JP6305750B2 - Processing machine with static eliminator - Google Patents

Description

  The present invention relates to a static eliminator for removing static electricity charged on a workpiece held on a holding table, and a processing machine equipped with the static eliminator.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by division lines arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the partitioned regions. . The semiconductor wafer thus formed is ground to have a predetermined thickness by grinding with a grinding device, and then cut along a predetermined dividing line by a cutting device provided with a cutting blade and divided into individual devices.

  A cutting apparatus for cutting a wafer along a line to be divided includes a chuck table for holding a wafer, a cutting means having a cutting blade for cutting the wafer held on the chuck table, and a wafer cut by the cutting means. Cleaning means for cleaning the wafer, a cassette table for placing a cassette containing a plurality of wafers, and a carry-in / out means for carrying out the wafer from the cassette placed on the cassette table and storing the wafer after cutting in the cassette And temporary placement means for temporarily placing the wafer carried to the carry-in and carry-in means, and the wafer transferred to the temporary placement means to the chuck table and the wafer after cutting carried by the cleaning means to be temporarily placed. A first conveying means for conveying to the means, and a cutting means on the chuck table. Cutting has been wafer comprising a second conveying means for conveying the cleaning means, the Te is cut automatically along the wafer dividing lines.

  If cleaning is performed with the cleaning means provided in the above-described cutting apparatus, there is a danger that static electricity will be charged on the wafer and the quality of the device will be reduced. Therefore, ionized air is generated adjacent to the cleaning means to remove static electricity. A static eliminating device for spraying is disposed (see, for example, Patent Document 1).

JP 2012-49359 A

Thus, if air is supplied to the ionized air generating means for generating ionized air, for example, at a pressure of 0.2 Mpa, the ionized air having a large flow rate is jetted and the static elimination speed is fast, but the amount of static electricity charged on the wafer is reduced. There is a problem that can not be.
On the other hand, if air is supplied to the ionized air generating means for generating ionized air, for example, at a pressure of 0.1 MPa, the ionization air with a small flow rate is injected and the amount of static electricity charged on the wafer can be reduced, but the static elimination speed is slow. There is a problem of poor productivity.

The present invention has been made in view of the above circumstances, the principal technical problem is to provide a static elimination speed is equipped with a fast yet charged can be Ru static electricity removing device to reduce the amount of static electricity machine It is.

In order to solve the above-mentioned main technical problem, according to the present invention, a workpiece holding means for holding a workpiece, a processing means for processing the workpiece held by the workpiece holding means, A processing machine comprising: a cleaning unit that cleans a workpiece processed by the processing unit; and a conveyance unit that carries the workpiece cleaned by the cleaning unit out of the cleaning unit,
The cleaning means includes a spinner table that rotates while sucking and holding the workpiece, cleaning water supply means for supplying cleaning water to the workpiece held on the spinner table, and a workpiece cleaned on the spinner table. Comprising a static eliminator that injects ionized air onto the workpiece,
The static eliminator comprises an air supply source, ionized air generating means for generating and ejecting ionized air, and air supply means for supplying air from the air supply source to the ionized air generating means, The air supply means includes a flow rate adjusting means for adjusting a flow rate of air supplied to the ionized air generating means , and further, when the workpiece cleaned from the spinner table is carried out by the conveying means, the flow rate adjusting means. , The ionized air is jetted at a first flow rate for a first predetermined time, and when the first predetermined time has elapsed, the ionized air is discharged in a state where the workpiece is separated from the spinner table. Control means for controlling to inject for a second predetermined time longer than the first predetermined time at a second flow rate less than the flow rate;
A processing machine characterized by the above is provided.

  The flow rate adjusting means is disposed in the first pipe, the first pipe communicating the air supply source and the ionized air generating means, the second pipe having an inner diameter smaller than the inner diameter of the first pipe, and the first pipe. A first electromagnetic on-off valve and a second electromagnetic on-off valve disposed in the second pipe.

