JP6847525B2 - Cutting equipment - Google Patents

Description

The present invention relates to a cutting apparatus for cutting a workpiece.

In the device chip manufacturing process, grid-like division schedule lines called streets are set on the surface of a wafer made of silicon or compound semiconductor, and devices such as ICs and LSIs are formed in each area partitioned by the division schedule lines. Will be done. These wafers are cut along the planned split line and split into individual device chips.

Cutting of a workpiece such as a wafer is performed by, for example, a cutting apparatus having a cutting unit including a cutting blade. The cutting unit includes a cylindrical spindle that serves as an axis of rotation, and a cutting blade. The cutting blade has a ring shape having a hole in the center, and the spindle is inserted into the hole and mounted on the spindle.

During cutting, the cutting blade is rotated by rotating the spindle. When the rotating cutting blade comes into contact with the workpiece, the workpiece is cut. At the time of cutting, the cutting fluid is supplied to the cutting blade and the workpiece. The cutting fluid removes cutting chips and heat generated by cutting the workpiece.

By the way, the work piece is supported by an adhesive tape stretched on an annular frame in advance so that the work piece can be easily handled even after the work piece is cut and divided into individual chips and the like. At the time of cutting, the workpiece is held on the chuck table provided in the cutting device in the state of the annular frame and the frame unit integrated with the adhesive tape. Then, after the cutting process is completed, the frame unit is separated from the chuck table.

At this time, the cutting fluid supplied during the cutting process and taking in the cutting chips adheres to the frame unit, but if the cutting fluid drops during the transportation of the frame unit, the transport path is contaminated. Therefore, the cutting device is provided with a cleaning nozzle that injects a cleaning liquid onto the upper surface of the frame unit that has been cut (see Patent Document 1). When a water curtain is formed by the cleaning nozzle and the frame unit is passed through the water curtain, the cutting fluid adhering to the upper surface can be removed.

Japanese Unexamined Patent Publication No. 2015-149428

The outer diameter of the upper surface (holding surface) of the chuck table of the cutting device is smaller than the outer diameter of the frame unit. Therefore, when the frame unit is sucked and held on the chuck table, the outer peripheral portion of the lower surface of the frame unit protrudes from the chuck table and is exposed. Then, the cutting fluid that is supplied to the cutting blade or the workpiece during cutting and scatters including cutting chips adheres not only to the upper surface of the frame unit but also to the lower surface exposed from the chuck table.

Since the cutting fluid adhering to the lower surface of the frame unit cannot be removed by the water curtain described above, the cutting fluid remains on the lower surface of the frame unit and then falls into the transport path of the frame unit to pollute the transport path. There is.

In addition, the frame unit that has been machined is finally housed in a cassette installed in the cutting device. A plurality of frame units are housed in the cassette. Therefore, when the frame unit in which the cutting fluid adheres to the lower surface is housed in the cassette, the cutting fluid falls on the other frame unit housed under the cassette and contaminates the workpiece of the other frame unit. In some cases.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a cutting device capable of removing cutting fluid adhering to a portion exposed from a chuck table on the lower surface of a frame unit.

According to one aspect of the present invention, a frame unit having an annular frame, an adhesive tape stretched on an opening of the annular frame, and a workpiece supported on the upper surface of the adhesive tape can be sucked and held on a holding surface. A chuck table that can rotate around an axis perpendicular to the holding surface, and a cutting unit that cuts the workpiece while supplying cutting fluid to the workpiece of the frame unit held by the chuck table. From the position facing the machining feed unit that moves the chuck table in the machining feed direction parallel to the holding surface and the first region of the lower surface of the frame unit held by the chuck table that protrudes from the chuck table. It has an air nozzle that ejects air toward the first region, and after cutting the workpiece, it ejects air toward the first region to remove the cutting fluid adhering to the first region. Provided is a cutting apparatus comprising a cutting fluid removing unit capable of removing the cutting fluid.

