JP2018192546A - Cutting device - Google Patents

Abstract

To remove cutting liquid stuck to an undersurface of a frame unit.SOLUTION: A cutting device comprises: a chuck table 14 which sucks and holds a pressure-sensitive adhesive tape 5 pasted over an opening of an annular frame 3 and a frame unit 1 having a workpiece 7 supported on an upper surface of the pressure-sensitive adhesive tape 5 on a holding surface 14a and is rotatable about an axis vertical to the holding surface 14a; a cutting unit for cutting-processing the workpiece 7 of the frame unit 1 held by the chuck table 14 while supplying a cutting liquid to the workpiece 7; a processing feed unit for moving the chuck table 14 in a processing feed direction parallel to the holding surface 14a; and an air nozzle 20 for jetting air from a position opposite an area protruding from the chuck table 14 of an undersurface of the frame unit 1 held by the chuck table 14 toward the area, and removes the cutting liquid stuck to the area by jetting the air toward the area after cutting-processing of the workpiece 7.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cutting device for cutting a workpiece.

  In the manufacturing process of device chips, grid-like division lines called streets are set on the surface of a wafer made of silicon or a compound semiconductor, and devices such as ICs and LSIs are formed in each area partitioned by the division lines. Is done. These wafers are cut along a dividing line and divided into individual device chips.

  Cutting processing on a workpiece such as a wafer is performed by, for example, a cutting apparatus having a cutting unit including a cutting blade. The cutting unit includes a cylindrical spindle that serves as a rotation axis, and a cutting blade. The cutting blade has an annular shape with a hole in the center, and the spindle is inserted into the hole and attached to the spindle.

  At the time of cutting, the cutting blade is rotated by rotating the spindle. When the rotating cutting blade comes into contact with the workpiece, the workpiece is cut. At the time of cutting, a cutting fluid is supplied to the cutting blade and the workpiece. The cutting fluid removes cutting waste and heat generated by cutting the workpiece.

  By the way, the workpiece is supported by an adhesive tape previously stretched on an annular frame so that the workpiece can be easily handled even after the workpiece is cut and divided into individual chips or the like. At the time of cutting, the workpiece is held on a chuck table included in the cutting device in a state of a frame unit integrated with the annular frame and the adhesive tape. Then, after the cutting process is completed, the frame unit is detached from the chuck table.

  At this time, the cutting fluid supplied at the time of cutting and taking in the cutting waste adheres to the frame unit, but if the cutting fluid falls during the conveyance of the frame unit, the conveyance path is contaminated. Therefore, a cleaning nozzle that injects the cleaning liquid onto the upper surface of the frame unit that has been subjected to the cutting process is provided in the cutting device (see Patent Document 1). When a water curtain is formed by the cleaning nozzle and the frame unit is passed through the water curtain, the cutting fluid adhering to the upper surface can be removed.

JP-A-2015-149428

  The outer diameter of the upper surface (holding surface) of the chuck table of the cutting device is smaller than the outer diameter of the frame unit. Therefore, when the frame unit is sucked and held on the chuck table, the outer peripheral portion of the lower surface of the frame unit protrudes from the chuck table and is exposed. Then, the cutting fluid that is supplied to the cutting blade and the workpiece during the cutting process and scatters including the cutting waste adheres not only to the upper surface of the frame unit but also to the lower surface exposed from the chuck table.

  Since the cutting fluid adhering to the lower surface of the frame unit cannot be removed by the water curtain described above, the cutting fluid remains on the lower surface of the frame unit, and then falls to the conveying path of the frame unit to contaminate the conveying route. There is.

  Further, the frame unit that has been subjected to the cutting process is finally accommodated in a cassette installed in the cutting apparatus. A plurality of frame units are accommodated in the cassette. Therefore, when the frame unit with the cutting fluid attached to the lower surface is accommodated in the cassette, the cutting fluid falls on the other frame unit accommodated below the cassette, and stains the workpiece of the other frame unit. There is a case.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a cutting apparatus capable of removing the cutting fluid adhering to a portion exposed from the chuck table on the lower surface of the frame unit.