The first flow rate is a flow rate ejected from the ionized air generating unit when the pressure of the air supplied to the ionized air generating unit is set to 0.2 MPa, and the second flow rate is a flow rate of the air supplied to the ionized air generating unit. It is a flow rate ejected from the ionized air generating means when the pressure is set to 0.1 Mpa,
The first predetermined time is 2 to 3 seconds, and the second predetermined time is 10 to 20 seconds.

A processing apparatus according to the present invention includes a workpiece holding means for holding a workpiece, a processing means for processing the workpiece held by the workpiece holding means, and a workpiece processed by the processing means. A processing machine comprising: a cleaning unit that cleans; and a transport unit that unloads the workpiece cleaned by the cleaning unit from the cleaning unit, the cleaning unit sucking and holding the workpiece and rotating the spinner A table, cleaning water supply means for supplying cleaning water to the workpiece held on the spinner table, and a static eliminator for injecting ionized air onto the workpiece cleaned on the spinner table. removal device, an air supply source, an ionization air generation means for injecting to generate ionized air, the air supplying air of the air supply source to the ionization air generation means Supply means, and the air supply means is provided with a flow rate adjusting means for adjusting the flow rate of the air supplied to the ionized air generating means. Therefore, when the workpiece after cleaning is carried out from the spinner table, the flow rate is adjusted. The adjustment means is operated to inject ionized air at a first flow rate for a first predetermined time, and when the first predetermined time has elapsed, the ionized air is flowed at a first flow rate while the work piece is separated from the spinner table. Since the second predetermined time that is longer than the first predetermined time is jetted at a smaller second flow rate, the flow rate of ionized air that is jetted onto the workpiece is increased when the cleaned workpiece is unloaded from the spinner table. As a result, the workpiece can be immediately unloaded from the spinner table, and the flow rate of ionized air injected to the workpiece can be reduced thereafter. It is possible to reduce the amount of static electricity charged to the workpiece for injecting the said first workpiece over a longer second predetermined time than the predetermined time.

The perspective view of the cutting machine as a processing machine equipped with the static eliminating device comprised according to this invention. The perspective view which fractures | ruptures and shows a part of washing | cleaning means with which the cutting machine shown in FIG. 1 was equipped. Explanatory drawing which shows the state which located the spinner table of the washing | cleaning means shown in FIG. 2 in the workpiece carrying in / out position. Explanatory drawing which shows the state which located the spinner table of the washing | cleaning means shown in FIG. 2 in the working position. The block block diagram of the static eliminating device comprised according to this invention. Explanatory drawing which shows the static elimination process implemented by the static elimination apparatus comprised according to this invention.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a static eliminator configured according to the present invention and a processing machine equipped with the static eliminator will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a cutting machine as a processing machine equipped with a static eliminator configured according to the present invention. A cutting machine 1 shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 as a work holding means for holding a work is disposed so as to be movable in a direction (X-axis direction) indicated by an arrow X which is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 3 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a work piece via a dicing tape. The chuck table 3 configured as described above can be moved in a cutting feed direction (X-axis direction) indicated by an arrow X by a cutting feed means (not shown).

  A cutting machine 1 shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is disposed along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the cutting feed direction (X-axis direction). The spindle unit 4 is moved in the index feed direction (Y-axis direction) by an index feed means (not shown), and is moved in the cut feed direction (Z-axis direction) indicated by an arrow Z in FIG. 1 by a not-shown cut feed means. It is like that. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in an indexing direction (Y-axis direction) and a cutting direction (Z-axis direction), and is rotatably supported by the spindle housing 41. A rotary spindle 42 and a cutting blade 43 attached to the front end of the rotary spindle 42 are provided.

  The illustrated cutting machine 1 includes imaging means 5 for imaging the surface of the workpiece held on the chuck table 3 and detecting an area to be cut by the cutting blade 43. The imaging means 5 is composed of optical means such as a microscope and a CCD camera. In addition, the cutting machine 1 includes a display unit 6 that displays an image captured by the imaging unit 5.