In one aspect of the present invention, the frame unit is conveyed between the cleaning unit for cleaning the workpiece of the frame unit machined by the cutting unit, the chuck table, and the cleaning unit. The cleaning unit is further provided with a unit, and the holding surface of the chuck table is composed of an upper surface of a porous member that exerts a negative pressure on the frame unit and an upper surface of a frame that surrounds the porous member. Has a cleaning holding surface that holds the frame unit and can rotate around an axis perpendicular to the cleaning holding surface, and a cleaning liquid is applied to the workpiece of the frame unit held by the cleaning table. The cleaning holding surface of the cleaning table is formed to have a size that fits on the upper surface of the porous member of the chuck table, and the cleaning unit is attracted by the frame unit to the chuck table. When held, a second region of the lower surface of the frame unit supported by the frame can be exposed when the frame unit is held on the washing table, and the centrifugal force due to the rotation of the washing table can be used to expose the second region. The cutting liquid adhering to the region 2 may be removed.

The cutting apparatus according to one aspect of the present invention is an air nozzle that ejects air from a position facing a first region protruding from the chuck table on the lower surface of the frame unit held by the chuck table toward the first region. It is equipped with a cutting fluid removal unit to have. According to the cutting fluid removing unit, the cutting fluid adhering to the first region can be removed by ejecting air toward the first region after cutting the workpiece.

In the cutting device, after cutting the workpiece, the machining feed unit is operated while ejecting air from the air nozzle to move the chuck table in the machining feed direction. When a part of the first region on the lower surface of the frame unit passes above the air nozzle, the air removes the cutting fluid adhering to the part.

Then, after rotating the chuck table around an axis perpendicular to the holding surface, the machining feed unit is operated to pass the other part of the first region of the lower surface of the frame unit above the air nozzle. And remove the cutting fluid adhering to the other part. By rotating the chuck table and moving the chuck table a plurality of times in this way, the cutting fluid is removed in the entire area of the first region exposed from the chuck table on the lower surface of the frame unit.

As described above, the present invention provides a cutting apparatus capable of removing the cutting fluid adhering to the exposed portion from the chuck table on the lower surface of the frame unit.

It is a perspective view which shows typically a cutting apparatus and a frame unit. FIG. 2A is a cross-sectional view schematically showing a cutting fluid removing unit and a chuck table of a cutting device, and a frame unit held by the chuck table, and FIG. 2B is a cross-sectional view of the cutting device. It is sectional drawing which shows typically the washing table and the frame unit held in the washing table.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram schematically showing a configuration example of a cutting device 2 according to the present embodiment. As shown in FIG. 1, the cutting device 2 includes a base 4 that supports each structure.

A rectangular opening 4a is formed in the front corner of the base 4, and a cassette support 6 that moves up and down is provided in the opening 4a. A cassette 8 accommodating a plurality of frame units 1 is placed on the upper surface of the cassette support base 6. Note that FIG. 1 shows only the outline of the cassette 8 for convenience of explanation.

The frame unit 1 has an annular frame 3, an adhesive tape 5 stretched in the opening of the annular frame 3, and a workpiece 7 supported on the upper surface of the adhesive tape 5. The workpiece 7 is, for example, a circular wafer made of a semiconductor material such as silicon, and its surface side is divided into a central device region and an outer peripheral surplus region surrounding the device region. The device area is further divided into a plurality of areas by scheduled division lines (streets) arranged in a grid pattern, and devices such as ICs and LSIs are formed in each area.

An adhesive tape 5 having a diameter larger than that of the workpiece 7 is attached to the back surface side of the workpiece 7. The outer peripheral portion of the adhesive tape 5 is fixed to the annular frame 3. That is, the workpiece 7 is supported by the annular frame 3 via the adhesive tape 5.

The workpiece 7 may be a wafer other than a circular wafer made of a semiconductor material such as silicon, and the material, shape, structure, etc. of the workpiece 7 are not limited. For example, a rectangular substrate made of a material such as ceramics, resin, or metal can be used as the workpiece 7. There are no restrictions on the type, quantity, arrangement, etc. of devices.

The cutting device 2 is provided with a transport mechanism (not shown) for taking out the frame unit 1 housed in the cassette 8 mounted on the cassette support 6 and mounting the frame unit 1 on the chuck table 14 described later. Has been done. According to the transfer mechanism, the frame unit 1 can be accommodated in the cassette 8 after the cutting process is completed.

