CN109986461B

CN109986461B - Cutting device

Info

Publication number: CN109986461B
Application number: CN201811566974.0A
Authority: CN
Inventors: 福冈武臣
Original assignee: Disco Corp
Current assignee: Disco Corp
Priority date: 2017-12-25
Filing date: 2018-12-20
Publication date: 2022-08-02
Anticipated expiration: 2038-12-20
Also published as: JP6973931B2; TWI806950B; JP2019111628A; CN109986461A; TW201929134A

Abstract

Provided is a cutting device which conveys a workpiece without using an independent conveying mechanism. The cutting device comprises: a cutting unit that cuts a workpiece with a cutting tool; a processing feeding unit which moves the chuck worktable between a processing area for cutting the processed object and a carrying-in and carrying-out area for carrying in and carrying out the processed object; a moving unit that moves the cutting unit in an index feeding direction and a direction perpendicular to the holding surface; a mounting area for mounting a workpiece before cutting; a carrying-out unit for carrying out the cut workpiece; and a transport pad that transports the workpiece before cutting to a chuck table located in a carry-in/out area and transports the cut workpiece to a carry-out unit, wherein the transport pad is attached to and detached from the moving unit, sucks and holds the workpiece in a state of being attached to the moving unit, sucks and holds the workpiece, and transports the workpiece by moving the workpiece by the moving unit while sucking and holding the workpiece.

Description

Cutting device

Technical Field

The present invention relates to a cutting apparatus for cutting a workpiece with a cutting tool.

Background

The following cutting devices are known: in a device chip manufacturing process, a substrate such as a semiconductor wafer, a package substrate, a ceramic substrate, or a glass substrate is cut by a cutting tool attached to a spindle.

The cutting device comprises: a cutting unit having a cutting tool; and a chuck table for holding the workpiece. An operator of the cutting apparatus carries the workpiece into the cutting apparatus and places the workpiece on a holding surface on the upper surface of the chuck table. The workpiece is sucked and held on the chuck table, and the cutting tool is rotated while being brought into contact with the workpiece to cut the workpiece. After the cutting is completed, the operator carries the workpiece out of the chuck table.

As described above, a cutting device in which an operator carries a workpiece to a chuck table is known as a manual cutting device. In contrast, a fully automatic cutting apparatus is known which automatically carries in and out a workpiece.

The fully automatic cutting device includes: a placement area for placing a workpiece before machining; a carry-out area for placing the processed object; and a conveying mechanism for carrying the object to be processed in and out. The conveying mechanism conveys the pre-processed object placed in the loading area to the chuck workbench, and conveys the processed object out of the chuck workbench to the conveying area. In some cases, a fully automatic cutting apparatus includes a cleaning unit for cleaning a workpiece after machining.

The manual cutting device without the conveying mechanism is cheap, simple in structure and small in area required for installation. However, the workpiece must be carried in and out by an operator at a predetermined timing before and after the cutting process, and the operator is required to perform a regular operation.

On the other hand, in the fully automatic cutting apparatus having the conveying mechanism, the operator can carry the object to be machined in and out of the cutting apparatus at an arbitrary timing regardless of the progress of the cutting process. However, since the conveying mechanism is provided, the apparatus structure becomes complicated, and the cutting apparatus is expensive and large in size, and therefore a relatively large installation area is required.

Therefore, in a fully automatic cutting apparatus, the following cutting apparatus has been developed: the machine has a conveying mechanism for conveying a workpiece with a relatively simplified configuration (see patent document 1).

Patent document 1: japanese patent laid-open publication No. 2017-84950

In the fully automatic cutting apparatus described in patent document 1, a conveying mechanism having a drive system that is independent of the conveyance of the workpiece to and from the chuck table is required. Therefore, the device structure is still complicated as compared with the manual cutting device, and the manufacturing cost of the cutting device is relatively expensive.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a cutting device capable of carrying in and out a workpiece without using an independent carrying mechanism.

