JP2019111628A - Cutting device - Google Patents

Abstract

To carry a work-piece without using an independent carrying mechanism.SOLUTION: The cutting device comprises: a cutting unit that cuts a work-piece with a cutting blade; a processing/feeding unit that moves a chuck table between a processing area where the work-piece is cut and a carrying-n/out area where the work-piece is carried in and out; a moving unit that moves the cutting unit in an indexing/feeding direction and a direction perpendicular to a holding surface; a placement area in which the work-piece before being cut is placed; a carrying-out unit that carries out the work-piece after being cut; and a carrying pad that carries the work-piece before being cut to the chuck table positioned at the carrying-in/out area and carries the work-piece after being cut to the carrying-out unit. The carrying pad is attached to and detached from the moving unit, suctions and holds the work-piece while being attached to the moving unit and is moved by the moving unit while suctioning and holding the work-piece to carry the work-piece.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cutting device for cutting a workpiece with a cutting blade.

  There is known a cutting device which cuts a substrate such as a semiconductor wafer, a package substrate, a ceramic substrate, a glass substrate or the like with a cutting blade mounted on a spindle in a device chip manufacturing process.

  The cutting device includes a cutting unit provided with a cutting blade, and a chuck table for holding a workpiece. The operator of the cutting device carries the workpiece into the cutting device and places it on the holding surface of the top surface of the chuck table. Then, the workpiece is suctioned and held by the chuck table, and the workpiece is cut while being brought into contact with the workpiece while rotating the cutting blade. After cutting is completed, the operator unloads the workpiece from the chuck table.

  As described above, a cutting device in which an operator carries a workpiece into and out of a chuck table is known as a manual type cutting device. On the other hand, there is known a fully-automatic type cutting device which automatically carries in and out a workpiece.

  The fully automatic type cutting apparatus includes a placement area on which a workpiece to be processed is placed, a carry-out area on which the workpiece to be processed is placed, and a transport mechanism for carrying in and out the workpiece. . The transport mechanism carries in the workpiece before processing placed in the placement area onto the chuck table, and carries out the workpiece after processing out of the chuck table into the unloading region. Furthermore, the full-automatic type cutting device may be equipped with a cleaning unit that cleans the processed workpiece.

  A manual-type cutting device without a transport mechanism is inexpensive, has a relatively simple structure, and requires a small area for installation. However, the operator has to carry in and out the workpiece at predetermined timings before and after cutting, which requires a regular operation by the operator.

  On the other hand, in a full-automatic type cutting device provided with a transport mechanism, the operator can carry in and out the workpiece to and from the cutting device at any timing regardless of the progress of cutting. However, the apparatus configuration becomes complicated because the transport mechanism is provided, the cost of the cutting apparatus becomes high, and the size becomes large, so a relatively large installation area is required.

  Therefore, in a full-automatic type cutting device, a cutting device has been developed that includes a transport mechanism that transports a workpiece with a relatively simplified configuration (see Patent Document 1).

JP 2017-84950 A

  Also in the full-automatic type cutting device described in Patent Document 1, a transport mechanism including an independent drive system is required for loading and unloading a workpiece to and from the chuck table. Therefore, the device configuration is still complicated as compared with the manual type cutting device, and the manufacturing cost of the cutting device becomes relatively expensive.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a cutting device capable of carrying in and out a workpiece without using an independent conveyance mechanism.

  According to one aspect of the present invention, there is provided a cutting unit for cutting a workpiece held on a holding surface of a chuck table with a cutting blade mounted on a spindle, a processing region in which the workpiece is cut, and a workpiece A processing feed unit for moving the chuck table in a processing feed direction parallel to the holding surface between a loading / unloading area to be carried in / out, and an index perpendicular to the processing feed direction parallel to the holding surface A moving unit for moving in a feeding direction and a direction perpendicular to the holding surface, a placement area adjacent to the loading / unloading area on which a workpiece before cutting is placed, and unloading the workpiece after cutting An unloading unit and a workpiece before cutting placed on the placement area are transported to the chuck table located in the loading and unloading area, and a workpiece after cutting placed on the chuck table is transported to the unloading unit Do A transfer pad, which is attached to and removed from the moving unit in a standby area adjacent to the loading and unloading area, suctions and holds the workpiece while being attached to the moving unit, There is provided a cutting device characterized in that a workpiece is transported by being moved by the moving unit while being held by suction.