  According to one aspect of the present invention, a frame unit having an annular frame, an adhesive tape stretched on an opening of the annular frame, and a workpiece supported on the upper surface of the adhesive tape can be sucked and held on the holding surface. A chuck table capable of rotating around an axis perpendicular to the holding surface, and a cutting unit for cutting the workpiece while supplying cutting fluid to the workpiece of the frame unit held by the chuck table; A machining feed unit for moving the chuck table in a machining feed direction parallel to the holding surface, and a position facing the first region of the lower surface of the frame unit held by the chuck table that protrudes from the chuck table. An air nozzle that ejects air toward the first region, and ejects air toward the first region after the workpiece is cut; In cutting device, characterized in that it comprises a cutting liquid removing unit capable of removing cutting liquid adhering to the first region, is provided.

  In one embodiment of the present invention, the frame unit is transported between the cleaning unit for cleaning the workpiece of the frame unit cut by the cutting unit, the chuck table, and the cleaning unit. A unit, and the holding surface of the chuck table is configured by an upper surface of a porous member that applies a negative pressure to the frame unit and an upper surface of a frame body that surrounds the porous member, and the cleaning unit Has a cleaning holding surface for holding the frame unit, and can be rotated around an axis perpendicular to the cleaning holding surface, and a cleaning liquid is applied to the workpiece of the frame unit held on the cleaning table. And a cleaning holding surface of the cleaning table is formed to a size that fits on the upper surface of the porous member of the chuck table. The cleaning unit is configured such that when the frame unit is held by the chuck table, the second region supported by the frame body on the lower surface of the frame unit is held by the cleaning table. The cutting fluid attached to the second region may be removed by centrifugal force generated by rotation of the cleaning table.

  A cutting apparatus according to an aspect of the present invention includes an air nozzle that blows air toward a first area from a position facing a first area protruding from the chuck table on a lower surface of a frame unit held by the chuck table. A cutting fluid removal unit is provided. According to the cutting fluid removing unit, the cutting fluid adhering to the first region can be removed by ejecting air toward the first region after the workpiece is cut.

  In the cutting apparatus, after the workpiece is cut, the work feed unit is operated while air is ejected from the air nozzle to move the chuck table in the work feed direction. When a part of the first region on the lower surface of the frame unit passes above the air nozzle, the cutting fluid adhering to the part is removed by the air.

  Then, after rotating the chuck table around an axis perpendicular to the holding surface, the machining feed unit is operated to pass the other part of the first region on the lower surface of the frame unit above the air nozzle. Then, the cutting fluid adhering to the other part is removed. Thus, the cutting fluid is removed in the entire region of the first region exposed from the chuck table on the lower surface of the frame unit by performing the rotation of the chuck table and the movement of the chuck table a plurality of times.

  As described above, according to the present invention, there is provided a cutting apparatus capable of removing the cutting fluid adhering to the portion exposed from the chuck table on the lower surface of the frame unit.

It is a perspective view which shows a cutting device and a frame unit typically. FIG. 2A is a cross-sectional view schematically showing a cutting fluid removal unit and a chuck table of the cutting apparatus, and a frame unit held by the chuck table, and FIG. It is sectional drawing which shows typically a washing | cleaning table and the frame unit hold | maintained at this washing | cleaning table.

  Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram schematically illustrating a configuration example of a cutting device 2 according to the present embodiment. As shown in FIG. 1, the cutting device 2 includes a base 4 that supports each structure.

  A rectangular opening 4a is formed at the front corner of the base 4, and a cassette support base 6 that moves up and down is provided in the opening 4a. A cassette 8 that houses a plurality of frame units 1 is placed on the upper surface of the cassette support 6. In FIG. 1, only the outline of the cassette 8 is shown for convenience of explanation.

  The frame unit 1 includes an annular frame 3, an adhesive tape 5 stretched on an opening of the annular frame 3, and a workpiece 7 supported on the upper surface of the adhesive tape 5. The workpiece 7 is, for example, a circular wafer made of a semiconductor material such as silicon, and the surface side is divided into a central device region and an outer peripheral surplus region surrounding the device region. The device region is further divided into a plurality of regions by division lines (streets) arranged in a lattice pattern, and devices such as ICs and LSIs are formed in each region.

