there are a plurality of ICs (32 in total, in this embodiment, 8 rows in the x-axis direction and 4 rows in the y-axis direction in FIG. 1). A chip is mounted. The semiconductor substrate A is divided into 32 semiconductor packages having a substantially square shape in plan view by being cut at a cutting portion indicated by a two-dot chain line. It should be noted that the cut portion may or may not be displayed on the surface of the semiconductor substrate A. In the semiconductor substrate A, alignment portions a1 and a2 when being placed on the jig 40 of the cutting unit 30 to be described later are formed at the center of each of the short side and the long side.

  The transport unit 20 includes a belt conveyor 21 and a first transport mechanism 22. The belt conveyor 21 sequentially conveys a plurality of semiconductor substrates A before cutting in the y-axis direction of FIG. The first transport mechanism 22 includes a main body 23, a suction plate 24 provided on the lower surface of the main body 23, and a CCD camera 25 that images the semiconductor substrate A and the jig 40 of the cutting unit 30. The main body 23 of the first transport mechanism 22 can reciprocate in the x-axis, y-axis, and z-axis directions. The suction board 24 is connected to the first vacuum pump 27 through the first air pipe 26.

The cutting unit 30 includes two cutting mechanisms 31 a and 31 b for cutting the semiconductor substrate A, and a jig 40 for fixing the semiconductor substrate A.
Each cutting mechanism 31a, 31b includes blades 32a, 32b, spindles 33a, 33b that support the blades 32a, 32b, and motors 34a, 34b that rotate the spindles 33a, 33b. The motors 34a and 34b are accommodated in casings 35a and 35b, and water injection units 36a and 35a and 35b for supplying cooling water for cleaning broken materials due to cooling and cutting of the blades 32a and 32b, 36b is attached. The water injection units 36 a and 36 b are connected to the first water supply pump 38 through the first water supply pipe 37.

  The casings 35a and 35b of the cutting mechanisms 31a and 31b can reciprocate in the x-axis, y-axis, and z-axis directions through a driving mechanism (not shown). When the casings 35a and 35b move in these directions, the motors 34a and 34b, the blades 32a and 32b, the spindles 33a and 33b, and the water injection units 36a and 36b also move in these directions.

  The jig 40 is formed in a rectangular shape having the same size as that of the semiconductor substrate A in plan view. The jig 40 includes a placement portion 41 on which the semiconductor substrate A is placed, and a blade groove 45 that is provided corresponding to the cut portion of the semiconductor substrate A. The mounting portions 41 are partitioned by blade grooves 45, and are substantially square shapes whose plan view is slightly smaller than the semiconductor package B manufactured by cutting the semiconductor substrate A, and have eight rows in the x-axis direction. They are arranged in four rows in the y-axis direction. The jig 40 is provided with alignment portions b1 and b2 with the semiconductor substrate A at the center of each of the short side and the long side. The jig 40 is supported by the table 30a of the cutting unit 30 so as to be rotatable about the center c of the jig 40 in the x-axis and y-axis directions. Thereby, the jig | tool 40 is comprised so that rotation between the state shown with a continuous line and the state shown with a 2 point | piece difference line in FIG. 1 is possible.

  FIG. 2 is an enlarged plan view showing the jig 40, and FIG. 3 shows the sectional structure taken along the line III-III in FIG. 2 and the peripheral mechanism of the jig 40 together. As shown in FIG. 3, the jig 40 has a two-layer structure in which the resin layer R overlaps the metal layer M in more detail, and each mounting portion 41 includes the resin layer R. Yes. As shown in FIGS. 2 and 3, suction holes 42 for adsorbing and fixing the semiconductor substrate A are formed in each placement portion 41 and a portion of the metal layer M corresponding to the placement portion 41. . Each suction hole 42 penetrates from the upper surface of each mounting portion 41 to the lower end of the metal layer M, and the lower end of each suction hole 42 is connected to the second vacuum pump 44 through the second air pipe 43.

  The blade groove 45 is a portion into which the blades 32a and 32b of the cutting mechanisms 31a and 31b are rotated and inserted when the semiconductor substrate A is cut. As shown in FIG. 3, the blade groove 45 includes a side wall of the resin layer R (mounting portion 41) and an upper surface of the metal layer M. The bottom surface of the blade groove 45 is formed with a plurality of water supply holes (removal means, fluid holes) 46 a that penetrate from the bottom surface to the lower end of the metal layer M. In the present embodiment, as shown in FIG. 2, three water supply holes 46 are provided corresponding to the four sides of one placement portion 41. Moreover, in this embodiment, the space | interval of the adjacent water supply hole 46 is set to 1 mm or less, for example. Thereby, water supply to the blade groove 45 through the water supply hole 46 described later is evenly and sufficiently performed to each part of the blade groove 45. As shown in FIG. 3, the water supply hole 46 is connected to a second water supply pump 48 through a second water supply pipe 47.