  In one aspect of the present invention, the transfer pad includes an engaged portion at the top, and the moving unit extends from the moving plate to which the cutting unit is fixed, and the moving plate in the processing feed direction. The arm having the engaging portion engaged with the engaged portion, and the transfer plate is moved in the direction perpendicular to the holding surface to move the transfer pad placed in the waiting area. The engaging portion of the arm may be engaged with the engaged portion, and the transfer pad may be connected to the moving plate.

  In one aspect of the present invention, the carry-out unit includes a carry-out table on which the workpiece is placed, and the carry-out table includes an area immediately above the carry-in / out area and a carry-out side of the processing feed unit. The unloading unit is movable between the area and the unloading unit moves the unloading table on which the workpiece is placed by the transfer pad to the unloading area when the unloading table is positioned in the area immediately above the unloading area. The workpiece may be unloaded.

  Furthermore, in one aspect of the present invention, a gas is jetted onto the surface of the workpiece placed on the movement path of the carry-out table and placed on the carry-out table, and the liquid attached during cutting is processed You may provide the drying nozzle which removes from things. Further, a liquid is jetted to the holding surface of the chuck table or the workpiece held by the chuck table and installed on the moving path of the chuck table moved by the processing feed unit to hold the holding surface or the workpiece. A cleaning nozzle may be provided to clean the workpiece.

  A cutting apparatus according to an aspect of the present invention includes a transport pad that transports a workpiece from a placement area to a chuck table, and transports the workpiece from the chuck table to a carry-out unit. Here, the transfer pad is attached to and removed from the moving unit for moving the cutting unit, and is moved by the moving unit. Therefore, the cutting device does not need a moving mechanism having an independent drive system only for moving the transfer pad.

  When the workpiece is not transported, for example, when the workpiece is cut, the transport pad is detached from the moving unit. Then, the load of the moving unit for moving the cutting unit does not increase.

  Therefore, the present invention provides a cutting device capable of carrying in and out the workpiece without using an independent transport mechanism.

It is a perspective view which shows a to-be-processed object and a cutting device typically. FIG. 2A is a side view schematically showing how the transfer pad is attached to the moving unit, and FIG. 2B is a view schematically showing how a workpiece is carried into the chuck table by the transfer pad. FIG. FIG. 3 (A) is a side view schematically showing a state in which the workpiece is cut by the cutting unit, and FIG. 3 (B) schematically shows a state in which the workpiece is placed on the carry-out unit by the transport pad. FIG. FIG. 4A is a top view schematically showing how the transport pad is attached to the moving unit, and FIG. 4B is a suction holding of the workpiece on which the transport pad is mounted in the mounting area. It is a top view which shows typically a mode that it does. FIG. 5A is a top view schematically showing how a workpiece is carried into a chuck table by a transfer pad, and FIG. 5B schematically shows how a workpiece is cut by a cutting unit. Is a top view shown in FIG. FIG. 6 (A) is a top view schematically showing how the work piece is sucked and held by the transfer pad, and FIG. 6 (B) is a top view schematically showing how the work piece is placed on the unloading unit. FIG. FIG. 7A is a top view schematically showing how a workpiece is carried out by the carry-out unit, and FIG. 7B is a moving unit for moving a transfer pad to suction and hold a new workpiece. It is a top view which shows typically a mode that it is moved by.

  A cutting device according to an aspect of the present invention will be described with reference to the drawings. First, the to-be-processed object of the cutting device which concerns on this embodiment is demonstrated using FIG. FIG. 1 is a perspective view schematically showing a workpiece and a cutting device.