  An adhesive tape 5 having a diameter larger than that of the workpiece 7 is attached to the back side of the workpiece 7. An outer peripheral portion of the adhesive tape 5 is fixed to the annular frame 3. That is, the workpiece 7 is supported by the annular frame 3 via the adhesive tape 5.

  The workpiece 7 may be other than a circular wafer made of a semiconductor material such as silicon, and the material, shape, structure, etc. of the workpiece 7 are not limited. For example, a rectangular substrate made of a material such as ceramics, resin, or metal can be used as the workpiece 7. There are no restrictions on the type, quantity, and arrangement of devices.

  The cutting device 2 is provided with a transport mechanism (not shown) for taking out the frame unit 1 accommodated in the cassette 8 placed on the cassette support 6 and placing the frame unit 1 on a chuck table 14 described later. It has been. According to the transport mechanism, the frame unit 1 can be accommodated in the cassette 8 after the cutting process is completed.

  A rectangular opening 4b that is long in the X-axis direction (front-rear direction, processing feed direction) is formed on the side of the cassette support base 6. In the opening 4b, there are provided an X-axis moving table 10, an X-axis moving mechanism (not shown) for moving the X-axis moving table 10 in the X-axis direction, and a dustproof and splash-proof cover 12 that covers the X-axis moving mechanism. .

  The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and the X-axis movement table 10 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 10 moves in the X-axis direction along the X-axis guide rail.

  A chuck table 14 for holding the frame unit 1 is provided above the X-axis moving table 10. The chuck table 14 includes a frame body 14c (see FIG. 2A) in which a circular opening is formed above, and a porous member 14b accommodated in the opening of the frame body 14c (see FIG. 2A). And having. In a state where the porous member 14b is accommodated in the opening, the porous member 14b is formed so that the upper surface of the frame 14c and the upper surface of the porous member 14b accommodated in the opening have the same height. Is done.

  The upper surface of the frame body 14 c and the upper surface of the porous member 14 b serve as a holding surface 14 a that holds the frame unit 1. The porous member 14b is connected to a suction source 14e (see FIG. 2 (A)) through a suction path 14d (see FIG. 2 (A)) formed inside the chuck table 14. When the frame unit 1 is placed on the holding surface 14a and the suction source 14e is operated to apply a negative pressure to the frame unit 1 through the suction path 14d and the porous member 14b, the frame unit 1 is applied to the chuck table 14. Suction hold.

  The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis perpendicular to the holding surface 14a. The chuck table 14 is processed and fed in the X-axis direction by the above-described X-axis moving mechanism. That is, the X-axis movement mechanism constitutes a machining feed unit.

  A transport unit (not shown) for transporting the frame unit 1 described above to the chuck table 14 is provided at a position close to the opening 4b. For example, the frame unit 1 transported by the transport unit is placed on the holding surface 14a of the chuck table 14 so that the upper surface side is exposed upward.

  A gate-type support structure 24 for supporting the two sets of cutting units 22a and 22b is disposed on the upper surface of the base 4 so as to straddle the opening 4b. Two sets of cutting unit moving mechanisms 26 for moving the cutting units 22a and 22b in the Y-axis direction (left and right direction, index feed direction) and the Z-axis direction are provided on the upper front surface of the support structure 24.

  Each cutting unit moving mechanism 26 is commonly provided with a pair of Y-axis guide rails 28 arranged in front of the support structure 24 and parallel to the Y-axis direction. A Y-axis moving plate 30 constituting each cutting unit moving mechanism 26 is slidably attached to the Y-axis guide rail 28.

  A nut portion (not shown) is provided on the back side (rear side) of each Y-axis moving plate 30, and a Y-axis ball screw 32 parallel to the Y-axis guide rail 28 is screwed into each nut portion. Has been. A Y-axis pulse motor 34 is connected to one end of each Y-axis ball screw 32. When the Y-axis ball motor 32 is rotated by the Y-axis pulse motor 34, the Y-axis moving plate 30 moves in the Y-axis direction along the Y-axis guide rail 28.