The illustrated cutting machine 1 includes a cleaning unit 7 that cleans the wafer cut by the cutting blade 43. The cleaning means 7 will be described with reference to FIGS.
The cleaning means 7 in the illustrated embodiment includes a spinner table mechanism 71 and a cleaning water receiving means 72 disposed so as to surround the spinner table mechanism 71. The spinner table mechanism 71 includes a spinner table 711, an electric motor 712 as a rotational drive unit that rotationally drives the spinner table 711, and a support mechanism 713 that supports the electric motor 712 so as to be movable in the vertical direction. . The spinner table 711 includes a suction chuck 711a whose upper surface formed of a porous material serves as a holding surface for holding a workpiece, and the suction chuck 711a communicates with suction means (not shown). Accordingly, the spinner table 711 holds the wafer on the suction chuck 711 by placing a wafer as a workpiece on the suction chuck 711a and applying a negative pressure by suction means (not shown). The electric motor 712 connects the spinner table 711 to the upper end of the drive shaft 712a. The support mechanism 713 includes a plurality of support legs 713a (three in the illustrated embodiment) and a plurality of support legs 713a that are connected to the electric motor 712 by connecting the support legs 713a (three in the illustrated embodiment). ) Air cylinder 713b. The support mechanism 713 configured as described above operates the air cylinder 713b to move the electric motor 712 and the spinner table 711 to the workpiece loading / unloading position, which is the upper position illustrated in FIG. 3, and the lower position illustrated in FIG. Position to the working position that is the position.

  The cleaning water receiving means 72 includes a cleaning water receiving container 721, three support legs 722 (two are shown in FIG. 2) that support the cleaning water receiving container 721, and the electric motor 712. And a cover member 723 attached to the drive shaft 712a. As shown in FIGS. 3 and 4, the washing water receiving container 721 includes a cylindrical outer wall 721a, a bottom wall 721b, and an inner wall 721c. A hole 721d through which the drive shaft 712a of the electric motor 712 is inserted is provided at the center of the bottom wall 721b, and an inner wall 721c protruding upward from the periphery of the hole 721d is formed. Further, as shown in FIG. 2, a drainage port 721e is provided in the bottom wall 721b, and a drain hose 724 is connected to the drainage port 721e. The cover member 723 is formed in a disc shape, and includes a cover portion 723a that protrudes downward from the outer peripheral edge thereof. When the electric motor 712 and the spinner table 711 are positioned at the work position shown in FIG. 4, the cover member 723 thus configured has a gap between the cover portion 723 a and the inner wall 721 c that constitutes the cleaning water receiving container 721. Is positioned to polymerize.

  The cleaning means 7 in the illustrated embodiment includes a cleaning water supply means 74 for supplying cleaning water to the semiconductor wafer 10 that is a processed workpiece held on the spinner table 711. The cleaning water supply means 74 includes a cleaning water injection nozzle 741 that supplies cleaning water toward the wafer held on the spinner table 711, and an electric motor 742 that can rotate forward and reverse to swing the cleaning water injection nozzle 741. I have. The cleaning water jet nozzle 741 is composed of a nozzle portion 741a that extends horizontally and has a tip bent downward, and a support portion 741b that extends downward from the base end of the nozzle portion 741a. The support portion 741b is the cleaning water. An insertion hole (not shown) provided in the bottom wall 721b constituting the receiving container 721 is inserted therethrough. The nozzle portion 741a of the cleaning water jet nozzle 741 includes a cleaning water passage and an air passage, the cleaning water passage is connected to the cleaning water supply source, and the air passage is connected to the air supply source. A sealing member (not shown) that seals between the support portion 741b and the support hole 741b is mounted on the periphery of the insertion hole (not shown) through which the support portion 741b of the cleaning water jet nozzle 741 configured as described above is inserted.

  Further, the cleaning means 7 in the illustrated embodiment includes an air injection means 75 for supplying air to the semiconductor wafer 10 which is a processed object held by the spinner table 711. The air ejecting means 75 includes an air nozzle 751 that ejects air toward the cleaned wafer held by the spinner table 711, and an electric motor 752 that can rotate forward and reverse to swing the air nozzle 751. The air nozzle 751 is connected to an air supply source (not shown). The air nozzle 751 includes a nozzle portion 751a that extends horizontally and has a distal end bent downward, and a support portion 751b that extends downward from the base end of the nozzle portion 751a. The support portion 751b is the above-described washing water receiving container. It is disposed through an insertion hole (not shown) provided in the bottom wall 721 b constituting the 721. A seal member (not shown) that seals between the support portion 751b and the support hole 751b is attached to the periphery of an insertion hole (not shown) through which the support portion 751b of the air nozzle 751 is inserted.