  The workpiece 1 is a substrate made of, for example, a material such as silicon, SiC (silicon carbide), or other semiconductor, or a material such as sapphire, glass, quartz, or ceramic. Alternatively, the workpiece is a package substrate in which the device is covered with a resin. A division planned line is set to the workpiece 1, and when the workpiece 1 is divided by cutting along the division planned line, a device chip can be formed.

  Next, the cutting device 2 according to the present embodiment will be described. The cutting device 2 includes a chuck table 6 having a device base 4 for supporting the respective components and sucking and holding the workpiece 1 on the upper surface of the device base 4, and a cutting unit 8 for cutting the workpiece 1 Prepare. The cutting device 2 sucks and holds the workpiece 1 by the chuck table 6 and cuts the workpiece 1 by the cutting unit 8. The cutting device 2 further includes a camera unit 10 that images the workpiece 1 in order to align the cutting unit 8 at a position adjacent to the cutting unit 8.

  The chuck table 6 internally has a suction passage (not shown) whose one end is connected to a suction source, and the other end of the suction passage is connected to a porous member disposed above the chuck table 6 . The porous member is exposed upward, and the upper surface of the porous member is the holding surface 6 a of the chuck table 6.

  When the workpiece 1 is placed on the holding surface 6 a and the suction source is activated to apply a negative pressure to the workpiece 1 through the porous member, the workpiece 1 is sucked and held by the chuck table 6. The chuck table 6 is rotatable about an axis along a direction perpendicular to the holding surface 6a.

  An opening 16 having a long side along the X-axis direction is provided at the central portion of the upper surface of the device base 4. Inside the opening 16, an X-axis moving table 18 and one end of the X-axis moving table are provided. A dustproof and drip-proof cover 20 attached to 18 is disposed. A processing feed unit (not shown) for moving the X-axis moving table 18 along the X-axis direction parallel to the holding surface 6a is provided in the area protected by the dustproof drip-proof cover 20 below the X-axis moving table 18. It is arranged.

  The machining feed unit machining feeds the chuck table 6 in the X-axis direction when cutting the workpiece 1. That is, the X-axis direction is the processing feed direction. Further, the processing feed unit moves the chuck table 6 in the processing feed direction between the processing area 62 where the workpiece 1 is cut and the loading / unloading area 60 where the workpiece 1 is carried in and out of the chuck table 6. Move it.

  At the rear of the upper surface of the device base 4, a support structure 22 having a protrusion extending to the top of the opening 16 is erected. A pair of Y-axis guide rails 24 parallel to the Y-axis direction is provided on the front side surface of the support structure 22, and a Y-axis moving plate 26 is slidably attached to the Y-axis guide rails 24.

  A nut portion (not shown) is provided on the rear surface side of the Y-axis moving plate 26, and the Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed to the nut portion. . The Y-axis pulse motor 30 is connected to one end of the Y-axis ball screw 28. When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

  The pair of Y-axis guide rails 24, the Y-axis moving plate 26, the Y-axis ball screw 28, and the Y-axis pulse motor 30 index and feed the cutting unit 8 and the camera unit 10 in the Y-axis direction Act as. That is, the Y-axis direction is the indexing feed direction.

  A pair of Z-axis guide rails 32 extending in the Z-axis direction and a Z-axis movement plate 34 slidably mounted on each Z-axis guide rail 32 are disposed on the front surface of the Y-axis movement plate 26 ing. A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis movement plate 34, and a Z-axis ball screw 36 parallel to the Z-axis guide rail 32 is screwed into this nut portion. ing.

  A Z-axis pulse motor 38 is connected to one end of the Z-axis ball screw 36. When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38, the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32. The cutting unit 8 and the camera unit 10 are fixed to the lower front side of the Z-axis moving plate 34.