According to one aspect of the present invention, there is provided a cutting apparatus comprising: a cutting unit for cutting the workpiece held by the holding surface of the chuck table by a cutting tool attached to the spindle; a processing feeding unit which moves the chuck table in a processing feeding direction parallel to the holding surface between a processing area for cutting the workpiece and a carrying-in/out area for carrying in/out the workpiece; a moving unit that moves the cutting unit in an indexing feed direction parallel to the holding surface and perpendicular to the machining feed direction and in a direction perpendicular to the holding surface; a loading area adjacent to the carrying-in and carrying-out area for loading the workpiece before cutting; a carrying-out unit for carrying out the cut workpiece; and a conveying pad that conveys the pre-cut workpiece placed on the placing area to the chuck table located in the carrying-in and carrying-out area, and conveys the cut workpiece placed on the chuck table to the carrying-out unit, wherein the conveying pad is attached to and detached from the moving unit in a standby area adjacent to the carrying-in and carrying-out area, and the conveying pad sucks and holds the workpiece in a state of being attached to the moving unit, and conveys the workpiece by moving the moving unit in a state of sucking and holding the workpiece.

In one aspect of the present invention, the transfer pad may have an engaged portion at an upper portion thereof, and the moving means may include: a moving plate that fixes the cutting unit; and an arm extending from the moving plate in the processing feed direction, having an engaging portion that engages with the engaged portion, and moving the moving plate in a direction perpendicular to the holding surface so that the engaging portion of the arm engages with the engaged portion of the conveying pad placed in the standby area to couple the conveying pad and the moving plate.

In one aspect of the present invention, the carrying-out unit may include a carrying-out table on which the workpiece is placed, the carrying-out table being movable between a region immediately above the carrying-in and carrying-out region and a carrying-out region on a side of the processing feeding unit, and the carrying-out unit may move the carrying-out table on which the workpiece is placed by the conveying pad when positioned in the region immediately above to the carrying-out region, and carry out the workpiece.

In one embodiment of the present invention, the machining device may further include a drying nozzle that is provided on a moving path of the carrying-out table, and that removes liquid adhering to the workpiece during cutting by jetting gas to a front surface of the workpiece placed on the carrying-out table. Further, the processing apparatus may further include a cleaning nozzle which is provided on a moving path of the chuck table moved by the processing feed unit, and which sprays a liquid to the holding surface of the chuck table or the workpiece held by the chuck table to clean the holding surface or the workpiece.

The cutting device according to one aspect of the present invention includes a conveyance pad that conveys a workpiece from a placement area onto a chuck table and conveys the workpiece from the chuck table to a carry-out unit. Here, the conveying pad is attached to and detached from a moving unit that moves the cutting unit, and is moved by the moving unit. Therefore, the cutting device does not need to have a moving mechanism having an independent driving system for moving only the conveying pad.

When the workpiece is not conveyed, such as during cutting of the workpiece, the conveying pad is separated from the moving unit. Thus, the load of the moving unit that moves the cutting unit does not increase.

Therefore, the present invention provides a cutting device capable of carrying in and out a workpiece without using an independent conveying mechanism.

Drawings

Fig. 1 is a perspective view schematically showing a workpiece and a cutting apparatus.

Fig. 2 (a) is a side view schematically showing a state in which the transfer pad is attached to the moving unit, and fig. 2 (B) is a side view schematically showing a state in which the workpiece is carried into the chuck table by the transfer pad.

Fig. 3 (a) is a side view schematically showing a case where the workpiece is cut by the cutting unit, and fig. 3 (B) is a side view schematically showing a case where the workpiece is placed on the carry-out unit by the conveyance pad.

Fig. 4 (a) is a plan view schematically showing a state in which the transport pad is attached to the moving unit, and fig. 4 (B) is a plan view schematically showing a state in which the transport pad sucks and holds the workpiece placed in the placement area.

Fig. 5 (a) is a plan view schematically showing a case where the workpiece is carried into the chuck table by the carrying pad, and fig. 5 (B) is a plan view schematically showing a case where the workpiece is cut by the cutting unit.

Fig. 6 (a) is a plan view schematically showing a case where the workpiece is sucked and held by the conveyance pad, and fig. 6 (B) is a plan view schematically showing a case where the workpiece is placed on the carry-out unit.