A rectangular opening 4b long in the X-axis direction (front-rear direction, machining feed direction) is formed on the side of the cassette support 6. Inside the opening 4b, an X-axis moving table 10, an X-axis moving mechanism (not shown) for moving the X-axis moving table 10 in the X-axis direction, and a dust-proof / drip-proof cover 12 for covering the X-axis moving mechanism are provided. ..

The X-axis moving mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and the X-axis moving table 10 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed into the nut portion.

An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 10 moves in the X-axis direction along the X-axis guide rail.

A chuck table 14 for holding the frame unit 1 is provided above the X-axis moving table 10. The chuck table 14 has a frame body 14c having a circular opening formed upward (see FIG. 2A) and a porous member 14b housed in the opening of the frame body 14c (see FIG. 2A). And have. With the porous member 14b housed in the opening, the porous member 14b is formed so that the upper surface of the frame body 14c and the upper surface of the porous member 14b housed in the opening have the same height. Will be done.

The upper surface of the frame body 14c and the upper surface of the porous member 14b serve as a holding surface 14a for holding the frame unit 1. The porous member 14b is connected to a suction source 14e (see FIG. 2A) via a suction path 14d (see FIG. 2A) formed inside the chuck table 14. When the frame unit 1 is placed on the holding surface 14a and the suction source 14e is operated to apply a negative pressure to the frame unit 1 through the suction path 14d and the porous member 14b, the frame unit 1 is placed on the chuck table 14. It is sucked and held.

The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis perpendicular to the holding surface 14a. Further, the chuck table 14 is machined and fed in the X-axis direction by the above-mentioned X-axis moving mechanism. That is, the X-axis moving mechanism constitutes a machining feed unit.

A transport unit (not shown) for transporting the above-mentioned frame unit 1 to the chuck table 14 is provided at a position close to the opening 4b. The frame unit 1 transported by the transport unit is placed on the holding surface 14a of the chuck table 14, for example, so that the upper surface side is exposed upward.

On the upper surface of the base 4, a gate-shaped support structure 24 for supporting two sets of cutting units 22a and 22b is arranged so as to straddle the opening 4b. Two sets of cutting unit moving mechanisms 26 for moving the cutting units 22a and 22b in the Y-axis direction (left-right direction, indexing feed direction) and the Z-axis direction are provided on the upper front surface of the support structure 24.

Each cutting unit moving mechanism 26 is commonly provided with a pair of Y-axis guide rails 28 arranged in front of the support structure 24 and parallel to the Y-axis direction. A Y-axis moving plate 30 constituting each cutting unit moving mechanism 26 is slidably attached to the Y-axis guide rail 28.

A nut portion (not shown) is provided on the back surface side (rear surface side) of each Y-axis moving plate 30, and a Y-axis ball screw 32 parallel to the Y-axis guide rail 28 is screwed into the nut portion. Has been done. A Y-axis pulse motor 34 is connected to one end of each Y-axis ball screw 32. When the Y-axis ball screw 32 is rotated by the Y-axis pulse motor 34, the Y-axis moving plate 30 moves in the Y-axis direction along the Y-axis guide rail 28.

A pair of Z-axis guide rails 36 parallel to the Z-axis direction are provided on the surface (front surface) of each Y-axis moving plate 30. A Z-axis moving plate 38 is slidably attached to the Z-axis guide rail 36.

A nut portion (not shown) is provided on the back surface side (rear surface side) of each Z-axis moving plate 38, and a Z-axis ball screw 40 parallel to the Z-axis guide rail 36 is screwed into the nut portion. Has been done. A Z-axis pulse motor 42 is connected to one end of each Z-axis ball screw 40. When the Z-axis ball screw 40 is rotated by the Z-axis pulse motor 42, the Z-axis moving plate 38 moves in the Z-axis direction along the Z-axis guide rail 36.

Cutting units 22a and 22b are provided below each Z-axis moving plate 38, respectively. The cutting units 22a and 22b include an annular cutting blade mounted on one end side of a spindle serving as a rotation axis. The cutting units 22a and 22b are provided with cutting fluid supply means for supplying the cutting fluid to the cutting blade and the frame unit 1 held on the chuck table 14. The cutting fluid is, for example, pure water.