  A pair of Z-axis guide rails 36 parallel to the Z-axis direction are provided on the surface (front surface) of each Y-axis moving plate 30. A Z-axis moving plate 38 is slidably attached to the Z-axis guide rail 36.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of each Z-axis moving plate 38, and a Z-axis ball screw 40 parallel to the Z-axis guide rail 36 is screwed into each nut portion. Has been. A Z-axis pulse motor 42 is connected to one end of each Z-axis ball screw 40. When the Z-axis ball screw 40 is rotated by the Z-axis pulse motor 42, the Z-axis moving plate 38 moves in the Z-axis direction along the Z-axis guide rail 36.

  Cutting units 22a and 22b are provided below the respective Z-axis moving plates 38. The cutting units 22a and 22b include an annular cutting blade attached to one end of a spindle that serves as a rotating shaft. The cutting units 22 a and 22 b are provided with a cutting fluid supply means for supplying a cutting fluid to the frame unit 1 held by the cutting blade and the chuck table 14. The cutting fluid is, for example, pure water.

  An imaging camera (imaging unit) 48 that images the workpiece 11 and the like is provided at a position adjacent to the cutting units 22a and 22b. If the Y-axis moving plate 30 is moved in the Y-axis direction by each cutting unit moving mechanism 26, the cutting units 22a and 22b and the imaging camera 48 are indexed and fed in the Y-axis direction. Further, if the Z-axis moving plate 38 is moved in the Z-axis direction by each cutting unit moving mechanism 26, the cutting units 22a and 22b and the imaging camera 48 are moved up and down.

  An upper surface side water nozzle 16 and an upper surface side air nozzle 18 are disposed on the upper surface of the base 4 so as to straddle the opening 4b in the Y axis direction (index feed direction) perpendicular to the X axis direction. Each of the upper surface side water nozzle 16 and the upper surface side air nozzle 18 has a pipe-shaped main body. Each of the main bodies is formed with a plurality of jetting ports (not shown) facing downward along the extending direction of the main bodies.

  One end of the main body of the upper surface side water nozzle 16 is connected to a water supply source (not shown). The upper surface side water nozzle 16 can eject a cleaning liquid (for example, pure water) supplied from the water supply source downward from the plurality of ejection ports to form a water curtain. One end of the main body of the upper surface side air nozzle 18 is connected to an air supply source (not shown). The upper surface side air nozzle 18 can form an air curtain by ejecting air supplied from the air supply source downward from the plurality of ejection ports.

  A pair of air nozzles 20 is disposed below the upper surface side water nozzle 16 and the upper surface side air nozzle 18 so as to sandwich the chuck table 14 processed and fed in the X-axis direction. The pair of air nozzles 20 protrude in the Y-axis direction from each of two wall surfaces perpendicular to the Y-axis direction of the base 4 in the opening 4b, and do not contact the chuck table 14 to be processed and fed. It is extended.

  Each of the pair of air nozzles 20 has a pipe-shaped main body with its tip closed. Each main body is formed with a plurality of upwardly directed jets (not shown) arranged along the extending direction of each main body. The pair of air nozzles 20 are respectively connected to an air supply source (not shown), and the air supplied from the air supply source can be ejected upward from the plurality of ejection ports.

  In the cutting apparatus 2, the upper surface side water nozzle 16, the upper surface side air nozzle 18, and the pair of air nozzles 20 function as a cutting fluid removal unit that removes the cutting fluid adhering to the chuck table 14.

  A circular opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning unit 50 for cleaning the frame unit 1 and the like after cutting is provided in the opening 4c. A transport unit 44 that transports the frame unit 1 mounted on the chuck table 14 to the cleaning unit 50 is disposed above the base 4.

  The transport unit 44 has a plurality of suction cups 46 corresponding to the shape of the annular frame 3 of the frame unit 1 on the lower surface. The transport unit 44 can transport the frame unit 1 to the cleaning unit 50 by sucking and holding the annular frame 3 with a suction cup 46. Further, the transport unit 44 can carry out the frame unit 1 cleaned by the cleaning unit 50 from the cleaning unit 50.

  The cleaning unit 50 provided inside the opening 4 c includes a cleaning table 52 that holds the frame unit 1, and a cleaning nozzle 54 that discharges the cleaning liquid to the frame unit 1 from above the frame unit 1 held on the cleaning table 52. And comprising. The cleaning liquid is pure water, for example.