Fig. 7 (a) is a plan view schematically showing a case where the workpiece is carried out by the carrying-out means, and fig. 7 (B) is a plan view schematically showing a case where the conveying pad is moved by the moving means in order to suck and hold a new workpiece.

Description of the reference symbols

1. 1 a: a workpiece; 3: cutting a groove; 2: a cutting device; 4: a device base station; 6: a chuck table; 6 a: a holding surface; 8: a cutting unit; 8 a: a cutting tool; 8 b: a nozzle; 10: a camera unit; 16: an opening; 18: an X-axis moving table; 20: a dustproof anti-dripping cover; 22: a support structure; 24. 32: a guide rail; 26. 34: moving the plate; 28. 36: a ball screw; 30. 38: a pulse motor; 40: a placement area; 42: an arm; 44: a carrying pad; 46: a clamped part; 48: a fastening part; 50: a carry-out unit; 52: moving out of the workbench; 54: cleaning the nozzle; 56: drying the nozzle; 58: a standby area; 60: a carrying-in and carrying-out area; 62: a machining area; 64. 66, 68: an aspiration path; 70: and a carrying-out area.

Detailed Description

A cutting apparatus according to an embodiment of the present invention will be described with reference to the drawings. First, a workpiece to be machined by the cutting apparatus of the present embodiment will be described with reference to fig. 1. Fig. 1 is a perspective view schematically showing a workpiece and a cutting device.

The workpiece 1 is a substrate made of a material such as silicon, SiC (silicon carbide), or other semiconductors, or a material such as sapphire, glass, quartz, or ceramics, for example. Alternatively, the object to be processed is a package substrate in which the device is covered with resin. A line to divide is set in the object 1, and when the object 1 is divided by cutting along the line to divide, a device chip can be formed.

Next, the cutting apparatus 2 of the present embodiment will be explained. The cutting apparatus 2 includes an apparatus base 4 for supporting each component, and the apparatus base 4 includes, on an upper surface thereof: a chuck table 6 for sucking and holding the workpiece 1; and a cutting unit 8 that cuts the workpiece 1. The cutting device 2 sucks and holds the workpiece 1 by the chuck table 6 and cuts the workpiece 1 by the cutting unit 8. The cutting apparatus 2 includes a camera unit 10 that photographs the workpiece 1 at a position adjacent to the cutting unit 8 in order to align the cutting unit 8.

The chuck table 6 has a suction passage (not shown) therein, one end of which is connected to a suction source, and the other end of the suction passage is connected to a porous member disposed above the chuck table 6. The porous member is exposed upward, and the upper surface of the porous member serves as a holding surface 6a of the chuck table 6.

When the workpiece 1 is placed on the holding surface 6a, the suction source is operated, and negative pressure is applied to the workpiece 1 through the porous member, the workpiece 1 is sucked and held on the chuck table 6. The chuck table 6 is rotatable about an axis in a direction perpendicular to the holding surface 6 a.

An opening 16 having a long side along the X-axis direction is provided in the center of the upper surface of the apparatus base 4, and disposed inside the opening 16 are: an X-axis moving table 18; and a dust-proof and drip-proof cover 20 having one end mounted on the X-axis moving table 18. A machining feed unit (not shown) is disposed in a region protected by the dust-proof and drip-proof cover 20 below the X-axis moving table 18, and the machining feed unit moves the X-axis moving table 18 in the X-axis direction parallel to the holding surface 6 a.

The machining feed unit feeds the chuck table 6 in the X-axis direction during cutting of the workpiece 1. That is, the X-axis direction is set as the machining feed direction. The machining feed unit moves the chuck table 6 in the machining feed direction between a machining region 62 in which the workpiece 1 is cut and a carrying-in/out region 60 in which the workpiece 1 is carried in/out with respect to the chuck table 6.

A support structure 22 having a protruding portion extending to the upper portion of the opening 16 is provided upright on the rear portion of the upper surface of the apparatus base 4. A pair of Y-axis rails 24 parallel to the Y-axis direction are provided on the front side surface of the support structure 22, and a Y-axis moving plate 26 is slidably attached to the Y-axis rails 24.