Further, an imaging camera (imaging unit) 48 for imaging the workpiece 11 and the like is provided at a position adjacent to the cutting units 22a and 22b. When the Y-axis moving plate 30 is moved in the Y-axis direction by each cutting unit moving mechanism 26, the cutting units 22a and 22b and the imaging camera 48 are indexed and fed in the Y-axis direction. Further, if the Z-axis moving plate 38 is moved in the Z-axis direction by each cutting unit moving mechanism 26, the cutting units 22a and 22b and the imaging camera 48 move up and down.

An upper surface side water nozzle 16 and an upper surface side air nozzle 18 are arranged on the upper surface of the base 4 so as to straddle the opening 4b in the Y axis direction (indexing feed direction) perpendicular to the X axis direction. The upper surface side water nozzle 16 and the upper surface side air nozzle 18 each have a pipe-shaped main body. Each of the main bodies is formed with a plurality of downwardly oriented spouts (not shown) arranged along the extension direction of the main body.

One end of the main body of the upper surface side water nozzle 16 is connected to a water supply source (not shown). The upper surface side water nozzle 16 can form a water curtain by ejecting a cleaning liquid (for example, pure water) supplied from the water supply source downward from the plurality of spouts. Further, one end of the main body of the upper surface side air nozzle 18 is connected to an air supply source (not shown). The upper surface side air nozzle 18 can form an air curtain by ejecting air supplied from the air supply source downward from the plurality of ejection ports.

Further, below the upper surface side water nozzle 16 and the upper surface side air nozzle 18, a pair of air nozzles 20 are arranged so as to sandwich the chuck table 14 which is processed and fed in the X-axis direction. The pair of air nozzles 20 project in the Y-axis direction from each of the two wall surfaces of the base 4 perpendicular to the Y-axis direction in the opening 4b, and have a length that does not contact the chuck table 14 to be machined and fed. It is growing.

Each of the pair of air nozzles 20 has a pipe-shaped main body with a closed tip. Each of the main bodies is formed with a plurality of upwardly directed spouts (not shown) arranged along the extension direction of each main body. The pair of air nozzles 20 are each connected to an air supply source (not shown), and the air supplied from the air supply source can be ejected upward from the plurality of ejection ports.

In the cutting device 2, the upper surface side water nozzle 16, the upper surface side air nozzle 18, and the pair of air nozzles 20 function as a cutting fluid removing unit that removes the cutting fluid adhering to the chuck table 14.

A circular opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning unit 50 for cleaning the frame unit 1 and the like after cutting is provided in the opening 4c. Above the base 4, a transport unit 44 that transports the frame unit 1 mounted on the chuck table 14 to the cleaning unit 50 is arranged.

The transport unit 44 has a plurality of suction cups 46 corresponding to the shape of the annular frame 3 of the frame unit 1 on the lower surface. The transport unit 44 can transport the frame unit 1 to the cleaning unit 50 by sucking and holding the annular frame 3 with a suction cup 46. Further, the transport unit 44 can carry out the frame unit 1 cleaned by the cleaning unit 50 from the cleaning unit 50.

The cleaning unit 50 provided inside the opening 4c includes a cleaning table 52 that holds the frame unit 1 and a cleaning nozzle 54 that discharges cleaning liquid to the frame unit 1 from above the frame unit 1 held by the cleaning table 52. And. The cleaning liquid is, for example, pure water.

The cleaning nozzle 54 has a shaft portion extending upward from the outer peripheral side of the cleaning table 52, and a pipe-shaped main body extending horizontally from the tip of the shaft portion. The shaft portion is connected to a water supply source, and the water supply source can supply a cleaning liquid to the main body through the shaft portion. A discharge port is provided at the tip of the pipe-shaped main body, and the cleaning liquid supplied to the main body is discharged downward from the discharge port. The cleaning nozzle 54 can rotate around the shaft portion. When the cleaning nozzle 54 rotates, the discharge port can be moved above the cleaning table 52.