  1 and 2, the cutting machine 1 supplies ionized air toward the semiconductor wafer 10 that is the workpiece after cleaning held by the spinner table 711 that constitutes the cleaning means 7. A static eliminating device 8 for spraying is provided. The static eliminator 8 includes ionized air generating means 81 that is disposed adjacent to the cleaning means 7 and generates and jets ionized air. The ionized air generating means 81 is supplied with air from an air supply source 82 via an air supply means 83 as shown in FIG. As the ionized air generating means 81 that generates ionized air, for example, trade name: Ionizer (registered trademark) manufactured and sold by Keyence Corporation can be used. The ionized air generating means 81 injects ionized air from the plurality of injection holes 811. The air supply source 82 is a common air supply source of air that is installed in a factory and supplied to various devices, and has a pressure of about 0.3 Mpa. The air supply means 83 includes an air introduction pipe 831 connected to the ionized air generation means 81, an air supply pipe 832 connected to the air supply source 82, and the air supply pipe 832 through the air introduction pipe 831. And a flow rate adjusting means 84 for adjusting the flow rate of the air supplied to the ionized air generating means 81. The flow rate adjusting means 84 is disposed in the first pipe 841 and the second pipe 842 that connect the air supply pipe 832 and the air introduction pipe 831, and the first pipe 841 and the second pipe 842, respectively. The first electromagnetic on-off valve 843 and the second electromagnetic on-off valve 844, and the control means 845 for controlling the opening and closing of the first electromagnetic on-off valve 843 and the second electromagnetic on-off valve 844. In the illustrated embodiment, the first pipe 841 and the second pipe 842 of the flow rate adjusting unit 84 configured as described above have an inner diameter set smaller than that of the first pipe 841. Then, by closing the second electromagnetic on-off valve 844 and opening the first electromagnetic on-off valve 843, the air supplied from the air supply pipe 832 is supplied to the ionized air generating means 81 through the first pipe 841. The air ionized by the ionized air generating means 81 is ejected from the plurality of ejection holes 811 at the first flow rate. The air supplied from the air supply pipe 832 by closing the first electromagnetic on-off valve 843 and opening the second electromagnetic on-off valve 844 is supplied to the ionized air generating means 81 through the second pipe 842. Air ionized by the ionized air generating means 81 is ejected from the plurality of injection holes 811 at the second flow rate. The first flow rate is a flow rate ejected from the plurality of injection holes 811 when the pressure of the air supplied to the ionized air generation unit 81 is set to 0.2 Mpa, and the second flow rate is the ionized air generation unit. This is the flow rate ejected from the plurality of ejection holes 811 when the pressure of the air supplied to 81 is set to 0.1 MPa.

  Referring back to FIG. 1, the description will continue. The illustrated cutting machine 1 includes a cassette mounting portion 11a on which a cassette that houses a semiconductor wafer 10 as a wafer to be processed is mounted. A cassette table 111 is disposed on the cassette mounting portion 11 a so as to be movable up and down by lifting means (not shown). The cassette 11 is mounted on the cassette table 111. The semiconductor wafer 10 is affixed to a dicing tape T mounted on an annular frame F, and is accommodated in the cassette 11 while being supported by the annular frame F via the dicing tape T. The semiconductor wafer 10 is divided into a plurality of areas by a plurality of streets 101 arranged in a lattice pattern on the surface, and devices 102 such as ICs and LSIs are formed in the divided areas. As shown in FIG. 1, the semiconductor wafer 10 thus configured is attached to the dicing tape T mounted on the annular frame F with the front surface, that is, the surface on which the street 101 and the device 102 are formed facing upward. Is done.