A nut portion (not shown) is provided on the rear surface side of the Y-axis moving plate 26, and the Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed into the nut portion. The Y-axis pulse motor 30 is connected to one end of the Y-axis ball screw 28. When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

A unit including the pair of Y-axis guide rails 24, the Y-axis moving plate 26, the Y-axis ball screw 28, and the Y-axis pulse motor 30 functions as an indexing unit that indexes the cutting unit 8 and the camera unit 10 in the Y-axis direction. That is, the Y-axis direction is taken as the index feeding direction.

On the front surface of the Y-axis moving plate 26 are disposed: a pair of Z-axis guide rails 32 extending in the Z-axis direction; and a Z-axis moving plate 34 slidably attached to each Z-axis guide rail 32. A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 34, and a Z-axis ball screw 36 parallel to the Z-axis guide rail 32 is screwed into the nut portion.

A Z-axis pulse motor 38 is connected to one end of the Z-axis ball screw 36. When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38, the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32. The cutting unit 8 and the camera unit 10 are fixed to the lower portion of the front surface side of the Z-axis moving plate 34.

The unit constituted by the pair of Z-axis guide rails 32, the Z-axis moving plate 34, the Z-axis ball screw 36, and the Z-axis pulse motor 38 functions as an elevating unit that moves the cutting unit 8 and the camera unit 10 in the Z-axis direction perpendicular to the holding surface 6a of the chuck table 6. The indexing unit and the lifting unit function as a moving unit that moves the cutting unit 8 and the like.

The cutting unit 8 has: a main axis (not shown) along the Y-axis direction; and an annular cutting tool 8a attached to the tip of the spindle. A spindle motor (not shown) is connected to a base end side of the spindle, and rotates the spindle in the Y-axis direction. When the spindle is rotated by the spindle motor, the cutting tool 8a is rotated.

The cutting insert 8a has a cutting edge on the outer periphery. The cutting edge includes, for example, abrasive grains and a binder in which the abrasive grains are dispersed. When the X-axis moving table 18 is moved in the machining feed direction while positioning the rotating cutting tool 8a at a predetermined height position, the workpiece 1 is cut by the cutting tool 8 a.

When the workpiece 1 is cut by the cutting tool 8a, chips are generated from the workpiece 1 and scattered. In addition, the workpiece 1 and the cutting tool 8a are heated to high temperatures due to the generation of machining heat by the cutting. Therefore, while the workpiece 1 is being cut, the cutting fluid is supplied to the workpiece 1 and the cutting tool 8 a. The cutting unit 8 has a nozzle 8b on the side of the cutting tool 8a, and the cutting fluid is supplied from the nozzle 8b to the upper surface of the workpiece 1 and the cutting tool 8 a.

The cutting fluid supplied from the nozzle 8b is, for example, pure water. The cutting fluid has a function of cooling the workpiece 1 and the cutting tool 8 a. Cutting chips and the like generated by the cutting process are removed by flowing the cutting fluid to the outside of the workpiece 1.

A placement area 40 for placing the workpiece 1 before cutting is provided on the upper surface of the device base 4 at a position adjacent to the carrying in/out area 60. The operator of the cutting apparatus 2 places the workpiece 1 before cutting on the placement area 40 at an arbitrary timing.

Further, a carrying-out unit 50 for carrying out the cut workpiece 1 is provided at another position adjacent to the carrying-in and carrying-out area 60 on the upper surface of the apparatus base 4. The carrying-out unit 50 has, for example, a carrying-out table 52 on which a workpiece is placed, and the carrying-out table 52 is movable between an area directly above the carrying-in area 60 and a carrying-out area 70 on the side of the processing and feeding unit. The cut workpiece 1 is placed on the carry-out unit 50 positioned in the region directly above. The carrying-out unit 50 moves to the carrying-out area 70 and can carry out the object 1.