  The pair of Z-axis guide rails 32, the Z-axis moving plate 34, the Z-axis ball screw 36, and the Z-axis pulse motor 38 make the cutting unit 8 and the camera unit 10 perpendicular to the holding surface 6a of the chuck table 6. It functions as a lifting unit that moves in the Z-axis direction. The index feeding unit and the elevating unit function as a moving unit for moving the cutting unit 8 and the like.

  The cutting unit 8 includes a spindle (not shown) along the Y-axis direction, and an annular cutting blade 8a attached to the tip of the spindle. A spindle motor (not shown) for rotating the spindle about the Y-axis direction is connected to the proximal end side of the spindle. When the spindle is rotated by the spindle motor, the cutting blade 8a is rotated.

  The cutting blade 8a is provided with a cutting edge at its outer peripheral portion. The cutting blade includes, for example, abrasive grains and a bonding material in which the abrasive grains are dispersed. When the rotating cutting blade 8a is positioned at a predetermined height position and the X-axis moving table 18 is moved in the processing feed direction, the workpiece 1 is cut by the cutting blade 8a.

  When the workpiece 1 is cut by the cutting blade 8a, cutting chips are generated from the workpiece 1 and scattered. In addition, machining heat is generated by cutting, and the workpiece 1 and the cutting blade 8a become high temperature. Therefore, while the workpiece 1 is being cut, cutting fluid is supplied to the workpiece 1 and the cutting blade 8a. The cutting unit 8 includes a nozzle 8b on the side of the cutting blade 8a, and supplies the cutting fluid from the nozzle 8b to the upper surface of the workpiece 1 and the cutting blade 8a.

  The cutting fluid supplied from the nozzle 8b is, for example, pure water. The cutting fluid has a function of cooling the workpiece 1 and the cutting blade 8a. In addition, cutting chips and the like generated by cutting are flowed out of the workpiece 1 by the cutting fluid and eliminated.

  At a position adjacent to the loading / unloading area 60 on the upper surface of the apparatus base 4, a placing area 40 on which the workpiece 1 before cutting is placed is set. The operator of the cutting device 2 places the workpiece 1 before cutting on the placement area 40 at an arbitrary timing.

  Further, at another position adjacent to the loading / unloading area 60 on the upper surface of the apparatus base 4, a carry-out unit 50 for carrying out the workpiece 1 after cutting is provided. The carry-out unit 50 includes, for example, a carry-out table 52 on which a workpiece is placed, and the carry-out table 52 is between the area immediately above the carry-in area 60 and the carry-out area 70 on the side of the processing feed unit. You can move The workpiece 1 after cutting is placed on the unloading unit 50 positioned in the area immediately above. Then, when the unloading unit 50 moves to the unloading area 70, the workpiece 1 can be unloaded.

  The cutting device 2 conveys the workpiece 1 placed on the placement area 40 to the chuck table 6 positioned in the loading and unloading area 60, and the workpiece 1 placed on the chuck table 6 is the delivery table of the delivery unit 50. A transfer pad 44 is provided for transferring to 52.

  The transfer pad 44 is removable from the Z-axis moving plate 34 of the moving unit. A still another position adjacent to the loading / unloading area 60 is provided with a standby area 58 where the transport pad 44 is placed, and when the transport pad 44 is not attached to the Z-axis moving plate 34, the standby area 58 Placed in

  The lower surface of the transfer pad 44 is a suction surface capable of sucking and holding the workpiece 1, and the inside of the transfer pad 44 is provided with a suction passage 68 (see FIG. 2A etc.) one end of which reaches the suction surface. . The transfer pad 44 has a bracket-like engaged portion 46 at the top, and the other end of the suction path 68 reaches the engaged portion 46.

  On the front surface of the Z-axis moving plate 34 of the moving unit, an arm 42 extending in the processing feed direction (X-axis direction) is fixed. The arm 42 has an engaging portion 48 engaged with the engaged portion 46 of the transfer pad 44 at the lower end of the tip. Inside the arm 42, there are provided two suction paths 64, 66 (see FIG. 2A etc.) one end of which communicates with the engaging portion 48. Independent suction sources (not shown) are connected to the other ends of the suction paths 64 and 66, respectively.