  As shown in FIG. 1, the storage unit 50 includes a second transport mechanism 51, a non-defective product tray 57, and a defective product tray 58. The second transport mechanism 51 includes a main body 52, a suction board 53 provided on the lower surface of the main body 52, and a CCD camera 54 that images the semiconductor package B after cutting. The main body 52 of the second transport mechanism 51 can reciprocate in the x-axis, y-axis, and z-axis directions. The suction board 53 is connected to the third vacuum pump 56 through the third air pipe 55. The non-defective product tray 57 stores the non-defective product B1 of the semiconductor package B after the semiconductor substrate A is cut, and the defective product tray 58 stores the defective product B2 of the semiconductor package B.

  The control device 60 is electrically connected to the mechanisms of the units 20, 30, and 50 as shown by the one-dot chain arrows in FIG. 1, and controls the operation of these mechanisms. Specifically, in the transport unit 20, the belt conveyor 21, the main body 23 of the first transport mechanism 22, the first vacuum pump 27, and the CCD camera 25 are electrically connected to the control device 60. In the cutting unit 30, the motors 34 a and 34 b of the cutting mechanisms 31 a and 31 b, the drive mechanism of the casings 35 a and 35 b, the second vacuum pump 44, and the water supply pumps 38 and 48 are electrically connected to the control device 60. Yes. In the storage unit 50, the main body 52, the third vacuum pump 56, and the CCD camera 54 of the second transport mechanism 51 are electrically connected to the control device 60.

  In the semiconductor package manufacturing apparatus 10 configured as described above, the semiconductor package B is manufactured as follows under the control of various mechanisms by the control device 60. A method for manufacturing a semiconductor package will be described with reference to FIGS. FIG. 4 is a plan view showing a state in which the semiconductor substrate A is cut by the two cutting mechanisms 31a and 31b, and FIG. 5 shows a sectional structure taken along line VV in FIG. FIG.

  As shown in FIG. 1, when the semiconductor substrate A is first placed on the belt conveyor 21, the belt conveyor 21 moves in the y-axis direction, and the semiconductor substrate A moves to the lowest end ( It is conveyed to the position of the end in the y-axis direction). The control device 60 moves the main body portion 23 of the first transport mechanism 22 downward (in the z-axis direction), and the first vacuum pump 27 is operated in this state so that the semiconductor substrate A is sucked and fixed by the suction plate 24. . The first transport mechanism 22 moves to the cutting unit 30 side (x-axis direction) after the main body portion 23 moves upward in a state where the semiconductor substrate A is sucked and fixed.

  The control device 60 controls the CCD camera 25 to image the semiconductor substrate A and the jig 40 of the cutting unit 30, and based on the imaging result, the alignment portions a1 and a2 of the semiconductor substrate A and the jig The main body portion 23 is moved so that the 40 alignment portions b1 and b2 are in the same position in the x-axis and y-axis directions. Based on the imaging result of the CCD camera 25, the control device 60 matches the positions of the alignment portions a1 and a2 of the semiconductor substrate A and the alignment portions b1 and b2 of the jig 40 in the x-axis direction and the y-axis direction. If determined, the driving of the first vacuum pump 27 is stopped. As a result, the semiconductor substrate A is placed on the jig 40 of the cutting unit 30 while being aligned.

  In the cutting unit 30, as shown in FIG. 5, the air in the suction hole 42 is sucked by the second vacuum pump 44 by operating the second vacuum pump 44 with the semiconductor substrate A placed thereon. The semiconductor substrate A is sucked and fixed to the mounting portion 41 of the jig 40. The control device 60 starts cutting the semiconductor substrate A by driving and controlling the cutting mechanisms 31a and 31b in a state where the semiconductor substrate A is fixed to the jig 40 by suction.

  First, as shown in FIGS. 4 and 5, the control device 60 moves the casings 35 a and 35 b of the cutting mechanisms 31 a and 31 b to bring the blades 32 a and 32 b into positions corresponding to the cutting positions of the semiconductor substrate A. Move. Note that the control device 60 stores a cutting location corresponding to the semiconductor substrate A to be cut in advance, and the control device 60 performs casings 35a and 35b of the cutting mechanisms 31a and 31b based on the stored information. The blades 32a and 32b are moved to positions corresponding to the cut portions of the semiconductor substrate A. The control device 60 drives the motors 34a and 34b of the cutting mechanisms 31a and 31b to rotate the blades 32a and 32b, and in this state, moves the casings 35a and 35b downward (z-axis direction). As a result, as shown in FIG. 5, the blades 32 a and 32 b pass through the cut portions of the semiconductor substrate A and are inserted into the blade grooves 45, thereby cutting the semiconductor substrate A.