  The illustrated cutting machine 1 carries out the unprocessed semiconductor wafer 10 housed in the cassette 11 to the temporary placement means 12 disposed in the temporary placement section 12 a and also loads the processed semiconductor wafer 10 into the cassette 11. On the chuck table 3, the workpiece unloading / loading means 13 to be processed, the first workpiece transporting means 14 for transporting the unprocessed semiconductor wafer 10 unloaded to the temporary placement means 12 onto the chuck table 3, and A second workpiece conveying means 15 for conveying the cut semiconductor wafer 10 to the cleaning means 7 is provided.

The cutting machine 1 equipped with the static eliminator 8 described above is configured as described above, and the operation thereof will be described below.
As shown in FIG. 1, an unprocessed semiconductor wafer 10 (hereinafter simply referred to as “semiconductor wafer 10”) supported on an annular frame F via a dicing tape T has a predetermined surface of the cassette 11 with the surface being the processing surface facing upward. Housed in position. The unprocessed semiconductor wafer 10 accommodated in a predetermined position of the cassette 11 is positioned at the unloading position when the cassette table 111 is moved up and down by lifting means (not shown). Next, the workpiece carry-out / carry-in means 13 moves forward and backward to carry the semiconductor wafer 10 positioned at the carry-out position to the temporary placement means 12 disposed in the temporary placement section 12a. The semiconductor wafer 10 carried out to the temporary placement means 12 is aligned at a predetermined position by the temporary placement means 12. Next, the unprocessed semiconductor wafer 10 aligned by the temporary placing means 12 is transferred onto the suction chuck 32 of the chuck table 3 by the turning operation of the first workpiece transfer means 14. Then, by operating a suction means (not shown), the dicing tape T side is sucked and held by the suction chuck 32. The annular frame F is fixed by a clamp 33. The chuck table 3 that sucks and holds the semiconductor wafer 10 in this way is positioned immediately below the imaging means 5 by a moving means (not shown).

  When the chuck table 3 is positioned immediately below the image pickup means 5, the division planned line formed on the semiconductor wafer 10 is detected by the image pickup means 5, and the spindle unit 4 is moved and adjusted in the arrow Y direction which is the indexing direction for division. A precise alignment operation between the planned line and the cutting blade 43 is performed (alignment process).

  When the alignment step is performed as described above, the chuck table 3 is moved to a cutting region below the cutting blade 43, and the cutting blade 43 is rotated in a predetermined direction and is fed by a predetermined amount. Then, the chuck table 3 holding the semiconductor wafer 10 by suction is moved in the cutting feed direction indicated by the arrow X at a predetermined cutting feed speed. As a result, the semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined division line by the cutting blade 43 (cutting process).

  If the above-described cutting process is performed along all the division lines of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first returned to the position where the semiconductor wafer 10 is sucked and held. The suction holding of the semiconductor wafer 10 is released. Then, the semiconductor wafer 10 is placed on the suction chuck 711a of the spinner table 711 that constitutes the cleaning means 7 positioned at the workpiece loading / unloading position as shown in FIG. It is conveyed and sucked and held by the suction chuck 711a. At this time, the cleaning water injection nozzle 741 of the cleaning water supply means 74 and the air nozzle 751 of the air injection means 75 are positioned at standby positions spaced apart from above the spinner table 711 as shown in FIG.

  If the processed semiconductor wafer 10 is held on the spinner table 711 of the cleaning means 7, a cleaning process is executed. That is, as shown in FIG. 4, the spinner table 711 is positioned at the work position, and the electric motor 742 of the cleaning water supply means 74 is driven to hold the nozzle outlet 741a of the cleaning water injection nozzle 741 on the spinner table 711. The semiconductor wafer 10 is positioned above the center portion. Then, while rotating the spinner table 711 at a rotational speed of, for example, 800 rpm, cleaning water composed of pure water and air is ejected from the ejection port of the nozzle portion 741a. The nozzle portion 741a is configured by a so-called two-fluid nozzle and is supplied with pure water of about 0.2 MPa, and is supplied with air of about 0.3 to 0.5 MPa, and the pure water is ejected by the air pressure. The surface that is the processed surface of the semiconductor wafer 10 is cleaned. At this time, from the position where the electric motor 742 is driven and the cleaning water ejected from the nozzle 741a of the cleaning water spray nozzle 741 hits the center of the semiconductor wafer 10 held by the spinner table 711 to the position hitting the outer periphery. It can be swung within the required angle range. As a result, the contamination adhering to the surface of the semiconductor wafer 10 can be easily washed away.