  The arm 42 of the Z-axis moving plate 34 applies a negative pressure to the engaged portion 46 through the suction path 64 to engage the engaged portion 46 of the transfer pad 44 with the engaging portion 48 of the arm 42. Further, when the transfer pad 44 is engaged with the arm 42, the suction path 66 provided in the arm 42 communicates with the suction path 68 provided in the transfer pad 44. The transport pad 44 applies a negative pressure to the workpiece 1 in contact with the suction surface through the suction path 66 and the suction path 68 to suction and hold the workpiece 1.

  The arm 42 and the engaged portion 46 are formed of, for example, a metal material whose main component is aluminum, in order to reduce the weight. However, in order to improve the adhesion between the engaged portion 46 and the engaging portion 48, for example, stainless steel may be used for the contact portion with each other, and the contact surface may be polished. Furthermore, a seal member such as an O-ring may be provided at the contact portion so as to surround the periphery of the connection portion in order to improve the airtightness of the connection portion of the suction path 66 and the suction path 68.

  The cutting device 2 has a pipe-like cleaning nozzle 54 straddling the opening 16 in the indexing feed direction (Y-axis direction) above the moving path of the chuck table 6 between the processing area 62 and the loading / unloading area 60. Prepare. The cleaning nozzle 54 is provided with a plurality of jet outlets (not shown) directed downward, and the cleaning nozzle 54 can eject a cleaning liquid such as pure water from the jet nozzles. When the cleaning table is ejected from the cleaning nozzle 54 when the chuck table 6 moves from the processing area 62 to the loading / unloading area 60, the workpiece 1 cut by the cutting unit 8 can be cleaned.

  A high-pressure cleaning solution may be jetted from the cleaning nozzle 54 to the workpiece 1 in order to enhance the cleaning effect. Further, two fluids in which air and water are mixed may be ejected from the cleaning nozzle 54.

  In addition, the cutting device 2 is a pipe extending over the moving path of the carry-out table 52 between the area immediately above the carry-in / out area 60 and the carry-out area 70 and straddling the moving path in the indexing feed direction (Y axis direction) The drying nozzle 56 is provided. The drying nozzle 56 is provided with a plurality of outlets (not shown) directed downward, and the drying nozzle 56 can eject a gas such as dry air from the outlets. When gas is ejected from the drying nozzle 56 when the unloading table 52 moves from the area immediately above the loading / unloading area 60 to the unloading area 70, the workpiece 1 to which the cutting fluid or the like adheres can be dried.

  Next, carrying in / out of the to-be-processed object 1 to the cutting device 2 and cutting of the to-be-processed object 1 are demonstrated with reference to drawings. First, as shown in FIG. 1, the operator of the cutting device 2 places the workpiece 1 on the placement area 40. The cutting device 2 conveys the workpiece 1 placed on the placement area 40 onto the holding surface 6 a of the chuck table 6 by the conveyance pad 44.

  When the workpiece 1 is transported by the transport pad 44, the transport pad 44 is attached to the Z-axis moving plate 34 of the moving unit. Since the transfer pad 44 before being mounted is placed in the standby area 58, first, the moving unit is operated so that the engaging portion 48 at the lower end of the arm 42 is directly below the engaged portion 46 of the transfer pad 44. Position at Then, the Z-axis moving plate 34 is moved in the Z-axis direction to bring the engaging portion 48 and the engaged portion 46 into contact with each other.

  FIG. 2A is a side view schematically showing how the transport pad is attached to the moving unit, and FIG. 4A is a top view schematically showing how the transport pad is attached to the moving unit. is there. FIGS. 2A and 4A schematically show a state in which the engaging portion 48 and the engaged portion 46 are in contact with each other. When negative pressure is applied to the engaged portion 46 through the suction path 64 in a state in which the engaging portion 48 and the engaged portion 46 are in contact with each other, the transfer pad 44 is attached to the moving unit.