  The cleaning nozzle 54 has a shaft portion that extends upward from the outer peripheral side of the cleaning table 52 and a pipe-shaped main body that extends in the horizontal direction from the tip of the shaft portion. The shaft portion is connected to a water supply source, and the water supply source can supply the cleaning liquid to the main body through the shaft portion. A discharge port is provided at the tip of the pipe-shaped main body, and the cleaning liquid supplied to the main body is discharged downward from the discharge port. The cleaning nozzle 54 can rotate around the shaft portion. When the cleaning nozzle 54 rotates, the discharge port can be moved above the cleaning table 52.

  Inside the cleaning table 52, there is provided a suction path 52d (see FIG. 2B) with one end communicating with the cleaning holding surface 52a on the upper surface of the cleaning table 52. The suction source 52c is provided at the other end of the suction path 52d. (See FIG. 2B). When the frame unit 1 is placed on the cleaning holding surface 52 a of the cleaning table 52 and the suction source 52 c is operated to apply a negative pressure to the frame unit 1, the frame unit 1 is sucked and held by the cleaning table 52. .

  The cleaning holding surface 52a of the cleaning table 52 is formed to a size that fits on the upper surface of the porous member 14b of the chuck table 14. That is, the diameter of the cleaning holding surface 52a is smaller than the diameter of the upper surface of the porous member 14b. Then, when the frame unit 1 is held on the cleaning table 52, an area of the lower surface of the frame unit 1 that is supported by the frame body 14 c of the chuck table 14 at the time of cutting is exposed from the cleaning table 52. The cleaning table 52 is connected to a rotation drive source (not shown) and can rotate around an axis perpendicular to the holding surface 52.

  Next, cutting of the workpiece 7 of the frame unit 1 in the cutting apparatus according to the present embodiment will be described.

  First, the frame unit 1 accommodated in the cassette 8 on the cassette support base 6 is taken out and conveyed by a conveyance mechanism (not shown) of the cutting device 2 and placed on the holding surface 14 a of the chuck table 14. When the suction source 14e (see FIG. 2A) of the chuck table 14 is operated to apply a negative pressure to the frame unit 1 through the suction path 14d and the porous member 14b, the frame unit 1 is moved to the chuck table 14. Is sucked in.

  Next, cutting of the workpiece 7 of the frame unit 1 is performed. First, when the cutting blades are rotated by rotating the spindles of the cutting units 22a and 22b, the cutting blades are positioned at a predetermined height, and the chuck table 14 is processed and fed in the machining feed direction, the rotating cutting blades are rotated. Comes into contact with the workpiece 7 and the workpiece 7 is cut.

  At the time of cutting, cutting fluid is supplied to the cutting blade and the workpiece 7 from the cleaning fluid supply means (not shown) of the cutting units 22a and 22b. The cutting fluid removes cutting waste and heat generated by cutting the workpiece 7.

  The cutting fluid adheres to the upper and lower surfaces of the frame unit 1 immediately after the end of the cutting process. If the cutting fluid is vaporized with the cutting fluid adhering to the upper surface, cutting waste contained in the cutting fluid adheres to the upper surface, which causes a problem. Therefore, the cutting fluid adhering to the frame unit 1 is removed after the end of the cutting process. The removal of the cutting fluid will be described with reference to FIG. FIG. 2A is a partial cross-sectional view schematically showing the cutting fluid removal unit of the cutting device 2 and the frame unit 1 held by the chuck table 14 when the cutting fluid is removed.

  After the end of the cutting process, the chuck table 14 is moved in the process feed direction to pass under the upper surface side water nozzle 16 and the upper surface side air nozzle 18. At this time, cleaning liquid and high-pressure air are ejected from the upper surface side water nozzle 16 and the upper surface side air nozzle 18, respectively. That is, when a water curtain or an air curtain is formed by the cleaning liquid or high-pressure air and the frame unit 1 is passed through the water curtain or the air curtain, the cutting fluid adhering to the upper surface of the frame unit 1 can be removed.

  Further, the cutting fluid supplied to the cutting blade and the frame unit 1 at the time of cutting wraps around and adheres to a region of the lower surface of the frame unit 1 that protrudes from the holding surface 14 a of the chuck table 14. For example, when the cutting fluid adhering to the lower surface of the frame unit 1 is not removed, the cutting device 2 may be soiled if the cutting fluid falls from the frame unit 1 during conveyance or the like. Further, the frame unit 1 with the cutting fluid attached to the lower surface may fall when stored in the cassette 8 and may adhere to another frame unit 1 stored below.