Inside the cleaning table 52, a suction path 52d (see FIG. 2B) having one end communicating with the cleaning holding surface 52a on the upper surface of the cleaning table 52 is provided, and a suction source 52c is provided at the other end of the suction path 52d. (See FIG. 2B) is connected. When the frame unit 1 is placed on the cleaning holding surface 52a of the cleaning table 52 and the suction source 52c is operated to apply a negative pressure to the frame unit 1, the frame unit 1 is suction-held by the cleaning table 52. ..

The cleaning holding surface 52a of the cleaning table 52 is formed to have a size that fits on the upper surface of the porous member 14b of the chuck table 14. That is, the diameter of the cleaning holding surface 52a is smaller than the diameter of the upper surface of the porous member 14b. Then, when the frame unit 1 is held on the cleaning table 52, a region of the lower surface of the frame unit 1 supported by the frame body 14c of the chuck table 14 at the time of cutting is exposed from the cleaning table 52. The cleaning table 52 is also connected to a rotational drive source (not shown) and can rotate about an axis perpendicular to the holding surface 52.

Next, the cutting process of the workpiece 7 of the frame unit 1 in the cutting device according to the present embodiment will be described.

First, the frame unit 1 housed in the cassette 8 on the cassette support 6 is taken out by a transport mechanism (not shown) of the cutting device 2 and transported, and placed on the holding surface 14a of the chuck table 14. Then, when the suction source 14e (see FIG. 2A) of the chuck table 14 is operated to apply a negative pressure to the frame unit 1 through the suction path 14d and the porous member 14b, the frame unit 1 causes the chuck table 14 to operate. Is sucked and held.

Next, the work piece 7 of the frame unit 1 is cut. First, the cutting blades are rotated by rotating the spindles of the cutting units 22a and 22b, and when the cutting blades are positioned at a predetermined height and the chuck table 14 is machined and fed in the machining feed direction, the cutting blades rotate. Is in contact with the workpiece 7, and the workpiece 7 is cut.

At the time of cutting, the cutting fluid is supplied to the cutting blade and the workpiece 7 from the cleaning liquid supply means (not shown) of the cutting units 22a and 22b. The cutting fluid removes cutting chips and heat generated by the cutting process of the workpiece 7.

The cutting fluid adheres to the upper surface and the lower surface of the frame unit 1 immediately after the completion of the cutting process. If the cutting fluid is vaporized with the cutting fluid adhering to the upper surface, cutting debris and the like contained in the cutting fluid stick to the upper surface, which causes a problem. Therefore, the cutting fluid adhering to the frame unit 1 is removed after the cutting process is completed. The removal of the cutting fluid will be described with reference to FIG. 2 (A). FIG. 2A is a partial cross-sectional view schematically showing a cutting fluid removing unit of the cutting device 2 at the time of removing the cutting fluid and a frame unit 1 held on the chuck table 14.

After the cutting process is completed, the chuck table 14 is moved in the processing feed direction to pass below the upper surface side water nozzle 16 and the upper surface side air nozzle 18. At this time, the cleaning liquid and high-pressure air are ejected from the upper surface side water nozzle 16 and the upper surface side air nozzle 18, respectively. That is, when a water curtain or an air curtain is formed by the cleaning liquid or high-pressure air and the frame unit 1 is passed through the water curtain or the air curtain, the cutting fluid adhering to the upper surface of the frame unit 1 can be removed.

Further, the cutting fluid supplied to the cutting blade and the frame unit 1 during the cutting process wraps around and adheres to the region of the lower surface of the frame unit 1 that protrudes from the holding surface 14a of the chuck table 14. For example, when the cutting fluid adhering to the lower surface of the frame unit 1 is not removed, if the cutting fluid drops from the frame unit 1 during transportation or the like, the cutting device 2 may be contaminated. Further, when the frame unit 1 adhering to the lower surface of the cutting fluid is stored in the cassette 8, the cutting fluid may fall and adhere to another frame unit 1 housed below.