The cutting apparatus 2 includes a conveying pad 44, and the conveying pad 44 conveys the workpiece 1 placed on the placing region 40 to the chuck table 6 located in the carrying-in and carrying-out region 60, and conveys the workpiece 1 placed on the chuck table 6 to the carrying-out table 52 of the carrying-out unit 50.

The transfer pad 44 is detachable from the Z-axis moving plate 34 of the moving unit. A standby area 58 in which the conveyance pad 44 is placed is provided at another position adjacent to the carry-in/out area 60, and the conveyance pad 44 is placed in the standby area 58 when not attached to the Z-axis moving plate 34.

The lower surface of the conveyance pad 44 is an adsorption surface capable of adsorbing and holding the workpiece 1, and the conveyance pad 44 has an adsorption path 68 (see fig. 2 a and the like) therein, one end of which reaches the adsorption surface. The transfer pad 44 has a bracket-shaped engaged portion 46 at the upper portion, and the other end of the suction path 68 reaches the engaged portion 46.

An arm 42 extending in the machining feed direction (X-axis direction) is fixed to the front surface of the Z-axis moving plate 34 of the moving unit. The arm 42 has an engaging portion 48 at a lower end thereof for engaging with the engaged portion 46 of the transfer pad 44. The arm 42 has two suction passages 64 and 66 (see fig. 2 a and the like) having one end opening into the engagement portion 48. The other ends of the

suction paths

64 and 66 are connected to independent suction sources (not shown).

The arm 42 of the Z-axis moving plate 34 applies a negative pressure to the engaged portion 46 through the suction path 64, and the engaged portion 46 of the transfer pad 44 is engaged with the engaging portion 48 of the arm 42. When the transfer pad 44 is engaged with the arm 42, the suction passage 66 of the arm 42 communicates with the suction passage 68 of the transfer pad 44. The conveyance pad 44 applies a negative pressure to the workpiece 1 in contact with the suction surface via the suction path 66 and the suction path 68, and suctions and holds the workpiece 1.

The arm 42 and the engaged portion 46 are formed of a metal material containing aluminum as a main component, for example, for the purpose of reducing weight. However, in order to improve the close contact between the engaged portion 46 and the engaging portion 48, for example, stainless steel may be used for the contact portion therebetween, and the contact surface may be polished. In addition, in order to improve the airtightness of the connection portion between the suction path 66 and the suction path 68, a sealing member such as an O-ring may be provided around the connection portion.

The cutting apparatus 2 includes a tubular cleaning nozzle 54 extending across the opening 16 in the indexing direction (Y-axis direction) above the movement path of the chuck table 6 between the processing area 62 and the carrying in/out area 60. The cleaning nozzle 54 is provided with a plurality of downward discharge ports (not shown), and the cleaning nozzle 54 can discharge a cleaning liquid such as pure water from the discharge ports. When the cleaning nozzle 54 discharges the cleaning liquid when the chuck table 6 moves from the processing area 62 to the carrying-in and carrying-out area 60, the workpiece 1 cut by the cutting unit 8 can be cleaned.

In order to enhance the cleaning effect, a high-pressure cleaning liquid may be discharged from the cleaning nozzle 54 to the workpiece 1. Alternatively, two fluids obtained by mixing air and water may be ejected from the cleaning nozzle 54.

The cutting apparatus 2 further includes a tubular drying nozzle 56 that crosses the movement path of the carry-out table 52 in the index direction (Y-axis direction) above the movement path between the area directly above the carry-in and carry-out area 60 and the carry-out area 70. The drying nozzle 56 is provided with a plurality of downward-facing discharge ports (not shown), and the drying nozzle 56 can discharge a gas such as dry air from the discharge ports. When the carrying-in/out table 52 moves from the area directly above the carrying-in/out area 60 to the carrying-out area 70 and the gas is discharged from the drying nozzle 56, the workpiece 1 to which the cutting fluid or the like has adhered can be dried.

Next, carrying in and out of the workpiece 1 with respect to the cutting device 2 and cutting of the workpiece 1 will be described with reference to the drawings. First, as shown in fig. 1, the operator of the cutting apparatus 2 places the workpiece 1 on the placement area 40. The cutting apparatus 2 conveys the workpiece 1 placed on the placement area 40 to the holding surface 6a of the chuck table 6 by the conveying pad 44.