  Next, the moving unit is operated to move in the indexing feed direction (Y-axis direction) to move the transfer pad 44 to the placement area 40. Then, the transfer pad 44 is lowered to bring the suction surface into contact with the workpiece 1. Thereafter, when a negative pressure is applied to the workpiece 1 through the suction path 66 and the suction path 68, the workpiece 1 is sucked and adsorbed onto the transfer pad 44. FIG. 4B is a top view schematically showing how the transport pad 44 sucks and holds the workpiece 1 placed on the placement area 40.

  Thereafter, the transport pad 44 is raised and moved in the indexing and feeding direction (Y-axis direction) to be positioned above the loading / unloading area 60. Then, the processing feed unit is operated to move the chuck table 6 to the loading area 60 and the transport pad 44 is lowered. When the workpiece 1 contacts the holding surface 6 a of the chuck table 6, the lowering of the transfer pad 44 is stopped. When suction and adsorption of the workpiece 1 by the transport pad 44 are released and the workpiece 1 is sucked and held by the chuck table 6, loading of the workpiece 1 by the transport pad 44 is completed.

  FIG. 2B is a side view schematically showing how the workpiece 1 is carried onto the chuck table 6 by the transport pad 44. FIG. 5A is a chuck of the workpiece 1 by the transport pad 44. It is a top view which shows typically a mode that it carries in to the table 6. FIG. As described above, since the workpiece 1 can be transported by moving the transport pad 44 by the moving unit, the cutting device 2 according to the present embodiment does not need an independent moving mechanism for moving the transport pad 44.

  FIG. 3 (A) is a side view schematically showing the cutting of the workpiece by the cutting unit, and FIG. 5 (B) is an upper surface schematically showing the cutting of the workpiece by the cutting unit. FIG. When the transfer pad 44 is attached to the moving unit, the load at the time of moving the cutting unit 8 by the moving unit when cutting the workpiece 1 is increased. Therefore, the transfer pad 44 is removed before the workpiece 1 is cut. It may be detached from the mobile unit and placed in the waiting area 58.

  In FIGS. 3A and 5B, the transfer pad 44 placed in the waiting area 58 is shown. When the transfer pad 44 is placed in the standby area 58, the moving unit is operated to bring the transfer pad 44 into contact with the standby area 58, and the suction of the transfer pad through the suction path 66 is stopped.

  When cutting the workpiece 1, the processing feed unit is operated to move the X-axis moving table 18 to the processing area 62. Then, the movement unit is operated to position the cutting blade 8a of the cutting unit 8 at a predetermined height suitable for cutting the workpiece 1, and the X-axis movement table 18 is moved in the machining feed direction. The workpiece 1 held on the holding surface 6a is cut to form a cutting groove 3. When cutting the workpiece 1, the camera unit 10 picks up an image of the workpiece 1 to confirm a line to be cut and perform alignment.

  After cutting the work piece 1 along one planned cutting line, the movement unit is operated to move the cutting unit 8 in the indexing feed direction, and the work feed unit is operated again to cut the work piece 1 . Then, after the cutting of the workpiece 1 along one direction is completed, the chuck table 6 is rotated about an axis perpendicular to the holding surface 6 a to cut the workpiece 1 along the other direction. .

  When cutting the workpiece 1, the cutting fluid is ejected from the nozzle 8 b to supply the cutting fluid to the cutting blade 8 a and the workpiece 1. The chips generated from the workpiece 1 by cutting are washed away by the cutting fluid. Further, the heat generated by the friction between the workpiece 1 and the cutting blade 8a is removed by the cutting fluid.

  In addition, while cutting the to-be-processed object 1, the operator of the cutting apparatus 2 may mount the new to-be-processed object 1a on the mounting area | region 40, as shown to FIG. 5 (B). Thus, the operator can carry the workpiece 1a into the cutting device 2 at an arbitrary timing.