Therefore, in the cutting device 2 according to the present embodiment, high-pressure air is also supplied from the air nozzle 20 to the region on the lower surface of the frame unit 1, and the cutting fluid adhering to the region is blown off by the high-pressure air. When the chuck table 14 is moved in the machining feed direction while high-pressure air is being supplied from the air nozzle 20, a part of the cutting fluid adhering to the lower surface of the frame unit 1 is removed.

It is difficult for the high-pressure air to act on the entire area of the region only by moving the chuck table 14 once in the processing feed direction. Therefore, the chuck table 14 is rotated by a predetermined angle around an axis perpendicular to the holding surface 14a to change the location where the high-pressure air is received, and the chuck table 14 is moved again in the machining feed direction. This is repeated to remove the cutting fluid adhering to the entire area by the high pressure air. Then, the cutting fluid adhering to the region does not fall during transportation or the like, and contamination inside the cutting device 2 is suppressed.

At the time of cutting and removing the cleaning liquid, the frame unit 1 is suction-held on the holding surface 14a of the chuck table 14. Then, the negative pressure leaks from a minute gap or the like between the frame body 14c of the chuck table 14 and the lower surface of the frame unit 1. Therefore, the cutting fluid may enter the porous member 14b side of the chuck table 14 through the minute gap.

When the cutting fluid that has entered the fine gap reaches the porous member 14b, it is sucked into the porous member 14b by the negative pressure, but a part of the cutting fluid that has entered through the fine gap is the frame body 14c. And may stay between the lower surface of the frame unit 1. That is, when the suction holding on the chuck table 14 is released and the frame unit 1 is conveyed, the cutting fluid may remain in the region of the lower surface of the frame unit 1 supported by the frame body 14c.

Therefore, in the cutting apparatus 2 according to the present embodiment, when the frame unit 1 is conveyed to the cleaning unit 50 to clean the workpiece 7, the region supported by the frame body 14c on the lower surface of the frame unit 1 is formed. Remove the residual cutting fluid.

The frame unit 1 including the workpiece 7 that has been machined is conveyed from the chuck table 14 onto the cleaning holding surface 52a of the cleaning table 52 of the cleaning unit 50 by the transfer unit 44. Next, when the suction source 52c (see FIG. 2B) is operated to apply a negative pressure to the frame unit 1 through the suction path 52d, the frame unit 1 is sucked and held by the cleaning table 14.

Next, the cleaning nozzle 54 is rotated around the shaft while discharging the cleaning liquid from the discharge port of the cleaning nozzle 54, and the discharge port is moved above the frame unit 1 sucked and held by the cleaning table 52. Also, the cleaning table 52 is rotated around an axis perpendicular to the cleaning holding surface 52a. Then, the cleaning liquid is supplied to the upper surface of the frame unit 1 to clean the upper surface of the frame unit 1, and the cleaning liquid is discharged from the upper surface by the centrifugal force due to the rotation of the cleaning table 52.

In the cutting device 2 according to the present embodiment, the cleaning holding surface 52a of the cleaning table 52 is formed to have a size that fits on the upper surface of the porous member 14b of the chuck table 14. Then, when the frame unit 1 is held on the cleaning table 52, a region of the lower surface of the frame unit 1 supported by the frame body 14c of the chuck table 14 at the time of cutting is exposed from the cleaning table 52. Therefore, the centrifugal force generated by the rotation of the cleaning table 52 also acts on the cutting fluid adhering to the region of the frame unit 1, and the cutting fluid is also discharged.

The cutting fluid adhering to the region of the lower surface of the frame unit 1 that protrudes from the holding surface 14a of the chuck table 14 is removed by the action of the pair of air nozzles 20. Further, the cutting fluid that has entered the region of the lower surface supported by the porous member 14b of the chuck table 14 is sucked toward the porous member 14b. Then, the cutting fluid adhering to the remaining region of the lower surface, that is, the region supported by the frame body 14c of the chuck table 14, is discharged by the action of the centrifugal force generated by the rotation of the cleaning table 52.

That is, the cutting fluid adhering to the lower surface of the frame unit 1 during cutting is eliminated in the entire area of the lower surface. The washed frame unit 1 is transported from the washing table 52 to the cassette 8 and stored, but since the cutting fluid does not remain on the lower surface of the frame unit 1, other frame units housed in the cassette 8 are stored. It does not contaminate.