  Therefore, in the cutting device 2 according to the present embodiment, high pressure air is supplied from the air nozzle 20 to the region on the lower surface of the frame unit 1, and the cutting fluid adhering to the region is blown off by the high pressure air. When the chuck table 14 is moved in the process feed direction while high-pressure air is supplied from the air nozzle 20, a part of the cutting fluid adhering to the lower surface of the frame unit 1 is removed.

  It is difficult to cause the high-pressure air to act on the entire region only by moving the chuck table 14 once in the machining feed direction. Therefore, the chuck table 14 is rotated by a predetermined angle around an axis perpendicular to the holding surface 14a to change the location for receiving high-pressure air, and the chuck table 14 is moved again in the machining feed direction. This process is repeated to remove the cutting fluid adhering to the high-pressure air over the entire area. Then, the cutting fluid adhering to the region does not fall during conveyance or the like, and contamination inside the cutting device 2 is suppressed.

  When cutting and removing the cleaning liquid, the frame unit 1 is sucked and held on the holding surface 14 a of the chuck table 14. Then, the negative pressure leaks from a minute gap between the frame body 14c of the chuck table 14 and the lower surface of the frame unit 1. Therefore, the cutting fluid may enter the porous member 14b side of the chuck table 14 from the minute gap.

  When the cutting fluid that has entered the fine gap reaches the porous member 14b, the negative pressure causes the cutting fluid to be sucked into the porous member 14b. And the lower surface of the frame unit 1 in some cases. That is, when the suction holding to the chuck table 14 is released and the frame unit 1 is transported, the cutting fluid may remain in the region of the lower surface of the frame unit 1 supported by the frame body 14c.

  Therefore, in the cutting device 2 according to the present embodiment, when the frame unit 1 is transported to the cleaning unit 50 and the workpiece 7 is cleaned, the region is supported by the frame body 14c on the lower surface of the frame unit 1. Remove remaining cutting fluid.

  The frame unit 1 including the workpiece 7 on which cutting has been performed is transported from the chuck table 14 onto the cleaning holding surface 52 a of the cleaning table 52 of the cleaning unit 50 by the transport unit 44. Next, when the suction source 52c (see FIG. 2B) is operated to apply a negative pressure to the frame unit 1 through the suction path 52d, the frame unit 1 is sucked and held on the cleaning table 14.

  Next, while the cleaning liquid is being discharged from the discharge port of the cleaning nozzle 54, the cleaning nozzle 54 is rotated around the shaft portion, and the discharge port is moved above the frame unit 1 sucked and held by the cleaning table 52. Further, the cleaning table 52 is rotated around an axis perpendicular to the cleaning holding surface 52a. Then, the cleaning liquid is supplied to the upper surface of the frame unit 1 to clean the upper surface of the frame unit 1, and the cleaning liquid is discharged from the upper surface by the centrifugal force generated by the rotation of the cleaning table 52.

  In the cutting device 2 according to the present embodiment, the cleaning holding surface 52a of the cleaning table 52 is formed to have a size that fits on the upper surface of the porous member 14b of the chuck table 14. Then, when the frame unit 1 is held on the cleaning table 52, an area of the lower surface of the frame unit 1 that is supported by the frame body 14 c of the chuck table 14 at the time of cutting is exposed from the cleaning table 52. Therefore, the centrifugal force generated by the rotation of the cleaning table 52 also acts on the cutting fluid adhering to the region of the frame unit 1, and the cutting fluid is also discharged.

  The cutting fluid adhering to the region of the lower surface of the frame unit 1 that protrudes from the holding surface 14 a of the chuck table 14 is removed by the action of the pair of air nozzles 20. Further, the cutting fluid that has entered the area of the lower surface supported by the porous member 14b of the chuck table 14 is sucked toward the porous member 14b. Then, the cutting fluid adhering to the remaining area of the lower surface, that is, the area supported by the frame 14 c of the chuck table 14 is discharged by the action of the centrifugal force generated by the rotation of the cleaning table 52.