  When the above-described cleaning process is completed, a drying process is performed. That is, the cleaning water injection nozzle 741 is positioned at the standby position, and the outlet of the nozzle portion 751a of the air nozzle 751 of the air injection means 75 is positioned above the central portion of the semiconductor wafer 10 held on the spinner table 711. Then, while rotating the spinner table 711 at a rotational speed of, for example, 2000 rpm, 0.5 MPa of air is ejected from the ejection port of the nozzle portion 751a for about 15 seconds. At this time, required from the position where the electric motor 752 is driven and the air jetted from the nozzle 751a constituting the air nozzle 751 hits the center of the semiconductor wafer 10 held by the spinner table 711 to the position hitting the outer periphery. It can be swung in an angular range. As a result, the surface of the semiconductor wafer 10 is dried.

  In the above-described cleaning process and drying process, the semiconductor wafer 10 as a workpiece is cleaned and dried by rotating the spinner table 711 at a high speed. For this reason, friction is generated between the surface of the spinner table 711 holding the semiconductor wafer 10 and the semiconductor wafer 10 in contact with the spinner table 711, and static electricity is generated, and the static electricity is charged to the semiconductor wafer 10. If the semiconductor wafer 10 is charged with static electricity, there is a risk of degrading the quality of the device 102. Therefore, it is necessary to remove the static electricity charged on the semiconductor wafer 10. Hereinafter, a static electricity removing process for removing static electricity charged in the semiconductor wafer 10 will be described.

  When the drying process described above is performed, the rotation of the spinner table 711 is stopped and the air nozzle 751 of the air ejecting means 75 is positioned at the standby position. Then, the spinner table 711 is positioned at the workpiece loading / unloading position shown in FIG. 3, and the suction holding of the semiconductor wafer 10 held on the spinner table 711 is released. Next, a static electricity removing process is performed to remove static electricity charged on the semiconductor wafer 10 by operating the static electricity removing device 8 and spraying ionized air, that is, ionized air, onto the semiconductor wafer 10 on the spinner table 711. In this static electricity removing step, first, as shown in FIG. 6A, the first workpiece transfer means 14 holds the annular frame F that supports the semiconductor wafer 10 via the dicing tape T, and is controlled. The means 845 closes the second electromagnetic on-off valve 844 that constitutes the flow rate adjusting means 84 of the static eliminator 8, and opens the first electromagnetic on-off valve 843. As a result, the air from the air supply source 82 is supplied to the ionized air generation means 81 through the air supply pipe 832 and the first pipe 841 at a pressure of 0.2 Mpa. The air having a pressure of 0.2 Mpa supplied to the ionized air generating means 81 in this way is ionized and injected from the plurality of injection holes 811 onto the semiconductor wafer 10 on the spinner table 711 at a first flow rate (first Static electricity removal process). This first static electricity removing step is performed for a first predetermined time (2 to 3 seconds). In the first static electricity removing step, since the pressure of the air supplied to the ionized air generating means 81 is relatively high 0.2 Mpa, the air is injected from the plurality of injection holes 811 onto the semiconductor wafer 10 on the spinner table 711. Since the air flow rate (first flow rate) is large, the static elimination speed is high, and the semiconductor wafer 10 can be carried out in a short time of 2 to 3 seconds.