  After cutting of the workpiece 1 is completed, the processing feed unit is operated to move the chuck table 6 to the loading / unloading area 60. At this time, when the cleaning liquid is jetted from the cleaning nozzle 54 to the workpiece 1, the surface to be processed of the workpiece 1 is cleaned.

  Next, the workpiece 1 is unloaded from the chuck table 6. When carrying out the workpiece 1 from the chuck table 6, the transport pad 44 is attached again to the arm 42 of the Z-axis moving plate 34 of the moving unit. Then, the moving unit is operated to move the transfer pad 44, and the transfer pad 44 sucks and holds the workpiece 1. FIG. 6A is a top view schematically showing a state in which the work piece 1 is suctioned and held by the transfer pad 44.

  Then, the workpiece 1 is moved in the direction (Z-axis direction) perpendicular to the holding surface 6a. Thereafter, the carry-out table 52 of the carry-out unit 50 is moved in the processing feed direction (X-axis direction), and positioned below the transfer pad in the area immediately above the carry-in / out area 60. Next, the transport pad 44 is lowered to bring the workpiece 1 into contact with the carry-out table 52, and the suction and suction of the workpiece 1 by the transport pad 44 are released.

  Then, the workpiece 1 is placed on the carry-out table 52. FIG. 3B is a side view schematically showing how the workpiece 1 is placed on the carry-out unit 50 by the transfer pad 44, and FIG. 6B shows how the workpiece 1 is placed on the carry-out unit 50. Is a top view schematically showing the Thereafter, when the unloading table 52 of the unloading unit 50 is moved to the unloading area 70, the workpiece 1 is unloaded. FIG. 7A is a top view schematically showing how the workpiece 1 is unloaded by the unloading unit 50. As shown in FIG.

  In addition, liquids, such as a cutting fluid and a washing | cleaning liquid, have adhered to the to-be-processed object 1 carried out from the cutting device 2. FIG. The liquid may be scattered outside the processing apparatus 2 on the floor surface, in the storage container of the workpiece 1 or the like to cause contamination. In addition, when the liquid adheres to the workpiece 1, it may cause deterioration of the workpiece 1. Therefore, when moving the carry-out table 52 of the carry-out unit 50 to the carry-out area 70, the work 1 is dried by ejecting high-pressure gas from the drying nozzle 56 onto the work 1 to remove the liquid. Good.

  The operator of the processing apparatus 2 can carry out the processed workpiece 1 from the carry-out table 52 at an arbitrary timing. In the processing device 2, as shown in FIG. 7B, before the workpiece 1 is carried out of the carry-out table 52, the conveyance of the new workpiece 1a by the conveyance pad 44 can be started. FIG. 7B is a top view schematically showing how the transfer pad 44 is moved by the moving unit in order to suction and hold a new workpiece 1a.

  Furthermore, drying of the workpiece 1 may be performed while performing cutting of a new workpiece 1a by the cutting unit 8. That is, while the new workpiece 1a is being cut, the discharge table 52 on which the workpiece 1 is mounted is repeatedly moved below the drying nozzle 56 while the high pressure gas is ejected from the drying nozzle 56. The article 1 may be dried.

  According to the cutting device 2 according to the present embodiment, the workpiece 1 can be transported by the transport pad 44 that is removable from the moving unit. The transfer pad 44 can be moved by a moving unit that moves the cutting unit 8 and the like, so the cutting device 2 can transfer the workpiece 1 without using an independent transfer mechanism. The cutting device 2 is a full-automatic type cutting device that allows the operator to carry in and out the workpiece 1 at any timing, but does not require an independent moving mechanism for transporting the workpiece 1. The configuration is not complicated, and the enlargement and cost increase of the cutting device 2 can be suppressed.