  That is, the cutting fluid adhering to the lower surface of the frame unit 1 at the time of cutting is excluded in the entire area of the lower surface. The cleaned frame unit 1 is transported from the cleaning table 52 to the cassette 8 and stored therein. However, since no cutting fluid remains on the lower surface of the frame unit 1, other frame units stored in the cassette 8 are attached to the frame unit 1. There is no contamination.

  In addition, this invention is not limited to description of said embodiment, A various change can be implemented. For example, in the above embodiment, the negative pressure (suction force) generated by the suction source 52 d of the cleaning table 52 may be larger than the negative pressure (suction force) generated by the suction source 14 e of the chuck table 14.

  In the cutting device 2 according to the above embodiment, the cleaning holding surface 52a of the cleaning table 52 is smaller than the holding surface 14a of the chuck table 14. In addition, the frame unit 1 is cleaned while the cleaning table 52 rotates around an axis perpendicular to the cleaning holding surface 52a. Therefore, by making the negative pressure (suction force) generated by the suction source 52d larger than the negative pressure (suction force) generated by the suction source 14e, the frame unit 1 is sucked and held more reliably.

  In the cutting device 2 according to the above-described embodiment, the air nozzle 20 is provided to remove the cutting fluid adhering to the lower surface of the frame unit 1. For example, the cutting device 2 is replaced with the air nozzle. You may provide the washing | cleaning nozzle which supplies a washing | cleaning liquid to this lower surface.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 1 Frame unit 3 Frame 5 Adhesive tape 7 Work piece 2 Cutting device 4 Base 4a, 4b, 4c Opening 6 Cassette support stand 8 Cassette 10 X-axis moving table 12 Dust-proof drip-proof cover 14 Chuck table 14a Holding surface 14b Porous member 14c Frame 14d, 52d Suction path 14e, 52c Suction source 16 Upper surface side water nozzle 18 Upper surface side air nozzle 20 Air nozzle 22a, 22b Cutting unit 24 Support structure 26 Cutting unit moving mechanism 28 Y-axis guide rail 30 Y-axis moving plate 32 Y Axis ball screw 34 Y-axis pulse motor 36 Z-axis guide rail 38 Z-axis moving plate 40 Z-axis ball screw 42 Z-axis pulse motor 44 Transport unit 46 Suction cup 48 Imaging camera (imaging unit)
50 Cleaning unit 52 Cleaning table 52a Cleaning holding surface 54 Cleaning nozzle

Claims (2)

A frame unit having an annular frame, an adhesive tape stretched on an opening of the annular frame, and a workpiece supported on the upper surface of the adhesive tape is sucked and held on the holding surface, and an axis perpendicular to the holding surface A chuck table that can rotate around
A cutting unit for cutting the workpiece while supplying a cutting fluid to the workpiece of the frame unit held by the chuck table;
A machining feed unit for moving the chuck table in a machining feed direction parallel to the holding surface;
An air nozzle that blows air toward the first region from a position facing the first region protruding from the chuck table on the lower surface of the frame unit held by the chuck table; A cutting fluid removal unit capable of removing the cutting fluid adhering to the first region by blowing air toward the first region after cutting;
A cutting apparatus comprising: A cleaning unit for cleaning the workpiece of the frame unit cut by the cutting unit;
A transport unit that transports the frame unit between the chuck table and the cleaning unit;
The holding surface of the chuck table includes an upper surface of a porous member that applies a negative pressure to the frame unit, and an upper surface of a frame body that surrounds the porous member.
The cleaning unit has a cleaning holding surface for holding the frame unit, can be rotated around an axis perpendicular to the cleaning holding surface, and the workpiece of the frame unit held on the cleaning table A cleaning nozzle for supplying a cleaning liquid to
The cleaning holding surface of the cleaning table is formed in a size that fits on the upper surface of the porous member of the chuck table,
The cleaning unit is configured such that when the frame unit is held by the chuck table, the second region supported by the frame body on the lower surface of the frame unit is held by the cleaning table. 2. The cutting apparatus according to claim 1, wherein the cutting fluid can be exposed and the cutting fluid adhering to the second region can be removed by centrifugal force generated by rotation of the cleaning table.