  Next, the first workpiece transfer means 14 is operated to separate (unload) the semiconductor wafer 10 from the upper surface of the spinner table 711 as shown in FIG. The first electromagnetic on-off valve 843 constituting the flow rate adjusting means 84 is closed and the second electromagnetic on-off valve 844 is opened. As a result, the air from the air supply source 82 is supplied to the ionized air generation means 81 through the air supply pipe 832 and the second pipe 842 at a pressure of 0.1 MPa. The air having a pressure of 0.1 Mpa supplied to the ionized air generating means 81 in this way is injected into the semiconductor wafer 10 which is ionized and separated from the upper surface of the spinner table 711 from the plurality of injection holes 811 at the second flow rate. (Second static electricity removing step). This second static electricity removing step is performed for a second predetermined time (10 to 20 seconds). In the second static electricity removing step, the pressure of the air supplied to the ionized air generating means 81 is 0.1 Mpa, which is lower than that in the first static electricity removing step. Therefore, the air is injected from the plurality of injection holes 811 onto the semiconductor wafer 10. Since the air flow rate (second flow rate) is small, the static elimination speed is slow. However, the semiconductor wafer 10 extends over a second predetermined time (10 to 20 seconds) longer than the first predetermined time (2 to 3 seconds). By spraying on the semiconductor wafer 10, the amount of static electricity charged in the semiconductor wafer 10 can be reduced.

  As described above, when the static electricity removing step including the first static electricity removing step and the second static electricity removing step for removing the static electricity charged on the semiconductor wafer 10 is performed, the first workpiece transfer means 14 is operated. Then, the semiconductor wafer 10 from which static electricity has been removed is transported to the temporary placement means 12 disposed in the temporary placement portion 12a. The processed semiconductor wafer 10 transported to the temporary placement means 12 is stored in a predetermined position of the cassette 11 by the workpiece unloading / loading means 13.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications can be made within the scope of the gist of the present invention. In the embodiment described above, the example in which the static eliminator 8 is incorporated in the cleaning means 7 of the cutting machine 1 has been described. However, the static eliminator 8 may be incorporated in the cleaning means of a processing machine such as a laser processing machine.

1: Cutting machine 3: Chuck table 4: Spindle unit 42: Rotating spindle 43: Cutting blade 6: Imaging means 5: Display means 7: Cleaning means 71: Spinner table mechanism 711: Spinner table 74: Cleaning water supply means 75: Air jetting means 8: Static electricity removing device 81: Ionized air generating means 82: Air supply source 83: Air supply means 84: Flow rate adjusting means 10: Semiconductor wafer 11: Cassette 12: Temporary placing means 13: Workpiece unloading / loading means 14: First workpiece conveying means 15: Second workpiece conveying means F: Annular frame T: Dicing tape

Claims (3)

A workpiece holding means for holding the workpiece, a processing means for processing the workpiece held by the workpiece holding means, and a cleaning means for cleaning the workpiece processed by the processing means A processing unit comprising: a transporting unit that unloads the workpiece cleaned by the cleaning unit from the cleaning unit;
The cleaning means includes a spinner table that rotates while sucking and holding the workpiece, cleaning water supply means for supplying cleaning water to the workpiece held on the spinner table, and a workpiece cleaned on the spinner table. Comprising a static eliminator that injects ionized air onto the workpiece,
The static eliminator comprises an air supply source, ionized air generating means for generating and ejecting ionized air, and air supply means for supplying air from the air supply source to the ionized air generating means, The air supply means includes a flow rate adjusting means for adjusting a flow rate of air supplied to the ionized air generating means , and further, when the workpiece cleaned from the spinner table is carried out by the conveying means, the flow rate adjusting means. , The ionized air is jetted at a first flow rate for a first predetermined time, and when the first predetermined time has elapsed, the ionized air is discharged in a state where the workpiece is separated from the spinner table. Control means for controlling to inject for a second predetermined time longer than the first predetermined time at a second flow rate less than the flow rate;
A processing machine characterized by that . The flow rate adjusting means is disposed in the first pipe, the first pipe communicating the air supply source and the ionized air generating means, the second pipe having an inner diameter smaller than the inner diameter of the first pipe, and the first pipe. The processing machine according to claim 1, further comprising: a first electromagnetic on-off valve that is provided, and a second electromagnetic on-off valve that is disposed in the second pipe. The first flow rate is a flow rate ejected from the ionized air generating unit when the pressure of the air supplied to the ionized air generating unit is set to 0.2 Mpa, and the second flow rate is supplied to the ionized air generating unit. The flow rate of the air from the ionized air generating means when the air pressure is set to 0.1 MPa.
The processing machine according to claim 1 or 2, wherein the first predetermined time is 2 to 3 seconds, and the second predetermined time is 10 to 20 seconds .

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