  Note that the cutting unit 30 of the present embodiment includes two cutting mechanisms 31a and 31b. Therefore, as shown in FIGS. 4 and 5, the two cutting mechanisms 31a and 31b are moved in the y-axis direction while being arranged in parallel in the x-axis direction. Two cutting points extending in the direction are cut simultaneously. 4 and 5, the two cutting mechanisms 31a and 31b have already cut the cutting points at both ends in the x-axis direction, and the blades 32a and 32b of the two cutting mechanisms 31a and 31b It shows a disconnected state. In this way, the cutting mechanisms 31a and 31b sequentially move inward in the x-axis direction, and sequentially cut the cutting portions extending in the y-axis direction. In the present embodiment, since the number of cutting points extending in the y-axis direction is an odd number of seven, the last one point is cut by one of the cutting mechanisms 31a and 31b.

  The control device 60 drives the water supply pumps 38 and 48 when the semiconductor substrate A is cut by the blades 32a and 32b of the cutting mechanisms 31a and 31b. As a result, water is sprayed to and around the blades 32a and 32b through the water ejecting portions 36a and 36b, the blades 32a and 32b are cooled, and the cutting dust and the like adhering to the upper surface of the semiconductor substrate A by cutting are broken. The material is removed by the water stream.

  Here, when the semiconductor substrate A is cut by the blades 32 a and 32 b, broken material due to the cutting may fall into the blade groove 45. In the present embodiment, water is ejected from above the semiconductor substrate A through the water ejecting portions 36a and 36b. Therefore, even when the water mixed with the broken material flows down to the blade groove 45, the broken material is removed from the blade. There is a possibility of entering the groove 45. For this reason, there is a possibility that broken materials adhere to the lower surface of the semiconductor substrate A. In this regard, in the present embodiment, water is supplied to the blade groove 45 through the water supply hole 46 by driving the second water supply pump 48. Therefore, by removing the broken material that has entered the blade groove 45 with a water flow, the broken material attached to the lower surface (the surface on the jig 40 side) of the semiconductor substrate A can be removed. In this way, in this embodiment, simultaneously with the cutting of the semiconductor substrate A, it is possible to remove both the broken materials adhering to the upper surface and the lower surface of the semiconductor substrate A.

  In the state shown in FIGS. 4 and 5, after cutting all the cutting points extending in the y-axis direction, as shown in FIG. 1, the jig 40 is rotated by 90 ° about the center c as the center of rotation. The state indicated by the dotted line is shown. Then, in the same manner as described above, three cutting lines extending in the y-axis direction are cut with a blade by the cutting mechanisms 31a and 31b. Also at this time, broken materials on the upper and lower surfaces of the semiconductor substrate A are removed by driving the water supply pumps 38 and 48. In this way, the semiconductor package B to which no broken material is attached is manufactured.

  The cut semiconductor package B is transported to the storage unit 50 by the second transport mechanism 51. Specifically, the main body 52 of the second transport mechanism 51 moves to the cutting unit 30 side and drives the third vacuum pump 56 to suck and fix the semiconductor packages B one by one by the suction disk 53. The control device 60 determines a cutting state (cutting position shift or the like) based on an image captured by the CCD camera 54 and sorts the semiconductor package B into a non-defective product tray 57 and a defective product tray 58. The semiconductor package B is manufactured as described above.

According to the said embodiment, there can exist the following effects.
(1) In the semiconductor package manufacturing apparatus 10, the jig 40 of the cutting unit 30 is inserted with the placement portion 41 on which the semiconductor substrate A is placed and the blades 32 a and 32 b that cut the semiconductor substrate A. A blade groove 45 and a water supply hole 46 having an opening 46 a in the blade groove 45 are provided. As a result, even when broken material falls into the blade groove 45 or water containing the broken material flows down, the water in the blade groove 45 is crushed by supplying water to the blade groove 45 through the water supply holes 46. Therefore, the broken material adhering to the surface of the semiconductor substrate A on the jig 40 side can be removed. Therefore, since it is not necessary to move the semiconductor package B after cutting to a cleaning unit different from the cutting unit 30 in removing the broken material of the semiconductor package B, the manufacturing time of the semiconductor package B can be shortened.