When the workpiece 1 is conveyed by the conveying pad 44, the conveying pad 44 is attached to the Z-axis moving plate 34 of the moving means. Since the conveyance pad 44 before mounting is placed in the standby area 58, the moving unit is first operated to position the engaging portion 48 at the lower end of the arm 42 directly below the engaged portion 46 of the conveyance pad 44. Then, the Z-axis moving plate 34 is moved in the Z-axis direction to bring the engaging portion 48 into contact with the engaged portion 46.

Fig. 2 (a) is a side view schematically showing a state in which the conveying pad is attached to the moving unit, and fig. 4 (a) is a plan view schematically showing a state in which the conveying pad is attached to the moving unit. Fig. 2 (a) and 4 (a) schematically show a state in which the engaging portion 48 is brought into contact with the engaged portion 46. When a negative pressure is applied to the engaged portion 46 through the suction path 64 in a state where the engaging portion 48 and the engaged portion 46 are in contact, the transfer pad 44 is attached to the moving unit.

Next, the moving means is operated to move in the index feeding direction (Y-axis direction), and the transport pad 44 is moved to the placement area 40. Then, the conveyance pad 44 is lowered to bring the suction surface into contact with the workpiece 1. When negative pressure is applied to the workpiece 1 through the suction path 66 and the suction path 68, the workpiece 1 is sucked and adsorbed to the conveyance pad 44. Fig. 4 (B) is a plan view schematically showing a state where the conveyance pad 44 sucks and holds the workpiece 1 placed in the placement area 40.

Then, the transport pad 44 is moved upward in the index feeding direction (Y-axis direction) and positioned above the carry-in/out area 60. Then, the processing feed unit is operated to move the chuck table 6 to the carry-in/out area 60, and the transport pad 44 is lowered. When the workpiece 1 comes into contact with the holding surface 6a of the chuck table 6, the lowering of the conveyance pad 44 is stopped. When the suction of the workpiece 1 by the conveyance pad 44 is released and the workpiece 1 is sucked and held by the chuck table 6, the conveyance of the workpiece 1 by the conveyance pad 44 is completed.

Fig. 2 (B) is a side view schematically showing a state where the workpiece 1 is carried into the chuck table 6 by the transport pad 44, and fig. 5 (a) is a plan view schematically showing a state where the workpiece 1 is carried into the chuck table 6 by the transport pad 44. In this way, since the workpiece 1 can be conveyed by moving the conveying pad 44 by the moving means, the cutting apparatus 2 of the present embodiment does not need an independent moving mechanism for moving the conveying pad 44.

Fig. 3 (a) is a side view schematically showing a case where the workpiece is cut by the cutting means, and fig. 5 (B) is a plan view schematically showing a case where the workpiece is cut by the cutting means. When the transport pad 44 is attached to the moving means, the load when the moving means moves the cutting means 8 during cutting of the workpiece 1 is increased, and therefore the transport pad 44 can be detached from the moving means and placed in the standby area 58 before the workpiece 1 is cut.

Fig. 3 (a) and 5 (B) show the conveyance pad 44 placed in the standby area 58. When the transport pad 44 is placed in the standby area 58, the moving means is operated to bring the transport pad 44 into contact with the standby area 58, and the suction of the transport pad through the suction path 66 is stopped.

When the workpiece 1 is cut, the X-axis moving table 18 is moved to the machining area 62 by operating the machining feed unit. When the moving means is operated to position the cutting tool 8a of the cutting means 8 at a predetermined height suitable for cutting the workpiece 1 and the X-axis moving table 18 is moved in the machining feed direction, the workpiece 1 held on the holding surface 6a of the chuck table 6 is cut to form the cut groove 3. When cutting the workpiece 1, the camera unit 10 photographs the workpiece 1 and checks the planned cutting line, thereby performing alignment.