The present invention is not limited to the description of the above-described embodiment, and can be implemented with various modifications. For example, in the above embodiment, the negative pressure (suction force) generated by the suction source 52d of the cleaning table 52 may be larger than the negative pressure (suction force) generated by the suction source 14e of the chuck table 14.

In the cutting apparatus 2 according to the above embodiment, the cleaning holding surface 52a of the cleaning table 52 is smaller than the holding surface 14a of the chuck table 14. Moreover, cleaning of the frame unit 1 is performed with the cleaning table 52 rotating around an axis perpendicular to the cleaning holding surface 52a. Therefore, by making the negative pressure (suction force) generated by the suction source 52d larger than the negative pressure (suction force) generated by the suction source 14e, the frame unit 1 is more reliably sucked and held.

Further, the cutting device 2 according to the above embodiment is provided with an air nozzle 20 for removing the cutting fluid adhering to the lower surface of the frame unit 1. For example, the cutting device 2 replaces the air nozzle. A cleaning nozzle for supplying a cleaning liquid may be provided on the lower surface.

In addition, the structure, method, etc. according to the above-described embodiment can be appropriately modified and implemented as long as the scope of the object of the present invention is not deviated.

1 Frame unit 3 Frame 5 Adhesive tape 7 Work piece 2 Cutting device 4 Base 4a, 4b, 4c Opening 6 Cassette support 8 Cassette 10 X-axis moving table 12 Dust-proof and drip-proof cover 14 Chuck table 14a Holding surface 14b Porous member 14c Frame 14d, 52d Suction path 14e, 52c Suction source 16 Top side water nozzle 18 Top side air nozzle 20 Air nozzle 22a, 22b Cutting unit 24 Support structure 26 Cutting unit movement mechanism 28 Y-axis guide rail 30 Y-axis movement plate 32 Y Axis ball screw 34 Y-axis pulse motor 36 Z-axis guide rail 38 Z-axis moving plate 40 Z-axis ball screw 42 Z-axis pulse motor 44 Conveyor unit 46 Sucker 48 Imaging camera (imaging unit)
50 Cleaning unit 52 Cleaning table 52a Cleaning holding surface 54 Cleaning nozzle

Claims (2)

A frame unit having an annular frame, an adhesive tape stretched on an opening of the annular frame, and a work piece supported on the upper surface of the adhesive tape is sucked and held on a holding surface, and an axis perpendicular to the holding surface. With a chuck table that can rotate around
A cutting unit that cuts the workpiece while supplying cutting fluid to the workpiece of the frame unit held on the chuck table.
A machining feed unit that moves the chuck table in the machining feed direction parallel to the holding surface, and
The work piece has an air nozzle that ejects air from a position facing the first region protruding from the chuck table on the lower surface of the frame unit held by the chuck table toward the first region. A cutting fluid removal unit that can remove the cutting fluid adhering to the first region by ejecting air toward the first region after cutting.
A cutting device characterized by being provided with. A cleaning unit that cleans the workpiece of the frame unit that has been machined by the cutting unit, and
A transport unit for transporting the frame unit between the chuck table and the cleaning unit is further provided.
The holding surface of the chuck table is composed of an upper surface of a porous member that exerts a negative pressure on the frame unit and an upper surface of a frame body that surrounds the porous member.
The cleaning unit has a cleaning holding surface for holding the frame unit, a cleaning table that can rotate around an axis perpendicular to the cleaning holding surface, and a workpiece of the frame unit held on the cleaning table. Equipped with a cleaning nozzle that supplies cleaning liquid to
The cleaning holding surface of the cleaning table is formed in a size that fits on the upper surface of the porous member of the chuck table.
When the frame unit is sucked and held by the chuck table, the cleaning unit holds a second region of the lower surface of the frame unit supported by the frame when the frame unit is held by the cleaning table. The cutting apparatus according to claim 1, wherein the cutting fluid can be exposed and the cutting fluid adhering to the second region can be removed by centrifugal force due to the rotation of the washing table.

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