  (2) In this embodiment, the cutting of the semiconductor substrate A by the blades 32 a and 32 b and the water supply to the blade groove 45 through the water supply hole 46 of the jig 40 are performed simultaneously. Thereby, the manufacturing time can be further shortened as compared with the case where the broken material is removed by water supply through the water supply hole 46 after the semiconductor substrate A is cut.

(Other embodiments)
In the above embodiment, the cutting of the semiconductor substrate A by the blades 32 a and 32 b and the water supply to the blade groove 45 through the water supply hole 46 are performed simultaneously. However, the semiconductor substrate may be cut by the blade and then supplied to the blade groove through the water supply hole. Even in this case, the broken material adhering to the lower surface of the semiconductor substrate can be washed away with water supply and removed. Moreover, since the broken material adhering to the lower surface of the semiconductor substrate A can be removed in a state where the semiconductor substrate is placed on the jig, the semiconductor package is moved to another unit for cleaning the broken material. This eliminates the need for manufacturing time.

  In the above embodiment, both the cooling of the blades 32a and 32b and the removal of the broken material adhering to the upper surface of the semiconductor substrate A are performed by spraying water by the water spraying portions 36a and 36b of the cutting mechanisms 31a and 31b. Like to do. However, the cooling of the blade and the removal of the broken material adhering to the upper surface of the semiconductor substrate A may be performed by individual means. In this case, for example, as shown in the background art, a mode in which cooling water is supplied to each of the side surface and the cutting edge of the blade and the gas-liquid two fluid is sprayed on the cut portion of the semiconductor substrate A is adopted. May be.

  In the above embodiment, the broken material adhering to the lower surface of the semiconductor substrate A is washed away by supplying water to the blade groove 45 through the water supply hole 46. However, for example, by blowing air to the blade groove through a fluid hole having an opening in the blade groove, the broken material adhering to the lower surface of the semiconductor substrate is blown away, or the breakage attached to the semiconductor substrate through the fluid hole is removed. You may make it remove the broken material adhering to the board | substrate for semiconductors by attracting | sucking material. Further, the removing means is not limited to a configuration having an opening on the bottom surface of the blade groove, and may be configured by, for example, a fluid pipe for supplying or sucking fluid from the side of the blade groove, You may remove the broken material of the lower surface of the board | substrate for semiconductors mounted in the jig | tool by methods other than attraction | suction.

  Moreover, the arrangement | sequence aspect and cutting location of IC in the semiconductor substrate mounted in a jig | tool are not specifically limited. Further, the present invention may be applied to a method and jig for manufacturing a product substrate by cutting a substrate to be cut other than a semiconductor substrate. For example, an IC substrate (semiconductor wafer) is cut into a plurality of IC chips. You may apply to the method and jig | tool to perform, and the method and jig | tool which cut | disconnect a resin substrate into a some resin substrate. Further, the shape and material of the jig, the interval and the number of fluid holes, and the like can be appropriately changed according to the substrate to be cut and the like, and are not limited to the shapes exemplified in the above embodiment.

  DESCRIPTION OF SYMBOLS 10 ... Manufacturing apparatus, 30 ... Cutting unit, 30a ... Table, 31a, 31b ... Cutting mechanism, 32a, 32b ... Blade, 36a, 36b ... Water injection part, 37, 38 ... 1st water supply piping, 40 ... Jig, 41 ... Placement part, 42 ... Suction hole, 43 ... Second air pipe, 44 ... Second vacuum pump, 45 ... Blade groove, 46 ... Water supply hole, 46a ... Opening, 47 ... Second water supply pipe, 48 ... Second water supply Pump, 60 ... control device.

Claims (6)

A placement section on which the substrate to be cut is placed;
A blade groove into which a blade for cutting the substrate to be cut is inserted;
A jig for a substrate to be cut, comprising: removing means for removing broken material in the blade groove. The said removal means has an opening in the said blade groove | channel, The fluid hole for supplying a fluid to the said blade groove | channel or attracting | sucking a fluid from the said blade groove | channel is characterized by the above-mentioned. Cutting board jig. The suction hole for sucking and fixing each of a plurality of product substrates manufactured by cutting the substrate to be cut is formed in the placement portion. Cutting board jig. Place the substrate to be cut on the jig,
The blade is divided into product substrates by cutting the substrate to be cut along the blade grooves formed in the jig,
A manufacturing method of a product substrate, wherein the broken material in the blade groove is removed by a removing means provided corresponding to the blade groove. The product according to claim 4, wherein the removing means is a fluid hole which has an opening in the blade groove and supplies fluid to the blade groove or sucks fluid from the blade groove. A method for manufacturing a substrate. 6. The method for manufacturing a product substrate according to claim 4, wherein the cutting of the substrate to be cut by the blade and the removal of the broken material by the removing means are simultaneously performed.

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