After the workpiece 1 is cut along one line to be cut, the moving means is operated to move the cutting means 8 in the indexing direction, and the machining feed means is operated again to cut the workpiece 1. After the workpiece 1 is cut in one direction, the chuck table 6 is rotated about an axis perpendicular to the holding surface 6a to cut the workpiece 1 in the other direction.

When cutting the workpiece 1, the cutting fluid is discharged from the nozzle 8b, and the cutting fluid is supplied to the cutting tool 8a and the workpiece 1. The chips generated from the workpiece 1 by cutting are washed away by the cutting fluid. Further, heat generated by friction between the workpiece 1 and the cutting tool 8a is removed by the cutting fluid.

While the workpiece 1 is being cut, the operator of the cutting apparatus 2 may place a new workpiece 1a on the placement area 40 as shown in fig. 5 (B). In this way, the operator can carry the workpiece 1a into the cutting apparatus 2 at an arbitrary timing.

After the cutting of the workpiece 1 is completed, the machining feed unit is operated to move the chuck table 6 to the carry-in/out area 60. At this time, when the cleaning liquid is discharged from the cleaning nozzle 54 to the workpiece 1, the workpiece 1 is cleaned on the workpiece surface side.

Subsequently, the workpiece 1 is carried out from the chuck table 6. When the workpiece 1 is carried out from the chuck table 6, the transfer pad 44 is attached to the arm 42 of the Z-axis moving plate 34 of the moving unit again. Then, the moving means is operated to move the conveying pad 44, and the workpiece 1 is sucked and held by the conveying pad 44. Fig. 6 (a) is a plan view schematically showing a state where the workpiece 1 is sucked and held by the conveyance pad 44.

Then, the workpiece 1 is moved in a direction (Z-axis direction) perpendicular to the holding surface 6 a. Then, the carry-out table 52 of the carry-out unit 50 is moved in the machining feed direction (X-axis direction), and the carry-out table 52 is positioned below the conveying pad in a region directly above the carry-in and carry-out region 60. Next, the conveyance pad 44 is lowered to bring the workpiece 1 into contact with the carry-out table 52, and the suction of the workpiece 1 by the conveyance pad 44 is released.

Then, the workpiece 1 is placed on the carry-out table 52. Fig. 3 (B) is a side view schematically showing a state where the workpiece 1 is placed on the carry-out unit 50 by the conveyance pad 44, and fig. 6 (B) is a plan view schematically showing a state where the workpiece 1 is placed on the carry-out unit 50. Then, when the carry-out table 52 of the carry-out unit 50 is moved to the carry-out area 70, the object 1 is carried out. Fig. 7 (a) is a plan view schematically showing a state where the object 1 is carried out by the carrying-out unit 50.

Further, a liquid such as a cutting fluid or a cleaning fluid adheres to the workpiece 1 carried out from the cutting device 2. The liquid may be scattered to the ground or the inside of the container for the workpiece 1 outside the processing apparatus 2, which may cause contamination. In addition, when the liquid adheres to the workpiece 1, the liquid may cause deterioration of the workpiece 1. Therefore, when the carry-out table 52 of the carry-out unit 50 is moved to the carry-out area 70, the object 1 can be dried by ejecting high-pressure gas from the drying nozzle 56 to the object 1, and the liquid can be removed.

The processed workpiece 1 can be carried out from the carrying-out table 52 at an arbitrary timing by an operator of the processing apparatus 2. In the processing apparatus 2, as shown in fig. 7 (B), before the workpiece 1 is carried out from the carrying-out table 52, the carrying of a new workpiece 1a by the carrying pad 44 can be started. Fig. 7 (B) is a plan view schematically showing a case where the transfer pad 44 is moved by the moving means in order to suck and hold the new workpiece 1 a.

The drying of the workpiece 1 may be performed while the cutting unit 8 is cutting a new workpiece 1 a. That is, while the new workpiece 1a is being cut, the workpiece 1 can be dried by repeatedly moving the carry-out table 52 on which the workpiece 1 is placed below the drying nozzle 56 while the high-pressure gas is ejected from the drying nozzle 56.