  In the above embodiment, the operator places the workpiece 1 before cutting on the placement area 40 and carries out the workpiece 1 after cutting from the carry-out table 52 of the carry-out unit 50. The cutting device 2 which concerns is not limited to this.

  For example, the operator may place the workpiece 1 before cutting on the carry-out table 52. In this case, the cutting device 2 conveys the workpiece 1 to the chuck table 6 by the carry-out unit 50 and the conveyance pad 44, and conveys the workpiece 1 after cutting to the placement area 40 by the conveyance pad 44. Then, the operator carries out the workpiece 1 after cutting placed in the placement area 40.

  Moreover, in the said embodiment, although the conveyance pad 44 hold | maintained the to-be-processed object 1 by attraction | suction, the holding method of the to-be-processed object 1 is not limited to this. For example, the transfer pad 44 may hold the workpiece 1 by magnetic force or electrostatic force.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

1, 1a Workpiece 3 Cutting groove 2 Cutting device 4 Device base 6 Chuck table 6a Holding surface 8 Cutting unit 8a Cutting blade 8b Nozzle 10 Camera unit 16 Opening 18 X axis moving table 20 Dustproof dripproof cover 22 Support structure 24, 32 Guide Rail 26, 34 Moving Plate 28, 36 Ball Screw 30, 38 Pulse Motor 40 Mounting Area 42 Arm 44 Carrier Pad 46 Engaged Part 48 Engaged Part 50 Carrying Out Unit 52 Carrying Out Table 54 Cleaning Nozzle 56 Drying Nozzle 58 Standby Area 60 Transfer area 62 Processing area 64, 66, 68 Suction path 70 Transfer area

Claims (5)

A cutting unit configured to cut the workpiece held on the holding surface of the chuck table with a cutting blade mounted on the spindle;
A processing feed unit for moving the chuck table in a processing feed direction parallel to the holding surface between a processing area in which the workpiece is cut and a loading / unloading area in which the workpiece is carried in / out;
A moving unit for moving the cutting unit in an indexing feed direction parallel to the holding surface and perpendicular to the machining feed direction, and in a direction perpendicular to the holding surface;
A placement area adjacent to the loading and unloading area on which a workpiece before cutting is placed;
An unloading unit that unloads the workpiece after cutting;
A transport pad for transporting the workpiece before cutting placed on the placement area to the chuck table located in the loading and unloading area and transporting the workpiece after cutting on the chuck table to the unloading unit; , And,
The transfer pad is attached to and detached from the moving unit in a standby area adjacent to the loading / unloading area, suctions and holds the workpiece in a state of being attached to the moving unit, and the moving unit while suctioning and holding the workpiece A cutting device characterized by conveying a workpiece by being moved by the The transfer pad has an engaged portion at the top,
The moving unit has a moving plate to which the cutting unit is fixed, and an arm having an engaging portion which extends from the moving plate in the processing feed direction and is engaged with the engaged portion.
By moving the moving plate in a direction perpendicular to the holding surface, the engaged portion of the arm is engaged with the engaged portion of the transfer pad placed in the waiting area, and the transfer plate is transferred to the moving plate The cutting device according to claim 1, characterized in that: The unloading unit includes an unloading table on which the workpiece is placed;
The unloading table can move between an area immediately above the loading and unloading area and an unloading area on the side of the processing feed unit,
The unloading unit is characterized in that the workpiece is unloaded by moving the unloading table on which the workpiece is placed by the transfer pad to the unloading region when the unloading unit is positioned in the region immediately above. The cutting device according to claim 1 or 2.   The drying nozzle is disposed on a moving path of the carry-out table, jets a gas onto the surface of the work placed on the carry-out table, and removes a liquid adhering during cutting from the work. The cutting apparatus according to claim 3, characterized in that   The holding surface or the work piece is disposed on a moving path of the chuck table moved by the processing feed unit, and jets a liquid onto the holding surface of the chuck table or the work held by the chuck table. The cutting device according to any one of claims 1 to 4, further comprising a cleaning nozzle for cleaning the.