According to the cutting apparatus 2 of the present embodiment, the workpiece 1 can be conveyed by the conveyance pad 44 that can be attached to and detached from the moving unit. The conveying pad 44 can be moved by a moving means that moves the cutting means 8 and the like, and therefore the workpiece 1 can be conveyed in the cutting apparatus 2 without using a separate conveying mechanism. The cutting device 2 is a fully automatic cutting device capable of carrying the workpiece 1 in and out at an arbitrary timing by an operator, but an independent moving mechanism for carrying the workpiece 1 is not necessary, the structure of the cutting device 2 is not complicated, and the size increase and cost increase of the cutting device 2 can be suppressed.

In the above embodiment, the operator places the workpiece 1 before cutting on the placement area 40 and carries the cut workpiece 1 out of the carrying-out table 52 of the carrying-out unit 50, but the cutting apparatus 2 according to one embodiment of the present invention is not limited to this.

For example, the operator may place the workpiece 1 before cutting on the carry-out table 52. In this case, the cutting apparatus 2 conveys the workpiece 1 to the chuck table 6 by the carry-out unit 50 and the conveying pad 44, and conveys the cut workpiece 1 to the placement area 40 by the conveying pad 44. Then, the operator carries out the cut workpiece 1 placed in the placement area 40.

In the above embodiment, the transport pad 44 holds the workpiece 1 by suction, but the method of holding the workpiece 1 is not limited to this. For example, the transport pad 44 may hold the workpiece 1 by a magnetic force or an electrostatic force.

In addition, the structure, method, and the like of the above embodiments may be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims

1. A cutting device is characterized in that a cutting tool is provided,

the cutting device comprises:

a cutting unit for cutting the workpiece held by the holding surface of the chuck table by a cutting tool attached to the spindle;

a processing feeding unit which moves the chuck table in a processing feeding direction parallel to the holding surface between a processing area for cutting the workpiece and a carrying-in/out area for carrying in/out the workpiece;

a moving unit that moves the cutting unit in an indexing feed direction parallel to the holding surface and perpendicular to the machining feed direction and in a direction perpendicular to the holding surface;

a loading area adjacent to the carrying-in and carrying-out area for loading the workpiece before cutting;

a carrying-out unit for carrying out the cut workpiece; and

a conveying pad for conveying the pre-cut workpiece placed on the placing area to the chuck table located in the carrying-in and carrying-out area, and conveying the post-cut workpiece placed on the chuck table to the carrying-out unit,

the conveying pad is attached to and detached from the moving unit that moves the cutting unit in a standby area adjacent to the carrying in and out area, sucks and holds the workpiece in a state of being attached to the moving unit that moves the cutting unit, and conveys the workpiece by moving the moving unit that moves the cutting unit in an indexing direction and a direction perpendicular to the holding surface in a state of sucking and holding the workpiece.

2. The cutting device of claim 1,

the carrying pad has an engaged portion at an upper portion,

the mobile unit has:

a moving plate that fixes the cutting unit; and

an arm extending from the moving plate in the machining feed direction and having an engaging portion for engaging with the engaged portion,

the moving plate is moved in a direction perpendicular to the holding surface, so that the engaging portion of the arm engages with the engaged portion of the conveying pad placed in the standby area, thereby coupling the conveying pad and the moving plate.

3. The cutting device according to claim 1 or 2,

the carrying-out unit has a carrying-out table on which the object to be processed is placed,

the carrying-in/out table is movable between an area directly above the carrying-in/out area and a carrying-out area on a side of the processing feeding unit,

the carrying-out unit moves the carrying-out table on which the object is placed by the conveying pad when positioned in the area directly above to the carrying-out area, thereby carrying out the object.

4. The cutting device of claim 3,

the cutting device is provided with a drying nozzle which is arranged on a moving path of the carrying-out workbench, and sprays gas to the front surface of the processed object carried on the carrying-out workbench to remove liquid attached during cutting from the processed object.

5. The cutting device according to claim 1 or 2,

the cutting device is provided with a cleaning nozzle which is arranged on a moving path of the chuck workbench moving through the processing feeding unit and sprays liquid to the holding surface of the chuck workbench or the processed object held by the chuck workbench to clean the holding surface or the processed object.